CN112643209A - Laser processing method and device for workpiece plated with DLC and PVD films - Google Patents
Laser processing method and device for workpiece plated with DLC and PVD films Download PDFInfo
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- CN112643209A CN112643209A CN202011468897.2A CN202011468897A CN112643209A CN 112643209 A CN112643209 A CN 112643209A CN 202011468897 A CN202011468897 A CN 202011468897A CN 112643209 A CN112643209 A CN 112643209A
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- laser
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- dlc
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a laser processing method and equipment for a workpiece plated with DLC and PVD films, which comprises the following steps: placing the workpiece plated with the DLC and PVD films on a processing platform, and starting a laser assembly; adjusting the focal lengths of the first laser and the second laser, and setting laser marking parameters; irradiating the surface of the workpiece by first laser to strip the DLC and PVD films; irradiating the surface of the workpiece by using second laser to melt the surface of the workpiece to whiten; taking out the processed workpiece to finish processing; the pulse width of the first laser is picosecond, and the pulse width of the second laser is nanosecond. The scheme adopts the first laser and the second laser to process DLC and PVD films, has high precision and high efficiency, is environment-friendly, can reduce the abrasion of equipment, and greatly shortens the production period.
Description
Technical Field
The invention relates to the field of laser processing, in particular to a laser processing method and equipment for a workpiece plated with DLC and PVD films.
Background
DLC (Diamond-like carbon) films, also called Diamond-like carbon films, are emerging as a new material, having the advantages of high hardness, high electrical resistance, good optical properties and abrasion resistance, etc., and having the excellent properties of Diamond and graphite. PVD thin films (Physical vapor Deposition) refer to Physical vapor Deposition thin films. The film has the advantages of high hardness, low friction coefficient, good wear resistance, good chemical stability and the like. The two films are used in many electronic devices, especially in electronic communication devices such as mobile phones, due to their excellent properties.
Due to the requirements of beauty, anti-counterfeiting and mandatory electronic equipment identification, the surface of the workpiece coated with DLC and PVD films, such as stainless steel, needs to be marked. Surface marking is generally performed by means of mechanical grinding, sand blasting, chemical etching, numerical control (CNC) and the like, but these methods have low precision, low efficiency and are not environment-friendly.
Disclosure of Invention
The invention aims to provide a laser processing method and equipment for workpieces plated with DLC and PVD films, which have the advantages of high precision, high efficiency and environmental friendliness in processing the workpieces plated with the DLC and PVD films.
The invention discloses a laser processing method of a workpiece plated with DLC and PVD films, which comprises the following steps:
placing the workpiece plated with the DLC and PVD films on a processing platform, and starting a laser assembly;
adjusting the focal lengths of the first laser and the second laser, and setting laser marking parameters;
irradiating the surface of the workpiece by first laser to strip the DLC and PVD films;
irradiating the surface of the workpiece by using second laser to melt the surface of the workpiece to whiten;
taking out the processed workpiece to finish processing;
the pulse width of the first laser is picosecond, and the pulse width of the second laser is nanosecond.
Optionally, the first laser wavelength is 1064nm, and the maximum power is 20W.
Optionally, the second laser wavelength is 1064nm, and the maximum power is 20W.
Optionally, the focus error of the first laser and the second laser is within 0.3 mm.
Optionally, the marking parameters of the first laser include: the marking speed is 1200-1500mm/s, the energy percentage is 30-60%, the Q frequency is 300-800KHz, the filling distance is 0.015-0.035mm, and the focus position is positive focus.
Optionally, the marking parameters of the first laser include: the marking speed is 600-1000mm/s, the energy percentage is 3-15%, the Q frequency is 50-100KHz, the filling interval is 0.01-0.03mm, and the focus position is positive focus.
Optionally, the laser processing method further includes the steps of:
and (3) carrying out ultrasonic cleaning on the workpiece plated with the DLC and PVD films, and removing oil stains on the surface by using alcohol.
Optionally, the laser processing method further includes the steps of:
and the first laser and the second laser irradiate the surface of the workpiece according to the vector diagram file to form a design pattern.
Optionally, the first laser and the second laser are infrared lasers.
The invention also discloses laser processing equipment which is used for processing the workpiece plated with the DLC and PVD films and comprises a processing platform and a laser assembly. The processing platform is used for placing workpieces plated with DLC and PVD films. The laser assembly is used for emitting first laser and second laser to laser processing of a workpiece. The pulse width of the first laser is picosecond, and the pulse width of the second laser is nanosecond.
The DLC and PVD films are processed by the first laser and the second laser, so that the precision and the efficiency are high, the abrasion of equipment can be reduced, and the production period is greatly shortened; compared with a chemical corrosion process, the method can reduce the use and discharge of chemical substances and is environment-friendly; compared with the traditional numerical control machine tool (CNC) machining, the use of the cutter and the cooling liquid is reduced, and the machining efficiency is higher. In addition, other processing modes cannot achieve the same effect of double-beam laser processing, and compared with other processing modes, the anti-counterfeiting effect is achieved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the embodiments of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention. It is obvious that the drawings in the following description are only some embodiments of the invention, and that for a person skilled in the art, other drawings can be derived from them without inventive effort. In the drawings:
fig. 1 is a flowchart of a laser processing method according to an embodiment of the present invention.
Detailed Description
It is to be understood that the terminology, the specific structural and functional details disclosed herein are for the purpose of describing particular embodiments only, and are representative, but that the present invention may be embodied in many alternate forms and should not be construed as limited to only the embodiments set forth herein.
The invention is described in detail below with reference to the figures and alternative embodiments.
As shown in fig. 1, as an embodiment of the present invention, a laser processing method for a workpiece plated with DLC and PVD films is disclosed, which comprises the steps of:
s100: placing the workpiece plated with the DLC and PVD films on a processing platform, and starting a laser assembly;
s200: adjusting the focal lengths of the first laser and the second laser, and setting laser marking parameters;
s300: irradiating the surface of the workpiece by first laser to strip the DLC and PVD films;
s400: irradiating the surface of the workpiece by using second laser to melt the surface of the workpiece to whiten;
s500: and taking out the processed workpiece to finish processing.
The pulse width of the first laser is picosecond, and the pulse width of the second laser is nanosecond. The workpiece may be stainless steel or other material. In order to conveniently explain the technical scheme, the stainless steel is taken as an example in the application. In step S100, the processing platform is first leveled, and then the laser module is turned on to ensure the laser effect. Specifically, the laser module may employ two laser heads to emit the first laser light and the second laser light, respectively.
In the scheme, the first laser is picosecond laser, and the second laser is nanosecond laser. Firstly, breaking chemical bonds on the surface of a coating material at a focus by using first laser to strip a film on the surface of stainless steel and drive the film to a certain depth, wherein the interaction time of the picosecond-level first laser and the stainless steel is short, and outer layer ions are ablated from the surface of the stainless steel before energy is transferred to surrounding materials to drive the film to a certain depth without bringing heat influence to the surrounding materials; and then, small-energy scanning is carried out on the surface of the workpiece by using second laser to modify the appearance, so that the surface of the stainless steel is slightly melted and whitened to form a deep white mark. The DLC and PVD films are processed by the first laser and the second laser, so that the precision and the efficiency are high, the abrasion of equipment can be reduced, and the production period is greatly shortened; compared with a chemical corrosion process, the method can reduce the use and discharge of chemical substances and is environment-friendly; compared with the traditional numerical control machine tool (CNC) machining, the use of the cutter and the cooling liquid is reduced, and the machining efficiency is higher. In addition, other processing modes cannot achieve the same effect of double-beam laser processing, and compared with other processing modes, the anti-counterfeiting effect is achieved.
In the present invention, the first laser, which is a picosecond laser, may be an infrared picosecond laser, a green picosecond laser, or an ultraviolet picosecond laser, without considering other processing effects. Similarly, the first laser which is the nanosecond laser may be infrared nanosecond laser, green nanosecond laser, or ultraviolet nanosecond laser.
The laser processing method further includes the steps of: and (3) carrying out ultrasonic cleaning on the workpiece plated with the DLC and PVD films, and removing oil stains on the surface by using alcohol. The method comprises the steps of pretreatment, removing dust and oil stains on the surface of stainless steel through ultrasonic cleaning and alcohol, avoiding shielding and reflection of the dust on laser and reflection or refraction of the oil stains on the laser, and improving the laser effect.
Further, the laser processing method further includes the steps of: and the first laser and the second laser irradiate the surface of the workpiece according to the vector diagram file to form a design pattern. The vector drawing file is a pattern to be marked and is drawn by marking software or other drawing software. When other drawing software is drawn, the drawn vector drawing file is led into marking software of laser processing equipment, and the vector drawing file can be amplified and stored before being led in so as to prevent the loss of local details of the drawing file. And controlling the position of the laser point by a high-precision high-speed galvanometer, processing the surface of the stainless steel according to the vector drawing file, and processing the surface of the stainless steel to form a designed pattern.
Further, in step S500, after the processed workpiece is taken out, the stainless steel is subjected to ultrasonic cleaning to remove dust generated on the surface of the stainless steel.
Specifically, the first laser wavelength is 1064nm, the maximum power is 20W, and the laser can be etched to a proper depth. While both too high and too low of the first laser energy may not hit the proper depth. The second laser wavelength is 1064nm, and the maximum power is 20W, so that the surface of the stainless steel is slightly melted and whitened to form a deep white mark. The excessive energy causes the surface of the stainless steel to be vaporized and grayed and darkened. Furthermore, the first laser wavelength and the second laser wavelength can share one set of external optical path system by adopting the same wavelength, and the system is simple and easy to debug. Aiming at stainless steel, the maximum power of 20W is a proper interval, so that the laser energy use efficiency can be improved, and the equipment loss can be reduced.
Further, the first laser and the second laser may be infrared lasers. Compared with green laser with the wavelength of 532nm and ultraviolet laser with the wavelength of 355nm, the device for selecting the red laser with the wavelength of 1064nm has low cost and higher achievable power.
When DLC and PVD films are processed by the first laser and the second laser, the first laser and the second laser are sensitive to energy, the laser focal depth acting on the DLC and PVD films is small, and the smaller focus error has great difference. Therefore, the focus error of the first laser and the second laser is within 0.3mm, the first laser and the second laser are ensured to emit light at the focus as much as possible, and the stability of the laser effect is ensured.
The marking parameters of the first laser include: the marking speed is 1200-1500mm/s, the energy percentage is 30-60%, the Q frequency is 300-800KHz, the filling distance is 0.015-0.035mm, and the focus position is positive focus; the marking parameters of the first laser include: the marking speed is 600-1000mm/s, the energy percentage is 3-15%, the Q frequency is 50-100KHz, the filling interval is 0.01-0.03mm, the focus position is positive focus, a white mark with depth is formed, the precision is high, and the efficiency is high.
For another embodiment of the invention, a laser processing apparatus for processing DLC and PVD film coated workpieces is disclosed, comprising a processing platform and a laser assembly. The processing platform is used for placing workpieces plated with DLC and PVD films. The laser assembly is used for emitting first laser and second laser to laser processing of a workpiece. The pulse width of the first laser is picosecond, and the pulse width of the second laser is nanosecond. Specifically, the laser assembly includes a picosecond laser head for emitting a first laser and a nanosecond laser head for emitting a second laser. The picosecond laser head and the nanosecond laser head can share one set of external light path system, and are concise and easy to debug.
It should be noted that, the limitations of the steps involved in the present disclosure are not considered to limit the order of the steps without affecting the implementation of the specific embodiments, and the steps written in the foregoing may be executed first, or executed later, or even executed simultaneously, and as long as the present disclosure can be implemented, all should be considered to belong to the protection scope of the present disclosure.
The foregoing is a more detailed description of the invention in connection with specific alternative embodiments, and the practice of the invention should not be construed as limited to those descriptions. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.
Claims (10)
1. A laser processing method for a workpiece plated with DLC and PVD films is characterized by comprising the following steps:
placing the workpiece plated with the DLC and PVD films on a processing platform, and starting a laser assembly;
adjusting the focal lengths of the first laser and the second laser, and setting laser marking parameters;
irradiating the surface of the workpiece by first laser to strip the DLC and PVD films;
irradiating the surface of the workpiece by using second laser to melt the surface of the workpiece to whiten;
taking out the processed workpiece to finish processing;
the pulse width of the first laser is picosecond, and the pulse width of the second laser is nanosecond.
2. The method of laser machining a workpiece as defined in claim 1 wherein the first laser wavelength is 1064nm and the maximum power is 20W.
3. The method of laser machining a workpiece as defined in claim 2 wherein the second laser wavelength is 1064nm and the maximum power is 20W.
4. The method of laser machining a workpiece as defined in claim 2, wherein the focus error of the first laser light and the second laser light is within 0.3 mm.
5. The method of laser machining a workpiece as defined in claim 2, wherein the marking parameters of the first laser include: the marking speed is 1200-1500mm/s, the energy percentage is 30-60%, the Q frequency is 300-800KHz, the filling distance is 0.015-0.035mm, and the focus position is positive focus.
6. The method of laser machining a workpiece as defined in claim 3, wherein the marking parameters of the first laser include: the marking speed is 600-1000mm/s, the energy percentage is 3-15%, the Q frequency is 50-100KHz, the filling interval is 0.01-0.03mm, and the focus position is positive focus.
7. The method of laser machining a workpiece according to claim 1, further comprising the steps of:
and (3) carrying out ultrasonic cleaning on the workpiece plated with the DLC and PVD films, and removing oil stains on the surface by using alcohol.
8. The method of laser machining a workpiece according to claim 1, further comprising the steps of:
and the first laser and the second laser irradiate the surface of the workpiece according to the vector diagram file to form a design pattern.
9. The method of claim 2, wherein the first laser and the second laser are infrared lasers.
10. A laser processing apparatus for processing a DLC and PVD film plated workpiece, comprising:
the processing platform is used for placing the workpiece plated with the DLC and PVD films;
the laser assembly is used for emitting first laser and second laser to carry out laser processing on the workpiece;
the pulse width of the first laser is picosecond, and the pulse width of the second laser is nanosecond.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011468897.2A CN112643209A (en) | 2020-12-14 | 2020-12-14 | Laser processing method and device for workpiece plated with DLC and PVD films |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011468897.2A CN112643209A (en) | 2020-12-14 | 2020-12-14 | Laser processing method and device for workpiece plated with DLC and PVD films |
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| Publication Number | Publication Date |
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| CN112643209A true CN112643209A (en) | 2021-04-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202011468897.2A Withdrawn CN112643209A (en) | 2020-12-14 | 2020-12-14 | Laser processing method and device for workpiece plated with DLC and PVD films |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1981291A (en) * | 2004-06-30 | 2007-06-13 | 通明国际科技有限公司 | Laser-based method and system for processing targeted surface material and article produced thereby |
| CN102026770A (en) * | 2008-05-13 | 2011-04-20 | 旭硝子株式会社 | Substrate with oxide layer and manufacturing method thereof |
| CN108393590A (en) * | 2018-01-16 | 2018-08-14 | 武汉华工激光工程有限责任公司 | The process of the surfaces laser ablation sapphire 3D PVD coating |
| CN110744205A (en) * | 2019-10-22 | 2020-02-04 | 大族激光科技产业集团股份有限公司 | Laser depth marking method for titanium-based multilayer composite material |
-
2020
- 2020-12-14 CN CN202011468897.2A patent/CN112643209A/en not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1981291A (en) * | 2004-06-30 | 2007-06-13 | 通明国际科技有限公司 | Laser-based method and system for processing targeted surface material and article produced thereby |
| CN102026770A (en) * | 2008-05-13 | 2011-04-20 | 旭硝子株式会社 | Substrate with oxide layer and manufacturing method thereof |
| CN108393590A (en) * | 2018-01-16 | 2018-08-14 | 武汉华工激光工程有限责任公司 | The process of the surfaces laser ablation sapphire 3D PVD coating |
| CN110744205A (en) * | 2019-10-22 | 2020-02-04 | 大族激光科技产业集团股份有限公司 | Laser depth marking method for titanium-based multilayer composite material |
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Application publication date: 20210413 |
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