CN109618500A - Reparation detection method for semiconductor test board - Google Patents
Reparation detection method for semiconductor test board Download PDFInfo
- Publication number
- CN109618500A CN109618500A CN201811609402.6A CN201811609402A CN109618500A CN 109618500 A CN109618500 A CN 109618500A CN 201811609402 A CN201811609402 A CN 201811609402A CN 109618500 A CN109618500 A CN 109618500A
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- China
- Prior art keywords
- copper facing
- facing hole
- open circuit
- hole
- copper
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Abstract
The invention discloses a kind of reparation detection methods for semiconductor test board, carry out open-circuit fault investigation to faulty circuit plate first, and determine at the open circuit inside open circuit copper facing hole.Suitable diamond piece is selected according to the aperture in open circuit copper facing hole, and open-circuit copper facing hole drills, at this point, open circuit copper facing hole is under the drilling operation of diamond piece, the side wall in aperture copper facing hole can be removed together at open circuit, bore copper facing hole so as to form non-notch on hole wall or returning for fracture.Again to return bore copper facing hole carry out conductive material filling, so that corresponding conductive capability can be obtained by repairing copper facing hole, that is the part that is drilled of open circuit copper facing hole is after conductive material is filled, can obtain with drill before preset the corresponding conductive capability in copper facing hole, and repair on the hole wall in copper facing hole non-notch or fracture.Finally, carrying out heavy copper, plate plating to copper facing hole is repaired.It realizes to the open circuit reparation on circuit board, avoids scrapping for circuit board.
Description
Technical field
The present invention relates to the technical fields of pcb board processing, examine more particularly to a kind of reparation for semiconductor test board
Survey method.
Background technique
Traditionally, the copper facing hole for realizing route interconnection conducting is equipped on pcb board (circuit board) face.With PCB skill
The thickness of the continuous renewal of art, pcb board body is more and more thicker, and the aperture in copper facing hole will not generally change, so that plating
The aspect ratio in copper hole is increasing (the ratio between finger-hole diameter and hole depth).When carrying out copper facing hole machined to semiconductor test board, partly lead
Body test board will appear open circuit defect.But traditional detection technique can only the finished product of semiconductor test board detected, i.e., pair
Copper facing hole carries out electrical testing.At this point, semiconductor test board can not be reprocessed if the electrical testing of semiconductor test board is unqualified,
It can only carry out scrapping processing.
Summary of the invention
Based on this, it is necessary to provide a kind of reparation detection method for semiconductor test board, can be avoided circuit blackboard newspaper
It is useless.
Its technical solution is as follows:
A kind of reparation detection method for semiconductor test board, comprising: determine the position in the open circuit copper facing hole on circuit board
It sets, and at the open circuit on the hole wall in the determining open circuit copper facing hole；It is drilled using diamond piece to the open circuit copper facing hole, and institute
The aperture for stating open circuit copper facing hole, which expands under the action of drilling and formed to return, bores copper facing hole, on the hole wall in the open circuit copper facing hole
Open circuit is removed during being in borehole enlargement；The brill copper facing hole of returning is carried out the filling of conductive material and is formed to repair plating
Copper hole, until the aperture for repairing copper facing hole is consistent with the open circuit aperture in copper facing hole；The reparation copper facing hole is carried out
Heavy copper, plate plating.
When using reparation detection method for semiconductor test board, open-circuit fault row is carried out to faulty circuit plate first
It looks into, and determines at the open circuit inside open circuit copper facing hole.Suitable diamond piece is selected according to the aperture in open circuit copper facing hole, and open-circuit plates
Copper hole drills, at this point, copper facing hole is opened a way under the drilling operation of diamond piece, it can be together at the side wall and open circuit in aperture copper facing hole
It removes, bores copper facing hole so as to form non-notch on hole wall or returning for fracture.Again to return bore copper facing hole carry out conductive material fill out
It fills, so that corresponding conductive capability can be obtained by repairing copper facing hole, i.e., the part that open circuit copper facing hole is drilled is passed through electrically
After material is filled, can obtain with drill before preset the corresponding conductive capability in copper facing hole, and repair on the hole wall in copper facing hole
Non-notch or fracture.Finally, carrying out heavy copper, plate plating to copper facing hole is repaired.It realizes and the open circuit on circuit board is repaired
It is multiple, avoid scrapping for circuit board.
Below with reference to above scheme, the present invention is further described:
Determine the position in the open circuit copper facing hole on circuit board, and at the open circuit on the hole wall in the determining open circuit copper facing hole
In step, the positioning carried out using Electronic Testing process to the circuit board at open circuit is further comprised the steps of:.
It is drilled using diamond piece to the open circuit copper facing hole, and the aperture in the open circuit copper facing hole is under the action of drilling
Expand and formed to return and bores copper facing hole, what the open circuit on the hole wall in the open circuit copper facing hole was removed during being in borehole enlargement
In step, further comprise the steps of: judge it is described open circuit place inner plating whether be equipped with other communication lines:
If it is described open circuit place inner plating be equipped with other communication lines, drilling when, it is described return bore copper facing hole should keep away
Exempt to contact with the weld-ring of other communication lines；
If the inner plating where the open circuit is not provided with other communication lines, described return is opened described in the aperture ratio for boring copper facing hole
Big 0.05mm~the 0.1mm in aperture in road copper facing hole.
It is drilled using diamond piece to the open circuit copper facing hole, and the aperture in the open circuit copper facing hole is under the action of drilling
Expand and formed to return and bores copper facing hole, what the open circuit on the hole wall in the open circuit copper facing hole was removed during being in borehole enlargement
In step, further comprise the steps of: when drilling to the open circuit copper facing hole, bore error deviation should be controlled in -1mil~1mil.
It is drilled using diamond piece to the open circuit copper facing hole, and the aperture in the open circuit copper facing hole is under the action of drilling
Expand and formed to return and bores copper facing hole, what the open circuit on the hole wall in the open circuit copper facing hole was removed during being in borehole enlargement
In step, further comprises the steps of: and drill in the open circuit copper facing hole completely.
The brill copper facing hole of returning is carried out the filling of conductive material and is formed to repair copper facing hole, until the reparation copper facing hole
Aperture with the consistent step in the open circuit aperture in copper facing hole, conductive material used by further comprising the steps of: is conductive tree
Rouge or ink.
The brill copper facing hole of returning is carried out the filling of conductive material and is formed to repair copper facing hole, until the reparation copper facing hole
Aperture described return is bored by copper facing hole carries out electrically with further comprising the steps of: in the consistent step in the open circuit aperture in copper facing hole
The filling of material, until the brill copper facing hole of returning is solid, using diamond piece identical with the open circuit copper facing hole aperture, to institute
It states to return and bores copper facing hole and returned brills again, up to identical with the open circuit copper facing hole aperture reparation copper facing hole of formation.
The diamond piece diameter and the radius-thickness ratio of the hole depth for repairing copper facing hole are less than 30:1.
In the step of carrying out heavy copper, plate plating to the reparation copper facing hole, further comprise the steps of: when the open circuit copper facing hole
When for resin hole, after carrying out heavy copper (heavy copper sheet plating and electroplating hole copper) to the reparation copper facing hole, it is also necessary to the reparation
Resin filling is carried out inside copper facing hole.
Reparation detection method for semiconductor test board further include repair inspection process, when to the reparation copper facing hole into
It goes after the completion of the step of sinking copper, plate plating, the reparation inspection process is carried out to the circuit board.
Detailed description of the invention
Fig. 1 is the flow chart described in one embodiment of the invention for the reparation detection method of semiconductor test board；
Fig. 2 is the flow chart described in another embodiment of the present invention for the reparation detection method of semiconductor test board；
Fig. 3 is the structural schematic diagram of circuit board described in one embodiment of the invention；
Fig. 4 is the structural schematic diagram of circuit board described in another embodiment of the present invention.
Description of symbols:
100, circuit board, 110, open circuit copper facing hole, 111, at open circuit, 120, return and bore copper facing hole, 130, repair copper facing hole,
200, diamond piece, 300, conductive material, 400, heavy copper, 500, resin.
Specific embodiment
To make the objectives, technical solutions, and advantages of the present invention more comprehensible, below in conjunction with attached drawing and specific embodiment party
Formula, the present invention is further described in detail.It should be understood that the specific embodiments described herein are only to solve
The present invention is released, and the scope of protection of the present invention is not limited.
It should be noted that it can directly on the other element when element is referred to as " being fixed on " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement for illustrative purposes only, are not meant to be the only embodiment.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more
Any and all combinations of relevant listed item.
Heretofore described " first ", " second " do not represent specific quantity and sequence, are only used for the differentiation of title.
As shown in Figure 1, in one embodiment, a kind of reparation detection method for semiconductor test board, comprising: determine
The position in the open circuit copper facing hole 110 on circuit board 100, and 111 at the open circuit on the hole wall in the determining open circuit copper facing hole 110.
It drills to the open circuit copper facing hole 110, and the aperture in the open circuit copper facing hole 110 expands formation under the action of drilling and returns
Copper facing hole 120 is bored, 111 are removed during borehole enlargement at the open circuit on the hole wall in the open circuit copper facing hole 110.To institute
It states to return the filling for boring the progress of copper facing hole 120 conductive material 300 and formed and repairs copper facing hole 130, until the reparation copper facing hole 130
Aperture it is consistent with the open circuit aperture in copper facing hole 110.Heavy copper 400, plate plating are carried out to the reparation copper facing hole 130.
Specifically, the heavy copper 400, plate plating include the operation such as heavy copper sheet plating and electroplating hole copper.
When using reparation detection method for semiconductor test board, open-circuit fault is carried out to faulty circuit plate 100 first
Investigation, and determine 111 at the open circuit inside open circuit copper facing hole 110.Suitable diamond piece is selected according to the aperture in open circuit copper facing hole 110
200, and open-circuit copper facing hole 110 drills, at this point, open circuit copper facing hole 110 is under the drilling operation of diamond piece 200, aperture is plated
The side wall in copper hole can be removed together at open circuit 111, bore copper facing hole 120 so as to form non-notch on hole wall or returning for fracture.
Again it to the brill copper facing hole 120 progress filling of conductive material 300 is returned, is led accordingly so that repairing copper facing hole 130 and can obtain
The part that electric energy power, i.e. open circuit copper facing hole 110 are drilled is after conductive material 300 is filled, before capable of obtaining and drilling
The default corresponding conductive capability in copper facing hole, and non-notch or fracture on the hole wall in reparation copper facing hole 130.Finally, being plated to repairing
Copper hole 130 carries out heavy copper 400, plate plating.It realizes to the open circuit reparation on circuit board 100, avoids circuit board 100
It scraps.
In one embodiment, specifically, in the present embodiment, circuit board 100 production welding process in, often by
In mismachining tolerance, lead to the case where occurring solder skip on circuit board 100 or leaking even, so that occurring open circuit feelings on circuit board 100
Condition.When open circuit phenomenon occurs in circuit board 100, open circuit investigation can be carried out to the plate face of circuit board 100 first, due to circuit board
100 connection is often than comparatively dense, and scolding tin is uneven or soldering tin amount not enough can all directly result in circuit board 100 and open a way
Situation.At this point it is possible to be checked by magnifying glass or other amplifier elements to the outer layer plate face of circuit board 100, for welding
Ineffective region can carry out repair welding, and the open circuit of circuit board 100 is solved the problems, such as with this.Meanwhile in the process for carrying out repair welding
In, it to avoid surprisingly being welded to other regular links, that is, avoid the occurrence of line short phenomenon.Above-mentioned is only one of implement
Mode, such as: or route mechanism more complicated circuit board 100 more intensive for route can consult circuit by computer
The corresponding design drawing of plate 100 finds more intensive route in design drawing, the small-pitch region of adjacent lines and is classified as weight
Point investigation area.Then, correspondence orients relevant range on circuit board 100, and carries out specific aim investigation.Aforesaid way can
111 at the significantly more efficient open circuit for determining circuit board 100.Further, in order to avoid circuit board 100 generates open circuit phenomenon,
As soon as every welding welding device, carries out open circuit detection to the welding device during welding to circuit board 100,
So as to be effectively prevented from the generation of 100 short circuit phenomenon of circuit board.
As shown in Fig. 2, in one embodiment, determining the position in the open circuit copper facing hole 110 on circuit board 100, and determine
In the step of 111 at open circuit on the hole wall in the open circuit copper facing hole 110, further comprise the steps of: using Electronic Testing process to institute
State the positioning that circuit board 100 carries out at open circuit 111.Specifically, in the present embodiment, when the inner plating of circuit board 100 is opened
Lu Shi is positioned by Electronic Testing process at inner plating open circuit 111 first.When Electronic Testing process is to circuit board 100
When carrying out open test, the different power utilization environments being applicable according to various boards 100 set one in Electronic Testing process
Basis open circuit preset value.Circuit board under test 100 is placed in Electronic Testing process, Electronic Testing program can be to circuit board at this time
100 all circuit networks carry out investigation detection.For example, being provided with basis open circuit preset value (resistance value) in Electronic Testing process
10 Ω (ohm), at this point, when Electronic Testing process detects that the resistance value in the part circuit network region on circuit board 100 is higher than 10
When Ω, i.e., the region can be reported open circuit situation occur.Then, Electronic Testing process can be locked in the open circuit region and carry out further
Investigation is until detecting occur the exact position opened a way on circuit board 100, according to the open-circuit position of circuit board 100 to circuit board
Corresponding copper facing hole is handled on 100.
Above-mentioned is only one of embodiment of the present embodiment, influence the factor of 100 normal use of circuit board in addition to
Open circuit situation, there are also the short-circuit conditions of circuit board 100.Therefore, short-circuit test is carried out to circuit board 100 by Electronic Testing process
When, it is default to set a basis short circuit in Electronic Testing process for the different power utilization environments being applicable according to various boards 100
Value.Circuit board under test 100 is placed in Electronic Testing process, Electronic Testing program can be to all routes of circuit board 100 at this time
Network carries out investigation detection.Such as: be provided in Electronic Testing process the short-circuit preset value (resistance value) in basis be 40M Ω (megaohm
Nurse), at this point, when Electronic Testing process detects the resistance value in the part circuit network region on circuit board 100 lower than 40M Ω,
The region can be reported short-circuit conditions occur.Then, Electronic Testing process can be locked in the short-circuited region and further be checked,
Until the exact position for detecting to occur short circuit on circuit board 100.
In one embodiment, it is drilled using diamond piece 200 to the open circuit copper facing hole 110, and the open circuit copper facing
The aperture in hole 110, which expands under the action of drilling and formed to return, bores copper facing hole 120, on the hole wall in the open circuit copper facing hole 110
At open circuit in 111 the step of being removed during borehole enlargement, further include step judge it is interior where 111 at the open circuit
Whether laminate is equipped with other communication lines.If the inner plating where 111 at the open circuit is equipped with other communication lines, drilling
When, described return bores copper facing hole 120 and should be avoided and contact with the weld-ring of other communication lines.If the inner plating where the open circuit is not set
There are other communication lines, the big 0.05mm in aperture in open circuit copper facing hole 110 described in the aperture ratio for returning brill copper facing hole 120~
0.1mm.Specifically, in the present embodiment, as the line width and spacing of route on circuit board 100 are smaller and smaller.When determining electricity
After 111 at the open circuit of 100 internal layer of road plate, when drilling to circuit board 100, to avoid influencing it during drilling
His regular link.Therefore, before drilling to circuit board 100, need to determine open circuit copper facing hole 110 and other routes first
Between spacing, then open-circuit copper facing hole 110 is reasonably drilled, to improve above-mentioned for semiconductor test board
Detection method is repaired for the repairing effect of circuit board 100.
In one embodiment, it is drilled using diamond piece 200 to the open circuit copper facing hole 110, and the open circuit copper facing
The aperture in hole 110, which expands under the action of drilling and formed to return, bores copper facing hole 120, on the hole wall in the open circuit copper facing hole 110
At open circuit in 111 the step of being removed during borehole enlargement, further comprises the steps of: and the open circuit copper facing hole 110 is carried out
When drilling, drilling stand-off error should be controlled in -1mil~1mil.Specifically, in the present embodiment, actual borehole direction and ideal
The opposite offset of boring direction is stand-off error.Wherein, the left side 1mil of ideal boring direction is partial in actual borehole direction, i.e.,
For -1mil, the right side 1mil of ideal boring direction, as -1mil are partial in actual borehole direction.Due to 100 internal layer of circuit board
Route it is complex, when open-circuit copper facing hole 110 is drilled, error is excessive, on the one hand will appear it is unexpected bore open it is other just
The risk of normal line, other hand also will appear at the open circuit on open circuit copper facing hole 110 111 and remove halfway situation.Therefore, will
When bore error control is in 0mil~1mil, drilling effect is ideal.Wherein 1mil=0.0254mm.
In one embodiment, it is drilled using diamond piece 200 to the open circuit copper facing hole 110, and the open circuit copper facing
The aperture in hole 110, which expands under the action of drilling and formed to return, bores copper facing hole 120, on the hole wall in the open circuit copper facing hole 110
At open circuit in 111 the step of being removed during borehole enlargement, further comprises the steps of: and bore in the open circuit copper facing hole completely
It wears.Specifically, in the present embodiment, in order to avoid to return bore copper facing hole 120 inside fill conductive material when, conductive material with open
Residual pores copper combination inside road copper facing hole 110 can not carry out effectively conduction, and therefore, open circuit copper facing hole 110 is drilled completely
The hole copper inside open circuit copper facing hole 110 can be disposed, and filling conductive material ensure that the conduction for repairing copper facing hole 130 again
Effect.
In one embodiment, to it is described return bore copper facing hole 120 carry out conductive material 300 filling and form reparation copper facing
Hole 130, up to further including in the step consistent with the open circuit aperture in copper facing hole 110 of the aperture for repairing copper facing hole 130
Step: used conductive material 300 is electroconductive resin or ink.Specifically, in the present embodiment, using electroconductive resin or oil
Ink is filled to brill copper facing hole 120 is returned, and while guaranteeing that returning brill copper facing hole 120 has conductive capability, can also guarantee to lead
Electric material returning bore copper facing hole 120 inside plumpness, can realize conductive material return brill copper facing hole 120 inside it is abundant
Filling.More specifically, being filled using resin 500 to copper facing hole, it can be further ensured that the smooth of 100 plate face of circuit board
Property, that is, it ensure that the using effect of circuit board 100.
In one embodiment, to it is described return bore copper facing hole 120 carry out conductive material 300 filling and form reparation copper facing
Hole 130, up to further including in the step consistent with the open circuit aperture in copper facing hole 110 of the aperture for repairing copper facing hole 130
Step: to the filling for returning and boring copper facing hole 120 and carrying out conductive material 300, it is solid that brill copper facing hole 120 is returned described in.
Using diamond piece 200 identical with 110 aperture of open circuit copper facing hole, brill is returned again to the brill copper facing hole 120 of returning, until
Form reparation copper facing hole 130 identical with 110 aperture of open circuit copper facing hole.Specifically, above embodiment can guarantee electricity
Property material 300 returning bore copper facing hole 120 inside filling effect, while also ensure reparation copper facing hole 130 conductive effect.
In one embodiment, 200 diameter of diamond piece and the radius-thickness ratio of the hole depth for repairing copper facing hole 130 are less than
30:1.Specifically, in the present embodiment, the diamond piece 200 can be closed according to the aperture for repairing copper facing hole 130 on circuit board 100
Reason adjusts the diameter of its 200 end of diamond piece.More specifically, it is contemplated that the aperture on circuit board 100 is all smaller, therefore, right
When the thicker circuit board 100 of plate thickness is drilled, the ratio between hole depth and the aperture in copper facing hole 130 are repaired to repair copper facing hole 130
Radius-thickness ratio；The diameter ratio of the hole depth for repairing copper facing hole 130 and 200 end of diamond piece is the radius-thickness ratio of diamond piece 200.When described
The radius-thickness ratio of diamond piece 200 is located at 130 radius-thickness ratio of reparation copper facing hole in the range of 30:1, i.e., described 200 diameter of diamond piece with
The radius-thickness ratio of the hole depth for repairing copper facing hole 130 is less than 30:1.At this point, diamond piece 200 is when drilling to circuit board 100,
The case where diamond piece 200 is not in breaking ensure that the normal use of diamond piece 200.
As shown in Figure 3 and Figure 4, in one embodiment, heavy copper 400, plate plating are carried out to the reparation copper facing hole 130
The step of in, further comprise the steps of: when the open circuit copper facing hole 110 be resin hole when, sink to the reparation copper facing hole 130
After copper 400, it is also necessary to be filled to resin 500 is carried out inside the reparation copper facing hole 130.Specifically, in the present embodiment, to electricity
Aperture on road plate 100 carries out 500 consent of resin and forms the resin hole.The resin hole can guarantee circuit board 100
The planarization on surface, to be conducive to the production processing of fine-line on circuit board 100.When the open circuit copper facing hole 110 is logical
Kong Shi no longer needs to carry out 500 consent of resin to reparation copper facing hole 130.
It in one embodiment, further include repairing inspection process for the reparation detection method of semiconductor test board.When right
After the completion of the reparation copper facing hole 130 carries out the step of heavy copper 400, plate plating, the reparation is carried out to the circuit board 100
Inspection process.Specifically, in the present embodiment, after the completion of the open circuit of circuit board 100 is repaired, by electrical universal meter to circuit
Plate 100 re-starts open circuit detection.If the region has met the numerical value of access normal requirement, then detects internal layer with electrical universal meter
Whether route has short-circuit conditions, if internal layer circuit does not occur short-circuit conditions, can assert that circuit board 100 has been completed to repair.
If the region does not still meet access regime values, the above-mentioned reparation detection side for semiconductor test board can be used again
Method is reprocessed, until the region has met access regime values requirement.
In one embodiment, after completing heavy copper 400, plate plating.Using electrical universal meter to reparation copper facing hole 130
Detected, i.e., detection repair copper facing hole 130 in whether complete copper facing.After qualification to be detected, blue glue is pasted on circuit board 100
Band (insulating tape) avoids circuit board 100 from occurring etching when in use or accidental damage.More specifically, when open circuit copper facing hole 110
It after the completion of reparation, opens a window on blue adhesive tape, windowed regions are corresponding with the reparation copper facing hole 130, then by repairing
Conducting resinl, which is pasted, at multiple copper facing hole 130 realizes plated conductive.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (10)
1. a kind of reparation detection method for semiconductor test board characterized by comprising
Determine the position in the open circuit copper facing hole on circuit board, and at the open circuit on the hole wall in the determining open circuit copper facing hole；
It is drilled using diamond piece to the open circuit copper facing hole, and the aperture in the open circuit copper facing hole expands under the action of drilling
And formed to return and bore copper facing hole, the open circuit on the hole wall in the open circuit copper facing hole is removed during being in borehole enlargement；
The brill copper facing hole of returning is carried out the filling of conductive material and is formed to repair copper facing hole, until the hole for repairing copper facing hole
Diameter is consistent with the open circuit aperture in copper facing hole；
Heavy copper, plate plating are carried out to the reparation copper facing hole.
2. the reparation detection method according to claim 1 for semiconductor test board, which is characterized in that determine circuit board
On open circuit copper facing hole position, and determine it is described open circuit copper facing hole hole wall on open circuit at the step of in, further comprise the steps of:
The positioning at open circuit is carried out to the circuit board using Electronic Testing process.
3. the reparation detection method according to claim 1 for semiconductor test board, which is characterized in that use diamond piece pair
The open circuit copper facing hole drills, and the aperture in the open circuit copper facing hole expands and formed under the action of drilling and returns brill copper facing
Hole further comprises the steps of: during the open circuit on the hole wall in the open circuit copper facing hole is in borehole enlargement in the step of being removed
Judge it is described open circuit place inner plating whether be equipped with other communication lines:
If it is described open circuit place inner plating be equipped with other communication lines, drilling when, it is described return bore copper facing hole should be avoided with
The weld-ring of other communication lines contacts；
If the inner plating where the open circuit is not provided with other communication lines, described to return plating of opening a way described in the aperture ratio for boring copper facing hole
Big 0.05mm~the 0.1mm in the aperture in copper hole.
4. the reparation detection method according to claim 1 for semiconductor test board, which is characterized in that use diamond piece pair
The open circuit copper facing hole drills, and the aperture in the open circuit copper facing hole expands and formed under the action of drilling and returns brill copper facing
Hole further comprises the steps of: during the open circuit on the hole wall in the open circuit copper facing hole is in borehole enlargement in the step of being removed
When drilling to the open circuit copper facing hole, bore error deviation should be controlled in -1mil~1mil.
5. the reparation detection method according to claim 1 for semiconductor test board, which is characterized in that use diamond piece pair
The open circuit copper facing hole drills, and the aperture in the open circuit copper facing hole expands and formed under the action of drilling and returns brill copper facing
Hole further comprises the steps of: during the open circuit on the hole wall in the open circuit copper facing hole is in borehole enlargement in the step of being removed
The open circuit copper facing hole is drilled completely.
6. the reparation detection method according to claim 1 for semiconductor test board, which is characterized in that return brill to described
Copper facing hole carries out the filling of conductive material and is formed to repair copper facing hole, until the aperture for repairing copper facing hole and the open circuit are plated
In the consistent step in the aperture in copper hole, conductive material used by further comprising the steps of: is electroconductive resin or ink.
7. the reparation detection method according to claim 1 for semiconductor test board, which is characterized in that return brill to described
Copper facing hole carries out the filling of conductive material and is formed to repair copper facing hole, until the aperture for repairing copper facing hole and the open circuit are plated
In the consistent step in the aperture in copper hole, further comprise the steps of: to the filling for returning and boring copper facing hole and carrying out conductive material, until described
It is solid to return brill copper facing hole, using diamond piece identical with the open circuit copper facing hole aperture, the progress of copper facing hole is bored again to described return
It is secondary to return brill, until forming reparation copper facing hole identical with the open circuit copper facing hole aperture.
8. the reparation detection method according to claim 6 for semiconductor test board, which is characterized in that the diamond piece is straight
Diameter and the radius-thickness ratio of the hole depth for repairing copper facing hole are less than 30:1.
9. the reparation detection method according to claim 1 for semiconductor test board, which is characterized in that the reparation
Copper facing hole carried out in the step of heavy copper, plate plating, further comprised the steps of: when the open circuit copper facing hole is resin hole, to institute
It states and repairs after copper facing hole carries out heavy copper, it is also necessary to progress resin filling inside the reparations copper facing hole.
10. according to claim 1 to the reparation detection method for being used for semiconductor test board described in 9 any one, feature exists
In, further include repair inspection process, when the reparations copper facing hole is carried out sink copper, plate plating the step of after the completion of, to described
Circuit board carries out the reparation inspection process.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811609402.6A CN109618500A (en) | 2018-12-27 | 2018-12-27 | Reparation detection method for semiconductor test board |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110248486A (en) * | 2019-04-29 | 2019-09-17 | 惠州中京电子科技有限公司 | A kind of reworking method that etching semi-finished product plate hole is broken |
| CN114245614A (en) * | 2021-12-17 | 2022-03-25 | 苏州浪潮智能科技有限公司 | Through hole electrical performance optimization design method and device, PCB and equipment |
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| US5257452A (en) * | 1991-05-27 | 1993-11-02 | Hitachi, Ltd. | Methods of recovering a multi-layer printed circuit board |
| CN102917540A (en) * | 2012-10-17 | 2013-02-06 | 无锡江南计算技术研究所 | Selective hole copper removing method for printed circuit board |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5257452A (en) * | 1991-05-27 | 1993-11-02 | Hitachi, Ltd. | Methods of recovering a multi-layer printed circuit board |
| CN102917540A (en) * | 2012-10-17 | 2013-02-06 | 无锡江南计算技术研究所 | Selective hole copper removing method for printed circuit board |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110248486A (en) * | 2019-04-29 | 2019-09-17 | 惠州中京电子科技有限公司 | A kind of reworking method that etching semi-finished product plate hole is broken |
| CN114245614A (en) * | 2021-12-17 | 2022-03-25 | 苏州浪潮智能科技有限公司 | Through hole electrical performance optimization design method and device, PCB and equipment |
| CN114245614B (en) * | 2021-12-17 | 2023-08-18 | 苏州浪潮智能科技有限公司 | Through hole electrical performance optimization design method and device, PCB and equipment |
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Application publication date: 20190412 |