JP2013123721A - Defect correcting device, defect correcting method, and defect correcting program - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a defect correcting device, a defect correcting method, and a defect correcting program, by which a defect is accurately corrected regardless of the size of the defect.SOLUTION: The defect correcting device is provided with: a stage, on which a substrate is placed, and which is movable relatively to an image picking-up part, on a plane that is parallel to the surface of the substrate; a stage controlling part for controlling movement of the stage and moving the stage to a position shifted, by a distance corresponding to the predetermined number of pixels, from a defect correcting position where correction treatment is executed; a matching part for comparing a first picking-up image, which is picked-up at a first picking-up position shifted from the defect correcting position through stage movement operated by the stage controlling part, with a reference image; a mask making part for making, based on judgment of the matching part, a mask image with a mask part, which corresponds to a non-laser-irradiation area, from the reference image; and a beam flux shaping means for shaping the cross-sectional shape of the beam flux of a laser beam emitted from a laser beam source into a shape that corresponds to the mask image.

Description

  The present invention relates to a defect correction apparatus, a defect correction method, and a defect correction program for repairing a patterning error (defect) generated during a patterning process on various substrates.

  Conventionally, in the manufacture of various substrates such as a liquid crystal display (LCD), a PDP (Plasma Display Panel), an organic EL (ElectroLuminescence) display, an FPD (Flat Panel Display) substrate, a semiconductor wafer, and a printed circuit board. In order to improve the yield, after each patterning process, it is sequentially inspected whether or not there is a patterning error (defect) such as a short circuit, a connection failure, a disconnection or a pattern failure. If there is a defect as a result of this inspection, the error portion is corrected at any time.

  As a technique for correcting the above-described defect, there is a technique called so-called laser repair in which a defect portion is corrected by irradiating a laser beam (see, for example, Patent Document 1). In the defect correction method disclosed in Patent Document 1, a pattern image of a workpiece is compared with a normal pattern image to detect a pattern defect, and a workpiece pattern obtained from the normal pattern is generated. The defect is corrected by shaping the cross-sectional shape of the laser beam according to the pattern using a micromirror array (laser beam shaping means) such as the above and irradiating the workpiece with the laser beam. According to this defect correcting method, it is possible to remove not only the above-described defects but also foreign matters such as particles and resists attached to the substrate surface.

JP 2009-262191 A

  By the way, in the conventional defect correction method disclosed in Patent Document 1, the substrate surface after the patterning process is imaged, and a pattern image (inspected image) obtained thereby and an image of a normal pattern image obtained in advance are imaged. By comparing by processing, the existence area of the defect on the substrate surface is specified. However, if there is a defect that covers most of the imaging field, a matching score indicating the matching ratio (degree of matching) is lowered when pattern matching of the image to be inspected with a normal pattern image is performed. . As a result, there is a problem in that the pattern of the image to be inspected cannot be matched with the normal pattern image, accurate alignment cannot be performed, and information on the normal pattern in the image to be inspected cannot be obtained.

  The present invention has been made in view of the above problems, and provides a defect correction apparatus, a defect correction method, and a defect correction program capable of accurately correcting a defect regardless of the size of the defect. Objective.

  In order to solve the above-described problems and achieve the object, the defect correction apparatus according to the present invention acquires an enlarged image of a part of a substrate on which a pattern in which the same picture elements are arranged periodically is formed. A defect correction apparatus that includes an imaging unit and irradiates a laser beam on the substrate using an image acquired by the imaging unit to correct a defect on the substrate, and places the substrate And a stage movable on a plane parallel to the plate surface of the substrate, and a position moved by a distance corresponding to a predetermined number of picture elements from the defect correction position for performing the correction process while controlling the movement of the stage. A stage control unit that moves the stage, and a reference image that is compared with a first captured image captured at a first imaging position moved from the defect correction position by the stage movement by the stage control unit. Based on a comparison result by the matching unit and the matching unit, a mask image having a mask unit corresponding to a non-laser irradiation area on the substrate is generated based on the reference image, and a laser light source And a light beam shaping means for shaping the beam beam cross-sectional shape of the laser light into a shape corresponding to the mask image.

  In the defect correction device according to the present invention, in the above invention, the matching unit includes a first captured image captured at the first imaging position moved by the stage movement by the stage control unit, and the reference image. And a control unit that determines whether or not the fitness is smaller than a preset threshold value, and the stage control unit has the fitness determined by the controller. When it is determined that the threshold is equal to or less than the threshold, the stage is moved from the first imaging position to a position moved by a distance corresponding to a predetermined number of picture elements, and the matching unit moves the stage by the stage control unit. The second captured image captured at the second imaging position moved from one imaging position is compared with the reference image.

  In the defect correction apparatus according to the present invention, in the above invention, the stage control unit moves the stage to the defect correction position when the control unit determines that the fitness is greater than the threshold value. The matching unit includes a third captured image captured at the defect correction position moved from the first or second imaging position by the stage movement by the stage control unit, and the first or second captured image. In comparison, the shift amount of the pattern between the first or second captured image and the third captured image is calculated, and the mask generation unit applies the shift amount to the generated mask image. The mask image is shifted based on the above.

  Further, in the defect correction apparatus according to the present invention, in the above invention, the mask generation unit is configured to reduce the laser irradiation region by forming the mask portion larger than a distance between outer edges of the non-laser irradiation region. It is characterized by performing processing.

  The defect correcting method according to the present invention acquires an image obtained by enlarging a part of a substrate on which a pattern in which the same picture elements are periodically arranged is formed by an imaging unit, and the image acquired by the imaging unit is obtained. A defect correction method for correcting a defect on the substrate by irradiating the substrate with a laser beam, wherein the defect is moved by a distance corresponding to a predetermined number of picture elements from the defect correction position for performing the correction process. A stage moving step for moving the stage to a position, and a matching step for comparing the first captured image captured at the first imaging position moved from the defect correction position by the stage movement by the stage moving step with a reference image. A mask image having a mask portion corresponding to a non-laser irradiation region on the substrate based on the comparison result of the matching step, A mask generation step of generating, based on the irradiation image, characterized in that it comprises a beam shaping step of shaping the laser light of the light flux cross-sectional shape of the laser light source into a shape corresponding to the mask image.

  Further, the defect correction program according to the present invention acquires an image obtained by enlarging a part of a substrate on which a pattern in which the same picture elements are periodically arranged is formed by an imaging unit, and the image acquired by the imaging unit is acquired. A defect correction program for causing a computer to execute a correction process for defects on the substrate by irradiating the substrate with a laser beam, according to a predetermined number of picture elements from a defect correction position for performing the correction process A stage moving procedure for moving the stage to a position moved by a predetermined distance, and a first captured image and a reference image captured at the first imaging position moved from the defect correction position by the stage movement by the stage moving procedure. Based on a matching procedure to be compared and a comparison result by the matching procedure, a mask portion corresponding to a non-laser irradiation region on the substrate is provided. A mask generation procedure for generating a mask image based on the reference image, and a light beam shaping step for shaping a light beam cross-sectional shape of a laser beam from a laser light source into a shape corresponding to the mask image. And

  According to the present invention, when a defect exists so as to cover the visual field area and pattern matching using an image at the defect correction position is difficult, matching is performed using a captured image at a position away from the defect correction position by a predetermined pixel. Since the mask image is generated based on the matching result after processing, the defect can be corrected accurately regardless of the size of the defect.

FIG. 1 is a conceptual diagram for explaining an outline of a defect tracking method incorporated in a defect correction apparatus according to Embodiment 1 of the present invention. FIG. 2 is a block diagram showing a schematic configuration of the defect correction apparatus according to Embodiment 1 of the present invention. FIG. 3 is a flowchart showing a schematic flow of mask generation processing in the defect correction method according to Embodiment 1 of the present invention. FIG. 4 is a schematic diagram illustrating an example of a reference image stored in the storage unit of the defect correction apparatus according to the first embodiment of the present invention. FIG. 5 is a schematic diagram showing a mask image generated based on the reference image shown in FIG. FIG. 6 is a schematic diagram illustrating an example of a field area of the laser processing objective lens of the defect correcting apparatus according to the first embodiment of the present invention. FIG. 7 is a schematic diagram illustrating an example of a reference image stored in the storage unit of the defect correction apparatus according to the first embodiment of the present invention. FIG. 8 is a schematic diagram showing a mask image generated based on the reference image shown in FIG. FIG. 9 is a flowchart showing a schematic flow of mask generation processing in the defect correction method according to the second embodiment of the present invention. FIG. 10 is a flowchart showing a schematic flow of mask generation processing in the defect correction method according to Embodiment 3 of the present invention. FIG. 11 is a schematic diagram illustrating an example of a reference image stored in the storage unit of the defect correction apparatus according to the third embodiment of the present invention. FIG. 12 is a schematic diagram showing a mask image generated based on the reference image shown in FIG.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the drawings. In addition, this invention is not limited by the following embodiment. The drawings referred to in the following description only schematically show the shape, size, and positional relationship so that the contents of the present invention can be understood. That is, the present invention is not limited only to the shape, size, and positional relationship illustrated in each drawing.

(Embodiment 1)
Hereinafter, a defect correction apparatus, a defect correction method, and a defect correction program according to Embodiment 1 of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a conceptual diagram for explaining an outline of a defect tracking method incorporated in the defect correction apparatus 100 (see FIG. 2) according to the first embodiment. In the first embodiment, defect coordinates specified by an external inspection unit such as an AOI (Automated Optical Inspection) system are input to the defect correction apparatus 100. Hereinafter, in this description, a patterning error or a foreign matter such as a particle or a resist adhering to the substrate surface is simply referred to as a defect. In order to distinguish this coordinate from other coordinates, it is called a defect coordinate. One defect coordinate is given to one defect. In the following description, the coordinate is 2 on the workpiece surface or the stage upper surface where the origin is the reference position provided on the upper surface of the stage on which the substrate (hereinafter referred to as a workpiece) is placed or the casing that supports the stage. Dimensional coordinates.

  In the defect correction method executed by the defect correction apparatus 100 according to the first embodiment, as shown in FIG. 1A, first, a work is based on the input defect coordinates on the surface of a repair target substrate (hereinafter referred to as a work). And the stage 116 is controlled so that the defect appears in the visual field region R1 of the microscope unit in the defect correcting apparatus 100. Subsequently, the microscope unit analyzes the image obtained by imaging the visual field region R1 of the objective lens M15, thereby specifying the region (recognition defect region) D1 of the defect D contained in the image. However, the region to be analyzed may be a specific recognition region R2 smaller than the visual field region R1 corresponding to the entire image, not the entire image. A plurality of recognition regions R2 may be set in the visual field region R1.

  In the microscope section according to the first embodiment, as the objective lens M15, for example, an objective lens having a relatively low magnification (hereinafter referred to as “low-magnification objective lens”) of 1 ×, 2 ×, and 5 ×, and 10 × At least one objective lens (hereinafter referred to as “high magnification objective lens”) having a high magnification with respect to the magnification of the low magnification objective lens of 20 × or 50 × is mounted on the revolver, and the objective lens can be switched. is there. The magnification of the low-magnification objective lens and the high-magnification objective lens is an example, and it is sufficient that the high-magnification objective lens is higher than the low-magnification objective lens. Further, the objective lens M15 at this time (field of view region R1) is a low-magnification objective lens.

  Further, in this defect correction method, the coordinates of the center of gravity C1 of the recognized defect area D1 specified above are specified (see FIG. 1A), and subsequently, outside the visual field area R1 (or recognition area R2) of the defect D. A tracking process S1 for tracking a portion extending to (unrecognized defect area D2) is executed. In the first embodiment, as the tracking process S1, as shown in FIG. 1B, the center of gravity C1 specified in FIG. 1A is drawn into the center of the visual field region R1 by the microscope unit of the defect correction apparatus 100. Take the case of performing as an example. As shown in FIG. 1 (b), at least part or all of the non-recognized defect area D2 outside the visual field area R1 of the defect D is drawn into the visual field area R1 due to this pull-in. Laser repair for the part becomes possible. However, this tracking process S1 may be executed only when, for example, the calculated coordinates of the center of gravity C1 are included near the outer end of the recognition region R2, that is, within the recognition region R2 and other than the center region R3.

  Subsequently, in this defect correction method, as shown in FIG. 1C, the recognition defect region D1a included in the image obtained by imaging the visual field region R1 after being pulled in is specified, and this recognition defect region A repair coordinate calculation process S2 for calculating center coordinates (repair coordinates) c1 to c5 of one or more shot areas (correction areas) p1 to p5 allocated to D1a is executed.

  Next, the objective lens M15 is switched to a high-magnification objective lens (laser processing objective lens), the stage 116 is sequentially moved to the center coordinates (repair coordinates) c1 to c5 of the shot areas (correction areas) p1 to p5, and centered. The unit captures an image in the field of view of the laser processing objective lens. The microscope unit creates a mask image by matching the captured image to be inspected with a reference image stored in the storage unit 107 in advance as a recipe.

  Thereafter, the control unit 101 sequentially drives the two-dimensional modulation element 123 (DMD 123) based on the obtained mask image according to the calculated repair coordinates c1 to c5 as shown in FIG. By performing laser irradiation on D, a repair process S3 for repairing a defective portion on the workpiece surface is executed.

  According to the operation as described above, in the first embodiment, even if the defect D is outside the visual field region R1, the portion of the defect D outside the visual field region R1 is drawn into the visual field region R1 and then the defect D is removed. The shot areas p1 to p5 (repair coordinates c1 to c5) can be allocated. As a result, even when the entire defect D cannot be captured by one imaging, it becomes possible to continuously irradiate the entire defect D with a laser, resulting in an increase in the number of strokes and a redundant work time. It is possible to repair the entire defect D while suppressing it.

  Next, the defect correction apparatus 100 according to the first embodiment will be described in detail with reference to the drawings. FIG. 2 is a block diagram showing a schematic configuration of the defect correction apparatus according to the first embodiment. As shown in FIG. 2, the defect correction apparatus 100 includes a stage 116 that can move in the XY plane, a stage control unit 104 that controls the horizontal movement of the stage 116, and a work W10 placed on the stage 116. A microscope unit 110 for observing the image from above, a laser repair head 120 for outputting a laser beam for defect repair irradiated on the workpiece W10, and image processing for executing various image processes on image data acquired by the microscope unit 110 Unit 102, storage unit 107 for storing various programs including a defect correction program that is a program for realizing the defect correction method according to the first embodiment, various parameters, and the like, and executing various programs and parameters read from storage unit 107 As a result, the defect tracking method according to the first embodiment is realized and the defect correcting apparatus 100 The control unit 101 that controls each unit, and the light beam cross-sectional shape of the laser beam for defect repair output by the laser repair head 120 under the control of the control unit 101 (the cross-sectional shape perpendicular to the optical axis of the laser light) are adjusted An area setting unit 103, a display unit 105 that displays images and various information acquired by the microscope unit 110, and a user interface including an input unit 106 that allows a user to input various operations and settings to the defect correction apparatus 100. . It should be noted that the stage 116 may be configured not only to be movable in the XY plane, but also to be configured so that the microscope 110 is movable in the XY plane. Any configuration may be employed as long as 110 is configured to scan the workpiece W10.

  In the above configuration, the work W10 to be repaired is an FPD glass substrate, a semiconductor substrate, a printed circuit board, or the like on which a predetermined pattern is formed. The workpiece W10 is placed on the stage 116. Innumerable holes are provided on the mounting surface of the stage 116. These countless holes are held on the stage 116 by a fixing member (not shown) in a state where the workpiece W10 is floated by a gas supplied from a pump (not shown). Alternatively, the infinite number of holes can be connected to a vacuum pump (not shown), and the work W10 placed on the stage 116 can be sucked and fixed to the stage 116 by suction from the infinite number of holes. is there. Further, as the holding means for holding the workpiece W10 on the stage 116 as described above, a configuration of a roller stage that holds the substrate movably by a plurality of rotating rollers other than the above may be adopted. Furthermore, it is good also as a structure which supports a board | substrate using mechanical means, such as a support pin and a clamp mechanism. In addition, the workpiece | work W10 concerning this Embodiment 1 is demonstrated as a glass substrate (TFT substrate) for FPD in which the same pattern is formed periodically. In this work W10, a plurality of TFT picture elements (sub-pixels constituting a pixel) functioning as a switching circuit, wiring patterns, and the like are periodically formed.

  The microscope unit 110 includes a light source 112 that illuminates the workpiece W10 on the stage 116, and an imaging element 111 such as a CCD sensor or a CMOS sensor that images the illuminated workpiece W10, and a part of the workpiece W10 that is a target substrate. It functions as an imaging unit that acquires an enlarged image. Illumination light output from the light source 112 of the microscope unit 110 passes through the relay lens M16 and is reflected by the half mirror M14, and then passes through the objective lens M15 as light coaxial with the observation optical axis AX with respect to the work W10. Illuminate. Further, the image of the workpiece W10 illuminated in this way is imaged by the observation optical system including the objective lens M15, the half mirror M14, the relay lens M13, and the imaging lens M12 arranged along the observation optical axis AX. For example, the image is magnified several times to several tens of times on the light receiving surface 111. Note that the field of view of the image sensor 111 through this observation optical system corresponds to the field of view R1 shown in FIG. This visual field region R1 is wider than one shot region. Furthermore, the area illuminated by the light source 112 is at least wider than the visual field area R1. Furthermore, at least the visual field region R1 is illuminated substantially uniformly from above by illumination light from the light source 112.

  Image data acquired by the image sensor 111 is input to the image processing unit 102. The image processing unit 102 performs various types of image processing on the input image data, and then inputs the processed image data to the display unit 105. Thereby, the image of the visual field region R1 acquired by the microscope unit 110 is displayed on the display unit 105, for example, in substantially real time. In addition, the image processing unit 102 performs a matching process using an image acquired by the image sensor 111 and a reference image (specimen pattern image) stored in the storage unit 107, and a comparison by the matching unit 102a. Based on the result, a mask generation unit 102b that generates a mask image having a mask portion corresponding to the non-laser irradiation area in the workpiece W10 based on the reference image is provided.

  Further, the stage control unit 104 controls the coordinates (predetermined position coordinates such as defect coordinates, barycentric coordinates, and repair coordinates) input from the control unit 101 under the control of the control unit 101 in the visual field region R1 of the microscope unit 110. The stage 116 is horizontally moved so as to be positioned at the center. Accordingly, the relative position between the microscope unit 110 and the workpiece W10 is controlled so that the coordinates (defect coordinates, barycentric coordinates, repair coordinates, etc.) input from the control unit 101 are positioned at the center in the visual field region R1 of the microscope unit 110. Is done.

  The laser repair head 120 outputs a laser light source 121 that outputs a laser beam (hereinafter referred to as a repair laser beam) applied to the workpiece W10, and a light beam sectional shape (hereinafter referred to as a laser sectional shape) of the laser light from the laser light source 121. In order to adjust the fine mirror array 123, which is a spatial light modulator, as a light beam shaping means for shaping into a desired shape (a shape corresponding to a mask image described later), the repair laser beam from the laser light source 121, and the field of view of the observation optical system. LED 122 that outputs the light (hereinafter referred to as guide light), and functions as a laser irradiation unit that irradiates the workpiece W10 with laser light spatially modulated for defect repair based on the image acquired by the microscope unit 110. The guide light from the LED 122 is reflected by the half mirror M <b> 21 so that its optical axis coincides with the optical axis of the laser light source 121. The optical axes of the repair laser light from the laser light source 121 and the guide light from the LED 122 are reflected by the half mirror M24 after passing through the high reflection mirror M22, the micromirror array 123, and the high reflection mirror M23. The optical axis coincides with the observation optical axis AX. Therefore, the repair laser light and the guide light reflected by the half mirror M24 are irradiated from above onto the workpiece W10 on the stage 116 along the observation optical axis AX via the relay lens M13, the half mirror M14, and the objective lens M15. . For the micromirror array 123, for example, DMD (Digital Micromirror Device) may be used. In addition, other MEMS devices or other devices such as a transmissive spatial modulation element such as a liquid crystal shutter can be substituted for the light beam shaping means. When such other devices are employed, the above optical system is configured using appropriate arrangements and members according to the optical conditions in light of technical common sense in this field. In addition, since said LED122 is used in order to confirm and adjust the irradiation position of repair laser beam with guide light, you may abbreviate | omit it as needed.

  Note that the micromirror array 123 that is a spatial light modulator has a configuration in which micromirrors that are one of microdevices are arranged in a two-dimensional array, for example. The reflection angle of each micromirror can be switched to at least one of an on angle and an off angle under the control of the control unit 101. The on-angle is an angle at which the repair laser beam reflected by the micromirror in this state is projected onto the work W10 on the stage 116, and the off-angle is a repair laser reflected by the micromirror in this state. This is an angle at which light is irradiated to a laser damper (not shown) such as a light shielding member or an absorption member (not shown) provided outside the optical path as unnecessary light. Therefore, the cross-sectional shape of the repair laser beam projected onto the workpiece W10 can be controlled by switching the reflection angle of each of the micromirrors arranged in a two-dimensional array to either the on angle or the off angle. It is. Switching between the on angle and the off angle is controlled based on a mask image to be described later. Thereby, it becomes possible to adjust the cross-sectional shape of the repair laser beam from the laser light source 121 to the shape of the repair pattern and to irradiate the workpiece W10. This repair pattern is a repair pattern that irradiates a repair laser beam in addition to the normal wiring pattern. For example, when repairing a defect such as a defective pattern removal, a minute pattern corresponding to a normal wiring area in the shot area is used. The pattern is such that the mirror is turned off and the micromirrors corresponding to other regions are turned on.

  The setting of the repair pattern may be set in accordance with the defect shape in addition to the setting according to the normal wiring pattern as described above. In this case, the cross-sectional shape of the repair laser beam is adjusted to the defect shape, the minute mirror corresponding to the defect region is set to the on angle, and the minute mirror corresponding to the region other than the defect region is set to the off angle.

  The region setting unit 103 controls the reflection angle of the micromirrors of the micromirror array 123 according to the repaired part pattern (mask image) input from the control unit 101, thereby changing the cross-sectional shape of the repair laser beam to the repair pattern. Control to shape.

  Further, as described above, the control unit 101 executes the various programs and parameters read from the storage unit 107, thereby realizing the defect correction method according to the first embodiment and controlling each unit in the defect correction apparatus 100. . Here, mask generation processing in the defect correction method executed by the control unit 101 will be described in detail with reference to the drawings. FIG. 3 is a flowchart showing a schematic flow of mask generation processing in the defect correction method according to the first embodiment. In the following description, it is assumed that each unit is operating under the control of the control unit 101.

  First, the control unit 101 causes the CCD 111 to capture an image (first image) in the field of the objective lens for laser processing using the objective lens M15 as the objective lens for laser processing (high magnification objective lens) (step S101). Thereafter, the matching unit 102a performs matching processing (first matching) using the first image and the reference image (specimen pattern image) stored in the storage unit 107 (step S102). In the matching process, a matching score, which is a degree of matching (matching degree, matching ratio) between the captured image and the sample pattern image, is calculated based on the ratio of the white area in the image.

  Here, when the matching unit 102a determines that the matching score between the first image and the reference image stored in the storage unit 107 is greater than the threshold (step S103: Yes), the mask generation unit 102b performs the first matching. A mask image is generated based on the reference image used in step S104.

  FIG. 4 is a schematic diagram illustrating an example of a reference image stored in the storage unit 107 of the defect correction apparatus 100 according to the first embodiment. FIG. 5 is a schematic diagram showing a mask image generated based on the reference image shown in FIG. In the reference image shown in FIG. 4, when the shot region Sh1 that is the laser irradiation region and the pattern portion P1 of the wiring pattern that is the non-irradiation region are formed, the mask generation unit 102b uses the laser beam as shown in FIG. A non-transmissive portion including a TFT, a wiring pattern, and the like, which are a transmissive portion Tr1 that transmits light (a region controlled to an on angle) and a region that does not transmit laser light (a region controlled to an off angle) according to the shot region Sh1 By forming Sn1 (mask part), a mask image Ms1 is generated. In the first embodiment, for example, it is assumed that the same picture element is periodically arranged with a pattern in a region surrounded by a broken line E shown in FIG. 4 as one picture element.

  FIG. 6 is a schematic diagram illustrating an example of the visual field region R4 of the laser processing objective lens of the defect correction apparatus 100 according to the first embodiment. In step S103, as shown in FIG. 6, when the defect D exists so as to cover the pattern P2 of the visual field region R4, the matching score becomes small or the matching is impossible (for example, the matching score is 0). When the matching unit 102 a determines that the matching score between the first image and the reference image stored in the storage unit 107 is equal to or less than the threshold (No in step S <b> 103), the control unit 101 instructs the stage control unit 104. Then, an instruction to move the stage 116 to a position moved by a distance corresponding to a predetermined number of picture elements in a periodic picture element on the work W (a distance corresponding to a predetermined picture element) is issued (step S105). Here, the distance for the predetermined picture element is determined by multiplying the predetermined number of picture elements and the picture element size.

  When the stage 116 moves to a position moved by a distance corresponding to a predetermined number of picture elements, the same picture elements are periodically arranged, so that the first image is in the field of view of the laser processing objective lens (objective lens M15). The same pattern portion as the first image in different picture elements will be arranged. The control unit 101 instructs the CCD 111 to image a pattern portion substantially the same as the first image in the different picture elements as a second image (first captured image) (step S106).

  Thereafter, the matching unit 102a performs a matching process (second matching) using the second image and the reference image stored in the storage unit 107 (step S107). Here, when the matching unit 102a determines that the matching score between the second image and the reference image stored in the storage unit 107 is larger than the threshold value (step S108: Yes), the stage control unit 104 determines that the objective lens M15 is used. The stage 116 is moved so that is positioned at the original coordinates (defect correction position) (step S109).

  When the stage 116 moves to the defect correction position, the control unit 101 instructs the CCD 111 to capture an image in the laser processing objective lens field of view at this position as a third image (third captured image) (step S110). . Here, the third image is an image captured at substantially the same position as the first image.

  After acquiring the third image in step S110, the matching unit 102a performs a matching process (third matching) using the second image and the third image (step S111). In the third matching, a shift (shift amount) between the second image matched with the reference image for creating the mask image and the third image at the original position is calculated. The shift amount obtained by the third matching is theoretically 0 because the pattern in the second image matches the pattern in the third image, but there is a shift in the pattern between images due to the movement accuracy of the stage 116 or the like. This is to correct in the event of a failure.

  When the third matching by the matching unit 102a is completed, the mask generation unit 102b generates a mask image based on the reference image used in the second matching (step S112). When the mask image is obtained in step S112, the mask generation unit 102b shifts the mask image by the obtained shift amount based on the result of the third matching (step S113).

  On the other hand, when the matching unit 102a determines in step S108 that the matching score between the second image and the reference image stored in the storage unit 107 is equal to or less than the threshold value (step S108: No), the control unit 101 It is determined whether or not the number of matching times for the second matching exceeds a predetermined number (step S114).

  Here, when the control unit 101 determines that the number of matching times for the second matching does not exceed the predetermined number of times (step S114: Yes), the control unit 101 proceeds to step S105 and further determines a predetermined number of picture elements. The stage 116 is moved to a position moved by a distance corresponding to the distance (a distance corresponding to a predetermined picture element), and the above-described processing is repeated with the captured image (second captured image) at the moved position as the second image. The predetermined picture element at this time may be one in which a predetermined value is sequentially added from the original picture element (the picture element at the defect correction position), or an integer of 1 or more as a predetermined value to the picture element before movement. May be added.

  On the other hand, when the control unit 101 determines that the number of matching times for the second matching exceeds the predetermined number (step S114: No), the control unit 101 proceeds to step S115 to indicate that a matching error has occurred. The notification process is performed. This notification process may display a matching error on the display screen of the display unit 105, or may notify using sound or light.

  Even if the defect D exists so as to cover the visual field region and the pattern matching using the image at the defect correction position is difficult by the mask generation processing described above, a mask image corresponding to the defect correction position is generated. It becomes possible. That is, according to the present invention, an image obtained by enlarging a part of a substrate on which a pattern in which the same picture elements are periodically arranged is formed is acquired by the imaging unit, and the image acquired by the imaging unit is used for the substrate. This is a defect correction method for correcting a defect on a substrate by irradiating a laser beam. The stage is moved to a position moved by a distance corresponding to a predetermined number of picture elements from a defect correction position to be corrected (stage moving step) : S105), the first captured image is acquired at the first imaging position moved from the defect correction position by moving the stage (S106), and then the first captured image is compared with the reference image (matching step: S107). Then, based on the matching score determination (S108), a mask image having a mask portion corresponding to the non-laser irradiation region on the substrate is generated based on the reference image (mask generation). Step: S112) The beam cross-sectional shape of the laser light from the laser light source is shaped into a shape corresponding to the mask image (light beam shaping step), and the defect correction target is irradiated with the laser light to correct the defect. Not all steps in FIG. 3 are required as a technical solution of the invention.

  FIG. 7 is a schematic diagram illustrating an example of the reference image Rf2 stored in the storage unit 107 of the defect correction apparatus 100 according to the first embodiment. FIG. 8 is a schematic diagram showing a mask image Ms2 generated based on the reference image shown in FIG. When the contact hole H is formed with a period of three picture elements as in the reference image Rf2 shown in FIG. 7, the predetermined picture element setting in step S105 in the flowchart of FIG. 3 is set to three picture elements. As in the mask image Ms2 shown in FIG. 8, the non-transparent portion Sn2 (mask portion) corresponding to the contact hole H can be formed without causing a picture element shift.

  According to the first embodiment described above, when the defect D exists so as to cover the visual field region, and pattern matching using an image at the defect correction position is difficult, the distance corresponding to a predetermined number of picture elements from the defect correction position Since the matching process is performed using the captured image of the position that has been moved, and the mask image is generated based on the matching result, accurate defect correction can be performed regardless of the size of the defect. It is.

(Embodiment 2)
FIG. 9 is a flowchart showing a schematic flow of mask generation processing in the defect correction method according to the second embodiment. In the following description, it is assumed that each unit is operating under the control of the control unit 101. In the second embodiment, the mask image is generated by moving from the defect correction position to a position where it is known in advance that there is no defect.

  First, the stage control unit 104 moves the stage 116 to a position corresponding to the set picture element from the defect correction position (step S201). After the stage 116 is moved, an image (first image) in the field of view of the laser processing objective lens is picked up by the CCD 111 using the objective lens M15 as the laser processing objective lens (high magnification objective lens) (step S202).

  Here, in step S201, for example, the control unit 101 acquires, from the defect information stored in the storage unit 107, position information where an adjacent defect-free region or a defect region with a small defect area exists, and the position information. By setting the destination picture element based on the above, the stage control unit 104 moves the stage 116 to the set destination picture element position. The destination picture element may be a picture element that is closest to the defect position, or a picture element that has no defect is set as the destination picture element. , It is possible to move to this set picture element every time. Further, when the contact hole H is formed with a period of several picture elements in the work W10 as in the reference image Rf2 shown in FIG. 7, it is preferable to take this period into consideration.

  Thereafter, the matching unit 102a performs matching processing (first matching) using the first image and the reference image (specimen pattern image) stored in the storage unit 107 (step S203). After the matching process, the stage control unit 104 moves the stage 116 to the original coordinates (defect correction position) (step S204).

  After moving the stage 116 in step S204, the CCD 111 is caused to capture an image (second image) in the laser processing objective lens field of view using the objective lens M15 as the laser processing objective lens (high magnification objective lens) (step S205).

  When the second image is acquired in step S205, the matching unit 102a performs a matching process (second matching) using the first image and the second image (step S206). This second matching corresponds to the above-described third matching, and calculates a shift (shift amount) between the first image matched with the reference image for creating the mask image and the second image at the original position.

  When the second matching by the matching unit 102a is completed, the mask generating unit 102b generates a mask image based on the reference image used in the first matching (step S207). When the mask image is obtained in step S207, the mask generation unit 102b shifts the mask image by the obtained shift amount based on the result of the second matching (step S208).

  Even if the defect D exists so as to cover the visual field region and the pattern matching using the image at the defect correction position is difficult by the mask generation processing described above, a mask image corresponding to the defect correction position is generated. It becomes possible.

  According to the above-described second embodiment, as in the first embodiment, when the defect D exists so as to cover the visual field region and pattern matching using an image at the defect correction position is difficult, a predetermined value is determined from the defect correction position. Since the matching process was performed using the captured image at the position where the number of picture elements was separated, and the mask image was generated based on the matching result, accurate defect correction was performed regardless of the size of the defect. It is possible.

  Further, according to the second embodiment, since the defect correction position is moved to the position where the adjacent defect-free region or the defect region with a small defect area exists, the process of step S114 in the first embodiment described above is performed. Since it is not necessary to perform such repeated processing, the processing can be simplified and the processing time can be shortened.

(Embodiment 3)
FIG. 10 is a flowchart showing a schematic flow of mask generation processing in the defect correction method according to the third embodiment. In the following description, it is assumed that each unit is operating under the control of the control unit 101. In the third embodiment, the mask image is generated by moving from the defect correction position to a position where it is known in advance that there is no defect.

  First, the stage control unit 104 moves the distance stage 116 corresponding to the picture element set from the defect correction position (step S301). After the stage 116 is moved, an image (substrate image) in the laser processing objective lens field of view is picked up by the CCD 111 using the objective lens M15 as the laser processing objective lens (high magnification objective lens) (step S302).

  Here, in step S301, as in step S201 described above, for example, the control unit 101 determines, based on the defect information stored in the storage unit 107, position information where there is an adjacent defect-free region or a defect region with a small defect area. And the stage control unit 104 moves the stage 116 to the set position of the destination picture element by setting the destination picture element based on the position information. The destination picture element may be a picture element that is closest to the defect position, or a picture element that has no defect is set as the destination picture element. , It is possible to move to this set picture element every time. Further, when the contact hole H is formed with a period of several picture elements in the work W10 as in the reference image Rf2 shown in FIG. 7, it is preferable to take this period into consideration.

  Thereafter, the matching unit 102a performs a matching process using the substrate image and the reference image (specimen pattern image) stored in the storage unit 107 (step S303). When the matching process by the matching unit 102a is completed, the mask generation unit 102b generates a mask image based on the reference image used in the matching in step S303 (step S304).

  When a mask image is obtained in step S304, the mask generation unit 102b performs an erosion process on the generated mask image (step S305). In this erosion process, when the shot region Sh2 that is the laser irradiation region and the pattern portion P3 that is the non-irradiation region are formed in the reference image Rf3 as shown in FIG. 11, the mask generation unit 102b is shown in FIG. As described above, the non-transparent portion Sn3 (mask portion), which is a region through which laser light is not transmitted (region controlled to an off angle), is formed to be larger than the width of the pattern portion P3 (see the broken line in FIG. 12), and transmits the laser light. The mask image Ms3 is generated by reducing the transmissive portion Tr2 (region controlled by the ON angle) to be smaller than the shot region Sh2.

  Even if the defect D exists so as to cover the visual field region and the pattern matching using the image at the defect correction position is difficult by the mask generation processing described above, a mask image corresponding to the defect correction position is generated. It becomes possible. The area setting unit 103 uses the mask image Ms3 to control the reflection angle of the micromirrors of the micromirror array 123 described above, thereby controlling the cross-sectional shape of the repair laser beam to the shape of the repair pattern. W10 is irradiated with repair laser light.

  According to the above-described third embodiment, as in the first embodiment, when there is a defect D so as to cover the visual field region and pattern matching using an image at the defect correction position is difficult, a predetermined value is determined from this defect correction position. Since the matching process was performed using the captured image at the position where the number of picture elements was separated, and the mask image was generated based on the matching result, accurate defect correction was performed regardless of the size of the defect. It is possible.

  Further, according to the third embodiment, the non-transparent portion Sn3 that is a region where the laser light is not transmitted (region controlled to an off angle) is formed to be larger than the width of the pattern portion P3, and the transparent portion that transmits the laser light. Since Tr2 (region controlled by the ON angle) is reduced so as to be smaller than the shot region Sh2, shift amount calculation as in step S112 in the first embodiment described above, Since there is no need to perform repeated processing, processing can be simplified and processing time can be shortened.

  As described above, the defect correction apparatus, the defect correction method, and the defect correction program according to the present invention are useful for accurately performing defect correction regardless of the size of the defect.

DESCRIPTION OF SYMBOLS 100 Defect correction apparatus 101 Control part 102 Image processing part 103 Area setting part 104 Stage control part 105 Display part 106 Input part 107 Storage part 110 Microscope part 111 Image pick-up element 112 Light source 116 Stage 120 Laser repair head 121 Laser light source 122 LED
123 Micromirror array Ms1-Ms3 Mask image P1-P3 Pattern part Rf1-Rf3 Reference image Sh1, Sh2 Shot area Sn1-Sn3 Non-transmission part Tr1, Tr2 Transmission part

Claims (6)

An imaging unit that acquires an enlarged image of a part of the substrate on which a pattern in which the same picture elements are periodically arranged is formed, and laser light is applied to the substrate using the image acquired by the imaging unit; A defect correction apparatus that performs a correction process of defects on the substrate by irradiating
A stage on which the substrate is placed and movable relative to the imaging unit on a plane parallel to the plate surface of the substrate;
A stage control unit that controls the movement of the stage and moves the stage to a position moved by a distance corresponding to a predetermined number of picture elements from a defect correction position for performing the correction process;
A matching unit that compares the first captured image captured at the first imaging position moved from the defect correction position by the stage movement by the stage control unit with a reference image;
Based on the determination by the matching unit, a mask generation unit that generates a mask image having a mask unit corresponding to a non-laser irradiation region on the substrate based on the reference image;
A light beam shaping means for shaping a light beam cross-sectional shape of laser light from a laser light source into a shape corresponding to the mask image;
A defect correction apparatus comprising: The matching unit compares the first captured image captured at the first imaging position moved by the stage movement by the stage control unit with the reference image, and calculates a fitness.
A controller that determines whether or not the fitness is smaller than a preset threshold;
The stage control unit moves the stage from the first imaging position to a position moved by a distance corresponding to a predetermined number of picture elements when the control unit determines that the fitness is less than or equal to the threshold value,
The said matching part compares the 2nd captured image imaged in the 2nd imaging position moved from the said 1st imaging position by the stage movement by the said stage control part, and the said reference image. The defect correcting apparatus according to 1. The stage control unit moves the stage to the defect correction position when the control unit determines that the fitness is greater than the threshold value,
The matching unit compares a third captured image captured at the defect correction position moved from the first or second imaging position by the stage movement by the stage control unit with the first or second captured image. Then, the shift amount of the pattern between the first or second captured image and the third captured image is calculated,
The defect correction apparatus according to claim 2, wherein the mask generation unit shifts the mask image based on the shift amount with respect to the generated mask image.   The defect correction according to claim 1, wherein the mask generation unit performs an erosion process for reducing the laser irradiation region by forming the mask portion larger than a distance between outer edges of the non-laser irradiation region. apparatus. An image obtained by enlarging a part of a substrate on which a pattern in which the same picture elements are periodically arranged is formed is acquired by an imaging unit, and the substrate is irradiated with laser light using the image acquired by the imaging unit A defect correcting method for correcting defects on the substrate,
A stage moving step of moving the stage to a position moved by a distance corresponding to a predetermined number of picture elements from a defect correction position for performing the correction process;
A matching step of comparing a first captured image captured at a first imaging position moved from the defect correction position by the stage movement by the stage moving step with a reference image;
Based on the determination by the matching step, a mask generation step of generating a mask image having a mask portion corresponding to a non-laser irradiation region on the substrate based on the reference image;
A light beam shaping step of shaping a light beam cross-sectional shape of laser light from a laser light source into a shape according to the mask image;
A defect correcting method comprising: An image obtained by enlarging a part of a substrate on which a pattern in which the same picture elements are periodically arranged is formed is acquired by an imaging unit, and the substrate is irradiated with laser light using the image acquired by the imaging unit A defect correction program for causing a computer to execute a defect correction process on the substrate,
A stage moving procedure for moving the stage to a position moved by a distance corresponding to a predetermined number of picture elements from a defect correction position for performing the correction process;
A matching procedure for comparing a first captured image captured at a first imaging position moved from the defect correction position by a stage movement by the stage moving procedure with a reference image;
Based on the determination by the matching procedure, a mask generation procedure for generating a mask image having a mask portion corresponding to a non-laser irradiation region on the substrate based on the reference image;
A light beam shaping step of shaping a light beam cross-sectional shape of laser light from a laser light source into a shape according to the mask image;
A defect correction program characterized by including:

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