JP6595870B2 - Correction information generating apparatus, drawing apparatus, correction information generating method, and drawing method - Google Patents

Description

  The present invention relates to a technique for generating correction information used for correcting drawing data of an image drawn on a substrate based on position information of a mark on the substrate.

  Conventionally, a pattern can be drawn by irradiating a photosensitive material formed on a semiconductor substrate, a printed circuit board, a glass substrate for a plasma display device or a liquid crystal display device (hereinafter referred to as “substrate”) with light. Has been done. 2. Description of the Related Art In recent years, drawing devices that directly draw a pattern by scanning a light beam on a photosensitive material have been used with higher definition of the pattern.

  For example, in the drawing apparatus of Patent Document 1, a pattern described by CAD data is obtained by irradiating a modulated laser beam from an optical head onto a wafer (so-called mold wafer) having a plurality of semiconductor chips mounted on the surface thereof. Are drawn on each semiconductor chip.

JP 2014-143335 A

  By the way, in the mold wafer as described above, a positional shift caused by mounting a semiconductor chip or a stress caused by molding occurs. In order to perform drawing by correcting such discrete positional deviations, the positions of marks such as alignment marks provided on a plurality of semiconductor chips are measured, and the displacement of each mark from the design position is calculated. After that, the drawing data of the pattern drawn on each semiconductor chip is matched with the displacement. The displacement calculation of the plurality of landmarks is performed by performing a pairing process for associating the plurality of landmarks extracted from the image of the entire wafer with the plurality of landmarks included in the design data. The measurement position and the design position are compared.

  As a method of the pairing process, a nearest neighbor search method is known in which a mark on a wafer image is associated with a mark located at a design position closest to the measurement position of the mark in design data. However, there is a possibility that appropriate pairing processing cannot be performed by the nearest neighbor search method, for example, when the imaged wafer is rotated with respect to the design data.

  The present invention has been made in view of the above problems, and an object of the present invention is to easily and appropriately perform mark pairing processing.

The invention according to claim 1 is a correction information generation device for generating correction information used for correcting drawing data of an image drawn on the substrate based on position information of a mark on the substrate, A design position storage unit that stores a design position of a target mark group that is a plurality of target marks arranged in a grid pattern in the vertical direction and the horizontal direction, and a measurement image that is an image of the target mark group, Acquire the measurement position of the target mark, which is the target mark, and pay attention to the adjacent area of a predetermined size centered on the adjacent center position that is a predetermined distance from the target mark in the vertical direction or the horizontal direction. Then, a mark included in the adjacent area is extracted as an adjacent mark adjacent to the target mark, and a measurement position acquisition unit that acquires a measurement position of the adjacent mark and the measurement acquisition unit are controlled to control the measurement. To the measuring positions of all the target mark in the image is acquired, the adjacent mark as a new target marker, new from the new attention landmark is a position where the predetermined distance in the longitudinal direction or the transverse direction Paying attention to the new adjacent area of the predetermined size centered on the adjacent center position, extracting a mark included in the new adjacent area as a new adjacent mark adjacent to the new attention mark, and A repeat control unit that repeats acquisition of measurement positions of adjacent landmarks, and associates the measurement positions of all target landmarks on the measurement image with the design positions of the target landmark group, and corresponding measurement positions and design positions. And a correction information generation unit that generates correction information used for correcting the drawing data based on the difference.

  The invention according to claim 2 is the correction information generating device according to claim 1, wherein the measurement position acquisition unit is the end in the vertical direction and the horizontal direction of the target mark group. One target mark located at the position is the target mark, and the target mark group includes a plurality of target mark strings each extending over the entire length of the target mark group in the other of the vertical direction and the horizontal direction. The measurement acquisition unit is controlled by the repetitive control unit as a set, whereby the measurement position of the target landmark string including the target landmark is first acquired, and the target landmark string whose measurement position has already been acquired and the one The measurement positions of the target mark strings adjacent in the direction are acquired in order.

According to a third aspect of the present invention, there is provided a correction information generating apparatus for generating correction information used for correcting drawing data of an image drawn on the substrate based on position information of a mark on the substrate, In the measurement position which is an image obtained by photographing the design position of a target mark group which is a plurality of target marks arranged in a grid pattern in the vertical direction and the horizontal direction, and a measurement image which is an image of the target mark group, the target A measurement position of a target mark that is one target mark located at the end in one of the vertical direction and the horizontal direction in the mark group is acquired, and the other of the vertical direction and the horizontal direction is acquired from the target mark. Pay attention to an adjacent area of a predetermined size centered on an adjacent center position that is a predetermined distance away in the direction, and extract a mark included in the adjacent area as an adjacent mark adjacent to the target mark By measuring the measurement position acquisition unit that acquires the measurement position of the adjacent mark and the measurement position acquisition unit, the target mark that includes the target mark and extends over the entire length of the target mark group in the other direction In the column, with the adjacent mark as a new attention mark , a new adjacent center position that is a position separated from the new attention mark in the other direction of the vertical direction and the horizontal direction by the predetermined distance is used as a center. Paying attention to the new adjacent area of the predetermined size, extracting a mark included in the new adjacent area as a new adjacent mark adjacent to the new attention mark, and determining the measurement position of the new adjacent mark Repeat to obtain a target marker sequence acquiring portion for acquiring the measurement positions of all target mark of the target object mark train, by controlling the target mark string obtaining section, wherein Until the measurement positions of all the target landmarks on the fixed image are acquired, among the unacquired target landmark groups excluding the target landmark string whose measurement positions have already been acquired from the target landmark group, the end position in the one direction is the end. A repeat control unit that obtains the measurement position of the next target mark that is the one target mark that is positioned, and repeats the acquisition of the measurement positions of all target marks of the next target mark sequence that includes the next target mark, and the measurement Associating the measurement positions of all the target landmarks on the image with the design positions of the target landmark group, and generating correction information used for correcting drawing data based on the difference between the corresponding measurement positions and the design positions And a correction information generation unit.

  According to a fourth aspect of the present invention, there is provided a drawing apparatus for drawing an image on a substrate, which is generated by a light source unit, the correction information generating apparatus according to any one of the first to third aspects, and the correction information generating apparatus. A drawing data correction unit that corrects drawing data of an image to be drawn on the substrate using the corrected information, and light modulation that modulates light from the light source unit based on the drawing data corrected by the drawing data correction unit And a scanning mechanism that scans the light modulated by the light modulation unit on the substrate.

The invention according to claim 5 is a correction information generating method for generating correction information used for correcting drawing data of an image drawn on the substrate based on position information of a mark on the substrate, and a) A step of preparing a design position of a target mark group which is a plurality of target marks arranged in a grid pattern in a vertical direction and a horizontal direction on a substrate; and b) a measurement image which is an image obtained by shooting the target mark group. A step of obtaining a measurement position of a target mark, which is a target mark, and c) a predetermined size centered on an adjacent center position that is a predetermined distance away from the target mark in the vertical direction or the horizontal direction. , Extracting a mark included in the adjacent area as an adjacent mark adjacent to the target mark, and obtaining a measurement position of the adjacent mark; d) of all target marks on the measurement image The measurement position is Until obtained, the neighboring landmarks measuring position is acquired by the step c) as a new target mark, at the predetermined distance away in the longitudinal direction or the lateral direction from the new attention landmark Pay attention to a new adjacent area of the predetermined size centered on a new adjacent center position, and extract a mark included in the new adjacent area as a new adjacent mark adjacent to the new attention mark, A step of repeatedly acquiring the measurement positions of the new adjacent landmarks, and e) the measurement positions of all the target landmarks on the measurement image obtained in the step d) corresponding to the design positions of the target landmark group. And generating correction information used for correcting drawing data based on the difference between the corresponding measurement position and the design position.

  The invention according to claim 6 is the correction information generation method according to claim 5, wherein in the step b), the target mark group is at the end in one of the vertical direction and the horizontal direction. One target mark that is positioned is used as the target mark, and in the step c) and the step d), the target mark group is the entire length of the target mark group in the other of the vertical direction and the horizontal direction. A measurement position of the target mark sequence including the target mark selected in the step b) is first acquired, and the target mark sequence whose measurement position has already been acquired. The measurement positions of the target mark trains adjacent in the one direction are acquired in order.

The invention according to claim 7 is a correction information generation method for generating correction information used for correcting drawing data of an image drawn on the substrate based on position information of a mark on the substrate, comprising: a) A step of preparing a design position of a target mark group which is a plurality of target marks arranged in a grid pattern in the vertical and horizontal directions on the substrate; and b) a measurement image which is an image of the target mark group, Obtaining a measurement position of a target mark that is one target mark located at the end in one of the vertical direction and the horizontal direction in the target mark group; c) from the target mark, the vertical direction and the Pay attention to an adjacent area of a predetermined size centered on an adjacent center position that is a predetermined distance away in the other lateral direction, and an adjacent mark adjacent to the target mark is included in the adjacent area When Obtaining the measurement position of the adjacent landmark, and d) in the target mark sequence that includes the target mark and extends over the entire length of the target mark group in the other direction. as new attention landmark has been said adjacent mark acquired measurement position Te, the longitudinal direction and the transverse direction of the new adjacent center said is the other said predetermined distance away in the direction from the new attention landmark Pay attention to the new adjacent area of the predetermined size centered on the position, extract the mark included in the new adjacent area as a new adjacent mark adjacent to the new attention mark, and the new adjacent mark repeatedly obtaining the measurement position, a step of acquiring a measurement position of the total subject mark of the target object mark column, e) to the measurement position of all subjects landmarks on the measurement image is acquired, Of the unacquired target mark group excluding the target mark string whose measurement position has already been acquired from the target mark group, the measurement position of the next target mark that is the one target mark located at the end in the one direction is Obtaining and repeating the steps c) and d) for the next notice mark to repeat obtaining the measurement positions of all the object marks in the next notice mark sequence including the next notice mark; f) The measurement positions of all the target landmarks on the measurement image acquired in the step e) are associated with the design positions of the target landmark group, and drawing is performed based on the difference between the corresponding measurement positions and the design positions. Generating correction information used for correcting data.

  The invention according to claim 8 is a drawing method for drawing an image on a substrate, the step of acquiring correction information by the correction information generation method according to any one of claims 5 to 7, and the correction information A step of correcting drawing data of an image to be drawn on the substrate, and a step of scanning the substrate with light modulated based on the corrected drawing data.

  In the present invention, the mark pairing process can be performed easily and appropriately.

It is a figure which shows the structure of a direct drawing apparatus. It is a top view which shows the upper surface of a board | substrate. It is a block diagram which shows the function of a control part. It is a figure which shows the flow of the drawing of the image on a board | substrate. It is a top view which shows the upper surface of a board | substrate. It is a block diagram which shows the function of a control part. It is a figure which shows the flow of the drawing of the image on a board | substrate.

  FIG. 1 is a diagram showing a schematic configuration of a direct drawing apparatus 1 which is a drawing apparatus according to an embodiment of the present invention. The direct drawing apparatus 1 is an apparatus for drawing an image of a pattern on a substrate 9 by irradiating light on the upper surface of the substrate 9 on which a photosensitive layer which is a layer of a photosensitive material such as a resist is formed. The substrate 9 is various substrates such as a semiconductor substrate, a printed wiring substrate, a color filter substrate, a liquid crystal display device, an organic EL display device, a glass substrate for a flat panel display device such as a plasma display device, a recording disk substrate, and the like. Good.

  The direct drawing apparatus 1 includes a stage 11, a stage moving mechanism 12, a light source unit 13, an optical head 14, a transport robot 15, a cassette mounting unit 16, a base 17, a cover 18, a control unit 19, and the like. The cover 18 covers the upper side of the base 17 and forms a processing space in which the substrate 9 is processed. In the processing space, a stage 11, a stage moving mechanism 12, a light source unit 13, an optical head 14, and a transfer robot 15 are arranged. The light source unit 13 may be disposed outside the processing space. The direct drawing apparatus 1 is also provided with an alignment unit (not shown).

  The stage moving mechanism 12 is disposed on the base 17. The stage moving mechanism 12 includes a Y direction moving mechanism 121, an X direction moving mechanism 122, and a rotating mechanism 123. The stage 11 holds the substrate 9 on its upper surface in a horizontal posture. The stage moving mechanism 12 is a moving mechanism that moves the substrate 9 together with the stage 11. The rotation mechanism 123 rotates the stage 11 around a central axis that faces the Z direction that is the vertical direction. The X direction moving mechanism 122 moves the rotating mechanism 123 and the stage 11 in the X direction that is the sub-scanning direction. The X direction is a horizontal direction perpendicular to the Z direction. The Y-direction moving mechanism 121 moves the X-direction moving mechanism 122, the rotating mechanism 123, and the stage 11 in the Y direction that is the main scanning direction. The Y direction is a horizontal direction perpendicular to the Z direction and the X direction.

  The Y direction moving mechanism 121 includes a linear motor and a guide rail 212, and moves the X direction moving mechanism 122 along the guide rail 212 by the linear motor. The X-direction moving mechanism 122 also includes a linear motor 221 and a guide rail 222, and the rotating mechanism 123 is moved along the guide rail 222 by the linear motor 221.

  The light source unit 13 is supported by a column 131 fixed to the base 17. The optical head 14 is connected to the light source unit 13. The number of the optical heads 14 may be two or more. In this case, for example, the optical heads 14 are arranged in the X direction. The light source unit 13 includes a laser driving unit, a laser oscillator, and an optical system. The light beam generated by the light source unit 13 is guided to the optical head 14.

  The optical head 14 includes a spatial light modulator 141 that is a light modulation unit that modulates light from the light source unit 13. The spatial light modulator 141 is, for example, a GLV (registered trademark) (Grating Light Valve). The spatial light modulator 141 may be a DMD (Digital Mirror Device) or the like. The optical head 14 is spatially modulated by the spatial light modulator 141 and an optical system that converts the light beam from the light source unit 13 into linear light whose beam cross section is linear and guides it to the spatial light modulator 141. And an optical system for guiding the light beam to the substrate 9.

  The unprocessed substrate 9 is placed on the cassette placing portion 16 while being accommodated in the cassette 161. The substrate 9 is taken out from the cassette 161 by the transfer robot 15 through the opening of the cover 18 and placed on the stage 11. Then, the control unit 19 controls the alignment unit, and the position and rotational position of the substrate 9 in the XY direction are adjusted.

  The stage 11 is moved in the Y direction by the Y direction moving mechanism 121, and in parallel, a light beam spatially modulated from the optical head 14 is emitted toward the substrate 9, and a pattern is drawn on the substrate 9. When the movement in the Y direction is completed, the stage 11 is stepped in the X direction by the X direction moving mechanism 122, and drawing is performed while moving in the direction opposite to the previous time from the Y direction moving mechanism 121. When the above operation is repeated and drawing is performed on the entire area to be drawn on the substrate 9, the substrate 9 is transferred from the stage 11 to the cassette 161 by the transfer robot 15.

  In the direct drawing apparatus 1, the stage moving mechanism 12 is a scanning mechanism that scans the light modulated by the spatial light modulator 141 on the substrate 9. As the scanning mechanism, a mechanism for moving the optical head 14 in the X direction and the Y direction on the fixed stage 11 may be provided. The direct drawing apparatus 1 further includes an imaging unit 21 that images the upper surface 91 of the substrate 9. The imaging unit 21 is attached to the optical head 14, for example.

  FIG. 2 is a plan view showing the upper surface 91 of the substrate 9. The substrate 9 is obtained by mounting a plurality of semiconductor chips 92 on a substantially disk-shaped semiconductor substrate and molding the plurality of semiconductor chips 92 with a resin (so-called mold substrate). Each semiconductor chip 92 has a substantially rectangular shape in plan view. In the example shown in FIG. 2, a mark 93 is provided at the upper left corner of each semiconductor chip 92. The mark 93 is, for example, an alignment mark provided on the upper surface of each semiconductor chip 92. The mark 93 may be a part of a pattern provided on the upper surface of the semiconductor chip 92. In FIG. 2, the mark 93 is indicated by a black circle, but the shape of the mark 93 may be variously changed. In addition, the number and arrangement of the semiconductor chips 92 and the number and arrangement of the marks 93 may be variously changed.

  The plurality of marks 93 are arranged in a lattice pattern on the substrate 9 in the horizontal direction (X direction) and the vertical direction (Y direction) in FIG. In the following description, the X direction and the Y direction are also simply referred to as “lateral direction” and “vertical direction”. Further, as will be described later, the mark 93 is an object of position measurement, and therefore will be referred to as “target mark 93” in the following description. Further, the plurality of target marks 93 on the substrate 9 are collectively referred to as “target mark group 94”. In the example shown in FIG. 2, the outer shape of the target mark group 94, that is, the shape in which a plurality of target mark 93 positioned on the outer edge of the target mark group 94 is connected by a straight line is a substantially rectangular shape. Note that the outer shape of the target mark group 94 is not limited to a substantially rectangular shape, and may be variously changed.

  In the direct drawing apparatus 1, the drawing data of the image drawn on the substrate 9 is corrected by the control unit 19 based on the position information of the mark 93 on the substrate 9, and a plurality of semiconductor chips 92 are based on the corrected drawing data. A pattern is drawn on top. The correction of the drawing data will be described later. In the substrate 9, the upper surfaces of the plurality of semiconductor chips 92 are a plurality of pattern drawing areas in which patterns are drawn.

  FIG. 3 is a block diagram illustrating functions of the control unit 19. FIG. 3 also shows a part of the configuration of the direct drawing apparatus 1 connected to the control unit 19. The control unit 19 has a general computer system configuration including a CPU that performs various arithmetic processes, a ROM that stores basic programs, and a RAM that stores various types of information. The function of the control unit 19 may be realized by a dedicated electrical circuit, or a partially dedicated electrical circuit may be used.

  As shown in FIG. 3, the control unit 19 includes a correction information generation device 31 and a drawing data correction unit 32. The correction information generation device 31 includes a design position storage unit 311, a measurement position acquisition unit 312, a repetition control unit 313, and a correction information generation unit 314. The correction information generation device 31 generates correction information used for correcting drawing data of an image drawn on the substrate 9 based on the position information of the mark 93 on the substrate 9. The drawing data correction unit 32 uses the correction information generated by the correction information generation device 31 to correct the drawing data of the image to be drawn on the substrate 9.

  Next, the flow of drawing an image on the substrate 9 by the direct drawing apparatus 1 will be described with reference to FIG. In the direct drawing device 1, first, the design position of the target mark group 94, which is a plurality of target marks 93 arranged in a grid in the vertical and horizontal directions on the substrate 9, is a design position storage unit of the correction information generating device 31. It is prepared by being stored by 311 (step S11). The design position of the target mark group 94 is extracted from, for example, CAD data that is design data of an image to be drawn on the substrate 9 and stored in the design position storage unit 311.

  In the design data, the design positions of the plurality of target marks 93 in the target mark group 94 are arranged at equal intervals along the vertical direction and the horizontal direction. In the following description, the distance between each two target marks 93 adjacent in the vertical direction or the horizontal direction is referred to as “the distance between the marks”. The distance between the marks in the vertical direction and the distance between the marks in the horizontal direction may be the same or different. In the example shown in FIG. 2, the distance between the marks in the vertical direction is the same as the distance between the marks in the horizontal direction. The distance between the marks is, for example, about 2 mm.

  Subsequently, the upper surface 91 of the substrate 9 on the stage 11 is imaged by the imaging unit 21, and an image of the substrate 9 (hereinafter referred to as “measurement image”) is acquired. The measurement image of the substrate 9 is an image obtained by photographing the target mark group 94 on the substrate 9. The measurement image acquired by the imaging unit 21 is sent to the measurement position acquisition unit 312 of the control unit 19.

  The measurement position acquisition unit 312 acquires the position of the target mark which is the one target mark 93 in the measurement image (step S12). In the following description, the position of the mark on the measurement image is referred to as “measurement position”. As the target mark, for example, one target mark 93 located at the end in one of the vertical direction and the horizontal direction is extracted from the target mark group 94 in the measurement image. In the example illustrated in FIG. 2, the most (−X) side target mark 93 in the target mark group 94 is extracted as the target mark, and the measurement position of the target mark is acquired. In FIG. 2, the target mark 93 that is the target mark is surrounded by a two-dot chain line circle.

  Subsequently, an adjacent center position that is a position separated from the target mark in the vertical or horizontal direction by the distance between the above-described marks is obtained, and an adjacent area 95 having a predetermined size centered on the adjacent center position is noted. . Then, the target mark 93 included in the adjacent area 95 is extracted as an adjacent mark adjacent to the target mark, and the measurement position of the adjacent mark in the measurement image is acquired (step S13). In FIG. 2, an adjacent region 95 centered on the adjacent center position that is separated from the above-described attention mark in the vertical direction ((−Y) side) by the distance between the marks is drawn by a two-dot chain line. In the example shown in FIG. 2, the adjacent region 95 has a substantially rectangular shape composed of sides substantially parallel to the vertical direction and the horizontal direction. The adjacent region 95 is, for example, a substantially square having a side of about 200 μm.

  Next, when the measurement position acquisition unit 312 is controlled by the repeat control unit 313, the adjacent mark from which the measurement position is acquired in step S13 is set as a new attention mark (step S14). And it returns to step S13 and acquisition of the measurement position of the new adjacent mark adjacent to the said new attention mark is repeated (step S15, S13). Specifically, a new adjacent center position that is a position separated from the new attention mark in the vertical or horizontal direction by the distance between the above-described marks is obtained, and a predetermined size centered on the new adjacent center position is obtained. The new adjacent area 95 is noted. Then, the target mark 93 included in the new adjacent area 95 is extracted as a new adjacent mark adjacent to the new attention mark, and the measurement position of the new adjacent mark in the measurement image is acquired. The repetition control unit 313 stores the order of the plurality of target marks 93 as the attention marks (hereinafter referred to as “attention order”).

  In the repetition of steps S13 to S15, for example, a plurality of target marks 93 arranged in the substantially (−Y) direction from the first target mark are sequentially set as adjacent marks, and the measurement position is acquired. When the target mark 93 does not exist in the (−Y) side adjacent area 95 of the attention mark, the (+ X) side adjacent area 95 of the attention mark is noted, and the target mark 93 of the adjacent area 95 is set as the adjacent mark. After the measurement position is acquired, it becomes a new attention mark. Then, a plurality of target marks 93 arranged in a substantially (+ Y) direction from the new target mark are sequentially set as adjacent marks, and a measurement position is acquired. Similarly, when the target mark 93 does not exist in the (+ Y) side adjacent area 95 of the target mark, the (+ X) side adjacent area 95 of the target mark is also noted, and the target mark 93 of the adjacent area 95 is displayed. After the measurement position is acquired as an adjacent mark, it is set as a new notice mark.

  Thereafter, a plurality of target marks 93 arranged in a substantially (−Y) direction from the new target mark are sequentially set as adjacent marks, and a measurement position is acquired. In this case, as shown in FIG. 5, in the target mark group 94, a plurality of target mark rows 96, each of which is a row of the target mark 93 extending in the vertical direction, from the (−X) side in the (+ X) direction. The measurement position of the target mark 93 is acquired sequentially. In FIG. 5, each target mark row 96 is surrounded by a two-dot chain line. In the example shown in FIG. 5, the target mark group 94 is a set of a plurality of target mark rows 96 each extending along the entire length of the target mark group 94 in the vertical direction and arranged along the horizontal direction. In the correction information generation device 31, the above steps S13 to S15 are repeated until the measurement positions of all the target marks 93 on the measurement image are acquired, that is, until the next adjacent mark does not exist.

  Note that the target mark row 96 may be a row of target mark 93 extending in the horizontal direction. In this case, the target mark group 94 is a set of a plurality of target mark rows 96 each extending over the entire length of the target mark group 94 in the horizontal direction and arranged along the vertical direction. In the correction information generation device 31, as described above, the above-described steps S <b> 13 to S <b> 15 are repeated until the measurement positions of all the target marks 93 on the measurement image are acquired, whereby a plurality of target mark sequences 96 are processed. For example, the measurement position of the target mark 93 is acquired sequentially from the (+ Y) side toward the (−Y) direction.

  In other words, in the correction information generation device 31, one target mark located at the end in one of the vertical direction and the horizontal direction in the target mark group 94 is set as the target mark. Then, the measurement position acquisition unit 312 is controlled by the repeat control unit 313, so that the target mark group 94 (that is, a plurality of pieces extending over the entire length of the target mark group 94 in the other direction of the vertical direction and the horizontal direction). In the set of target mark sequences 96, the measurement position of the target mark sequence 96 including the target mark is first acquired. Thereafter, the measurement positions of the target mark sequence 96 whose measurement positions have already been acquired and the target mark sequence 96 adjacent in the one direction described above are sequentially acquired.

  When the measurement positions of all the target marks 93 on the measurement image are acquired, the correction information generation unit 314 associates each measurement position of the all target marks 93 with the design position of the target mark group 94. Associating the measurement position of the target mark group 94 with the design position (that is, pairing processing), for example, the measurement position of the target mark string 96 on the most (−X) side from which the measurement position is first acquired is designed. After associating with the design position of the target mark sequence located on the most (−X) side in the data, the remaining target mark sequence 96 is associated with the target mark sequence of the design data for each column.

  Then, for each target mark 93 in the target mark group 94, correction information used for correcting the drawing data is generated based on the difference between the corresponding measurement position and the design position (step S16). Specifically, the deviation of the measurement position of each target mark 93 from the design position is acquired as the position shift from the design position of the semiconductor chip 92 corresponding to each target mark 93, and all the semiconductor chips 92 on the substrate 9 are obtained. Correction information for correcting each of the positional deviations is generated.

  When the correction information is acquired as described above, the drawing data correction unit 32 corrects the drawing data of the image to be drawn on the substrate 9 using the correction information (step S17). Specifically, the position of the pattern to be drawn on each semiconductor chip 92 included in the drawing data is corrected based on correction information indicating a positional deviation from the design position of each semiconductor chip 92. The modulated light is scanned on the substrate by controlling the spatial light modulator 141 and the stage moving mechanism 12 based on the corrected drawing data. Thereby, the pattern for each semiconductor chip 92 included in the drawing data is accurately drawn on each corresponding semiconductor chip 92 in consideration of the positional deviation of the semiconductor chip 92 (step S18).

  As described above, the correction information generation device 31 includes the design position storage unit 311, the measurement position acquisition unit 312, the repetition control unit 313, and the correction information generation unit 314. The design position storage unit 311 stores the design position of the target mark group 94 which is a plurality of target marks 93 arranged in a lattice pattern in the vertical direction and the horizontal direction on the substrate 9. The measurement position acquisition unit 312 acquires the measurement position of the target mark that is one target mark 93 in the measurement image that is an image obtained by capturing the target mark group 94. Then, pay attention to an adjacent area 95 having a predetermined size centered on an adjacent center position that is a position that is a predetermined distance (distance between the marks) in the vertical or horizontal direction from the target mark. The target mark 93 included is extracted as an adjacent mark adjacent to the target mark, and the measurement position of the adjacent mark is acquired.

  The iterative control unit 313 controls the measurement position acquisition unit 312 to use the adjacent mark as a new attention mark until the measurement positions of all the target marks 93 on the measurement image are acquired, and is adjacent to the new attention mark. Repeat acquisition of the measurement position of a new adjacent landmark. The correction information generation unit 314 associates the measurement positions of all the target marks 93 on the measurement image with the design positions of the target mark group 94, and uses them for correcting the drawing data based on the difference between the corresponding measurement positions and the design positions. Correction information to be generated is generated.

  As described above, the correction information generation apparatus 31 sequentially acquires the measurement positions of the other target marks 93 adjacent to the target mark 93 in the vertical direction or the horizontal direction by using the already acquired measurement positions of the target mark 93. By doing so, the measurement position of each target mark 93 of the target mark group 94 can be acquired with high accuracy. Thereby, the pairing process of the target mark 93 can be performed easily and appropriately. As a result, correction information used for correcting drawing data of an image drawn on the substrate 9 can be generated easily and with high accuracy.

  In the correction information generation device 31, the acquisition of the measurement position of the target mark 93 in steps S <b> 13 to S <b> 15 and the pairing process in step S <b> 16 may be performed alternately for each target mark row 96. That is, after the measurement position of the most (−X) side target mark sequence 96 from which the measurement position is first acquired is acquired, the next target mark sequence 96 (second target mark sequence 96 from the (−X) side) is acquired. ) Before the measurement position is acquired, the measurement position of the first target mark train 96 is associated with the design position. Each time the measurement position of the new target mark sequence 96 is acquired, the measurement position of the new target mark sequence 96 is associated with the design position. Accordingly, since the result of the pairing process of the first target mark sequence 96 can be used in the pairing process of the second and subsequent target mark sequences 96 from the (−X) side, the second and subsequent target mark sequences 96 can be used. The pairing process of the target mark sequence 96 can be easily performed.

  As described above, the direct drawing device 1 includes the correction information generation device 31, the light source unit 13, the drawing data correction unit 32, the spatial light modulator 141, and the stage moving mechanism 12. The drawing data correction unit 32 corrects the drawing data of the image to be drawn on the substrate 9 using the correction information generated by the correction information generation device 31. The spatial light modulator 141 is a light modulation unit that modulates light from the light source unit 13 based on the drawing data corrected by the drawing data correction unit 32. The stage moving mechanism 12 is a scanning mechanism that scans the light modulated by the spatial light modulator 141 on the substrate 9. In the direct drawing device 1, it is possible to realize high-precision drawing on a plurality of pattern drawing regions on the substrate 9 based on the positions of the plurality of target marks 93 on the substrate 9.

  The acquisition order of the measurement positions of the plurality of target marks 93 by the correction information generation device 31 may be variously changed. For example, in the same way as described above, the measurement position acquisition unit 312 sets one target mark 93 located at the end in one of the vertical direction and the horizontal direction as the target mark in the target mark group 94. Subsequently, when the measurement position acquisition unit 312 is controlled by the repetition control unit 313, the target mark group 94 (that is, each extends over the entire length of the target mark group 94 in the other of the vertical direction and the horizontal direction). In a set of a plurality of target mark sequences 96), the measurement position of the target mark sequence 96 including the target mark is first acquired. Note that the target mark does not necessarily have to be positioned at the end of the target mark string 96 including the target mark, and may be positioned at the center of the target mark string 96.

  Thereafter, for each target mark 93 of the target mark row 96 from which the measurement position is first acquired, an adjacent region 95 centered on an adjacent center position that is separated from the measurement position of each target mark 93 by the distance between the marks (+ X). Is noticed. Then, in the plurality of adjacent areas 95 adjacent to the plurality of target marks 93 in the first target mark row 96 in the one direction, for example, from the (+ Y) side toward the (−Y) side, The measurement position of the target mark 93 is acquired in order. Thereby, the measurement position of all the target mark 93 of the 2nd target mark row | line 96 from the (-X) side is acquired. Thereafter, the measurement positions of the target mark sequence 96 whose measurement positions have already been acquired and the target mark sequence 96 adjacent in the one direction described above are sequentially acquired.

  As described above, the correction information generating device 31 uses the measurement positions of the target mark marks 93 of the target mark string 96 whose measurement positions have already been acquired, and uses the target mark marks 96 of the target mark mark 96 adjacent in the one direction. 93 measurement positions can be easily obtained.

  Also in this case, the acquisition of the measurement position of the target mark 93 in steps S13 to S15 and the pairing process in step S16 may be performed alternately for each target mark row 96. That is, after the measurement position of the most (−X) side target mark sequence 96 from which the measurement position is first acquired is acquired, the next target mark sequence 96 (second target mark sequence 96 from the (−X) side) is acquired. ) Before the measurement position is acquired, the measurement position of the first target mark train 96 is associated with the design position. Each time the measurement position of the new target mark sequence 96 is acquired, the measurement position of the new target mark sequence 96 is associated with the design position. Accordingly, since the result of the pairing process of the first target mark sequence 96 can be used in the pairing process of the second and subsequent target mark sequences 96 from the (−X) side, the second and subsequent target mark sequences 96 can be used. The pairing process of the target mark sequence 96 can be easily performed.

  In the acquisition of the measurement position of the target mark 93 described above, the first target mark 93 is one target mark 93 located at the end in one of the vertical direction and the horizontal direction in the target mark group 94 in the measurement image. There is no necessity. For example, any one target mark 93 in the target mark group 94 is selected as a notice mark, and adjacent areas on the (+ X) side, (−X) side, (+ Y) side, and (−Y) side of the notice mark. The measurement positions may be acquired by focusing on 95 in order, and using the target mark 93 of each adjacent region 95 as the adjacent mark. Then, the acquisition of the measurement position of the adjacent mark where the measurement position is not acquired among the new adjacent marks adjacent to the target mark is repeated using the adjacent mark from which the measurement position is acquired as a new attention mark. If the measurement positions of all the adjacent landmarks adjacent to the new attention mark have been acquired, the above attention order is traced back, the new attention mark is selected, and the acquisition of the measurement positions of the adjacent landmarks is repeated. The new target mark selected retroactively is the target mark 93 whose measurement position has been acquired, and the target mark 93 which is adjacent to the target mark 93 whose measurement position has not been acquired in the vertical or horizontal direction. It is.

  Also in this case, steps S13 to S15 described above are repeated until the measurement positions of all the target marks 93 on the measurement image are acquired. When the measurement positions of all the target marks 93 on the measurement image are acquired, the correction information generation unit 314 associates each measurement position of the all target marks 93 with the design position of the target mark group 94. The correspondence between the measurement position of the target mark group 94 and the design position is, for example, the measurement position of the target mark 93 positioned at each corner of the target mark group 94 having a substantially rectangular shape at each corner in the design data. This is performed by associating with the design position of the target mark to be positioned. Then, for each target mark 93 in the target mark group 94, correction information used for correcting the drawing data is generated based on the difference between the corresponding measurement position and the design position. As a result, the pairing process of the target mark 93 can be performed easily and appropriately as described above, and as a result, correction information used for correcting the drawing data can be generated easily and with high accuracy.

  FIG. 6 is a diagram illustrating another preferable example of the control unit 19 of the direct drawing apparatus 1. In the control unit 19 illustrated in FIG. 6, the correction information generation device 31 a further includes a target mark sequence acquisition unit 315 in addition to the design position storage unit 311, the measurement position acquisition unit 312, the repetition control unit 313, and the correction information generation unit 314. Prepare.

  FIG. 7 is a diagram illustrating a flow of drawing an image by the direct drawing device 1 including the correction information generation device 31a. In the direct drawing apparatus 1, first, similarly to step S <b> 11 shown in FIG. 4, the design position of the target mark group 94 that is a plurality of target marks 93 arranged in a grid pattern in the vertical direction and the horizontal direction on the substrate 9 is set. The information is prepared by being stored in the design position storage unit 311 of the correction information generation device 31 (step S21).

  Subsequently, a measurement image obtained by photographing the target mark group 94 on the substrate 9 is acquired by the imaging unit 21 and sent to the measurement position acquisition unit 312 of the control unit 19. The measurement position acquisition unit 312 selects a target mark that is one target mark 93, and acquires a measurement position that is a position on the measurement image of the target mark (step S22). In step S22, one target mark 93 located at the end in one of the vertical direction and the horizontal direction in the target mark group 94 in the measurement image is extracted as the target mark and the measurement position is acquired. For example, the target mark 93 on the most (−X) side in the target mark group 94 is extracted as a target mark so as to be surrounded by a two-dot chain circle in FIG. 2, and the measurement position of the target mark is acquired. .

  Next, an adjacent center position that is a position separated by the distance between the above-mentioned marks in the other direction of the vertical direction and the horizontal direction from the target mark is obtained, and an adjacent area having a predetermined size centered on the adjacent center position 95 is noted. For example, as shown by a two-dot chain line in FIG. 2, an adjacent region 95 centering on an adjacent center position that is separated from the above-mentioned attention mark by a distance between the marks in the vertical direction ((−Y) side) is noted. . Then, the target mark 93 included in the adjacent area 95 is extracted as an adjacent mark adjacent to the target mark, and the measurement position of the adjacent mark in the measurement image is acquired.

  Thereafter, the target mark sequence acquisition unit 315 extracts the target mark sequence including the target mark and extending over the entire length of the target mark group 94 in the other direction described above. For example, among the plurality of target mark sequences 96 arranged in the horizontal direction (X direction) in FIG. 5, the target mark sequence 96 closest to the (−X) side is extracted as the target target mark sequence. Further, the measurement position acquisition unit 312 is controlled by the target mark sequence acquisition unit 315, whereby the adjacent target mark is set as a new target mark in the target target mark sequence in the other direction described above. Acquisition of a measurement position of a new adjacent landmark is repeated. As a result, the measurement positions of all the target marks 93 in the target mark series are obtained (step S23).

  When step S <b> 23 ends, the repetitive control unit 313 removes the target mark sequence 96 for which the measurement position has already been acquired from the target mark group 94. In the following description, a target mark group 96 from which the measurement position has already been acquired from the target mark group 94 is referred to as an “unacquired target mark group”. If there is an unacquired target mark group (step S24), the repetition control unit 313 controls the target mark string acquisition unit 315 to return to step S22, and among the unacquired target mark group, the one direction described above Next, the next target mark 93 which is the one target mark 93 positioned at the end is selected, and the measurement position of the next target mark is acquired (step S22). Then, the measurement positions of all target marks 93 in the next target mark sequence including the next target mark are acquired (step S23).

  In the correction information generating device 31a, the above steps S22 to S24 are repeated until the measurement positions of all the target marks 93 on the measurement image are acquired, that is, until there is no unacquired target mark group.

  When the measurement positions of all the target marks 93 on the measurement image are acquired, the correction information generation unit 314 associates each measurement position of the all target marks 93 with the design position of the target mark group 94 (that is, The pairing process is performed.) In the pairing process, for example, the measurement position of the most (−X) side target mark sequence 96 from which the measurement position is first acquired is the design position of the target mark sequence positioned on the most (−X) side in the design data. After the association, the remaining target mark sequence 96 is associated with the target mark sequence of the design data for each column. Then, for each target mark 93 of the target mark group 94, correction information used for correcting the drawing data is generated based on the difference between the corresponding measurement position and the design position (step S25).

  When the correction information is acquired in this way, the drawing data correction unit 32 corrects the drawing data of the image to be drawn on the substrate 9 using the correction information (step S26). The modulated light is scanned on the substrate by controlling the spatial light modulator 141 and the stage moving mechanism 12 based on the corrected drawing data. Thereby, the pattern for each semiconductor chip 92 included in the drawing data is accurately drawn on each corresponding semiconductor chip 92 in consideration of the positional deviation of the semiconductor chip 92 (step S27).

  As described above, the correction information generating device 31a can easily and appropriately perform the pairing process of the target mark 93 by acquiring the measurement positions of the plurality of target mark 93 for each target mark row 96. . As a result, correction information used for correcting drawing data of an image drawn on the substrate 9 can be generated easily and with high accuracy. Further, in the direct drawing device 1 including the correction information generating device 31a, it is possible to realize high-precision drawing on a plurality of pattern drawing regions on the substrate 9 based on the positions of the plurality of target marks 93 on the substrate 9. it can.

  In the correction information generation device 31a, the acquisition of the measurement position of the target mark 93 of the target mark string 96 in steps S22 to S24 and the pairing process in step S25 may be alternately performed for each target mark string 96. That is, after the measurement position of the most (−X) side target mark sequence 96 from which the measurement position is first acquired is acquired, the next target mark sequence 96 (second target mark sequence 96 from the (−X) side) is acquired. ) Before the measurement position is acquired, the measurement position of the first target mark train 96 is associated with the design position. Each time the measurement position of the new target mark sequence 96 is acquired, the measurement position of the new target mark sequence 96 is associated with the design position. Thereby, the pairing process of the object mark row | line | column 96 can be performed easily.

  Various modifications are possible in the above-described correction information generation devices 31 and 31a and the direct drawing device 1.

  For example, in the direct drawing device 1, the imaging unit 21 may be omitted. In this case, for example, an image (measurement image) of the target mark group 94 on the substrate 9 photographed by an apparatus other than the direct drawing apparatus 1 is input to the correction information generation apparatuses 31 and 31a and is measured by the measurement position acquisition unit 312. Accepted.

  Each semiconductor chip 92 on the substrate 9 may be provided with two or more marks. For example, marks are provided at the upper left corner and the lower right corner of the upper surface of each semiconductor chip 92. In this case, first, a plurality of marks arranged at the upper left corners of the plurality of semiconductor chips 92 are set as the target marks 93, respectively, and the plurality of the upper left corners are obtained in the same manner as the acquisition of the measurement positions of the target marks 93 described above. The measurement position of the target mark 93 is acquired. Thereafter, a plurality of marks arranged at the lower right corners of the plurality of semiconductor chips 92 are set as the target marks 93, respectively, and the plurality of lower right plurality of marks are obtained in the same manner as the acquisition of the measurement positions of the target marks 93 described above. The measurement position of the target mark 93 is acquired. Then, the difference between the measurement position and the design position of the target mark 93 arranged at the upper left corner and the lower right corner of each semiconductor chip 92 is obtained, and correction information is generated based on the difference.

  Alternatively, first, a plurality of marks arranged at upper left corners of the plurality of semiconductor chips 92 are set as target marks 93, respectively, and the plurality of upper left corners are obtained in the same manner as the acquisition of the measurement position of the target mark 93 described above. The measurement position of the target mark 93 is acquired. Then, in each semiconductor chip 92, an adjacent area centered on an adjacent center position that is separated by a predetermined distance in the lower right direction from the target mark 93 disposed in the upper left corner is noted, and the mark in the adjacent area The measurement position (that is, the mark placed at the lower right corner) is acquired. Thereafter, the difference between the measurement position of the target mark 93 arranged at the upper left corner of each semiconductor chip 92 and the mark arranged at the lower right corner and the design position is obtained, and correction information is obtained based on the difference. Generated.

  The correction information generation device 31 including the design position storage unit 311, the measurement position acquisition unit 312, the repetition control unit 313, and the correction information generation unit 314 illustrated in FIG. 3 draws on the substrate 9 based on the position information of the mark on the substrate 9. It may be used alone as an apparatus (for example, a computer system as described above) that generates correction information used for correcting drawing data of an image to be performed. 6 includes a design position storage unit 311, a measurement position acquisition unit 312, a repeat control unit 313, a correction information generation unit 314, and a target mark sequence acquisition unit 315. It may be used alone as a device (for example, a computer system as described above) that generates correction information used for correcting drawing data of an image drawn on the substrate 9 based on position information. Alternatively, the correction information generation devices 31 and 31a may be used together with a device other than the direct drawing device 1.

  The configurations in the above-described embodiments and modifications may be combined as appropriate as long as they do not contradict each other.

DESCRIPTION OF SYMBOLS 1 Direct drawing apparatus 9 Board | substrate 12 Stage moving mechanism 13 Light source part 31, 31a Correction information generation apparatus 32 Drawing data correction part 93 Target mark 94 Target mark group 95 Adjacent area 96 Target mark row 141 Spatial light modulator 311 Design position memory | storage part 312 Measurement position acquisition unit 313 Repetition control unit 314 Correction information generation unit 315 Target mark sequence acquisition unit S11 to S18, S21 to S27 Steps

Claims (8)

A correction information generating device that generates correction information used for correcting drawing data of an image drawn on the substrate based on position information of a mark on the substrate,
A design position storage unit that stores a design position of a target mark group that is a plurality of target marks arranged in a grid pattern in the vertical and horizontal directions on the substrate;
In a measurement image that is an image obtained by photographing the target landmark group, a measurement position of the target landmark that is one target landmark is acquired, and is a position that is separated from the target landmark by a predetermined distance in the vertical direction or the horizontal direction. Pay attention to an adjacent area of a predetermined size centered on the adjacent center position, extract a mark included in the adjacent area as an adjacent mark adjacent to the target mark, and acquire a measurement position of the adjacent mark And
By controlling the measurement acquisition unit, until the measurement positions of all target marks on the measurement image are acquired, the adjacent mark is used as a new mark of interest, and the vertical direction or the horizontal direction from the new mark of interest. Pay attention to the new adjacent area of the predetermined size centered on the new adjacent center position that is a position separated by the predetermined distance, and use the mark included in the new adjacent area as the new attention mark It extracts as a new adjacent mark adjacent to it, and repeatedly repeats acquisition of the measurement position of the new mark,
Correction information used for correcting drawing data based on the difference between the corresponding measurement position and the design position by associating the measurement positions of all the target marks on the measurement image with the design positions of the target mark group A correction information generation unit for generating
A correction information generating apparatus comprising: The correction information generating device according to claim 1,
By the measurement position acquisition unit, one target mark located at the end in one of the vertical direction and the horizontal direction in the target mark group is set as the target mark.
The target mark group is a set of a plurality of target mark rows each extending over the entire length of the target mark group in the other direction of the vertical direction and the horizontal direction, and the measurement acquisition unit is controlled by the repetitive control unit As a result, the measurement position of the target mark sequence including the target mark is first acquired, and the measurement positions of the target mark sequence adjacent to the target mark sequence in which the measurement position is already acquired in the one direction are sequentially acquired. The correction information generation device characterized by the above. A correction information generating device that generates correction information used for correcting drawing data of an image drawn on the substrate based on position information of a mark on the substrate,
A design position storage unit that stores a design position of a target mark group that is a plurality of target marks arranged in a grid pattern in the vertical and horizontal directions on the substrate;
In the measurement image that is an image obtained by photographing the target mark group, the measurement position of the target mark that is one of the target marks located at the end in the vertical direction or the horizontal direction in the target mark group is acquired. Then, pay attention to an adjacent area of a predetermined size centered on an adjacent center position that is a predetermined distance away from the attention mark in the other of the vertical direction and the horizontal direction, and included in the adjacent area And a measurement position acquisition unit that acquires a measurement position of the adjacent mark;
By controlling the measuring position acquisition unit, the focused target mark row extending over the entire length of the target mark group in the other direction with including the target mark, the adjacent mark as a new target marker, the new Pay attention to the new adjacent area of the predetermined size centered on the new adjacent center position that is a position separated by the predetermined distance in the other direction of the vertical direction and the horizontal direction from the attention mark Extracting the mark included in the new adjacent area as a new adjacent mark adjacent to the new target mark, and repeatedly acquiring the measurement position of the new adjacent mark, A target mark sequence acquisition unit for acquiring the measurement position of
By not controlling the target mark sequence acquisition unit, until the measurement positions of all target landmarks on the measurement image are acquired, the unacquired target excluding the target mark sequence whose measurement positions have already been acquired from the target mark group The measurement position of the next target mark that is the one target mark located at the end in the one direction in the one direction is acquired, and all the target marks of the next target mark sequence including the next target mark are acquired. A repeat control unit that repeats acquisition of the measurement position;
Correction information used for correcting drawing data based on the difference between the corresponding measurement position and the design position by associating the measurement positions of all the target marks on the measurement image with the design positions of the target mark group A correction information generation unit for generating
A correction information generating apparatus comprising: A drawing device for drawing an image on a substrate,
A light source unit;
The correction information generating device according to any one of claims 1 to 3,
A drawing data correction unit for correcting drawing data of an image to be drawn on a substrate using the correction information generated by the correction information generation device;
A light modulation unit that modulates light from the light source unit based on the drawing data corrected by the drawing data correction unit;
A scanning mechanism that scans the light modulated by the light modulator on the substrate;
A drawing apparatus comprising: A correction information generation method for generating correction information used for correcting drawing data of an image drawn on the substrate based on position information of a mark on the substrate,
a) preparing a design position of a target mark group that is a plurality of target marks arranged in a grid pattern in the vertical and horizontal directions on the substrate;
b) obtaining a measurement position of a target landmark that is one target landmark in a measurement image that is an image of the target landmark group; and
c) paying attention to an adjacent area having a predetermined size centered on an adjacent center position that is a predetermined distance away from the attention mark in the vertical direction or the horizontal direction, and the mark included in the adjacent area is Extracting as an adjacent mark adjacent to the target mark, and obtaining a measurement position of the adjacent mark;
d) Until the measurement positions of all the target marks on the measurement image are acquired, the adjacent marks whose measurement positions have been acquired in the step c) are used as new attention marks, and the vertical direction from the new attention mark. Alternatively, pay attention to a new adjacent area of the predetermined size centered on a new adjacent center position that is a position separated by the predetermined distance in the lateral direction, and a mark included in the new adjacent area is added to the new adjacent area. Extracting as a new adjacent mark adjacent to the attention mark, repeating the acquisition of the measurement position of the new adjacent mark ,
e) associating the measurement positions of all the target landmarks on the measurement image acquired in the step d) with the design positions of the target landmark group, and based on the difference between the corresponding measurement positions and the design positions. Generating correction information used to correct drawing data;
A correction information generation method comprising: The correction information generation method according to claim 5,
In the step b), one target mark located at the end in one of the vertical direction and the horizontal direction in the target mark group is set as the target mark.
In the step c) and the step d), the target mark group is a set of a plurality of target mark rows each extending over the entire length of the target mark group in the other direction of the vertical direction and the horizontal direction, The measurement position of the target landmark sequence including the target landmark selected in the step b) is first acquired, and the measurement position of the target landmark sequence adjacent in the one direction to the target landmark sequence whose measurement position has already been acquired. Are acquired in order, the correction information generation method characterized by the above-mentioned. A correction information generation method for generating correction information used for correcting drawing data of an image drawn on the substrate based on position information of a mark on the substrate,
a) preparing a design position of a target mark group that is a plurality of target marks arranged in a grid pattern in the vertical and horizontal directions on the substrate;
b) In the measurement image that is an image obtained by photographing the target mark group, the measurement position of the target mark that is the one target mark that is located at the end in one of the vertical direction and the horizontal direction in the target mark group A process of obtaining
c) pay attention to an adjacent area having a predetermined size centered on an adjacent center position that is a predetermined distance away from the target mark in the other of the vertical direction and the horizontal direction, and is included in the adjacent area Extracting the mark to be a mark adjacent to the mark of interest and obtaining a measurement position of the mark;
d) In the target mark array that includes the target mark and extends in the other direction over the entire length of the target mark group, the adjacent mark whose measurement position is acquired in step c) is used as a new target mark. A new adjacent region having a predetermined size centered on a new adjacent center position that is a position separated from the new attention mark in the other direction of the vertical direction and the horizontal direction by the predetermined distance. Pay attention, extract the mark included in the new adjacent area as a new adjacent mark adjacent to the new attention mark, and repeatedly obtain the measurement position of the new adjacent mark , Acquiring measurement positions of all target landmarks;
e) Until the measurement positions of all the target landmarks on the measurement image are acquired, in the one direction among the unacquired target landmark groups excluding the target landmark string whose measurement positions have already been acquired from the target landmark group The measurement position of the next attention mark which is the one target mark located at the end is obtained, and the next attention including the next attention mark is performed by performing the step c) and the step d) with respect to the next attention mark. Repeating the acquisition of measurement positions of all target landmarks in the target landmark row;
f) Associating the measurement positions of all the target marks on the measurement image acquired in the step e) with the design positions of the target mark group, and based on the difference between the corresponding measurement positions and the design positions Generating correction information used to correct drawing data;
A correction information generation method comprising: A drawing method for drawing an image on a substrate,
Obtaining correction information by the correction information generating method according to any one of claims 5 to 7,
Correcting the drawing data of the image drawn on the substrate using the correction information;
Scanning light modulated on the substrate based on the corrected drawing data;
A drawing method comprising:

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