CN115138988A - Laser cutting method, system, device and computer readable storage medium - Google Patents
Laser cutting method, system, device and computer readable storage medium Download PDFInfo
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- CN115138988A CN115138988A CN202210785410.6A CN202210785410A CN115138988A CN 115138988 A CN115138988 A CN 115138988A CN 202210785410 A CN202210785410 A CN 202210785410A CN 115138988 A CN115138988 A CN 115138988A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T1/00—General purpose image data processing
- G06T1/0014—Image feed-back for automatic industrial control, e.g. robot with camera
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/70—Determining position or orientation of objects or cameras
Abstract
The invention discloses a laser cutting method, a laser cutting system, laser cutting equipment and a computer readable storage medium, and belongs to the laser cutting technology. The laser cutting method comprises the steps of judging the position and the material quality of each layer of material in the multilayer composite material, determining the corresponding wave band according to the material quality of each layer of material, and further sequentially emitting laser corresponding to the wave band to different corresponding laser focus positions according to the position of each layer of material so as to realize the laser cutting of the multilayer composite material. The problem of multilayer combined material because each layer material is different and the cutting effect is poor is solved, the cutting to multilayer combined material has been realized.
Description
Technical Field
The present invention relates to the field of laser cutting technologies, and in particular, to a laser cutting method, a laser cutting system, a laser cutting apparatus, and a computer-readable storage medium.
Background
The cutting method which is widely applied at present is a mechanical cutting method. The cutting of the multilayer material can be performed by a mechanical cutting method, however, when the hardness of the material is high, it is difficult to use a mechanical cutting technique, the requirement for the cutter head is high, and phenomena such as frictional heat generation are generated. Therefore, the applicable material range of the mechanical slicing is small.
The prior art often uses laser cutting methods instead of mechanical cutting methods to cut different types of materials. However, when the conventional laser cutting technology cuts a multilayer composite material, the energy required for laser cutting is different because the absorption rates of different materials are different, and the multilayer composite material cannot be cut.
Disclosure of Invention
The invention mainly aims to provide a laser cutting method, a laser cutting system, laser cutting equipment and a computer readable storage medium, and aims to realize cutting of multilayer composite materials.
In order to achieve the above object, the present invention provides a laser cutting method, including the steps of:
when detecting a multilayer composite material to be cut, judging the position and the material of each layer of material in the multilayer composite material;
determining corresponding wave bands according to the material of each layer of material;
and sequentially emitting laser corresponding to the wave band to the corresponding laser focus position according to the position of each layer of material so as to cut the multilayer composite material.
Optionally, the step of sequentially emitting laser corresponding to the wavelength band to a corresponding laser focus position according to the position of each layer of material to cut the multilayer composite material includes:
setting multiband laser parameters based on the waveband;
and controlling the multiband laser to sequentially emit laser corresponding to the wave band to the corresponding laser focus position according to the parameters of the multiband laser so as to cut the multilayer composite material according to the position of each layer of material.
Optionally, the step of sequentially emitting laser corresponding to the wavelength band to a corresponding laser focus position according to the position of each layer of material to cut the multilayer composite material includes:
selecting corresponding single-waveband lasers according to the waveband, wherein the number of the single-waveband lasers is greater than or equal to the number of materials in the multilayer composite material;
and according to the positions of the materials of all layers, sequentially controlling the corresponding single-waveband laser to emit laser corresponding to the waveband to the corresponding laser focus position so as to cut the multilayer composite material.
Optionally, before the step of sequentially emitting laser corresponding to the wavelength band to the corresponding laser focus position according to the position of each layer of material to cut the multilayer composite material, the method further includes:
obtaining the thickness of each layer of material;
and confirming the corresponding laser focus position according to the position of each layer material and the thickness.
Optionally, the step of confirming the corresponding laser focus position according to the position and the thickness of each layer of material includes:
judging whether the thickness of each layer of material is greater than a preset threshold value or not;
if the thickness is larger than a preset threshold value, confirming the number of laser focuses according to the thickness;
confirming the corresponding laser focus position according to the position, the thickness and the laser focus number of each layer of material;
optionally, the step of sequentially emitting laser corresponding to the wavelength band to a corresponding laser focus position according to the position of each layer of material to cut the multilayer composite material includes:
and sequentially emitting laser corresponding to the wave band to the corresponding laser focus position according to the position of each layer of material, and controlling a galvanometer to move according to a preset laser cutting path so as to cut the multilayer composite material.
Optionally, before the step of sequentially emitting laser corresponding to the wavelength band to a corresponding laser focus position according to the position of each layer of material, and controlling a galvanometer to move according to a preset laser cutting path to cut the multilayer composite material, the method further includes:
confirming the laser cutting path according to the cutting requirement of the multilayer composite material.
In addition, to achieve the above object, the present invention also provides a laser cutting system, including:
the detection module is used for judging the position and the material of each layer of material in the multilayer composite material when the multilayer composite material to be cut is detected;
the selection module is used for determining corresponding wave bands according to the materials of all layers;
and the laser module is used for sequentially emitting laser corresponding to the wave band to the corresponding laser focus position according to the position of each layer of material so as to cut the multilayer composite material.
Optionally, the system further comprises:
the parameter adjusting module is used for setting parameters of the multiband laser based on the wave band; and controlling the multiband laser to sequentially emit laser corresponding to the wave band to the corresponding laser focus position according to the parameters of the multiband laser so as to cut the multilayer composite material.
Optionally, the parameter adjusting module is further configured to:
selecting corresponding single-waveband lasers according to the wavebands, wherein the number of the single-waveband lasers is larger than or equal to the number of materials in the multilayer composite material;
and according to the positions of the materials of all layers, sequentially controlling the corresponding single-waveband laser to emit laser corresponding to the waveband to the corresponding laser focus position so as to cut the multilayer composite material.
Optionally, the laser module is further configured to:
obtaining the thickness of each layer of material;
confirming the corresponding laser focus position according to the position and the thickness of each layer of material;
optionally, the laser module is further configured to:
judging whether the thickness of each layer of material is greater than a preset threshold value or not;
if the thickness is larger than a preset threshold value, confirming the number of laser focuses according to the thickness;
confirming the corresponding laser focus position according to the position, the thickness and the laser focus number of each layer of material;
optionally, the apparatus further comprises:
and the motion control module is used for controlling the galvanometer to move according to a preset laser cutting path so as to cut the multilayer composite material.
Optionally, the motion control module is further configured to:
confirming the laser cutting path according to the cutting requirement of the multilayer composite material.
In addition, to achieve the above object, the present invention also provides a laser cutting apparatus, comprising: a memory, a processor and a laser cutting program stored on the memory and executable on the processor, the laser cutting program being configured to implement the steps of the laser cutting method as described above.
In addition, to achieve the above object, the present invention also provides a computer readable storage medium having a laser cutting program stored thereon, which when executed by a processor implements the steps of the laser cutting method as described above.
The laser cutting method, the laser cutting system, the laser cutting equipment and the computer readable storage medium provided by the invention realize the laser cutting of the multilayer composite material by judging the position and the material of each layer of material in the multilayer composite material, determining the corresponding wave band according to the material of each layer of material and further sequentially emitting the laser corresponding to the wave band according to the position of each layer of material. The problem of multilayer combined material because each layer material is different and the cutting effect is poor is solved, the cutting to multilayer combined material has been realized.
Drawings
FIG. 1 is a schematic structural diagram of a laser cutting apparatus in a hardware operating environment according to an embodiment of the present invention;
FIG. 2 is a schematic flow chart of a first embodiment of a laser cutting method according to the present invention;
FIG. 3 is a flowchart illustrating a detailed process of step S30 according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of an embodiment of a laser cutting method according to the present invention;
FIG. 5 is a schematic view of a multilayer composite material according to an embodiment of the laser cutting method of the present invention;
FIG. 6 is a schematic view of a detailed process of step S30 in an embodiment of the laser cutting method of the present invention;
fig. 7 is a functional block diagram of a laser cutting system according to an embodiment of the present invention.
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a laser cutting apparatus in a hardware operating environment according to an embodiment of the present invention.
As shown in fig. 1, the laser cutting apparatus may include: a processor 1001, such as a Central Processing Unit (CPU), a communication bus 1002, a user interface 1003, a network interface 1004, and a memory 1005. Wherein a communication bus 1002 is used to enable connective communication between these components. The user interface 1003 may include a Display (Display), an input unit such as a Keyboard (Keyboard), and the optional user interface 1003 may also include a standard wired interface, a wireless interface. The network interface 1004 may optionally include a standard wired interface, a WIreless interface (e.g., a WIreless-FIdelity (WI-FI) interface). The Memory 1005 may be a Random Access Memory (RAM) Memory, or may be a Non-Volatile Memory (NVM), such as a disk Memory. The memory 1005 may alternatively be a storage device separate from the processor 1001 described previously.
Those skilled in the art will appreciate that the configuration shown in fig. 1 does not constitute a limitation of the laser cutting apparatus and may include more or fewer components than those shown, or some components may be combined, or a different arrangement of components.
As shown in fig. 1, the memory 1005, which is a storage medium, may include therein an operating system, a data storage module, a network communication module, a user interface module, and a laser cutting program.
In the laser cutting apparatus shown in fig. 1, the network interface 1004 is mainly used for data communication with other apparatuses; the user interface 1003 is mainly used for data interaction with a user; the processor 1001 and the memory 1005 of the laser cutting device of the present invention may be disposed in the laser cutting device, and the laser cutting device calls the laser cutting program stored in the memory 1005 through the processor 1001 and executes the laser cutting method provided by the embodiment of the present invention.
An embodiment of the present invention provides a laser cutting method, and referring to fig. 2, fig. 2 is a schematic flow chart of a first embodiment of a laser cutting method according to the present invention.
In this embodiment, the laser cutting method includes:
step S10, when a multilayer composite material to be cut is detected, judging the position and the material of each layer of material in the multilayer composite material;
s20, determining a corresponding wave band according to the material of each layer of material;
and S30, sequentially emitting laser corresponding to the wave band to the corresponding laser focus position according to the position of each layer of material so as to cut the multilayer composite material.
The laser cutting method is used in a laser cutting system or device.
The principle of laser cutting is that a laser focusing mirror is adopted to focus laser beams on the surface or inside of a material to be cut, and the material is heated by absorbing laser energy through the high absorption rate of the material to laser of a certain wave band, so that the material is expanded due to heating to generate large compressive stress. And along with the movement of the focused laser beam, the heated material is rapidly cooled and contracted under the action of convection of air and conduction and heat dissipation in the material, so that larger tensile stress is formed. When the formed tensile stress exceeds the fracture threshold of the material, the material can generate an expansion crack along the laser scanning direction to be automatically separated or separated under the action of mechanical external force, and the aim of laser cutting separation is fulfilled.
When the laser cutting is applied to cutting a multilayer composite material, the composite material at least comprises two materials made of different materials, so that the corresponding absorption rates of the at least two different materials are different, and the laser with one wavelength is used for cutting, so that the desired cutting effect cannot be well achieved, and incomplete cutting or cutting cannot be caused. Accordingly, the laser cutting method of the present invention is proposed to achieve cutting of a multilayer composite material.
The respective steps will be described in detail below:
s10, when detecting a multilayer composite material to be cut, judging the position and the material of each layer of material in the multilayer composite material;
in one embodiment, when the multilayer composite material to be cut is detected, the position and material of each layer of the multilayer composite material are determined. It can be understood that, after the material of the lower layer is cut, the material of the upper layer is cut one by one, so that the position of the multilayer composite material on each layer of material needs to be obtained, and the cutting is performed in the order from bottom to top. Specifically, the piece to be cut can be scanned by a photographing scanning head equipped on the cutting device, and the number of layers and the arrangement sequence of the layers are obtained as the positions of the materials of the layers. In the next embodiment, the number of layers and the stacking relation of the multilayer composite material to be cut can be obtained through manual observation and measurement.
S20, determining a corresponding wave band according to the material of each layer of material;
in one embodiment, the corresponding wavelength band of each layer of material in the multi-layer composite material is determined based on the material of each layer of material. It is understood that the absorption rate of a material to laser light depends on the type and structure of the material, the wavelength of the laser light, and whether it is polarized. The absorption of laser light is different between non-metallic materials and metallic materials, and generally speaking, non-metallic materials have a low reflectivity and a high absorption for laser light, and their absorption is strongly wavelength selective, which is determined by the non-metallic structural characteristics. When materials of different layers are cut, according to the material of each layer, the material is confirmed to have high absorption rate and wavelength, a laser capable of providing laser beams with corresponding wavelengths is further confirmed, and laser beams with proper wave bands, power, frequency and pulse width are obtained by adjusting laser beam parameters of the laser.
Further, in an embodiment, the laser parameters are obtained according to the surface or interface roughness and material of each layer of material, and the laser parameters include a laser band, a laser power, and the like. The influence of the surface roughness of the material on the laser absorption rate is obvious, and the main influence factor can be divided into two parts. In one aspect, the material surface absorbs the multiple reflections of the laser light repeatedly. When light is irradiated onto a material surface, multiple reflections are inevitably generated due to surface irregularities. On the other hand, the absorptivity of some non-metallic materials varies with the incident angle of the laser, and when the incident angle is brewster angle, the absorptivity of the laser on the surface of the material is maximum, and almost all the energy of the beam can be absorbed. However, due to the surface roughness of the material, the rugged contours cannot all be the same, so that the incident angle of all light on the surface of the material cannot be maintained at the brewster angle, and the laser absorption rate is not constant. Therefore, the roughness of the surface of each layer of material or the interface of the joint of each layer of material needs to be considered when setting the laser parameters so as to improve the cutting quality.
And S30, sequentially emitting laser corresponding to the wave band to the corresponding laser focus position according to the position of each layer of material so as to cut the multilayer composite material.
In one embodiment, laser corresponding to the wave band is emitted in sequence according to the position of each layer of material to cut the multilayer composite material. Specifically, according to the sequence of the material layers from bottom to top, the laser is controlled to sequentially emit laser with wave bands corresponding to the material layers, so that the material layers are sequentially cut. It can be understood that the corresponding wave bands of different material layers are different, so that the cutting times are related to the number of layers of the multilayer composite material, and the material of the upper layer is cut after the material of the lowest layer is cut. Meanwhile, the position of the laser can be confirmed according to the position of each layer of material, the laser can be directly focused on the surface of the material layer for a slightly thin material, and the laser can be focused inside the material for a certain thickness of material, so that deeper cutting mark can be obtained. In addition, when the light path design is carried out, the laser of different wave bands can be focused by the same reflector to obtain a plurality of focuses, namely the focuses corresponding to the positions of materials of all layers, so that the light path design is simplified.
In this embodiment, the position and the material of each layer of material in the multilayer composite material are determined, and the corresponding wavelength band is determined according to the material of each layer of material, and further, the laser corresponding to the wavelength band is sequentially emitted to the multilayer composite material according to the position of each layer of material, that is, the laser is emitted to the focal position corresponding to each wavelength band, so as to realize laser cutting of the multilayer composite material. The problem of multilayer combined material because each layer material is different and the cutting effect is poor is solved, the cutting to multilayer combined material has been realized.
Further, a second embodiment of the laser cutting method of the present invention is proposed based on the first embodiment of the laser cutting method of the present invention.
Referring to fig. 3, fig. 3 is a detailed flowchart of step S30 in an embodiment of the laser cutting method of the present invention, and in a second embodiment, the step of sequentially emitting laser corresponding to the wavelength band to a corresponding laser focus position according to the position of each layer of material to cut the multilayer composite material includes:
step S31, setting parameters of the multiband laser based on the wave band;
and S32, controlling the multiband laser to sequentially emit laser corresponding to the wave band to the corresponding laser focus position according to the parameters of the multiband laser according to the position of each layer of material so as to cut the multilayer composite material.
In one embodiment, a multiband laser is selected to obtain a laser beam required by cutting, the multiband laser can emit laser with multiple required wavelengths, and laser paths which originally need to be obtained by multiple lasers and have multiple wavelengths are integrated into one light path, so that the efficiency can be improved. Therefore, in the embodiment, the parameters of the multiband laser are sequentially set according to the corresponding wave bands of the materials of each layer in the multilayer composite material, and then the multiband laser sequentially emits laser to act on different focus positions of the multilayer composite material to be cut as required, so that the materials of each layer are cut. Referring to fig. 4, fig. 4 is a schematic structural diagram of an embodiment of the laser cutting method of the present invention, in which reference numeral 1 is a multiband laser capable of emitting laser with 2 or more different wavelengths. The number 2 is a total reflection mirror corresponding to the wavelength 1, and the number 3 is a beam combining mirror capable of reflecting the wavelength 1 and transmitting the laser light of the wavelength 2. The serial number 4 is a full-wave-band galvanometer. Number 5 is a full band field lens. The serial number 6 is a clamp, and the software can control the clamp to ascend and descend. It should be noted that the wavelength 1 and the wavelength 2 in the drawing are only schematic, and more wavelengths can be obtained according to actual cutting needs, and meanwhile, the wavelength 1 and the wavelength 2 are respectively provided with different focus positions, so that materials of different layers can be cut. The external light path configuration used by the laser cutting method is not fixed, and can be changed according to actual conditions so as to meet different requirements.
Further, in an embodiment, the step of sequentially emitting laser corresponding to the wavelength band to a corresponding laser focus position according to the position of each layer of material to cut the multilayer composite material includes:
s33, selecting corresponding single-waveband lasers according to the wavebands, wherein the number of the single-waveband lasers is larger than or equal to the number of materials in the multilayer composite material;
and S34, sequentially controlling the corresponding single-waveband laser to emit laser corresponding to the waveband to the corresponding laser focus position according to the position of each layer of material so as to cut the multilayer composite material.
In one embodiment, a corresponding single-waveband laser is selected according to a waveband corresponding to each layer of material, and the corresponding single-waveband laser is controlled to emit laser with a corresponding waveband to cut the multilayer composite material. That is, in the present embodiment, the laser light of each wavelength band is emitted by a corresponding laser, and the cost of the single-wavelength laser is lower than that of the multi-wavelength laser, so the single-wavelength laser is often used in practical applications. However, in practical application, the laser can be selected according to the requirement, if the required wave band is more, and a larger number of single-wave-band lasers need to be arranged, the cost of using the multi-wave-band laser can be comprehensively considered, and the selection can be performed according to the influence on the volume and the efficiency of the whole equipment.
Referring to fig. 5 and 5, a schematic diagram of a multilayer composite material in an embodiment of the laser cutting method of the invention is shown, where a multilayer composite material sample is composed of two different materials, a material layer a emits light from a single-band laser corresponding to the material layer a during cutting a, and another single-band laser corresponding to the material layer B emits light during cutting B.
In the embodiment, a multiband laser or a single-waveband laser is selected according to wavebands, and corresponding laser parameters are set, so that laser with wavebands required by materials of all layers is obtained, and the laser with the corresponding wavebands is sequentially emitted to different laser focus positions of the multilayer composite material to be cut, so that the multilayer composite material is cut. The multiband laser is adopted, so that the light path structure can be simplified, and the effect of improving the processing efficiency can be achieved; and the single-waveband laser can reduce the cost of the instrument.
Further, a third embodiment of the laser cutting method of the present invention is proposed based on the previous embodiment of the laser cutting method of the present invention.
Referring to fig. 6, fig. 6 is a schematic view of a detailed flow of step S30 in an embodiment of the laser cutting method of the present invention, in this embodiment, before the step of sequentially emitting laser corresponding to the wavelength band to a corresponding laser focus position according to the position of each layer of material to cut the multilayer composite material, the method further includes:
s41, obtaining the thickness of each layer of material;
and step S42, confirming the corresponding laser focus position according to the position and the thickness of each layer of material.
In one embodiment, the thickness of each layer of material is obtained, and the corresponding laser focal position is determined based on the position and thickness of each layer of material. The position of each layer of material refers to the stacking sequence of each layer of material. It will be appreciated that for each layer of material the laser focus may be at the very bottom of the layer of material, allowing the laser to cut through the material completely, however, for thinner materials the laser focus may also be selected directly on the surface of the material, and therefore the selection of the laser focus may be based on the thickness of the material.
Further, in an embodiment, the step of confirming the corresponding laser focus position according to the position and the thickness of each layer of material includes:
step S421, judging whether the thickness of each layer of material is larger than a preset threshold value;
step S422, if the thickness is larger than a preset threshold value, confirming the number of laser focuses according to the thickness;
step S423, confirming the corresponding laser focus position according to the position, the thickness and the number of the laser focuses of the material of each layer.
In one embodiment, whether the thickness of each layer of material is larger than a preset threshold value or not is judged, if the thickness is larger than the preset threshold value, the number of laser focuses is confirmed according to the thickness, the corresponding laser focus positions are confirmed according to the position, the thickness and the number of the laser focuses of each layer of material, and laser corresponding to a wave band is sequentially emitted to the laser focus positions to cut the multilayer composite material. Namely, whether the thickness of each layer of material exceeds a preset threshold value or not is confirmed, and for the material layer with the thickness exceeding the preset threshold value, a plurality of laser focuses are selected in the thickness range of the material layer, and the material layer is cut at different depths, so that better cutting quality is obtained. Wherein, the number of the laser focuses is determined according to the thickness, and more laser focuses can be selected for thicker materials. And selecting the position of the laser focus according to the determined number of the laser focuses, the position of the material and the thickness of the material. It can be understood that the focal position must correspond to the position of the material layer to be cut, that is, different material layers have different laser focal positions, and in practice, the laser spot with different focal depths can be obtained by arranging the spot shaper.
In addition, the laser beams with the same wave band can be obtained by splitting the laser beams with the wave band corresponding to the material layer through the diffraction optical device, the number of the sub-beams can be selected according to the number of the laser focuses, the sub-beams are focused at different focus positions of the material layer through the focusing lens, and the depths and the positions of the different focus positions are different, so that the material layer can be cut at different depths at the same time.
Further, in an embodiment, the step of sequentially emitting laser light corresponding to the wavelength band to a corresponding laser focus position according to the position of each layer of material to cut the multilayer composite material includes:
and S44, sequentially emitting laser corresponding to the wave band to the corresponding laser focus position according to the position of each layer of material, and controlling a galvanometer to move according to a preset laser cutting path so as to cut the multilayer composite material.
In one embodiment, according to the position of each layer of material, laser corresponding to a wave band is sequentially emitted to the corresponding laser focus position, and the galvanometer is controlled to move according to a preset laser cutting path to cut the multilayer composite material. The galvanometer can convert the received electric signal of the industrial personal computer into a control program, a preset point to be cut is drawn on the abscissa and the ordinate of the galvanometer, and the path can be understood to generally consist of a plurality of points.
Optionally, in another embodiment, the cutting of the multilayer composite material may also be achieved by controlling the carrying motion platform to move through a preset laser cutting path. The bearing motion platform is provided with an X-axis moving mechanism and a Y-axis moving mechanism, sets a coordinate origin according to a laser emitting position, and carries out accurate positioning and shooting according to the CCD camera and the lighting source, so that the cutting equipment can cut out a required workpiece according to a laser cutting path.
Further, in an embodiment, before the step of sequentially emitting laser corresponding to the wavelength band according to the position of each layer of material, and controlling a galvanometer to move according to a preset laser cutting path to cut the multilayer composite material, the method further includes:
step a, confirming the laser cutting path according to the cutting requirement of the multilayer composite material.
In one embodiment, the cutting requirements of the multilayer composite material may be determined based on material characteristics of the multilayer composite material, such as shape, size, and the like. For example: when the multi-layer composite material is a composite material with an irregular shape, such as a tile-like composite material with a wavy shape, it is necessary to consider whether each layer of the material corresponding to the cutting path is on the same horizontal plane during cutting, so that the cutting is more convenient and faster. In addition, for example, if the cutting requirement is to save the processing time, a laser cutting path which saves the processing time can be selected, specifically, if the first layer of material to be cut is cut from the left end to the right end, the next layer of material can be cut from the right end to the left end, so that the bearing moving platform is not required to return to the initial position, and then the bearing moving platform moves from left to right, thereby reducing the processing time.
This embodiment is through the thickness that obtains each layer material, according to the position and the thickness of each layer material, confirm corresponding laser focus position, the laser that launches in proper order again and correspond with the wave band cuts multilayer combined material to laser focus position, and through the thickness that obtains each layer material, confirm laser focus quantity, and then confirm laser focus position according to the position and the thickness of each layer material, thereby beat the target laser focus position with laser, realize the cutting to multilayer combined material, can improve the cutting quality.
The invention also provides a laser cutting system. Fig. 7 is a schematic diagram of functional modules of a laser cutting system according to an embodiment of the invention.
The laser cutting system of the present invention comprises:
the device comprises a detection module 10, a cutting module and a cutting module, wherein the detection module is used for judging the position and the material of each layer of material in a multilayer composite material when the multilayer composite material to be cut is detected;
a selecting module 20, configured to determine a corresponding waveband according to a material of each layer of material;
and the laser module 30 is used for sequentially emitting laser corresponding to the wave band to the corresponding laser focus position according to the position of each layer of material so as to cut the multilayer composite material.
Optionally, the system further comprises:
the parameter adjusting module is used for setting parameters of the multiband laser based on the wave band; and controlling the multiband laser to sequentially emit laser corresponding to the wave band to the corresponding laser focus position according to the parameters of the multiband laser so as to cut the multilayer composite material.
Optionally, the parameter adjusting module is further configured to:
selecting corresponding single-waveband lasers according to the waveband, wherein the number of the single-waveband lasers is greater than or equal to the number of materials in the multilayer composite material;
and according to the positions of the materials of all layers, sequentially controlling the corresponding single-waveband laser to emit laser corresponding to the waveband to the corresponding laser focus position so as to cut the multilayer composite material.
Optionally, the laser module is further configured to:
obtaining the thickness of each layer of material;
and confirming the corresponding laser focus position according to the position of each layer material and the thickness.
Optionally, the laser module is further configured to:
judging whether the thickness of each layer of material is greater than a preset threshold value or not;
if the thickness is larger than a preset threshold value, confirming the number of laser focuses according to the thickness;
and confirming the corresponding laser focus position according to the position of each layer of material, the thickness and the number of the laser focuses.
Optionally, the apparatus further comprises:
and the motion control module is used for controlling the galvanometer to move according to a preset laser cutting path so as to cut the multilayer composite material.
Optionally, the motion control module is further configured to:
confirming the laser cutting path according to the cutting requirement of the multilayer composite material.
The invention also provides a computer readable storage medium.
The computer-readable storage medium of the present invention has stored thereon a laser cutting program which, when executed by a processor, implements the steps of the laser cutting method as described above.
The method implemented when the laser cutting program run on the processor is executed may refer to each embodiment of the laser cutting method of the present invention, and details are not described herein.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or system. Without further limitation, an element defined by the phrases "comprising a," "8230," "8230," or "comprising" does not exclude the presence of other like elements in a process, method, article, or system comprising the element.
The above-mentioned serial numbers of the embodiments of the present invention are only for description, and do not represent the advantages and disadvantages of the embodiments.
Through the above description of the embodiments, those skilled in the art will clearly understand that the method of the above embodiments can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware, but in many cases, the former is a better implementation manner. Based on such understanding, the technical solution of the present invention may be embodied in the form of a software product, which is stored in a storage medium (e.g., ROM/RAM, magnetic disk, optical disk) as described above and includes instructions for enabling a terminal device (e.g., a mobile phone, a computer, a server, or a network device) to execute the method according to the embodiments of the present invention.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A laser cutting method, characterized by comprising the steps of:
when detecting a multilayer composite material to be cut, judging the position and the material of each layer of material in the multilayer composite material;
determining corresponding wave bands according to the material of each layer of material;
and sequentially emitting laser corresponding to the wave band to the corresponding laser focus position according to the position of each layer of material so as to cut the multilayer composite material.
2. The laser cutting method according to claim 1, wherein the step of sequentially emitting laser light corresponding to the wavelength band to a corresponding laser focus position in accordance with the position of each layer of material to cut the multilayer composite material comprises:
setting parameters of the multiband laser based on the waveband;
and controlling the multiband laser to sequentially emit laser corresponding to the wave band to the corresponding laser focus position according to the parameters of the multiband laser so as to cut the multilayer composite material.
3. The laser cutting method according to claim 1, wherein the step of sequentially emitting laser light corresponding to the wavelength band to a corresponding laser focus position according to the position of each layer of material to cut the multilayer composite material comprises:
selecting corresponding single-waveband lasers according to the wavebands, wherein the number of the single-waveband lasers is larger than or equal to the number of materials in the multilayer composite material;
and according to the positions of the materials of all layers, sequentially controlling the corresponding single-waveband laser to emit laser corresponding to the waveband to the corresponding laser focus position so as to cut the multilayer composite material.
4. The laser cutting method according to claim 1, wherein before the step of sequentially emitting the laser light corresponding to the wavelength band to the corresponding laser focus position according to the position of each layer of the material to cut the multilayer composite material, the method further comprises:
obtaining the thickness of each layer of material;
and confirming the corresponding laser focus position according to the position of each layer material and the thickness.
5. The laser cutting method according to claim 4, wherein the step of confirming the corresponding laser focal position in accordance with the position of each layer material and the thickness comprises:
judging whether the thickness of each layer of material is greater than a preset threshold value or not;
if the thickness is larger than a preset threshold value, confirming the number of laser focuses according to the thickness;
and confirming the corresponding laser focus position according to the position of each layer of material, the thickness and the number of the laser focuses.
6. The laser cutting method according to claim 1, wherein the step of sequentially emitting laser light corresponding to the wavelength band to a corresponding laser focus position in accordance with the position of each layer of material to cut the multilayer composite material comprises:
and sequentially emitting laser corresponding to the wave band to the corresponding laser focus position according to the position of each layer of material, and controlling a galvanometer to move according to a preset laser cutting path so as to cut the multilayer composite material.
7. The laser cutting method according to claim 6, wherein before the step of sequentially emitting the laser corresponding to the wavelength band to the corresponding laser focus position according to the position of each layer of the material and controlling the galvanometer to move according to a preset laser cutting path to cut the multilayer composite material, the method further comprises:
confirming the laser cutting path according to the cutting requirement of the multilayer composite material.
8. A laser cutting system, characterized in that the system comprises:
the detection module is used for judging the position and the material of each layer of material in the multilayer composite material when the multilayer composite material to be cut is detected;
the selection module is used for determining corresponding wave bands according to the materials of all layers;
and the laser module is used for sequentially emitting laser corresponding to the wave band to the corresponding laser focus position according to the position of each layer of material so as to cut the multilayer composite material.
9. A laser cutting apparatus, characterized in that the apparatus comprises: a memory, a processor, and a laser cutting program stored on the memory and executable on the processor, the laser cutting program configured to implement the steps of the laser cutting method of any one of claims 1 to 7.
10. A computer-readable storage medium, characterized in that a laser cutting program is stored thereon, which when executed by a processor implements the steps of the laser cutting method according to any one of claims 1 to 7.
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| CN202210785410.6A CN115138988A (en) | 2022-07-05 | 2022-07-05 | Laser cutting method, system, device and computer readable storage medium |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116652372A (en) * | 2023-07-28 | 2023-08-29 | 苏州科韵激光科技有限公司 | Laser repairing method and device for laminated circuit |
| CN116810184A (en) * | 2023-08-30 | 2023-09-29 | 苏州科韵激光科技有限公司 | Micro-fine line laser repairing device |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116652372A (en) * | 2023-07-28 | 2023-08-29 | 苏州科韵激光科技有限公司 | Laser repairing method and device for laminated circuit |
| CN116652372B (en) * | 2023-07-28 | 2024-03-22 | 苏州科韵激光科技有限公司 | Laser repairing method and device for laminated circuit |
| CN116810184A (en) * | 2023-08-30 | 2023-09-29 | 苏州科韵激光科技有限公司 | Micro-fine line laser repairing device |
| CN116810184B (en) * | 2023-08-30 | 2024-02-02 | 苏州科韵激光科技有限公司 | Micro-fine line laser repairing device |
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