KR101665764B1 - Drawing apparatus, substrate processing system and drawing method - Google Patents

Abstract

In the substrate processing system, the imaging section and the moving mechanism are controlled in the imaging apparatus, so that a plurality of alignment marks in each imaging area of the substrate are captured. The both-side acquisition section determines the position or deformation amount of each imaging area on the basis of the imaging result of the imaging section. Then, by controlling the drawing head and the moving mechanism, the circuit pattern is drawn only in the normal drawing region where the determination is positive. As described above, in the drawing apparatus, each of the plurality of drawing regions on the substrate is determined, and the determination result is used for drawing the circuit pattern immediately thereafter, thereby shortening the time required for drawing the circuit pattern on the substrate .

Description

[0001] DRAWING APPARATUS, SUBSTRATE PROCESSING SYSTEM AND DRAWING METHOD [0002]

The present invention relates to a drawing apparatus and a drawing method for drawing a circuit pattern by irradiating a substrate with light, and also relates to a substrate processing system including the drawing apparatus.

Conventionally, when manufacturing a laminated substrate in which a unit substrate (i.e., a piece) is multi-ply-formed on a work substrate such as a package substrate, it is necessary to attach a scratch or mark on the piece in which the defect is found in the intermediate inspection, As shown in Fig.

For example, Japanese Patent Application Laid-Open No. 2007-48868 (Document 1) discloses a pattern manufacturing system in which a circuit pattern is formed on each of a plurality of pieces on a work substrate. The pattern manufacturing system includes: a pattern forming apparatus for patterning a resist material stacked on a substrate, a developing device for developing the exposed resist to form a resist pattern, a copper foil on the substrate on which the resist pattern is formed, And an image recognition device for picking up a circuit pattern formed by etching by a CCD camera and judging whether the circuit pattern is correct or not. The pattern manufacturing system is used for manufacturing a laminated substrate in which an external workpiece substrate is laminated on a built-in workpiece substrate. In the pattern manufacturing system, defective information indicating the position of the defective piece determined to be defective by the image recognition apparatus at the time of manufacturing the built-in work substrate is stored. In manufacturing an external work substrate, in the exposure apparatus, an identification mark indicating failure is exposed on the external work substrate piece corresponding to the defective piece of the internal work substrate, based on the defect information.

However, in the patterning apparatus of the monotone type that draws the pattern by scanning the light to be modulated as in the exposure apparatus of Document 1, deformation occurs in a pattern (so-called bottom) already formed on each of the pieces on the substrate and the substrate In the presence of the deformed pattern, the pattern is corrected in accordance with the deformation when the drawing is performed on the deformed piece. However, if the deformation of the piece becomes larger than a certain degree, even if the pattern is corrected and drawn, in the inspection performed by the inspection apparatus after drawing, it is determined that the piece is a defective piece which can not be used for the product. That is, in the patterning device, rendering of the defective piece is unnecessary, and the time required for rendering is unnecessarily long.

The present invention is directed to a drawing apparatus for drawing a circuit pattern by irradiating a substrate with light, and aims at shortening the time required for drawing a circuit pattern.

A drawing apparatus according to the present invention includes a substrate holding section for holding a substrate on which a plurality of drawing areas are set, an imaging section for imaging a plurality of alignment marks set in each drawing area, Acquiring a position of the plurality of alignment marks on the substrate on the basis of an imaging result of the alignment marks and determining the position or deformation amount of each of the drawing areas based on the positions of the plurality of alignment marks; A moving mechanism for moving the substrate with respect to the imaging head relative to the imaging head to scan the area irradiated with the light from the imaging head on the substrate, , The drawing head and the moving mechanism are controlled so that the determination by the both-portion obtaining section is positive It is only provided with a drawing control unit that performs imaging the circuit pattern area drawn in normal rendering area. According to the drawing apparatus, the time required for drawing the circuit pattern can be shortened.

Another drawing apparatus according to the present invention includes a substrate holding section for holding a substrate on which a plurality of drawing areas are set, an imaging section for imaging a plurality of alignment marks set in each drawing area, Wherein the alignment mark of the defective imaging area or the peripheral pattern thereof is modified so as to obtain both of the imaging areas on the basis of the imaging result of the imaging unit, A moving mechanism for moving the substrate relative to the imaging head in conjunction with the substrate holding section to scan an area irradiated with light from the imaging head on the substrate; , Only the normal drawing region, which is the drawing region identified as the amount in the above-mentioned portion acquiring section, And a drawing control section which performs imaging. The time required for drawing the circuit pattern can be shortened also by the drawing apparatus.

In a preferred embodiment of the present invention, the imaging controller controls the imaging head and the moving mechanism by the imaging controller so that a defective display pattern indicating failure is displayed in the defective area, which is the imaging area specified as defective in the above- .

More preferably, in the above-mentioned associating portion, the failure classification of the failure rendering area is also specified, and the failure indication pattern includes information indicating the failure classification.

In addition, the defective display pattern is disposed on the first alignment mark image captured for the first time in the apparatus of the subsequent process among the plurality of alignment marks in the defective drawing area, or around the first alignment mark.

Alternatively, the defective display pattern is an entire fill pattern or a hatch pattern of a predetermined area.

According to another preferred embodiment of the present invention, there is further provided a defect information output unit for outputting the position information on the substrate of the defective area, which is a defective area specified as defective in the defective area acquisition unit.

The present invention can also be applied to a substrate processing system for processing a substrate. The substrate processing system includes the above-described imaging apparatus, a developing apparatus that performs development processing on the substrate on which the circuit pattern is drawn by the imaging apparatus in the normal imaging area, and a developing apparatus that performs development processing by the developing apparatus An etching apparatus for performing an etching process on the substrate and a processing apparatus for performing predetermined processing only on the normal drawing region of the substrate after the etching process among the plurality of drawing regions of the substrate.

The present invention can also be applied to a drawing method in which a substrate is irradiated with light to draw a circuit pattern.

The foregoing and other objects, features, aspects and advantages of the present invention will become more apparent from the following detailed description of the present invention when taken in conjunction with the accompanying drawings.

1 is a diagram showing a configuration of a substrate processing system according to an embodiment.
2 is a diagram showing a configuration of a drawing device.
3 is a diagram showing a part of a source image.
4 is a plan view showing a part of the substrate.
5 is a block diagram showing the function of the control unit.
6 is a diagram showing the flow of substrate processing.
7 is a diagram showing the flow of substrate processing.
8 is a plan view showing a part of the substrate.
9 is a plan view showing a part of the substrate.
10 is a plan view showing a part of the substrate.

1 is a diagram showing a configuration of a substrate processing system 10 according to an embodiment of the present invention. The substrate processing system 10 is a system for processing a printed wiring board (hereinafter simply referred to as " substrate "). The substrate processing system 10 includes a drawing apparatus 1, a developing apparatus 21, an etching apparatus 22, and a processing apparatus 3.

The drawing apparatus 1 is a direct drawing apparatus (so-called coarse apparatus) for drawing a circuit pattern by irradiating a modulated light onto a resist film on the substrate and scanning the irradiated region of the light on the substrate. The resist film is formed of a photosensitive material on a copper layer provided on a substrate. The developing apparatus 21 performs development processing on a substrate on which a circuit pattern is drawn by the drawing apparatus 1. [ The etching apparatus 22 forms an interconnection pattern of copper corresponding to the circuit pattern by performing an etching process on the substrate subjected to the developing process by the developing apparatus 21. [ The processing apparatus 3 performs predetermined processing on the substrate after the etching process. In the processing apparatus 3, for example, an inspection process for inspecting the wiring pattern on the substrate after the etching process is performed.

Fig. 2 is a diagram showing the configuration of the painting apparatus 1. Fig. The imaging apparatus 1 includes a substrate holding section 12, an imaging section 13, a imaging head 14, and a moving mechanism 15. The substrate holding portion 12 holds the substrate 9 from below.

Fig. 3 is a diagram showing a part of the original image 80 including a plurality of circuit patterns 81 to be drawn on the substrate 9. Fig. A plurality of circuit patterns 81 are respectively drawn in a plurality of drawing regions 92 set on the substrate 9. In Fig. 3, the substrate 9 and the drawing area 92 are indicated by two-dot chain lines. The plurality of drawing regions 92 are arranged, for example, in a matrix form and spaced apart from each other. Each drawing area 92 has, for example, a substantially rectangular shape.

4 is a plan view showing a part of the substrate 9. Fig. On the one main surface (hereinafter referred to as " upper surface 91 ") of the substrate 9, the above-described plurality of drawing regions 92 are set. In each drawing area 92, a plurality of alignment marks 93 are set. The alignment mark 93 is an eye mark provided on the substrate 9 to indicate the position of the imaging area 92. The alignment mark 93 is, for example, a solid circular shape. In the example shown in Fig. 4, the alignment mark 93 is set at the apex of each rendering area 92. [ In FIG. 4, the drawing area 92 is surrounded by a solid line, and no line surrounding the drawing area 92 is provided on the actual substrate 9 (the same also in FIGS. 8 to 10).

The substrate 9 is different from the original image 80 by the deformation of the substrate 9 and the influence of deformation and positional deviation of a pattern (so-called bottom) already formed in each drawing region 92 , The alignment mark 93 may deviate from the reference position, which is a position where the alignment mark 93 is disposed in design. In Fig. 4, when the alignment mark 93 deviates from the reference position, the reference position is indicated by the hollow circle of the broken line. In addition, the position of the design drawing area 92 is indicated by a two-dot chain line.

The imaging unit 13 shown in Fig. 2 picks up an image of the upper surface 91 of the substrate 9. Fig. The imaging section 13 picks up a plurality of alignment marks 93 (see Fig. 4) set in the respective imaging areas 92. Fig. The imaging head 14 irradiates the modulated light onto the substrate 9. [ The imaging head 14 includes a light source 141 for emitting laser light and a spatial light modulation device 142 for guiding light from the light source 141. Modulated light in the spatial light modulating device 142 is guided to the substrate 9 on the substrate holding portion 12. As the spatial light modulating device 142, for example, a DMD (digital micromirror device (registered trademark)) is used, which is an optical element in which a plurality of microscopic specular surfaces that can be individually changed in respective directions are arranged in a plane.

The moving mechanism 15 moves the substrate 9 relative to the imaging head 14 together with the substrate holding portion 12. Thereby, the irradiation area of the light from the imaging head 14 is scanned on the substrate 9. [ In the example shown in FIG. 2, the moving mechanism 15 includes a holding portion moving mechanism 151 and a head moving mechanism 152. The holding portion moving mechanism 151 moves the substrate 9 together with the substrate holding portion 12 in the main scanning direction which is a direction perpendicular to the paper surface in Fig. The head moving mechanism 152 moves the imaging head 14 together with the imaging unit 13 in the sub-scan direction in the lateral direction in Fig. Further, the substrate 9 may be rotatable in the horizontal plane by the moving mechanism 15. [

In the drawing apparatus 1, the substrate 9 is moved in the main scanning direction by the holding unit moving mechanism 151 while irradiating the space 9 modulated by the drawing head 14 onto the substrate 9, 9) is carried out. Subsequently, the writing head 14 is moved by a predetermined distance in the sub-scanning direction by the head moving mechanism 152, and while the space-modulated light is irradiated onto the substrate 9, the substrate 9 is moved in the main scanning direction So that drawing on the substrate 9 is performed. In the drawing apparatus 1, the circuit pattern is drawn on the substrate 9 by repeating the movement of the substrate 9 in the main scanning direction and the movement of the drawing head 14 in the sub-scanning direction in this manner All.

The substrate 9 is moved in the main scanning direction by the holding portion moving mechanism 151 and the imaging portion 13 is moved in the sub scanning direction by the head moving mechanism 152, The imaging section 13 is positioned above each position on the substrate 9. [ In the imaging apparatus 1, the imaging unit 13 can pick up a desired position on the upper surface 91 of the substrate 9.

The imaging apparatus 1 further includes a control unit for controlling the respective components of the imaging unit 13, the imaging head 14, the moving mechanism 15, and the like. Fig. 5 is a block diagram showing the function of the control section 16 of the drawing apparatus 1. Fig. The control unit 16 has a general computer system in which a CPU for performing various arithmetic processing, a ROM for storing a basic program, and a RAM for storing various information are connected to a bus line. Fig. 5 also shows another structure of the drawing apparatus 1 connected to the control unit 16. Fig.

The control unit 16 includes an image capturing control unit 161, an image capturing unit 162, a storage unit 163, a rendering control unit 164, and a defect information output unit 165. The image pickup control section 161 acquires an image of the upper surface 91 of the substrate 9 by controlling the image pickup section 13 and the moving mechanism 15. [ In the drawing apparatus 1, for example, for each alignment mark 93 on the substrate 9, a reference position, which is a position where each alignment mark 93 is designed in the design, and an image in the vicinity thereof are acquired. The image pickup result by the image pickup section 13 is sent to the both-part obtaining section 162.

Both parts of the drawing area 92 are determined or obtained for each drawing area 92 on the substrate 9 based on the image pickup result by the image pickup part 13. Specifically, the position of the plurality of alignment marks 93 on the substrate 9 with respect to each imaging area 92 is acquired from the imaging result. Then, for each drawing area 92, the position of each drawing area 92 or the amount of deformation is determined on the basis of the positions of the obtained plurality of alignment marks 93. Information indicating the presence or absence of modification of the alignment mark 93 is acquired for each imaging area 92 from the imaging result, and both sides of each imaging area 92 are acquired based on the information.

For example, of the six drawing areas 92 in FIG. 4, the four alignment marks 93 are not modified for the drawing area 92 at the upper left, and the four alignment marks 93 Since the position overlaps the reference position, the determination by the positive / negative part acquiring unit 162 becomes positive (that is, it is confirmed as positive). Even when the deviation of each alignment mark 93 in the drawing area 92 from the reference position is within the permissible range, it is determined that the drawing area 92 is positive.

In the drawing area 92 on the upper right side in Fig. 4, the entire drawing area 92 rotates largely, and the position deviates from the designed position by an allowable range. In the positive / negative part acquiring unit 162, the rendering area 92 is specified as a bad position. Although not shown in FIG. 4, even when the drawing area 92 is not deformed and moves vertically or horizontally beyond the permissible range, the drawing area 92 has a position that is not good Is specified.

In the drawing area 92 on the left side of FIG. 4, the upper left alignment mark 93 is greatly deviated from the reference position. As a result, the upper left portion of the drawing area 92 is deformed to a larger extent than the allowable range. The degree of deformation of the imaging area 92 is determined by, for example, a straight line connecting the two alignment marks 93 that are adjacent to each other in the vertical direction or the left and right direction, It is obtained by the angle formed by the straight line. In the positive / negative part acquiring unit 162, the drawing area 92 is specified to be defective.

In the drawing area 92 on the right side of FIG. 4, the entire drawing area 92 is enlarged larger than the allowable range. The enlargement of the drawing area 92 is also one of the deformation of the drawing area 92. [ In the positive / negative part acquiring unit 162, the drawing area 92 is also specified to be defective. Although not shown in FIG. 4, when the entire drawing area 92 is reduced to a size smaller than the allowable range, the drawing area 92 is specified as defective, similarly to the above.

In the drawing area 92 on the lower left side in Fig. 4, the upper left alignment mark 93 is not present because it is deleted in the previous step. In the drawing area 92 on the lower right side, the upper left alignment mark 93 is deformed into a hollow circular shape. The drawing area 92 in which the alignment mark 93 is modified (i.e., erased or deformed) in this way is positioned in the drawing area 92 in which a defect is detected in the previous process rather than a process described later by the substrate processing system 10 )to be. The modification of the alignment mark 93 is performed manually by the operator before the substrate 9 is brought into the substrate processing system 10, for example. The modification of the alignment mark 93 may be performed in an apparatus in which the abovementioned alignment is performed.

Deletion of the alignment mark 93 in the drawing area 92 on the lower left side indicates a defect in which a pattern to be formed in the drawing area 92 is not formed in the previous step, for example. The deformation of the alignment mark 93 in the drawing area 92 on the lower right side indicates that defects such as disconnection are generated in the pattern formed in the drawing area 92 in the previous step, for example. It is determined that defects in the previous steps exist in these two drawing regions 92 in the both-portion obtaining unit 162. [

Hereinafter, the upper left drawing area 92, which is determined to be positive by the upper limit acquisition section 162, is referred to as a " normal drawing area 92a ", and the other drawing area 92, Is referred to as a " defective rendering area 92b ". Also in Fig. 4, the reference numerals 92a and 92b are attached.

The deficiency type of the defective drawing area 92b is also specified in the deficiency obtaining section 162. [ More specifically, the failure category of the failure rendering area 92b on the upper right side in FIG. 4 is the rotation of the rendering area, and the failure classification of the failure rendering area 92b on the left side of the interruption is deformation of the rendering area. The failure type of the failure rendering area 92b on the right side of the interruption is enlargement, which is a kind of deformation of the rendering area. The defect type of the defect drawing region 92b on the lower left side is a pattern defect formation in the previous step and the defect type of the defect drawing region 92b on the lower right side is a break of the pattern formed in the previous step.

The information acquired for each drawing area 92 by the both-part obtaining unit 162 is stored in the storage unit 163 as defect information according to the substrate 9. [ The defect information includes information indicating both sides of each rendering area 92, position information of each defect rendering area 92b on the substrate 9, and failure category of each defect rendering area 92b Information. The defect information stored in the storage unit 163 is used for drawing the circuit pattern 81 in the drawing apparatus 1, as described later. The defect information is output to the processing unit 3 (see FIG. 1) by the defect information output unit 165, and is also used in the processing in the processing unit 3.

Next, the flow of the processing of the substrate 9 by the substrate processing system 10 will be described with reference to Figs. 6 and 7. Fig. In the substrate processing system 10, first, the substrate 9 (see Fig. 4) subjected to the processing in the previous step is loaded into the drawing apparatus 1 shown in Fig. 2 (step S11). The substrate 9 is held on the substrate holder 12. Thereby, the substrate 9 on which the plurality of imaging areas 92 are set on the upper surface 91 is prepared (step S12).

Subsequently, the image pickup section 13 and the moving mechanism 15 are controlled by the image pickup control section 161 (see Fig. 5) so that a plurality of alignment marks 93 set in each drawing area 92 are picked up (step S13 ). The image pickup result by the image pickup section 13 is sent to the both-part obtaining section 162.

As described above, the both-side acquisition section 162 determines or acquires both sides of the respective rendering areas 92 (step S14) based on the imaging result at step S13. In step S14, the position information on the substrate 9 of each defective drawing area 92b is obtained by the deflector 162, and the defective type in each defective drawing area 92b is specified . These pieces of information acquired for the respective drawing areas 92 by the both-part obtaining unit 162 are stored in the storage unit 163 as the defect information according to the substrate 9. [ The defect information is output to the processing unit 3 by the defect information output unit 165 (step S15).

Next, the imaging controller 14 controls the imaging head 14 and the moving mechanism 15 based on the defect information stored in the storage unit 163 by the imaging control unit 164. Thus, only in the normal drawing region 92a, which is the drawing region where the judgment by the both-portion obtaining unit 162 was positive (that is, the drawing region in which the judgment is affirmative), the modulation from the drawing head 14 And the area irradiated with the light is scanned on the normal imaging area 92a. As a result, the circuit pattern 81 is drawn only in the normal drawing region 92a on the substrate 9 (Steps S16 and S17), as shown in Fig. The defective display pattern 82 indicating the defective area is drawn in the defective area 92b, which is the defective area designated as defective in the defective area acquisition unit 162 (steps S16 and S18).

The defective display pattern 82 includes information indicating the defective type in the defective drawing area 92b. The information indicating the failure category is based on the above-described failure information. In the example shown in Fig. 8, the number surrounded by the rectangular frame is drawn in the defective drawing area 92b as the defective display pattern 82. [ The numbers indicate both the rendering area is the failure rendering area 92b and the failure type at the same time. For example, when the defective indication pattern 82 is " 1 ", it indicates that the defective type is the rotation of the drawing area. When the defective display pattern 82 is in the range of "2" to "5", the defective type varies depending on the type of deformation, the deformation of the drawing area, the enlargement of the drawing area, It is a disconnection of a pattern. The display of the failure type by the failure indication pattern 82 is not necessarily limited to numbers, and may be performed in various modes.

The defective indication pattern 82 is arranged around the alignment mark 93 on the upper left or on the alignment mark 93 on the upper left among the plurality of alignment marks 93 in each defective drawing area 92b. In the example shown in Fig. 8, the defective display pattern 82 is disposed around the alignment mark 93 on the upper left in the defective drawing area 92b. The alignment mark 93 on the left upper side of each defective drawing area 92b is set so that the alignment mark 93 of each drawing area 92 in the subsequent process apparatus Is the first alignment mark to be first picked up among the alignment marks 93 in each drawing area 92. [ In the failure rendering area 92b in which the upper left alignment mark 93 (i.e., the first alignment mark) is deleted as in the failure rendering area 92b on the lower left side in FIG. 8, The bad indication pattern 82 is disposed on the periphery or the reference position.

In the drawing apparatus 1, steps S16 to S18 are repeated until the drawing of the pattern for all the drawing areas 92 on the substrate 9 is completed (step S19). Thereby, the circuit patterns 81 are drawn in all the normal drawing regions 92a, and the defective display patterns 82 are drawn in all the defective drawing regions 92b.

In the drawing apparatus 1, a pattern is drawn in a predetermined order with respect to a plurality of drawing regions 92. In the case where the drawing region is the normal drawing region 92a, the circuit pattern 81 is drawn, In the case of the defective drawing area 92b, the defective display pattern 82 is drawn. In the drawing apparatus 1, for example, after the drawing of the circuit pattern 81 with respect to all the normal drawing regions 92a is completed, the drawing of the bad display pattern 82 with respect to all the defective drawing regions 92b . Alternatively, the drawing of the circuit pattern 81 with respect to all the normal drawing regions 92a may be performed after the drawing of the bad display pattern 82 with respect to all the defect drawing regions 92b is completed.

When the drawing operation in the drawing apparatus 1 is completed, the substrate 9 is taken out of the drawing apparatus 1 and brought into the developing apparatus 21 shown in Fig. 1 (step S21). In the developing apparatus 21, the development processing is performed on the substrate 9 on which the circuit pattern 81 is drawn by the drawing apparatus 1 in the normal drawing region 92a (Step S22). Subsequently, the substrate 9 is carried into the etching apparatus 22 (step S23). In the etching apparatus 22, the substrate 9 subjected to the developing process by the developing apparatus 21 is etched (step S24). Thus, in the normal drawing region 92a, a copper wiring pattern corresponding to the circuit pattern 81 is formed. In the defective drawing region 92b, a display pattern of copper corresponding to the defective display pattern 82 is formed.

When the etching process is completed, the substrate 9 is taken out of the etching apparatus 22 and brought into the processing apparatus 3 (step S31). The processing apparatus 3 determines whether or not a plurality of drawing areas 92 on the substrate 9 based on the defect information outputted from the defect information output unit 165 of the drawing apparatus 1 to the processing apparatus 3 The inspecting process of the wiring pattern described above is performed only in the normal drawing region 92a (Steps S32 to S34). Thereafter, the substrate 9 is carried out from the processing apparatus 3, and the processing to the substrate 9 by the substrate processing system 10 is completed.

As described above, in the substrate processing system 10, the alignment marks 93 of the respective drawing areas 92 of the substrate 9 are picked up in the drawing device 1, and the position of each drawing area 92 Or the deformation amount is determined. The drawing control unit 164 controls the drawing head 14 and the moving mechanism 15 so that the circuit pattern 81 is drawn only in the normal drawing region 92a where the determination is positive. As described above, in the drawing apparatus 1, each of the plurality of drawing regions 92 on the substrate 9 is determined, and the determination result is used for drawing the circuit pattern 81 immediately thereafter, The time required for drawing the circuit pattern 81 with respect to the line pattern 81 can be shortened.

On the substrate 9, the alignment mark 93 of the defective imaging area 92b in which defects are detected in the previous step is modified. In the imaging apparatus 1, the modified alignment mark 93 is imaged The defective drawing area 92b is specified. Thereby, even if the position information of the defective drawing area 92b is not sent from the main definition device to the drawing device 1, the defective drawing area 92b is easily specified and only the normal drawing area 92a (81) can be drawn. As a result, the time required for drawing the circuit pattern 81 with respect to the substrate 9 can be shortened.

The alignment marks 93 that are changed in the defective drawing area 92b in which the defects are detected in the previous process are the same as the alignment marks 93 in the defective drawing area 92b, It is preferable that the first alignment mark is the alignment mark 93 first captured in the area 92. [ Thereby, the defective drawing area 92b can be specified easily and quickly in the drawing apparatus 1. [

The alignment mark 93 does not always need to be changed in the defect drawing area 92b where the defect is detected in the previous step and the alignment mark 93 is not necessarily formed in the defect drawing area 92b. May be changed. As a result, similarly to the above, even if the position information of the defective drawing area 92b is not sent from the main defintion apparatus to the drawing apparatus 1, the defective drawing area 92b is easily specified and the normal drawing area 92a Only the circuit pattern 81 can be drawn. As a result, the time required for drawing the circuit pattern 81 with respect to the substrate 9 can be shortened. It is preferable that the modified pattern is a pattern around the first alignment mark described above. Thereby, the defective drawing area 92b can be specified easily and quickly in the drawing apparatus 1 similarly to the above.

In the drawing apparatus 1, the defective display pattern 82 is drawn in the defective drawing area 92b. This makes it easy to identify that the imaging area 92 is the defective imaging area 92b. As a result, the processing in the post-process can be facilitated. Incidentally, since the bad display pattern 82 includes information indicating the type of bad, it is possible to easily identify the type of bad in the bad rendering area 92b. As a result, it is possible to easily acquire information such as the frequency of occurrence of each kind of defect. The above information can be used for analyzing the cause of the defect.

As described above, the positional information on the substrate 9 in the defective area 92b specified as defective by the deflector 162 is processed by the defective information output unit 165 in the post-process And output to the device 3. Thereby, the processing for only the normal imaging area 92a in the subsequent process (that is, the skipping of the processing for the defective imaging area 92b) is performed in a plurality of imaging areas 92 , It is possible to easily realize the determination without making an affirmative determination. As a result, the substrate 9 in the substrate processing system 10 can be quickly processed. It should be noted that the failure information output from the failure information output unit 165 to the processing apparatus 3 (step S15) need not necessarily be performed after step S14 and immediately after step S14 .

The defective information output unit 165 is omitted from the control unit 16 and the defective information is not output to the processing apparatus 3 in the drawing apparatus 1. [ In this case, in the processing apparatus 3, the imaging of the upper left alignment mark 93 (i.e., the above-described first alignment mark) and the vicinity thereof are performed with respect to each imaging area 92 of the substrate 9 Is done. When there is no upper left alignment mark 93, the reference position of the alignment mark 93 and the vicinity thereof are imaged. When the defective display pattern 82 is arranged on the upper left alignment mark 93 of the drawing area 92 or around the alignment mark 93, (92b), and no inspection process is performed on the defective area 92b. When the bad display pattern 82 is not disposed on the upper left alignment mark 93 of the drawing area 92 and around the alignment mark 93, It is determined that the area 92a is present, and the inspection processing is performed on the normal drawing area 92a.

As described above, in the substrate processing system 10, the defective display pattern 82 is formed in each of the plurality of alignment marks 93 in the defective drawing area 92b in each of the drawing areas 92 Or on the periphery of the first alignment mark, which is the alignment mark 93 that is first photographed in the first alignment mark. Thereby, the defective drawing area 92b can be specified easily and quickly in the subsequent step.

In the drawing apparatus 1, the defective display pattern 82 displayed in the defective drawing area 92b does not necessarily include information indicating the defective type. The bad indication pattern 82 on the substrate 9 may be a whole fill pattern extending over substantially all of the defect occurrence areas 92b as shown in Fig. The bad display pattern 82 on the substrate 9 may be a hatching pattern extending over substantially all of the defect rendering areas 92b as shown in Fig. 10, for example. The entire fill pattern which is the defect indication pattern 82 shown in Fig. 9 need not necessarily be drawn over substantially the entire defective drawing area 92b. For example, in the defective drawing area 92b, . The hatching pattern which is the defective display pattern 82 shown in Fig. 10 may also be drawn in a predetermined area in the defective drawing area 92b. As described above, the defect painting area 92b can be easily identified by drawing the entire fill pattern or the hatching pattern as the defective display pattern 82. [

In the substrate processing system 10, various modifications are possible.

For example, the alignment mark 93 provided as an eye mark on the substrate 9 may have various shapes other than a solid circular shape. The alignment mark 93 may be, for example, a cross shape. The alignment mark 93 may be a through hole formed in the substrate 9. [ Alternatively, a part of the pattern already formed in the drawing area 92 may be used as the alignment mark 93 to be imaged by the drawing device 1. FIG.

Movement of the substrate 9 and the substrate holding section 12 by the moving mechanism 15 may be performed relative to the imaging head 14 and the imaging section 13 in the imaging apparatus 1. The imaging head 14 and the imaging section 13 may move in the main scanning direction and the sub scanning direction without moving the substrate 9 and the substrate holding section 12, for example. Alternatively, the substrate 9 and the substrate holder 12 may be moved in the main scanning direction and the sub scanning direction without moving the imaging head 14 and the imaging section 13.

The imaging section 13 may be, for example, a line sensor capable of imaging over the entire width of the substrate 9 in the sub scanning direction. In this case, the imaging section 13 is fixed above the substrate holding section 12, and the substrate 9 is moved in the main scanning direction by the holding section moving mechanism 151, 9 is picked up.

In the drawing apparatus 1, if the circuit pattern 81 is not drawn to the defective drawing area 92b, it is not always necessary to draw the defective display pattern 82 in the defective drawing area 92b .

In the processing apparatus 3, various processes other than the above-described inspection process may be performed. For example, among the plurality of drawing regions 92 of the substrate 9, mounting processing for mounting the electronic components may be performed only in the normal drawing region 92a of the substrate 9 after the etching process. Alternatively, a drawing process of a new circuit pattern may be performed only in the normal drawing region 92a of the substrate 9 after the etching process.

The substrate 9 on which the drawing operation is performed in the drawing apparatus 1 is not necessarily limited to the printed wiring board. In the drawing apparatus 1, for example, a semiconductor substrate, a glass substrate for a flat panel display such as a liquid crystal display or a plasma display, a glass substrate for a photomask, a substrate for a solar cell panel, Rendering may be performed.

The configurations of the above-described embodiments and modified examples may be appropriately combined as long as they do not contradict each other.

While the invention has been described and illustrated in detail, the description is illustrative and not restrictive. Therefore, many modifications and variations are possible without departing from the scope of the present invention.

1 drawing apparatus
3 processor
9 substrate
10 substrate processing system
12 substrate holding portion
13 Imaging unit
14 Drawing Head
15 mobile device
21 developing device
22 Etching equipment
81 Circuit pattern
82 bad indication pattern
92 Drawing area
92a normal drawing area
92b defective drawing area
93 alignment mark
162 Positive part acquisition part
164 Drawing control section
165 Bad information output section
S11 to S19, S21 to S24, S31 to S34

Claims (30)

1. An image drawing apparatus for drawing a circuit pattern by irradiating light onto a substrate,
A substrate holding section for holding a substrate on which a plurality of drawing regions are set;
An imaging unit for imaging a plurality of alignment marks set in each imaging area;
Acquiring positions of the plurality of alignment marks on the substrate on the basis of an imaging result of the imaging section with respect to each of the imaging areas, and determining whether a deviation between a position of the plurality of alignment marks and a reference position in design is acceptable An area-acquisition unit operable to determine a position or a deformation amount of each of the rendering areas,
An imaging head for irradiating the substrate with modulated light;
A moving mechanism for moving the substrate relative to the imaging head together with the substrate holder and scanning the area irradiated with light from the imaging head on the substrate,
And a drawing control unit which controls the drawing head and the moving mechanism so as to draw a circuit pattern only in the normal drawing region which is the drawing region where the determination by the both-portion obtaining unit was positive. The method according to claim 1,
Wherein the imaging controller controls the imaging head and the moving mechanism so that the defective display pattern indicating the defective area is drawn in the defective area that is the defective area in the defective area. 1. An image drawing apparatus for drawing a circuit pattern by irradiating light onto a substrate,
A substrate holding section for holding a substrate on which a plurality of drawing regions are set;
An imaging unit for imaging a plurality of alignment marks set in each imaging area;
Acquiring positions of the plurality of alignment marks on the substrate on the basis of an imaging result of the imaging section with respect to each of the imaging areas and determining a position of each of the imaging areas based on positions of the plurality of alignment marks A correcting unit for correcting the amount of deformation,
An imaging head for irradiating the substrate with modulated light;
A moving mechanism for moving the substrate relative to the imaging head together with the substrate holder and scanning the area irradiated with light from the imaging head on the substrate,
And a drawing control unit that controls the drawing head and the moving mechanism so as to draw a circuit pattern only in a normal drawing region that is a drawing region where the determination by the above-
The defective display pattern indicating defective is drawn in the defective drawing area which is the defective drawing area specified in the defective part in the above-mentioned portion acquiring part by controlling the drawing head and the moving mechanism by the drawing control part,
In the above-mentioned correcting portion, the failure type of the defective drawing region is also specified,
Wherein the defective display pattern includes information indicating the defective type. The method of claim 3,
Wherein the defective indication pattern is disposed on a first alignment mark which is first picked up in a device of a subsequent process among the plurality of alignment marks in the defective drawing area or around the first alignment mark. The method of claim 2,
Wherein the defective indication pattern is disposed on a first alignment mark which is first picked up in a device of a subsequent process among the plurality of alignment marks in the defective drawing area or around the first alignment mark. The method of claim 2,
Wherein the bad display pattern is an entire fill pattern or a hatching pattern of a predetermined area. The method according to any one of claims 1 to 6,
Further comprising a defect information outputting section for outputting the position information on the substrate of the defect drawing area which is a drawing area specified as a defect in the both-side obtaining section. 1. An image drawing apparatus for drawing a circuit pattern by irradiating light onto a substrate,
A substrate holding section for holding a substrate on which a plurality of drawing regions are set;
An imaging unit for imaging a plurality of alignment marks set in each imaging area;
And a control section for controlling the image forming section to acquire the positive and negative sides of the respective imaging areas in accordance with whether or not the alignment marks of the defective imaging area, An acquisition unit,
An imaging head for irradiating the substrate with modulated light;
A moving mechanism for moving the substrate relative to the imaging head together with the substrate holder and scanning the area irradiated with light from the imaging head on the substrate,
And a drawing control unit that controls the drawing head and the moving mechanism to draw a circuit pattern only in a normal drawing area that is a drawing area identified as an amount in the both-side drawing unit. The method of claim 8,
Wherein the imaging controller controls the imaging head and the moving mechanism so that the defective display pattern indicating the defective area is drawn in the defective area that is the defective area in the defective area. 1. An image drawing apparatus for drawing a circuit pattern by irradiating light onto a substrate,
A substrate holding section for holding a substrate on which a plurality of drawing regions are set;
An imaging unit for imaging a plurality of alignment marks set in each imaging area;
A correction part for correcting an alignment mark in a defective area to be defective and a peripheral pattern thereof in a defective area in which a defective area is detected in the previous step,
An imaging head for irradiating the substrate with modulated light;
A moving mechanism for moving the substrate relative to the imaging head together with the substrate holder and scanning the area irradiated with light from the imaging head on the substrate,
And a drawing control unit that controls the drawing head and the moving mechanism so as to draw a circuit pattern only in a normal drawing region which is a drawing region confirmed to be a positive in the above-
The defective display pattern indicating defective is drawn in the defective drawing area which is the defective drawing area specified in the defective part in the above-mentioned portion acquiring part by controlling the drawing head and the moving mechanism by the drawing control part,
In the above-mentioned correcting portion, the failure type of the defective drawing region is also specified,
Wherein the defective display pattern includes information indicating the defective type. The method of claim 10,
Wherein the defective indication pattern is disposed on a first alignment mark which is first picked up in a device of a subsequent process among the plurality of alignment marks in the defective drawing area or around the first alignment mark. The method of claim 9,
Wherein the defective indication pattern is disposed on a first alignment mark which is first picked up in a device of a subsequent process among the plurality of alignment marks in the defective drawing area or around the first alignment mark. The method of claim 9,
Wherein the bad display pattern is an entire fill pattern or a hatching pattern of a predetermined area. The method according to any one of claims 8 to 13,
Further comprising a defect information outputting section for outputting the position information on the substrate of the defect drawing area which is a drawing area specified as a defect in the both-side obtaining section. A substrate processing system for processing a substrate,
A drawing device for drawing a circuit pattern on only a normal drawing area by irradiating light onto a substrate on which a plurality of drawing areas are set;
A developing device for performing development processing on the substrate on which the circuit pattern is drawn by the drawing device in the normal drawing area,
An etching apparatus for performing an etching process on the substrate subjected to the developing process by the developing apparatus,
And a processing device which performs predetermined processing only on the normal drawing area of the substrate after the etching process among the plurality of drawing areas of the substrate,
Wherein the drawing device comprises:
A substrate holder for holding the substrate;
An imaging section for imaging a plurality of alignment marks set in respective imaging areas of the plurality of imaging areas;
Acquires the positions of the plurality of alignment marks on the substrate on the basis of the imaging result of the imaging section with respect to each of the imaging areas and determines whether the deviation between the positions of the plurality of alignment marks and the reference position in design is acceptable An area-acquisition unit operable to determine a position or a deformation amount of each of the rendering areas,
An imaging head for irradiating the substrate with modulated light;
A moving mechanism for moving the substrate relative to the imaging head together with the substrate holder and scanning the area irradiated with light from the imaging head on the substrate,
And a drawing control section that controls the drawing head and the moving mechanism so as to draw the circuit pattern only in the normal drawing area that is the drawing area where the determination by the both-side obtaining section was positive. A substrate processing system for processing a substrate,
A drawing device for drawing a circuit pattern on only a normal drawing area by irradiating light onto a substrate on which a plurality of drawing areas are set;
A developing device for performing development processing on the substrate on which the circuit pattern is drawn by the drawing device in the normal drawing area,
An etching apparatus for performing an etching process on the substrate subjected to the developing process by the developing apparatus,
And a processing device which performs predetermined processing only on the normal drawing area of the substrate after the etching process among the plurality of drawing areas of the substrate,
Wherein the drawing device comprises:
A substrate holder for holding the substrate;
An imaging section for imaging a plurality of alignment marks set in respective imaging areas of the plurality of imaging areas;
And a control section for controlling the image forming section to acquire the positive and negative sides of the respective imaging areas in accordance with whether or not the alignment marks of the defective imaging area, An acquisition unit,
An imaging head for irradiating the substrate with modulated light;
A moving mechanism for moving the substrate relative to the imaging head together with the substrate holder and scanning the area irradiated with light from the imaging head on the substrate,
And a drawing control section that controls the drawing head and the moving mechanism so as to draw the circuit pattern only in the normal drawing area which is a drawing area identified as a positive in the both-side obtaining section. A drawing method for drawing a circuit pattern by irradiating a substrate with light,
a) preparing a substrate on which a plurality of drawing regions are set,
b) imaging a plurality of alignment marks set in each imaging area;
(c) obtaining positions of the plurality of alignment marks on the substrate on the basis of the imaging results in the step (b) for each of the drawing areas, and calculating the positions of the plurality of alignment marks Determining a position or a deformation amount of each of the drawing areas according to whether a deviation is within an allowable range;
and d) drawing the circuit pattern only in the normal drawing region, which is the drawing region where the judgment by the step c) was positive, by scanning the irradiation region of the light on the substrate while irradiating the modulated light onto the substrate. Drawing method. 18. The method of claim 17,
Further comprising a step of drawing a defective display pattern indicating a defective area in a defective drawing area that is a defective area specified as defective in the step c). A drawing method for drawing a circuit pattern by irradiating a substrate with light,
a) preparing a substrate on which a plurality of drawing regions are set,
b) imaging a plurality of alignment marks set in each drawing area,
(c) acquiring the positions of the plurality of alignment marks on the substrate on the basis of the imaging results in the step (b) for each of the drawing areas, and based on the positions of the plurality of alignment marks, Determining a position of a region or both sides of the deformation;
and d) drawing a circuit pattern only in a normal drawing region, which is a drawing region where the judgment by the step c) was positive, by scanning the irradiation region of the light on the substrate while irradiating the modulated light onto the substrate,
Further comprising a step of drawing a defective display pattern indicating defective in a defective drawing area that is a defective area specified as defective in the step c)
In the step c), the defective type of the defective area is specified,
Wherein the defective indication pattern includes information indicating the defective type. The method of claim 19,
Wherein the defective display pattern is disposed on a first alignment mark that is first picked up in a subsequent process among the plurality of alignment marks in the defective drawing area or around the first alignment mark. 19. The method of claim 18,
Wherein the defective display pattern is disposed on a first alignment mark that is first picked up in a subsequent process among the plurality of alignment marks in the defective drawing area or around the first alignment mark. 19. The method of claim 18,
Wherein the bad display pattern is an entire fill pattern or a hatching pattern of a predetermined area. The method according to any one of claims 17 to 22,
Further comprising the step of outputting positional information on the substrate in the defective area, which is a defective area specified as defective in the step (c). A drawing method for drawing a circuit pattern by irradiating a substrate with light,
a) preparing a substrate on which a plurality of drawing regions are set,
b) imaging a plurality of alignment marks set in each imaging area;
and c) determining whether or not the alignment mark of the defective area to be defective, which is the defective area in which the defective area has been detected in the previous step than the step a), or the surrounding pattern thereof has been modified based on the imaging result in the step b) A step of obtaining both sides of each drawing area,
and d) drawing a circuit pattern only in a normal imaging area, which is an imaging area identified as an amount in the step c), by scanning the irradiation area of the light onto the substrate while irradiating the modulated light onto the substrate. Drawing method. 27. The method of claim 24,
Further comprising a step of drawing a defective display pattern indicating a defective area in a defective drawing area that is a defective area specified as defective in the step c). A drawing method for drawing a circuit pattern by irradiating a substrate with light,
a) preparing a substrate on which a plurality of drawing regions are set,
b) imaging a plurality of alignment marks set in each drawing area,
and c) an alignment mark or a peripheral pattern of a defective area, which is a defective area in which defects have been detected in the previous step than the step a), is modified, and on the basis of the imaging result in step b) A step of obtaining a positive part,
and d) drawing the circuit pattern only in the normal drawing area, which is the drawing area identified as the amount in the step c), by scanning the irradiation area of the light on the substrate while irradiating the modulated light onto the substrate,
Further comprising a step of drawing a defective display pattern indicating defective in a defective drawing area that is a defective area specified as defective in the step c)
In the step c), the defective type of the defective area is specified,
Wherein the defective indication pattern includes information indicating the defective type. 27. The method of claim 26,
Wherein the defective display pattern is disposed on a first alignment mark that is first picked up in a subsequent process among the plurality of alignment marks in the defective drawing area or around the first alignment mark. 26. The method of claim 25,
Wherein the defective display pattern is disposed on a first alignment mark that is first picked up in a subsequent process among the plurality of alignment marks in the defective drawing area or around the first alignment mark. 26. The method of claim 25,
Wherein the bad display pattern is an entire fill pattern or a hatching pattern of a predetermined area. 29. The method of any one of claims 24 to 29,
Further comprising the step of outputting positional information on the substrate in the defective area, which is a defective area specified as defective in the step (c).

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