CN111031686B - Positioning method for grabbing PCB and positioning hole glue removing device for PCB - Google Patents
Positioning method for grabbing PCB and positioning hole glue removing device for PCB Download PDFInfo
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- CN111031686B CN111031686B CN201911362736.2A CN201911362736A CN111031686B CN 111031686 B CN111031686 B CN 111031686B CN 201911362736 A CN201911362736 A CN 201911362736A CN 111031686 B CN111031686 B CN 111031686B
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- pcb
- mechanical arm
- milling machine
- positioning hole
- hole
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/166—Alignment or registration; Control of registration
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Manipulator (AREA)
Abstract
The invention discloses a positioning method for grabbing a PCB and a positioning hole glue removing device of the PCB in the technical field of glue removing of the PCB, aiming at solving the technical problems of large positioning error, low board cutting utilization rate and high processing cost in the glue removing process in the prior art, and a light source irradiates the back of the PCB; respectively collecting light transmitted through different positioning holes on the PCB on the front surface of the PCB, and acquiring the central position of each positioning hole; calculating the central position of the PCB according to the central position of each positioning hole, and transmitting the central position of the PCB to the first mechanical arm; the first mechanical arm aligns the center of the first sucker with the center of the PCB and grabs the PCB. And placing the PCB on the horizontal table board through a mechanical arm, and finally, carrying out accurate hole milling and glue removal on the positioning hole of the PCB by the hole milling device. The method can automatically and effectively identify the position of the positioning hole, accurately remove residual resin on the positioning hole, can be used for various sizes of operation, and can effectively improve the board cutting utilization rate and the multilayer printed circuit board processing efficiency.
Description
Technical Field
The invention belongs to the technical field of PCB glue removal, and particularly relates to a positioning method for grabbing a PCB and a positioning hole glue removal device for the PCB.
Background
In the existing lamination technology (the number of layers is 14-58) of the high-order plate, a PIN nail is generally adopted for pressing and positioning, and after pressing, resin flows out along a gap between a positioning hole and the PIN nail to generate glue residue to be attached to the positioning hole; at present, the cleaning mode aiming at the residual glue on the positioning hole is that a person uses a traditional hole milling machine to mill the hole.
When the traditional hole milling machine actually mills holes, a person manually holds a plate, places the plate on the table board of the hole milling machine, aligns the lower part of a milling cutter in a mode of visual displacement, and controls the hole milling depth of a lower cutter by the time of foot stepping. The position and the depth of the milled hole fluctuate less greatly. Therefore, the periphery of the positioning hole can not be used as an effective processing area within a certain range, so that the utilization rate of the cutting plate is lower, and the processing cost is high. And the surface has the perk copper to remain behind the milling opening easily, piles up between the back plate and is scratched easily.
Disclosure of Invention
The invention aims to provide a positioning method for grabbing a PCB and a positioning hole glue removing device for the PCB, and aims to solve the technical problems of large positioning error, low board cutting utilization rate and high processing cost in the glue removing process in the prior art.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows: a positioning method for grabbing a PCB comprises the following steps: the light source irradiates the back of the PCB; respectively collecting light transmitted through different positioning holes on the PCB on the front surface of the PCB, and acquiring the central position of each positioning hole; calculating the central position of the PCB according to the central position of each positioning hole, and transmitting the central position of the PCB to the first mechanical arm; the first mechanical arm aligns the center of the first sucker with the center of the PCB and grabs the PCB.
And respectively collecting light transmitted through different positioning holes on the PCB by adopting a CCD (charge coupled device) imaging device on the front surface of the PCB, and acquiring the central position of each positioning hole.
The utility model provides a locating hole adhesive deposite device of PCB board, includes: the PCB comprises a light source, a CCD imaging device, a first mechanical arm, a second mechanical arm, a first hole milling machine and a second hole milling machine, wherein the light source irradiates the back of the PCB; the CCD imaging device collects light transmitted through different positioning holes in the PCB on the front side of the PCB, acquires the central position and the angle of the PCB and transmits the central position and the angle to the first mechanical arm; the first mechanical arm grabs the front face of the PCB and transfers the PCB to a first table top of the first hole milling machine; after the first hole milling machine cleans the glue residues on the front side of the PCB, the first mechanical arm grabs the front side of the PCB and enables the back side of the PCB to face the second mechanical arm; the second mechanical arm grabs the back of the PCB and transfers the PCB to a second table top of the second hole milling machine; and after the second hole milling machine cleans the glue residues on the back surface of the PCB, the second mechanical arm grabs the back surface of the PCB and moves the PCB out of the second hole milling machine.
The light source is installed on the conveying device, the conveying device comprises a roller, a first stop block and a second stop block, the roller stops rotating after the PCB is driven by the roller to move to the position above the light source along the conveying device, the PCB stops moving after touching the first stop block, and the second stop block adjusts the PCB to a set position.
The conveying device further comprises an infrared sensing device, and the infrared sensing device controls the roller to stop rotating after detecting the PCB.
The first mechanical arm is a six-axis mechanical arm, a first sucker is arranged on the first mechanical arm, and the CCD imaging device is installed on the first sucker.
The second mechanical arm is a six-shaft mechanical arm, and a second sucker is arranged on the second mechanical arm.
The first hole milling machine moves along the X-axis direction under the driving of a first X-axis servo motor and moves along the Y-axis direction under the driving of a first Y-axis servo motor.
The second hole milling machine moves along the X-axis direction under the driving of a second X-axis servo motor and moves along the Y-axis direction under the driving of a second Y-axis servo motor.
And a plurality of conical thimbles are arranged on the first table top and the second table top.
Compared with the prior art, the invention has the following beneficial effects:
(1) according to the invention, the CCD imaging device is adopted for identification and positioning, and the mechanical arm is adopted for grabbing and transferring the PCB, so that the positioning precision of grabbing and transferring the PCB is improved, the utilization rate of the PCB is also improved, and the production cost is reduced;
(2) according to the PCB clamping and transferring device, the mechanical arm is used for clamping and transferring the PCB instead of manual operation, so that the labor force is saved, the processing quality and the production efficiency are improved, and the production cost is reduced.
Drawings
FIG. 1 is a schematic plan view of a PCB board positioned by stitching with a PIN nail;
fig. 2 is a schematic plan view of a conveying device of a positioning hole glue removing device for a PCB board according to an embodiment of the present invention;
FIG. 3 is a schematic view of a planar structure of a positioning hole glue removing device of a PCB identified and positioned by a CCD imaging device according to an embodiment of the present invention;
fig. 4 is a schematic plane structure diagram of a hole milling machine of a positioning hole glue removing device of a PCB board according to an embodiment of the present invention;
FIG. 5 is a schematic view of a planar structure of a positioning hole glue removing device for a PCB board according to an embodiment of the present invention;
FIG. 6 is a schematic view of a general process for removing the glue residue from the positioning hole of the PCB in the prior art;
FIG. 7 is a schematic view of a process of removing glue residue from a positioning hole by using the positioning hole glue removing device of the PCB of the present invention;
in the figure: 1, a PCB board; 11. a first positioning hole; 12. a second positioning hole; 21. a roller; 22. a second stopper; 23. a first stopper; 24. an infrared sensing device; 25. a light source; 31. a first robot arm; 311. a first suction cup; 32. a second mechanical arm; 321. a second suction cup; 4, CCD imaging device; 51. a first hole milling machine; 511. a first X-axis servomotor; 512. a first Y-axis servo motor; 513. a first table top; 514. a first conical thimble; 52. a second hole milling machine; 521. a second X-axis servomotor; 522. a second Y-axis servo motor; 523. a second table top; 524. a second conical thimble; 6. an inclined back trolley.
Detailed Description
The invention is further described below with reference to the accompanying drawings. The following examples are only for illustrating the technical solutions of the present invention more clearly, and the protection scope of the present invention is not limited thereby.
The first embodiment is as follows:
as shown in fig. 1 to 3, in a positioning method for grabbing a PCB, after a PCB 1 moves to a position above a light source 25 along a conveyor under the driving of a roller 21 of the conveyor, the PCB is detected by an infrared sensing device 24 arranged on the conveyor, the infrared sensing device 24 controls the roller 21 to stop rotating, the PCB 1 stops moving after touching a first stop 23, and a second stop 22 adjusts the PCB 1 to center the PCB near the edge. The light source 25 is arranged on the conveying device by adopting an incandescent lamp, the light source 25 irradiates the back surface of the PCB 1, and the light penetrates upwards through the positioning hole in the PCB 1. The first mechanical arm 31 is provided with a first sucker 311, the first sucker 311 is provided with a CCD imaging device 4, the first mechanical arm 31 moves the CCD imaging device 4 on the first sucker 311 to the position above the first positioning hole 11 of the PCB 1, and the CCD imaging device 4 detects light rays penetrating from the first positioning hole 11 and captures the central position of the first positioning hole 11; the first mechanical arm 31 moves the CCD imaging device 4 on the first suction disc 311 to the position above the second positioning hole 12 of the PCB board 1, and the CCD imaging device 4 detects the light passing through the second positioning hole 12 and captures the central position of the second positioning hole 12; the CCD imaging device 4 calculates the center position and angle of the PCB 1 according to the center positions of the first positioning hole 11 and the second positioning hole 12 and transmits the calculated center position and angle to the first robot arm 31, the first robot arm 31 drives the first suction cup 311 to move correspondingly, and the first suction cup 311 descends to grab the PCB 1 after aligning the center of the first suction cup 311 with the center of the PCB 1. The invention adopts the CCD imaging device to carry out identification and positioning, adopts the mechanical arm to grab and transfer the PCB, and improves the positioning precision of grabbing and transferring the PCB.
Example two:
as shown in fig. 4 and 5, based on the positioning method for grabbing the PCB according to the first embodiment, the present invention provides a positioning hole glue removing device for the PCB, including: the PCB edge positioning device comprises a light source 25, a CCD imaging device 4, a first mechanical arm 31, a second mechanical arm 32, a first hole milling machine 51 and a second hole milling machine 52, wherein the light source 25 is arranged on a conveying device, a PCB 1 is driven by a roller 21 of the conveying device to move to the position above the light source 25, a first stop block 23 and a second stop block 22 are matched to enable the PCB to be positioned in the middle close to the edge, a first suction cup 311 is arranged on the first mechanical arm 31, and the CCD imaging device 4 is arranged on the first suction cup 311. The method and the working process of the first robot arm 31 driving the first suction cup 311 to pick up the PCB 1 from the conveying device are the same as those of the first embodiment. The first mechanical arm 31 grabs the front side of the PCB 1 through the first suction cup 311, the PCB 1 is transferred onto the first table 513 of the first hole milling machine 51, the center of the PCB 1 is aligned with the center of the first table 513, the first conical ejector pin 514 below the first table 513 is ejected out, the diameter of the first conical ejector pin 514 is smaller than the aperture of the first positioning hole 11 and the aperture of the second positioning hole 12 of the PCB, when the first conical ejector pin 514 is ejected, the PCB 1 slides into the bottom end of the first conical ejector pin 514 through self weight to realize positioning, the central position of the PCB 1 is corrected, the position after correction is more accurate, and subsequent positioning is facilitated. The first hole milling machine 51 moves along the X-axis direction under the driving of the first X-axis servo motor 511, moves along the Y-axis direction under the driving of the first Y-axis servo motor 512, the first hole milling machine 51 moves to the position above the positioning hole to be cleaned of the glue residue under the driving of the first X-axis servo motor 511 and the first Y-axis servo motor 512, the milling cutter of the first hole milling machine 51 mills the hole downwards, and the glue residue in each positioning hole on the front surface of the PCB is sequentially cleaned.
After the removal of the scum in the front positioning holes of the PCB 1 is completed, the first mechanical arm 31 grabs the front side of the PCB 1 and directs the back side of the PCB 1 to the second mechanical arm 32, the second mechanical arm 32 is provided with a second suction cup 321, the second mechanical arm 32 grabs the back side of the PCB 1 with the second suction cup 321 and places the back side on the second table 523 of the second hole milling machine 52, and aligns the center of the PCB 1 with the center of the second table 523, the second conical thimble 524 below the second table 523 is ejected to correct the center position of the PCB 1, the second hole milling machine 52 moves along the X-axis direction under the driving of the second X-axis servo motor 521 and moves along the Y-axis direction under the driving of the second Y-axis servo motor 522, the second hole milling machine 52 moves to the position above the positioning holes to be removed under the driving of the second X-axis servo motor 521 and the second Y-axis servo motor 522, the milling cutter 52 mills the holes downwards, and removing the glue residues in each positioning hole on the back surface of the PCB in sequence.
After the glue residue in the back positioning hole of the PCB 1 is removed, the second mechanical arm 32 grabs the PCB 1 on the second table 523 by the second suction cup 321, and transfers the PCB to the oblique-back trolley 6. And finishing the glue removal work of the positioning holes. In the embodiment of the invention, the model of the CCD imaging device is BASLER sca1800-20 gm; the first mechanical arm 31 and the second mechanical arm 32 both adopt six-axis mechanical arms; a plurality of small vacuum suckers are arranged on the first sucker 311 and the second sucker 321 and connected with a vacuumizing device, so that the purpose of grabbing the PCB 1 is achieved. The invention can be used for the glue removal work of the positioning holes of the PCBs with different specifications.
FIG. 6 is a schematic view showing a general process for removing the glue residue from the positioning hole of the PCB in the prior art; fig. 7 is a schematic diagram showing a process of removing glue residue from a positioning hole by using the positioning hole glue removing device of the PCB of the present invention, wherein the positioning hole of the PCB is identified by using the CCD image processing device, and then aligned to the position of the board by the displacement of the robot arm. Then on moving it to the milling hole mesa, whole process utilizes the arm to replace manual operation, has saved the labour, has realized automatic milling hole, has improved processingquality and production efficiency, has promoted the milling hole precision simultaneously to promote the effective processing area of PCB board, promoted the board rate of cutting out of PCB board, reduced the cost of manufacture of PCB board.
The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, several modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.
Claims (8)
1. The utility model provides a locating hole adhesive deposite device of PCB board, characterized by includes: a light source, a CCD imaging device, a first mechanical arm, a second mechanical arm, a first hole milling machine and a second hole milling machine,
the light source irradiates the back surface of the PCB;
the CCD imaging device collects light transmitted through different positioning holes in the PCB on the front side of the PCB, acquires the central position and the angle of the PCB and transmits the central position and the angle to the first mechanical arm;
the first mechanical arm grabs the front face of the PCB and transfers the PCB to a first table top of the first hole milling machine;
after the first hole milling machine cleans the glue residues on the front side of the PCB, the first mechanical arm grabs the front side of the PCB and enables the back side of the PCB to face the second mechanical arm; the second mechanical arm grabs the back of the PCB and transfers the PCB to a second table top of the second hole milling machine;
and after the second hole milling machine cleans the glue residues on the back surface of the PCB, the second mechanical arm grabs the back surface of the PCB and moves the PCB out of the second hole milling machine.
2. The device for removing glue from the positioning holes of the PCB as claimed in claim 1, wherein the light source is mounted on a conveying device, the conveying device comprises a roller, a first stop and a second stop, the roller stops rotating after the PCB moves along the conveying device to a position above the light source under the driving of the roller, the PCB stops moving after contacting the first stop, and the second stop adjusts the PCB to a set position.
3. The apparatus as claimed in claim 2, wherein the conveyor further comprises an infrared sensor, and the infrared sensor detects the PCB and controls the roller to stop rotating.
4. The apparatus for removing glue from positioning holes of PCB board as claimed in claim 1, wherein said first robot arm is a six-axis robot arm, said first robot arm is provided with a first suction cup, said CCD imaging device is mounted on said first suction cup.
5. The apparatus for removing glue from positioning holes of PCB board as claimed in claim 1, wherein said second robot arm is a six-axis robot arm, and said second robot arm is provided with a second suction cup.
6. The apparatus for removing glue from positioning holes of PCB as claimed in claim 1, wherein said first hole milling machine is driven by a first X-axis servomotor to move along the X-axis direction and driven by a first Y-axis servomotor to move along the Y-axis direction.
7. The apparatus as claimed in claim 1, wherein the second hole milling machine is driven by a second X-axis servomotor to move along the X-axis direction, and driven by a second Y-axis servomotor to move along the Y-axis direction.
8. The apparatus as claimed in claim 1, wherein a plurality of conical pins are provided on each of the first and second table-boards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911362736.2A CN111031686B (en) | 2019-12-26 | 2019-12-26 | Positioning method for grabbing PCB and positioning hole glue removing device for PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911362736.2A CN111031686B (en) | 2019-12-26 | 2019-12-26 | Positioning method for grabbing PCB and positioning hole glue removing device for PCB |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111031686A CN111031686A (en) | 2020-04-17 |
| CN111031686B true CN111031686B (en) | 2021-10-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201911362736.2A Active CN111031686B (en) | 2019-12-26 | 2019-12-26 | Positioning method for grabbing PCB and positioning hole glue removing device for PCB |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115816095B (en) * | 2023-02-09 | 2023-04-18 | 四川英创力电子科技股份有限公司 | Device and method for assembling bonding pad and end head of efficiently and fixedly connected printed board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002134847A (en) * | 2000-10-20 | 2002-05-10 | Mitsubishi Electric Corp | Frame for semiconductor device modules and group thereof |
| CN105307395A (en) * | 2014-07-14 | 2016-02-03 | 深港产学研基地 | PCB information acquisition device |
| CN109471337A (en) * | 2018-12-29 | 2019-03-15 | 苏州源卓光电科技有限公司 | A kind of exposure machine and alignment exposure method for the exposure of PCB inner plating |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4817009B2 (en) * | 2005-12-16 | 2011-11-16 | 日立化成工業株式会社 | Method for manufacturing printed wiring board |
| CN105700165B (en) * | 2016-04-29 | 2018-01-05 | 宁波维真显示科技股份有限公司 | 3D gratings align laminating apparatus and method |
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2019
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002134847A (en) * | 2000-10-20 | 2002-05-10 | Mitsubishi Electric Corp | Frame for semiconductor device modules and group thereof |
| CN105307395A (en) * | 2014-07-14 | 2016-02-03 | 深港产学研基地 | PCB information acquisition device |
| CN109471337A (en) * | 2018-12-29 | 2019-03-15 | 苏州源卓光电科技有限公司 | A kind of exposure machine and alignment exposure method for the exposure of PCB inner plating |
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| CN111031686A (en) | 2020-04-17 |
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