TWI660246B - Drawing device - Google Patents

Drawing device Download PDF

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Publication number
TWI660246B
TWI660246B TW104113472A TW104113472A TWI660246B TW I660246 B TWI660246 B TW I660246B TW 104113472 A TW104113472 A TW 104113472A TW 104113472 A TW104113472 A TW 104113472A TW I660246 B TWI660246 B TW I660246B
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mark
substrate
light source
forming
exposure
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TW104113472A
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Chinese (zh)
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TW201608345A (en
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山賀勝
清水修一
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日商奧克製作所股份有限公司
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Abstract

本發明提出一種描繪裝置,具有載置基板的描繪桌;以及相對於該描繪桌移動並用於描繪圖樣於該描繪桌的基板的曝光描繪部。該描繪裝置形成於基板的對準標記的位置誤差少且不損及基板的平面精度。該描繪桌上包括:複數的基準標記,用以設定相對於該曝光描繪部的位置基準;以及複數的標記形成手段,用以形成對準標記於載置在該描繪桌上的基板的背面,並且位於相對於該各基準標記的特定位置。 The present invention provides a drawing device including a drawing table on which a substrate is placed, and an exposure drawing section that moves relative to the drawing table and draws a pattern on the substrate of the drawing table. The position error of the alignment mark formed on the substrate by the drawing device is small, and the plane accuracy of the substrate is not impaired. The drawing table includes: a plurality of reference marks for setting a position reference with respect to the exposure drawing part; and a plurality of mark forming means for forming an alignment mark on a back surface of a substrate placed on the drawing table. And it is located in a specific position with respect to each reference mark.

Description

描繪裝置 Drawing device

本發明係有關於對電子電路基板、LCD用玻璃基板、PDP用玻璃基板等的平面基板的正反兩面描繪出圖樣的描繪裝置。 The present invention relates to a drawing device for drawing patterns on the front and back surfaces of a flat substrate such as an electronic circuit substrate, a glass substrate for an LCD, and a glass substrate for a PDP.

近年來,直接曝光裝置(描繪裝置)在市場上興起,這種直接曝光裝置不使用轉印光罩而直接對基板的正反兩面照射設定好彼此位置關係的描繪光來描繪出圖樣。在進行這種兩面曝光時,對表面(第1面)進行圖樣曝光的同時(或者是在曝光之前),會對背面(第2面)曝光(形成)出複數的對準標記,然後翻轉基板的正反面而對背面(第2面)進行圖樣曝光時,將形成於第2面的對準標記做為基準來設定圖樣曝光位置(專利文獻1、2)。對準標記具體上會使用直徑少於2mm的圓形圖樣或十字等的指標,並且一般會做為運用了光阻的自發色性的圖像(自發色圖像)光學地設置在要曝光的基板的角落部。 In recent years, a direct exposure device (drawing device) has emerged on the market. This type of direct exposure device directly irradiates the front and back sides of a substrate with drawing light set in a positional relationship with each other without using a transfer mask to draw patterns. When performing such double-sided exposure, while pattern-exposing the surface (the first surface) (or before the exposure), the rear surface (the second surface) is exposed (formed) with multiple alignment marks, and then the substrate is flipped When pattern exposure is performed on the front surface and the back surface (second surface), the pattern exposure position is set using the alignment mark formed on the second surface as a reference (Patent Documents 1 and 2). Specifically, the alignment mark uses indicators such as a circular pattern or a cross with a diameter of less than 2 mm, and is generally set optically as an image (spontaneous color image) using the spontaneous color of a photoresist to be exposed. Corner of the substrate.

[先行技術文獻] [Advanced technical literature] [專利文獻] [Patent Literature]

專利文獻1:日本特開2009-294337號公報 Patent Document 1: Japanese Patent Application Laid-Open No. 2009-294337

專利文獻2:日本特開2013-213852號公報 Patent Document 2: Japanese Patent Application Publication No. 2013-213852

然而,專利文獻1、2的描繪裝置具備相對於載置基板的描繪桌可動的標記形成手段(對準標記形成手段、標記曝光裝置),使標記形成手段相對於描繪桌(上面載置了基板)移動,在基板背面形成對準標記。因此,因為標記形成手段的移動機構本身無法避免的機械誤差,有可能會產生對準標記的位置誤差。如果,對準標記的形成位置有誤差,第2面的描繪圖樣與第1面的描繪圖像就沒有辦法正確地整合。又或者是進行描繪面的伸縮等的尺寸修正時,會造成與實際的基板伸縮不同的修正。 However, the drawing apparatuses of Patent Documents 1 and 2 are provided with a mark formation means (alignment mark formation means, mark exposure device) movable with respect to a drawing table on which a substrate is placed, and the mark formation means with respect to the drawing table (on which a substrate is placed) ) Move to form an alignment mark on the back of the substrate. Therefore, due to mechanical errors that cannot be avoided by the moving mechanism of the mark forming means, there is a possibility that a position error of the alignment mark may occur. If there is an error in the formation position of the alignment mark, the drawing pattern on the second side and the drawing image on the first side cannot be correctly integrated. Or, when dimensional correction such as stretching of the drawing surface is performed, a correction different from the actual stretching of the substrate is caused.

習知的裝置因為必須設置相對於描繪桌可調節位置的標記形成手段,所以無法避免裝置整體的大型化。又,專利文獻2為了使標記形成手段移動而在描繪桌的表面設置了標記形成手段的逃出部(溝部)。如此一來,因為這個逃出部無法支持基板的背面,可能會對圖樣的描繪精度(基板的平面精度)帶來不良的影響。 In conventional devices, since it is necessary to provide a marker forming means capable of adjusting the position with respect to the drawing table, it is impossible to avoid an increase in the size of the entire device. Further, in Patent Document 2, an escape portion (a groove portion) of the mark forming means is provided on the surface of the drawing table in order to move the mark forming means. In this way, because this escape portion cannot support the back surface of the substrate, it may adversely affect the drawing accuracy of the pattern (planar accuracy of the substrate).

因此,本發明的目的是提出一種形成於基板的對準標記的位置誤差少且不損及基板的平面精度的描繪裝置。 Therefore, an object of the present invention is to provide a drawing device that has less positional errors in alignment marks formed on a substrate and does not impair the plane accuracy of the substrate.

本發明將習知的描繪裝置中標記形成手段可相對於載置基板的描繪桌移動這點視為對準標記的形成位置產生誤差的原因,因而著眼於若在描繪桌內形成手段而對載置於該 描繪桌上的基板的背面直接形成對準標記的話,就能夠防止誤差的發生。 The present invention regards the fact that the mark forming means in the conventional drawing device can be moved relative to the drawing table on which the substrate is placed as the cause of the error in the formation position of the alignment mark. Put in If alignment marks are directly formed on the back surface of the substrate on the table, errors can be prevented.

也就是說,本發明的描繪裝置,包括:描繪桌,載置基板;以及曝光描繪部,相對於該描繪桌移動,描繪圖樣於該描繪桌上的基板,其中該描繪桌上包括:複數的基準標記,用以設定相對於該曝光描繪部的位置基準;以及複數的標記形成手段,用以形成對準標記於載置在該描繪桌上的基板的背面,並且位於相對於該各基準標記的特定位置。該描繪桌具備桌本體、以覆蓋該桌本體的方式固定於該桌本體上的蓋板。該標記形成手段由穿設於該蓋板的至少一貫通孔、以及固定於該桌本體的標記形成光源所組成。該標記形成光源從該貫通孔射出該貫通孔的形狀的標記形成光。 That is, the drawing device of the present invention includes: a drawing table on which a substrate is placed; and an exposure drawing section that moves with respect to the drawing table and draws a substrate on the drawing table, wherein the drawing table includes: a plurality of A reference mark for setting a position reference with respect to the exposure drawing part; and a plurality of mark formation means for forming an alignment mark on a back surface of the substrate placed on the drawing table and positioned relative to the reference marks Specific location. The drawing table includes a table body, and a cover plate fixed to the table body so as to cover the table body. The mark forming means is composed of at least one through hole penetrating through the cover plate and a mark forming light source fixed on the table body. The mark-forming light source emits mark-forming light in a shape of the through-hole from the through-hole.

該描繪桌中,該基準標記具有穿設於該蓋板的至少一貫通孔、以及固定於該桌本體的可見光源,其中該可見光源從該貫通孔射出可見光以做為點標記。 In the drawing table, the reference mark has at least one through hole penetrating through the cover and a visible light source fixed to the table body, wherein the visible light source emits visible light from the through hole as a point mark.

形成該標記形成手段的該貫通孔能夠具有複數個沿著該描繪桌及該曝光描繪部的相對移動方向以既定的間隔穿設於該蓋板。該桌本體能夠具備從該複數的貫通孔中按照基板尺寸而選擇的貫通孔射出該標記形成光的該標記形成光源。 The through hole forming the mark forming means may have a plurality of through-holes formed in the cover plate at a predetermined interval along a relative movement direction of the drawing table and the exposure drawing portion. The table body can include the mark-forming light source that emits the mark-forming light from the through-holes selected according to the substrate size from the plurality of through-holes.

該基準標記與該標記形成手段具體來說,能夠位於載置在該描繪桌上的基板周緣部的相對的2邊,並分別各具有一對。 Specifically, the reference mark and the mark forming means can be located on two opposite sides of the peripheral edge portion of the substrate placed on the drawing table, and each has a pair.

該曝光描繪部能夠具有拍攝該基準標記或對準標記的拍攝手段。對於該基板表面的圖樣描繪能夠在依據該拍攝 手段拍攝的基準標記位置資訊而設定的座標系統下來實行。將該基板正反面翻轉後對於該基板背面的圖樣描繪能夠在依據該拍攝手段拍攝的對準標記位置資訊而設定的座標系統下來實行。 The exposure and drawing section may include an imaging means for imaging the reference mark or the alignment mark. The drawing of the surface of the substrate can be performed in accordance with the shooting The coordinate system set based on the position information of the fiducial mark of the shooting is implemented. The drawing of the pattern on the back surface of the substrate after the front surface and the back surface of the substrate is reversed can be implemented by a coordinate system set according to the position information of the alignment mark photographed by the photographing means.

該基準標記在一實施形態中是來自可見光源的點標記。 This fiducial mark is a point mark from a visible light source in one Embodiment.

本發明中,載置基板的描繪桌具備標記成型手段來形成對準標記於基板背面,因此對準標記的形成位置不會有機械性誤差(標記形成手段的移動誤差等)。根據本發明,能夠維持簡單的構造且高精度地對齊描繪於基板正反面的圖樣的位置。又,能夠保持描繪桌表面平滑,且能夠以直到周邊部都能維持一樣高的平面性來吸附保持被載置的基板。 In the present invention, since the drawing table on which the substrate is placed includes a mark forming means for forming alignment marks on the back surface of the substrate, there is no mechanical error (such as a movement error of the mark forming means) in the formation position of the alignment mark. According to the present invention, the position of a pattern drawn on the front and back surfaces of a substrate can be aligned with high accuracy while maintaining a simple structure. In addition, the surface of the drawing table can be kept smooth, and the substrate to be placed can be sucked and held with the same flatness up to the peripheral portion.

11‧‧‧基底 11‧‧‧ substrate

12‧‧‧閘 12‧‧‧Gate

13‧‧‧滑動部 13‧‧‧ sliding section

14‧‧‧軌道 14‧‧‧ track

15‧‧‧描繪桌 15‧‧‧painting table

15c‧‧‧吸引連接器 15c‧‧‧Attraction connector

15P‧‧‧蓋板 15P‧‧‧ Cover

15Q‧‧‧桌本體 15Q‧‧‧Table body

15r‧‧‧凹部 15r‧‧‧ recess

15v‧‧‧吸引孔 15v‧‧‧ suction hole

17‧‧‧基板壓條 17‧‧‧ substrate bead

18‧‧‧控制裝置 18‧‧‧Control device

19‧‧‧真空源 19‧‧‧Vacuum source

20、20a、20b‧‧‧光源部 20, 20a, 20b‧‧‧‧Light source department

21‧‧‧UV燈 21‧‧‧UV Light

22‧‧‧第1全反射鏡 22‧‧‧The first total reflection mirror

23‧‧‧聚光透鏡 23‧‧‧ condenser lens

24‧‧‧第2全反射鏡 24‧‧‧ 2nd Total Mirror

25‧‧‧複眼微透鏡 25‧‧‧Flying Eye Micro Lenses

30‧‧‧曝光描繪部 30‧‧‧Exposure and Drawing Department

33‧‧‧第1投影透鏡 33‧‧‧The first projection lens

34‧‧‧反射鏡 34‧‧‧Reflector

36‧‧‧DMD元件 36‧‧‧DMD components

37‧‧‧第2透鏡群 37‧‧‧ 2nd lens group

41‧‧‧基準標記 41‧‧‧ fiducial mark

41h‧‧‧基準標記孔 41h‧‧‧ fiducial mark hole

41j‧‧‧基準標記形成光源 41j‧‧‧ fiducial mark forming light source

41k‧‧‧反射元件 41k‧‧‧Reflective element

42‧‧‧標記形成手段 42‧‧‧mark formation means

42h‧‧‧對準標記孔 42h‧‧‧Alignment mark hole

42j‧‧‧對準標記形成光源 42j‧‧‧Alignment mark to form light source

43‧‧‧電路基板 43‧‧‧circuit board

100‧‧‧描繪裝置 100‧‧‧ depicting device

AC‧‧‧對準相機 AC‧‧‧ pointed at the camera

AM‧‧‧對準標記 AM‧‧‧Alignment mark

F‧‧‧外框 F‧‧‧ frame

L‧‧‧文字 L‧‧‧ text

W‧‧‧基板 W‧‧‧ substrate

第1圖係本發明的描繪裝置的全體構造的立體圖。 FIG. 1 is a perspective view of the overall structure of a drawing device of the present invention.

第2圖係第1圖的描繪裝置的描繪桌的一實施形態的分解立體圖。 Fig. 2 is an exploded perspective view of an embodiment of a drawing table of the drawing device of Fig. 1.

第3圖係同描繪桌的平面圖。 Figure 3 is a plan view depicting the table.

第4圖係沿著第3圖的IV-IV線的剖面圖。 FIG. 4 is a cross-sectional view taken along the line IV-IV in FIG. 3.

第5圖係描繪於基板表面(第1面)時的概要平面圖。 Fig. 5 is a schematic plan view when the substrate surface (first surface) is drawn.

第6圖係描繪於基板背面(第2面)時的概要平面圖。 FIG. 6 is a schematic plan view when the substrate is drawn on the rear surface (second surface) of the substrate.

第1圖係本發明的描繪裝置100的全體構造的立體 圖。描繪裝置100具備基底11、從基底11的兩側部立設的閘12、被支持於此閘12上的曝光描繪部30。 FIG. 1 is a perspective view of the entire structure of the drawing device 100 of the present invention. Illustration. The drawing device 100 includes a base 11, gates 12 erected from both sides of the base 11, and an exposure drawing unit 30 supported by the gates 12.

基底11上配置有描繪桌15,載置了正反面塗布了感光材料的基板W。此描繪桌15沿著軌道14可藉由例如線性馬達移動手段而移動於X方向。以下,將水平面中與X方向垂直的方向稱為Y方向,將鉛直面中與X方向垂直的方向稱為Z方向。 A drawing table 15 is arranged on the base 11, and a substrate W coated with a photosensitive material on the front and rear sides is placed. This drawing table 15 can be moved in the X direction along the track 14 by, for example, a linear motor moving means. Hereinafter, a direction perpendicular to the X direction in a horizontal plane is referred to as a Y direction, and a direction perpendicular to the X direction in a vertical plane is referred to as a Z direction.

曝光描繪部30的前面設置有延伸於Y方向的滑動部13,滑動部13上設置有在Y方向上彼此分離的一對的對準相機(拍攝手段)AC。滑動部13藉由線性馬達驅動或步進馬達驅動而將對準相機AC移動到Y方向上的任意位置。 A slide section 13 extending in the Y direction is provided in front of the exposure drawing section 30, and a pair of alignment cameras (shooting means) AC separated from each other in the Y direction are provided on the slide section 13. The sliding portion 13 is driven by a linear motor or a stepping motor to move the alignment camera AC to an arbitrary position in the Y direction.

曝光描繪部30具備光源部20。光源部20事由具有相同內部構造的2個光源部20a、光源部20b構成。光源部20a及光源部20b為相同構造,所以以光源部20a為代表來說明。 The exposure drawing section 30 includes a light source section 20. The light source unit 20 is composed of two light source units 20a and 20b having the same internal structure. Since the light source section 20a and the light source section 20b have the same structure, the light source section 20a will be described as a representative.

光源部20a是由UV燈21、第1全反射鏡22、聚光透鏡23、第2全反射鏡24、複眼微透鏡25、開孔(未圖示)所構成。光源部20a具備UV燈21,UV燈21發出從365nm~440nm的各種波長混合的紫外光。 The light source unit 20a is composed of a UV lamp 21, a first total reflection mirror 22, a condenser lens 23, a second total reflection mirror 24, a fly-eye microlens 25, and an opening (not shown). The light source unit 20a includes a UV lamp 21, and the UV lamp 21 emits ultraviolet light mixed with various wavelengths from 365 nm to 440 nm.

從UV燈21射出的紫外光因為橢圓鏡26而朝向天方向(+Z軸方向)照射,第1全反射鏡22改變照射方向至水平方向,聚光透鏡23進行集光,第2全反射鏡24改變照射方向至地面方向(-Z軸方向)。照射方向改變的紫外光經過複眼微透鏡25及開孔而成為4分歧的光束。光束更經由8個第1投影透鏡33與8個反射鏡34入射到8個DMD(數位微鏡裝置)元件36,成為 受控制的光束。此受控制的光束通過第2透鏡群37來調整透影的曝光描繪倍率後被照射到基板W。也就是說,描繪裝置100按照預先收納了希望的曝光圖像的描繪資料,控制光源部20a與光源部20b的紫外光。 The ultraviolet light emitted from the UV lamp 21 is irradiated in the sky direction (+ Z axis direction) by the elliptical mirror 26. The first total reflection mirror 22 changes the irradiation direction to the horizontal direction, the condenser lens 23 collects light, and the second total reflection mirror 24 Change the irradiation direction to the ground direction (-Z axis direction). The ultraviolet light whose irradiation direction is changed passes through the fly-eye microlens 25 and the opening to become a divergent light beam. The light beam is incident on eight DMD (digital micromirror device) elements 36 through eight first projection lenses 33 and eight mirrors 34, and becomes Controlled light beam. This controlled light beam is irradiated to the substrate W after passing through the second lens group 37 to adjust the exposure and drawing magnification of the transmission. That is, the drawing device 100 controls the ultraviolet light of the light source section 20 a and the light source section 20 b in accordance with the drawing data in which a desired exposure image is stored in advance.

描繪桌15具備桌本體(下部桌)15Q、該桌本體15Q上的蓋板15P。第2至4圖顯示了描繪桌15的細節。描繪桌15外觀是沿著XYZ正交的三平面延伸的立方體。描繪桌本體15Q與蓋板15P在X方向及Y方向的尺寸相同,蓋板15P在Z方向上的厚度比桌本體15Q薄。桌本體15Q與蓋板15P如第2圖概要地顯示出可以進行分解,並且藉由例如未圖示的位置決定裝置及吸附裝置,被固定在正規位置而組成描繪桌15(第1、3、4圖)。 The drawing table 15 includes a table body (lower table) 15Q and a cover plate 15P on the table body 15Q. Figures 2 to 4 show details depicting table 15. The appearance of the drawing table 15 is a cube extending along three planes orthogonal to XYZ. The dimensions of the table body 15Q and the cover plate 15P in the X direction and the Y direction are the same, and the thickness of the cover plate 15P in the Z direction is thinner than the table body 15Q. The table body 15Q and the cover plate 15P can be disassembled as shown in FIG. 2 in outline, and the drawing table 15 is fixed in a regular position by, for example, a position determination device and an adsorption device (not shown) (FIG. 1, 3, Figure 4).

矩形的描繪桌15的基板載置面的四個角落分別設置有一個基準標記41、以及用以對應至各基準標記41並用以形成對準標記的標記形成手段42。也就是說,描繪桌15上設置有複數的基準標記41、以及對應到各基準標記41的複數標記形成手段42。 Four corners of the substrate mounting surface of the rectangular drawing table 15 are provided with a reference mark 41 and mark forming means 42 corresponding to each reference mark 41 and for forming an alignment mark. In other words, the drawing table 15 is provided with a plurality of reference marks 41 and a plurality of mark formation means 42 corresponding to the reference marks 41.

各基準標記41是由形成於蓋板15P的一個基準標記孔(貫通孔)41h與被桌面本體15Q所支持的基準標記形成光源41j所形成。標記形成手段42是由形成於蓋板15P的複數(圖示實施形態為4個)對準標記孔(貫通孔)42h與對應到各對準標記孔42h並且被桌面本體15Q所支持的4個對準標記形成光源42j所形成。基準標記形成光源41j是由紅色(可見光)LED組成,被反射元件41k反射的光會從基準標記孔41h往Z方向(對準相機AC方向)射出。對準標記形成光源42j是由紫外光LED 組成,會從對準標記孔42h直接往Z方向射出。基準標記形成光源41j與對準標記形成光源42j固定於電路基板43(第4圖)上,此電路基板43與反射元件41k配設於形成在桌本體15Q的凹部15r內。 Each reference mark 41 is formed by one reference mark hole (through-hole) 41h formed in the cover plate 15P and a reference mark forming light source 41j supported by the table top body 15Q. The mark formation means 42 are formed by a plurality of (four through-holes) alignment mark holes 42h formed in the cover plate 15P and four corresponding to each alignment mark hole 42h and supported by the desktop body 15Q. The alignment mark forming light source 42j is formed. The reference mark forming light source 41j is composed of a red (visible light) LED, and the light reflected by the reflective element 41k is emitted from the reference mark hole 41h in the Z direction (aligned with the camera AC direction). Alignment mark forming light source 42j is made of ultraviolet LED The composition will be directly emitted from the alignment mark hole 42h in the Z direction. The reference mark forming light source 41j and the alignment mark forming light source 42j are fixed to a circuit board 43 (FIG. 4), and the circuit board 43 and the reflective element 41k are disposed in a recess 15r formed in the table body 15Q.

1個基準標記孔41h(基準標記形成光源41j)與4個對準標記孔42h(對準標記形成光源42j)在X方向上排成一列,使得搭載於曝光描繪部30的同一對準相機AC的拍攝較為容易。如第3、4圖所示,圖示例中,標記形成手段42的各對準標記孔42h的間隔相同,基準標記41相對於這些標記形成手段42,以對準標記孔42h之間的間隔以上的距離分離。 One reference mark hole 41h (reference mark forming light source 41j) and four alignment mark holes 42h (alignment mark forming light source 42j) are aligned in the X direction so that the same alignment camera AC mounted on the exposure drawing section 30 Shooting is easier. As shown in FIGS. 3 and 4, in the example of the figure, the intervals of the alignment mark holes 42 h of the mark forming means 42 are the same. The reference marks 41 are aligned with the intervals of the mark holes 42 h with respect to these mark forming means 42. The above distances are separated.

1個基準標記41與4個標記形成手段42的位置關係在描繪桌15上固定。相互的位置關係(XY平面上的座標系統)能夠嚴格地被辨識。因此,對準相機AC拍攝標記形成手段42(基準標記41)求出標記位置等同於求出基準標記41(由標記形成手段42形成的對準標記)的位置。 The positional relationship between one reference mark 41 and four mark forming means 42 is fixed on the drawing table 15. The mutual positional relationship (coordinate system on the XY plane) can be strictly identified. Therefore, finding the mark position by the alignment camera AC shooting mark formation means 42 (reference mark 41) is equivalent to finding the position of the reference mark 41 (alignment mark formed by the mark formation means 42).

又,描繪桌15上的四個角落的基準標記41配置到比標記形成手段42更外側的位置,在基準標記41與標記形成手段42之間有基板壓條17。基板壓條17要支持被載置於描繪桌15上的基板W的緣部(X方向的兩側緣部),因此至少相對於描繪桌15的表面可在接離方向(Z方向)上移動。 In addition, the reference marks 41 that depict the four corners on the table 15 are arranged outside the mark formation means 42, and a substrate bead 17 is provided between the reference marks 41 and the mark formation means 42. Since the substrate bead 17 supports the edges of the substrate W placed on the drawing table 15 (both edges in the X direction), at least the surface of the drawing table 15 can be moved in the separation direction (Z direction).

載置於描繪桌15上的基板W的平面尺寸有許多種,因此基板壓條17也可在X方向上移動為佳。然而,基板W不會超出基板壓條17而突出至基準標記41方向。也就是說,不論載置於描繪桌15上的基板W的大小,基準標記41都不會被基 板W遮蓋。相對於此,不論基板W的大小,標記形成手段42的4個對準標記孔42h(的至少一個)會被基板W遮蓋。 Since there are many kinds of planar sizes of the substrate W placed on the drawing table 15, the substrate bead 17 can also be moved in the X direction. However, the substrate W does not protrude beyond the substrate bead 17 to the direction of the reference mark 41. That is, regardless of the size of the substrate W placed on the drawing table 15, the reference mark 41 will not be replaced by the base mark. Plate W is covered. In contrast, regardless of the size of the substrate W, the four alignment mark holes 42h (at least one) of the mark forming means 42 are covered by the substrate W.

描繪桌15的蓋板15P的表面如第2圖概要顯示,開口了如習知的無數的吸引孔15v,這些吸引孔15v透過設置於桌本體15Q的吸引連接器15c而連接到控制裝置18與真空源19。 The surface of the cover plate 15P depicting the table 15 is schematically shown in FIG. 2, and a myriad of suction holes 15v are opened as is known in the art. These suction holes 15v are connected to the control device 18 and the suction connector 15c provided on the table body 15Q. Vac source 19.

藉由上述構造的描繪裝置100,以例如以下的步驟對基板W的正反面進行圖樣的描繪。做為被描繪裝置100描繪於基板W的正反面的圖樣(例如電路圖樣),為了方便(容易理解),假設在基板W的表面描繪如第5圖所示的「P」的文字L,在背面描繪如第6圖所示的外框F。又,假設桌本體15Q與蓋板15P預先以正規的位置關係固定,做為描繪桌15被支持於基底11(軌道14)上。 With the drawing device 100 having the above structure, for example, the front and back surfaces of the substrate W are patterned in the following steps. As a pattern (for example, a circuit pattern) drawn on the front and back sides of the substrate W by the drawing device 100, for convenience (easy understanding), it is assumed that the letter "P" shown in FIG. 5 is drawn on the surface of the substrate W, and The outer frame F shown in FIG. 6 is depicted on the back. In addition, it is assumed that the table body 15Q and the cover plate 15P are fixed in a regular positional relationship in advance, and the table 15 is supported on the base 11 (rail 14) as a drawing.

第1步驟:將基板W載置於描繪桌15的蓋板15P上。當基板W被未圖示的搬運裝置載置的情況下,因為是預先對準好(決定預備位置)的基板W被載置,所以在這個時間點基板的大略位置已經決定。如果是作業者用手載置基板W的情況下,就藉由設置於蓋板15P的對齊標準物來決定位置。因此為了因應以手進行設置的情況,也可以在描繪桌15(蓋板15P或桌本體15Q)設置決定基板位置用的冶具。決定基板位置用的冶具例如畫在蓋板15P上的線,或者是位置決定插銷等。基板W上的XY座標系統會因為對準標記(由對準相機AC拍攝的描繪桌15上的4個基準標記41的位置及4個標記形成手段42所形成)的位置而定,所以不需要將基板W對蓋板15P做嚴格的位置配合。 Step 1: The substrate W is placed on the cover plate 15P of the drawing table 15. When the substrate W is placed on a conveying device (not shown), the substrate W is aligned in advance (determining the preliminary position), and therefore the approximate position of the substrate is determined at this point in time. When the operator places the substrate W by hand, the position is determined by an alignment standard provided on the cover plate 15P. Therefore, in order to respond to the setting by hand, a drawing tool for determining the position of the substrate may be provided on the drawing table 15 (the cover plate 15P or the table body 15Q). The tool for determining the position of the substrate is, for example, a line drawn on the cover plate 15P, or a position determining pin. The XY coordinate system on the substrate W is determined by the positions of the alignment marks (the positions of the four reference marks 41 and the four mark forming means 42 on the drawing table 15 taken by the alignment camera AC), so it is not necessary The substrate W is strictly matched with the cover plate 15P.

第2步驟:載置於蓋板15P的基板W藉由吸引孔15v、控制裝置18、真空源19而被真空吸附,又被基板壓條17所箝制。基板壓條17移動到預先指定的位置後,將基板W壓到蓋板15P上。 Second step: The substrate W placed on the cover plate 15P is vacuum-adsorbed by the suction hole 15v, the control device 18, and the vacuum source 19, and clamped by the substrate bead 17. After the substrate bead 17 is moved to a predetermined position, the substrate W is pressed onto the cover plate 15P.

第3步驟:描繪桌15及滑動部13移動,對準相機AC拍攝描繪桌15上的4個位置的基準標記41的影像(點標記)(對準相機AC相對移動於各基準標記41上)。也就是說,基準標記形成光源41j發出的紅色LED光被反射元件41k反射後從基準標記孔41h射出,對準相機AC伴隨著描繪桌15在X方向移動而辨識出4個基準標記41(第5圖)。對準相機AC拍攝的4個基準標記41的位置資訊會傳送到位置決定裝置,以描繪桌15上的基準標記41定出XY座標系統。 Step 3: The drawing table 15 and the sliding part 13 are moved, and the image AC (dot mark) of the reference mark 41 at the four positions on the table 15 is shot with the camera AC (the alignment camera AC moves relative to each reference mark 41) . In other words, the red LED light emitted by the reference mark forming light source 41j is reflected by the reflecting element 41k and emitted from the reference mark hole 41h. The alignment camera AC recognizes the four reference marks 41 as the drawing table 15 moves in the X direction (No. Figure 5). The position information of the four fiducial marks 41 taken by the camera AC is transmitted to the position determining device, and the XY coordinate system is determined by drawing the fiducial marks 41 on the table 15.

第4步驟:標記形成手段42的4個對準標記形成光源42j的任一者對基板W的背面(第2面)照射紫外光,形成對準標記孔42h形狀的自發色影像(對準標記AM(第6圖))。使用複數標記形成手段42中的哪一個進行照射會根據基板尺寸(利用元件清單等)來決定。被選擇的標記形成手段42以外的光源42j不會發光。照射時間的一個例子是約10秒。此外,這個第4步驟能夠與其他步驟平行進行,又或者在第3步驟開始前進行。 Step 4: Either of the four alignment mark formation light sources 42j of the mark formation means 42 irradiates the back surface (second surface) of the substrate W with ultraviolet light to form a spontaneous color image (alignment mark) in the shape of the alignment mark hole 42h AM (Figure 6)). Which of the plurality of mark formation means 42 is used for irradiation is determined according to the substrate size (using a component list, etc.). Light sources 42j other than the selected mark forming means 42 do not emit light. An example of the irradiation time is about 10 seconds. In addition, this fourth step can be performed in parallel with other steps or before the third step is started.

第5步驟:位置決定裝置從根據基準標記41的描繪桌15上的XY座標系統,訂定出根據基板背面的對準標記AM的XY座標系統。雖然也可以使用根據基準標記41而定的XY座標系統,但因為描繪是在基板W上進行,所以使用根據基板W上 的對準標記AM而定的XY座標系統為佳。然後,因應基板背面的對準標記AM的形成位置,使圖樣描繪位置與基板位置彼此配合。此位置的配合能夠藉由曝光描繪部30修正描繪圖樣資料來補償描繪位置來實施,或者是,將描繪桌15移動於XYθ方向來實施。θ方向是平行於Z方向為軸的旋轉方向。這種位置的配合技術廣為周知,能夠因應需要而採用適當的方法。 Step 5: The position determining device determines an XY coordinate system based on the alignment mark AM on the back surface of the substrate from the XY coordinate system on the drawing table 15 based on the reference mark 41. Although an XY coordinate system based on the reference mark 41 can also be used, since the drawing is performed on the substrate W, the The XY coordinate system based on the alignment mark AM is preferred. Then, according to the formation position of the alignment mark AM on the back surface of the substrate, the pattern drawing position and the substrate position are matched with each other. This position can be implemented by correcting the drawing pattern data by the exposure drawing unit 30 to compensate the drawing position, or by moving the drawing table 15 in the XYθ direction. The θ direction is a rotation direction parallel to the Z direction as an axis. Such a position matching technique is widely known, and an appropriate method can be adopted as required.

第6步驟:基板W的表面(第1面)進行圖樣(圖示例子為文字L)的描繪。圖樣的描繪式結由曝光描繪部30與描繪桌15(基板W)的相對移動來進行。本實施形態中,描繪桌15連續地移動於X方向時,曝光描繪部30將描繪光連續地照射基板W。圖樣的描繪可藉由周知的多重曝光技術來實施。 Step 6: The surface (first surface) of the substrate W is drawn with a pattern (the example shown in the figure is the character L). The drawing knot of the pattern is performed by the relative movement of the exposure drawing unit 30 and the drawing table 15 (the substrate W). In the present embodiment, when the drawing table 15 is continuously moved in the X direction, the exposure drawing unit 30 continuously irradiates the substrate W with the drawing light. The drawing of the pattern can be performed by a well-known multiple exposure technique.

第7步驟:將表面(第1面)的圖樣描繪結束後的基板W從描繪桌15搬出。翻轉被搬出的基板W,使背面(第2面)朝上。搬出及翻轉作業由未圖示的搬運裝置來實施,或者是由作業者用手實施。 Step 7: The substrate W after the drawing of the pattern on the front surface (the first surface) is removed from the drawing table 15. The unloaded substrate W is turned over so that the back surface (second surface) faces upward. The unloading and turning operations are carried out by a conveying device (not shown), or by the operator's hand.

第8步驟:描繪桌15的蓋板15P上載置翻轉的基板W(第6圖)。此時的描繪桌(描繪裝置)可以是與第1步驟相同的裝置,也可以是不同的描繪裝置。與第1步驟相同地,基板W在預先對準的狀態下被載置。 Step 8: The cover 15P of the table 15 is drawn to place the inverted substrate W (FIG. 6). The drawing table (drawing device) at this time may be the same device as in the first step, or may be a different drawing device. As in the first step, the substrate W is placed in a pre-aligned state.

第9步驟:與第2步驟相同地,載置於蓋板15P上的基板W被真空吸附,又被基板壓條17箝制固定。 Ninth step: As in the second step, the substrate W placed on the cover plate 15P is vacuum-adsorbed and clamped and fixed by the substrate bead 17.

第10步驟:對準相機AC相對於形成於基板W的背面(第2面)的對準標記AM的位置移動。藉由對準相機AC所具備的反射照明來拍攝對準標記AM,並將影像傳送給位置決 定裝置(第6圖)。 Step 10: The alignment camera AC moves relative to the position of the alignment mark AM formed on the back surface (second surface) of the substrate W. The alignment mark AM is captured with the reflected illumination of the alignment camera AC, and the image is transmitted to the position determination. 定 装置 (Figure 6).

第11步驟:位置決定裝置從對準相機AC送來的影像求出對準標記AM的位置,與第5步驟相同地,使圖樣描繪位置與基板位置互相配合(第6圖)。此時不只位置互相配合,也可以因應基板伸縮來修正描繪資料的形狀。這是因為表面(第1面)曝光描繪後溫度變化等的影像會使基板伸縮,因此修正因為這種變形導致的圖樣描繪位置的誤差。 Step 11: The position determining device obtains the position of the alignment mark AM from the image sent from the alignment camera AC, and matches the pattern drawing position with the substrate position in the same manner as in the step 5 (FIG. 6). At this time, not only the positions are matched with each other, but also the shape of the drawing data can be corrected according to the expansion and contraction of the substrate. This is because an image such as a temperature change after the surface (the first surface) is exposed and drawn will cause the substrate to expand and contract. Therefore, an error in the drawing position due to such deformation is corrected.

第12步驟:與第6步驟相同地,對基板W的背面(第2面)進行圖樣(外框F)的描繪(第6圖)。 Twelfth step: In the same manner as in the sixth step, a drawing (outer frame F) of the back surface (second surface) of the substrate W is drawn (FIG. 6).

第13步驟:從描繪桌15上搬出背面(第2面)的圖像已描繪結束後的基板W,移動至下一階段的步驟。 Step 13: A step of moving the substrate W from which the image on the back surface (second surface) has been drawn from the drawing table 15 to the next stage.

以上的實施形態中,對於每1個基準標記41設置複數(4個)標記形成手段42,但因應基板W的平面尺寸,也可以對於每1個基準標記41對應設置1個標記形成手段42。設置複數的標記形成手段42的情況下,在以上的實施形態中是排成一列,但並不一定要排成一列,只要排列複數的標記形成手段42時,能夠因應基板尺寸使對準標記形成在相對於基準標記的既定位置的話即可。 In the above embodiment, plural (four) mark forming means 42 are provided for each reference mark 41, but one mark forming means 42 may be provided corresponding to each reference mark 41 in accordance with the planar size of the substrate W. When a plurality of mark formation means 42 are provided, they are arranged in a row in the above embodiment, but they are not necessarily arranged in a row. When the plurality of mark formation means 42 are arranged, alignment marks can be formed according to the size of the substrate. It only needs to be at a predetermined position relative to the fiducial mark.

又,也可以因應基板W來更換蓋板15P。這樣的話,能夠對應更多種類的基板與標記位置。又,基準標記41與標記形成手段42的光源可以不是LED,光的波長也可以因應塗布或貼附於基板的感光材料的感度來適當地選擇能夠充分形成自發色影像的波長。基準標記41能夠由對準相機AC所拍攝而判斷出位置的話,也可以是非發光性(例如印刷物)。 The cover plate 15P may be replaced in accordance with the substrate W. In this way, more types of substrates and mark positions can be supported. In addition, the light sources of the reference mark 41 and the mark forming means 42 may not be LEDs, and the wavelength of the light may be appropriately selected according to the sensitivity of the photosensitive material applied or attached to the substrate. The reference mark 41 may be non-luminous (for example, printed matter) if the position can be determined by shooting with the alignment camera AC.

Claims (5)

一種描繪裝置,包括:描繪桌,載置基板;以及曝光描繪部,相對於該描繪桌移動,描繪圖樣於該描繪桌上的基板,其中該描繪桌上包括:複數的基準標記,用以設定相對於該曝光描繪部的位置基準;以及複數的標記形成手段,用以形成對準標記於載置在該描繪桌上的基板的背面,並且位於相對於該各基準標記的特定位置,其中該描繪桌具備桌本體、以覆蓋該桌本體的方式固定於該桌本體上的蓋板,該標記形成手段由穿設於該蓋板的至少一貫通孔、以及固定於該桌本體的標記形成光源所組成,該標記形成光源從該貫通孔射出該貫通孔的形狀的標記形成光。A drawing device includes: a drawing table on which a substrate is placed; and an exposure drawing section that moves relative to the drawing table and draws a substrate on the drawing table, wherein the drawing table includes: a plurality of reference marks for setting A position reference with respect to the exposure drawing portion; and a plurality of mark forming means for forming an alignment mark on a back surface of the substrate placed on the drawing table, and located at a specific position with respect to each reference mark, wherein The drawing table includes a table body, a cover plate fixed to the table body so as to cover the table body, and the mark forming means is formed by at least one through hole penetrating through the cover plate and a mark fixed to the table body to form a light source. In the composition, the mark forming light source emits the mark forming light in a shape of the through hole from the through hole. 如申請專利範圍第1項所述之描繪裝置,其中該基準標記具有穿設於該蓋板的至少一貫通孔、以及固定於該桌本體的可見光源,其中該可見光源從該貫通孔射出可見光以做為點標記。The drawing device according to item 1 of the scope of patent application, wherein the fiducial mark has at least one through hole penetrating through the cover plate, and a visible light source fixed to the table body, wherein the visible light source emits visible light from the through hole. Take as a point mark. 如申請專利範圍第2項所述之描繪裝置,其中形成該標記形成手段的該貫通孔具有複數個沿著該描繪桌及該曝光描繪部的相對移動方向以既定的間隔穿設於該蓋板,該桌本體具備從該複數的貫通孔中按照基板尺寸而選擇的貫通孔射出該標記形成光的該標記形成光源。The drawing device according to item 2 of the scope of patent application, wherein the through-hole forming the mark forming means has a plurality of through-holes formed at predetermined intervals along a relative movement direction of the drawing table and the exposure drawing portion. The table body includes the mark-forming light source that emits the mark-forming light from the through-holes selected according to the substrate size from the plurality of through-holes. 如申請專利範圍第3項所述之描繪裝置,其中該基準標記與該標記形成手段位於載置在該描繪桌上的基板周緣部的相對的2邊,並分別各具有一對。The drawing device according to item 3 of the scope of patent application, wherein the reference mark and the mark forming means are located on two opposite sides of the peripheral edge portion of the substrate placed on the drawing table, and each has a pair. 如申請專利範圍第1至4項任一項所述之描繪裝置,其中該曝光描繪部具有拍攝該基準標記或對準標記的拍攝手段,對於該基板表面的圖樣描繪會在依據該拍攝手段拍攝的基準標記位置資訊而設定的座標系統下來實行,將該基板正反面翻轉後對於該基板背面的圖樣描繪會在依據該拍攝手段拍攝的對準標記位置資訊而設定的座標系統下來實行。The drawing device according to any one of claims 1 to 4, wherein the exposure drawing section has a shooting means for shooting the reference mark or the alignment mark, and the pattern drawing of the surface of the substrate is shot in accordance with the shooting method. The coordinate system set based on the position information of the fiducial mark is implemented. After the front and back sides of the substrate are reversed, the drawing of the pattern on the back of the substrate will be implemented by the coordinate system set according to the position information of the alignment mark captured by the photographing means.
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