JP2010113296A - Proximity exposure apparatus, method of conveying mask in the proximity exposure apparatus, and method of manufacturing display panel substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To position a mask smaller than a substrate with high accuracy and mount the mask on a mask holder. <P>SOLUTION: A chuck 10 includes a plurality of push-up pin units each having a push-up pin 12 rising from the inside of the chuck 10 and a motor 11 vertically moving the push-up pin 12. A mask 2 is conveyed by a mask conveying device to the chuck 10 and received by the push-up pins 12 from the mask conveying device. A first image acquisition device 52 is moved by a moving means 53, and an image of a mark for detecting a position of the mask 2 is acquired by the first image acquisition device 52. The image signal of the first image acquisition device 52 is processed to detect the position of the mask 2; the chuck 10 is moved by an X stage 5, a Y stage 7 and a θ stage 8 on the basis of the detected position of the mask 2 so as to position the mask 2; and the mask 2 is mounted on the mask holder 20 by the push-up pins 12. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a proximity exposure apparatus that exposes a substrate using a proximity method in the manufacture of a display panel substrate such as a liquid crystal display device, a mask transport method for the proximity exposure apparatus, and a display panel using the same. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate manufacturing method, and in particular, a proximity exposure apparatus suitable for positioning a large mask and mounting it on a mask holder, a mask transport method for the proximity exposure apparatus, and a display panel substrate manufacturing using the same. Regarding the method.

  Manufacturing of TFT (Thin Film Transistor) substrates, color filter substrates, plasma display panel substrates, organic EL (Electroluminescence) display panel substrates, and the like of liquid crystal display devices used as display panels is performed using photolithography using an exposure apparatus. This is performed by forming a pattern on the substrate by a technique. As an exposure apparatus, a projection method in which a mask pattern is projected onto a substrate using a lens or a mirror, and a minute gap (proximity gap) is provided between the mask and the substrate to transfer the mask pattern to the substrate. There is a proximity method. The proximity method is inferior in pattern resolution performance to the projection method, but the configuration of the irradiation optical system is simple, the processing capability is high, and it is suitable for mass production.

  The proximity exposure apparatus includes a chuck on which a substrate is mounted and a mask holder that holds a mask, and performs exposure by bringing a mask held on the mask holder and a substrate mounted on the chuck very close to each other. Usually, the chuck is mounted on a stage that moves and positions the substrate, and fixes the substrate by vacuum suction. The mask holder is provided above the chuck on which the substrate is mounted, and fixes the periphery of the mask by vacuum suction. In order to avoid contact between the mask and the substrate, loading of the substrate away from the exposure position under the mask is usually performed by the handling arm of the substrate transfer robot. / Performed at the unload position. After the substrate is mounted on the chuck at the load / unload position, the stage moves to the exposure position under the mask, and the substrate is positioned at the exposure position.

Conventionally, the mask is carried into the mask holder and the mask is carried out from the mask holder by a handling arm of a mask carrying robot. However, since the handling arm of the mask transfer robot is cantilevered, if the mask becomes large and its weight increases, the handling arm will bend and it will not be possible to support the mask horizontally, and the handling arm will shake. Has become larger, and it has become difficult to secure a stroke for moving the mask holder downward. On the other hand, in Patent Document 1, a mask temporary support member is provided on the outer peripheral edge of the chuck, the mask is placed on the temporary support member, and the conveyance error of the mask is corrected by the stage so A technique for pressing a mask against the lower end surface of a mask holder by a connected Z-axis direction drive mechanism is disclosed.
JP 2003-186199 A

  In recent years, in the manufacture of various substrates for display panels, a relatively large substrate is prepared in order to cope with an increase in size and a variety of sizes, and one or a plurality of substrates can be selected from one substrate depending on the size of the display panel. Manufactures display panel substrates. In this case, in the proximity method, if one surface of the substrate is to be exposed at once, a mask having the same size as the substrate is required, and the cost of the expensive mask is further increased. In view of this, the mainstream method is to divide and expose one surface of a substrate into a plurality of shots while using a mask that is relatively smaller than the substrate and moving the substrate stepwise in the XY direction by a stage. In this method, since the mask is smaller than the substrate mounted on the chuck, the technique described in Patent Document 1 cannot be applied.

  Further, when the mask and the substrate are brought close to each other or when the mask and the substrate are separated from each other, the mask held by the mask holder is bent by being pushed or pulled by the air between the mask and the substrate. Then, when the bent mask returns to its original position, there is a risk of mask misalignment. Conventionally, when transferring a mask using a handling arm of a mask transfer robot, a plurality of positioning pins are provided on the mask holder, and after the mask is mounted on the mask holder, the side of the mask is pushed with the positioning pins, The position of the mask was adjusted. The positioning pins have also played a role in preventing displacement of the mask when the mask and the substrate are brought close to each other or when the mask and the substrate are separated. However, when positioning the mask before mounting the mask, if it is attempted to prevent the mask from being displaced with the conventional positioning pins, the position of the positioned mask is not changed when the positioning pins are applied to the side of the mask. There was a problem of shifting.

  An object of the present invention is to accurately position a mask smaller than the substrate and attach it to the mask holder. Another object of the present invention is to prevent misalignment of the mask when the mask and the substrate are brought close to each other or when the mask and the substrate are separated without shifting the position of the positioned mask. Furthermore, an object of the present invention is to manufacture a high-quality display panel substrate.

  A proximity exposure apparatus according to the present invention includes a chuck on which a substrate is mounted, a mask holder that holds the mask, and a stage that moves the chuck, and a fine gap is provided between the mask and the substrate to form a mask pattern. In the proximity exposure apparatus that transfers the substrate to the substrate, the first control means for controlling the movement of the stage, the mask transport apparatus for carrying the mask into the chuck, and the push-up pins and push-up pins that move up from the inside of the chuck are moved up and down. A plurality of push-up pin units attached to the chuck, a first image acquisition device that acquires an image of a position detection mark provided on the mask and outputs an image signal; The moving means for moving the image acquisition device and the image signal output from the first image acquisition device are processed to detect the position of the mask. A plurality of push-up pin units that receive the mask from the mask transport device by the push-up pins, and the first control unit detects and detects the image signal of the first image acquisition device by the first control means. Based on the position of the mask, the chuck is moved by the stage to position the mask, and a plurality of push-up pin units attach the mask to the mask holder using the push-up pins.

  The mask exposure method of the proximity exposure apparatus according to the present invention comprises a chuck for mounting a substrate, a mask holder for holding the mask, and a stage for moving the chuck, and a minute gap is formed between the mask and the substrate. A mask exposure method for a proximity exposure apparatus for transferring a mask pattern to a substrate, wherein the chuck includes a push-up pin rising from the inside of the chuck and a plurality of push-up pin units having a motor for moving the push-up pin up and down. A first image acquisition device for obtaining an image of a position detection mark provided on the mask and outputting an image signal; and a moving means for moving the first image acquisition device, and transporting the mask to the mask It is carried into the chuck by the apparatus, the mask is received from the mask conveying apparatus by the push-up pin, and the first image is received by the moving means The acquisition device is moved, the image of the mask position detection mark is acquired by the first image acquisition device, the image signal of the first image acquisition device is processed to detect the position of the mask, and the detected mask Based on this position, the chuck is moved by the stage, the mask is positioned, and the mask is mounted on the mask holder by the push-up pin.

  Plural push-up pins rising from the inside of the chuck and a plurality of push-up pin units having a motor for moving the push-up pins up and down are provided in the chuck, and the mask is received by the push-up pins from the mask transfer device, so the mask is smaller than the substrate mounted on the chuck However, the mask can be carried into the chuck. Then, the chuck is moved by the stage to position the mask, and the mask is mounted on the mask holder by the push-up pin. Therefore, the mask carried into the chuck is accurately positioned by the stage and mounted on the mask holder.

  In order to accurately position the mask, it is necessary to accurately detect the position of the mask. The detection of the mask position is performed by acquiring an image of the mask position detection mark. However, the detection accuracy increases as an image acquisition device with higher resolution is used. However, the high-resolution image acquisition apparatus has a narrow field of view, and the mask position detection mark may not enter the field of view when the mask position is shifted. Therefore, a first image acquisition device that acquires an image of the position detection mark provided on the mask and a moving unit that moves the first image acquisition device are provided, and the first image acquisition device is moved by the moving unit. Then, an image of the mask position detection mark is acquired by the first image acquisition device. Then, the image signal of the first image acquisition device is processed to detect the position of the mask, and based on the detected position of the mask, the chuck is moved by the stage to position the mask. Even if the position of the mask is shifted, the position of the mask is detected with high accuracy using a high-resolution image acquisition device, and the positioning of the mask is performed with high accuracy.

  The proximity exposure apparatus according to the present invention further includes a second image acquisition device that is fixed above the mask holder, acquires an image of a mask position detection mark, and outputs an image signal. The image signal output from the second image acquisition device is processed to detect the position of the mask, and the first control means detects the image signal of the second image acquisition device processed by the image processing device. Based on the position of the mask, the chuck is moved by the stage to correct the position of the positioned mask.

  The mask exposure method of the proximity exposure apparatus according to the present invention includes a second image acquisition device that is fixed above the mask holder, acquires an image of a mask position detection mark, and outputs an image signal. An image of a mask position detection mark is acquired by the second image acquisition device, an image signal of the second image acquisition device is processed to detect the mask position, and the stage is detected based on the detected mask position. The position of the positioned mask is corrected by moving the chuck.

  When the first image acquisition device is moved, the detection result of the mask position includes a movement error of the first image acquisition device. Therefore, a second image acquisition device is provided that is fixed above the mask holder, acquires an image of a mask position detection mark, and outputs an image signal. The second image acquisition device uses the second image acquisition device to provide a mask position detection mark. Get the image. Then, the image signal of the second image acquisition device is processed to detect the position of the mask, and based on the detected position of the mask, the chuck is moved by the stage to correct the position of the positioned mask. Using the second image acquisition device fixed above the mask holder, the position of the mask is detected with higher accuracy, and the position of the positioned mask is corrected with higher accuracy.

  Furthermore, the proximity exposure apparatus according to the present invention has a wide field of view with a resolution lower than that of the first image acquisition device above the mask receiving position for receiving the mask from the mask transport device by the push-up pin, and detects the position of the mask. A third image acquisition device that acquires an image of the mark for use and outputs an image signal, and the image processing device processes the image signal output by the third image acquisition device to detect the position of the mask. The first control means moves the chuck by the stage based on the position of the mask detected by the image processing apparatus processing the image signal of the third image acquisition apparatus, and the mask is moved from the mask receiving position to the mask holder. It moves to the lower mask mounting position.

  Further, according to the mask exposure method of the proximity exposure apparatus according to the present invention, the mask is received from the mask transfer device by the push-up pin at the mask receiving position provided separately from the mask mounting position under the mask holder, and is received from the first image acquisition device. A third image acquisition device having a low resolution and a wide field of view, acquiring an image of a mask position detection mark, and outputting an image signal above the mask receiving position. Is used to acquire an image of a mask position detection mark, process the image signal of the third image acquisition device to detect the mask position, move the chuck on the stage based on the detected mask position, and Is moved from the mask receiving position to the mask mounting position.

  When the mask is received from the mask transfer device by the push-up pin at the mask receiving position provided separately from the mask mounting position under the mask holder, and the mask is moved from the mask receiving position to the mask mounting position, the mask position is set at the mask receiving position. Based on the detected position of the mask, the chuck is moved by the stage, and the mask is moved from the mask receiving position to the mask mounting position. Therefore, the position of the mask received from the mask conveying device by the push-up pin at the mask receiving position is Even if it is displaced, the mask is accurately moved to the mask mounting position.

  The detection of the mask position at the mask receiving position is performed by acquiring an image of the mask position detection mark. If the position of the mask received from the mask transport device by the push-up pin is greatly displaced, the first image is detected. If an image acquisition device having a high resolution is used as in the acquisition device, it may take a long time to put the mask position detection mark in the field of view. Therefore, a third image acquisition device having a lower resolution and a wider field of view than the first image acquisition device is provided above the mask receiving position, and an image of the mask position detection mark is acquired by the third image acquisition device. To do. Even if the position of the mask received by the push-up pin from the mask transport device is greatly displaced, an image of the mask position detection mark is acquired in a short time, and the position of the mask is detected in a short time at the mask receiving position.

  Furthermore, the proximity exposure apparatus according to the present invention includes a plurality of spacers that are installed on the surface of the chuck and come into contact with the peripheral portion of the pattern surface of the mask when the push-up pin on which the mask is placed descends. In the mask exposure method of the proximity exposure apparatus according to the present invention, a plurality of spacers that contact the peripheral portion of the pattern surface of the mask when the push-up pin on which the mask is placed descends are installed on the surface of the chuck. If the push-up pin descends for some reason after the push-up pin receives the substrate from the mask conveyance device, the pattern surface of the mask may come into contact with the surface of the chuck, and the pattern may be damaged. Therefore, a plurality of spacers that contact the peripheral portion of the mask pattern surface when the push-up pin on which the mask is placed descends are installed on the chuck surface to prevent the mask pattern surface from contacting the chuck surface. .

  Furthermore, the proximity exposure apparatus according to the present invention moves the positional displacement prevention pin that contacts the side surface of the mask held by the mask holder to prevent the positional displacement of the mask and the positional displacement prevention pin to contact the lateral surface of the mask. A motor and a sensor for detecting that the misregistration prevention pin is in contact with the side surface of the mask, and a plurality of misregistration prevention pin units attached to the mask holder and a motor for controlling the motor of each misregistration prevention pin unit. 2, and the second control unit controls the motor of each misregistration prevention pin unit to move the misregistration prevention pin toward the side surface of the mask, and based on the detection result of the sensor, The movement of the slip prevention pin is stopped.

  Further, the mask transport method of the proximity exposure apparatus according to the present invention moves the mask of the mask by moving the misalignment prevention pin and the misalignment prevention pin that contact the side surface of the mask held by the mask holder to prevent the misalignment of the mask. The mask holder is provided with a plurality of misregistration prevention pin units each having a motor that contacts the side surface and a sensor that detects that the misregistration prevention pin has contacted the side surface of the mask, and controls the motor of each misregistration prevention pin unit. The displacement prevention pin is moved toward the side surface of the mask, and the movement of the displacement prevention pin is stopped based on the detection result of the sensor.

  Control the motor of each misregistration prevention pin unit to move the misregistration prevention pin toward the side of the mask and detect the position based on the detection result of the sensor that detects that the misregistration prevention pin contacts the side of the mask. Since the movement of the displacement prevention pin stops, the displacement prevention pin contacts the side surface of the mask without shifting the position of the positioned mask, and when the mask and the substrate are brought close, or when the mask and the substrate are separated. Misalignment of the mask is prevented.

  The method for producing a display panel substrate according to the present invention exposes a substrate using any one of the above-described proximity exposure apparatuses, or masks using any one of the above-described proximity exposure apparatus mask transport methods. It is mounted on a mask holder and the substrate is exposed. Since the mask is positioned with high accuracy, the pattern is transferred with high accuracy, and a high-quality display panel substrate is manufactured.

  According to the proximity exposure apparatus and the mask conveyance method of the proximity exposure apparatus of the present invention, the mask is carried into the chuck by the mask conveyance apparatus, the mask is received from the mask conveyance apparatus by the push-up pin, and the first image is obtained by the moving means. The apparatus is moved, the image of the mark for detecting the position of the mask is acquired by the first image acquisition device, the image signal of the first image acquisition device is processed, the position of the mask is detected, and the detected mask Based on the position, the chuck is moved by the stage, the mask is positioned, and the mask is mounted on the mask holder by the push-up pin, so that the mask smaller than the substrate can be accurately positioned and mounted on the mask holder. it can.

  Further, according to the proximity exposure apparatus and the mask conveyance method of the proximity exposure apparatus of the present invention, the image of the mask position detection mark is acquired by the second image acquisition device fixed above the mask holder, The image signal of the image acquisition device 2 is processed to detect the position of the mask, and based on the detected position of the mask, the chuck is moved by the stage to correct the position of the positioned mask. Using the second image acquisition device fixed upward, the position of the mask can be detected with higher accuracy, and the position of the positioned mask can be corrected with high accuracy.

  Furthermore, according to the proximity exposure apparatus of the present invention and the mask conveyance method of the proximity exposure apparatus, the mask is received from the mask conveyance apparatus by the push-up pin at the mask reception position provided separately from the mask mounting position under the mask holder, The image of the mask for detecting the position of the mask is acquired by a third image acquisition device having a lower resolution and a wider field of view than the first image acquisition device, and the image signal of the third image acquisition device is processed to process the mask. The position of the mask is detected, the chuck is moved by the stage based on the detected mask position, and the mask is moved from the mask receiving position to the mask mounting position. Even if it is displaced, the mask position is detected in a short time at the mask receiving position, and the mask is placed in the mask mounting position. It can be accurately moved.

  Furthermore, according to the proximity exposure apparatus and the mask conveyance method of the proximity exposure apparatus of the present invention, the plurality of spacers that contact the peripheral portion of the pattern surface of the mask when the push-up pin is lowered are installed on the surface of the chuck. Thus, even if the push-up pin is lowered for some reason, it is possible to prevent the pattern surface of the mask from coming into contact with the surface of the chuck and damaging the pattern.

  Furthermore, according to the proximity exposure apparatus and the mask transport method of the proximity exposure apparatus of the present invention, the misalignment prevention pin that prevents the misalignment of the mask by contacting the side surface of the mask held by the mask holder, the misalignment prevention A plurality of misregistration prevention pin units having a motor for moving the pin to contact the side surface of the mask and a sensor for detecting that the misregistration prevention pin contacts the side surface of the mask are provided on the mask holder. Control the unit motor to move the misalignment prevention pin toward the side of the mask and stop moving the misalignment prevention pin based on the detection result of the sensor without shifting the position of the positioned mask.・ Prevent mask misalignment when bringing the mask and substrate close together or when separating the mask and substrate It can be.

  According to the method for manufacturing a display panel substrate of the present invention, the mask can be positioned with high accuracy, so that the pattern can be transferred with high accuracy and a high-quality display panel substrate can be manufactured.

  FIG. 1 is a diagram showing a schematic configuration of a proximity exposure apparatus according to an embodiment of the present invention. FIG. 2 is a plan view of a proximity exposure apparatus according to an embodiment of the present invention. The proximity exposure apparatus includes a base 3, an X guide 4, an X stage 5, a Y guide 6, a Y stage 7, a θ stage 8, a chuck support base 9, a chuck 10, a push pin unit, a push pin unit control system, and a mask holder. 20, mask protection spacer 30, spacer installation device 31, mask transport robot 40, mask stocker 42, wide field of view camera 51, high resolution movable camera 52, camera moving mechanism 53, high resolution fixed camera 54, image processing device 55, X stage The drive circuit 71, the Y stage drive circuit 72, the θ stage drive circuit 73, and the main controller 80 are configured.

  In FIG. 1, the control system of the push-up pin unit, the mask protection spacer 30, the spacer installation device 31, the mask transport robot 40, the mask stocker 42, and the camera moving mechanism 53 are omitted. In FIG. 2, the control system of the push-up pin unit, the image processing device 55, the X stage drive circuit 71, the Y stage drive circuit 72, the θ stage drive circuit 73, and the main control device 80 are omitted. In addition to these, the proximity exposure apparatus includes an irradiation optical system that irradiates exposure light, a gap sensor, an alignment sensor, a temperature control unit that manages temperature in the apparatus, and the like.

  Note that the XY directions in the embodiments described below are examples, and the X direction and the Y direction may be interchanged.

  In FIG. 2, the chuck 10 is in a mask receiving position where the mask 2 is received. The mask transport robot 40 takes out the mask 2 from the mask stocker 42 and carries it into the chuck 10 at the mask receiving position, and carries the mask 2 out of the chuck 10 at the mask receiving position and stores it in the mask stocker 42. To do. The handling arm 41 of the mask transfer robot 40 is provided with a mask support portion 41a that comes into contact with the peripheral portion on which the pattern surface (lower surface) of the mask 2 is not formed. The handling arm 41 includes the mask support portion 41a. Thus, the peripheral portion of the pattern surface (lower surface) of the mask 2 is supported. A push-up pin of a push-up pin unit, which will be described later, receives the mask 2 from the handling arm 41 of the mask transfer robot 40 when carrying the mask 2 into the chuck 10 and handles the mask transfer robot 40 when carrying the mask 2 out of the chuck 10. Transfer the mask 2 to the arm 41. As will be described later, the mask 2 carried into the chuck 10 is moved to a mask mounting position below the mask holder 20 and mounted on the mask holder 20 at the mask mounting position.

  When the substrate is exposed, the chuck 10 is first moved to a load / unload position where the substrate is loaded / unloaded. In the load / unload position, the substrate is loaded onto the chuck 10 and the substrate is unloaded from the chuck 10. The chuck 10 loaded with the substrate is moved from the load / unload position to the exposure position where the substrate is exposed.

  A mask holder 20 for holding the mask 2 is installed above the exposure position. The mask holder 20 holds the periphery of the mask 2 by vacuum suction. An irradiation optical system (not shown) is disposed above the mask 2 held by the mask holder 20. During exposure, exposure light from the irradiation optical system passes through the mask 2 and is irradiated onto the substrate, whereby the pattern of the mask 2 is transferred to the surface of the substrate 1 and a pattern is formed on the substrate 1.

  In FIG. 1, a chuck 10 is mounted on a θ stage 8 via a chuck support 9, and a Y stage 7 and an X stage 5 are provided below the θ stage 8. The X stage 5 is mounted on an X guide 4 provided on the base 3 and moves along the X guide 4 in the X direction (the horizontal direction in FIG. 1). The Y stage 7 is mounted on a Y guide 6 provided on the X stage 5 and moves along the Y guide 6 in the Y direction (the depth direction in FIG. 1). The θ stage 8 is mounted on the Y stage 7 and rotates in the θ direction. The chuck support 9 is mounted on the θ stage 8 and supports the back surface of the chuck 10 at a plurality of points. The X stage drive circuit 71, the Y stage drive circuit 72, and the θ stage drive circuit 73 drive the X stage 5, the Y stage 7, and the θ stage 8 under the control of the main controller 80, respectively.

  The chuck 10 is moved between the load / unload position and the exposure position by the movement of the X stage 5 in the X direction and the movement of the Y stage 7 in the Y direction. At the load / unload position, the pre-alignment of the substrate mounted on the chuck 10 is performed by moving the X stage 5 in the X direction, moving the Y stage 7 in the Y direction, and rotating the θ stage 8 in the θ direction. Done. At the exposure position, the movement of the X stage 5 in the X direction and the movement of the Y stage 7 in the Y direction cause a step movement of the substrate mounted on the chuck 10 in the XY direction. Then, the substrate is aligned by moving the X stage 5 in the X direction, moving the Y stage 7 in the Y direction, and rotating the θ stage 8 in the θ direction. Further, the gap between the mask 2 and the substrate is adjusted by moving and tilting the mask holder 20 in the Z direction (the vertical direction in FIG. 1) by a Z-tilt mechanism (not shown).

  In the present embodiment, the gap between the mask 2 and the substrate is adjusted by moving and tilting the mask holder 20 in the Z direction. However, the chuck support 9 is provided with a Z-tilt mechanism to The gap between the mask 2 and the substrate may be adjusted by moving and tilting 10 in the Z direction.

  FIG. 3 is a top view of the chuck. On the surface of the chuck 10, a not-shown convex portion, a bank, and a suction hole are provided. The convex portion has a pin shape with a diameter of several mm, and a plurality of convex portions are provided on the surface of the chuck 10 at a predetermined interval. When the substrate is mounted on the chuck 10, the convex portion supports the substrate at a plurality of points. At this time, a space is formed between the portion other than the convex portion on the surface of the chuck 10 and the substrate. The bank is a continuous wall having a predetermined width, and divides a space formed between a portion other than the convex portion on the surface of the chuck 10 and the substrate into a plurality of vacuum compartments. The bank is not a straight line but an irregular line so that the surface shape of the chuck 10 is difficult to be recognized by the human eye when a back surface transfer in which the surface shape of the chuck 10 is baked onto the surface of the substrate occurs. A plurality of suction holes are provided at predetermined intervals in portions other than the convex portions and the bank of the surface of the chuck 10, and evacuation of each vacuum section divided by the bank is performed.

  Further, the chuck 10 is provided with a plurality of push-up pins for receiving / delivering a substrate (not shown). The push-up pins for receiving / delivering the substrate are lifted from the surface of the chuck 10 to load the substrate onto the chuck 10, receive the substrate from a substrate transfer robot (not shown), and unload the substrate from the chuck (not shown). Deliver the substrate to the substrate transfer robot.

  In FIG. 3, a plurality of openings into which a push-up pin unit, which will be described later, is inserted are provided near the center of the chuck 10, and a lid 13 is fitted in the openings. The lid 13 is provided with a through hole, and a push-up pin 12 is inserted into the through hole from below the lid 13. In the present embodiment, 16 openings are provided near the center of the chuck 10, but the position and number of openings are not limited to this.

  4A is a top view of an opening provided in the chuck, and FIG. 4B is a cross-sectional view taken along a line AA in FIG. 4A. FIG. 5A is a top view of the opening provided in the chuck, and FIG. 5B is a cross-sectional view taken along the line BB in FIG. 5A. The push pin unit includes a motor 11, a push pin 12, a lid 13, a flange 14, bolts 15 and 17, and a set screw 16.

  The motor 11 includes a pulse motor, a ball screw connected to the pulse motor, and a rod. By driving the ball screw with the pulse motor, the rod stored in the rod storage portion 11a is raised. And descend. A push-up pin 12 is attached to the tip of the rod of the motor 11.

  In FIG. 4B, a flange 14 is attached to the upper surface of the rod storage portion 11 a of the motor 11, and the flange 14 is fixed to the back surface of the lid 13 with a bolt 15. On the other hand, a ring-shaped support plate 18 that supports the lid 13 is attached to the periphery of the opening on the back surface of the chuck 10. The support plate 18 is fixed to the back surface of the chuck 10 by bolts 19.

  4 (a) and 5 (a), a screw hole into which the set screw 16 is screwed and a stepped hole through which the bolt 17 is passed are provided at a plurality of locations around the lid 13. As shown in FIG. In FIG. 4B, the lid 13 is fixed to the support plate 18 by bolts 17 that pass through stepped holes in the periphery of the lid 13. In FIG. 5B, the set screw 16 is screwed into the screw hole in the peripheral portion of the lid 13, protrudes from the bottom surface of the lid 13, and contacts the upper surface of the support plate 18.

  In the present embodiment, when the push-up pin unit is attached to the chuck 10, first, the push-up pin unit is inserted into the opening from above the chuck 10 and the screwing amount of the set screw 16 is adjusted to adjust the height of the push-up pin unit. Adjust the height. Then, the lid 13 is fixed to the support plate 18 with the bolts 17 and the push-up pin unit is attached to the chuck 10. The push-up pin unit is inserted into the opening from above the chuck 10, the mounting height is adjusted by the set screw 16, and the chuck unit is attached to the chuck 10. Even in the vicinity, adjustment of the mounting height of the push-up pin unit is easily performed from above the chuck 10. Therefore, the height of the push-up pin 12 can be easily adjusted even if the chuck 10 is enlarged as the substrate is enlarged.

  FIG. 6 is a diagram showing a control system of the push-up pin unit. Under the control of the main controller 80, the push-up pin drive control circuit 50 designates the movement destination of the push-up pin 12 and instructs the motor 11 of each push-up pin unit to move to the movement destination. . The motor 11 has an encoder inside, and the encoder outputs an end signal indicating that the movement is finished to the push-up pin drive control circuit 50 when the push-up pin 12 reaches a predetermined range from the designated movement destination. To do.

  Hereinafter, a mask carrying method of a proximity exposure apparatus according to an embodiment of the present invention will be described. In FIG. 2, a spacer installation device 31 and a wide-field camera 51 are arranged above the chuck 10 at the mask receiving position. FIG. 7 is a diagram showing the arrangement of the spacer installation device and the wide-field camera. In FIG. 7, the mask 2 carried in by the mask carrying robot 40 is indicated by a broken line. The spacer installation device 31 is disposed above the peripheral portion of the mask 2 and installs the mask protection spacer 30 on the surface of the chuck 10 from above the chuck 10 as described later. The wide-field camera 51 is arranged above the position detection mark provided on the mask 2 and acquires an image of the position detection mark on the mask 2.

  8A is a top view of the mask protection spacer, FIG. 8B is a side view of the mask protection spacer viewed from the direction of arrow C in FIG. 8A, and FIG. 8C is FIG. 8A. It is a side view of the mask protection spacer seen from the direction of arrow D. The mask protection spacer 30 has a flat surface 30a, a step surface 30b higher than the flat surface 30a, and an inclined surface 30c provided between the flat surface 30a and the step surface 30b. As shown in FIGS. 8B and 8C, a groove 30 d extending in the horizontal direction is provided on the side surface of the mask protection spacer 30. When the push-up pin 12 on which the mask 2 is placed is lowered, the edge of the pattern surface (lower surface) of the mask 2 is guided by the inclined surface 30c, and the flat surface 30a is the periphery where the pattern of the mask pattern surface (lower surface) is not formed. The mask 2 is supported in contact with the portion.

  Fig.9 (a) is a side view of a spacer installation apparatus, FIG.9 (b) is a front view of a spacer installation apparatus. The spacer installation device 31 includes an air cylinder table 32, a chuck base 33, an air chuck 34, a bracket 35, a clamp 36, and a claw 37. The air cylinder table 32 drives the air cylinder by the pressure of air supplied from a pneumatic circuit (not shown), and moves the table 32a downward in the drawing. A chuck base 33 having an L-shaped cross section is attached to the table 32 a of the air cylinder table 32, and an air chuck 34 is attached to the lower end of the chuck base 33. As shown in FIG. 9B, the clamps 36 are respectively attached to the two brackets 35 connected to the air chuck 34, and the two clamps 36 are driven by the air chuck 34 as shown in FIG. ) Move in the horizontal direction of the drawing and open and close. Each clamp 36 is provided with a claw 37 that is hooked in a groove 30d provided on the side surface of the mask protection spacer 30. The two clamps 36 are configured to mask the claw 37 in the closed state shown in FIG. The mask protective spacer 30 is held by being hooked in the groove 30 d of the protective spacer 30.

  FIG. 10 is a diagram for explaining the operation of the spacer installation device. The spacer installation device 31 installs the mask protection spacer 30 on the surface of the chuck 10 before the mask 2 is carried into the chuck 10. Before the mask protection spacer 30 is installed, as shown in FIG. 10A, the table 32a of the air cylinder table 32 is in a raised state, and the clamp 36 holds the mask protection spacer 30 above the chuck 10. Yes. When installing the mask protection spacer 30, the spacer installation device 31 lowers the table 32 a of the air cylinder table 32 as shown in FIG. 10B and moves the mask protection spacer 30 held by the clamp 36 to the chuck 10. Move to the surface. Then, the clamp 36 is opened and the mask protection spacer 30 is placed on the surface of the chuck 10. Thereafter, as shown in FIG. 10C, the spacer installation device 31 raises the table 32a of the air cylinder table 32 again and stands by. When the mask protection spacer 30 is recovered from the chuck 10, the reverse operation is performed.

  In this embodiment, the spacer installation device 31 is disposed above the chuck 10 and the mask protection spacer 30 is installed on the surface of the chuck 10 from above the chuck 10. However, the mask protection spacer is built in the chuck 10. Then, the mask protection spacer may be raised from the surface of the chuck 10.

  FIG. 11 is a top view of the chuck provided with the mask protection spacer. The mask protection spacer 30 installed on the surface of the chuck 10 comes into contact with the peripheral portion where the pattern of the pattern surface (lower surface) of the mask 2 is not formed when the push-up pin 12 on which the mask 2 indicated by the broken line is lowered. The mask 2 is supported. This prevents the pattern surface (lower surface) of the mask 2 from coming into contact with the surface of the chuck 10 and damaging the pattern.

  FIG. 12 is a diagram for explaining the operations of the push-up pin unit and the mask transfer robot. When the mask 2 is carried into the chuck 10, first, the motor 11 of each push-up pin unit raises the push-up pin 12 (FIG. 12A). The mask transfer robot 40 moves the handling arm 41 on which the mask 2 is placed above the chuck 10 (FIG. 12A). Next, the mask transfer robot 40 lowers the handling arm 41 and places the mask 2 on the push-up pin 12 (FIG. 12B), further lowers the handling arm 41, and the mask support portion 41a of the handling arm 41. Is separated from the mask 2 (FIG. 12C). Thereby, each push-up pin 12 receives the mask 2 from the mask transport robot 40. Next, the mask transfer robot 40 retracts the handling arm 41 from above the chuck 10 (FIG. 8D).

  A plurality of push-up pin units having a push-up pin 12 rising from the inside of the chuck 10 and a pulse motor 11 for moving the push-up pin up and down are provided in the chuck 10, and the mask 1 is received from the mask transport robot 40 by the push-up pin 12. Even if 2 is smaller than the substrate mounted on the chuck 10, the mask 2 can be carried into the chuck 10.

  When the chuck 10 is moved from the mask receiving position to the mask mounting position, the motor 11 of each push-up pin unit lowers the push-up pin 12 and places the mask 2 on the mask protection spacer 30. When the mask 2 is unloaded from the chuck 10, the reverse operation is performed.

  FIG. 13 is a diagram illustrating a state where the mask is carried into the chuck at the mask receiving position. The wide-field camera 51 disposed above the chuck 10 at the mask receiving position has a wider field of view than the high-resolution movable camera 52 and the high-resolution fixed camera 54 described later, and is placed on the push-up pin 12. An image of the position detection mark on the mask 2 is acquired, and an image signal is output to the image processing device 55 in FIG. The image processing device 55 processes the image signal output from the wide-field camera 51 and detects the position of the mask 2. Even if the position of the mask 2 received by the push-up pin 12 from the mask transport robot 40 is greatly deviated, the image of the position detection mark of the mask 2 is acquired in a short time using the wide-field camera 51, and the mask is received at the mask receiving position. The position of 2 is detected in a short time.

  In FIG. 1, the main control device 80 inputs the detection result of the position of the mask 2 detected by the image processing device 55 processing the image signal of the wide-field camera 51, and stores the mask 2 at the mask receiving position stored in advance. Compared with the reference position, the displacement amount of the position of the mask 2 is detected. Subsequently, the main controller 80 controls the X stage drive circuit 71, the Y stage drive circuit 72, and the θ stage drive circuit 73, and moves the chuck 10 by the X stage 5, the Y stage 7, and the θ stage 8. The mask 2 is moved from the mask receiving position to the mask mounting position under the mask holder 20. At that time, main controller 80 determines the movement amounts of X stage 5, Y stage 7, and θ stage 8 from the coordinates of the reference position of mask 2 and the coordinates of the mask mounting position stored in advance, and detects the detected mask. The determined amount of movement is corrected based on the amount of displacement of position No. 2.

  The position of the mask 2 is detected at the mask receiving position, and the chuck 10 is moved by the X stage 5, the Y stage 7 and the θ stage 8 based on the detected position of the mask 2, and the mask 2 is attached to the mask from the mask receiving position. Therefore, even if the position of the mask 2 received from the mask transport robot 40 by the push-up pin 12 is shifted at the mask receiving position, the mask 2 is accurately moved to the mask mounting position.

  FIG. 14 is a top view of the mask holder. The mask holder 20 is provided with an opening that is slightly larger than the opening 20a through which the exposure light passes. Inside the opening, an opening 20a through which the exposure light passes is formed by the holder portions 21a and 21b. The holder portions 21a and 21b are attached to the lower surface of the mask holder 20, and portions below the mask holder 20 of the holder portions 21a and 21b are indicated by broken lines. The holder parts 21a and 21b hold the peripheral part of the mask 2 indicated by broken lines by vacuum suction. The holder portion 21a is provided with a mask position detection window, which will be described later, at the position of the position detection mark on the mask 2. A high resolution movable camera 52 and a high resolution fixed camera 54 are provided above the mask position detection window. Has been placed. The high-resolution movable camera 52 is attached to a camera moving mechanism 53, and is moved in the X and Y directions above the mask holder 20 by the camera moving mechanism 53 and rotated in the θ direction. The high resolution fixed camera 54 is fixed above the mask holder 20.

  FIG. 15 is a diagram for explaining the operation of mounting the mask on the mask holder. When the mask is mounted on the mask holder at the mask mounting position, first, the motor 11 of each push-up pin unit raises the push-up pin 12 to a height at which the position detection mark of the mask 2 matches the focus of the high-resolution movable camera 52. (FIG. 15A). The high-resolution movable camera 52 acquires an image of the position detection mark on the mask 2 through the mask position detection window 22 provided on the holder portion 21a. At this time, if the position of the mask 2 moved to the mask mounting position is slightly shifted and the position detection mark of the mask 2 is out of the field of view of the high resolution movable camera 52, the camera moving mechanism 53 causes the high resolution movable camera 52 to move. To move the position detection mark of the mask 2 into the field of view of the high-resolution movable camera 52. The high-resolution movable camera 52 outputs an image signal of the acquired image to the image processing device 55 in FIG. The image processing device 55 processes the image signal output from the high-resolution movable camera 52 and detects the position of the mask 2.

  In FIG. 1, the main controller 80 inputs the detection result of the position of the mask 2 detected by the image processing device 55 processing the image signal of the high-resolution movable camera 52, and stores the mask 2 at the mask mounting position stored in advance. Compared with the reference position, a displacement amount of the position of the mask 2 is detected. Then, the main controller 80 controls the X stage drive circuit 71, the Y stage drive circuit 72, and the θ stage drive circuit 73 based on the detected displacement amount of the mask 2, and the X stage 5 and the Y stage. 7 and the θ stage 8 move the chuck 10 to position the mask 2. Even if the position of the mask 2 is shifted at the mask mounting position, the position of the mask 2 is detected with high accuracy using the high-resolution movable camera 52, and the positioning of the mask 2 is performed with high accuracy.

  In FIG. 15, after the positioning of the mask 2 is completed, the motor 11 of each push-up pin unit further raises the push-up pin 12 and presses the mask 2 against the holder portions 21a and 21b (FIG. 15 (b)). A negative pressure glass 23 is provided above the mask 2 pressed against the holder portions 21 a and 21 b, and a negative pressure chamber is formed between the negative pressure glass 23 and the mask 2. The holder portions 21a and 21b are provided with suction grooves (not shown). After the pressure in the negative pressure chamber is controlled, the holder portions 21a and 21b vacuum-suck the peripheral portion of the mask 2 with the suction grooves (not shown).

  The chuck 10 is moved by the X stage 5, the Y stage 7, and the θ stage 8 to position the mask 2, and the mask 2 is mounted on the mask holder 20 by the push-up pins 12, so that the mask 2 carried into the chuck 10 is The X stage 5, the Y stage 7, and the θ stage 8 are positioned with high accuracy and mounted on the mask holder 20.

  After the holder portions 21a and 21b vacuum-suck the mask 2, the high-resolution fixed camera 54 acquires an image of the position detection mark of the mask 2 through the mask position detection window 22 provided in the holder portion 21a, and outputs an image signal. Is output to the image processing apparatus 55 of FIG. The image processing device 55 processes the image signal output from the high resolution fixed camera 54 and detects the position of the mask 2.

  In FIG. 1, the main controller 80 inputs the detection result of the position of the mask 2 detected by the image processing device 55 processing the image signal of the high-resolution fixed camera 54, and the mask 2 at the mask mounting position stored in advance. Compared with the reference position, the amount of displacement of the position of the mask 2 is detected, and it is determined whether correction of the position of the mask 2 is necessary. In the present embodiment, when the position of the mask 2 is detected by moving the high-resolution movable camera 52, the detection result of the position of the mask 2 includes a movement error of the high-resolution movable camera 52. Therefore, the position of the mask 2 positioned based on the position of the mask 2 detected by the image processing device 55 processing the image signal of the high resolution movable camera 52 may be shifted from the reference position of the mask 2.

  When correction of the position of the mask 2 is necessary, after the vacuum suction of the mask 2 is released and the pressure in the negative pressure chamber is returned to the atmospheric pressure, the push-up pin 12 is lowered to remove the mask 2 from the holder portions 21a and 21b. Release. Then, the main controller 80 controls the X stage drive circuit 71, the Y stage drive circuit 72, and the θ stage drive circuit 73 based on the detected displacement amount of the mask 2, and the X stage 5 and the Y stage. 7 and the θ stage 8 move the chuck 10 to correct the position of the mask 2. Using the high resolution fixed camera 54 fixed above the mask holder 20, the position of the mask 2 is detected with higher accuracy, and the position of the positioned mask 2 is corrected with higher accuracy.

  After correcting the position of the mask 2, the motor 11 of each push-up pin unit raises the push-up pin 12 again and presses the mask 2 against the holder portions 21a and 21b. After controlling the pressure in the negative pressure chamber, the holder portions 21a and 21b vacuum-suck the mask 2 through suction grooves (not shown). After the mounting of the mask 2 is completed, the motor 11 of each push-up pin unit lowers the push-up pin 12 (FIG. 15 (c)). Then, the chuck 10 is returned to the mask receiving position, and the mask protection spacer 30 is recovered from the chuck 10 by the spacer installation device 31.

  In the exposure of the substrate, when the gap between the mask 2 and the substrate is aligned, or when the mask 2 and the substrate are separated from each other, the air is pressed or pulled by the air between the mask 2 and the substrate and held in the mask holder 20. The mask 2 is bent. When the bent mask 2 returns to its original position, there is a risk that the mask 2 will be displaced. In the present embodiment, a misalignment prevention pin unit is provided on the lower surface of the mask holder to prevent misalignment of the mask 2 when the mask 2 and the substrate are brought close to each other or when the mask 2 and the substrate are separated.

  FIG. 16 is a view showing a misalignment prevention pin unit provided on the lower surface of the mask holder. In this embodiment, two types of pins, a reference pin and a pressing pin, are used as the misalignment prevention pins. The reference pin misalignment prevention pin unit includes a reference pin 61, a pulse motor 62, a ball screw 63, and a contact sensor 64, and is provided on one side of two opposite sides of the mask 2. The pressing pin misalignment prevention pin unit includes a pressing pin 66 and an air cylinder 67, and is provided on the other side of the two opposite sides of the mask 2.

  In this embodiment, the reference pin misalignment prevention pin unit and the press pin misalignment prevention pin unit are provided, but the reference pin misalignment prevention pin is used instead of the press pin misalignment prevention pin unit. A unit may be provided, and all of them may be used as a pin misalignment prevention pin unit. In this embodiment, two misalignment prevention pin units are provided on the long side of the mask 2 and one on the short side. However, the number and positions of the misalignment prevention pin units are the same as those of the mask 2. It is determined appropriately according to the dimensions.

  FIG. 17 is a diagram for explaining the operation of the reference pin misalignment prevention pin unit. A ball screw 63 is connected to the pulse motor 62, and a reference pin 61 and a contact sensor 64 are attached to the nut of the ball screw 63. When the pulse motor 62 drives the ball screw 63, the reference pin 61 and the contact sensor 64 are moved toward the side surface of the mask 2. As shown in FIG. 17A, the tip of the contact sensor 64 protrudes by a distance D from the tip of the reference pin 61.

  The reference pin drive control circuit 65 shown in FIG. 16 controls the pulse motor 62 to move the reference pin 61 and the contact sensor 64 toward the side surface of the mask 2. The tip of the contact sensor 64 is displaced when it hits the side surface of the mask 2, and the contact sensor 64 detects the amount of displacement and outputs a detection signal to the reference pin drive control circuit 65. As shown in FIG. 17A, when the tip of the contact sensor 64 is not in contact with the side surface of the mask 2, the displacement of the tip of the contact sensor 64 is zero. As shown in FIG. 17B, when the tip of the contact sensor 64 comes into contact with the side surface of the mask 2, the displacement of the tip of the contact sensor 64 thereafter is the amount of movement of the reference pin 61 and the contact sensor 64. Be the same.

  The reference pin drive control circuit 65 slows down the moving speed of the reference pin 61 and the contact sensor 64 when the displacement amount of the tip of the contact sensor 64 becomes the same as the movement amount of the reference pin 61 and the contact sensor 64. When the reference pin 61 and the contact sensor 64 are further moved at a low speed and the tip of the reference pin 61 contacts the side surface of the mask 2 as shown in FIG. 17C, thereafter, the reference pin 61 and the contact sensor 64 are moved. Even if it moves, the amount of displacement of the tip of the contact sensor 64 does not change. The reference pin drive control circuit 65 stops the movement of the reference pin 61 and the contact sensor 64 when the tip of the reference pin 61 contacts the side surface of the mask 2 and the displacement amount of the tip of the contact sensor 64 does not change. When the reference pin 61 comes into contact with the side surface of the mask 2, the movement of the reference pin 61 is stopped, so that the position of the mask 2 positioned by the mask 2 being pushed by the reference pin 61 is not shifted.

  In FIG. 16, after the tip of the reference pin 61 is brought into contact with the side surface of the mask 2, the pressing pin drive control circuit 68 supplies air to the air cylinder 67, and the air cylinder 67 moves the pressing pin 66 to the side surface of the mask 2. Press to. When the mask 2 and the substrate are brought close to each other or when the mask 2 and the substrate are separated from each other, when the mask 2 held by the mask holder 20 is bent, the side surface of the mask 2 moves toward the center of the mask. The reference pin 61 does not follow the movement of the side surface of the mask 2, and the side surface of the mask 2 is separated from the tip of the reference pin 61. The pressing pin 66 moves following the movement of the side surface of the mask 2. When the bent mask 2 returns to its original position, the side surface of the mask 2 on the reference pin 61 side is positioned in contact with the reference pin 61, and the side surface of the mask 2 on the pressing pin 66 side overcomes the pressing force of the pressing pin 66. To return to the original position. Accordingly, the displacement of the mask when the mask 2 and the substrate are brought close to each other or when the mask 2 and the substrate are separated is prevented.

  According to the embodiment described above, the mask 2 is carried into the chuck 10 by the mask transfer robot 40, the mask 2 is received from the mask transfer robot 40 by the push-up pin 12, and the high-resolution movable camera 52 is moved by the camera moving mechanism 53. Then, the image of the position detection mark of the mask 2 is acquired by the high resolution movable camera 52, the image signal of the high resolution movable camera 52 is processed, the position of the mask 2 is detected, and the detected position of the mask 2 is set. Based on this, the chuck 10 is moved by the X stage 5, the Y stage 7, and the θ stage 8, the mask 2 is positioned, and the mask 2 is mounted on the mask holder 20 by the push-up pins 12. Can be positioned with high accuracy and mounted on the mask holder 20.

  Further, the image of the position detection mark of the mask 2 is acquired by the high resolution fixed camera 54 fixed above the mask holder 20, and the image signal of the high resolution fixed camera 54 is processed to detect the position of the mask 2. Based on the detected position of the mask 2, the chuck 10 is moved by the X stage 5, the Y stage 7, and the θ stage 8 to correct the position of the positioned mask 2, thereby fixing the mask 2 above the mask holder 20. The position of the mask 2 can be detected with higher accuracy using the high-resolution fixed camera 54, and the position of the positioned mask 2 can be corrected with higher accuracy.

  Further, the mask 2 is received from the mask transport robot 40 by the push-up pin 12 at a mask receiving position provided separately from the mask mounting position under the mask holder 20, and the resolution is lower than that of the high-resolution movable camera 52 and has a wide field of view. The image of the position detection mark of the mask 2 is acquired by the field camera 51, the image signal of the wide field camera 2 is processed to detect the position of the mask 2, and the X stage 5, Y based on the detected position of the mask 2 When the chuck is moved by the stage 7 and the θ stage 8 and the mask 2 is moved from the mask receiving position to the mask mounting position, the position of the mask 2 received by the push-up pin 12 from the mask transfer robot 40 is greatly shifted. Also, the position of the mask 2 is detected in a short time at the mask receiving position, and the mask 2 is moved to the mask mounting position. You can move well every time.

  Further, by installing a plurality of mask protection spacers 30 that contact the peripheral portion of the pattern surface of the mask 2 when the push-up pin 12 is lowered on the surface of the chuck 10, even if the push-up pin 12 is lowered for some reason, It is possible to prevent the pattern surface of the mask 2 from coming into contact with the surface of the chuck 10 and damaging the pattern.

  Further, a reference pin 61 that contacts the side surface of the mask 2 held by the mask holder 20 to prevent displacement of the mask 2, a pulse motor 62 that moves the reference pin 61 to contact the side surface of the mask 2, and a reference pin A plurality of misregistration prevention pin units having contact sensors 64 for detecting that 61 has contacted the side surface of the mask 2 are provided in the mask holder 20, and the reference motor 61 is controlled by controlling the pulse motor 62 of each misregistration prevention pin unit. Is moved toward the side surface of the mask 2, and the movement of the reference pin 61 is stopped based on the detection result of the contact sensor 40, thereby bringing the mask 2 and the substrate closer to each other without shifting the position of the positioned mask 2. In this case, it is possible to prevent displacement of the mask 2 when the mask 2 is separated from the substrate.

  The substrate is exposed using the proximity exposure apparatus of the present invention, or the mask is mounted on the mask holder using the mask transport method of the proximity exposure apparatus of the present invention, and the substrate is exposed to expose the mask. Since the positioning can be performed with high accuracy, the pattern can be transferred with high accuracy, and a high-quality display panel substrate can be manufactured.

  For example, FIG. 18 is a flowchart showing an example of the manufacturing process of the TFT substrate of the liquid crystal display device. In the thin film formation step (step 101), a thin film such as a conductor film or an insulator film, which becomes a transparent electrode for driving liquid crystal, is formed on the substrate by sputtering, plasma chemical vapor deposition (CVD), or the like. In the resist coating process (step 102), a photosensitive resin material (photoresist) is applied by a roll coating method or the like to form a photoresist film on the thin film formed in the thin film forming process (step 101). In the exposure step (step 103), the mask pattern is transferred to the photoresist film using a proximity exposure apparatus, a projection exposure apparatus, or the like. In the development step (step 104), a developer is supplied onto the photoresist film by a shower development method or the like to remove unnecessary portions of the photoresist film. In the etching process (step 105), a portion of the thin film formed in the thin film formation process (step 101) that is not masked by the photoresist film is removed by wet etching. In the stripping step (step 106), the photoresist film that has finished the role of the mask in the etching step (step 105) is stripped with a stripping solution. Before or after each of these steps, a substrate cleaning / drying step is performed as necessary. These steps are repeated several times to form a TFT array on the substrate.

  FIG. 19 is a flowchart showing an example of the manufacturing process of the color filter substrate of the liquid crystal display device. In the black matrix forming step (step 201), a black matrix is formed on the substrate by processing such as resist coating, exposure, development, etching, and peeling. In the colored pattern forming step (step 202), a colored pattern is formed on the substrate by a dyeing method, a pigment dispersion method, a printing method, an electrodeposition method, or the like. This process is repeated for the R, G, and B coloring patterns. In the protective film forming step (step 203), a protective film is formed on the colored pattern, and in the transparent electrode film forming step (step 204), a transparent electrode film is formed on the protective film. Before, during or after each of these steps, a substrate cleaning / drying step is performed as necessary.

  In the TFT substrate manufacturing process shown in FIG. 18, in the exposure process (step 103), in the color filter substrate manufacturing process shown in FIG. 19, in the black matrix forming process (step 201) and the colored pattern forming process (step 202). In this exposure process, the proximity exposure apparatus of the present invention or the mask transport method of the proximity exposure apparatus of the present invention can be applied.

It is a figure which shows schematic structure of the proximity exposure apparatus by one embodiment of this invention. 1 is a plan view of a proximity exposure apparatus according to an embodiment of the present invention. It is a top view of a chuck. 4A is a top view of an opening provided in the chuck, and FIG. 4B is a cross-sectional view taken along a line AA in FIG. 4A. FIG. 5A is a top view of an opening provided in the chuck, and FIG. 5B is a cross-sectional view taken along the line BB in FIG. 5A. It is a figure which shows the control system of a push-up pin unit. It is a figure which shows arrangement | positioning of a spacer installation apparatus and a wide-field camera. 8A is a top view of the mask protection spacer, FIG. 8B is a side view of the mask protection spacer viewed from the direction of arrow C in FIG. 8A, and FIG. 8C is FIG. 8A. It is a side view of the mask protection spacer seen from the direction of arrow D. Fig.9 (a) is a side view of a spacer installation apparatus, FIG.9 (b) is a front view of a spacer installation apparatus. It is a figure explaining operation | movement of a spacer installation apparatus. It is a top view of the chuck | zipper in which the mask protection spacer was installed. It is a figure explaining operation | movement of a push-up pin unit and a mask conveyance robot. It is a figure which shows the state in which the mask was carried in to the chuck | zipper in a mask receiving position. It is a top view of a mask holder. It is a figure explaining the operation | movement which mounts | wears a mask holder with a mask. It is a figure which shows the position shift prevention pin unit provided in the lower surface of the mask holder. It is a figure explaining operation | movement of the position shift prevention pin unit of a reference | standard pin. It is a flowchart which shows an example of the manufacturing process of the TFT substrate of a liquid crystal display device. It is a flowchart which shows an example of the manufacturing process of the color filter board | substrate of a liquid crystal display device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Substrate 2 Mask 3 Base 4 X guide 5 X stage 6 Y guide 7 Y stage 8 θ stage 9 Chuck support base 10 Chuck 11 Motor 12 Push-up pin 13 Lid 14 Flange 15, 17, 19 Bolt 16 Set screw 18 Support plate 20 Mask Holder 21a, 21b Holder 22 Mask position detection window 23 Negative pressure glass 30 Mask protection spacer 31 Spacer installation device 32 Air cylinder table 33 Chuck base 34 Air chuck 35 Bracket 36 Clamp 37 Claw 40 Mask transfer robot 41 Handling arm 41a Mask support 42 mask stocker 50 push-up pin drive control circuit 51 wide-field camera 52 high-resolution movable camera 53 camera moving mechanism 54 high-resolution fixed camera 55 image processing device 61 reference pin (position misalignment prevention pin)
62 Pulse Motor 63 Ball Screw 64 Contact Sensor 65 Reference Pin Drive Control Circuit 66 Press Pin (Position Deviation Prevention Pin)
67 Air cylinder 68 Press pin drive control circuit 71 X stage drive circuit 72 Y stage drive circuit 73 θ stage drive circuit 80 Main controller

Claims (12)

Proximity exposure that includes a chuck for mounting a substrate, a mask holder for holding the mask, and a stage for moving the chuck, and provides a minute gap between the mask and the substrate to transfer the mask pattern to the substrate. In the device
First control means for controlling movement of the stage;
A mask carrying device for carrying the mask into the chuck;
A plurality of push-up pin units attached to the chuck, the push-up pins rising from the inside of the chuck and a motor for moving the push-up pins up and down;
A first image acquisition device that acquires an image of a position detection mark provided on a mask and outputs an image signal;
Moving means for moving the first image acquisition device;
An image processing device that processes an image signal output from the first image acquisition device and detects a position of a mask;
The plurality of push-up pin units receive a mask from the mask transfer device by the push-up pins,
The first control means positions the mask by moving the chuck by the stage based on the position of the mask detected by the image processing apparatus by processing the image signal of the first image acquisition apparatus. ,
The proximity exposure apparatus, wherein the plurality of push-up pin units attach a mask to the mask holder by the push-up pins. A second image acquisition device that is fixed above the mask holder, acquires an image of a mask position detection mark, and outputs an image signal;
The image processing device processes the image signal output by the second image acquisition device to detect the position of the mask,
The first control means moves the chuck by the stage based on the position of the mask detected by the image processing apparatus by processing the image signal of the second image acquisition apparatus. The proximity exposure apparatus according to claim 1, wherein: The image of the mask position detection mark is acquired above the mask receiving position for receiving the mask from the mask transport device by the push-up pin, having a lower field of view and lower resolution than the first image acquisition device. A third image acquisition device for outputting an image signal,
The image processing device processes the image signal output by the third image acquisition device to detect the position of the mask,
The first control means moves the chuck by the stage based on the position of the mask detected by the image processing apparatus by processing the image signal of the third image acquisition apparatus, so that the mask is received by the mask. The proximity exposure apparatus according to claim 2, wherein the proximity exposure apparatus moves to a mask mounting position below the mask holder.   4. The apparatus according to claim 1, further comprising a plurality of spacers that are disposed on the surface of the chuck and come into contact with a peripheral portion of a pattern surface of the mask when the push-up pin on which the mask is placed is lowered. The proximity exposure apparatus according to one item. A displacement prevention pin that contacts a side surface of the mask held by the mask holder to prevent displacement of the mask, a motor that moves the displacement prevention pin to contact the side surface of the mask, and the displacement prevention pin; A sensor for detecting contact with the side surface of the mask, and a plurality of misalignment prevention pin units attached to the mask holder;
Second control means for controlling the motor of each misalignment prevention pin unit,
The second control means controls the motor of each misregistration prevention pin unit to move the misregistration prevention pin toward the side surface of the mask, and based on the detection result of the sensor, The proximity exposure apparatus according to any one of claims 1 to 4, wherein the movement is stopped. Proximity exposure apparatus comprising a chuck for mounting a substrate, a mask holder for holding the mask, and a stage for moving the chuck, and providing a minute gap between the mask and the substrate to transfer the mask pattern to the substrate The mask transport method of
The chuck is provided with a plurality of push-up pin units each having a push-up pin rising from the inside of the chuck and a motor for moving the push-up pin up and down.
A first image acquisition device for acquiring an image of a position detection mark provided on the mask and outputting an image signal; and a moving means for moving the first image acquisition device;
The mask is carried into the chuck by the mask transfer device,
Receive the mask from the mask transfer device with the push-up pin,
The first image acquisition device is moved by the moving means, the image of the mask position detection mark is acquired by the first image acquisition device,
Processing the image signal of the first image acquisition device to detect the position of the mask;
Based on the detected mask position, move the chuck with the stage to position the mask,
A mask conveying method of a proximity exposure apparatus, wherein a mask is attached to a mask holder by a push-up pin. A second image acquisition device is provided that is fixed above the mask holder, acquires an image of a mask position detection mark, and outputs an image signal;
The image of the mark for detecting the position of the mask is acquired by the second image acquisition device,
Processing the image signal of the second image acquisition device to detect the position of the mask;
8. The proximity exposure apparatus mask transport method according to claim 6, wherein the position of the positioned mask is corrected by moving the chuck based on the detected mask position. Receiving the mask from the mask transport device by the push-up pin at the mask receiving position provided separately from the mask mounting position under the mask holder,
A third image acquisition device is provided above the mask receiving position, which has a lower resolution and a wider field of view than the first image acquisition device, acquires an image of a mask position detection mark, and outputs an image signal. ,
The image of the mark for detecting the position of the mask is acquired by the third image acquisition device,
Processing the image signal of the third image acquisition device to detect the position of the mask;
8. The proximity exposure apparatus mask transport method according to claim 7, wherein the chuck is moved by the stage based on the detected mask position, and the mask is moved from the mask receiving position to the mask mounting position.   9. The plurality of spacers that contact the periphery of the pattern surface of the mask when the push-up pin on which the mask is placed descends are provided on the surface of the chuck. 10. Mask Propagation Method for Proximity Exposure Apparatus A misalignment prevention pin that contacts the side surface of the mask held by the mask holder to prevent misalignment of the mask, a motor that moves the misalignment prevention pin to contact the side surface of the mask, and the misalignment prevention pin is on the side surface of the mask The mask holder is provided with a plurality of misalignment prevention pin units having sensors for detecting contact with the mask holder,
The motor of each misregistration prevention pin unit is controlled to move the misregistration prevention pin toward the side surface of the mask, and the movement of the misregistration prevention pin is stopped based on the detection result of the sensor. The method for transporting a mask of a proximity exposure apparatus according to any one of claims 6 to 9.   A method for manufacturing a display panel substrate, wherein the substrate is exposed using the proximity exposure apparatus according to any one of claims 1 to 5.   A manufacturing method of a display panel substrate, wherein the mask is mounted on a mask holder using the mask transport method of the proximity exposure apparatus according to any one of claims 6 to 10, and the substrate is exposed. Method.

Images