JP2009251200A - Defect repair system, server, defect repair device for use in the defect repair system, defect repair program, information recording medium, and defect repair device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To automatically perform proper repair in conformity with a defect without relying upon a new defect repair technique even when an already registered defect repair technique cannot be applied to a defect at a wiring part. <P>SOLUTION: Defect repair devices B1 to Bn are connectable to a server via a telecommunication circuit. The defect repair devices B1 to Bn include a defect position specifying means D1 specifying a defect position, a determination means D2 determining the existence of the defect repair technique coping with the defect position, a repair technique search means D3 searching for a usable defect repair technique from among the plurality of defect repair techniques stored in the server C when it is determined that there is no corresponding defect repair technique, a repair technique conversion means D4 converting the searched defect repair technique into one coping with the wiring part with the defect, and defect repair means D5 repairing the wiring part with the defect. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a flat panel display such as an organic EL (electroluminescence) or liquid crystal, for example, and in particular, a defect repair system, a server, and a defect repair program for repairing a defect in a device pattern or a wiring pattern formed on a substrate such as a TFT substrate. The present invention relates to an information recording medium and a defect repair apparatus.

Conventionally, as the size of an FPD (Flat Panel Display) increases, the yield of a TFT (Thin Film Transistor) substrate decreases. Therefore, a laser repair process for repairing a defective portion has become essential.
However, in the laser repair process in the production line, an operator visually observes a defect, determines a defect repair method, and performs a defect repair operation.
For this reason, there has been a problem that it takes too much tact time and the working speed of the laser repair process cannot follow the mass production speed of the entire production line.

In order to solve the above problem, there is a defect repair device disclosed in Patent Document 1.
The defect repair apparatus disclosed in Patent Document 1 is an input unit that inputs information including substrate information, panel information, and defect information, and a defect to be repaired from among a plurality of defects occurring in a specific panel. A calculation unit that obtains a specific matter including the position based on the information, and an output unit that outputs the specific matter as data for repairing the defect to be repaired to the repair machine.
Japanese Patent Laid-Open No. 2005-221974

  However, in the defect repair apparatus described in Patent Document 1, if a defect that cannot be dealt with by the already registered defect repair technique occurs in the wiring portion, the operator of the defect repair apparatus must repair the defect manually. In other words, there is a problem that efficient defect repair cannot be performed.

  Therefore, the present invention provides a defect that can automatically perform appropriate repair according to a defect without using a new defect repair method even when a registered defect repair method cannot be applied to a defect in a wiring portion. An object of the present invention is to provide a repair system, a server, a defect repair device used in the defect repair system, a defect repair program, an information recording medium, and a defect repair device.

  In order to achieve the above object, a defect repair system according to the present invention includes a defect-free reference image serving as a reference for a plurality of wiring portions arranged on a substrate, and a plurality of defects for repairing defects in the plurality of wiring portions. A server capable of storing defect repair techniques that can be connected to a defect repair device having an image capturing unit for capturing these wiring units and a substrate repair unit for repairing those defects via an electric communication line. A defect position specifying means for specifying a defect position by comparing a photographed image of the wiring section photographed by the photographing section with the reference image, and presence / absence of a defect repair method corresponding to the defect at the identified defect position If it is determined that there is no determination means and a defect repair method corresponding to the defect at the specified defect position, a defect repair method that can be diverted from a plurality of defect repair methods stored in the server. Based on the repair method search means for searching for the method, the repair method conversion means for converting the found defect repair method to correspond to the defect at the specified defect position, and the converted defect repair method, The defect repairing apparatus has defect repairing means for repairing the defect via the substrate repairing unit.

  A server of the present invention for achieving the above-described object is provided with a plurality of defect repair methods for repairing defects in a plurality of substrates having different configurations and a plurality of wiring portions respectively arranged on these substrates. Are stored in a database associated with each other, and a plurality of defect repair devices for repairing defects in the wiring portion can be connected via an electric communication line. In response to the request, a defect repair technique sending means for sending a corresponding defect repair technique to the defect repair apparatus is provided.

  A defect repairing apparatus used in the defect repairing system of the present invention for achieving the same object as described above repairs defects on a plurality of substrates having different configurations and a plurality of wiring portions respectively arranged on these substrates. An imaging unit for imaging a plurality of wiring units arranged on the board and connected to a server storing a database in which a plurality of defect repair methods are associated with each other A substrate repair unit for repairing defects of the above, a captured image of the wiring unit imaged by the imaging unit, the defect position specifying means for specifying the defect position by comparing the reference image, When it is determined that there is no defect repair method corresponding to the defect at the specified defect position and a determination means for determining whether there is a defect repair method corresponding to the defect at the specified defect position Corresponding to the defect at the specified defect position, the repair method searching means to search for a defect repair method that can be diverted from the multiple defect repair methods stored in the server, and the found defect repair method A repair method conversion unit that converts the defect as possible, and a defect repair unit that repairs the defect via the substrate repair unit based on the converted defect repair method.

  The defect repair program used in the defect repair system of the present invention for achieving the above-described object is a defect-free reference image that serves as a reference for a plurality of wiring portions arranged on a substrate, and repairs the defects in the plurality of wiring portions. A defect repairing device including a photographing unit for photographing these wiring parts and a board repairing part for repairing those defects is stored via a telecommunication line in a server storing a plurality of defect repairing methods for A defect position identifying function for identifying a defect position by comparing a photographed image of the wiring section photographed by the photographing section with the reference image, and a defect position identified. When it is determined that there is no defect repair method corresponding to a defect at the specified defect position and a determination function for determining whether there is a defect repair method corresponding to a certain defect, it is stored in the server. A repair method that finds a reusable defect repair method from multiple defect repair methods, and a repair that converts the found defect repair method to correspond to the defect at the specified defect location. This is a content that realizes a technique repair function and a wiring part repair function for repairing the defect via the substrate repair section based on the converted defect repair technique in the defect repair apparatus.

  In order to achieve the above object, an information recording medium of the present invention is characterized by recording a defect repair program used in the above-described defect repair system.

  In order to achieve the above-described object, a defect repairing apparatus according to the present invention includes a defect-free reference image serving as a reference for a plurality of wiring portions arranged on a substrate, and a plurality of defects for repairing defects in the plurality of wiring portions. It has a storage unit that stores a defect repair method and a substrate repair unit for repairing those defects, and compares the captured image of the wiring unit captured by the imaging unit with the reference image to determine the defect position. It is determined that there is no defect position specifying means for identifying the defect, a determination means for determining the presence or absence of a defect repair method corresponding to the wiring portion having the specified defect, and a defect repair method corresponding to the defect at the specified defect position. Sometimes, a repair method searching means for searching for a reusable defect repair method, a repair method converting means for converting the found defect repair method so as to correspond to the defective wiring portion, and defect Based on recovery techniques, the repair of the defective and defect repairing means for performing through the substrate recovery unit defect repairing apparatus has.

  According to the present invention, even when an existing defect repair method cannot be applied to a defect in a wiring portion, appropriate repair according to the defect can be automatically performed without using a new defect repair method.

  EMBODIMENT OF THE INVENTION Below, the form for implementing this invention is demonstrated with reference to drawings. FIG. 1 is a block diagram illustrating a schematic configuration of a defect repair system according to an embodiment of the present invention, and FIG. 2 is a block diagram illustrating a configuration of a defect repair apparatus that forms part of the defect repair system. FIG. 3 is an explanatory diagram showing the configuration of the substrate.

  As shown in FIG. 1, a defect repair system A according to an embodiment of the present invention can connect a plurality of defect repair devices B1 to Bn to a server C via a telecommunication line such as a local area network or the Internet. It is a thing of the structure made into.

As shown in FIG. 2, the defect repair apparatus B1 includes an imaging unit 10, an input unit 15 such as a keyboard, a display 20, a defect inspection apparatus 25, a board repair unit 30, and a line connection unit for connecting to the server C (illustrated). No)) is connected to the control unit D described later in detail.
In the following, the defect repair device B1 will be described as an example, but the other defect repair devices B2 to Bn have the same configuration, and thus description thereof is omitted.

The substrate repair unit 30 mainly includes a repair mechanism control unit 31, a repair mechanism unit 32, a stage control unit 33, and an XY stage 34.
The repair mechanism drive unit 31 has a function of generating a drive signal for driving the repair mechanism unit 32 based on a control signal sent from the control unit D.

The repair mechanism unit 32 includes a laser light source 35, optical lenses 36 and 37, a variable slit 38, and optical lenses 39 to 41, and is driven by a drive signal transmitted from the repair mechanism drive unit 31. ing.
In this configuration, the laser beam emitted from the laser light source 35 is corrected by the optical lenses 36 and 37, then passed through the variable slit 38 and further transmitted through the three optical lenses 39 to 41, so that the irradiation size, The angle can be changed.

  The stage control unit 33 has a function of generating drive signals for driving the XY stage 34 and the focus stage 42 by the control signal transmitted from the control unit D, respectively.

The XY stage 34 mounts the substrate 50 and is driven in the XY direction by a drive signal transmitted from the stage control unit 33.
That is, when the stage control unit 33 receives the control signal transmitted from the control unit D, the defective wiring unit detected by the defect inspection apparatus 25 is directly below the objective lens 43 according to the control signal. The stage 34 is moved.

The focus stage 42 has a function of adjusting the distance between the objective lens 43 and the substrate 50, so that a focused image of the light transmitted through the optical lens 44 can be captured by the imaging unit 10 described above.
In the present embodiment, an image having appropriate brightness is obtained by epi-illumination by the half mirrors 45 and 46, the optical lens 47, and the lamp 48.

As shown in FIG. 3, the substrate 50 constitutes a part of a display device (not shown), and a large number of wiring portions E are formed in a two-dimensional matrix corresponding to the pixels of the display device. Is.
In other words, on the common wiring board 51, a large number of wiring portions E are arranged in a grid pattern. In addition, what is shown by E 'in the figure is an example of a wiring part having a defect.

FIG. 4A is an explanatory diagram illustrating header information and object information that constitute a defect repair method, and FIG. 4B is an explanatory diagram illustrating a detailed configuration of a wiring unit according to an example.
The wiring portion E is divided into three regions (hereinafter also referred to as “sub-areas”) E1 to E3 corresponding to the three primary colors RGB.

The sub-areas E1 (to E3) shown in FIG. 4B are formed to have the same size, and scanning lines (shown by broken lines) 52, 56 provided on the wiring board 51 (see FIG. 3). Further, the signal line 53, the power supply line 54, and the ground electrode 55 are arranged so as to extend in a direction orthogonal to the scanning line 52 via an interlayer insulating film (not shown).
The sub-areas E1 (to E3) have different structures in that they have electrodes 57 to 59 having different signal storage capacities.
In the present embodiment, an example in which some of the three subareas E1 to E3 have different shapes (structures) will be described. However, these subareas have the same shape (structure). Of course, it may be.

By the way, as shown in FIG. 1, a storage device 60 composed of a hard disk or the like according to an example of an information recording medium is connected to the server C described above.
In the storage device 60, a reference image without defects serving as a reference for the wiring portions E, and a plurality of defect repairing methods for repairing defects in the wiring portions E are stored in a database.
The database 61 associates a plurality of defect repairing methods for repairing defects in each wiring part E ... with the wiring part or subarea, and for each of a plurality of types of substrates having different configurations. It is stored in association. In other words, a database is constructed for each different type of substrate.

In this database 61, a new defect repair technique, an existing defect repair technique, and the like are rewritten as needed by registration information sent from a defect repair apparatus B1 (to Bn), which will be described in detail later.
Further, a function (defect repair technique sending means) for sending a corresponding defect repair technique toward the defect repair apparatus B1 (~ Bn) in response to a request for a defect repair technique from the defect repair apparatus B1 (~ Bn). Have.

  The photographing unit 10 is for photographing each wiring part E, E ′... Of the substrate 50, and is configured to have a CCD or the like.

The defect inspection apparatus 25 obtains positional information of defective wiring portions E ′ by inspecting defects generated in the wiring portions E of the substrate 50 electrically or optically or both. The position information of the wiring part E ′ is transmitted to the control part D.
The defect inspection apparatus 25 may be configured to be individually connected to each of the defect repair apparatuses B1 to Bn as shown in the present embodiment, but one defect inspection apparatus 25 is connected via an electric communication line. May be connected in common to a plurality of defect repair apparatuses B1 to Bn.

The defect repair program according to an embodiment of the present invention realizes the following functions (I) to (V) in each of the defect repair apparatuses B1 to Bn, and thus in the control unit D that is a computer of each apparatus. The contents are stored in the storage device 60 described above.
(I) a defect position specifying function for specifying a defect position by comparing a photographed image of the wiring part photographed by the photographing part with the reference image;
(II) a discriminating function for discriminating whether or not there is a defect repair method corresponding to the defect at the specified defect position;
(III) When it is determined that there is no defect repair method corresponding to the defect at the specified defect position, a repair for finding a divertable defect repair method from a plurality of defect repair methods stored in the server Method search function,
(IV) a repair method conversion function for converting the found defect repair method so as to correspond to the defect at the specified defect position;
(V) A defect repair function for performing repair of the defect via the substrate repair section based on the converted defect repair technique.

The control unit D exhibits the following functions by executing the above-described defect repair program.
(1) A function of identifying a defect position by collating a photographed image of the wiring section E photographed by the photographing section 10 with the reference image. This function is referred to as “defect position specifying means D1”.
In the present embodiment, based on the positional information of one or more wiring parts E ′ having a defect transmitted from the defect inspection apparatus 25 described above, a photographed image of the wiring part E ′ having the defect is obtained by the photographing part. 10 is used for shooting.

(2) A function of determining whether or not there is a defect repair method corresponding to the defect at the specified defect position. This function is referred to as “discriminating means D2.”
Whether or not there is a defect repair method associated with the wiring part E ′ is determined with reference to a plurality of defect repair methods stored in the database 61.

Next, details of the defect repair method will be described with reference to FIGS.
The defect repair method is a data file having header information and object information associated with the header information.
The defect repair method is also referred to as “defect repair information”, and the wiring portion is also referred to as “pixel” or “pixel”.

  The header information “a” includes a “recipe name (or recipe number)” of the defect repair method, an “area number” indicating a defective subarea (area), a “subarea number” indicating a subarea, and a reference pixel on the substrate 50. “Reference pixel number” indicating the position of the reference pixel, “neighboring pixel number” indicating the presence / absence and position of adjacent pixels on the top and bottom and left and right of the reference pixel, and “object” of a repair object indicating a defect registered in the recipe and a defect repair method Number ".

The object information b includes a defect object 70 that imitates a defect, and repair objects 71 and 71 that indicate portions to be repaired according to the position of the defect object in the wiring portion E ′ and its characteristics.
In other words, the object information b is obtained by associating and registering defect objects and repair objects by the number of objects registered in the header information. Note that simply “registration” means registration to the database 61 described above.

The object information b includes “recipe name (or recipe number)” for matching with the recipe header, “coordinates” indicating the position of the object in the wiring section E, “object shape”, “angle”, “ "Position correction information" is included as basic information. The basic information has both the defect object 70 and the repair objects 71 and 70.
The “correction information” is information for position correction by comparison with the defect position of the actual defect image, and the “angle” is the above-described normal position of the defect on the XY stage 34. The rotation angle.

In FIG. 4A, repair objects 71 and 71 are associated with the defect object 70.
Since the illustrated defective object 70 is in the sub-area E1, the information of the sub-area E1 is associated.

In the object information b, an origin is set in advance in the reference pixel, and the object position information is registered based on the relative coordinates and angle from the origin.
Since the repair recipe information is read from the database 61 and superimposed on the defect image and the defect repair information is displayed on the display 20, the operator (operator) can visually recognize the contents of the defect repair technique.
That is, the defect repairing apparatus has a function (overlay display means D6) for displaying defect repairing information on the display 20 so as to be superimposed on the defect image.

  In addition, the data indicating the feature of the defect is stored in the defect information of the header information a or the object information b with the classification result or the like in an ADC (not shown) (not shown), so that the automatic repair recipe can be obtained from the feature of the defect. Detection can also be performed.

(3) A function for finding a divertable defect repair technique from a plurality of defect repair techniques stored in the server when it is determined that there is no defect repair technique corresponding to the defect at the specified defect position. . This is referred to as “repair technique searching means D3”.
Searching for a divertable defect repair method depends on whether or not the defect object 70 matches a defect in the sub-area E1. Specifically, this is based on whether or not the defect object 70 is in a predetermined area centered on the defect. Specifically, the search is performed based on the coordinates thereof.

(4) A function of converting the found defect repair technique so as to be able to deal with the defect at the specified defect position. This function is referred to as “repair technique conversion means D4”.
This function will be described with reference to FIGS. 5 to 9 together with a series of operations of the defect repair system configured as described above. FIG. 5 is a flowchart showing a main routine of a series of defect repair processing, and FIG. 6 is a flowchart showing detailed conversion processing of the defect repair technique.

Step S1 (abbreviated as S1 in the figure. The same applies hereinafter): Parameter setting A parameter is set in the defect repair apparatus B1. That is, the above basic information for repairing is set in the defect repairing apparatus B1.
Specifically, the basic information related to the substrate 50 such as the number and arrangement of the wiring portions E in the substrate 50 to be repaired, the number of patterns, the arrangement, and the alignment mark position, and the defect to be repaired automatically. The defect repair apparatus (hereinafter simply referred to as “apparatus”), such as size and conditions, repair condition setting information such as the number of repairs in the substrate 50 and priority defect characteristics, wiring pattern shape and repair method database, and the like. ) The parameter set uniquely in B1 is set.

Step S2: Loading of substrate 50 and setting of input information The substrate 50 is loaded from the outside into the apparatus B1, and defect information of the previous process of the substrate 50 is input. The loaded substrate 50 and defect information are collated with the parameters set in the apparatus B1, the basic information of the substrate 50 to be repaired is determined, and the initial setting of repair conditions (clearing the number of repair processes, etc.) is performed. .

  The defect information is either the number and coordinates of defects detected by the optical inspection in the defect inspection apparatus 25, or pixel information (including line defects or point defects) of the defects detected by the electric inspection. Or, the defect detected by the electrical inspection and the defect detected by the optical inspection are associated with each other.

Step S3: Set defect information From the list of defect information for each substrate 50 described above, whether to repair in order from the top of the list or whether specific defects (such as giving priority to line defects) are sorted together. Alternatively, one piece of defect information is input by either the method of selecting an arbitrary defect by the operator of the apparatus B1.

Step S4: Check of defect information It is confirmed from the input defect information list of the substrate 50 whether the repair can be automatically performed.
Whether it can be automatically repaired depends on the current substrate, such as whether the darkening process has not been performed more than the specified number, the repair process has not been performed more than the specified number, or the defect has already been repaired. If it does not meet 50 repair conditions, the coordinates of the input defect are indeterminate, or it is a place that is clearly defined not to be repaired outside the pattern, etc. This is because there are times when processing is impossible.

Step S5: Acquisition of defect position information When it is determined that the input defect information is a defect to be repaired, detailed coordinate information of the defect is acquired. Specifically, the location where the defect actually exists is calculated from the defect coordinates of the optical inspection result or the pixel number of the electric inspection result. Note that step S5 is described as “subpixel coordinate acquisition” in FIG.

Step S6: Shooting of Defect Image When the detailed position of the defect is calculated, the XY stage 34 is moved to capture the defect image and acquire detailed defect information in the pattern. In FIG. 5, “review information acquisition” is described.

Step S7: Defect repair technique acquisition process The detailed defect information acquired from the defect image is compared with the defect repair technique, and the optimum defect repair technique is retrieved from the database 61 and output in accordance with the defect position information.
The “defect repair method acquisition process” in this step will be described in detail with reference to FIG.

Step S8: Repair Execution Processing A defect repair method is set according to the actual defect position, position correction is performed as necessary, and repair is executed. The restoration execution result at that time is stored separately in the storage device 60. This step S8 is described as “repair execution” in FIG.

Step S9: Repair determination processing When the repair execution is completed, simple determination is made as to whether or not appropriate repair has been completed by capturing and comparing the repaired images with the same coordinates and magnification as the location where the defect image was captured. .

Step S10: Repair result update process The repair result is updated. The update contents include determination as to whether the repair has been properly performed, details of the repair, the number of repair processes, the number of repair processes for darkening, and the like.
After updating the repair result, check the defect information list again, determine whether there is an unprocessed defect or whether the repair is completed, and then continue the repair process by entering another defect information, or repair To determine whether to carry out the substrate 50.
Here, when it is determined that there is an unprocessed defect, the process returns to step S2.

Step S11: Substrate unloading / repair information set All defects have been repaired for the input substrate 50, or the repair end condition (repair exceeding the specified numerical value is performed, repairing the darkness exceeding the specified numerical value) When the repair for the specific defect is completed, the substrate 50 is taken out and defect repair information is output to the defect information management system.

Step S12: Parameter update If a defect repair method is newly registered in each of the above processes or if it is necessary to change the laser power or the condition of the defect to be repaired, the parameters of the set device B1 are set. The information is updated and the next substrate 50 is set.

  Next, details of the defect repair technique acquisition process in step 7 will be described with reference to FIGS. FIG. 7 is an explanatory diagram for explaining a defect repair method according to an example when the R subarea E1 is used as a reference, and FIG. 8 is a defect repair according to another example when the R subarea E1 is used as a reference. It is explanatory drawing for demonstrating a method.

  First, the subareas E1 to E3 shown in FIG. 7 are defined as shown in Table 1.

The coordinate conversion formula when the reverse conversion is not performed can be expressed by the following formulas (a) and (b).
(A)
Movement destination X = movement destination Left + (movement destination W / movement source W * (movement source X−movement source Left))
(B)
Destination Y = Destination (Move destination H / Move source H * (Move source Y−Move source Top))

The coordinate conversion formula when the reverse conversion is performed can be expressed by the following formulas (c) and (d).
(C)
Movement destination X = movement destination BRright− (movement destination W / movement source W * (movement source X−movement source Left))
(D)
Movement destination Y = movement destination Bottom− (movement destination H / movement source H * (movement source Y−movement source Top))

  When the coordinates (X, Y) indicated by “★” in the R subarea E1 are (RX, RY), respectively, the coordinates (GX, GY) of the G subarea E2 are the coordinates of the B subarea E3. The expansion formula when converting to (BX, BY) is as follows.

The coordinates of the G sub-area E2 can be expressed by the following equations (e) and (f).
(E) GX = GLleft + (GW / RW * (RX−RLLeft))
(F) GY = GTTop + (GH / RH * (RY−RTop))

The coordinates of the sub-area E3 of B can be expressed by the following equations (g) and (h).
(G) BX = BRight− (BW / RW * (RX−RLLeft))
(H) BY = BTTop + (BH / RH * (RX−RTop))
Since the sub-area E3 of B is inverted only in the X direction, the definition formula changes.

Conversely, a defect repair method (hereinafter also referred to as “template”) set in other subareas can be developed in the reference subarea.
In this case, the transformation of coordinates from the G sub-area E2 to the R sub-area E1 can be expressed by the following equations (i) and (j).
(I) RX = RL Left + (RW / GW * (GX−GL Left))
(J) RY = RTTop + (RH / GH * (GY−GTTop))

The transformation of the coordinates of the B sub-area E3 to the R sub-area E1 can be expressed by the following equations (k) and (l).
(K) RX = RRright- (RW / BW * (BX-BLleft))
(L) RY = RTTop + (RH / BH * (BY−BTTop))
As shown in FIG. 8, in the case of the rectangular repair object 73 in which the rotation angle Rθ is defined around the R coordinates (RX, RY), the rotation angle when the rotation is reversed is also reversed.

The rotation angle Gθ of the G sub-area and the rotation angle Bθ of the B sub-area can be expressed by the following equations (m) and (n).
(M) Gθ = Rθ
(N) Bθ = −Rθ

  As described above, when a template registered in a specific subarea is converted to another template, it is possible to prevent the template from being unable to be repaired due to missing template registration, or to reduce the template registration itself. .

FIG. 6 is a sub-flowchart showing the detailed contents of the above-described defect repair technique acquisition process.
Step T1: (In the figure, simply abbreviated as “T1”. The same applies hereinafter.): The defect information is input, and the process proceeds to Step T2.
Step T2: It is determined whether or not an appropriate defect repair method is registered. In FIG. 6, the defect repair method is described as a “repair method”.
If it is determined that an appropriate defect repair technique is registered, the process proceeds to step T3. If it is determined that an appropriate defect repair technique is not registered, the process proceeds to step T8.

  Step T3: It is determined whether or not the defect repair method can be applied by shift conversion around the wiring portion. Here, if it can be determined that the defect repair method can be applied by shift conversion to the periphery of the wiring portion, the process proceeds to step T5. If it is determined that the defect repair method cannot be applied by shifting the defect repair method to the periphery of the wiring portion, the process proceeds to step T4. move on.

Step T4: It is determined whether or not another sub-area defect repair method can be applied by shift conversion or shift and inversion conversion.
If it is determined that the defect repair method for another sub-area can be applied by shift conversion or shift and inversion conversion, the process proceeds to step T6. If it is determined that the defect repair method for another sub-area cannot be applied by shift conversion or shift and inversion conversion, the process proceeds to step T7.

Step T5: Shift conversion is performed around the wiring portion, and the process proceeds to Step T8.
Step T6: Shift conversion is performed so as to correspond to the corresponding sub-area, and the process proceeds to Step T8.

Step T7: Edit and register a new defect repair method, and proceed to Step T9.
Step T8: The defect repair method converted or edited in steps T2, 5, and 6 is applied, and the process proceeds to step T9.
Step T9: The converted or edited defect repair method applied in Step T8 is executed, and the process proceeds to Step T10.
Step T10: It is determined whether or not there is a wiring part whose defect has not been repaired. If it is determined that there is a wiring part that has not repaired the defect, the process returns to step T1 and defect information is input.
If it is determined that there is no wiring part that has not repaired the defect, the process proceeds to step T11 and proceeds to the next process.

Incidentally, as shown in FIGS. 4, 7, and 8, when the shape of a specific area in a sub-area is special, it may not always be possible to develop defect templates in all sub-areas only by automatic development.
In addition, even if the number of templates is large and the processing is equivalent, it is more manageable to register each individual subarea from the viewpoint of preventing duplicate registration and missing registration of a specific subarea template. The top can be easy.

  In such a case, in contrast to repairing defects in other subareas with a specific template, one template is registered and then automatically deployed to another template to determine the appropriateness of the template after deployment. By repairing individual templates, it is possible to prevent a template from a specific sub-area from being registered and not being repaired.

(5) A function of performing the repair of the defect via the substrate repair unit based on the converted defect repair method. This function is referred to as “defect repairing means D5”.

  Next, a case where a new defect repair method is registered corresponding to the wiring portion will be described with reference to FIGS. FIG. 9 is a flowchart showing a procedure performed manually by an operator for associating a defect repair method with a defect in the wiring portion, and FIGS. 10 to 14 are operations for automatically expanding a template registered in one subarea. It is explanatory drawing which shows a screen.

First, with reference to FIG. 9, a procedure for an operator to manually associate a defect repair method with a wiring portion, in other words, a procedure for an operator to edit and register a new defect repair method will be described.
Step U1 (abbreviated as “U1” in the figure. The same applies hereinafter): A subarea is defined.
Step U2: A defect repair method is registered for each sub-area, and the process proceeds to Step U2.
Step U3: It is determined whether or not it is possible to integrate into a plurality of subareas. If it is determined that the integration cannot be performed, the process proceeds to Step U4. If it is determined that the integration is possible, the process proceeds to Step U9.
“Integration” refers to associating one defect repair technique with a plurality of areas in common.

Step U4: Expands to all sub-areas and proceeds to step U5.
Step U5: Confirmation, editing, deletion, etc. of individual defect repair methods are performed.
Step U6: It is determined whether or not there is a sub-area that can be integrated. If it is determined that there is an area that can be integrated, the process proceeds to step T9, and if it cannot be integrated, the process proceeds to step U7. .

Step U7: It is determined whether or not the defect repair technique is properly registered for all the sub-areas. If it is determined that the defect repair technique is properly registered, the process proceeds to Step U8 and defect repair is performed. If the method is not properly registered, the process returns to step U2.
Step U8: Register another defect repair method and complete the registration of the defect repair method.

Step U9: A plurality of subareas are integrated and registered for the defect repair method.
Step U10: It is determined whether or not the defect repair method is covered for all subareas. If it is determined that the defect repair method is covered here, the process proceeds to Step U7, and if not covered, the process proceeds to Step U11. move on.
Step U11: The defect repair technique is developed in the unregistered subarea or the defect repair technique is additionally registered, and the process proceeds to Step U7.

Next, an operation screen that is sequentially displayed on the above-described display when performing the operations shown in steps U1 to U11 will be described with reference to FIGS.
When the operator edits and registers a new defect repair method, an operation screen associated with a plurality of tabs is displayed on the display 20.
The tabs are divided into sub-area editing 100, template editing 110, template development 120, template integration 130, and registered content confirmation 140, and information unique to them is displayed corresponding to the page.

On the page of the subarea editing 100 shown in FIG. 10, an input column 101 for inputting subarea information and a display column 102 for displaying any one wiring part F are displayed divided into left and right. .
The input field 101 includes a list box 104 for setting a reference area, a text box 105 for selecting and switching a registered sub area, and editing the order and settings in the sub area information input field 103, and a sub area area. A list box 106 for designating, a list box 107 for designating and registering a development method, a toggle switch 108 and the like are displayed to be operable.

On the page of the template development 120 shown in FIG. 11, an input field 121 for inputting subarea information and a display field 122 for displaying any one wiring part F are displayed divided into left and right.
The input field 121 includes a sub-area development setting field 123 and a selection template display setting field 124.
In the sub-area development setting field 123, a list box 125 for designating a development destination, a check box 126 for designating a development method, and the like are displayed in an operable manner.
Note that the list box 125 shown in FIG. 11 shows a case where the data is expanded from area 1 to area 2, and 127 is a defect and 128 is a repair object.

A list box 125 shown in FIG. 12 shows a case where the defect repair method applied to the area 1 is expanded to all areas, and an overwrite expansion check box 126 for an existing template and a preview check box 127 are displayed. The case where each is checked is shown.
In addition, when the check boxes 129a and 129b of “display all expanded same templates” and “highlight unexpanded subareas” in the selected template display setting field 124 are checked, they are not expanded. The sub-area can be visually confirmed.

On the page of the template integration 130 shown in FIG. 13, an input field 131 for expanding and setting subareas and a display field 132 for displaying any one wiring part F are displayed on the left and right sides.
In the input field 131, a list box 133 for designating registered subareas, an integrated subarea list box 134 for selecting whether to integrate with a template of any subarea, and the like are displayed in an operable manner. ing.

On the page of the template editing 110 shown in FIG. 14, an input field 111 for expanding and setting subareas and a display field 112 for displaying any one wiring part F are displayed divided into left and right.
The input field 111 includes a sub-area development setting field 113 and a selection template display setting field 114.
In the sub-area development setting column 113, a check box 113 in which a chuck box for selecting, displaying, and editing a template to be integrated is displayed in a tree view, and the like are operable.
The selected template display setting field 114 displays the detailed contents of the template as a dialog box 116 when the “detailed information display” toggle switch 115 is turned on. As a result, the detailed contents of the template can be visually confirmed.

The wiring part F displayed in the display column 102 shown in FIG. 10 has a structure different from that of the wiring part E described above, and has a structure divided into four regions F1 to F4.
The regions F1 to F4 shown in the present embodiment have a structure that is developed in a mirror-like shape on the left and right sides and also in a mirror-like shape on the top and bottom.
In addition, in FIGS. 10-14, area | regions F1-F4 are also described as the areas 1-4.

The specific operation content is as follows.
First, the coordinates of the sub-areas are set from area 1 to area 4, and how each area can be developed when the reference area is area 1 is specified.
FIG. 10 shows an example in which the area 3 is registered with the setting that the shape from the reference area is vertically inverted. Select and register the sub-area area with the edit box or mouse track designation.
The registered subarea is displayed in a list, and its position is indicated by a frame in the image. When an area or list in which sub-areas in the image are registered is selected with a mouse or keyboard, the color of the frame changes, and the registration order and setting contents can be changed.

If the reference area is changed halfway, the registration of individual shapes will be changed accordingly.
In FIG. 10, when the reference area is area 1, area 2 is set upside down and area 3 is set upside down. However, if the reference area is switched to area 2, area 1 is set up horizontally and area 3 is set up. Is changed to registration that flips left and right and then also flips up and down.
Even if the reference area is changed, only the calculation method at the time of development changes, so there is no effect on the coordinates of the defect repair technique registered in each sub-area and the registered contents of the template.

When the subarea settings are complete, edit the template or load an existing template.
If the sub-area is not set in the existing template or the area setting is different from the registered sub-area, the default setting value is the center area of the defect or the sub-area where the defect area is set the most. Re-register as a sub-area of each template.
When editing and registering a template, a sub-area is also specified as registration information.

As shown in FIGS. 11 and 12, a template to be expanded is selected from registered templates, a template to be expanded is displayed from a list of registered or expanded subareas, and an area to be expanded is selected and expanded. .
FIG. 12 shows a case where the template of area 1 is expanded to area 2, and the display color and the like are changed so that the expansion source area and the expansion destination area can be seen.
By default, the inversion when expanding is specified by the contents set in the editing of the subarea, but can be arbitrarily changed.
Since automatic expansion is only coordinate conversion, it is possible to edit the template again after expansion when the shape of the sub-area of the expansion destination is different from the expansion source.

FIG. 12 shows a case where the template of area 1 is automatically expanded in all registered sub-areas.
All the developments in FIG. 11 are performed at once without specifying the sub-areas to be developed.
By displaying a preview of the shape of the template at the development destination, it is possible to visually grasp the template after the development. Also, if there are already registered templates in the deployment destination subarea, all registered templates are displayed on the same pattern, or a mark is displayed in unregistered subareas to check for missing registration. it can.
Also, when the same template is already registered in a specific subarea, it is possible to specify whether to overwrite or leave it as it is at the time of batch development, and there is a subarea template whose position has been adjusted after development. To be able to deal with it efficiently.

In FIG. 13, the area 1 and the area 2 are closely reversed and the registered defect 127 of the template extends over a plurality of adjacent areas, and the place where both the area 1 and the area 2 are repaired is as follows. Be the same.
In this case, it is possible to repair defects in a plurality of sub-areas with one template, and registration contents are duplicated even if they are developed for each sub-area. In this case, a setting for sharing one template among a plurality of subareas is performed.

If the template is not expanded, the subarea to be integrated with the subarea information in the registered template may be specified. In addition, it is possible to select whether to delete a template whose contents that have already been developed are duplicated or to save it with a different name after integration.
Further, with the integrated template shown in FIG. 13 selected, the user can move to the template expansion screen again, expand the area 3 upside down, and then merge the areas 3 and 4 together. Subareas and templates can be set efficiently while retaining them.

In FIG. 14, when a plurality of sub-areas are defined in the wiring section, it is possible to visually confirm the registration status of each sub-area with respect to the template.
In other words, check whether all subareas are defined for each template and whether the defined subarea names and subarea designation methods are correct, which may cause some problems. Marking certain things makes it easier to manage them all together.

Also, the template selected by the mouse is displayed on the screen, or the detailed information of each template is displayed so that the contents of the template can be confirmed.
When any defect is confirmed for a specific template or sub-area, the corresponding template can be selected and edited again, or expanded and integrated.

  As described in detail above, even if the repair area in the substrate is set for each defect repair method, and there are multiple identical circuits in it, and the defect repair method changes due to different shapes, the defect coordinates Therefore, it becomes possible to select and execute an appropriate defect repair method.

According to the present invention described above, the following effects can be obtained.
-By selecting sub-area areas that are more electrically equivalent in the registered wiring section and setting the optimum defect repair method for each, the optimum defect repair method for the position of the defect coordinates is automatically selected and executed. Is possible.
In addition, even when there is a defect to which the registered defect repair method cannot be applied, the repair can be executed by moving the existing defect repair method by the wiring portion or the sub area area.
・ Furthermore, by registering and integrating the registered defect repair methods in a plurality of areas, it is possible to confirm omissions and duplication of defect repair methods and create an optimal database.
・ In this project, the following functions can be expanded.
・ If a defect template that overlaps the adjacent area in the wiring section has been registered, the template registration can be simplified by shifting the template in one of the 8 directions of the wiring area up, down, left, and right. Can be

The present invention is not limited to the above-described embodiments, and the following modifications can be made.
In the above-described embodiment, an example in which n defect repair apparatuses are connected has been described. However, a configuration in which one defect repair apparatus is connected to the server described above may be used.
In the embodiment described above, the defect repair device is connected to the server, and the defect repair device is provided with defect position specifying means, discrimination means, repair technique searching means, repair technique conversion means, and defect repair means. Although the defect repair system has been described, the following configuration may be used.

  That is, without having a configuration in which the defect repair device can be connected to the server as a terminal, the defect repair device is provided with a storage unit storing the plurality of defect repair methods as well as the photographing unit and the substrate repair unit. Set up.

Further, it is determined whether or not there is a defect position specifying means for specifying a defect position by comparing a photographed image of the wiring section photographed by the photographing section with the reference image, and a defect repairing method corresponding to the identified defective wiring section. When it is determined that there is no defect repair method corresponding to the defect at the specified defect position, the determination means and a repair method search means for searching for a usable defect repair method, A repair method converting means for converting the defective wiring portion so as to correspond to the defective wiring portion; and a defect repairing means for repairing the defective wiring portion through the substrate repair portion based on the converted defect repairing method; Is provided.
Even with this configuration, even when a registered defect repair method cannot be applied to a defect in the wiring portion, appropriate repair according to the defect can be automatically performed without using a new defect repair method.

  In the above-described embodiment, the configuration in which the defect repair program used in the defect repair system is stored in the storage device 60 as an example of the information recording medium has been described. However, the information recording medium is not limited to the storage device 60. It may be stored in a disk, a compact disk, a digital video disk, a magneto-optical disk, a portable hard disk, a portable memory, ROМ, or the like.

1 is a block diagram showing a schematic configuration of a defect repair system according to an embodiment of the present invention. It is a block diagram which shows the structure of the defect repair apparatus which makes a part of defect repair system. It is explanatory drawing which shows the structure of a board | substrate. (A) is explanatory drawing which shows the header information and object information which make a defect repair method, (B) is explanatory drawing which shows the detailed structure of the wiring part which concerns on an example. It is a flowchart which shows the main routine of a series of defect repair processes. It is a flowchart which shows the detailed conversion process of a defect repair method. It is explanatory drawing for demonstrating the defect repair method which concerns on an example when R subarea is made into the reference | standard. It is explanatory drawing for demonstrating the defect repair method which concerns on the other example when R subarea is made into the reference | standard. It is a flowchart which shows the procedure which an operator associates with a wiring part a defect repair method and is performed manually. It is explanatory drawing which shows the operation screen for carrying out the automatic expansion | deployment of the template registered into one subarea, and is an operation screen for editing a subarea. It is explanatory drawing which shows the operation screen for carrying out the automatic expansion | deployment of the template registered into one subarea, and is the operation screen which concerns on an example for expand | deploying a template. It is explanatory drawing which shows the operation screen for carrying out the automatic expansion | deployment of the template registered into one subarea, and is the operation screen which concerns on the other example for expand | deploying a template. It is explanatory drawing which shows the operation screen for carrying out the automatic expansion | deployment of the template registered into one subarea, and is an operation screen for integrating a template. It is explanatory drawing which shows the operation screen for carrying out the automatic expansion | deployment of the template registered into one subarea, and is an operation screen for editing a template.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 50 ... Board | substrate, 10 ... Image pick-up part, 30 ... Board | substrate repair part, 60 ... Information recording medium (memory | storage part), 61 ... Database, B1-Bn ... Defect repair apparatus, C ... Server, D1 ... Defect position specific | specification means, D2 ... Discriminating means, D3... Repair method searching means, D4... Repair method converting means, D5... Defect repair means, E.

Claims (10)

The wiring parts are photographed in a server storing a reference image without defects serving as a reference for the plurality of wiring parts arranged on the substrate and a plurality of defect repairing methods for repairing defects in the plurality of wiring parts. A defect repairing system capable of connecting a defect repairing device having a photographing unit for repairing and a substrate repairing unit for repairing those defects via an electric communication line,
A defect position specifying means for specifying a defect position by collating a photographed image of the wiring section photographed by the photographing section with the reference image;
A discriminating means for discriminating whether or not there is a defect repair method corresponding to the defect at the identified defect position;
When it is determined that there is no defect repair method corresponding to the defect at the specified defect position, a repair method search for searching for a usable defect repair method from a plurality of defect repair methods stored in the server Means,
A repair method conversion means for converting the found defect repair method so as to correspond to the defect at the specified defect position;
A defect repair system characterized in that the defect repair device has a defect repair means for repairing the defect via the substrate repair section based on the converted defect repair technique.   The defect repair system according to claim 1, wherein the repair technique conversion means performs coordinate conversion of the found defect repair technique that can be diverted so as to correspond to the defect at the specified defect position. The wiring section is divided into multiple areas,
The defect repair system according to claim 1, wherein the repair technique converting means performs coordinate conversion of the found and usable defect repair technique so as to correspond to a defective area.   The defect repair system according to claim 1, wherein the repair technique conversion unit performs coordinate conversion of the defect repair technique related to the conversion so as to correspond to the defect at the specified defect position.   The defect repair system according to claim 1, wherein one defect repair technique is commonly associated with a plurality of regions. A database in which a plurality of substrates having different configurations and a plurality of defect repair methods for repairing defects in a plurality of wiring sections respectively arranged on each of these substrates is stored in correspondence with each other, and the wiring sections are stored. A server capable of connecting a plurality of defect repairing devices for repairing defects in the network via a telecommunication line,
A server comprising: a defect repair technique sending means for sending a corresponding defect repair technique to the defect repair apparatus in response to a request for a defect repair technique from the defect repair apparatus. Electrical communication to a server that stores a database in which a plurality of substrates having different configurations and a plurality of defect repair methods for repairing defects in a plurality of wiring sections arranged on each of these substrates are associated with each other Defect repair used in a defect repair system, which is connected via a line and includes a photographing unit for photographing a plurality of wiring parts arranged on the substrate and a substrate repairing unit for repairing those defects A device,
A defect position specifying means for specifying a defect position by collating a photographed image of the wiring section photographed by the photographing section with the reference image;
A discriminating means for discriminating whether or not there is a defect repair method corresponding to the defect at the identified defect position;
When it is determined that there is no defect repair method corresponding to the defect at the specified defect position, a repair method search for searching for a usable defect repair method from a plurality of defect repair methods stored in the server Means,
A repair method conversion means for converting the found defect repair method so as to correspond to the defect at the specified defect position;
A defect repairing apparatus for use in a defect repairing system, comprising: defect repairing means for repairing the defect via the substrate repairing part based on the converted defect repairing technique. In order to photograph these wiring portions on a server storing a defect-free reference image serving as a reference for the plurality of wiring portions arranged on the substrate and a plurality of defect repairing methods for repairing the defects of the plurality of wiring portions. A defect repairing program for use in a defect repairing system capable of connecting a defect repairing device having a photographing unit and a substrate repairing unit for repairing those defects via an electric communication line,
A defect position identifying function for identifying a defect position by collating a photographed image of the wiring section photographed by the photographing section with the reference image;
A discriminating function for discriminating whether or not there is a defect repair method corresponding to the defect at the specified defect position;
When it is determined that there is no defect repair method corresponding to the defect at the specified defect position, a repair method search for searching for a usable defect repair method from a plurality of defect repair methods stored in the server Function and
A repair method conversion function for converting the found defect repair method so as to correspond to the defect at the specified defect position,
A defect repair program for use in a defect repair system, characterized in that, based on a converted defect repair technique, a defect repair apparatus realizes a wiring repair function that repairs the defect via the substrate repair unit.   An information recording medium in which a defect repair program used in the defect repair system according to claim 8 is recorded. A reference image having no defect serving as a reference for a plurality of wiring units arranged on a substrate, a storage unit storing a plurality of defect repairing methods for repairing defects in the plurality of wiring units, and repairing those defects In a defect repairing apparatus having a substrate repairing part for
A defect position specifying means for specifying a defect position by collating a photographed image of the wiring section photographed by the photographing section with the reference image;
A discriminating means for discriminating the presence or absence of a defect repair technique corresponding to the identified defective wiring portion;
When it is determined that there is no defect repair method corresponding to the defect at the specified defect position, a repair method search means for searching for a usable defect repair method,
A repair technique conversion means for converting the found defect repair technique so as to correspond to the defective wiring part; and
A defect repairing apparatus characterized in that the defect repairing apparatus has defect repairing means for repairing the defect via the substrate repairing part based on the converted defect repairing technique.

Images