JP2005221974A - Correction device for defect and method therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a correction device and method of defects of a flat-panel display, capable of improving its productivity and production yield, by improving the unit process time and the quality of the plates, after repair. <P>SOLUTION: CIM information, such as defect information, is inputted to the input 2 from a high order CIM 1. The information of the correction device is also inputted to the input 2 from the database, other than the high order CIM. The operation unit 3 obtains the relative positions between the defects and the kinds of defects, based on the inputted CIM information. Further, it obtains specific items, including the position and the kind of the defects to correct based on it. The output 4 outputs these specific items to the correction device 5 as the data, to correct the target defects. The correction device 5 uses a laser CVD to correct the defects, based on specific items inputted from the output 4. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a defect correcting device for a flat panel display such as a liquid crystal display device and PDP (Plasma Display Panel) and a method for correcting the same, and more particularly to an apparatus for correcting a defect in a flat panel display generated in a manufacturing process and a method for correcting the same. .

  With the recent increase in the size of flat panel displays such as liquid crystal display devices, in the manufacturing process, repeated processes of a manufacturing process, an inspection process, and a correction process are performed. The reason why the inspection process and the correction process are included in the manufacturing process is to regenerate a substrate having defects that can only be discarded, thereby improving the yield. For example, the manufacturing process of a conventional TFT array substrate is generally the process shown in FIG. 6, and pattern formation by film formation, resist coating, exposure, development, and etching is repeated for each layer. In some of the repeated processes, inspection and correction are performed after completion of pattern formation by etching, and the TFT array substrate is completed. In general, each manufacturing process, inspection process, and correction process are integrated and managed by CIM (Computer Integrated Manufacturing), etc. In the correction work, the location of the correction part is specified, and the correction is removed. Is determined by CIM or the like.

  In JP-A-10-177844, there is a manufacturing method for improving the yield of flat panel displays and reducing the cost by managing information on defect inspection and information on defect correction in units of substrates or lots. Proposed.

JP-A-10-177844

  As described above, a system integrated by CIM or the like is generally adopted in the manufacturing process of the TFT array substrate, and a manufacturing method described in Japanese Patent Laid-Open No. 10-177844 has been proposed. However, the production efficiency and the product yield are proposed. Is not enough.

  The present invention has been made in view of such problems, and by further improving the tact time and further improving the quality after the substrate correction work, the production efficiency of the flat panel display and the product yield are improved. An object of the present invention is to provide a defect correcting apparatus and a correcting method thereof that can realize improvement.

  A defect correction apparatus according to the first invention of the present application is a defect correction apparatus for correcting defects of a flat panel display generated in a manufacturing process, an input unit for inputting information including board information, panel information and defect information, and a specific panel A calculation unit for obtaining a specific matter including the position of a defect to be corrected based on the information from among a plurality of defects occurring in And an output unit that outputs the data as data to be performed.

  In this defect correction apparatus, it is preferable that the specific items include a defect type, a size, or a correction method in addition to the position of the defect. The information preferably includes at least one of a relative positional relationship between defects, a defect type, a defect size, and a panel pattern layout. In addition, it is preferable that the information further includes information related to a device status of the correction machine and / or information related to a correction condition unique to the correction machine.

  In addition, the information further includes at least one correction selected from the group consisting of correction part characteristics including a correction part material and temperature during defect correction by the correction machine, substrate material and temperature, and defect correction conditions. It is preferable to include medium data.

  Furthermore, it is preferable that the correction machine corrects the defect by laser irradiation.

  The defect correction method according to the second invention of the present application is a defect correction method for correcting a defect of a flat panel display that occurs in a manufacturing process. The defect correction method is performed by inputting information including board information, panel information, and defect information, and occurring in a specific panel. A specific matter including the position of a defect to be corrected is obtained from the plurality of defects based on the information, and the specific matter is output to a correction machine as data for correcting the defect to be corrected. It is characterized by doing.

  In this defect correction method, it is preferable that the specific items include a defect type, a size, or a correction method in addition to the position of the defect. The information preferably includes at least one of a relative positional relationship between defects, a defect type, a defect size, and a panel pattern layout. In addition, it is preferable that the information further includes information related to a device state of the correction machine and / or information related to a correction condition unique to the correction machine.

  In addition, the information further includes at least one correction selected from the group consisting of correction part characteristics including a correction part material and temperature during defect correction by the correction machine, substrate material and temperature, and defect correction conditions. It is preferable to include medium data.

  Furthermore, it is preferable that the correction machine corrects the defect by laser irradiation.

  The inventors of the present application have found that the cause of the problem is that there are many processes that require the operator's judgment in the actual correction work of the defective part using the correction device, and the glass substrate, the correction part, and the laser of the correction machine during the correction work. The present inventors have arrived at the present invention as described above, considering that the strength data is not fed back to the modification work condition change.

  In the defect correcting apparatus and the defect correcting method of the present invention configured as described above, the information including the board information, the panel information, and the defect information obtained from the upper CIM is processed, and the position of the defect to be corrected is determined. The specific matters including the above are output to the corrector as data for correcting the defect to be corrected, and the corrector is operated. Adjustment of the condition of the correction machine, final determination of the correction position, determination of correction conditions of the correction machine, and the like are automatically performed. As a result, the tact time can be further improved and the quality after the substrate correction work can be further improved, so that the production efficiency in the flat panel display manufacturing process and the product yield can be improved.

  In addition to the position of the defect, the specific matter includes the type, size, or correction method of the defect, so that the accuracy in specifying the defect to be corrected can be further improved. Further, by including at least one of the relative positional relationship between the defects, the type of defect, the size of the defect, and the panel pattern layout in the information, the accuracy in identifying the defect to be corrected is further improved. be able to. Further, by including information on the device status of the corrector and / or information on correction conditions unique to the corrector in the information, it is possible to perform an appropriate correction operation according to the capability of the corrector such as position accuracy. it can. Further, the information includes at least one data under correction selected from the group consisting of a correction part characteristic including a correction part material and temperature during defect correction by the correction machine, a substrate material and temperature, and a defect correction condition. By including, the correction process is automatically optimized and correction defects can be reduced.

  Next, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a block diagram of a defect correction apparatus according to an embodiment of the present invention.

  First, as a first embodiment, a defect correction apparatus that corrects a defect based on CIM information input from a host CIM and data of a correction machine will be described. In the defect correction apparatus of the present embodiment, CIM information such as lot information, glass information, panel information, and defect information is input from the upper CIM 1 to the input unit (data transfer unit) 2. Further, data related to the device status of the correction machine and information related to the correction conditions unique to the correction machine are input to the input unit (data transfer unit) 2 from the host CIM or a database other than the CIM. The calculation unit (data processing unit) 3 obtains the relative positional relationship and the type of defect between the defects based on the input CIM information and the corrector information, and further, the relative position between the defects. Based on the relationship and the type of defect, specific matters including the position, the type of defect, and the correction method are calculated for the defect to be corrected. The output unit 4 outputs this specific matter to the corrector 5 as data for correcting the defect to be corrected. The corrector 5 corrects the defect by laser CVD or the like based on the specific matter input from the output unit 4.

  Glass information, panel information, and defect information, which are data input from the host CIM, will be described with reference to FIGS. FIG. 2 is a schematic view of a liquid crystal panel formed on a glass substrate. FIG. 3A is a view showing a part of the liquid crystal in which a defect exists, and FIGS. 3B and 3C are enlarged views of the defective portion. As shown in FIG. 2, a plurality of liquid crystal panels 22 are formed on a glass substrate 21, and a TFT pattern (not shown), an electrode pad 25, and the like are formed on each of them. Information about the position of the glass substrate 21 is determined based on the glass substrate reference 23, and information about the position of the liquid crystal panel 22 is determined based on the panel reference 24. The formed liquid crystal panel 22 and the corresponding defect inspection result are associated with the glass substrate 21.

  Next, the operation of this embodiment when the defect “C” is corrected will be described with reference to FIGS. The calculation unit 3 uses the data received from the upper CIM 1 or the like via the input unit 2 to determine the position of the defect and the type of the defect by specifying a specific panel of the glass substrate to be corrected and specific cell designation or absolute coordinate designation. First recognize. Further, information obtained from the upper CIM 1 and the like regarding the defects “A”, “C”, and “B” in FIG. 3, for example, information that the defect to be corrected is a defect on the source line, and “B” is a defect in the cell. Based on the information indicating that “B” is not necessary, the calculation unit 3 determines that “B” does not require processing. Further, the calculation unit 3 calculates “A” and “C” from the relative relationship between the coordinate point “B” obtained from the coordinate information of each defect based on the reference point and the coordinate points “A” and “C”. Distinguish and identify the defect “C”. In addition to identifying the defect “C” in this way, information on the device status of the correction machine and information on correction conditions unique to the correction machine, for example, the coordinate system and the control accuracy of the correction machine in the initial settings of the correction machine In consideration of the above, the calculation unit 3 determines the correction condition. The output unit 4 outputs the correction condition to the correction machine 5 as data for correcting the defect to be corrected. The corrector 5 corrects the defect by laser CVD or the like based on the correction condition input from the output unit 4.

  In the actual correction, the corrector 5 moves the center of the coordinate system to the coordinate point “C” specified as described above based on the correction condition data input from the output unit 4 to Perform the correction work.

  In the present embodiment, the correction conditions are automatically adjusted according to the data characteristics, so an example of specific contents regarding the adjustment of the correction conditions according to the data characteristics will be described below. First, regarding the glass substrate information and the panel information obtained from the upper CIM 1 and the like, as shown in FIG. 2, a normal point or an alignment mark exists on each of the normal glass substrate and the panel. In the data based on these, errors in the exposure process and the inspection process are accumulated. Therefore, in order to automatically perform the correction work based on the defect position information based on these, the correction condition is such that the circle indicating the error at the point B in FIG. 3 is reduced to an area that does not overlap with other defects. It is necessary to sufficiently increase the coordinate accuracy on the corrector side. In this embodiment, when the correction condition is determined using the glass substrate information and the panel information, the coordinate accuracy on the correction machine side is automatically sufficiently increased. Next, regarding the defect information obtained from the upper CIM 1 etc., the data by the visual inspection machine represents the position information of each defect in a coordinate system based on a certain standard, and the data by the wiring continuity inspection is a defect. The cell in which the symbol exists is specified by the line. In this way, the data has characteristics. Conventionally, the corrector is operated only by discriminating these data types and replacing the coordinate system on the corrector side. However, the information based on the difference in these data is not only in the defect position designation method, but also in the defect detection method and the inspection area. It becomes possible to discriminate the glass substrate, the panel, the defect, and the like, and the accuracy when specifying the defect to be corrected is improved.

  In order to further improve the accuracy in the present embodiment, the information obtained from the upper CIM 1 is processed by automatically performing coordinate function of coordinate data sequentially and appropriately, and the error range circle of the defect coordinate position is equivalent. There is a way to make it smaller. As a result, the coordinate accuracy on the corrector side can be automatically processed with an accuracy equal to or lower than that of the conventional correction method.

  Next, the point that the present embodiment is superior to the conventional method will be described. Even in the conventional method, it is possible to specify the position and type of a defect as shown in FIGS. 3A and 3B based on data from a higher-order CIM such as lot information, glass information, panel information, and defect information. It was done.

  However, information from the upper CIM, such as lot information, glass information, panel information, and defect information, was only used by diverting inspection information necessary for the production process side to the correction process, and was obtained for the purpose of correction. Using these pieces of information as they were instead of data was not accurate enough to identify defects. In other words, although it is possible to specify the position and type of the defect with a certain degree of accuracy for each of the defects “A”, “B”, and “C” in FIG. 3B, they are actually received from the upper CIM or the like. In the data, at the stage of actual correction, the position targeted by the correction machine and the position of the defect did not match with sufficient accuracy. For example, with respect to point B, there is an error in the circle shown in FIG. 3C, and “A”, “B”, and “C” cannot be specified with the data received from the upper CIM, etc. Many scenes that require the operator to make a judgment are included in the confirmation by the worker and the position alignment of the correction part.

  The same applies to the specification of the C point. Conventionally, using the data received from the upper CIM 1 or the like, the position of the defect and the type of the defect by specifying the specific panel of the glass substrate to be corrected and the specific cell designation or absolute coordinate designation First, the coordinates of the defect were not specified with high accuracy as in the present embodiment. Therefore, even if the coordinate system of the correction machine is moved to the recognized defect position, the dimensional coordinate error of about the circle in FIG. 3 is not avoided, and the defect position is not changed even if the correction system coordinate system is moved to the designated position. "A", "B" or "C" could not be specified. If there is information on the difference in correction form, the difference between the defects “A” and “C” on the line and the defect “B” in the cell can be determined, but the difference between “A” and “C” cannot be determined. In this correction form, the operator's judgment is involved here, and the non-selection confirmation of “B” by the defect type, selection of the defect “C” necessary for the actual correction work, and the correction to the defect “C” to the correction machine The correction condition is designated, and finally, the defect “C” is subjected to a specific correction by a correction machine.

  For example, in Patent Document 1, while the wiring width is set to about 5 to 10 μm in paragraph 0017, the accuracy of detecting the position of a defect necessary for correction is set to about ± 100 μm in paragraph 0022. This is insufficient as position information for defect correction, and finally correction work cannot be realized without the intervention of the operator. In addition, the worker has to work for finding defects, which increases the work load.

  However, as in the present invention, the information obtained from the higher-level CIM or the like is processed in advance, thereby automating the correction process that has been conventionally involved by the worker and greatly reducing the burden on the worker. Can do. As described above, with respect to the defects “A”, “C” and “B” of the defects in the cell on the source line in FIG. Using this result, each defect position can be specified, or each of the defects “A”, “B”, and “C” can be distinguished and discriminated.

  In addition, in the said patent document 1, it is not touched about automating the correction process which the operator intervened.

  If the information obtained by the upper CIM or the like is processed in advance as described above, the correction function is selected by the correction machine, the correction condition is switched according to the defect type, the correction condition is switched according to the defect position and size, and each device condition is changed. It can be used to correct the correction conditions. As a result, not only can the position to be corrected and the type of correction be specified more accurately, but also the correction conditions can be automatically adjusted according to the conditions of the device. It can be automatically and optimally implemented.

  Therefore, the following processes that the operator always determined at the time of correction work, that is, confirmation of necessity of correction, specification of correction position, and change of correction conditions according to the change of correction mode type and device condition In this case, the operator's judgment is not necessary, everything can be automated, and the effect of improving the tact time and improving the correction quality can be obtained.

  As another method for accurately identifying a defect to be corrected as in the present embodiment, a cell having a defect obtained by pattern recognition by image processing and “A”, “B”, “C” are provided. There is also a method using the position data. In addition, coordinate processing is performed for each correction operation, data errors such as the correction device and CIM are always corrected, the coordinate error is reduced, and the position of the defect to be corrected can be determined without involving the operator. A method is also conceivable.

  Furthermore, in the above embodiment, the material and temperature of the correction part during the defect correction, the material and temperature of the glass substrate, and the correction conditions are processed so that they can be used for adjustment of the correction function of the correction machine, and the processed data Moreover, it is possible to further reduce defects caused by the correction machine by controlling the correction machine based on the condition adjustment function on the correction machine side.

  Hereinafter, a second embodiment of the present invention will be described with reference to FIG. This second embodiment reduces defects caused by the above-described correction machine by changing to the optimal correction condition based on the correction part material and temperature, the glass substrate material and temperature, and the correction condition during the correction process. To do.

  In the first embodiment described above, the position and type of the defect are specified based on the information obtained from the higher-level CIM 1 and the data about the correction machine, thereby enabling the determination of the correction position and the processing independent of the operator of the correction work. . In addition to this, in the second embodiment, the material and temperature of the correction part during the defect correction, the material and temperature of the glass substrate, and the correction conditions are also fed back and input to the data transfer unit 2. The calculation unit 3 obtains correction conditions for the correction machine based on this data. The output unit 4 outputs the correction condition to the correction machine 5 as a change in the correction condition. The corrector 5 corrects the defect based on the changed correction condition input from the output unit 4.

  A case where the “A” defect in FIG. 3 is corrected using a laser CVD apparatus as a correction machine will be described. The “A” defect existing in a specific cell in the glass substrate is recognized based on the data such as the upper substrate CIM1 such as the glass substrate information and the defect information given in the first embodiment, and the condition depending on the area of the glass substrate is determined. Selected. That is, it is selected whether it is a defect in the region L in FIG. 5, that is, the source line and the gate line, or a defect in the region M in FIG. Furthermore, the “A” defect is specified by the relative positional relationship between the defects “B” and “C”. Next, the condition of the correction part where the defect exists is also selected, and the first correction condition of the correction machine is set first. Based on the correction condition, the correction work is actually performed by the laser CVD apparatus. During the correction work, the material of the glass substrate during the correction process, the temperature, the material of the laser irradiation part at the correction site, the temperature, the state of the laser of the correction machine, the state of the CVD raw material, the correction position on the glass substrate and the correction time Data such as variations in the characteristics of the correction machine with respect to time are taken in, and these data are fed back to the input unit 2 and input. Based on the data, the calculation unit 3 obtains correction conditions for the correction machine. The output unit 4 outputs the correction condition as a change in the correction condition to the correction machine 5 (laser CVD apparatus). The corrector 5 (laser CVD apparatus) corrects the defect by changing the laser intensity and the laser irradiation position based on the changed correction condition input from the output unit 4.

  Corrections are made by adjusting and changing the correction conditions of the correction machine in real time during the correction process, taking into account the data on the glass substrate, correction site, laser, etc. obtained during the correction process and the condition conditions of the correction machine. It is possible to always process the location under the optimal correction condition, and it is possible to reduce correction defects in the correction process.

  As described above, in the second embodiment, the correction machine is controlled without an operator so as to always operate optimally. For this reason, the adjustment of the correction condition based on the information on the material of the correction unit and the information on the wiring material on the board side of the correction unit, and the adjustment of the correction condition due to the condition of the apparatus are sequentially corrected and adjusted during the correction process. It becomes possible to eliminate correction defects caused by processing. This makes it possible to optimize the adjustment of correction conditions based on factors such as differences in device conditions, board types, and wiring types of correction units, regardless of the operator during correction processing. It becomes possible to eliminate the operator's intervention in the correction process. As a result, optimization in the correction process can be automatically performed, and improvement in correction efficiency and improvement in the quality of the liquid crystal display device can be realized.

  The adjustment of the correction condition of the correction machine in this embodiment is not performed sequentially during correction, but is performed at regular inspection intervals, or regardless of adjustment at the correction point on the substrate of the actual product, It may be changed to a method that is performed separately in a form in which calibration data is obtained by providing a specific condition setting position, and the correction method may be changed to a method other than the laser CVD method.

  In addition, there are two methods for judging the quality of the correction state, such as an optical observation method for the correction part and a continuity inspection method for the correction part. In order to correct the defective part appropriately, the correction process and the result of the correction result are good. It is necessary to carry out the determination step together.

  The present invention can be used in a process for correcting defects in a flat panel display generated in the manufacturing process, thereby improving the production efficiency of the flat panel display and improving the product yield.

1 is a block diagram of a defect correction apparatus according to a first embodiment of the present invention. It is a schematic diagram of the liquid crystal panel formed on the glass substrate. (A) is the figure which showed a part of liquid crystal in which a defect exists, (b) and (c) are the enlarged views of a defective part. It is a block diagram of the defect correction apparatus which concerns on the 2nd Embodiment of this invention. It is a conceptual diagram for selecting the area | region where a defect exists. It is a figure which shows the general manufacturing process of the conventional TFT array substrate.

Explanation of symbols

21: Glass substrate 22: Liquid crystal panel 23: Glass substrate reference 24: Panel reference 31: Panel electrode 32: Panel pattern wiring 33: Cell having defect 34: Source 35: Gate 36: Error range of defect B

Claims (12)

In a defect correction apparatus for correcting defects in a flat panel display that occurs in the manufacturing process, from an input unit for inputting information including board information, panel information and defect information, and a plurality of defects occurring in a specific panel, A calculation unit for obtaining a specific matter including the position of the defect to be corrected based on the information, and an output unit for outputting the specific item as data for correcting the defect to be corrected to the correction machine. A defect correction device comprising: The defect correction apparatus according to claim 1, wherein the specific matter includes a defect type, a size, or a correction method in addition to the position of the defect. The defect correction apparatus according to claim 1, wherein the information includes at least one of a relative positional relationship between defects, a defect type, a defect size, and a panel pattern layout. . The defect correction apparatus according to any one of claims 1 to 3, wherein the information further includes information on an apparatus state of the correction machine and / or information on a correction condition unique to the correction machine. The information further includes at least one data under correction selected from the group consisting of a correction part property including a correction part material and temperature during defect correction by the correction machine, a substrate material and temperature, and a defect correction condition. The defect correction apparatus according to claim 1, wherein the defect correction apparatus includes: The defect correction apparatus according to claim 1, wherein the correction machine corrects the defect by laser irradiation. In a defect correction method for correcting a defect of a flat panel display generated in a manufacturing process, information including substrate information, panel information and defect information is input, and a correction target is selected from a plurality of defects generated in a specific panel. A defect correction method characterized in that a specific matter including a position of a defect is obtained based on the information, and the specific matter is output to a correction machine as data for correcting the defect to be corrected. The defect correction method according to claim 7, wherein the specific matter includes a defect type, a size, or a correction method in addition to the position of the defect. The defect correction apparatus according to claim 7, wherein the information includes at least one of a relative positional relationship between defects, a defect type, a defect size, and a panel pattern layout. . The defect correction method according to any one of claims 7 to 9, wherein the information further includes information on an apparatus state of the correction machine and / or information on a correction condition unique to the correction machine. The information further includes at least one data under correction selected from the group consisting of a correction part property including a correction part material and temperature during defect correction by the correction machine, a substrate material and temperature, and a defect correction condition. The defect correction method according to claim 7, comprising: The defect correction method according to claim 7, wherein the correction machine corrects the defect by laser irradiation.

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