JP2002296806A - Exposure device and substrate positioning method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To perform exposure processing of an exposure object substrate larger than a mask with a high precision. SOLUTION: In an exposure device which successively positions an exposure object substrate B larger than a mask A for pattern formation to prescribed positions relative to the mask and performs exposure processing in each of the prescribed positions, the positional deviation of the exposure object substrate B from the mask A, which deviation corresponds to the displacement of an exposure chuck 3 to a shaft, is corrected in each prescribed position by using a correction means 8 before the mask A is held on a mask holder 2 to set the mask A at a prescribed angle to the shaft 4 in each prescribed position. Positional deviation corresponding to the displacement of the exposure object substrate B to the shaft 4 is corrected with a table 6 before the exposure object substrate B is carried onto the exposure chuck 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an exposure apparatus for forming a pattern on a surface of a glass substrate, a color filter or the like in a manufacturing process of a flat panel display such as a liquid crystal display and a plasma display, and more particularly to an exposure apparatus for forming a pattern. An exposure apparatus and an exposure apparatus for exposing the entire glass substrate by sequentially positioning a large glass substrate at a predetermined position in a plurality of times with respect to the photomask and performing an exposure process at each of the positioned predetermined positions. The present invention relates to a substrate positioning method.

[0002]

2. Description of the Related Art Liquid crystal displays (LCD)
tal Display) can be made thinner and lighter than a CRT (Cathode R-ay Tube).
It has been adopted as a display device such as ision) and OA equipment, and the screen size has been increased to 10 inches or more, and higher definition and color have been promoted.

A liquid crystal display is made by drawing a fine pattern on the surface of a glass substrate by a photolithography technique. The exposure apparatus draws this fine pattern on a glass substrate. As the exposure apparatus, there are a projection system in which a mask pattern is projected onto a glass substrate using a lens or a mirror, and a proximity system in which a minute gap is provided between a photomask and the glass substrate to transfer the mask pattern onto the glass substrate. There is a method.

[0004] The proximity type exposure apparatus is inferior in pattern resolution performance to the projection type, but has a very simple irradiation optical system, high throughput, and excellent cost performance in terms of apparatus cost. It is suitable for mass production equipment with high productivity. Conventionally, the proximity type exposure apparatus has adopted a loader / unloader unit of an in-line compatible pass-through type. They are arranged in order.

The loader unit sequentially supplies the glass substrates, and the unloader unit sequentially discharges the glass substrates that have been subjected to the exposure processing. The substrate carrying-in unit carries out centering positioning of the glass substrate of the loader unit, and then carries the glass substrate onto the exposure chuck of the alignment stage by the carrying-in arm. The alignment stage unit includes an exposure chuck, a tilting Z stage, a substrate alignment stage, a mask holder, and the like. This alignment stage unit has
There is an irradiation optical system that irradiates ultraviolet rays via a photomask onto a glass substrate held by an exposure chuck provided outside the inline. The substrate unloading unit unloads the exposed glass substrate on the exposure chuck to the unloader unit.

In the above exposure apparatus, a photomask for forming a pattern is suction-held by a mask holder, a glass substrate to be exposed is suction-held by an exposure chuck, and a mask pattern of the photomask is transferred to the glass substrate. Usually, since a predetermined mask pattern is sequentially transferred to a glass substrate using a plurality of photomasks, the alignment accuracy between the photomask and the glass substrate occupies an important position in the exposure performance. Therefore, in the alignment stage unit, pre-alignment for correcting a shift of the transfer position of the glass substrate with respect to the exposure chuck, and alignment for positioning the photomask and the glass substrate with high accuracy are performed. When the glass substrate is larger than the photomask, the exposure chuck is moved stepwise with respect to the mask in a predetermined direction by the step table traveling axis, so that the glass substrate is divided into the predetermined position with respect to the photomask in plural times. By sequentially positioning and performing exposure processing at each of the predetermined positions that have been positioned,
A step exposure method for performing exposure processing on the entire glass substrate is employed.

[0007]

In the above exposure apparatus of the step exposure method, in the exposure processing step, the exposure chuck holding the glass substrate is step-moved to a predetermined exposure position by the step table traveling axis. There is a case where the exposure chuck is not step-moved straight along the step table traveling axis due to the transport accuracy of the traveling axis or the like. In this case, the exposure chuck is displaced with respect to the step table traveling axis, whereby the glass substrate is displaced in the X direction which is the axial direction of the step table traveling axis or in the Y direction perpendicular to the X direction, or The glass substrate is X to the table traveling axis
It may be inclined obliquely in the θ direction around the intersection of the direction and the Y direction. For this reason, the glass substrate is displaced with respect to the photomask, and a part of the mask pattern protrudes from a predetermined exposure region of the glass substrate due to the displacement. As a result, the mask pattern cannot be transferred to a predetermined exposure region of the glass substrate, and there has been a problem that the alignment accuracy of the mask pattern on the glass substrate is reduced.

Further, the glass substrate is carried into the exposure chuck from one end of the step table traveling shaft by the carry-in arm.
The glass substrate is displaced with respect to the step table travel axis,
Thereby, the glass substrate is displaced in the X direction, which is the axial direction of the step table traveling axis, or in the Y direction perpendicular to the X direction, or when the X direction and the Y direction are shifted with respect to the step table traveling axis. There is a case where the sheet is carried in a state of being inclined obliquely in the θ direction around the intersection. In this case, the glass substrate is displaced with respect to the step table traveling axis, and the glass substrate is held by the exposure chuck in a state of being displaced with respect to the step table traveling axis due to the positional displacement. There is a problem that the precision of imposition of the glass substrate is reduced.

In such a step type exposure apparatus, the step table travel axis serves as a transport reference axis for the step movement of the glass substrate and the positioning of the exposure area. If the misalignment between the corresponding glass substrate and the photomask is corrected, the mask pattern can be transferred into the exposure area of the exposure target substrate without protruding from the predetermined exposure area. Accuracy can be improved, and exposure processing can be performed with high accuracy. Further, if the displacement of the glass substrate with respect to the step table travel axis is corrected, the glass substrate can be held on the exposure chuck without causing a displacement with respect to the step table travel axis, and the surface of the glass substrate with respect to the exposure chuck can be held. The mounting accuracy can be improved, and the exposure processing can be performed with high accuracy.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-described circumstances, and corrects a positional shift of a mask with respect to an exposure target substrate so that exposure processing on an exposure target substrate larger than a pattern forming mask can be performed with high accuracy. Accordingly, it is an object of the present invention to provide an exposure apparatus in which the arrangement accuracy of a mask pattern on an exposure target substrate is improved. Further, in order to perform the exposure processing on the exposure target substrate larger than the pattern forming mask with high accuracy, the displacement of the exposure target substrate with respect to the axis for moving the step of the exposure chuck is corrected, and the exposure target substrate with respect to the exposure chuck is corrected. An object of the present invention is to provide an exposure apparatus with improved imposition accuracy and a substrate positioning method in the exposure apparatus.

[0011]

An exposure apparatus according to the present invention holds an exposure target substrate larger than a pattern forming mask held by a mask holder on an exposure chuck, and moves the exposure chuck to the mask. In an exposure apparatus that performs step movement in a predetermined direction by a predetermined axis to sequentially position the substrate to be exposed with respect to the mask at a predetermined position in a plurality of times, and performs an exposure process at each of the positioned predetermined positions. A correcting means for correcting the position of the mask before the mask is held by the mask holder; and a correcting means for providing the mask and the exposure chuck before the mask is held by the mask holder. Detecting alignment marks at each of the predetermined positions,
Detecting means for outputting a detection signal corresponding to the position of the mark; obtaining a positional shift of the mask with respect to the exposure chuck at each of the predetermined positions based on the detection signal; Calculating means for calculating a correction amount for setting the mask at a predetermined angle with respect to the axis; and correcting means for setting the mask at a predetermined angle with respect to the axis at each of the predetermined positions based on the correction amount And control means for controlling the driving of the motor.
According to this, before the mask is held by the mask holder, the correcting means corrects the positional deviation between the exposure target substrate and the mask in accordance with the displacement of the exposure chuck with respect to the axis at each predetermined position. Can set the mask at a predetermined angle with respect to the axis. This makes it possible to transfer the pattern into the exposure area without protruding from the predetermined exposure area of the exposure target substrate, thereby improving the pattern arrangement accuracy with respect to the exposure target substrate and performing the exposure processing with high accuracy Become like

Further, by holding a substrate to be exposed larger than the mask for pattern formation held by the mask holder on the exposure chuck, and moving the exposure chuck stepwise with respect to the mask in a predetermined direction by a predetermined axis. An exposure apparatus for sequentially positioning the substrate to be exposed with respect to the mask a plurality of times at predetermined positions and performing exposure processing at each of the positioned predetermined positions, wherein the mask is held by the mask holder; A correcting means for correcting the position of the mask holder, and, in a state where the mask is held by the mask holder, a mark for alignment provided on the mask and the exposure chuck at each of the predetermined positions. Detecting means for detecting and outputting a detection signal in accordance with the position of the mark; and detecting at each of the predetermined positions based on the detection signal. Calculating means for determining a displacement of the mask with respect to the exposure chuck and calculating a correction amount for setting the mask at a predetermined angle with respect to the axis at each of the predetermined positions based on the displacement; Control means for controlling the driving of the correction means so as to set the mask holder at a predetermined angle with respect to the axis at each of the predetermined positions based on the above. According to this, in a state where the mask is held by the mask holder, the correcting means corrects the positional deviation between the exposure target substrate and the mask in accordance with the displacement of the exposure chuck with respect to the axis at each predetermined position. The mask can be set at a predetermined angle with respect to the axis by the mask holder. This makes it possible to transfer the pattern into the exposure area without protruding from the predetermined exposure area of the exposure target substrate, thereby improving the pattern arrangement accuracy with respect to the exposure target substrate and performing the exposure processing with high accuracy Become like

Further, a substrate to be exposed which is larger than the pattern-forming mask held by the mask holder is carried in and held by the exposure chuck, and the exposure chuck is moved stepwise in a predetermined direction by a predetermined axis with respect to the mask. In the exposure apparatus, the exposure target substrate is sequentially positioned at a predetermined position in a plurality of times with respect to the mask with respect to the mask, and performs exposure processing at each of the positioned predetermined positions. Moving, a table for aligning the exposure target substrate with respect to the mask, a detection unit for detecting a position of the exposure target substrate carried on the exposure chuck, and outputting a detection signal; A position shift of the exposure target substrate with respect to the axis is determined based on the axis, and the exposure chuck is set at a predetermined angle with respect to the axis based on the position shift. Calculating means for calculating a correction amount for setting to the table, and positioning the exposure chuck at a predetermined angle with respect to the axis before the exposure chuck holds the exposure target substrate based on the correction amount. And control means for controlling driving. According to this, before the substrate to be exposed is loaded onto the exposure chuck, the table corrects the positional deviation according to the displacement of the substrate to be exposed with respect to the axis, so that the positional deviation of the substrate to be exposed with respect to the axis occurs. It can be held on the exposure chuck without the need. Thereby, the accuracy of imposition of the substrate to be exposed on the exposure chuck can be improved, and the exposure process can be performed with high accuracy.

Further, in the method of positioning a substrate in an exposure apparatus according to the present invention, a substrate to be exposed which is larger than a mask for pattern formation held by a mask holder is loaded and held on an exposure chuck, and the exposure chuck is mounted on the mask. The exposure target substrate is sequentially positioned at a predetermined position by dividing the exposure target substrate into the mask a plurality of times by performing a step movement in a predetermined direction with respect to the mask, and performing the exposure processing at each of the positioned predetermined positions. In the exposure apparatus, using a table that moves the exposure chuck in a predetermined direction and aligns the exposure target substrate with respect to the mask,
Before holding the exposure target substrate on the exposure chuck,
A substrate positioning method for positioning the substrate to be exposed with respect to the axis, wherein the step of detecting the position of the substrate to be exposed loaded on the exposure chuck and outputting a detection signal, based on the detection signal Obtaining a displacement of the exposure target substrate with respect to the axis, calculating a correction amount for setting the exposure chuck at a predetermined angle with respect to the axis based on the displacement, and performing the exposure based on the correction amount. Controlling the drive of the table to position the chuck at a predetermined angle with respect to the axis. According to this, before the substrate to be exposed is loaded onto the exposure chuck, the table can correct the positional deviation according to the displacement of the substrate to be exposed with respect to the axis. The wafer can be held on the exposure chuck without any displacement. Thereby, the accuracy of imposition of the substrate to be exposed on the exposure chuck can be improved, and the exposure process can be performed with high accuracy.

[0015]

Embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a schematic configuration diagram showing one embodiment of an exposure apparatus according to the present invention. FIG. 1 illustrates the alignment stage unit 1 and omits other units (a loader unit, a substrate carry-in unit, a substrate carry-out unit, and an unloader unit).

In FIG. 1, an exposure apparatus sequentially positions a glass substrate B, which is larger than a photomask A, at a predetermined position with respect to the photomask A a plurality of times, and performs an exposure process at each of the positioned predetermined positions. Is applied to a step-type exposure apparatus that performs The alignment stage unit 1 has, for example, an exposure chuck 3 directly below a mask holder 2 for holding a photomask A formed in a vertically long rectangular shape as shown in FIG. On the exposure chuck 3, for example, a glass substrate B formed in a horizontally long rectangular shape as shown in FIG. 4 is provided on one end side of the step table traveling shaft 4 (in the illustrated example, on the left end side of the step table traveling shaft 4). ) To the loading arm 1 of the substrate loading unit
0 is carried in. The glass substrate B is sucked and held at a predetermined position by the exposure chuck 3, and the exposure chuck 3 is step-moved by the step table traveling shaft 4 in the arrow X direction shown in FIG. As shown in the figure, the photomask A is sequentially positioned at a predetermined position in a plurality of times (two times in the illustrated example), and an exposure process is performed at each of the positioned predetermined positions.

In the exposure apparatus, before the exposure processing, first, a pre-alignment for correcting the transfer position of the glass substrate B with respect to the exposure chuck 3 is performed by the alignment stage 6, and then the photomask is corrected by the tilting Z stage 5. Proximity gap control for setting the proximity gap between A and the glass substrate B to an appropriate gap value is performed. Finally, alignment for positioning the photomask A and the glass substrate B with high accuracy by the alignment stage 6 is performed. Done.

However, in the exposure processing step, the exposure chuck 3 is moved stepwise by the step table traveling shaft 4, so that the exposure chuck 3 is moved by the step table traveling shaft 4 due to the conveyance accuracy of the step table traveling shaft 4.
If the glass substrate B is not moved stepwise along the step table, the glass substrate B is displaced with respect to the step table traveling shaft 4 together with the exposure chuck 3, whereby the X direction shown in FIG. Or, the glass substrate B is shifted in the Y direction perpendicular to the X direction,
The glass substrate B is X with respect to the step table traveling axis 4.
When the glass substrate B is tilted obliquely in the θ direction around the intersection of the direction and the Y direction, the glass substrate B shifts with respect to the photomask A. If the shift can be corrected, The arrangement accuracy of the mask pattern can be improved. Therefore, in this example, at each of the exposure positions shown in FIGS. 5 and 6, before the photomask A is sucked and held by the mask holder 2, the misalignment of the photomask A is corrected by the mask correction mechanism 8. The photomask A is set at a predetermined angle that is parallel to and perpendicular to the step table traveling axis 4.

Further, in the loading process of the glass substrate B, the glass substrate B is loaded onto the exposure chuck 3 from one end of the step table traveling shaft 4 by the loading arm 11, which may be caused by the transport accuracy of the loading arm 10. As a result, the glass substrate B is displaced with respect to the step table traveling shaft 4, and the glass substrate B is moved in the X direction shown in FIG. 4 which is the axial direction of the step table traveling shaft 4 or in the Y direction perpendicular to the X direction. If the glass substrate B is displaced or tilted obliquely in the θ direction around the intersection of the X direction and the Y direction with respect to the step table travel axis 4, the glass substrate B is positioned with respect to the step table travel axis 4. Although the displacement occurs, if the displacement can be corrected, the accuracy of imposition of the glass substrate B on the exposure chuck 3 can be improved. Therefore, in this example, the glass substrate B is
Before being held by suction, the glass substrate B is corrected by the alignment stage 6 so that the glass substrate B is positioned at a predetermined angle that is parallel to the step table traveling axis 4 and at a right angle. did.

In the exposure apparatus shown in the present embodiment, the step table traveling shaft 4 moves the exposure chuck 3 holding the glass substrate A stepwise as it is in the X direction.
Positioning is performed by the control unit 12 shown in FIG. 2 by closed loop control using an optical linear scale.

The tilting Z stage 5 includes a coarse movement stage that moves the exposure chuck 3 up and down in parallel with the photomask A, and a three-point contact type that tilts the glass substrate B to control the proximity gap. It has a tilt drive mechanism and the like. When performing the proximity gap control, the gap amount between the photomask A and the glass substrate B is detected by four gap detection sensors (not shown), and the calculation result is calculated by the calculation unit 13 shown in FIG. The control unit 12 drives the tilt driving mechanism according to the gap amount to set a predetermined proximity gap between the photomask A and the glass substrate B.

As shown in FIG. 4, the alignment stage 6 moves in the X direction and in the -X direction opposite thereto, with the center of the glass substrate B held by the exposure chuck 3 as the origin O, for example. An axis table 6a;
It is composed of a Y-axis table 6b that moves in the Y direction and the −Y direction opposite thereto, a θ-axis table 6c that moves in the θ direction, and the like. When performing pre-alignment, the edge of the glass substrate B is detected in a non-contact manner by an edge detection sensor (not shown) in a state where the glass substrate B is held by the exposure chuck 3, and the calculation unit 13 uses the detection result. The control unit 12 appropriately drives the X-axis table 6a, the Y-axis table 6b, and the θ-axis table 6c based on the calculated shift amount, so that the glass substrate B
Is corrected. When alignment is performed, alignment marks provided on both the photomask A and the glass substrate B are detected using a CCD sensor (not shown) while the glass substrate B is held by the exposure chuck 3. The control unit 12 controls the X-axis table 6 based on the deviation amount calculated by the calculation unit 13 from the detection result.
a, the glass substrate B is accurately positioned with respect to the photomask A by appropriately driving the Y-axis table 6b and the θ-axis table 6c.

As shown in FIG. 4, a plurality of (three in the illustrated example) edges for optically detecting the edges of the glass substrate B in the step of loading the glass substrate B around the outer periphery of the exposure chuck 3. Detection sensors 7a to 7c are provided. Among the edge detection sensors 7a to 7c, the edge detection sensors 7a and 7b are arranged at predetermined positions L1 at positions where the glass substrate B is to be sucked and held by the exposure chuck 3 in the X direction. , Two different points on the edge B1 on the X direction side are detected. The edge detection sensor 7c is disposed at a position where the glass substrate B is to be sucked and held by the exposure chuck 3 in the Y direction.
Is detected at one point on the edge B2 on the Y direction side. When the edge detection sensors 7a to 7c detect the edges B1 and B2 of the glass substrate B, they transmit an edge position detection signal corresponding to the positions of the edges B1 and B2 to the input / output circuit 11 shown in FIG.

As shown in FIG. 4, the mask correction mechanism 8 includes a plurality (three in the illustrated example) of mask position correction mechanisms 8a to 8c provided around the outer periphery of the photomask A. The mask position correcting mechanisms 8a to 8c include a linear motor 8a1 to 8c1 and a pusher 8a11, respectively.
To 8c11 and the like. Among the mask position correcting mechanisms 8a to 8c, the mask position correcting mechanisms 8a and 8b
The linear motors 8a1 and 8b1 are in contact with the end face A1 on the X direction side of the photomask A at the tips, and the pushers 8a11 and 8b11 are in contact with the end face A2 opposite to the end face A1 at the tips. Mask position correction mechanism 8c
The linear motor 8c1 contacts the end face A3 of the photomask A on the Y direction side at the tip end, and the pusher 8c11
Is in contact with the end face A4 opposite to the end face A3 at the tip. In the mask position correcting mechanisms 8a and 8b, the pushers 8a11 and 8b11 are composed of, for example, coil springs, and always urge the photomask A to the corresponding opposite linear motors 8a1 and 8b1 at the tips. The linear motors 8a1 and 8b1 are simultaneously or individually driven by the control unit 12, and are driven in the X direction or-
By moving back and forth simultaneously or individually in the X direction,
The photomask A is moved in the X direction, the −X direction, or the θ direction. In the mask position correcting mechanism 8c, the pusher 8c11 is formed of, for example, a coil spring, and constantly biases the photomask A to the corresponding opposite linear motor 8c1 at the tip. The linear motor 8c1 is
The photomask A is moved in the Y direction or the −Y direction by being driven by the control unit 12 to move forward and backward in the Y direction or the −Y direction. In this example, the linear motors 8a1 to 8a1 are used in the mask position correcting mechanisms 8a to 8c.
8c1, the linear motors 8a1 to 8c
1. A hydraulic cylinder is used in place of 1 and the photomask A is moved by the hydraulic cylinder in the X direction, the −X direction, the θ direction, and the Y direction.
It may be configured to move in the direction or the −Y direction.

As shown in FIG. 5A, marks 3a to 3f (in the illustrated example, X-shaped marks) and Aa to Af are provided on the exposure chuck 3 and the photomask A, respectively. (In the example shown, a + shaped mark)
Are provided at predetermined positions. Marks 3a to 3f and Aa
Af are provided at positions corresponding to the mask position correcting mechanisms 8a to 8c at the respective exposure positions shown in FIGS. For example, marks 3a to 3c and Aa to Ac
Are provided at positions corresponding to the mask position correcting mechanisms 8a to 8c in the exposure positions shown in FIG. Mark 3
Marks 3a and 3b among a to 3c and Aa to Ac
Are provided at mark attaching portions 31a and 31b provided at two different positions on the X direction side of the exposure chuck 3 so as to correspond to the mask position correcting mechanisms 8a and 8b, respectively. The mark 3c is provided at the mask position correcting mechanism. 8c, it is provided in a mark attaching portion 31c provided at one position on the Y-direction end of the exposure chuck 3. The marks Aa and Ab are provided at two different positions on the X direction side of the photomask A so as to correspond to the mask position correcting mechanisms 8a and 8b.
5a and A5b, the mark Ac is provided on the photomask A so as to correspond to the mask position correcting mechanism 8c.
Mark-attached portion A provided at one position at the end on the direction side
5c. On the other hand, marks 3d to 3f and Ad
Af is provided at a position corresponding to the mask position correcting mechanisms 8a to 8c in the exposure position shown in FIG. For example, of the marks 3d to 3f and Ad to Af, the mark 3
d and 3e are mark attaching portions 31d and 3 provided at two different positions on the -X direction end of the exposure chuck 3 so as to correspond to the mask position correcting mechanisms 8a and 8b.
1e, the mark 3f is provided by the mask position correcting mechanism 8
The mark is provided on a mark attaching portion 31f provided at one position on the end portion on the −Y direction side of the exposure chuck 3 so as to correspond to c. Further, the marks Ad and Ae are provided at two mark attaching portions A5d and A5e provided at two different positions on the -X direction end of the photomask A so as to correspond to the mask position correcting mechanisms 8a and 8b. Af
Is provided in a mark attaching portion A5f provided at one position on the -Y direction end of the photomask A so as to correspond to the mask position correcting mechanism 8c.

As shown in FIG. 5A, the marks 3a to 3f and Aa to Af are located above the photomask A.
, A plurality of (six in the illustrated example) mark detection sensors 9a to 9f are provided. Mark detection sensors 9a to 9
f is constituted by, for example, a CCD sensor or the like. Among the mark detection sensors 9a to 9f, the mark detection sensor 9a
To 9c correspond to the marks 3a to 3c and Aa to Ac, and the mark detection sensors 9d to 9f correspond to the marks 3d to 3c.
f and Ad to Af. Mark detection sensor 9
a to 9c, the mark detection sensors 9a and 9b are the mark 3 on the X direction side of the exposure chuck 3 and the photomask A.
a and Aa, and 3b and Ab, are arranged at a predetermined interval L2. At the exposure position shown in FIG. 5, the mark detection sensor 9a detects the marks Aa and 3a.
Are detected, and the mark detection sensor 9b detects the marks Ab and 3b.
Is detected. The mark detection sensor 9c detects the exposure chuck 3 and the photomask A at the exposure position shown in FIG.
Are detected in the Y direction. Further, among the mark detection sensors 9d to 9f, the mark detection sensor 9
d and 9e are-of the exposure chuck 3 and the photomask A.
The marks 3d and Ad on the X direction side and 3e and Ae are arranged at a predetermined interval L3 so as to detect the marks 3e and Ae.
In the exposure position shown in (1), the mark detection sensor 9d detects the marks Ad and 3d, and the mark detection sensor 9e detects the marks Ae and 3e. Mark detection sensor 9f
At the exposure position shown in FIG.
And marks 3f and Af on the −Y direction side of photomask A
Is detected. Thus, each of the mark detection sensors 9a to 9
f detects the marks 3a to 3f and Aa to Af at the respective exposure positions shown in FIGS. 5 and 6, and outputs a mark position detection signal corresponding to the positions of the marks 3a to 3f and Aa to Af in FIG. To the input / output circuit 11 shown in FIG. In this example, marks 3a to 3
f, marks are provided at predetermined positions on the glass substrate B, and the marks Aa to Af on the photomask A and the marks on the glass substrate B are detected by the mark detection sensors 9a to 9f, respectively. May be sent to the input / output circuit 11 according to the mark position detection signal.

In FIG. 2, an input / output circuit 11 includes an A / D converter for an edge position detection signal and a mark position detection signal, and circuits necessary for drive control of the alignment stage 6 and the mask correction mechanism 8, and the like. You. ROM and R
Various reference data (setting data) required for the sequence operation of the exposure apparatus, the drive control of the alignment stage 6, and the position correction of the glass substrate A and the photomask B are stored in the memory unit 14 including the AM. It is remembered. The control unit 12 is configured by an MPU or the like, and executes programs stored in the memory unit 14 to perform various processes such as a sequence operation of the exposure apparatus, a drive control process of the alignment stage 6, and a position correction process. . The arithmetic unit 13 performs arithmetic processing of detection data obtained from the edge detection sensors 7a to 7c and the mark detection sensors 9a to 9c according to a command signal from the control unit 12.

With reference to the flow chart shown in FIG. 7, a description will be given of the positional deviation correction processing for positioning the glass substrate B in the exposure apparatus shown in this embodiment. In step S1, edge position detection signals are input from the edge detection sensors 7a to 7c.

In step S2, the edge detection sensor 7a
The position deviation of the glass substrate B with respect to the step table traveling axis 4 is calculated by the calculation unit 12 based on the edge position detection signals from .about.7c. For example, the edge detection sensors 7a and 7
b) any one edge position detection signal obtained from
By performing predetermined arithmetic processing using the reference position data of the edge B1 on the X direction side of the glass substrate A (reference position data when the edge B1 is perpendicular to the step table traveling axis 4), FIG. , The shift amount Δx in the X direction of the glass substrate B indicated by the dashed line is obtained. Further, the shift amount Δx and both edge detection sensors 7 a and 7
By performing a predetermined calculation using the distance L1 between b, the amount of inclination deviation Δθ in the θ direction of the glass substrate B is obtained.
Further, an edge position detection signal obtained from the edge detection sensor 7c and an edge B2 on the Y direction side of the glass substrate A
Is performed by using the reference position data (reference position data when the edge B2 is parallel to the step table traveling axis 4) to obtain the deviation amount Δy of the glass substrate B in the Y direction. .

In step S3, the calculation unit 12 calculates a correction amount for correcting the position of the glass substrate B based on the positional deviation amount obtained in step S2. For example, the deviation amount Δ
As a correction amount of x, a correction amount −Δ that offsets the shift amount Δx
Calculate x. Further, as a correction amount of the inclination deviation amount Δθ,
A correction amount-[Delta] [theta] that cancels out the deviation [Delta] [theta] is calculated. Further, as a correction amount of the deviation amount Δy, a correction amount−ΔY that cancels out the deviation amount ΔY is calculated.

In step S4, the controller 12 controls the alignment stage 6 based on the correction amount calculated in step S3.
To drive the X-axis table 6a, the Y-axis table 6b, θ
The displacement of the glass substrate B with respect to the step table traveling axis 4 is corrected by appropriately moving the axis table 6c. For example, the X-axis table 6a is driven and the correction amount−Δ
Move x minutes. Further, the θ-axis table 6c is driven to move by the correction amount −Δθ. Also, the Y-axis table 6b
To move by the correction amount -Δy. by this,
An edge B1 on the X direction side of the glass substrate B is perpendicular to the step table traveling axis 4, and an edge B2 on the Y direction side of the glass substrate B is parallel to the step table traveling axis 4.

As described above, in the loading step of the glass substrate B, before the glass substrate B is held by the exposure chuck 3, the tables 6a to 6c are corrected in a predetermined direction in accordance with the displacement of the glass substrate B. The position of the glass substrate B with respect to the step stage travel axis 4 is corrected because of the movement of the glass substrate B with respect to the step stage travel axis 4 as shown by a dashed line in FIG.
Can be positioned at a predetermined angle which is parallel to and at a right angle. As a result, the glass substrate B is sucked and held by the exposure chuck 3 while keeping the predetermined angle.

Next, the position correction processing of the photomask A in the exposure apparatus shown in this embodiment will be described with reference to the flowchart shown in FIG. In step S11, FIG.
At the first exposure position shown in (a), mark position detection signals of marks 3a to 3c and Aa to Ac are input from mark detection sensors 9a to 9c.

In step S12, the mark detection sensor 9
a calculation unit 13 based on the mark position detection signals from
Is used to determine the amount of displacement between the exposure chuck 3 and the photomask A. For example, in the mark detection sensors 9a and 9b, a predetermined calculation process is performed using a mark position detection signal of the exposure chuck 3 obtained from one of the mark detection sensors 9a or 9b and a mark position detection signal of the photomask A. As a result, as shown in FIG. 3, a shift amount Δx between the exposure chuck 3 and the photomask A in the X direction is obtained. Further, by performing a predetermined calculation using the deviation amount Δx and the distance L2 between the mark detection sensors 9a and 9b shown in FIG. 5A, the exposure chuck 3 and the photomask A in the θ direction can be obtained. The inclination deviation amount Δθ is obtained. Also,
By performing a predetermined arithmetic process using the mark position detection signal of the exposure chuck 3 obtained from the mark detection sensor 9c and the mark position detection signal of the photomask A, the Y direction between the exposure chuck 3 and the photomask A in the Y direction is determined. The shift amount Δy is obtained.

In step S13, the calculation unit 13 calculates a correction amount for correcting the position of the photomask A based on the positional shift amount between the exposure chuck 3 and the photomask A obtained in step S12. For example, as a correction amount of the shift amount Δx, a correction amount −Δx for canceling the shift amount Δx is calculated. In addition, as a correction amount of the inclination deviation amount Δθ, the deviation amount Δ
A correction amount -Δθ that cancels θ is calculated. In addition, the deviation amount Δ
As a correction amount of y, a correction amount −Δ that offsets the deviation amount Δy
Calculate y.

In step S14, based on the correction amount calculated in step S13, the controller 12 controls the linear motor 8 in the mask position correcting mechanisms 8a to 8c of the mask correcting mechanism 8.
a1 to 8c1 are appropriately driven to correct the displacement between the exposure chuck 3 and the photomask A. For example, the linear motors 8a1 and 8b1 of the mask position correcting mechanisms 8a and 8b
Are driven simultaneously or individually to move the photomask A by an amount corresponding to the correction amounts −Δx and −Δθ. Further, the linear motor 8c1 of the mask position correcting mechanism 8c is adjusted by the correction amount−
Move by an amount corresponding to Δy. Thereby, the end face A2 on the X direction side and the end face A on the −X direction side of the photomask A
1 is perpendicular to the step table travel axis 4, and the end face A3 on the Y direction side and the end face A4 on the −Y direction side of the photomask A are parallel to the step table travel axis 4.

As described above, at the first exposure position shown in FIG. 5, the linear motors 8a1 to 8c1 of the respective mask position correcting mechanisms 8a to 8c are driven to shift the amount of displacement between the exposure chuck 3 and the photomask A. Since the photomask A is moved in a predetermined direction by the correction amount according to the above, the positional deviation between the exposure chuck 3 and the photomask A is corrected. Thereby, as shown by the dashed line in FIG.
The photomask A is set at a predetermined angle which is parallel to the step table traveling axis 4 and perpendicular to the axis. As a result, the photomask A is sucked and held by the mask holder 2 at the predetermined angle, so that the pattern does not protrude from the exposure area BA1 of the glass substrate B as shown in FIGS. The image can be transferred into the exposure area BA1.

In step S15, at the second exposure position shown in FIG. 6, mark position detection signals of marks 3d to 3f and Ae to Af are input from the mark detection sensors 9d to 9f.

In step S16, the mark detection sensor 9
calculation unit 13 based on the mark position detection signals from
Is used to determine the amount of displacement between the exposure chuck 3 and the photomask A. For example, assuming that the amount of displacement between the exposure chuck 3 and the photomask A at the first exposure position is the same at the second exposure position, the mark detection sensor 9d
And 9e, one of the mark detection sensors 9
By performing predetermined arithmetic processing using the mark position detection signal of the exposure chuck 3 obtained from d or 9e and the mark position detection signal of the photomask A, as shown in FIG. The shift amount Δx in the X direction from the mask A is obtained. In addition, the deviation amount Δx and FIG.
By performing a predetermined calculation using the distance L3 between the mark detection sensors 9d and 9e shown in (a), the inclination shift amount Δθ between the exposure chuck 3 and the photomask A in the θ direction.
Ask for. A mark position detection signal of the exposure chuck 3 obtained from the mark detection sensor 9f and a photomask A
By performing a predetermined arithmetic processing using the mark position detection signal of the above, the shift amount Δy between the exposure chuck 3 and the photomask A in the Y direction is obtained.

In step S17, the calculation unit 13 calculates a correction amount for correcting the position of the photomask A based on the positional shift amount between the exposure chuck 3 and the photomask A obtained in step S16. For example, as a correction amount of the shift amount Δx, a correction amount −Δx for canceling the shift amount Δx is calculated. Further, as a correction amount of the inclination deviation amount Δθ, a correction amount −Δθ that cancels out the inclination deviation amount Δθ is calculated. In addition, as a correction amount of the shift amount Δy, a correction amount −Δy that cancels out the shift amount Δy is calculated.

In step S18, based on the correction amount calculated in step S17, the control unit 12 controls the linear motor 8 in the mask position correcting mechanisms 8a to 8c of the mask correcting mechanism 8.
a1 to 8c1 are appropriately driven to correct the displacement between the exposure chuck 3 and the photomask A. For example, the linear motors 8a1 and 8b1 of the mask position correcting mechanisms 8a and 8b
Are driven simultaneously or individually to move the photomask A by an amount corresponding to the correction amounts −Δx and −Δθ. Further, the linear motor 8c1 of the mask position correcting mechanism 8c is adjusted by the correction amount−
Move by an amount corresponding to Δy. Thereby, the end face A2 on the X direction side and the end face A on the −X direction side of the photomask A
1 is perpendicular to the step table travel axis 4, and the end face A3 on the Y direction side and the end face A4 on the −Y direction side of the photomask A are parallel to the step table travel axis 4.

As described above, at the second exposure position shown in FIG. 6, the linear motors 8a1 to 8c1 of the mask position correcting mechanisms 8a to 8c are driven to shift the position of the exposure chuck 3 and the photomask A. Since the photomask A is driven in a predetermined direction by the correction amount corresponding to the above, the positional deviation between the exposure chuck 3 and the photomask A is corrected. Thereby, as shown by the dashed line in FIG.
The photomask A can be set at a predetermined angle that is parallel to and perpendicular to the step table traveling axis 4. As a result, the photomask A is sucked and held by the mask holder 2 at the predetermined angle, so that the pattern does not protrude from the exposure area BA2 of the glass substrate B as shown in FIGS. The image can be transferred into the exposure area BA2.

As described above, at each of the first and second exposure positions, the exposure regions BA1 and BA2 of the glass substrate B are exposed.
Since the position of the photomask A is corrected so that the mask pattern fits within the mask pattern, the arrangement accuracy of the mask pattern on the glass substrate B can be improved, and the exposure processing on the glass substrate B larger than the photomask A can be performed with high accuracy. Become like

In the exposure apparatus shown in this embodiment, an X-axis table and a Y-axis table are used in place of the mask mechanism 8 in order to correct the displacement between the exposure chuck 3 and the mask holder 2 in the same manner as the alignment stage 6. And a mask correction mechanism (not shown) composed of a θ axis table, etc.
May be provided on the mask holder 2. In this case, while the photomask A is suction-held by the mask holder 2, the mask correction mechanism is driven and controlled by the control unit 12, thereby correcting the displacement between the exposure chuck 3 and the mask holder 2. Thus, the photomask A can be set at a predetermined angle that is parallel to the step table traveling axis 4 and perpendicular to the step table traveling axis 4. However, mask holder 2
In the case where the mask correction mechanism is provided, the size of the apparatus is inevitably increased. Therefore, if the mask mechanism 8 is used to correct the displacement between the exposure chuck 3 and the mask holder 2, the apparatus can be downsized. This is advantageous in that

In the exposure apparatus shown in this example, as shown in FIG. 9, the pattern of the photomask A is transferred to the right half of the glass substrate B by the first exposure, and
In the second exposure, the pattern of the photomask A is changed to the glass substrate B.
Is transferred to the left half, but the number of steps and the exposure position in the step exposure are not limited to those described above.

[0046]

As described above, according to the present invention, before the mask is held by the mask holder, the exposure target substrate and the mask corresponding to the displacement of the exposure chuck with respect to the axis at each predetermined position by the correction means. Is corrected, the mask can be set at a predetermined angle with respect to the axis at each of the predetermined positions, whereby the pattern does not protrude from the predetermined exposure area of the exposure target substrate. Transfer can be performed within the exposure region, and therefore, the arrangement accuracy of the pattern on the substrate to be exposed can be improved, and an excellent effect that the exposure process can be performed with high accuracy is achieved.

In the state where the mask is held by the mask holder, the misalignment between the exposure target substrate and the mask in accordance with the displacement of the exposure chuck with respect to the axis at each predetermined position is corrected by the correction means. At each predetermined position, the mask can be set at a predetermined angle with respect to the axis by the mask holder, so that the pattern can be transferred into the exposure area of the substrate to be exposed without protruding from the exposure area. Accordingly, the arrangement accuracy of the pattern on the substrate to be exposed can be improved, and an excellent effect that the exposure processing can be performed with high accuracy is achieved.

Further, before the substrate to be exposed is loaded onto the exposure chuck, the table is used to correct the positional deviation corresponding to the displacement of the substrate to be exposed with respect to the axis.
The substrate to be exposed can be held on the exposure chuck without causing a displacement with respect to the axis, thereby improving the accuracy of imposition of the substrate to be exposed on the exposure chuck and performing the exposure process with high accuracy. It works.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram showing an example of an exposure apparatus according to the present embodiment.

FIG. 2 is a control block diagram of the exposure apparatus of the present embodiment.

FIG. 3 is an explanatory diagram of correction of a position shift of a photomask by a mask correction mechanism.

FIG. 4 is an explanatory diagram of position shift correction by an alignment table for positioning a glass substrate.

5A and 5B are explanatory diagrams of a case where a first exposure process is performed on a glass substrate, wherein FIG. 5A is a plan view showing an arrangement of a glass substrate and a photomask, and FIG. 5B is a side view of FIG.

6A and 6B are explanatory diagrams of a case where a second exposure process is performed on a glass substrate, wherein FIG. 6A is a plan view showing an arrangement of a glass substrate and a photomask, and FIG. 6B is a side view of FIG.

FIG. 7 is a flowchart showing a position shift correction process for positioning a glass substrate.

FIG. 8 is a flowchart showing a photomask position correction process.

FIG. 9 is an explanatory diagram of a step exposure process by the exposure apparatus of the present example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Alignment stage unit 2 Mask holder 3 Exposure chuck 3a-3f Positioning mark 4 Step table traveling axis 6 Alignment stage 6a X-axis table 6b Y-axis table 6c θ-axis table 7a-7c Edge detection sensor 8 Mask correction mechanism 8a- 8c Mask position correction mechanism 9a to 9f Mark detection sensor 10 Loading arm 12 Control unit 13 Operation unit A Photomask Aa to Af Positioning mark B Glass substrate

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2H097 GA45 KA03 KA13 KA16 KA28 LA12 5F046 BA02 CC01 CC02 CC04 CC05 CC08 CC09 CC10 CD01 CD04 EB01 EB02 ED01 FA10 FC04 FC05 FC08

Claims (7)

[Claims] 1. An exposure target substrate larger than a pattern forming mask held by a mask holder is held by an exposure chuck, and the exposure chuck is moved stepwise in a predetermined direction by a predetermined axis with respect to the mask. An exposure apparatus that sequentially positions the substrate to be exposed at a predetermined position in a plurality of times with respect to the mask and performs an exposure process at each of the positioned predetermined positions, wherein before the mask is held by the mask holder, Correcting means for correcting the position of the mask; and detecting alignment marks provided on the mask and the exposure chuck at the respective predetermined positions before the mask is held in the mask holder. Detecting means for outputting a detection signal corresponding to the position of the mark; and the exposure chuck at each of the predetermined positions based on the detection signal. Calculating means for calculating a correction amount for setting the mask at a predetermined angle with respect to the axis at each of the predetermined positions based on the position deviation of the mask with respect to the mask; Control means for controlling driving of the correction means so as to set the mask at a predetermined angle with respect to the axis at each of the predetermined positions. 2. The apparatus according to claim 1, wherein the correcting unit is configured to contact the mask at least at two points in the axial direction of the axis to perform position correction of the mask, 2. The exposure apparatus according to claim 1, further comprising: a third position correction mechanism configured to correct a position of the mask by contacting the mask at least at one position in a direction perpendicular to the axial direction. . 3. An exposure target substrate larger than a pattern forming mask held by a mask holder is held by an exposure chuck, and the exposure chuck is step-moved in a predetermined direction by a predetermined axis with respect to the mask. An exposure apparatus for sequentially positioning the substrate to be exposed at a predetermined position in a plurality of times with respect to the mask and performing an exposure process at each of the positioned predetermined positions, wherein the mask is held by the mask holder; A correcting means for correcting the position of the mask holder; and, in a state where the mask is held by the mask holder, aligning marks provided on the mask and the exposure chuck at the respective predetermined positions. Detecting means for detecting and outputting a detection signal in accordance with the position of the mark; and Calculating means for calculating a positional shift of the mask with respect to the exposure chuck, calculating a correction amount for setting the mask at a predetermined angle with respect to the axis at each of the predetermined positions based on the positional shift; Control means for controlling driving of the correction means so as to set the mask holder at a predetermined angle with respect to the axis at each of the predetermined positions. 4. A first position correction table for correcting the position of the mask holder in the axial direction of the axis, and a correcting means for correcting the position of the mask holder in a direction perpendicular to the axis. And a third position correction table for performing position correction of the mask holder in a direction around an intersection point where the axis direction of the axis and the perpendicular direction intersect with each other. Exposure apparatus according to the above. 5. An exposure target substrate larger than a pattern forming mask held by a mask holder is loaded and held on an exposure chuck, and the exposure chuck is step-moved with respect to the mask in a predetermined direction by a predetermined axis. In the exposure apparatus, the exposure target substrate is sequentially positioned at a predetermined position by dividing the exposure target substrate into a plurality of times with respect to the mask, and performs an exposure process at each of the positioned predetermined positions, wherein the exposure chuck is moved in a predetermined direction. A table for moving and aligning the exposure target substrate with respect to the mask, detecting means for detecting a position of the exposure target substrate carried on the exposure chuck, and outputting a detection signal; The position shift of the exposure target substrate with respect to the axis is obtained based on the position shift, and the exposure chuck is set at a predetermined angle with respect to the axis based on the position shift. Calculating means for calculating a correction amount for setting; and driving the table to position the exposure chuck at a predetermined angle with respect to the axis before the exposure chuck holds the substrate to be exposed based on the correction amount. An exposure apparatus, comprising: a control unit for controlling the exposure. 6. The first table, which moves in the axial direction of the axis, aligns the substrate to be exposed with the mask, and moves in a direction perpendicular to the axis, A second table for aligning the exposure target substrate with respect to the mask; and a second table for moving the exposure target substrate with respect to the mask by moving in a direction around an intersection where the axis direction of the axis intersects the perpendicular direction. The exposure apparatus according to claim 5, further comprising a third table. 7. An exposure target substrate larger than a pattern forming mask held by a mask holder is loaded and held by an exposure chuck, and the exposure chuck is step-moved with respect to the mask by a predetermined axis in a predetermined direction. In the exposure apparatus, the exposure target substrate is sequentially positioned at a predetermined position in a plurality of times with respect to the mask with respect to the mask, and performs exposure processing at each of the positioned predetermined positions. Using a table to move and align the exposure target substrate with respect to the mask,
Before holding the exposure target substrate on the exposure chuck,
A substrate positioning method for positioning the substrate to be exposed with respect to the axis, wherein the step of detecting the position of the substrate to be exposed loaded on the exposure chuck and outputting a detection signal; and Calculating a displacement of the exposure target substrate with respect to the axis, calculating a correction amount for setting the exposure chuck at a predetermined angle with respect to the axis based on the displacement, and performing the exposure based on the correction amount. Controlling the drive of the table to position the chuck at a predetermined angle with respect to the axis.