CN105388707A - Drawing apparatus - Google Patents
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- CN105388707A CN105388707A CN201510354272.6A CN201510354272A CN105388707A CN 105388707 A CN105388707 A CN 105388707A CN 201510354272 A CN201510354272 A CN 201510354272A CN 105388707 A CN105388707 A CN 105388707A
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Abstract
The invention provides a drawing apparatus. The drawing apparatus comprises a drawing table and an exposure drawing part, wherein a substrate is arranged on the drawing table, the exposure drawing part moves relative to the above drawing table, a pattern is drawn on the substrate of the drawing table, in the drawing apparatus, the position error of the alignment mark formed on the substrate is small, and the plane precision of the substrate does not be damaged. The drawing apparatus comprises a plurality of alignment marks arranged on the drawing table and a plurality of position-determined mark forming units relative to the above alignment marks, the plurality of alignment marks are used for setting the position reference relative to the above exposure drawing part, the plurality of mark forming units generate the alignment mark on the reverse side of the substrate on the drawing table.
Description
Technical field
The present invention relates to the drawing apparatus of depicting pattern on the tow sides of the planar substrates such as electronic circuit board, LCD glass substrate, PDP glass substrate.
Background technology
In recent years, commercially rise direct exposure device (drawing apparatus), in this direct exposure device (drawing apparatus), do not use transfer mask, but carry out depicting pattern to the description light that the tow sides direct irradiation of substrate determines position relationship mutually.When this double-sided exposure, when carrying out pattern exposure to front (the 1st face) (or before exposure), at the upper exposure of reverse side (the 2nd face) (formation) multiple alignment mark, during the pattern exposure to the 2nd carried out in the positive and negative upset by substrate, to be formed in alignment mark on the 2nd for benchmark is to determine pattern exposure position (patent documentation 1,2).Specifically, alignment mark have employed the index such as circular pattern, cross less than φ 2mm, generally, alignment mark, in the bight of the substrate that will expose, is set to the picture (develop the color picture certainly) from colour rendering that make use of photoresist to be optically.
Patent documentation 1: Japanese Unexamined Patent Publication 2009-294337 publication
Patent documentation 2: Japanese Unexamined Patent Publication 2013-213852 publication
But, the drawing apparatus of patent documentation 1 and 2 possesses and movably marks forming unit (alignment mark forming unit, mark exposure device) relative to the drawing desk of mounting substrate, makes mark forming unit mobile relative to drawing desk (mounting substrate thereon) and define alignment mark on substrate back side.Therefore, the site error of alignment mark may be comprised due to the unavoidable machine error of the travel mechanism of mark forming unit.If the forming position of alignment mark exists error, then the depicting pattern of the 2nd can not correctly be mated with the depicting pattern of the 1st.In addition, wait convergent-divergent timing at the flexible of the description face of enforcement, cause implementing different correction of stretching from the substrate of reality.
In addition, existing apparatus must arrange the mark forming unit can carrying out position adjustments relative to drawing desk, therefore cannot the maximization of avoiding device entirety.In addition, in patent documentation 2, in order to make mark forming unit move, be provided with the backoff portion (groove portion) of mark forming unit in drawing desk front.Therefore, cannot supporting substrates reverse side at this backoff portion place, likely harmful effect is caused to the description precision (plane precision of substrate) of pattern.
Summary of the invention
Therefore, the little and drawing apparatus that the plane precision of substrate can not be made impaired of the site error that the object of the invention is to obtain a kind of alignment mark be formed on substrate.
The present invention is conceived to following situation and completes: determine in existing drawing apparatus, mark forming unit can carry out moving relative to the drawing desk of mounting substrate the reason of the error being generation alignment mark forming position, as long as be arranged on the forming unit substrate back side that is placed on this drawing desk directly being formed alignment mark in drawing desk, the generation of error just can be prevented.
That is, drawing apparatus of the present invention has: drawing desk, and it loads substrate; And exposure plotting portion, itself and above-mentioned drawing desk relatively move, by on the substrate of pattern plotter on this drawing desk, the feature of above-mentioned drawing apparatus is, on above-mentioned drawing desk, be provided with multiple reference mark and by the multiple mark forming units of position determined relative to above-mentioned each reference mark, above-mentioned multiple reference mark is for setting the position reference relative to above-mentioned exposure plotting portion, and alignment mark is formed on the reverse side of the substrate be placed on this drawing desk by above-mentioned multiple mark forming unit.
Above-mentioned drawing desk is such as made up of platform main body and the cover plate be positioned in this main body, and above-mentioned mark forming unit can be made up of following part: run through at least one through hole be arranged on above-mentioned cover plate; And forming light source by the mark of above-mentioned body abutment, above-mentioned mark forms light source and forms light from above-mentioned through hole injection mark.
Can run through the above-mentioned through hole arranging multiple formation above-mentioned mark forming unit on above-mentioned cover plate, above-mentioned main body can possess mark and form light source, and above-mentioned mark forms light source and forms light to being marked by the through hole injection selected in above-mentioned multiple through hole.
Specifically, said reference mark and mark forming unit can be positioned at the relative both sides of the circumference of the substrate be positioned on above-mentioned drawing desk, and are equipped with a pair separately.
Above-mentioned exposure plotting portion can possess the image unit taken said reference mark and alignment mark.And, the reference mark position information captured by above-mentioned image unit can be utilized and the coordinate system set, perform the pattern plotter to aforesaid substrate front, the alignment mark positional information captured by above-mentioned image unit can be utilized and the coordinate system set, the pattern plotter to substrate back side carried out after performing the positive and negative upset by aforesaid substrate.
In one embodiment, said reference mark is the spot mark from visible light source.
In the present invention, the drawing desk of mounting substrate possesses the mark forming unit be formed in by alignment mark on substrate back side, and therefore, alignment mark forming position can not produce the error component (displacement error etc. of mark forming unit) of machinery.According to the present invention, the position alignment of the pattern described at substrate pros and cons can be carried out accurately with simple structure.In addition, the level and smooth of drawing desk front can be guaranteed, until periphery, the substrate placed by can both keeping with same uniform high planarity absorption.
Accompanying drawing explanation
Fig. 1 is the integrally-built stereographic map that drawing apparatus of the present invention is shown.
Fig. 2 is the exploded perspective view of an embodiment of the drawing desk of the drawing apparatus that Fig. 1 is shown.
Fig. 3 is the vertical view of this drawing desk.
Fig. 4 is the cut-open view of the IV-IV line along Fig. 3.
Fig. 5 is schematic plan when describing on the front (the 1st face) of substrate.
Fig. 6 is schematic plan when describing on the reverse side (the 2nd face) of substrate.
Label declaration
100: drawing apparatus; 11: pedestal; 15: drawing desk; 15c: aspiration connector; 15r: recess; 15v: SS; 15P: cover plate; 15Q: platform main body; 17: substrate casting die; 18: control device; 19: vacuum source; 20: light source portion; 30: exposure plotting portion; 41: reference mark; 41h: reference mark hole; 41j: reference mark forms light source; 41k: reflecting element; 42: mark forming unit; 42h: alignment mark hole; 42j: alignment mark forms light source; 43: circuit substrate; AC: aligned with camera (image unit); AM: alignment mark; W: substrate.
Embodiment
Fig. 1 is the structuring concept figure of drawing apparatus 100 entirety of the present invention.Drawing apparatus 100 possesses pedestal 11, erect the door 12 that arranges from the both sides of pedestal 11 and be supported in this exposure plotting portion 30 12.
Pedestal 11 is configured with drawing desk 15, drawing desk 15 has loaded the substrate W being coated with photosensitive material at pros and cons.This drawing desk 15 such as can move along guide rail 14 by linear electric motors mobile unit in the X direction., direction vertical with X-direction in surface level is set to Y-direction below, direction vertical with X-direction in vertical plane is set to Z-direction.
The front surface in exposure plotting portion 30 is provided with the sliding part 13 extended along Y-direction, on sliding part 13, the mode separated in the Y direction is provided with a pair aligned with camera (image unit) AC.Sliding part 13 is driven or driving stepper motor by linear electric motors, aligned with camera AC is moved to any position of Y-direction.
Exposure plotting portion 30 possesses light source portion 20.Light source portion 20 is made up of 2 light source portion 20a and light source portion 20b with identical inner structure.Because light source portion 20a and light source portion 20b are identical structure, therefore with light source portion 20a for representative is described.
Light source portion 20a is made up of UV lamp 21, the 1st completely reflecting mirror 22, collector lens 23, the 2nd completely reflecting mirror 24, fly's-eye lens 25 and aperture (aperture) (not shown).Light source portion 20a possesses UV lamp 21, penetrates from UV lamp 21 ultraviolet light that mixing exists the various wavelength of 365nm to 440nm.
The ultraviolet light penetrated from UV lamp 21 is irradiated by oval shape mirror 26 heavenwards direction (+Z-direction), horizontal direction is changed into by the 1st completely reflecting mirror 22 in its direction, after being assembled by collector lens 23, direction, ground (-Z-direction) is changed into by the 2nd completely reflecting mirror 24 in its direction.The ultraviolet light changing direction becomes through fly's-eye lens 25 and aperture the light beam being divided into 4 tunnels.Light beam, further via 8 the 1st projecting lens 33 and 8 catoptrons 34, is incident to 8 DMD (DigitalMicro-mirrorDevice: Digital Micromirror Device) element 36, becomes thus by the light beam after controlling.This through the 2nd projection lens set 37 by the light beam after controlling, is adjusted the multiplying power of the exposure plotting that will project thus and exposes to substrate W.That is, drawing apparatus 100 is according to the description data of exposure picture of preserving expectation in advance, controls the ultraviolet light of light source portion 20a and light source portion 20b.
Drawing desk 15 possesses the cover plate 15P on platform main body (lower stage) 15Q and this main body 15Q.Fig. 2 to Fig. 4 shows the details of drawing desk 15.It is rectangular-shaped that drawing desk 15 extends along three vertical plane directions of XYZ in outside surface.Measure-alike in X-direction and Y-direction of platform main body 15Q and cover plate 15P, cover plate 15P Thickness Ratio platform main body 15Q is in z-direction thin.Platform main body 15Q and cover plate 15P can decompose as schematically shown in Fig. 2, such as, utilize not shown locating device and adsorbent equipment, be fixed on normal position and form drawing desk 15 (Fig. 1, Fig. 3 and Fig. 4).
Be respectively equipped with a reference mark 41 in the corner in the substrate-placing face of the drawing desk 15 of rectangle and form the mark forming unit 42 of the alignment mark corresponding with each reference mark 41.That is, drawing desk 15 is provided with multiple reference mark 41 and the multiple mark forming units 42 corresponding with each reference mark 41.
Each reference mark 41 forms light source 41j by reference mark hole (through hole) 41h be formed on cover plate 15P and the reference mark be bearing on platform main body 15Q and is formed.Mark forming unit 42 is by multiple (being 4 in the illustrated embodiment) alignment mark hole (through hole) 42h be formed on cover plate 15P and form light source 42j with 4 alignment marks that each alignment mark hole 42h is bearing on platform main body 15Q accordingly and formed.Reference mark forms light source 41j and is made up of red (visible ray) LED, the light after being reflected is penetrated from reference mark hole 41h to Z-direction (aligned with camera AC direction) by reflecting element 41k.Alignment mark forms light source 42j and is made up of ultraviolet LED, is penetrated by light from alignment mark hole 42h directly to Z-direction.Reference mark forms light source 41j and alignment mark formation light source 42j is fixed on circuit substrate 43 (Fig. 4), and this circuit substrate 43 and reflecting element 41k are disposed in the recess 15r of formation on platform main body 15Q.
1 reference mark hole 41h (reference mark forms light source 41j) and 4 alignment mark hole 42h (alignment mark forms light source 42j) are formed with forming a line in the X direction, make easily to utilize the same aligned with camera AC be mounted in exposure plotting portion 30 to take.As shown in Figure 3, Figure 4, in the example in the figures, the interval of each alignment mark hole 42h of mark forming unit 42 is identical, reference mark 41 and these mark the distance that forming unit 42 has been separated by more than alignment mark hole 42h interval to each other.
1 reference mark 41 and 4 position relationships marked between forming unit 42 are fixing on drawing desk 15, and mutual position relationship (coordinate system in XY plane) can strictly carry out identifying (being identified).Therefore, aligned with camera AC shot mark forming unit 42 (reference mark 41) is obtained mark position and is equal to the position obtaining reference mark 41 (alignment mark formed by mark forming unit 42).
In addition, the reference mark 41 of the corner on drawing desk 15 is configured to than mark forming unit 42 in the outer part, and substrate casting die 17 is between reference mark 41 and mark forming unit 42.Substrate casting die 17 supports by the edge of the substrate W be positioned on drawing desk 15 (edge, both sides of X-direction), at least can be upper mobile direction (Z-direction) that is close, that leave drawing desk 15 front.
Be various sizes by the planar dimension of the substrate W be positioned on drawing desk 15, therefore preferably make substrate casting die 17 also can move in the X direction.But substrate W can not exceed substrate casting die 17 and outstanding to reference mark 41 direction.That is, be no matter how many by the size of the substrate W be positioned on drawing desk 15, reference mark 41 all can not be blocked by substrate W.On the other hand, no matter the size of substrate W is how many, and 4 alignment mark hole 42h of mark forming unit 42 (at least one) can be blocked by substrate W.
On the surface of the cover plate 15P of drawing desk 15, as schematically shown in Fig. 2, offer known several SS 15v, these SSs 15v, via the aspiration connector 15c be arranged on platform main body 15Q, is connected with control device 18 and vacuum source 19.
Utilize the drawing apparatus 100 of said structure, such as, according to following step, the pros and cons of substrate W is carried out to the description of pattern.For convenience's sake (in order to easy understand), as the pattern (such as circuit pattern) that the pros and cons utilizing drawing apparatus 100 at substrate W is described, be set to following pattern: the character L of " P " shown in the front depiction 5 of substrate W, at the framework F shown in the reverse side depiction 6 of substrate W.In addition, platform main body 15Q and cover plate 15P is fixed according to regular position relationship in advance, and is supported on pedestal 11 (guide rail 14) as drawing desk 15.
1st step
The cover plate 15P of drawing desk 15 loads substrate W.When utilizing not shown conveying device to load substrate W, mounting has carried out the substrate W of prealignment (pre-determined bit) in advance, so be implemented rough location at this time point substrate.When operating personnel puts substrate W with hand shovelling, the positioning mark be arranged on cover plate 15P is utilized to position.In order to tackle situation about arranging with hand, the fixture of substrate orientation also can be set on drawing desk 15 (cover plate 15P or platform main body 15Q).The fixture of substrate orientation such as adopts the line or register pin etc. that are drawn on cover plate 15P.XY coordinate system for substrate W is that the position of the alignment mark utilizing the position of 4 place's reference marks 41 on the drawing desk 15 captured by aligned with camera AC and the mark forming unit 42 at 4 places to be formed is determined, therefore, do not need to carry out the strict position alignment of substrate W on cover plate 15P.
2nd step
Utilize SS 15v, control device 18, vacuum source 19 to carry out vacuum suction to the substrate W be positioned on cover plate 15P, and utilize substrate casting die 17 to clamp substrate W.Substrate casting die 17 moves to the position indicated in advance, and substrate W is pressed into cover plate 15P.
3rd step
Mobile drawing desk 15 and sliding part 13, make the picture (spot mark) of aligned with camera AC to 4 place's reference marks 41 on drawing desk 15 take (aligned with camera AC relatively moves to above each reference mark 41).That is, the light forming the red LED of light source 41j from reference mark is penetrated from reference mark hole 41h by after reflecting element 41k reflection, and aligned with camera AC moves along with the X-direction of drawing desk 15, identifies 4 reference marks 41 (Fig. 5).The positional information of the reference mark of 4 captured by aligned with camera AC 41 is sent to locating device, determines the XY coordinate system based on reference mark 41 on drawing desk 15.
4th step
4 alignment marks of mark forming unit 42 form any one reverse side to substrate W (the 2nd face) irradiating ultraviolet light in light source 42j, form the picture (alignment mark AM (Fig. 6)) that certainly develops the color of alignment mark hole 42h shape.Use in multiple mark forming unit 42 which be predetermined according to substrate size (service manual (recipe) etc.) to carry out irradiation.Light source 42j beyond selected mark forming unit 42 is not lit.In one example, irradiation time is about 10 seconds.In addition, the 4th step can be carried out concurrently with other steps, or also can carry out before beginning the 3rd step.
5th step
Locating device, according to based on the XY coordinate system on the drawing desk 15 of reference mark 41, determines the XY coordinate system of the alignment mark AM based on substrate back side.Although the XY coordinate system based on reference mark 41 also can be used, owing to describing to carry out on substrate W, so preferably use the XY coordinate system based on the alignment mark AM on substrate W.Then, according to the forming position of the alignment mark AM of this substrate back side, with substrate position, relative position alignment is carried out to pattern plotter position.This relative position alignment can be corrected by 30 pairs, exposure plotting portion depicting pattern data and description position be offset carry out, or can be undertaken by making drawing desk 15 move up in XY θ side.θ direction is the sense of rotation in the direction parallel with Z-direction.Relative position alignment technology is like this known technology, can adopt suitable method as required.
6th step
The front (the 1st face) of substrate W is carried out the description of pattern (being character L in illustrated example).By the relative movement between exposure plotting portion 30 and drawing desk 15 (substrate W), carry out the description of pattern.In the present embodiment, when drawing desk 15 moves in the X direction continuously, description light is irradiated continuously to substrate W in exposure plotting portion 30.By known multiple exposure techniques, carry out the description of pattern.
7th step
The substrate W of the pattern plotter finishing front (the 1st face) is taken out of from drawing desk 15.The substrate W taken out of is overturn and makes reverse side (the 2nd face) upward.Take out of and overturn operation utilize not shown conveying device to carry out or carried out with hand by operating personnel.
8th step
Substrate W (Fig. 6) on the cover plate 15P of drawing desk 15 after mounting upset.In addition, drawing desk (drawing apparatus) now can be the device identical with the 1st step, or also can be different drawing apparatuses.In the same manner as the 1st step, loaded under the state of substrate W after prealignment.
9th step
In the same manner as the 2nd step, vacuum suction is carried out to the substrate W be positioned on cover plate 15P, and utilize substrate casting die 17 to clamp and fixing base W.
10th step
Aligned with camera AC relatively move to be formed in substrate W reverse side (the 2nd face) on the position of alignment mark AM.Utilize the indirect illumination that aligned with camera AC possesses, shooting alignment mark AM, sends image (Fig. 6) to locating device.
11st step
Locating device, according to the image from aligned with camera AC, obtains the position of alignment mark AM, in the same manner as the 4th step, carries out relative position alignment (Fig. 6) to pattern plotter position and substrate position.And now, not only can carry out relative position alignment, the shape correcting accordingly and describe data of also stretching with substrate.This carries out to correct the error of pattern plotter position caused by distortion, and this distortion is due to after the exposure plotting to front (the 1st face), and impact that substrate is subject to temperature variation etc. sometimes occurs flexible and produces.
12nd step
In the same manner as the 6th step, the reverse side (the 2nd face) of substrate W carries out the description (Fig. 6) of pattern (frame F).
13rd step
Take out of the substrate W of the pattern plotter finishing reverse side (the 2nd face) from drawing desk 15, and be transported to subsequent processing.
In the above embodiment, be provided with multiple (4) mark forming unit 42 for 1 reference mark 41, but, 1 reference mark 41 also can be made 1 mark forming unit 42 is corresponded to according to the planar dimension of substrate W.When arranging multiple mark forming unit 42, in the above embodiment, configure with lining up 1 row, but, do not need to be configured to 1 row, as long as multiple mark forming unit 42 is arranged in alignment mark can be formed in the position determined for reference mark according to substrate size.
In addition, also cover plate 15P can correspondingly be changed with substrate W.Thereby, it is possible to correspond to various substrate and mark position.
In addition, the light source of reference mark 41 and mark forming unit 42 may not be LED, in addition, for the wavelength of light, can with coating or the light sensitivity being attached to the photosensitive material on substrate correspondingly, the suitably selected wavelength that can fully be formed from colour developing picture.
About reference mark 41, as long as aligned with camera AC can be utilized to carry out shooting to determine position, also can be non-luminescent (such as printed article).
Claims (6)
1. a drawing apparatus, it has: drawing desk, and it loads substrate; And exposure plotting portion, itself and above-mentioned drawing desk relatively move, and by the substrate of pattern plotter on this drawing desk, the feature of above-mentioned drawing apparatus is,
On above-mentioned drawing desk, be provided with multiple reference mark and determined multiple mark forming units of the position marked relative to each said reference, above-mentioned multiple reference mark is for setting the position reference relative to above-mentioned exposure plotting portion, and alignment mark is formed on the reverse side of the substrate be placed on this drawing desk by above-mentioned multiple mark forming unit.
2. drawing apparatus according to claim 1, is characterized in that,
The cover plate that above-mentioned drawing desk has platform main body and is positioned in this main body, above-mentioned mark forming unit is made up of following part: run through at least one through hole be arranged on above-mentioned cover plate; And forming light source by the mark of above-mentioned body abutment, above-mentioned mark forms light source and forms light from above-mentioned through hole injection mark.
3. drawing apparatus according to claim 2, is characterized in that,
Above-mentioned cover plate runs through the above-mentioned through hole being provided with multiple formation above-mentioned mark forming unit, and above-mentioned main body possesses mark and forms light source, and above-mentioned mark forms light source and forms light to being marked by the through hole injection selected in above-mentioned multiple through hole.
4. the drawing apparatus according to any one in claims 1 to 3, is characterized in that,
Said reference mark and mark forming unit are positioned at the relative both sides of the circumference of the substrate be positioned on above-mentioned drawing desk, and are equipped with a pair separately.
5. the drawing apparatus according to any one in claims 1 to 3, is characterized in that,
Above-mentioned exposure plotting portion has the image unit taken said reference mark or alignment mark, the reference mark position information captured by above-mentioned image unit of utilization and the coordinate system that sets, perform the pattern plotter to the front of aforesaid substrate, utilize alignment mark positional information captured by above-mentioned image unit and the coordinate system that sets, the pattern plotter to substrate back side carried out after performing the positive and negative upset by aforesaid substrate.
6. the drawing apparatus according to any one in claims 1 to 3, is characterized in that,
Said reference mark is the spot mark from visible light source.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-172363 | 2014-08-27 | ||
| JP2014172363A JP6465591B2 (en) | 2014-08-27 | 2014-08-27 | Drawing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105388707A true CN105388707A (en) | 2016-03-09 |
| CN105388707B CN105388707B (en) | 2019-01-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510354272.6A Active CN105388707B (en) | 2014-08-27 | 2015-06-24 | Drawing apparatus |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6465591B2 (en) |
| KR (1) | KR102333949B1 (en) |
| CN (1) | CN105388707B (en) |
| TW (1) | TWI660246B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109471337A (en) * | 2018-12-29 | 2019-03-15 | 苏州源卓光电科技有限公司 | A kind of exposure machine and alignment exposure method for the exposure of PCB inner plating |
| CN112549170A (en) * | 2019-09-10 | 2021-03-26 | 昊佰电子科技（上海）有限公司 | Machining method for flat plate cutting plotter |
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| CN106371298B (en) * | 2016-11-25 | 2018-09-14 | 天津津芯微电子科技有限公司 | LDI position alignment of inner layer plates method and system |
| DE102018132001A1 (en) | 2018-12-12 | 2020-06-18 | Laser Imaging Systems Gmbh | Device for exposing plate-shaped workpieces with high throughput |
| KR102238691B1 (en) * | 2018-12-17 | 2021-04-12 | 주식회사 선익시스템 | wafer size expanding apparatus and wafer alignment apparatus including the same |
| KR102214357B1 (en) * | 2018-12-18 | 2021-02-10 | 주식회사 선익시스템 | wafer size expanding apparatus and wafer alignment apparatus including the same |
| JP7203959B2 (en) * | 2018-12-19 | 2023-01-13 | 江蘇影速集成電路装備股▲ふん▼有限公司 | Double-sided exposure alignment apparatus, method, and equipment |
| CN117082746B (en) * | 2023-10-12 | 2024-01-23 | 四川英创力电子科技股份有限公司 | Processing method of half-etched copper characters |
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Also Published As
| Publication number | Publication date |
|---|---|
| TWI660246B (en) | 2019-05-21 |
| KR20160025441A (en) | 2016-03-08 |
| JP6465591B2 (en) | 2019-02-06 |
| KR102333949B1 (en) | 2021-12-01 |
| TW201608345A (en) | 2016-03-01 |
| CN105388707B (en) | 2019-01-15 |
| JP2016048273A (en) | 2016-04-07 |
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