JP2005021916A - Microscope device with function of correcting defect - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a microscope with a function of correcting defects by which observation can be excellently executed. <P>SOLUTION: The microscope device 1 with the function of correcting the defects has an observation microscope 20 for observing the defects of an inspected object and a laser device for correcting the defects. The optical system of the observation microscope 20 and that of the laser device are independent in the microscope device 1. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a microscope apparatus with a defect correction function for observing and correcting an object to be inspected.
[0002]
[Prior art]
When a substrate such as a semiconductor is manufactured, a defect correction process for correcting a defective portion of the substrate is performed. In this defect correction process, a microscope apparatus with a defect correction function for observing a defect location to be corrected and correcting it with a laser beam is generally used.
[0003]
For example, Patent Document 1 discloses a conventional microscope apparatus with a defect correction function. The conventional microscope apparatus 100 with a defect correcting function of Patent Document 1 is schematically shown in FIG. The microscope apparatus 100 includes an observation unit 120 for observing the substrate 3 to be inspected, a laser unit 130 for outputting a laser, and an objective lens 140 common to these units. Further, the microscope apparatus 100 can switch the optical path from the objective lens 140 to the observation means 120 or the laser means 130 by the prism 150 disposed between the observation means 120 and the laser means 130 and the objective lens 140. is there. For this reason, this conventional microscope apparatus 100 can perform imaging, observation, and laser repair of the inspection object by switching the observation means 120 and the laser means 130 by the prism 150.
[0004]
[Patent Document 1]
Japanese Patent Application Laid-Open No. 08-290280 (page 2-6, FIG. 1)
[0005]
[Problems to be solved by the invention]
As described above, in this conventional microscope apparatus, the observation unit 120 and the laser unit 130 perform imaging, observation, and laser repair using the common objective lens 140. For this reason, the laser light emitted from the laser means passes through the objective lens 140 also used for observation. The objective lens 140 may be burned by the laser beam, or processing waste may be scattered due to laser processing during correction by the laser, and the tip may be soiled by the processing waste. In addition, processing conditions in laser repair such as processing range and laser power may be set based on the observation result of the observation means. At this time, when the objective lens 140 is burned or soiled, there is a possibility that observation of an object to be inspected such as visual observation or imaging cannot be performed satisfactorily.
Therefore, there is a demand for a microscope apparatus that can observe an inspection object satisfactorily while having laser means.
[0006]
In view of the above-described problems, an object of the present invention is to provide a microscope with a defect correction function that can be favorably observed.
[0007]
[Means for Solving the Problems]
In view of the said subject, the microscope apparatus with a defect correction function of this invention has the following structures.
[0008]
The microscope apparatus with a defect correction function of one embodiment of the present invention includes an observation microscope for observing a defect of an object to be inspected and a laser apparatus for correcting the defect. In this microscope apparatus, the optical system of the observation microscope and the optical system of the laser apparatus are independent of each other.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
A microscope apparatus with a defect correction function according to one embodiment of the present invention will be described below with reference to FIG.
[0010]
FIG. 1 is a schematic partially cutaway perspective view showing a microscope apparatus 1 with a defect correction function according to the present embodiment.
The microscope apparatus 1 is an apparatus for observing an object to be inspected and correcting a defect, and includes an apparatus body 10, an observation microscope 20, and a correction microscope 30. In the present embodiment, the object to be inspected is a substrate having a plurality of patterns, which is indicated by reference numeral 3 in FIG.
[0011]
The apparatus main body 10 has an X stage 11 and a Y stage support 12.
The X stage 11 is disposed on the apparatus main body 10 and is a mounting table that holds the substrate 3 and moves the substrate 3 along a predetermined axis. In this specification, the moving direction of the substrate by the X stage 11 is defined as an X axis, and an axis perpendicular to the X axis is defined as a Y axis. Further, an axis perpendicular to the X and Y axes is taken as a Z axis. In the present embodiment, the X stage 11 holds the substrate 3 substantially parallel to a plane (horizontal plane) passing through the X and Y axes. The X stage 11 has a Y stage support 12 that supports the observation microscope 20 and the correction microscope 30.
[0012]
The Y stage support section 12 is bridged to the apparatus main body 10 so as to straddle the X stage 11 along the Y axis, and is disposed at a substantially central position along the X axis of the apparatus main body 10. The Y stage support section 12 has two Y stages 12a and 12b. More specifically, the Y stages 12a and 12b are supported by the Y stage support portion 11 so as to be arranged in line symmetry with respect to the Y axis. These Y stages 12a and 12b are configured to be driven on the Y stage support portion 12 along the Y axis.
[0013]
Z stages 13a and 13b that are driven along the Z axis are fixed to the Y stages 12a and 12b, respectively. The observation microscope 20 is fixed to the Z stage 13a, and the correction microscope 30 is fixed to the Z stage 13b. Therefore, the observation microscope 20 and the correction microscope 30 are arranged in the X and Y directions with respect to the substrate 3 arranged on the X stage 11 by the X stage 11, Y stages 12a and 12b, and Z stages 13a and 13b (drive system). And relatively movable along the Z axis.
[0014]
The observation microscope 20 is an observation unit for observing the substrate 3 disposed on the X stage 11. This observation microscope 20 has an optical system capable of zooming, and has a microscope camera 21 that captures an image formed by the optical system. The observation microscope 20 has an autofocus (AF) mechanism (not shown) for focusing on the substrate 3. This AF mechanism is connected to the Z stage 13a and performs focusing on the observation position by operating the Z stage 13a.
[0015]
The correction microscope 30 is a laser device for outputting a laser beam and correcting a defect with the laser beam. The correction microscope 30 has an optical system capable of zooming, and has a microscope camera 31 that captures an image formed by the optical system and a laser head 32 that outputs a laser beam for defect correction. is doing. Similarly to the observation microscope 20, the correction microscope 30 also has an AF mechanism connected to the Z stage 13 b, and the Z stage 13 b is operated to focus the correction target on the substrate 3.
[0016]
In addition, the correction microscope 30 has an irradiation range setting mechanism (not shown) such as a slit in order to adjust the irradiation range of the laser beam to be output.
[0017]
The microscope camera 31 and the laser head 32 share the above optical system of the correction microscope 30. Therefore, in the correction microscope 30, the position focused by the optical system is a position where the microscope camera 31 can pick up an image, and a position where the laser correction can be performed by the laser head 32.
[0018]
A microscope control device 4 that controls driving of the microscope device 1 is connected to the microscope device 1 configured as described above. The microscope control device 4 includes a control computer 41, an operation panel 42, and a monitor 43.
The control computer 41 is connected to the drive system of the microscope apparatus 1, the observation microscope 20, and the correction microscope 30, and controls these drives. Since the control computer 41 is connected to the drive system, it is possible to detect the positions of the observation microscope 20 and the correction microscope 30.
[0019]
The control computer 41 is connected to a host computer 44 in addition to the microscope apparatus 1. The host computer 44 is a computer connected to at least one other device used in the substrate manufacturing process. The host computer 44 has a function of acquiring information from the connected device. The host computer 44 of the present embodiment is connected to a defect detection device (not shown) that detects the position of the defective portion of the substrate 3, and receives information (defect information) indicating the position of the defective portion of the substrate 3. Can get. 0
The operation panel 42 is connected to the control computer 41 and is an input device for inputting data necessary for scanning the microscope apparatus 1 and operation commands to the control computer 41. The monitor 43 is an output device of a control computer connected to the control computer 41.
[0020]
Below, operation | movement of the microscope apparatus 1 with a defect correction function of the said structure is demonstrated. In the microscope apparatus 1 with a defect correction function, the following steps are performed in order to correct a defect generated on the substrate 3 (defect correction processing). In the present embodiment, before the defect correction process is performed, the position and type of the defect portion of the substrate 3 are detected by the defect detection device, and the defect information of each defect portion is stored in the host computer 44. ing.
[0021]
(Inspection process)
In the microscope apparatus 1 with a defect correction function of the present embodiment, first, the substrate 3 to be corrected is placed on the X stage 11 in this inspection object placement step. At the same time, the control computer 41 of the microscope control device 4 acquires the defect information of each defect from the host computer 44. After the inspection object arranging step is completed in this way, an observation step is subsequently performed.
[0022]
(Observation process)
In this observation step, the microscope apparatus 1 observes the defective portion in accordance with a command from the microscope control apparatus 4. Specifically, the control computer 41 issues a drive command to the X stage 11 and the Y stage 12a based on the position coordinates of the defective part in the acquired defect information. The X and Y stages 11 and 12a that have received the drive command move the observation microscope 20 relative to the substrate 3 so that the observation position of the observation microscope 20 is arranged on the defect portion. In other words, the correction microscope 20 is moved relative to the substrate 3 so that the optical axis is disposed on the defect portion.
[0023]
After the positions of the observation microscope 20 in the X and Y axes are determined in this way, the control computer 41 determines the displacement amount of the position of the correction microscope 30 in the X and Y axes with respect to the determined position of the observation microscope 20 as XY. Acquired as deviation amount information. At the same time, the AF mechanism operates the Z stage 13a to focus the observation microscope 20 on the defective portion. At this time, the control computer 41 stores the position along the Z axis when the observation microscope 20 is focused as focusing information.
[0024]
After focusing, the microscope camera 21 images the observation portion of the observation microscope 20 and sends the image data to the control computer 41. The control computer 41 outputs the acquired imaging data to the monitor 43. The user can determine whether or not the defective portion is a defect to be corrected by visually observing the image output to the monitor 43 (defect determination).
[0025]
The determination result of the result determination can be input to the control computer 41 through the operation panel 42. When the user determines that the defective portion is not a defect to be corrected (correction target defect), the observation process is performed again for another defective portion. In addition, when determining the defect of all the defective portions in the substrate 3, if the defective portion that is determined not to be the correction target is the last defective portion, the substrate 3 that is currently inspecting, While being routed to the next step in the substrate manufacturing process, another substrate 3 to be inspected next is processed again from the inspection target arrangement step.
[0026]
Further, in the defect determination, when it is determined that the defect portion to be inspected is a defect portion to be corrected, a defect correction step is subsequently performed.
[0027]
(Defect correction process)
In this defect correction process, a correction process for a defect portion to be corrected is performed. Specifically, the control computer 41 drives the X and Y stages 11 and 12b to align the correction microscope 30 with respect to the defect to be corrected in order to cause the correction microscope 30 to perform correction processing. At this time, the control computer 41 controls the X alignment Y stages 11 and 12b based on the XY deviation amount information acquired in the observation step, and moves the correction microscope 30 by the difference with respect to the position of the observation microscope 20.
By this movement, the correction microscope 30 is arranged at a position facing the defect portion to be corrected. In other words, the optical axis of the correction microscope 30 is arranged on the defect portion to be corrected.
[0028]
In this way, the correcting microscope 30 is focused on the defect portion to be corrected after the positions along the X and Y axes are determined. In this focusing, the control computer 41 issues a drive command to the Z stage 13b so as to move the correction microscope 30 to a position along the Z axis indicated in the focusing information. As a result, after the position of the correction microscope 30 along the Z axis is substantially determined, an AF mechanism (not shown) operates the Z stage 13b to finely adjust the position along the Z axis. By this fine adjustment, focusing of the correction microscope 30 is completed.
[0029]
After the focusing is completed, the microscope camera 31 images the focused defect to be corrected and sends imaging data to the control computer 41. The control computer 41 outputs the acquired imaging data to the monitor 43. The user visually determines the output conditions such as the laser irradiation range and the output energy amount by observing the image output on the monitor 43.
[0030]
After setting the output condition, the laser head 32 outputs a laser beam according to the output condition, and corrects the defect portion to be corrected. When this correction is completed, if there is a defect portion for which no defect determination is made in the observation step, the observation step is performed again. Further, when the defect determination for all the defective portions and the correction for all the defective portions to be corrected are completed, the following processing is performed. In this case, the substrate 3 currently inspected is transferred to the next step in the substrate manufacturing process, and another substrate 3 to be inspected next is processed again from the inspection target arrangement step. Is called.
[0031]
In this way, the microscope apparatus 1 with a defect correction function completes the defect correction for the substrate 3.
As shown in the above configuration, in the microscope apparatus 1 with a defect correction function of the present embodiment, the optical system of the observation microscope 20 and the optical system of the correction microscope 30 that is the laser apparatus are independent of each other. Therefore, the laser beam output from the laser head 32 does not pass through the optical system of the observation microscope. For this reason, the optical member of the optical system of the observation microscope 20 is not burned by the laser beam, unlike the case where the observation microscope and the laser device share the optical system. Therefore, the observation microscope 20 can always observe the substrate 3 that is the object to be inspected satisfactorily and can perform the defect determination more reliably. Further, since the optical system of the observation microscope 20 is independent of the optical system of the correction microscope 30 which is the laser device, it is not necessary to select according to the characteristics of the laser light of the laser device. Therefore, the optical system of the observation microscope 20 can select the optical member more freely.
[0032]
In addition, since the microscope apparatus 1 according to the present embodiment includes the observation microscope 20 and the correction microscope 30, observation for defect determination and observation before correction by the correction microscope 30 are performed under substantially the same conditions. obtain. Therefore, the microscope apparatus 1 of the present embodiment can perform defect determination and observation before correction with higher accuracy.
[0033]
In the present embodiment, the control computer 41 of the microscope control device 4 stores the in-focus position of the optical system of the observation microscope 20 as in-focus information. Then, the control computer 41 moves the correction microscope 30 by the Z stage 13b so that the correction microscope 30 is focused using the focusing information. Thereby, the correction microscope 30 can focus more rapidly than the case where focusing is performed without referring to the focusing position, and the overall throughput can be improved. In the present embodiment, the correction microscope 30 can be finely adjusted by an AF mechanism (not shown) after being moved along the Z axis so as to be focused. Thereby, the correction microscope 30 of the present embodiment can be focused accurately while being quick. When the driving accuracy of the microscope apparatus 1 is high, fine adjustment by the AF mechanism can be omitted.
[0034]
The control computer 41 obtains the positional deviation amount between the observation microscope 20 and the correction microscope as XY deviation amount information. Accordingly, the control computer 41 controls the X alignment Y stages 11 and 12b based on the XY deviation amount information, moves the correction microscope 30 by the difference with respect to the position of the observation microscope 20, and sets the defect to be corrected. The correction microscope 30 can be aligned. Therefore, the correction microscope 30 can perform alignment with respect to the defect portion to be corrected more quickly and accurately than in the case where alignment is performed without referring to the shift amount. Therefore, the microscope apparatus 1 of the present embodiment can improve the overall throughput by the rapid alignment of the laser apparatus.
[0035]
In the present embodiment, the defect is corrected only for the defect portion to be corrected selected as the correction target. For this reason, the microscope apparatus 1 of this Embodiment can correct only the defective part which needs to be corrected, and can improve the whole throughput. Further, the selective correction process can reduce the number of operations of the correction microscope 30 compared to the number of operations of the observation microscope 20. Accordingly, the number of movements of the correction microscope 30 can be reduced, and the service life of the correction microscope 30 can be improved.
[0036]
In the microscope apparatus 1 according to the present embodiment, the observation microscope 20 and the correction microscope 30 are separated from each other via the Y stage support unit 12. Therefore, even when the processing waste is scattered from the correction portion of the substrate 3 by the defect correction processing using the laser beam of the correction microscope 30, the processing waste does not contaminate the optical system of the observation microscope 20. Therefore, the microscope apparatus 1 according to the present embodiment can always be observed favorably with the observation microscope 20. The separation distance is arbitrary as long as it is not contaminated by processing waste, and the separation direction is also arbitrary.
[0037]
In the microscope apparatus 1 according to the present embodiment, the observation microscope 20 and the correction microscope 30 are arranged symmetrically with respect to the Y axis by the Y stage support unit 12. In the above arrangement, the observation microscope 20 and the correction microscope 30 are supported by the Y stage support section 12 with a well-balanced and stable center of gravity. Therefore, the above configuration is preferable because the driving accuracy of the driving system can be improved. However, the observation microscope 20 and the correction microscope 30 can be arranged along the Y axis, and are not limited in arrangement.
[0038]
Moreover, although the microscope apparatus 1 of this Embodiment is performing observation and correction | amendment for every defect part alternately, after observing all the defect parts, it applies to the defect part used as the correction object selected by the said observation. It is also possible to make corrections. Even in this case, the microscope control device 4 acquires the focusing information and the XY deviation amount information every time each defect portion is observed. The acquired information is stored in the control computer 41.
Thereby, even when performing defect correction after observing all the defective parts, the correction microscope 30 can quickly perform alignment and focusing on the defect to be corrected using the above information.
[0039]
In the present embodiment, the microscope camera 31 and the laser head 32 share an optical system, but each may have an independent optical system. In this case, the optical member used for the optical system of the microscope camera 31 does not need to use an optical member corresponding to the short wavelength even when the laser beam output from the laser head 32 has a short wavelength. In addition, since the optical system of the microscope camera 31 configured without using an optical member corresponding to a short wavelength can suppress the occurrence of aberration, it is preferable for use in observation. Therefore, when it is independent as described above, the correction microscope 30 can observe the correction target defect better.
[0040]
In the present embodiment, all the defect portions are observed by the observation microscope 20 in the observation step. However, the microscope apparatus 1 of the present embodiment can control the operation of the observation microscope 20 so as to select a defect portion to be observed from all the defect portions and observe only the selected defect portion. It is. In general, the degree of necessity for repair in each defective portion varies depending on the arrangement on the inspection object. For example, in the case of a defect on a semiconductor substrate, a defect portion extending over a plurality of wirings is highly important because there is a high risk of shorting the wirings. In addition, a defective portion at a location that is difficult to repair in a subsequent process in the substrate manufacturing process is highly important in the current process. Conversely, whether or not to repair a defect other than these depends on the requirements for the substrate to be manufactured. For this reason, the microscope apparatus 1 according to the present embodiment can reduce the number of observations and improve the overall throughput by performing the selective observation only on the defective portion having high importance. In addition, since the microscope apparatus 1 according to the present embodiment needs to correct a defect portion having a high degree of necessity for correction, the defect is less frequently required for correction without being observed. It is also possible to make a defect determination as to whether or not correction is performed by observing only the portion. Even in this case, the microscope apparatus 1 can reduce the number of observations and improve the overall throughput.
[0041]
The above selection can be arbitrarily made by the user. In addition, the selection can be made by the control computer 41 acquiring feature data of each defective portion as defect information from the host computer 44 and automatically setting the control computer 41 based on the feature data. . For example, as the characteristic data, data such as the position, size, and type of the defective portion (identification type such as the defective portion on the wiring) is acquired from the host computer 44, and the control computer 41 The selection can be made based on the feature data.
[0042]
Further, in the microscope apparatus 1 according to the present embodiment, the user makes a defect determination visually. However, the microscope apparatus 1 can be provided with an inspection unit that inspects defects based on the image data acquired in the control computer 41. Specifically, the inspection unit acquires a reference image obtained by capturing an image of an object to be inspected or an area having no defect of an object having the same configuration as the object to be inspected. Then, the inspection unit detects a defective part by comparing the reference image with image data captured by the observation microscope 20. Thereby, the microscope apparatus 1 of the present embodiment can detect and correct defects as an independent apparatus that is not operable even if it is not connected to the host computer 44. When inspecting the substrate 3 having a plurality of patterns as described above, it is preferable that the reference image is composed of an image obtained by imaging one pattern (unit pattern) because it can be used in common for all patterns.
[0043]
Further, in the present embodiment, the laser output condition is performed using an image captured by the correction microscope 30 in the defect correction process. However, the setting of the output condition can also be performed in the observation process. In this case, the above condition setting need not be performed using an image captured by the correction microscope 30 sharing the optical system of the microscope camera 31 and the laser head 32. In other words, the above condition setting can be performed according to observation with the observation microscope 20 that can be observed well. Therefore, the condition setting in the observation step has an advantage that it can be performed with higher accuracy because the defect portion to be corrected can be observed more favorably.
[0044]
Moreover, although the microscope apparatus 1 of this Embodiment has the drive device (Y arrangement Z stage 12a, b, 13a, b) of the observation microscope 20 and the correction microscope 30 independently, it can also share. Is possible. Thereby, the microscope apparatus 1 can simplify a structure.
[0045]
In addition, the microscope apparatus 1 sharing the driving device as described above can move to the defect correcting step while maintaining the position along the Z axis performed in the observation step depending on the accuracy of the driving device. Therefore, the microscope apparatus 1 having this configuration can improve the overall throughput.
[0046]
Moreover, although the microscope apparatus 1 of this Embodiment has acquired XY shift | offset | difference amount information in the observation process, it is also possible to acquire the said XY shift | offset | difference amount information previously before an observation process. For example, before performing the defect correction process, the XY deviation amount information is acquired using a positioning sample 60 as shown in FIG. Specifically, first, the sample 60 is placed on the X stage 11. Subsequently, the observation microscope 20 is aligned so that the optical axis comes to the center of the cross pattern of this sample. When aligned, the control computer 41 acquires the position of the observation microscope 20. Subsequently, the control computer 41 drives the X and Y stages 11 and 12b to move the sample 60 to a position where the optical axis of the correction microscope 30 and the center of the cross pattern of the sample 60 coincide. After this movement, the control computer 41 acquires the position of the correction microscope 30. Thus, after acquiring the positions of the observation microscope 20 and the correction microscope 30, the control computer 41 can calculate the difference between these positions and set the XY deviation amount information. Thereby, the XY shift amount information can be accurately calculated as a shift amount between the positions of the optical axes of the observation microscope 20 and the correction microscope 30.
[0047]
In this way, when the XY deviation amount information is acquired in advance, the position of the optical axis of the correction microscope 30 can be accurately calculated based on the position of the observation microscope 20. For this reason, it is not necessary to acquire the position of the correction microscope 30 every time in order to obtain the XY deviation amount information in the observation step. That is, when the XY deviation amount information is acquired in advance, the microscope apparatus 1 can simplify the observation process and perform the observation process quickly.
[0048]
Further, when the XY deviation information is obtained as described above, the drive system can be adjusted using the sample 60 again. Specifically, the optical axis of the observation microscope 20 is arranged at the center of the cross pattern of the sample 60, and then the correction microscope 30 is moved by the difference with respect to the optical axis of the observation microscope 20 indicated by the XY deviation information. If the optical axis of the correction microscope 30 is not positioned at the center of the cross pattern of the sample 60 due to this movement, it can be seen that the drive system (X and Y stages 11, 12b) has poor drive accuracy. After the movement, the drive system can be adjusted by correcting the deviation of the optical axis of the correction microscope 30 from the cross pattern of the sample 60. Thereby, the microscope apparatus 1 can drive the observation microscope 20 and the correction microscope 30 with higher accuracy.
[0049]
Although one embodiment has been specifically described so far with reference to the drawings, the present invention is not limited to the above-described embodiment, and all the embodiments performed without departing from the scope of the invention are not limited thereto. including.
[0050]
【The invention's effect】
The present invention can provide a microscope with a defect correction function that allows good observation.
[Brief description of the drawings]
FIG. 1 is a schematic partially cutaway perspective view showing a microscope with a defect correcting function according to an embodiment of the present invention.
FIG. 2 is a diagram illustrating a sample for position adjustment;
FIG. 3 is a diagram showing a conventional microscope with a defect correction function.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Microscope apparatus with a defect correction function, 3 ... Board | substrate, 4 ... Microscope control apparatus, 10 ... Apparatus main body, 11 ... X stage, 12 ... Y stage support part, 12a, b ... Y stage, 13a, b ... Z stage, DESCRIPTION OF SYMBOLS 20 ... Observation microscope, 21 ... Microscope camera, 30 ... Correction microscope, 31 ... Microscope camera, 32 ... Laser head, 41 ... Control computer, 42 ... Operation panel, 43 ... Monitor, 44 ... Host computer

Claims (6)

A microscope apparatus with a defect correction function having an observation microscope for observing a defect of an inspection object and a laser device for correcting the defect,
A microscope apparatus with a defect correction function, wherein the optical system of the observation microscope and the optical system of the laser apparatus are independent of each other. It further has a control unit that controls the operation of the observation microscope and the laser device,
2. The defect correction according to claim 1, wherein the control unit stores an in-focus position of an optical system of an observation microscope, and moves the laser apparatus so as to focus the laser apparatus using the in-focus position. Microscope device with function. The microscope device with a defect correction function according to claim 1, wherein the control unit acquires a deviation amount between the position of the observation microscope and the position of the laser device. The observation microscope further has an imaging means for imaging the inspection object,
The microscope apparatus with a defect correction function according to claim 1, wherein the control unit includes an inspection unit that inspects defects using the captured image. The microscope with a defect correction function according to claim 1, wherein the control unit controls the driving of the observation microscope so as to select a defect to be observed and observe only the selected defect. The microscope with a defect correction function according to claim 1, wherein the control unit selects a defect to be corrected and controls driving of the laser device so as to correct only the selected defect.

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