JP2010052024A - Working apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a working apparatus which can perform such treatments as soldering, brazing, welding, fusing, heating and UV curing on a work to be treated with a high efficiency. <P>SOLUTION: The working apparatus includes a stage to hold a plurality of work aligned in one direction in a designated interval, an optical source, a first shaping optical system to shape a beam from the optical source into a first optical beam having a designated transverse cross section, a second shaping optical system to shape the first optical beam into a plurality of second optical beams which are discretely arranged in an interval corresponding to the interval of the plurality of work, and a relative movement means which moves the first optical beam and the second shaping optical system relatively in the one direction. The plurality of second optical beams irradiate the plurality of work one by one through the relative movement using the relative movement means. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a processing apparatus, and more particularly, to a processing apparatus that uses laser light to perform soldering, brazing, welding, fusing, heating, or ultraviolet curing.

With high integration and high density mounting of semiconductor devices, for example, work for soldering high integration and high density components on a printed circuit board is increasing. Laser soldering apparatuses are widely used for soldering such highly integrated and high density components.
A laser soldering apparatus performs soldering by sequentially irradiating and heating a plurality of conductor parts arranged at a fine pitch with laser light having a small diameter (Patent Document 1).

Japanese Patent Laid-Open No. 2002-1521

However, since the laser soldering apparatus described in Patent Document 1 performs soldering by sequentially irradiating each of a large number of conductor parts arranged at a fine pitch with laser light, There was a problem that work time was required and workability was very bad. In particular, there is a problem that the working efficiency decreases as the number of conductor parts arranged increases.
Such a problem is not limited to the above-described laser soldering apparatus, and a large number of parts arranged at a fine pitch are processed by laser light, for example, brazing, welding, fusing, heating, This is a problem common to processing apparatuses that perform ultraviolet curing.

The processing apparatus according to claim 1 is:
A stage for placing a plurality of workpieces arranged at predetermined intervals in one direction;
A light source;
A first shaping optical system for shaping a light beam from the light source into a first light beam having a predetermined cross-sectional shape;
A second shaping optical system for shaping the first light flux into a plurality of discrete second light fluxes having an interval corresponding to an interval between the plurality of workpieces;
Relative movement means for relatively moving the first light flux and the second shaping optical system in the one direction;
With
The plurality of second light fluxes sequentially irradiate the plurality of workpieces by the relative movement by the relative movement unit.

According to the present invention, a plurality of second light fluxes are created by the second shaping optical system, and the plurality of second light fluxes sequentially irradiate the plurality of work pieces by the relative movement means, so that the work pieces are extremely efficiently handled. Can be processed.
Further, the sequential irradiation of the plurality of second light fluxes by the relative moving means can make the respective irradiation amounts to the plurality of workpieces substantially uniform.

-First embodiment-
A first embodiment in which the present invention is applied to a laser soldering apparatus will be described.
FIG. 1 and FIG. 2 are a schematic front view and a schematic side view, respectively, schematically showing the laser soldering apparatus of the first embodiment of the present invention.
1 and 2, a large number of soldering objects 2 are placed on a stage 1 that can reciprocate in the X direction. As shown in FIG. 3, each soldering object 2 includes a conductor pattern 4 formed on the printed circuit board 3 and leads 5 placed on each conductor pattern 4.
A large number of conductor patterns 4 are arranged at a constant interval D along the X direction. This interval, that is, the pitch D is, for example, 200 μm. The shape of the conductor pattern 4 is, for example, a substantially rectangular shape elongated in the Y direction perpendicular to the X direction.
The lead 5 placed on each conductor pattern 4 extends in the Y direction, and the lead 5 is covered with a preliminary solder 6. The lead 5 has a portion of the preliminary solder 6 in contact with the conductor pattern 4. FIG. 4 shows the cross-sectional shapes of the conductor pattern 4, the lead 5, and the preliminary solder 6.
Note that several tens or more of the conductor patterns 4 and leads 5 are arranged, but only four are shown in FIGS. 1 and 3.

1 and 2 again, the laser light 8 from the laser light source 7 is changed to a parallel light beam 8 a by the collimator lens 9. The parallel light beam 8a enters the cylindrical lens 10, passes through the cylindrical lens 10, and enters the cylindrical lens array 11 as a light beam 8b.
The cylindrical lens 10 does not have lens power in the X direction, but has lens power in the direction perpendicular to the paper surface. Accordingly, the laser parallel light beam 8a incident on the cylindrical lens 10 passes through the cylindrical lens 10 as it is in the front view shown in FIG. 1, that is, without receiving the lens action, but in the side view of FIG. 10, the laser beam 8b is subjected to a converging action, that is, a condensing action.
Thus, the cross-sectional shape of the light beam 8b on the cylindrical lens array 11 becomes a shape in which the width in the direction perpendicular to the X direction is narrowed from the cross-sectional shape of the parallel light beam 8a.

As shown in FIG. 5, the cylindrical lens array 11 includes a large number of small cylindrical lenses 11a, 11b, 11c, and 11d arranged in the X direction.
These cylindrical lenses 11a, 11b, 11c, and 11d have the same shape, and are bonded to each other on their side surfaces. Further, the arrangement pitch of the cylindrical lenses 11a, 11b, 11c, and 11d is determined to be the same as the arrangement pitch D of the conductor pattern 4.
Further, the axial length L of the cylindrical lenses 11a, 11b, 11c, and 11d is set to be larger than the length of the preliminary solder 6 of the lead 5 as shown in FIG.
The cylindrical lens array 11 having such a configuration converts the incident laser beam 8b into four discrete laser beams 8c that are discrete from each other by the cylindrical lenses 11a, 11b, 11c, and 11d as shown in FIG. In other words, the cylindrical lens array 11 shapes the laser beam 8b into a plurality of discrete laser beams 8c.
In FIGS. 1 and 5, only four cylindrical lenses 11a, 11b, 11c, and 11d are shown in order to avoid complication of the drawings.

1 is determined such that the width W in the X direction is equal to or greater than the total width 4D of the cylindrical lens array 11 as shown in FIGS. 1 and 6A.
As described above, the collimator lens 9 and the cylindrical lens 10 constitute a first shaping optical system that shapes the laser light 8 from the laser light source 1 into a light beam 8b having a predetermined cross-sectional shape.
A masking plate 12 is provided around the cylindrical lens array 11, and the masking plate 12 shields the periphery of the cylindrical lens array 11 to ensure that the light beam 8 b passes only through the cylindrical lens array 11.

The stage 1 is driven by the driving device 13 so as to reciprocate in the X direction.
The laser light source 7, the collimator lens 9, and the cylindrical lens 10 are integrally held by a frame member (not shown).
Further, the stage 1, the cylindrical lens array 11, and the masking plate 12 are integrally held by a frame member that is not shown. For example, the cylindrical lens array 11 and the masking plate 12 are attached to a support member (not shown) fixed to the stage 1.
A block 14 indicated by a two-dot broken line indicates that the laser light source 7, the collimator lens 9 and the cylindrical lens 10 are integrally held. Similarly, a block 15 indicated by a two-dot broken line indicates the stage 1 and the cylindrical lens. This shows that the array 11 and the masking plate 12 are held together.

  Thus, when the driving device 13 moves the stage 1 in the X direction, the cylindrical lens array 11 and the masking plate 12 are also moved in the same direction integrally with the stage 1, whereby the stage 1, the cylindrical lens array 11 and the masking plate 12 are moved. And move relative to the laser beam 8b.

Next, the operation of the laser soldering apparatus according to the first embodiment of the present invention will be described.
1 and 2, the soldering object 2 is placed on the stage 1. At this time, each of the soldering objects 2 is positioned so as to be located immediately below the corresponding four cylindrical lenses 11a, 11b, 11c, and 11d.
Further, as shown in FIG. 6A, the positional relationship between the stage 1 and the laser beam 8b is determined so that the entire laser beam 8b is positioned on the masking plate 12 and is blocked by the light. Yes.

In this state, the soldering operation is started as follows.
In FIG. 6A, as the stage 1 is moved leftward by the driving device 13 at a constant speed, that is, at a constant speed, a part of the laser light beam 8b starts to enter the cylindrical lens 11a.
When the stage 1 reaches the position shown in FIG. 6B, the leftmost cylindrical lens 11a converts the laser beam 8b into the laser beam 8c. The laser beam 8c irradiates the preliminary solder 6 and the conductor pattern 4 located at the left end.
As the stage 1 moves further, the laser beam 8b sequentially enters the cylindrical lenses 11b, 11c, and 11d, and the cylindrical lenses 11b, 11c, and 11d also convert the laser beam 8b into discrete laser beams 8c. Convert.
In FIG. 6C, the laser beam 8b is incident on the entire cylindrical lens array 11, and the laser beam 8c formed by all the cylindrical lenses 11a, 11b, 11c, and 11d is bonded to all the preliminary solder 6 and the conductor pattern 4. It shows a state where they are simultaneously irradiated and heated.
When the stage 1 is further moved to the left and all laser beams 8b come off the cylindrical lens array 11 and are shielded by the masking plate 12 as shown in FIG. 6D, the stage 1 stops there. Is done.
Thus, the laser beam 8b and the stage 1 are moved at a relatively constant speed so that one end and the other end of the beam 8b in the X direction cross the optical axes of all the cylindrical lenses 11a, 11b, 11c, and 11d. During the constant speed movement, all the preliminary solder 6 and the conductor pattern 4 are heated by the laser beam 8c, and the soldering operation is performed.

Next, the function of the cylindrical lens array 11 will be described in detail.
As the stage 1 moves to the left from the position shown in FIG. 6A, the cylindrical lenses 11a, 11b, 11c, and 11d sequentially convert the incident laser beam 8b into a discrete laser beam 8c. .
Therefore, even if the illuminance is not uniform in the X direction in the cross section of the laser beam 8b, the laser beam is moved by moving the stage 1 from the position of FIG. 6 (a) to the position of FIG. 6 (d). The total irradiation amount to each pre-solder 6 of 8c is the same.

  In the above description, the object 2 to be soldered has the preliminary solder 6 attached to the lead 5, but may be attached to the conductor pattern 4. Further, the soldering object 2 may be one in which cream solder is applied to the lead 5 and the conductor pattern 4 instead of the preliminary solder 6.

According to the laser soldering apparatus according to the first embodiment described above, the following operational effects can be obtained.
(1) Since the arrangement of the cylindrical lenses 11a, 11b, 11c, and 11d of the cylindrical lens array 11 is determined to be equal to the arrangement pitch D of the soldering object 2 shown in FIG. Each of the soldering objects 2 is not required to be aligned, and the relative movement between the stage 1 and the laser beam 8b allows all the soldering objects 2 to be soldered in a short time, resulting in very high work efficiency. To be high.
(2) Even if the illuminance is non-uniform in the X direction, that is, the relative movement direction of the laser beam 8b, the integration of the laser beam 8c to each soldering object 2 by the relative movement of the stage 1 and the laser beam 8b. Since the irradiation amounts are the same, each soldering object 2 is soldered under the same conditions, and uniform soldering without variation is obtained.
(3) Since a large number of laser light beams 8c are discrete light beams having a predetermined distance from each other,
The laser light is never irradiated to the area between the adjacent soldering objects 2, and thus it is possible to prevent the parts located between the adjacent soldering objects from being damaged by heating.

In the laser soldering apparatus according to the first embodiment described above, the stage 1 side, that is, the block 15 is moved. Instead, the block 14 is replaced with the laser light source 7 and the collimator lens 9. The cylindrical lens 10 may be moved integrally at a constant speed. As a result, the laser beam 8 b is moved relative to the cylindrical lens array 11.
Furthermore, in order to move the light beam 8b relative to the cylindrical lens array 11, instead of moving the entire block 14, a polygon mirror and an fθ lens are arranged in the optical path of the light beam 8b. The light beam 8b may be moved at a constant speed in the X direction by the rotation of.

Next, the relationship between the width W of the laser beam 8b shown in FIG. 6A and the total width 4D of the cylindrical lens array 11 will be described.
As described above, the width W of the laser beam 8b is determined to be equal to or larger than the total width 4D of the cylindrical lens array 11 as shown in FIG. 6C. The laser beam 8b is incident on all the cylindrical lenses 11a to 11d at the same time. Therefore, work efficiency can be improved.
However, when the number of the soldering objects 2 becomes very large and the entire width of the cylindrical lens array 11 becomes very large, if the width of the laser beam b is increased accordingly, the laser beam b is increased. The illuminance of 8b is lowered and the soldering object 2 cannot be sufficiently heated.
Therefore, when the entire width of the cylindrical lens array 11 is very large, it is desirable to set the width W of the laser light beam 8b to be smaller than the entire width of the cylindrical lens array 11.

-Second embodiment-
Next, a laser soldering apparatus according to a second embodiment of the present invention will be described.
In FIG. 7, a pattern mask 16 is disposed at the imaging position of the cylindrical lens array 11, and the pattern mask 16 has a predetermined size at the position of the imaging point 17 of each cylindrical lens 11a, 11b, 11c, 11d, 11e. Having an opening 16a. Each of the discrete laser beams 8c passes through the opening 16a and enters the zoom relay lens 18.
Each laser beam 8c incident on the zoom relay lens 18 passes through the zoom relay lens 18, is converted into a discrete laser beam 8d, and irradiates the soldering object 2. In other words, the zoom relay lens 18 re-images each imaging point 17 of each of the cylindrical lenses 11a, 11b, 11c, 11d, and 11e on a re-imaging point 19 on the soldering object 2.

The zoom relay lens 18 has a variable focal length, and by adjusting the focal length, the distance d can be changed without changing the position of each reimaging point 19 in the optical axis direction.
Further, the zoom relay lens 18 enlarges or reduces the size of the projected image of the opening 16a of the pattern mask 16 at the re-imaging point 19 according to the focal length. It is desirable that the size of the projected image of the opening 16a of the pattern mask 16 corresponds to the size of the soldering object. Therefore, a plurality of pattern masks 16 having different sizes and shapes of the openings 16a are prepared, and the pattern mask 16 is configured so as to be inserted into and removed from the laser beam path, depending on the size and shape of the soldering object. It is desirable to insert the most suitable pattern mask into the laser beam path.

The opening 16a of the pattern mask 16 is determined so that its size and shape correspond to the size and shape of the soldering object 2. By determining in this way, the laser beam 8d can irradiate only the soldering point of the object to be soldered, and can prevent other portions from being irradiated.
Other configurations such as a laser light source, a collimator lens, and a cylindrical lens are the same as those of the laser soldering apparatus according to the first embodiment.

Next, the operation of the laser soldering apparatus according to the second embodiment will be described.
The soldering object 2 is placed on the stage 1. At this time, the focal distance of the zoom relay lens 18 is adjusted based on the arrangement pitch d of the placed soldering object 2, and the interval between the re-imaging points 19 is set to the arrangement pitch d of the soldering object 2. To match.
Since the subsequent operation is the same as the operation of the laser soldering apparatus according to the first embodiment, the description thereof is omitted.

According to the laser soldering apparatus according to the second embodiment described above, the following actions and effects can be obtained in addition to the actions and effects obtained by the laser soldering apparatus according to the first embodiment.
(1) Even with respect to the soldering object 2 having different arrangement pitch d, by adjusting the focal length of the zoom relay lens 18, the cylindrical lenses 11a to 11e can be replaced with cylindrical lenses having different pitches. The laser beam 8d can be accurately irradiated onto the soldering object.
(2) When stray light such as laser scattered light reaches and irradiates an electronic component or the like existing between adjacent soldering objects 2, the electronic component may be damaged. Therefore, it is possible to reliably prevent damage to the electronic parts and the like.

--Third embodiment--
Next, a laser soldering apparatus according to a third embodiment of the present invention will be described.
As shown in FIGS. 1 to 4, when a large number of conductor patterns 4 and a large number of leads 5 are placed on the stage 1, the preliminary solder 6 of all the leads 5 is in contact with the conductor pattern 4. Thus, the soldering operation can be performed well.
However, when the preliminary solder 6 of some of the multiple leads 5 is slightly lifted from the conductor pattern 4, the lifted preliminary solder 6 is likely to be poorly soldered.
Therefore, the laser soldering apparatus according to the third embodiment of the present invention is provided with a mechanism for preventing such soldering failure. This will be described in detail below.

FIG. 8 is an enlarged view of the presser 20 that presses the lead downward. The presser 20 has its distal end branched to form a large number of engagement pieces 21. Each engagement piece 21 is cut at the tip, and a depression or notch 21a is formed. The arrangement pitch P of the engagement pieces 21 is determined to be equal to the arrangement pitch of the soldering object 2 and is, for example, about 200 μm.
The material of the presser 20 having such a configuration is desirably a fluororesin such as Teflon (registered trademark) having elasticity and low thermal conductivity.
FIG. 9 is an enlarged perspective view showing a state where one engagement piece 21 presses the lead.
In FIG. 8, a part of the lead 5 extending from the cable C is covered with a preliminary solder 6. The lead 5 is placed on the conductor pattern 4 so that the preliminary solder 6 contacts the conductor pattern 4.
The notch 21a at the tip of the engaging piece 21 of the presser engages with the tip 5a of the lead 5 and elastically presses the lead 5 downward. As a result, the preliminary solder 6 is also pressed downward so as to contact the conductor pattern 4.
Thus, the engagement piece 21 engages with the tip 5a of the lead 5 extended from the cable C and presses the lead 5 downward. Therefore, even if the lead 5 or the pre-solder 6 is lifted from the conductor pattern 4 and the pre-solder 6 is not sufficiently in contact with the conductor pattern 4, the engaging piece 21 moves the lifted lead 5 downward. The preliminary solder 6 can be brought into contact with the conductor pattern 4 by pressing.

Although FIG. 9 shows a state where one engagement piece 21 is engaged with one lead 5 and elastically pressed, the presser 20 has a large number of engagement pieces 21 arranged at a pitch P. The leads 5 are respectively engaged with the leads 5 arranged at the same pitch to elastically press the leads 5.
Since the engaging piece 21 is made of an elastic material and can be elastically deformed independently of each other, each of the lifted lead 5 and the non-lifted lead 5 is further different even when there is a difference in the lift amount. The preliminary solder 6 can be brought into contact with the conductor pattern 4.
FIG. 9 shows an example in which the tip 5a of the lead 5 is pressed using one presser. However, as will be described in detail later with reference to FIG. 5 can be pressed on both sides of the preliminary solder 6.
In this case, the engaging piece 21 of one presser is engaged with the tip 5a of the lead 5 as shown in FIG. 9, and the engaging piece of the other presser is the lead 5 extended from the cable C. Engage with and press the end portion 5b. In this way, by pressing the lead 5 on both sides of the preliminary solder 6 using the two pressers 20, the preliminary solder 6 can be brought into contact with the conductor pattern 4 more reliably.

FIG. 10 is a front view showing a support structure of the presser 20.
In FIG. 10, the stage 1 is movable in the direction perpendicular to the paper surface. A large number of conductor patterns 4 and a large number of leads 5 of cables C are placed on the stage 1 as objects to be soldered. The conductor pattern 4 and the lead 5 of the cable C are arranged at predetermined intervals in a direction perpendicular to the paper surface. The lead 5 is positioned so that the preliminary solder 6 is placed on the conductor pattern 4.
A support 22 is fixed to one end of the stage 1, and a support member 22 a is projected from the support 22. A holding plate 23 is supported by the support member 22a so as to be pivotable by a pivot 24 at one end. The holding plate 23 can be rotated between a horizontal position shown in the figure and a vertical position rotated 90 ° from the horizontal position in the direction of the arrow. When the holding plate 23 is in a horizontal position, the holding plate 23 is parallel to the stage 1.

The holding plate 23 has an opening 23a at a predetermined position, and holds the cylindrical lens array 11 above the opening 23a. The cylindrical lens array 11 has a large number of cylindrical lenses arranged in a direction perpendicular to the paper surface.
A pair of pressers 20, 20 are fixed to the lower surface of the holding plate 23 at one end, and these pressers 20, 20 hang obliquely from the lower surface of the holding plate 23. The fixing positions of the pressers 20 and 20 with respect to the holding plate 23 are determined so that the opening 23a of the holding plate 23 is positioned between both the pressers.
The reason why the pressers 20, 20 hang obliquely from the holding plate 23 is to ensure that the large number of engagement pieces 21 are elastically deformed independently of each other. As a result, the engagement piece 21 can engage with all the leads 5 and reliably press the lead 5 to bring the preliminary solder 6 into contact with the conductor pattern 4.
The horizontal position of the holding plate 23 is determined so that the imaging point of each cylindrical lens of the cylindrical lens array 11 is positioned on the soldering objects 4 and 6.
The pressers 20, 20 that hang obliquely from the holding plate 23 engage with a number of leads 5 that are placed on the stage 1, respectively, and press the leads 5 downward. To do.

In such a state, by moving the stage 1 in a direction perpendicular to the paper surface, the laser light beam 8 b incident on the cylindrical lens array 11 is converted into a discrete light beam 8 c by each cylindrical lens of the cylindrical lens array 11. The respective soldering objects are sequentially irradiated and heated.
When the preliminary solder 6 is melted by this heating, the lead 5 that is elastically pressed by the presser 20 further descends and directly contacts the conductor pattern 4. A large number of preliminary solders 6 are melted sequentially as the stage 1 moves, and the engagement pieces 21 of the presser 20 lower the leads 5 that have started melting one after another to directly contact the conductor pattern.
Thus, the presser 20 brings all the leads 5 into direct contact with the conductor pattern 4 as the preliminary solder 6 melts.
Such sequential lowering of the lead 5 is achieved by the engagement pieces 21 of the presser 20 elastically biasing the lead 5 independently of each other.

Thus, when the laser soldering process is finished, the holding plate 23 is turned in the direction of the arrow and moved to the vertical position, and then the soldering object for which the soldering work is finished is taken out from the stage 1.
After that, when a new soldering object is placed on the stage 1, the holding plate 23 is swung down from the vertical position to the horizontal position, and the engagement pieces 21 of the pair of pressers 20, 20 are shown in FIG. 10. Engage with lead 5 as shown.

The interval between the cylindrical lens array 11 and the soldering object on the stage 1 needs to be set accurately so that the imaging position of the cylindrical lens matches the soldering object. Similarly, the positional relationship between the presser 20 and the soldering object needs to be accurately set so that the engaging piece 21 of the presser engages the lead 5.
For these reasons, the cylindrical lens array 11 and the presser 20 are both supported by the holding plate 23.
When the thickness of the soldering object placed on the stage 1, that is, the height of the soldering point of the soldering object differs greatly depending on the soldering object, the support member 22a is used as a support column. It is desirable to have a configuration that can move minutely in the vertical direction with respect to 22.
As a result, when the soldering object is relatively thick, the support member 22a is moved upward according to the thickness, and the holding plate 23 is raised by a small amount. Conversely, when the thickness of the soldering object is relatively thin, the support member 22a is moved downward accordingly, and the holding plate 23 is lowered by a minute amount. Thereby, the laser beam 8c can irradiate the soldering point of the soldering object regardless of the thickness difference of the soldering object.

  The presser 20 is preferably made of a material having low thermal conductivity. When the engagement piece 21 is engaged with the lead 5, the heat generated when the laser beam irradiates and heats the preliminary solder when the engagement piece 21 is engaged with the lead 5. This is to prevent leakage from 21.

  The various embodiments of the present invention described above all relate to the laser soldering apparatus. However, the present invention is not limited to these, and brazing, welding, fusing, heating, ultraviolet rays, and the like. The present invention can be applied to various processing apparatuses that perform curing processing and the like.

  As long as the characteristics of the present invention are not impaired, the present invention is not limited to the above-described embodiments, and other forms conceivable within the scope of the technical idea of the present invention are also included in the scope of the present invention. .

The schematic front view which showed the whole structure of the laser soldering apparatus which concerns on the 1st Embodiment of this invention. The schematic side view which showed the whole structure of the laser soldering apparatus which concerns on the 1st Embodiment of this invention. The top view which showed the soldering target object. Sectional drawing which showed the soldering target object. The perspective view which showed the cylindrical lens array. Sectional drawing which showed the effect | action of the cylindrical lens array. Sectional drawing which showed the principal part of the laser soldering apparatus which concerns on the 2nd Embodiment of this invention. The perspective view which showed the pressing tool of the laser soldering apparatus which concerns on the 3rd Embodiment of this invention. The perspective view which shows the effect | action of a presser. The front view which showed the principal part of the laser soldering apparatus which concerns on 3rd Embodiment.

Explanation of symbols

1: Stage, 2: Soldering object, 4: Conductor pattern, 5: Lead, 6: Pre-solder, 7: Laser light source, 8: Laser beam, 8b: Laser beam, 8c: Laser beam, 9: Collimator lens 10: Cylindrical lens, 11: Cylindrical lens array

Claims (13)

A stage for placing a plurality of workpieces arranged at predetermined intervals in one direction;
A light source;
A first shaping optical system for shaping a light beam from the light source into a first light beam having a predetermined cross-sectional shape;
A second shaping optical system for shaping the first light flux into a plurality of discrete second light fluxes having an interval corresponding to an interval between the plurality of workpieces;
Relative movement means for relatively moving the first light flux and the second shaping optical system in the one direction;
With
The plurality of second light beams irradiate the plurality of workpieces sequentially by the relative movement by the relative movement means. The processing apparatus according to claim 1,
The relative movement means moves the second shaping optical system and the stage integrally with respect to the first shaping optical system. The processing apparatus according to claim 1,
The processing apparatus according to claim 1, wherein the relative moving unit moves the first shaping optical system with respect to the second shaping optical system. The processing apparatus according to claim 1,
The relative movement means moves the first light beam with respect to the second shaping optical system. The processing apparatus according to claim 1,
The second shaping optical system includes a plurality of small lenses arranged in the one direction,
Each of the small lenses creates the second light flux,
The processing apparatus according to claim 1, wherein the number of the plurality of small lenses is at least the same as the number of the plurality of workpieces. The processing apparatus according to claim 1,
The second shaping optical system includes a plurality of small lenses arranged in the one direction,
Each of the small lenses creates the second light flux,
The processing apparatus according to claim 1, wherein a length of the first light beam in the cross-sectional shape in the one direction is substantially equal to a full width of the plurality of small lenses. The processing apparatus according to claim 5, wherein
The relative movement means is configured to cause the first light beam and the second shaping so that one end and the other end of the first light beam in the one direction substantially cross all optical axes of the plurality of small lenses. A processing apparatus characterized by moving relative to an optical system. In the processing apparatus according to claim 5,
The workpiece is an extension extending in a direction substantially perpendicular to the one direction;
Each of the plurality of small lenses is a cylindrical lens extending in the vertical direction. In the processing apparatus according to claim 5,
The second shaping optical system further includes a relay lens having an adjustable focal length disposed between the plurality of small lenses and the plurality of workpieces,
The relay lens re-images the images formed by the plurality of small lenses in the vicinity of the plurality of workpieces, respectively.
The processing device, wherein the relay lens changes an interval between the plurality of second light beams by adjusting a focal length thereof. In the processing apparatus according to claim 5,
The second shaping optical system further includes a relay lens having an adjustable focal length disposed between the plurality of small lenses and the plurality of workpieces,
The relay lens re-images the images formed by the plurality of small lenses in the vicinity of the plurality of workpieces, respectively.
The second shaping optical system further includes a mask having an opening at each imaging position by the plurality of small lenses,
The processing apparatus characterized in that the opening of the mask corresponds to the size of the workpiece. The processing apparatus according to claim 1,
Each of the plurality of workpieces includes a first workpiece piece and a second workpiece piece,
The processing apparatus, wherein the second light beam irradiates at least one of the first and second workpiece pieces to join the first and second workpiece pieces. The processing apparatus according to claim 11, wherein
The first workpiece is placed on the stage;
The second workpiece is placed on the first workpiece;
The second luminous flux irradiates at least a predetermined portion of the second workpiece;
A first presser having a plurality of engagement pieces that elastically press each of the second workpiece pieces in a direction in which each of the second workpiece pieces comes into contact with each of the first workpiece pieces. A processing apparatus further comprising a tool. The processing apparatus according to claim 12, wherein
A second presser having a plurality of engaging pieces that elastically press each of the second workpiece pieces in a direction in which each of the second workpiece pieces comes into contact with each of the first workpiece pieces. Further equipped with tools,
The engagement piece of the first presser and the engagement piece of the second presser respectively press the second workpiece piece with the predetermined portion irradiated by the second light flux interposed therebetween. A processing apparatus characterized by that.

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