KR102084148B1 - Apparatus for reparing electrode line and method for repairing electrode line using the same - Google Patents

Abstract

According to an embodiment of the present invention, an electrode line repair method comprises the steps of: photographing a substrate to obtain an electrode line image; analyzing the image to determine whether a short circuit defect or a disconnection defect is present; repairing the short circuit through a short circuit repair unit including a laser oscillator when the short circuit defect is present; repairing the disconnection through a disconnection repair unit printing in an electrohydrodynamic (EHD) manner when the disconnection defect is present. The repairing of the disconnection includes the steps of: discharging ink between the disconnected electrode lines through the disconnection repair unit to connect the disconnected electrode lines to form a connection pattern; thermally treating the connection pattern; determining whether the width of the connection pattern satisfies a set value according to the width of the electrode lines; and trimming the edge of the connection pattern by trimming when the set value is not satisfied. Therefore, the electrode line repair method can easily repair the disconnection and short circuit defects.

Description

Electrode line repair device and repair method using the same {APPARATUS FOR REPARING ELECTRODE LINE AND METHOD FOR REPAIRING ELECTRODE LINE USING THE SAME}

The present invention relates to an electrode line repair apparatus and a repair method using the same.

Recently, as the spread of various mobile devices including smartphones and tablet PCs has been rapidly growing, and the market share of high-performance and high-pixel TVs has increased, LCDs or self-illuminating LCDs that use liquid crystals to display video on mobile devices and TVs OLEDs are widely used.

Almost all electronic products, including mobile devices and TVs, contain semiconductor devices such as ICs, and PCBs are becoming thinner and more integrated in line with miniaturization and slimming. In particular, in the case of an LCD or OLED employed for displaying an image of a mobile device or a TV, a driving device including a TFT for adjusting each pixel to realize a color image, and a substrate on which electrode lines connecting them are complicated Doing.

A common phenomenon in semiconductors, flat panel displays, PCBs, and the like, not only is the size of circuit elements formed on each substrate becoming smaller, but also the width of electrode lines connecting the respective elements becomes very narrow.

Therefore, a large number of disconnection defects and short circuit defects are generated and repaired when forming the electrode lines.

In the case of short circuit failure, when the repair is performed using a laser, the substrate is exposed to high heat due to the laser, thereby causing deformation and shortening the life of the OLED display.

In the case of disconnection failure, the line width is very narrow, and it is not easy to form the metal pattern only in the disconnection region.

Accordingly, the present invention is to provide an electrode line repair apparatus and a repair method using the same that can easily repair the disconnection failure and short circuit failure.

In addition, the present invention provides a method that can be repaired so that the width of the electrode line does not increase when printing the electrode line.

Electrode line repair method according to an embodiment of the present invention includes the steps of acquiring the electrode line image by photographing the substrate, determining whether the short circuit failure or disconnection failure by analyzing the image, if the short circuit failure, including a laser oscillator Repairing the short circuit through the short circuit repair unit, and in the case of a disconnection failure, repairing the disconnection through a disconnection repair unit printed by an electrohydrodynamic (EHD) method, and repairing the disconnection includes the disconnection. Discharging ink between the disconnected electrode lines through a repair unit to connect the disconnected electrode lines to form a connection pattern, heat treating the connection pattern, and a width of the connection pattern is set according to the width of the electrode line. Determining whether or not to satisfy, if the set value is not satisfied, tree edge of the connection pattern Removing by ming.

In the repairing of the short circuit, the laser oscillator generates a first laser beam, and the laser oscillator may separate by cutting the shorted electrode line.

In the heat treatment step, the heat treatment may irradiate the second laser beam generated by the laser oscillator.

In the step of removing by trimming, trimming may be performed by irradiating a third laser beam generated by the laser oscillator.

In the trimming, the third laser beam generated by the laser oscillator may be irradiated to both edges of the electrode line.

The first laser beam may be a microwave pulse laser beam, the second laser beam may be a nanosecond or less pulse laser beam, and the third laser beam may be a microwave pulse.

The first laser beam may have a pulse width of 500 femtoseconds or less.

According to another exemplary embodiment of the present invention, an electrode line repair apparatus includes a stage unit on which a substrate is placed, a damage detection unit detecting damage of an electrode line formed on the substrate, a disconnection repair unit and a short circuit repair unit that are movable in multiple axes when supported by the stage unit. And a printing unit of the disconnection repair unit discharges ink in an EHD manner to connect the electrode lines, and the short circuit repair unit generates a laser beam to separate the electrode lines.

The laser beam may be a microwave pulse laser beam.

The disconnection repair unit may further include a heat treatment unit for heat treatment after the ink is ejected.

The heat treatment may proceed with a laser beam.

The disconnection repair unit may further include a line width processing unit for trimming an edge of the electrode line after connecting the electrode line.

The trimming may proceed with a laser beam.

The damage detector may include a camera photographing a substrate, a data input unit for inputting an image photographed by the camera, an analysis unit for storing and analyzing the image input through the data input unit, and the disconnection repair unit according to damage information analyzed through the analysis unit. And a controller for controlling the short circuit repair unit.

The short circuit repair unit may include a reflective member, a tube lens, and an objective lens that are sequentially disposed on an optical path through which the laser beam passes.

According to one embodiment of the present invention, by integrating a short circuit failure and a disconnection failure into one device, it is possible to easily proceed to repair selectively depending on the failure.

In addition, according to an embodiment of the present invention, by reducing the line width of the printed electrode using a laser, it is possible to print a precise and fine electrode.

In addition, according to an embodiment of the present invention, by heating the print electrode with a laser, it is possible to increase the electrical characteristics of the print electrode.

1 is a schematic configuration diagram of an electrode line repair apparatus according to an embodiment of the present invention.
2 and 3 are views for explaining a line width repair method in the electrode repair apparatus of FIG.
4 is a flowchart illustrating a method for repairing an electrode line according to an exemplary embodiment of the present invention.
5 is a view for explaining a method for repairing a short circuit failure.
6 is a view for explaining a method for repairing disconnection failure.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention.

In order to clearly describe the present invention, parts irrelevant to the description are omitted, and like reference numerals designate like elements throughout the specification.

In addition, throughout the specification, when a part is said to "include" a certain component, it means that it can further include other components, except to exclude other components unless specifically stated otherwise.

1 is a schematic configuration diagram of an electrode line repair apparatus according to an embodiment of the present invention.

As shown in FIG. 1, the electrode line repair apparatus 1000 according to an exemplary embodiment may include a stage unit 100, a damage detection unit 200, a short circuit repair unit 300, and a disconnection repair unit 400. Include.

The stage unit 100 is a place where the substrate 10 to be repaired is placed, and supports the short circuit repair unit 300 and the disconnection repair unit 400. The short circuit repair unit 300 and the disconnection repair unit 400 may be installed in the stage unit 100 to be movable in a plurality of axial directions including the x, y, and z axes.

Here, the substrate 10 is a generic term for a substrate on which an electric circuit is formed, and the electrode line 20 is not only an electrode formed on the substrate 10 but also various patterns constituting wiring and an electric circuit. All of these are collectively.

The damage detector 200 includes a photographing unit 202, a data input unit 204, an analyzer 206, and a controller 208.

The photographing unit 202 is a camera 22 for photographing the substrate 10 to generate an image, and an image tube for forming an image transmitted from an objective lens having different focal positions onto the substrate 10 at a predetermined position. And a beam splitter 24 positioned on the path through which the relay lens 23 and the laser beam pass to reflect or transmit light. In this case, a reflective member 26 may be positioned between the camera 22 and the relay image tube lens 23 to transmit an image to the camera 22, and the reflective member 26 may be installed according to the position of the camera. Can be It may be omitted if the camera is located on the same line as the image tube lens.

The photographing unit 202 may photograph while scanning the substrate 10 in order to detect a damaged part, and may receive an image of a processed part of the substrate 10 by receiving a laser beam reflected from the substrate 10. In this case, the reflected beam may be reflected by the beam splitter 24 and then transmitted to the camera 22 through the relay image tube lens 23.

As such, the photographing unit 202 may not only photograph the pre-repair image, but also determine in real time whether the machining is correctly performed as desired while checking the image of the machining portion in real time.

In order to obtain a clearer image acquisition, an illumination 25 may be provided, which may be transmitted to the substrate 10 through the beam splitter 24.

Meanwhile, the camera 22 acquires an image by photographing the substrate 10 while scanning the entire substrate 2010, and transfers the image to the data input unit 204. At this time, when the damage site is specified through a separate inspection device, the camera 22 may photograph only the image damage site and acquire a high resolution image.

In addition, the photographing unit 202 acquires an image image during the disconnection repair or the short circuit repair to monitor the progress of the disconnection repair and the short circuit repair in real time to an output device such as a display unit (not shown). I can deliver it.

The data input unit 204 receives an image and may be an external device such as a computer connected to the photographing unit 202, the analysis unit 206, and the control unit 208 by wired or wireless communication. Alternatively, the storage device may be a storage device in which the photographed image included in the photographing unit 202 is stored and moved.

The analysis unit 206 stores the image transmitted from the data input unit 204, and analyzes the stored image to extract information on the damaged part, for example, damage location information and information on the damage type such as a short circuit or a disconnection line. .

The method of analyzing an image may be performed by a known technique, and for example, may be performed by using a predetermined image analysis technique, and then the location information and damage form may be derived by comparing with the stored reference data or input data. Can be.

As described above, the repair process may be performed using the disconnection repair unit 400 or the short circuit repair unit 300.

The control unit 208 generates and outputs a driving signal necessary for the repair using the disconnection repair unit 400 or the short circuit repair unit 300 according to the result transmitted from the analysis unit 206.

The driving signal may include damage information on the size, shape, location, etc. of the disconnection or the short circuit together with the on / off signals of the short circuit repair unit 300 and the disconnection repair unit 400. Therefore, the control unit 208 derives the process conditions of the disconnection repair unit 300 and the short circuit repair unit 400 according to the damage information, and transfers them to the short circuit repair unit 300 or the disconnection repair unit 400.

The short circuit repair unit 300 electrically separates the electrode line by separating the electrode line 20 formed on the substrate 10 by using a laser.

The short circuit repair unit 300 includes a laser oscillator 302 for generating a laser beam, a reflective member 303 disposed on an optical path of the laser beam generated from the laser oscillator 302, a tube lens 304, an objective lens ( 305).

At least one reflective member 303 is disposed to reflect the laser beam to change the optical path so that the laser beam can be transmitted on the substrate 10, the tube lens 304 is irradiated to the repair area accurately the laser beam Focusing on the light, the objective lens 305 is appropriately selected depending on the inspection or processing process, and focuses the light on the substrate.

The laser oscillator 302 generates a laser beam having an intensity of a laser beam set according to a setting signal transmitted from the control unit 208 according to the damage information, and irradiates the laser beam according to a moving distance and an irradiation depth of the set laser beam. .

The laser beam may be a laser having a bimil e.g., picosecond pulses (10 ^-12 seconds), femtosecond pulses (10 ^-15 second) or attosecond (10 ^-18 seconds) pulses in ultra-short pulses. For convenience of explanation, hereinafter referred to as a first laser beam L1.

The disconnection repair unit 400 repairs the electrode line formed on the substrate when the electrode line is disconnected, thereby electrically connecting the electrode line.

The disconnection repair unit 400 includes a printing unit 402, an HV control unit 404, and a heat treatment unit 406 for ejecting ink to form electrode lines.

According to one embodiment of the invention, the printing unit 402 is connected to the printing nozzle 41, the printing nozzle 41 for supplying ink onto the substrate 10, the ink for supplying the ink to the printing nozzle 41 The supply part 42 may be provided, and ink may be ejected onto the substrate 10 through an electrohydrodynamic (EHD) method.

As a result, since the electrode line can be formed through an inkjet method rather than a deposition method, a vacuum chamber becomes unnecessary, and formation of a very thin electrode line and processing of the electrode line can be facilitated. For example, an electric field is formed between the printing nozzle 41 composed of inkjet nozzles and the substrate 10, and ions formed in the ink are discharged by the electric field formed between the printing nozzle 41 and the substrate 10. Can be. Such an electro-hydraulic method is well known in the art, and thus, detailed description thereof will be omitted, and may be configured in various forms in addition to the illustrated configuration.

The print nozzle 41 may be formed in a pointed end at which ink is discharged to form a fine electrode line, and may be installed at an angle to the substrate 10 by the photographing unit 202 so as to facilitate photographing. .

The HV control unit 404 is connected to the control unit 208 by wire communication or wireless communication, and sets the voltage, waveform, etc. of the printing unit 402 set according to the setting signal transmitted from the control unit 208 according to the damage information. The ink may be discharged at the size, discharge time, interval, and discharge amount of the ink droplets under the set conditions.

The heat treatment unit 406 heats the printed electrode lines to cure the discharged ink and improve electrical characteristics, and may be performed using a laser beam. Therefore, the laser beam of the heat treatment unit 406 may be a laser beam generated from the short circuit repair unit 300. Hereinafter, for convenience of description, the laser beam irradiated for heat treatment is referred to as a second laser beam.

The second laser beam may be a laser beam having sub-nanosecond pulses, for example, nanosecond pulses, picosecond pulses, femtosecond pulses, or attosecond pulses, and the second laser beam of sub-nanosecond pulses is irradiated onto the electrode lines to thereby heat-treat the electrode lines. can do.

For example, the second laser beam L2 may be a laser beam having a pulse width of several to several hundreds ns (10 ⁻⁹ seconds), and when the second laser beam L2 is irradiated onto the printed electrode line. The high temperature of the laser beam irradiation site may change the properties of the material.

In particular, an electrical characteristic of the electrode line may be improved through a heat treatment process of irradiating a second laser beam L2 of a pulse of nanoseconds or less, for example, a specific resistance of the electrode line may be reduced.

In general, the resistance increases as the line width of the electrode line decreases, and the specific resistance of the electrode line can be reduced by irradiating the electrode line with a second laser beam L2 having a nanosecond pulse or less, and reducing the resistivity of the line. The increase in resistance may be minimized by adjusting the line width by the unit 408.

The disconnection repair unit 400 further includes a line width processing unit 408. The line width processing part 408 is a structure which adjusts the line width of the formed wiring through the disconnection repair part 400. FIG.

There is a limit to the line width of the electrode line formed according to an embodiment of the present invention. For example, when forming an electrode line through an electro-hydraulic inkjet nozzle, forming a line width of less than 3 μm is not easy in the state of the art. However, in one embodiment of the present invention, after printing the electrode line through the line width processing unit 408, the line width of the continuously printed electrode line can be adjusted smaller.

The laser beam of the line width processing unit may be processed through the laser beam generated from the short circuit repair unit 300. Hereinafter, for convenience of explanation, it is referred to as a third laser beam L3.

Therefore, the line width may be adjusted while the line width processing unit 408 moves in the opposite direction where the heat treatment is performed through the heat treatment unit 406.

That is, when the disconnection repair unit 400 moves from left to right in the first direction to form electrode lines, and the heat treatment unit 406 performs heat treatment while moving from left to right, the line width processing unit 408 The heat treatment can be performed while moving from the right side to the second direction on the left side.

2 and 3 are views for explaining a line width repair method in the electrode repair apparatus of FIG.

Referring to FIG. 2, the third laser beam L3 is irradiated to the edge of the electrode line 20 printed on the substrate 10, and the line width is reduced by removing the edge of the electrode line 20.

The third laser beam L3 is an ultra-short pulsed laser beam and may be irradiated to the electrode line 20. That is, the third laser beam L3 is a laser beam having a pulse width of picoseconds, femtoseconds or attoseconds. According to an exemplary embodiment, the third laser beam L3 may have a pulse width of 500 femtoseconds or less.

Unlike the laser beam of the nanosecond pulse of the above-mentioned second laser beam L2 or the laser beam of the nanosecond pulse or more that the heat is generated at the irradiation site, the third laser beam L3 is generated by the plasma, not heat. Processing is achieved. Therefore, when the third laser beam L3 is irradiated to the electrode line 20, problems such as substrate damage due to heat, lower layer damage, and material denaturation do not occur.

In other words, the use of an ultra-short laser beam enables a non-thermal process in the processing of the electrode line 20. In particular, OLEDs which are susceptible to heat can be effectively applied to the printing, processing and repair processes of electrodes.

The third laser beam L3 is irradiated along the path of the first laser beam L1 of the short circuit processing unit 300 and may be irradiated through various optical elements.

According to an embodiment of the present invention, the third laser beam L3 may remove edges of the electrode line 20 by trimming while moving along the electrode line 20 formed on the substrate. This trimming process may reduce the line width of the electrode line 20 by a desired range by repeating the electrode line 20 once or several times.

For example, the third laser beam L3 having a pulse width of 500 femtoseconds or less may be irradiated to the electrode line 20 to adjust the line width to 0.5 μm to 5 μm.

On the other hand, by irradiating the edge of the electrode line with the third laser beam L3 of the ultra-short pulse, the structure of the electrode line 20 is similar to the secondary heat treatment, more specifically, the heat treatment at the edge of the electrode line 20. The phenomenon of modifying may additionally occur.

Through this, it may help to reduce the electrical characteristics of the electrode line 20, for example, the resistivity value. Therefore, by irradiating the third laser beam L3 to the electrode line, the heat treatment effect can be improved as compared with the case where only the heat treatment through the second laser beam L2 is performed.

Referring to FIG. 3, the third laser beam L3 may be configured as a pair, and the pair of third laser beams L3 may be arranged with a predetermined interval G spaced apart. In this case, the predetermined interval G may be a line width to be formed, and both edges may be simultaneously cut by irradiating the third laser beam L3 along both edges of the electrode line 20. As such, when the laser beam is irradiated in pairs, the number of movements of the third laser beam may be reduced.

On the other hand, in order to branch the third laser beam L3 into a pair, the disconnection repair unit 400 adjusts the distance between the branching means (not shown) for branching the laser beam and the pair of laser beams. (Not shown) may be provided. Accordingly, the line width of the electrode line 20 to be processed can be easily adjusted as necessary.

Hereinafter, a method of repairing an electrode using the electrode repair apparatus described above will be described.

4 is a flowchart illustrating a method for repairing an electrode line according to an exemplary embodiment of the present invention, FIG. 5 is a diagram for describing a method for repairing a short circuit failure, and FIG. 6 is a method for repairing a disconnection failure. It is for the drawing.

4 is a method of repairing an electrode line using the electrode line repair apparatus of FIG. 1, and reference numerals of the electrode line repair apparatus refer to FIG. 1.

Referring to FIG. 4, the electrode line repairing method according to an embodiment of the present invention starts by placing the substrate 10 on the stage 100 of the electrode line repairing apparatus 1000. In this case, the substrate 10 and the stage 100 may be aligned (S11) using an alignment mark.

Thereafter, the substrate 10 is scanned through the photographing unit 202 of the damage detection unit 200 to acquire an image of the electrode line 20 (S12), and the acquired image is analyzed by the analysis unit (204) through the data input unit 204. 206) (S13). In this case, when the inspection of the entire substrate is in progress, the imaging unit 202 may proceed with imaging only the repair area.

The analyzing unit 206 analyzes the stored image to determine whether the short circuit is bad (S14). If the short circuit is bad, the short repair unit 300 is moved to the repair area through the control unit 208 (S21).

And, according to the damage information transmitted from the control unit 208, the laser oscillator 302 sets the electrode line to be removed by cutting, the electrode line region to be left, accordingly the intensity of the first laser beam (L1), the first laser A first laser beam L1 suitable for processing conditions such as a moving path of the beam L1, etc. is generated (S22), and the first laser beam L1 is irradiated to the repair area as shown in FIG. 5 to perform short circuit repair. Proceed (S23).

The repairing of the short circuit using the first laser beam L1 may be repeatedly performed while moving the short repair unit 300 according to the number of repair regions analyzed by the analyzer 206.

Then, it is determined whether there is an additional failure (S41), and if there is an additional failure, the process moves to step S13. If no further failure occurs, the substrate is taken out (S42) and terminated.

The additional defect may be input in advance according to the number of repair regions analyzed by the analysis unit 206, and the short repair unit may be moved to the repair region according to the number of repair regions (S21), and the first laser beam for short repair may be generated (S22). ), The process of performing short-circuit repair with the first laser beam (S23) is repeated.

Of course, when the analysis unit 202 derives information about one repair area, after repairing one defect, the process of repeating the step S23 of performing the short circuit repair from the step S12 of photographing the substrate may be performed. Can be.

That is, the defective repair can sequentially proceed with the repair process after inputting the defective positions in order for a plurality of defects found on the entire substrate. In addition, each time a defect is found at the time of a board | substrate inspection, after completion | finish of a repair process, defect inspection of a board | substrate may be performed and a repair process may be performed every time a defect is found.

On the other hand, if it is not a short circuit defect, it is determined whether it is a disconnection defect (S15). If the disconnection is not a defect, since the defect is not a repairable disconnection or a short circuit failure according to an embodiment of the present invention, the substrate 10 is taken out (S42) and terminated.

If the disconnection is defective, the disconnection repair unit 400 is moved to the repair area through the control unit 208 (S31).

Then, according to the damage information transmitted from the control unit 208, the HV control unit 404 determines the electrode line area to be repaired, and sets the voltage, waveform, and the like according to the ink supply unit 42 and the printing nozzle 41 The ink amount set in FIG. 6 is set to be discharged (S32), and as shown in FIG. 6, the printing process is performed (S33) to form the connection pattern 15.

Thereafter, the laser oscillator 302 is moved to the repair region, and a heat treatment process is performed (S34). In this case, the heat treatment process through the heat treatment unit 406 may be performed through the laser oscillator 302 of the short circuit repair unit 300. The control unit 208 transmits the damage information to the HV control unit 404 and also transmits the damage information to the laser oscillator 302 so that the laser oscillator 302 generates the second laser beam L2 necessary for the heat treatment process. do.

Next, when the heat treatment process is completed, it is determined whether or not the width of the repaired electrode line 20 satisfies the set value, that is, the width of the previously formed electrode line 20 (S35).

When the width of the electrode line 20 does not satisfy the set value, trimming of the edge of the electrode line 20 is performed through the line width adjusting unit 408 as shown in FIG. 6 (S36). At this time, the third laser beam L3 of the line width adjusting unit 408 may proceed through the laser oscillator 302 of the short circuit repair unit 300, and repeatedly until the width of the electrode line 20 satisfies the set value. Can be implemented.

The process of repairing the disconnection using the disconnection repair unit may be repeatedly performed while moving the disconnection repair unit 300 according to the number of repair regions analyzed by the analysis unit 206.

If the width of the electrode line 20 satisfies the set value, it is determined whether there is an additional failure (S41). If there is an additional failure, the process moves to step S13. If no further failure occurs, the substrate is taken out (S42) and terminated.

Like a repair process using a short repair unit, additional defects may be input in advance according to the number of repair areas analyzed by the analysis unit 206, and moving the disconnection repair unit to the repair area according to the number of repair areas (S31). From the step of proceeding the trimming to the third laser beam (S26) it can proceed repeatedly.

Of course, when the analysis unit 202 derives information about one repair area, after repairing one defect, the process of repeating the repair of the disconnection (S36) from photographing the substrate (S12) may be performed. Can be.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited thereto, and various modifications and changes can be made within the scope of the claims and the detailed description of the invention and the accompanying drawings. Naturally, it belongs to the range of.

100: substrate 200: damage detection unit
202: recording unit 204: data input unit
206: analysis unit 208: control unit
300: short circuit repair unit 302: laser oscillator
303: reflection member 304: tube lens
306: objective lens 400: disconnection repair unit
402: printing unit 404: HV control unit
406: heat treatment portion 408: line width processing portion

Claims (15)

Photographing the substrate to obtain an electrode line image,
Analyzing the image to determine whether there is a short circuit failure or a disconnection failure;
Repairing the short circuit by cutting and separating the shorted electrode line through a first laser beam generated from the laser oscillator of the short repair unit including a laser oscillator, in case of a short circuit failure,
If the disconnection is defective, repairing the disconnection through a disconnection repair unit printed by electrohydrodynamic (EHD).
Including,
Repairing the disconnection may include discharging ink between the electrode lines disconnected through the disconnection repair unit to connect the disconnected electrode lines to form a connection pattern.
Heat-treating the connection pattern with a second laser beam generated by the laser oscillator,
Determining whether a width of the connection pattern satisfies a set value according to the width of the electrode line;
If the set value is not satisfied, trimming an edge of the connection pattern by trimming the third laser beam generated by the laser oscillator;
Including,
The first laser beam and the third laser beam are laser beams of ultrashort pulses of sub-picosecond pulses,
And the second laser beam is a laser beam of pulses of nanoseconds or less. delete In claim 1,
In the heat treatment step,
And the heat treatment is performed by irradiating a second laser beam generated by the laser oscillator. delete In claim 1,
In the step of removing by trimming,
And a third laser beam generated by the laser oscillator is irradiated to both edges of the electrode line. delete In claim 1,
And the first laser beam has a pulse width of 500 femtoseconds or less. A stage portion on which a substrate is placed,
A damage detection unit detecting damage of an electrode line formed on the substrate;
Single line repair unit and short circuit repair unit that can be moved in multiple axes when supported by the stage unit
Including,
The printing unit of the disconnection repair unit discharges ink in an EHD manner to connect the electrode lines,
And the short circuit repair unit separates the electrode lines by generating an ultra-short pulsed laser beam of picosecond pulse or less. delete In claim 8,
The disconnection repair unit is a heat treatment unit for heat treatment after the ink is discharged
Electrode line repair device further comprising. In claim 10,
And the heat treatment is performed by a laser beam. In claim 8,
The disconnection repair unit is connected to the electrode line line width processing unit for trimming the edge of the electrode line
Electrode line repair device further comprising. In claim 12,
And the trimming proceeds with a laser beam. In claim 8,
The damage detection unit
A camera for photographing the substrate,
A data input unit for inputting an image photographed by the camera,
An analysis unit which stores and analyzes the image input through the data input unit,
Control unit for controlling the disconnection repair unit and the short circuit repair unit in accordance with the damage information analyzed by the analysis unit
Electrode line repair apparatus comprising a. In claim 8,
And the short circuit repair unit includes a reflective member, a tube lens, and an objective lens, which are sequentially disposed on an optical path through which the laser beam passes.

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