CN109587967B - Circuit board short circuit repairing method - Google Patents
Circuit board short circuit repairing method Download PDFInfo
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- CN109587967B CN109587967B CN201811609918.0A CN201811609918A CN109587967B CN 109587967 B CN109587967 B CN 109587967B CN 201811609918 A CN201811609918 A CN 201811609918A CN 109587967 B CN109587967 B CN 109587967B
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- short circuit
- circuit
- circuit board
- repairing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a short circuit repairing method for a circuit board, which comprises the following steps: short circuit positioning procedure, drilling procedure and short circuit cutting procedure. When the circuit board short circuit repairing method is adopted, firstly, the short circuit of a fault circuit board is checked, and the short circuit position inside the circuit board is determined. And determining a test surface and a free surface of the circuit board (the free surface refers to the non-use surface of the circuit board). At this time, the corresponding hole opening of the short circuit on the idle surface is the short circuit repairing hole of the idle surface. Then, drilling is started from the short-circuit repair hole. And when the drilling depth reaches the depth of the short circuit in the inner layer of the circuit board, drilling the short circuit in a depth-controlled manner. At the moment, residual copper or metal impurities at the short circuit part can be drilled in the process of depth control drilling, so that accidental electrical communication between inner layer conductors is solved, namely the short circuit repairing method of the circuit board can effectively repair the inner layer short circuit of the circuit board.
Description
Technical Field
The invention relates to the technical field of circuit board maintenance, in particular to a circuit board short circuit repairing method.
Background
Conventionally, as the line width and the distance of the printed circuit board are smaller and smaller, the phenomenon of short circuit between two adjacent lines is easier to occur. The short circuit phenomenon of the circuit board can directly influence the normal use of the circuit. Therefore, when the short circuit phenomenon occurs on the surface of the circuit board, the targeted treatment can be directly carried out. However, when the short-circuit area is inside the circuit board, the conventional repair method is to fuse the short-circuit area by using a wire burning machine (fusing machine), but the repair method can only repair the short circuit of the fine residual copper inside the circuit board, and cannot repair the inner layer short circuit caused by the large residual copper or metal impurities inside the circuit board, and at this time, the circuit board can only be scrapped.
Disclosure of Invention
Accordingly, there is a need for a method for repairing a short circuit in a circuit board, which can effectively repair an inner short circuit of the circuit board.
The technical scheme is as follows:
a circuit board short circuit repair method comprises the following steps: short circuit positioning, drilling and cutting off; in the short circuit positioning procedure, the position of a short circuit position of an inner layer plate in the circuit board is determined; in the drilling process, a board surface of the circuit board provided with the welding device is defined as a test surface, a surface of the circuit board opposite to the test surface is an idle surface, an orifice corresponding to a short circuit position on the idle surface is defined as a short circuit repairing hole according to the position of the short circuit position, and the short circuit repairing hole penetrates through the short circuit repairing hole to drill towards the short circuit position; and in the truncation procedure, when the depth of the drilled hole reaches the depth of the short circuit in the inner layer of the circuit board, drilling the hole with depth control.
When the circuit board short circuit repairing method is adopted, firstly, the short circuit of a fault circuit board is checked, and the short circuit position inside the circuit board is determined. And determining a test surface and a free surface of the circuit board (the free surface refers to the non-use surface of the circuit board). At this time, the corresponding hole opening of the short circuit on the idle surface is the short circuit repairing hole of the idle surface. Then, drilling is started from the short-circuit repair hole. And when the drilling depth reaches the depth of the short circuit in the inner layer of the circuit board, drilling the short circuit in a depth-controlled manner. At the moment, residual copper or metal impurities at the short circuit part can be drilled in the process of depth control drilling, so that accidental electrical communication between inner layer conductors is solved, namely the short circuit repairing method of the circuit board can effectively repair the inner layer short circuit of the circuit board.
The invention is further illustrated below with reference to the above scheme:
in the short circuit positioning procedure, the short circuit position of the circuit board is positioned by adopting an electronic testing procedure.
And in the drilling process, judging whether the laminate where the short circuit is positioned has other communication lines.
In the drilling procedure, the short circuit repairing hole is a resin hole formed in the circuit board.
In the drilling process, a drill is adopted to drill towards the short circuit position through the short circuit repairing hole.
The diameter of the end part of the drill bit is larger than the aperture of the short-circuit repairing hole.
The diameter of the end part of the drill bit is 0.1-0.2 mm larger than the aperture of the short circuit repairing hole.
And in the cutting process, the drill cutter is adopted to drill the short circuit position in a depth-controlled manner.
The short circuit repairing method of the circuit board further comprises a repairing and checking process, and when the intercepting process is completed, the repairing and checking process is carried out on the circuit board.
The short circuit repairing method of the circuit board further comprises a filling procedure, and after the repairing and checking procedure is completed, the short circuit repairing hole is filled.
Drawings
Fig. 1 is a schematic structural diagram of a circuit board according to an embodiment of the invention;
fig. 2 is a schematic structural diagram of a circuit board according to another embodiment of the invention;
fig. 3 is a flowchart of a method for repairing a short circuit of a circuit board according to an embodiment of the invention;
fig. 4 is a flowchart of a circuit board short circuit repairing method according to another embodiment of the invention;
fig. 5 is a flowchart of a method for repairing a short circuit of a circuit board according to another embodiment of the present invention;
fig. 6 is a flowchart of a method for repairing a short circuit of a circuit board according to still another embodiment of the invention.
Description of reference numerals:
100. the circuit board comprises a circuit board body, 110, a short circuit position, 120, a testing surface, 130, a spare surface, 140, a short circuit repairing hole, 141, a resin hole, 150, an inner layer board, 200, a drill bit, 300 and a two-component adhesive.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to the accompanying drawings and the detailed description. It should be understood that the detailed description and specific examples, while indicating the scope of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
The terms "first" and "second" used herein do not denote any particular order or quantity, but rather are used to distinguish one element from another.
As shown in fig. 1 to 3, in one embodiment, a method for repairing a short circuit of a circuit board includes: short circuit positioning procedure, drilling procedure and cutting procedure. In the short circuit positioning process, the position of the short circuit 110 of the inner board 150 in the circuit board 100 is determined. In the drilling process, a board surface of the circuit board 100 on which the soldering device is mounted is defined as a test surface 120, a surface of the circuit board 100 opposite to the test surface 120 is defined as an idle surface 130, an orifice of the idle surface 130 corresponding to the short-circuit position 110 is defined as a short-circuit repairing hole 140 according to the position of the short-circuit position 110, and the hole penetrates through the short-circuit repairing hole 140 and is drilled towards the short-circuit position 110. In the cutting process, when the depth of the hole to be drilled reaches the depth of the short circuit part 110 in the inner layer of the circuit board 100, the hole is drilled in a depth-controlled manner.
When the circuit board short-circuit repairing method is adopted, firstly, the short-circuit of the fault circuit board 100 is checked, and the short-circuit position 110 in the circuit board 100 is determined. The test side 120 and the idle side 130 of the circuit board 100 are determined (the idle side 130 refers to the non-use side of the circuit board 100). At this time, the corresponding aperture of the short circuit 110 on the idle surface 130 is the short circuit repairing hole 140 of the idle surface 130. Then, drilling is started from the short-circuit repair hole 140. And when the drilling depth reaches the depth of the short circuit part 110 in the inner layer of the circuit board 100, drilling the short circuit part 110 in a depth-controlled manner. At this time, the residual copper or metal impurities at the short circuit part 110 can be drilled in the depth control drilling process, so that the accidental electrical communication between the inner layer conductors is solved, namely, the short circuit repairing method of the circuit board can effectively repair the inner layer short circuit of the circuit board 100.
Specifically, in the present embodiment, during the soldering process of the circuit board 100, the adjacent circuits of the circuit board 100 are often accidentally connected (electrically connected) due to processing errors. When the short circuit occurs on the circuit board 100, the short circuit is firstly checked on the board surface of the circuit board 100. Since the circuit board 100 has dense circuit connections, fine solder wires or copper foils may accidentally connect two adjacent circuits. At this time, the outer layer board surface of the circuit board 100 may be inspected by using a magnifying glass or other magnifying elements, and when a residual welding wire or a residual copper foil is found between adjacent lines, the welding wire or the residual copper may be cleaned directly by using a fusing machine or a wire burning machine. In the cleaning process, the normal line is prevented from being cut off accidentally. For example, for a circuit board 100 with dense circuits or a complex circuit structure, a computer may look up a design drawing corresponding to the circuit board 100, find an area with dense circuits and a small distance between adjacent circuits in the design drawing, and list the area as a key investigation area. Then, the relevant area is correspondingly located on the circuit board 100, and the targeted investigation is performed. The above manner can more effectively determine the short circuit 110 of the circuit board 100. Further, in order to avoid the short circuit phenomenon of the circuit board 100, the short circuit detection is performed on the soldering device every time one soldering device is soldered in the process of soldering the circuit board 100, so that the short circuit phenomenon of the circuit board 100 can be effectively avoided.
In one embodiment, as shown in fig. 4, in the short circuit positioning process, an electronic test process is used to position the short circuit 110 on the circuit board 100. Specifically, in the present embodiment, when a short circuit occurs in the inner layer board 150 of the circuit board 100, the short circuit site 110 of the inner layer board 150 is first located through an electrical test process. When the electronic testing process performs the short circuit test on the circuit board 100, a basic short circuit preset value is set in the electronic testing process according to different power utilization environments suitable for different circuit boards 100. The circuit board 100 to be tested is placed in an electronic testing process, and at this time, the electronic testing program will perform troubleshooting and detection on all circuit networks of the circuit board 100. For example: a basic short circuit preset value (resistance value) of 40M Ω (mega ohm) is set in the electronic test procedure, and at this time, when the electronic test procedure detects that the resistance value of a part of line network area on the circuit board 100 is lower than 40M Ω, the area is reported to have a short circuit condition. The electronic test process may then lock into the short circuit area for further scrutiny until the precise location on the circuit board 100 where the short circuit occurred is detected. This is but one example, and the electronic testing process described above may also perform open circuit detection on the circuit board 100. Depending on the different power usage environments used by the different circuit boards 100. A basic open circuit preset value is set during the electronic test procedure. The circuit board 100 to be tested is placed in an electronic testing process, and at this time, the electronic testing program will perform troubleshooting and detection on all circuit networks of the circuit board 100. For example, a basic open circuit preset value (resistance value) is set to 10 Ω (ohm) in the electronic test process, and at this time, when the electronic test process detects that the resistance value of a partial line network area on the circuit board 100 is higher than 10 Ω, the open circuit condition in the area is reported. The electronic test process may then lock into the open area for further scrutiny until the precise location on the circuit board 100 where the open circuit occurred is detected.
In one embodiment, as shown in fig. 5, during the drilling process, it is determined whether there are any other communication lines on the laminate where the short circuit 110 is located. Specifically, in the present embodiment, the line width and the pitch of the circuit on the circuit board 100 are smaller and smaller. When the short circuit 110 of the inner plate 150 is determined, other normal circuits are prevented from being affected during the drilling process when the circuit board 100 is drilled. Therefore, before drilling the circuit board 100, the distance between the line near the short circuit 110 and the short circuit 110 needs to be determined, and then the hole diameter of the drilled hole needs to be determined reasonably, so that the repairing effect of the circuit board short circuit repairing method on the circuit board 100 is improved.
As shown in fig. 1 and 2, in one embodiment, in the drilling process, the short repairing hole 140 is a resin hole 141 formed in the circuit board 100. Specifically, in the present embodiment, when the circuit board 100 is soldered, a plurality of holes are formed on the board surface in consideration of the need of later routing. Meanwhile, the holes which are not utilized are filled with resin, so that resin plugging is realized (the purpose is to ensure that the surface of the circuit board 100 is smooth, thereby being beneficial to manufacturing and processing of fine circuits on the circuit board 100). More specifically, in the short-circuit repairing process of the circuit board 100, the resin hole 141 corresponding to the short-circuit 110 on the idle surface 130 is selected as the short-circuit repairing hole 140 according to the actual position of the short-circuit 110 of the inner plate 150, and at this time, because the previous hole-opening base is available, the drilling of the circuit board 100 is more convenient.
In one embodiment, during the drilling process, a drill 200 is used to drill a hole through the short circuit repair hole 140 toward the short circuit 110. The end diameter of the drill 200 is larger than the diameter of the short-circuit repair hole 140. The diameter of the end part of the drill 200 is 0.1 mm-0.2 mm larger than the diameter of the short circuit repairing hole 140. Specifically, in the present embodiment, the drill 200 may be adjusted in diameter at the end of the drill 200 according to the diameter of the resin hole 141 of the circuit board 100. More specifically, considering that the hole diameters on the circuit board 100 are all relatively small, when the circuit board 100 with a thick board is drilled, the ratio of the hole depth to the hole diameter of the short-circuit repairing hole 140 is the thickness-diameter ratio of the short-circuit repairing hole 140; the ratio of the hole depth of the short circuit repairing hole 140 to the diameter of the end of the drill 200 is the ratio of the thickness to the diameter of the drill 200. When the thickness-diameter ratio of the short circuit repairing hole 140 is in the range of 30:1, the diameter of the end part of the drill bit 200 is ensured to be 0.1-0.2 mm larger than the diameter of the short circuit repairing hole 140. At this time, when the drill 200 drills the circuit board 100, the drill 200 does not break, and normal use of the drill 200 is ensured. For example: the short-circuit repairing hole 140 has a hole diameter of 0.15mm and a hole depth of 4.5 mm. At the moment, the thickness-diameter ratio of the short-circuit repairing hole 140 is 30:1, the diameter of the end part of the drill 200 is determined according to the diameter of the short-circuit repairing hole 140, and the drill 200 which is 0.1mm larger than the diameter of the short-circuit repairing hole 140 is selected. That is, the diameter of the end of the drill 200 is 0.25mm, and at this time, the ratio of the depth (4.5mm) of the short-circuit repairing hole 140 to the diameter (0.25mm) of the end of the drill 200 is 18:1, that is, smaller than the ratio of the depth to the diameter (30:1) of the short-circuit repairing hole 140, so that the drill 200 does not break when drilling the circuit board 100.
In one embodiment, the cutting process uses the drill 200 to drill the short circuit 110 with controlled depth. Specifically, in the present embodiment, the length of the drill 200 may be estimated according to the required drilling depth of the drill 200 on the circuit board 100. Namely, the corresponding position of the drill 200 is marked, when the mark is kept flat with the outer surface of the circuit board 100, it is indicated that the drill 200 has reached the short-circuit position 110 of the inner layer board 150, and at this time, the drill 200 does not need to be further extended, and the short-circuit position 110 of the inner layer board 150 can be cleaned only by drilling a depth-controlled hole at the current depth. This is just one embodiment, and the depth control of the drill 200 can be achieved precisely by numerical control techniques, for example.
As shown in fig. 6, in one embodiment, the method for repairing a short circuit of a circuit board further includes a repair checking process. After the cutting process is completed, the repair and inspection process is performed on the circuit board 100. Specifically, in the present embodiment, after the drill 200 completes the depth-controlled drilling on the short-circuit portion 110, the short-circuit detection is performed on the area through the electrical universal meter. If the area meets the value of the normal requirement of the path, an electrical universal meter is used for detecting whether the inner layer line is drilled with an open circuit, and if the inner layer line does not form an open circuit, the short circuit part 110 of the circuit board 100 can be confirmed to be repaired. If the area still does not meet the normal numerical value of the access, the drill bit 200 can be inserted into the short circuit repairing hole 140 again for back drilling until the area meets the normal numerical value requirement of the access.
In one embodiment, the method for repairing the short circuit of the circuit board further comprises a filling process. After the repairing and inspecting process is completed, the short-circuit repairing hole 140 is filled. Specifically, after the circuit board 100 is repaired, the drilled portion of the short repair hole 140 is repaired with an adhesive. In this embodiment, the adhesive used is a two-component adhesive 300 (i.e., one component is the adhesive and the other component is a hardener, and the two components are mixed to harden. Further, the present adhesive in the two-component adhesive 300 is also a resin (epoxy resin), so that the two-component adhesive 300 can be used to fill and adhere the short-circuit repairing hole 140 on the one hand, and also facilitate the interaction between the two-component adhesive 300 and the original resin inside the short-circuit repairing hole 140 on the other hand. Finally, after the two-component adhesive 300 is completely filled in the short-circuit repairing hole 140 (the two-component adhesive 300 is flush with the hole of the short-circuit repairing hole 140, that is, completely filled), the outer-layer bonding pad is aligned to the hole of the short-circuit repairing hole 140 and is bonded with the circuit board 100 under the action of the two-component adhesive 300, so that the appearance integrity of the circuit board 100 after being repaired is ensured.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A circuit board short circuit repairing method is characterized by comprising the following steps: short circuit positioning, drilling and cutting off;
in the short circuit positioning procedure, the position of a short circuit position of an inner layer plate in the circuit board is determined;
in the drilling process, a board surface of the circuit board provided with the welding device is defined as a test surface, a surface of the circuit board opposite to the test surface is an idle surface, an orifice corresponding to a short circuit position on the idle surface is defined as a short circuit repairing hole according to the position of the short circuit position, and the short circuit repairing hole penetrates through the short circuit repairing hole to drill towards the short circuit position;
and in the truncation procedure, when the depth of the drilled hole reaches the depth of the short circuit in the inner layer of the circuit board, drilling the hole with depth control.
2. The method for repairing a short circuit of a circuit board according to claim 1, wherein in the short circuit positioning step, an electronic test step is used to position the short circuit position of the circuit board.
3. The method of claim 2, wherein in the drilling step, it is determined whether there are any other connecting lines on the laminate where the short circuit is located.
4. The method for repairing a short circuit in a circuit board according to claim 1, wherein the short circuit repairing hole is a resin hole formed in the circuit board in the drilling step.
5. The method for repairing a short circuit of a circuit board according to claim 4, wherein in the drilling step, a drill is used to drill a hole through the short circuit repairing hole to the short circuit position.
6. The method of claim 5, wherein the diameter of the end of the drill is larger than the diameter of the short-circuit repairing hole.
7. The method for repairing a short circuit of a circuit board according to claim 6, wherein a diameter of an end portion of the drill is 0.1mm to 0.2mm larger than a diameter of the short circuit repairing hole.
8. The method for repairing a short circuit of a circuit board according to claim 7, wherein in the cutting step, a thickness-to-diameter ratio of the short circuit repairing hole is less than 30: 1.
9. the method for repairing a short circuit of a circuit board according to claim 1, further comprising a repair inspection step of performing the repair inspection step on the circuit board after the cutoff step is completed.
10. The method for repairing a short circuit of a circuit board according to claim 9, further comprising a filling step of filling the short circuit repairing hole after the repairing and inspecting step is completed.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811609918.0A CN109587967B (en) | 2018-12-27 | 2018-12-27 | Circuit board short circuit repairing method |
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| CN201811609918.0A CN109587967B (en) | 2018-12-27 | 2018-12-27 | Circuit board short circuit repairing method |
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| CN109587967A CN109587967A (en) | 2019-04-05 |
| CN109587967B true CN109587967B (en) | 2020-08-18 |
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| CN201811609918.0A Active CN109587967B (en) | 2018-12-27 | 2018-12-27 | Circuit board short circuit repairing method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI743918B (en) * | 2020-07-31 | 2021-10-21 | 牧德科技股份有限公司 | Electrical test method of circuit board |
| CN112557417B (en) * | 2021-02-28 | 2021-05-11 | 深圳宜美智科技股份有限公司 | PCB laser repairing method and device based on image detection |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US4290195A (en) * | 1978-09-01 | 1981-09-22 | Rippere Ralph E | Methods and articles for making electrical circuit connections employing composition material |
| US6518517B2 (en) * | 2001-02-20 | 2003-02-11 | International Business Machines Corporation | Circuit board having a through hole having an insulating material inside and a conductive element |
| CN1377218A (en) * | 2001-03-23 | 2002-10-30 | 黄国铉 | Method for making short-circuit test tool of PCB and its short-circuit test method |
| CN106908713B (en) * | 2017-02-23 | 2019-10-22 | 深圳崇达多层线路板有限公司 | A kind of determination method of wiring board internal layer circuit short circuit reason |
| CN207443219U (en) * | 2017-11-03 | 2018-06-01 | 深圳市飞翔电路有限公司 | A kind of PCB of side attachment component |
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