JP2009168507A - Method and apparatus for detecting edge position of transparent substrate - Google Patents

Method and apparatus for detecting edge position of transparent substrate Download PDF

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JP2009168507A
JP2009168507A JP2008004524A JP2008004524A JP2009168507A JP 2009168507 A JP2009168507 A JP 2009168507A JP 2008004524 A JP2008004524 A JP 2008004524A JP 2008004524 A JP2008004524 A JP 2008004524A JP 2009168507 A JP2009168507 A JP 2009168507A
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substrate
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mark
edge position
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JP4960266B2 (en
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Tadashi Kanasashi
理 金指
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NSK Ltd
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<P>PROBLEM TO BE SOLVED: To provide an edge position detection method and an edge position detection apparatus of transparent substrates capable of detecting the edge positions of transparent substrates without contact nor having to apply any special processing to the substrates and reducing costs. <P>SOLUTION: The edge position detection apparatus 10 of a transparent substrate W is provided with a substrate holding part 11 capable of holding the transparent substrate W and provided with marks 12 extending in directions intersecting with edges of the substrate W; an imaging means 13 for imaging the marks 12 and the substrate W through the use of light refraction; and a position detection means 14 for detecting the edge positions of the substrate W on the basis of positional information on border parts between images of marks 12 imaged by the imaging means 13 through the substrate W and images of marks 12 imaged outside the edges of the substrate W. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、透明基板のエッジ位置検出方法及びエッジ位置検出装置に関し、例えば、近接露光において、液晶表示装置用の透明な基板をプリアライメントする際の該基板のエッジ位置検出方法及びエッジ位置検出装置に関する。   The present invention relates to a transparent substrate edge position detection method and an edge position detection device, and, for example, an edge position detection method and an edge position detection device for a transparent substrate for liquid crystal display devices in proximity exposure when pre-aligning the transparent substrate. About.

近接露光は、表面に感光剤を塗布した透明なガラス基板を近接露光装置の基板ステージ上に保持すると共に、該基板をマスクステージのマスク保持枠に保持されたマスクに接近させて両者のすき間を例えば数10μm〜数100μmにし、次いで、マスクの基板から離間する側から照射装置によって露光用の光をマスクに向けて照射することにより該基板上に該マスクに描かれたパターンを露光転写するようにしたものである。   In the proximity exposure, a transparent glass substrate coated with a photosensitive agent on the surface is held on the substrate stage of the proximity exposure apparatus, and the substrate is brought close to the mask held on the mask holding frame of the mask stage so that a gap between the two is obtained. For example, the pattern drawn on the mask is exposed and transferred onto the substrate by irradiating the exposure light toward the mask with an irradiation device from the side away from the substrate of the mask. It is a thing.

ところで、基板は露光装置に搬送されてそれぞれ基板ステージに保持されるが、搬送前において予め基板ステージに対する基板の位置決めを行うプリアライメントがなされる。即ち、基板ステージに対する基板の高精度の位置決めは、露光装置に搬入後に行われるのであるが、露光装置への基板の搬入位置のずれ量が大きすぎると、この高精度な位置決めが困難になるか、或いは長時間を要することとなる。このようなことを避けるために、プリアライメントが行われる。   By the way, the substrate is transported to the exposure apparatus and held on the substrate stage, but pre-alignment for positioning the substrate with respect to the substrate stage in advance is performed before the transport. That is, high-precision positioning of the substrate with respect to the substrate stage is performed after loading into the exposure apparatus. If the amount of shift of the substrate loading position into the exposure apparatus is too large, is this high-precision positioning difficult? Or it will take a long time. In order to avoid this, pre-alignment is performed.

このプリアライメントに際しては、プリアライメント装置の基板保持台に保持された基板の複数のエッジの位置を検出して、該検出結果から基板のずれ量を求め、このずれ量に応じて基板保持台を駆動手段により移動させて、露光装置の基板ステージに対する基板の相対的な位置決めを行なう。そして、プリアライメント装置でプリアライメントされた基板はローダで露光装置に搬送されて、基板ステージ上に吸着保持される。   At the time of this pre-alignment, the positions of a plurality of edges of the substrate held on the substrate holding table of the pre-alignment apparatus are detected, and the deviation amount of the substrate is obtained from the detection result, and the substrate holding table is set according to the deviation amount. The substrate is moved relative to the substrate stage of the exposure apparatus by the driving means. Then, the substrate pre-aligned by the pre-alignment apparatus is transported to the exposure apparatus by the loader, and is sucked and held on the substrate stage.

また、液晶カラーフィルタ用の基板のエッジ位置を検出する際には、基板の割れ防止や発塵防止のため、基板に非接触でエッジの位置を検出する必要である。
基板のエッジ位置を非接触で検出する方法としては、例えば、基板のエッジに向けて上方から発光センサにより光を照射して、該照射光を基板のエッジ近傍の下方に配置された受光センサにより受光して、該受光結果に基づいて基板のエッジ位置を検出する方法が提案されている(例えば、特許文献1参照)。
Further, when detecting the edge position of the substrate for the liquid crystal color filter, it is necessary to detect the edge position without contact with the substrate in order to prevent the substrate from cracking and dust generation.
As a method for detecting the edge position of the substrate in a non-contact manner, for example, light is emitted from above by a light emitting sensor toward the edge of the substrate, and the irradiated light is received by a light receiving sensor disposed below the edge of the substrate. A method of receiving light and detecting the edge position of the substrate based on the light reception result has been proposed (for example, see Patent Document 1).

また、基板保持台に保持された基板のエッジをカメラ等により撮像して、該撮像画像に基づいて基板のエッジ位置を検出する方法が知られている。
特開平5−326361号公報
Further, a method is known in which the edge of the substrate held on the substrate holding table is imaged by a camera or the like and the edge position of the substrate is detected based on the captured image.
JP-A-5-326361

しかし、上記特許文献1では、基板の上下に発光センサと受光センサをそれぞれ配置する必要があるため、センサ数が多くなってコスト高になる。また、光を透過させるために、基板保持台は基板より小さく設計されており、エッジ部分の保持が不安定となる可能性がある。   However, in Patent Document 1, since it is necessary to dispose the light emitting sensor and the light receiving sensor above and below the substrate, the number of sensors increases and the cost increases. Further, since the substrate holding table is designed to be smaller than the substrate in order to transmit light, the holding of the edge portion may become unstable.

さらに、基板のエッジをカメラ等により撮像する場合は、透明の基板ではエッジが光学的に見えないため、該エッジに面取り加工を施すことで、エッジを光学的に見えるようにする必要があり、上記同様に、コスト高になる。   Furthermore, when imaging the edge of the substrate with a camera or the like, since the edge is not optically visible on a transparent substrate, it is necessary to make the edge optically visible by chamfering the edge. Similar to the above, the cost increases.

本発明は、このような不都合を解消するためになされたものであり、その目的は、透明な基板のエッジ位置を該基板に特別な加工を施すことなく非接触で検出することができるとともに、低コスト化を図ることができる透明基板のエッジ位置検出方法及びエッジ位置検出装置を提供することにある。   The present invention has been made to eliminate such inconveniences, and its purpose is to detect the edge position of a transparent substrate in a non-contact manner without performing special processing on the substrate, An object of the present invention is to provide a transparent substrate edge position detection method and an edge position detection apparatus capable of reducing the cost.

本発明の上記目的は、下記の構成により達成される。
(1) 基板保持部に保持される透明な基板のエッジ位置を検出する方法であって、
前記基板保持部に設けられたマークと交差する方向にエッジが延びるように、前記基板を前記基板保持部に保持する工程と、
前記マークと前記基板とを光の屈折を利用して撮像し、前記基板を通した前記マークの撮像画像と該基板のエッジ外での前記マークの撮像画像との境部の位置情報を基に前記基板のエッジ位置を検出する工程と、
を備えることを特徴とする透明基板のエッジ位置検出方法。
(2) 前記基板保持部には、矩形上の前記基板の一辺のエッジが交差可能な少なくとも2つの前記マークと、該一辺と直交する他辺のエッジが交差可能な少なくとも1つの前記マークが設けられており、
前記エッジ位置検出工程において、前記少なくとも3つのマークを前記基板と共にそれぞれ撮像して、前記基板のエッジ位置を検出することで、前記基板の位置が測定されることを特徴とする請求項1に記載の透明基板のエッジ位置検出方法。
(3) 透明な基板を保持可能であるとともに、前記保持された基板のエッジに対して交差するように延びるマークを有する基板保持部と、
前記マークと前記基板とを光の屈折を利用して撮像する撮像手段と、
該撮像手段による前記基板を通した前記マークの撮像画像と該基板のエッジ外での前記マークの撮像画像との境部の位置情報を基に前記基板のエッジ位置を検出する位置検出手段と、
を備えることを特徴とする透明基板のエッジ位置検出装置。
(4) 前記基板保持部には、矩形上の前記基板の一辺のエッジが交差可能な少なくとも2つの前記マークと、該一辺と直交する他辺のエッジが交差可能な少なくとも1つの前記マークが設けられており、
前記撮像手段は、前記基板保持部の基板保持面と直交する方向に対して傾斜して配置され、前記少なくとも3つのマークと前記基板とを光の屈折を利用してそれぞれ撮像する少なくとも3つの撮像手段を有し、
前記位置検出手段は、前記少なくとも3つの撮像手段によって得られた前記位置情報を基に、前記基板の位置を測定することを特徴とする(3)に記載の透明基板のエッジ位置検出装置。
(5)前記透明基板は、液晶表示装置用の基板であり、
前記基板保持部、前記撮像手段、前記位置検出手段は、前記基板のプリアライメントを行うプリアライメント装置に設けられることを特徴とする(3)又は(4)に記載の透明基板のエッジ位置検出装置。
The above object of the present invention is achieved by the following configurations.
(1) A method for detecting an edge position of a transparent substrate held by a substrate holding unit,
Holding the substrate on the substrate holding portion such that an edge extends in a direction intersecting with a mark provided on the substrate holding portion;
The mark and the substrate are imaged using light refraction, and based on positional information of a boundary between the image of the mark passing through the substrate and the image of the mark outside the edge of the substrate Detecting an edge position of the substrate;
A method for detecting an edge position of a transparent substrate.
(2) The substrate holding portion is provided with at least two marks that can intersect one edge of the substrate on a rectangle and at least one mark that can intersect another edge that is orthogonal to the one side. And
2. The position of the substrate is measured by detecting the edge position of the substrate by imaging each of the at least three marks together with the substrate in the edge position detecting step. Edge position detection method for transparent substrate.
(3) a substrate holding part that can hold a transparent substrate and has a mark that extends so as to intersect with an edge of the held substrate;
Imaging means for imaging the mark and the substrate using refraction of light;
Position detecting means for detecting an edge position of the substrate based on position information of a boundary portion between an imaged image of the mark passing through the substrate by the imaging means and an imaged image of the mark outside the edge of the substrate;
A device for detecting an edge position of a transparent substrate.
(4) The substrate holding portion is provided with at least two marks that can intersect one edge of the substrate on a rectangle and at least one mark that can intersect another edge that is orthogonal to the one side. And
The imaging means is arranged to be inclined with respect to a direction orthogonal to the substrate holding surface of the substrate holding unit, and images at least three marks and the substrate using light refraction, respectively. Having means,
The position detection means measures the position of the substrate based on the position information obtained by the at least three image pickup means, and the edge position detection device for a transparent substrate according to (3).
(5) The transparent substrate is a substrate for a liquid crystal display device,
The transparent substrate edge position detection apparatus according to (3) or (4), wherein the substrate holding unit, the imaging unit, and the position detection unit are provided in a pre-alignment apparatus that performs pre-alignment of the substrate. .

本発明の透明基板のエッジ位置検出方法及びエッジ位置検出装置によれば、マークと基板とを光の屈折を利用して撮像し、基板を通したマークの撮像画像と基板のエッジ外でのマークの撮像画像との境部の位置情報を基に基板のエッジ位置を検出するので、透明な基板のエッジ位置を該基板に特別な加工を施すことなく非接触で検出することができるとともに、低コスト化を図ることができる。   According to the edge position detection method and the edge position detection apparatus of the transparent substrate of the present invention, the mark and the substrate are imaged using refraction of light, and the captured image of the mark passing through the substrate and the mark outside the edge of the substrate Since the edge position of the substrate is detected based on the position information of the boundary with the captured image, the edge position of the transparent substrate can be detected in a non-contact manner without performing special processing on the substrate. Cost can be reduced.

以下、本発明の透明基板のエッジ位置検出方法及びエッジ位置検出装置に係る一実施形態について、図面を参照して詳細に説明する。図1は本発明の透明基板のエッジ位置検出装置が適用されるプリアライメント装置と近接露光装置とローダとの配置を示す概略平面図、図2は近接露光装置の一例を示す側面図、図3及び図4は、プリアライメント装置を示す図である。   Hereinafter, an embodiment according to an edge position detection method and an edge position detection apparatus of a transparent substrate of the present invention will be described in detail with reference to the drawings. FIG. 1 is a schematic plan view showing the arrangement of a pre-alignment apparatus, a proximity exposure apparatus and a loader to which the edge position detection apparatus for a transparent substrate of the present invention is applied, FIG. 2 is a side view showing an example of the proximity exposure apparatus, and FIG. 4 is a diagram showing a pre-alignment apparatus.

図1に示すように、本実施形態の透明基板のエッジ位置検出装置10を備えるプリアライメント装置20は、近接露光装置PEの外側に配置され、不図示のストッカからローダ40により搬入された透明な基板Wを保持して該基板Wのプリアライメントを行うものであり、プリアライメントされた基板Wはローダ40で近接露光装置PEに搬送されて後述する基板ステージ3上に吸着保持される。   As shown in FIG. 1, the pre-alignment apparatus 20 including the transparent substrate edge position detection apparatus 10 according to the present embodiment is disposed outside the proximity exposure apparatus PE, and is a transparent substrate carried by a loader 40 from a stocker (not shown). The substrate W is held and pre-alignment of the substrate W is performed. The pre-aligned substrate W is transported to the proximity exposure apparatus PE by a loader 40 and sucked and held on a substrate stage 3 described later.

まず、説明の便宜上、近接露光装置PEから説明すると、この近接露光装置PEは、図2に示すように、被露光材としての基板Wより小さいマスクMを用い、該マスクMをマスクステージ1のマスク保持枠2で保持すると共に、基板Wを基板ステージ3で保持する。そして、この状態で基板ステージ3をマスクMに対してX軸方向とY軸方向の二軸方向にステップ移動させて各ステップ毎にマスクMと基板Wとを近接して対向配置し、照射手段4からパターン露光用の光をマスクMに向けて照射することにより、マスクMの複数のパターンを基板W上に露光転写する。   First, for convenience of explanation, the proximity exposure apparatus PE will be described. As shown in FIG. 2, the proximity exposure apparatus PE uses a mask M smaller than the substrate W as an exposure material, and uses the mask M of the mask stage 1. While being held by the mask holding frame 2, the substrate W is held by the substrate stage 3. In this state, the substrate stage 3 is moved stepwise with respect to the mask M in two axial directions, ie, the X-axis direction and the Y-axis direction, and the mask M and the substrate W are placed close to each other and opposed to each other. By irradiating light for pattern exposure from 4 toward the mask M, a plurality of patterns of the mask M are exposed and transferred onto the substrate W.

図2において符号5は装置ベースであり、この装置ベース5上には基板ステージ3をX軸方向にステップ移動させるためのX軸ステージ送り機構6が設置され、X軸ステージ送り機構6上には基板ステージ3をY軸方向にステップ移動させるためのY軸ステージ送り機構7が設置され、Y軸ステージ送り機構7上に基板ステージ3が設置されている。   In FIG. 2, reference numeral 5 denotes an apparatus base. On this apparatus base 5, an X-axis stage feed mechanism 6 for stepping the substrate stage 3 in the X-axis direction is installed, and on the X-axis stage feed mechanism 6 A Y-axis stage feed mechanism 7 for moving the substrate stage 3 stepwise in the Y-axis direction is installed, and the substrate stage 3 is installed on the Y-axis stage feed mechanism 7.

Y軸ステージ送り機構7と基板ステージ3の間には、基板ステージ3の単純な上下動作を行うことにより該基板ステージ3を予め設定した位置までマスクMと基板Wとのすき間の計測を行うことなく昇降させる上下粗動装置8と、基板ステージ3を上下に微動させてマスクMと基板Wとの対向面間のすき間を所定量に微調整する上下微動装置9とが設置されている。   Between the Y-axis stage feed mechanism 7 and the substrate stage 3, the clearance between the mask M and the substrate W is measured to a preset position by performing a simple vertical movement of the substrate stage 3. There are provided a vertical coarse movement device 8 that moves up and down and a vertical fine movement device 9 that finely moves the substrate stage 3 up and down to finely adjust the gap between the opposing surfaces of the mask M and the substrate W to a predetermined amount.

次に、図1、図3及び図4を参照して、エッジ位置検出装置10が搭載されたプリアライメント装置20について詳述する。プリアライメント装置20は、透明な基板Wを保持可能で、基台21に対してX,Y,θ(Z軸回りの揺動)方向に移動可能な基板保持部11を備える。基板保持台11の上面には、基板Wのエッジに対して交差する方向に延びる線状のマーク12が設けられている。   Next, the pre-alignment device 20 on which the edge position detection device 10 is mounted will be described in detail with reference to FIGS. The pre-alignment apparatus 20 includes a substrate holding unit 11 that can hold a transparent substrate W and can move in the X, Y, and θ (oscillation around the Z axis) directions with respect to the base 21. On the upper surface of the substrate holder 11, a linear mark 12 extending in a direction intersecting with the edge of the substrate W is provided.

図3に示すように、基板保持部11は、その下面に設けられた複数の連結部22を介して駆動テーブル23に連結されている。駆動テーブル23には、そのX方向一側面の中間部にX方向駆動機構24が、X方向両側面の端部側に一対のY方向駆動機構25,26がそれぞれ固定されている。そして、基板保持部11は、X方向駆動機構24、Y方向駆動機構25,26の各モータ24a,25a,26aをそれぞれ駆動することで、駆動テーブル23と共にX,Y,θ方向に移動する。   As shown in FIG. 3, the board | substrate holding | maintenance part 11 is connected with the drive table 23 via the several connection part 22 provided in the lower surface. In the drive table 23, an X-direction drive mechanism 24 is fixed to an intermediate portion on one side surface in the X direction, and a pair of Y-direction drive mechanisms 25 and 26 are fixed to end portions on both side surfaces in the X direction. The substrate holding unit 11 moves in the X, Y, and θ directions together with the drive table 23 by driving the motors 24a, 25a, and 26a of the X direction drive mechanism 24 and the Y direction drive mechanisms 25 and 26, respectively.

また、基板保持部11と駆動テーブル23との間には、上面に図示しない複数のピンが固定されたピン保持テーブル27が設けられている。ピン保持テーブル27には、図4に示すピン駆動機構28が取り付けられており、ピン駆動機構28のモータ28aを駆動することで、くの字型に曲がったアーム29を介してピン保持テーブル27をZ方向に駆動し、ピンを基板保持部11の上面から進退させる。   Further, a pin holding table 27 having a plurality of pins (not shown) fixed on the upper surface is provided between the substrate holding unit 11 and the drive table 23. A pin driving mechanism 28 shown in FIG. 4 is attached to the pin holding table 27. By driving a motor 28a of the pin driving mechanism 28, the pin holding table 27 is interposed via an arm 29 bent in a dogleg shape. Is driven in the Z direction, and the pin is advanced and retracted from the upper surface of the substrate holding part 11.

これにより、基板Wを載せたローダ40が、ピン上に基板Wを載置し、ピンの頭部に設けられた吸盤によって負圧で基板Wを吸着固定する。そして、ローダ40が退避した後、ピンを下降させて基板Wを基板保持部11に保持させている。   As a result, the loader 40 on which the substrate W is placed places the substrate W on the pins, and the substrate W is sucked and fixed by the suction cups provided on the heads of the pins with negative pressure. Then, after the loader 40 is retracted, the pins are lowered to hold the substrate W on the substrate holding unit 11.

また、マーク12は、基板Wが基板保持台11に正確に位置決めされた状態においては、基板WのY軸方向に沿うエッジに対して直交する方向に交差して延びてY軸方向に互いに離間して2箇所配置されるとともに、基板WのX軸方向に沿うエッジに対して直交する方向に交差して延びて1箇所配置されている。   Further, the mark 12 extends in a direction orthogonal to the edge along the Y-axis direction of the substrate W and is separated from each other in the Y-axis direction when the substrate W is accurately positioned on the substrate holding base 11. In addition, two places are arranged, and one place is arranged so as to cross and extend in a direction orthogonal to the edge along the X-axis direction of the substrate W.

また、基板保持台11の上方には、基板保持台11上のマーク12を斜め上方から撮像するカメラ(撮像手段)13が設けられている。カメラ13は、マーク12の数に対応して3台設置されており、3台のカメラ13は、その撮像光軸が対応するマーク12の基板Wと交差する位置近傍を指向するように配置されて、該マーク12と基板Wとを撮像する。   A camera (imaging means) 13 is provided above the substrate holding table 11 to image the marks 12 on the substrate holding table 11 obliquely from above. Three cameras 13 are installed corresponding to the number of marks 12, and the three cameras 13 are arranged so that their imaging optical axes are directed near the position where the corresponding mark 12 intersects the substrate W. Thus, the mark 12 and the substrate W are imaged.

また、これら3台のカメラ13は、基板Wを通したマーク12の撮像画像と基板Wのエッジ外でのマーク12の撮像画像との境部の位置情報を基に基板Wのエッジ位置を検出する制御装置14(位置検出手段)に連結されている。   The three cameras 13 detect the edge position of the substrate W based on the position information of the boundary between the captured image of the mark 12 that has passed through the substrate W and the captured image of the mark 12 outside the edge of the substrate W. Connected to the control device 14 (position detecting means).

図5は基板保持台11上のマーク12をカメラ13で撮像した際の画像を示す図であり、(a)は基板保持台11に基板Wが保持されていない状態でのマーク12の撮像画像を示す図、(b)は基板保持台11に基板Wが保持されている状態でのマーク12の撮像画像を示す図である。   FIG. 5 is a diagram illustrating an image when the mark 12 on the substrate holding table 11 is imaged by the camera 13, and (a) is a captured image of the mark 12 in a state where the substrate W is not held on the substrate holding table 11. FIG. 6B is a diagram illustrating a captured image of the mark 12 in a state where the substrate W is held on the substrate holding table 11.

図5(b)から判るように、基板保持台11に基板Wが保持されている状態においては、カメラ13による基板Wを通したマーク12の撮像画像は、透明な基板Wによる光の屈折作用により、基板Wのエッジ外でのマーク12の撮像画像に対してずれて見える。したがって、カメラ13による基板Wを通したマーク12の撮像画像と基板Wのエッジ外でのマーク12の撮像画像との境部を基板Wのエッジ位置として検出することができる。   As can be seen from FIG. 5B, in the state where the substrate W is held on the substrate holding table 11, the captured image of the mark 12 that has passed through the substrate W by the camera 13 is the light refracting action by the transparent substrate W. Thus, the image appears to be shifted from the captured image of the mark 12 outside the edge of the substrate W. Therefore, the boundary between the captured image of the mark 12 through the substrate W by the camera 13 and the captured image of the mark 12 outside the edge of the substrate W can be detected as the edge position of the substrate W.

この基板Wのエッジ位置の検出は、カメラ13により撮像された画像データを基に、制御装置14により実行される。また、制御装置14は、検出した基板Wのエッジ位置情報から予め設定された基板Wの基準位置に対するずれ量を算出するとともに、該ずれ量に応じて駆動機構24,25,26を駆動して基板保持台11をX,Y,θ(Z軸回りの揺動)方向に移動させ、基板Wの位置が基準位置となるように基板Wの位置補正を行なう。   The detection of the edge position of the substrate W is executed by the control device 14 based on the image data captured by the camera 13. Further, the control device 14 calculates a deviation amount with respect to a preset reference position of the substrate W from the detected edge position information of the substrate W, and drives the driving mechanisms 24, 25, and 26 according to the deviation amount. The position of the substrate W is corrected so that the position of the substrate W becomes the reference position by moving the substrate holder 11 in the X, Y, θ (oscillation around the Z axis) direction.

以上説明したように、本実施形態によれば、マーク12を透明な基板Wと共に撮像した際の基板Wを通したマーク12の撮像画像と基板Wのエッジ外でのマーク12の撮像画像との境部の位置情報を基に基板Wのエッジ位置を検出することができるので、透明な基板Wのエッジ位置を該基板Wのエッジに面取り等の特別な加工を施すことなく非接触で検出することができる。   As described above, according to the present embodiment, when the mark 12 is imaged together with the transparent substrate W, the captured image of the mark 12 through the substrate W and the captured image of the mark 12 outside the edge of the substrate W are displayed. Since the edge position of the substrate W can be detected based on the boundary position information, the edge position of the transparent substrate W is detected in a non-contact manner without performing special processing such as chamfering on the edge of the substrate W. be able to.

また、基板保持台11の上方に設置されたカメラ13による撮像データを基に透明な基板Wのエッジ位置を検出することができるので、従来のように、基板保持台11の下方に受光センサ等を配置しなくて済み、基板Wのエッジに面取り等の特別な加工を施す必要がないことと相まってコスト低減を図ることができる。   Further, since the edge position of the transparent substrate W can be detected based on the image data obtained by the camera 13 installed above the substrate holding table 11, a light receiving sensor or the like is provided below the substrate holding table 11 as in the prior art. In combination with the fact that no special processing such as chamfering is required on the edge of the substrate W, the cost can be reduced.

なお、本発明は、上記実施形態に例示したものに限定されるものではなく、本発明の要旨を逸脱しない範囲において適宜変更可能である。
例えば、上記実施形態では、プリアライメント装置20に本発明のエッジ位置検出装置を搭載した場合を例示したが、これに限定されず、近接露光装置や露光装置用のプリアライメント装置以外に本発明のエッジ位置検出装置を搭載するようにしてもよい。
また、本発明の基板は、透明な基板であればよく、液晶表示装置用としては、上述したカラーフィルタ基板だけでなく、アレイ基板であってもよい。
In addition, this invention is not limited to what was illustrated to the said embodiment, In the range which does not deviate from the summary of this invention, it can change suitably.
For example, in the above embodiment, the case where the edge position detection device of the present invention is mounted on the pre-alignment device 20 is illustrated, but the present invention is not limited to this, and the present invention is not limited to a proximity exposure device or a pre-alignment device for an exposure device. You may make it mount an edge position detection apparatus.
The substrate of the present invention may be a transparent substrate, and for a liquid crystal display device, not only the above-described color filter substrate but also an array substrate.

本発明の実施の形態の一例である透明基板のエッジ位置検出装置を備えるプリアライメント装置と近接露光装置とローダとの配置を示す概略平面図である。It is a schematic plan view which shows arrangement | positioning of a pre-alignment apparatus provided with the edge position detection apparatus of the transparent substrate which is an example of embodiment of this invention, a proximity exposure apparatus, and a loader. 近接露光装置の一例を説明するための図である。It is a figure for demonstrating an example of a proximity exposure apparatus. プリアライメント装置の側面図である。It is a side view of a pre-alignment apparatus. プリアライメント装置を基台側からみた下面図である。It is the bottom view which looked at the pre-alignment apparatus from the base side. 基板保持台に設けられたマークをカメラで撮像した際の画像を示す図であり、(a)は基板保持台に基板が保持されていない状態でのマークの撮像画像を示す図、(b)は基板保持台に基板が保持されている状態でのマークの撮像画像を示す図である。It is a figure which shows the image at the time of imaging the mark provided in the board | substrate holding stand with a camera, (a) is a figure which shows the picked-up image of the mark in the state in which the board | substrate is not hold | maintained at a board | substrate holding stand, (b). FIG. 5 is a diagram showing a captured image of a mark in a state where the substrate is held on the substrate holding table.

符号の説明Explanation of symbols

W 基板(透明基板)
10 エッジ位置検出装置
11 基板保持台(基板保持部)
12 マーク
13 カメラ(撮像手段)
14 制御装置(位置検出手段)
W substrate (transparent substrate)
10 Edge position detection device 11 Substrate holder (substrate holder)
12 mark 13 camera (imaging means)
14 Control device (position detection means)

Claims (5)

基板保持部に保持される透明な基板のエッジ位置を検出する方法であって、
前記基板保持部に設けられたマークと交差する方向にエッジが延びるように、前記基板を前記基板保持部に保持する工程と、
前記マークと前記基板とを光の屈折を利用して撮像し、前記基板を通した前記マークの撮像画像と該基板のエッジ外での前記マークの撮像画像との境部の位置情報を基に前記基板のエッジ位置を検出する工程と、
を備えることを特徴とする透明基板のエッジ位置検出方法。
A method for detecting the edge position of a transparent substrate held by a substrate holding unit,
Holding the substrate on the substrate holding portion such that an edge extends in a direction intersecting with a mark provided on the substrate holding portion;
The mark and the substrate are imaged using light refraction, and based on positional information of a boundary between the image of the mark passing through the substrate and the image of the mark outside the edge of the substrate Detecting an edge position of the substrate;
A method for detecting an edge position of a transparent substrate.
前記基板保持部には、矩形上の前記基板の一辺のエッジが交差可能な少なくとも2つの前記マークと、該一辺と直交する他辺のエッジが交差可能な少なくとも1つの前記マークが設けられており、
前記エッジ位置検出工程において、前記少なくとも3つのマークを前記基板と共にそれぞれ撮像して、前記基板のエッジ位置を検出することで、前記基板の位置が測定されることを特徴とする請求項1に記載の透明基板のエッジ位置検出方法。
The substrate holding portion is provided with at least two marks that can intersect one edge of the substrate on a rectangle and at least one mark that can intersect another edge that is orthogonal to the one side. ,
2. The position of the substrate is measured by detecting the edge position of the substrate by imaging each of the at least three marks together with the substrate in the edge position detecting step. Edge position detection method for transparent substrate.
透明な基板を保持可能であるとともに、前記保持された基板のエッジに対して交差するように延びるマークを有する基板保持部と、
前記マークと前記基板とを光の屈折を利用して撮像する撮像手段と、
該撮像手段による前記基板を通した前記マークの撮像画像と該基板のエッジ外での前記マークの撮像画像との境部の位置情報を基に前記基板のエッジ位置を検出する位置検出手段と、
を備えることを特徴とする透明基板のエッジ位置検出装置。
A substrate holding part capable of holding a transparent substrate and having a mark extending so as to intersect with an edge of the held substrate;
Imaging means for imaging the mark and the substrate using refraction of light;
Position detecting means for detecting an edge position of the substrate based on position information of a boundary portion between an imaged image of the mark passing through the substrate by the imaging means and an imaged image of the mark outside the edge of the substrate;
A device for detecting an edge position of a transparent substrate.
前記基板保持部には、矩形上の前記基板の一辺のエッジが交差可能な少なくとも2つの前記マークと、該一辺と直交する他辺のエッジが交差可能な少なくとも1つの前記マークが設けられており、
前記撮像手段は、前記基板保持部の基板保持面と直交する方向に対して傾斜して配置され、前記少なくとも3つのマークと前記基板とを光の屈折を利用してそれぞれ撮像する少なくとも3つの撮像手段を有し、
前記位置検出手段は、前記少なくとも3つの撮像手段によって得られた前記位置情報を基に、前記基板の位置を測定することを特徴とする請求項3に記載の透明基板のエッジ位置検出装置。
The substrate holding portion is provided with at least two marks that can intersect one edge of the substrate on a rectangle and at least one mark that can intersect another edge that is orthogonal to the one side. ,
The imaging means is arranged to be inclined with respect to a direction orthogonal to the substrate holding surface of the substrate holding unit, and images at least three marks and the substrate using light refraction, respectively. Having means,
4. The transparent substrate edge position detection apparatus according to claim 3, wherein the position detection unit measures the position of the substrate based on the position information obtained by the at least three imaging units.
前記透明基板は、液晶表示装置用の基板であり、
前記基板保持部、前記撮像手段、前記位置検出手段は、前記基板のプリアライメントを行うプリアライメント装置に設けられることを特徴とする請求項3又は4に記載の透明基板のエッジ位置検出装置。
The transparent substrate is a substrate for a liquid crystal display device,
The transparent substrate edge position detection apparatus according to claim 3, wherein the substrate holding unit, the imaging unit, and the position detection unit are provided in a pre-alignment apparatus that performs pre-alignment of the substrate.
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