CN105403823A - Method and program for testing mainboard of B ultrasound machine - Google Patents
Method and program for testing mainboard of B ultrasound machine Download PDFInfo
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- CN105403823A CN105403823A CN201410458854.4A CN201410458854A CN105403823A CN 105403823 A CN105403823 A CN 105403823A CN 201410458854 A CN201410458854 A CN 201410458854A CN 105403823 A CN105403823 A CN 105403823A
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Abstract
The invention discloses a method and program for testing a mainboard of a B ultrasound machine. A testing program for the mainboard of the B ultrasound machine is set on a platform of an on-line tester. The method comprises the steps: preset short circuit testing, open circuit testing, element testing, IC missing solder testing, power-on testing, digital testing, and analog-digital mixed testing. The method completely testes the performance of a single element on the mainboard and functions of the whole mainboard, improves the testing coverage rate, and enables the testing coverage rate to be improved from 60% to 89%. The method is complete in testing and is high in efficiency.
Description
Technical field
The present invention relates to field of printed circuit board fabrication, be specifically related to method and program thereof that a kind of test b surpasses mainboard.
Background technology
Printed circuit board (PCB), is generally referred to as pcb board (English is PrintedCircuitBoard), is widely used at electronic enterprises.Along with electronic product is towards miniaturization, digitizing future development, printed circuit board (PCB), also towards high density, high precision future development, is also therefore a difficult problem to the detection of printed circuit board (PCB).
A kind of checkout facility conventional in BChao Jishi hospital, it has a motherboard (hereinafter referred to as mainboard) being similar to computer main board, control, computing, storage and other electronic element can be loaded, have a lot of integrated circuit, and the needs had burning program in integrated circuits.
Mainboard can produce various problem in the manufacturing, as the problem of components and parts itself, as component value overproof, lost efficacy or damage, the program error etc. of storage class, mounting process problem, as scolding tin short circuit, element wrong plug, anti-inserted, neglected loading, pin tilting, rosin joint, solder joint connect weldering, PCB short circuit, broken string etc., also have the problem of burning program mistake, the function problem etc. of whole mainboard.
And at present for the test of this mainboard, be generally adopt simulation test, test and comparison is simple, and the coverage rate of test is not high, cannot carry out upper electrical testing yet, and testing efficiency is also lower.Therefore, after usually problematic mainboard being flow to, complete machine (B ultrasonic machine) assembling and setting is caused to go wrong.
Therefore, design a kind of method that novel test b surpasses mainboard, making test comprehensive, efficiently, is this area technical issues that need to address.
Summary of the invention
The technical problem to be solved in the present invention: design a kind of method that novel test b surpasses mainboard, makes test comprehensive, efficiently.
For solving the problems of the technologies described above, technical scheme of the present invention is as follows:
Test b surpasses a method for mainboard, and the method is on a kind of platform of In-circiut tester, and the test procedure worked out for described B ultrasonic mainboard realizes, and described method of testing comprises the steps:
A. pre-short-circuit test;
B. open-short circuit;
C. element test;
D.IC missing solder is tested;
E. electrical testing is gone up;
F. digital test;
G. modulus hybrid test;
The resistance of the pre-short-circuit test of described steps A to be Impedance measurement the be element of 0 ohm;
The open-short circuit of described step B is the resistance testing whole B ultrasonic mainboard;
The IC missing solder test of described step D is the quality of welding spot of the IC in the described B ultrasonic mainboard of test;
The digital test of described step F is the performance of testing described IC;
In the test process of each step, if noted abnormalities, then can send warning, show defective, and stop performing test procedure, otherwise continue next step, until tested.
Preferably, after described step G, be also provided with burning step, described burning step is in described IC by burning program prepared in advance.
Preferably, after described burning step, be also provided with burning detecting step, described burning detecting step is the function of the described IC after detecting burning program.
Preferably, the element test of described step C is test the performance of discrete component, and described element comprises resistance, electric capacity, inductance, potentiometer, transformer, triode and diode.
Preferably, need before described steps A to load onto the measurement jig mating described B ultrasonic mainboard, and clamp described B ultrasonic mainboard with measurement jig, described measurement jig is the special fixture made according to described B ultrasonic mainboard, is provided with the conductive contact that multiple and described B ultrasonic mainboard is suitable above it.
Preferably, described measurement jig uses a kind of method of vacuum suction to clamp described B ultrasonic mainboard, ensures that described conductive contact contacts well with described B ultrasonic mainboard.
Preferably, after described measurement jig clamps described B ultrasonic mainboard, after need carrying out contact test, then enter steps A, described contact test is the formedness that the conductive contact of the described measurement jig of test contacts with described B ultrasonic mainboard.
A kind of test b surpasses the program of mainboard, comprise master routine and database, described master routine defines manner of execution and the order of all testing procedures according to claim 1, and described database comprises out short circuit document data base, analog element storehouse, digital element storehouse, IC missing solder test database, hybrid test storehouse and cabling data bank.
Preferably, the standard that short circuit document data base defines the open-short circuit in described B ultrasonic mainboard is opened described in; Described analog element storehouse defines the performance parameter of all analog elements in described B ultrasonic mainboard; Described digital element storehouse defines the performance parameter of all digital elements in described B ultrasonic mainboard; Described IC missing solder test database defines all testing standards needing the element carrying out missing solder test in described B ultrasonic mainboard; Described hybrid test storehouse defines all test parameter and the standards needing the element carrying out modulus or digital-to-analogue test in described B ultrasonic mainboard; Described cabling data bank defines the cabling data of described B ultrasonic mainboard, is convenient to after warning, determine abnormal region or element.
Preferably, described program also comprises measurement jig file, and described measurement jig file defines the data needing the measurement jig coordinated with test procedure made.
Pass through technique scheme, a kind of test b provided by the invention surpasses the method for mainboard, by on a kind of platform of In-circiut tester, work out and to realize for the test procedure of described B ultrasonic mainboard, comprise the step such as pre-short-circuit test, open-short circuit, element test, the test of IC missing solder, upper electrical testing, digital test, modulus hybrid test, fully tested the performance of discrete component in B ultrasonic mainboard and the function of whole mainboard, improve test coverage rate, make test coverage rate be promoted to 89% from by original 60%.Its beneficial effect is: test is comprehensive, efficiently.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 surpasses the schematic flow sheet of the step of the method for mainboard for a kind of test b disclosed in the embodiment of the present invention;
Fig. 2 surpasses the structural representation of the program of mainboard for a kind of test b disclosed in the embodiment of the present invention.
Numeral and the corresponding component title represented by letter in figure:
101. steps A 102. step B103. step C104. step D105. step e 106. step F 107. step G2. master routines 31. open 34.IC missing solder test database 35. hybrid test storehouse 36., digital element storehouse, short circuit document data base 32. analog element storehouse 33. cabling data bank.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only a part of embodiment of the present invention, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
Principle of the present invention is: be on a kind of platform of In-circiut tester, work out and to realize for the test procedure of described B ultrasonic mainboard, comprise the step such as pre-short-circuit test, open-short circuit, element test, the test of IC missing solder, upper electrical testing, digital test, modulus hybrid test, fully tested the performance of discrete component in B ultrasonic mainboard and the function of whole mainboard, improve test coverage rate, make test coverage rate be promoted to 89% from by original 60%.
Embodiment:
As shown in Figure 1, a kind of test b surpasses the method for mainboard, and the method is on a kind of platform of In-circiut tester, and the test procedure worked out for B ultrasonic mainboard (hereinafter referred to as mainboard) realizes, and method of testing comprises the steps:
A. pre-short-circuit test 101;
B. open-short circuit 102;
C. element test 103;
D.IC missing solder test 104;
E. electrical testing 105 is gone up;
F. digital test 106;
G. modulus hybrid test 107;
The pre-short-circuit test 101 of steps A is the resistance of the element of 0 ohm for Impedance measurement, mainly tests the element that the impedance such as wire jumper, fuse is zero, if non-vanishing, is then abnormal.
The open-short circuit 102 of step B is the resistance testing whole mainboard, as resistance value exceeds normal range, then can send warning, and reason may be that short circuit or open circuit have appearred in part.
The element test 103 of step C is the performance of test discrete component, as the electric capacity of electric capacity, and the one-way conduction etc. of diode.
The IC missing solder test 104 of step D is the quality of welding spot of the IC of testing host, as whether having rosin joint etc.
The upper electrical testing 105 of step e, for after energising, tests the current potential of each point.
The digital test 106 of step F is the function of test I C, and can comprise in IC and the logic element such as door, not gate, these are all checked by digital test.
The modulus hybrid test 107 of step G is test modulus hydrid component wherein, as simulating signal is inputted modulus hydrid component, and meeting output digit signals, otherwise, can outputting analog signal.
In the test process of each step, if test result is not in the scope of setting, warning can be sent, show defective (being generally that custom english abbreviation NG represents), and stop perform test procedure, and due to test tool and test procedure be all design according to the concrete condition of mainboard, so after reporting to the police, can also provide problematic is which region or which part of mainboard, otherwise continues next step, until tested.If mainboard is in the pre-short-circuit test 101 of steps A, if NG, then not continuing the necessity of testing, because can confirm that mainboard is defective products, is next exactly the problem (as repaired or scrapping) how to process.
In the present embodiment, after step G, be also provided with burning step, burning step is in IC by burning program prepared in advance.This is the mainboard (some does not need burning) meeting the needs of burning program, burning program is also generally be placed on finally, because the time of burning program is long, so guarantee that test OK's just carries out burning, and, as good with regard to burning before testing, the detection before may disturbing.In addition, after burning well, also having the step that a step burning detects, detect the function of the IC after burning program, by detecting the function of IC, confirming the quality of burning.If burning mistake, generally can also burning again.
In the present embodiment, the element test 103 of step C is test the performance of discrete component, and element comprises resistance, electric capacity, inductance, potentiometer, transformer, triode and diode.This is the element that mainboard often has, and what other was of little use also according to the type of concrete mainboard, can increase testing standard in the database of program.
In the present embodiment, need the measurement jig loading onto coupling mainboard before steps A 101, and clamp mainboard with measurement jig, measurement jig is the special fixture made according to mainboard, is provided with multiple conductive contact suitable with mainboard above it.This makes to test more convenient, quick, if do not have special measurement jig, be also fine, but test can be extremely busy, and easily makes mistakes.
In the present embodiment, measurement jig uses a kind of method clamping mainboard of vacuum suction, ensures that conductive contact contacts well with mainboard.This method is implemented simple, effective, and is not easy to damage mainboard
In the present embodiment, after measurement jig clamping mainboard, after need carrying out contact test, then enter steps A, contact test is the formedness that the conductive contact of test measurement jig contacts with mainboard.Only have contact good, the test after just completing, this is the step increased after adopting special measurement jig.
As shown in Figure 2, a kind of test b surpasses the program of mainboard, comprise master routine 2 and database, master routine defines manner of execution and the order of all testing procedures according to claim 1, and database comprises out short circuit document data base 31, analog element storehouse 32, digital element storehouse 33, IC missing solder test database 34, hybrid test storehouse 35 and cabling data bank 36.
In order to clearly understand the situation of database, the data of database is listed below:
Open short circuit document data base 31: the standard defining the open-short circuit on mainboard;
Analog element storehouse 32: the performance parameter of all analog elements on mainboard;
Digital element storehouse 33: the performance parameter of all digital elements on mainboard;
IC missing solder test database 34: all testing standards needing the element carrying out missing solder test on mainboard;
Hybrid test storehouse 35: all test parameter and the standards needing the element carrying out modulus or digital-to-analogue test on mainboard;
Cabling data bank 36: the cabling data of mainboard, is convenient to after warning, determine abnormal region or element.
In addition, conveniently make measurement jig, program also comprises measurement jig file, and measurement jig file defines the data needing the measurement jig coordinated with test procedure made.
When mainboard puts into special measurement jig, master routine starts to perform, and the testing procedure that equipment is write according to this test procedure is automatically tested item by item, and calls associated databases, and whether exact p-value result meets standard, and whether final confirmation mainboard is non-defective unit.
In the above-described embodiments, a kind of test b provided by the invention surpasses the method for mainboard, by on a kind of platform of In-circiut tester, work out and to realize for the test procedure of described B ultrasonic mainboard, comprise the step such as pre-short-circuit test, open-short circuit, element test, the test of IC missing solder, upper electrical testing, digital test, modulus hybrid test, fully tested the performance of discrete component in B ultrasonic mainboard and the function of whole mainboard, improve test coverage rate, make test coverage rate be promoted to 89% from by original 60%.Its beneficial effect is: test is comprehensive, efficiently.
Above-described is only the preferred embodiment of the present invention, it should be pointed out that for the person of ordinary skill of the art, and without departing from the concept of the premise of the invention, can also make some distortion and improvement, these all belong to protection scope of the present invention.
Claims (10)
1. test b surpasses a method for mainboard, it is characterized in that, the method is on a kind of platform of In-circiut tester, and the test procedure worked out for described B ultrasonic mainboard realizes, and described method of testing comprises the steps:
A. pre-short-circuit test;
B. open-short circuit;
C. element test;
D.IC missing solder is tested;
E. electrical testing is gone up;
F. digital test;
G. modulus hybrid test;
The resistance of the pre-short-circuit test of described steps A to be Impedance measurement the be element of 0 ohm;
The open-short circuit of described step B is the resistance testing whole B ultrasonic mainboard;
The IC missing solder test of described step D is the quality of welding spot of the IC in the described B ultrasonic mainboard of test;
The digital test of described step F is the performance of testing described IC;
In the test process of each step, if noted abnormalities, then can send warning, show defective, and stop performing test procedure, otherwise continue next step, until tested.
2. a kind of test b according to claim 1 surpasses the method for mainboard, it is characterized in that, after described step G, be also provided with burning step, and described burning step is in described IC by burning program prepared in advance.
3. a kind of test b according to claim 2 surpasses the method for mainboard, it is characterized in that, after described burning step, is also provided with burning detecting step, and described burning detecting step is the function of the described IC after detecting burning program.
4. a kind of test b according to claim 1 surpasses the method for mainboard, it is characterized in that, the element test of described step C is test the performance of discrete component, and described element comprises resistance, electric capacity, inductance, potentiometer, transformer, triode and diode.
5. a kind of test b according to claim 1 surpasses the method for mainboard, it is characterized in that, need before described steps A to load onto the measurement jig mating described B ultrasonic mainboard, and clamp described B ultrasonic mainboard with measurement jig, described measurement jig is the special fixture made according to described B ultrasonic mainboard, is provided with the conductive contact that multiple and described B ultrasonic mainboard is suitable above it.
6. a kind of test b according to claim 5 surpasses the method for mainboard, it is characterized in that, described measurement jig uses a kind of method of vacuum suction to clamp described B ultrasonic mainboard, ensures that described conductive contact contacts well with described B ultrasonic mainboard.
7. a kind of test b according to claim 6 surpasses the method for mainboard, it is characterized in that, after described measurement jig clamps described B ultrasonic mainboard, after need contact test being carried out, enter steps A again, described contact test is the formedness that the conductive contact of the described measurement jig of test contacts with described B ultrasonic mainboard.
8. a test b surpasses the program of mainboard, it is characterized in that, comprise master routine and database, described master routine defines manner of execution and the order of all testing procedures according to claim 1, and described database comprises out short circuit document data base, analog element storehouse, digital element storehouse, IC missing solder test database, hybrid test storehouse and cabling data bank.
9. a kind of test b according to claim 8 surpasses the program of mainboard, it is characterized in that, described in open the standard that short circuit document data base defines the open-short circuit in described B ultrasonic mainboard; Described analog element storehouse defines the performance parameter of all analog elements in described B ultrasonic mainboard; Described digital element storehouse defines the performance parameter of all digital elements in described B ultrasonic mainboard; Described IC missing solder test database defines all testing standards needing the element carrying out missing solder test in described B ultrasonic mainboard; Described hybrid test storehouse defines all test parameter and the standards needing the element carrying out modulus or digital-to-analogue test in described B ultrasonic mainboard; Described cabling data bank defines the cabling data of described B ultrasonic mainboard, is convenient to after warning, determine abnormal region or element.
10. a kind of test b according to claim 9 surpasses the program of mainboard, it is characterized in that, described program also comprises measurement jig file, and described measurement jig file defines the data needing the measurement jig coordinated with test procedure made.
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| CN201410458854.4A CN105403823A (en) | 2014-09-11 | 2014-09-11 | Method and program for testing mainboard of B ultrasound machine |
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| CN201410458854.4A CN105403823A (en) | 2014-09-11 | 2014-09-11 | Method and program for testing mainboard of B ultrasound machine |
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| CN86102660A (en) * | 1985-04-19 | 1986-10-15 | 川崎电子株式会社 | Printed circuit board functional test system and the method for using said system |
| CN1377218A (en) * | 2001-03-23 | 2002-10-30 | 黄国铉 | Method for making short-circuit test tool of PCB and its short-circuit test method |
| TW200710746A (en) * | 2005-09-02 | 2007-03-16 | Inventec Corp | Test script generation system and method for production line |
| CN1967275A (en) * | 2005-11-18 | 2007-05-23 | 鸿富锦精密工业（深圳）有限公司 | PCB Online testing and maintain system and method thereof |
| TW201027092A (en) * | 2009-01-07 | 2010-07-16 | Inventec Appliances Corp | Testing apparatus and testing method |
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2014
- 2014-09-11 CN CN201410458854.4A patent/CN105403823A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN86102660A (en) * | 1985-04-19 | 1986-10-15 | 川崎电子株式会社 | Printed circuit board functional test system and the method for using said system |
| CN1377218A (en) * | 2001-03-23 | 2002-10-30 | 黄国铉 | Method for making short-circuit test tool of PCB and its short-circuit test method |
| TW200710746A (en) * | 2005-09-02 | 2007-03-16 | Inventec Corp | Test script generation system and method for production line |
| CN1967275A (en) * | 2005-11-18 | 2007-05-23 | 鸿富锦精密工业（深圳）有限公司 | PCB Online testing and maintain system and method thereof |
| TW201027092A (en) * | 2009-01-07 | 2010-07-16 | Inventec Appliances Corp | Testing apparatus and testing method |
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Application publication date: 20160316 |