CN110744205A - Laser depth marking method for titanium-based multilayer composite material - Google Patents
Laser depth marking method for titanium-based multilayer composite material Download PDFInfo
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- CN110744205A CN110744205A CN201911006592.7A CN201911006592A CN110744205A CN 110744205 A CN110744205 A CN 110744205A CN 201911006592 A CN201911006592 A CN 201911006592A CN 110744205 A CN110744205 A CN 110744205A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Abstract
The invention provides a laser depth marking method for a titanium-based multilayer composite material, which comprises a titanium alloy substrate, a ceramic glaze layer covering the titanium alloy substrate and light-cured paint arranged on the surface of the ceramic glaze layer, wherein the laser depth marking method comprises the following steps: making a depth marking drawing file; according to the depth marking drawing file, removing the photocuring paint and the ceramic glaze layer on the surface of the corresponding position of the titanium-based multilayer composite material by adopting an ultrafast laser, and processing a groove-shaped mark on the titanium alloy substrate; and (4) carrying out micro-polishing treatment on the groove type mark by adopting a long-pulse-width infrared nanosecond laser, and finishing the processing. The invention can complete the depth marking of the titanium-based multilayer composite material only by the drawing file processing and the multi-pulse width beam-combining laser processing, and has high flexibility, low cost and short production period. The depth mark has neat and non-sawtooth edges and metallic luster, and meets the requirements of beauty and permanent marking.
Description
Technical Field
The invention belongs to the technical field of laser processing, and particularly relates to a laser depth marking method for a titanium-based multilayer composite material.
Background
Electronic product housings, high-grade ornaments, and the like are often made of multilayer composite materials. The internal titanium alloy has high strength and good corrosion resistance; the surface of the ceramic glaze layer of the middle layer is smooth and has stable chemical properties and good decoration, and the defects that the specific strength of titanium is not high and the titanium cannot be applied in a high-temperature environment can be overcome; the ultraviolet light curing paint on the surface layer has good transparency, high hardness and excellent yellowing resistance, and can ensure that the ultraviolet light curing paint is new for a long time.
The electronic product shell and the high-grade ornament with the structure usually need to be finely marked with brand patterns and characters in the processing process, and the marking effect is required to be attractive and clear and to be kept permanent. At present, two methods are mainly used for marking, one method is to adopt a numerical control machine tool to carve and process a product, the carving process is not fine enough, a cutter is easy to wear, so that the cutter is changed frequently, and the edge breakage is easy to cause due to the large difference of material properties in the processing of a multi-layer material. The other method is a method of exposure, development and etching, and a series of steps such as mask making, development, etching and the like are required, so that the processing procedures are multiple, the processing efficiency is low, and the used equipment is expensive.
Therefore, the prior art has yet to be developed.
Disclosure of Invention
The invention aims to solve the technical problem of providing a laser depth marking method for a titanium-based multilayer composite material, and aims to solve the problems of multiple working procedures, low efficiency and relatively high cost of the existing marking method.
In order to solve the technical problem, the invention is realized by a laser depth marking method of a titanium-based multilayer composite material, the titanium-based multilayer composite material comprises a titanium alloy substrate, a ceramic glaze layer covering the titanium alloy substrate, and a light-cured paint arranged on the surface of the ceramic glaze layer, and the laser depth marking method of the titanium-based multilayer composite material comprises the following steps:
making a depth marking drawing file;
according to the depth marking drawing file, removing the photocuring paint and the ceramic glaze layer on the surface of the corresponding position of the titanium-based multilayer composite material by adopting an ultrafast laser, and processing a groove-shaped mark on the titanium alloy substrate;
and (4) carrying out micro-polishing treatment on the groove type mark by adopting a long-pulse-width infrared nanosecond laser, and finishing the processing.
Further, the tolerance of the laser focus position of the ultrafast laser is +/-0.1 mm.
Furthermore, the wavelength of the ultrafast laser is 1030-1064nm, and the pulse width is less than or equal to 10 ps.
Further, in the step of removing the photo-curing paint and the ceramic glaze layer on the surface of the corresponding position of the titanium-based multilayer composite material by adopting the ultrafast laser, the laser marking speed is 400-1000mm/s, and the frequency is 300-500 KHz.
Furthermore, the wavelength of the long-pulse-width infrared nanosecond laser is 1030 and 1064nm, and the pulse width is larger than or equal to 100 ns.
Further, in the step of processing the groove-type mark on the titanium alloy substrate, the laser marking speed is 1500-.
Further, the step of performing micro-polishing treatment on the groove-shaped mark by using a long-pulse-width infrared nanosecond laser further comprises the following steps of:
and setting the long-pulse-width infrared nanosecond laser to enable the central contact ratio of the long-pulse-width infrared nanosecond laser and the ultrafast laser to be less than or equal to 0.04mm on an outer light path.
Further, in the step of performing micro-polishing treatment on the groove-shaped mark by adopting a long-pulse-width infrared nanosecond laser, the laser marking speed is 400-1200mm/s, the frequency is 30-70KHz,
compared with the prior art, the invention has the beneficial effects that: the laser depth marking method of the titanium-based multilayer composite material can finish the depth marking of the titanium-based multilayer composite material only by the processing of a figure file and the laser processing of multi-pulse width combined beams. Compared with the numerical control machine tool processing and exposure developing process in the traditional process, the invention has the advantages of high flexibility, low cost, short production period and the like. The discharge of wastes such as cutting fluid is reduced, subsequent treatment such as cleaning is not needed after processing, and the products can be directly processed and delivered at the rear section of product production and assembly. The multi-pulse width beam-combination laser processing comprehensively utilizes the advantages of narrow-pulse width ultrafast laser cold etching processing and long-pulse width nanosecond laser ablation polishing, and can effectively mark and process the depth of the multilayer composite material. The product obtained by the invention has the characteristics of regular and non-serrated depth mark edge, metallic luster and the like, and meets the requirements of beauty and permanent mark.
Drawings
FIG. 1 is a flow chart of an embodiment of a laser depth marking method of a titanium-based multilayer composite of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The invention relates to processing treatment of a titanium-based multilayer composite material, which is a multilayer composite material taking a titanium alloy as a substrate, a ceramic glaze layer as a decoration and an ultraviolet light curing paint layer as a protection, and can meet the requirements of the functional performance and the decorative performance of products such as electronic product shells, high-grade ornaments, cards and the like. Specifically, the titanium-based multilayer composite material comprises a titanium alloy substrate, a ceramic glaze layer covering the titanium alloy substrate, and light-cured paint arranged on the surface of the ceramic glaze layer. The invention provides a laser depth marking method for a titanium-based multilayer composite material, which comprises the following steps as shown in figure 1:
and S1, making a depth mark drawing file.
Specifically, the drawing file can be designed according to the shape of the marking pattern and/or the character by computer design software such as Coreldraw and the like, and the plt format drawing file, namely the depth marking drawing file, which can be used by the laser equipment is derived after the design is finished.
And S2, according to the depth marking drawing file, removing the photocuring paint and the ceramic glaze layer on the surface of the corresponding position of the titanium-based multilayer composite material by adopting an ultrafast laser, and processing a groove-shaped mark on the titanium alloy substrate.
According to the depth marking drawing file, an ultrafast laser is adopted to process the shapes of marking patterns and/or characters on the titanium-based multilayer composite material. Specifically, the titanium-based multilayer composite material is placed on a jig, laser equipment is started, the laser focus position is tested firstly, and preferably, the tolerance of the laser focus position of the ultrafast laser is +/-0.1 mm. The jig adopts the mode of jacking up to ensure the product and beat the uniformity of mark position, avoid the influence of focus difference to the mark effect. And adjusting the motor to enable the titanium-based multilayer composite material to be in a laser processing position. And then setting the processing parameters and the drawing file of the ultrafast laser, controlling the processing path of the laser through a high-precision high-speed galvanometer, and removing the ultraviolet light curing paint layer and the ceramic glaze layer on the surface of the designated position by utilizing the characteristics of small heat influence and high peak power of the narrow pulse width of the ultrafast laser. And finally, processing a groove with a certain depth on the titanium alloy base material, and forming a pattern consistent with the depth marking drawing file on the titanium alloy base material.
In this embodiment, the laser parameters of the ultrafast laser are preferably: the wavelength of 1030 and 1064nm, and the pulse width of less than or equal to 10 ps.
In this embodiment, the processing parameters when removing the photo-curing paint and the ceramic glaze layer on the surface of the corresponding position of the titanium-based multilayer composite material are preferably set as follows: the laser marking speed is 400-1000mm/s, and the frequency is 300-500 KHz.
In the present embodiment, the processing parameter settings when processing the groove type mark are preferably: the laser marking speed is 1500-.
Compared with the nanosecond laser, the heat influence of the nanosecond laser in the laser processing process is large, the pulse width of the ultrafast laser is narrow, the interaction time with an object is short, the peak power of the ultrafast laser is far higher than that of the nanosecond laser, and the surface ultraviolet light curing paint layer and the ceramic oil layer can be effectively removed in a vaporization etching mode in the laser processing process, so that the phenomenon that the ultraviolet light curing paint layer and the ceramic oil layer are affected by heat impact in the laser processing process to cause color change and edge collapse is avoided. Then, the titanium alloy is subjected to deep processing by adopting an ultrafast laser Burst mode (multi-pulse mode). The depth of the laser processing titanium alloy can be processed according to the designated groove shape, the depth control can be accurate to the micron level, the phenomena of yellowing, blackening and other thermal influences can not occur in the process of marking the depth of the titanium alloy, and the laser processing titanium alloy has extremely high processing precision and processing quality. Further detailed parameters of ultrafast laser removal of the uv cured layer and the ceramic glaze layer and the titanium alloy deep processing may be set as in table 1 below.
TABLE 1 ultrafast laser process parameter set-up Range
And S3, carrying out micro-polishing treatment on the groove type mark by adopting a long-pulse-width infrared nanosecond laser, and finishing the processing.
Specifically, a beam combining optical brake motor and a long-pulse-width infrared nanosecond laser are arranged, so that the long-pulse-width infrared nanosecond laser and the ultrafast laser are coaxial on an external optical path. Preferably, the coincidence ratio of the centers of the outer optical paths of the two lasers is less than or equal to 0.04 mm. The processing path of the laser is controlled by a high-precision high-speed galvanometer, the processed titanium alloy surface is subjected to melting micro-etching by using long-pulse-width infrared nanosecond laser, micro-polishing treatment is carried out, and the obtained depth marking pattern has rich metal luster.
In this embodiment, the parameters of the long-pulse-width infrared nanosecond laser are preferably: the wavelength of 1030 and 1064nm, and the pulse width is not less than 100 ns.
In this embodiment, the processing parameters during the micro-polishing process are preferably set as follows: the laser marking speed is 400-1200mm/s, and the frequency is 30-70 KHz.
When the long-pulse width infrared nanosecond laser beam is focused on the surface of the titanium alloy processed by the ultrafast laser, when the laser energy density reaches a certain value, the convex peak part on the surface reaches the melting point and starts to melt, the melted part generates a surface tension gradient due to the difference between gravity and the curvature radius of each part, so that the melted part flows to the position with low curvature to keep the curvature of each part consistent, and the solid-liquid interface is solidified at the speed of several meters per second, thereby finally obtaining a smooth and flat surface with metallic luster. Further detailed parameters of the micro-polishing process may be set as in table 2 below.
TABLE 2 Long pulse Width Infrared nanosecond laser processing parameter set Range
The invention is further illustrated by the following specific examples.
Example 1
(1) And making a depth mark figure file in a plt format.
(2) The method comprises the steps of placing a titanium-based multilayer composite material on a jig, testing the laser focus position of the ultrafast laser by the jig in a jacking mode, setting the processing parameters of the ultrafast laser according to the table 3, controlling the processing path of laser through a high-precision high-speed galvanometer, and removing an ultraviolet curing paint layer and a ceramic glaze layer on the surface of an appointed position. And finally, processing a groove with a certain depth on the titanium alloy base material.
Table 3 ultrafast laser process parameter setting embodiment
(3) And adjusting the long pulse width infrared nanosecond laser to enable the long pulse width infrared nanosecond laser and the ultrafast laser to be coaxial on an external light path. And controlling the processing path of the laser by a high-precision high-speed vibrating mirror, carrying out melting micro-etching on the surface of the processed titanium alloy by using the long-pulse-width infrared nanosecond laser according to the parameters in the table 4, and carrying out micro-polishing treatment to complete processing.
Table 4 long pulse width infrared nanosecond laser processing parameter setting examples
The product obtained by the embodiment has the characteristics of tidy and non-sawtooth depth mark edge, metallic luster and the like, and meets the requirements of beauty and permanent marks.
In conclusion, the depth marking of the titanium-based multilayer composite material can be completed only by the drawing file processing and the multi-pulse width combined laser processing. Compared with the numerical control machine tool processing and exposure developing process in the traditional process, the invention has the advantages of high flexibility, low cost, short production period and the like. The discharge of wastes such as cutting fluid is reduced, subsequent treatment such as cleaning is not needed after processing, and the products can be directly processed and delivered at the rear section of product production and assembly. The multi-pulse width beam-combination laser processing comprehensively utilizes the advantages of narrow-pulse width ultrafast laser cold etching processing and long-pulse width nanosecond laser ablation polishing, and can effectively mark and process the depth of the multilayer composite material.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (8)
1. A laser depth marking method for a titanium-based multilayer composite material, which comprises a titanium alloy substrate, a ceramic glaze layer covering the titanium alloy substrate and a light-cured paint arranged on the surface of the ceramic glaze layer, and is characterized by comprising the following steps:
making a depth marking drawing file;
according to the depth marking drawing file, removing the photocuring paint and the ceramic glaze layer on the surface of the corresponding position of the titanium-based multilayer composite material by adopting an ultrafast laser, and processing a groove-shaped mark on the titanium alloy substrate;
and (4) carrying out micro-polishing treatment on the groove type mark by adopting a long-pulse-width infrared nanosecond laser, and finishing the processing.
2. The laser depth marking method of titanium-based multilayer composite of claim 1, wherein the ultrafast laser has a laser focus position tolerance of ± 0.1 mm.
3. The laser depth marking method of titanium-based multilayer composite material as claimed in claim 1, wherein the ultrafast laser has a wavelength of 1030-1064nm and a pulse width of 10ps or less.
4. The laser depth marking method of the titanium-based multilayer composite material as claimed in claim 1, wherein in the step of removing the photo-curing paint and the ceramic glaze layer on the surface of the corresponding position of the titanium-based multilayer composite material by using the ultrafast laser, the laser marking speed is 400-1000mm/s, and the frequency is 300-500 KHz.
5. The laser depth marking method of titanium-based multilayer composite material as claimed in claim 1, wherein the wavelength of said long pulse width infrared nanosecond laser is 1030-1064nm, and the pulse width is greater than or equal to 100 ns.
6. The laser depth marking method of titanium-based multilayer composite material as claimed in claim 1, wherein in the step of processing the groove-type mark on the titanium alloy substrate, the laser marking speed is 1500-.
7. The laser depth marking method of titanium-based multilayer composite of claim 1, wherein said step of micro-polishing said channel markings with a long pulse width infrared nanosecond laser further comprises:
and setting the long-pulse-width infrared nanosecond laser to enable the central contact ratio of the long-pulse-width infrared nanosecond laser and the ultrafast laser to be less than or equal to 0.04mm on an outer light path.
8. The laser depth marking method of the titanium-based multilayer composite material as claimed in claim 1, wherein in the step of performing micro-polishing treatment on the groove-shaped mark by using a long-pulse-width infrared nanosecond laser, the laser marking speed is 400-1200mm/s, and the frequency is 30-70 KHz.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112171068A (en) * | 2020-08-28 | 2021-01-05 | 江苏大学 | Method for efficiently removing thick coating in large area and application thereof |
| CN112643209A (en) * | 2020-12-14 | 2021-04-13 | 大族激光科技产业集团股份有限公司 | Laser processing method and device for workpiece plated with DLC and PVD films |
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