CN109587967A - Circuit board short circuit restorative procedure - Google Patents
Circuit board short circuit restorative procedure Download PDFInfo
- Publication number
- CN109587967A CN109587967A CN201811609918.0A CN201811609918A CN109587967A CN 109587967 A CN109587967 A CN 109587967A CN 201811609918 A CN201811609918 A CN 201811609918A CN 109587967 A CN109587967 A CN 109587967A
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- CN
- China
- Prior art keywords
- circuit
- short circuit
- short
- circuit board
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
Abstract
The invention discloses a kind of circuit board short circuit restorative procedures, comprising: short-circuit positioning process, drilling operating and short circuit truncation process.When using circuit board short circuit restorative procedure, short circuit inspection is carried out to faulty circuit plate first, and is determined at the short circuit inside circuit board.Determine the test surfaces and idle face (the non-using face that idle face refers to circuit board) of circuit board.At this point, short circuit, which is in the short circuit that the correspondence aperture on idle face is idle face, repairs hole.Then, it drills since hole is repaired in short circuit.Hole depth to be drilled has reached short circuit when being in the depth of the circuit inner cord, carries out control gun drilling to short-circuit place.At this point, the residual copper or metal sundries at short circuit can be drilled hold during controlling gun drilling, to solve the unexpected electrical communication between inner conductor, i.e., foregoing circuit plate short circuit restorative procedure can effectively repair the short circuit of circuit inner cord.
Description
Technical field
The present invention relates to the technical fields of circuit board repair, more particularly to a kind of circuit board short circuit restorative procedure.
Background technique
Traditionally, it as printed circuit board line width and spacing are smaller and smaller, is increasingly easy between two adjacent routes
There is the phenomenon of short circuit.Short circuit phenomenon, which occurs, in circuit board will have a direct impact on the normal use of circuit.Therefore, when circuit board surface goes out
When existing short circuit phenomenon, directly can targetedly it be handled.But when short-circuited region is inside circuit board, traditional is repaired
Compound method is to carry out fusing processing to short-circuited region using burning line machine (fusing machine), and still, above-mentioned this repair mode can only be right
Subtle residual copper inside circuit board carries out short-circuit reparation, internal layer caused by residual copper biggish for circuit board inside or metal sundries
It is short-circuit then can not repair, at this point, circuit board, which can only be taken, scraps processing.
Summary of the invention
Based on this, it is necessary to a kind of circuit board short circuit restorative procedure is provided, can the internal layer short circuit to circuit board have
It repairs on effect ground.
Its technical solution is as follows:
A kind of circuit board short circuit restorative procedure, comprising: short-circuit positioning process, drilling operating and short circuit truncation process；It is short
In the positioning process of road, the position in circuit board at the short circuit of inner plating is determined；In drilling operating, by circuit board equipped with welding device
Plate face be defined as test surfaces, the face opposite with the test surfaces is that idle face will be not busy according to the position at short circuit on circuit board
It sets and is defined as short circuit reparation hole on face with corresponding aperture at short circuit, repair hole across short circuit and drill towards short-circuit place；Truncation
In process, hole depth to be drilled has reached short circuit when being in the depth of the circuit inner cord, carries out control gun drilling.
When using circuit board short circuit restorative procedure, short circuit inspection is carried out to faulty circuit plate first, and determine in circuit board
At the short circuit in portion.Determine the test surfaces and idle face (the non-using face that idle face refers to circuit board) of circuit board.At this point, short circuit is in
Correspondence aperture on idle face is that hole is repaired in the short circuit in idle face.Then, it drills since hole is repaired in short circuit.Hole depth to be drilled
Short circuit is had reached when being in the depth of the circuit inner cord, control gun drilling is carried out to short-circuit place.At this point, short circuit at residual copper or
Metal sundries can be drilled hold during controlling gun drilling, to solve the unexpected electrical communication between inner conductor, i.e., on
The short circuit of circuit inner cord can effectively be repaired by stating circuit board short circuit restorative procedure.
Below with reference to above scheme, the present invention is further described:
In short-circuit positioning process, the positioning at short circuit is carried out to the circuit board using Electronic Testing process.
In drilling operating, judge whether the short-circuit place has remaining communication line on laminate.
In drilling operating, it is the resin hole opened up on the circuit board that hole is repaired in the short circuit.
In drilling operating, hole is repaired by short circuit using drill and is drilled towards short-circuit place.
The end diameter of the drill is greater than the aperture that hole is repaired in the short circuit.
The end diameter of the drill is 0.1mm~0.2mm bigger than the aperture that hole is repaired in the short circuit.
Be truncated process in, using the drill to it is described short circuit at carry out control gun drilling.
Circuit board short circuit restorative procedure further includes repairing inspection process, after the completion of the interception process, to the circuit
Plate carries out the reparation inspection process.
Circuit board short circuit restorative procedure further includes filling up process, after the completion of the reparation inspection process, to the short circuit
Hole is repaired to carry out filling up process.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of circuit board described in one embodiment of the invention；
Fig. 2 is the structural schematic diagram of circuit board described in another embodiment of the present invention；
Fig. 3 is the flow chart of circuit board short circuit restorative procedure described in one embodiment of the invention；
Fig. 4 is the flow chart of circuit board short circuit restorative procedure described in another embodiment of the present invention；
Fig. 5 is the flow chart of circuit board short circuit restorative procedure described in further embodiment of this invention；
Fig. 6 is the flow chart of circuit board short circuit restorative procedure described in yet another embodiment of the invention.
Description of symbols:
100, circuit board, 110, short circuit place, 120, test surfaces, 130, idle face, 140, short circuit reparation hole, 141, resin
Hole, 150, inner plating, 200, drill, 300, two component adhesive.
Specific embodiment
To make the objectives, technical solutions, and advantages of the present invention more comprehensible, below in conjunction with attached drawing and specific embodiment party
Formula, the present invention is further described in detail.It should be understood that the specific embodiments described herein are only to solve
The present invention is released, and the scope of protection of the present invention is not limited.
It should be noted that it can directly on the other element when element is referred to as " being fixed on " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement for illustrative purposes only, are not meant to be the only embodiment.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more
Any and all combinations of relevant listed item.
Heretofore described " first ", " second " do not represent specific quantity and sequence, are only used for the differentiation of title.
As shown in Figure 1 to Figure 3, in one embodiment, a kind of circuit board short circuit restorative procedure, comprising: short circuit positioning work
Sequence, drilling operating and short circuit truncation process.In short-circuit positioning process, determine in circuit board 100 at the short circuit of inner plating 150
110 position.In drilling operating, circuit board 100 is defined as test surfaces 120 equipped with the plate face of welding device, on circuit board 100
The face opposite with the test surfaces 120 is idle face 130, according at short circuit 110 position, be would sit idle on face 130 and at short circuit
110 corresponding apertures are defined as short circuit and repair hole 140, repair hole 140 across short circuit and drill towards at short circuit 110.Work is truncated
In sequence, hole depth to be drilled has reached at short circuit 110 in the depth of 100 internal layer of circuit board, carries out control gun drilling.
When using circuit board short circuit restorative procedure, short circuit inspection is carried out to faulty circuit plate 100 first, and determine circuit board
110 at short circuit inside 100.(idle face 130 refers to circuit board 100 for the test surfaces 120 for determining circuit board 100 and idle face 130
Non- using face).At this point, the 110 correspondence aperture on idle face 130 is that hole 140 is repaired in the short circuit in idle face 130 at short circuit.
Then, it drills since hole 140 is repaired in short circuit.Hole depth to be drilled have reached at short circuit 110 100 internal layer of circuit board depth
When spending, control gun drilling is carried out at short circuit 110.At this point, 110 residual copper or metal sundries can be in the processes of control gun drilling at short circuit
In be drilled open, to solve the unexpected electrical communication between inner conductor, i.e. foregoing circuit plate short circuit restorative procedure can be right
100 internal layer short circuit of circuit board is effectively repaired.
Specifically, in the present embodiment, circuit board 100, often due to mismachining tolerance, causes in production welding process
There is unexpected connection (electrical communication) in the adjacent lines of circuit board 100.It, can be right first when short circuit phenomenon occurs in circuit board 100
The plate face of circuit board 100 carries out short circuit inspection.Since the connection of circuit board 100 is than comparatively dense, subtle welding wire or
Copper foil is likely to be connected to adjacent two lines road surprisingly.At this point it is possible to by magnifying glass or other amplifier elements to circuit
The outer layer plate face of plate 100 is checked, and when finding to occur remaining welding wire or residual copper foil between adjacent lines, can be directlyed adopt
Fusing machine or burning line machine clear up welding wire or residual copper.In carrying out scale removal process, accidental amputation regular link is avoided.On
Only one of embodiment is stated, for example, or line construction more complicated circuit board 100 more intensive for route,
The corresponding design drawing of circuit board 100 can be consulted by computer, find route in design drawing is more intensive, adjacent lines spacing compared with
Small region is simultaneously classified as emphasis investigation area.Then, correspondence orients relevant range on circuit board 100, the hand-manipulating of needle of going forward side by side
To property investigation.Aforesaid way significantly more efficient can be determined 110 at the short circuit of circuit board 100.Further, in order to avoid electricity
Road plate 100 generates short circuit phenomenon, as soon as every welding welding device during being welded to circuit board 100, to described
It welds device and carries out short-circuit detecting, so as to be effectively prevented from the generation of 100 short circuit phenomenon of circuit board.
As shown in figure 4, in one embodiment, in short-circuit positioning process, using Electronic Testing process to the circuit board
100 carry out at short circuit 110 positioning.Specifically, in the present embodiment, when short circuit occurs in the inner plating 150 of circuit board 100,
It is positioned first by Electronic Testing process at the short circuit of inner plating 150 110.When Electronic Testing process is to circuit board 100
When carrying out short-circuit test, the different power utilization environments being applicable according to various boards 100 set one in Electronic Testing process
Basic short circuit preset value.Circuit board under test 100 is placed in Electronic Testing process, Electronic Testing program can be to circuit board at this time
100 all circuit networks carry out investigation detection.Such as: the short-circuit preset value (resistance value) in basis is provided in Electronic Testing process is
40M Ω (megohm), at this point, when Electronic Testing process detects that the resistance value in the part circuit network region on circuit board 100 is low
When 40M Ω, i.e., the region can be reported short-circuit conditions occur.Then, Electronic Testing process can be locked in short-circuited region progress
Further investigation, until the exact position for detecting to occur short circuit on circuit board 100.This is only one of embodiment, on
Open circuit detection can also be carried out to circuit board 100 by stating Electronic Testing process.According to difference electricity consumption used in various boards 100
Environment.A basis open circuit preset value is set in Electronic Testing process.Circuit board under test 100 is placed on Electronic Testing process
In, Electronic Testing program can carry out investigation detection to all circuit networks of circuit board 100 at this time.For example, in Electronic Testing process
In to be provided with basis open circuit preset value (resistance value) be 10 Ω (ohm), at this point, detecting on circuit board 100 when Electronic Testing process
Part circuit network region resistance value be higher than 10 Ω when, i.e., the region can be reported open circuit situation occur.Then, electronic, horological trial work
Sequence can be locked in the open circuit region and further check until detecting occur the exact position opened a way on circuit board 100.
As shown in figure 5, in one embodiment, in drilling operating, judging whether have on 110 place laminates at the short circuit
Remaining communication line.Specifically, in the present embodiment, as the line width and spacing of route on circuit board 100 are smaller and smaller.When true
After making 110 at the short circuit of inner plating 150, when drilling to circuit board 100, to avoid influencing during drilling
Other regular links.Therefore, before drilling to circuit board 100, need to determine the route near 110 at the short circuit first
With 110 at the short circuit between spacing, then reasonably determine drilling aperture, repaired to improve foregoing circuit plate short circuit
Repairing effect of the compound method for circuit board 100.
As depicted in figs. 1 and 2, in one embodiment, in drilling operating, it is the circuit that hole 140 is repaired in the short circuit
The resin hole 141 opened up on plate 100.Specifically, in the present embodiment, circuit board 100 is during welding, it is contemplated that the later period
Cabling needs can open up multiple apertures in plate face.Meanwhile also resin can be realized by unused aperture by potting resin
Consent is (its object is to guarantee that the plate face of circuit board 100 is smooth, so that the production for being conducive to fine-line on circuit board 100 adds
Work).More specifically, in the short-circuit repair process of circuit board 100, according at 150 short circuit of inner plating 110 physical location, selection
Hole 140 is repaired as short circuit with 110 corresponding resin holes 141 at the short circuit on idle face 130, at this point, because having had
Preceding open-porous base, so that more convenient when drilling to circuit board 100.
In one embodiment, in drilling operating, hole 140 is repaired by short circuit using drill 200 and is carried out towards at short circuit 110
Drilling.The end diameter of the drill 200 is greater than the aperture that hole 140 is repaired in the short circuit.The end diameter ratio of the drill 200
Big 0.1mm~the 0.2mm in aperture in hole 140 is repaired in the short circuit.Specifically, in the present embodiment, the drill 200 can basis
The aperture in resin hole 141 rationally adjusts the diameter of its 200 end of drill on circuit board 100.More specifically, it is contemplated that circuit board
Aperture on 100 is all smaller, and therefore, when the circuit board 100 thicker to plate thickness drills, the hole in hole 140 is repaired in short circuit
140 radius-thickness ratio of hole is repaired for short circuit in the ratio between deep and aperture；The hole depth in hole 140 and the diameter of 200 end of drill are repaired in the short circuit
The ratio between be drill 200 radius-thickness ratio.When short circuit repairs 140 radius-thickness ratio of hole in the range of 30:1, while guaranteeing the end of drill 200
Portion's diameter is 0.1mm~0.2mm bigger than the aperture that hole 140 is repaired in the short circuit.At this point, drill 200 is bored to circuit board 100
The case where Kong Shi, drill 200 is not in breaking, ensure that the normal use of drill 200.Such as: the hole in hole 140 is repaired in short circuit
Diameter is 0.15mm, hole depth 4.5mm.It is 30:1 that 140 radius-thickness ratio of hole is repaired in short circuit at this time, and the aperture in hole 140 is repaired according to short circuit
It determines the diameter of 200 end of drill, selects the drill 200 0.1mm bigger than the aperture that hole 140 is repaired in short circuit.That is 200 end of drill
Diameter be 0.25mm, at this point, short circuit repair hole 140 hole depth (4.5mm) and 200 end of drill diameter (0.25mm) thickness
Diameter ratio is 18:1, that is, is less than the radius-thickness ratio (30:1) that hole 140 is repaired in short circuit, therefore, drill 200 is bored to circuit board 100
It is not in breaking situation when hole.
In one embodiment, it is truncated in process, control gun drilling is carried out at the short circuit 110 using the drill 200.
Specifically, in the present embodiment, the depth pierced needed for according to drill 200 on circuit board 100, can be to the length of drill 200
Degree is estimated.It is marked in the corresponding site of drill 200, when the outer surface of the label and circuit board 100 is at the same level,
Illustrate that drill 200 has arrived at 110 at the short circuit of inner plating 150, no longer needs to extend further into drill 200 at this time, only need to protect
Card current depth carry out control gun drilling can the short circuit to inner plating 150 place 110 realizations clear up.This is only one of real
Mode is applied, such as accurate control is deep to be realized to drill 200 by Numeric Control Technology.
As shown in fig. 6, in one embodiment, circuit board short circuit restorative procedure further includes repairing inspection process.When described
After the completion of intercepting process, the reparation inspection process is carried out to the circuit board 100.Specifically, in the present embodiment, work as drill
110 complete after controlling gun drilling at 200 pairs of short circuits, carry out short-circuit detecting to the region by electrical universal meter.If the region meets
The numerical value of access normal requirement, then whether have drilled open circuit with electrical universal meter detection internal layer circuit, if the non-shape of internal layer circuit
At open circuit, then it is able to confirm that at the short circuit of circuit board 100 and 110 has completed to repair.If it is normal that the region does not still meet access
Drill 200 can then be repaired in hole 140 again insertable into short circuit and carry out returning brills by numerical value, up to have met access normal in the region
Numerical requirements.
In one embodiment, circuit board short circuit restorative procedure further includes filling up process.When the reparation inspection process is complete
Cheng Hou repairs hole 140 to the short circuit and carries out filling up process.Specifically, after the completion of the reparation of circuit board 100, using adhesive
The bore portion for repairing hole 140 to short circuit carries out glue.In the present embodiment, used adhesive is two component adhesive
300 (i.e. wherein one group is divided into this glue, and another group is divided into curing agent, and the mixing of two components can harden.It is commonly called as AB glue).Into one
Step, this glue in two component adhesive 300 also belongs to resin (epoxy resin), therefore, using 300 1 side of two component adhesive
Face can repair hole 140 to short circuit and be filled bonding, be on the other hand also convenient for two component adhesive 300 and hole is repaired in short circuit
Initial resin interaction inside 140.Finally, being filled up completely after hole 140 is repaired in short circuit (double groups after two component adhesive 300
Point adhesive 300 and short circuit, which are repaired, to be flush as being filled up completely at the aperture in hole 140), outer layer pad registration short circuit is repaired
The bonding with circuit board 100 is realized at the aperture in hole 140 and under the action of two component adhesive 300, and then ensure that circuit
Complete appearance after the reparation of plate 100.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (10)
1. a kind of circuit board short circuit restorative procedure characterized by comprising short-circuit positioning process, drilling operating and short circuit are cut
Disconnected process；
In short-circuit positioning process, the position in circuit board at the short circuit of inner plating is determined；
In drilling operating, circuit board is defined as test surfaces equipped with the plate face of welding device, on circuit board with the test surfaces phase
Pair face be idle face, according to the position at short circuit place, would sit idle for locating corresponding aperture with short circuit on face being defined as short-circuit reparation hole,
Hole is repaired across short circuit to drill towards short-circuit place；
It is truncated in process, hole depth to be drilled has reached short circuit when being in the depth of the circuit inner cord, carries out control gun drilling.
2. circuit board short circuit restorative procedure according to claim 1, which is characterized in that in short-circuit positioning process, using electricity
Sub- test step carries out the positioning at short circuit to the circuit board.
3. circuit board short circuit restorative procedure according to claim 2, which is characterized in that in drilling operating, judge described short
Whether road place has remaining communication line on laminate.
4. circuit board short circuit restorative procedure according to claim 1, which is characterized in that in drilling operating, the short circuit is repaired
Multiple holes are the resin hole opened up on the circuit board.
5. circuit board short circuit restorative procedure according to claim 4, which is characterized in that in drilling operating, passed through using drill
Short circuit reparation hole is crossed to drill towards short-circuit place.
6. circuit board short circuit restorative procedure according to claim 5, which is characterized in that the end diameter of the drill is greater than
The aperture in hole is repaired in the short circuit.
7. circuit board short circuit restorative procedure according to claim 6, which is characterized in that the end diameter of the drill compares institute
State the big 0.1mm~0.2mm in aperture that hole is repaired in short circuit.
8. circuit board short circuit restorative procedure according to claim 7, which is characterized in that in truncation process, the short circuit is repaired
The radius-thickness ratio of multiple holes is less than 30:1.
9. circuit board short circuit restorative procedure according to claim 1, which is characterized in that it further include repairing inspection process, when
After the completion of the interception process, the reparation inspection process is carried out to the circuit board.
10. circuit board short circuit restorative procedure according to claim 9, which is characterized in that further include filling up process, when described
After the completion of repairing inspection process, hole is repaired to the short circuit and carries out filling up process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811609918.0A CN109587967B (en) | 2018-12-27 | 2018-12-27 | Circuit board short circuit repairing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811609918.0A CN109587967B (en) | 2018-12-27 | 2018-12-27 | Circuit board short circuit repairing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109587967A true CN109587967A (en) | 2019-04-05 |
| CN109587967B CN109587967B (en) | 2020-08-18 |
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ID=65933008
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811609918.0A Active CN109587967B (en) | 2018-12-27 | 2018-12-27 | Circuit board short circuit repairing method |
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| Country | Link |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112557417A (en) * | 2021-02-28 | 2021-03-26 | 深圳宜美智科技股份有限公司 | PCB laser repairing method and device based on image detection |
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|---|---|---|---|---|
| US4290195A (en) * | 1978-09-01 | 1981-09-22 | Rippere Ralph E | Methods and articles for making electrical circuit connections employing composition material |
| US20020112883A1 (en) * | 2001-02-20 | 2002-08-22 | International Business Machines Corporation | Structure and method for replacing an electrical net |
| CN1377218A (en) * | 2001-03-23 | 2002-10-30 | 黄国铉 | Method for making short-circuit test tool of PCB and its short-circuit test method |
| CN106908713A (en) * | 2017-02-23 | 2017-06-30 | 深圳崇达多层线路板有限公司 | A kind of decision method of wiring board internal layer circuit short circuit reason |
| CN207443219U (en) * | 2017-11-03 | 2018-06-01 | 深圳市飞翔电路有限公司 | A kind of PCB of side attachment component |
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2018
- 2018-12-27 CN CN201811609918.0A patent/CN109587967B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4290195A (en) * | 1978-09-01 | 1981-09-22 | Rippere Ralph E | Methods and articles for making electrical circuit connections employing composition material |
| US20020112883A1 (en) * | 2001-02-20 | 2002-08-22 | International Business Machines Corporation | Structure and method for replacing an electrical net |
| CN1377218A (en) * | 2001-03-23 | 2002-10-30 | 黄国铉 | Method for making short-circuit test tool of PCB and its short-circuit test method |
| CN106908713A (en) * | 2017-02-23 | 2017-06-30 | 深圳崇达多层线路板有限公司 | A kind of decision method of wiring board internal layer circuit short circuit reason |
| CN207443219U (en) * | 2017-11-03 | 2018-06-01 | 深圳市飞翔电路有限公司 | A kind of PCB of side attachment component |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112557417A (en) * | 2021-02-28 | 2021-03-26 | 深圳宜美智科技股份有限公司 | PCB laser repairing method and device based on image detection |
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| Publication number | Publication date |
|---|---|
| CN109587967B (en) | 2020-08-18 |
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