JP2009014805A - Exposure device and exposure method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce an exposure processing time by reducing the replacement time and alignment time required for a mask in an exposure device. <P>SOLUTION: The exposure device includes: an optical unit 1 for exposure; a mask changer 2 loaded with a mask stage to which a mask is fixed, and moving the mask stage to confront the optical unit 1; and a mask carrying means 17 for carrying in and out the mask to the mask changer. The mask carrying means has a plurality of mask carrying means 17, 17a adapted to carry out another mask while one mask is carried in, and the mask changer 2 has a mechanism in which a plurality of mask stages 7-9 to which masks 3-5 are respectively fixed at least in a line and moved in the direction of the line. The plurality of mask stages 7-9 respectively include an alignment means (an alignment scope 14) for aligning the mask stages 7-9 with the respective masks 3-6. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an exposure apparatus and an exposure method, and more particularly to an exposure apparatus and an exposure method that include an exposure mask transport unit.

  Here, as an example of the exposure apparatus, an exposure apparatus in a method for manufacturing a liquid crystal display panel will be described. In this case, the exposure apparatus is used in a manufacturing process of a TFT (thin film transistor) or the like of a liquid crystal display panel. Before describing the exposure method, the manufacturing process of the TFT will be described.

  In the TFT, first, a metal thin film (such as a low resistance film such as Al, Cr, or Mo) or a semiconductor layer film (amorphous Si or SiNx) that is a wiring material is formed on a glass substrate. Next, a photoresist (PR) is applied to form a pattern for this film formation. Next, this PR is exposed and developed through an exposure mask to form an etching PR mask. Next, after the film formation is etched through the PR mask, the PR mask is peeled off to form a thin film pattern. These steps are repeated for each film formation to manufacture a TFT.

  As an exposure operation in this case, the exposure mask is exchanged for each thin film pattern forming step, the lower layer pattern and the upper layer pattern are aligned so that the overlay accuracy is within 1.0 μm, and the exposure is performed. It is necessary to. This exposure work procedure is summarized in the following 1) to 5).

  1) The exposure mask is transported to the mask stage, and sucked and fixed there, and alignment (rough alignment) between the exposure mask and the exposure apparatus is performed.

  2) A substrate coated with PR on the substrate stage (hereinafter referred to as a PR substrate) is transported and sucked and fixed there.

  3) Align (finely align) the exposure mask and the PR substrate. The exposure mask and the PR substrate are provided with alignment marks, respectively.

  4) An exposure operation is performed after the alignment is completed.

5) The PR substrate is discharged after the exposure operation is completed.
Thereafter, 2) to 5) are repeated for each PR substrate until the next exposure mask is replaced.

  An exposure apparatus used for these exposure operations includes an optical unit for exposure, a substrate mounting means for mounting a PR substrate, a mask stage for mounting an exposure mask, and a PR substrate facing the optical unit through the exposure mask. And a mask changer that moves the mask stage so that exposure can be performed.

  Here, an example in which the PR substrate is continuously exposed with the exposure masks A and B will be described. FIGS. 5A and 5B are schematic block diagrams when the exposure apparatus performs exposure with an exposure mask and when the exposure mask is unloaded. The exposure apparatus includes an optical unit 1, a mask changer 2b, and a robot arm 17. The mask changer 2b has a mask stage 7a thereon, and the mask stage 7a mounts an exposure mask (hereinafter referred to as a mask) 3a thereon. The robot arm 17 is means for carrying in and out the mask on the mask stage 7a. In the present invention, the alignment (coarse alignment) between the mask and the exposure apparatus is the subject, and the alignment (fine alignment) between the mask and the PR substrate is not directly related, so here the PR substrate to the exposure apparatus is used. The description and illustration of the configuration of the mounting portion will be omitted.

  1) First, using the robot arm 17, the mask 3a is carried onto the mask stage 7a. Thereafter, alignment between the mask stage 7a and the mask 3a is performed. Then, as shown in FIG. 5A, the mask stage 2a is made to oppose the optical unit 1 by the mask changer 2b, and the PR substrate is exposed using the mask 3a on the mask stage 7a.

  2) After the exposure work with the mask 3a is completed, the mask stage 7a is shifted from the optical unit 1a by the mask changer 2b and the mask 3a is unloaded from the mask stage 7a using the robot arm 17, as shown in FIG. 5B. To do.

  3) Then, as shown in FIG. 6, the next mask 4a is carried into the mask stage 7a by using the robot arm 17. Thereafter, the mask changer 2b is moved so that the mask stage 7a faces the optical unit 1, and the alignment of the mask stage 7a and the mask 4a is performed. Then, using the mask 4a, the PR substrate is exposed.

  In this way, after the exposure work of the first mask is completed and the unloading of the first mask is completed, the next mask is loaded and the alignment of the mask is performed, which causes a problem that it takes a long time to replace the mask. To do. Therefore, there is a problem that the production efficiency is deteriorated when performing an exposure operation of the PR substrate that frequently requires mask replacement.

  In order to solve this problem, Japanese Patent Laid-Open No. 2006-031025 (hereinafter referred to as Patent Document 1) shows an exposure apparatus having a plurality of submask stages. FIG. 7 and FIG. 8 are block diagrams for explaining this exposure apparatus, and show steps for carrying in and out a mask and a PR substrate (hereinafter referred to as a substrate).

  As shown in FIGS. 7 and 8, the exposure apparatus includes first and second mask loading apparatuses 20 and 21, first and second mask transport apparatuses 22 and 23, and first and second submask stages 24. 25 and the main mask stage 26 are installed in a U-shape. A substrate fixing device 30, a substrate transfer device 33, and first and second substrate loading devices 31, 32 are disposed below the main mask stage 26 and spaced apart from the main mask stage 26 by a predetermined distance. . At least one or more masks are loaded on the first and second mask loading devices 20 and 21, and the first and second mask loading devices 20 and 21 are spaced apart by a predetermined distance.

  The first mask transport device 22 transports the first mask 3 b loaded on the first mask loading device 20 to the first submask stage 24 or the main mask stage 26. Further, the second mask transfer device 23 transfers the second mask 4 b loaded on the second mask loading device 21 to the second submask stage 25 or the main mask stage 26.

  The first and second mask transfer devices 22 and 23 are robot arms, and the mask can be moved or rotated vertically or horizontally by such robot arms. By installing a plurality of mask loading devices and mask transport devices in this way, the mask replacement time can be shortened. A mask 3b or 4b is arranged on the upper surface of the main mask stage 26, and a substrate is conveyed and arranged at a predetermined distance from the main mask stage 26 corresponding to the lower part of the main mask stage 26.

  On the left and right sides of the main mask stage 26, first and second sub mask stages 24 and 25 are installed, respectively. That is, the first and second submask stages 24 and 25 are installed between the main mask stage 26 and the first and second mask loading devices 20 and 21, respectively. As described above, since the mask is always arranged on any one of the first and second submask stages 24 and 25, the mask can always maintain the standby state. Therefore, when the mask needs to be replaced, the waiting mask can be immediately moved to the main mask stage 26, so that the mask can be replaced quickly.

  Further, shuttles 27 and 28 for transporting the mask are installed between the main mask stage 26 and the first and second submask stages 24 and 25. The substrate fixing device 30 is positioned below the main mask stage 26 and supports and fixes the substrate during the exposure process. The first and second substrate loading devices 31 and 32 also serve as a substrate aligner for loading substrates and aligning the substrates.

  The substrate transfer device 33 transfers the substrate from the first substrate loading device 31 to the substrate fixing device 30. At this time, the substrate is loaded on the second substrate loading device 32. Then, the substrate transport device 33 transports the substrate on which the exposure process has been performed from the substrate fixing device 30 to the first substrate loading device 31. Then, the substrate transport device 33 transports the substrate from the second substrate loading device 32 to the substrate fixing device 30, and performs an exposure process.

  In Patent Document 1, since there are two axes for mask replacement, the loading and unloading of the mask are separate operations, and the replacement efficiency is somewhat lowered. Further, the mask exchange work for the main mask stage 26 cannot be performed at the same time. Further, since the mask alignment is performed by the main mask stage 26, there is a problem that a waiting time until the mask moves is generated.

  Japanese Laid-Open Patent Publication No. 11-1766743 (hereinafter referred to as Patent Document 2) discloses an exposure apparatus using a mask exchange apparatus equipped with a plurality of mask (reticle) stages in order to shorten the alignment time of a substrate (wafer). It is shown.

  In this exposure apparatus, when a pattern on an exposure mask (reticle) is transferred onto a substrate by a projection optical system, a plurality of masks can be arbitrarily mounted on the mask stage. During exposure processing and exposure processing using any mask, It has a function that allows exposure processing with other masks.

JP 2006-031025 A (FIGS. 1 and 2, paragraph numbers “0013” to “0018”) Japanese Patent Laid-Open No. 11-1766743 (FIG. 1, paragraph numbers “0020” to “0029”)

  However, since Patent Document 1 of the prior art has a configuration in which there are two shafts for exchanging the mask, the loading and unloading of the mask are separate operations, and the exchange efficiency is somewhat lowered. Further, as shown in FIG. 7, the moving operation of the sub stage 24 and the main stage 26, the moving operation of the main stage 26 and the sub stage 25, and the mask exchange operation of the main mask stage 26 cannot be performed simultaneously. Further, since the mask alignment is performed by the main mask stage 26, there is a problem that a waiting time until the mask moves is generated.

  Further, in Patent Document 2, since a plurality of mask stages are provided, the mask replacement time can be shortened to some extent. However, since there is only one mask transport mechanism, it takes time to load and unload the mask. There's a problem. Moreover, since the mask alignment is performed at the stage where the optical unit, the mask stage, and the substrate stage are set, there is a problem that the alignment time cannot be shortened. In addition, since a plurality of (two) mask stages are each driven by a linear motor, the mask stage has two axes of movement, and there is a problem that mask overlay accuracy is lowered.

  SUMMARY OF THE INVENTION The main object of the present invention is to provide an exposure apparatus and an exposure method capable of reducing the exposure processing time by shortening the mask loading / unloading time and the mask alignment time.

  The configuration of the present invention includes an exposure optical unit, a mask changer that is mounted with a mask stage on which a mask is fixed, and that can be moved so that the mask stage faces the optical unit, and the mask is carried into and out of the mask stage. In the exposure apparatus including the mask transporting unit, the mask transporting unit has a plurality of mask transporting units so that another mask is unloaded while the one mask is being loaded, and the mask changer Each of the plurality of mask stages has a mechanism that can be arranged in at least one row and moved in the row direction, and each of the plurality of mask stages has alignment means for aligning the mask stage and each mask. It is characterized by that.

  In the present invention, the alignment means is provided with at least two apparatus reference marks on each mask stage so as to align with the reference mark of the mask, and also aims at the apparatus reference mark and the reference mark of the mask. An alignment scope for aligning the mask can be provided in each mask stage, and the mask changer includes a plurality of mask stages to which the mask is fixed respectively arranged in a plurality of rows in the row direction. Each of the mask conveying means can be a robot arm, and can be provided attached to each of the mask stages.

  According to another aspect of the present invention, there is provided an exposure optical unit, a mask changer mounted with a mask stage to which a mask is fixed, and a mask changer capable of moving so that the mask stage faces the optical unit, and carrying the mask into the mask stage. In an exposure method of an exposure apparatus comprising a mask transfer means for carrying out, the mask changer in which a plurality of mask stages to which the masks are respectively fixed are arranged in at least one row is moved in the row direction, and the plurality of each The mask is exchanged, and the alignment means provided on each of the plurality of mask stages performs alignment between the plurality of mask stages and each of the masks, and each mask is carried into and out of the mask stage. During the loading of one mask by the mask transport means, the other masks are unloaded And performing at the same time.

  In the present invention, the apparatus reference mark provided on each mask stage is used for alignment between the mask stage and the mask reference mark, and the apparatus reference mark is provided by an alignment scope provided for each of the plurality of mask stages. The mask can be aligned with the reference mark of the mask and the mask changer can be aligned, and a plurality of mask stages to which the mask is fixed are arranged in a plurality of rows, and the mask changer is moved in the row direction. In addition, each mask can be carried in and out at the same time by a mask conveying means provided attached to each mask stage, and the mask stage is not during an exposure operation. Alignment between each mask and each equipment reference mark is completed in advance So you can keep.

  As described above, according to the present invention, the mask transfer unit can simultaneously load and unload a plurality of masks on the mask stage so that another mask is unloaded while the mask is being loaded. In addition, since the alignment of the mask reference mark and the apparatus reference mark of the mask stage can be performed in advance, the work time can be reduced accordingly.

  Next, embodiments of the present invention will be described with reference to the drawings. FIGS. 1A and 1B are schematic block diagrams for explaining the working process of the exposure apparatus according to the embodiment of the present invention. As shown in FIG. 1, the exposure apparatus according to this embodiment includes an exposure optical unit 1, a mask changer 2, and a plurality of robot arms 17, 17a, 17b. The exposure optical unit 1 and the robot arms 17, 17 a, and 17 b are fixed to the exposure apparatus, and the mask changer 2 is a portion that can move in one direction (array direction) with respect to the optical unit 1.

  The mask changer 2 has mask stages 7, 8, and 9 on which the masks 3, 4, and 5 can be mounted, respectively. The mask stages 7 to 9 can fix the masks 3 to 5, respectively. That is, the mask changer 2 is configured such that a plurality of mask stages 7 to 9 on which the masks 3 to 5 are respectively installed can be simultaneously moved in a fixed direction by a moving mechanism (not shown). This moving mechanism may be a conventional driving mechanism that can be driven by a normal motor or linear motor. The optical unit 1 incorporates a light source such as a mercury lamp and various lenses for ensuring resolution and uniformity.

  Here, the robot arms 17, 17 a, and 17 b are mechanisms that simultaneously carry in and out the masks 3 to 5 on the mask stages 7 to 9, respectively. In particular, as shown in FIG. 1, for example, a plurality of robot arms 17, 17a, 17b are provided so that another mask 4 can be carried out from the mask stage 8 while one mask 3 is carried into the mask stage 7. .

  Further, the exposure apparatus of this embodiment has alignment means that can align the mask stages 7 to 9 and the masks 3 to 5 on the mask changer 2 in the mask stages 7 to 9, respectively. These alignment means are provided with two alignment scopes 14 for each of the mask stages 7 to 9 and also provided with an apparatus reference mark for each of the mask stages 7 to 9 so that each mask stage 7 to 9 can be aligned with each mask. I have to.

  The alignment operation is performed in two steps: 1) alignment of the apparatus reference mark on the mask stage and the mask (rough alignment) and 2) alignment of the substrate and mask (fine alignment). The alignment (rough alignment) with the exposure apparatus is the subject, and the alignment of the mask and the substrate (fine alignment) is not directly related to the configuration of the present invention. The description of is omitted. Here, a case where three mask stages 7 to 9 and four masks A to D (3 to 6) are used will be described.

  First, the optical unit 1 transfers the pattern on the mask onto the substrate by scanning the masks 3 to 6 and the substrate in synchronization. The replacement of the masks 3 to 6 is performed using the robot arms 17, 17 a and 17 b of the mask transfer means provided on the mask stages 7 to 9. The masks 3 to 6 are sucked and fixed to the mask stages 7 to 9. The A substrate to be exposed is not shown in the figure, but is placed below the mask changer 2. Each mask stage 7-9 is equipped with a laser interferometer or the like for high-precision position control.

  Next, the mask stages 7 to 9 and the masks 3 to 6 are provided with an alignment scope 14, a reference mark 12, and a mask as alignment means for aligning the mask as shown in the layout diagram of FIG. Mark 11 is provided. Here, the case where the mask 5 is set on the mask stage 9 has been described, but the same applies to the other mask stages 7 and 8 and the masks 3 and 4. That is, as shown in FIG. 2A, the mask stage 9 is provided with two alignment scopes 14, and two double-shaped reference marks 12 that serve as the position reference of the apparatus are provided on both sides of the mask 5. Yes. The reference mark 12 is a position measurement mark using an LED light source or the like. The mask 5 is also provided with two cross-shaped mask marks 11 on both sides.

  When the mask 5 is properly arranged on the mask stage 9, as shown in FIG. 2B, the composite mark 13 in which the mask mark 11 of the mask 5 is superimposed on the reference mark 12 of the mask stage 9; Become. When the composite mark 13 is viewed by the alignment scope 14, the double and + overlap and look like a king character. Therefore, if the mask 5 and the mask stage 9 are aligned so that the composite mark 13 looks like a king character, It will be good.

  Next, an alignment method for setting the mask 5 on the mask stage 9 will be described with reference to FIGS. The alignment procedure is performed in two stages: alignment of the mask 5 and the mask stage 9 (rough alignment) and alignment of the substrate and the mask 5 (fine alignment). The alignment between the substrate and the mask may be performed in two stages: rough alignment and fine alignment.

  Next, alignment between the mask mark 11 of the mask 5 and the apparatus reference mark 12 of the mask stage 9 will be described by taking the case of FIG. 2 as an example. Alignment is performed using the reference mark 12 of the mask stage 9 and the mask mark 11 arranged on the mask 5. The positions at which the mask marks 11 are arranged are necessary at the center portion of the mask 5 and at two positions on the left and right. The alignment scope 14 observes and aligns the mask mark 11 and the reference mark 12 of the mask stage 9.

  Here, since the final goal is to align the optical unit 1 and the mask 5, movement control of the mask stage 9 is important. In the present embodiment, the positional relationship between the optical unit 1 and the mask changer 2 is clear as an exposure apparatus, and even if the mask changer 2 moves, the alignment can be performed in advance. In particular, when the mask changer 2 moves in only one direction, the alignment is easy. Moreover, the positional relationship between the mask stages 9 on the mask changer 2 is also fixed, and the positional relationship is clear. Therefore, if the alignment between each mask stage 9 and the mask 5 is performed according to this embodiment, the alignment (rough alignment) between the optical unit 1 and the mask 5 can be performed.

  The alignment between the mask stage 9 and the mask 5 is performed by controlling the position of the alignment scope 14 with a laser interferometer mounted on the mask stage 9, and the positions of the optical unit 1 and the mask 5 are controlled. . The position of the alignment scope 14 can be controlled using a position measurement reference mark (FD mark).

  According to the configuration of the present embodiment, a plurality of masks can be simultaneously carried in and out from the mask stage so that another mask can be carried out while carrying one mask by the robot arm of the mask carrying means.・ The unloading time is shortened, and the alignment means provided on each of the plurality of mask stages enables the alignment between each mask and the apparatus (mask stage) in advance. As a result, the exposure work time can be shortened.

  Next, the operation of the embodiment of the present invention will be described in detail with reference to the drawings. Here, a description will be given of an example of an exchange operation of four masks A, B, C, and D (3 to 6). The masks 3 to 5 are fixed to the mask stages 7 to 9 by vacuum suction. Each mask stage 7 to 9 is on the same mask changer 2. Each mask stage 7-9 has a reference mark 12 for alignment with the masks 3-5. Alignment is performed at two locations on the left and right simultaneously. The mask stages 7 to 9 are equipped with a laser interferometer and the like for high-precision position control along with the alignment scope 14. The positions of the reference mark 12 and the alignment scope 14 are controlled using a position measurement reference mark (FD mark) using an LED light source or the like.

  The order of exposure is masks B, A, C, and D. First, as shown in FIG. 1A, the optical unit 1 is in a position not facing the mask stages 7 to 9, and the exposure operation of the B mask 4 is completed. At this stage, the robot arms 17, 17 a, 17 b carry the masks 3, 5 of A and C into the mask changer 2 (downward arrows) and place them on the mask stages 7, 9 and on the mask stage 8. The B mask 4 is unloaded (upward arrow), and these are performed simultaneously. Here, a plurality of masks are simultaneously loaded and unloaded onto the mask stage of the mask changer 2 by a plurality of robot arms so that the other masks 4 are unloaded while the two masks 3 and 5 are being loaded.

  Next, in order to perform an exposure operation using the A mask 3, the mask changer 2 is translated to the position shown in FIG. 1B so that the optical unit 1 is on the mask stage 7. Is set on the A mask 3. Then, an exposure operation is performed using the A mask 3 by the operation of the optical system unit 1 (exposure scanning is an up and down arrow).

  At this time, since the mask changer 2 is in the same apparatus housing, the C mask 5 also scans in the same manner as the A mask 3, but the C mask 5 is not in the exposure area of the optical unit 1, Only the pattern of the A mask 3 in the exposure area is transferred to the substrate.

  Here, during the exposure operation using the A mask 3, the alignment of the C mask 5 with the apparatus reference mark 12 can be completed. When aligning the substrate and the mask, the required alignment accuracy is about 1.0 μm or less, but depending on the TFT element structure to be manufactured, there are cases where it is required to be within 0.6 μm.

  The next step is the schematic block of FIGS. When the stage of FIG. 1B is completed, that is, after the exposure work with the A mask 3 is completed, the mask changer 2 is moved to the original position of FIG. 1A as shown in FIG. Will return. Here, while the A mask 3 is carried out by the robot arms 17 and 17a, the next D mask 6 is carried in, and these are simultaneously performed. Next, the mask changer 2 moves to the position shown in FIG. 3B, and the optical unit 1 is placed on the C mask 5 so that the exposure operation with the C mask 5 is performed. At this time, the alignment of the D mask 6 with the apparatus reference mark 12 is completed.

  According to the configuration of the present embodiment, the mask carrying means can carry in and carry out a plurality of masks simultaneously on the mask stage so as to carry out another mask while carrying in one mask. In addition, since the alignment between each mask and the apparatus (mask stage) can be performed in advance by the alignment means provided on each of the plurality of mask stages, the exposure work and the alignment work can be performed in parallel. The work time can be shortened accordingly.

  FIG. 4 is a schematic block diagram of the second embodiment of the present invention. In the present embodiment, the configuration of the mask changer is changed to a mask changer 2 a having four mask stages 7 to 9 and 16. Here, a case where two robot arms 17 and 17a are used is shown. In this case, one mask stage 16 is added to the first embodiment, and the mask 15 is mounted on the mask stage 16. That is, the masks 3, 4, 5, and 15 are mounted on the four mask stages 7, 8, 9, and 16, respectively. The arrangement of the mask stages in this case is not a horizontal row in the first embodiment, but four mask stages are arranged in two rows and two columns.

  In this case, each mask stage 7, 8, 9, 15 has two alignment scopes 14 each equipped with a laser interferometer or the like capable of highly accurate position control. The mask changer 2a is biaxially moved with respect to the optical unit 1, but the alignment can be performed in advance. In addition, since the laser interferometer and the like can be moved in two axes, high-precision two-axis position control by the laser interferometer and the like is possible.

  In the case of the present embodiment, since the two robot arms 17 and 17a are used, a plurality of masks can be simultaneously carried in and out of the mask stage so that other masks can be carried out while carrying one mask. Two masks can be carried in and out, and the loading and unloading time can be shortened. In addition, since four types (pieces) of masks can be prepared and aligned in advance, the exposure work is flexible, and the work time can be further shortened.

  In these embodiments, the case where three or two robot arms are fixed to the exposure apparatus as the mask transfer means has been described. However, each mask stage can have a robot arm. In this case, it is only necessary to assign a robot arm to each mask stage in advance, so that operability can be improved. As for the number of robot arms, if there are at least two robot arms, it is possible to carry in / out the mask at the same time, so that the time for carrying in / out can be shortened.

  As an application example of the present invention, the present invention can be applied to an exposure apparatus and an exposure method used in a color liquid crystal manufacturing process. The present invention can also be applied to an exposure apparatus and exposure method for large semiconductor wafers.

(A) (b) is a schematic block diagram explaining the operation | work process of the exposure apparatus of one Embodiment of this invention. (A) (b) is a schematic block diagram explaining the alignment process of the exposure apparatus of FIG. It is a schematic block diagram explaining the next work process of the exposure apparatus of FIG. It is a schematic block diagram explaining the operation | work process of the exposure apparatus of the other Example of this invention. (A) (b) is a schematic block diagram explaining the operation | work process of the exposure apparatus of a prior art example. FIG. 6 is a schematic block diagram illustrating a next work process of FIG. 5. It is a schematic block diagram explaining the operation | work process of the exposure apparatus of another conventional example. FIG. 8 is a schematic block diagram illustrating the next work process of FIG. 7.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Optical unit 2, 2a, 2b Mask changer 3, 3a, 3b, 4, 4b, 5, 5b, 6, 15 Mask 7, 7a, 8, 9, 16 Mask stage 11 Mask mark 12 Reference mark 13 Composite mark 14 Alignment Scope 17, 17a, 17b Robot arm 20, 21 Mask loading device 22, 23 Mask transport device 24, 25 Sub mask stage 26 Main mask stage 27, 28 Shuttle 30 Substrate fixing device 31, 32 Substrate loading device 33 Substrate transport device

Claims (9)

An exposure optical unit; a mask changer mounted with a mask stage to which a mask is fixed; and a mask changer capable of moving the mask stage so as to face the optical unit; and a mask transport means for carrying the mask into and out of the mask stage. In the exposure apparatus provided,
The mask conveying means has a plurality of mask conveying means so as to carry out another mask while carrying in one mask,
The mask changer has a mechanism capable of moving in the row direction by arranging a plurality of mask stages to which the masks are respectively fixed in at least one row,
The exposure apparatus characterized in that the plurality of mask stages have alignment means for performing alignment between the mask stages and the masks. The alignment means is provided with at least two apparatus reference marks on each mask stage so as to align with the reference mark of the mask, and aims at the apparatus reference mark and the reference mark of the mask to aim the mask. The exposure apparatus according to claim 1, wherein each mask stage is provided with an alignment scope for performing alignment. The exposure apparatus according to claim 1, wherein the mask changer has a mechanism in which a plurality of mask stages to which the masks are respectively fixed are arranged in a plurality of rows and can be moved in the row directions. 4. The exposure apparatus according to claim 1, wherein the mask carrying means is composed of a robot arm and is provided attached to each of the mask stages. An exposure optical unit, a mask changer mounted with a mask stage to which a mask is fixed, and a mask changer capable of moving so that the mask stage faces the optical unit, and a plurality of mask carrying means for carrying the mask into and out of the mask stage In an exposure method of an exposure apparatus comprising:
The mask changer in which a plurality of mask stages to which the mask is fixed is arranged in at least one row is moved in the row direction, and each mask is exchanged.
Each alignment between the mask stage and the mask is performed by the alignment means provided on each mask stage,
The exposure method according to claim 1, wherein carrying in / out of each mask to / from the mask stage is performed simultaneously so that another mask is carried out while carrying in one mask by the plurality of mask carrying means. Alignment of each mask stage and the reference mark of the mask is performed by the apparatus reference mark provided on each mask stage, and the apparatus reference mark and the mask are aligned by an alignment scope provided on each of the plurality of mask stages. The exposure method according to claim 5, wherein the mask is aligned while aiming at a reference mark. 7. The exposure method according to claim 5, wherein a plurality of mask stages to which the masks are respectively fixed are arranged in a plurality of rows, and the mask changer is moved in each row direction. 8. The exposure method according to claim 5, 6 or 7, wherein each mask is carried in and out simultaneously by a mask carrying means provided attached to each mask stage. 8. The exposure method according to claim 5, wherein each mask stage is not in an exposure operation, and alignment between each mask and each apparatus reference mark is completed in advance.

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