JP2007163892A - Defect correction apparatus and defect correction method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve a defect correction process in work efficiency and to shorten a cycle time. <P>SOLUTION: The defect correction method using the defect correction apparatus for correcting a defect 20f which is detected by collating a defect image 34 photographed of a substrate 1, in which a plurality of wiring sections are repeatedly formed, to a reference image without any defect, comprises steps of: extracting position information of the defect 20f on the substrate 1 and area information of which area the defect belongs to, in a plurality of areas 14, 15, 16 and 17, for composing the wiring sections; extracting feature information of the defect 20f; reading a defect correction method of high priority according to the position information of the defect, the area information and the feature information, from a data base in which various defect correction methods are accumulated including the defect correction methods implemented in the past; and correcting the defect, based on the read defect correction method. The read defect correction method is superimposed with the defect image 34 and displayed. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a defect correction apparatus and a defect correction method for correcting defects on a substrate on which a large number of wiring portions are repeatedly formed.

2. Description of the Related Art Conventionally, in the manufacture of display devices such as organic EL (Electro Luminescence) displays and liquid crystal displays, so-called FPD (Flat Panel Display), so-called TFTs (Thin Film Transistors) that become wiring boards for driving the FPDs become larger. A defect correction process for correcting a defect portion is indispensable because the number of defect portions generated in the substrate increases and the yield decreases.
As a technique for correcting the defect, for example, cutting of a short-circuited portion by laser light irradiation (laser repair), connection of a broken portion by a laser CVD (Chemical Vapor Deposition) method, or the like can be given. As an example of a device that performs defect correction, a laser processing device that corrects and efficiently processes a predetermined location by irradiating a target with laser light of equal energy in a beam shape that matches a desired processing shape, and performs correction (For example, refer to Patent Document 1).
JP-A-2005-186100

  By the way, as described in Patent Document 1, when correction is simply performed by using a difference image between a defect image (inspected image) and a reference pattern as a defect range, the correction fails unless the type of the defect is grasped. It's easy to do.

For example, in the case of a TFT substrate for display or the like, since there are a plurality of potential supply wirings as well as signal wirings and scanning wirings in the wiring portion corresponding to each pixel, the wiring density in the pixel is increased and the pixel The complexity of the structure is remarkable.
Select different defect correction methods depending on the type and presence of surrounding members, even when correcting defects that are in contact with the same wiring, or defects that occur at approximately the same position in the wiring section. It is necessary to do. For example, when considering the cutting of a short-circuited part by laser light irradiation, it is necessary to avoid deterioration of the surrounding thin film transistor (TFT) or the like due to thermal diffusion.
In particular, when the type and arrangement of the wiring constituting the wiring portion (pixel) is complicated as in an organic EL display, the wiring on both sides such as the potential supply wiring connected to the power supply at both ends of the wiring is on the other side. In the case where the wiring part is configured in a mixed manner with the drive wiring, the choices of correction methods for defects are extremely increased, and accordingly, it is difficult to select an appropriate correction method.

  As described above, in the display panel manufacturing, there are more choices of defect generation modes and correction methods (correction procedures) therefor, and it becomes necessary to irradiate laser light several times to correct one defect. The time required to determine the light irradiation conditions becomes longer.

  In the defect correction process on the panel manufacturing line, the operator confirms the defect on the spot, decides the defect correction method, and performs the defect correction work such as laser repair. There is a problem that the speed has not kept up with the mass production speed of the entire line.

  For this reason, many panel manufacturing factories avoid such problems by purchasing a plurality of defect repair devices (laser repair machines) and increasing the number of workers in charge of each defect repair device.

  However, when such an avoidance method is used, a serious problem arises in that the apparatus cost and the man-hour cost of the workers increase due to a significant increase in the number of defect correcting devices and workers, and the profit is significantly reduced.

  The present invention has been made in view of such points, and aims to improve the work efficiency of the defect correction process and shorten the tact time.

In order to solve the above problems, the defect correction apparatus of the present invention corrects a defect detected by comparing a defect image obtained by photographing a substrate on which a plurality of wiring portions are repeatedly formed with a reference image having no defect. The apparatus reads out a high-priority defect correction method corresponding to a location where the defect is detected from a database in which a plurality of defect correction methods including a defect correction method performed in the past are accumulated. A correction method generating means for correcting the defect based on the issued defect correction technique is provided.
In this defect correction apparatus, the wiring portion is divided into a plurality of regions in advance, and the defect occurrence mode is classified according to the region where the defect is detected and its feature.

  According to the above configuration, since it is possible to preferentially call a defect correction method or a registered defect correction method performed in the past corresponding to a location where a defect is detected, even if complicated correction is necessary, The defect correction technique is easily determined, and the work efficiency of the operator who operates the defect correction apparatus is improved.

The defect correction method of the present invention is a defect correction method using a defect correction apparatus that corrects a defect detected by comparing a defect image obtained by photographing a substrate on which a plurality of wiring portions are repeatedly formed with a reference image having no defect. A process of extracting positional information of the defect on the substrate and area information indicating which of the plurality of areas constituting the wiring portion the defect belongs to, and extracting feature information of the defect A defect correction method having a high priority corresponding to the position information, area information, and feature information of the defect is read out from a database in which various defect correction methods including a process of performing and a defect correction method performed in the past are accumulated. And a step of correcting a defect based on the read defect correction method.
In this defect correction method, the defect occurrence mode is classified according to the area where the defect is detected on the wiring section previously divided into a plurality of areas and the characteristics thereof.

  According to the above configuration, since it is possible to preferentially call a defect correction method or a registered defect correction method performed in the past corresponding to a location where a defect is detected, even if complicated correction is necessary, Defect repair techniques are easily determined.

  According to the defect correction apparatus of the present invention, the work efficiency of the defect correction process can be improved and the tact time can be shortened. Therefore, since it is not necessary to purchase a defect correction device and increase the number of workers, the device cost and the man-hour cost of the worker can be suppressed.

  According to the defect correction method of the present invention, the work efficiency of the defect correction process can be improved and the tact time can be shortened.

Embodiments of the present invention will be described below with reference to the accompanying drawings.
In the present embodiment, a case where a target wiring substrate constitutes a display device, that is, a case where a large number of wiring portions constituting the wiring substrate are formed in a two-dimensional matrix corresponding to the pixels of the display device will be described. I do.

FIG. 1 shows a flowchart of a manufacturing process of a wiring board according to an embodiment.
In the present embodiment, first, the wiring portion forming step is performed by laminating the scanning wiring, the interlayer insulating film, the signal wiring and the potential supply wiring as the main components of the target wiring portion on the substrate. (Steps S1, S2, S3)

  Subsequently, as shown in the schematic diagram of FIG. 2, an optical inspection for detecting a defective wiring portion 2a by optically observing a large number of wiring portions 2 with respect to a common substrate 3 constituting the final wiring substrate 1. A process is performed (step S4). The defect position information on the substrate 3 of the defect wiring part 2a is sent to a control unit such as a computer of the defect correction apparatus. In this optical inspection process, not only the presence of the defective wiring portion 2a but also so-called pattern defect classification information including not only the presence of the defective wiring portion 2a and its position, but also the defect Identify features such as size and type (material state, etc.).

  In the defect correction step, the defect correction apparatus reads the defect position information, so that the stage of the defect correction apparatus moves to the defect position, the defect is confirmed by the observation system, and the defect can be corrected by laser irradiation.

  As will be described later, a defect correction method (repair recipe) including a defect correction method implemented in the past and stored in advance in a database is configured with defects detected in the optical inspection process and a predetermined predetermined wiring unit. Selectively read out in correspondence with the positional relationship with a plurality of areas to be performed (step S5), and a defect correcting process for correcting the defective wiring portion by the selected appropriate defect correcting technique is performed (step S6), A wiring board is manufactured.

  In the present invention, since the data file of the past defect correction method (defect correction procedure) can be called up, the correction process can be made much more efficient. Furthermore, the defect correction process can be automated by detecting the defect position, size, and type and selecting appropriate correction data.

FIG. 3A shows a schematic configuration of a predetermined wiring section 2 (unit pixel) to be inspected in the present embodiment.
In the wiring portion 2, a scanning wiring (shown by a broken line) 4 is provided on a substrate 3, and a signal wiring 6, a current supply wiring 7, and a ground electrode 8 are provided on the scanning wiring 4 through an interlayer insulating film 5. The scanning wiring 4 is arranged so as to mainly extend in a direction orthogonal to the scanning wiring 4.
The signal wiring 6 is configured to face a capacitor (capacitance element) 12 connected from the ground electrode 8 through the gate of the first TFT element 7, and the capacitor 12 has the current supply wiring 7 as a source. It is provided as the gate of the second TFT element 10. A wiring that opposes the current supply wiring 7 via the second TFT element 10 is connected to an anode electrode 11 of an organic EL element (not shown) serving as a light emitting portion.

In the operation of the wiring section 2, the scanning wiring 4 is a1, the signal wiring 6 is b1, the potential supply wiring 7 is b2, the ground wiring 8 is b3, the first and second TFT elements 9 and 10 are Tr1 and Tr2, and the anode. When the light emitting part having the electrode 11 is EL and the capacitor 12 is c, the light emission is performed according to the equivalent circuit diagram shown in FIG. 3B.
That is, a current is always supplied to the potential supply wiring b2, and when a scanning pulse is applied to the scanning wiring a1 and a required signal is supplied to the signal wiring b1, the first TFT element Tr1 is turned on. A required signal is written to the capacitor c. Based on the written signal, the second TFT element Tr2 is turned on, and a current corresponding to the signal amount is supplied to the light emitting unit EL through the potential supply wiring b2, and light emission display is performed in the light emitting unit EL.

FIG. 4 shows an example in which a plurality of wiring portions 2 (unit pixels) shown in FIG. 3 are formed on a substrate.
In the method of manufacturing the wiring board according to the present embodiment, depending on which region of the finite number of regions (four in this example) constituting the wiring portion has a defect, that is, in the optical inspection process. Depending on the position of the detected defect, the correction method (repair recipe) of the defect wiring part 2 read from the database in the above-described defect correction step is roughly classified.
In the following description, a region where a defect exists on the wiring portion (unit pixel) is also referred to as a defective region.

As illustrated in FIG. 5 as an example of the configuration of the defective wiring portion 2a, the unit pixel is divided into the following four regions.
1st area | region 14: Wiring part (with scanning line)
Second region 15: wiring portion (no scanning line)
Third region 16: TFT element portion (with scanning line)
Fourth region 17: capacitor and TFT element portion (no scanning line)

Since the first region 14 and the second region 15 do not have a member that changes in quality due to thermal diffusion, the region can be completely corrected by directly irradiating a laser beam to a short-circuited portion caused by, for example, a foreign substance. However, since the first region 14 has the scanning wiring 4 immediately below it, the first region 14 is a region requiring attention at the time of laser beam irradiation, and the second region 15 has no scanning wiring in the lower layer, so that, for example, with higher energy This is a region where laser light irradiation can be performed.
On the other hand, the third region 16 and the fourth region 17 are regions where members such as TFT elements and capacitors are present, and are difficult to completely repair if new defects or alterations occur in these. Furthermore, since scanning wiring exists in the lower layer in the third region 16, the third region 16 avoids direct correction processing as much as possible, and considers that laser light irradiation is performed with low energy even when it is unavoidable. Is a more difficult area.
As described above, it is necessary to perform laser repair using an appropriate correction method appropriately for each region.

In the defect correction process according to the present embodiment, prior to at least the optical inspection process, the defect wiring part 2a is classified into a finite number of areas by classifying the wiring part 2 having no defect based on the original equivalent circuit described above. In contrast, in the optical inspection process, as shown in FIG. 5, it is possible to determine in which region of the first region 14 to the fourth region 17 the defect 20 is generated.
The classification of the wiring section 2 into a finite number of areas in this way is performed at the initial stage of accumulating (recording) the defect correction technique in the database in advance, that is, prior to the wiring section forming process. It is considered more preferable for enabling vertical startup (rapid mass production) and the like.

  Next, after classifying the wiring section 2 into the first area 14 to the fourth area 17, based on the image coordinate system and information on the defect size and defect type necessary for automatically selecting an accurate defect correction method. Further, as shown in FIG. 6, it is further subdivided into A1, B1, C1,.

  In the manufacturing process of the wiring board according to the present embodiment, not only the presence or absence of defects but also the position, size and type are specified in the optical inspection process. As a specific means for specifying the position of the result, FIG. As shown in FIG. 7, a method of specifying a corner of the wiring portion corresponding to the unit pixel as the coordinate origin (0, 0) and the coordinate system information of the defect 20a at the position (X, Y) as (x1, y1). Is mentioned. Moreover, as a specific method for specifying the size and type of the defect, there is a method for detecting a difference in physical characteristics such as reflectance and brightness at a defective portion from that in a predetermined configuration.

Further, in order to detect defect information for each of the first region 14 to the second region 17 and identify the detected defect, which region (region) has a defect from the defect image, that is, the defect It is necessary to recognize the area.
Therefore, area registration information for one pixel is prepared in advance as shown in FIG. 8, and an image of each area is created individually. And pattern matching (collation) with each area | region of the defect image 21 is performed, and the position of the defect 20b is calculated. At this time, the area of the defect image 21 to be subjected to pattern matching with the registration area information is an area that does not have a defect and completely coincides with, for example, the first area 14 in the example of FIG. By calculating the area where the defect exists in the defect image 21 (fourth area 17) from the relative position with the matched area (first area 14), the pattern matching error due to the defect 20b or the area where the defect 20b exists Even when there is a positional deviation or a defect in the area, it is possible to acquire a correct defect area.
As a technique for improving the accuracy of area acquisition, pattern matching may be performed for each area of the previous registration area information using an image obtained by imaging a wiring part adjacent to the defect image 21 (or an image of an adjacent wiring part). Can be mentioned.

  Further, as shown in FIG. 9, when the defect 20c exists across a plurality of registered area information, for example, two adjacent areas, the fourth area 17 including the center of the defect 20c is defined as a main area (main area), The second region that does not include the other central portion but has the defect 20c is defined as a sub region (sub region). Thus, by defining the main area and the other sub areas, the type of the defect 20c and the repair method can be defined in more detail.

Furthermore, the sub-region may exist over adjacent pixels in addition to those existing in the same pixel (same wiring portion). In that case, as shown in FIG. 10A, supplementary region information including a neighboring pixel (proximity wiring portion) and a reference pixel (reference wiring portion) is defined. At this time, in the adjacent pixels, similarly to the reference pixel, the fifth region 24 to the eighth region 27 corresponding to the first region 14 to the fourth region 17 of the reference pixel are divided.
FIG. 10B shows an example in which a defect 20d existing across two pixels in the defect image 28 is detected. In this example, the reference pixel (reference wiring portion) on the right side of the drawing including the center portion of the defect 20d is the main region (second region 15), and the neighboring pixel (proximity wiring portion) on the left side of the drawing including the other defects 20d. ) Defines a sub-region (eighth region 27).

FIG. 11 is a diagram for explaining defect correction information (hereinafter also referred to as “repair recipe information”) indicating a defect correction method.
The defect correction information (repair recipe information) according to the present invention includes a defect object that imitates a defect, and a repair object that indicates a portion to be corrected according to the position and characteristics of the defect object on the wiring portion. It is a data file that contains. For example, the defect object indicates a region to which the defect object belongs, a scale, a shape, a circuit where the defect object is located, and the like. The repair object indicates the position, output, etc. of the laser irradiation corresponding to the defect.

  The specifications of the database that stores defect correction information and the display method of the defect correction method differ depending on the defect area and the position and size of the defect, so the defect correction information is registered for each condition. Take a technique.

Specifically, as shown in FIG. 11, “recipe name (or recipe number)” of defect correction information from the past example, “area number” indicating a defect area, and “sub area number” if there is a sub area. , “Reference pixel number” indicating the position of the reference pixel on the wiring board 1, “proximity pixel number” indicating the presence / absence and position of the adjacent pixels on the upper / lower and left / right sides of the reference pixel, and defects and defect correction registered in the recipe First, the “number of objects” of the repair object representing the technique is registered as recipe header information.
The “defect information” is defect information such as a classification result by an external ADC (automatic defect classification apparatus).

Next, defect objects (or repair objects) are registered as object information by the number of objects registered in the header information. Object information is based on “recipe name (or recipe number)” for matching with the recipe header, “coordinates” indicating the position of the object in the wiring section, “object shape”, “angle”, and “position correction information” Registered as information. These registrations are performed for both the defect object and the repair object.
The correction information is information for position correction by comparison with a defect position of an actual defect image, and will be described in detail later.
The angle is a rotation angle from the normal position of the defect on the XY stage.

  In the example of FIG. 11, a defect object 32 and repair objects 33a and 33b corresponding thereto are registered. Since the defect object 32 spans the second area 15 and the fourth area 17, information on the second area is registered as the area number, and information on the fourth area is registered as the sub area.

  In the object information, the origin (see FIG. 7) is provided in advance in the reference pixel, and the object position information is registered with the relative coordinates and angle from the origin. By reading repair recipe information from the database and overlaying the defect image on the defect image and displaying the defect correction information on the display device, the operator (operator) can visually recognize the contents of the defect correction technique.

  In addition, automatic repair recipe detection can be performed from defect characteristics by holding the classification result of ADC (defect automatic classification device) in the defect information of the defect information of the header information or defect object information. Is possible.

  As a specific method for automatically reflecting the defect correction information registered in the database in the actual defect image, the following can be cited.

  A first method is to detect a defect position area of a defect image and use defect correction information having the defect area in header information as a candidate for defect correction processing.

  Second, in addition to the first method, defect correction information having header information with a matching sub-area is used as a candidate. This is applied when a defect extends over a plurality of regions.

  Third, in addition to the first method, the defect correction information in which the defect position information (coordinate system) registered in the defect correction information matches the position of the defect is used as a candidate.

  Fourth, in addition to the first method, the defect correction information having the same defect characteristics such as the defect classification information such as ADC registered in the defect correction information is used as a candidate.

  These various conditions are combined and prioritized in consideration of the characteristics of the substrate 3, and defect correction information, that is, defect correction technique candidates are selected. For the selected defect correction information, only the repair object is displayed superimposed on the defect image.

Next, an example in which the defect correction information registered in the database is automatically reflected in an actual defect image will be described with reference to FIG.
The defect 20f of the defect image 34 shown in the lower part of FIG. 12 is classified into a second area 15 (main area) and a fourth area 17 (main area). Due to this defect position, that is, due to the positional relationship between the defect and a finite number of areas, it occurs in the area including the second area 15 or the fourth area 17 as shown in the correction methods (defect correction information) 1 to 3 shown in FIG. The pattern of the optimal correction method 2 is selected and read out from the correction methods 1 to 3 according to the possible defect positions after confirming that there is no problem with the defect size and defect type.

  That is, here, the defect object 32a of the correction method 1 is a defect in which the pixel coordinate system is different from the defect 20f of the defect image 34, and the ground electrode 8 and the signal wiring 6 are short-circuited. The defect object 32c of the correction method 3 is also different because the pixel coordinate system is substantially the same, but the defect size is large, and the current supply wiring 7a, the ground electrode 8, and the signal wiring 6 are short-circuited. Therefore, the optimum defect correction method is determined as the correction method 2 based on the coincidence of the pixel coordinate system and the defect size of the defect object 32b.

  Then, in the selected correction method 2 (defect correction information), only the repair objects 33d and 33e are displayed superimposed on the defect image 34 (see the lower part of FIG. 12). At this time, the repair object 33e outside the range of the displayed defect image 34 is not displayed, but is retained as output defect correction information.

  In this example, the correction method 2 cuts the repair objects 33d and 33e at the upper and lower portions of the signal wiring 6 by laser irradiation and performs complete correction. Even if part of the signal wiring 6 is disconnected between the repair objects 33d and 33e, the connection between the signal wiring 6 (b1) and the first TFT element 9 (Tr1) is maintained as shown in the equivalent circuit of FIG. 3B. Therefore, it is possible to avoid the non-lighting of the entire display device finally obtained and the occurrence of so-called broken lines.

  The repair object 33c of the correction method 1 indicates a process of cutting the short-circuit portion between the ground electrode 8 and the signal wiring 6 due to the defect 32a. The repair objects 33f and 33g of the correction method 3 indicate processing for cutting the short-circuit portions of the current supply wiring 7a, the ground electrode 8, and the signal wiring 6 due to the defect 32c, respectively.

  According to the defect correction method according to the present embodiment, a position is created by constructing a database in which information related to such wiring and the like is recorded in association with (related to) a finite number of classified areas and defects. A defect correction process can be automated by reading a defect correction method selected in accordance with the relationship, and it is possible to avoid the complexity of making a distinction artificially.

When there is no applicable defect correction method among the correction methods 1 to 3 when the correction procedure is read from the database, the correction method with the highest priority, for example, the correction method with the highest use frequency or the correction difficulty level is low. The method is automatically selected.
In addition, when there is no suitable processing setting file (repair recipe information) for the target defect, the operator can set the laser processing conditions manually, and further add the setting file to the database. You can also.

  In addition, when a defect exists across a plurality of wiring portions (see FIGS. 10A and 10B), a main area related to the reference pixel of the defect, a sub-area related to the adjacent pixel, and a defect correction method stored in the database The defect correction technique in which the main area and the sub-area associated with each other coincide with each other is preferentially read from the database.

Here, the defect object and repair object correction processing will be described with reference to FIGS.
For example, as shown in FIG. 13, the actual defect 20 g of the defect image 35 and the defect information of the defect correction information may have a deviation in the position or area of the defect, so that only the defect type information has other defects. May be selected as a defect correction candidate. That is, proper defect repair is not performed on the actual defect 20g, and there is a possibility that the laser beam is irradiated to the wrong place. Therefore, correction information is provided for each recipe object.
Specifically, the defect object has the maximum and minimum values of the defect size and the error range of misalignment, and the repair object has defect tracking information so that defect correction information corresponding to the defect misalignment is automatically Generate.

FIG. 14 is an explanatory diagram for each object correction. A indicates object correction information for a defective object, and B indicates object correction information for a repair object.
In the present embodiment, the defect object 32 d has correction information of a defect minimum width 36, a defect minimum height 37, a defect position essential range 38, and a defect position error range 39. The defect position essential range 38 includes a defect that satisfies the minimum defect width 36 and the minimum defect height 37 within this range. The defect position error range 39 indicates an error range that is regarded as an allowable range as long as the defect 32d satisfies the defect position error range 39 (see FIG. 14A). The repair correction range 40 designates a range in which the repair object can follow a defect, that is, a range of defect position information that can be corrected (see FIG. 14B).
At this time, it is specified which defect the repair object is to be linked to be corrected. If there is no designation, the defect correction portion, that is, the repair object is fixed.

FIG. 15 shows an example in which the correction method after the object correction is displayed superimposed on the defect image 35.
In the present embodiment, the repair object 33j in FIG. 13 is corrected to become a repair object 33k arranged at a position corresponding to the positional shift of the defect 20g, and the short-circuited portion of the ground electrode 8 and the signal wiring 6 is cut by a laser to complete the repair object 33k. Can be repaired.

In an actual defect image, a defect correction target location is not necessarily one location. Accordingly, defect correction information that is optimized is automatically generated by combining a plurality of defect correction information.
FIG. 16 shows an example in which two correction methods are combined. There are two defects 20h and 20i in the defect image 41, the defect 20h straddles the second region 15 (main region) and the fourth region 17 (subregion), and the defect 20i is the third region 16 (main region). (See the lower part of FIG. 16). The repair method 2 having repair objects 33d and 33e for cutting the signal wiring 6 at the upper and lower portions is applied to the defect 20h, and the first TFT element 9 and the second TFT element 10 are cut for the defect 20i. The correction method 4 having the repair object 33m to be applied is applied (see the upper part of FIG. 16).
A combination of these two correction methods and superimposed on the defect image 41 is shown in the lower part of FIG. The main area of each defect in the defect image 41 is stored as defect information, and can be switched to each defect 20h and 20i to obtain defect correction information for each defect (see the lower part of FIG. 16). That is, two pieces of defect information may be combined to form one piece of defect correction information, or each defect may have defect correction information.

  Next, a defect inspection apparatus that executes the above-described defect correction method will be described.

FIG. 17 shows a configuration diagram of an example of a defect correcting apparatus for correcting defects on a TFT substrate such as a liquid crystal display.
The defect correction apparatus 1 according to the present embodiment is a so-called laser repair apparatus, but may be configured to perform a wiring correction technique such as a CVD method, and is not limited to this example.

  As a result of the defect inspection performed in advance by the defect inspection apparatus 200, the defect correction apparatus 1 converts the defect position information on the TFT substrate 106 into an overall control unit (hereinafter referred to as “control unit”) in the defect correction apparatus 100. .) Received at 102. The control unit 102 is a computer (arithmetic processing device) such as a personal computer, and constitutes a correction method generation unit together with the image analysis and correction method generation unit 101.

  First, the control unit 102 sends a command to the stage control unit 107 to move the XY stage 105 on which the TFT substrate 106 is mounted so that the defect location detected by the defect inspection apparatus 100 is directly below the objective lens 108. Next, the focus stage 110 is moved to adjust the distance between the objective lens 108 and the TFT substrate 106 so that the imaging device 117 can capture a focused image of the light transmitted through the optical lens 114g. Here, an image with appropriate brightness is obtained by epi-illumination by the half mirrors 15a and 15b, the optical lens 114a, and the lamp 109. The captured defect image is temporarily stored in the defect image memory 118.

  Next, the control unit 102 sends a command to the stage control unit 107 to move the XY stage 105, and moves to an adjacent pixel of the defective part or several repeated patterns from the defective part, that is, a position where the same pixel pattern is obtained. A reference image having no defect is picked up so that the position is directly below the objective lens 108 and stored in the reference image memory 119. The pixel here corresponds to the wiring portion 2 shown in FIG.

  The defect extraction unit 120 extracts and extracts an image of a defective part by generating a difference image after aligning the defect image stored in the defect image memory 118 and the reference image stored in the reference image memory 119. The image of the defective part is output to the detailed position information extraction unit 121 and the feature extraction unit 122.

  The detailed position information extraction unit 121 calculates the exact position of the extracted defect on the TFT substrate 106 from the current position of the XY stage 105 and the defect image, and sends the information to the region determination unit 124 and the correction method generation unit 126. .

The area determination unit 124 outputs area information indicating which area of the normal pixel pattern the defect belongs to based on the accurate position of the defect and the normal pixel pattern information stored in the normal pixel pattern memory 22. The normal pixel pattern memory 123 is an example of a memory, and the normal pixel pattern is a unit pixel or a wiring unit (see FIG. 3) having no defect, and the normal pixel pattern memory 123 stores the wiring pattern of the normal pixel in a plurality of areas. It is memorized separately.
The area determination unit 124 constitutes a defect information extraction unit together with the detailed position information extraction unit 121 and the regular pixel pattern memory 123.

  Also, the feature extraction unit 21 digitizes the feature information such as the color, size, and shape of the defect extracted by the defect extraction unit 120 and outputs it.

The correction method generation unit 126 defines how to operate the correction mechanism unit 104 from the detailed position information 121, the region determination unit 124, and the detailed position information, feature information, and region information obtained from the feature extraction unit 122. The appropriate defect correction information (repair recipe information) is read from the correction method database 125.
More specifically, a defect method with higher priority based on detailed position information, feature information, etc., from among defect methods in which the region information of the detected defect matches the region information associated with the defect method. Is read out from the correction technique database 125 (see, for example, FIG. 12).
The control unit 102 may correct a part of the repair object of the defect correction information based on the defect information such as the position and the characteristic depending on the situation (see FIGS. 13 to 15). One defect correction information may include a plurality of correction methods (see FIG. 16).

  The control unit 102 displays the correction method based on the defect correction information generated by the correction method generation unit 126 on the display (display device) 127 so as to overlap the defect image.

  If the operator looks at the display 127 and determines that there is a problem, the operator can select another correction method using the input device 25 such as a keyboard, or change part or all of the correction method (defect correction information). You can also. Further, when a plurality of defect correction methods are read out from the correction method database 125 by the correction method generation unit 126, the plurality of defect correction methods are displayed on the display 127, prompting the operator to select, and designated by the input device 128. The selected defect correction method is selected and the defect is corrected.

  The control unit 102 receives a command (command) from the input device 128 and records a defect correction technique selection or change history in the correction technique database 125. The correction methods stored in the correction method database 125 are used for defect correction from the next time.

If the defect correction method is finally determined, the control unit 102 sends a command to the correction mechanism unit control unit 116 according to the defect correction method, operates each unit in the correction mechanism unit 104, and corrects the defect. .
The correction mechanism unit 4 corrects the laser beam emitted from the laser light source 113 with the optical lenses 114b and 114c, passes the variable slit 112, and further transmits the optical lenses 114d, 114e, and 114f. The irradiation size and angle can be changed.

  It should be noted that by always selecting the correction method with the highest priority among the defect correction methods generated by the correction method generation unit 126, it is possible to correct the defect automatically without an operator.

  As described above, the embodiment of the defect correcting apparatus for executing the defect correcting method according to the present invention has been described in the case of correcting a defect such as a TFT substrate. Since correction methods and registered defect correction methods can be preferentially called from the correction method database, even when complex corrections are required, appropriate defect correction methods can be determined easily and accurately, and the defect correction device can be operated. As a result, the working efficiency of the operator is greatly improved and the tact time can be shortened.

  In addition, since the defect correction method can be displayed superimposed on the defect image, the operator can visually check the displayed contents, and can easily determine whether the called defect correction method is appropriate.

  Further, by determining which region of the regular pixel pattern the defect position is, an appropriate defect correction method considering the pixel circuit configuration is selected.

  In addition, by preferentially selecting defect correction methods that have been used frequently, it becomes easier to select an appropriate defect correction method, and finally the defect correction process can be automated.

  Also, for example, in the correction of defects that are in contact with the same wiring, or defects that are generated at approximately the same position in the wiring section, different correction procedures are selected depending on the type and presence / absence of the members located in the vicinity. This makes it possible to reduce the burden on the operator (operator), that is, improve work efficiency. In particular, the defective wiring portion having a more complicated wiring pattern than in the present embodiment is also corrected by classifying it into a finite number of regions based on the equivalent circuit as described above. Therefore, it is considered that the improvement is made more significantly.

  In addition, the numerical conditions such as the materials used, the amount thereof, the processing time, and the dimensions mentioned in the above description are only suitable examples, and the dimensional shapes and arrangement relationships in the drawings used for the description are also schematic. That is, the present invention is not limited to this embodiment.

  For example, the number of the finite number of regions may be a specific plurality that can properly grasp the defect pattern by classification, and only a plurality of wirings are provided as in this example. In the case of classifying it into a region where it is necessary to consider the layout relationship (not only the shape of each) but also the wiring and other wiring existing across the TFT element and the interlayer insulating film, The present invention can be variously modified and changed, such as being able to classify regions according to purposes.

  Further, in the above-described embodiment, the case of correcting the defect of the design pattern formed on the glass substrate of the flat panel display has been described. However, the correction target is not limited to this example, for example, a semiconductor wafer, a photo The present invention can be applied to a mask, a magnetic disk or the like in which a predetermined pattern is formed on a correction target substrate.

It is a flowchart which shows the manufacturing process of the wiring board which concerns on one embodiment of this invention. It is a figure which shows an example of the wiring board which concerns on one embodiment of this invention. A is a schematic configuration of a unit pixel according to an embodiment of the present invention, and B is a diagram showing an equivalent circuit thereof. It is a figure which shows the example of a repeating pattern of the unit pixel which concerns on one embodiment of this invention. It is a figure where it uses for description of the area division of the unit pixel which concerns on one embodiment of this invention. It is a figure where it uses for description of the defect classification | category which concerns on one embodiment of this invention. It is a figure where it uses for description of the pixel coordinate system which concerns on one embodiment of this invention. It is a figure (1) with which it uses for specific description of the defect area | region which concerns on one embodiment of this invention. It is FIG. (2) with which it uses for specific description of the defect area | region which concerns on one embodiment of this invention. FIGS. 7A and 7B are diagrams for explaining extension of a defect area according to an embodiment of the present invention. It is a figure with which it uses for description of the defect correction information (repair recipe information) which concerns on one embodiment of this invention. It is an example of the defect correction information which concerns on one embodiment of this invention. It is a figure which shows the example by which the defect correction method which is not appropriate was selected. It is a figure which shows object correction information with respect to the defect object with respect to a defect, B shows the object correction information with respect to a repair object for the description about the object correction concerning one embodiment of this invention. It is a figure which shows the example of a repeating pattern of a unit pixel. It is the figure which showed the example of the defect correction information after the correction | amendment which concerns on one embodiment of this invention. It is a figure which shows the example which combined two defect correction information which concerns on one embodiment of this invention. It is a block diagram of an example of the defect correction apparatus which concerns on one embodiment of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Wiring board, 2 ... Wiring part (unit pixel), 2a ... Defect wiring part, 3 ... Substrate, 14 ... 1st area | region, 15 ... 2nd area | region, 16 ... 3rd area | region, 17 ... 4th area | region, 20a, 20 b, 20 c, 20 d, 20 f, 20 g, 20 h, 20 i... Defect 21, 22, 28, 34, 35, 41 ... defect image, 24 ... fifth region, 25 ... sixth region, 26 ... seventh region, 27 ... 8th area | region, 32, 32a, 32b, 32c, 32d, 32e ... Defect object, 33a, 33b, 33c, 33d, 33e, 33f, 33g, 33h, 33i, 33j, 33k, 33m ... Repair object, 36 ... Defect Minimum width, 37 ... Minimum defect height, 38 ... Defect position essential range, 39 ... Defect position error range, 40 ... Repair correction range, 100 ... Defect correction device, 102 ... Overall control unit, 104 ... Correction mechanism unit, 105 XY stage, 106 ... TFT substrate, 107 ... Stage control unit, 113 ... Laser light source, 116 ... Correction mechanism control unit, 117 ... Imaging device, 120 ... Defect extraction unit, 121 ... Detailed position information extraction unit, 122 ... Feature extraction unit , 123 ... Regular pixel pattern memory, 124 ... Area determination unit, 125 ... Correction method database, 126 ... Correction method generation unit, 127 ... Display, 128 ... Input device

Claims (20)

A defect correction apparatus for correcting a defect detected by comparing a defect image obtained by photographing a substrate on which a plurality of wiring portions are repeatedly formed and a reference image having no defect,
A defect correction method having a high priority is read out from a database in which a plurality of defect correction methods including a defect correction method performed in the past are accumulated, and the defect correction method having a high priority corresponding to the location where the defect is detected is read out. A defect correction apparatus comprising: a correction method generation unit that corrects the defect based on a technique. The correction method generation means includes:
A defect information extraction unit that extracts position information of the defect on the substrate and region information indicating which of the plurality of regions constituting the wiring unit the defect belongs to;
A feature extraction unit for extracting feature information of the defect;
A correction method generation unit that reads out a defect correction method having a high priority corresponding to the position information, area information, and feature information of the defect from the database;
The defect correction apparatus according to claim 1, further comprising: a control unit that causes a correction mechanism unit to correct the defect according to the defect correction method read by the correction method generation unit. The defect information extraction unit
A detailed position information extraction unit for calculating the position of the defect on the substrate;
A memory for storing a wiring pattern of a wiring part having no defect in a plurality of areas;
A region determination unit that compares the defect image for each region of the wiring unit stored in the memory and determines which region of the wiring pattern stored in the memory the defect belongs to; The defect correction apparatus according to claim 2. The area determination unit is a defect-free wiring stored in the memory, using an image obtained by imaging a defect-free portion in the wiring part of the defect image or a wiring part adjacent to the wiring part on the defect image. Collation for each area of the copy is performed.
The defect correction apparatus according to claim 3. The said control part displays the said defect correction technique on a display apparatus, and changes the said displayed defect correction technique to the other defect correction technique by the instruction | command from an input device. Defect correction equipment. When a plurality of defect correction methods are read from the database by the correction method generation unit, the control unit displays the plurality of defect correction methods on a display device, and designates a defect correction method designated from an input device. The defect correction apparatus according to claim 2, wherein the defect correction apparatus is selected. The defect according to claim 2, wherein the priority is determined by at least one of the characteristics of the detected defect, the number of times the defect has been performed in the past, the correction difficulty level of the defect, or a combination thereof. Correction device. The defect correction apparatus according to claim 2, wherein the control unit changes a part or all of the read defect correction technique based on an instruction from an input device. The defect correction apparatus according to claim 2, wherein the control unit corrects a part or all of a correction portion in the read defect correction method based on at least the position and characteristics of the defect. The controller, after reading the defect correction method for the defect from the database, changing from the read defect correction method to another defect correction method, or selecting from a plurality of read defect correction methods, Alternatively, when a part or all of the read defect correction method is changed, each content is stored in the database in association with a location where the defect is detected. Correction device. The defect correction technique read from the database is:
The data file includes a defect object that imitates a defect, and a repair object that indicates a portion on which correction processing is performed according to the position and characteristics of the defect object on the wiring portion. Defect correcting apparatus as described. The defect correction apparatus according to claim 11, wherein the control unit displays a repair object of a data file of the defect correction technique on a display device so as to overlap the defect image. The defect correction apparatus according to claim 11, wherein the control unit changes a position of a part or all of a repair object of a data file of the defect correction method based on an instruction from an input device. The defect correction apparatus according to claim 11, wherein the control unit corrects a position of a part or all of a repair object of a data file of the defect correction method based on at least the position and characteristics of the defect. . The correction method generation unit preferentially reads out from the database a defect correction method in which a region where the detected defect exists and a region associated with the defect correction method stored in the database match. The defect correction apparatus according to claim 2. When the detected defect exists across a plurality of regions in the wiring part, the region information of the defect consists of information on the main region including the center of the defect and other sub regions,
A defect correction method in which a main region and a sub region of the defect coincide with a main region and a sub region associated with the defect correction method stored in the database is preferentially read from the database. The defect correction apparatus according to claim 15. When the detected defect exists across a plurality of wiring parts, the defect area information includes supplementary area information including a reference wiring part including the center part of the defect and other sub-wiring parts,
A defect correction technique in which the main area and the sub area related to the defect correction technique stored in the database match the main area and the sub area related to the sub-wiring part, and the main area related to the reference wiring part of the defect, The defect correction apparatus according to claim 15, wherein the defect correction apparatus reads the data preferentially from the database. 3. The defect according to claim 2, wherein when there are a plurality of detected defects, the defect correction technique is read out from the database for each defect, and each defect correction technique is displayed on a display device simultaneously or individually. Correction device. A defect correction method using a defect correction apparatus for correcting a defect detected by comparing a defect image obtained by photographing a substrate on which a plurality of wiring portions are repeatedly formed and a reference image without a defect,
A process of extracting position information on the substrate of the defect and region information indicating which of the plurality of regions constituting the wiring part the defect belongs to;
A process of extracting feature information of the defect;
A process of reading out a defect correction method having a high priority corresponding to the position information, area information and feature information of the defect from a database in which various defect correction methods including a defect correction method performed in the past are accumulated,
A defect correcting method comprising: correcting a defect based on the read defect correcting method. After reading the defect correction method for the defect from the database, changing from the read defect correction method to another defect correction method, or selecting from a plurality of read defect correction methods, or a read defect The defect correction apparatus according to claim 2, wherein when a part or all of the correction method is changed, each content is stored in the database in association with a location where the defect is detected.

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