TWI643247B - Correction information generating apparatus, imaging apparatus, correction information generating method and imaging method - Google Patents

Abstract

The measurement position acquisition unit of the present invention acquires the measurement position of the attention mark as an object mark 93 in the measurement image which is the image of the subject mark group 94. Then, the object mark 93 included in the adjacent area 95 centered on the adjacent center position that is a predetermined distance from the attention mark in the vertical or horizontal direction is taken as the adjacent mark, and the measurement position is obtained. The repeated control unit sets the adjacency mark as a new attention mark, and repeatedly acquires the measurement positions of the new adjacency marks adjacent to the new attention mark, until the measurement positions of all the object marks 93 on the measurement image are acquired. The correction information generation unit establishes a correspondence relationship between the measurement positions of all the object marks 93 on the measurement image and the design positions of the object mark group 94, and generates correction information for correcting the drawing data based on the difference between the corresponding measurement positions and the design positions. . Thereby, the pairing process of the object symbol 93 can be performed easily and appropriately.

Description

Correction information generation device, drawing device, correction information generation method, and drawing method

The present invention relates to a technology for generating correction information for correcting drawing data of an image drawn on the substrate based on position information of a mark on the substrate.

Conventionally, a photosensitive material formed on a semiconductor substrate or a printed substrate, or a glass substrate for a plasma display device or a liquid crystal display device (hereinafter referred to as a "substrate") is irradiated with light to draw a pattern. In recent years, with the high definition of a pattern, a drawing device that directly draws a pattern by scanning a light beam on a photosensitive material.

For example, in the drawing device of Japanese Patent Laid-Open No. 2014-143335 (Document 1), a wafer (a so-called molded wafer) having a plurality of semiconductor wafers mounted on its surface is irradiated with a modulated laser light from an optical head. In this way, patterns described in computer aided design (CAD) data are repeatedly depicted on each semiconductor chip.

However, in the molded wafer as described above, a positional shift during mounting of the semiconductor wafer or a positional shift due to stress generated during molding occurs. In order to correct such discrete positional displacements, the positions of marks such as alignment marks provided on a plurality of semiconductor wafers are measured, the displacements of the measurement positions of each mark from the design position are calculated, and then the semiconductor wafers are drawn. The movement of the pattern's drawing data to match the displacement. The displacement calculation of the plurality of marks is to establish a corresponding relationship between the plurality of marks extracted from the image obtained by photographing the entire wafer and the plurality of marks included in the design data. The system performs the pairing process, and compares the measurement position of each mark that has established the corresponding relationship with the design position.

As a method of the pairing process, a closest search method is known in which a mark on a wafer image and a mark in a design data located at a design position closest to a measurement position of the mark are related. However, when the photographed wafer is rotated relative to the design data, etc., there is a possibility that the closest matching method cannot be used for proper matching processing.

The present invention is suitable for a correction information generating device, and an object thereof is to easily and appropriately perform a pairing process of symbols. The present invention is also suitable for a drawing device, a method for generating correction information, and a drawing method.

One correction information generating device of the present invention generates correction information for correcting drawing data of an image drawn on a substrate based on position information of a mark on the substrate. The correction information generating device includes a design position memory unit that memorizes the design positions of a plurality of object marks that are arranged in a grid pattern in the vertical and horizontal directions on the substrate, that is, the design position of the object mark group. The image is a measurement image, and the measurement position of the attention mark as an object mark is obtained. The attention is focused on a predetermined size centered on a position that is a predetermined distance from the attention mark in the longitudinal direction or the transverse direction, that is, adjacent to the center position. The adjacent area extracts the marks contained in the adjacent area as the adjacent marks adjacent to the attention mark and obtains the measurement position of the adjacent mark. The repeated control unit controls the measurement acquisition unit to set the adjacent mark. For the new attention mark, repeatedly obtain the measurement positions of the new adjacent marks adjacent to the new attention mark until the measurement positions of all the object marks on the above-mentioned measurement image are obtained; and the correction information generation section, which applies the above measurement The above measurement positions of all the above object marks on the image Above design position of the object of establishing the corresponding relationship mark group, and corresponds based on The difference between the measured position and the design position generates correction information for correcting the drawing data. According to the correction information generating device, it is possible to easily and appropriately perform the pairing processing of the marks.

Preferably, with the measurement position acquisition unit, one of the object marks located at the extreme end in the longitudinal direction and one of the lateral directions is set as the attention mark, and the object mark groups are set as A set of a plurality of object mark lines extending across the entire length of the object mark group in the other direction of the vertical direction and the horizontal direction, and the measurement acquisition unit is controlled by the iterative control unit, thereby obtaining the first one containing the attention mark The measurement position of the object mark line is sequentially obtained, and the measurement position of the object mark line adjacent to the measurement position in the above direction is sequentially obtained.

Another correction information generating device of the present invention generates correction information for correcting drawing data of an image drawn on the substrate based on position information of a mark on the substrate. The correction information generating device includes a design position memory unit that memorizes the design positions of a plurality of object marks that are arranged in a grid pattern in the vertical and horizontal directions on the substrate, that is, the design position of the object mark group; and a measurement position acquisition unit that captures the above object mark group In the image, that is, the measurement image, the measurement position of the object mark that is the most noticeable mark in the above-mentioned longitudinal direction and the above-mentioned horizontal direction in the above-mentioned object mark group is obtained. Positions that are separated by a predetermined distance in the other direction in the horizontal direction, that is, adjacent areas of a predetermined size centered on the adjacent center position, extract the marks contained in the adjacent areas as adjacent marks adjacent to the attention marks, and obtain the measurement positions of the adjacent marks ; The object mark line acquisition unit, which controls the measurement position acquisition unit, and sets the adjacency mark in the attention object mark line that includes the attention mark and extends across the entire length of the object mark group in the other direction. For new attention marks, repeatedly get the new attention with the above Determination of adjacent symbols to the symbols adjacent to the other direction of the new position, and acquires the measured positions of all objects that the target mark of the target mark row; repeatedly The control unit obtains one of the most unobtained object mark groups obtained by removing the object mark lines whose measurement positions have been acquired from the object mark group by controlling the object mark line acquisition section. The object mark is the measurement position of the next attention mark, and the measurement positions of all the object marks including the line of the next attention object mark below the next attention mark are repeatedly obtained until the measurement positions of all the object marks on the above measurement image are obtained. ; And a correction information generating unit that establishes a correspondence relationship between the measurement positions of all the object marks on the measurement image and the design positions of the object mark group, and generates an application based on a difference between the corresponding measurement positions and the design positions. Correction information in the correction drawing data. According to the correction information generating device, it is possible to easily and appropriately perform the pairing processing of the marks.

The drawing device for drawing an image on a substrate according to the present invention includes: a light source section; a correction information generating device such as any of the above; and a drawing data correction section for correcting the substrate using the correction information generated by the correction information generating device. Drawing data of a drawn image; a light modulation unit that modulates light from the light source unit based on the drawing data corrected by the drawing data correction unit; and a scanning mechanism that modifies the light by the light Partially modulated light is scanned on the substrate.

A method for generating correction information according to the present invention generates correction information for correcting drawing data of an image drawn on the substrate based on position information of a mark on the substrate. The method for generating correction information includes the following steps: a) preparing a plurality of object marks arranged in a grid pattern in a vertical and horizontal direction on a substrate, that is, a design position of the object mark group; b) taking an image of the above object mark group, that is, The step of obtaining the measurement position of the attention mark as an object mark in the measurement image; c) paying attention to a predetermined size centered on a position at a predetermined distance from the above-mentioned attention mark in the longitudinal direction or the transverse direction, that is, adjacent to the center position. Adjacent areas, extract the symbols contained in the adjacent areas as adjacent to the attention note Step of obtaining the adjacent position of the adjacent sign and obtaining the measurement position of the above-mentioned adjacent sign; d) setting the above-mentioned adjacent sign whose measurement position has been acquired in the step c) as a new attention mark, and repeating the above step c) to obtain The steps of measuring positions of the new adjacent marks adjacent to the above-mentioned new attention mark until obtaining the measurement positions of all the object marks on the above-mentioned measurement image; and e) the above-mentioned measurement image to be obtained in the above-mentioned step d) The above-mentioned measurement positions of all the above-mentioned object marks correspond to the above-mentioned design positions of the above-mentioned object mark group, and based on the difference between the corresponding measurement positions and the design positions, a step of generating correction information for correcting the drawing data is generated. According to this method of generating correction information, it is possible to easily and appropriately perform the pairing processing of the marks.

Preferably, in the step b), one of the object marks located at the extreme end in one of the longitudinal direction and the lateral direction is set as the attention mark, and in the step c) and the step d), In the above, the object token group is set as a collection of a plurality of object token lines extending across the entire length of the object token group in the longitudinal direction and the lateral direction, respectively, and the first selection includes the one selected in step b) above. The measurement position of the object mark line of the above-mentioned attention mark is sequentially acquired, and the measurement position of the object mark line adjacent to the measurement position in the above-mentioned one side is sequentially obtained.

Another method for generating correction information of the present invention is to generate correction information for correcting drawing data of an image drawn on the substrate based on position information of a mark on the substrate. The method for generating correction information includes the following steps: a) preparing a plurality of object marks arranged in a grid pattern in a vertical and horizontal direction on a substrate, that is, a design position of the object mark group; b) taking an image of the above object mark group, that is, In the measurement image, the step of obtaining the measurement position of the object mark that is the most noticeable mark in the above-mentioned longitudinal direction and the above-mentioned horizontal direction in the above-mentioned object mark group; Positions in the other direction that are separated by a predetermined distance in the lateral direction, that is, adjacent areas of a predetermined size with the center position as the center, are drawn from the symbols included in the adjacent areas as adjacent to the above note. The steps of obtaining the adjacent position of the target mark and obtaining the measurement position of the adjacent sign; d) in the line of the target line of the target line that includes the above-mentioned line of attention and extends across the entire length of the group of target marks in the other direction, The above-mentioned adjacent mark whose measurement position has been acquired in step) is set as a new attention mark, and step c) is repeated, and the measurement position of a new adjacent mark adjacent to the new attention mark is repeatedly obtained, so as to obtain the above-mentioned attention. Steps for determining the position of all object marks in the object mark line; e) Obtaining from the above object mark group, one of the most unobtained object mark groups obtained by removing the object mark lines whose measurement positions have been obtained is located at one of the extreme ends in the above direction. The object mark is the measurement position of the next attention mark. Perform the above steps c) and d) on the next attention mark, and repeatedly obtain the measurement positions of all the object marks including the line of the next attention mark under the next attention mark. Until the measurement positions of all the object marks on the measurement image are obtained; and f) A correspondence relationship is established between the measurement positions of all the object marks on the measurement images obtained in the above step e) and the design positions of the object mark groups, and based on the difference between the corresponding measurement positions and the design positions, Steps to correct the correction information that describes the data. According to this method of generating correction information, it is possible to easily and appropriately perform the pairing processing of the marks.

The drawing method for drawing an image on a substrate according to the present invention includes the following steps: the step of obtaining correction information by using the method for generating correction information according to any of the above; and using the correction information to correct the drawing data of the image drawn on the substrate A step of scanning the substrate by adjusting the light based on the corrected drawing data.

The above-mentioned objects and other objects, features, aspects, and advantages will be clarified with reference to the accompanying drawings and based on the following detailed description of the present invention.

1‧‧‧direct drawing device

9‧‧‧ substrate

11‧‧‧platform

12‧‧‧Platform mobile mechanism

13‧‧‧Light source department

14‧‧‧optical head

15‧‧‧ transfer robot

16‧‧‧ Cassette mounting section

17‧‧‧ abutment

18‧‧‧ cover

19‧‧‧ Control Department

21‧‧‧ Camera Department

31, 31a‧‧‧ Correction information generating device

32‧‧‧painting data correction department

91‧‧‧ top surface

92‧‧‧Semiconductor wafer

93‧‧‧ Object mark

94‧‧‧ Object Mark Group

95‧‧‧adjacent area

96‧‧‧ Object mark line

121‧‧‧Y-direction moving mechanism

122‧‧‧X-direction moving mechanism

123‧‧‧rotating mechanism

131‧‧‧ Pillar

141‧‧‧space light modulator

161‧‧‧Box

212, 222‧‧‧rail

221‧‧‧ Linear Motor

311‧‧‧Design Position Memory

312‧‧‧Measurement position acquisition section

313‧‧‧Repeat Control Department

314‧‧‧ Correction Information Generation Department

315‧‧‧ Object Mark Line Acquisition Department

S11 ~ S18, S21 ~ S27‧‧‧step

FIG. 1 is a diagram showing the structure of a direct drawing device.

FIG. 2 is a plan view showing the upper surface of the substrate.

Fig. 3 is a block diagram showing the functions of the control section.

FIG. 4 is a diagram showing a flow of drawing an image on a substrate.

FIG. 5 is a plan view showing the upper surface of the substrate.

Fig. 6 is a block diagram showing the functions of the control section.

FIG. 7 is a diagram showing a flow of drawing an image on a substrate.

FIG. 1 is a diagram showing a schematic configuration of a direct drawing device 1 as a drawing device according to an embodiment of the present invention. The direct drawing device 1 is a device for irradiating light on the upper surface of a substrate 9 on which a photosensitive layer serving as a layer of a photosensitive material such as a resist is formed to draw an image of a pattern on the substrate 9. The substrate 9 may be a glass substrate for a flat-panel display device such as a semiconductor substrate, a printed wiring substrate, a color filter substrate, a liquid crystal display device, an organic electroluminescence (EL) display device, a plasma display device, or a recording disc. Various substrates such as substrates.

The direct scan device 1 includes a platform 11, a platform moving mechanism 12, a light source section 13, an optical head 14, a transfer robot 15, a cassette mounting section 16, a base 17, a cover 18, a control section 19, and the like. The cover 18 covers the top of the base 17 to form a processing space for processing the substrate 9. In the processing space, a platform 11, a platform moving mechanism 12, a light source section 13, an optical head 14, and a transfer robot 15 are arranged. The light source section 13 may be disposed outside the processing space. An alignment unit (not shown) is also provided in the direct drawing device 1.

The platform moving mechanism 12 is disposed on the base 17. The platform moving mechanism 12 includes a Y-direction moving mechanism 121, an X-direction moving mechanism 122, and a rotation mechanism 123. The stage 11 holds the substrate 9 on the upper surface thereof in a horizontal posture. The platform moving mechanism 12 is a moving mechanism that moves the substrate 9 and the platform 11 together. The rotation mechanism 123 causes the platform 11 to face The center axis in the Z direction which is the vertical direction is the center rotation. The X-direction moving mechanism 122 moves the rotating mechanism 123 and the stage 11 in the X-direction as a sub-scanning direction. The X direction is a horizontal direction perpendicular to the Z direction. The Y-direction moving mechanism 121 moves the X-direction moving mechanism 122, the rotation mechanism 123, and the stage 11 in the Y direction which is the main scanning direction. The Y direction is a horizontal direction perpendicular to the Z direction and the X direction.

The Y-direction moving mechanism 121 includes a linear motor and a guide rail 212, and the X-direction moving mechanism 122 is moved along the guide rail 212 by the linear motor. The X-direction moving mechanism 122 also includes a linear motor 221 and a guide rail 222, and the rotating mechanism 123 is moved along the guide rail 222 by the linear motor 221.

The light source section 13 is supported by a pillar 131 fixed to the base 17. The optical head 14 is connected to the light source section 13. The number of the optical heads 14 may be two or more. In this case, for example, the optical heads 14 are arranged in the X direction. The light source section 13 includes a laser driving section, a laser oscillator, and an optical system. The light beam generated by the light source section 13 is guided to the optical head 14.

The optical head 14 includes a spatial light modulator 141 that modulates light from the light source section 13 as a light modulator. The spatial light modulator 141 is, for example, GLV (registered trademark) (Grating Light Valve). The spatial light modulator 141 may also be a digital micromirror device (DMD). The optical head 14 further includes an optical system that converts a light beam from the light source section 13 into linear light having a beam cross-section and guides it to the spatial light modulator 141, and performs spatial modulation on the spatial light modulator 141. The subsequent light beam is guided to the optical system of the substrate 9.

The unprocessed substrate 9 is placed on the cassette mounting portion 16 in a state of being stored in the cassette 161. The substrate 9 is taken out from the cassette 161 by the transfer robot 15 through the opening of the cover 18 and is placed on the platform 11. Furthermore, the control unit 19 controls the alignment unit to adjust the position in the XY direction and the rotation position of the substrate 9.

The stage 11 is moved in the Y direction by the Y-direction moving mechanism 121, and in parallel with this, the spatially modulated light beam is emitted from the optical head 14 toward the substrate 9, and a pattern is drawn on the substrate 9. When the movement in the Y direction is completed, the platform 11 moves stepwise in the X direction by the X direction moving mechanism 122, and draws while moving in the direction opposite to the last time by the Y direction moving mechanism 121. When the entire region to be drawn on the substrate 9 is drawn over and over again, the substrate 9 is transferred from the platform 11 to the cassette 161 by the transfer robot 15.

In the direct drawing device 1, the platform moving mechanism 12 is a scanning mechanism that scans the light modulated on the substrate 9 by the spatial light modulator 141. Furthermore, as the scanning mechanism, a mechanism for moving the optical head 14 in the X direction and the Y direction may be provided on the fixed platform 11. The direct-viewing device 1 further includes an imaging section 21 that images the upper surface 91 of the substrate 9. The imaging unit 21 is mounted on, for example, the optical head 14.

FIG. 2 is a plan view showing the upper surface 91 of the substrate 9. The substrate 9 is obtained by mounting a plurality of semiconductor wafers 92 on a substantially disc-shaped semiconductor substrate and molding the plurality of semiconductor wafers 92 with a resin (a so-called molded substrate). Each semiconductor wafer 92 has a substantially rectangular shape in a plan view. In the example shown in FIG. 2, a mark 93 is provided on the upper left corner of each semiconductor wafer 92. The mark 93 is, for example, an alignment mark provided on the upper surface of each semiconductor wafer 92. The mark 93 may be a part of a pattern or the like provided on the upper surface of the semiconductor wafer 92. In FIG. 2, the symbol 93 is indicated by a black dot, but the shape of the symbol 93 can be variously changed. The number and arrangement of the semiconductor wafers 92 and the number and arrangement of the symbols 93 can be variously changed.

The plurality of marks 93 are arranged on the substrate 9 in a grid shape along the horizontal direction (X direction) and the vertical direction (Y direction) in FIG. 2. In the following description, the X direction and the Y direction are also referred to as "horizontal" and "vertical". In addition, as described below, the symbol 93 becomes a pair for position measurement. It is called "object mark 93" in the following description. Furthermore, the plurality of target symbols 93 on the substrate 9 are collectively referred to as "target symbol group 94". In the example shown in FIG. 2, the shape of the object symbol group 94, that is, a shape obtained by connecting a plurality of object symbols 93 on the outer edge of the object symbol group 94 by a straight line, is substantially rectangular. The outer shape of the target symbol group 94 is not limited to a substantially rectangular shape, and various changes can be made.

In the direct drawing device 1, based on the position information of the mark 93 on the substrate 9, the control unit 19 corrects the drawing data of the image drawn on the substrate 9, and draws on the plurality of semiconductor wafers 92 based on the corrected drawing data. pattern. The correction of drawing information will be described below. On the substrate 9, the upper surfaces of the plurality of semiconductor wafers 92 are a plurality of pattern drawing regions where patterns are respectively drawn.

FIG. 3 is a block diagram showing the functions of the control unit 19. FIG. 3 also shows a part of the configuration of the direct drawing device 1 connected to the control unit 19. The control unit 19 becomes a central processing unit (CPU, Central Processing Unit) that performs various arithmetic processing, a read only memory (ROM) that stores basic programs, and a random access memory (RAM, Random Access Memory). The function of the control unit 19 may be realized by a dedicated circuit, or a dedicated circuit may be partially used.

As shown in FIG. 3, the control unit 19 includes a correction information generating device 31 and a drawing data correction unit 32. The correction information generating device 31 includes a design position storage unit 311, a measurement position acquisition unit 312, an iterative control unit 313, and a correction information generation unit 314. The correction information generating device 31 generates correction information for correcting the drawing data of the image drawn on the substrate 9 based on the position information of the mark 93 on the substrate 9. The drawing data correction unit 32 corrects the drawing data of the image drawn on the substrate 9 using the correction information generated by the correction information generating device 31.

Next, referring to FIG. 4, a description will be given of a flow of drawing an image on the substrate 9 by the direct-viewing device 1. In the direct drawing device 1, first, by using the design position memory section 311 of the correction information generating device 31 to memorize, a plurality of object marks 93, that is, object mark groups 94 are arranged on the substrate 9 in a grid shape in the vertical and horizontal directions. Position (step S11). The design position of the object mark group 94 is, for example, extracted from CAD data, which is design data of a predetermined image drawn on the substrate 9, and stored in the design position storage unit 311.

In the design data, the design positions of the plurality of object marks 93 of the object mark group 94 are arranged at equal intervals in the vertical and horizontal directions. In the following description, the distance between the two object marks 93 adjacent to each other in the vertical or horizontal direction is referred to as "distance between marks". The distance between vertical symbols and the distance between horizontal symbols may be the same or different. In the example shown in FIG. 2, the distance between vertical symbols is the same as the distance between horizontal symbols. The distance between the marks is, for example, about 2 mm.

Then, the imaging unit 21 captures the upper surface 91 of the substrate 9 on the stage 11 and acquires an image of the substrate 9 (hereinafter, referred to as a "measurement image"). The measurement image of the substrate 9 is an image obtained by photographing the object mark group 94 on the substrate 9. The measurement image acquired by the imaging section 21 is transmitted to a measurement position acquisition section 312 of the control section 19.

The measurement position acquisition unit 312 acquires the position of the attention mark as an object mark 93 in the measurement image (step S12). In the following description, the position of the mark on the measurement image is referred to as a "measurement position". As the attention mark, for example, an object mark 93 located at the extreme end in one of the vertical and horizontal directions in the object mark group 94 in the measurement image is extracted. In the example shown in FIG. 2, the object mark 93 on the (-X) side of the object mark group 94 is extracted as the attention mark, and the measurement position of the attention mark is obtained. In FIG. 2, a circle of a two-dot chain line surrounds the object mark 93 as the attention mark.

Then, find the distance between the above-mentioned mark and the note mark in the vertical or horizontal direction. The position of the distance is the adjacent center position. Attention is given to the adjacent area 95 of a predetermined size centered on the adjacent center position. Then, the object mark 93 included in the adjacent area 95 is extracted as an adjacent mark adjacent to the attention mark, and the measurement position of the adjacent mark in the measurement image is obtained (step S13). In FIG. 2, a two-dot chain line is used to describe the adjacent area 95 centered on the adjacent center position of the distance between the symbols above the attention mark in the longitudinal direction ((-Y) side). In the example shown in FIG. 2, the abutting region 95 has a substantially rectangular shape composed of sides substantially parallel to the vertical and horizontal directions. The adjacent region 95 is, for example, a substantially square with one side being about 200 μm.

Then, by controlling the measurement position acquisition unit 312 with the repeated control unit 313, the adjacent mark whose measurement position has been acquired in step S13 is set as a new attention mark (step S14). Then, it returns to step S13, and iteratively acquires the measurement position of the new adjacent mark adjacent to this new attention mark (step S15, S13). Specifically, a position adjacent to the new attention mark in the vertical or horizontal direction from the above mark is a new adjacent center position, and a new adjacent area 95 of a predetermined size centered on the new adjacent center position is determined. Then, the object mark 93 included in the new adjacent area 95 is extracted as a new adjacent mark adjacent to the new attention mark, and the measurement position of the new adjacent mark in the measurement image is obtained. In the iterative control unit 313, the order of the attention marks 93 (hereinafter referred to as "attention order") is memorized.

When steps S13 to S15 are repeatedly performed, for example, a plurality of object marks 93 arranged in the approximate (-Y) direction from the first attention mark are sequentially set as adjacent marks and a measurement position is acquired. When the target symbol 93 does not exist in the adjacent area 95 on the (-Y) side of the attention mark, attention is paid to the adjacent area 95 on the (+ X) side of the attention mark, and the target symbol 93 of the adjacent area 95 is set to be adjacent. The measurement position is obtained by marking, and the target mark 93 is set as a new attention mark. Then, a plurality of object marks 93 arranged in the approximate (+ Y) direction from the newly remarked attention mark are sequentially set as adjacent marks, and a measurement position is acquired. Again, in the note In the case where the target symbol 93 does not exist in the adjacent area 95 on the (+ Y) side of the head mark, the adjacent area 95 on the (+ X) side of the target mark is similarly noted, and the target mark 93 in the adjacent area 95 is set to The measurement position is acquired adjacent to the mark, and the target mark 93 is set as a new attention mark.

Thereafter, a plurality of object marks 93 arranged in the approximate (-Y) direction from the newly noticed mark are sequentially set as adjacent marks, and a measurement position is acquired. In this case, as shown in FIG. 5, in the object symbol group 94, the rows of the object symbols 93 respectively extending in the longitudinal direction, that is, the plurality of object symbol rows 96, are shifted from the (-X) side toward the (+ X) direction. The measurement position of the object mark 93 is acquired sequentially. In FIG. 5, each object symbol line 96 is surrounded by a two-dot chain line. In the example shown in FIG. 5, the object symbol group 94 is a collection of a plurality of object symbol rows 96 extending in the longitudinal direction across the entire length of the object symbol group 94 and arranged in the horizontal direction. In the correction information generating device 31, the above steps S13 to S15 are repeatedly performed until the measurement positions of all the object marks 93 on the measurement image are acquired, that is, until the next adjacent mark does not exist.

Furthermore, the object mark line 96 may be a line of the object mark 93 extending in the horizontal direction. In this case, the object symbol group 94 is a collection of a plurality of object symbol rows 96 that extend across the entire length of the object symbol group 94 in the horizontal direction and are arranged along the vertical direction. In the correction information generating device 31, similar to the above, by repeatedly performing the above steps S13 to S15, a plurality of object mark lines 96 are sequentially performed, for example, from the (+ Y) side toward the (-Y) direction, the object marks 93 are sequentially performed. The measurement positions are acquired until the measurement positions of all the object marks 93 on the measurement image are acquired.

In other words, in the correction information generating device 31, one of the object marks located at the extreme end in the vertical and horizontal directions in the object mark group 94 is set as the attention mark. Then, by controlling the measurement position acquisition unit 312 with the repeated control unit 313, the entire length of the subject mark group 94 (that is, across the entire length of the subject mark group 94 in the other direction in the vertical and horizontal directions, respectively) is controlled. In the extended set of object mark lines 96), the measurement position of the object mark line 96 including the attention mark is first acquired. Thereafter, the measurement positions of the target mark line 96 adjacent to the above-mentioned one side in the above-mentioned one side are sequentially acquired.

When the measurement positions of all the object marks 93 on the measurement image are acquired, the correction information generating section 314 establishes a correspondence relationship between the measurement positions of each of the object marks 93 and the design positions of the object mark group 94. The establishment of the correspondence between the measurement position and the design position of the object mark group 94 (ie, the pairing process) is performed by, for example, the following steps, that is, the object mark line 96 on the most (-X) side where the measurement position is acquired first The measurement position is related to the design position of the object mark line located on the most (-X) side in the design data, and then the remaining object mark line 96 and the object mark line of the design data are established in a correspondence unit.

Next, for each target symbol 93 of the target symbol group 94, correction information for correcting the drawing data is generated based on the difference between the corresponding measurement position and the design position (step S16). Specifically, the offset of the measurement position from the design position of each object mark 93 is obtained as the position offset of the semiconductor wafer 92 corresponding to each object mark 93 from the design position, and the positions of all the semiconductor wafers 92 on the substrate 9 are generated. The offset is corrected separately.

When the correction information is acquired in the manner described above, the drawing data correction unit 32 corrects the drawing data of a predetermined image drawn on the substrate 9 by using the correction information (step S17). Specifically, the position of a predetermined pattern drawn on each semiconductor wafer 92 included in the drawing data is corrected based on the correction information indicating the positional deviation of each semiconductor wafer 92 from the design position. Then, based on the corrected drawing data, the spatial light modulator 141 and the platform moving mechanism 12 are controlled, so that the modulated light is scanned on the substrate. In this way, the pattern for each semiconductor wafer 92 included in the drawing is used to consider the semiconductor wafer 92. After the position shift, the corresponding semiconductor wafer 92 is accurately drawn (step S18).

As described above, the correction information generating device 31 includes a design position memory section 311, a measurement position acquisition section 312, an iterative control section 313, and a correction information generation section 314. The design position storage unit 311 stores the design positions of the plurality of object marks 93, that is, the object mark group 94, arranged on the substrate 9 in a grid shape in the vertical and horizontal directions. The measurement position acquisition unit 312 acquires a measurement position which is an attention mark of the object mark 93 in the measurement image which is an image obtained by the subject mark group 94. Next, attention is drawn to a neighboring area 95 of a predetermined size centered on a position that is a predetermined distance (distance between signs) from the attention mark in the vertical or horizontal direction, that is, the adjacent center position, and the object mark 93 contained in the adjacent area 95 is extracted. Obtain the measurement position of the adjacent symbol as the adjacent symbol adjacent to the attention mark.

The iterative control unit 313 controls the measurement position acquisition unit 312 to set the adjacency mark to a new attention mark, and repeatedly acquires the measurement position of a new adjacency mark adjacent to the new attention mark, until all of the measurement images are acquired. To the measurement position of the object mark 93. The correction information generating section 314 associates the measurement positions of all the object marks 93 on the measurement image with the design positions of the object mark group 94, and generates corrections for correcting the drawing data based on the difference between the corresponding measurement positions and the design positions. Information.

In this way, the correction information generating device 31 uses the acquired measurement positions of the object mark 93 to sequentially acquire the measurement positions of other object marks 93 adjacent to the object mark 93 in the vertical or horizontal direction, thereby making it possible to obtain high accuracy. The measurement position of each object mark 93 of the object mark group 94 is acquired. Thereby, the pairing process of the object symbol 93 can be performed easily and appropriately. As a result, it is possible to easily and accurately generate correction information for correcting the drawing data of the image drawn on the substrate 9.

In the correction information generating device 31, the acquisition of the measurement position of the object mark 93 in steps S13 to S15, and the pairing process in step S16 can also be recorded for each object. Line 96 is performed alternately. That is, after obtaining the measurement position of the object mark line 96 on the most (-X) side where the measurement position was acquired first, and acquiring the next object mark line 96 (the second object mark from the (-X) side) Before the measurement position of line 96), the correspondence between the measurement position of the first object mark line 96 and the design position is established. Then, whenever a new measurement position of the object mark line 96 is acquired, the correspondence between the measurement position and the design position of the new object mark line 96 is established. With this, when the pairing process of the second object mark line 96 from the (-X) side is performed, the result of the pairing process of the first object mark line 96 can be used, so the second one can be easily performed. Subsequent pairing processing of the object mark line 96.

As described above, the direct drawing device 1 includes the correction information generating device 31, the light source section 13, the drawing data correction section 32, the spatial light modulator 141, and the platform moving mechanism 12. The drawing data correction unit 32 corrects the drawing data of the image drawn on the substrate 9 using the correction information generated by the correction information generating device 31. The spatial light modulator 141 is a light modulation section that modulates light from the light source section 13 based on the drawing data corrected by the drawing data correction section 32. The stage moving mechanism 12 is a scanning mechanism that scans light on the substrate 9 after being modulated by the spatial light modulator 141. The direct drawing device 1 can realize high-precision drawing of a plurality of pattern drawing regions on the substrate 9 based on the positions of the plurality of object marks 93 on the substrate 9.

The acquisition order of the measurement positions of the plurality of object marks 93 by the correction information generating device 31 can be variously changed. For example, in the same way as described above, the measurement position acquisition unit 312 sets the object mark 93 at the extreme end in the vertical and horizontal directions of the object mark group 94 as the attention mark. Then, by controlling the measurement position acquisition unit 312 with the repeated control unit 313, the object mark group 94 (that is, a plurality of object mark rows 96 extending across the entire length of the object mark group 94 in the other direction in the vertical and horizontal directions, respectively) is extended. In the collection), the measurement position of the object mark line 96 including the attention mark is obtained first. Furthermore, The attention mark does not have to be located at the end in the target mark line 96 containing the attention mark, and it may be located at the center of the target mark line 96.

After that, for each object mark 93 of the object mark line 96 whose measurement position was first acquired, attention is paid to the adjacent area centered on the adjacent center position of the distance between the measurement positions of each object mark 93 and the (+ X) side. 95. Then, in the plurality of adjacent areas 95 adjacent to the plurality of object marks 93 adjacent to the first object mark line 96 in the above direction, for example, each adjacent area is sequentially obtained from the (+ Y) side toward the (-Y) side. Measurement position of object mark 93 of 95. Thereby, the measurement positions of all the object marks 93 in the second object mark line 96 from the (-X) side are acquired. Thereafter, the measurement positions of the target mark line 96 adjacent to the above-mentioned one side in the above-mentioned one side are sequentially acquired.

In this way, in the correction information generating device 31, the measurement position of each object mark 93 of the object mark line 96 whose measurement position has been acquired can be used to easily obtain each of the object marks 93 of the object mark line 96 adjacent to the above direction. Measurement position.

In this case, the acquisition of the measurement position of the object mark 93 in steps S13 to S15 and the pairing process in step S16 may be performed alternately for each object mark line 96. That is, after obtaining the measurement position of the object mark line 96 on the most (-X) side where the measurement position is acquired first, and acquiring the next object mark line 96 (the second object mark from the (-X) side) Before the measurement position of line 96), the correspondence between the measurement position of the first object mark line 96 and the design position is established. Then, whenever a new measurement position of the object mark line 96 is acquired, the correspondence between the measurement position and the design position of the new object mark line 96 is established. With this, when the pairing process of the second object mark line 96 from the (-X) side is performed, the result of the pairing process of the first object mark line 96 can be used, so the second one can be easily performed. Subsequent pairing processing of the object mark line 96.

When acquiring the measurement position of the above object mark 93, the first attention mark It is not necessary to be one of the object marks 93 located at the extreme end in the vertical and horizontal directions in the object mark group 94 in the measurement image. For example, any object mark 93 in the object mark group 94 may be selected as the attention mark, and the attention mark (+ X) side, (-X) side, (+ Y) side, and (-Y) side of the attention mark may be sequentially noted. In the adjacent area 95, the object mark 93 of each adjacent area 95 is set as an adjacent mark, and a measurement position is acquired. Then, the adjacent mark whose measurement position has been acquired is set as a new attention mark, and the measurement position of the adjacent mark whose acquisition position is not acquired among the new adjacent marks adjacent to the attention mark is repeatedly acquired. Furthermore, when the measurement positions of all adjacent markers adjacent to the new attention mark are obtained, the above-mentioned attention order is traced back, a new attention mark is selected, and the measurement positions of the adjacent marks are repeatedly obtained. The new attention mark selected by backtracking the attention order is the object mark 93 obtained after the measurement position is acquired, and is the object mark 93 adjacent to the object mark 93 whose measurement position has not been obtained in the vertical or horizontal direction.

In this case, the above steps S13 to S15 are also repeated until the measurement positions of all the object marks 93 on the measurement image are acquired. When the measurement positions of all the object marks 93 on the measurement image are acquired, the correction information generating section 314 establishes a correspondence relationship between the measurement positions of each of the object marks 93 and the design positions of the object mark group 94. The correspondence between the measurement position and the design position of the object mark group 94 is established, for example, by measuring the measurement position of the object mark 93 located at each corner of the substantially rectangular object mark group 94 and the object located at each corner in the design data. The design positions of the marks are established in correspondence. Then, for each object mark 93 of the object mark group 94, correction information for correcting the drawing data is generated based on the difference between the corresponding measurement position and the design position. This makes it possible to easily and appropriately perform the pairing process of the object symbol 93 in the same manner as described above, and as a result, it is possible to easily and accurately generate the correction information for correcting the drawing data.

FIG. 6 is a diagram showing another preferred example of the control unit 19 of the direct-viewing device 1. FIG. In the control unit 19 shown in FIG. 6, the correction information generating device 31a includes a design position memory. In addition to the unit 311, the measurement position acquisition unit 312, the iterative control unit 313, and the correction information generation unit 314, the target mark line acquisition unit 315 is further included.

FIG. 7 is a diagram showing a flow of drawing an image by the direct drawing device 1 including the correction information generating device 31a. In this direct drawing device 1, first, as in step S11 shown in FIG. 4, by using the design position memory section 311 of the correction information generating device 31 to memorize, it is prepared to be arranged in a grid shape on the substrate 9 in the vertical and horizontal directions. The plurality of object marks 93 are design positions of the object mark group 94 (step S21).

Then, a measurement image obtained by photographing the object mark group 94 on the substrate 9 is acquired by the imaging unit 21 and sent to the measurement position acquisition unit 312 of the control unit 19. The measurement position acquisition unit 312 selects the attention mark as an object mark 93, and acquires the measurement position which is the position of the attention mark on the measurement image (step S22). In step S22, one of the object mark groups 94 located at the extreme end in one of the vertical and horizontal directions in the measurement image is extracted as the attention mark, and the measurement position is obtained. For example, as surrounded by a two-point chain line circle in FIG. 2, the object mark 93 on the (-X) side of the object mark group 94 is extracted as the attention mark, and the measurement position of the attention mark is obtained.

Next, a position adjacent to the center of the distance between the marker in the other direction in the longitudinal direction and the lateral direction is the adjacent center position, and the adjacent region 95 having a predetermined size centered on the adjacent center position is determined. For example, as indicated by a two-dot chain line in FIG. 2, the adjacent area 95 is centered on the adjacent center position of the distance between the symbols from the above-mentioned attention mark in the longitudinal direction ((-Y) side). Then, the object mark 93 included in the adjacent area 95 is extracted as an adjacent mark adjacent to the attention mark, and the measurement position of the adjacent mark in the measurement image is obtained.

After that, the target mark line acquisition unit 315 extracts the target mark that includes the attention mark and extends across the entire length of the target mark group 94 in the other direction. Row. For example, the object mark line 96 on the (-X) side of the plurality of object mark lines 96 arranged in the horizontal direction (X direction) in FIG. 5 is extracted as the attention target mark line. Furthermore, by using the target mark line acquisition section 315 to control the measurement position acquisition section 312, in the attention target mark line, the above-mentioned adjacent mark is set as a new attention mark, and it is repeatedly acquired in the other direction adjacent to the new mark. The measurement position of the new adjacent symbol of the attention mark of. Thereby, the measurement positions of all the object marks 93 in the attention object mark line are acquired (step S23).

If step S23 ends, the target mark line 96 that has obtained the measurement position by the repeated control unit 313 is removed from the target mark group 94. In the following description, the object mark group 96 from which the measurement position has been acquired from the object mark group 94 is referred to as an "unobtained object mark group". When there is an unobtained object token group (step S24), the iterative control unit 313 controls the object token line acquisition unit 315, thereby returning to step S22, and selecting the unobtained object token group to be located at the extreme end in the above direction One of the object marks 93 is the next attention mark, and the measurement position of the next attention mark is acquired (step S22). Then, the measurement positions of all the object marks 93 including the next attention object mark line below the next attention mark are acquired (step S23).

In the correction information generating device 31a, the above steps S22 to S24 are repeatedly performed until the measurement positions of all the object marks 93 on the measurement image are acquired, that is, until there is no unobtained object mark group.

When the measurement positions of all the object marks 93 on the measurement image are acquired, the correction information generating section 314 establishes a corresponding relationship between the measurement positions of each of the object marks 93 and the design positions of the object mark group 94 (that is, For pairing). This pairing process is performed, for example, by the following steps: the measurement position of the object mark line 96 on the most (-X) side where the measurement position is acquired first and the object on the (-X) side of the design data Establish the corresponding relationship between the design positions of the mark lines, and then use the behavior unit to mark the remaining object mark lines 96 Establish a corresponding relationship with the object mark line of the design data. Next, for each target symbol 93 of the target symbol group 94, correction information for correcting the drawing data is generated based on the difference between the corresponding measurement position and the design position (step S25).

When the correction information is acquired in this manner, the drawing data correction unit 32 corrects the drawing data of a predetermined image drawn on the substrate 9 by using the correction information (step S26). Then, based on the corrected drawing data, the spatial light modulator 141 and the platform moving mechanism 12 are controlled, so that the modulated light is scanned on the substrate. Thereby, the pattern for each semiconductor wafer 92 included in the drawing data is accurately drawn on the corresponding semiconductor wafer 92 after considering the positional deviation of the semiconductor wafer 92 (step S27).

As described above, in the correction information generating device 31a, the measurement positions of the plurality of object marks 93 are acquired for each object mark line 96, whereby the pairing process of the object marks 93 can be performed easily and appropriately. As a result, it is possible to easily and accurately generate correction information for correcting the drawing data of the image drawn on the substrate 9. In addition, the direct drawing device 1 including the correction information generating device 31 a can realize high-precision drawing of a plurality of pattern drawing areas on the substrate 9 based on the positions of the plurality of object marks 93 on the substrate 9.

In the correction information generating device 31a, the acquisition of the measurement position of the object mark 93 of the object mark line 96 in steps S22 to S24, and the pairing process in step S25 may be performed alternately for each object mark line 96. That is, after obtaining the measurement position of the object mark line 96 on the (-X) side which is the first measurement position obtained, and acquiring the next object mark line 96 (the second object mark line 96 from the (-X) side) ) Before the measurement position, the correspondence between the measurement position and the design position of the first object mark line 96 is established. Then, whenever a new measurement position of the object mark line 96 is acquired, the correspondence between the measurement position and the design position of the new object mark line 96 is established. Thereby, the pairing process of the object mark line 96 can be easily performed.

The correction information generating devices 31 and 31a and the direct-viewing device 1 can be variously changed.

For example, the direct imaging device 1 may omit the imaging section 21. In this case, for example, an image (measurement image) of the object mark group 94 on the substrate 9 captured by a device other than the direct-viewing device 1 is input to the correction information generating devices 31 and 31a, and the measurement position The acquisition unit 312 accepts.

Two or more marks may be provided on each semiconductor wafer 92 on the substrate 9. For example, marks are provided on the upper left corner and the lower right corner of the upper surface of each semiconductor wafer 92. In this case, first, a plurality of marks arranged in the upper left corner of the plurality of semiconductor wafers 92 are set as the object mark 93, respectively. The method for obtaining the measurement position of the object mark 93 is used to obtain the upper left The measurement positions of the plurality of object marks 93. Thereafter, a plurality of marks arranged at the lower right corners of the plurality of semiconductor wafers 92 are set as the target mark 93, respectively, and the plurality of the bottom right are obtained by the same method as that for obtaining the measurement position of the target mark 93 described above. Measurement position of the object mark 93. Then, the difference between the measurement position and the design position of the object mark 93 arranged at the upper left corner and the lower right corner of each semiconductor wafer 92 is obtained, and correction information is generated based on the difference.

Alternatively, firstly, a plurality of marks arranged on the upper left corners of the plurality of semiconductor wafers 92 are respectively set as the target mark 93, and the plurality of target marks on the upper left are obtained by using the same method as that of obtaining the measurement position of the target mark 93 above. Measurement position of 93. Next, in each semiconductor wafer 92, attention is paid to the adjacent area centered on the adjacent center position at a predetermined distance from the object mark 93 disposed in the upper left corner in the lower right direction, and the mark (i.e., the configuration) in the adjacent area is obtained. (Marked in the lower right corner). Thereafter, the difference between the measurement position and the design position of the object mark 93 arranged at the upper left corner of each semiconductor wafer 92 and the mark arranged at the lower right corner is obtained, and based on the difference Generate correction information.

The correction information generating device 31 including the design position memory section 311, the measurement position acquisition section 312, the iterative control section 313, and the correction information generation section 314 shown in FIG. 3 can also be used to generate position information based on the marks on the substrate 9 for correction. A device (for example, a computer system as described above) that corrects the drawing data of the image drawn on the substrate 9 is used alone. In addition, the correction information generating device 31a including the design position memory section 311, the measurement position acquisition section 312, the iterative control section 313, the correction information generation section 314, and the object mark line acquisition section 315 shown in FIG. A device (for example, a computer system as described above) for generating correction information for correcting the drawing data of the image drawn on the substrate 9 using the position information of the mark is used alone. Alternatively, the correction information generating devices 31 and 31a may be used together with devices other than the direct-viewing device 1.

The configurations in the above-described embodiment and each modification can be appropriately combined as long as they do not contradict each other.

The invention has been described and explained in detail, but the above description is illustrative and not restrictive. Therefore, it is considered that various modifications or aspects can be realized without departing from the scope of the present invention.

Claims (8)

A correction information generating device generates correction information for correcting drawing data of an image drawn on the substrate based on position information of marks on a plurality of pattern drawing areas provided on the substrate; and includes: design position memory Unit, which stores the design positions of a plurality of object marks, that is, the object mark group, arranged in a grid shape in the vertical and horizontal directions on the substrate; and a measurement position acquisition unit, which acquires in the measurement image when the image of the object mark group is taken As a measurement position of the attention mark of an object mark, attention is paid to a predetermined size adjacent area centered on a position that is a predetermined distance from the attention mark in the vertical or horizontal direction, that is, the adjacent center position, and the included adjacent area is extracted. The mark is used as an adjacency mark adjacent to the above-mentioned attention mark, and the measurement position of the above-mentioned adjacency mark is obtained; the iterative control unit, which controls the above-mentioned measurement acquisition unit, sets the above-mentioned adjacency mark as a new attention mark, and repeatedly obtains the adjacency At the measurement position of the new adjacent mark above the new attention mark, Until the measurement positions of all the object marks on the measurement image are obtained; and a correction information generating unit that establishes a correspondence relationship between the measurement positions of the all object marks on the measurement image and the design positions of the object mark group, Based on the difference between the corresponding measurement position and the design position, correction information for correcting the drawing data is generated. For example, the correction information generating device of claim 1, wherein the measurement position acquisition unit sets the object mark located at the extreme end of the object mark group in one of the vertical direction and the horizontal direction as the attention mark, and sets the above The target mark group is a collection of a plurality of target mark lines extending across the entire length of the target mark group in the other direction of the vertical direction and the horizontal direction. The measurement acquisition unit is controlled by using the repeated control unit. Obtain the measurement position of the object mark line containing the above-mentioned attention mark, and sequentially obtain the measurement position of the object mark line adjacent to the measurement position at the above-mentioned one side of the object mark line. A correction information generating device generates correction information for correcting drawing data of an image drawn on the substrate based on position information of marks on a plurality of pattern drawing areas provided on the substrate; and includes: design position memory Unit, which stores the design positions of a plurality of object marks, that is, the object mark group, arranged in a grid shape in the vertical and horizontal directions on the substrate; and a measurement position acquisition unit, which acquires in the measurement image when the image of the object mark group is taken In the above object mark group, the measurement position of the object mark which is the most end in one of the vertical direction and the horizontal direction is the measurement position of the attention mark, and is focused on the position at a predetermined distance from the attention mark in the vertical direction and the other direction of the horizontal direction. That is, an adjacent area of a predetermined size with the adjacent center position as the center, extracting the marks contained in the adjacent area as the adjacent marks adjacent to the attention mark, and obtaining the measurement position of the adjacent mark; the object mark line acquisition section, which uses The measurement position acquisition unit is controlled to include the above-mentioned attention mark And in the attention object mark line extending across the entire length of the object mark group in the other direction, the adjacency mark is set as a new attention mark, and a new one adjacent to the new attention mark in the other direction is repeatedly obtained. Adjacent to the measurement position of the mark, the measurement positions of all the object marks of the above-mentioned object mark line are acquired; the repeated control section, which obtains the measurement positions from the above-mentioned object mark group by controlling the above-mentioned object mark line acquisition section In the unobtained object mark group obtained by removing the object mark line, the position of one of the object marks located at the extreme end in the above direction, that is, the measurement position of the next attention mark, and repeatedly obtaining the line containing the attention mark below the next attention mark The measurement positions of all the object marks until the measurement positions of all the object marks on the above-mentioned measurement image are obtained; and a correction information generating unit that combines the above-mentioned measurement positions of all the object marks on the above-mentioned measurement image with the above-mentioned object mark group Establish a corresponding relationship between the above design positions, and based on the corresponding measurement Poor location and design of the home, generate a correction of data depicting the correction information. A drawing device for drawing an image on a substrate. The drawing device includes a light source section, a correction information generating device according to any one of claims 1 to 3, and a drawing data correction section using the correction generated by the correction information generating device. Information, and corrects the drawing data of the image drawn on the substrate; the light modulation section adjusts the light from the light source section based on the drawing data corrected by the drawing data correction section; and the scanning mechanism makes The light modulated by the light modulation section is scanned on the substrate. A method for generating correction information is to generate correction information for correcting the drawing data of an image drawn on the substrate based on the position information of the marks on the substrate; it includes the following steps: a) preparing the substrate along the longitudinal and lateral directions A step of arranging a plurality of object marks in a grid shape, that is, a design position of the object mark group; b) a step of obtaining the measurement position of the attention mark as an object mark in the measurement image of the image of the above object mark group; c) Attention is given to an adjacent area of a predetermined size centered on a position at a predetermined distance from the above-mentioned attention mark in the above-mentioned longitudinal direction or in the above-mentioned horizontal direction, that is, the adjacent center position, and the marks included in the above-mentioned adjacent area are extracted as adjacent to the above-mentioned attention mark. Steps of adjacency marks and obtaining the measurement positions of the adjacency marks; d) setting the adjacency marks whose measurement positions have been acquired in the step c) above as new attention marks, repeating the above step c) to obtain adjacency to the above The measurement position of the new attention mark and the new adjacent mark until all the pairs on the measurement image are acquired The steps up to the measurement positions of the marks; and e) the measurement positions of all the object marks on the measurement images to be acquired in the step d) and the design positions of the object mark groups are established, and based on the correspondence The difference between the measurement position and the design position, and a step of generating correction information for correcting drawing data. For example, in the method for generating correction information of claim 5, wherein in step b) above, the object mark located at the extreme end in the vertical direction and the horizontal direction of the object mark group is set as the attention mark, and in c In step) and step d) above, the object token group is set as a collection of a plurality of object token lines extending across the entire length of the object token group in the other direction of the vertical direction and the horizontal direction, respectively. b) The measurement position of the object mark line of the above-mentioned attention mark selected in the step, and the measurement position of the object mark line adjacent to the measurement position in the above-mentioned one side is sequentially obtained. A method for generating correction information, which generates correction information for correcting the drawing data of an image drawn on the substrate based on the position information of a mark on the substrate; it includes the following steps: a) preparing to arrange on the substrate in the vertical and horizontal directions Steps of designing a plurality of object marks in a grid shape, that is, the design position of the object mark group; b) Obtaining the image of the object mark group, that is, a measurement image, obtaining the object mark group in one of the vertical direction and the horizontal direction The step of measuring the position of an object mark located at the extreme end, ie, the attention mark; c) paying attention to a predetermined size centered on a position that is a predetermined distance from the attention mark in the longitudinal direction and the lateral direction, that is, adjacent to the center position; Adjacent areas, the steps of extracting the marks contained in the adjacent areas as the adjacent marks adjacent to the attention marks and obtaining the measurement positions of the adjacent marks; d) including the attention marks and straddling the object in the other direction above The full length of the marked object's marked line in the marked group will be measured in step c) above. The above-mentioned adjacent mark whose position has been acquired is set as a new attention mark, and the above step c) is repeatedly performed, and the measurement position of the new adjacent mark adjacent to the new attention mark is repeatedly obtained, so as to obtain the above-mentioned attention object mark. Steps for measuring the position of all object marks; e) Obtaining from the above object mark group the object mark group whose measurement position has been obtained by removing the object mark line that has been obtained is located at the end of the object mark in the above direction. For a measurement position of an attention mark, perform the above steps c) and d) on the next attention mark, and repeatedly obtain the measurement positions of all object marks including a line of attention object marks below the next attention mark, until the above-mentioned is obtained. The steps up to the measurement positions of all the object marks on the image; and f) the above-mentioned measurement positions of all the above-mentioned object marks on the above-mentioned measurement image obtained in step e) and the above-mentioned design positions of the above-mentioned object mark group Establish a correspondence relationship, and generate a correction trace based on the difference between the corresponding measurement position and the design position Correction step data of the information. A drawing method is a person who draws an image on a substrate. The method includes the following steps: a step of obtaining correction information by using the method for generating correction information of any one of items 5 to 7; and using the correction information to correct the drawing of the substrate. A step of drawing the image of the image; and a step of scanning the light on the substrate based on the adjusted drawing data.