CN109471337B - Exposure machine for exposure of PCB inner layer plate and alignment exposure method - Google Patents
Exposure machine for exposure of PCB inner layer plate and alignment exposure method Download PDFInfo
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- CN109471337B CN109471337B CN201811636066.4A CN201811636066A CN109471337B CN 109471337 B CN109471337 B CN 109471337B CN 201811636066 A CN201811636066 A CN 201811636066A CN 109471337 B CN109471337 B CN 109471337B
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- 238000000034 method Methods 0.000 title claims description 16
- 239000000758 substrate Substances 0.000 claims abstract description 66
- 238000001259 photo etching Methods 0.000 claims abstract description 40
- 230000007246 mechanism Effects 0.000 claims abstract description 25
- 238000005286 illumination Methods 0.000 claims description 10
- 238000012544 monitoring process Methods 0.000 claims description 2
- 230000003760 hair shine Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7049—Technique, e.g. interferometric
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The invention aims to provide an exposure machine for exposing a PCB inner layer plate, which can ensure that the positions of patterns exposed on the front surface and the back surface of the PCB inner layer plate correspond to each other, and comprises a substrate table surface and an alignment system, wherein a positioning mechanism is arranged below the substrate table surface and comprises a light source, a collimating lens and a diaphragm, the PCB inner layer plate is arranged above the diaphragm, at least three light holes are arranged on the diaphragm, the light holes can be used for determining a circle, light beams respectively irradiate the back surface of the PCB inner layer plate through each light hole to leave a photoetching mark, the photoetching mark is used as an alignment hole on the back surface of the PCB inner layer plate, the diaphragm is arranged at one end of a marking plate positioned on the substrate table surface, the other end of the marking plate is provided with a marking point corresponding to the light holes on the diaphragm, and the change of the position of the diaphragm is monitored in real time to compensate the position relation between the exposure system and the photoetching mark.
Description
Technical Field
The invention relates to the field of digital direct writing type exposure machines, in particular to an exposure machine for exposing a PCB inner layer plate and an alignment exposure method thereof.
Background
At present, when the PCB industry exposes the PCB inner layer plate, holes or marks which can be used for alignment are not commonly formed, the PCB inner layer plate needs to expose the front surface and the back surface of the PCB inner layer plate respectively, meanwhile, the positions of patterns on the front surface and the back surface of the PCB inner layer plate are required to be corresponding, the device of the traditional structure for exposing the inner layer plate burns the marks on the back surface of the PCB inner layer plate by using a laser technology, the device and an exposure system have a fixed position relationship, so that the position relationship between the patterns on the front surface and the marks on the back surface is established, and an alignment system grabs the burned marks to acquire relevant position data when the back surface is exposed, and then the back surface patterns are exposed, so that the patterns on the front surface and the back surface of the PCB inner layer plate can be aligned.
The device of the traditional structure for exposing the inner layer plate still has no reference object when exposing the front surface of the PCB inner layer plate, only blind exposure is carried out by means of equipment parameters, no monitoring is carried out on the front surface, the device is influenced by external unstable factors, the position relation between the mark firing device and an exposure system is changed, and the device is not a fixed numerical value set by the system. This can result in misalignment and random variation of the front pattern with the back laser fired marks. In this case, it is difficult for the apparatus to realize the production of the high-precision inner PCB board.
Disclosure of Invention
The invention aims to provide an exposure machine for exposing the PCB inner layer plate, and aims to solve the technical problems.
The technical scheme is as follows: the utility model provides an exposure machine for exposure of PCB inlayer board, is including installing the mobilizable base plate mesa and setting on the base plate mesa is in alignment system on the base plate mesa, PCB inlayer board front side up back down is arranged in on the base plate mesa, its characterized in that is located base plate mesa below is equipped with positioning mechanism, positioning mechanism includes from down up the light source that sets up in proper order, collimating lens, diaphragm, PCB inlayer board is arranged in the top of diaphragm, follow the facula that the light source produced is through the collimating lens refraction is a plurality of parallel light beam projection to on the diaphragm, be equipped with at least three light trap on the diaphragm, the light trap can confirm a circle, the light beam is respectively through each light trap shining on the back of PCB inlayer board and is corresponding to leave a photoetching mark on the back of PCB inlayer board, the photoetching mark is used for being as the counterpoint hole on the PCB inlayer board back, the diaphragm sets up in the one end of the mark board on the base plate mesa, be equipped with on the other end of mark board with the mark point that the light trap board is equipped with the light trap one end of mark board stretches out of base plate mesa setting.
Further, the substrate table top is installed on the base through a multi-axis motion platform, the multi-axis motion platform can drive the PCB inner layer board to move in a three-dimensional space, a gantry is arranged on the base, and the alignment system and the exposure system are arranged on the gantry.
Further, the alignment system comprises a fixed alignment assembly and a movable alignment assembly which are mounted on the gantry, the fixed alignment assembly comprises a fixed alignment camera and an illumination light source which are fixed on the gantry, a lens of the fixed alignment camera is arranged downwards, the movable alignment assembly comprises a sliding rail which is arranged along the gantry, the sliding rail is provided with a movable alignment camera which can move along the sliding rail, and the lens of the movable alignment camera is arranged downwards.
Further, the positioning mechanisms are at least three, and the positioning mechanisms are arranged along the edge of the length direction of the substrate table top or the edge of the width direction of the substrate table top.
Further, the light holes are arranged in six, six light holes are respectively arranged on the circumference of a circle, and the light holes are arranged at intervals of 60 degrees on the circumference.
Further, the edge of the substrate platform is provided with a positioning scale along the length direction and the width direction of the substrate platform, the PCB inner layer board is positioned on the substrate table surface through the positioning scale, the positioning scale is provided with a protection groove, and one end of the marking board provided with a marking point is arranged in the protection groove.
Further, the multi-axis motion platform comprises a y-axis motion assembly, an X-axis motion assembly and a z-axis motion assembly, the X-axis motion assembly and the y-axis motion assembly are matched to enable the substrate table top to move in a plane parallel to the base, and the z-axis motion assembly can enable the PCB inner layer plate on the substrate table top to move to a focus plane for exposure and alignment.
The method for aligning and exposing the PCB inner layer plate by adopting the exposure machine is characterized by comprising the following steps of: the method comprises the following steps:
step S1: front position adjustment and exposure: the substrate table surface carrying the PCB inner layer plate is moved to the lower part of the alignment system through the multi-axis motion platform, the light source of the positioning mechanism emits light, the photoetching marks are left on the back surface of the PCB inner layer plate through the collimating lens and the diaphragm, the photoetching marks corresponding to each positioning mechanism can determine the position of one opposite point, the alignment system photographs the mark points on the substrate table surface, the coordinates of the actual positions of the mark points are obtained, the error between the coordinates of the actual positions of the mark points and the coordinates of the theoretical positions of the mark points after the movement of the multi-axis motion platform is obtained, the relation between the alignment system and the actual positions of the mark points is obtained, the positional relation between the alignment system and the exposure system is obtained, the positional parameters of the patterns required to be exposed on the front surface of the PCB inner layer plate are adjusted according to the relation between the exposure system and the actual positions of the mark points, the position relation between the front surface patterns of the PCB inner layer plate and the photoetching marks on the back surface is kept unchanged, the substrate table surface continues to move, and the exposure of the front surface of the PCB inner layer plate is carried out through the exposure system.
Step S2: turning over: turning over the PCB inner layer board so that the back surface of the PCB inner layer board faces upwards;
step S3: back exposure; and grabbing the alignment points on the back surface of the PCB inner layer plate through an alignment system, ensuring that the positions of the exposed patterns on the front surface and the back surface of the PCB inner layer plate correspond to each other through the alignment points, and then continuously moving the substrate table top, and exposing the back surface of the PCB inner layer plate through an exposure system.
Further, in step S3, the substrate table surface carrying the PCB inner layer board is moved to the lower side of the alignment system by the multi-axis motion platform, and the illumination light source is turned on to illuminate the PCB inner layer board, so that the alignment point on the back surface of the PCB inner layer board appears under the illumination of the illumination light source; the method comprises the steps that the fixed alignment camera is used for grabbing alignment points on the left upper corner of the PCB inner layer board, the movable alignment camera is used for moving and grabbing other alignment points on the width direction of the substrate table board, the multi-axis motion platform continues to move in the length direction of the substrate table board, the fixed camera is used for grabbing other alignment points on the length direction, the back of the PCB inner layer board is positioned by grabbing at least 3 alignment points which are not on the same straight line, the positions of exposed patterns on the front and back of the PCB inner layer board are corresponding to each other through the alignment points, then the substrate table board continues to move, and the exposure system is used for exposing the back of the PCB inner layer board.
According to the exposure machine for exposing the PCB inner layer plate, the marking plate is arranged on the substrate table surface, the marking point is arranged on one end of the marking plate, which extends out of the substrate table surface, the alignment system photographs the marking point on the substrate table surface, the coordinate of the actual position of the marking point is obtained, the error between the coordinate of the actual position of the marking point and the coordinate of the theoretical position of the marking point after the movement of the multi-axis motion platform is obtained, and therefore the relation between the alignment system and the actual position of the marking point is obtained, the position parameters of patterns to be exposed on the front surface of the PCB inner layer plate are adjusted according to the relation between the exposure system and the actual position of the marking point, when the situation of thermal expansion and contraction or abrasion occurs, the position relation between the photoetching marking and the exposure system is changed, the position relation between the front surface patterns and the photoetching marking fired by laser is caused, the position relation between the photoetching marking and the back surface is changed, the position relation between the photoetching marking and the photoetching marking of the back surface is monitored in real time, and the position of the photoetching position of the back surface is always in real time is always in the relation to the position relation between the position of the photoetching marking and the back surface patterns is obtained, and the position of the photoetching position of the back surface is always in real time is high;
the diaphragm that the marking plate is provided with positioning mechanism in the inboard one end of base plate mesa, positioning mechanism shines through the light source, through collimating lens, diaphragm, shines the back of PCB inlayer plate, leaves the photoetching mark on the back of PCB inlayer plate, its stable positional relationship that has with exposure system to the positive figure of PCB inlayer plate has just established positional relationship with the mark on back, and alignment system snatchs photoetching mark and acquires relevant positional data when PCB inlayer plate back exposure back and exposes back figure again, makes the positive and negative two sides figure of PCB inlayer plate can align.
Drawings
FIG. 1 is a schematic top view of a part of the structure of an exposure machine for exposing an inner layer board of a PCB according to the present invention;
FIG. 2 is an enlarged schematic view of FIG. 1 at A;
FIG. 3 is a schematic view of a marking plate of the present invention mounted on a substrate stage in a semi-cut-away configuration;
fig. 4 is a schematic structural view of the positioning mechanism of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
Referring to fig. 1, fig. 2, fig. 3 and fig. 4, the exposure machine for exposing the inner-layer plate of the PCB is provided with a substrate table top 1 arranged on a base 2 through a multi-axis motion platform, the multi-axis motion platform can drive the inner-layer plate 3 of the PCB to move in a three-dimensional space, a gantry 4 is arranged on the base 2, an alignment system 7 and an exposure system 8 are arranged on the gantry 4, the inner-layer plate 3 of the PCB is arranged on the substrate table top 1 from top to bottom, a positioning mechanism 5 is arranged below the substrate table top 1, the positioning mechanism comprises a light source 51, a collimating lens 52 and a diaphragm 53 which are sequentially arranged from bottom to top, light spots generated by the light source 51 are refracted into a plurality of parallel beams through the collimating lens 52 and projected onto the diaphragm 53, six light holes 54 are respectively arranged on the circumference of a circle, the light holes 54 are respectively arranged at 60 degrees on the circumference, the light beams respectively penetrate through each light holes 54 to irradiate the back surface of the inner-layer plate 3 and correspond to a photoetching mark on the substrate table top 1, the positioning mechanism 5 is arranged below the substrate table top 1, the positioning mechanism comprises a light source 51, a collimating lens 52 and a diaphragm 53 which is sequentially arranged above the diaphragm 3, the diaphragm 53 is arranged on the substrate table top, the diaphragm plate 3 is arranged on the substrate table top, the substrate table top 1 is provided with a positioning plate 6, the positioning plate is provided with a positioning mark 1, the light spot is arranged on the end of the light beam is provided with a corresponding to the positioning mark 9, and the positioning plate is arranged on the side of the substrate table top 7, and the substrate table 3, and the positioning plate is provided with a positioning plate 9, and the positioning plate is provided with a positioning mark 9, and one end of the positioning plate is provided with the positioning plate is positioned on the side and has and one end of the position 3.
The alignment system 7 includes a fixed alignment assembly mounted on the gantry 4, the fixed alignment assembly including a fixed alignment camera 71 fixed on the gantry and an illumination light source, the lens of the fixed alignment camera 71 being disposed downward, and a moving alignment assembly including a slide rail 72 disposed along the gantry 4, a moving alignment camera 73 being disposed on the slide rail 72 to be movable along the slide rail 72, the lens of the moving alignment camera 73 being disposed downward.
The positioning mechanism 5 is arranged along the edge of the length direction of the substrate table top or along the edge of the width direction of the substrate table top, the number of the positioning mechanisms 5 is set according to the size of the PCB inner layer board, in the embodiment, 9 positioning mechanisms 5 are arranged in total, 9 corresponding marking boards 6 are also arranged, and the marking points 7 on the outer side of the marking boards 6 are also correspondingly arranged at 9 positions.
The multi-axis motion platform comprises a y-axis motion assembly, an X-axis motion assembly and a z-axis motion assembly, wherein the X-axis motion assembly is generally parallel to the width direction of the base, the y-axis motion assembly is parallel to the length direction of the base, the z-axis is perpendicular to the plane where the base is located, the X-axis motion assembly and the y-axis motion assembly are matched to enable the substrate table top to move in the plane parallel to the base, and the z-axis motion assembly can enable the PCB inner layer plate on the substrate table top to move to the focus plane for exposure and alignment.
In this embodiment, a light source is used to irradiate a PCB inner layer board to obtain a photo-etching mark, the circle center of a circle determined by the photo-etching mark is used as the circle center of an alignment hole, the alignment hole is formed in the substrate, six light holes are formed in the circumference of one circle, each light hole is arranged at 60 degrees on the circumference, so that the photo-etching mark is also arranged at 60 degrees on the circumference, the photo-etching mark is used as the alignment hole on the back surface of the PCB inner layer board, the PCB inner layer board is arranged above the diaphragm and is close to the diaphragm, and the light beam transmitted by the mark can be fired on the PCB inner layer board with higher quality.
The obtained alignment holes have high precision, so that the position accuracy of the composition printed on the PCB inner layer plate in the photoetching process is high, and the alignment holes can realize high-precision positioning of the composition printed on the back surface of the PCB inner layer plate.
The method for aligning and exposing the PCB inner layer plate by adopting the exposure machine comprises the following steps:
step S1: front position adjustment and exposure: the method comprises the steps that a substrate table surface carrying a PCB inner layer board is moved to the lower part of an alignment system through a multi-axis motion platform, a light source of a positioning mechanism emits light, photoetching marks are left on the back surface of the PCB inner layer board through a collimating lens and a diaphragm, the photoetching marks corresponding to each positioning mechanism can determine the position of a counterpoint, meanwhile, the alignment system photographs mark points on the substrate table surface, the coordinates of the actual positions of the mark points are obtained, the error between the coordinates of the actual positions of the mark points and the coordinates of the theoretical positions of the mark points after the multi-axis motion platform moves is obtained, the relation between the alignment system and the actual positions of the mark points is obtained, the relation between the alignment system and the exposure system is obtained, the relation between the exposure system and the actual positions of the mark points is obtained, and the position parameters of patterns required to be exposed on the front surface of the PCB inner layer board are adjusted according to the relation between the exposure system and the actual positions of the mark points, and the photoetching mark positions on the back surface of the PCB inner layer board are kept unchanged;
the position relation between the photoetching marks and the exposure system can be monitored in real time through the mark points and the position compensation can be carried out, so that the production of the high-precision PCB inner layer board is ensured, because the mark points and the diaphragms are arranged in one part mark process, the position relation is stable, the alignment system obtains the real-time positions of the mark points, namely the real-time positions of the back photoetching marks, so that the position errors of the exposure system and the back photoetching marks caused by a plurality of factors are avoided, the position relation between the front patterns and the back photoetching marks of the exposure system is always stable, and the back photoetching marks are used for positioning the back patterns, so that the high-precision position corresponding relation between the front and the back patterns is ensured;
the light source of the positioning mechanism emits light, a photoetching mark is left on the back surface of the PCB inner layer plate through the collimating lens and the diaphragm, the photoetching mark corresponding to each positioning mechanism can determine the position of an opposite point, the substrate table surface continues to move, and the exposure system is used for exposing the front surface of the PCB inner layer plate;
step S2: turning over: turning over the PCB inner layer board so that the back surface of the PCB inner layer board faces upwards;
step S3: back exposure; moving the substrate table surface carrying the PCB inner layer plate to the lower part of the alignment system through the multi-axis motion platform, and starting the illumination light source to irradiate the PCB inner layer plate, so that the alignment point on the back surface of the PCB inner layer plate is displayed under the irradiation of the illumination light source; the method comprises the steps that the fixed alignment camera is used for grabbing alignment points on the left upper corner of the PCB inner layer board, the movable alignment camera is used for moving and grabbing other alignment points on the width direction of the substrate table board, the multi-axis motion platform continues to move in the length direction of the substrate table board, the fixed camera is used for grabbing other alignment points on the length direction, the back of the PCB inner layer board is positioned by grabbing at least 3 alignment points which are not on the same straight line, the positions of exposed patterns on the front and back of the PCB inner layer board are corresponding to each other through the alignment points, then the substrate table board continues to move, and the exposure system is used for exposing the back of the PCB inner layer board.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (9)
1. An exposure machine for exposing a PCB inner layer plate, comprises a movable substrate table surface arranged on a base and an alignment system arranged on the substrate table surface, wherein the PCB inner layer plate is arranged on the substrate table surface with the right side facing upwards and the back side facing downwards, and the exposure machine is characterized in that: the positioning mechanism comprises a light source, a collimating lens and a diaphragm which are sequentially arranged from bottom to top, the PCB inner layer board is arranged above the diaphragm, light spots generated by the light source are refracted into a plurality of parallel light beams through the collimating lens and projected onto the diaphragm, at least three light holes are formed in the diaphragm, a circle can be determined through the light holes, the light beams irradiate onto the back surface of the PCB inner layer board through each light hole respectively and correspondingly leave a photoetching mark on the back surface of the PCB inner layer board, the photoetching mark is used as an alignment hole on the back surface of the PCB inner layer board, the diaphragm is arranged at one end of a marking board on the substrate table board, a marking point corresponding to the light holes on the diaphragm is arranged at the other end of the marking board, one end of the marking board provided with the marking point extends out of the substrate table board, and the alignment system is used for photographing the marking point to obtain the position of the marking point and is used for monitoring the position change of the diaphragm in real time so as to compensate the position relation of an exposure system and the photoetching mark.
2. An exposure machine for exposing an inner layer board of a PCB according to claim 1, wherein: the substrate table top is arranged on the base through a multi-axis motion platform, the multi-axis motion platform can drive the PCB inner layer board to move in a three-dimensional space, a gantry is arranged on the base, and the alignment system and the exposure system are arranged on the gantry.
3. An exposure machine for exposing an inner layer board of a PCB according to claim 2, wherein: the alignment system comprises a fixed alignment assembly and a movable alignment assembly which are arranged on the gantry, the fixed alignment assembly comprises a fixed alignment camera and an illumination light source which are fixed on the gantry, a lens of the fixed alignment camera is arranged downwards, the movable alignment assembly comprises a sliding rail which is arranged along the gantry, the sliding rail is provided with a movable alignment camera which can move along the sliding rail, and the lens of the movable alignment camera is arranged downwards.
4. An exposure machine for exposing an inner layer board of a PCB according to claim 1, wherein: the positioning mechanisms are arranged at least three, and are arranged along the edge of the length direction of the substrate table top or along the edge of the width direction of the substrate table top.
5. An exposure machine for exposing an inner layer board of a PCB according to claim 1, wherein: the light holes are arranged in six, six light holes are respectively arranged on the circumference of a circle, and the light holes are arranged at 60-degree intervals on the circumference.
6. An exposure machine for exposing an inner layer board of a PCB according to claim 1, wherein: the edge of the substrate table top is respectively provided with a positioning scale along the length direction and the width direction of the substrate table top, the PCB inner layer board is positioned on the substrate table top through the positioning scales, the positioning scales are provided with a protection groove, and one end of the marking board provided with a marking point is arranged in the protection groove.
7. An exposure machine for exposing an inner layer board of a PCB according to claim 1, wherein: the multi-axis motion platform comprises a y-axis motion assembly, an X-axis motion assembly and a z-axis motion assembly, wherein the X-axis motion assembly and the y-axis motion assembly are matched to enable the substrate table top to move in a plane parallel to the base, and the z-axis motion assembly can enable the PCB inner layer plate on the substrate table top to move to a focus plane for exposure and alignment.
8. A method for aligning exposure of a PCB inner layer board using the exposure machine of claim 3, comprising: the method comprises the following steps:
step S1: front position adjustment and exposure: the method comprises the steps that a substrate table surface carrying a PCB inner layer plate is moved to the lower part of an alignment system through a multi-axis motion platform, a light source of a positioning mechanism emits light, photoetching marks are left on the back surface of the PCB inner layer plate through a collimating lens and a diaphragm, the photoetching marks corresponding to each positioning mechanism can determine the position of a counterpoint, meanwhile, the alignment system photographs mark points on the substrate table surface, the coordinates of the actual positions of the mark points are obtained, the error between the coordinates of the actual positions of the mark points and the coordinates of the theoretical positions of the mark points after the movement of the multi-axis motion platform is obtained, the relation between the alignment system and the actual positions of the mark points is obtained, the positional relation between the alignment system and an exposure system is obtained, the positional parameters of patterns required to be exposed on the front surface of the PCB inner layer plate are adjusted according to the relation between the exposure system and the actual positions of the mark points, the position relation between the front surface patterns of the PCB inner layer plate and the photoetching marks on the back surface is kept unchanged, the substrate table surface continues to move, and the exposure of the front surface of the PCB inner layer plate is carried out through the exposure system;
step S2: turning over: turning over the PCB inner layer board so that the back surface of the PCB inner layer board faces upwards;
step S3: back exposure; and grabbing the alignment points on the back surface of the PCB inner layer plate through an alignment system, ensuring that the positions of the exposed patterns on the front surface and the back surface of the PCB inner layer plate correspond to each other through the alignment points, and then continuously moving the substrate table top, and exposing the back surface of the PCB inner layer plate through an exposure system.
9. A method of aligning exposure of a PCB innerlayer board as set forth in claim 8, wherein: in step S3, the substrate table surface carrying the PCB inner layer plate is moved to the lower part of the alignment system through the multi-axis motion platform, and the illumination light source is started to irradiate the PCB inner layer plate, so that the alignment point on the back surface of the PCB inner layer plate is displayed under the irradiation of the illumination light source; the method comprises the steps that the fixed alignment camera is used for grabbing alignment points on the left upper corner of the PCB inner layer board, the movable alignment camera is used for moving and grabbing other alignment points on the width direction of the substrate table board, the multi-axis motion platform continues to move in the length direction of the substrate table board, the fixed camera is used for grabbing other alignment points on the length direction, the back of the PCB inner layer board is positioned by grabbing at least 3 alignment points which are not on the same straight line, the positions of exposed patterns on the front and back of the PCB inner layer board are corresponding to each other through the alignment points, then the substrate table board continues to move, and the exposure system is used for exposing the back of the PCB inner layer board.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811636066.4A CN109471337B (en) | 2018-12-29 | 2018-12-29 | Exposure machine for exposure of PCB inner layer plate and alignment exposure method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811636066.4A CN109471337B (en) | 2018-12-29 | 2018-12-29 | Exposure machine for exposure of PCB inner layer plate and alignment exposure method |
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| CN109471337A CN109471337A (en) | 2019-03-15 |
| CN109471337B true CN109471337B (en) | 2023-12-05 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111031686B (en) * | 2019-12-26 | 2021-10-12 | 沪士电子股份有限公司 | Positioning method for grabbing PCB and positioning hole glue removing device for PCB |
| CN111273525B (en) * | 2020-03-25 | 2021-02-26 | 苏州源卓光电科技有限公司 | Exposure machine applied to inner-layer plate and real-time monitoring method of alignment system |
| CN112631080B (en) * | 2020-12-21 | 2022-05-31 | 苏州源卓光电科技有限公司 | Exposure method of double-workbench exposure machine |
| CN112987517A (en) * | 2021-03-01 | 2021-06-18 | 锡凡半导体无锡有限公司 | Alignment device and alignment method for PCB inner-layer board |
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| EP1223469A1 (en) * | 2001-01-15 | 2002-07-17 | ASML Netherlands B.V. | Lithographic apparatus |
| CN102081312A (en) * | 2009-11-26 | 2011-06-01 | 上海微电子装备有限公司 | Double-sided alignment apparatus and alignment method thereof |
| CN104204957A (en) * | 2012-03-30 | 2014-12-10 | 株式会社阿迪泰克工程 | Exposure writing device and exposure writing method |
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| CN209525558U (en) * | 2018-12-29 | 2019-10-22 | 苏州源卓光电科技有限公司 | A kind of exposure machine for the exposure of PCB inner plating |
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