KR101738982B1 - Apparatus and Method for Repairing Substrate - Google Patents

Abstract

The present invention relates to a process for identifying defects on a substrate, a process for applying ink having a larger area than the defects to the defects, a process for curing the applied ink to form a coating film, And removing the coating film in the predetermined setting area while moving the laser beam, the defect on the pattern on the substrate can be quickly repaired.

Description

[0001] Apparatus and Method for Repairing Substrate [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a repair apparatus and a repair method, and more particularly, to a repair apparatus and a repair method capable of quickly repairing defects occurring on a pattern on a substrate.

Recently, the spread of various mobile devices including smart phones and tablet PCs has grown rapidly, and FPDs of various sizes have been rapidly growing as the share of TVs adopting FPDs such as LCDs and OLEDs has increased. In addition, almost all electronic products contain semiconductor elements such as ICs, and the conventional PCBs are becoming smaller and slimmer, and wiring formed on the substrate is becoming thinner and more highly integrated.

In a mobile device or a TV adopting FPD, an LCD adopting a liquid crystal capable of adjusting light transmittance or an OLED that emits light is used as a configuration for displaying an image. In order to implement a color image, a TFT And a wiring for connecting them are formed. The semiconductor wafer and the PCB are not the same as the FPD, but the wiring is formed on the substrate in a similar manner.

As described above, wirings including driving elements formed on a substrate may be broken or short-circuited due to foreign substances during each manufacturing process. In the case where the number of defects exceeds a certain number, wirings are generally treated as defective. However, in the case of a simple wire or short circuit, the defects may be repaired (or repaired) to become a normal product. Therefore, defects on the substrate are detected and repaired.

Conventionally, when the wiring is broken, the broken wiring is connected by using a metal source and a laser to perform repair work. However, in the case of a conventional apparatus for supplying a metal source, it is difficult to finely control the amount of the metal source to be discharged because the metal source is discharged by using a pneumatic pressure or using a piezo motor. Thus, it is difficult or impossible to form or repair fine wiring.

In addition, when patterning the hardened metal source while moving the laser beam, the direction of movement of the laser beam moving in only one direction along the patterned shape must be changed. Therefore, in the case of forming a complicated pattern, the moving direction of the laser beam has to be changed from time to time, thereby increasing the time required for the repair work.

KR 2014-0099404 A

The present invention provides a repair apparatus and repair method capable of quickly repairing defects on a pattern on a substrate.

The present invention provides a repair apparatus and repair method capable of easily repairing defects of a complicated pattern on a substrate.

The present invention relates to a method of manufacturing an ink jet recording head comprising a stage on which a substrate is placed, an ink supply portion for supplying ink toward a defect of the pattern on the substrate, a laser beam portion for irradiating a first laser beam for curing the ink and a second laser beam for patterning the cured ink And a moving unit for supporting the ink supply unit and the laser unit and moving the ink supply unit and the laser unit relative to the stage on the substrate.

The laser unit may include a first laser unit for generating the first laser beam, a second laser unit for generating the second laser beam, a second laser unit disposed in a movement path of the second laser beam, And an objective lens for irradiating the substrate with the first laser beam or the second laser beam having passed through the scanner unit.

The scanner unit includes a first scanner mirror for reflecting the second laser beam and controlling a forward and backward irradiation position of the second laser beam, and a second scanner mirror for reflecting the second laser beam, And a second scanner mirror for controlling the second scanner mirror.

The laser unit includes a control unit that opens and closes the movement path of the second laser beam and continuously adjusts the tilt of the first scanner mirror and the second scanner mirror.

The ink supply unit includes a nozzle unit for ejecting the ink, and a power supply unit for supplying power to the nozzle unit to form an electric field between the substrate and the nozzle unit.

The moving unit includes a first moving unit capable of moving back and forth in one direction and a second moving unit connected to the ink supply unit and the laser unit and connected to the first moving unit so as to be movable in a direction intersecting the one direction do.

The second laser beam is generated in a pulsed wave form and is irradiated with a beam size smaller than the beam size of the first laser beam.

The second laser beam includes at least one of a nano-laser, a pico-laser, and a femto-laser.

The present invention relates to a process for identifying defects on a substrate, a process for applying ink having a larger area than the defects to the defects, a process for curing the applied ink to form a coating film, And removing the coating film in the predetermined setting region while moving the laser beam.

The process of applying the ink includes a process of discharging the ink using electrohydraulics.

The process of moving the laser beam includes a process of irradiating a scan laser beam of a pulsed wave type, and a process of repeatedly moving the scan laser beam across an area of the coating film.

The process of removing the coating film may include irradiating the laser beam in the setting region and not irradiating the laser beam in another region.

The process of curing the ink to form a coating film includes irradiating the applied ink with a cured laser beam of a continuous wave type at a size larger than the area coated with the ink.

The setting region includes a region where the pattern on the substrate should not be formed.

The defect includes an open defect, and the process of removing the coating film in the setting region is a process of forming a crystal pattern.

According to the embodiments of the present invention, it is possible to precisely supply the ink toward the defects of the pattern on the substrate. Therefore, even minute defects can be repaired, and the amount of ink supplied onto the defect can be precisely controlled.

In addition, the cured ink can be quickly patterned on the defect while continuously controlling the angle at which the laser beam is irradiated. Thus, the defects of the pattern on the substrate can be quickly repaired, and defects of a complicated pattern on the substrate can be easily repaired.

1 is a perspective view schematically showing a repair apparatus according to an embodiment of the present invention;
2 is a view showing a structure of a laser part and an ink supply part according to an embodiment of the present invention.
3 is a flow chart showing the sequence of a repair method according to an embodiment of the present invention.
4 is a cross-sectional view illustrating a repair method according to an embodiment of the present invention.
5 is a plan view showing a repair method according to an embodiment of the present invention;

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. It will be apparent to those skilled in the art that the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, It is provided to let you know. To illustrate the invention in detail, the drawings may be exaggerated and the same reference numbers refer to the same elements in the figures.

FIG. 1 is a perspective view schematically showing a repair apparatus according to an embodiment of the present invention, and FIG. 2 is a view showing the structure of a laser unit and an ink supply unit according to an embodiment of the present invention.

Referring to FIG. 1, a repair apparatus 1000 according to an embodiment of the present invention includes a stage 10 on which a substrate is placed, an ink supply unit 200 for supplying ink toward defects of the pattern on the substrate, (100) for irradiating a first laser beam for curing and a second laser beam for patterning the cured ink, and a laser part (100) for supporting the ink supply part (200) and the laser part (100) And a moving unit 40 for moving the laser unit 100 relative to the stage 10 and includes a table 20 and a rail 30.

The moving unit 40 moves the ink supply unit 200 and the laser unit 100 relative to the stage 10 when the stage 10 moves or when the moving unit 40 moves the ink supply unit 200, And the laser part 100, all of which may move. Although the moving unit 40 moves the ink supply unit 200 and the laser unit 100 on the stage 10 in the embodiment of the present invention, various modifications are possible.

The table 20 has a flat upper surface and a predetermined area and thickness. The table 20 serves as a base for supporting the stage 10. For example, the table 20 may be a plate of a predetermined thickness. In addition, the table 20 can be installed on a frame structure that is rigidly mounted to the ground and can prevent external vibration or shock.

The stage 10 is installed on the table 20. A substrate is placed on the stage 10, and the stage 10 serves to support the substrate. For example, the upper surface of the stage 10 may be formed to have an area larger than the area of the substrate so that the substrate can be stuck to the upper surface. Further, the shape of the stage 10 may be formed corresponding to the shape of the substrate.

The pair of rails 30 extend in one direction and are formed on both sides of the table 20 in a straight line. Further, a pair of rails 30 are disposed on the table 20 outside the stage 10. The moving unit 40 moving on the rail 30 can move the ink supply unit 200 and the laser unit 100 onto the stage 10. [

The moving part 40 is connected to the ink supply part 200 and the laser part 100 to support and move them. The moving unit 40 is connected to the first moving unit 41 capable of moving back and forth in one direction and the ink supply unit 200 and the laser unit 100, And a second moving unit 42 movably connected in an intersecting direction.

The first moving unit 41 is formed so as to extend in the direction intersecting the extending direction of the rail 30 and is capable of moving back and forth on the rail 30 in one direction. That is, the first moving unit 41 can be moved forward and backward along the rail 30 in one direction.

The second moving unit 42 is movably connected to the first moving unit 41 in a direction intersecting with one direction. That is, the second moving unit 42 can move along the direction in which the first moving unit 41 extends. The ink supply unit 200 and the laser unit 100 are installed on the front surface of the second moving unit 42. Thus, the ink supply unit 200 and the laser unit 100 can move together with the first moving unit 41 and the second moving unit 42. Therefore, by controlling the operation of the first moving unit 41 and the second moving unit 42, the ink supply unit 200 and the laser unit 100 are moved in a direction intersecting with one direction and one direction, .

Here, the first mobile unit 41 and the second mobile unit 42 move on the same plane in the direction intersecting each other, for example, the first mobile unit 41 moves on the X axis, (42) can move on the Y axis.

The ink supply unit 200 serves to supply ink to a wiring defect of a pattern on a substrate, for example, an open defect or a short circuit. The ink supply unit 200 according to the embodiment of the present invention can precisely eject a very small amount of ink by using the electrohydraulics. That is, ink may be ejected from the nozzle unit 210 by an electric field formed between the nozzle unit 210 and the substrate by forming an electric field between the nozzle unit 210 and the substrate, which will be described later. As the ink, a source of the same material as the material of the pattern on the substrate and silver (Ag) excellent in conductivity can be used. Therefore, the portion where the short circuit is caused by the applied ink can be connected. However, the material of the ink is not limited thereto and may vary.

2, the ink supply unit 200 includes a nozzle unit 210 that discharges ink, and a nozzle unit 210 that supplies power to the nozzle unit 210 to form an electric field between the substrate and the nozzle unit 210 A power supply unit 220, and may include a pneumatic unit (not shown), a storage unit 230, and a photographing unit 240.

The nozzle unit 210 serves to eject the ink toward the defects of the pattern. The ink ejection portion of the nozzle unit 210 is disposed downward or downwardly inclined. The nozzle unit 210 can be made of a material that is easier to process than a metal such as glass or plastic so that the area of the ink ejection portion can be formed as small as desired. In addition, the nozzle unit 210 may be coated with a metal material on the surface of the nozzle unit 210 to perform the function of the electrode. Accordingly, a portion where the ink is ejected from the nozzle unit 210 can be formed small so as to eject a very small amount of ink, and a uniform electric field can be formed by uniformly coating the surface of the nozzle unit 210 with a metal material. Therefore, since the uniform force can be applied to the ink inside the nozzle unit 210, the discharge amount of the ink can be precisely controlled. However, the structure and material of the nozzle unit 210 are not limited to these, and may vary.

The storage unit 230 stores ink therein and is connected to the nozzle unit 210 to supply ink to the nozzle unit 210. The storage unit 230 may be insulated or insulated so that electricity flows only from the nozzle unit 210 to the substrate. On the other hand, when an electric field and a pneumatic pressure are used together for discharging the ink, the storage unit 230 may be connected to a pneumatic unit to be described later. However, the connection structure of the storage unit 230 is not limited to this and may vary.

The power supply unit 220 serves to supply power to the nozzle unit 210 so that an electric field is formed between the nozzle unit 210 and the substrate. The power supply unit 220 is connected to the metal coated on the surface of the nozzle unit 210. Thus, the entire nozzle unit 210 has a constant potential with respect to the substrate, and an electric field is formed by a potential difference between the nozzle unit 210 and the substrate. When the direct current is supplied to the nozzle unit 210, the substrate or the stage 10 must be connected to the electrode. However, in the case of AC, there is no need to separately ground the substrate and the stage 10, The material of the stage 10 may not be limited to metal.

Whether to discharge ink droplets or ink droplets continuously is determined by the intensity, frequency, amount of electric current supplied from the power supply unit 220, and the like. Accordingly, as the power of the power supply unit 220 is controlled to increase, the ink ejected from the nozzle unit 210 changes from a drop shape to a sprayed shape. In addition, since the number of droplets discharged per second changes according to the frequency, the discharge amount can be controlled by adjusting the frequency.

On the other hand, when controlling the discharge amount of the ink by assisting not only the power source but also the pneumatic pressure, the shape of the meniscus formed by the pneumatic pressure differs depending on the strength of the pneumatic pressure, and the shape of the ink is convex at the tip of the nozzle due to the capillary phenomenon. The discharge amount is controlled accordingly. For example, when the pneumatic pressure is increased, the meniscus is formed to be large and the volume to be discharged is increased. In this case, the ink can be discharged through the nozzle unit 210 even if the power supply is low.

The pneumatic unit serves to supply pneumatic pressure to the nozzle unit 210. The strength of the power to be supplied may be greatly increased depending on the characteristics of the ink. In this case, there is a problem in safety and it may become difficult to control the precise amount of ink to be discharged. Therefore, by supplying a constant-sized pneumatic pressure to the nozzle unit 210 with the supply unit, the strength of the power supplied to the nozzle unit 210 can be reduced. Therefore, safety is ensured and the discharge amount of the ink is precisely adjusted .

The photographing unit 240 serves to photograph a pattern or defect on the substrate. The photographing unit 240 is disposed above the portion of the nozzle unit 210 where the ink is ejected. Therefore, it is possible to monitor in real time whether the ink is accurately ejected due to a defect in the pattern through the photographing unit 240. Thus, reliability and precision of the work can be improved.

The laser unit 100 serves to form a crystal pattern on the substrate by irradiating a laser beam onto a region where the coating film is formed on the substrate. 2, the laser unit 100 includes a first laser unit 110 for generating a first laser beam, a second laser unit 120 for generating a second laser beam, A scanner unit (130) disposed in the path and adapted to adjust an angle at which the second laser beam is irradiated, and a second laser beam source (130) for irradiating the substrate with the second laser beam through the first laser beam or the scanner unit A lens 150, and may include a laser mirror 160, a slit 140, and a control unit 170. [

The first laser unit 110 includes a first laser generator (not shown) for generating a first laser beam and a first attenuator (not shown) for opening and closing the movement path of the first laser beam generated by the first laser generator, . ≪ / RTI > The first laser beam serves to cure the ink supplied as a defect in the pattern on the substrate. Therefore, a laser beam in the form of a continuous wave (CW: Coutinuous Wave) may be used as the first laser beam to maintain the reaction temperature for curing the ink. Since such a laser beam is a laser beam having a small energy per unit pulse, the curing reaction rate of the ink can be improved while preventing the ink from being cut off.

The second laser unit 120 includes a first laser generator (not shown) for generating a second laser beam and a second attenuator (not shown) for opening and closing the path of the second laser beam generated by the second laser generator, . ≪ / RTI > Thus, the second attenuator may serve as a switch for turning on / off the second laser beam. The second laser beam functions to pattern a coating film formed by curing the ink to form a quartz crystal pattern in a defect occurrence portion. Therefore, a laser beam in the form of a pulse wave can be used as the second laser beam to cut the coating film.

At this time, a short wavelength (UV series) laser beam can be used to reduce the damage to the lower pattern or the substrate under the coating film by the second laser beam. That is, the laser beam having a long length (IR series) has a relatively high penetration rate and energy as compared with the short wavelength laser beam, and can damage the lower pattern or the substrate below the coating film. Therefore, at least one of a nano-laser, a pico-laser, and a femto-laser, which is a short-wavelength laser beam, can be used as the second laser beam.

The laser mirror 160 includes a first laser mirror 161 disposed between the second laser unit 120 and the scanner unit 130 and a second laser mirror 161 disposed between the first laser unit 110 and the objective lens 150, And a second laser mirror 162 disposed between the first lens 130 and the objective lens 150.

The first laser mirror 161 serves to guide the second laser beam generated by the second laser unit 120 to the scanner unit 130. That is, the first laser mirror 161 reflects the second laser beam on one side and moves it to the scanner unit 130.

The second laser mirror 162 serves to guide the first laser beam generated by the first laser unit 110 or the second laser beam reflected by the scanner unit 130 to the objective lens 150. That is, one surface of the second laser mirror 162 reflects the second laser beam to move the second laser beam to the objective lens 150, and the other surface of the second laser mirror 162 transmits the first laser beam And can be moved to the objective lens 150. However, the number of the laser mirrors 160 and the position of the laser mirrors 160 are not limited to these, and may be various.

The scanner unit 130 serves to adjust the angle of the second laser beam emitted from the second laser unit 120. [ The scanner unit 130 includes a first scanner mirror (not shown) that reflects the second laser beam to control the forward and backward irradiation positions of the second laser beam, and a second scanner mirror And a second scanner mirror (not shown) for controlling the irradiating position of the beam in the horizontal direction, and may include a first motor (not shown) and a second motor (not shown).

The first scanner mirror is disposed on the movement path of the second laser beam, and reflects the second laser beam. The first scanner mirror is connected to the first motor so that the angle of tilting in the forward and backward directions can be adjusted. Accordingly, when the angle of the first scanner mirror is adjusted, the angle of reflection of the second laser beam is adjusted so that the front-rear direction position of the laser beam irradiated on the substrate can be adjusted.

The second scanner mirror is disposed on the movement path of the second laser beam, and reflects the second laser beam. The second scanner mirror may be disposed between the second laser unit 120 and the first scanner mirror or between the first scanner mirror and the objective lens 150. That is, the second laser beam reflected by the second scanner mirror can be moved by the first scanner mirror, or the second laser beam reflected by the first scanner mirror can move to the second scanner mirror.

And the second scanner mirror is connected to the second motor so that the tilt angle in the left and right direction can be adjusted. Accordingly, when the angle of the second scanner mirror is adjusted, the angle of reflection of the second laser beam is adjusted so that the lateral position of the laser beam irradiated on the substrate can be adjusted. Therefore, by adjusting the tilted angle of the first scanner mirror and the second scanner mirror, the laser beam irradiated on the substrate can be moved back and forth, right and left. However, the method of moving the laser beam is not limited to this and may be various.

The slit 140 is disposed on the movement path of the laser beam to adjust the size and shape of the laser beam moving toward the objective lens 150. For example, the slit 140 may be disposed between the second laser mirror 162 and the objective lens 150 to reflect the first laser beam or the second laser mirror 162 passing through the second laser mirror 162, The size and shape of the second laser beam can be adjusted. However, the position of the slit 140 is not limited to this and may vary.

The objective lens 150 serves to compress and irradiate the laser beam. That is, the objective lens 150 allows the first laser beam or the second laser beam to be focused on the substrate or pattern on the substrate. The objective lens 150 may be a revolver type or a linear type so as to selectively use a plurality of lenses having different magnifications. For example, the objective lens 150 may include a x5 lens, a x10 lens, a x20 lens, and a x50 lens. Accordingly, the size of the laser beam can be adjusted by selecting the magnification of the objective lens 150 according to the operation. However, the magnification of the objective lens 150 and the number of magnifications that can be changed are not limited to these, and may vary.

In the case of the first laser beam, since the laser beam is for curing the ink, the beam size must be irradiated at least the area of the supplied ink. That is, since the area of contact of the first laser beam with the ink increases, the ink quickly hardens as a whole, so that the repairing process proceeds quickly. Therefore, the beam size of the first laser beam can be adjusted by adjusting the slit 140 and the objective lens 150 to be equal to or larger than the area of the supplied ink, for example, twice or more of the area of the supplied ink.

In the case of the second laser beam, since the ink is cured to cut the formed coating film, a laser beam of a small size must be irradiated in order to form a crystal pattern accurately. That is, as the size of the laser beam is reduced, a fine pattern can be formed, so that the precision of the work is improved. Therefore, the beam size of the second laser beam can be reduced by adjusting the slit 140 and the objective lens 150. For example, the beam size of the second laser beam can be reduced to 5 mu m or less for precise work. However, the beam sizes of the first laser beam and the second laser beam are not limited to these and may vary.

The control unit 170 is connected to the second attenuator, the first motor, and the second motor to open and close the movement path of the second laser beam, and to continuously adjust the inclination of the first scanner mirror and the second scanner mirror . Therefore, when a part of the coating film is removed to form a quartz crystal pattern, a portion to be cut out of the entire area of the coating film can be selected and input to the control unit 170. The control unit 170 controls the first motor and the second motor to move the second laser beam along the area of the coating film while opening the path of movement of the second laser beam at the portion to be cut using the second attenuator, It is possible to close the movement path of the second laser beam. Therefore, the second laser beam is irradiated only to the region to be cut, and a desired pattern of the correction pattern can be formed in the portion where the defect of the substrate state occurs.

Since ink can be precisely supplied to the defects of the pattern on the substrate, fine defects can also be repaired and the amount of ink supplied onto the defect can be precisely controlled. In addition, the cured ink can be quickly patterned on the defect while continuously controlling the angle at which the laser beam is irradiated. Thus, the defects of the pattern on the substrate can be quickly repaired, and defects of a complicated pattern on the substrate can be easily repaired.

4 is a cross-sectional view illustrating a repair method according to an embodiment of the present invention, and FIG. 5 is a flowchart illustrating a repair method according to an embodiment of the present invention. Fig.

Hereinafter, a repair method according to an embodiment of the present invention will be described.

A repair method according to an embodiment of the present invention includes the steps of: confirming a defect on a pattern on a substrate (S100); applying ink having a larger area than the area of the defect (S200) (S300) of forming a coating film by curing, and removing a coating film in a predetermined setting region while moving the laser beam along the area of the coating film (S400). At this time, the defect may be an open defect caused by shorting or cutting the pattern, and the pattern may be a metal material pattern, and the process of removing the coating film of the setting region may include a process of forming a crystal pattern Lt; / RTI >

The pattern on the substrate can be confirmed visually or by a camera whether a defect has occurred due to a short circuit on the substrate. When a combination of patterns on a substrate is found, it is possible to carry out an operation of forming a crystal pattern in a defect-generated portion.

First, the ink supply unit 200 is positioned above the defective portion. Then, as shown in FIG. 4 (b), the ink is discharged to a portion where the pattern P is short-circuited through the nozzle unit 210 of the ink supply unit 200. At this time, the ink is an ink used as a correction liquid.

On the other hand, ink can be ejected to a portion where a short circuit occurs by using the electrohydraulic. That is, electric power may be supplied to the nozzle unit 210 or the nozzle unit 210 and the substrate to form an electric field between the nozzle unit 210 and the substrate. Whether to discharge ink droplets or successively ink droplets is determined by the intensity, frequency, amount of current, and the like of the supplied power source. In addition, since the number of droplets discharged per second changes according to the frequency, the discharge amount can be controlled by adjusting the frequency.

Since the amount of ink supplied to the defective portion of the pattern P can be precisely controlled by controlling the power source, it is possible to precisely control the amount of ink supplied to the defective portion of the pattern P as shown in FIG. 4 (c) The coating film M can be formed. Therefore, the amount of ink used can always be kept constant, so that the same type of coating film M can always be formed at the portion where the pattern P defects occur. Therefore, the area of the coating film M can be easily known.

Further, the amount of the ink to be ejected is equal to or larger than the area of the coating of the defective portion of the pattern (P). That is, the coating film has an area equal to or greater than the area of the broken area or the cut area due to the occurrence of defects. For example, the amount of ink to be ejected can be controlled so that the area of the coating film has an area of 110% to 400% of the area of the defective part of the pattern P.

It may be difficult to form a quartz crystal pattern on the substrate when the ink is supplied so that the area of the coating film M is less than 110% of the area of the defective portion of the pattern P. [ That is, if the shape of the pattern P is complicated, if the area of the coating film M is not sufficient, the coating film M may not completely cover the protruding defect portion of the pattern P. Thus, a quartz crystal pattern can not be formed in a place where the coating film M is not covered, and a defective portion of the pattern P can not be repaired. Therefore, the ink can be supplied to a larger extent than the defective area of the pattern P so that the coating film M sufficiently covers the defective portion of the pattern P. [

On the other hand, when the pattern P is complicated, the amount of ink ejected increases. However, when the ink is supplied such that the area of the coating film M exceeds 400% of the area of the defective portion of the pattern P, the amount of ink used becomes too large, which may waste the ink. Further, as the area of the coating film M increases, the area where the second laser beam must move on the coating film M increases in order to remove the coating film M. [ Therefore, when the ink is excessively discharged, there arises a problem that the cost and the working time are increased. Thus, it is possible to control the ink not to be excessively discharged so that the cost and the working time are shortened. However, the supply amount of the ink is not limited to this and may vary.

The process of forming and patterning the coating film M to form a quartz crystal pattern will be described in more detail. As shown in FIG. 5 (b), the ink can be supplied to a portion where a short circuit occurs.

Then, the laser unit 100 is moved to the upper side of the portion to which the ink is applied, and the first laser beam is irradiated toward the applied ink. The first laser beam serves to cure the ink. Therefore, a laser beam in the form of a continuous wave (CW: Coutinuous Wave) may be used as the first laser beam to maintain the reaction temperature for curing the ink. Since such a laser beam is a laser beam having a small energy per unit pulse, the curing reaction rate of the ink can be improved while preventing the ink from being cut off.

Also, as the area of contact between the first laser beam and the ink increases, the ink cures quickly as a whole. Accordingly, the beam size of the first laser beam can be adjusted to be equal to or larger than the area of the supplied ink by adjusting the slit 140 and the objective lens 150. [ Thus, the coating film M can be formed at the portion where the defect occurs as shown in Fig. 5 (c), while the curing laser beam of the continuous wave type is irradiated to the ink at a size larger than the area coated with the ink.

Then, the control unit 170 can preliminarily input the setting area where the coating film M is to be removed and the area which is not to be removed. The setting area is an area on the substrate where no pattern should be formed. That is, the operator can determine the setting area so that only the coating film M of the portion on the substrate on which the pattern is to be formed is left, and the rest is removed. At this time, since the entire area of the coating film M is known, it is easier to determine the setting area.

Then, the first laser beam is stopped from being irradiated and a second laser beam is generated. The second laser beam serves to pattern a coating film (M) to form a quartz crystal pattern in a defect-generating portion. Therefore, in order to cut the coating film M, a laser beam in the form of pulsed waves can be used as the second laser beam. At this time, a short wavelength (UV series) laser beam can be used to reduce the damage to the lower pattern or the substrate under the coating film M by the second laser beam. For example, at least one of a nano-laser, a pico-laser, and a femto-laser, which is a short-wavelength laser beam, can be used as the second laser beam.

Further, in the case of the second laser beam, since the ink beam is a laser beam for cutting the formed coating film formed by curing, a laser beam of a small size must be irradiated to form a fine pattern. That is, as the size of the laser beam is smaller than the area of the defect, a fine pattern can be formed, thereby improving the precision of the operation. Accordingly, the slit 140 and the objective lens 150 can be adjusted to reduce the beam size of the second laser beam to less than the area of the defect. For example, the beam size of the second laser beam can be reduced to 5 mu m or less for precise work.

Next, a second laser, which is a pulsed laser beam in the form of a pulsed wave, is radiated toward the coating film M, and the second laser beam is traversed over the area of the coating film M as shown in Fig. 5 (e) It can be moved repeatedly. For example, the second laser beam can be moved in a zigzag manner while scanning the coating film M along the area of the coating film M. [ That is, the control unit 170 controls the operation of the first motor and the second motor to adjust the inclination of the first scanner mirror and the second scanner mirror, and moves the second laser beam along the area of the coating film M .

The area of the range in which the second laser beam moves is equal to or larger than the area of the coating film M. [ That is, when the second laser beam moves in a range smaller than the area of the coating film M, the coating film M outside the moving range of the second laser beam is not removed. Thus, when the coating film M to be removed is outside the moving range of the second laser beam, the coating film M can not be removed, and defective substrate may be defective. Therefore, the area of the moving range of the second laser beam may be equal to or larger than the area of the coating film M so as to cover the entire coated film M.

At this time, the control unit 170 may control the operation of the second attenuator while moving the second laser beam to irradiate the second laser beam in the setting region, and not irradiate the second laser beam in the other region. Thus, only the coating film in the setting region is removed, and a correction pattern can be formed as shown in Fig. 5 (f). Therefore, if only the setting area is input to the control unit 170, a correction pattern can be formed quickly even if a defect occurs in the complex pattern P.

Since ink can be precisely supplied to the defects of the pattern on the substrate, fine defects can also be repaired and the amount of ink supplied onto the defect can be precisely controlled. In addition, the cured ink can be quickly patterned on the defect while continuously controlling the angle at which the laser beam is irradiated. Thus, the defects of the pattern on the substrate can be quickly repaired, and defects of a complicated pattern on the substrate can be easily repaired.

Although the present invention has been described in detail with reference to the specific embodiments thereof, it will be apparent to those skilled in the art that various modifications and variations can be made without departing from the scope of the present invention. Therefore, the scope of the present invention should not be limited by the described embodiments, but should be defined by the appended claims, as well as the appended claims.

10: stage 40: moving part
100: laser unit 110: first laser unit
120: second laser unit 130: scanner unit
150: Objective lens 200: Ink supply part
210: nozzle unit 220: power supply unit
1000: Repair device

Claims (15)

A stage on which a substrate is placed;
An ink supply unit for supplying ink, which is a correction liquid, so as to be spread over the area of the open defect toward the open defect of the pattern on the substrate;
A laser part for irradiating a first laser beam for curing the ink and a second laser beam for patterning the cured ink to form a quartz crystal pattern; And
A moving unit for supporting the ink supply unit and the laser unit and moving the ink supply unit and the laser unit relative to the stage on the substrate; Repair devices included. The method according to claim 1,
The laser unit includes:
A first laser unit for generating the first laser beam;
A second laser unit for generating the second laser beam;
A scanner unit disposed in a movement path of the second laser beam and adjusting an angle of irradiation of the second laser beam; And
An objective lens for irradiating the substrate with the first laser beam or the second laser beam having passed through the scanner unit; Repair devices included. The method of claim 2,
The scanner unit includes:
A first scanner mirror that reflects the second laser beam and controls a forward and backward irradiation position of the second laser beam; And
A second scanner mirror for reflecting the second laser beam and controlling the irradiating position of the second laser beam in the lateral direction; Repair devices included. The method of claim 3,
Wherein the laser unit includes a control unit that opens and closes the path of movement of the second laser beam and continuously adjusts the inclination of the first scanner mirror and the second scanner mirror. The method according to claim 1,
The ink supply unit includes:
A nozzle unit for ejecting the ink; And
A power supply unit for supplying power to the nozzle unit to form an electric field between the substrate and the nozzle unit; Repair devices included. The method according to claim 1,
The moving unit includes:
A first mobile unit capable of moving back and forth in one direction; And
A second moving unit connected to the ink supply unit and the laser unit and connected to the first moving unit movably in a direction crossing the one direction; Repair devices included. The method according to any one of claims 1 to 6,
Wherein the second laser beam is generated in a pulsed wave form and irradiated with a beam size smaller than the beam size of the first laser beam. The method of claim 7,
Wherein the second laser beam includes at least one of a nano-laser, a pico-laser, and a femto-laser. A process of confirming an open defect in a pattern on a substrate;
Applying an ink, which is a correction liquid, to a portion where the defect occurs, the ink being wider than an area of the defect;
Curing the applied ink to form a coating film; And
Removing a coating film in a predetermined setting region while moving a laser beam along an area of the coating film to form a crystal pattern; Included repair method. The method of claim 9,
The process of applying the ink includes:
And discharging the ink using electrohydrodynamics. The method of claim 9,
The process of moving the laser beam includes:
A process of irradiating a scan laser beam in the form of a pulse wave; And
Repeatedly moving the scanning laser beam across an area of the coating film; Included repair method. The method of claim 9,
The process of removing the coating film may include:
And irradiating the laser beam in the setting area and not irradiating the laser beam in another area. The method of claim 9,
In the process of curing the ink to form a coating film,
And irradiating the applied ink with a cured laser beam of a continuous wave type at a size equal to or larger than the area of the ink applied. The method of claim 9,
Wherein the setting area includes a region on which the pattern on the substrate should not be formed. delete

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