JP2012150288A - Substrate supporting device and pattern correction apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate supporting device with a simple device configuration and capable of suppressing deflection of a substrate as a correction object, and a pattern correction apparatus using the same.SOLUTION: A substrate supporting device 4 includes plural sub-stages 12 that are disposed apart from each other so as to form a clearance 13 which can be entered by a hand part of a transport device for transporting a substrate 3 and hold the substrate 3, and an interpolation stage 14 that is disposed between the adjacent sub-stages 12 so as to be movable in the clearance 13 and hold the substrate 3.

Description

  The present invention relates to a substrate support device and a pattern correction device, and more particularly to a substrate support device for supporting a substrate having a fine pattern formed on the surface and a pattern correction device including the substrate support device. .

  In flat panel displays such as liquid crystal displays, plasma displays, and EL displays, there is a demand for larger displays and improved production efficiency. Correspondingly, in the manufacture of flat panel displays, the substrate size tends to increase, and recently, a large glass substrate exceeding 3 m square may be used. In addition, the number of pixels tends to increase with the progress of high definition display. Along with this, the existence probability of defects in the fine pattern formed on the surface of the substrate in the manufacturing process is high. Accordingly, in order to improve the yield, a pattern correction apparatus corresponding to a large substrate is demanded.

  For example, as a pattern correction device that corrects a white defect in which a part of a colored layer of a liquid crystal color filter substrate (glass substrate) is discolored, after applying correction liquid (correction ink) to the tip of the needle, There is known one in which a correction liquid is applied by pressing against a defective portion (white defect) (see, for example, Patent Document 1). This pattern correction device is provided with a glass surface plate (substrate support device) on which a glass substrate (color filter) to be corrected is mounted. This glass surface plate includes a lift-up mechanism for lifting up the glass substrate when the glass substrate is carried in and out. The glass surface plate is formed with lifter pin holes for allowing the lifter pins to pass therethrough and vacuum suction grooves for fixing the glass substrate to the upper surface of the glass surface plate. In this pattern correction device, when the glass substrate is unloaded, the glass substrate is lifted upward by a lifter, and a space is provided between the glass surface plate and the glass substrate, and then the glass substrate is conveyed into this space. Insert the robot hand to hold the glass substrate and carry it out. On the other hand, when the glass substrate is carried in, the glass substrate held and carried by the robot's hand is placed on the lifter, and after the robot's hand is pulled out, the lifter is lowered to move the glass substrate. A glass substrate is held on the board.

  Further, there has been proposed a pattern correction device in which a chuck stage (substrate support device) that holds a glass substrate is divided into a plurality of substages (see, for example, Patent Document 2). In this pattern correction apparatus, since the robot hand can enter a gap formed between adjacent substages, it is easy to carry in and out the substrate.

JP 2006-7295 A JP 2008-15031 A

  However, the pattern correction apparatus described in Patent Document 1 has a problem in that the apparatus configuration is complicated because a mechanism is provided in which a hole is made in a glass surface plate and a lifter pin is moved up and down through the hole. Further, as the substrate to be corrected becomes larger, it is necessary to prepare a large glass surface plate corresponding to this. Furthermore, when holes or grooves are formed in the glass surface plate, there is a problem that processing is difficult and cost is increased.

  Further, in the pattern correction apparatus described in Patent Document 2, the gap between adjacent substages is set to a distance that does not interfere with the robot hand, for example, about several hundred mm. At this time, since the region of the glass substrate located on the gap is not supported by the substage, the region is bent and deformed downward. Therefore, when the defect is confirmed and corrected, when the fine pattern in the region is observed with the observation optical system, the focus position is greatly changed as compared with the case where the other region is observed. For this reason, there are problems such as that it takes time to detect the focus position and that the focus position is out of the detection range. Further, when performing processing that applies force from above the substrate, such as polishing, to correct a fine pattern, the glass substrate region located above the gap is elastically deformed (ie, bent), and is desired. There is a problem that it becomes difficult to perform the processing.

  The present invention has been made to cope with the above-described problems, and an object of the present invention is to use a substrate support device that has a simple device configuration and that can suppress the bending of a substrate to be corrected, and the same. A pattern correction apparatus is provided.

  A substrate support apparatus according to the present invention is a substrate support apparatus for supporting a substrate whose defect is to be corrected in a pattern correction apparatus. The substrate support device is disposed apart from each other so as to form a gap into which a hand unit of the transfer device that transfers the substrate can enter, and is movable in the gap and a plurality of substages that hold the substrate. And an interpolation stage that is disposed between adjacent substages and holds the substrate.

  The substrate support apparatus of the present invention includes an interpolation stage that can move through a gap between the substages. As a result, the interpolation stage can be moved to a position where the substrate bending should be suppressed, and the substrate bending can be appropriately suppressed. For example, when performing polishing or the like on the gap, the interpolation stage moves so as to support the position corresponding to the region to be processed, thereby suppressing the bending of the substrate and facilitating the processing. be able to. Further, the above operation can be performed by a simple apparatus configuration in which a movable interpolation stage is arranged between the sub-stages. Thus, according to the substrate support device of the present invention, it is possible to provide a substrate support device that has a simple device configuration and can suppress the bending of the substrate to be corrected.

  In the substrate support apparatus, the interpolation stage may be movable in the gap so as to form a state in which the hand portion can enter the gap.

  Thus, when the substrate is carried in and out, the interpolation stage moves to a position where it does not interfere with the hand portion of the transfer device that enters the gap, so that the substrate can be easily carried in and out. On the other hand, when the pattern on the substrate is corrected, the interpolation stage moves to a position suitable for suppressing the bending of the substrate, so that the bending of the substrate can be suppressed.

  In the substrate support apparatus, the sub stage may extend along a direction in which the hand unit enters, and the interpolation stage may be movable in a direction intersecting the direction in which the hand unit enters.

  This facilitates the entry of the hand portion into the gap, and can easily achieve appropriate support of the substrate by the interpolation stage in the gap.

  The substrate support apparatus may include a plurality of interpolation stages, and the plurality of interpolation stages may be moved in conjunction with each other by being connected to each other. Thereby, position control of a plurality of interpolation stages can be easily achieved.

  In the substrate support apparatus, a plurality of interpolation stages may be arranged in the gap. As a result, the substrate can be supported by a plurality of interpolation stages in one gap. As a result, the bending of the substrate can be further reliably suppressed.

  In the substrate support apparatus, the surface of the interpolation stage that should contact the substrate may be a curved surface that is convex toward the side on which the substrate is held.

  Moreover, in the said board | substrate support apparatus, the outer peripheral part may be chamfered in the surface which should contact the board | substrate of an interpolation stage.

  Moreover, in the said board | substrate support apparatus, the friction reduction layer which reduces friction with a board | substrate may be formed so that the surface which should contact the board | substrate of an interpolation stage may be included.

  In this way, even when the interpolation stage is moved while the substrate is supported, friction between the substrate and the interpolation stage can be suppressed.

  The pattern correction apparatus according to the present invention is a pattern correction apparatus for correcting a defective portion of a fine pattern formed on a substrate. The pattern correction apparatus includes a surface plate, a substrate support device that is disposed on the surface plate and supports the substrate, and a defect correction unit that is disposed on the surface plate and corrects a defect of the substrate. The substrate support device is the substrate support device of the present invention.

  By providing the substrate support device of the present invention, according to the pattern correction device of the present invention, there is provided a pattern correction device having a simple device configuration and capable of suppressing the bending of the substrate to be corrected. be able to.

  The pattern correction device further includes an illuminating unit that is disposed between the surface plate and the substrate support device and irradiates light to the substrate, and the substage and the interpolation stage are capable of transmitting the light. Also good.

  Since the illumination unit is arranged in this way and the substage and the interpolation stage can transmit light from the illumination unit, it is easy to observe a fine pattern on the substrate.

  In the pattern correction apparatus, the sub stage and the interpolation stage may be made of resin. By employing a resin as a material for the sub stage and the interpolation stage, it is possible to easily manufacture a light sub stage and an interpolation stage that can transmit light from the illumination unit.

  As is apparent from the above description, according to the substrate support device and the pattern correction device of the present invention, the substrate configuration is simple and the substrate support device capable of suppressing the deflection of the substrate to be corrected is used. A pattern correcting device can be provided.

It is a schematic perspective view which shows the structure of a pattern correction apparatus. It is a schematic sectional drawing which shows the cross section along line segment II-II of FIG. It is a schematic plan view which shows the structure on the surface plate of a pattern correction apparatus. It is a schematic sectional drawing which shows the cross section along line segment IV-IV of FIG. It is a schematic sectional drawing for demonstrating operation | movement of an interpolation stage. It is a schematic plan view for demonstrating operation | movement of an interpolation stage. It is a schematic sectional drawing for demonstrating operation | movement of an interpolation stage. It is a schematic sectional drawing for demonstrating operation | movement of an interpolation stage. It is a schematic sectional drawing which shows the structure of the interpolation stage in a 1st modification. It is a schematic sectional drawing which shows the structure of the interpolation stage in a 2nd modification. It is a schematic sectional drawing which shows the structure of the interpolation stage in a 3rd modification. 5 is a schematic cross-sectional view showing a structure of a substrate holding device in a second embodiment. FIG. 5 is a schematic cross-sectional view showing a structure of a substrate holding device in a second embodiment. FIG. 10 is a schematic cross-sectional view showing a structure of a substrate holding device in a third embodiment. FIG. FIG. 10 is a schematic plan view showing a structure of a substrate holding device in a third embodiment. It is a schematic sectional drawing which shows the cross section which follows the line segment XVI-XVI of FIG. FIG. 10 is a schematic cross-sectional view showing a structure of a substrate holding device in a modification of the third embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following drawings, the same or corresponding parts are denoted by the same reference numerals, and description thereof will not be repeated.

(Embodiment 1)
Referring to FIG. 1, a pattern correction apparatus 1 in the present embodiment is a pattern correction apparatus for correcting a defective portion of a fine pattern formed on a substrate 3. The pattern correction device 1 is disposed on the surface plate 2, the substrate support device 4 that is disposed on the surface plate 2 and supports the substrate 3, and the defect correction unit that is disposed on the surface plate 2 and corrects a defect on the substrate 3. And. The substrate 3 is, for example, a glass substrate having a fine pattern formed on the surface. On the surface plate 2, a gantry type XY stage 5 is mounted. The XY stage 5 includes an X-axis stage 51 and a portal-type Y-axis stage 52. The Y-axis stage 52 is provided so as to straddle the substrate support apparatus 4, and the one mounted thereon can be moved in the Y-axis direction indicated by an arrow in FIG. The X-axis stage 51 is mounted on the Y-axis stage 52 and can be moved in the X-axis direction indicated by an arrow in FIG. The X-axis direction and the Y-axis direction are parallel to the main surface of the surface plate 2, and the X-axis direction is orthogonal to the Y-axis direction.

  On the X-axis stage 51, a Z-axis stage 6 that can move the one mounted thereon in the vertical direction is mounted. An observation optical system 7, a coating unit 8, and a laser 9 are mounted on the Z-axis stage 6. The observation optical system 7 includes an objective lens 10 and is used for observing a defect portion or the like on the substrate 3. The laser 9 irradiates a defect on the substrate 3 with a laser beam via the observation optical system 7, and shapes the defect shape by laser ablation, or removes the defect and the correction ink attached to the periphery of the defect. Used for.

  Then, by controlling the X-axis stage 51, the Y-axis stage 52, and the Z-axis stage 6, each of the observation optical system 7, the laser 9, and the coating unit 8 is moved above a desired position on the surface of the substrate 3. It is possible. The XY stage 5, the Z-axis stage 6, the observation optical system 7, the coating unit 8, and the laser 9 constitute a defect correction unit that corrects defects in the substrate 3.

  In the present embodiment, the case where the defect correction unit includes the application unit 8 that applies correction ink has been described. However, the defect correction unit in the pattern correction apparatus of the present invention is not limited to this, and various defect correction units may be used. Can be included.

  With reference to FIGS. 1 to 4, the substrate support device 4 is arranged apart from each other so as to form a gap 13 into which the hand unit 31 of the transfer device that transfers the substrate 3 can enter, and holds the substrate 3. And an interpolation stage 14 that is disposed between the adjacent substages 12 so as to be movable in the gap 13 and holds the substrate 3.

  Here, as shown in FIG. 2, in the substrate support device 4, the interpolation stage 14 is arranged in the gap 13 so as to form a state in which the hand unit 31 of a transfer device such as a transport robot can enter the gap 13. It may be movable. The substage 12 extends along the direction in which the hand portion 31 enters. The interpolation stage 14 may extend along the direction in which the hand unit 31 enters, intersect the direction in which the hand unit 31 enters, and be movable in the direction along the main surface of the surface plate 2. . Furthermore, as shown in FIGS. 1 to 4, when the substrate support device 4 includes a plurality of interpolation stages 14, the plurality of interpolation stages 14 may be connected to each other so as to be movable in conjunction with each other. .

  More specifically, the substrate support device 4 that holds the substrate 3 includes stages that are divided into a plurality of (four in the present embodiment) substages 12 in the X-axis direction, and adjacent substages 12. A gap 13 for inserting the hand portion 31 of the transporting device that supports and transports the substrate 3 from below is formed between them. A vacuum suction groove for fixing the substrate 3 and an air ejection groove (not shown) are formed on the upper surface (main surface opposite to the surface plate 2) of each substage 12. . An interpolation stage 14 is disposed in each gap 13. The interpolation stage 14 is fixed to a connecting plate 15, and the connecting plate 15 is supported by a linear motion bearing 16. In addition, one end of the connecting plate 15 is connected to an output shaft of a drive unit 17 that drives the connecting plate 15. As a result, a plurality of (three in the present embodiment) interpolation stages 14 can move in the X-axis direction in the gap 13 between the sub-stages 12 in conjunction with each other. As the drive unit 17, a direct acting actuator such as an air cylinder can be employed. A single-axis stage that incorporates the linear motion bearing 16 and the drive unit 17 and can be positioned may be employed.

  Next, the operation of the pattern correction apparatus 1 will be described. First, the substrate 3 to be corrected is carried into the pattern correcting device 1 while being held by the hand unit 31 of a transfer device (not shown) such as a robot. At this time, referring to FIG. 2 and FIG. 3, the interpolation stage 14 moves in conjunction with the connecting plate 15 driven by the driving unit 17, and is brought close to the sub-stage 12. As a result, the hand unit 31 entering the gap 13 does not interfere with the interpolation stage 14. Then, after the hand unit 31 holding the substrate 3 enters the gap 13 and places the substrate on the sub stage 12 and the interpolation stage 14, the hand unit 31 moves out of the gap 13. The substrate 3 placed on the substage 12 and the interpolation stage 14 is fixed to the substage 12 by reducing the pressure inside the suction groove formed on the main surface of the substage 12.

  Next, referring to FIG. 5 and FIG. 6, the interpolation stage 14 moves in conjunction with the connecting plate 15 driven by the driving unit 17, and is in a state of being located at the approximate center of the gap 13. Thereby, the area | region of the board | substrate 3 located on the clearance gap 13 is effectively supported by the interpolation stage 14, and the bending of the board | substrate 3 is suppressed. For example, when a projection defect A is found on the substrate 3 as shown in FIG. 7, the force for pressing the projection defect A is moved by moving the interpolation stage 14 to a position corresponding to the projection defect A as shown in FIG. In a state where the bending of the substrate 3 in the case of loading is suppressed, the protrusion defect A can be scraped off by bringing the polishing tape into contact with the protrusion defect A. Thereby, the correction of the projection defect A can be easily performed.

  As described above, in the substrate support device 4 and the pattern correction device 1 including the substrate support device according to the present embodiment, the interpolation stage 14 can be moved to a position where the bending of the substrate 3 should be suppressed. In addition, the bending of the substrate 3 can be suppressed. Further, in the substrate support device 4, the substrate 3 can be carried in and out by the transport device without lifting the substrate 3. Furthermore, when observing the surface of the substrate 3 with the observation optical system 7, the search range for automatic focusing (focusing) can be narrowed, so that the focusing time can be further shortened. Further, the above effect can be obtained by a simple apparatus configuration in which the movable interpolation stage 14 is arranged between the sub-stages 12. As described above, the substrate support device 4 and the pattern correction device 1 including the substrate support device according to the present embodiment have a simple device configuration and can suppress the bending of the substrate 3 to be corrected.

  Next, a modified example of the substrate support device 4 and the pattern correction device 1 provided with the same in the present embodiment will be described. In the first modification shown in FIG. 9, more specifically, so as to cover the upper surface of the interpolation stage 14 so as to include the surface to be in contact with the substrate 3 of the interpolation stage 14 (upper surface of the interpolation stage 14). A friction reducing layer 14 </ b> A for reducing friction with the substrate 3 is formed. As a material constituting the friction reducing layer 14A, for example, a polyacetal resin or a fluorine resin can be employed.

  In the second modified example shown in FIG. 10, the surface of the interpolation stage 14 that should contact the substrate 3 (the upper surface of the interpolation stage 14) is a curved surface that is convex toward the side on which the substrate 3 is held. Yes. More specifically, the upper surface of the interpolation stage 14 is an arcuate surface 14B in a cross section perpendicular to the longitudinal direction.

  In the third modified example shown in FIG. 11, the outer peripheral portion of the surface to be brought into contact with the substrate 3 of the interpolation stage 14 (the upper surface of the interpolation stage 14) is chamfered. More specifically, a chamfered portion 14 </ b> C is formed on the upper surface of the interpolation stage 14.

  By performing the modifications 1 to 3 above, even when the interpolation stage 14 is moved in a state where the substrate 3 is supported, friction between the substrate 3 and the interpolation stage is suppressed, and the back surface (fine pattern) of the substrate 3 is suppressed. The main surface on the opposite side of the surface on which the surface is formed can be prevented from being scratched. Alternatively, a groove or hole may be formed on the upper surface of the interpolation stage 14, and a gas such as air may be ejected from the groove or hole to form an air film between the interpolation stage 14 and the substrate 3. In addition, you may implement the said modification suitably combining suitably.

(Embodiment 2)
Next, Embodiment 2 which is another embodiment of the present invention will be described. The substrate support apparatus and the pattern correction apparatus including the substrate support apparatus according to the second embodiment have basically the same configuration as that of the first embodiment and have the same effects. However, the substrate support apparatus and the pattern correction apparatus in the second embodiment are different from those in the first embodiment in the configuration of the interpolation stage.

  Referring to FIG. 12, in substrate support device 4 in the second embodiment, a plurality of (two in FIG. 12) interpolation stages 141 and 142 are arranged in gap 13. Then, when the substrate 3 is carried in and out, the interpolation stages 141 and 142 are brought close to the sub-stage 12 so that the hand unit 31 of the transfer device can be inserted into the gap 13 as shown in FIG. State. More specifically, the interpolation stage 141 and the interpolation stage 142 are arranged at positions close to the sub-stage 12 so as to overlap each other.

  On the other hand, when the fine pattern on the surface of the substrate 3 is corrected, as shown in FIG. 13, the interpolation stages 141 and 142 are separated from the sub-stage 12, and the interpolation stage 141 and the interpolation stage 142 are mutually connected. Being separated. In this way, the substrate 3 can be supported by the plurality of interpolation stages 141 and 142 in one gap 13. As a result, the bending of the substrate 3 can be more reliably suppressed.

(Embodiment 3)
Next, Embodiment 3 which is still another embodiment of the present invention will be described. The substrate support apparatus and the pattern correction apparatus provided with the same in the third embodiment basically have the same configuration as that of the first embodiment and have the same effects. However, the pattern correction apparatus according to the third embodiment is different from the case of the first embodiment in that the pattern correction apparatus further includes an illumination unit that is disposed between the surface plate and the substrate support device and irradiates light onto the substrate. Is different.

  As a method for installing the illuminating unit, for example, a method in which a long fluorescent lamp is arranged so that its longitudinal direction is along the X-axis direction and the fluorescent lamp can be moved in the Y-axis direction can be considered. The following configuration is adopted. That is, referring to FIGS. 14 to 16, in pattern correction device 1 in the third embodiment, spacer 18 is arranged between surface plate 2 and substrate support device 4. And the illumination part 21 is arrange | positioned in the space between the surface plate 2 formed by arrangement | positioning of the spacer 18, and the board | substrate support apparatus 4. FIG. The illumination unit 21 is disposed on the Y-axis stage 20 that supports the illumination unit 21 so as to be movable in the Y-axis direction. The Y-axis stage 20 is disposed on an X-axis stage 19 that supports the Y-axis stage 20 so as to be movable in the X-axis direction. The substage 12 and the interpolation stage 14 can transmit light from the illumination unit 21. As a material of the sub stage 12 and the interpolation stage 14, for example, glass can be adopted. Thereby, it is avoided that the light from the illumination unit 21 is blocked by the substage 12 and the interpolation stage 14, and the fine pattern on the substrate 3 can be easily observed.

  In addition, when the edge part of the sub stage 12 or the interpolation stage 14 and the defective part on the board | substrate 3 adjoin, or the board | substrate 3 provided in the surface which touches the board | substrate 3 of the sub stage 12 or the interpolation stage 14 is adsorbed and fixed. When a groove (not shown) for this purpose and a defective portion on the substrate 3 are close to each other, the observation image by the observation optical system 7 may become dark. From a viewpoint corresponding to this, the substrate shift mechanism 22 may be installed on the substage 12. Thereby, when the observation image by the observation optical system 7 becomes dark as described above, the substrate shift mechanism 22 is used to move the substrate 3 in the horizontal direction (the direction along the main surface of the surface plate 2) by a small amount. Thus, the brightness of the observation image can be ensured.

  Further, a transparent resin (for example, acrylic) can be adopted as a material constituting the sub stage 12 and the interpolation stage 14. Thereby, the weight reduction of the board | substrate support apparatus 4 can be anticipated. Since the resin material is easily charged, a resin material with an antistatic function is selected as a material constituting the substage 12 and the interpolation stage 14, or an antistatic agent is formed on the surface after the substage 12 and the interpolation stage 14 are manufactured. Is preferably applied.

  When a resin material is used as a material for the sub stage 12 and the interpolation stage 14, the resin material may be worn when sliding with the substrate 3. From a viewpoint corresponding to this, the modification shown in FIG. 17 can be adopted. That is, with reference to FIG. 17, on the upper surface (surface to be contacted with the substrate 3) of the substage 12 and the interpolation stage 14 of the substrate support device 4 in the present modification, respectively, A glass plate 24 is arranged. Thereby, abrasion of the sub stage 12 and the interpolation stage 14 can be suppressed.

  The embodiment disclosed this time is to be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  The substrate support apparatus and the pattern correction apparatus of the present invention can be particularly advantageously applied to a substrate support apparatus for supporting a substrate having a fine pattern formed on the surface and a pattern correction apparatus including the substrate support apparatus.

  1 pattern correction device, 2 surface plate, 3 substrate, 4 substrate support device, 5 XY stage, 6 Z-axis stage, 7 observation optical system, 8 coating unit, 9 laser, 10 objective lens, 12 substage, 13 gap, 14 Interpolation stage, 14A Friction reduction layer, 14B Arc-shaped surface, 14C Chamfered part, 15 Connecting plate, 16 Linear motion bearing, 17 Drive part, 18 Spacer, 19 X-axis stage, 20 Y-axis stage, 21 Illumination part, 22 Substrate shift Mechanism, 23, 24 Glass plate, 31 Hand part, 51 X-axis stage, 52 Y-axis stage, 141, 142 Interpolation stage.

Claims (11)

A substrate support device for supporting a substrate to be corrected for defects in a pattern correction device,
A plurality of sub-stages that are disposed apart from each other so as to form a gap into which a hand unit of a transport device that transports the substrate can enter, and holds the substrate;
A substrate support apparatus comprising: an interpolation stage that is disposed between the adjacent substages so as to be movable in the gap and holds the substrate.   The substrate support apparatus according to claim 1, wherein the interpolation stage is movable in the gap so as to form a state in which the hand unit can enter the gap. The substage extends along a direction in which the hand portion enters,
The substrate support apparatus according to claim 1, wherein the interpolation stage is movable in a direction crossing a direction in which the hand unit enters. A plurality of the interpolation stages;
The substrate support apparatus according to claim 1, wherein the plurality of interpolation stages are movable in conjunction with each other by being connected to each other.   The substrate support apparatus according to claim 1, wherein a plurality of the interpolation stages are arranged in the gap.   The substrate support apparatus according to claim 1, wherein a surface of the interpolation stage that is to contact the substrate is a curved surface that is convex toward a side on which the substrate is held.   The substrate support apparatus according to claim 1, wherein an outer peripheral portion of the surface to be brought into contact with the substrate of the interpolation stage is chamfered.   The substrate support apparatus according to claim 1, wherein a friction reduction layer that reduces friction with the substrate is formed so as to include a surface that should contact the substrate of the interpolation stage. A pattern correction apparatus for correcting a defective portion of a fine pattern formed on a substrate,
A surface plate,
A substrate support device disposed on the surface plate and supporting the substrate;
A defect correcting unit disposed on the surface plate and correcting a defect of the substrate;
The said board | substrate support apparatus is a pattern correction apparatus which is a board | substrate support apparatus of any one of Claims 1-8. An illumination unit that is disposed between the surface plate and the substrate support device and irradiates light to the substrate;
The pattern correction apparatus according to claim 9, wherein the substage and the interpolation stage are capable of transmitting the light.   The pattern correction apparatus according to claim 9, wherein the sub stage and the interpolation stage are made of resin.

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