WO2006077804A1 - Clamping apparatus and image forming apparatus - Google Patents

Clamping apparatus and image forming apparatus Download PDF

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Publication number
WO2006077804A1
WO2006077804A1 PCT/JP2006/300478 JP2006300478W WO2006077804A1 WO 2006077804 A1 WO2006077804 A1 WO 2006077804A1 JP 2006300478 W JP2006300478 W JP 2006300478W WO 2006077804 A1 WO2006077804 A1 WO 2006077804A1
Authority
WO
WIPO (PCT)
Prior art keywords
base
clamp
stage
workpiece
substrate material
Prior art date
Application number
PCT/JP2006/300478
Other languages
French (fr)
Japanese (ja)
Inventor
Akihiro Hashiguchi
Takashi Fukui
Kazuhiro Terada
Hiroki Sudo
Original Assignee
Fujifilm Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corporation filed Critical Fujifilm Corporation
Publication of WO2006077804A1 publication Critical patent/WO2006077804A1/en

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Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03GELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00Apparatus for electrographic processes using a charge pattern
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70791Large workpieces, e.g. glass substrates for flat panel displays or solar panels
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/707Chucks, e.g. chucking or un-chucking operations or structural details
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H05K13/0069Holders for printed circuit boards

Definitions

  • the present invention relates to a clamp device for clamping a workpiece such as a printed wiring board mounted on a stage, and further, the clamped printed wiring by a light beam modulated based on image information.
  • the present invention relates to an image forming apparatus that forms an image by exposing a drawing area of a workpiece such as a substrate.
  • the laser exposure apparatus includes a stage member on which a printed wiring board to be subjected to image exposure is placed (loaded), and the stage member is moved along a predetermined conveyance path. It has become.
  • the printed wiring board is sucked onto the stage member by sucking air from a plurality of (many) holes provided on the upper surface of the stage member. Is positioned and mounted.
  • the stage member positioned and mounted on the stage member and attracted and held moves at a predetermined speed in the sub-running direction, and is positioned at a predetermined measurement position and aligned on the printed wiring board.
  • a hole (hereinafter referred to as “alignment mark”) is imaged by a CCD camera.
  • alignment processing is performed on the image information by performing coordinate conversion of the drawing target area in the drawing coordinate system in accordance with the position of the printed wiring board obtained by the imaging.
  • the printed circuit board on the stage member is modulated on the basis of the image information at a predetermined exposure position, and the upper surface of the printed circuit board is deflected in the main scanning direction by a polygon mirror.
  • the photosensitive coating film formed on is scanned and exposed.
  • an image (latent image) based on the image information (corresponding to the wiring pattern) is formed in a predetermined area (drawing area) on the printed wiring board.
  • the printed wiring board on which the image (latent image) is formed has the stage member at the initial position. After returning, the stage member taken out (unloaded) from the stage member and removed from the printed wiring board is transferred to a process for exposing the next printed wiring board (for example, Patent Document 1). reference).
  • Patent Document 1 JP 2000-338432 A
  • the substrate When the thickness of the printed circuit board is thin, for example, 1.5 mm or less, the substrate can be sufficiently adsorbed and held on the stage member by the air suction force. 3. If it is thicker than Omm, the substrate itself may be warped. Therefore, the substrate can be sufficiently sucked and held (fixed) on the stage member only by the air suction force. There was a problem that became difficult.
  • the present invention provides a clamping device capable of securely fixing a workpiece (processing object) having a thickness that can be attached to and detached from the stage and warps, on the stage.
  • An image forming apparatus including a clamp device is provided.
  • the clamping device includes a base on which a plate-shaped workpiece is placed and detachably mounted on a stage, and the edge of the workpiece is provided on the base. And a clamp part for clamping, wherein the base is provided with a plurality of communication holes for communicating between the base upper surface side and the stage side.
  • At least a part of the communication hole is a plurality of suction holes provided in the stage. It is characterized by being the same arrangement as at least a part of.
  • the clamp portion can be attached to and detached from the stage, the clamp portion can be attached to and detached from the stage, and ⁇ ⁇ Since the base on which the workpiece is placed has a plurality of communication holes that communicate with the suction holes on the stage, even workpieces with a thickness that would cause warping are securely fixed on the stage via the base. The power to do S. In addition, it is not necessary to clamp the workpiece on the stage (since it is only necessary to clamp the workpiece on the base), the clamping operation can be performed easily.
  • the clamping device according to the third aspect of the present invention is the clamping device according to the first or second aspect of the present invention, wherein a plurality of the clamp portions are provided for one side of the base. It is characterized by comprising a clamp member.
  • the clamping device is the clamping device according to any one of the four aspects according to the first aspect to the third aspect of the present invention, wherein the clamp portion is provided on the base.
  • a support portion is the clamping device according to any one of the four aspects according to the first aspect to the third aspect of the present invention, wherein the clamp portion is provided on the base.
  • the clamping device is the clamping device according to any one of the first aspect to the third aspect of the present invention, wherein the clamping portion is provided on the base.
  • a locking plate that engages with the flange and prevents the clamp member from falling off the support column, and a through hole formed in a base portion on the opposite side of the claw portion of the clamp member.
  • the force S for easily mounting the clamp member to the base can be achieved.
  • the contact part (claw part) provided on the opposite side of the base part is configured to clamp (press) the workpiece. Can be achieved.
  • the image forming apparatus of the sixth aspect of the present invention is configured so that the stage on which the base in any of the four clamping devices of the first aspect to the fifth aspect of the present invention is mounted has a predetermined conveying path.
  • the stage on which the base in one clamp device is mounted is transported in a predetermined manner.
  • Image information indicating a conveyance mechanism that conveys along the path, a measurement unit that detects the alignment mark of the workpiece on the stage conveyed by the conveyance mechanism, and a drawing area of the workpiece after alignment based on the detection result of the measurement unit
  • an exposure unit that performs exposure with a light beam modulated based on the above, and forms an image in the drawing region.
  • a clamping device that can be securely fixed on a stage even if the workpiece is detachable from the stage and has a thickness that causes warping. It is possible to provide an image forming apparatus provided with the clamping device.
  • FIG. 1 is a schematic perspective view showing a laser exposure apparatus.
  • FIG. 2 is a schematic plan view showing a clamp device.
  • FIG. 3 is a schematic perspective view showing a slide member and a clamp member provided on the base member.
  • FIG. 4 is a schematic plan view showing a slide member provided on the base member.
  • FIG. 5 (A) is a schematic plan view showing the clamp member before the locking plate slides.
  • FIG. 5 (B) is a schematic plan view showing the clamp member after sliding the locking plate.
  • FIG. 6 (A) is a schematic perspective view showing a configuration of a positioning portion.
  • FIG. 6 (B) is a schematic perspective view showing the configuration of the positioning portion.
  • FIG. 7 (A) is a schematic plan view for explaining a positioning method by a positioning unit.
  • FIG. 7 (B) is a schematic plan view for explaining a positioning method by a positioning unit.
  • FIG. 7C is a schematic plan view for explaining a positioning method by the positioning unit.
  • FIG. 7 (D) is a schematic plan view for explaining a positioning method by a positioning unit.
  • FIG. 8 (A) is a schematic side view showing a state in which substrate materials having different thicknesses are clamped by a movable type clamp portion.
  • FIG. 8 (B) is a schematic side view showing a state in which substrate materials having different thicknesses are clamped by a movable type clamp portion.
  • FIG. 8 (C) is a schematic side view showing a state in which substrate materials having different thicknesses are clamped by a movable type clamp portion.
  • FIG. 9 (A) is a schematic side view showing a state in which substrate materials having different thicknesses are clamped by a fixed type clamp portion.
  • FIG. 9 (B) is a schematic side view showing a state in which substrate materials having different thicknesses are clamped by a fixed type clamp portion.
  • FIG. 9 (C) is a schematic side view showing a state in which substrate materials having different thicknesses are clamped by a fixed type clamp portion.
  • FIG. 10 (A) is a schematic plan view showing an exposure area by an exposure head.
  • FIG. 10 (B) is a schematic plan view showing an arrangement pattern of exposure heads.
  • FIG. 1 is a schematic perspective view of a laser exposure apparatus 10 showing an example of an image forming apparatus according to the present invention
  • FIGS. It is. 1 and 2, arrow A is the transport direction, arrow B is the width direction, arrow FR is “front”, arrow RE is “back”, arrow RI is “right”, and arrow LE is “left”. In some cases, the position of each part is described using front / rear / right / left expressions.
  • the laser one exposure apparatus 10 includes a rectangular thick plate-shaped installation base 14 supported by six legs 12.
  • Two guide rails 16 are arranged on the upper surface of the installation table 14 along the longitudinal direction (conveying direction).
  • a rectangular flat plate shape is provided via a guide portion 19.
  • the stage member 20 is provided.
  • the stage member 20 is disposed such that the longitudinal direction thereof faces the extending direction (conveying direction) of the guide rail 16, and is supported by the guide rail 16 and the guide portion 19 so as to be capable of reciprocating on the installation table 14. . That is, for example, it is configured to reciprocate at a predetermined speed along the guide rail 16 by a transport mechanism such as a motor 18 and a ball screw 22.
  • a rectangular flat substrate material 100 as an exposure object is placed in a state of being positioned at a predetermined position by a positioning unit (not shown).
  • a plurality of (many) holes 20A are formed on the upper surface of the stage member 20, and the inside of the stage member 20 is made negative by a negative pressure supply source (not shown), so that Air is sucked from the portion 20A, and the suction force causes the substrate material 100 to be sucked and held on the upper surface of the stage member 20.
  • the clamping device 30 When the substrate material 100 has a predetermined thickness or more and is warped, it cannot be sufficiently adsorbed and held only by the air suction force (it is difficult to securely fix it). Therefore, the clamping device 30 described later assists the substrate material 100 to be securely attracted and held (fixed) on the upper surface of the stage member 20.
  • the substrate material 100 is provided with a plurality of alignment marks (not shown) indicating the reference of the exposure position in the drawing region on the exposed surface.
  • the alignment marks are formed by, for example, circular through-holes, and a total of four alignment marks are disposed in the vicinity of the four corners (hereinafter referred to as “corner portions”) of the substrate material 100.
  • a substantially “U” -shaped gate 24 is provided at the center of the installation table 14 so as to straddle the movement path of the stage member 20. Both ends of the gate 24 are fixed to the installation base 14, and an exposure part (drawing) for exposing the substrate material 100 is exposed on one side (rear side) across the gate 24.
  • An exposure head 28 is provided as an image section, and a plurality of (for example, two) CCD cameras 26 as measurement sections for photographing alignment marks provided on the substrate material 100 are provided on the other side (front side). Is provided.
  • each CCD camera 26 causes the strobe light source to emit light at the timing when the alignment mark of the substrate material 100 reaches a predetermined photographing position, and the strobe light irradiated to the substrate material 100 is reflected on the upper surface of the substrate material 100.
  • the alignment mark is photographed by inputting light into the camera body through the lens.
  • a transport mechanism (motor 18 and ball screw 22) for moving the stage member 20, a CCD camera 26, an exposure head 28, and the like are connected to a controller (not shown) that controls them.
  • the stage member 20 is controlled to move at a predetermined speed
  • the CCD camera 26 is controlled to photograph the alignment mark of the substrate material 100 at a predetermined timing
  • the exposure head 28 is controlled to the substrate at a predetermined timing. Controlled to expose material 100.
  • the exposure heads 28 are arranged in an approximate matrix of m rows and n columns (for example, 2 rows 4 mm IJ). Then, as shown in FIGS. 10A and 10B, an exposure area 28A by the exposure head 28 is configured in a rectangular shape having a short side in the transport direction, for example. Therefore, a strip-shaped exposed region 102 is formed for each exposure head 28 in the substrate material 100 in accordance with the movement operation in the transport direction (front side to rear side).
  • each of the exposure heads 28 of each row arranged in a line is predetermined in the arrangement direction so that the strip-shaped exposed regions 102 are arranged without gaps in the width direction (left-right direction) orthogonal to the transport direction. Arranged at intervals (natural number times the long side of the exposure area 28A). For this reason, for example, a portion that cannot be exposed between the exposure area 28A in the first row and the exposure area 28A in the second row can be exposed in the exposure area 28A in the second row.
  • Each exposure head 28 includes a digital 'micromirror device (DM D) (not shown) as a spatial light modulation element that modulates the incident laser beam for each pixel in accordance with image data. Yes.
  • This DMD has a data processor and mirror drive controller. Connected to the above controller.
  • the data processing unit of the controller generates a control signal for driving and controlling each micromirror in the region to be controlled by the DMD for each exposure head 28 based on the input image data.
  • the mirror drive control unit controls the angle of the reflection surface of each micromirror in the DMD for each exposure head 28 based on the control signal generated by the data processing unit.
  • a bundle-shaped optical fiber drawn from an illumination device that emits multi-beams as laser light is connected to the light incident side of the DMD in each exposure head 28.
  • the illumination device has a plurality of multiplexing modules that multiplex laser beams emitted from a plurality of semiconductor laser chips and input them to the optical fiber.
  • Each optical module that extends is an optical fiber that propagates the combined laser light.
  • a plurality of optical fibers are bundled into one to form a bundle of optical fibers. Yes.
  • the substrate material 100 for image exposure by the laser exposure apparatus 10 includes a substrate as a material for forming a pattern (image exposure) such as a printed wiring board and a liquid crystal display element, and a photosensitive epoxy resin on the surface of a glass plate or the like. In the case of a dry film, it may be laminated.
  • the substrate material 100 is placed on the upper surface of the stage member 20 by a loader (not shown) and positioned by a positioning unit (not shown), the substrate material 100 is sucked by air from the hole 20A. Adsorbed 'held on the top surface of 20.
  • the substrate material 100 is a thick substrate of 3 mm or more, for example, and warping has occurred, it cannot be sufficiently adsorbed and held only by the air suction force (can be securely fixed). For this reason, the substrate material 100 is placed on the base member 32 of the clamping device 30 to be described later, and the substrate material 100 is clamped by the clamp portion 34 provided on the base member 32. Attach to stage member 20. At this time, the base member 32 is provided with a plurality of (a large number of) holes 32A similar to the stage member 20. The substrate material 100 is sucked and held (fixed) on the stage member 20 through the member 32.
  • the stage member 20 starts to move in the transport direction (from the rear side to the front side), and the substrate material 100 is moved by the CCD camera 26. It is conveyed to the alignment detection process. That is, the exposure operation of the laser exposure apparatus 10 is started by the operator performing an exposure start input operation from the instruction input unit of the controller.
  • the transport mechanism (the motor 18 and the ball screw 22) is controlled by the controller, and the stage member 20 holding the substrate material 100 on the upper surface is held along the guide rail 16 in the transport direction (from the rear side to the front side). Start moving at a constant speed. In synchronism with the start of movement of the stage member 20 or at a timing just before the tip of the substrate material 100 reaches just below each CCD camera 26, each CCD camera 26 is controlled by the controller and starts operating. .
  • the CCD camera 26 emits a strobe light source at a predetermined timing, and photographs each alignment mark.
  • the captured image data (reference position data) is output to the data processing unit of the controller.
  • the data processing unit inputs the image data (reference position data) of each alignment mark.
  • From the position of the stage member 20 at the time of shooting and the position of the CCD camera 26, the positional deviation of the substrate material 100 on the stage member 20, the inclination with respect to the moving direction, the dimensional accuracy error, etc. are ascertained by calculation processing. Calculate the appropriate exposure position for the exposed surface.
  • the image data corresponding to the exposure pattern is temporarily stored in the memory in the controller. Therefore, during image exposure by the exposure head 28, correction control (alignment) for aligning the control signal generated based on the image data of the exposure pattern stored in the memory with the appropriate exposure position described above (alignment). Execute.
  • this image data the density of each pixel constituting the image is expressed in binary (whether or not dots are recorded). Data.
  • the stage member 20 is transported to the exposure process by the exposure head 28 by driving the transport mechanism (motor 18 and ball screw 22). Is done. That is, the stage member 20 starts to move along the guide rail 16 in the opposite direction (from the front side to the rear side).
  • the drawing area on the exposed surface of the substrate material 100 reaches the exposure start position below the exposure head 28, each exposure head 28 irradiates a laser beam to the exposed surface (drawing area) of the substrate material 100. Start image exposure.
  • the image data stored in the memory of the controller is sequentially read out for a plurality of lines, and a control signal is generated for each exposure head 28 based on the image data read out by the data processing unit.
  • the This control signal is subjected to correction of exposure position deviation with respect to the substrate material 100 measured by alignment by correction control (alignment).
  • the mirror drive control unit performs on / off control of each micromirror of the DMD for each exposure head 28 based on the generated and corrected control signals.
  • the laser beam emitted from the optical fiber of the illuminating device is irradiated onto the DMD, the laser light force reflected when the micromirror of the DMD is turned on.
  • the substrate material 100 is moved together with the stage member 20 at a constant speed, so that the substrate material 100 is moved by the exposure head 28 in the direction opposite to the moving direction of the stage member 20 (in FIG. A strip-shaped exposed region 102 is formed for each exposure head 28 (see FIG. 10A).
  • the stage member 20 returns to the initial position where the substrate material 100 is placed, so that suction by air suction and further clamping are performed.
  • the clamp by the apparatus 30 is released, and the substrate material 100 is removed from the stage member 20 (base member 32) by an unloader (not shown).
  • the substrate material 100 removed from the stage member 20 is transported outside the machine (not shown). It is conveyed to the conveyor and conveyed to the next process.
  • the clamp apparatus 30 used in the image forming apparatus such as the laser exposure apparatus 10 will be described in detail with reference to FIGS. 2 to 9A, 9B, and 9C.
  • the clamping device 30 is placed on the stage member 20 and is rectangular plate-shaped (which naturally has a surface area larger than that of the substrate material 100, which is positioned by a positioning portion not shown). ) and the base member 3 2, and a clamp portion 34 provided on the base member 32 Les, Ru.
  • the base member 32 is provided with a plurality of (many) holes 32A that are in communication with the holes 20A when placed on the stage member 20 and positioned.
  • the substrate member 100 placed thereon can be sucked and held (fixed) by the stage member 20 via the base member 32 (for each base member 32).
  • the clamp part 34 is provided in two types, a fixed type clamp part 34A and a movable type clamp part 34B.
  • a fixed type clamp part 34A For example, the front side and the left side of the stage member 20 are fixed type clamp parts 34A, and the right side and the rear side. The side is the movable clamp part 34B.
  • the fixed type clamp portion 34A has a slide member 36, which will be described later, as a fixed member 38. Therefore, the positioning portion 70 shown in detail in FIGS. 6A and 6B is not provided.
  • a plurality of positioning portions for example, positioning pins 33, which are positioned first, are arranged in the vicinity of the inner side of the fixing plate 46 described later (the one shown in the figure is on the front side). This is different from the movable type clamp part 34 B in that it is erected.
  • the movable type clamp part 34B will be mainly described below, and the fixed type clamp part 34A is denoted by the same reference numerals in the drawings with the same functions as those of the movable type clamp part 34B. The detailed explanation is omitted.
  • the movable type clamp portion 34B is provided so as to be slidable and fixable so as to approach and separate from the substrate material 100 placed on the base member 32.
  • a plurality of clamp members 40 are detachably attached to the fixing member 38 (three in the figure are attached to each side of the substrate material 100).
  • the slide member 36 At both ends of the slide member 36, long elongated holes 36A are formed in a direction perpendicular to the longitudinal direction, and fixing screws 90 that can be screwed with fingers are passed through the elongated holes 36A. Screwed to base member 32. Therefore, the slide member 36 is configured to be manually slidable and fixable in a direction in which the base member 32 approaches and separates from the base material 100. Note that the fixing member 38 is fixed to the base member 32 by mounting screws 94.
  • a substantially columnar column 44 for mounting the clamp member 40 is erected via the mounting plate 42.
  • the mounting plate 42 has a bifurcated base portion 42A side attached to the slide member 36 with mounting screws 96, and a column 44 is erected at a predetermined position on the tip 42B side.
  • a plurality of the support poles 44 are erected via a mounting plate 42 at a predetermined interval in the longitudinal direction of the slide member 36 (three clamp members 40 are shown in the figure).
  • a substantially disc-shaped flange 44A having a larger diameter than that of the support 44 is formed on the upper portion of each support 44. Then, as shown in FIGS. 8 (A), (B), and (C), a mounting screw 92 is screwed onto the lower end portion of the column 44.
  • a fixing plate 46 is attached by mounting screws 94 in parallel to the slide member 36 and at a predetermined interval.
  • This fixed plate 46 has a long hole 46A that is long in the direction perpendicular to the longitudinal direction (the direction in which it is close to or away from the substrate material 100) so that the lower end portion including the mounting screw 92 of the column 44 can be inserted.
  • the lower end portion of the support 44 is configured to move along the long hole 46A.
  • the same fixing plate 46 is also provided on the fixing member 38 side in parallel with the fixing member 38 and at a predetermined interval by a mounting screw 94.
  • the fixing plate 46 has a long hole 46A. Not drilled. That is, the mounting plate 42 is not attached to the fixing member 38 side, and the support 44 is directly attached to the fixing plate 46 (see FIGS. 9A, 9B, and 9C).
  • the substrate material 100 is disposed on the inner side of the fixed plate 46, and the slide member 36 slides toward and away from the fixed plate 46 on the outer side of the fixed plate 46.
  • the movable type clamp part 34B has an edge part that is outside the drawing region of the substrate material 100 arranged inside the fixed plate 46 when the slide member 36 approaches and separates from the fixed plate 46.
  • the clamp member 40 can be adjusted with respect to 100A.
  • the support 44 (including the flange 44A) can be loosely mounted in the substantially central portion of the clamp member 40 in the width direction (indicated by arrow D).
  • a plurality of holes 40A are formed along the longitudinal direction with a predetermined interval (three in the figure), and the clamp member 40 is slidable in the longitudinal direction at the substantially central portion of the upper surface.
  • the configured locking plate 50 is provided with a length slightly shorter than the length in the longitudinal direction of the clamp member 40 (a length that does not protrude from the clamp member 40 even if it is slid in the longitudinal direction).
  • two long holes 50A that are long in the longitudinal direction (sliding direction) are formed in the locking plate 50 at predetermined intervals, and mounting screws 94 are respectively inserted through the long holes 50A.
  • Clamp member 40 is attached to the upper surface.
  • the locking plate 50 can slide in the longitudinal direction within the range of the long hole 50A.
  • the locking plate 50 has the same diameter as the flange 44A or a slightly larger diameter than the flange 44A and a smaller diameter than the mounting hole 40A, and the same diameter as the support 44.
  • two locking holes 52 formed so as to communicate with the small-diameter portion 52B, which has a long hole shape in the sliding direction, can be communicated with the mounting hole 40A. ing.
  • a notch 53 that is substantially the same as the small diameter portion 52B is formed at the left end of the locking plate 50.
  • the lower surface of one long side portion of the clamp member 40 In addition, a claw portion 54 that protrudes in a substantially arc shape in cross-section and comes into contact with the edge portion 100A of the substrate material 100 from above is formed. And the clamping member 40 The other long side portion is defined as a base portion 56, and a plurality of the base portions 56 are arranged along the longitudinal direction of the through hole 56A corresponding to (in parallel with) the mounting hole 40A (with a predetermined interval). 3) Drilled.
  • a substantially cylindrical support rod 58 whose lower end protrudes in a substantially hemispherical shape is passed through the through-hole 56A, and the support rod 58 is provided near the upper end and the lower end thereof.
  • the flanges 62A and 62B larger in diameter than the support rod 58 are fitted.
  • the support rod 58 is prevented from falling off from the clamp member 40.
  • the support rod 58 is provided on the lower surface side of the clamp member 40 (base portion 56).
  • the coil spring 60 is fitted. That is, the coil spring 60 is fitted between the lower surface of the clamp member 40 (base 56) and the lower flange 62B of the support rod 58.
  • the support rod 58 is urged so as to always protrude downward from the lower surface of the clamp member 40.
  • a support portion 48 for supporting the lower end portion of the support rod 58 is formed between the base portions 42A of the mounting plate 42 having a bifurcated shape. It has been done.
  • the support 48 is recessed in a substantially hemispherical shape having a smaller curvature than the lower end of the support rod 58, and is configured so that the lower end of the support rod 58 is slidably contacted.
  • a plurality of positioning portions 70 for the substrate material 100 are provided on the inner side (substrate material 100 side) end surface of the slide member 36 (the illustrated one is spaced apart from each slide member 36 by a predetermined interval). 2 each). Then, the fixing plate 46 in the portion where the positioning portion 70 is provided is appropriately cut out to allow the positioning portion 70 to be attached.
  • the positioning portion 70 has a pin shape provided so as to be able to enter and exit the slide member 36.
  • the positioning member 72 is brought into contact with the end surface 100B of the substrate material 100, and the slide member 36 (clamp member 40) is positioned with respect to the substrate material 100. .
  • a substantially rectangular flat casing 64 is attached to the inner side (substrate material 100 side) end face of the slide member 36 by means of a mounting screw 96, and the top slit 64A of the casing 64 has a first slit.
  • 66A force Slide member 36 parallel to the longitudinal direction of the top plate 64A It is drilled to the center.
  • one side wall 64B of the casing 64 has a second slit 66B force communicating with the first slit 66A, and a predetermined length is drilled in a direction away from the substrate material 100 (sliding member 36 side).
  • the positioning member 72 is formed by bending a cylindrical pin having a predetermined length into a substantially "L" shape, and a short end (hereinafter referred to as an "operation part") 72A is formed by the first slit 66A or the first 2 Projects outward from slit 66B.
  • the front wall 64C of the casing 64 facing the substrate material 100 is provided with a circular opening 68 having the same force as the diameter of the positioning member 72 and a slightly larger diameter than the positioning member 72.
  • the other end portion (hereinafter referred to as “contact portion”) 72B can enter and exit through the opening 68.
  • a coin spring 74 is fitted into the contact portion 72B side of the bending member 72C of the positioning member 72.
  • One end of the coil spring 74 abuts on a locking flange 76 fitted approximately in the middle between the bent portion 72C and the abutting portion 72B, and the other end of the coil spring 74 is fixed to the inner surface of the front wall 64C.
  • the contact portion 72B is in contact with a locking flange 78 that can be inserted. Accordingly, the positioning member 72 is constantly biased in the direction away from the substrate material 100 (sliding member 36 side) by the biasing force of the coil spring 74.
  • the positioning method by the positioning unit 70 will be described mainly based on FIGS. 7 (A), (B), (C), and (D).
  • the substrate material 100 is placed on the base member 32, and the positioning pin 33 provided near the inner side (substrate material 100 side) of the fixed plate 46 in the fixed type clamp portion 34A is placed on the positioning pin 33.
  • the front end face 100B and the left end face 100B are brought into contact with each other.
  • the second slit 66B protrudes from the end of the slide member 36 side and is locked and held in a state of being biased by the biasing force of the coil spring 74.
  • Each operating portion 72A is moved to the substrate material 100 side against the biasing force of the coil spring 74 (see FIG. 7A).
  • each positioning member 72 is connected to the end of the first slit 66A on the top plate 64A side (the abbreviation of the top plate 64A). In the center), the urging force of the coil spring 74 is brought into contact with and locked to the top plate 64A, and the contact portion 72B of each positioning member 72 protrudes from the opening 68 by a predetermined length.
  • each slide member 36 is elongated until each contact portion 72B contacts the right end surface 100B and the rear end surface 100B of the substrate material 100. 3 Approach (slide) the substrate material 100 side along 6A and the long hole 46A (see Fig. 7 (C)). Then, when the respective contact portions 72B are brought into contact with the right end surface 100B and the rear end surface 100B of the substrate material 100, the respective slide members 36 are fixed by the fixing screws 90 at the positions.
  • each operation portion 72A is placed in the first slit 66A as described above. Rotate in the opposite direction and release your finger after turning it into the second slit 66B.
  • each positioning member 72 is automatically moved in the direction away from the substrate material 100 (sliding member 36 side) by the urging force of the coil spring 74, and each abutting portion protruding from the opening 68. 72B retracts into the casing 64 (see Fig. 7 (D)). Thereby, the positioning operation of the slide member 36 with respect to the substrate material 100 is completed.
  • each clamp member 40 abuts the lower end portion of the support rod 58 on the support portion 48 provided on each slide member 36 and each fixing member 38. At the same time, the flange 44A of the support 44 is inserted into the mounting hole 40A.
  • the clamp member 40 can be attached to the slide member 36. In other words, if the operation part 72A of the positioning member 72 protrudes from the top plate 64A, the clamp member 40 cannot be attached. Forgetting the operation after positioning the member 72 can be prevented.
  • the flange 44A of the support 44 has a force of the large diameter portion 52A of the mounting hole 40A and the locking hole 52 only by the weight of the clamp member 40, Le which does not protrude upwards. Therefore, the upper surface of the clamp member 40 is manually pressed, and the flange 44A of the support pole 44 is protruded upward from the large diameter portion 52A of the mounting hole 40A and the locking hole 52. Then, with this state maintained, the locking plate 50 is slid in the left direction in FIGS. 5A and 5B within the range of the long hole 50A.
  • each clamp member 40 can be attached to the column 44 in a state in which the drop-off is prevented. In this way, each clamp member 40 is attached to the slide member 36 and the fixed member 38, whereby the edge portion 100 A of the substrate material 100 is clamped by each clamp member 40.
  • the clamp member 40 is pushed upward (from the base member 32) upward by the biasing force of the base 56 side force coil spring 60, and between the column 44 and the mounting hole 40A. Since the predetermined gap is formed, the claw portion 54 side is rotated downward with the vicinity of the mounting hole 40A into which the support 44 is inserted as a fulcrum. Accordingly, the claw 54 can press and hold the edge 100A of the substrate material 100 by the biasing force of the coil spring 60, and the clamp member 40 clamps the edge 100A of the substrate material 100. That force becomes S positive.
  • the front end surface 100B and the left end surface 100B of the substrate material 100 are brought into contact with the positioning pin 33, whereby the positioning of the clamp member 40 with respect to each edge 100A is already completed. is doing. Further, since the positioning of the clamp member 40 with respect to each edge 100A of the substrate material 100 is completed by the positioning unit 70 on the slide member 36 side, even if the substrate material 100 is warped (deformed), the drawing region The outer edge 100A can be securely clamped. That is, when the substrate material 100 with warp is clamped by the clamp member 40, the force that deforms the substrate material 100 so that it slightly expands.
  • a predetermined gap is formed by the positioning member 72.
  • the positioning member 72 is positioned in consideration of the elongation of the base material 100 that occurs when the warp is corrected. Even if such deformation occurs, it can be sufficiently tolerated.
  • the clamp member 40 is configured such that the claw portion 54 on the opposite side is pressed from the top to the bottom by the base 56 side being pushed up from the bottom to the top.
  • the thickness of the substrate material 100 is different. (Even if it gets thicker) can be clamped correspondingly enough.
  • this clamping device 30 it is possible to clamp the substrate material 100 having a thickness of up to 7 mm.
  • the clamp portion 34 is configured so that each corner portion of the substrate material 100 can be reliably clamped. That is, as shown in FIG. 2 and FIG. 4, the clamp part 34A, which is a fixed type on the front side, and the claw part 54 of the clamp part 34B, which is a movable type on the rear side, are each a fixed type on the left side.
  • the clamp part 34A and the clamp part 34B of the right movable type are clamped on the extension line (indicated by the phantom line K in FIG. 4) so as to overlap the extension line in the longitudinal direction of the claw part 54 of the clamp part 34B. It is constructed so that a support 44 for mounting the member 40 is provided.
  • the base member 32 is placed on the stage member 20 and is positioned by a positioning portion (not shown). At this time, the base member 32 is perforated. Since the hole portion 32A communicates with the hole portion 20A formed in the stage member 20, the air is sucked from the hole portions 20A and 32A, thereby The substrate material 100 clamped by the lamp device 30 can be securely adsorbed and held on the stage member 20.
  • the clamp device 30 can also be applied to a device such as a laser processing machine that forms a hole for conduction in a substrate material 100.
  • the base member 32 provided with the clamp portion 34 can be attached to and detached from the stage member 20, and the substrate material 100 is placed on the base member 32. Since it is configured, the clamp part 34 can be attached to and detached from the stage member 20, and even when the substrate material 100 having a thickness that causes warping is exposed, the stage member 20 is interposed via the base member 32. It can be securely adsorbed and held (fixed) on the top. Further, since this clamping operation does not need to be performed on the stage member 20 which is sufficient to be performed on the base member 32, there is an advantage that it can be easily performed.
  • the clamp member 40 is configured to be attached to the column 44 by sliding the locking plate 50, so that the attaching / detaching operation can be easily performed.
  • a plurality of clamp members 40 are provided and clamped on each side of the substrate material 100, that is, on the slide member 36 and the fixing member 38 (in other words, on each slide member 36 and each fixing member 38). Therefore, even if the size of the substrate material 100 is changed, the structure can be flexibly accommodated. However, when the size of the substrate material 100 is greatly changed, the base member 32 is replaced according to the size of the substrate material 100.
  • a hole (communication hole)
  • Locking plate Locking member
  • Support rod support part
  • Coil spring biasing member

Abstract

A clamping apparatus, which can be removably arranged on a stage, and can surely fix on the stage even a work having a thickness which might cause warping; and an image forming apparatus provided with such clamping apparatus. The clamping apparatus (30) is provided with a base (32) which is removably mounted on the stage (20) with the board-shaped work (100) placed on the base, and a clamping section (34) arranged on the base (32) for clamping an edge section (100A) of the work (100). A plurality of communicating holes (32A) penetrate the base (32) for communicating between an upper plane side of the base (32) and a side of a stage (20). The image forming apparatus (10) is provided with the clamping apparatus (30).

Description

明 細 書  Specification
クランプ装置及び画像形成装置  Clamp device and image forming apparatus
技術分野  Technical field
[0001] 本発明は、ステージ上に載置されたプリント配線基板等のワークをクランプするクラ ンプ装置に関し、更には、画像情報に基づいて変調された光ビームにより、そのクラ ンプされたプリント配線基板等のワークの描画領域を露光して画像を形成する画像 形成装置に関する。  The present invention relates to a clamp device for clamping a workpiece such as a printed wiring board mounted on a stage, and further, the clamped printed wiring by a light beam modulated based on image information. The present invention relates to an image forming apparatus that forms an image by exposing a drawing area of a workpiece such as a substrate.
背景技術  Background art
[0002] 従来から、例えばプリント配線基板(以下「基板」又は「基板材料」ともいう)等に配線 パターンを形成する画像形成装置としてのレーザー露光装置が知られている。このレ 一ザ一露光装置には、画像露光の対象となるプリント配線基板を載置する(ロードす る)ステージ部材が備えられ、そのステージ部材を所定の搬送経路に沿って移動させ るようになっている。  Conventionally, there has been known a laser exposure apparatus as an image forming apparatus for forming a wiring pattern on a printed wiring board (hereinafter also referred to as “substrate” or “substrate material”), for example. The laser exposure apparatus includes a stage member on which a printed wiring board to be subjected to image exposure is placed (loaded), and the stage member is moved along a predetermined conveyance path. It has become.
[0003] 具体的に説明すると、まず、プリント配線基板は、ステージ部材の上面に設けられ た複数(多数)の孔部からエアーが吸引されることによって、そのステージ部材上に吸 着された状態で位置決め載置される。ステージ部材上に位置決め載置され、吸着- 保持されたステージ部材は、所定の速度で副走查方向へ移動し、所定の測定位置 におレ、て、そのプリント配線基板に設けられた位置合わせ孔(以下「ァライメントマ一 ク」という)が CCDカメラによって撮像される。そして、その撮像によって得られたプリ ント配線基板の位置に合わせて、描画座標系中の描画対象領域を座標変換すること により、画像情報に対するァライメント処理が実行される。  [0003] Specifically, first, the printed wiring board is sucked onto the stage member by sucking air from a plurality of (many) holes provided on the upper surface of the stage member. Is positioned and mounted. The stage member positioned and mounted on the stage member and attracted and held moves at a predetermined speed in the sub-running direction, and is positioned at a predetermined measurement position and aligned on the printed wiring board. A hole (hereinafter referred to as “alignment mark”) is imaged by a CCD camera. Then, alignment processing is performed on the image information by performing coordinate conversion of the drawing target area in the drawing coordinate system in accordance with the position of the printed wiring board obtained by the imaging.
[0004] ァライメント処理の実行後、ステージ部材上のプリント配線基板は、所定の露光位 置において、画像情報に基づいて変調され、ポリゴンミラーにより主走查方向へ偏向 されたレーザービームによって、その上面に形成された感光性塗膜が走査、露光処 理される。これにより、プリント配線基板上の所定の領域 (描画領域)に、画像情報に 基づく(配線パターンに対応する)画像 (潜像)が形成される。  [0004] After the alignment process, the printed circuit board on the stage member is modulated on the basis of the image information at a predetermined exposure position, and the upper surface of the printed circuit board is deflected in the main scanning direction by a polygon mirror. The photosensitive coating film formed on is scanned and exposed. As a result, an image (latent image) based on the image information (corresponding to the wiring pattern) is formed in a predetermined area (drawing area) on the printed wiring board.
[0005] そして、画像 (潜像)が形成されたプリント配線基板は、ステージ部材が初期位置に 復帰移動した後、ステージ部材から取り出され (アンロードされ)、プリント配線基板が 取り除かれたステージ部材は、次のプリント配線基板を露光する工程に移行するよう になっている(例えば、特許文献 1参照)。 [0005] The printed wiring board on which the image (latent image) is formed has the stage member at the initial position. After returning, the stage member taken out (unloaded) from the stage member and removed from the printed wiring board is transferred to a process for exposing the next printed wiring board (for example, Patent Document 1). reference).
特許文献 1 :特開 2000— 338432号公報  Patent Document 1: JP 2000-338432 A
発明の開示  Disclosure of the invention
発明が解決しょうとする課題  Problems to be solved by the invention
[0006] し力しながら、プリント配線基板の厚さが、例えば 1. 5mm以下のように薄い場合は 、エアーの吸引力によって、その基板をステージ部材上に充分に吸着 ·保持できるが 、例えば 3. Omm以上のように厚い場合は、基板自体に反りが発生することがあるた め、エアーの吸引力だけでは、その基板を充分にステージ部材上に吸着 ·保持(固 定)することが困難となる不具合があった。  [0006] When the thickness of the printed circuit board is thin, for example, 1.5 mm or less, the substrate can be sufficiently adsorbed and held on the stage member by the air suction force. 3. If it is thicker than Omm, the substrate itself may be warped. Therefore, the substrate can be sufficiently sucked and held (fixed) on the stage member only by the air suction force. There was a problem that became difficult.
[0007] そのため、基板を補助的にクランプできるクランプ装置が必要とされる力 プリント配 線基板は、上記のように厚さが異なるため、常にクランプ装置力ステージ部材に取り 付けられている必要はなぐむしろ、クランプ装置はステージ部材に対して着脱可能 とされる方が望ましい。  [0007] Therefore, a force that requires a clamping device that can clamp the substrate in an auxiliary manner Since the printed wiring boards have different thicknesses as described above, it is necessary that the clamping device is always attached to the force stage member. Rather, it is desirable that the clamping device be detachable from the stage member.
課題を解決するための手段  Means for solving the problem
[0008] そこで、本発明は、ステージに対して着脱可能とされ、反りが発生してしまうような厚 さのワーク(処理対象物)でも、そのステージ上に確実に固定できるクランプ装置と、 そのクランプ装置を備えた画像形成装置を提供する。  [0008] In view of the above, the present invention provides a clamping device capable of securely fixing a workpiece (processing object) having a thickness that can be attached to and detached from the stage and warps, on the stage. An image forming apparatus including a clamp device is provided.
[0009] 本発明の第 1の態様のクランプ装置は、板状のワークが載置され、ステージ上に着 脱可能に装着されるベースと、前記ベースに設けられ、前記ワークの縁端部をクラン プするクランプ部と、を備え、前記ベースには、該ベース上面側と前記ステージ側と の間を連通させる複数の連通孔が穿設されていることを特徴としている。  [0009] The clamping device according to the first aspect of the present invention includes a base on which a plate-shaped workpiece is placed and detachably mounted on a stage, and the edge of the workpiece is provided on the base. And a clamp part for clamping, wherein the base is provided with a plurality of communication holes for communicating between the base upper surface side and the stage side.
[0010] そして、本発明の第 2の態様のクランプ装置は、本発明の第 1の態様のクランプ装 置において、前記連通孔の少なくとも一部が、前記ステージに設けられた複数の吸 着孔の少なくとも一部と同じ配置とされることを特徴としている。  [0010] Then, in the clamping device according to the second aspect of the present invention, in the clamping device according to the first aspect of the present invention, at least a part of the communication hole is a plurality of suction holes provided in the stage. It is characterized by being the same arrangement as at least a part of.
[0011] 本発明の第 1、第 2の態様によれば、クランプ部が設けられたベースをステージに対 して着脱可能としたので、クランプ部をステージに対して着脱可能とでき、かつ、ヮー クが載置されるベースに、ステージの吸着孔と連通する連通孔を複数穿設したので、 反りが発生してしまうような厚さのワークでも、ベースを介してステージ上に確実に固 定すること力 Sできる。また、ステージ上でワークのクランプ作業をする必要がないため (ベース上でワークのクランプ作業をすればよいため)、そのクランプ作業が容易にで きる。 [0011] According to the first and second aspects of the present invention, since the base provided with the clamp portion can be attached to and detached from the stage, the clamp portion can be attached to and detached from the stage, andヮ ー Since the base on which the workpiece is placed has a plurality of communication holes that communicate with the suction holes on the stage, even workpieces with a thickness that would cause warping are securely fixed on the stage via the base. The power to do S. In addition, it is not necessary to clamp the workpiece on the stage (since it is only necessary to clamp the workpiece on the base), the clamping operation can be performed easily.
[0012] また、本発明の第 3の態様のクランプ装置は、本発明の第 1又は第 2の態様のクラン プ装置において、前記クランプ部が、前記ベースの 1つの辺に対してそれぞれ複数 設けられるクランプ部材を備えることを特徴としている。  [0012] In addition, the clamping device according to the third aspect of the present invention is the clamping device according to the first or second aspect of the present invention, wherein a plurality of the clamp portions are provided for one side of the base. It is characterized by comprising a clamp member.
[0013] 本発明の第 3の態様によれば、ワークのサイズが変更になっても、柔軟に対応する こと力 Sできる。  [0013] According to the third aspect of the present invention, even when the size of the workpiece is changed, it is possible to respond flexibly.
[0014] また、本発明の第 4の態様のクランプ装置は、本発明の第 1の態様乃至第 3の態様 の何れ力 4つの態様のクランプ装置において、前記クランプ部が、前記ベースに設け られ、抜け止め部が形成された案内部と、前記案内部に遊嵌される取付孔が穿設さ れ、前記縁端部に当接する当接部が形成されたクランプ部材と、前記クランプ部材に 設けられ、前記抜け止め部に係合して、該クランプ部材を前記案内部から脱落不能 とする係止部材と、前記クランプ部材の前記当接部とは反対側の基部に穿設された 貫通孔に、脱落不能に挿通された支持部と、前記支持部に挿嵌され、該支持部を下 方に向かって付勢する付勢部材と、前記ベースに設けられ、前記支持部を支持する 支持部と、を有することを特徴としている。  [0014] In addition, the clamping device according to the fourth aspect of the present invention is the clamping device according to any one of the four aspects according to the first aspect to the third aspect of the present invention, wherein the clamp portion is provided on the base. A guide member in which a retaining portion is formed, a clamp member in which a mounting hole that is loosely fitted in the guide portion is formed, and a contact portion that is in contact with the edge portion is formed; and A locking member that engages with the retaining portion and prevents the clamp member from falling off the guide portion, and a through-hole that is perforated at a base portion opposite to the contact portion of the clamp member A support part that is inserted in the hole so as not to fall off, a biasing member that is fitted into the support part and biases the support part downward, and is provided on the base to support the support part. And a support portion.
[0015] そして、本発明の第 5の態様のクランプ装置は、本発明の第 1の態様乃至第 3の態 様の何れ力 1つのクランプ装置において、前記クランプ部が、前記ベースに設けられ 、頭部にフランジが形成された支柱と、前記支柱に遊嵌される取付孔が穿設され、前 記縁端部に上方から当接する爪部が形成されたクランプ部材と、前記クランプ部材 の上面にスライド可能に設けられ、前記フランジに係合して、該クランプ部材を前記 支柱から脱落不能とする係止プレートと、前記クランプ部材の前記爪部とは反対側の 基部に穿設された貫通孔に、脱落不能に揷通された支持ロッドと、前記支持ロッドに 揷嵌され、該支持ロッドを下方に向かって付勢するコイルばねと、前記ベースに設け られ、前記支持ロッドの下端部を支持する支持部と、を有することを特徴としてレ、る。 [0016] 本発明の第 4又は第 5の態様によれば、ベースに対して、クランプ部材を容易に装 着すること力 Sできる。また、クランプ部材の基部を下から突き上げることで、基部とは反 対側に設けられた当接部 (爪部)がワークをクランプする(押圧する)構成になってい るので、クランプ部の薄型化を図ることができる。 [0015] The clamping device according to the fifth aspect of the present invention is the clamping device according to any one of the first aspect to the third aspect of the present invention, wherein the clamping portion is provided on the base. A support column in which a flange is formed on the head, a clamp member in which a mounting hole that is loosely fitted to the support column is formed, and a claw portion that comes into contact with the edge from above is formed, and an upper surface of the clamp member A locking plate that engages with the flange and prevents the clamp member from falling off the support column, and a through hole formed in a base portion on the opposite side of the claw portion of the clamp member. A support rod that is threaded through the hole so as not to fall off, a coil spring that is fitted into the support rod and biases the support rod downward, and is provided on the base. And a supporting part for supporting It Les as a feature, and Ru. [0016] According to the fourth or fifth aspect of the present invention, the force S for easily mounting the clamp member to the base can be achieved. In addition, by pushing up the base part of the clamp member from below, the contact part (claw part) provided on the opposite side of the base part is configured to clamp (press) the workpiece. Can be achieved.
[0017] また、本発明の第 6の態様の画像形成装置は、本発明の第 1の態様乃至第 5の態 様の何れ力 4つのクランプ装置におけるベースが装着されるステージを所定の搬送 路に沿って搬送する搬送機構と、前記搬送機構によって搬送されるステージ上のヮ 一クのァライメントマークを検出する測定部と、前記測定部の検出結果に基づくァライ メント後のワークに対して画像を形成する描画部と、を有することを特徴としている。  [0017] Further, the image forming apparatus of the sixth aspect of the present invention is configured so that the stage on which the base in any of the four clamping devices of the first aspect to the fifth aspect of the present invention is mounted has a predetermined conveying path. An image for a workpiece after alignment based on the detection result of the measurement unit, a measurement unit for detecting a single alignment mark on the stage conveyed by the conveyance mechanism, And a drawing portion for forming the pattern.
[0018] そして更に、本発明の第 7の態様の画像形成装置は、本発明の第 1の態様乃至第 5の態様の何れ力、 1つのクランプ装置におけるベースが装着されるステージを所定の 搬送路に沿って搬送する搬送機構と、前記搬送機構によって搬送されるステージ上 のワークのァライメントマークを検出する測定部と、前記測定部の検出結果に基づく ァライメント後のワークの描画領域を画像情報に基づいて変調された光ビームにより 露光し、該描画領域に画像を形成する露光部と、を有することを特徴としている。  [0018] Further, in the image forming apparatus of the seventh aspect of the present invention, the force of any one of the first aspect to the fifth aspect of the present invention, the stage on which the base in one clamp device is mounted is transported in a predetermined manner. Image information indicating a conveyance mechanism that conveys along the path, a measurement unit that detects the alignment mark of the workpiece on the stage conveyed by the conveyance mechanism, and a drawing area of the workpiece after alignment based on the detection result of the measurement unit And an exposure unit that performs exposure with a light beam modulated based on the above, and forms an image in the drawing region.
[0019] 本発明の第 6又は第 7の態様の発明によれば、反りが発生してしまうような厚さのヮ ークでも、ステージ上に確実に固定することができる。したがって、そのワークに好適 に画像を形成することができる。  [0019] According to the sixth or seventh aspect of the present invention, even a fork having a thickness that causes warping can be reliably fixed on the stage. Therefore, an image can be suitably formed on the work.
発明の効果  The invention's effect
[0020] 以上のように、本発明によれば、ステージに対して着脱可能とされ、反りが発生して しまうような厚さのワークでも、そのステージ上に確実に固定できるクランプ装置と、そ のクランプ装置を備えた画像形成装置を提供することができる。  [0020] As described above, according to the present invention, there is provided a clamping device that can be securely fixed on a stage even if the workpiece is detachable from the stage and has a thickness that causes warping. It is possible to provide an image forming apparatus provided with the clamping device.
図面の簡単な説明  Brief Description of Drawings
[0021] [図 1]レーザー露光装置を示す概略斜視図である。  FIG. 1 is a schematic perspective view showing a laser exposure apparatus.
[図 2]クランプ装置を示す概略平面図である。  FIG. 2 is a schematic plan view showing a clamp device.
[図 3]ベース部材に設けられたスライド部材とクランプ部材を示す概略斜視図である。  FIG. 3 is a schematic perspective view showing a slide member and a clamp member provided on the base member.
[図 4]ベース部材に設けられたスライド部材を示す概略平面図である。  FIG. 4 is a schematic plan view showing a slide member provided on the base member.
[図 5(A)]クランプ部材の係止プレート摺動前を示す概略平面図である。 [図 5(B)]クランプ部材の係止プレート摺動後を示す概略平面図である。 FIG. 5 (A) is a schematic plan view showing the clamp member before the locking plate slides. FIG. 5 (B) is a schematic plan view showing the clamp member after sliding the locking plate.
[図 6(A)]位置決め部の構成を示す概略斜視図である。  FIG. 6 (A) is a schematic perspective view showing a configuration of a positioning portion.
[図 6(B)]位置決め部の構成を示す概略斜視図である。  FIG. 6 (B) is a schematic perspective view showing the configuration of the positioning portion.
[図 7(A)]位置決め部による位置決め方法を説明する概略平面図である。  FIG. 7 (A) is a schematic plan view for explaining a positioning method by a positioning unit.
[図 7(B)]位置決め部による位置決め方法を説明する概略平面図である。  FIG. 7 (B) is a schematic plan view for explaining a positioning method by a positioning unit.
[図 7(C)]位置決め部による位置決め方法を説明する概略平面図である。  FIG. 7C is a schematic plan view for explaining a positioning method by the positioning unit.
[図 7(D)]位置決め部による位置決め方法を説明する概略平面図である。  FIG. 7 (D) is a schematic plan view for explaining a positioning method by a positioning unit.
[図 8(A)]可動タイプのクランプ部で厚さの異なる基板材料をクランプしたときの様子を 示す概略側面図である。  FIG. 8 (A) is a schematic side view showing a state in which substrate materials having different thicknesses are clamped by a movable type clamp portion.
[図 8(B)]可動タイプのクランプ部で厚さの異なる基板材料をクランプしたときの様子を 示す概略側面図である。  FIG. 8 (B) is a schematic side view showing a state in which substrate materials having different thicknesses are clamped by a movable type clamp portion.
[図 8(C)]可動タイプのクランプ部で厚さの異なる基板材料をクランプしたときの様子を 示す概略側面図である。  FIG. 8 (C) is a schematic side view showing a state in which substrate materials having different thicknesses are clamped by a movable type clamp portion.
[図 9(A)]固定タイプのクランプ部で厚さの異なる基板材料をクランプしたときの様子を 示す概略側面図である。  FIG. 9 (A) is a schematic side view showing a state in which substrate materials having different thicknesses are clamped by a fixed type clamp portion.
[図 9(B)]固定タイプのクランプ部で厚さの異なる基板材料をクランプしたときの様子を 示す概略側面図である。  FIG. 9 (B) is a schematic side view showing a state in which substrate materials having different thicknesses are clamped by a fixed type clamp portion.
[図 9(C)]固定タイプのクランプ部で厚さの異なる基板材料をクランプしたときの様子を 示す概略側面図である。  FIG. 9 (C) is a schematic side view showing a state in which substrate materials having different thicknesses are clamped by a fixed type clamp portion.
[図 10(A)]露光ヘッドによる露光領域を示す概略平面図である。  FIG. 10 (A) is a schematic plan view showing an exposure area by an exposure head.
[図 10(B)]露光ヘッドの配列パターンを示す概略平面図である。 FIG. 10 (B) is a schematic plan view showing an arrangement pattern of exposure heads.
発明を実施するための最良の形態 BEST MODE FOR CARRYING OUT THE INVENTION
以下、本発明の最良な実施の形態について、図面に示す実施例を基に詳細に説 明する。図 1は本発明に係る画像形成装置としての一例を示すレーザー露光装置 1 0の概略斜視図であり、図 2乃至図 9 (A) (B) (C)はクランプ装置の構成を示す概略 図である。なお、図 1、図 2において、矢印 Aを搬送方向、矢印 Bを幅方向とし、矢印 F Rを「前」、矢印 REを「後」、矢印 RIを「右」、矢印 LEを「左」として、各部の位置を前後 左右の表現を用いて説明する場合がある。 [0023] [レーザー露光装置の構成] The best mode for carrying out the present invention will be described in detail below based on the embodiments shown in the drawings. FIG. 1 is a schematic perspective view of a laser exposure apparatus 10 showing an example of an image forming apparatus according to the present invention, and FIGS. It is. 1 and 2, arrow A is the transport direction, arrow B is the width direction, arrow FR is “front”, arrow RE is “back”, arrow RI is “right”, and arrow LE is “left”. In some cases, the position of each part is described using front / rear / right / left expressions. [0023] [Configuration of laser exposure apparatus]
まず最初に、レーザー露光装置 10について説明する。図 1で示すように、このレー ザ一露光装置 10は、 6本の脚部 12に支持された矩形厚板状の設置台 14を備えて いる。設置台 14の上面には、長手方向(搬送方向)に沿って 2本のガイドレール 16が 配設されており、これら 2本のガイドレール 16上には、ガイド部 19を介して矩形平板 状のステージ部材 20が設けられてレ、る。  First, the laser exposure apparatus 10 will be described. As shown in FIG. 1, the laser one exposure apparatus 10 includes a rectangular thick plate-shaped installation base 14 supported by six legs 12. Two guide rails 16 are arranged on the upper surface of the installation table 14 along the longitudinal direction (conveying direction). On the two guide rails 16, a rectangular flat plate shape is provided via a guide portion 19. The stage member 20 is provided.
[0024] ステージ部材 20は、長手方向がガイドレール 16の延設方向(搬送方向)を向くよう に配置され、ガイドレール 16及びガイド部 19によって設置台 14上を往復移動可能 に支持されている。すなわち、例えばモーター 18及びボールネジ 22等の搬送機構 によって、ガイドレール 16に沿って所定の速度で往復移動するように構成されている  [0024] The stage member 20 is disposed such that the longitudinal direction thereof faces the extending direction (conveying direction) of the guide rail 16, and is supported by the guide rail 16 and the guide portion 19 so as to be capable of reciprocating on the installation table 14. . That is, for example, it is configured to reciprocate at a predetermined speed along the guide rail 16 by a transport mechanism such as a motor 18 and a ball screw 22.
[0025] ステージ部材 20の上面には、露光対象物となる矩形平板状の基板材料 100が、図 示しない位置決め部により、所定の位置に位置決めされた状態で載置される。このス テージ部材 20の上面には、複数(多数)の孔部 20Aが穿設されており、そのステージ 部材 20の内部が負圧供給源(図示省略)によって負圧とされることにより、孔部 20A からエアーが吸引され、その吸引力によって基板材料 100がステージ部材 20の上面 に吸着'保持されるようになってレ、る。 [0025] On the upper surface of the stage member 20, a rectangular flat substrate material 100 as an exposure object is placed in a state of being positioned at a predetermined position by a positioning unit (not shown). A plurality of (many) holes 20A are formed on the upper surface of the stage member 20, and the inside of the stage member 20 is made negative by a negative pressure supply source (not shown), so that Air is sucked from the portion 20A, and the suction force causes the substrate material 100 to be sucked and held on the upper surface of the stage member 20.
[0026] なお、基板材料 100が、所定の厚さ以上で、反りが発生している場合には、エアー の吸引力だけでは充分に吸着 ·保持できないので (確実に固定することが困難である ため)、後述するクランプ装置 30によって、基板材料 100がステージ部材 20の上面 に確実に吸着 ·保持(固定)されるように補助する。  [0026] When the substrate material 100 has a predetermined thickness or more and is warped, it cannot be sufficiently adsorbed and held only by the air suction force (it is difficult to securely fix it). Therefore, the clamping device 30 described later assists the substrate material 100 to be securely attracted and held (fixed) on the upper surface of the stage member 20.
[0027] また、基板材料 100には、その被露光面上の描画領域における露光位置の基準を 示すァライメントマーク(図示省略)が複数設けられている。このァライメントマークは、 例えば円形の貫通孔によって構成され、基板材料 100の四隅(以下「コーナー部」と いう)近傍にそれぞれ 1個ずつ計 4個配設されている。  [0027] Further, the substrate material 100 is provided with a plurality of alignment marks (not shown) indicating the reference of the exposure position in the drawing region on the exposed surface. The alignment marks are formed by, for example, circular through-holes, and a total of four alignment marks are disposed in the vicinity of the four corners (hereinafter referred to as “corner portions”) of the substrate material 100.
[0028] 設置台 14の中央部には、ステージ部材 20の移動経路を跨ぐように略「コ」字状のゲ ート 24が設けられている。ゲート 24は、両端部がそれぞれ設置台 14に固定されてお り、ゲート 24を挟んで、一方の側(後側)には、基板材料 100を露光する露光部(描 画部)としての露光ヘッド 28が設けられ、他方の側(前側)には、基板材料 100に設 けられたァライメントマークを撮影する測定部としての複数 (例えば 2台)の CCDカメラ 26が設けられている。 A substantially “U” -shaped gate 24 is provided at the center of the installation table 14 so as to straddle the movement path of the stage member 20. Both ends of the gate 24 are fixed to the installation base 14, and an exposure part (drawing) for exposing the substrate material 100 is exposed on one side (rear side) across the gate 24. An exposure head 28 is provided as an image section, and a plurality of (for example, two) CCD cameras 26 as measurement sections for photographing alignment marks provided on the substrate material 100 are provided on the other side (front side). Is provided.
[0029] したがって、基板材料 100がステージ部材 20の移動に伴って CCDカメラ 26の下方 を通過する際に、その CCDカメラ 26によるァライメントマークの測定が行われる。す なわち、各 CCDカメラ 26は、基板材料 100のァライメントマークが所定の撮影位置に 至ったタイミングで、ストロボ光源を発光させ、基板材料 100へ照射したストロボ光の 基板材料 100上面での反射光を、レンズを介してカメラ本体に入力させることにより、 そのァライメントマークを撮影する。  Accordingly, when the substrate material 100 passes below the CCD camera 26 as the stage member 20 moves, the alignment mark is measured by the CCD camera 26. In other words, each CCD camera 26 causes the strobe light source to emit light at the timing when the alignment mark of the substrate material 100 reaches a predetermined photographing position, and the strobe light irradiated to the substrate material 100 is reflected on the upper surface of the substrate material 100. The alignment mark is photographed by inputting light into the camera body through the lens.
[0030] また、ステージ部材 20を移動させるための搬送機構(モーター 18及びボールネジ 2 2)、 CCDカメラ 26、露光ヘッド 28等は、これらを制御するコントローラー(図示省略) に接続されている。このコントローラーにより、ステージ部材 20は所定の速度で移動 するように制御され、 CCDカメラ 26は所定のタイミングで基板材料 100のァライメント マークを撮影するように制御され、露光ヘッド 28は所定のタイミングで基板材料 100 を露光するように制御される。  In addition, a transport mechanism (motor 18 and ball screw 22) for moving the stage member 20, a CCD camera 26, an exposure head 28, and the like are connected to a controller (not shown) that controls them. By this controller, the stage member 20 is controlled to move at a predetermined speed, the CCD camera 26 is controlled to photograph the alignment mark of the substrate material 100 at a predetermined timing, and the exposure head 28 is controlled to the substrate at a predetermined timing. Controlled to expose material 100.
[0031] 露光ヘッド 28は、 m行 n列(例えば 2行 4歹 IJ)の略マトリックス状に配列されてレ、る。そ して、図 10 (A) (B)で示すように、露光ヘッド 28による露光エリア 28Aは、例えば搬 送方向を短辺とする矩形状に構成されている。したがって、基板材料 100には、その 搬送方向(前側から後側)への移動動作に伴って、露光ヘッド 28毎に帯状の露光済 み領域 102が形成される。  [0031] The exposure heads 28 are arranged in an approximate matrix of m rows and n columns (for example, 2 rows 4 mm IJ). Then, as shown in FIGS. 10A and 10B, an exposure area 28A by the exposure head 28 is configured in a rectangular shape having a short side in the transport direction, for example. Therefore, a strip-shaped exposed region 102 is formed for each exposure head 28 in the substrate material 100 in accordance with the movement operation in the transport direction (front side to rear side).
[0032] また、帯状の露光済み領域 102が搬送方向と直交する幅方向(左右方向)に隙間 無く並ぶように、ライン状に配列された各行の露光ヘッド 28の各々は、配列方向に所 定間隔(露光エリア 28Aの長辺の自然数倍)ずらして配置されている。このため、例 えば第 1行目の露光エリア 28Aと第 2行目の露光エリア 28Aとの間の露光できない部 分は、第 2行目の露光エリア 28Aにより露光することができる。  [0032] In addition, each of the exposure heads 28 of each row arranged in a line is predetermined in the arrangement direction so that the strip-shaped exposed regions 102 are arranged without gaps in the width direction (left-right direction) orthogonal to the transport direction. Arranged at intervals (natural number times the long side of the exposure area 28A). For this reason, for example, a portion that cannot be exposed between the exposure area 28A in the first row and the exposure area 28A in the second row can be exposed in the exposure area 28A in the second row.
[0033] 各露光ヘッド 28は、それぞれ入射されたレーザービームを画像データに応じて各 画素毎に変調する空間光変調素子としてのデジタル 'マイクロミラー ·デバイス(DM D) (図示省略)を備えている。この DMDは、データ処理部とミラー駆動制御部を備え た上記コントローラーに接続されている。 [0033] Each exposure head 28 includes a digital 'micromirror device (DM D) (not shown) as a spatial light modulation element that modulates the incident laser beam for each pixel in accordance with image data. Yes. This DMD has a data processor and mirror drive controller. Connected to the above controller.
[0034] コントローラーのデータ処理部では、入力された画像データに基づいて、各露光へ ッド 28毎に DMDの制御すべき領域内の各マイクロミラーを駆動制御する制御信号 を生成する。また、ミラー駆動制御部では、データ処理部で生成した制御信号に基 づいて、各露光ヘッド 28毎に DMDにおける各マイクロミラーの反射面の角度を制御 する。  The data processing unit of the controller generates a control signal for driving and controlling each micromirror in the region to be controlled by the DMD for each exposure head 28 based on the input image data. In addition, the mirror drive control unit controls the angle of the reflection surface of each micromirror in the DMD for each exposure head 28 based on the control signal generated by the data processing unit.
[0035] 各露光ヘッド 28における DMDの光入射側には、マルチビームをレーザー光として 出射する照明装置から引き出されたバンドル状の光ファイバ一が接続されている。照 明装置は、その内部に複数の半導体レーザーチップから出射されたレーザー光を合 波して光ファイバ一に入力する合波モジュールが複数個設置されている。各合波モ ジュール力 延びる光ファイバ一は、合波したレーザー光を伝搬する合波光ファイバ 一であって、複数の光ファイバ一が 1つに束ねられてバンドル状の光ファイバ一として 形成されている。  A bundle-shaped optical fiber drawn from an illumination device that emits multi-beams as laser light is connected to the light incident side of the DMD in each exposure head 28. The illumination device has a plurality of multiplexing modules that multiplex laser beams emitted from a plurality of semiconductor laser chips and input them to the optical fiber. Each optical module that extends is an optical fiber that propagates the combined laser light. A plurality of optical fibers are bundled into one to form a bundle of optical fibers. Yes.
[0036] [レーザー露光装置の作用]  [0036] [Operation of laser exposure apparatus]
次に、以上のような構成のレーザー露光装置 10の作用について説明する。なお、 レーザー露光装置 10により画像露光を行う基板材料 100としては、プリント配線基板 や液晶表示素子等のパターンを形成 (画像露光)する材料としての基板や、ガラスプ レート等の表面に感光性エポキシ樹脂等のフォトレジストを塗布、又はドライフィルム の場合はラミネートしたものなどが挙げられる。  Next, the operation of the laser exposure apparatus 10 configured as described above will be described. The substrate material 100 for image exposure by the laser exposure apparatus 10 includes a substrate as a material for forming a pattern (image exposure) such as a printed wiring board and a liquid crystal display element, and a photosensitive epoxy resin on the surface of a glass plate or the like. In the case of a dry film, it may be laminated.
[0037] まず、図示しないローダーによって基板材料 100がステージ部材 20の上面に載置 され、図示しない位置決め部によって位置決めされると、その基板材料 100は、孔部 20Aからのエアーの吸引によりステージ部材 20の上面に吸着'保持される。  First, when the substrate material 100 is placed on the upper surface of the stage member 20 by a loader (not shown) and positioned by a positioning unit (not shown), the substrate material 100 is sucked by air from the hole 20A. Adsorbed 'held on the top surface of 20.
[0038] このとき、基板材料 100が、例えば 3mm以上の厚い基板で、反りが発生している場 合には、エアーの吸引力だけでは充分に吸着 ·保持できないので (確実に固定する ことが困難であるため)、後述するクランプ装置 30のベース部材 32に基板材料 100 を載置し、そのベース部材 32に設けられているクランプ部 34で基板材料 100をクラ ンプし、そのベース部材 32ごとステージ部材 20に取り付ける。このとき、ベース部材 3 2にはステージ部材 20と同様の孔部 32Aが複数(多数)穿設されているので、ベース 部材 32を介して基板材料 100がステージ部材 20上に吸着 ·保持(固定)される。 [0038] At this time, if the substrate material 100 is a thick substrate of 3 mm or more, for example, and warping has occurred, it cannot be sufficiently adsorbed and held only by the air suction force (can be securely fixed). For this reason, the substrate material 100 is placed on the base member 32 of the clamping device 30 to be described later, and the substrate material 100 is clamped by the clamp portion 34 provided on the base member 32. Attach to stage member 20. At this time, the base member 32 is provided with a plurality of (a large number of) holes 32A similar to the stage member 20. The substrate material 100 is sucked and held (fixed) on the stage member 20 through the member 32.
[0039] こうして、基板材料 100をステージ部材 20の上面に吸着 ·保持(固定)したら、ステ 一ジ部材 20が搬送方向(後側から前側)へ移動し始め、基板材料 100が CCDカメラ 26によるァライメント検出工程へ搬送される。すなわち、オペレーターがコントローラ 一の指示入力部から露光開始の入力操作を行うことにより、レーザー露光装置 10の 露光動作が開始される。 When the substrate material 100 is sucked and held (fixed) on the upper surface of the stage member 20 in this way, the stage member 20 starts to move in the transport direction (from the rear side to the front side), and the substrate material 100 is moved by the CCD camera 26. It is conveyed to the alignment detection process. That is, the exposure operation of the laser exposure apparatus 10 is started by the operator performing an exposure start input operation from the instruction input unit of the controller.
[0040] まず、コントローラ一により搬送機構(モーター 18及びボールネジ 22)が制御され、 基板材料 100を上面に吸着'保持したステージ部材 20が、ガイドレール 16に沿って 搬送方向(後側から前側)に一定速度で移動を開始する。このステージ部材 20の移 動開始に同期して、又は基板材料 100の先端が各 CCDカメラ 26の真下に達する少 し手前のタイミングで、各 CCDカメラ 26はコントローラ一により制御されて作動を開始 する。 [0040] First, the transport mechanism (the motor 18 and the ball screw 22) is controlled by the controller, and the stage member 20 holding the substrate material 100 on the upper surface is held along the guide rail 16 in the transport direction (from the rear side to the front side). Start moving at a constant speed. In synchronism with the start of movement of the stage member 20 or at a timing just before the tip of the substrate material 100 reaches just below each CCD camera 26, each CCD camera 26 is controlled by the controller and starts operating. .
[0041] すなわち、例えば基板材料 100の各コーナー部近傍に設けられた 4個のァライメン トマークが、各 CCDカメラ 26におけるレンズの光軸上(CCDカメラ 26の真下)にそれ ぞれ達すると、各 CCDカメラ 26は、所定のタイミングでストロボ光源を発光し、各ァラ ィメントマークを撮影する。そして、撮影された画像データ(基準位置データ)は、コン トローラーのデータ処理部へ出力される。  That is, for example, when four alignment marks provided in the vicinity of each corner of the substrate material 100 reach the optical axis of the lens in each CCD camera 26 (below the CCD camera 26), The CCD camera 26 emits a strobe light source at a predetermined timing, and photographs each alignment mark. The captured image data (reference position data) is output to the data processing unit of the controller.
[0042] データ処理部は、入力された各ァライメントマークの画像データ(基準位置データ) 力 判明する画像内におけるァライメントマークの位置及びァライメントマーク間のピ ツチ等と、そのァライメントマークを撮影したときのステージ部材 20の位置及び CCD カメラ 26の位置から、演算処理によって、ステージ部材 20上における基板材料 100 の位置ずれ、移動方向に対する傾き、寸法精度誤差等を把握し、基板材料 100の被 露光面に対する適正な露光位置を算出する。  [0042] The data processing unit inputs the image data (reference position data) of each alignment mark. The position of the alignment mark in the image to be determined, the pitch between the alignment marks, and the alignment mark. From the position of the stage member 20 at the time of shooting and the position of the CCD camera 26, the positional deviation of the substrate material 100 on the stage member 20, the inclination with respect to the moving direction, the dimensional accuracy error, etc. are ascertained by calculation processing. Calculate the appropriate exposure position for the exposed surface.
[0043] ここで、露光パターンに応じた画像データは、コントローラー内のメモリーに一旦記 憶されている。したがって、露光ヘッド 28による画像露光時に、そのメモリーに記憶さ れている露光パターンの画像データに基づいて生成する制御信号を、上記した適正 な露光位置に合わせ込んで画像露光する補正制御(ァライメント)を実行する。なお、 この画像データは、画像を構成する各画素の濃度を 2値(ドットの記録の有無)で表し たデータである。 Here, the image data corresponding to the exposure pattern is temporarily stored in the memory in the controller. Therefore, during image exposure by the exposure head 28, correction control (alignment) for aligning the control signal generated based on the image data of the exposure pattern stored in the memory with the appropriate exposure position described above (alignment). Execute. In this image data, the density of each pixel constituting the image is expressed in binary (whether or not dots are recorded). Data.
[0044] こうして、各 CCDカメラ 26によるァライメントマークの測定 (撮影)が完了すると、ステ 一ジ部材 20は搬送機構(モーター 18及びボールネジ 22)の駆動により、露光ヘッド 28による露光工程へと搬送される。すなわち、ステージ部材 20はガイドレール 16に 沿って上記とは逆の方向(前側から後側)へ移動を開始する。そして、基板材料 100 の被露光面における描画領域が、露光ヘッド 28下方の露光開始位置に達すると、各 露光ヘッド 28はレーザービームを照射して基板材料 100の被露光面 (描画領域)に 対する画像露光を開始する。  [0044] Thus, when the alignment mark measurement (photographing) by each CCD camera 26 is completed, the stage member 20 is transported to the exposure process by the exposure head 28 by driving the transport mechanism (motor 18 and ball screw 22). Is done. That is, the stage member 20 starts to move along the guide rail 16 in the opposite direction (from the front side to the rear side). When the drawing area on the exposed surface of the substrate material 100 reaches the exposure start position below the exposure head 28, each exposure head 28 irradiates a laser beam to the exposed surface (drawing area) of the substrate material 100. Start image exposure.
[0045] すなわち、コントローラーのメモリーに記憶された画像データが複数ライン分ずつ順 次読み出され、データ処理部で読み出された画像データに基づいて各露光ヘッド 2 8毎に制御信号が生成される。この制御信号には、補正制御(ァライメント)により、ァ ライメント測定した基板材料 100に対する露光位置ずれの補正が加えられている。そ して、ミラー駆動制御部は、生成及び補正された制御信号に基づいて各露光ヘッド 2 8毎に DMDのマイクロミラーの各々をオン'オフ制御する。  That is, the image data stored in the memory of the controller is sequentially read out for a plurality of lines, and a control signal is generated for each exposure head 28 based on the image data read out by the data processing unit. The This control signal is subjected to correction of exposure position deviation with respect to the substrate material 100 measured by alignment by correction control (alignment). Then, the mirror drive control unit performs on / off control of each micromirror of the DMD for each exposure head 28 based on the generated and corrected control signals.
[0046] 照明装置の光ファイバ一力 出射されたレーザー光が DMDに照射されると、 DM Dのマイクロミラーがオン状態のときに反射されたレーザー光力 レンズ系により基板 材料 100の被露光面上に結像される。こうして、照明装置から出射されたレーザー光 が画素毎にオン'オフされて、基板材料 100が DMDの使用画素数と略同数の画素 単位(露光エリア 28A)で露光される。  [0046] When the laser beam emitted from the optical fiber of the illuminating device is irradiated onto the DMD, the laser light force reflected when the micromirror of the DMD is turned on. The exposed surface of the substrate material 100 by the lens system Imaged on top. In this way, the laser light emitted from the illumination device is turned on and off for each pixel, and the substrate material 100 is exposed in approximately the same number of pixels (exposure area 28A) as the number of pixels used in the DMD.
[0047] そして、基板材料 100がステージ部材 20と共に一定速度で移動されることにより、 基板材料 100が露光ヘッド 28によってステージ部材 20の移動方向と反対の方向(図 10 (A)において矢印 Sで示す走查方向)に露光され、各露光ヘッド 28毎に帯状の露 光済み領域 102が形成される(図 10 (A)参照)。  Then, the substrate material 100 is moved together with the stage member 20 at a constant speed, so that the substrate material 100 is moved by the exposure head 28 in the direction opposite to the moving direction of the stage member 20 (in FIG. A strip-shaped exposed region 102 is formed for each exposure head 28 (see FIG. 10A).
[0048] こうして、露光ヘッド 28による基板材料 100への画像露光が完了すると、ステージ 部材 20は、基板材料 100が載置された初期位置に復帰するので、エアーの吸引に よる吸着、更にはクランプ装置 30によるクランプが解除され、図示しないアンローダ 一によつてステージ部材 20 (ベース部材 32)上から基板材料 100が取り除かれる。そ して、ステージ部材 20上から取り除かれた基板材料 100は、図示しない機外の搬送 コンベアへ搬送され、次工程へ搬送される。 [0048] Thus, when the image exposure onto the substrate material 100 by the exposure head 28 is completed, the stage member 20 returns to the initial position where the substrate material 100 is placed, so that suction by air suction and further clamping are performed. The clamp by the apparatus 30 is released, and the substrate material 100 is removed from the stage member 20 (base member 32) by an unloader (not shown). The substrate material 100 removed from the stage member 20 is transported outside the machine (not shown). It is conveyed to the conveyor and conveyed to the next process.
[0049] [クランプ装置の構成]  [0049] [Configuration of clamping device]
次に、以上のようなレーザー露光装置 10等の画像形成装置において使用されるク ランプ装置 30について、図 2乃至図 9 (A) (B) (C)を基に詳細に説明する。図 2で示 すように、このクランプ装置 30は、ステージ部材 20上に載置され、図示しない位置決 め部によって位置決めされる矩形板状の(当然ながら基板材料 100よりも表面積が 大きレ、)ベース部材 32と、ベース部材 32に設けられるクランプ部 34とを有してレ、る。 Next, the clamp apparatus 30 used in the image forming apparatus such as the laser exposure apparatus 10 will be described in detail with reference to FIGS. 2 to 9A, 9B, and 9C. As shown in FIG. 2, the clamping device 30 is placed on the stage member 20 and is rectangular plate-shaped (which naturally has a surface area larger than that of the substrate material 100, which is positioned by a positioning portion not shown). ) and the base member 3 2, and a clamp portion 34 provided on the base member 32 Les, Ru.
[0050] ベース部材 32には、ステージ部材 20上に載置 ·位置決めしたときに、孔部 20Aと 同位置になって連通する孔部 32Aが複数(多数)穿設されており、ベース部材 32上 に載置される基板材料 100を、ベース部材 32を介して(ベース部材 32ごと)ステージ 部材 20が吸着 ·保持(固定)できるように構成されている。  [0050] The base member 32 is provided with a plurality of (many) holes 32A that are in communication with the holes 20A when placed on the stage member 20 and positioned. The substrate member 100 placed thereon can be sucked and held (fixed) by the stage member 20 via the base member 32 (for each base member 32).
[0051] クランプ部 34は、固定タイプのクランプ部 34Aと可動タイプのクランプ部 34Bの 2種 類設けられ、例えば、ステージ部材 20の前側と左側が固定タイプのクランプ部 34Aと され、右側と後側が可動タイプのクランプ部 34Bとされる。  [0051] The clamp part 34 is provided in two types, a fixed type clamp part 34A and a movable type clamp part 34B. For example, the front side and the left side of the stage member 20 are fixed type clamp parts 34A, and the right side and the rear side. The side is the movable clamp part 34B.
[0052] 固定タイプのクランプ部 34Aは、後述するスライド部材 36が固定部材 38とされ、そ のために、図 6 (A) (B)で詳細に示す位置決め部 70が設けられていない点、及び基 板材料 100をベース部材 32に載置したときに、最初に位置決めする位置決め部、例 えば位置決めピン 33が、後述する固定プレート 46の内方側近傍に複数(図示のもの は前側に 2個、左側に 1個の計 3個)立設されている点が、可動タイプのクランプ部 34 Bとは異なっている。したがって、以下、可動タイプのクランプ部 34Bについて主に説 明し、固定タイプのクランプ部 34Aについては、各図において、可動タイプのクランプ 部 34Bと同等の機能を有するものに同じ符号を付して、その詳細な説明は省略する  [0052] The fixed type clamp portion 34A has a slide member 36, which will be described later, as a fixed member 38. Therefore, the positioning portion 70 shown in detail in FIGS. 6A and 6B is not provided. When the base plate material 100 is placed on the base member 32, a plurality of positioning portions, for example, positioning pins 33, which are positioned first, are arranged in the vicinity of the inner side of the fixing plate 46 described later (the one shown in the figure is on the front side). This is different from the movable type clamp part 34 B in that it is erected. Therefore, the movable type clamp part 34B will be mainly described below, and the fixed type clamp part 34A is denoted by the same reference numerals in the drawings with the same functions as those of the movable type clamp part 34B. The detailed explanation is omitted.
[0053] 図 3、図 4で示すように、可動タイプのクランプ部 34Bは、ベース部材 32に載置され た基板材料 100に対して接近 '離間するように、スライド可能かつ固定可能に設けら れる細長いプレート状のスライド部材 36と、スライド部材 36に対して着脱可能に取り 付けられる略矩形板状の複数(図示のものは基板材料 100の各辺に対して 3個ずつ )のクランプ部材 40とを有している。なお、固定タイプのクランプ部 34Aにおいては、 固定部材 38に対してクランプ部材 40が着脱可能に複数(図示のものは基板材料 10 0の各辺に対して 3個ずつ)取り付けられる。 As shown in FIGS. 3 and 4, the movable type clamp portion 34B is provided so as to be slidable and fixable so as to approach and separate from the substrate material 100 placed on the base member 32. A long and narrow plate-like slide member 36 and a plurality of substantially rectangular plate-like clamp members (three are shown for each side of the substrate material 100 in the figure) that are detachably attached to the slide member 36. And have. In the fixed clamp part 34A, A plurality of clamp members 40 are detachably attached to the fixing member 38 (three in the figure are attached to each side of the substrate material 100).
[0054] スライド部材 36の両端部には、その長手方向と直交する方向に長い長孔 36Aが穿 設されており、その長孔 36Aに、手指で螺合できる固定ネジ 90が揷通されてベース 部材 32にネジ止めされている。したがって、スライド部材 36は、ベース部材 32上を基 板材料 100に対して接近'離間する方向に、手動によってスライド可能かつ固定可能 となる構成である。なお、固定部材 38は、取付ネジ 94によってベース部材 32に固定 されている。 [0054] At both ends of the slide member 36, long elongated holes 36A are formed in a direction perpendicular to the longitudinal direction, and fixing screws 90 that can be screwed with fingers are passed through the elongated holes 36A. Screwed to base member 32. Therefore, the slide member 36 is configured to be manually slidable and fixable in a direction in which the base member 32 approaches and separates from the base material 100. Note that the fixing member 38 is fixed to the base member 32 by mounting screws 94.
[0055] また、スライド部材 36の上面には、クランプ部材 40を取り付けるための略円柱状の 支柱 44が取付プレート 42を介して立設されている。取付プレート 42は二股状に形成 された基部 42A側が、スライド部材 36に取付ネジ 96によって取り付けられ、先端 42 B側の所定位置に支柱 44が立設されている。  Further, on the upper surface of the slide member 36, a substantially columnar column 44 for mounting the clamp member 40 is erected via the mounting plate 42. The mounting plate 42 has a bifurcated base portion 42A side attached to the slide member 36 with mounting screws 96, and a column 44 is erected at a predetermined position on the tip 42B side.
[0056] この支柱 44は、スライド部材 36の長手方向に所定間隔を隔てて複数(図示のもの はクランプ部材 40が 1つに対して 3個ずつ)取付プレート 42を介して立設されており、 各支柱 44の上部には、支柱 44よりも大径とされた略円板状のフランジ 44Aがー体に 形成されている。そして、支柱 44の下端部には、図 8 (A) (B) (C)で示すように、取付 ネジ 92が螺合されてレ、る。  [0056] A plurality of the support poles 44 are erected via a mounting plate 42 at a predetermined interval in the longitudinal direction of the slide member 36 (three clamp members 40 are shown in the figure). A substantially disc-shaped flange 44A having a larger diameter than that of the support 44 is formed on the upper portion of each support 44. Then, as shown in FIGS. 8 (A), (B), and (C), a mounting screw 92 is screwed onto the lower end portion of the column 44.
[0057] また、スライド部材 36よりも内方側(基板材料 100側)には、固定プレート 46が、スラ イド部材 36と平行に、かつ所定間隔を隔てて、取付ネジ 94によって取り付けられて いる。この固定プレート 46には、長手方向と直交する方向(基板材料 100に対して接 近'離間する方向)に長い長孔 46Aが、支柱 44の取付ネジ 92を含む下端部を挿入 可能に穿設されており、スライド部材 36が長孔 36Aに沿って移動するときに、支柱 4 4の下端部が長孔 46Aに沿って移動するように構成されている。  Further, on the inner side (substrate material 100 side) of the slide member 36, a fixing plate 46 is attached by mounting screws 94 in parallel to the slide member 36 and at a predetermined interval. . This fixed plate 46 has a long hole 46A that is long in the direction perpendicular to the longitudinal direction (the direction in which it is close to or away from the substrate material 100) so that the lower end portion including the mounting screw 92 of the column 44 can be inserted. Thus, when the slide member 36 moves along the long hole 36A, the lower end portion of the support 44 is configured to move along the long hole 46A.
[0058] なお、固定部材 38側にも同様の固定プレート 46が、固定部材 38と平行に、かつ所 定間隔を隔てて、取付ネジ 94によって取り付けられる力 この固定プレート 46には長 孔 46Aは穿設されない。つまり、固定部材 38側には、取付プレート 42が取り付けら れず、支柱 44は固定プレート 46に直接取り付けられている(図 9 (A) (B) (C)参照)。  [0058] It should be noted that the same fixing plate 46 is also provided on the fixing member 38 side in parallel with the fixing member 38 and at a predetermined interval by a mounting screw 94. The fixing plate 46 has a long hole 46A. Not drilled. That is, the mounting plate 42 is not attached to the fixing member 38 side, and the support 44 is directly attached to the fixing plate 46 (see FIGS. 9A, 9B, and 9C).
[0059] したがって、基板材料 100は、固定プレート 46よりも内側に配置され、スライド部材 36は、固定プレート 46よりも外方側で、固定プレート 46に対して接近 '離間するよう にスライドする。つまり、可動タイプのクランプ部 34Bは、スライド部材 36が固定プレ ート 46に対して接近 ·離間することにより、固定プレート 46の内側に配置された基板 材料 100の描画領域外である縁端部 100Aに対するクランプ部材 40の位置が調整 できる構成になっている。 [0059] Accordingly, the substrate material 100 is disposed on the inner side of the fixed plate 46, and the slide member 36 slides toward and away from the fixed plate 46 on the outer side of the fixed plate 46. In other words, the movable type clamp part 34B has an edge part that is outside the drawing region of the substrate material 100 arranged inside the fixed plate 46 when the slide member 36 approaches and separates from the fixed plate 46. The clamp member 40 can be adjusted with respect to 100A.
[0060] 一方、図 5 (A) (B)で示すように、クランプ部材 40の幅方向(矢印 Dで示す)略中央 部には、支柱 44 (フランジ 44Aを含む)が遊揷可能な取付孔 40Aが、長手方向に沿 つて、かつ所定間隔を隔てて複数(図示のものは 3個)穿設されており、クランプ部材 40の上面略中央部には、その長手方向に摺動可能に構成された係止プレート 50が 、クランプ部材 40の長手方向の長さよりも少し短い長さ(長手方向に摺動させてもクラ ンプ部材 40から突出しない程度の長さ)で設けられている。  [0060] On the other hand, as shown in FIGS. 5 (A) and 5 (B), the support 44 (including the flange 44A) can be loosely mounted in the substantially central portion of the clamp member 40 in the width direction (indicated by arrow D). A plurality of holes 40A are formed along the longitudinal direction with a predetermined interval (three in the figure), and the clamp member 40 is slidable in the longitudinal direction at the substantially central portion of the upper surface. The configured locking plate 50 is provided with a length slightly shorter than the length in the longitudinal direction of the clamp member 40 (a length that does not protrude from the clamp member 40 even if it is slid in the longitudinal direction).
[0061] また、この係止プレート 50には、長手方向(摺動方向)に長い長孔 50Aが、所定間 隔を隔てて 2っ穿設され、その長孔 50Aを通して、取付ネジ 94がそれぞれクランプ 部材 40の上面に取り付けられている。これにより、係止プレート 50が長手方向に、そ の長孔 50Aの範囲内で摺動可能となる構成である。  [0061] In addition, two long holes 50A that are long in the longitudinal direction (sliding direction) are formed in the locking plate 50 at predetermined intervals, and mounting screws 94 are respectively inserted through the long holes 50A. Clamp member 40 is attached to the upper surface. As a result, the locking plate 50 can slide in the longitudinal direction within the range of the long hole 50A.
[0062] また、この係止プレート 50には、フランジ 44Aと同径カ 又はそれよりも若干大径で 、取付孔 40Aよりも小径とされた大径部 52Aと、支柱 44と同径で、かつ摺動方向に 長孔状とされた小径部 52Bとが連通して形成された係止孔 52が、取付孔 40Aに連 通可能に 2個、図示のものは中央と右側に穿設されている。そして、係止プレート 50 の左端部には、小径部 52Bと略同一とされた切欠部 53が形成されている。  [0062] Further, the locking plate 50 has the same diameter as the flange 44A or a slightly larger diameter than the flange 44A and a smaller diameter than the mounting hole 40A, and the same diameter as the support 44. In addition, two locking holes 52 formed so as to communicate with the small-diameter portion 52B, which has a long hole shape in the sliding direction, can be communicated with the mounting hole 40A. ing. A notch 53 that is substantially the same as the small diameter portion 52B is formed at the left end of the locking plate 50.
[0063] したがって、支柱 44のフランジ 44Aが取付孔 40A及び大径部 52Aに揷通されて係 止プレート 50の上面から突出した後、その係止プレート 50を長手方向(図示のもの は左方向)に摺動させて支柱 44に小径部 52B及び切欠部 53を係合させることにより 、図 5 (B)で示すように、クランプ部材 40がスライド部材 36から脱落防止に取り付けら れる構成である。  [0063] Therefore, after the flange 44A of the column 44 is passed through the mounting hole 40A and the large diameter portion 52A and protrudes from the upper surface of the locking plate 50, the locking plate 50 is moved in the longitudinal direction (the left side in the figure is the left direction). ) And the support member 44 is engaged with the small diameter portion 52B and the cutout portion 53, so that the clamp member 40 is attached to the slide member 36 to prevent the dropout, as shown in FIG. 5 (B). .
[0064] また、図 3、図 8 (A) (B) (C)、図 9 (A) (B) (C)で示すように、クランプ部材 40の一 方の長辺部における下面には、断面視略円弧状に突出して、基板材料 100の縁端 部 100Aに上方から当接する爪部 54が形成されている。そして、クランプ部材 40の 他方の長辺部が基部 56とされ、その基部 56には、取付孔 40Aに対応する(並列す る)貫通孔 56A力 長手方向に沿って、かつ所定間隔を隔てて複数(図示のものは 3 個)穿設されている。 Further, as shown in FIGS. 3, 8 (A), (B), (C), and FIGS. 9 (A), (B), and (C), the lower surface of one long side portion of the clamp member 40 In addition, a claw portion 54 that protrudes in a substantially arc shape in cross-section and comes into contact with the edge portion 100A of the substrate material 100 from above is formed. And the clamping member 40 The other long side portion is defined as a base portion 56, and a plurality of the base portions 56 are arranged along the longitudinal direction of the through hole 56A corresponding to (in parallel with) the mounting hole 40A (with a predetermined interval). 3) Drilled.
[0065] 貫通孔 56Aには、下端部が略半球状に突出した略円柱状の支持ロッド 58が揷通 されるようになっており、その支持ロッド 58の上端部近傍及び下端部近傍には、支持 ロッド 58よりも大径なフランジ 62A、 62Bが嵌着されている。これにより、支持ロッド 58 のクランプ部材 40からの脱落が防止される構成である。  [0065] A substantially cylindrical support rod 58 whose lower end protrudes in a substantially hemispherical shape is passed through the through-hole 56A, and the support rod 58 is provided near the upper end and the lower end thereof. The flanges 62A and 62B larger in diameter than the support rod 58 are fitted. Thus, the support rod 58 is prevented from falling off from the clamp member 40.
[0066] また、図 8 (A) (B) (C)、図 9 (A) (B) (C)で示すように、支持ロッド 58には、クランプ 部材 40 (基部 56)の下面側において、コイルばね 60が揷嵌されている。すなわち、ク ランプ部材 40 (基部 56)の下面と、支持ロッド 58の下側のフランジ 62Bとの間にコィ ノレばね 60が揷嵌されている。これにより、支持ロッド 58をクランプ部材 40の下面から 、常時下方に向かって突出するように付勢する構成である。  [0066] Further, as shown in FIGS. 8 (A), (B), (C), and FIGS. 9 (A), (B), and (C), the support rod 58 is provided on the lower surface side of the clamp member 40 (base portion 56). The coil spring 60 is fitted. That is, the coil spring 60 is fitted between the lower surface of the clamp member 40 (base 56) and the lower flange 62B of the support rod 58. Thus, the support rod 58 is urged so as to always protrude downward from the lower surface of the clamp member 40.
[0067] また、図 3、図 4で示すように、スライド部材 36において、二股状とされた取付プレー ト 42の基部 42A間には、支持ロッド 58の下端部を支持する支持部 48が形成されて いる。この支持部 48は、支持ロッド 58の下端部よりも曲率の小さい略半球状に凹設さ れ、支持ロッド 58の下端部が摺動可能に当接するように構成されている。  Further, as shown in FIGS. 3 and 4, in the slide member 36, a support portion 48 for supporting the lower end portion of the support rod 58 is formed between the base portions 42A of the mounting plate 42 having a bifurcated shape. It has been done. The support 48 is recessed in a substantially hemispherical shape having a smaller curvature than the lower end of the support rod 58, and is configured so that the lower end of the support rod 58 is slidably contacted.
[0068] また、スライド部材 36の内方側(基板材料 100側)端面には、基板材料 100に対す る位置決め部 70が複数(図示のものは各スライド部材 36に対し、所定間隔を隔てて 2個ずつ)設けられている。そして、この位置決め部 70が設けられる部位における固 定プレート 46は、適宜切り欠かれて、その位置決め部 70の取付を許容する構成とさ れている。  [0068] Further, a plurality of positioning portions 70 for the substrate material 100 are provided on the inner side (substrate material 100 side) end surface of the slide member 36 (the illustrated one is spaced apart from each slide member 36 by a predetermined interval). 2 each). Then, the fixing plate 46 in the portion where the positioning portion 70 is provided is appropriately cut out to allow the positioning portion 70 to be attached.
[0069] 位置決め部 70は、図 6 (A) (B)、図 7 (A) (B) (C) (D)で示すように、スライド部材 3 6に対して出入可能に設けられるピン状の位置決め部材 72を有しており、この位置 決め部材 72を基板材料 100の端面 100Bに当接させて、スライド部材 36 (クランプ部 材 40)の基板材料 100に対する位置決めを行うようになっている。  [0069] As shown in Figs. 6 (A) (B), Fig. 7 (A) (B) (C) (D), the positioning portion 70 has a pin shape provided so as to be able to enter and exit the slide member 36. The positioning member 72 is brought into contact with the end surface 100B of the substrate material 100, and the slide member 36 (clamp member 40) is positioned with respect to the substrate material 100. .
[0070] すなわち、スライド部材 36の内方側(基板材料 100側)端面には、略矩形扁平状の ケーシング 64が取付ネジ 96によって取り付けられ、そのケーシング 64の天板 64Aに は、第 1スリット 66A力 スライド部材 36の長手方向と平行に、その天板 64Aの略中 央まで穿設されている。そして、ケーシング 64の一方の側壁 64Bには、その第 1スリツ ト 66Aと連通する第 2スリット 66B力 基板材料 100から離間する方向(スライド部材 3 6側)へ所定長さ穿設されてレ、る。 That is, a substantially rectangular flat casing 64 is attached to the inner side (substrate material 100 side) end face of the slide member 36 by means of a mounting screw 96, and the top slit 64A of the casing 64 has a first slit. 66A force Slide member 36 parallel to the longitudinal direction of the top plate 64A It is drilled to the center. Then, one side wall 64B of the casing 64 has a second slit 66B force communicating with the first slit 66A, and a predetermined length is drilled in a direction away from the substrate material 100 (sliding member 36 side). The
[0071] 位置決め部材 72は、所定長さの円柱状のピンが略「L」字状に屈曲形成され、その 短い方の一端部(以下「操作部」という) 72Aが第 1スリット 66A又は第 2スリット 66Bか ら外方へ突出されている。また、ケーシング 64の基板材料 100と対向する前壁 64C には、位置決め部材 72の径と同じ力、、それより若干大径とされた円形の開孔 68が穿 設されており、位置決め部材 72の他端部(以下「当接部」という) 72Bが、その開孔 6 8から出入可能とされている。  [0071] The positioning member 72 is formed by bending a cylindrical pin having a predetermined length into a substantially "L" shape, and a short end (hereinafter referred to as an "operation part") 72A is formed by the first slit 66A or the first 2 Projects outward from slit 66B. The front wall 64C of the casing 64 facing the substrate material 100 is provided with a circular opening 68 having the same force as the diameter of the positioning member 72 and a slightly larger diameter than the positioning member 72. The other end portion (hereinafter referred to as “contact portion”) 72B can enter and exit through the opening 68.
[0072] そして、その位置決め部材 72の屈曲部 72Cよりも当接部 72B側には、コィノレばね 7 4が揷嵌されている。コイルばね 74の一端は、屈曲部 72Cと当接部 72Bの略中間に 嵌着された係止フランジ 76に当接し、コイルばね 74の他端は、前壁 64Cの内面に固 着されるとともに当接部 72Bが挿通可能とされた係止フランジ 78に当接している。し たがって、位置決め部材 72は、コイルばね 74の付勢力により、常時基板材料 100か ら離間する方向(スライド部材 36側)へ付勢される構成である。  [0072] Further, a coin spring 74 is fitted into the contact portion 72B side of the bending member 72C of the positioning member 72. One end of the coil spring 74 abuts on a locking flange 76 fitted approximately in the middle between the bent portion 72C and the abutting portion 72B, and the other end of the coil spring 74 is fixed to the inner surface of the front wall 64C. The contact portion 72B is in contact with a locking flange 78 that can be inserted. Accordingly, the positioning member 72 is constantly biased in the direction away from the substrate material 100 (sliding member 36 side) by the biasing force of the coil spring 74.
[0073] [クランプ装置の作用]  [0073] [Operation of clamping device]
次に、以上のような構成のクランプ装置 30の作用について説明する。まず最初に、 位置決め部 70による位置決め方法について、主に図 7 (A) (B) (C) (D)を基に説明 する。まず、ベース部材 32に基板材料 100を載置し、固定タイプのクランプ部 34Aに おける固定プレート 46の内方側(基板材料 100側)近傍に設けられた位置決めピン 3 3に、基板材料 100の前端面 100Bと左端面 100Bをそれぞれ当接させる。  Next, the operation of the clamp device 30 configured as described above will be described. First, the positioning method by the positioning unit 70 will be described mainly based on FIGS. 7 (A), (B), (C), and (D). First, the substrate material 100 is placed on the base member 32, and the positioning pin 33 provided near the inner side (substrate material 100 side) of the fixed plate 46 in the fixed type clamp portion 34A is placed on the positioning pin 33. The front end face 100B and the left end face 100B are brought into contact with each other.
[0074] その後、可動タイプのクランプ部 34Bにおいて、まず手動により、第 2スリット 66Bの スライド部材 36側端部から突出し、コイルばね 74の付勢力によって付勢された状態 で係止 ·保持されている各操作部 72Aを、そのコイルばね 74の付勢力に抗して基板 材料 100側へ移動させる(図 7 (A)参照)。  [0074] After that, in the movable type clamp portion 34B, first, the second slit 66B protrudes from the end of the slide member 36 side and is locked and held in a state of being biased by the biasing force of the coil spring 74. Each operating portion 72A is moved to the substrate material 100 side against the biasing force of the coil spring 74 (see FIG. 7A).
[0075] そして、第 2スリット 66Bの基板材料 100側端部まで達したら、そのまま第 1スリット 6 6A内へ移動させるように上方に向かって回動する(図 7 (B)参照)。これにより、各位 置決め部材 72の操作部 72Aは、第 1スリット 66Aの天板 64A側端部(天板 64Aの略 中央)において、コイルばね 74の付勢力によって、その天板 64Aに当接'係止され、 各位置決め部材 72の当接部 72Bは、開孔 68から所定長さ突出する。 Then, when the end of the second slit 66B reaches the end of the substrate material 100, the second slit 66B is rotated upward so as to be moved into the first slit 66A as it is (see FIG. 7B). As a result, the operation portion 72A of each positioning member 72 is connected to the end of the first slit 66A on the top plate 64A side (the abbreviation of the top plate 64A). In the center), the urging force of the coil spring 74 is brought into contact with and locked to the top plate 64A, and the contact portion 72B of each positioning member 72 protrudes from the opening 68 by a predetermined length.
[0076] こうして、開孔 68から各当接部 72Bを突出させたら、その各当接部 72Bが基板材 料 100の右端面 100B及び後端面 100Bに当接するまで、各スライド部材 36を長孔 3 6A及び長孔 46Aに沿って基板材料 100側に接近 (スライド)させる(図 7 (C)参照)。 そして、基板材料 100の右端面 100B及び後端面 100Bに各当接部 72Bを当接させ たら、その位置において、各スライド部材 36を固定ネジ 90によって固定する。  [0076] Thus, when each contact portion 72B is projected from the opening 68, each slide member 36 is elongated until each contact portion 72B contacts the right end surface 100B and the rear end surface 100B of the substrate material 100. 3 Approach (slide) the substrate material 100 side along 6A and the long hole 46A (see Fig. 7 (C)). Then, when the respective contact portions 72B are brought into contact with the right end surface 100B and the rear end surface 100B of the substrate material 100, the respective slide members 36 are fixed by the fixing screws 90 at the positions.
[0077] こうして、可動タイプのクランプ部 34Bにおいて、基板材料 100に対するスライド部 材 36の位置決めが完了したら(各スライド部材 36を固定したら)、各操作部 72Aを第 1スリット 66A内において、上記とは逆方向に回動させ、第 2スリット 66B内まで回動さ せたら手指を放す。  [0077] In this way, when the positioning of the slide member 36 with respect to the substrate material 100 is completed in the movable type clamp portion 34B (when each slide member 36 is fixed), each operation portion 72A is placed in the first slit 66A as described above. Rotate in the opposite direction and release your finger after turning it into the second slit 66B.
[0078] すると、各位置決め部材 72は、コイルばね 74の付勢力により、基板材料 100から 離間する方向(スライド部材 36側)へ自動的に移動し、開孔 68から突出していた各 当接部 72Bがケーシング 64内へ引っ込む(図 7 (D)参照)。これにより、基板材料 10 0に対するスライド部材 36の位置決め作業が完了する。  Then, each positioning member 72 is automatically moved in the direction away from the substrate material 100 (sliding member 36 side) by the urging force of the coil spring 74, and each abutting portion protruding from the opening 68. 72B retracts into the casing 64 (see Fig. 7 (D)). Thereby, the positioning operation of the slide member 36 with respect to the substrate material 100 is completed.
[0079] なお、位置決め部 70による位置決め後、固定部材 38及びスライド部材 36には、ク ランプ部材 40が複数個(図示のものは各辺に対して 3個ずつ)取り付けられる。した がって、次にクランプ部材 40の取付方法について、主に図 3を基に説明する。  [0079] After the positioning by the positioning portion 70, a plurality of clamp members 40 (three in the figure are attached to each side) are attached to the fixing member 38 and the slide member 36. Therefore, the mounting method of the clamp member 40 will be described mainly based on FIG.
[0080] 各クランプ部材 40は、位置決め部 70によってスライド部材 36が位置決めされた後 、各スライド部材 36及び各固定部材 38に設けられている支持部 48に、支持ロッド 58 の下端部を当接させるとともに、支柱 44のフランジ 44Aを取付孔 40Aに挿通させる。  [0080] After the slide member 36 is positioned by the positioning portion 70, each clamp member 40 abuts the lower end portion of the support rod 58 on the support portion 48 provided on each slide member 36 and each fixing member 38. At the same time, the flange 44A of the support 44 is inserted into the mounting hole 40A.
[0081] なお、このとき、ケーシング 64の天板 64Aから操作部 72Aが突出しない状態となつ ているので、スライド部材 36に対してクランプ部材 40を取り付けることができる。すな わち、位置決め部材 72の操作部 72Aが、天板 64Aから突出した状態であると、クラ ンプ部材 40を取り付けることができない構造になっているので、可動タイプのクランプ 部 34Bにおいて、位置決め部材 72の位置決め後の操作忘れを防止することができ る。  At this time, since the operation portion 72A does not protrude from the top plate 64A of the casing 64, the clamp member 40 can be attached to the slide member 36. In other words, if the operation part 72A of the positioning member 72 protrudes from the top plate 64A, the clamp member 40 cannot be attached. Forgetting the operation after positioning the member 72 can be prevented.
[0082] 何れにしても、支柱 44のフランジ 44Aを取付孔 40Aに揷通させたら、その状態のま まクランプ部材 40の上面をコイルばね 60の付勢力に抗して手指で押圧し、支柱 44 のフランジ 44Aを取付孔 40A及び係止孔 52 (大径部 52A)に挿通させつつ、係止プ レート 50を図 5 (A) (B)における左方向に摺動 (スライド)させる。 [0082] In any case, when the flange 44A of the support 44 is passed through the mounting hole 40A, the state is maintained. The upper surface of the clamp member 40 is pressed with a finger against the urging force of the coil spring 60, and the flange 44A of the column 44 is inserted into the mounting hole 40A and the locking hole 52 (large diameter portion 52A), while the locking Slide rate 50 to the left in Figures 5 (A) and 5 (B).
[0083] つまり、支持ロッド 58にはコイルばね 60が揷嵌されているので、支柱 44のフランジ 44Aはクランプ部材 40の自重だけでは、取付孔 40A及び係止孔 52の大径部 52A 力、ら上方に突出しなレ、。したがって、クランプ部材 40の上面を手動により押圧し、支 柱 44のフランジ 44Aを取付孔 40A及び係止孔 52の大径部 52Aから上方に突出さ せる。そして、この状態を維持したまま、係止プレート 50を図 5 (A) (B)における左方 向に長孔 50Aの範囲内で摺動 (スライド)させる。  That is, since the coil spring 60 is fitted to the support rod 58, the flange 44A of the support 44 has a force of the large diameter portion 52A of the mounting hole 40A and the locking hole 52 only by the weight of the clamp member 40, Le which does not protrude upwards. Therefore, the upper surface of the clamp member 40 is manually pressed, and the flange 44A of the support pole 44 is protruded upward from the large diameter portion 52A of the mounting hole 40A and the locking hole 52. Then, with this state maintained, the locking plate 50 is slid in the left direction in FIGS. 5A and 5B within the range of the long hole 50A.
[0084] すると、係止プレート 50に穿設されている係止孔 52の小径部 52B及び切欠部 53 が支柱 44の周面に当接するので、コイルばね 60の付勢力により、フランジ 44Aの下 面に係止プレート 50の上面を当接 ·係合させることができる。つまり、各クランプ部材 40を支柱 44に対して、その脱落が防止された状態で取り付けることができる。こうし て、各クランプ部材 40がスライド部材 36及び固定部材 38に取り付けられることにより 、基板材料 100の縁端部 100Aが各クランプ部材 40によってクランプされる。  Then, since the small diameter portion 52B and the notch portion 53 of the locking hole 52 formed in the locking plate 50 abut against the peripheral surface of the support post 44, the biasing force of the coil spring 60 causes the bottom of the flange 44A. The upper surface of the locking plate 50 can be brought into contact with and engaged with the surface. That is, each clamp member 40 can be attached to the column 44 in a state in which the drop-off is prevented. In this way, each clamp member 40 is attached to the slide member 36 and the fixed member 38, whereby the edge portion 100 A of the substrate material 100 is clamped by each clamp member 40.
[0085] すなわち、クランプ部材 40は、その基部 56側力 コイルばね 60の付勢力により、上 方に向かって下から(ベース部材 32から)突き上げられ、かつ支柱 44と取付孔 40Aと の間には、所定の間隙が形成されているので、その支柱 44が挿嵌されている取付孔 40A付近を支点にして、爪部 54側が下方に向かって回動される。したがって、その 爪部 54が、コイルばね 60の付勢力により、基板材料 100の縁端部 100Aを押圧 ·保 持することが可能となり、クランプ部材 40が基板材料 100の縁端部 100Aをクランプ すること力 S可肯 となる。  [0085] That is, the clamp member 40 is pushed upward (from the base member 32) upward by the biasing force of the base 56 side force coil spring 60, and between the column 44 and the mounting hole 40A. Since the predetermined gap is formed, the claw portion 54 side is rotated downward with the vicinity of the mounting hole 40A into which the support 44 is inserted as a fulcrum. Accordingly, the claw 54 can press and hold the edge 100A of the substrate material 100 by the biasing force of the coil spring 60, and the clamp member 40 clamps the edge 100A of the substrate material 100. That force becomes S positive.
[0086] ここで、固定部材 38側は、基板材料 100の前端面 100B及び左端面 100Bを位置 決めピン 33に当接させることにより、その各縁端部 100Aに対するクランプ部材 40の 位置決めが既に完了している。そして、スライド部材 36側も、位置決め部 70により、 基板材料 100の各縁端部 100Aに対するクランプ部材 40の位置決めが完了してい るので、基板材料 100に反り(変形)があっても、描画領域外である縁端部 100Aを確 実にクランプすることができる。 [0087] すなわち、反りがある基板材料 100をクランプ部材 40でクランプしたときには、その 基板材料 100が若干広がるように変形する力 スライド部材 36側の固定プレート 46と 基板材料 100との間には、位置決め部材 72によって、所定の間隙が形成されるよう になっている、換言すれば、この位置決め部材 72は、反りを矯正したときに生じる基 板材料 100の伸びを考慮した位置決めになっているので、そのような変形が生じても 充分に許容することができる。 [0086] Here, on the fixing member 38 side, the front end surface 100B and the left end surface 100B of the substrate material 100 are brought into contact with the positioning pin 33, whereby the positioning of the clamp member 40 with respect to each edge 100A is already completed. is doing. Further, since the positioning of the clamp member 40 with respect to each edge 100A of the substrate material 100 is completed by the positioning unit 70 on the slide member 36 side, even if the substrate material 100 is warped (deformed), the drawing region The outer edge 100A can be securely clamped. That is, when the substrate material 100 with warp is clamped by the clamp member 40, the force that deforms the substrate material 100 so that it slightly expands. Between the fixed plate 46 on the slide member 36 side and the substrate material 100, A predetermined gap is formed by the positioning member 72. In other words, the positioning member 72 is positioned in consideration of the elongation of the base material 100 that occurs when the warp is corrected. Even if such deformation occurs, it can be sufficiently tolerated.
[0088] また、このクランプ部材 40は、基部 56側が下から上に向かって突き上げられること により、その反対側の爪部 54が上から下に向かって押圧するような構成になっている ので、クランプ部 34において薄型化を図ることができ、かつ図 8 (A) (B) (C)、図 9 (A ) (B) (C)で示すように、基板材料 100の厚さが異なっても(厚くなつても)充分に対応 して確実にクランプすることができる。ちなみに、このクランプ装置 30においては、厚 さが 7mmまでの基板材料 100をクランプすることが可能となっている。  [0088] Further, the clamp member 40 is configured such that the claw portion 54 on the opposite side is pressed from the top to the bottom by the base 56 side being pushed up from the bottom to the top. As shown in FIGS. 8 (A) (B) (C) and FIGS. 9 (A) (B) (C), the thickness of the substrate material 100 is different. (Even if it gets thicker) can be clamped correspondingly enough. Incidentally, in this clamping device 30, it is possible to clamp the substrate material 100 having a thickness of up to 7 mm.
[0089] また、このクランプ部 34は、基板材料 100の各コーナー部を確実にクランプできる ように構成されている。すなわち、図 2、図 4で示すように、前側の固定タイプとされた クランプ部 34A及び後側の可動タイプとされたクランプ部 34Bの爪部 54は、それぞ れ左側の固定タイプとされたクランプ部 34A及び右側の可動タイプとされたクランプ 部 34Bの爪部 54の長手方向における延長線上にオーバーラップするように、更には 、その延長線(図 4において仮想線 Kで示す)上にクランプ部材 40を取り付けるため の支柱 44が来るように構成されてレ、る。  In addition, the clamp portion 34 is configured so that each corner portion of the substrate material 100 can be reliably clamped. That is, as shown in FIG. 2 and FIG. 4, the clamp part 34A, which is a fixed type on the front side, and the claw part 54 of the clamp part 34B, which is a movable type on the rear side, are each a fixed type on the left side. The clamp part 34A and the clamp part 34B of the right movable type are clamped on the extension line (indicated by the phantom line K in FIG. 4) so as to overlap the extension line in the longitudinal direction of the claw part 54 of the clamp part 34B. It is constructed so that a support 44 for mounting the member 40 is provided.
[0090] このような構成にすれば、基板材料 100に反り等が発生していても、その各コーナ 一部を確実にクランプすることができるので、充分にその反りを矯正する (解消する) こと力 Sできる。したがって、ステージ部材 20の孔部 20A及びベース部材 32の孔部 32 Aを通って吸引されるエアーの吸引力により、基板材料 100を確実に吸着 ·保持する こと力 Sできる。  [0090] With such a configuration, even if the substrate material 100 is warped, a portion of each corner can be reliably clamped, so that the warp is sufficiently corrected (resolved). That power S. Therefore, it is possible to reliably suck and hold the substrate material 100 by the suction force of the air sucked through the hole 20A of the stage member 20 and the hole 32A of the base member 32.
[0091] つまり、基板材料 100に対するクランプ装置 30のクランプが完了したら、ベース部 材 32をステージ部材 20上に載置し、図示しない位置決め部によって位置決めする 力 このとき、ベース部材 32に穿設された孔部 32Aとステージ部材 20に穿設された 孔部 20Aが連通するので、その孔部 20A、 32Aからエアーを吸引することにより、ク ランプ装置 30によってクランプされた基板材料 100をステージ部材 20上に確実に吸 着'保持することができる。 That is, when the clamping of the clamping device 30 to the substrate material 100 is completed, the base member 32 is placed on the stage member 20 and is positioned by a positioning portion (not shown). At this time, the base member 32 is perforated. Since the hole portion 32A communicates with the hole portion 20A formed in the stage member 20, the air is sucked from the hole portions 20A and 32A, thereby The substrate material 100 clamped by the lamp device 30 can be securely adsorbed and held on the stage member 20.
[0092] したがって、 CCDカメラ 26によるァライメント処理と、露光ヘッド 28による露光処理 を精度よく好適に実行することが可能となり、正確な画像を確実に形成することが可 能となる。よって、レーザー露光装置 10等の画像形成装置における信頼性を向上さ せること力 Sできる。なお、このクランプ装置 30は、レーザー加工機のような基板材料 1 00に導電用の穴部を穿設する装置などにも適用が可能である。  Accordingly, the alignment process by the CCD camera 26 and the exposure process by the exposure head 28 can be performed with good accuracy and accuracy, and an accurate image can be reliably formed. Therefore, it is possible to improve the reliability of the image forming apparatus such as the laser exposure apparatus 10. The clamp device 30 can also be applied to a device such as a laser processing machine that forms a hole for conduction in a substrate material 100.
[0093] 以上、何れにしても、本発明によれば、クランプ部 34が設けられたベース部材 32を ステージ部材 20に対して着脱可能とし、そのベース部材 32上に基板材料 100を載 置する構成としたので、クランプ部 34をステージ部材 20に対して着脱可能とでき、反 りが発生してしまうような厚さの基板材料 100を露光する場合でも、ベース部材 32を 介してステージ部材 20上に確実に吸着 ·保持(固定)することができる。また、このクラ ンプ作業は、ベース部材 32上で行えばよぐステージ部材 20上で行う必要がないた め、容易にできる利点もある。  As described above, in any case, according to the present invention, the base member 32 provided with the clamp portion 34 can be attached to and detached from the stage member 20, and the substrate material 100 is placed on the base member 32. Since it is configured, the clamp part 34 can be attached to and detached from the stage member 20, and even when the substrate material 100 having a thickness that causes warping is exposed, the stage member 20 is interposed via the base member 32. It can be securely adsorbed and held (fixed) on the top. Further, since this clamping operation does not need to be performed on the stage member 20 which is sufficient to be performed on the base member 32, there is an advantage that it can be easily performed.
[0094] また、クランプ部材 40は、係止プレート 50をスライドさせることにより、支柱 44に対し て装着する構成になっているので、その着脱作業が容易にできる。そして、このクラン プ部材 40は、基板材料 100の各辺、即ちスライド部材 36及び固定部材 38に対し、 複数個設けられてクランプする(換言すれば、各スライド部材 36及び各固定部材 38 に対し、分割されてクランプする)構成になっているので、基板材料 100のサイズが変 更になつても、柔軟に対応することができる。但し、基板材料 100のサイズが大きく変 更された場合には、ベース部材 32ごと、基板材料 100のサイズに合わせて交換され る。  In addition, the clamp member 40 is configured to be attached to the column 44 by sliding the locking plate 50, so that the attaching / detaching operation can be easily performed. A plurality of clamp members 40 are provided and clamped on each side of the substrate material 100, that is, on the slide member 36 and the fixing member 38 (in other words, on each slide member 36 and each fixing member 38). Therefore, even if the size of the substrate material 100 is changed, the structure can be flexibly accommodated. However, when the size of the substrate material 100 is greatly changed, the base member 32 is replaced according to the size of the substrate material 100.
符号の説明  Explanation of symbols
[0095] 10 レーザー露光装置(画像形成装置) [0095] 10 Laser exposure apparatus (image forming apparatus)
18 モーター (搬送機構)  18 Motor (Transfer mechanism)
20 ステージ部材 (ステージ)  20 Stage material (Stage)
20A 孔部(吸着孔)  20A hole (adsorption hole)
22 ボールネジ (搬送機構) CCDカメラ(測定部) 露光ヘッド(露光部、描画部) クランプ装置 22 Ball screw (conveyance mechanism) CCD camera (measurement unit) Exposure head (exposure unit, drawing unit) Clamp device
ベース部材  Base member
A 孔部(連通孔) A hole (communication hole)
位置決めピン  Positioning pin
クランプ部  Clamp part
スライド部材  Slide member
固定部材  Fixed member
クランプ部材  Clamp member
取付プレート  Mounting plate
支柱 (案内部) Prop (guide section)
A フランジ (抜け止め部) 固定プレート A Flange (Retaining part) Fixing plate
支持部  Supporting part
係止プレート (係止部材) 係止孔  Locking plate (Locking member) Locking hole
切欠部  Notch
爪部(当接部)  Claw part (contact part)
基部  Base
支持ロッド (支持部) コイルばね(付勢部材)A 第 1スリット Support rod (support part) Coil spring (biasing member) A 1st slit
B 第 2スリット B 2nd slit
開孔  Opening
位置決め部  Positioning part
位置決め部材  Positioning member
コィノレは'ね 76 係止フランジ 78 係止フランジKoinole is 76 Locking flange 78 Locking flange
100 基板材料 (ワーク)100 Substrate material (workpiece)
100A 縁端部 100A edge
100B 端面  100B end face

Claims

請求の範囲 The scope of the claims
[1] 板状のワークが載置され、ステージ上に着脱可能に装着されるベースと、  [1] A base on which a plate-like workpiece is placed and detachably mounted on the stage;
前記ベースに設けられ、前記ワークの縁端部をクランプするクランプ部と、 を備え、  A clamp part that is provided on the base and clamps an edge of the workpiece, and
前記ベースには、該ベース上面側と前記ステージ側との間を連通させる複数の連 通孔が穿設されてレ、ることを特徴とするクランプ装置。  The clamp apparatus according to claim 1, wherein the base has a plurality of communication holes for communicating between the base upper surface side and the stage side.
[2] 前記連通孔の少なくとも一部が、前記ステージに設けられた複数の吸着孔の少なく とも一部と同じ配置とされることを特徴とする請求項 1に記載のクランプ装置。  [2] The clamp device according to [1], wherein at least a part of the communication hole has the same arrangement as at least a part of the plurality of suction holes provided in the stage.
[3] 前記クランプ部は、前記ベースの 1つの辺に対してそれぞれ複数設けられるクラン プ部材を備えることを特徴とする請求項 1に記載のクランプ装置。 [3] The clamp device according to [1], wherein the clamp unit includes a plurality of clamp members provided for one side of the base.
[4] 前記クランプ部は、 [4] The clamp part is
前記ベースに設けられ、抜け止め部が形成された案内部と、  A guide portion provided on the base and formed with a retaining portion;
前記案内部に遊嵌される取付孔が穿設され、前記縁端部に当接する当接部が形 成されたクランプ部材と、  A clamping member in which a mounting hole loosely fitted in the guide portion is formed, and a contact portion that contacts the edge portion is formed;
前記クランプ部材に設けられ、前記抜け止め部に係合して、該クランプ部材を前記 案内部から脱落不能とする係止部材と、  A locking member that is provided on the clamp member, engages with the retaining portion, and prevents the clamp member from falling off from the guide portion;
前記クランプ部材の前記当接部とは反対側の基部に穿設された貫通孔に、脱落不 能に揷通された支持部と、  A support portion that is threadably inserted into a through hole formed in a base portion on the opposite side of the abutting portion of the clamp member;
前記支持部に揷嵌され、該支持部を下方に向かって付勢する付勢部材と、 前記ベースに設けられ、前記支持部を支持する支持部と、  An urging member that is fitted into the support portion and urges the support portion downward; a support portion that is provided on the base and supports the support portion;
を有することを特徴とする請求項 1に記載のクランプ装置。  The clamping device according to claim 1, comprising:
[5] 前記クランプ部は、 [5] The clamp part is
前記ベースに設けられ、頭部にフランジが形成された支柱と、  A support provided on the base and having a flange formed on the head,
前記支柱に遊嵌される取付孔が穿設され、前記縁端部に上方から当接する爪部が 形成されたクランプ部材と、  A clamp member in which a mounting hole that is loosely fitted to the support column is formed, and a claw portion that contacts the edge end portion from above is formed;
前記クランプ部材の上面にスライド可能に設けられ、前記フランジに係合して、該ク ランプ部材を前記支柱から脱落不能とする係止プレートと、  A locking plate that is slidably provided on the upper surface of the clamp member, engages with the flange, and prevents the clamp member from falling off the column;
前記クランプ部材の前記爪部とは反対側の基部に穿設された貫通孔に、脱落不能 に挿通された支持ロッドと、 The clamp member cannot be dropped into the through hole formed in the base opposite to the claw. A support rod inserted into the
前記支持ロッドに挿嵌され、該支持ロッドを下方に向かって付勢するコイルばねと、 前記ベースに設けられ、前記支持ロッドの下端部を支持する支持部と、 を有することを特徴とする請求項 1に記載のクランプ装置。  A coil spring that is inserted into the support rod and biases the support rod downward, and a support portion that is provided on the base and supports a lower end portion of the support rod. Item 2. The clamping device according to item 1.
[6] 板状のワークが載置され、ステージ上に着脱可能に装着されるベースと、前記べ一 スに設けられ、前記ワークの縁端部をクランプするクランプ部と、を備え、前記ベース には、該ベース上面側と前記ステージ側との間を連通させる複数の連通孔が穿設さ れている、クランプ装置におけるベースが装着されるステージを所定の搬送路に沿つ て搬送する搬送機構と、 [6] A base on which a plate-like workpiece is placed and detachably mounted on a stage, and a clamp portion provided on the base and clamping an edge portion of the workpiece. In this case, a plurality of communication holes for communicating between the upper surface side of the base and the stage side are formed, and the stage on which the base in the clamp device is mounted is transported along a predetermined transport path. Mechanism,
前記搬送機構によって搬送されるステージ上のワークのァライメントマークを検出す る測定部と、  A measurement unit for detecting alignment marks of a workpiece on a stage conveyed by the conveyance mechanism;
前記測定部の検出結果に基づくァライメント後のワークに対して画像を形成する描 画咅と、  A drawing rod for forming an image on the workpiece after alignment based on the detection result of the measurement unit;
を有することを特徴とする画像形成装置。  An image forming apparatus comprising:
[7] 板状のワークが載置され、ステージ上に着脱可能に装着されるベースと、前記べ一 スに設けられ、前記ワークの縁端部をクランプするクランプ部と、を備え、前記ベース には、該ベース上面側と前記ステージ側との間を連通させる複数の連通孔が穿設さ れている、クランプ装置におけるベースが装着されるステージを所定の搬送路に沿つ て搬送する搬送機構と、 [7] A base on which a plate-like workpiece is placed and detachably mounted on a stage, and a clamp portion provided on the base and clamping an edge of the workpiece, A plurality of communication holes for communicating between the base upper surface side and the stage side are formed, and the stage on which the base in the clamp device is mounted is transported along a predetermined transport path. Mechanism,
前記搬送機構によって搬送されるステージ上のワークのァライメントマークを検出す る測定部と、  A measurement unit for detecting alignment marks of a workpiece on a stage conveyed by the conveyance mechanism;
前記測定部の検出結果に基づくァライメント後のワークの描画領域を画像情報に 基づいて変調された光ビームにより露光し、該描画領域に画像を形成する露光部と を有することを特徴とする画像形成装置。  An image forming system comprising: an exposure unit that exposes a drawing region of a workpiece after alignment based on a detection result of the measurement unit with a light beam modulated based on image information, and forms an image in the drawing region. apparatus.
PCT/JP2006/300478 2005-01-20 2006-01-17 Clamping apparatus and image forming apparatus WO2006077804A1 (en)

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