CN108788482A - The radium-shine processing method and ceramic on ceramic surface - Google Patents
The radium-shine processing method and ceramic on ceramic surface Download PDFInfo
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- CN108788482A CN108788482A CN201810636328.0A CN201810636328A CN108788482A CN 108788482 A CN108788482 A CN 108788482A CN 201810636328 A CN201810636328 A CN 201810636328A CN 108788482 A CN108788482 A CN 108788482A
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- ceramic
- radium
- shine
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- ultrafast laser
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
Abstract
The present invention relates to a kind of radium-shine processing method on ceramic surface and ceramics.The radium-shine processing method on ceramic surface, includes the following steps：The finished surface of ceramic is cleaned；The pattern that laser engraving is pre-designed is carried out to the finished surface of ceramic using ultrafast laser：Using single pulse mode, roughhew is carried out with the mark speed of 800mm/s-1200mm/s；Using multiple-pulse mode, finishing impression is carried out with the mark speed of 50mm/s-300mm/s；The wavelength of the ultrafast laser is 1030nm-1064nm, pulsewidth 5ps-25ps, the filling distance 0.005mm-0.1mm, and radium-shine power is 10%-40%；Ceramic after being surface-treated by the above method, the working depth of pattern is 3.1um-7.8um on the ceramic finished surface；Working depth can be made to reach micron order, keep working depth more shallow, ceramic surface touch good hand touch.
Description
Technical field
The present invention relates to laser-engraving technique fields, a kind of radium-shine processing method more particularly to ceramic surface and
Ceramic.
Background technology
Radium-shine processing, also known as laser processing.It is exactly the light beam using high-energy density, is irradiated to material surface, makes material
Vaporization or the process that color change occurs.
Ceramic material has good machinery and high temperature resistance, has been widely used in the industry such as metallurgy, chemical industry, aerospace
In field, the distinctive covalent bond of ceramics and ion bond structure make it have good comprehensive mechanical property and mechanical performance.It is existing
Ceramic manufacturing method machining process, optical manufacturing method, electricity processing method are divided into according to the difference of process principle
Deng.
Wherein machining process mainly has turning, drilling, grinding, grinding and polishing, and the machinery of ceramics is added at present
The problem of work method is in the prevalence of easy fragmentation cannot be satisfied fixed point, labyrinth and high-precision processing request；Electrical spark working
Work is to generate breakdown effects using spark discharge to perform etching the process of removal, but for ceramic material, electricity
Resistance rate is excessive, and the difficulty being processed to it using electric spark is larger, and since the fusing point of ceramic material is at thousands of degrees Celsius, causes
Keep electric spark low to the processing efficiency of such material.
Laser processing technology is contactless by its, is suitable for the advantages outstanding such as complicated processing, is widely used in metal, pottery
The processing of ceramic material, laser power density can reach 107-1011W/cm after focusing in laser processing procedure2, therefore laser pair
Almost all of material can be carried out processing, and be to solve the various unmanageable effective ways of hard brittle material.
However existing technology to ceramic surface process small size figure (such as character) when, due to common laser to pottery
Ceramic products are processed, and the long pulse width of laser and low laser intensity cause material melts and continue to evaporate, although laser beam
It can be focused into the hot spot of very little, but still very big to the thermal shock of material, limit machining accuracy, working depth is general
Reach grade, causes working depth deeper, touch feeling is poor.
Invention content
Based on this, it is necessary to when for carrying out the processing of small size pattern to ceramic surface currently with laser technology, processing
The deeper problem of depth provides a kind of radium-shine processing method on ceramic surface.
A kind of radium-shine processing method on ceramic surface, includes the following steps：
The finished surface of ceramic is cleaned；
The pattern that laser engraving is pre-designed is carried out to the finished surface of ceramic using ultrafast laser：Using
Single pulse mode carries out roughhew with the mark speed of 800mm/s-1200mm/s；Using multiple-pulse mode, with 50mm/s-
The mark speed of 300mm/s carries out finishing impression；The wavelength of the ultrafast laser be 1030nm-1064nm, pulsewidth 5ps-25ps,
The filling distance is 0.005mm-0.1mm, and radium-shine power is 10%-40%.
The wavelength of the ultrafast laser is 1064nm, pulsewidth 15ps in one of the embodiments, and the filling distance is
0.03mm, radium-shine power are 40%.
The wavelength of the ultrafast laser is 1030nm, pulsewidth 20ps in one of the embodiments, and the filling distance is
0.005mm, radium-shine power are 25%.
The wavelength of the ultrafast laser is 1045nm, pulsewidth 25ps in one of the embodiments, and the filling distance is
0.08mm, radium-shine power are 28%.
The wavelength of the ultrafast laser is 1030nm, pulsewidth 5ps in one of the embodiments, and the filling distance is
0.1mm, radium-shine power are 10%.
The repetition rate of the ultrafast laser is 50KHZ-1000KHZ in one of the embodiments,.
In one of the embodiments, it includes by ceramic that the finished surface to ceramic, which carries out cleaning,
The step that finished surface deionized water or alcohol wipe totally air-dry afterwards.
A kind of ceramic obtains after being surface-treated by the radium-shine processing method on above-mentioned ceramic surface.
The ceramic is by zirconia ceramics, aluminium oxide ceramics, silicon nitride ceramics or carbon in one of the embodiments,
SiClx ceramics are made.
The working depth of pattern is 3.1um-7.8um on the ceramic finished surface in one of the embodiments,.
Using above-mentioned technical proposal, when being applied on ceramic with the burst length of picosecond magnitude, by optical maser wavelength
Be set as 1030nm-1064nm, pulsewidth 5ps-25ps, significant changes can occur for processing effect, with pulse energy drastically on
It rises, high power density is enough peeling outer layer electronics, and working depth can reach micron order, keep working depth more shallow, ceramic
Surface touch good hand touch.
Description of the drawings
Fig. 1 is to test ceramic material through swashing using Keyemce VK-X100k 3D laser microscopes in the embodiment of the present invention one
The working depth test chart of the radium-shine rear surface character of light.
Specific implementation mode
To facilitate the understanding of the present invention, referring to relevant drawings to invention is more fully described.It is given in attached drawing
Present pre-ferred embodiments are gone out.But the present invention can realize in many different forms, however it is not limited to described herein
Embodiment.Make the understanding more preferably thorough and comprehensive of the disclosure of invention on the contrary, purpose of providing these embodiments is.
Picosecond laser be a pulsewidth be picosecond laser.With picosecond ultrashort pulsewidth, repetition rate is adjustable, arteries and veins
The features such as energy is high is rushed, has more and more extensive answer in fields such as biomedicine, optical parametric oscillator, biology microscope imagings
With being increasingly becoming the tool that becomes more and more important in modern biotechnology imaging and analysis system.Present invention application picosecond laser is to ceramics
Etching of the finished surface of product into patterns such as line characters.
Embodiment one
A kind of radium-shine processing method on ceramic surface of the present embodiment, includes the following steps：
Step 1 totally air-dries aluminium oxide ceramic products with alcohol wipe afterwards；
Step 2 edits in CorelDraw and needs radium-shine character outline map file, the map file that export format is PLT,
It is imported into laser system (mark software), the setting of technological parameter is carried out in laser system；
Aluminium oxide ceramic products are fixed in horizontal brace by step 3, and ultrafast laser is arranged in mark software
Wavelength is 1064nm, and pulsewidth 15ps, filling spacing is 0.03mm, and repetition rate 50KHZ, radium-shine power is 40%, by focus
It is placed in ceramic surface；It is 1000mm/s that mark speed is arranged first in mark software, is being aoxidized using single pulse mode
Aluminium ceramic surface carry out roughhew, it is radium-shine go out character appearance, character bottom is relatively rough at this time；Then it is arranged in mark software
Mark speed is 300mm/s, and finishing impression is carried out on the basis of roughhew using multiple-pulse mode.
After aluminium oxide ceramics uses laser complete, ceramic material is tested using Keyemce VK-X100k 3D laser microscopes
Expect the working depth test chart through laser rear surface character, as shown in Figure 1.
In Fig. 1：Abscissa is the horizontal distance of test, and ordinate be the height value tested, two groups of horizontal directions it is parallel
The distance between line is difference in height, and the distance between parallel lines of two groups of vertical directions are that horizontal distance is poor.The character wheel of test
Part of the wide part between two groups of horizontal lines and two groups of vertical lines in forming region.
The horizontal distance for the character that can be tested from Fig. 1 is 148.88um, difference in height 4.22um.
After aluminium oxide ceramics uses laser complete, the oxygen is tested using Keyemce VK-X100k 3D laser microscopes
Change the working depth of aluminium Ceramic character and roughness the results are shown in Table 1, the working depth of character is 4.2um, roughness 0.24um.
See that character shading is the frosted shape in even particle distribution, ceramic finished surface with 40 times of hand magnifier
Beauty is touched with hand without apparent sense of touch.
Embodiment two
A kind of radium-shine processing method on ceramic surface of the present embodiment, includes the following steps：
Step 1 totally air-dries zirconia ceramic product with alcohol wipe afterwards；
Step 2 edits in CAD and needs radium-shine character outline map file, and the map file that export format is DXF is imported into
In laser system (mark software), the setting of technological parameter is carried out in laser system；
Zirconia ceramic product is fixed in horizontal brace by step 3, and ultrafast laser is arranged in mark software
Wavelength is 1030nm, and pulsewidth 20ps, filling spacing is 0.005mm, and repetition rate 300KHZ, radium-shine power is 25%, will be burnt
Point is placed in ceramic surface；It is 800mm/s that mark speed is arranged first in mark software, is being aoxidized using single pulse mode
Zircon ceramic surface carry out roughhew, it is radium-shine go out character appearance, character bottom is relatively rough at this time；Then it is arranged in mark software
Mark speed is 200mm/s, and finishing impression is carried out on the basis of roughhew using multiple-pulse mode.
After zirconia ceramics uses laser complete, using the test mode with one identical standard of embodiment, using base grace
Scholar's VK-X100k 3D laser microscopes test the working depth of the zirconia ceramics character and roughness the results are shown in Table 1, character
Working depth be 5.4um, roughness 0.53um.
See that character shading is the smooth shape being evenly distributed in fine particle, ceramic processing with 40 times of hand magnifier
Certain glossiness is presented in surface aesthetic, character, is touched without apparent sense of touch sense with hand.
Embodiment three
A kind of radium-shine processing method on ceramic surface of the present embodiment, includes the following steps：
Step 1 totally air-dries silicon nitride ceramics with alcohol wipe afterwards；
Step 2 edits in CAD and needs radium-shine character outline map file, and the map file that export format is DXF is imported into
In laser system (mark software), the setting of technological parameter is carried out in laser system；
Silicon nitride ceramics are fixed in horizontal brace by step 3, and ultrafast laser is arranged in mark software
Wavelength is 1045nm, and pulsewidth 25ps, filling spacing is 0.08mm, and repetition rate 1000KHZ, radium-shine power is 28%, will be burnt
Point is placed in ceramic surface；It is 1200mm/s that mark speed is arranged first in mark software, using single pulse mode in nitrogen
SiClx ceramic surface carry out roughhew, it is radium-shine go out character appearance, character bottom is relatively rough at this time；Then in mark software
Middle setting mark speed is 100mm/s, and finishing impression is carried out on the basis of roughhew using multiple-pulse mode.
After silicon nitride ceramics uses laser complete, using the test mode with one identical standard of embodiment, using base grace
Scholar's VK-X100k 3D laser microscopes test the working depth of the silicon nitride ceramics character and roughness the results are shown in Table 1, character
Working depth be 7.8um, roughness 0.44um.
It sees that character shading is smooth smooth shape with 40 times of hand magnifier, there is extremely strong reflecting effect, ceramic system
Product finished surface is beautiful, and certain glossiness is presented in character, is touched without apparent sense of touch with hand.
Example IV
A kind of method of the radium-shine ceramic surface character of ultrafast laser of the present embodiment includes step in detail below:
Step 1 totally air-dries silicon carbide ceramic product with alcohol wipe afterwards；
Step 2 edits in CorelDraw and needs radium-shine character outline map file, the map file that export format is PLT,
It is imported into laser system (mark software), the setting of technological parameter is carried out in laser system；
Silicon carbide ceramic product is fixed in horizontal brace by step 3, and ultrafast laser is arranged in mark software
Wavelength is 1030nm, and pulsewidth 5ps, filling spacing is 0.1mm, and repetition rate 100KHZ, radium-shine power is 10%, and focus is set
In ceramic surface；It is 1200mm/s that mark speed is arranged first in mark software, using single pulse mode in silicon carbide
Ceramic surface carry out roughhew, it is radium-shine go out character appearance, character bottom is relatively rough at this time；Then it is set in mark software
It is 50mm/s to set mark speed, and finishing impression is carried out on the basis of roughhew using multiple-pulse mode.
After silicon carbide ceramics uses laser complete, using the test mode with one identical standard of embodiment, using base grace
Scholar's VK-X100k 3D laser microscopes test the working depth of the silicon carbide ceramics character and roughness the results are shown in Table 1, character
Working depth be 3.1um, roughness 0.12um.
The frosted shape that character shading is small hill shape is seen with 40 times of hand magnifier, and ceramic finished surface is beautiful, word
Certain glossiness is presented in symbol, is touched without apparent sense of touch with hand.
Table 1 is that the working depth for the ceramic face character that various embodiments of the present invention are prepared and the Ra of roughness are surveyed
Test result.
Table 1：
| Embodiment | Depth (um) | Roughness (um) |
| Embodiment one | 4.2 | 0.24 |
| Embodiment two | 5.4 | 0.53 |
| Embodiment three | 7.8 | 0.44 |
| Example IV | 3.1 | 0.12 |
In conclusion influence of the repetition rate to machining accuracy is smaller, and the selection of pulse mode, the choosing of mark speed
It selects, the combination of the wavelength of ultrafast laser, pulsewidth, the filling distance and radium-shine power is affected to machining accuracy.
Since the laser beam of picosecond magnitude and ceramic interaction time are very short, ion is around transferring energy to
Before material just from ceramic surface it is ablated fall, heat affecting will not be carried out to the material strips of surrounding.Ultrashort pulse adds
Work energy injects the zone of action of very little as quick as thought, and transient energy density precipitation makes Electron absorption and motion mode change,
The influences such as laser linear absorption, energy transfer and diffusion are avoided, laser is fundamentally changed and interacts with ceramic
Mechanism.
Using the character on the obtained ceramic surface of the radium-shine processing method on ceramic surface provided by the invention
Almost without depth, and there is good glossiness；And picosecond short pulse duration and high peak power can be by ceramic surface
Material instant vaporization and heat affecting will not be carried out to the material strips of surrounding, so high in machining efficiency and will not be to the strong of ceramic
Degree impacts.The processing method of the present invention is simple for process, and easy to operate, efficient, less energy consumption is at low cost, need not use
Chemical reagent can be achieved character shading by the debugging of technological parameter and effect be controllable.
Each technical characteristic of embodiment described above can be combined arbitrarily, to keep description succinct, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, it is all considered to be the range of this specification record.
Several embodiments of the invention above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Range.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
1. a kind of radium-shine processing method on ceramic surface, which is characterized in that include the following steps：
The finished surface of ceramic is cleaned；
The pattern that laser engraving is pre-designed is carried out to the finished surface of ceramic using ultrafast laser：Using simple venation
Mode is rushed, roughhew is carried out with the mark speed of 800mm/s-1200mm/s；Using multiple-pulse mode, with 50mm/s-300mm/s's
Mark speed carries out finishing impression；The wavelength of the ultrafast laser is 1030nm-1064nm, pulsewidth 5ps-25ps, the filling distance
For 0.005mm-0.1mm, radium-shine power is 10%-40%.
2. the radium-shine processing method on ceramic surface according to claim 1, which is characterized in that the ultrafast laser
Wavelength be 1064nm, pulsewidth 15ps, the filling distance 0.03mm, radium-shine power be 40%.
3. the radium-shine processing method on ceramic surface according to claim 1, which is characterized in that the ultrafast laser
Wavelength be 1030nm, pulsewidth 20ps, the filling distance 0.005mm, radium-shine power be 25%.
4. the radium-shine processing method on ceramic surface according to claim 1, which is characterized in that the ultrafast laser
Wavelength be 1045nm, pulsewidth 25ps, the filling distance 0.08mm, radium-shine power be 28%.
5. the radium-shine processing method on ceramic surface according to claim 1, which is characterized in that the ultrafast laser
Wavelength be 1030nm, pulsewidth 5ps, the filling distance 0.1mm, radium-shine power be 10%.
6. the radium-shine processing method on the ceramic surface according to claim 1-5 any one, which is characterized in that described
The repetition rate of ultrafast laser is 50KHZ-1000KHZ.
7. the radium-shine processing method on the ceramic surface according to claim 1-5 any one, which is characterized in that described
It includes that the finished surface deionized water or alcohol wipe of ceramic is clean to carry out cleaning to the finished surface of ceramic
Air-dried step afterwards.
8. a kind of ceramic, which is characterized in that radium-shine by the ceramic surface described in claim 1-7 any one adds
Work method obtains after being surface-treated.
9. ceramic according to claim 8, which is characterized in that the ceramic is by zirconia ceramics, aluminium oxide
Ceramics, silicon nitride ceramics or silicon carbide ceramics are made.
10. ceramic according to claim 9, which is characterized in that pattern adds on the ceramic finished surface
Work depth is 3.1um-7.8um.
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| CN111574238A (en) * | 2020-04-29 | 2020-08-25 | 南京理工大学 | Ultrafast laser welding method applied to ceramics |
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