CN101738870B - Proximity exposure apparatus, method of delivering a mask of a proximity exposure apparatus and method of manufacturing a display panel substrate - Google Patents

Proximity exposure apparatus, method of delivering a mask of a proximity exposure apparatus and method of manufacturing a display panel substrate Download PDF

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Publication number
CN101738870B
CN101738870B CN2009101788730A CN200910178873A CN101738870B CN 101738870 B CN101738870 B CN 101738870B CN 2009101788730 A CN2009101788730 A CN 2009101788730A CN 200910178873 A CN200910178873 A CN 200910178873A CN 101738870 B CN101738870 B CN 101738870B
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CN
China
Prior art keywords
mask
chuck
image
ejector pin
image acquiring
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Expired - Fee Related
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CN2009101788730A
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Chinese (zh)
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CN101738870A (en
Inventor
森顺一
松山胜章
樋川博志
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Hitachi High Tech Corp
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Hitachi High Technologies Corp
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection

Abstract

A proximity exposure apparatus of the invention can position a mask smaller than a substrate with excellent precision for installing the mask on a mask holder. A plurality of ejector pin units which are provided with ejector pins 12 that lift from the inner part of a chuck 10 and a motor 11 for vertically moving the ejector pins 12 are equipped on the chuck 10. The mask 2 is conveyed into the chuck 10 through a mask conveying device. Furthermore the mask 2 is received from the mask conveying device through the ejector pins 12. A first image obtaining device 52 is moved through a moving mechanism 53. Furthermore a marked image for detecting the position of the mask 2 is obtained through the first image obtaining device 52. The image signal of the first image obtaining device 52 is processed for detecting the position of the mask 2. Additionally, according to the detected position of the mask 2, the chuck 10 is moved through an X platform 5, a Y platform 7 and a theta platform 8 for positioning the mask 2. The mask 2 is equipped to the mask holder 20 through the ejector pins 12.

Description

The manufacturing approach of proximity printing device, its mask transfer method and display panel substrate
Technical field
The present invention relates in a kind of manufacturing of the display panel substrate at LCD device etc.; Use is carried out the proximity printing device of base plate exposure, the mask transfer method of proximity printing device and the manufacturing approach of using the display panel substrate of said device and method near formula (proximity) mode, particularly relates to a kind ofly being suitable for large-scale mask is positioned and being installed in the proximity printing device on the mask holder, the mask transfer method of proximity printing device and the manufacturing approach of using the display panel substrate of said device and method.
Background technology
Be used as thin film transistor (TFT) (the Thin FilmTransistor of the LCD device of display panel; TFT) substrate, colored filter (color filter) substrate, plasma (plasma) display pannel are with substrate and organic electroluminescent (ElectroIuminescence; EL) manufacturing of display panel substrate etc. is to use exposure device, and on substrate, forms pattern through photoetching (photolithography) technology and carry out.As exposure device, use lens (lens) or minute surface are arranged and with the graphic pattern projection of mask to the substrate projection (projection) mode and between mask and substrate, be provided with small gap (near the formula gap) with the pattern transfer of mask to substrate near the formula mode.Compare with projection pattern, near the pattern exploring poor-performing of formula mode, but the formation of illuminating optical system is simple, and processing power is high and be suitable for volume production and use.
The proximity printing device comprises the chuck of mounted board and keeps the mask holder of mask, through making mask that remains on the mask holder and very approaching exposure of substrate of carrying on chuck.Usually, chuck is to carry on the platform that substrate is moved and locating, and substrate is carried out vacuum suction and fixes.Mask holder is arranged on the top of the chuck that is carrying substrate, and the periphery of mask is carried out vacuum suction and fixes.In chuck, move into substrate and from chuck, take out of substrate; Normally the motion arm (handling arm) by the substrate transferring robot carries out, but carries out at the load/unload position place away from the exposure position below the mask with contacting of substrate for fear of mask.After the load/unload position place carries substrate on the chuck, platform is moved to the exposure position of mask below, and carry out the location of substrate at exposure position.
In mask holder, moving into mask and from mask holder, take out of mask, also is that the motion arm through the mask transfer robot carries out in the past.But; Therefore the motion arm of mask transfer robot is that an end is fixed, is large-scale and its weight when increasing at mask, and motion arm can be crooked and can't flatly support mask; And rocking of motion arm can become big, thereby be difficult to guarantee the stroke (stroke) that moves in order to the mask holder below.With respect to this; Disclose in the patent documentation 1 a kind of technology is arranged; The temporary transient supporting member of mask is set in the outer peripheral edges portion of chuck; Mask carried place on the temporary transient supporting member, come the conveyance skew of mask correction, and mask is pressed into the lower surface of mask holder through the Z-direction driving mechanism that is attached at the chuck lower face side through platform.
Patent documentation 1: Japanese Patent Laid is opened the 2003-186199 communique
In recent years, maximize and the variation of size, in the manufacturing of the various substrates of display panel, prepare relatively large substrate,, make one or more display panel substrate by a substrate according to the size of display panel in order to tackle.In the case, near the formula mode, if the one side unification of substrate is made public, then need the mask with the identical size of substrate, so the cost of expensive mask can further increase.Therefore, following mode is just becoming main flow, that is and, use and compare less relatively mask with substrate, through platform make substrate towards XY direction carry out stepping (step) to move on one side, one side is divided into a plurality of exposure areas (shot) with the one side of substrate and makes public.In this mode, because mask is littler than the substrate that carries on chuck, so can't use the technology of record in the patent documentation 1.
And, make mask and substrate near the time or when mask and substrate are separated, receive the extruding or the stretching of the air between mask and the substrate, remain on the mask holder mask can the bending.And, when the mask of bending recovered former state, the off normal of mask might take place.In the past, when the motion arm that uses the mask transfer robot comes the conveyance mask, the pin of a plurality of location usefulness had been set on the mask holder, be installed to mask on the mask holder after, the side that utilizes the pin of location usefulness to push mask is to regulate the position of mask.Make mask and substrate near the time or when mask and substrate are separated, the pin of said location usefulness has also been brought into play the effect that prevents the mask off normal.But, when before mask is installed, carrying out the location of mask,, then there is following problem if the pin of the location usefulness before utilizing prevents the off normal of mask, that is, when the pin of location usefulness is run into the side of mask, can squint in the position of oriented mask.
This shows that the manufacturing approach of above-mentioned existing proximity printing device, its mask transfer method and display panel substrate obviously still has inconvenience and defective, and demands urgently further improving in product structure, method and use.In order to solve the problem of above-mentioned existence; Relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly; But do not see always that for a long time suitable design is developed completion; And common product and method do not have appropriate structure and method to address the above problem, and this obviously is the problem that the anxious desire of relevant dealer solves.Therefore how to found a kind of manufacturing approach of new proximity printing device, its mask transfer method and display panel substrate, real one of the current important research and development problem that belongs to, also becoming the current industry utmost point needs improved target.
Summary of the invention
The objective of the invention is to; Overcome the defective of the manufacturing approach existence of existing proximity printing device, its mask transfer method and display panel substrate; And a kind of manufacturing approach of new proximity printing device, its mask transfer method and display panel substrate is provided, technical matters to be solved is its precision to be located than the little mask of substrate well attach it on the mask holder; In addition, under the situation that oriented mask can not misplace make mask and substrate near the time, or when mask and substrate are separated, prevent the off normal of mask; And then, make high-quality display panel substrate, be very suitable for practicality.
Proximity printing device of the present invention comprises: the chuck of mounted board, the mask holder that keeps mask and the platform of mobile chuck; Between mask and substrate, be provided with small gap; Pattern transfer with mask arrives substrate; Wherein, this proximity printing device comprises: to first control gear of controlling that moves of platform; Mask is moved into the mask transfer device of chuck; A plurality of ejector pin unit of going up have from inner last ejector pin that rises of chuck and the motor (motor) that ejector pin is moved up and down, and are installed on the chuck independently respectively; First image acquiring device obtains the position probing that is arranged on the mask image with mark, and output image signal; The travel mechanism that first image acquiring device is moved; And image processing apparatus, the picture signal that first image acquiring device is exported is handled, detect the position of the XY direction of mask, and a plurality of ejector pin unit of going up receive mask through last ejector pin from the mask transfer device; First control gear is handled the picture signal of first image acquiring device according to image processing apparatus and the position of the XY direction of detected mask utilizes platform to move chuck, carries out the location of mask; A plurality of ejector pin unit of going up are installed to mask on the mask holder through last ejector pin.
In addition; The mask transfer method of proximity printing device of the present invention is the mask transfer method of following proximity printing device; This proximity printing device comprises the chuck of mounted board, the mask holder that keeps mask and the platform of mobile chuck; Between mask and substrate, be provided with small gap, arrive substrate with pattern transfer, wherein mask; A plurality of ejector pin unit of going up are arranged on respectively on the chuck independently, and said a plurality of ejector pin unit of going up have from inner last ejector pin that rises of chuck and the motor that ejector pin is moved up and down; First image acquiring device and travel mechanism that first image acquiring device is moved are set, and said first image acquiring device obtains the position probing that is arranged on the mask image with mark, and output image signal; Utilize the mask transfer device that mask is moved into chuck; Receive mask through last ejector pin from the mask transfer device; Utilize travel mechanism to move first image acquiring device, and utilize first image acquiring device and obtain the image of the position probing of mask with mark; Picture signal to first image acquiring device is handled, with the position of the XY direction that detects mask; Position according to the XY direction of detected mask utilizes platform to move chuck, to carry out the location of mask; And mask is installed on the mask holder through last ejector pin.
Be provided with on the chuck a plurality of on the ejector pin unit; It has from inner last ejector pin that rises of chuck and the motor that ejector pin is moved up and down; And through last ejector pin and from mask transfer device reception mask; Even if therefore mask is littler than the substrate that carries on chuck, also can mask be moved into chuck.And, utilizing platform to move chuck carrying out the location of mask, and mask is installed on the mask holder through last ejector pin, the mask of therefore having moved in the chuck can precision located through platform well, and is installed on the mask holder.
For precision is carried out the location of mask well, must precision detect the position of mask well.The detection of mask position is that the position probing through obtaining mask is carried out with the image of mark, and the resolution of used image acquiring device is high more, and accuracy of detection is just high more.But the visual field of high-resolution image acquiring device is narrow and small, and when in the position of mask skew taking place, the position probing that mask might occur does not enter into the situation in the visual field with mark.Therefore; Be provided be used to obtain the position probing that is arranged on the mask with first image acquiring device of the image of mark, with the travel mechanism that first image acquiring device is moved; And utilize travel mechanism to move first image acquiring device, utilize first image acquiring device and obtain the image of the position probing of mask with mark.And, the picture signal of first image acquiring device is handled, detecting the position of mask, and, utilize platform to move chuck, to carry out the location of mask according to the position of detected mask.Even if squint in the position of mask, also can utilize high-resolution image acquiring device and precision detects the position of mask well, thereby precision is carried out the location of mask well.
And then; Proximity printing device of the present invention comprises second image acquiring device, and this second image acquiring device is fixed on the top of mask holder, with the position probing of the obtaining mask image with mark; And output image signal; The picture signal that image processing apparatus is exported second image acquiring device is handled, and to detect the position of mask, first control gear is handled and the position of detected mask the picture signal of second image acquiring device according to image processing apparatus; Utilize platform to move chuck, the position of oriented mask is revised.
In addition, the mask transfer method of proximity printing device of the present invention is: second image acquiring device is set, and this second image acquiring device is fixed on the top of mask holder, with the position probing of obtaining mask image with mark, and output image signal; Utilize second image acquiring device and obtain the image of the position probing of mask with mark; Picture signal to second image acquiring device is handled, to detect the position of mask; According to the position of detected mask, utilize platform to move chuck, the position of oriented mask is revised.
When first image acquiring device is moved, will comprise the displacement error of first image acquiring device in the testing result of mask position.Therefore; Be provided with second image acquiring device, this second image acquiring device is fixed on the top of mask holder, with the position probing of the obtaining mask image with mark; And output image signal, utilize this second image acquiring device and obtain the image of the position probing of mask with mark.And, the picture signal of second image acquiring device is handled, detect the position of mask, and, utilize platform to move chuck according to the position of detected mask, the position of oriented mask is revised.Use is fixed on second image acquiring device of mask holder top, and further precision detects the position of mask well, and the good correction of precision is carried out in the position of oriented mask.
And then; Proximity printing device of the present invention comprises the 3rd image acquiring device; Ejector pin on passing through and receive the sky of the mask receiving position of mask from the mask transfer device, the 3rd image acquiring device has the visual field low and wider than the resolution of first image acquiring device, obtains the image of the position probing of mask with mark; And output image signal; The picture signal that image processing apparatus is exported the 3rd image acquiring device is handled, and to detect the position of mask, first control gear is handled and the position of detected mask the picture signal of the 3rd image acquiring device according to image processing apparatus; Utilize platform to move chuck, mask is moved to the mask installation site of mask holder below from the mask receiving position.
In addition, the mask transfer method of proximity printing device of the present invention is: with mask holder below the mask receiving position place that is provided with in addition, different ground, mask installation site, receive mask through last ejector pin from the mask transfer device; The 3rd image acquiring device is arranged on the top of mask receiving position, and said the 3rd image acquiring device has the visual field low and wider than the resolution of first image acquiring device, obtains the image of the position probing of mask with mark, and output image signal; Utilize the 3rd image acquiring device and obtain the image of the position probing of mask with mark; Picture signal to the 3rd image acquiring device is handled, to detect the position of mask; According to the position of detected mask, utilize platform to move chuck, mask is moved to the mask installation site from the mask receiving position.
With mask holder below the mask receiving position place that is provided with in addition, different ground, mask installation site, receive mask through last ejector pin from the mask transfer device, and mask moved to the mask installation site from the mask receiving position; In the case; Detect the position of mask at mask receiving position place, and, utilize platform to move chuck according to the position of detected mask; Mask is moved to the mask installation site from the mask receiving position; Therefore, even if mask receiving position place by on ejector pin squint to some extent from the position of the received mask of mask transfer device, also can make the mask precision move to the mask installation site well.
The detection of the mask position that carries out at the mask receiving position; Be that position probing through obtaining mask is carried out with the image of mark; But when through last ejector pin and from the position of the received mask of mask transfer device bigger skew taking place; If use the high-resolution image acquiring device identical, then might come into view with mark and need the long period for the position probing that makes mask with first image acquiring device.Therefore, the 3rd image acquiring device that will have the visual field low and wider than the resolution of first image acquiring device is arranged on the top of mask receiving position, and utilizes the 3rd image acquiring device and obtain the image of the position probing of mask with mark.Even if, also can obtain the image of the position probing of mask at short notice, and detect the position of mask in the short time at mask receiving position place with mark by of the bigger skew of position generation of last ejector pin from the received mask of mask transfer device.
And then proximity printing device of the present invention comprises a plurality of distance pieces (spacer), is arranged on the surface of chuck, and said a plurality of distance pieces touch the periphery of the pattern plane of mask when carrying the last ejector pin decline putting mask.In addition, the mask transfer method of proximity printing device of the present invention is with the surface that is arranged on chuck at a plurality of distance pieces that carry the periphery of putting the pattern plane that touches mask when ejector pin descends on the mask.After last ejector pin received substrate from the mask transfer device, if former thereby cause that going up ejector pin descends because of some, then the pattern plane of mask can touch the surface of chuck and might cause pattern impaired.Therefore, the surface of chuck be provided with carrying putting mask on ejector pin can touch a plurality of distance pieces of periphery of the pattern plane of mask when descending, touch the surface of chuck with the pattern plane that prevents mask.
And then; Proximity printing device of the present invention comprises: a plurality of preventing offsetting pins unit; Have with the contacts side surfaces that remains on the mask on the mask holder with the preventing offsetting pin that prevents the mask off normal, make the preventing offsetting pin move and touch the motor of mask side and be used for detecting the sensor that the preventing offsetting pin joint contacts the mask side face, and said a plurality of preventing offsetting pins unit is installed on the mask holder; And second control gear that the motor of each preventing offsetting pin unit is controlled; And; Second control gear is controlled the motor of each preventing offsetting pin unit, and the preventing offsetting pin is moved towards the side of mask, and according to the testing result of sensor the mobile of preventing offsetting pin is stopped.
In addition; The mask transfer method of proximity printing device of the present invention is: a plurality of preventing offsetting pins unit is arranged on the mask holder; Said a plurality of preventing offsetting pins unit have with the contacts side surfaces that remains on the mask on the mask holder with the preventing offsetting pin that prevents the mask off normal, make said preventing offsetting pin move and touch the motor of mask side and detect the sensor that said preventing offsetting pin joint contacts the mask side face; And; Motor to each preventing offsetting pin unit is controlled, and said preventing offsetting pin is moved towards the side of mask, and according to the testing result of said sensor the mobile of said preventing offsetting pin is stopped.
Because the motor of each preventing offsetting pin unit is controlled; Said preventing offsetting pin is moved towards the side of mask; And the testing result that contacts the sensor of mask side face according to the said preventing offsetting pin joint of detection stops the mobile of said preventing offsetting pin; So under the situation that oriented mask can not misplace, make said preventing offsetting pin joint contact the side of mask, thus make mask and substrate near the time, or when mask and substrate are separated, prevent the off normal of mask.
The manufacturing approach of display panel substrate of the present invention is: use said each proximity printing device to carry out the exposure of substrate; Perhaps use said each the proximity printing device the mask transfer method and mask is installed on the mask holder, and carry out the exposure of substrate.Because precision is carried out the location of mask well, but so precision is carried out the transfer printing of pattern well, thereby high-quality display panel substrate can be made.
The present invention compared with prior art has tangible advantage and beneficial effect.By technique scheme, the manufacturing approach of proximity printing device of the present invention, its mask transfer method and display panel substrate has advantage and beneficial effect at least:
According to the mask transfer method of proximity printing device of the present invention and proximity printing device, utilize the mask transfer device that mask is moved into chuck, receive mask through last ejector pin from the mask transfer device; And utilize travel mechanism and first image acquiring device is moved; Obtaining the image of the position probing of mask through first image acquiring device, and the picture signal of first image acquiring device is handled, to detect the position of mask with mark; Position according to detected mask; Utilize platform to move chuck, carry out the location of mask, and mask is installed on the mask holder through last ejector pin; Like this, can precision locate well and attach it on the mask holder than the little mask of substrate.
And then according to the mask transfer method of proximity printing device of the present invention and proximity printing device, utilization is fixed on second image acquiring device of mask holder top and obtains the image of the position probing of mask with mark; Picture signal to second image acquiring device is handled, detecting the position of mask, and according to the position of detected mask; Utilize platform to move chuck; Position to oriented mask is revised, and like this, uses second image acquiring device that is fixed on the mask holder top; Further precision detects the position of mask well, precision is carried out in the position of oriented mask revise well.
And then; Mask transfer method according to proximity printing device of the present invention and proximity printing device; With mask holder below the mask receiving position place that is provided with in addition, different ground, mask installation site through on ejector pin and receive mask from the mask transfer device; The 3rd image acquiring device that utilization has the visual field low and wider than the resolution of first image acquiring device obtains the image of the position probing of mask with mark, and the picture signal of the 3rd image acquiring device is handled and detected the position of mask, and according to the position of detected mask; Utilize platform to move chuck; Mask is moved to the mask installation site from the mask receiving position, like this, even if by of the position generation bigger skew of last ejector pin from the received mask of mask transfer device; Also can detect the position of mask the short time, thereby can the mask precision be moved to the mask installation site well at mask receiving position place.
And then; Mask transfer method according to proximity printing device of the present invention and proximity printing device; Be provided with a plurality of distance pieces of the periphery of the pattern plane that when last ejector pin descends, can touch mask on the surface of chuck; Like this, even if former thereby cause that going up ejector pin descends because of some, the pattern plane that also can prevent mask touches surface and the pattern of lesions of chuck.
And then; Mask transfer method according to proximity printing device of the present invention and proximity printing device; On mask holder, be provided with a plurality of preventing offsetting pins unit; Said a plurality of preventing offsetting pins unit have with the contacts side surfaces that remains on the mask on the mask holder with the preventing offsetting pin that prevents the mask off normal, make said preventing offsetting pin move and touch the motor of mask side and detect the sensor that said preventing offsetting pin joint contacts the mask side face, and, the motor of each preventing offsetting pin unit is controlled; Said preventing offsetting pin is moved towards the side of mask; And according to the testing result of said sensor the mobile of said preventing offsetting pin stopped, like this, under the situation that oriented mask can not misplace can make mask and substrate near the time or when mask and substrate are separated, prevent the off normal of mask.
According to the manufacturing approach of display panel substrate of the present invention, but precision is carried out the location of mask well, but therefore precision is carried out the transfer printing of pattern well, thereby can make high-quality display panel substrate.
In sum, but the present invention's precision locate well than the little mask of substrate and attach it on the mask holder.To have from inner the last ejector pins 12 that rise of chuck 10 and make that the ejector pin unit are arranged on the chuck 10 on motor 11 that ejector pin 12 moves up and down a plurality of.Utilize the mask transfer device that mask 2 is moved in the chuck 10, and receive mask 2 from the mask transfer device through last ejector pin 12.Utilize travel mechanism 53 to move first image acquiring device 52, and utilize first image acquiring device 52 and obtain the image of the position probing of mask 2 with mark.Picture signal to first image acquiring device 52 is handled; Detect the position of mask 2; And according to the position of detected mask 2; Utilize X platform 5, Y platform 7 and theta stage 8 to move chuck 10, carry out the location of mask 2, mask 2 is installed on the mask holder 20 through last ejector pin 12.
Above-mentioned explanation only is the general introduction of technical scheme of the present invention; Understand technological means of the present invention in order can more to know; And can implement according to the content of instructions, and for let of the present invention above-mentioned with other purposes, feature and advantage can be more obviously understandable, below special act preferred embodiment; And conjunction with figs., specify as follows.
Description of drawings
Fig. 1 is the synoptic diagram that the summary of the proximity printing device of an expression embodiment of the present invention constitutes.
Fig. 2 is the planimetric map of the proximity printing device of an embodiment of the present invention.
Fig. 3 is the vertical view of chuck.
Fig. 4 a is the vertical view of opening set on the chuck, and Fig. 4 b is the sectional view of the A-A part of Fig. 4 a.
Fig. 5 a is the vertical view of opening set on the chuck, and Fig. 5 b is the sectional view of the B-B part of Fig. 5 a.
Fig. 6 is the synoptic diagram that the control system of ejector pin unit is gone up in expression.
Fig. 7 is the synoptic diagram of the configuration of expression distance piece setting device and wide visual field camera.
Fig. 8 a is the vertical view of mask protection distance piece, and Fig. 8 b is the side view from the observed mask protection of the arrow C direction of Fig. 8 a distance piece, and Fig. 8 c is the side view from the observed mask protection of the arrow D direction of Fig. 8 a distance piece.
Fig. 9 a is the side view of distance piece setting device, and Fig. 9 b is the front view of distance piece setting device.
Figure 10 is that (wherein, Figure 10 a is the synoptic diagram that the platform of distance piece setting device cylinder platform is in propradation to the synoptic diagram that describes of the action to the distance piece setting device; Figure 10 b is the synoptic diagram that the distance piece setting device descends the platform of cylinder platform; Figure 10 c is the synoptic diagram that the distance piece setting device makes the platform of cylinder platform rise once more, wait for).
Figure 11 is the vertical view that is provided with the chuck of mask protection distance piece.
Figure 12 be the synoptic diagram that describes of the action to last ejector pin unit and mask transfer robot (wherein; Figure 12 a is that the motor of going up the ejector pin unit rises ejector pin, and the while, the mask transfer robot made the synoptic diagram that motion arm that mask is being set moves towards the sky of chuck; Figure 12 b is that the mask transfer robot descends motion arm, and mask is arranged on the synoptic diagram on the ejector pin; Figure 12 c is that motion arm further descends, and makes the mask support portion of motion arm leave the synoptic diagram of mask; Figure 12 d is the synoptic diagram that the mask transfer robot makes motion arm keep out of the way from the sky of chuck).
Figure 13 is illustrated in the synoptic diagram that the mask receiving position is moved into mask the state in the chuck.
Figure 14 is the vertical view of mask holder.
Figure 15 is that (Figure 15 a is the synoptic diagram of the motor of going up the ejector pin unit position probing that ejector pin risen to make mask with the mark height consistent with the focus of the movable camera of high resolving power for synoptic diagram that the action that mask is installed on mask holder is described; Figure 15 b is that the motor of going up the ejector pin unit further rises ejector pin, mask is pressed into the synoptic diagram of retainer portion; Figure 15 c is after the installation of mask finishes, the synoptic diagram that the motor of last ejector pin unit descends ejector pin).
Figure 16 is the synoptic diagram that expression is arranged on the preventing offsetting pin unit of mask holder lower surface.
Figure 17 is that (wherein, Figure 17 a is that the displacement of the leading section of feeler becomes zero synoptic diagram under the state of the side that do not touch mask of the leading section at feeler to the synoptic diagram that describes of the action to the preventing offsetting pin unit of reference pins; Figure 17 b is after the leading section of feeler touches the side of mask, and the displacement of the leading section of feeler becomes the synoptic diagram identical with the amount of movement of reference pins and feeler; Figure 17 c is after the front end of reference pins touches the side of mask, even if reference pins and feeler are moved, and the synoptic diagram that the displacement of the leading section of feeler also can not change).
Figure 18 be the expression LCD device the TFT substrate manufacturing process one the example process flow diagram.
Figure 19 be the expression LCD device colored filter substrate manufacturing process one the example process flow diagram.
1: substrate 2: mask
3: pedestal 4:X guides
5:X platform 6:Y guides
7:Y platform 8: theta stage
9: chuck brace table 10: chuck
11: motor 11a: the bar incorporating section
12: go up ejector pin 13: lid
14: flange 15,17,19: screw
16: stop screw 18: back up pad
20: mask holder 20a: opening
21a, 21b: retainer portion 22: mask position detection window
23: negative pressure glass 30: mask protection distance piece
30a: tabular surface 30b: section difference face
30c: dip plane 30d: groove
31: distance piece setting device 32: the cylinder platform
32a: platform 33: chuck pedestal
34: air chuck 35: support
36: clamp 37: pawl
40: mask transfer robot 41: motion arm
41a: mask support portion 42: mask bank
50: go up ejector pin Drive and Control Circuit 51: wide visual field camera
52: the movable camera 53 of high resolving power: mobile camera moving mechanism
54: high resolving power fixed camera 55: image processing apparatus
61: reference pins (preventing offsetting pin) 62: impulse motor
63: ball screw 64: feeler
65: reference pins Drive and Control Circuit 66: press pad (preventing offsetting pin)
67: cylinder 68: press the pad Drive and Control Circuit
71:X platform driving circuit 72:Y platform driving circuit
73: theta stage driving circuit 80: main control unit
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention; Below in conjunction with accompanying drawing and preferred embodiment; To its embodiment of manufacturing approach, structure, method, step, characteristic and the effect thereof of the proximity printing device, its mask transfer method and the display panel substrate that propose according to the present invention, specify as after.
Relevant aforementioned and other technology contents, characteristics and effect of the present invention can be known to appear in the following detailed description that cooperates with reference to graphic preferred embodiment.Through the explanation of embodiment, when can being to reach technological means that predetermined purpose takes and effect to obtain one more deeply and concrete understanding to the present invention, yet the appended graphic usefulness that only provides reference and explanation be not to be used for the present invention is limited.
Fig. 1 is the synoptic diagram that the summary of the proximity printing device of an expression embodiment of the present invention constitutes.In addition, Fig. 2 is the planimetric map of the proximity printing device of an embodiment of the present invention.The proximity printing device comprises with the lower part and constituting: pedestal 3; X guides 4; X platform 5; Y guides 6; Y platform 7; Theta stage 8; Chuck brace table 9; Chuck 10; Last ejector pin unit; The control system of last ejector pin unit; Mask holder 20; Mask protection distance piece 30; Distance piece setting device 31; Mask transfer robot 40; Mask bank (mask stocker) 42; Wide visual field camera 51; The movable camera 52 of high resolving power; Mobile camera moving mechanism 53; High resolving power fixed camera 54; Image processing apparatus 55; X platform driving circuit 71; Y platform driving circuit 72; Theta stage driving circuit 73 and main control unit 80.
Moreover, among Fig. 1, omitted control system, the mask of last ejector pin unit and protected distance piece 30, distance piece setting device 31, mask transfer robot 40, mask bank 42, reach mobile camera moving mechanism 53.In addition, among Fig. 2, omitted control system, image processing apparatus 55, X platform driving circuit 71, Y platform driving circuit 72, theta stage driving circuit 73, and the main control unit 80 of last ejector pin unit.Except that said each several part, the proximity printing device comprises that the illuminating optical system that shines exposure light, gap sensor, aligning (alignment) are with sensor and carry out the temperature control unit etc. of the temperature treatment in the device.
Moreover below the XY direction in the embodiment of explanation is merely illustration, also can be with directions X and the transposing of Y direction.
Among Fig. 2, chuck 10 is present in the mask receiving position of the reception of carrying out mask 2.Mask transfer robot 40 takes out mask 2 from mask bank 42, and moves in the chuck 10 at mask receiving position place, and from the chuck 10 of mask receiving position, takes out of mask 2, and is received in the mask bank 42.On the motion arm 41 of mask transfer robot 40; The mask support portion 41a that contacts with the periphery that does not form pattern of the pattern plane (lower surface) of mask 2 is being set, and motion arm 41 supports the periphery of the pattern plane (lower surface) of mask 2 through mask support portion 41a.About the following last ejector pin of going up the ejector pin unit, when in chuck 10, moving into mask 2, from the motion arm 41 reception masks 2 of mask transfer robot 40, when from chuck 10, taking out of mask 2, the motion arm 41 handing-over masks 2 to mask transfer robot 40.Be described below, the mask of having moved in the chuck 10 2 moves to the mask installation site of mask holder 20 belows, and is installed on the mask holder 20 in the mask installation site.
When carrying out base plate exposure, chuck 10 at first moves to the load/unload position of the load/unload that carries out substrate.At the load/unload position place, mounting substrate on chuck 10, and unload carried base board from chuck 10.The chuck 10 that is loading substrate moves to the exposure position that carries out base plate exposure from load/unload position.
In the sky of exposure position, be provided with the mask holder 20 that keeps mask 2.The periphery of 20 pairs of masks 2 of mask holder carries out vacuum suction and is keeping.The sky remaining in the mask 2 on the mask holder 20 is disposing not shown illuminating optical system.When exposure, make exposure light see through mask 2 and shine substrate from illuminating optical system, with this pattern transfer of mask 2 is arrived the surface of substrate 1, thereby on substrate 1, form pattern.
Among Fig. 1, chuck 101 carries on theta stage 8 via chuck brace table 9, and the below of theta stage 8 is provided with Y platform 7 and X platform 5.X platform 5 carries on X guides 4 set on the pedestal 3, moves towards directions X (the drawing Width of Fig. 1) along X guides 4.Y platform 7 carries on Y guides 6 set on the X platform 5, moves towards Y direction (the drawing depth direction of Fig. 1) along Y guides 6.Theta stage 8 carries on Y platform 7, rotates towards the θ direction.Chuck brace table 9 carries on theta stage 8, supports the back side of chuck 10 through a plurality of points.X platform driving circuit 71, Y platform driving circuit 72, and theta stage driving circuit 73 drive X platform 5, Y platform 7, and theta stage 8 respectively through the control of main control unit 80.
Reach Y platform 7 at X platform 5 under the effect of moving of Y direction towards moving of directions X, chuck 10 moves between load/unload position and exposure position.In load/unload position, through X platform 5 moving towards the moving of directions X, Y platform 7 towards the Y direction, and theta stage 8 towards the rotation of θ direction, carry the prealignment of the substrate on chuck 10.At exposure position, through X platform 5 towards directions X move and Y platform 7 towards the moving of Y direction, the substrate that carries on chuck 10 moves towards the stepping of XY direction.And, through X platform 5 moving towards the moving of directions X, Y platform 7 towards the Y direction, and theta stage 8 towards the rotation of θ direction, carry out the aligning of substrate.In addition, utilize not shown Z-leaning device and make mask holder 20 move and tilt, carry out the gap alignment of mask 2 and substrate with this towards Z direction (the drawing above-below direction of Fig. 1).
Moreover; In this embodiment, be through making mask holder 20 move and tilt to carry out the gap alignment of mask 2 and substrate, but also the Z-leaning device can be set on chuck brace table 9 towards the Z direction; Make chuck 10 move and tilt, carry out the gap alignment of mask 2 and substrate whereby towards the Z direction.
Fig. 3 is the vertical view of chuck.On the surface of chuck 10, be provided with not shown protuberance, dike and adsorption hole.Protuberance is the pin shape that diameter is counted mm, with the interval of stipulating a plurality of these protuberances is being set on the surface of chuck 10.When being equipped with substrate on the chuck 10, protuberance passes through a plurality of points and supporting substrate.At this moment, between the part and substrate beyond the protuberance on the surface of chuck 10, formed the space.Dike is the continuous wall of Rack, and formed space between part beyond the protuberance on the surface of chuck 10 and the substrate is divided into a plurality of regions of no pressure.Dike is that non-rectilinear constitutes by irregular line so that the back side transfer printing that the surface configuration of chuck 10 is carried out when being etched to substrate surface when taking place human eye be difficult to identification.Adsorption hole is being provided with a plurality of with the part of interval beyond the protuberance on the surface of chuck 10 and dike of regulation, the vacuum draw of each region of no pressure of carrying out being divided by dike.
In addition, on chuck 10, the last ejector pin of not shown a plurality of substrate reception/handing-over usefulness is being set.The last ejector pin of substrate reception/handing-over usefulness rises from the surface of chuck 10, when mounting substrate on chuck 10, receives substrate in the never illustrated substrate transferring robot, and when from chuck, unloading carried base board, to not shown substrate transferring robot handing-over substrate.
Among Fig. 3, near the central portion of chuck 10, a plurality of openings that following last ejector pin unit is inserted are being set, are being installed with on the said opening and cover 13, lid 13 is provided with through hole, is inserted with ejector pin 12 from covering 13 below in the said through hole.Moreover, in this embodiment, near the central portion of chuck 10, be provided with 16 openings, but the position of opening and quantity are not limited thereto.
Fig. 4 a is the vertical view of opening set on the chuck, and Fig. 4 b is the sectional view of the A-A part of Fig. 4 a.In addition, Fig. 5 a is the vertical view of opening set on the chuck, and Fig. 5 b is the sectional view of the B-B part of Fig. 5 a.Last ejector pin unit comprises following part and constitutes: motor 11, go up ejector pin 12, lid 13, flange 14, screw 15 and 17 and stop screw 16.
Motor 11 comprises impulse motor (pulse motor), is connected in the ball screw (ball screw) of impulse motor, and bar (rod) and constituting, and drives the ball screw by impulse motor, makes the bar that is accommodated in the 11a of bar incorporating section rise and descend thus.Front end at the bar of motor 11 is installed with ejector pin 12.
Among Fig. 4 b, the upper surface at the bar incorporating section of motor 11 11a is installed with flange 14, and flange 14 is to be fixed on through screw 15 to cover 13 the back side.On the other hand, the open circumferential at the back side of chuck 10 is equipped with and is supporting the back up pad 18 of covering 13 ring-type.Back up pad 18 is the back side that is fixed on chuck 10 through screw 19.
Among Fig. 4 a and Fig. 5 a,, the hole that the section of having of screw that stop screw 16 is screwed into and 17 break-through of screw differs from is being set at a plurality of positions of lid 13 periphery.Among Fig. 4 b, lid 13 is that the screw 17 of institute's break-through in the hole that differs from through the section of having of covering 13 periphery is fixed on the back up pad 18.Among Fig. 5 b, stop screw 16 is threaded in the screw that covers 13 periphery, and outstanding and contact with the upper surface of back up pad 18 from covering 13 bottom surface.
In this embodiment, in the time will going up the ejector pin unit and be installed in the chuck 10, at first, last ejector pin unit is inserted into opening from the top of chuck 10, regulates the amount of being screwed into of stop screw 16, to regulate the setting height(from bottom) of ejector pin unit.Then, utilize screw 17 will cover 13 and be fixed on the back up pad 18, and will go up the ejector pin unit and be installed on the chuck 10.Owing to be that last ejector pin unit is inserted into opening from the top of chuck 10; And regulate setting height(from bottom) to be installed on the chuck 10 through stop screw 16; Even if so near the central portion for the chuck that is difficult to arrive from the outside of chuck 10 with hand or anchor clamps, the adjusting of also going up the setting height(from bottom) of ejector pin unit from the top of chuck 10 easily.Therefore, even if chuck 10 is maximized, also regulate the height of going up ejector pin 12 easily along with the maximization of substrate.
Fig. 6 is the synoptic diagram that the control system of ejector pin unit is gone up in expression.Last ejector pin Drive and Control Circuit 50 is through the control of main control unit 80 motor of ejector pin unit on each 11 to be specified the mobile destination of going up ejector pin 12, and indication is gone up ejector pin 12 and moved to mobile destination.The inside of motor 11 has scrambler (encoder), when last ejector pin 12 when the mobile destination of being indicated arrives specialized range, scrambler makes progress, and 50 outputs of ejector pin Drive and Control Circuit are a kind of representes to move the end signal that has finished.
Below, the mask transfer method of the proximity printing device of an embodiment of the present invention is explained.Among Fig. 2, the sky at the chuck 10 at mask receiving position place is disposing distance piece setting device 31 and wide visual field camera 51.Fig. 7 is the synoptic diagram of the configuration of expression distance piece setting device and wide visual field camera.Among Fig. 7, the mask of moving into through mask transfer robot 40 2 dots.Distance piece setting device 31 is configured in the top of the periphery of mask 2, is described below, and protects the surface of distance piece 30 from the top of chuck 10 to chuck 10 to be provided with mask.Wide visual field camera 51 is configured in the top of position probing set on the mask 2 with mark, obtains the image of the position probing of mask 2 with mark.
Fig. 8 a is the vertical view of mask protection distance piece, and Fig. 8 b is the side view from the observed mask protection of the arrow C direction of Fig. 8 a distance piece, and Fig. 8 c is the side view from the observed mask protection of the arrow D direction of Fig. 8 a distance piece.Mask protection distance piece 30 has: tabular surface 30a, than the high section difference face 30b of tabular surface 30a and be arranged on tabular surface 30a and section difference face 30b between dip plane 30c.In the side of mask protection distance piece 30, shown in Fig. 8 b and Fig. 8 c, the groove 30d that extends to horizontal direction is being set.When the last ejector pin that mask 2 is being set 12 descended, the edge of the pattern plane of mask 2 (lower surface) was tilted face 30c guiding, tabular surface 30a touch mask pattern plane (lower surface) the periphery that does not form pattern and support mask 2.
Fig. 9 a is the side view of distance piece setting device, and Fig. 9 b is the front view of distance piece setting device.Distance piece setting device 31 comprises with the lower part and constituting: cylinder platform (air cylinder table) 32, chuck pedestal (chuck base) 33, air chuck (air chuck) 34, support (bracket) 35, clamp (clamp) 36, and pawl 37.Cylinder platform 32 utilizes the pressure of the air that never illustrated air hydraulic circuit supplies with and drives cylinder (air cylinder), and platform 32a is moved towards the drawing lower direction.On the platform 32a of cylinder platform 32, it is the chuck pedestal 33 of L font that section is installed, and in the lower end of chuck pedestal 33, air chuck 34 is installed.Shown in Fig. 9 b, be connected on two supports 35 of air chuck 34,36, two clamps 36 of clamp are installed respectively under the driving of air chuck 34, move and open and close towards the drawing Width of Fig. 9 b.On each clamp 36; Pawl 37 is being set, and said pawl 37 is hung among the set groove 30d in the side of mask protection distance piece 30, and two clamps 36 are under the state that closes shown in Fig. 9 b; Pawl 37 is hung among the groove 30d of mask protection distance piece 30, to keep mask protection distance piece 30.
Figure 10 is the synoptic diagram that the action to the distance piece setting device describes.Before mask 2 was moved into chuck 10, distance piece setting device 31 protected distance piece 30 to be arranged on the surface of chuck 10 mask.Before mask protection distance piece 30 was set, shown in Figure 10 a, the platform 32a of cylinder platform 32 was in the state of rising, and clamp 36 protects distance piece 30 to remain on the sky of chuck 10 mask.When mask protection distance piece 30 was set, shown in Figure 10 b, distance piece setting device 31 descended the platform 32a of cylinder platform 32, thereby the mask protection distance piece 30 that remains in the clamp 36 is moved towards the surface of chuck 10.Then, open clamp 36, protect distance piece 30 to be placed on the surface of chuck 10 mask.Afterwards, shown in Figure 10 c, distance piece setting device 31 makes the platform 32a of cylinder platform 32 rise once more, wait for.When from chuck 10, reclaiming mask protection distance piece 30, carry out and above-mentioned opposite action.
Moreover; In this embodiment; It is the sky that distance piece setting device 31 is configured in chuck 10; And protect the surface of distance piece 30 to be provided with the mask from the top of chuck 10 to chuck 10, but also can protect distance piece to be built in the chuck 10 mask, and mask protection distance piece is risen from the surface of chuck 10.
Figure 11 is the vertical view that is provided with the chuck of mask protection distance piece.Be provided with the mask 2 shown in the dotted line on ejector pin 12 when descending, the mask protection distance piece 30 that is arranged on the surface of chuck 10 touch mask 2 pattern plane (lower surface) the periphery that does not form pattern and support mask 2.The pattern plane (lower surface) that like this, can prevent mask 2 touches surface and the pattern of lesions of chuck 10.
Figure 12 is the synoptic diagram that the action to last ejector pin unit and mask transfer robot describes.When moving into mask 2 in the chuck 10, at first, on each the motor 11 of ejector pin unit ejector pin 12 is risen (Figure 12 a).Mask transfer robot 40 makes the motion arm 41 that mask 2 is being set move towards the sky of chuck 10 that (Figure 12 a).Then, mask transfer robot 40 descends motion arm 41, mask 2 is arranged on (Figure 12 b) on the ejector pin 12, and motion arm 41 is further descended, so that the mask support portion 41a of motion arm 41 leaves mask 2 (Figure 12 c).Like this, ejector pin 12 receives mask 2 from mask transfer robot 40 on each.Then, mask transfer robot 40 makes motion arm 41 keep out of the way (Figure 12 d) from the sky of chuck 10.
Because a plurality of ejector pin unit of going up are being set on the chuck 10; It has last ejector pin 12 that rises from the inside of chuck 10 and the impulse motor 11 that ejector pin is moved up and down; And through last ejector pin 12 and from mask transfer robot 40 reception masks 1; Even if, also can mask 2 be moved in the chuck 10 so mask 2 is littler than the substrate that carries on chuck 10.
Make chuck 10 from the mask receiving position when move the mask installation site, the motor 11 of ejector pin unit descends ejector pin 12 on each, thereby mask 2 is arranged on the mask protection distance piece 30.When from chuck 10, taking out of mask 2, carry out and above-mentioned opposite action.
Figure 13 is illustrated in the synoptic diagram that the mask receiving position is moved into mask the state in the chuck.The wide visual field camera 51 that the sky disposed at the chuck 10 at mask receiving position place has the low and wider visual field of resolution than movable camera 52 of following high resolving power and high resolving power fixed camera 54; With the position probing of obtaining the mask 2 that is arranged on the ejector pin 12 image, and picture signal outputed to the image processing apparatus 55 of Fig. 1 with mark.The picture signal that 55 pairs of wide visuals field of image processing apparatus camera 51 is exported is handled, to detect the position of mask 2.From the position of the received mask 2 of mask transfer robot 40 even if bigger skew takes place by last ejector pin 12; Also can use wide visual field camera 51 to obtain the image of the position probing of mask 2 at short notice, thereby detect the position of mask 2 in the short time at mask receiving position place with mark.
Among Fig. 1; Main control unit 80 is handled the picture signal of 55 pairs of wide visuals field of image processing apparatus camera 51 and the position Detection result of detected mask 2 imports; And compare with the reference position of mask 2 at the mask receiving position place of storage in advance, with the side-play amount of the position of detecting mask 2.Then; 80 pairs of X platforms of main control unit driving circuit 71, Y platform driving circuit 72, and theta stage driving circuit 73 control; Utilize X platform 5, Y platform 7, and theta stage 8 move chuck 10, the mask installation site of mask 2 20 belows from the mask receiving position towards mask holder is moved.At this moment; Main control unit 80 is according to the coordinate of the reference position of the mask of storing in advance 2 and the coordinate of mask installation site; Decide X platform 5, Y platform 7, and the amount of movement of theta stage 8, and revise the amount of movement that is determined according to the side-play amount of the position of detected mask 2.
Owing to be the position of detecting mask 2 at the mask receiving position; And according to the position of detected mask 2; Utilize X platform 5, Y platform 7, and theta stage 8 move chuck 10; So that mask 2 moves towards the mask installation site from the mask receiving position, so even if mask receiving position place by on ejector pin 12 squint to some extent from the position of the received mask 2 of mask transfer robot 40, also can make mask 2 precision move to the mask installation site well.
Figure 14 is the vertical view of mask holder.On mask holder 20, the opening of the big figure of the opening 20a that passes than exposure light is being set, in the inboard of this opening, be formed with the opening 20a that exposure light is passed through the 21a of retainer portion, 21b.The 21a of retainer portion, 21b are installed in the lower surface of mask holder 20, and the ratio mask holder 20 of the 21a of retainer portion, 21b more dots near the part of below.The 21a of retainer portion, 21b carry out vacuum suction to the periphery of the mask shown in the dotted line 2 and are keeping.Among the 21a of retainer portion,, be provided with following mask position detection window,, disposing movable camera 52 of high resolving power and high resolving power fixed camera 54 in the sky of mask position detection window in the position probing of mask 2 position with mark.The movable camera 52 of high resolving power is installed in the mobile camera moving mechanism 53, through mobile camera moving mechanism 53 above mask holder 20 towards directions X and the Y direction moves and rotate towards the θ direction.High resolving power fixed camera 54 is fixed on the top of mask holder 20.
Figure 15 is the synoptic diagram that the action that mask is installed on mask holder is described.In the mask installation site, when being installed to mask on the mask holder, at first, (Figure 15 a) till with the consistent height of the focus of the movable camera 52 of mark and high resolving power for the position probing that the motor 11 of ejector pin unit rises to ejector pin 12 to make mask 2 on each.The movable camera 52 of high resolving power obtains the image of the position probing of mask 2 with mark through the mask position detection window 22 that is arranged on the 21a of retainer portion.At this moment; When the position of the mask 2 that present dynasty moves the mask installation site has the position probing that squints and make mask 2 to depart from the visual field of the movable camera 52 of high resolving power with mark slightly; Utilize mobile camera moving mechanism 53 to move the movable camera 52 of high resolving power, so that the position probing of mask 2 enters into the visual field of the movable camera 52 of high resolving power with mark.Movable camera 52 picture signals with the image that is obtained of high resolving power output to the image processing apparatus 55 of Fig. 1.The picture signal that the movable camera 52 of 55 pairs of high resolving power of image processing apparatus is exported is handled, to detect the position of mask 2.
Among Fig. 1; Main control unit 80 is handled the picture signal of 55 pairs of movable cameras 52 of high resolving power of image processing apparatus and the position Detection result of detected mask 2 imports; And compare with the reference position of mask 2 of the mask installed position of storage in advance, with the side-play amount of the position of detecting mask 2.Then; Main control unit 80 is controlled X platform driving circuit 71, Y platform driving circuit 72, is reached theta stage driving circuit 73 according to the side-play amount of the position of detected mask 2; With utilize X platform 5, Y platform 7, and theta stage 8 move chuck 10, carry out the location of mask 2.In the mask installation site, even if squint to some extent in the position of mask 2, also can use the movable camera 52 of high resolving power and precision detects the position of mask 2 well, thereby precision is carried out the location of mask 2 well.
Among Figure 15, after finished the location of mask 2, the motor 11 of ejector pin unit further rose ejector pin 12 on each, and mask 2 is pressed into the 21a of retainer portion, 21b (Figure 15 b).The sky at the mask 2 that is pressed into the 21a of retainer portion, 21b is being provided with negative pressure glass 23, between negative pressure glass 23 and mask 2, is formed with negative pressure chamber.Be provided with not shown adsorption tank among the 21a of retainer portion, the 21b, after the pressure in negative pressure chamber was controlled, the 21a of retainer portion, 21b carried out vacuum suction through not shown adsorption tank to the periphery of mask 2.
Because be utilize X platform 5, Y platform 7, and theta stage 8 move chuck 10 and carry out the location of mask 2; And through last ejector pin 12 mask 2 is installed on the mask holder 20, so the mask of moving in the chuck 10 2 can be through X platform 5, Y platform 7, and theta stage 8 and precision is located to be installed on the mask holder 20 well.
After the 21a of retainer portion, 21b carry out vacuum suction to mask 2; High resolving power fixed camera 54 is obtained the image of the position probing of mask 2 with mark through the mask position detection window 22 that is arranged on the 21a of retainer portion, and picture signal is outputed to the image processing apparatus 55 of Fig. 1.The picture signal that 55 pairs of high resolving power fixed camera 54 of image processing apparatus are exported is handled, to detect the position of mask 2.
Among Fig. 1; Main control unit 80 is handled the picture signal of 55 pairs of high resolving power fixed camera 54 of image processing apparatus and the position Detection result of detected mask 2 imports; And compare with the reference position of mask 2 of the mask installed position of storage in advance; With the side-play amount of the position of detecting mask 2, and judge whether to carry out the position correction of mask 2.In this embodiment, detect in that the movable camera 52 of high resolving power is moved under the situation of position of mask 2, in the position Detection result of mask 2, comprise the displacement error of the movable camera 52 of high resolving power.Therefore, might make according to the picture signal of 55 pairs of movable cameras 52 of high resolving power of image processing apparatus and handle and the reference position of the position deviation mask 2 of the mask 2 that locate the position of detected mask 2.
When needs carry out the position correction of mask 2, remove the vacuum suction of mask 2, the pressure in the negative pressure chamber is returned to after the atmospheric pressure, make ejector pin 12 declines and make mask 2 leave the 21a of retainer portion, 21b.Then; Main control unit 80 is according to the side-play amount of the position of detected mask 2; Come to X platform driving circuit 71, Y platform driving circuit 72, and theta stage driving circuit 73 control, and utilize X platform 5, Y platform 7, and theta stage 8 move chuck 10, with the position of mask correction 2.Use is fixed on the high resolving power fixed camera 54 of mask holder 20 tops, and further precision detects the position of mask 2 well, revises well thereby precision is carried out in the position of oriented mask 2.
After the position correction of having carried out mask 2, the motor 11 of ejector pin unit rises ejector pin 12 once more on each, and mask 2 is pressed into the 21a of retainer portion, 21b.After the pressure in the negative pressure chamber was controlled, the 21a of retainer portion, 21b utilized not shown adsorption tank and mask 2 are carried out vacuum suction.After the installation of mask 2 finished, the motor 11 of ejector pin unit made ejector pin 12 declines (Figure 15 c) on each.Then, make chuck 10 return to the mask receiving position, from chuck 10, reclaim mask protection distance piece 30 through distance piece setting device 31.
In the exposure of substrate, when carrying out the gap alignment of mask 2 and substrate or when mask 2 and substrate separate, receive the extruding or the stretching of the air between mask 2 and the substrate, the mask 2 that remains on the mask holder 20 can be crooked.And when crooked mask 2 recovered former state, the off normal of mask 2 may take place.In this embodiment, preventing offsetting pin unit is being set at the lower surface of mask holder so that mask 2 and substrate near the time or when mask 2 and substrate are separated, prevent the off normal of mask 2.
Figure 16 is the synoptic diagram that expression is arranged on the preventing offsetting pin unit of mask holder lower surface.In this example, use reference pins and be used as the preventing offsetting pin by these two kinds of pins of pad.The preventing offsetting pin unit of reference pins comprises reference pins 61, impulse motor 62, ball screw 63, and feeler 64 and constituting, and is arranged on a side on the relative both sides of mask 2.Comprise by the preventing offsetting pin unit of pad and to push pin 66 and cylinder 67 and constitute, and be arranged on the opposite side on the relative both sides of mask 2.
Moreover; In this embodiment; Preventing offsetting pin unit that reference pins is being set and preventing offsetting pin unit, but also can replace the preventing offsetting pin unit that reference pins is set by the preventing offsetting pin unit of pad by pad, with all preventing offsetting pin unit all as the preventing offsetting pin unit of reference pins.In addition, in this embodiment, be provided with two preventing offsetting pin unit, and short brink is provided with a preventing offsetting pin unit, but the quantity of preventing offsetting pin unit and position can be according to the sizes of mask 2 and suitably decision at the long side of mask 2.
Figure 17 is the synoptic diagram that the action to the preventing offsetting pin unit of reference pins describes.Connecting ball screw 63 on the impulse motor 62, reference pins 61 and feeler 64 are being installed on the nut of ball screw 63.Drive through 62 pairs of ball screws 63 of impulse motor reference pins 61 and feeler 64 are moved towards the side of mask 2.Shown in Figure 17 a, the leading section of feeler 64 has only been given prominence to distance B than the front end of reference pins 61.
The reference pins Drive and Control Circuit 65 paired pulses motors 62 of Figure 16 are controlled, so that reference pins 61 and feeler 64 move towards the side of mask 2.The leading section of feeler 64 can be subjected to displacement when running into the side of mask 2, and 64 pairs of these displacements of feeler detect, and detection signal is outputed to reference pins Drive and Control Circuit 65.Shown in Figure 17 a, do not touch at the leading section of feeler 64 under the state of side of mask 2, the displacement of the leading section of feeler 64 becomes zero.Shown in Figure 17 b, if the leading section of feeler 64 touches the side of mask 2, subsequently, it is identical with the amount of movement of reference pins 61 and feeler 64 that the displacement of the leading section of feeler 64 will become.
Become amount of movement with reference pins 61 and feeler 64 when identical at the displacement of the leading section of feeler 64, reference pins Drive and Control Circuit 65 makes the translational speed of reference pins 61 and feeler 64 slower.Reference pins 61 and feeler 64 are moved further with low speed; And shown in Figure 17 c; When the front end of reference pins 61 touched the side of mask 2, even if reference pins 61 and feeler 64 are moved, the displacement of the leading section of feeler 64 can not change yet.When the displacement of the leading section of feeler 64 no longer changed after the front end of reference pins 61 touches the side of mask 2, reference pins Drive and Control Circuit 65 stopped reference pins 61 and the mobile of feeler 64.Because the mobile of reference pins 61 stopped, therefore mask 2 being pressed onto on the reference pins 61 and can not squint in the position of the mask 2 of location.
Among Figure 16, touch the side of mask 2 at the front end that makes reference pins 61 after, press 68 pairs of cylinder 67 air supplies of pad Drive and Control Circuit, cylinder 67 will be pressed into the side of mask 2 by pad 66.Make mask 2 and substrate near the time, or when mask 2 and substrate were separated, if remain on mask 2 bendings on the mask holder 20, then moved towards the center position of mask the side of mask 2.Reference pins 61 is not followed the moving of side of mask 2, and the front end of reference pins 61 is left in the side of mask 2.Follow the moving and moving of side of mask 2 by pad 66.When crooked mask 2 recovered former states, the side of reference pins 61 sides of mask 2 can touch reference pins 61 and be positioned, and the side by pad 66 sides of mask 2 overcomes by the pressing force of pad 66 and returns to initial position.Therefore, can prevent make mask 2 and substrate near the time, or the off normal of mask when mask 2 and substrate are separated.
According to embodiment discussed above, utilize mask transfer robot 40 that mask 2 is moved into chuck 10, ejector pin 12 in the utilization and receive masks 2 from mask transfer robot 40; And move the movable camera 52 of high resolving power through mobile camera moving mechanism 53; Obtain the image of the position probing of mask 2 through the movable camera 52 of high resolving power, the picture signal of the movable camera 52 of high resolving power is handled, to detect the position of mask 2 with mark; And according to the position of detected mask 2; Utilize X platform 5, Y platform 7, and theta stage 8 move chuck 10, carry out the location of mask 2, ejector pin 12 is installed to mask 2 on the mask holder 20 in the utilization; Like this, but precision locate well than the little mask 2 of substrate and attach it to mask holder 20.
And then utilization is fixed on the high resolving power fixed camera 54 of mask holder 20 tops and obtains the image of the position probing of mask 2 with mark, and the picture signal of high resolving power fixed camera 54 is handled; To detect the position of mask 2; And according to the position of detected mask 2, utilize X platform 5, Y platform 7, and theta stage 8 move chuck 10, the position of oriented mask 2 is revised; Like this; Use is fixed on the high resolving power fixed camera 54 of mask holder 20 tops, and further precision detects the position of mask 2 well, precision is carried out in the position of oriented mask 2 revise well.
And then; With mask holder 20 below the mask receiving position place that is provided with in addition, different ground, mask installation site pass through on ejector pin 12 and from mask transfer robot 40, receive mask 2; The wide visual field camera 51 that utilization has the visual field low and wider than the resolution of the movable camera 52 of high resolving power obtains the image of the position probing of mask 2 with mark; The picture signal of wide visual field camera 2 is handled and detected the position of mask 2; And according to the position of detected mask 2, utilize X platform 5, Y platform 7, and theta stage 8 move chuck, mask 2 is moved to the mask installation site from the mask receiving position; Like this; Even if bigger skew takes place the position by last ejector pin 12 received mask 2 from mask transfer robot 40, also can detect the position of mask 2 in the short time, thereby can mask 2 precision be moved to the mask installation site well at mask receiving position place.
And then; A plurality of mask protection distance pieces 30 of the periphery of the pattern plane that when ejector pin 12 descends, can touch mask 2 are being set on the surface of chuck 10; Like this; Even if former thereby cause that going up ejector pin 12 descends because of some, the pattern plane that also can prevent mask 2 touches surface and the pattern of lesions of chuck 10.
And then; A plurality of preventing offsetting pins unit is being set on mask holder 20; Said a plurality of preventing offsetting pins unit have with the contacts side surfaces that remains on the mask 2 on the mask holder 20 with the reference pins 61 that prevents mask 2 off normals, reference pins 61 moved and touch impulse motor 62 and the feeler 64 of the side that detection reference pin 61 touches mask 2 of the side of mask 2; And; Impulse motor 62 to each preventing offsetting pin unit is controlled, and reference pins 61 is moved towards the side of mask 2, and according to the testing result of feeler 64 the mobile of reference pins 61 is stopped; Like this, under the situation that oriented mask 2 can not misplace can make mask 2 and substrate near the time, or when mask 2 and substrate are separated, prevent the off normal of mask 2.
Use proximity printing device of the present invention to carry out the exposure of substrate; Perhaps use the mask transfer method of proximity printing device of the present invention and mask is installed on the mask holder; And carry out the exposure of substrate, like this, but precision is carried out the location of mask well; Therefore but precision is carried out the transfer printing of pattern well, thereby produces high-quality display panel substrate.
For example, Figure 18 be the expression LCD device the TFT substrate manufacturing process one the example process flow diagram.Form in the operation (step 101) at film; Utilize sputter (sputtering) method or PCVD (Chemical Vapor Deposition; CVD) method etc. forms the film of electric conductor film or the insulator film etc. of the transparency electrode of using as liquid crystal drive on substrate.In resist (resist) painting process (step 102), utilize rolling method to wait and be coated with photosensitive resin material (photoresist (photoresist)), form at film and form the photoresistance film on the formed film of operation (step 101).In exposure process (step 103), use proximity printing device or projection aligner etc., with the pattern transfer of mask to the photoresistance film.In developing procedure (step 104), use shower (shower) development method etc. and developer solution is supplied on the photoresistance film, to remove the redundance of photoresistance film.In etching (etching) operation (step 105),, film is formed the part that is not hidden by the photoresistance film in the film that forms in the operation (step 101) remove through Wet-type etching (wetetching).In stripping process (step 106), utilize stripper that the photoresistance film of the covering effect of accomplishing in the etching work procedure (step 105) is peeled off.Before or after said each operation, implement the washing/drying operation of substrate as required.Said operation is carried out several repeatedly, on substrate, form tft array (array).
In addition, Figure 19 be LCD device colored filter substrate manufacturing process one the example process flow diagram.Form in the operation (step 201) at black matrix (black matrix),, on substrate, form black matrix through resist-coated, exposure, development, etching, the processing of peeling off etc.Form in the operation (step 202) at colored pattern,, on substrate, form colored pattern through decoration method, pigment dispersing method, print process, electro-deposition (electrodeposition) method etc.To the colored pattern of R, G, B and carry out said operation repeatedly.Form in the operation (step 203) at diaphragm, on colored pattern, form diaphragm, form in the operation (step 204), on diaphragm, form ELD at ELD.Before said each operation, midway or after, implement the washing/drying operation of substrate as required.
In the exposure process (step 103) of the manufacturing process of TFT substrate shown in Figure 180, the black matrix of the manufacturing process of colored filter substrate shown in Figure 19 forms operation (step 201) and colored pattern forms in the exposure-processed of operation (step 202), can use proximity printing device of the present invention or the mask transfer method near the formula plate exposure apparatus of the present invention.
The above only is preferred embodiment of the present invention, is not the present invention is done any pro forma restriction; Though the present invention discloses as above with preferred embodiment; Yet be not in order to limiting the present invention, anyly be familiar with the professional and technical personnel, in not breaking away from technical scheme scope of the present invention; When the method for above-mentioned announcement capable of using and technology contents are made a little change or be modified to the equivalent embodiment of equivalent variations; In every case be the content that does not break away from technical scheme of the present invention, to any simple modification, equivalent variations and modification that above embodiment did, all still belong in the scope of technical scheme of the present invention according to technical spirit of the present invention.

Claims (12)

1. proximity printing device; Comprise: the mask holder of the chuck of mounted board, maintenance mask and the platform that moves said chuck; Between mask and substrate, be provided with small gap, arrive substrate with the pattern transfer with mask, this proximity printing device is characterised in that and comprises:
First control gear of controlling that moves to said platform;
Mask is moved into the mask transfer device of said chuck;
A plurality of ejector pin unit of going up have the last ejector pin that rises from said chuck inside and make the motor that ejector pin moves up and down on this, and are installed on the said chuck respectively independently;
First image acquiring device obtains the position probing that is arranged on the mask image with mark, and output image signal;
The travel mechanism that said first image acquiring device is moved; And
Image processing apparatus is handled the picture signal that said first image acquiring device is exported, and detects the position of the XY direction of mask, and
Said a plurality of ejector pin unit of going up receives mask through said upward ejector pin from said mask transfer device;
Said first control gear is handled the picture signal of said first image acquiring device according to said image processing apparatus and the position of the XY direction of detected mask utilizes said platform to move said chuck, to carry out the location of mask;
Said a plurality of ejector pin unit of going up is installed to mask on the said mask holder through said upward ejector pin.
2. proximity printing device according to claim 1 is characterized in that:
Comprise second image acquiring device, be fixed on the top of said mask holder, obtain the image of the position probing of mask with mark, and output image signal,
The picture signal that said image processing apparatus is exported said second image acquiring device is handled, with the position of detection mask,
Said first control gear is handled and the position of detected mask the picture signal of said second image acquiring device according to said image processing apparatus, utilizes said platform to move said chuck, and the position of oriented mask is revised.
3. proximity printing device according to claim 2 is characterized in that:
Comprise the 3rd image acquiring device; In the sky that receives the mask receiving position of mask through ejector pin on said from said mask transfer device; The 3rd image acquiring device has the visual field low and wider than the resolution of said first image acquiring device; Obtain the image of the position probing of mask with mark, and output image signal
The picture signal that said image processing apparatus is exported said the 3rd image acquiring device is handled, with the position of detection mask,
Said first control gear is handled and the position of detected mask the picture signal of said the 3rd image acquiring device according to said image processing apparatus; Utilize said platform to move said chuck, mask is moved to the mask installation site of said mask holder below from the mask receiving position.
4. according to each described proximity printing device in the claim 1 to 3, it is characterized in that:
Comprise a plurality of distance pieces, be arranged on the surface of said chuck, when carrying the said periphery that touches the pattern plane of mask when ejector pin descends of going up of putting mask.
5. according to each described proximity printing device in the claim 1 to 3, it is characterized in that comprising:
A plurality of preventing offsetting pins unit; Have with the contacts side surfaces that remains on the mask on the said mask holder with the preventing offsetting pin that prevents the mask off normal, make this preventing offsetting pin move and touch the motor of mask side and detect the sensor that this preventing offsetting pin joint contacts the mask side face, and said a plurality of preventing offsetting pins unit is installed on the said mask holder; And
Second control gear that the motor of each preventing offsetting pin unit is controlled, and
Said second control gear is controlled the motor of each preventing offsetting pin unit, and said preventing offsetting pin is moved towards the side of mask, and according to the testing result of said sensor the mobile of said preventing offsetting pin is stopped.
6. the mask transfer method of a proximity printing device; This proximity printing device comprises the chuck of mounted board, the mask holder that keeps mask and the platform of mobile chuck; Between mask and substrate, be provided with small gap; Pattern transfer with mask arrives substrate, and the mask transfer method of this proximity printing device is characterised in that:
A plurality of ejector pin unit of going up are arranged on respectively on the chuck independently, and said a plurality of ejector pin unit of going up have from inner last ejector pin that rises of chuck and the motor that ejector pin is moved up and down;
First image acquiring device and travel mechanism that first image acquiring device is moved are set, and said first image acquiring device obtains the position probing that is arranged on the mask image with mark, and output image signal;
Utilize the mask transfer device that mask is moved into chuck;
Receive mask through last ejector pin from the mask transfer device;
Utilize travel mechanism to move first image acquiring device, and utilize first image acquiring device and obtain the image of the position probing of mask with mark;
Picture signal to first image acquiring device is handled, with the position of the XY direction that detects mask;
Position according to the XY direction of detected mask utilizes platform to move chuck, carries out the location of mask;
Through last ejector pin mask is installed on the mask holder.
7. the mask transfer method of proximity printing device according to claim 6 is characterized in that:
Second image acquiring device is set, and this second image acquiring device is fixed on the top of mask holder, obtains the image of the position probing of mask with mark, and output image signal;
Utilize second image acquiring device and obtain the image of the position probing of mask with mark;
Picture signal to second image acquiring device is handled, to detect the position of mask;
According to the position of detected mask, utilize platform to move chuck, the position of oriented mask is revised.
8. the mask transfer method of proximity printing device according to claim 7 is characterized in that:
With mask holder below the mask receiving position place that is provided with in addition, different ground, mask installation site, receive mask through last ejector pin from the mask transfer device;
The 3rd image acquiring device is arranged on the top of mask receiving position, and said the 3rd image acquiring device has the visual field low and wider than the resolution of first image acquiring device, with the position probing of obtaining mask image with mark, and output image signal;
Utilize the 3rd image acquiring device and obtain the image of the position probing of mask with mark;
Picture signal to the 3rd image acquiring device is handled, to detect the position of mask;
According to the position of detected mask, utilize platform to move chuck, mask is moved to the mask installation site from the mask receiving position.
9. according to the mask transfer method of each described proximity printing device in the claim 6 to 8, it is characterized in that:
A plurality of distance pieces are arranged on the surface of chuck, said a plurality of distance pieces carry putting mask on ejector pin touch the periphery of the pattern plane of mask when descending.
10. according to the mask transfer method of each described proximity printing device in the claim 6 to 8, it is characterized in that:
A plurality of preventing offsetting pins unit is arranged on the mask holder, said a plurality of preventing offsetting pins unit have with the contacts side surfaces that remains on the mask on the said mask holder with the preventing offsetting pin that prevents the mask off normal, said preventing offsetting pin is moved and touch said mask the side motor and detect the sensor that said preventing offsetting pin joint contacts the side of said mask;
Motor to each preventing offsetting pin unit is controlled, and said preventing offsetting pin is moved towards the side of mask, and according to the testing result of said sensor the mobile of said preventing offsetting pin is stopped.
11. the manufacturing approach of a display panel substrate is characterized in that:
Each described proximity printing device carries out the exposure of substrate in the use claim 1 to 5.
12. the manufacturing approach of a display panel substrate is characterized in that:
Use the mask transfer method of each described proximity printing device in the claim 6 to 10, mask is installed on the mask holder, carry out the exposure of substrate.
CN2009101788730A 2008-11-10 2009-10-09 Proximity exposure apparatus, method of delivering a mask of a proximity exposure apparatus and method of manufacturing a display panel substrate Expired - Fee Related CN101738870B (en)

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JP2008-287941 2008-11-10

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JP2017183298A (en) * 2014-08-20 2017-10-05 株式会社ニコン Exposure apparatus, exposure method, and apparatus manufacturing method
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