JP2006098488A - Double-face drawing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a double-face drawing apparatus which can directly draw a pattern with an exposure light beam on a resist layer on the top and the back surfaces of a substrate, and to provide a method for drawing an image. <P>SOLUTION: The exposure optical system 20 includes: a laser light source 21 as a light source unit; a plurality of mirrors 22, 23, 24 to guide the emitted laser light to a scanning unit; an optical modulator 25 constituting an optical modulating means; a polygon mirror 26 constituting the scanning unit; an f-θ lens 27; an optical splitter 28 constituting an optical branching means comprising a half mirror or the like to branch the emitted exposure beam to the top surface side and to the back surface side of the object to be exposed; and a beam superposition regulating device 29 as a beam superposition regulating means. The beam superposition regulating device 29 comprises a beam regulator 30 and a position sensor 31. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an apparatus that directly draws a pattern on a photosensitive material on a substrate using an exposure beam, and more particularly to a double-sided drawing apparatus that simultaneously draws a pattern on a photosensitive material formed on the front and back of a substrate.

  Shadow masks for color cathode ray tubes, lead frames used for mounting semiconductor devices, fine pore filter meshes, and masks used in the exposure process for manufacturing flat panels (plasma display panels, liquid crystal display panels, etc.) or printed wiring boards Various substrates such as films are usually manufactured by patterning a long base material. As the precision and miniaturization of the base material processing advances, a technology for processing the base material using a resist mask formed by a photolithography technique as an etching mask for a long base material has become essential. This method is in practical use.

  In the formation of a resist mask by the photolithography technique, there is a method in which a required pattern on a photomask installed in an exposure apparatus is exposed and transferred to a resist layer, which is a photosensitive material coated on the surface of a substrate, and developed (for example, Patent Documents). 1). In addition, there is a method in which a pattern is directly drawn on a resist layer on the surface of a substrate with a laser beam (see, for example, Patent Document 2).

Here, no matter which method is used, in order to increase the accuracy of the substrate processing, it is necessary to perform positioning for pattern formation with respect to the substrate surface. In the method using the photomask, an alignment mark is formed on at least the surface of the substrate, the alignment mark position is read in exposure, alignment is performed with an exposure apparatus or a photomask, and positioning is performed. Further, in the direct pattern drawing method, for example, the laser optical axis is adjusted based on a position sensor provided at a predetermined position in the laser beam path of the exposure optical system, and positioning adjustment for direct pattern drawing is performed.
Japanese Patent No. 2682002 (page 4, FIG. 2) JP-A-5-307148 (paragraphs [0006] to [0008], FIG. 1)

  In recent years, in etching processing of a long base material using the resist mask, it is known that a resist mask is formed on both the front and back surfaces of the base material so that the base material can be etched from both sides of the base material. . As a result, the processing time can be shortened to about ½ by etching from both sides, and the manufacturing costs of the various substrates described above can be reduced. In addition, the side etching amount of the substrate is reduced in the etching process, and the fine processing becomes easy.

  However, the above-described prior art forms a resist mask only on the surface side of the substrate. Therefore, in order to form resist masks on both sides of the base material, in an exposure apparatus using a photomask as in the above-mentioned Patent Document 1, an apparatus structure in which two photomasks are simply attached to the front surface side and the back surface side of the base material. In addition, it is possible to follow the above positioning method as it is, so that each photomask pattern can be exposed and transferred onto the front surface side and the back surface side of the substrate. However, in this case, since it is necessary to correspond to the long base material, it is necessary to operate two photomasks. For this reason, there arises a problem that the exposure apparatus becomes very large and the exposure mechanism must be made highly accurate.

  On the other hand, using the direct pattern drawing method as described in Patent Document 2, it is possible to simultaneously form a pattern on the front surface side and the back surface side of the base material by positioning the pattern formed on the front surface and the pattern formed on the back surface. It is difficult because no specific measures have been taken.

  An object of the present invention is to provide a double-sided drawing apparatus capable of directly drawing a pattern with an exposure beam on a resist layer on a front surface and a back surface of a base material.

The above object is achieved by the following configurations.
(1) A double-sided drawing apparatus that exposes and draws patterns on both the front and back surfaces of a material to be exposed, and that scans the exposure beam on the front and back sides of the light source unit that generates an exposure beam. A double-sided drawing apparatus comprising: a scanning unit; and a beam superimposing adjusting unit that adjusts scanning of the exposure beam so that the trajectories of the exposure beam that scans on both sides coincide with each other.
(2) The beam overlap adjusting means includes a position sensor having an imaging unit sandwiching the material to be exposed and facing each other on the front side and the back side, and on the front side or the back side based on detection data of the position sensor. The double-sided drawing apparatus according to claim 1, further comprising a beam adjuster that adjusts scanning of the upper exposure beam.
(3) The beam adjuster is provided at a rear stage of the scanning unit, and is provided at at least one of a pair of bar-shaped mirrors facing the image sensor of the position sensor, and the bar-shaped mirror. The double-sided drawing apparatus according to claim 2, further comprising a piezo element that is displaced in position.
(4) The beam adjuster includes a pair of optical mirrors that are rotationally driven by a piezo actuator provided in a front stage of the scanning unit, and the optical mirror adjusts the beam direction by the piezo actuator. The double-sided drawing apparatus according to claim 2.
(5) Optical modulation means for modulating the exposure beam based on drawing data corresponding to the pattern, and optical branching means for dividing the modulated exposure beam into a front surface side and a back surface side of the material to be exposed. The double-sided drawing apparatus according to claim 1, further comprising:

  According to the present invention, compared with a double-sided exposure apparatus using a photomask pattern transfer, the double-sided drawing apparatus of the present invention has a compact and lightweight structure, and no heavy photomask is required, and the operability of the apparatus is much easier. become. Moreover, it becomes possible to form a desired resist mask aligned with high accuracy between the front and back surfaces of the long base material. And it becomes easy to increase the precision and miniaturization of the pattern processing of the long base material, the processing time is shortened, and the manufacturing cost is greatly reduced. Moreover, it is possible to respond very quickly to changes in the pattern of long substrate processing from customers.

(First embodiment)
Hereinafter, embodiments of the present invention will be described with reference to the drawings. First, a first embodiment of the present invention will be described with reference to FIGS.

  FIG. 1 is a configuration diagram showing an overall schematic configuration for patterning the long base material including the double-sided drawing apparatus of the present invention. In FIG. 1, a rewinder 1 is provided with a coil 3 of a strip-like metal thin plate such as stainless steel, steel plate, brass, aluminum, etc., which is a base material 2 of an exposed member, and a predetermined back tension is given by a motor 4. ing.

  Then, the base material 2 whose curl has been corrected by a tension leveler (not shown) is supplied to the resist coating device 5, and for example, a positive resist is applied to the front and back surfaces of the base material 2 by the resist coating device 5. Thus, the exposed member 6 is formed.

  The exposed member 6 is step-conveyed to a baking furnace 7 and a double-sided drawing device 8 for drying the resist, for example, by a conveyance mechanism composed of a roll having a resin coating on the outer surface. Then, a required pattern is directly drawn by the double-side drawing device 8, and the resist layer of the exposed member 6 is exposed (see FIG. 2).

  The exposed to-be-exposed member 6 is developed by a development processing unit 9 for developing a resist, and a resist mask having a predetermined pattern is formed on the front surface and the back surface of the substrate 2.

  Then, an etching processing unit 10 is disposed on the rear side of the development processing unit 9, and the etching process of the base material 2 is performed using the resist mask as an etching mask. Further, the resist mask is peeled and removed by the resist removing section 11 provided on the rear side of the etching processing section 10.

  A winder 12 is disposed on the rear side of the resist removing unit 11 and is driven to rotate clockwise by a drive motor 14 that is driven to rotate by a control signal from a drive control device 13. Here, both the drive control device 13 and the double-sided drawing device 8 are controlled by the controller 15.

  The double-sided drawing apparatus 8 of the present invention is composed of an exposure optical system and a control system as a basic structure. FIG. 2 is a diagram showing a schematic configuration of the exposure optical system 20 for direct pattern drawing. FIG. 2 shows a part of the rewinding machine 1 shown in FIG. 1, the exposed member 6, and the winder 12.

  The exposure optical system 20 includes a laser light source 21 that emits a laser beam as a light source unit for an exposure beam, a plurality of mirrors 22, 23, and 24 that guide the emitted laser beam to a scanning unit, and pattern data for pattern drawing as an optical modulation unit. Based on this, an optical modulator 25 for on / off modulation of the laser light, a polygon mirror 26 constituting the scanning unit, and an f-θ lens 27 are provided. Here, the polygon mirror 26 is a rotary polygon mirror that is driven to rotate by a mirror motor, and an encoder (not shown) is interlocked to detect the rotation angle position or rotation amount. Further, the f-θ lens 27 compensates for the distortion of the optical image caused by the exposure light beam entering obliquely with respect to the exposed material surface. Note that the laser light source 21 may be configured by, for example, a semiconductor laser capable of emitting pulsed light, a strobe light, or the like. In this case, the optical modulator 25 may be omitted by operating the laser light source 21 based on the pattern data. Note that an Ar laser, an excimer laser such as KrF, or a He—Cd laser is used as the laser light.

  Further, the exposure optical system 20 includes an optical splitter 28 composed of a half mirror or the like that branches the emitted exposure beam to the front surface side and the back surface side of the exposed member 6 as an optical branching unit, and serves as a beam overlap adjusting unit. A beam overlap adjusting device 29. Here, the beam overlap adjusting device 29 includes a beam adjuster 30 and a position sensor 31. The beam adjuster 30 is configured to be provided at the subsequent stage of the scanning unit described above.

  In the exposure optical system 20 as described above, all except the laser light source 21, mirror 22, optical modulator 25, and optical splitter 28 are installed on the front side and the back side of the exposed member 6. Then, a double-sided pattern is drawn on the resist layers on the front and back surfaces of the exposed member 6 with laser light. Here, the winder 12 is driven by the drive motor 14 controlled by the drive control device 13 shown in FIG. 1, and conveys the exposed member 6 below the exposure optical system 20 at a predetermined speed. At the same time, the laser beam is scanned by the polygon mirror 26 of the scanning unit described above. Hereinafter, the scanning direction by the polygon mirror 26 is referred to as a main scanning direction, and the scanning direction by the drive motor 14 is referred to as a sub-scanning direction. These scans are simultaneously controlled by the controller 15 of FIG.

  In the double-sided drawing apparatus of the present invention, the beam overlap adjusting device 29 performs alignment (beam overlap) so that the exposure beam irradiation beam positions on the front surface side and the back surface side of the exposed member 6 are the same. It will be. The beam overlap adjusting device 29, which is a feature of the present invention, will be described in detail with reference to FIGS.

  FIG. 3 is a top view of the beam adjuster 30. The beam adjuster 30 includes a bar mirror 32 that bends the laser beam from the f-θ lens 27 toward the surface of the exposed member 6, and a rod mirror 32 that connects the bar mirror 32 via elastic bodies 33 and 34. The structure includes a character-shaped support 35 and a first piezo element portion 36 and a second piezo element portion 37 that are provided on both sides in the axial direction on one side surface of the bar mirror 32 and are connected to the bar mirror 32. is there. The right ends of the first piezo element 36 and the second piezo element 37 are fixed to the bar mirror 35 as shown in FIG. 3, and the other ends are fixed to a support (not shown). The elastic body 33 connects the side surface of the bar mirror 32 opposite to the side surface on which the first piezo element portion 36 and the second piezo element portion 37 are provided to the support body 35, and the elastic body 34 is the bar mirror 32. Both ends in the axial direction are connected to the support 35. Here, the first piezo element portion 36 and the second piezo element portion 37 are configured to displace the bar mirror 32 independently in the direction of the arrow in FIG. The elastic bodies 33 and 34 are made of a material that can sufficiently follow the positional displacement caused by the piezoelectric element. Therefore, the bar mirror 32 is displaced according to the expansion and contraction of the first piezo element 36 or the second piezo element 37.

  As shown in FIGS. 2 and 4, the position sensor 31 includes a first imaging unit 38 a and a second imaging unit 38 b provided on the both sides in the axial direction of the bar mirror 32 on the surface side of the exposed member 6, and a back surface. On the side, the first imaging unit 38a and the second imaging unit 38b are opposed to each other so as to have a third imaging unit 39a and a fourth imaging unit 39b provided on both sides in the axial direction of the bar mirror 32. It is fixed to the body. The image pickup unit has a structure including a CCD element, for example.

  As described above, in the exposure optical system beam superimposing adjustment device 29 according to the present invention, the beam adjuster 30 is provided after the scanning section of the exposure optical system provided on the front surface side and the back surface side of the exposed member 6, respectively. Installed. On the other hand, the position sensor 31 is positioned and arranged with respect to the exposed member 6 independently of the beam adjuster 30.

  FIG. 4 shows an arrangement relationship between the beam adjuster 30 and the position sensor 31. A resist layer 42 is formed on the front side and the back side of the substrate 2. The position sensor 31 is arranged with the exposed member 6 having such a configuration sandwiched inside. Specifically, the first imaging unit 38a and the third imaging unit 39a are arranged to face the front surface side and the back surface side of the exposed member 6 on one axial end side of the bar mirror 32, respectively. In addition, the second imaging unit 38b and the fourth imaging unit 39b are respectively disposed on the other end side in the axial direction of the bar mirror 32 so as to face the front surface side and the back surface side of the exposed member 6. Then, a pair of beam adjusters 30 having rod mirrors 32 disposed on the front surface side and the back surface side are installed on the outer sides in the front and back direction of the respective imaging units 38a, 38b, 39a, 39b. The laser beam 43 from the f-θ lens 26 of the scanning unit of the exposure optical system 20 is bent by the bar mirror 32, and the front and back laser beams are received by the imaging units 38a, 38b, 39a, and 39b, respectively. The amount of beam displacement during that time is calculated.

  Next, the control system 44 of the beam overlap adjusting device 29 will be described with reference to FIG. As shown in FIG. 5, the basic structure of the control system 44 includes a control unit 45, a first imaging unit 38a, a second imaging unit 38b, a third imaging unit 39a, a fourth imaging unit 39b, an angle drive control unit 46, The offset drive control unit 47 is included.

  The control unit 45 includes a CPU, a memory, a large-capacity high-speed storage device, an input / output interface, and the like. The CPU executes a control program to control each unit, and performs the beam superposition adjustment as described above. The imaging units 38 a, 38 b, 39 a, 39 b detect the corresponding laser beam positions and supply the detected signals to the control unit 45. Based on the position detection data, the CPU calculates a beam displacement amount. Based on the beam displacement amount, the angle drive control unit 46 and the offset drive control unit 47 perform the first piezo element unit 36 and the second piezo element of the beam adjuster 30. The element part 37 is driven.

  Next, double-sided drawing will be described with reference to FIGS. 1 to 6 together with the operation of the beam overlap adjusting device 29. Here, FIG. 6 schematically shows a trajectory of laser light scanning in the beam superimposition adjustment on the front side and the back side of the exposed member, which is performed in advance before the pattern is drawn on both sides.

(A) First, the controller 15 shown in FIG. 1 drives the drive motor 14 by the drive control device 13, conveys the exposed material member 6 to the initial drawing position, and temporarily stops. That is, the sub scanning is stopped together with the main scanning. Here, prior to this, the angle adjustment between the scanning unit of the exposure optical system 20 and the exposed member 6 has been completed so that the main scanning direction and the sub-scanning direction are perpendicular to each other.

(B) In the position sensor 31 as shown in FIG. 4, the first imaging unit 38 a, the third imaging unit 39 a, the second imaging unit 38 b, and the fourth imaging unit 39 b are arranged so as to sandwich the exposed material member 6. In this manner, as described with reference to FIG. 4, each bar mirror 32 of the beam adjuster 30 is disposed outside the first imaging unit 38 a and the third imaging unit 39 a. Further, the bar mirrors 32 are also arranged outside the second imaging unit 38b and the fourth imaging unit 39b (not shown).

(C) Laser light is emitted from the laser light source 21 of FIG. 2 and main scanning at a constant speed is performed through the scanning unit of the exposure optical system 20 disposed on the front surface side and the back surface side of the exposed member 6. Then, the first imaging unit 38a and the second imaging unit 38b receive the start point position and the end point position of the laser beam 43 on the surface side bent by the bar mirror 32, respectively. At the same time, the third imaging unit 39a and the fourth imaging unit 39b receive the starting point position and the ending point position of the laser beam 43 on the back side that is bent by the bar mirror 32, respectively.

(D) The control unit 45 shown in FIG. 5 calculates the trajectory of each laser beam based on the detection signals of the start point position and end point position of the received laser beam 43 on the front surface side and the back surface side. Based on both beam displacement amounts, beam superposition adjustment is performed as follows.

(E) The solid line indicating the locus of the laser beam in FIG. 6A is that of the laser beam 43 on the surface side of the exposed member 6. Here, the start point 48a and the end point 49a are received by the first imaging unit 38a and the second imaging unit 38b, respectively. Similarly, the broken lines in the figure are those of the laser beam 43 on the back side of the exposed member 6, and the start point 48b and the end point 49b are respectively received by the third imaging unit 39a and the fourth imaging unit 39b. . From such both beam displacement amounts, angle adjustment and offset adjustment are sequentially or simultaneously performed.

(F) The angle drive control unit 46 receives a command signal from the control unit 45, applies different voltages to the first piezo element unit 36 and the second piezo element unit 37, and has a surface as indicated by an arrow in FIG. Different displacement amounts are given to the side bar mirror 32. Thereby, the angle of the locus of the laser beam indicated by the solid line is adjusted with respect to the locus of the laser beam indicated by the broken line. FIG. 7B shows the locus of the laser beam after the angle adjustment. By this adjustment, the locus of the laser beam indicated by the broken line and the locus indicated by the solid line become parallel, and the difference therebetween is only the offset amount.

(G) The offset drive control device 47 similarly applies the same voltage to the first piezo element unit 36 and the second piezo element unit 37, and applies a displacement amount corresponding to the offset amount to the bar mirror 32 on the surface side. . Thereby, the locus of the laser beam indicated by the solid line is offset adjusted with respect to the locus of the laser beam indicated by the broken line. FIG. 7C shows the locus of the laser beam after the offset adjustment. With this adjustment, the trajectory of the laser beam indicated by the broken line and the trajectory indicated by the solid line completely coincide with each other, and the beam superposition adjustment is completed.

  After performing the beam superposition adjustment, double-sided drawing is performed on the resist layer on the front surface side and the back surface side of the exposed member 6. First, the adjusted front-side and back-side beam adjusters 30 are fixed to the exposure optical system 20 as they are, and the arrangement of the position sensor 31 is released. Then, the controller 15 shown in FIG. 1 starts the sub-scan of the exposed material member 6 as described above, and simultaneously activates the double-sided drawing device 8.

  By the activation, a rectangular or circular laser beam is emitted from the laser light source 21, and the laser light modulated by the optical modulator 25 based on the drawing pattern data is branched to the front side and the back side by the optical splitter 28, respectively. Main scanning is performed by the scanning unit (polygon mirror, f-θ lens) of the exposure optical system 20. These laser beams pass through the bar mirrors 32 of the respective beam adjusters 30, and the same pattern is exposed and drawn on the respective resist layers 42. The exposure drawing of the pattern here can be performed by a general control system.

  When the predetermined exposure drawing is completed, the above-described beam overlay adjustment is performed again, and the above drawing is repeated. Alternatively, the beam superimposition adjustment may be performed only at the initial drawing position of the exposed material member 6, and the exposure drawing may be continuously performed thereafter.

  With such a configuration, it is possible to draw both sides of a desired pattern that is aligned with high accuracy between the resist layers on the front and back surfaces of the long base material. And it becomes easy to increase the precision and miniaturization of the pattern processing of the long base material, the processing time is shortened, and the manufacturing cost is greatly reduced.

  Further, compared to a double-sided exposure apparatus using a photomask pattern transfer, the double-sided drawing apparatus of the present invention has a compact and lightweight structure, and does not require a heavy photomass, and the work operability of the apparatus is greatly improved. In addition, a great effect is brought about in that it is possible to respond very quickly to a customer's pattern change for processing a long base material.

(Second Embodiment)
Next, a second embodiment of the present invention will be described with reference to FIGS. In the second embodiment, the configuration of the beam adjuster 30 described in the first embodiment is different. FIG. 8 is a diagram showing a schematic configuration of a modification of the exposure optical system of the double-sided drawing apparatus. The drawing shows the exposed member 6 and the winder 12 shown in FIG. In addition, the same thing as 1st Embodiment is shown with the same code | symbol, and the overlapping description is abbreviate | omitted or simplified.

  As shown in FIG. 7, in the exposure optical system 50, the beam overlap adjusting device has mirrors 51 and 52 with piezoelectric actuators provided in the optical path of the laser beam as a beam adjuster, and has a position sensor 31. . Here, the mirrors with piezoelectric actuators 51 and 52 have a structure in which the angle of the laser beam can be adjusted by the piezoelectric actuator (described later). In other respects, as in the first embodiment, a laser light source 21 that emits laser light in a pulsed manner, a mirror 22 that guides the emitted laser light to a scanning unit, and laser light on / off based on pattern data at the time of pattern drawing An optical modulator 25 for modulating, an optical splitter 28 for branching the emitted laser light to the front side and the back side of the exposed member 6, a polygon mirror 26 constituting the scanning unit, and an f-θ lens 27 are provided. . Further, a bar mirror 60 that bends the laser beam toward the surface of the exposed member 6 is provided at the subsequent stage of the f-θ lens 27.

  The piezo-actuator-equipped mirrors 51 and 52, the scanning unit, and the bar mirror 60 of the exposure optical system 50 as described above are installed on the front surface side and the back surface side of the exposed member 6. Then, a double-sided pattern is drawn on the resist layers on the front and back surfaces of the exposed member 6 with laser light. Here, the winder 12 is driven by the drive motor 14 shown in FIG. 1, and conveys the exposed member 6 below the exposure optical system 50 at a predetermined speed.

  In this embodiment, the mirrors 51 and 52 with piezo actuators and the position sensor 31 are aligned so that the beam positions of the laser light irradiation on the front side and the back side of the exposed member 6 are the same. The mirrors 51 and 52 with piezoelectric actuator will be described in detail with reference to FIG.

FIG. 8 is a perspective view of mirrors 51 and 52 with piezoelectric actuators. As shown in FIG. 8, the piezo actuator 53 is configured to include a gear mechanism 54 and a piezo element unit 55 that change a linear motion into a rotational motion. The gear mechanism 54 adjusts the angle of the mirrors 51 and 52 with piezoelectric actuators with respect to the laser beam 56.
The configurations of the piezo actuator-equipped mirrors 51 and 52 are not limited to the configuration shown in FIG. 8, and the mirrors may be rotated by other means. Further, instead of rotating one of the mirrors 51 and 52, it may be finely moved up and down or left and right in FIG.

  Next, beam superimposition adjustment in the second embodiment will be described in correspondence with the first embodiment. In the present embodiment, the functions of the first piezo element portion 36 and the second piezo element portion 37 described in FIG. 3 are performed by piezo actuators attached to mirrors 51 and 52 with piezo actuators. These piezo elements 55 are driven by the angle drive control unit 46 and the offset drive control unit 47 described in FIG. 5 to adjust the angles of the mirrors 51 and 52 with piezo actuators. By adjusting the angles of the two mirrors with piezoelectric actuators 51 and 52, the incident angle of the laser beam to the rotary polygon mirror constituting the polygon mirror 26 is changed, and the scanning direction of the laser beam generated by the rotation of the polygon mirror 26 is changed and adjusted. become able to. By adjusting the scanning direction in this way, it is possible to adjust the exposure position by the laser beam on the front surface side and the back surface side of the exposed member 6. In this case, the position sensor 31 is used in exactly the same way as described in the first embodiment.

  Other configurations and operations are the same as those described in the first embodiment. Further, it is more preferable to combine the configuration of the second embodiment with the configuration of the first embodiment.

Here, an example of processing the base material using a resist mask formed by the double-sided drawing apparatus of the present invention as an etching mask for a long base material will be described, and the effects of the present invention will be described. FIG. 9 is a partial plan view of a lead frame formed by a series of apparatuses for patterning the long base material described in FIG. Here, a predetermined opening 57 is formed in the base material 2. The manufacturing process will be described with reference to FIG. FIG. 10 is a cross-sectional view corresponding to the section cut along A ₁ -B ₁ shown in FIG.

  As shown in FIG. 10A, positive resist layers 42 are respectively formed on the front surface side and the back surface side of the base material 2 made of stainless steel by being conveyed to the resist coating device 5. This becomes the exposed member 6. Then, the beam overlay adjustment as described above is performed in the double-sided drawing apparatus 8 of the present invention, and a predetermined pattern is simultaneously drawn on the resist layer 42 with a laser beam.

  Next, the resist layer 42 is developed by the development processing unit 9. With this development, the resist layer in the region irradiated with the laser beam is removed. In this way, a resist mask 58 is formed on the front surface and the back surface of the substrate 2 as shown in FIG. Here, the alignment of the resist mask 58 on the front surface and the back surface is completed by the beam superimposition adjustment of the present invention.

  Next, the base material 2 is conveyed to a baking furnace, and the resist masses 58 and 58a are baked. Then, in the subsequent etching processing section 10, as shown in FIG. 10C, a chemical chemical solution is applied from the front surface side and the back surface side of the substrate 2 using the resist masks 58 and 58 a aligned with each other as an etching mask. The substrate 2 is etched to form the opening 57. Thus, since the etching proceeds from both sides, the processing time is reduced to about ½. Further, in this etching process, the amount of side etching is reduced, the size of the opening 57 can be reduced, and the substrate processing can be easily miniaturized.

  Subsequently, the resist masks 58 and 58a are removed at the subsequent resist stripping portion 11. In this way, an opening 57 as shown in FIGS. 10D and 9 can be formed, and the long base 2 can be processed into a lead frame.

The present invention is not limited to the above-described embodiments, and the embodiments can be appropriately changed within the scope of the technical idea of the present invention.
In the present embodiment, the beam conditioner composed of the rod mirror and the piezo element of the first embodiment, and the beam conditioner composed of the optical mirror and the piezo element of the second embodiment are provided on both sides of the front surface and the back surface. However, a beam adjuster may be provided on at least one of the front surface and the back surface to perform overlay adjustment.
Further, in this embodiment, the exposure beam from a single light source unit is exposed on the front side and the back side of the exposed member using an optical branching unit, but separate light source units are provided on the front side and the back side. It may be provided and exposed individually.

  In addition, for example, the double-sided drawing method according to the present invention forms metal wiring on the front surface side and the back surface side of the substrate like a printed multilayer wiring board in addition to the processing of the long base material as in the above embodiment. The same applies to the case. In this case, the patterns of the metal wiring formed on the front surface side and the metal wiring formed on the back surface side are generally different from each other, unlike the case of the above embodiment. However, even in this case, the double-sided drawing apparatus of the present invention can be applied in the same manner, and the metal wirings on both sides can be aligned by the beam overlap adjusting device.

  In the present invention, it is noted that exposure light such as g-line and i-line other than laser light may be used as the exposure beam. In this case, the controllability of the exposure beam in the exposure optical system is slightly deteriorated, but it can be sufficiently applied in the present invention.

It is a schematic block diagram for the process of the elongate base material containing the double-sided drawing apparatus of this invention. It is an exposure optical system of the double-sided drawing apparatus in the 1st Embodiment of this invention. It is a top view of the beam adjuster used for the beam superposition adjustment apparatus in the 1st Embodiment of this invention. It is a top view of the beam superposition adjustment apparatus of the double-sided drawing apparatus in the 1st Embodiment of this invention. It is a basic lineblock diagram of the control system in a 1st embodiment of the present invention. It is a figure which shows the laser beam locus | trajectory in the beam superimposition adjustment of this invention. It is an exposure optical system of the double-sided drawing apparatus in the 2nd Embodiment of this invention. It is a perspective view of the mirror with a piezoelectric actuator used in the 2nd Embodiment of this invention. It is a top view of the elongate base material processed using the double-sided drawing apparatus of this invention. It is sectional drawing of the process sequence of the said elongate base material.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Rewinding machine 2 Base material 3 Coil 4 Motor 5 Resist coating device 6 Exposed member 7 Baking furnace 8 Double-sided drawing device 9 Development processing part 10 Etching processing part 11 Resist peeling part 12 Winding machine 13 Drive control apparatus 14 Drive motor 15 Controllers 20, 50 Exposure optical system 21 Laser light sources 22, 23, 24 Mirror 25 Optical modulator 26 Polygon mirror 27 f-θ lens 28 Optical splitter 29 Beam superposition adjustment device 30 Beam adjuster 31 Position sensor 32 Bar mirror 33, 34 Elasticity Body 35 Support 36 First piezo element part 37 Second piezo element part 38a First imaging part 38b Second imaging part 39a Third imaging part 39b Fourth imaging part 42 Resist layers 43, 56 Laser beam 44 Control system 45 Control part 46 Angle drive control unit 47 Offset drive control units 48a and 48b Start point 4 a, 49b endpoints 51 and 52 with the piezoelectric actuator mirror 53 piezoelectric actuator 54 gear mechanism 55 piezoelectric element 57 opening 58 the resist mask

Claims (5)

  A double-sided drawing apparatus that exposes and draws a pattern on both the front and back surfaces of a material to be exposed, a light source unit that generates an exposure beam, and a scanning unit that scans the exposure beam on the front and back sides of the material to be exposed. A double-sided drawing apparatus comprising: a beam superimposing adjusting unit that adjusts scanning of the exposure beam so that trajectories of the exposure beam that scans on both sides coincide with each other.   The beam superimposing adjustment means includes a position sensor having an imaging unit sandwiching the material to be exposed and arranged to face each other on the front surface side and the back surface side, and exposure on the front surface or the back surface based on detection data of the position sensor. The double-sided drawing apparatus according to claim 1, further comprising: a beam adjuster that adjusts beam scanning.   The beam adjuster is provided at a subsequent stage of the scanning unit, and is provided at least one of a pair of rod-shaped mirrors opposed to each other with the imaging unit of the position sensor interposed therebetween, and displaces the rod-shaped mirror. The double-sided drawing apparatus according to claim 2, further comprising a piezo element.   The beam adjuster includes a pair of optical mirrors that are rotationally driven by a piezo actuator provided in front of the scanning unit, and the optical mirror adjusts the beam direction by the piezo actuator. Item 3. The double-sided drawing apparatus according to Item 2.   Optical modulation means for modulating the exposure beam based on drawing data corresponding to the pattern; and optical branching means for dividing the modulated exposure beam into a front surface side and a back surface side of the material to be exposed. The double-sided drawing apparatus according to any one of claims 1 to 4.

Images