KR20150005522A - Exposure writing device and exposure writing method - Google Patents

Exposure writing device and exposure writing method Download PDF

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Publication number
KR20150005522A
KR20150005522A KR1020147026036A KR20147026036A KR20150005522A KR 20150005522 A KR20150005522 A KR 20150005522A KR 1020147026036 A KR1020147026036 A KR 1020147026036A KR 20147026036 A KR20147026036 A KR 20147026036A KR 20150005522 A KR20150005522 A KR 20150005522A
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South Korea
Prior art keywords
substrate
stage
exposure
exposed
exposure apparatus
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KR1020147026036A
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Korean (ko)
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KR102032807B1 (en
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히로노리 츠루이
아키히로 하시구치
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가부시키가이샤 아도테크 엔지니어링
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention provides an exposure apparatus and an exposure method that can prevent deterioration in the quality of alignment marks for front and back caused by warpage or lifting of an end portion of a substrate to be exposed. That is, the exposure apparatus of the present invention comprises a stage 10 for mounting a substrate to be exposed, an end portion of the substrate 10, which is moved from a first predetermined position to a second position, A drawing section for drawing a predetermined circuit pattern on the first surface by exposing the first surface of the substrate to be exposed in a state where the end portion is fixed, And a forming portion (51) that moves in conjunction with the movement of the stationary portion and forms a predetermined mark on a second surface opposite to the first surface of the substrate to which the end portion is fixed by the fixing portion.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an exposure apparatus and an exposure method,

The present invention relates to an exposure apparatus and an exposure method. The present invention particularly relates to an exposure apparatus and an exposure method for imaging an image on a substrate.

In recent years, as an exposure apparatus for forming a circuit pattern using a flat substrate as a substrate to be exposed, an exposure apparatus has been developed for irradiating the substrate with the drawing light directly without using a transfer mask to draw a circuit pattern. However, in the case of drawing a circuit pattern on a substrate requiring high resolution, the dust adhered to the hole during the hole forming process and the dust adhered to the hole during the process of moving may fall on another substrate or may be heated The perimeter of the hole may be deformed. In this case, a circuit pattern drawn on one side (hereinafter also referred to as "first side") of the substrate and a circuit pattern drawn on the other side (hereinafter also referred to as "second side") opposite to the one side The relative positions of the patterns may be shifted.

As an art to solve this problem, there has been proposed an exposure apparatus for drawing an alignment mark necessary for drawing a circuit pattern on the first surface and the second surface of the substrate. Japanese Unexamined Patent Publication No. 2008-292915 discloses a technique relating to this, in which first and second alignment marks are drawn on the first and second surfaces of the substrate, respectively, and based on the first and second alignment marks Thereby drawing a circuit pattern on the first surface and the second surface of the substrate.

In the specification of U.S. Patent No. 6,701,192 B2, a fixed ultraviolet light source in a positional relationship between a stage and a substrate is used to form a mark for alignment on the second surface simultaneously with the exposure of the first surface of the substrate to be exposed An exposure apparatus is disclosed.

However, in the exposure apparatus disclosed in the specification of U.S. Patent No. 6,701,192 B2, an ultraviolet light source is fixed. For this reason, it does not occur that the substrate to be projected is excited by the movable groove of the ultraviolet light source. However, if the substrate to be mounted on the stage is not firmly fixed to the end, there is a possibility that the substrate is warped or excited from the stage. In this case, there is a possibility that the mark shape on the second surface becomes unstable.

The present invention provides an exposure apparatus and an exposure method that can prevent deterioration in the quality of alignment marks for front and back caused by warpage or lifting of an end portion of a substrate to be exposed.

According to a first aspect of the present invention, there is provided an exposure apparatus comprising: a stage for mounting a substrate to be exposed; an end portion of the substrate, which is moved from a first predetermined position to a second position, A drawing section for drawing a predetermined circuit pattern on the first surface by exposing a first surface of the substrate to be exposed in a state where the end portion is fixed by the fixing section; And a forming unit that moves in conjunction with the movement of the fixing unit and forms a predetermined mark on the second surface opposite to the first surface of the substrate in a state in which the end is fixed by the fixing unit.

According to the exposure apparatus of the first aspect of the present invention, the substrate to be imaged by the stage is moved and moved from the predetermined first position to the second position, And an end of the substrate is clamped and fixed between the stage and the stage.

Here, in the first embodiment of the present invention, a predetermined circuit pattern is drawn on the first surface by exposing the first surface of the substrate to be exposed in a state where the end portion is fixed by the fixing portion. In addition, a predetermined mark is formed on the second surface opposite to the first surface of the substrate to which the end portion is fixed by the fixing portion, by the forming portion moving in conjunction with the movement of the fixing portion.

That is, in the first embodiment of the present invention, the circuit pattern is drawn on the first surface of the substrate to be exposed while the substrate is mounted on the stage and the end portion of the substrate is fixed by the fixing portion, A mark is formed on the second surface of the substrate. In addition, in the first embodiment of the present invention, when drawing a circuit pattern on the second surface, the positions of the front and back surfaces of the substrate to be exposed are adjusted by adjusting the drawing position by marks formed on the second surface.

As described above, according to the exposure apparatus of the first embodiment of the present invention, the alignment mark can be formed on the second surface of the substrate to be exposed while the end portion of the substrate is fixed by the fixing portion. As a result, the first embodiment of the present invention can prevent deterioration in the quality of alignment marks for the front and back surfaces (first and second surfaces) caused by warpage or lifting of the end portion of the substrate to be exposed.

The second embodiment of the present invention may further comprise a position measuring section for measuring the position of the forming section in the first embodiment. Thus, the second embodiment of the present invention can adjust the drawing position of the circuit pattern with respect to the second surface using the measured position of the formed portion.

The third embodiment of the present invention may be constituted by a clamp which forms a through hole in the stage and fixes the substrate to be projected to the substrate loading side through the through hole in the second embodiment. Thus, the third embodiment of the present invention can firmly fix the substrate to be mounted on the stage.

In the fourth embodiment of the present invention, in the third embodiment, the mark may be formed on the second surface of the substrate to be exposed through the through hole. Thus, in the fourth embodiment of the present invention, a mark can be formed on the second surface of the substrate to be exposed without forming a new through-hole in the stage.

According to a fifth aspect of the present invention, in the fourth embodiment, the forming section has a light source that emits an ultraviolet beam, passes an ultraviolet beam emitted from the light source through a through hole, The mark may be formed. Thus, the fifth embodiment of the present invention can form marks on the second surface of the substrate to be subjected to high precision.

In the sixth embodiment of the present invention, in the second to fifth embodiments, the position measuring unit has a reference portion serving as a reference of a position of a forming portion moving in association with the movement of the forming portion, with respect to each of the forming portions, Or may be provided at a position exposed to the outside of the substrate in a state in which the substrate is mounted on the stage. In the sixth embodiment of the present invention, the position of the formed portion can be easily measured by this.

In the seventh embodiment of the present invention, in the sixth embodiment, the reference portion may be exposed to the outside through the through hole. Thus, in the seventh embodiment of the present invention, the position of the formed portion can be measured without forming a new through hole on the stage.

Further, an eighth embodiment of the present invention is characterized in that it comprises storage means for storing the positional relationship between the corresponding forming portion and the reference portion in the sixth or fifth embodiment, measuring means for measuring the position of the reference portion, And deriving means for deriving the position of the forming portion from the position of the reference portion measured by the position detecting portion and the positional relationship stored in the storing means. Thus, the eighth embodiment of the present invention can easily measure the position of the forming portion.

According to a ninth aspect of the present invention, in the eighth aspect of the present invention, the reference portion is a plurality of position identification marks, and the storage means stores the positional relationship between each of the plurality of position identification marks and the formation portion, The position of each of the position identification marks measured by the measurement means and the positional relationship between the position of each position identification mark measured by the measurement means and the positional relationship stored in the storage means The position of the formed portion may be derived. Thus, the ninth embodiment of the present invention can more easily measure the position of the forming portion.

According to a tenth aspect of the present invention, in the ninth embodiment, the stage is reciprocatable in a predetermined direction, and in each of the exposed portions, each of the plurality of position identifying marks intersects the reciprocating direction of the stage Or may be provided so as to be parallel to each other. Thus, in the tenth embodiment of the present invention, a plurality of position identification marks can be measured at the same timing.

In the eleventh aspect of the present invention, in the above-described embodiment, the forming part may be movably provided within a predetermined range with respect to the stage. Thus, in the eleventh embodiment of the present invention, marks can be formed at appropriate positions according to the size of the substrate to be exposed.

According to a twelfth embodiment of the present invention, in the sixth or fifth embodiment, the stage may be provided with another fixing portion for fixing the substrate from the direction of the first surface or the second surface. Thus, the twelfth embodiment of the present invention can further prevent deterioration in the quality of the alignment mark for the front and back caused by the warping or lifting of the end portion of the substrate.

The thirteenth embodiment of the present invention may be configured such that the other fixing portion in the twelfth embodiment is fixed to the stage by sucking the substrate from the direction of the first surface or the second surface. Thus, the thirteenth embodiment of the present invention can further prevent deterioration in the quality of the alignment mark for the front and back caused by the warpage or lift-off of the end portion of the substrate.

A fourteenth embodiment of the present invention is an exposure imaging method, comprising: a stage for mounting a substrate to be exposed; an end portion of a substrate, which is moved from a first predetermined position to a second position and is placed on a stage, A drawing section for drawing a predetermined circuit pattern on the first surface by exposing the first surface of the substrate in a state in which the end portion is fixed by the fixing section; A forming portion for forming a predetermined mark on a second surface opposite to the first surface of the substrate to which the end portion is fixed by the fixing portion and which is moved in conjunction with the movement of the forming portion, An exposure method in an exposure apparatus having a reference part serving as a reference, the method comprising: a storing step of storing a positional relationship between a corresponding forming part and a reference part; And a deriving step of deriving a formation position of the parts from the position between the storage position and in the measurement step for measuring a given position of the parts, the parts of the reference position and a storage step measured at measurement step.

According to the exposure method of the fourteenth embodiment of the present invention, since it functions in the same manner as the exposure apparatus of the first embodiment of the present invention, It is possible to prevent deterioration in the quality of the mark for alignment of the front and back surfaces (the first surface and the second surface).

[Effects of the Invention]

According to the embodiment of the present invention, it is possible to prevent the deterioration of the quality of the alignment mark for the front and back caused by the warpage or lifting of the end portion of the substrate to be subjected to the exposure.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a configuration diagram showing the entire configuration of an exposure imaging system according to an exemplary embodiment of the present invention. Fig.
2 is a block diagram showing the function of the exposure system according to the exemplary embodiment of the present invention.
FIG. 3A is a front view showing an example of the surface when exposure is performed on the surface of the substrate to be exposed in the exposure imaging system according to the exemplary embodiment of the present invention. FIG.
3B is a front view showing an example of the back surface when the back surface of the substrate to be exposed is exposed in accordance with the exemplary embodiment of the present invention.
4 is a perspective view showing a configuration of a first exposure drawing apparatus and a second drawing exposure apparatus according to an exemplary embodiment of the present invention.
5 is an exploded perspective view of the substrate clamp mechanism portion of the first exposure apparatus and the second exposure apparatus according to the exemplary embodiment of the present invention.
6 is an enlarged cross-sectional view for explaining the functions of the photosensors of the first and second exposure apparatus according to the exemplary embodiment of the present invention.
7A is an enlarged cross-sectional view of main parts for explaining a position measuring member of the first exposure apparatus and the second exposure apparatus according to the exemplary embodiment of the present invention.
Fig. 7B is an enlarged top view of the main parts for explaining the position measuring member of the first and second exposure apparatus according to the exemplary embodiment of the present invention; Fig.
8 is a schematic measurement side view showing the configuration of the reversing mechanism in the reversing apparatus of the exposure system according to the exemplary embodiment of the present invention.
9 is a configuration diagram showing an electrical system of the first exposure apparatus and the second exposure apparatus according to the exemplary embodiment of the present invention.
10 is a view showing the relationship between the moving direction of the stage and the moving direction of the photographing section in the exposure system according to the exemplary embodiment of the present invention.
11 is a schematic front view and a detailed view showing a stage on which a substrate to be exposed is mounted in a first exposure apparatus according to an exemplary embodiment of the present invention.
12 is a schematic side view for explaining the flow of fixing the end portion of the substrate to be mounted on the stage by the substrate clamping mechanism in the first exposure apparatus according to the exemplary embodiment of the present invention.
13A is a schematic front view showing a stage on which a substrate to be exposed is mounted in a conventional exposure apparatus.
Fig. 13B is a schematic sectional view taken along the line bb in Fig. 13A. Fig.
14 is a flowchart showing the flow of processing of the exposure preprocessing program according to the exemplary embodiment of the present invention.
15 is a schematic front view provided in the description of the exposure pre-treatment according to the exemplary embodiment of the present invention.
16 is a flowchart showing the flow of processing of the first exposure processing program according to the exemplary embodiment of the present invention.
17 is a schematic front view provided in the description of the first exposure process according to the exemplary embodiment of the present invention.
18 is a flowchart showing the flow of processing of the second exposure processing program according to the exemplary embodiment of the present invention.
Fig. 19 is a schematic front view provided in the description of the second exposure process according to the exemplary embodiment of the present invention. Fig.

Hereinafter, the exposure system according to the present exemplary embodiment will be described in detail with reference to the accompanying drawings. In the present exemplary embodiment, a flat substrate, such as a printed wiring board and a glass substrate for a flat panel display, is used as the exposure substrate C as the exposure imaging system 1 and the first surface (Hereinafter also referred to as " surface ") C1) and a second surface (hereinafter also referred to as " back surface ") C2.

Fig. 1 is a configuration diagram showing the entire configuration of an exposure imaging system 1 according to the present exemplary embodiment. 2 is a block diagram showing the functions of the exposure and drawing system 1 according to the present exemplary embodiment. 1 and 2, the exposure system 1 includes a first exposure apparatus 2, an inversion apparatus 3, a second exposure apparatus 4, a first transport unit 5, 2 conveying section 6, a third conveying section 7, and a fourth conveying section 8. As shown in FIG. The first exposure apparatus 2 measures the position of the ultraviolet light source 51 and then exposes the surface C1 of the substrate C to be exposed Thereby forming an alignment mark M for alignment. The inverting device 3 inverts the front and back of the substrate C to be exposed. The second exposure apparatus 4 adjusts the drawing position by the alignment mark M and exposes the back surface C2 of the substrate C to be exposed. The first carry section 5 conveys the substrate C to the first exposure apparatus 2. The second carrying section 6 conveys the substrate C from the first exposure apparatus 2 to the reversing apparatus 3. [ The third carrying section 7 conveys the substrate C from the reversing device 3 to the second exposure apparatus 4. The fourth transfer section 8 conveys the substrate C from the second exposure apparatus 4.

3A is a front view showing an example of the surface C1 when the surface C1 of the substrate C is exposed and FIG. Fig. 2 is a front view showing an example of the back side (C2) in the case where the back side is made.

As shown in Fig. 3A, on the surface C1 of the substrate C, a first image P1 (an image in the form of an " F " in the present embodiment) for the surface is formed by the first exposure apparatus 2 . 3B, on the back surface C2 of the substrate C, a back side image (in this exemplary embodiment, "F" in the surface C1) is formed by the second exposure apparatus 4, (Hereinafter referred to as an "image coordinate system") in which the image P1 for the surface of the surface C1 is drawn is referred to as an "image coordinate system" in which the image P2 of the rectangular frame surrounding the area of the back surface C2 corresponding to the image of the surface C1 is drawn ., ≪ / RTI > The rear surface C2 of the substrate C is provided with a plurality of (two in this exemplary embodiment, two in the present exemplary embodiment) Is drawn on the mark M for alignment. The alignment mark M is used for aligning the position of the image P1 for the surface and the position of the image P2 for the rear surface which are respectively drawn on the surface C1 and the back surface C2 of the substrate C Mark.

In the exposure drawing system 1 according to the present exemplary embodiment, the first exposure apparatus 2 is provided on the upstream side in the carrying direction of the substrate C to be exposed. When the unexposed substrate C of the unexamined light is transported into the apparatus by the first transport section 5, the first exposure apparatus 2 is operated in the state where the substrate C is loaded on the stage 10 The surface C1 of the substrate C is exposed and an image P1 for the surface is drawn on the surface of the substrate C The mark M for alignment is formed. A method of measuring the position of the ultraviolet light source 51 will be described later.

In the exposure imaging system 1 according to the present exemplary embodiment, the alignment mark M is drawn in a circular shape of about 0.5 mm to 1 mm. The size and shape of the alignment mark M are not limited to this and the size may be any size as long as it does not overlap with the drawing of the image P1 for the surface and the image P2 for the back surface, Good when set.

An inverting device 3 for inverting the front and back surfaces of the substrate C is provided downstream of the first exposure apparatus 2 in the carrying direction of the substrate C to be exposed. When the surface C1 is exposed by the first exposure apparatus 2 and the substrate C on which the alignment mark M is drawn is carried in the inverting apparatus 3, C of the substrate C in order to perform exposure on the back surface C2 of the substrate C.

A second exposure apparatus 4 for exposing the back surface C2 of the substrate C to the exposure is provided on the downstream side of the substrate 3 in the transport direction of the substrate C. [ When the exposed substrate C inverted by the reversing device 3 is brought into the apparatus, the second exposure apparatus 4 exposes the back surface C2 of the substrate C to a backside image P2). At this time, the second exposure apparatus 4 is aligned with the alignment mark M drawn on the substrate C by the first exposure apparatus 2, Exposure is performed.

The exposure imaging system 1 according to the present exemplary embodiment includes the first transfer device 5, the second transfer device 6, the third transfer device 7, and the fourth transfer device 8 . The first transfer device 5 carries the substrate C to the first exposure apparatus 2 and transfers the substrate C to the first exposure apparatus 2. The second transfer device 6 transfers the substrate C discharged from the first exposure apparatus 2 to the inverting device 3 and transfers the substrate to the inverting device 3. [ The third transport apparatus 7 transports the substrate C discharged from the reversing apparatus 3 to the second exposure apparatus 4 and conveys the substrate C to the second exposure apparatus 4. And transports the substrate C to be exposed, which is discharged from the fourth transport apparatus 8 and the second exposure apparatus 4.

Each of the transport devices has a plurality of rotating rollers and a driving motor for rotating the rotating rollers. A plurality of rotating rollers are installed in parallel, and one end of the rotating roller is equipped with a sprocket or a pulley receiving a rotational force transmitted by a belt or a wire. As a means for transmitting the rotational force of the driving motor for rotating the rotating roller, a method of transmitting by a cylindrical magnet other than a belt or a wire may be adopted.

In the present exemplary embodiment, in order to increase the throughput (production amount per hour) of the substrate C to be exposed, the first and second exposure apparatus 2 and 4 use two exposure apparatus, The exposure apparatus 2 exposes the surface C1 of the substrate C and the second exposure apparatus 4 exposes the back surface C2 of the substrate C. [ However, the present invention is not limited to this, and it is also possible to draw the both surfaces of the substrate C with the first exposure apparatus 2 only by reversing the substrate C from the surface C1 to the back surface C2.

Next, the configurations of the first and second exposure apparatus 2 and 4 will be described.

4 is a perspective view showing the configurations of the first and second exposure apparatus 2 and 4 according to the present exemplary embodiment. The configuration of the first exposure apparatus 2 will be described here. The configuration of the second exposure apparatus 4 is not described for the configuration common to the first exposure apparatus 2, Only the difference from the drawing apparatus 2 will be described. In the following description, the direction in which the stage 10 moves is defined as the Y direction, the direction perpendicular to the Y direction is defined as the X direction, the direction orthogonal to the Y direction is defined as the Z direction, The rotation direction about the Z axis is defined as the? Direction.

As shown in Fig. 4, the first exposure apparatus 2 includes a stage 10 in the form of a flat plate for fixing the substrate C to be exposed. On the upper surface of the stage 10, there is provided a suction mechanism (not shown) having a plurality of suction holes for sucking air in a region where the substrate C is to be mounted. The attraction mechanism sucks the air between the target surface C and the stage 10 from the suction hole 10a when the substrate C is fixed on the upper surface of the stage 10, Is vacuum-adsorbed on the upper surface of the stage 10 to hold the substrate 10 on the stage 10 by suction. The stage 10 is movable so that the substrate C fixed to the stage 10 moves the substrate C to the exposure position in accordance with the movement of the stage 10, The light beam is irradiated by the exposure section 16 to draw the surface image P1 on the first surface C1.

The stage 10 is supported by a flat plate-like base 12 movably provided on the surface of the base 11 in the form of a table. A moving mechanism 13 having a moving driving mechanism (not shown) configured by a motor or the like is provided between the base 12 and the stage 10. The stage 10 is rotated by the moving mechanism 13 in the direction of? With the vertical line at the center of the stage 10 as the central axis with respect to the base 12.

On the upper surface of the base 11, one or a plurality (two in the present exemplary embodiment) of the guide rails 14 are provided. The base 12 is supported by the guide rail 14 so as to be capable of reciprocating movement, and is moved by a stage driving section (a stage driving section 71 described later) constituted by a motor or the like. Then, the stage 10 moves along the guide rail 14 by being supported on the upper surface of the movable base 12.

A gate 15 is provided on the upper surface of the substrate 11 so as to extend over the guide rail 14. An exposure section 16 is mounted on the gate 15. The exposure section 16 is composed of a plurality of exposure heads 16a (sixteen in this exemplary embodiment) and fixedly arranged on the movement path of the stage 10. [ The optical fiber 18 drawn out from the light source unit 17 and the signal cable 20 drawn out from the image processing unit 19 are connected to the exposure unit 16, respectively.

Each exposure head 16a has a digital micromirror device (DMD) as a reflection type spatial light modulation device. Each exposure head 16a modulates the light beam from the light source unit 17 by controlling the DMD based on the image data input from the image processing unit 19 and outputs the light beam to the substrate 10 (C). Thus, exposure by the first exposure apparatus 2 is performed. Also, a transmission type spatial light modulation device such as a liquid crystal may be used as the spatial light modulation device.

A gate 22 is further provided on the upper surface of the base 11 so as to extend over the guide rail 14. The gate 22 is provided with one or a plurality of imaging units 23 (two in this exemplary embodiment) for imaging the substrate C mounted on the stage 10. The photographing section 23 is a CCD camera or the like incorporating a strobe having a very short light emitting time. Each of the photographing sections 23 is provided so as to be movable in a direction (X direction) perpendicular to the moving direction (Y direction) of the stage 10 in the horizontal plane and includes a position measuring member 52, And is provided for taking an image of the alignment mark M drawn on the optical substrate (C). The relative position of the photographing section 23 with respect to the stage 10 is measured in accordance with the movement of the stage 10 or the photographing section 23 and stored in the memory means of the system control section 70. [ When the ultraviolet light source 51 of the position measurement member 52 is photographed, it is performed in a state in which the substrate C is not mounted.

The first exposure apparatus 2 derives the position of the ultraviolet light source 51 on the substrate C from the image of the position measurement member 52 taken by the imaging section 23. [ The second exposure apparatus 4 compares the position of the ultraviolet light source 51 in the first exposure apparatus 2 with the position of the image of the alignment mark M photographed by the photographing section 23 And detects the position difference amount (the difference amount in the X, Y, and θ directions). The information of the positional difference amount of the alignment mark M is the position of the image P1 for the surface to be imaged on the surface C1 of the substrate C and the image P2 for the back surface to be imaged on the back surface C2 .

It is ideal that the photographing section 23 is provided in a number corresponding to the number of the position measuring members 52 (or the number of alignment marks M). However, the present invention is not limited to this, and a plurality of mark forming sections 52 or a plurality of alignment marks M may be photographed by providing one photographing section 23 and moving the photographing section 23. [

Further, on the upper surface of the stage 10, a substrate clamp mechanism unit 30 for firmly fixing the substrate C to the stage is provided.

5 is an exploded perspective view of the first exposure apparatus 2 and the substrate clamp mechanism 30 of the second exposure apparatus 4 according to the present exemplary embodiment. 5, the substrate clamp mechanism unit 30 includes a pair of clamp bars 31a and 31b for clamping both ends in one direction of the substrate C from above, A pair of clamp bars 31c and 31d for clamping both end portions in the direction perpendicular to the one direction on the horizontal plane of the clamp bar 31a from the upper side and a pair of clamp bars 31c and 31d for moving the clamp bars 31a to 31d in parallel Units 32a to 32d. The clamping bars 31a to 31d are arranged on the upper surface of the stage 10 and the moving units 32 to 32d are arranged on the lower side of the stage 10. [

The clamping bars 31a and 31b are elongated in the Y-direction and opposed in the X-direction, and the clamping bars 31c and 31d are long in the X-direction and opposed in the Y-direction. The clamping bars 31a and 31b are formed so as to be shorter than the clamping bars 31b and 31d and do not interfere with each other even when the size of the substrate to be exposed C is relatively small.

The clamp bar 31a is fixed to a clamp holder 33 made of metal (for example aluminum) and an inner region (a central region side of the stage 10) of the lower surface of the clamp holder 33, A clamp blade 34 made of a resin that contacts the surface C1 of the clamp holder 33 and two support pillars 35 provided in the outer region of the lower surface of the clamp holder 33 (the outer region of the stage 10). The stage 10 is provided with insertion holes 37 extending in the Y direction or the X direction so as to penetrate in the front and back direction from the end toward the center and to have one or a plurality of insertion holes 37 on each side (in this exemplary embodiment, And two support posts 35 of the clamp bar 31a are inserted into the two insertion holes 37 at the respective sides. The clamp bars 31b to 31d have the same configuration as the clamp bar 31a.

The moving unit 32a has a support plate 40 for supporting two support columns 35 and an air cylinder 41 for slidingly moving the support plate 40 in the Z direction. The tip end of the piston rod (42) of the air cylinder (41) is fixed to the lower surface of the support plate (40). The air cylinder 41 lowers and raises the piston rod 42 by a driving unit constituted by a motor or the like. The range of movement of the piston rod 42 is limited and stops at a predetermined position even when the piston rod 42 is lowered or raised.

When the piston rod 42 descends, the clamp bar 31a is lowered together with the piston rod 42, and the clamp bar 31a is pressed against the stage 10. Here, when the substrate 10 is mounted on the stage 10, the substrate C is clamped by the clamp bar 31a. On the other hand, when the piston rod 42 rises, the clamp bar 31a rises together with the piston rod 42, and the clamp bar 31a moves away from the stage 10 in the Z direction. The distance that the clamp bar 31a is away from the stage 10 is larger than the thickness of the substrate C to be exposed.

The moving unit 32a includes a drive pulley 44 and a driven pulley 45 arranged in the X direction, a timing belt 46 wound around the pulleys 44 and 45, And further has a belt drive motor 47. The belt drive motor 47 is capable of forward rotation and reverse rotation. The air cylinder 41 is mounted on the timing belt 46 through the mounting portion 48. When the timing belt 46 is driven, the air cylinder 41 and the support plate 40 move in the X direction, The bar 31a moves in the X direction. The clamp bar 31a slides while moving the support column 35 along the insertion hole 37 so that the support bar 35 is retreated from the retreated position located at the outer end of the insertion hole 37, Is located between the center position located at the inner end of the insertion hole 37. The position of the clamp bar 31a (any position between the retracted position and the center position) when the clamp bar 31a clamps the peripheral portion of the substrate C is referred to as a clamping position.

The mobile units 32b, 32c, and 32d have the same configuration as the mobile unit 32a. The moving unit 32b moves the clamp bar 31b in the Z direction and the X direction while the moving unit 32c moves the clamp bar 31c in the Z direction and the Y direction, The clamp bar 31d is moved in the Z and Y directions.

6 is an enlarged cross-sectional view for explaining the functions of the photosensors 49 of the first and second exposure apparatus 2 and 4 according to the present exemplary embodiment. 5 and 6, a reflection type photosensor (substrate edge sensor) 49 for detecting the presence or absence of the substrate C is provided on the support plate 40 of the movable unit 32a . The photosensor 49 is mounted on the support plate 40 and is installed at a position corresponding to the insertion hole 37, that is, at a position where the photosensor 49 is exposed from the insertion hole 37 . The photosensor 49 has a light projecting portion for emitting inspection light upward and a light receiving portion for receiving the inspection light reflected on the back surface C2 of the substrate C so that when the light receiving portion receives the inspection light, When the light receiving unit does not receive the inspection light, it outputs a no substrate signal.

A clamp blade 34 of the clamp bar 31a is positioned above the photosensor 49. [ In order to prevent the inspection light from the photosensor 49 from being reflected by the clamp blade 34 and returning to the photosensor 49, a portion corresponding to the insertion hole 37 of the clamp blade 34 is provided with an inclined surface 50 are formed. A photosensor 49 similar to the moving unit 32a is also provided on the support plate 40 of each of the mobile units 32b, 32c and 32d.

Each of the support plates 40 is provided with a position measuring member 52 for forming an alignment mark M on the substrate C mounted on the stage 10. FIG. 7A is an enlarged cross-sectional view of essential parts for explaining the first and second exposure apparatus 2 and the position measuring member 52 of the second exposure apparatus 4 according to the present exemplary embodiment. Fig. 7B is an enlarged top view of the main parts for explaining the position measuring member 52 of the first and second exposure apparatus 2 and 4 according to the present exemplary embodiment. In Fig. 7B, the substrate C is omitted for explaining the structure of the ultraviolet light source 51. Fig.

As shown in Figs. 5, 7A and 7B, each of the position measuring members 52 corresponds to the insertion hole 37 formed at the center among the plurality of insertion holes 37 formed at each side, And is formed in a plate shape extending in the direction along the through hole 37. [ The position measuring member 52 is provided with an ultraviolet light source 51 for generating an ultraviolet beam (light beam of short wavelength) (UV) toward the stage 10 at the center side of the stage 10. The ultraviolet light beam UV generated by the ultraviolet light source 51 is irradiated to the substrate C while passing through the insertion hole 37 to contact the second surface of the substrate C The alignment mark M is drawn on the surface on the side where the alignment mark is located.

The position measurement member 52 is provided with a plurality of (two in this exemplary embodiment) position identification marks 52a on the side of the stage 10 on the stage 10, Are provided on the same plane. These position identification marks 52a are formed on the substrate 10 so that the substrate C is not covered with the substrate C in a state in which the substrate C is mounted on the stage 10 and fixed to the substrate clamping mechanism 30 And is formed at a position visible through the hole 37 from the outside. Therefore, each of the position identification marks 52a can be recognized as a photographed image obtained by the photographing section 23. [

Each of the position measuring members 52 moves in conjunction with the movement of the mobile units 32a to 32d, respectively. The insertion holes 37 corresponding to the respective mark forming portions 52 are formed in the region including the movement path of each position measuring member 52. [ The ultraviolet light source 51 penetrates through the insertion hole 37 in which the support column 35 is not inserted while the exposure is performed on the surface C1 of the substrate C by the exposure unit 16 The ultraviolet beam (UV) can be generated. In addition, the irradiation time of the ultraviolet beam (UV) may be set to an optimal time according to the photosensitive material applied to the substrate (C).

The positions of the ultraviolet light sources 51 and the position identifying marks 52a are set so that they are in a known positional relation with each other in the position measuring member 52. In addition, ) Is stored in the storage means. Thus, even when the ultraviolet light source 51 can not be photographed by the photographing section 23 when the ultraviolet light source 51 is located on the rear side of the substrate C, the position identification marks 52a The position of the ultraviolet light source 51 is measured from the position of each of the position identification marks 52a measured and the positional relationship between the stored ultraviolet light source 51 and the position identification mark 52a .

Although the first exposure apparatus 2 includes a plurality of ultraviolet light sources 51, the second exposure apparatus 4 does not necessarily have a plurality of ultraviolet light sources 51. A plurality of alignment marks M may be drawn by moving a plurality of ultraviolet light sources and moving the ultraviolet light source in the first exposure apparatus 2.

The first exposure apparatus 2 includes an auto carrier hand (hereinafter referred to as an AC hand) for carrying the substrate C, which has been transported by the first transport apparatus 5, into the first exposure apparatus 2, (Not shown). The AC hand 62 is formed in a flat plate shape and is movable in the horizontal direction and the vertical direction in parallel with the horizontal plane. A suction mechanism having a suction portion 63 for sucking and holding the substrate C by vacuum suction by sucking air is provided on the lower surface of the AC hand 62. The sucking mechanism 63 presses the substrate C downward A pressing mechanism having a pressing portion 64 capable of moving up and down is provided.

The AC hand 62 lifts the substrate P by lifting the unexposed substrate C by a suction mechanism to hold the lifted substrate C on the stage 10, In a predetermined position on the upper surface of the wafer W. When the substrate 10 to be exposed is placed on the stage 10, the substrate 10 is pressed against the stage 10 by a pressing mechanism to release the suction by the suction unit 63, The optical substrate C is firmly fixed to the stage 10. [

The AC hand 62 is lifted upward by attracting and holding the exposed substrate C on the upper surface of the stage 10 by means of an adsorption mechanism to attract and hold the lifted substrate C The substrate C is moved to the second transfer device 6 by releasing the suction by the suction mechanism after moving to the second transfer device 6. [

The substrate clamp mechanism portion 30 of the exposure imaging system 1 according to the present exemplary embodiment can reliably correct the warpage and deformation of the substrate C by clamping the periphery of the substrate C And a moving mechanism for moving the ultraviolet light source 51 and the photosensor 59 to the ultraviolet light source 51 and the position identification member 52 and the photosensor 59 together with the clamping bars 31a to 31d, The manufacturing cost of the substrate clamp mechanism unit 30 can be reduced.

8 is a schematic measurement side view showing the configuration of the reversing mechanism in the reversing device 3 of the exposure imaging system 1 according to the present exemplary embodiment. As shown in Fig. 7, the reversing device 3 includes a roller unit 3b having a plurality of rollers 3a for sandwiching the substrate C thereon. The roller unit 3b is supported by a support rod 3c and is rotated by a rotation shaft 3d provided at the center of the roller unit 3b in a state that the roller unit 3b is lifted by the support rod 3c when the substrate C is sandwiched therebetween As shown in Fig. The front and back surfaces of the substrate C are reversed by releasing the substrate C from the roller unit 3b after the roller unit 3b has rotated 180 degrees. The configuration of the inversion mechanism is not limited to the above-described configuration, and a method of lifting one end of the substrate C and rotating the substrate C by 180 degrees to invert the front and back of the substrate C, Other conventional methods may be used.

Fig. 9 is a configuration diagram showing electrical systems of the first and second exposure apparatus 2 and 4 according to the present exemplary embodiment.

As shown in Fig. 9, a system control unit 70 electrically connected to each unit of the apparatus is provided in the first exposure apparatus 2, and the system control unit 70 controls each unit in a general manner. The system control unit 70 controls the AC hand 62 to perform the carrying-in and discharging operations of the substrate 10 to the stage 10. The system control unit 70 controls the stage driving unit 71 to move the stage 10 while taking the image of the alignment mark M by the image pickup unit 23 and controlling the position of the alignment mark M And controls the light source unit 17 and the image processing unit 19 to perform exposure processing on the exposure head 16a. The operation device 73 has a display portion and an input portion and is operated, for example, when inputting the external size of the substrate C to be exposed.

The substrate stacking position determining unit 72 determines the stacking position of the substrate C with respect to the stage 10 (this stacking position is referred to as a proper stacking position). In addition, since the alignment mark M can be positioned at the center of the photographing area by adjusting the imaging timing of the photographing section 23 in the Y direction, the proper placement position in the Y direction can be set to any position on the stage 10 In the present exemplary embodiment, the optimum loading position in the Y direction is set to a position where the center of the substrate 10 and the center of the stage 10 coincide with each other.

The substrate stacking position determining section 72 determines the optimum stacking position of the substrate in the X direction (the alignment mark M (for alignment)) on the basis of the information obtained by the preparation operation performed before the exposure operation on the substrate C is performed )] Is calculated. In this preparatory operation, the substrate 10 to be imaged (in the Y direction, the center of the substrate 10 is aligned with the center of the stage 10) is mounted on the stage 10 ) And the opposing sides of one side of the substrate C are parallel to each other), then the alignment mark M is photographed by the photographing section 23 and photographed in the X direction The amount of difference between the center position of the area and the position of the alignment mark M is calculated and the proper position of the substrate in the X direction is calculated based on this difference amount. In the preparation operation, by performing this process for a plurality of substrates (for example, five substrates), an appropriate stacking position can be obtained more accurately. In this preparatory operation, the photographing timing of the photographing section 23 is also determined. The calculated loading position information and photographing timing information of the substrate are sent to the system control unit 70 and stored in the storage means of the system control unit 70.

When the position of the ultraviolet light source 51 is measured at the time of movement of the stage 10 based on the instruction of the system control unit 70, the movement control unit 74 controls the position identification marks And the movement of the photographing section 23 is controlled so that the photographing section 52a passes through the photographing region of each of the photographing sections 23. [ When the exposure control unit 74 performs exposure imaging on the substrate C based on an instruction from the system control unit 70, a plurality of alignment marks M formed on the substrate C And controls the movement of the photographing section 23 so as to pass through the photographing regions of the plurality of photographing sections 23.

The movement control section 74 controls the drive of the mobile units 32a to 32d based on an instruction from the system control section 70, respectively. The movement control section 74 monitors the signals (substrate presence signal or substrate absence signal) from the photosensors 49 of the mobile units 32a to 32d and outputs the signals to the mobile units 32a to 32d The driving of the cylinder 41 and the belt driving motor 75 is controlled so that the clamping bars 31a to 31d are clamped.

The movement control section 74 controls the movement of the substrate C in the region on the stage 10 based on the substrate size information input from the operation device 73 and the appropriate placement position information of the substrate calculated by the preparatory operation And the moving speed of the clamp bars 31a to 31d is switched between high speed and low speed on the basis of the estimated area. More specifically, a high-speed movement is set on the stage 10 outside the position (see FIG. 6) away from the periphery of the substrate C by a distance L1 (for example, 40 mm) Speed moving is set. This makes it possible to reliably detect the substrate C because the detection of the substrate C is performed during low-speed movement. A position away from the peripheral edge of the substrate C by a distance L1 is referred to as a deceleration position (switching point). The clamping bars 31a to 31d stop at a clamping position that is a predetermined distance (for example, 5 mm) from the position where the substrate C is detected to the inside thereof, and clamping is performed at the clamping position. This clamping position is a position where the support pillars 35 of the clamp bars 31a to 31d do not contact the edge of the substrate C to be exposed.

When the substrate C is detected while the clamp bars 31a to 31d are moving at a high speed, the movement control unit 74 determines that the actual substrate size is larger than the input substrate size, and the movement control unit 74 controls the movement of the clamp bars 31a to 31d Immediately stops moving and outputs an abnormal signal to the system control unit 70. The system control unit 70 receives an abnormal signal and causes the display unit of the operation device 73 to display error information indicating that the substrate size is large. Instead of displaying the error information, a warning sound may be generated.

When the clamp bars 31a to 31d move at a low speed and the substrate C is not detected and the low-speed movement is continued for a predetermined time, the movement control unit 74 determines that the actual substrate size is smaller than the inputted substrate size It judges that the substrate is not loaded and immediately stops the movement of the clamp bars 31a to 31d and outputs an abnormal signal to the system control unit 70. [ The system control unit 70 receives an abnormal signal and displays error information indicating that the substrate size is small or that the substrate C is not loaded on the display unit of the operation device 73. [

10 is a diagram showing the relationship between the moving direction of the stage 10 and the moving direction of the photographing section 23 in the exposure and drawing system 1 according to the present exemplary embodiment. As shown in Fig. 10, the moving direction of the photographing section 23 is a direction (X direction) perpendicular to the moving direction (Y direction) of the stage 10 in the horizontal direction. When the photographing unit 23 photographs the alignment mark M drawn on the plurality of ultraviolet light sources 51 or the substrate C to be exposed, the position of the stage 10 is moved to control the position in the Y direction, The relative position is controlled so that the plurality of position measuring members 52 or the alignment marks M are included in the photographing region of the photographing section 23 by controlling the position in the X direction by moving the position measuring members 52, The moving direction of the photographing section 23 is not limited to the X direction but the alignment mark M drawn on the position measuring member 52 or the substrate C can be photographed. Direction or may be movable in other directions than the X direction and the Y direction.

Here, in the exposure drawing system 1 according to the present exemplary embodiment, the position of the ultraviolet light source 51 allows the positional alignment between the image to be drawn on the first surface C1 and the image to be drawn on the second surface C2 The position of the ultraviolet light source 51 is measured by the position measuring member 52.

11 is a schematic front view and a detailed view showing the stage 10 on which the substrate C is mounted in the first exposure apparatus 2 according to the present exemplary embodiment. 12, which will be described later, is a schematic sectional view taken along the line a-a in Fig.

11, in a state in which the substrate 10 is mounted on the stage 10 and the end of the substrate C is fixed by the clamp holder 33 of the substrate clamping mechanism 30 Since the ultraviolet light source 51 is located behind the substrate C, the position identification marks 52a of the position measuring member 52 can not be visually recognized. However, when the stage 10 is viewed from the front, Since it is disposed at a position not overlapping the substrate C, it can be visually confirmed.

11, one ultraviolet light source 51 and one position measuring member 52 (two position identifying marks 52a) are combined to form an ultraviolet light source 51 And the respective position identifying marks 52a are formed so as to have a known positional relationship. The positional relationship between each of the position identification marks 52a and the ultraviolet light source 51 is previously measured and stored in the storage means of the system control unit 70. [ Thus, even when the position of the ultraviolet light source 51 can not be measured directly, for example, when the ultraviolet light source 51 is located on the rear portion of the substrate C, the position of each position identifying mark 52a The position of the ultraviolet light source 51 can be derived from the respective positions measured by measuring the position identification mark 52a and the stored positional identification mark 52a and the positional relationship between the ultraviolet light source 51. [

Further, in the present exemplary embodiment, two or more position identification marks 52a are formed in order to accurately derive the position of the ultraviolet light source 51 including the rotational component, but the present invention is not limited to this and the position identification marks 52a are marks having a shape capable of specifying the direction in which the ultraviolet light source 51 exists, and if the distance between the position identifying mark 52a and the ultraviolet light source 51 is previously measured and stored, Since the position of the ultraviolet light source 51 can be derived from the identification mark 52a, the number of the position identification marks 52a may be one.

Two pieces of the ultraviolet light source 51 and the position identification mark 52a out of the four sets of the ultraviolet light source 51 and the position identification mark 52a are arranged in a rectangular shape on the substrate (For example, in the Y direction) parallel to one side of the substrate C to be mounted in a stacking region to be loaded, and at the positions not passing through the center of the stacking region. The other two sets of the ultraviolet light sources 51 and the position identifying marks 52a are also parallel to the other opposing side of the substrate C in the stacking region where the rectangular substrate C is loaded For example, in the X direction), and are formed so as to have the same straight line shape at positions not passing through the center of the stacking area. As a result, with respect to the two sets of ultraviolet light sources 51 and the position identifying marks 52a extending in the Y direction, the stage 10 is moved in the Y direction by one photographing section 23 You can shoot. At this time, since each of the ultraviolet light sources 51 and the position identifying marks 52a are formed so as to have the same straight line shape not passing through the center of the stacking area, the ultraviolet light source 51 or the position identifying marks 52a The horizontal direction and the vertical direction of the substrate C can be identified.

The alignment mark M may be formed in the vicinity of the center of each side of the stacking area where each of the ultraviolet light sources 51 is mounted on the substrate C in a rectangular shape. This makes it possible to reduce the error in alignment of the first surface C1 and the second surface C2 of the substrate C during drawing, thereby improving the accuracy of alignment.

In addition, by positioning each of the plurality of position identifying marks 52 in one position measuring member 52 in parallel in the X direction that is directly opposite to the moving direction of the stage 10, The position of each of the position identification marks 52a can be measured at the same timing since the image is photographed at the same timing when the image is photographed by the image pickup device 23 at the same timing.

In this case, if the substrate is warped or deformed, the end portion of the substrate to be inspected may be excited from the stage, and an alignment mark may be formed at the end of the substrate to be exposed It is difficult to precisely form the alignment mark at the predicted position. In the present exemplary embodiment, the end portion of the substrate C mounted on the stage 10 is sandwiched between the stage 10 and the clamp holder 33 of the substrate clamping mechanism 30 The end portion of the substrate C is prevented from being excited by the stage 10. [

12 illustrates the flow of fixing the end portion of the substrate C mounted on the stage 10 by the substrate clamping mechanism 30 in the first exposure apparatus 2 according to the present exemplary embodiment Fig.

12 (1), in the state in which the substrate 10 is mounted on the upper surface of the stage 10, the clamp holder 33 is placed on the stage 10 as shown in Fig. 12 (2) And moves up to stop the end portion of the substrate C and stops. 12 (3), the clamp holder 33 moves in a plane along the upper surface of the stage 10 and moves to a position where the clamp holder 33 overlaps the end portion of the substrate C in the Z direction, The clamp holder 33 is moved downward to stop the state in which the end portion of the substrate C is sandwiched between the clamp holder 33 and the stage 10 as shown in Fig. 12 (4). As a result, the end of the substrate C is fixed between the stage 10 and the clamp holder 33. Thus, by forming the alignment mark M by irradiating the substrate C with the ultraviolet light source UV on the substrate C while sandwiching and fixing the end portion of the substrate C, A mark M for use can be formed.

13A is a schematic front view showing a stage on which a substrate to be exposed is mounted in a conventional exposure apparatus, and Fig. 13B is a schematic sectional view taken along the line b-b in Fig. 13A.

As shown in Fig. 13A, in a state in which the substrate is loaded on the stage, the substrate is not adsorbed and fixed on the stage in the region where the through-hole on the stage is formed. Therefore, as shown in Fig. 13B, there is a possibility that the substrate to be exposed is deformed from the stage and is excited in a region where the insertion hole is formed. In such a case, in the conventional exposure apparatus, exposure drawing is performed in a state in which the substrate to be exposed is deformed, so that the exposure drawing fails and a defective product is generated.

In the first exposure apparatus 2 according to the present exemplary embodiment, the end portion of the substrate C is fixed by the substrate clamp mechanism 30 so that the insertion hole 37 of the substrate C is formed It is possible to eliminate the deformation in the region where it is formed.

Next, the flow of the exposure drawing processing in the exposure drawing system 1 according to the present exemplary embodiment will be described.

14 is a flowchart showing the flow of processing of the exposure preprocessing program according to the present exemplary embodiment. The program is stored in a predetermined area of the ROM, which is a recording medium provided in the system control section 70 of the first exposure apparatus 2, As shown in Fig. 15 is a schematic front view provided in the description of the exposure pre-treatment according to the present exemplary embodiment.

The system control unit 70 of the first exposure apparatus 2 executes the exposure preprocessing program at a predetermined timing (in this exemplary embodiment, the timing at which the substrate C is loaded on the stage 10).

When the substrate C is mounted on the stage 10, the system control unit 70 moves the position of the ultraviolet light source 51 to the substrate C in step S101. In the present exemplary embodiment, it moves in conjunction with the movement of the moving units 32a to 32d of the substrate clamp mechanism unit 30. [ Therefore, the system controller 70 controls the moving unit 32a to start the movement of the clamp bars 31a to 31d in the open state from the end portion of the stage 10 to the central portion thereof, thereby changing the position of the ultraviolet light source 51 And when the substrate presence signal is received from the photosensor 49, the clamp bars 31a to 31d are moved to the open state at the position where they were received or at a position moved by a predetermined distance after they were received. As a result, the clamping bars 31a to 31d are fixed in a state where the substrate 10 is sandwiched with the substrate 10, and the position of the ultraviolet light source 51 is also fixed.

In step S103, the system control unit 70 photographs each of the plurality of position identifying marks 52a by the photographing unit 23, measures the position of the position identifying mark 52a from the captured image, The position of the ultraviolet light source 51 is derived from the position of one position identifying mark 52a. The method of measuring the position of the ultraviolet light source 51 is not limited to the method described above and the positional relationship between the clamp bars 31a to 31d and the ultraviolet light source 51 is known and the position of the clamp bars 31a to 31d The position of the ultraviolet light source 51 may be derived from the relative positions of the clamp bars 31a to 31d and the ultraviolet light source 51. [ In this case, the system control unit 70 measures the position of the clamp bars 31a to 31d by acquiring the pulses of the stepping motor provided in the belt drive motor 75.

In step S105, the system control unit 70 sets a corresponding coordinate system (hereinafter, referred to as a "stage coordinate system") on the stage 10 and ends the exposure preprocessing program. As shown in Fig. 15, at the stage of the pre-exposure processing, the respective ultraviolet light sources 51 are arranged at predetermined positions in the stage coordinate system.

The system control unit 70 of the first exposure apparatus 2 executes the first exposure process at the timing when the exposure pre-processing is completed. 16 is a flowchart showing the flow of processing of the first exposure processing program according to the present exemplary embodiment, and the program is stored in the ROM (read-only memory) of the recording medium provided in the system control section 70 of the first exposure apparatus 2 And is stored in advance in a predetermined area. 17 is a schematic front view provided in the description of the first exposure process according to the present exemplary embodiment.

In step S201, the system controller 70 sets an image coordinate system, which is a coordinate system for drawing the surface image P1, on the substrate C based on the position of the ultraviolet light source 51 measured in step S103 do. As shown in Fig. 15, in the first exposure processing step, an image coordinate system is set according to the position of the ultraviolet light source 51 with respect to the stage coordinate system. The position of the ultraviolet light source 51 may be introduced into an arbitrary image coordinate system.

In step S203, the system control unit 70 moves the stage 10 to the exposure position based on the image coordinate system set in step S201. At this time, the system controller 70 moves the stage 10 along the guide rail 14 in the X direction, and moves the stage 10 to the exposed substrate C by the exposure head 16a Thereby moving the stage 10 to a position coinciding with the start position at the time of drawing the image P1 for the surface.

In step S205, the system control unit 70 starts exposure by each of the exposure heads 16a and performs exposure on the surface C1 of the substrate C at a position based on the image coordinate system set in step S201 The image P1 is drawn. In step S207, the system control unit 20 generates an ultraviolet beam UV from the ultraviolet light source 51 to draw the alignment mark M on the back surface C2 of the substrate C. [ The processing on the surface C1 of the substrate C in step 205 and the processing on the back surface C2 of the substrate C in step S207 can be performed in parallel without interfering with each other Therefore, the processes of step S205 and step S207 may be performed at the same time, or the process of step S207 may be performed before the process of step S205. The surface image P1 is drawn on the surface C1 of the substrate C based on the image coordinate system and the alignment mark M is drawn on the back surface C2 as shown in Fig.

As described above, the process of rendering the alignment mark M by drawing the alignment mark M on the back side C2 during the drawing process of the image P1 for the surface with respect to the surface C1 of the substrate C The holding time of the firing of the alignment mark M can be secured for a long time without affecting the cycle time of the exposure drawing process and the alignment time for the alignment in the drawing process for the back side C2 can be made long, Since the contrast of the photographed image of the mark M can be improved, the recognition difference of the alignment mark M can be suppressed.

Since the alignment mark M is displayed after being irradiated with the ultraviolet beam UV and baked so as to be visually recognizable on the substrate C, the position and shape of the alignment mark M are photographed by the photographing section 23 .

In step S209, the system control unit 70 moves the stage 10 to the position where the substrate C is loaded, and ends the first exposure processing program. When the stage 10 moves to the loading position of the substrate C, the substrate C is attracted and held by the AC hand 62 to move to the second carrying device 6, and the second carrying device 6 And is transported to the second exposure apparatus 4 by the third transport apparatus 7 after the front and back sides are inverted by the inverting apparatus 3. [

The system control unit 70 of the second exposure apparatus 4 executes the exposure preprocessing program at a predetermined timing (in this exemplary embodiment, the timing at which the substrate C is loaded on the stage 10).

18 is a flowchart showing the flow of the processing of the second exposure processing program according to the present exemplary embodiment and the program is stored in the ROM of the system control unit 70 of the second exposure apparatus 4, And is stored in advance in a predetermined area. 19 is a schematic front view provided in the description of the second exposure process according to the present exemplary embodiment.

In step S301, the system control unit 70 determines whether or not the entire alignment mark M drawn in step S207 is included in the image picked up by the image pickup device 23, on the stage 10 on which the substrate C is mounted Position. At this time, the system controller 70 moves the stage 10 along the guide rail 14 in the Y direction and detects the position where the photographing part 23 is provided and the position where the alignment mark M is formed The stage 10 is moved to a position substantially coinciding with the Y direction.

The photographing area by the photographing section 23 is an area in which the alignment mark M is formed on the back surface C2 of the substrate to be subjected to the exposure and includes an area including an installation error of the substrate C . As a result, even if the mounting position of the substrate C is deviated from the previously set mounting position, if the center of the alignment mark M is photographed at the center, As shown in Fig.

In step S303, the system control unit 70 measures the position of the alignment mark M from the picked-up image in which the alignment mark M is picked up by the image pickup unit 23. In step S305, the system controller 70 draws the back side image P2 on the back side C2 of the substrate C based on the position of the alignment mark M measured in step S303 An image coordinate system for determining the position is set. At this time, the image coordinate system is set so as to correspond to the image coordinate system set in step S201, that is, the relative position between the position of the ultraviolet light source 51 measured in step S103 and the drawing position of the image C1 for the surface, Position and the relative position of the drawing position of the back side image C2 to each other. 19, in the second exposure processing step, since the image coordinate system is set based on the position of the alignment mark M, when the relative position between the stage coordinate system and the image coordinate system is different from the first exposure processing step There is also.

In step S307, the system controller 70 moves the stage 10 to the exposure position based on the image coordinate system set in step S305. At this time, the system controller 70 moves the stage 10 in the Y direction along the guide rail 14 and moves the stage 10 to a position on the substrate C to be exposed by the exposure head 16a. The stage 10 is moved to a position coinciding with the start position at the time of drawing the back side image P2.

In step S309, the system control unit 70 starts exposure by each of the exposure heads 16a and draws the back side image P2 on the back side C2 of the substrate C to be exposed. The backside image P2 is drawn on the back side C2 of the substrate C based on the image coordinate system as shown in Fig.

In step S311, the system control unit 70 moves the stage 10 to the position where the substrate C is loaded, and ends the second exposure processing program. When the stage 10 is moved to the loading position of the substrate C, the substrate C on which the image is drawn on both surfaces C1 and C2 is attracted and held by the AC hand 62, And is conveyed by the fourth conveying device 8.

18 is a schematic front view showing the relationship between the size of the substrate to be exposed (C) and the drawing position of the alignment mark (M) in the exposure system (1) according to the present exemplary embodiment. In this exemplary embodiment, when the clamping bars 31a to 31d are moved by the moving units 32a to 32d of the substrate clamp mechanism unit 30, the ultraviolet light source 51 moves in conjunction with the movement thereof. 18, the photosensor 49 detects the end portion of the substrate C so that the clamping bars 31a to 31d fix the end portion of the substrate C to be automatically fixed to the ultraviolet light source 51 are fixed to the end of the substrate C to be irradiated with the ultraviolet beam UV. In addition, the positions of the clamp bars 31a to 31d and the positional relationship of the ultraviolet light source 51 can be freely designed. Therefore, in this exemplary embodiment, the alignment mark M can be drawn at a predetermined position on the substrate C, regardless of the size of the substrate C to be subjected to the alignment.

The method of measuring the position of the ultraviolet light source 51 in step S103 depends on the required measurement precision and the moving units 32a to 32d of the substrate clamp mechanism unit 30 include stepping motors, Or the like. Alternatively, the mobile units 32a to 32d are provided with rotary encoders, and the positions may be measured by the pulses of the rotary encoders. Alternatively, an optical distance sensor or a distance sensor using ultrasonic waves may be provided at any one of the first exposure apparatus 2 and the position may be measured by these distance sensors.

Even if the ultraviolet light source 51 can not be photographed when the position of the ultraviolet light source 51 is measured using the position identification mark 52a, it is sufficient that two or more position identification marks are taken by the photographing section 23 , The timing for measuring the position of the ultraviolet light source 51 is not limited to the timing of step S103, and the position of the ultraviolet light source 51 may be measured at any timing in the pre-processing or the first exposure processing.

When the position of the ultraviolet light source 51 is measured by a difference amount from the theoretical value of the position of the ultraviolet light source 51 in the photographed image, the ultraviolet light source 51 is within the depth of focus of the imaging unit 23 It is preferable that the height of the stage 10 in the Z direction is set so that the ultraviolet light source 51 is positioned within the depth of focus of the imaging section 23 when the ultraviolet light source 51 is not within the depth of focus of the imaging section 23. [ Position) may be changed.

In this exemplary embodiment, two alignment marks M are drawn. However, the present invention is not limited to this, and the number of alignment marks M may be arbitrarily set if there are two or more alignment marks. As the number of the alignment marks M increases, the alignment accuracy on the front and back sides of the substrate C can be improved.

In the present exemplary embodiment, the mark for alignment M is drawn on the substrate C using the ultraviolet light source 51, but the present invention is not limited to this, and it may be drawn by jetting or transferring the ink.

In the present exemplary embodiment, the ultraviolet light source 51 is provided so as to be movable in the X direction or the Y direction. However, the ultraviolet light source 51 is not limited to this, and an ultraviolet light source movable in an arbitrary direction may be used. The path of movement of the ultraviolet light source may be a path traversing the central portion of the substrate C or a path traversing an arbitrary position of the substrate C. [

In the present exemplary embodiment, the ultraviolet light source 51 is moved in conjunction with the moving units 32a to 32d of the clamp mechanism unit 30. However, the ultraviolet light source 51 is not limited to this, May be independently moved. In this case, the ultraviolet light source 51 may be set so as to move to a predetermined position according to the stored size and the loaded position because the size of the substrate C and the loading position in the stage 10 are stored in advance.

If it is determined in step S205 that rendering of the image for the surface P1 is failed, the process in step S207 (rendering process of the alignment mark M) is not performed and the process proceeds to step S209. In this case, since the alignment mark M is not drawn on the substrate C that has failed to draw the image P1 for the surface, the user can set the alignment mark M , It is possible to judge whether the drawing for the surface image P1 succeeds or fails.

When drawing the back side image P2 in step S309, the back side image P2 may be displayed on the display unit of the operation device 73 after the image coordinate system is set in step S305. This allows the user to guess the difference amount between the stage coordinate system and the image coordinate system by confirming the back side image P2 displayed on the display unit.

The moving range of the ultraviolet light source 51 may be set to a range including the position of the end face of the minimum size substrate to be exposed and the position of the end face of the maximum size substrate. Thus, the alignment mark M can be drawn by the ultraviolet light source 51 regardless of the size of the substrate to be exposed.

Although the ultraviolet light source 51 and the position measuring member 52 are fixed to the support plate 40 (that is, the movable unit 32) in the exposure and drawing system 1 according to the present exemplary embodiment, The ultraviolet light source 51 and the position measuring member 52 may be moved relative to the moving unit 32. [ In this case, for example, the ultraviolet light source 51 and the position measuring member 52 may be provided in the mobile unit 32 with a moving mechanism having a motor or the like interposed therebetween. That is, the positional relationship between the ultraviolet light source 51 and the position measuring member 52 is known, and the position of the ultraviolet light source 51 can be derived by measuring the position of the position measuring member 52. The ultraviolet light source 51 and the position identifying member 52 are moved independently of the movable regions of the moving units 32a to 32d of the substrate clamping mechanism 30 to move the substrate The mark M can be formed.

The disclosure of Japanese Patent Application No. 2012-082559 is hereby incorporated by reference in its entirety.

All publications, patent applications, and technical specifications described in this specification are herein incorporated by reference to the same extent as if each individual publication, patent application, and technical specification were specifically and individually indicated to be incorporated by reference .

Claims (14)

A stage for mounting a substrate to be exposed;
A fixing unit that moves from a predetermined first position to a second position and fixes an end portion of the substrate to be mounted on the stage at the second position by holding the end portion of the substrate with the stage;
A drawing section for drawing a predetermined circuit pattern onto the first surface by exposing a first surface of the substrate to be exposed in a state where the end portion is fixed by the fixing section; And
And a forming unit that moves in conjunction with the movement of the fixing unit and forms a predetermined mark on a second surface opposite to the first surface of the substrate to which the end is fixed by the fixing unit The exposure apparatus comprising: The method according to claim 1,
And a position measuring section for measuring a position of the forming section. 3. The method of claim 2,
A through hole is formed in the stage,
Wherein the fixing portion is constituted by a clamp which protrudes toward the substrate loading side through the through hole to fix the substrate to be exposed. The method of claim 3,
Wherein the forming portion forms the mark on the second surface of the substrate to be exposed through the through hole. 5. The method of claim 4,
Wherein the forming unit has a light source for emitting an ultraviolet beam and forms the mark by irradiating the ultraviolet beam emitted from the light source through the through hole to the second surface of the substrate to be subjected to the exposure, . 6. The method according to any one of claims 2 to 5,
Wherein the position measuring unit has a reference portion for each of the forming portions as a reference for the position of the forming portion that moves in association with the movement of the forming portion and the reference portion is formed on the substrate in a state in which the substrate is mounted on the stage, Is exposed to the outside of the exposure apparatus. The method according to claim 6,
And the reference portion is exposed to the outside through the through hole. The method according to claim 6,
Storage means for storing a positional relationship between each of the corresponding forming portions and the reference portion;
Measuring means for measuring the position of the reference portion,
Further comprising deriving means for deriving a position of the forming portion from the position of the reference portion measured by the measuring means and the positional relationship stored in the storing means. 9. The method of claim 8,
Wherein the reference portion is a plurality of position identification marks,
The storage means stores the positional relationship between each of the plurality of position identifying marks and the forming portion,
Wherein said measuring means is in a known relationship with a position at which a circuit pattern is drawn and measures the position of each of said plurality of position identifying marks,
Wherein the deriving means derives the position of the forming portion from the position of each of the position identifying marks measured by the measuring means and the positional relationship stored in the storing means. 10. The method of claim 9,
The stage is reciprocatable in a predetermined direction,
Wherein each of said plurality of position identifying marks in each of said exposed portions is provided so as to be juxtaposed in a direction intersecting with a reciprocating direction of said stage. The method according to claim 1,
Wherein the forming section is provided movably within a predetermined range with respect to the stage. The method according to claim 1,
Wherein the stage is provided with another fixing portion for fixing the substrate to the first surface or the second surface. 13. The method of claim 12,
And the other fixing portion fixes the substrate to the stage by sucking the substrate from the direction of the first surface or the second surface. A fixing unit that moves from a predetermined first position to a second position and fixes an end portion of the substrate to be mounted on the stage while sandwiching the end portion between the stage and the fixing unit; A drawing section for drawing a predetermined circuit pattern on the first surface by exposing a first surface of the substrate in a state in which the end is fixed by the fixing section, A forming unit configured to form a predetermined mark on a second surface of the substrate facing the first surface of the substrate in a state in which the end portion of the substrate is fixed; An exposure method in an exposure apparatus having an exposure unit,
A storage step of storing a positional relationship between each of the corresponding forming parts and the reference part;
A position measuring step of measuring a position of the reference portion,
And a derivation step of deriving a position of the forming portion from the position of the reference portion measured in the measuring step and the positional relationship stored in the storing step.
KR1020147026036A 2012-03-30 2013-02-22 Exposure writing device and exposure writing method KR102032807B1 (en)

Applications Claiming Priority (3)

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JP2012082559A JP5813555B2 (en) 2012-03-30 2012-03-30 Exposure drawing apparatus and exposure drawing method
JPJP-P-2012-082559 2012-03-30
PCT/JP2013/054579 WO2013145986A1 (en) 2012-03-30 2013-02-22 Exposure writing device and exposure writing method

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TW201344380A (en) 2013-11-01
CN104204957B (en) 2016-08-10
JP2013213850A (en) 2013-10-17
KR102032807B1 (en) 2019-10-16
WO2013145986A1 (en) 2013-10-03
JP5813555B2 (en) 2015-11-17
CN104204957A (en) 2014-12-10

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