CN113351999A - Finished plate copper surface nondestructive reprinting reprocessing technology based on laser etching - Google Patents
Finished plate copper surface nondestructive reprinting reprocessing technology based on laser etching Download PDFInfo
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- CN113351999A CN113351999A CN202110601348.6A CN202110601348A CN113351999A CN 113351999 A CN113351999 A CN 113351999A CN 202110601348 A CN202110601348 A CN 202110601348A CN 113351999 A CN113351999 A CN 113351999A
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- laser etching
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/60—Preliminary treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a finished product plate copper surface nondestructive reprinting reprocessing process based on laser etching, which belongs to the technical field of circuit board processing and comprises the following steps: comparing the ink patterns and the copper sheet positions on the new PCB product and the old PCB product, and finding out the position where the ink and the copper sheet need to be removed; drawing a pattern needing to remove ink and copper skin in a laser etching machine, wherein the drawn pattern generates an executable file of the laser etching machine; debugging the positioning and focal length parameters of the laser engraving machine; according to the invention, the laser engraving machine is utilized to correspondingly remove the positions of the printing ink and the copper sheet on the PCB product, so that the old PCB product is quickly modified without manual maintenance, the processing efficiency of modification is greatly improved, the rework process of printing ink again after ink retreating is avoided, the rework process is reduced, the consumption of printing ink is not required, and the cost of modification processing is reduced.
Description
Technical Field
The invention belongs to the technical field of circuit board processing, and particularly relates to a finished board copper surface non-damage reprinting reprocessing process based on laser etching.
Background
Laser engraving is the permanent marking of various material surfaces with laser beams. The marking effect is that the deep substance is exposed through the evaporation of the surface substance, or the trace is carved through the chemical and physical change of the surface substance caused by the light energy, or the pattern and the character which need to be etched are shown through burning off part of the substance by the light energy.
The speed of upgrading and upgrading of products is accelerated, some old-style PCB products which are delivered but not loaded can not meet the use requirements of customers, the PCB products are thrown again, new-style PCB products are made, the old-style PCB products can be directly scrapped, the old-style PCB products which are delivered are prevented from being scrapped, economic loss is caused, and the old-style PCB products are often selected to be upgraded: such as adding a hole ring, adding a large copper surface PAD and adding optical points to meet the latest use requirement.
At present, when the exposed surface of the copper surface of a PCB product is modified, the first method is manual maintenance, namely, ink at a designated position is maintained and removed by a blade, but the method has the problems of low maintenance efficiency, irregular maintenance pattern, copper surface damage and poor maintenance yield, and the second method is to perform ink removing cleaning on the PCB product and then perform ink printing again, so that the reworking process is increased, and the ink cost is increased.
Disclosure of Invention
The invention aims to: the finished plate copper surface non-damage reprinting reprocessing technology based on laser etching is provided to solve the problems that when a PCB product is modified, manual overhaul is utilized to remove oil stains at a designated position, the PCB product is cleaned by ink removing and is printed with ink again, so that overhaul efficiency is low, overhaul yield is poor, and rework cost is high.
In order to achieve the above object, the present invention adopts the following method: a finished plate copper surface non-damage reprinting reprocessing process based on laser etching comprises the following steps:
1) comparing the ink patterns and the copper sheet positions on the new PCB product and the old PCB product, and finding out the position where the ink and the copper sheet need to be removed;
2) drawing a pattern needing to remove ink and copper skin in a laser etching machine, wherein the drawn pattern generates an executable file of the laser etching machine;
3) debugging the positioning and focal length parameters of the laser engraving machine;
4) turning on a light source, irradiating the PCB product by the light source, extracting the outline characteristics of the PCB product by a camera, and feeding back the position parameters of the outline characteristics of the PCB product to the laser etching machine by the camera;
5) training linkage between a camera and the laser carving machine;
6) and starting the laser engraving machine to perform laser engraving operation and burn off the ink or copper sheets at the designated positions.
As a further description of the above technical solution:
in the step 2) -the step 6), the laser etching machine is a CO2 laser etching machine.
As a further description of the above technical solution:
and 3), placing the old PCB product on a positioning table of the laser etching machine, trying to run an executable file, adjusting the focal length of the laser etching machine according to the removing position and effect of the printing ink and the copper sheet, and adjusting the position of the positioning table of the laser etching machine.
As a further description of the above technical solution:
in the step 4), the light source is a green light source.
As a further description of the above technical solution:
in the step 4), the light source is connected with a light source intensity regulator.
As a further description of the above technical solution:
in the step 5), after the laser etching machine obtains the position parameters fed back by the camera, the position parameters are compared with the positioning position coordinate parameters, and a high-speed galvanometer scanner on the laser etching machine performs position adjustment, so that the deviation between actual positioning and preset positioning is compensated.
As a further description of the above technical solution:
and 6), before the laser engraving machine is started, covering the old PCB product by using a cover plate, wherein a clearance through hole is reserved in the position of the cover plate, where the printing ink and the copper sheet need to be removed, correspondingly.
In summary, due to the adoption of the method, the beneficial effects of the invention are as follows:
1. according to the invention, the positions of the printing ink and the copper sheet on the PCB product are correspondingly removed by using the laser engraving machine, so that the old PCB product is quickly modified without manual maintenance, the processing efficiency of modification is greatly improved, the rework process of printing ink reprinting after ink returning is avoided, the rework process is reduced, printing ink consumable material is not required, and the cost of modification processing is reduced.
2. According to the invention, by utilizing accurate positioning on the laser engraving machine and using the camera to capture the characteristic position of the PCB product, the high-speed galvanometer scanner on the laser engraving machine carries out position adjustment, so that the deviation on the positioning is compensated, the laser engraving machine can mark complicated and various patterns, and the processing yield of plate changing is improved.
Drawings
FIG. 1 is a block diagram of a finished plate copper surface non-damage reprinting reprocessing process based on laser etching.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, the present invention provides a method: a finished plate copper surface non-damage reprinting reprocessing process based on laser etching comprises the following steps:
s01, comparing the ink patterns and the copper sheet positions on the new PCB product and the old PCB product, and finding out the positions where the ink and the copper sheet need to be removed;
s02, drawing a pattern needing to remove ink and copper sheets in the laser etching machine, wherein the drawn pattern generates an executable file of the laser etching machine;
s03, debugging the positioning and focal length parameters of the laser engraving machine;
s04, turning on a light source, irradiating the PCB product by the light source, extracting the outline characteristics of the PCB product by a camera, and feeding back the position parameters of the outline characteristics of the PCB product to the laser engraving machine by the camera;
s05, training linkage between the camera and the laser carving machine;
s06, starting the laser etching machine to carry out laser etching operation and burn off ink or copper sheets at the designated position;
in the S02-S06, the laser engraving machine is a CO2 laser engraving machine, the printing effect and the marking speed of the CO2 laser engraving machine can meet the requirements of high efficiency, high speed and high reliability of modern mass production, and marking characters are clear and attractive and cannot be abraded;
in the step S03, placing the old PCB product on a positioning table of a laser etching machine, trying to run an executable file, adjusting the focal length of the laser etching machine according to the removing positions and effects of the ink and the copper sheets, and adjusting the position of the positioning table of the laser etching machine, so that each old PCB product can obtain the same processing effect after being processed, and the version changing processing is stable;
in the step S04, the light source is a green light source;
in the S04, the light source is connected with the light source intensity regulator, so that the brightness of the light source can be quickly regulated, the surface reflection degree of different PCB products can be adapted, and the camera can shoot the outline of the PCB product;
in the step S05, after the laser engraving machine obtains the position parameter fed back by the camera, the position parameter is compared with the positioning position coordinate parameter, and a high-speed galvanometer scanner on the laser engraving machine performs position adjustment, so as to compensate the deviation between the actual positioning and the preset positioning;
in S06, before the laser engraving machine is started, the cover plate is used for covering old PCB products, and the cover plate is provided with a clearance through hole at the position where ink and copper sheets need to be removed correspondingly, so that the position of the PCB product which does not need to be processed is protected from accidental damage.
The working principle is as follows: firstly, comparing ink patterns and copper skin positions on new and old PCB products, finding out the positions where the ink and the copper skin need to be removed, drawing the patterns where the ink and the copper skin need to be removed in a laser engraving machine, generating an executable file of the laser engraving machine by the drawn patterns, secondly, placing the old PCB product on a positioning table of the laser engraving machine, trying to run the executable file, adjusting the focal length of the laser engraving machine according to the removal positions and effects of the ink and the copper skin, adjusting the position of the positioning table of the laser engraving machine, then adjusting an intensity adjuster of a green light source to adjust the intensity of the green light source, irradiating the PCB product with the light source, extracting outline characteristics of the PCB product by a camera, feeding back position parameters of the outline characteristics of the PCB product to the laser engraving machine by the camera, comparing the position parameters with positioning position coordinate parameters after the laser engraving machine obtains the position parameters fed back by the camera, the high-speed galvanometer scanner on the laser radium carving machine carries out position control to compensate the deviation between actual location and the predetermined location, at last, before starting laser radium carving machine, use the apron to leave the clearance through-hole with old money PCB product shade, the apron is in the position that corresponds needs get rid of printing ink and copper skin, starts laser radium carving machine, carries out radium carving operation, burns out appointed position printing ink or copper skin.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (6)
1. The finished plate copper surface non-damage reprinting reprocessing process based on laser etching is characterized by comprising the following steps of: the method comprises the following steps:
1) comparing the ink patterns and the copper sheet positions on the new PCB product and the old PCB product, and finding out the position where the ink and the copper sheet need to be removed;
2) drawing a pattern needing to remove ink and copper skin in a laser etching machine, wherein the drawn pattern generates an executable file of the laser etching machine;
3) debugging the positioning and focal length parameters of the laser engraving machine;
4) turning on a light source, irradiating the PCB product by the light source, extracting the outline characteristics of the PCB product by a camera, and feeding back the position parameters of the outline characteristics of the PCB product to the laser etching machine by the camera;
5) training linkage between a camera and a laser engraving machine, comparing the position parameters with the positioning position coordinate parameters after the laser engraving machine obtains the position parameters fed back by the camera, and adjusting the position of a high-speed galvanometer scanner on the laser engraving machine so as to compensate deviation between actual positioning and preset positioning;
6) and starting the laser engraving machine to perform laser engraving operation and burn off the ink or copper sheets at the designated positions.
2. The finished plate copper surface non-damage reprinting reprocessing process based on laser etching according to claim 1, wherein in the step 2) -the step 6), the laser etching machine is a CO2 laser etching machine.
3. The laser etching-based finished plate copper surface non-damage reprinting reprocessing process according to claim 1, wherein in the step 3), an old-style PCB product is placed on a positioning table of a laser etching machine, an executable file is tried to run, the focal length of the laser etching machine is adjusted according to the removing position and effect of the ink and the copper sheet, and the position of the positioning table of the laser etching machine is adjusted.
4. The laser etching-based finished plate copper surface non-damage reprinting reprocessing process according to claim 1, wherein in the step 4), the light source is a green light source.
5. The laser etching-based finished plate copper surface non-damage reprinting reprocessing process according to claim 1, wherein in the step 4), the light source is connected with a light source intensity regulator.
6. The laser etching-based finished plate copper surface non-damage reprinting reprocessing process according to claim 1, wherein in the step 6), before starting the laser etching machine, an old PCB product is covered by a cover plate, and a clearance through hole is reserved on the cover plate at a position corresponding to the position where ink and copper skin need to be removed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110601348.6A CN113351999A (en) | 2021-05-31 | 2021-05-31 | Finished plate copper surface nondestructive reprinting reprocessing technology based on laser etching |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110601348.6A CN113351999A (en) | 2021-05-31 | 2021-05-31 | Finished plate copper surface nondestructive reprinting reprocessing technology based on laser etching |
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| CN113351999A true CN113351999A (en) | 2021-09-07 |
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| CN202110601348.6A Pending CN113351999A (en) | 2021-05-31 | 2021-05-31 | Finished plate copper surface nondestructive reprinting reprocessing technology based on laser etching |
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Citations (10)
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|---|---|---|---|---|
| JPH04264791A (en) * | 1991-02-19 | 1992-09-21 | Sumitomo Electric Ind Ltd | Flexible circuit board |
| US20090004403A1 (en) * | 2007-06-29 | 2009-01-01 | Yonggang Li | Method of Providing Patterned Embedded Conducive Layer Using Laser Aided Etching of Dielectric Build-Up Layer |
| CN101646308A (en) * | 2008-08-05 | 2010-02-10 | 富葵精密组件(深圳)有限公司 | Circuit compensation system of circuit board and method for circuit compensation thereby |
| CN102284796A (en) * | 2011-06-07 | 2011-12-21 | 深圳市大族激光科技股份有限公司 | Method for processing window on covering film |
| CN108990299A (en) * | 2018-07-27 | 2018-12-11 | 广东工业大学 | A kind of laser amendment pcb board defect method based on image detection |
| CN110508930A (en) * | 2019-08-22 | 2019-11-29 | 湖北工业大学 | The localization method of PCB on-line marking |
| CN111515543A (en) * | 2019-01-16 | 2020-08-11 | 福士瑞精密工业(郑州)有限公司 | Laser degumming method and device |
| CN111867268A (en) * | 2020-07-07 | 2020-10-30 | 深圳市睿达科技有限公司 | Method for repairing PCB (printed Circuit Board) by laser |
| TW202104876A (en) * | 2019-07-29 | 2021-02-01 | 由田新技股份有限公司 | Printed circuit board repair method and system thereof |
| CN112557417A (en) * | 2021-02-28 | 2021-03-26 | 深圳宜美智科技股份有限公司 | PCB laser repairing method and device based on image detection |
-
2021
- 2021-05-31 CN CN202110601348.6A patent/CN113351999A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04264791A (en) * | 1991-02-19 | 1992-09-21 | Sumitomo Electric Ind Ltd | Flexible circuit board |
| US20090004403A1 (en) * | 2007-06-29 | 2009-01-01 | Yonggang Li | Method of Providing Patterned Embedded Conducive Layer Using Laser Aided Etching of Dielectric Build-Up Layer |
| CN101646308A (en) * | 2008-08-05 | 2010-02-10 | 富葵精密组件(深圳)有限公司 | Circuit compensation system of circuit board and method for circuit compensation thereby |
| CN102284796A (en) * | 2011-06-07 | 2011-12-21 | 深圳市大族激光科技股份有限公司 | Method for processing window on covering film |
| CN108990299A (en) * | 2018-07-27 | 2018-12-11 | 广东工业大学 | A kind of laser amendment pcb board defect method based on image detection |
| CN111515543A (en) * | 2019-01-16 | 2020-08-11 | 福士瑞精密工业(郑州)有限公司 | Laser degumming method and device |
| TW202104876A (en) * | 2019-07-29 | 2021-02-01 | 由田新技股份有限公司 | Printed circuit board repair method and system thereof |
| CN110508930A (en) * | 2019-08-22 | 2019-11-29 | 湖北工业大学 | The localization method of PCB on-line marking |
| CN111867268A (en) * | 2020-07-07 | 2020-10-30 | 深圳市睿达科技有限公司 | Method for repairing PCB (printed Circuit Board) by laser |
| CN112557417A (en) * | 2021-02-28 | 2021-03-26 | 深圳宜美智科技股份有限公司 | PCB laser repairing method and device based on image detection |
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