JP5878821B2 - Pattern forming device - Google Patents

Description

  The present invention relates to an apparatus for performing pattern formation on a carrier by an object or pattern formation on an object by a carrier by bringing the carrier into contact with a plate-like object.

  As such an apparatus, for example, the invention described in Patent Document 1 has been known. In the present invention, after a blanket (support) and a plate (object) are brought into contact with each other to form a pattern layer on the blanket, the pattern layer formed on the blanket and the substrate (object) are brought into contact with each other to form a pattern. Transfer the layer to the substrate.

JP 2010-158799 A

  In such a technique, the object needs to be brought into contact with the carrier while being held at a predetermined position. However, Patent Document 1 does not specifically describe how to hold the object. Here, as a technique for holding the object, for example, an adsorption technique can be used. This is a technique for sucking and holding an object by supplying a negative pressure to a suction means such as a suction pad to create a vacuum state. However, holding the object by suction may cause the following problems. That is, when a plate-like object such as a plate or a substrate is sucked and held, these sucked portions are locally dented, and there is a possibility that pattern formation may not be performed well in those portions. Further, when a plate-like object is adsorbed at a plurality of locations in an area facing the pattern formation area of the carrier, the flatness of the object is deteriorated due to the difference in adsorption intensity, which may cause pattern formation failure. It was.

  This invention is made | formed in view of the said subject, and it aims at providing the pattern formation apparatus which can perform pattern formation satisfactorily.

A pattern forming apparatus according to a first aspect of the present invention is a pattern forming apparatus that forms a pattern by bringing a pattern forming region on a carrier into contact with a plate-like object in order to achieve the above object. comprises a negative pressure supply means for supplying a negative pressure, and a suction means for holding suction an object by a negative pressure supplied from the negative pressure supply means, suction means, the patterning of the suction surface for attracting and holding an object A suction plate provided with an opening to which negative pressure is supplied from the negative pressure supply means on the outside of the area facing the area, and a plurality of objects for locally adsorbing objects in an area outside the pattern formation area of the object A local adsorption portion of the object, and adsorbs the outside of the area facing the pattern formation area during pattern formation of the object, and the opening defines an area of the adsorption surface that faces the pattern formation area during pattern formation. Ri surround is formed as a suction groove, the plurality of local suction unit, characterized in that it is arranged outside the suction grooves of the suction plate.
In order to achieve the above object, a pattern forming apparatus according to a second aspect of the present invention is a pattern forming apparatus that forms a pattern by bringing a pattern forming region on a carrier into contact with a plate-like object. A suction plate having an opening capable of sucking and holding the object. The suction plate includes: a negative pressure supplying means for supplying a negative pressure; and a suction means for sucking and holding the object by the negative pressure supplied from the negative pressure supply means. And a plurality of local suction parts that can hold and hold a plurality of local areas that are narrower than the area that the suction plate can hold and hold, and suck the outside of the object that faces the pattern formation area during pattern formation The opening is formed outside a region of the suction plate that faces the pattern formation region during pattern formation, and the plurality of local suction portions face the pattern formation region during pattern formation. And at least a part of the plurality of local suction portions is a suction pad that can be elastically deformed in a direction in which the object and the carrier are separated after contacting the object and the carrier. It is characterized by.

  According to the present invention, the outside of an area (hereinafter referred to as “effective area”) facing a pattern formation area on a carrier during pattern formation is adsorbed among plate-like objects. That is, since the effective area of the object is not attracted, it is possible to prevent the occurrence of local dents and the decrease in flatness due to the attracting in the effective area. As a result, pattern formation can be performed satisfactorily.

  Here, in the pattern forming apparatus according to the present invention, the suction means includes a suction plate having an opening capable of sucking and holding an object and a plurality of local areas narrower than a region where the suction plate can suck and hold. And an opening is formed outside a region of the suction plate that faces the pattern formation region during pattern formation, and the plurality of local suction portions are regions that face the pattern formation region during pattern formation. It is preferable that it is arranged on the outside.

  As described above, since the opening is formed outside the region of the suction plate that faces the pattern formation region during pattern formation, the opening sucks the outside of the effective region of the object. In addition, since the plurality of local suction portions are arranged outside the region facing the pattern formation region at the time of pattern formation, the plurality of local suction portions suction the outside of the effective region of the object. Furthermore, as adsorption means, it is provided with an adsorption plate having an opening and a plurality of local adsorption parts capable of adsorbing and holding a plurality of local areas narrower than the area where the adsorption plate can adsorb and hold, so that adsorption holding is performed according to each step. It is possible to optimally perform pattern formation by properly using these forms.

  In addition, it is preferable that at least a part of the plurality of local suction portions is a suction pad that can be elastically deformed in a direction in which the object and the carrier are separated after the object and the carrier are brought into contact with each other. At the time of separation in which the object and the carrier are brought into contact with each other and then separated, there is a risk that the plate-like object will be pulled and deformed by the side of the carrier to damage the object. However, if at least a part of the plurality of local suction portions holding the object at the time of peeling is elastically deformable in the separating direction, the suction pad is elastically deformed when the object is pulled toward the carrier at the time of peeling. This makes it possible to suppress the deformation of the object. As a result, the plate-like object can be prevented from being damaged during peeling.

  The opening is preferably formed as a suction groove that surrounds a region of the suction plate that faces the pattern formation region during pattern formation. Thus, if the opening formed in the suction plate is a suction groove, the opening area can be reduced. As a result, since the amount of negative pressure to be supplied to the opening of the suction plate for holding the object by suction can be reduced, it is possible to quickly hold the suction. In addition, since the suction groove surrounds a region of the suction plate that faces the pattern formation region during pattern formation, the effective area of the object can be stably held by the suction plate.

  In addition, it is preferable that the plurality of local suction portions are disposed outside the suction groove. When a plate-like object is sucked and held by a plurality of local suction parts, there is a possibility that the object will bend between the local suction parts. However, if the plurality of local suction portions are arranged outside the suction groove, it is possible to suppress the influence of deflection on the effective area of the object located inside the suction groove. Therefore, pattern formation can be performed more satisfactorily.

1 is a perspective view showing an embodiment of a printing apparatus equipped with a pattern forming apparatus according to the present invention. It is a figure which shows typically the cross section of the printing apparatus shown in FIG. It is a block diagram which shows the electric constitution of the apparatus of FIG. 2 is a flowchart illustrating an overall operation of the printing apparatus in FIG. 1. It is a perspective view which shows arrangement | positioning of an adsorption | suction means. It is a figure explaining the adsorption | suction method of a plate.

  FIG. 1 is a schematic perspective view showing an embodiment of a printing apparatus equipped with a pattern forming apparatus according to the present invention, in which the apparatus cover is removed in order to clearly show the internal configuration of the apparatus. FIG. 2 is a diagram schematically showing a cross section of the printing apparatus shown in FIG. FIG. 3 is a block diagram showing an electrical configuration of the apparatus shown in FIG. The printing apparatus 100 is peeled after the upper surface of the blanket carried into the apparatus from the front side of the apparatus is brought into close contact with the lower surface of the plate PP carried into the apparatus from the left side of the apparatus. The pattern layer is formed by patterning the coating layer on the blanket with the pattern formed on the lower surface of the plate PP (patterning process). Further, the printing apparatus 100 is formed on the blanket by peeling off the upper surface of the patterned blanket after the upper surface of the substrate SB carried into the apparatus is brought into close contact with the lower surface of the substrate SB from the right side of the apparatus. The transferred pattern layer is transferred to the lower surface of the substrate SB (transfer process). In FIG. 1 and each drawing to be described later, in order to clarify the arrangement relationship of each part of the apparatus, the transport direction of the plate PP and the substrate SB is “X direction”, and the right hand side in FIG. The horizontal direction is referred to as “+ X direction”, and the reverse direction is referred to as “−X direction”. Further, among the horizontal directions orthogonal to the X direction, the front side of the apparatus is referred to as “+ Y direction” and the back side of the apparatus is referred to as “−Y direction”. Further, the upward direction and the downward direction in the vertical direction are referred to as “+ Z direction” and “−Z direction”, respectively.

  In this printing apparatus 100, each part of the apparatus (conveyance unit 2, upper stage unit 3, alignment unit 4, lower stage unit 5, pressing unit 7, pre-alignment unit 8, static elimination unit 9) is provided on the stone surface plate 1. The control unit 6 controls each part of the apparatus.

  The transport unit 2 is a device that transports the plate PP and the substrate SB in the X direction, and is configured as follows. In this transport unit 2, two brackets (not shown) are erected from the right rear corner and the left corner of the upper surface of the stone surface plate 1, and a ball screw mechanism so as to connect the upper ends of both brackets to each other. 21 extends in the left-right direction, that is, in the X direction. In this ball screw mechanism 21, a ball screw (not shown) extends in the X direction, and a rotary shaft (not shown) of a shuttle horizontal drive motor M21 is connected to one end thereof. A ball screw bracket (not shown) is screwed to the center of the ball screw, and a shuttle holding plate 22 extending in the X direction is attached to the (+ Y) side surface of the ball screw bracket. It has been.

  A plate shuttle 23L is provided at the (+ X) side end of the shuttle holding plate 22 so as to be movable up and down in the vertical direction Z, while a substrate shuttle 23R is provided at the (−X) side end so as to be movable up and down in the vertical direction Z. It has been. Since these shuttles 23L and 23R have the same configuration except for the hand rotation mechanism, here, the configuration of the plate shuttle 23L will be described, and the substrate shuttle 23R will be given the same or corresponding reference numerals. Therefore, description of the configuration is omitted.

  The shuttle 23L has an elevating plate 231 extending in the X direction approximately the same as or slightly longer than the width of the plate PP (X direction size), and the (+ X) side end and the (−X) side end of the elevating plate 231 respectively. It has two plate-use hands 232 and 232 extending to the front side, that is, the (+ Y) side. The elevating plate 231 is attached to the (+ X) side end of the shuttle holding plate 22 via a ball screw mechanism (not shown) so as to be elevable. In other words, the ball screw mechanism extends in the vertical direction Z with respect to the (+ X) side end of the shuttle holding plate 22. At the lower end of this ball screw mechanism, a rotary shaft (not shown) is connected to a plate shuttle lifting motor M22L (FIG. 3). A ball screw bracket (not shown) is screwed to the ball screw mechanism, and an elevating plate 231 is attached to the (+ Y) side surface of the ball screw bracket. For this reason, the plate lifting / lowering motor M22L is operated in accordance with an operation command from the motor control unit 63 of the control unit 6 so that the elevating plate 231 is driven up and down in the vertical direction Z.

  The front-rear size (Y-direction size) of each hand 232, 232 is longer than the length size (Y-direction size) of the plate PP, and the plate PP can be held on the front end side (+ Y side) of each hand 232, 232. Yes.

  In order to detect that the plate PP is held by the plate hands 232 and 232 in this way, a plate detection sensor (not shown) is provided from the center of the elevating plate 231 to the (+ Y) side via a sensor bracket. It is attached. For this reason, when the plate PP is placed on both hands 232, the sensor detects the rear end of the plate PP, that is, the (−Y) side end, and outputs a detection signal to the control unit 6.

  Further, the plate hands 232 and 232 are attached to the elevating plate 231 via bearings, and are rotatable about a rotation axis extending in the front-rear direction (Y direction). Further, rotary actuators RA2 and RA2 (FIG. 3) are attached to both ends of the elevating plate 231 in the X direction. These rotary actuators RA2 and RA2 operate using pressurized air as a drive source, and can be rotated in 180 ° units by opening and closing a valve inserted in a pressurized air supply path. For this reason, by controlling the opening and closing of the valve by the valve control unit 64 of the control unit 6, a hand posture suitable for handling the plate PP before patterning with one main surface of the plate hands 232 and 232 facing upward. (Hereinafter referred to as “unused posture”) and a hand posture suitable for handling the patterned PP with the other main surface facing upward (hereinafter referred to as “used posture”). It is possible. The point of having the hand posture switching mechanism is the only difference between the plate shuttle 23L and the substrate shuttle 23R.

  Next, attachment positions of the plate shuttle 23L and the substrate shuttle 23R with respect to the shuttle holding plate 22 will be described. In this embodiment, as shown in FIG. 2, the plate shuttle 23L and the substrate shuttle 23R have a width size of the plate PP or the substrate SB (in the embodiment, the width size of the plate PP and the substrate SB is the same). It is attached to the shuttle holding plate 22 spaced apart in the X direction by a longer interval. When the rotary shaft of the shuttle horizontal drive motor M21 is rotated in a predetermined direction, both the shuttles 23L and 23R move in the X direction while maintaining the above-mentioned separation distance. For example, in FIG. 2, the symbol XP23 indicates the position immediately below the upper stage unit 3, and the shuttles 23L and 23R are equidistant from the position XP23 in the (+ X) direction and the (−X) direction, respectively (this distance is referred to as “step movement”). It is located at positions XP22 and XP24 separated by "unit". In the present embodiment, the state shown in FIG. 2 is referred to as an “intermediate position state”.

  Further, when the rotary shaft of the shuttle horizontal drive motor M21 is rotated in a predetermined direction from this intermediate position state and the shuttle holding plate 22 is moved in the (+ X) direction by the step movement unit, the substrate shuttle 23R is moved in the (+ X) direction. It moves and moves to a position XP23 directly below the upper stage portion 3 for positioning. At this time, the plate shuttle 23L also moves integrally in the (+ X) direction and is positioned at a position XP21 close to a plate cleaning device (not shown) arranged on the (+ X) direction side of the printing apparatus 100.

  Conversely, when the rotary shaft of the shuttle horizontal drive motor M21 is rotated in the direction opposite to the predetermined direction and the shuttle holding plate 22 is moved in the (−X) direction by the step movement unit, the plate shuttle 23L is moved from the intermediate position state. It moves in the (−X) direction and moves to a position XP23 directly below the upper stage portion 3 to be positioned. At this time, the substrate shuttle 23R also moves integrally in the (−X) direction, and is positioned at a position XP25 close to the substrate cleaning device (not shown) arranged on the (−X) direction side of the printing apparatus 100. . Thus, in this specification, the five positions XP21 to XP25 are defined as the shuttle positions in the X direction. That is, the plate delivery position XP21 is the closest position to the plate cleaning device among the three positions XP21 to XP23 where the plate shuttle 23L is positioned, and the plate PP is carried into and out of the plate cleaning device X It means the direction position. The substrate delivery position XP25 is the closest position to the substrate cleaning apparatus among the three positions XP23 to XP25 where the substrate shuttle 23R is positioned, and the position in the X direction where the substrate SB is carried into and out of the substrate cleaning apparatus. Means. The position XP23 means an X-direction position where the suction plate 34 of the upper stage unit 3 moves in the vertical direction Z and sucks and holds the plate PP and the substrate SB, and the plate shuttle 23L is located at the X-direction position XP23. In this case, the position XP23 is referred to as a “plate suction position XP23”. On the other hand, when the substrate shuttle 23R is located at the X-direction position XP23, the position XP23 is referred to as a “substrate suction position XP23”. Called. In addition, the position in the vertical direction Z where the plate PP and the substrate SB are transported by the shuttles 23L and 23R, that is, the height position is referred to as a “transport position”.

  In the present embodiment, the thickness of the plate PP and the substrate SB is measured in order to accurately control the gap amount between the plate PP and the blanket during patterning and the gap amount between the substrate SB and the blanket during transfer. There is a need. Therefore, a plate thickness measurement sensor SN22 and a substrate thickness measurement sensor SN23 are provided. In the present embodiment, a reflection type optical sensor having a light projecting part and a light receiving part is used as both sensors SN22 and SN23, but other sensors may be used.

  At the position XP23, the upper stage unit 3 is arranged. In the upper stage portion 3, a ball screw mechanism 31 extending in the vertical direction Z is fixed, and a rotating shaft (not shown) of the first stage lifting motor M 31 is attached to the upper end portion of the ball screw mechanism 31. In addition to being connected, a ball screw bracket (not shown) is screwed into the ball screw mechanism 31. A support frame 32 is fixed to the ball screw bracket, and can be moved up and down in the vertical direction Z integrally with the ball screw bracket. Further, another ball screw mechanism (not shown) is supported on the frame surface of the support frame 32. This ball screw mechanism is provided with a ball screw having a narrower pitch than the ball screw of the ball screw mechanism 31, and a rotary shaft (not shown) of the second stage lifting motor M32 (FIG. 3) is provided at the upper end thereof. While being connected, a ball screw bracket is screwed into the central portion.

  A stage holder 33 is attached to the ball screw bracket. A metal suction plate 34 such as an aluminum alloy is attached to the lower surface of the stage holder 33. Therefore, the suction plate 34 is moved up and down in the vertical direction Z by operating the stage lifting motors M31 and M32 in accordance with an operation command from the motor control unit 63 of the control unit 6. Further, in the present embodiment, by combining ball screw mechanisms having different pitches and operating the first stage elevating motor M31, the suction plate 34 can be moved up and down at a relatively wide pitch, that is, the suction plate 34 can be moved at high speed. In addition, the suction plate 34 can be moved up and down at a relatively narrow pitch by operating the second stage lifting motor M32, that is, the suction plate 34 can be precisely positioned.

  A suction mechanism is provided on the lower surface of the suction plate 34, that is, a suction surface for sucking and holding the plate PP and the substrate SB, and is connected to a negative pressure supply source via a negative pressure supply path. Then, the plate PP and the substrate SB can be sucked by the suction mechanism by controlling the suction valves V31 and V32 (FIG. 3) connected to the suction mechanism in accordance with an opening / closing command from the valve control unit 64 of the control unit 6. . In the present embodiment, the above-described suction mechanism and the suction mechanism that sucks and holds the blanket as described later use factory power as a negative pressure supply source, but the apparatus 100 is a negative pressure supply unit such as a vacuum pump. The negative pressure supply unit may be configured to supply negative pressure to the suction mechanism.

  In the upper stage unit 3 configured as described above, after the plate is transported from the left hand side of FIG. 1 to the plate suction position XP23 directly below the upper stage unit 3 through the transport space by the plate shuttle 23L of the transport unit 2. Then, the suction plate 34 of the upper stage unit 3 descends to hold the plate PP by suction. Conversely, when the suction plate 34 that has attracted the plate PP is released while the plate shuttle 23L is positioned immediately below the upper stage unit 3, the plate PP is transferred to the transport unit 2. In this way, the plate is delivered between the transport unit 2 and the upper stage unit 3.

  Further, the substrate SB is also held by the upper stage unit 3 in the same manner as the plate PP. That is, after the substrate SB is transported from the right hand side of FIG. 1 to the position immediately below the upper stage unit 3 by the substrate shuttle 23R of the transport unit 2, the suction plate 34 of the upper stage unit 3 is lowered. The substrate SB is sucked and held. Conversely, when the suction plate 34 of the upper stage unit 3 that has sucked the substrate SB is released while the substrate shuttle 23 </ b> R is positioned immediately below the upper stage unit 3, the substrate SB is transferred to the transport unit 2. . In this way, the substrate SB is delivered between the transport unit 2 and the upper stage unit 3.

  Below the upper stage portion 3 in the vertical direction (hereinafter referred to as “vertically below” or “(−Z) direction”), the alignment portion 4 is disposed on the upper surface of the stone surface plate 1. In the alignment unit 4, the support plate 41 is disposed in a horizontal posture so as to straddle the concave portion of the stone surface plate 1 and is fixed to the upper surface of the stone surface plate 1 as shown in FIG. 1. An alignment stage 42 is fixed on the upper surface of the support plate 41. The lower stage unit 5 is placed on the alignment stage 42 of the alignment unit 4, and the upper surface of the lower stage unit 5 faces the suction plate 34 of the upper stage unit 3. The upper surface of the lower stage unit 5 can suck and hold the blanket BL, and the control unit 6 controls the alignment stage 42 so that the blanket BL on the lower stage unit 5 can be positioned with high accuracy.

  The alignment stage 42 includes a stage base 421 that is fixed on the support plate 41, and a stage top 422 that is disposed vertically above the stage base 421 and supports the lower stage unit 5. Both the stage base 421 and the stage top 422 have a frame shape having an opening in the center. Between the stage base 421 and the stage top 422, a support mechanism such as a cross roller bearing having three degrees of freedom in the rotational direction, the X direction, and the Y direction with the rotational axis extending in the vertical direction Z as the rotational center. 423 is arranged in the vicinity of each corner of the stage top 422. Each support mechanism 423 is provided with a ball screw mechanism (not shown), and a stage drive motor M41 (FIG. 3) is attached to each ball screw mechanism. Then, by operating each stage drive motor M41 in accordance with an operation command from the motor control unit 63 of the control unit 6, the stage top 422 is placed in a horizontal plane while providing a relatively large space at the center of the alignment stage 42. The suction plate 51 of the lower stage unit 5 can be positioned by being moved and rotated about the vertical axis. In this embodiment, one of the reasons for using the alignment stage 42 having a hollow space is formed on the blanket BL held on the upper surface of the lower stage portion 5 and the substrate SB held on the lower surface of the upper stage portion 3. This is because the alignment mark is imaged by the imaging unit 43.

  The lower stage unit 5 includes a suction plate 51, a column member 52, a stage base 53, and a lift pin unit 54. The stage base 53 is provided with three elongated holes extending in the left-right direction X and arranged in the front-rear direction Y. The stage base 53 is fixed on the alignment stage 42 so that these long hole openings and the central opening of the alignment stage 42 overlap in a plan view from above. In addition, a part of the imaging unit 43 is loosely inserted into the long hole opening. A column member 52 is erected at (+ Z) from the upper surface corner of the stage base 53, and each apex supports the suction plate 51.

  The suction plate 51 is made of a metal plate such as an aluminum alloy. A suction mechanism (not shown) is provided on the upper surface of the suction plate 51, one end of a positive pressure supply pipe (not shown) is connected to the suction mechanism, and the other end is connected to a pressurizing manifold. ing. Further, a pressurizing valve V51 (FIG. 3) is inserted in an intermediate portion of each positive pressure supply pipe. The pressure manifold is constantly supplied with a constant pressure of air obtained by adjusting the pressure of air supplied from the factory power with a regulator. For this reason, when a desired pressurization valve V51 is selectively opened in accordance with an operation command from the valve control unit 64 of the control unit 6, the pressure is adjusted with respect to the adsorption mechanism connected to the selected pressurization valve V51. Pressurized air is supplied.

  Moreover, not only selective supply of pressurized air but also selective negative pressure supply is possible for a part of the adsorption mechanism. That is, one end of a negative pressure supply pipe (not shown) is connected to each of the specific adsorption mechanisms, and the other end is connected to a negative pressure manifold. Further, an adsorption valve V52 (FIG. 3) is inserted in an intermediate portion of each negative pressure supply pipe. A negative pressure supply source is connected to the negative pressure manifold via a regulator, and a predetermined negative pressure is constantly supplied. For this reason, when a desired suction valve V52 is selectively opened in accordance with an operation command from the valve control unit 64 of the control unit 6, the negative pressure adjusted with respect to the suction mechanism connected to the selected suction valve V52. Is supplied.

  As described above, in this embodiment, the blanket BL is partially or completely adsorbed on the suction plate 51 by opening / closing control of the valves V51 and V52, or air is partially supplied between the suction plate 51 and the blanket BL. Then, the blanket BL is partially inflated and can be pressed against the plate PP and the substrate SB held on the upper stage portion 3.

  In the lift pin portion 54, a lift plate 541 is provided between the suction plate 51 and the stage base 53 so as to be movable up and down. The lift plate 541 is formed with notches at a plurality of locations to prevent interference with the imaging unit 43. In addition, a plurality of lift pins 542 are erected vertically upward from the upper surface of the lift plate 541. On the other hand, a pin elevating cylinder CL51 (FIG. 3) is connected to the lower surface of the lift plate 541. And the valve | bulb control part 64 of the control part 6 switches the opening / closing of the valve connected to the pin raising / lowering cylinder CL51, thereby operating the pin raising / lowering cylinder CL51 to raise / lower the lift plate 541. As a result, all the lift pins 542 are moved back and forth with respect to the upper surface of the suction plate 51, that is, the suction surface. For example, the lift pins 542 project from the upper surface of the suction plate 51 in the (+ Z) direction, so that the blanket BL can be placed on the top of the lift pins 542 by a blanket transport robot (not shown). Then, following the placement of the blanket BL, the lift pin 542 moves backward in the (−Z) direction from the upper surface of the suction plate 51, so that the blanket BL is transferred to the upper surface of the suction plate 51. Thereafter, the thickness of the blanket BL is measured by a blanket thickness measurement sensor SN51 (FIG. 3) disposed in the vicinity of the suction plate 51 at an appropriate timing as will be described later.

  As described above, in the present embodiment, the upper stage unit 3 and the lower stage unit 5 are disposed to face each other in the vertical direction Z. Between them, a pressing unit 7 that presses the blanket BL placed on the lower stage unit 5 from above and a pre-alignment unit 8 that pre-aligns the plate PP, the substrate SB, and the blanket BL are arranged. ing.

  The pressing part 7 can be switched between two states by raising and lowering a pressing member 71 provided vertically above the suction plate 51 in the vertical direction Z by a switching mechanism (not shown). That is, when the switching mechanism lowers the pressing member 71, the blanket BL on the suction plate 51 is pressed by the pressing portion 7 (a blanket pressing state). On the other hand, when the switching mechanism raises the pressing member 71, the pressing portion 7 is separated from the blanket BL and is released from the blanket BL (a blanket pressing release state).

  In the pre-alignment unit 8, the pre-alignment upper part 81 and the pre-alignment lower part 82 are stacked in two stages in the vertical direction Z. Among these, the pre-alignment upper portion 81 is arranged vertically above the pre-alignment lower portion 82, and is brought into contact with the blanket BL by the plate PP and the substrate shuttle 23R held by the plate shuttle 23L at the position XP23. The substrate SB to be held is aligned. On the other hand, the pre-alignment lower part 82 aligns the blanket BL placed on the suction plate 51 of the lower stage unit 5 prior to close contact with the plate PP and the substrate SB. Note that the pre-alignment upper portion 81 and the pre-alignment lower portion 82 basically have the same configuration. Therefore, in the following, the configuration of the pre-alignment upper portion 81 will be described, and the pre-alignment lower portion 82 will be assigned the same or corresponding reference numerals, and the description of the configuration will be omitted.

  In the pre-alignment upper portion 81, four upper guides 812 are movably provided with respect to the frame-like frame structure 811. That is, the frame structure 811 includes two horizontal frames spaced apart in the left-right direction X and extending in the front-rear direction Y, and two horizontal frames spaced apart in the front-rear direction Y and extended in the left-right direction X. Are combined. Then, as shown in FIG. 2, the upper guide 812 at the center of the left horizontal plate of the two horizontal plates extending in the front-rear direction Y is moved in the left-right direction X by a ball screw mechanism (not shown). It is provided to be freely movable. The upper guide 812 moves in the left-right direction X when the drive motor M81 (FIG. 3) coupled to the ball screw mechanism operates in accordance with an operation command from the motor control unit 63 of the control unit 6. Similarly to the above, the upper guide 812 is configured to move in the left-right direction X by the drive motor M81 with respect to the right horizontal plate. Further, for each of the two horizontal plates extending in the front-rear direction Y, the upper guide 812 is configured to move in the left-right direction X by the drive motor M81 as described above. In this way, the four upper guides 812 surround the plate PP and the substrate SB at a position vertically below the position XP23, and each upper guide 812 can be moved toward and away from the plate PP independently. Therefore, it is possible to align the plate PP and the substrate SB by horizontally moving or rotating them on the shuttle hand by controlling the movement amount of each upper guide 812.

  In this embodiment, as will be described later, after the pattern layer on the blanket BL is transferred to the substrate SB, the blanket BL is peeled off from the substrate SB, and static electricity is generated in the peeling step. In addition, static electricity is generated when the blanket BL is peeled from the plate PP after the coating layer on the blanket BL is patterned by the plate PP. Therefore, in the present embodiment, a static elimination unit 9 is provided to neutralize static electricity. The charge removal unit 9 includes an ionizer 91 that irradiates ions toward a space sandwiched between the upper stage unit 3 and the lower stage unit 5 from the (+ X) side.

  The control unit 6 includes a CPU (Central Processing Unit) 61, a memory 62, a motor control unit 63, a valve control unit 64, an image processing unit 65, and a display / operation unit 66. The CPU 61 is stored in the memory 62 in advance. Each part of the apparatus is controlled according to the program, and the patterning process and the transfer process are executed as shown in FIG.

  FIG. 4 is a flowchart showing the overall operation of the printing apparatus of FIG. In the initial state of the printing apparatus 100, the plate shuttle 23L and the substrate shuttle 23R are positioned at intermediate positions XP22 and XP24, respectively. The plate PP loading process (step S1) and the substrate SB of the substrate cleaning robot (not shown) of the substrate cleaning apparatus are transferred in synchronism with the plate PP transfer operation of the plate cleaning robot (not shown) of the plate cleaning apparatus. In synchronization with the operation, the substrate SB loading step (step S2) is executed. Since the plate shuttle 23L and the substrate shuttle 23R integrally move in the left-right direction X, the plate PP is loaded (step S1), and then the substrate SB is loaded. (Step S2) may interchange the order of both.

  As described above, in this embodiment, not only the plate PP but also the substrate SB is prepared before the patterning process is performed, and the patterning process and the transfer process are continuously performed as will be described in detail later. To do. As a result, the time interval until the coating layer patterned on the blanket BL is transferred to the substrate SB can be shortened, and stable processing is performed.

  In the next step S3, the shuttle horizontal drive motor M21 rotates the rotation shaft to move the shuttle holding plate 22 in the (−X) direction. As a result, the plate shuttle 23L moves to the plate suction position XP23 and is positioned. Then, the plate shuttle elevating motor M22L rotates the rotation shaft to move the elevating plate 231 downward (-Z). As a result, the plate PP is moved and positioned to a pre-alignment position lower than the transport position while being supported by the plate shuttle 23L.

  Next, the upper guide drive motor M81 is actuated to move the upper guide 812, and each upper guide 812 contacts the end face of the plate PP supported by the plate shuttle 23L to position the plate PP at a preset horizontal position. To do. Thereafter, each upper guide drive motor M81 operates in the reverse direction, and each upper guide 812 is separated from the plate PP. Thus, when the pre-alignment processing of the plate PP is completed, the stage elevating motor M31 rotates the rotating shaft in a predetermined direction, and the suction plate 34 is lowered downward (−Z) to contact the upper surface of the plate PP. Subsequently, the valves V31 and V32 are opened, whereby the plate PP is sucked onto the suction plate 34 by the upper stage suction mechanism.

  When the adsorption of the plate PP is completed in this way, the stage elevating motor M31 rotates in the reverse direction, and the adsorption plate 34 moves up vertically while adsorbing and holding the plate PP, so that the plate PP is placed at a position above the plate adsorption position XP23. Move. Then, the plate shuttle elevating motor M22L rotates the rotation shaft to move the elevating plate 231 vertically upward, and the plate shuttle 23L is moved from the pre-alignment position to the transport position, that is, the plate suction position XP23 and positioned. Thereafter, the shuttle horizontal drive motor M21 rotates the rotation shaft to move the shuttle holding plate 22 in the (+ X) direction, and the empty plate shuttle 23L is positioned at the intermediate position XP22.

  In the next step S4, the stage drive motor M41 is operated to move the alignment stage 42 to the initial position. As a result, the start becomes the same position every time. Subsequently, the pin elevating cylinder CL51 operates to raise the lift plate 541 and cause the lift pin 542 to protrude vertically upward from the upper surface of the suction plate 51. Thus, when the blanket BL preparation is completed, a blanket transport robot (not shown) accesses the apparatus 100 and places the blanket BL on the top of the lift pin 542 and then withdraws from the apparatus 100. Next, the pin lifting cylinder CL51 operates to lower the lift plate 541. As a result, the lift pins 542 descend while supporting the blanket BL and place the blanket BL on the suction plate 51. Then, the lower guide drive motor M82 operates, the lower guide 822 moves, and each lower guide 822 contacts the end face of the blanket BL supported by the suction plate 51 to position the blanket BL at a preset horizontal position.

  When the pre-alignment process of the blanket BL is completed in this way, the suction valve V52 is opened, whereby a negative pressure adjusted to the lower stage suction mechanism is supplied, and the blanket BL is sucked to the suction plate 51. Further, each lower guide drive motor M82 rotates the rotating shaft in the reverse direction, and each lower guide 822 is separated from the blanket BL. Thereby, the preparation for the patterning process is completed.

  In the next step S5, the sensor horizontal drive cylinder CL52 (FIG. 3) operates to position the blanket thickness measurement sensor SN51 at a position immediately above the right end of the blanket BL. And blanket thickness measurement sensor SN51 outputs the information relevant to the thickness of blanket BL to the control part 6, and, thereby, the thickness of blanket BL is measured. Thereafter, the sensor horizontal drive cylinder CL52 operates in the reverse direction to retract the blanket thickness measurement sensor SN51 from the suction plate 51.

  Next, the first stage elevating motor M31 rotates the rotating shaft in a predetermined direction, lowers the suction plate 34 downward (−Z), and moves the plate PP to the vicinity of the blanket BL. Further, the second stage elevating motor M32 rotates the rotating shaft to raise and lower the suction plate 34 at a narrow pitch, thereby accurately adjusting the interval between the plate PP and the blanket BL in the vertical direction Z, that is, the gap amount. The gap amount is determined by the control unit 6 based on the thickness measurement results of the plate PP and the blanket BL.

  Then, the pressing member 71 of the pressing part 7 is lowered and the peripheral edge of the blanket BL is pressed by the pressing member 71 over the entire circumference. Subsequently, the valves V51 and V52 operate to partially supply air between the suction plate 51 and the blanket BL to partially expand the blanket BL. This floating portion is pressed against the plate PP held on the upper stage portion 3. As a result, the central portion of the blanket BL is in close contact with the plate PP, and a pattern formed in advance on the lower surface of the plate PP comes into contact with the coating layer previously applied on the upper surface of the blanket BL, and the coating layer is patterned to form a pattern layer. Form.

  In the next step S6, the second stage elevating motor M32 rotates the rotating shaft, and the suction plate 34 is raised to peel the plate PP from the blanket BL. Further, in parallel with raising the plate PP to perform the peeling process, the valve V51, V52 is switched between open and closed, and negative pressure is applied to the blanket BL to draw it toward the suction plate 51. After that, the first stage elevating motor M31 rotates the rotation shaft to raise the suction plate 34 and position the plate PP at a static elimination position substantially the same height as the ionizer 91. Further, the pressing member 71 of the pressing unit 7 is raised to release the blanket BL. Subsequently, the ionizer 91 operates to remove static electricity generated during the plate peeling process. When this removal process is completed, the first stage elevating motor M31 rotates the rotation shaft, and the suction plate 34 moves up to the initial position (position higher than the plate suction position XP23) while sucking and holding the plate PP.

  In the next step S7, the rotary actuators RA2 and RA2 operate to rotate the plate hands 232 and 232 by 180 ° to position them from the origin position to the reverse position. As a result, the hand posture is switched from the unused posture to the used posture, and the preparation for receiving the used plate PP is completed. Then, the shuttle horizontal drive motor M21 rotates the rotation shaft to move the shuttle holding plate 22 in the (−X) direction. As a result, the plate shuttle 23L moves to the plate suction position XP23 and is positioned.

  On the other hand, the first stage elevating motor M31 rotates the rotation shaft, the suction plate 34 descends toward the hands 232, 232 of the plate shuttle 23L while holding the plate PP, and the plate PP is placed on the hands 232, 232. After the positioning, the valves V31 and V32 are closed, whereby the suction of the plate PP by the suction mechanism of the suction plate 34 is released, and the delivery of the plate PP at the transport position is completed. Then, the first stage elevating motor M31 rotates the rotating shaft in the reverse direction to raise the suction plate 34 to the initial position. Thereafter, the shuttle horizontal drive motor M21 rotates the rotation shaft to move the shuttle holding plate 22 in the (+ X) direction. As a result, the plate shuttle 23L moves to the intermediate position XP22 and is positioned while holding the used plate PP.

  In the next step S8, the shuttle horizontal drive motor M21 rotates the rotation shaft to move the shuttle holding plate 22 in the (+ X) direction. Thus, the substrate shuttle 23R that holds the unprocessed substrate SB moves to the substrate suction position XP23 and is positioned. Then, the pre-alignment process of the substrate SB and the suction process of the substrate SB are performed in the same manner as the pre-alignment process of the plate PP and the suction process of the plate PP by the suction plate 34. Thereafter, when the adsorption of the substrate SB is detected, the stage elevating motor M31 rotates the rotation shaft, and the adsorption plate 34 is moved vertically upward while the substrate SB is adsorbed and held, so that the substrate SB is positioned higher than the substrate adsorption position XP23. Move. Then, the substrate shuttle elevating motor M22R rotates the rotation shaft to move the substrate shuttle 23R from the pre-alignment position to the transport position for positioning. Thereafter, the shuttle horizontal drive motor M21 rotates the rotation shaft to move the shuttle holding plate 22 in the (−X) direction, and positions the empty substrate shuttle 23R at the intermediate position XP24.

  In the next step S9, the blanket thickness is measured, and after the fine alignment is executed, the transfer process is executed. That is, the thickness of the blanket BL is measured in the same manner as the thickness measurement in the patterning process. The main reason for measuring the thickness of the blanket BL not only immediately before patterning but also immediately before transfer is that the thickness of the blanket BL changes with time due to swelling of a part of the blanket BL. By measuring the blanket thickness at, a highly accurate transfer process can be performed.

  Next, the first stage elevating motor M31 rotates the rotation shaft in a predetermined direction, lowers the suction plate 34 downward (−Z), and moves the substrate SB to the vicinity of the blanket BL. Further, the second stage elevating motor M32 rotates the rotating shaft to raise and lower the suction plate 34 at a narrow pitch, thereby accurately adjusting the distance between the substrate SB and the blanket BL in the vertical direction Z, that is, the gap amount. The gap amount is determined by the control unit 6 based on the thickness measurement results of the substrate SB and the blanket BL. Then, similarly to the patterning (step S5), the pressing member 71 presses the peripheral edge of the blanket BL.

  Thus, both the substrate SB and the blanket BL are pre-aligned and positioned at a distance suitable for the transfer process, but in order to accurately transfer the pattern layer formed on the blanket BL to the substrate SB. It is necessary to align the two precisely. Therefore, in the present embodiment, the imaging unit 43 images the alignment marks patterned on the blanket BL and the alignment marks formed on the substrate SB, and outputs these images to the image processing unit 65 of the control unit 6. Based on these images, the control unit 6 obtains a control amount for aligning the blanket BL with respect to the substrate SB, and further creates an operation command for the stage drive motor M41 of the alignment unit 4. Then, the stage drive motor M41 operates according to the control command to move the suction plate 51 in the horizontal direction and rotate around the virtual rotation axis extending in the vertical direction Z to precisely align the blanket BL with the substrate SB. (Alignment process).

  Then, the valves V51 and V52 are operated to partially supply air between the suction plate 51 and the blanket BL to partially inflate the blanket BL. This floating portion is pressed against the substrate SB held on the upper stage portion 3. As a result, the blanket BL adheres to the substrate SB. Thus, the pattern layer on the blanket BL side is transferred to the substrate SB while being precisely aligned with the pattern on the lower surface of the substrate SB.

  In the next step S10, similarly to the plate peeling (step S6), the peeling of the substrate SB from the blanket BL, the positioning of the substrate SB to the discharging position, the pressing release of the blanket BL by the pressing member 71, and discharging are executed. Thereafter, the first stage elevating motor M31 rotates the rotation shaft, and the suction plate 34 moves up to the initial position (position higher than the transport position) while holding the substrate SB by suction.

  In the next step S11, the shuttle horizontal drive motor M21 rotates the rotation shaft to move the shuttle holding plate 22 in the (+ X) direction. As a result, the substrate shuttle 23R moves to the substrate suction position XP23 and is positioned. Further, the first stage elevating motor M31 rotates the rotation shaft to lower the suction plate 34 toward the hands 232 and 232 of the substrate shuttle 23R while holding the substrate SB. Thereafter, the valves V31 and V32 are closed, whereby the adsorption of the substrate SB by the adsorption mechanism is released. Then, the first stage elevating motor M31 rotates the rotating shaft in the reverse direction to raise the suction plate 34 to the initial position. Thereafter, the shuttle horizontal drive motor M21 rotates the rotating shaft, moves the shuttle holding plate 22 in the (−X) direction, and moves the substrate shuttle 23R to the intermediate position XP24 while holding the substrate SB, thereby positioning.

  In the next step S12, the valves V51 and V52 are operated to release the suction of the blanket BL by the suction plate 51. Then, the pin lifting cylinder CL51 operates to raise the lift plate 541 and lift the used blanket BL vertically upward from the suction plate 51. Then, the blanket transport robot accesses the apparatus 100 to receive the used blanket BL from the top of the lift pin 542 and retracts from the apparatus 100. Following this, the pin elevating cylinder CL51 operates to lower the lift plate 541 and lower the lift pin 542 downward (−Z) from the suction plate 51.

  In the next step S13, the shuttle horizontal drive motor M21 rotates the rotation shaft, and the shuttle holding plate 22 moves in the (+ X) direction. As a result, the plate shuttle 23L moves to the plate delivery position XP21 and is positioned. Subsequently, the used plate PP is taken out from the printing apparatus 100 by the plate transport robot of the plate cleaning apparatus. When unloading of the plate PP is completed in this way, the shuttle horizontal drive motor M21 rotates the rotation shaft to move the shuttle holding plate 22 in the (−X) direction, thereby positioning the plate shuttle 23L at the intermediate position XP22.

  In the next step S14, the shuttle horizontal drive motor M21 rotates the rotation shaft, and moves the shuttle holding plate 22 in the (−X) direction. Thus, the substrate shuttle 23R is moved to the substrate delivery position XP25 and positioned. Subsequently, the substrate transport robot of the substrate cleaning apparatus takes out the substrate SB subjected to the transfer process from the printing apparatus 100. When the unloading of the substrate SB is completed in this manner, the shuttle horizontal drive motor M21 rotates the rotation shaft to move the shuttle holding plate 22 in the (+ X) direction, thereby positioning the substrate shuttle 23R at the intermediate position XP23. Thereby, the printing apparatus 100 returns to the initial state.

  In the printing apparatus 100 according to the present embodiment described above, an adsorption mechanism that adsorbs and holds the plate PP and the substrate SB will be described with reference to FIGS. FIG. 5 is a perspective view showing the arrangement of the suction means, and FIG. 6 is a diagram for explaining a plate suction method. 6A is a view of the suction plate 34 holding the plate PP by suction from the suction surface side, and FIG. 6B is a cross-sectional view taken along the line AA in FIG. It is the figure seen so that the adsorption surface of may become a lower side.

  In the present embodiment, a suction plate 34 having a suction groove 351 formed on the suction surface and a plurality of suction pads 352 disposed on the suction plate 34 are provided as suction means constituting the suction mechanism. As shown in FIG. 6B, the suction groove 351 is connected via a valve V31, and each suction pad 352 is connected via a valve V32 to a negative pressure supply source installed in advance in the factory where the printing apparatus 100 is installed. ing. When the valve V31 is opened in response to an opening / closing command from the valve control unit 64 of the control unit 6, negative pressure is supplied to the suction groove 351 to hold the plate PP by suction. Further, when the valve V32 is opened in accordance with an opening / closing command from the valve control unit 64 of the control unit 6, negative pressure is supplied to each suction pad 352 to hold the plate PP by suction.

  Next, the arrangement of the suction grooves 351 and the suction pads 352 will be described in detail with reference to FIG. FIG. 5 schematically shows a state where the blanket BL is held by suction on the upper surface of the suction plate 51 and the plate PP is located at the plate suction position XP23. In FIG. 5, a region of the blanket BL where the pattern layer is formed by the plate PP is shown as a pattern formation region A1, and a region of the plate PP facing the pattern formation region A1 is shown as an effective region A2. . Further, an area of the suction surface of the suction plate 34 that faces the effective area A2 of the plate PP is shown as a facing area A3. That is, the pattern formation region A1, the effective region A2, and the opposing region A3 overlap each other in plan view.

  The suction groove 351 and each suction pad 352 are disposed outside the facing area A3. In the present embodiment, the suction groove 351 is formed in a circumferential shape so as to surround the facing region A3, and each suction pad 352 is disposed in a region further outside the suction groove 351. Five suction pads 352 are provided along each side of the rectangular suction plate 34, and a total of 16 suction pads 352 are shared by each side. When the valves V31 and V32 are opened in response to an opening / closing command from the valve control unit 64 of the control unit 6, as shown in FIG. 6, the suction groove 351 and the suction pad 352 arranged outside the facing area A3 are formed on the plate PP. Is adsorbed in an area outside the effective area A2. In this state, the plate PP and the blanket BL are brought into pressure contact with each other to perform patterning.

  As described above, the effective area A2 of the plate PP is not directly adsorbed by the adsorption groove 351 and the adsorption pad 352 by adsorbing the outside of the effective area A2 of the plate PP at the time of patterning. Therefore, it is possible to prevent the occurrence of local dents and the decrease in flatness due to the adsorption in the effective area A2 of the plate PP, and the patterning can be performed satisfactorily.

  Further, by using a plurality of suction pads 352 as the suction means, the plate PP can be easily peeled from the blanket BL from the vicinity of the local region sucked by the suction pads 352. This is because, when the plate PP is sucked and held by the plurality of suction pads 352, the local area attracted to the suction pad 352 is easily separated from the blanket BL together with the suction pad 352, and peeling is likely to proceed from the vicinity of the local area. Because. Further, by providing the suction groove 351 capable of sucking and holding a wide range in addition to the suction pad 352, the plate PP can be sucked and held more firmly over a wide range, and the patterning can be stably performed. When the plate PP is peeled from the blanket BL, if a vacuum break occurs in a part of the suction groove 351, the influence may be exerted on the entire suction groove 351, resulting in a large fluctuation in the suction force, which may prevent stable peeling. There is. In order to avoid such a problem, it is possible not to perform suction holding by the suction groove 351 during peeling.

  In the present embodiment, the suction pad 352 is used. However, it is preferable that the suction pad 352 be provided with a portion that can be elastically deformed when the plate PP is separated from the blanket BL and separated. By using such a suction pad 352, when the plate PP is pulled to the blanket BL side at the time of peeling, a part of the suction pad 352 is elastically deformed, so that deformation of the plate PP can be suppressed. . As a result, it is possible to prevent the plate PP from being damaged during peeling.

  Further, by forming the suction groove 351 as an opening provided on the suction surface of the suction plate 34, the opening area can be reduced. As a result, the amount of negative pressure to be supplied to hold the plate PP by suction can be reduced, so that quick suction holding can be performed.

  Further, as in the above-described embodiment, arranging the plurality of suction pads 352 outside the suction grooves 351 has the following advantages. When the plate PP is sucked and held by the plurality of suction pads 352, the plate PP may bend between the suction pads 352. However, according to the above arrangement, the suction groove 351 is positioned between the plurality of suction pads 352 and the effective area A2 of the plate PP, and the influence of the deflection can be prevented from reaching the effective area A2 of the plate PP. Patterning can be performed more satisfactorily.

  While the case where the plate PP is held by suction during patterning has been described above, the suction holding of the substrate SB during the transfer of the pattern layer is similarly performed. That is, the effective area of the substrate SB that faces the pattern formation area A1 of the blanket BL during transfer coincides with the effective area A2 of the plate PP in plan view, and therefore, the suction grooves 351 and the suction pads 352 arranged as described above are used. As a result, the substrate SB is adsorbed outside the effective area. In addition, it goes without saying that the above-described effects can be achieved even during transfer by using the suction mechanism described in the above embodiment for suction holding of the substrate SB.

  In the above-described embodiment, the portion of the printing apparatus 100 that is involved in the patterning and transfer processes functions as the pattern forming apparatus according to the present invention, and the patterning and transfer correspond to “pattern formation” in the present invention. The plate PP and the substrate SB correspond to the “object” of the present invention, the suction groove 351 corresponds to the “opening” of the present invention, the suction pad 352 corresponds to the “local suction portion” of the present invention, and valve control. The portion 64 and the valves V31 and V32 cooperate to function as the “negative pressure supply means” of the present invention.

  The present invention is not limited to the above-described embodiment, and various modifications can be made to the above-described one without departing from the spirit of the present invention. For example, in the above-described embodiment, the pattern forming apparatus performs both patterning and transfer, but may perform only one of them.

  Further, although the suction groove 351 and the plurality of suction pads 352 are provided as the suction means, it is not an essential requirement to provide two kinds of suction means as described above, and only one kind of suction means may be provided. It is also possible to provide the above suction means. Further, when a plurality of types of adsorption means are provided, which adsorption means is used in which process can be freely determined according to each condition. Further, it is not always necessary to form the circumferential suction groove 351 as the opening, and a shape other than the groove may be formed, and the arrangement and number thereof may be changed as appropriate. It is also possible to adopt forms other than the suction pad as the local suction part. For example, a form in which suction holes are formed in the suction plate 34 and a negative pressure is supplied to the suction holes may be employed as the local suction portion.

  In the above embodiment, the plate PP and the substrate SB are sucked and held using the same suction means. However, if the outside of the effective area of the plate PP and the substrate SB is sucked, different suction means are used. It is also possible to hold it by suction.

  The present invention can be applied to all apparatuses that perform pattern formation on a carrier by an object or pattern formation on an object by a carrier by bringing the carrier into contact with a plate-like object.

34 ... Suction plate 64 ... Valve controller (negative pressure supply means)
351 ... Adsorption groove (opening)
352 ... Suction pad (local suction part)
BL ... Blanket (carrier)
PP ... plate (object)
SB ... Substrate (object)
V31, V32 ... Valve (negative pressure supply means)

Claims (4)

A pattern forming apparatus that forms a pattern by bringing a pattern forming region on a carrier into contact with a plate-like object,
Negative pressure supply means for supplying negative pressure;
Suction means for sucking and holding the object by the negative pressure supplied from the negative pressure supply means;
With
The suction means includes a suction plate provided with an opening to which negative pressure is supplied from the negative pressure supply means outside a region facing the pattern formation region of the suction surface for sucking and holding the object; and the object A plurality of local adsorption portions that locally adsorb the object in a region outside the pattern formation region, and outside the region of the object that faces the pattern formation region during the pattern formation. Adsorbed,
The opening is formed as a suction groove that surrounds a region of the suction surface that faces the pattern formation region when the pattern is formed,
The pattern forming apparatus, wherein the plurality of local suction portions are arranged outside the suction groove in the suction plate .   The pattern forming apparatus according to claim 1, wherein the object adsorbed by the local adsorption unit and the adsorption groove is separated from the carrier. At least some of said plurality of local suction unit according to claim 1 which is elastically deformable suction pad in the direction of separating said object and said bearing member after abutting the said carrier and the object or 3. The pattern forming apparatus according to 2.   A pattern forming apparatus that forms a pattern by bringing a pattern forming region on a carrier into contact with a plate-like object,
  Negative pressure supply means for supplying negative pressure;
  Suction means for sucking and holding the object by the negative pressure supplied from the negative pressure supply means;
With
  The suction means includes a suction plate having an opening capable of sucking and holding the object, and a plurality of local suction portions capable of sucking and holding a plurality of local regions narrower than a region where the suction plate can suck and hold. , Adsorbing the outside of the region facing the pattern formation region during the pattern formation of the object,
  The opening is formed outside a region of the suction plate that faces the pattern formation region when the pattern is formed.
  The plurality of local adsorption portions are arranged outside a region facing the pattern formation region during the pattern formation,
  At least a part of the plurality of local suction portions is a suction pad that is elastically deformable in a direction in which the object and the carrier are separated from each other after the object and the carrier are brought into contact with each other. Pattern forming apparatus.

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