CN1377218A

CN1377218A - Method for making short-circuit test tool of PCB and its short-circuit test method

Info

Publication number: CN1377218A
Application number: CN 01110111
Authority: CN
Inventors: 黄国铉
Original assignee: Individual
Current assignee: Individual
Priority date: 2001-03-23
Filing date: 2001-03-23
Publication date: 2002-10-30

Abstract

The invention relates to a method for making a short circuit test tool of a print circuit board (PCB) and a method for testing the circuit. Based on the drill hole sizes and positions on the inner layer plate to be tested, relevant bulgy contact points of copper foil are made on the substrate of PCB with copper foil covered. The test tool and the inner layer plate to be tested are put on the testing machine and positioned. With installed on the test tool, several probes come into contact with the copper foil on the inner plate to be tested. When the press machine of the testing machine presses down, the insulated annulus around the drill hole on the plate to be tested are contacted to the copper foil contact points on the testing tool. Whether the drill hole sizes and positions on the inner layer plate are correct or not as well as whether there are residual copper dregs or not can be determined

Description

The short-circuit test tool making method and the short circuit test method of printed circuit board (PCB)

The present invention relates to a kind of short-circuit test tool making method and short circuit test method of printed circuit board (PCB), refer to the whether method of residual copper ashes of whether correct and this bore position insulation ring portion in a kind of bore position of detecting the inner layer of printed-circuit board plate and aperture especially.

General printed circuit board (PCB) is to contain the required circuit of making on the inner plating of Copper Foil, this inner plating must be etched into number insulation ring portion according to the line design position earlier, carry out bore operation again, yet after the etching operation, may residual copper ashes on this insulation ring portion and cause circuit to insulate.In past people all is whether to detect on this dead ring residual copper ashes with the probe that connects test machine, but general probe tip is very tiny, and it can't detect the copper ashes on the insulation ring portion probably when detecting.Therefore most circuit board testing dealer can whether residual copper ashes not be detected at the insulation ring portion on the circuit board, though the chance of the insulation ring portion remaining copper slag of circuit board is minimum, yet when on a rare occasion taking place, still can cause waste following process time and misuse.In addition, also lack the method for detecting at present for aperture of holing on the circuit board and position.

Main purpose of the present invention is to provide a kind of short circuit test method of printed circuit board (PCB), it checked in advance whether whether boring aperture and bore position correctly and with other circuit pressing produce short circuit afterwards before printed circuit board (PCB) is carried out the production process of pressing and boring.

Another object of the present invention is to provide a kind of printed circuit board (PCB) short-circuit test tool making method, this manufacture method realizes being easier to, and this testing tool is simple in structure, with low cost.

The short-circuit test tool making method of a kind of printed circuit board (PCB) of the present invention is characterized in that comprising the steps:

A, cover a dielectric film containing on the printed circuit base material of Copper Foil;

B, remove with inner plating to be measured on dielectric film on the corresponding Copper Foil in position of bore position insulation ring portion, make and the corresponding contact point of this bore position insulation ring portion, promptly this contact point is plated on the Copper Foil of this counterpart and makes contact point be higher than dielectric film and form the Copper Foil contact point of projection in the mode of electro copper foil.

Described Copper Foil is thin Copper Foil.

When described Copper Foil is thicker Copper Foil, before described step a, more comprise:

A1, cover an anti-etching-film containing on the substrate for printed circuit board of thicker Copper Foil;

A2, remove with inner plating to be measured on anti-etching-film on the Copper Foil zone outside the corresponding contact point in position of bore position insulation ring portion, etch away this Copper Foil zone gradually with chemical agent again, make the Copper Foil in this Copper Foil zone reach minimum thickness, and still link to each other with each contact point Copper Foil;

And in described step a, described dielectric film is to cover the etched Copper Foil zone in addition that has point of contact;

Simultaneously described step b is replaced with following steps: remove the anti-etching-film on the contact point and expose Copper Foil, make the projecting dielectric film of the Copper Foil of this contact point to form the Copper Foil contact point of projection.

A kind of short circuit test method that utilizes the printed circuit board (PCB) of described testing tool is characterized in that its testing procedure is as follows:

A, inner plating to be measured is placed on the testing tool, again testing tool and circuit board under test are placed on the base of test machine, and locate with location hole;

B, on testing tool, install test probe, this test probe is contacted with Copper Foil on the inner plating to be measured, and the other end of test probe is connected to the test machine computer processor, installs a power supply signal line again and be connected to the test machine computer processor on the Copper Foil of testing tool;

The press of c, test machine presses down, and the bore position insulation ring portion of inner plating to be measured is contacted with the Copper Foil contact point of testing tool projection, and test probe contacts with Copper Foil on the inner plating to be measured.

D, judge residual copper ashes on boring aperture too big or positional fault or the bore position insulation ring portion according to whether producing the loop between the Copper Foil of test probe and testing tool.

Installing one or several test probes on described testing tool.

Effect of the present invention is: according to the boring aperture and the position of inner plating to be measured, constitute testing tool containing the corresponding protruding Copper Foil contact point of making on the board substrate of Copper Foil, make the bore position insulation ring portion of inner plating to be measured contact with the Copper Foil contact point of this instrument with the bore position of detecting inner plating and aperture whether correctly and this treat the bore position whether residual copper ashes of ring portion that insulate, if the Copper Foil of test probe and testing tool produces the loop, too big or positional fault of expression boring aperture or the bore position residual copper ashes on the ring portion that insulate; The making of this testing tool is easy, simple in structure and with low cost simultaneously.

Below be simple declaration to accompanying drawing of the present invention:

Figure 1A, 1B are the plane graph and the cutaway view of circuit board under test of the present invention;

Fig. 2 A, 2B are one embodiment of the invention testing tool plane graph and cutaway view;

Fig. 3 A, 3B are the plane graph and the cutaway view of another embodiment of the present invention testing tool;

Fig. 4 is the floor map that testing tool of the present invention and circuit board under test are positioned to test on the test machine.

The present invention is described in detail below in conjunction with accompanying drawing.

Seeing also Figure 1A to Fig. 4, is the short-circuit test tool making method and the short circuit test method of a kind of printed circuit board (PCB) of the present invention.Wherein this testing tool 1 has two kinds of manufacture methods:

For containing instrument than thin copper foil 12 for substrate for printed circuit board 11, can cover a dielectric film 14 on its Copper Foil 12 to prevent Copper Foil 31 on the inner plating 3 to be measured and directly contact and to conduct electricity with testing tool 1, and then remove with inner plating 3 to be measured on dielectric film on the corresponding Copper Foil 12 in position of bore position insulation ring portion 32, make and these bore position insulation ring portion 32 corresponding contact points, promptly the mode with electro copper foil is plated on Copper Foil 12 with this contact point and makes this contact point be higher than periphery dielectric film 14 and the Copper Foil contact point 13 of formation projection, as Fig. 2 A, shown in the 2B;

For the instrument that contains thicker Copper Foil 12 for substrate for printed circuit board 11, can on its Copper Foil 12, cover the anti-etching-film 16 of one deck, remove then with inner plating 3 to be measured on anti-etching-film on the Copper Foil zone outside the corresponding contact point in position of bore position insulation ring portion 32, etch away the Copper Foil zone in addition that had point of contact gradually with chemical agent again, make the thickness in this Copper Foil zone reach minimum thickness, but the Copper Foil 12 of each contact point still is connected to prevent that contact point from becoming the independent point that does not link to each other with system with contact point Copper Foil zone in addition, cover one deck dielectric film 14 again this moment on this etched Copper Foil zone, and remove anti-etching-film 16 on the contact point make the Copper Foil 12 of contact point around exposing dielectric film 14 and form the Copper Foil contact point 13 of projection, as Fig. 3 A, shown in the 3B.

After making above-mentioned testing tool, inner plating 3 to be measured is placed testing tool 1 top, again testing tool 1 and inner plating 3 to be measured are placed on the base 41 of test machine 4, with its location hole 15,33 location.Contact with conductive Copper Foil 31 on the inner plating to be measured at several test probes 2 of installing on the testing tool at last, test probe 2 other ends then are connected to a test machine computer processor 5.In addition, the Copper Foil 12 of testing tool 1 is to be connected to test machine computer processor 5 by a power supply signal line.When the press 42 of test machine 4 pressed down, the bore position insulation ring portion 32 on the inner plating 3 to be measured contacted with the Copper Foil contact point 13 of testing tool 1 projection, and test probe 2 contacts with the Copper Foil 31 of inner plating to be measured, as shown in Figure 4.This moment is if the Copper Foil 12 of test probe 2 and testing tool 1 produces loops, promptly represents residual copper ashes on boring aperture too big or positional fault or the bore position insulation ring portion 32 and produces the situation in loop.

Claims

1, a kind of short-circuit test tool making method of printed circuit board (PCB) is characterized in that comprising the steps:

2, the short-circuit test tool making method of printed circuit board (PCB) as claimed in claim 1 is characterized in that described Copper Foil is thin Copper Foil.

3, the short-circuit test tool making method of printed circuit board (PCB) as claimed in claim 1 when it is characterized in that described Copper Foil for thicker Copper Foil, more comprised before described step a:

4, a kind of short circuit test method that utilizes the printed circuit board (PCB) of claim 2 or 3 described testing tools is characterized in that its testing procedure is as follows:

5, the short circuit test method of the printed circuit board (PCB) of testing tool as claimed in claim 4 is characterized in that installing one or several test probes on described testing tool.