JP2013074242A - Position detecting device, drawing device and position detecting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technique capable of promptly and surely detecting a position of a substrate using information which can be acquired from an in-plane region of the substrate.SOLUTION: A position detecting device includes: a stage 11 on which a substrate 9 is placed; an imaging part for imaging an in-plane region of the substrate 9 placed on the stage 11; and a position specification part for specifying a position of the substrate 9 on the basis of imaging data acquired by the imaging part. The position specification part analyzes the imaging data, detects an outermost peripheral scribe line 910 disposed on the outermost periphery of scribe lines formed on a surface of the substrate, specifies a position of a center chip region 920 disposed on a center of a layout region 93 on the basis of the detection position of the outermost peripheral scribe line 910 and specifies the position of a substrate center 90 on the basis of the position of the center chip region 920.

Description

  The present invention relates to various substrates such as semiconductor substrates, printed substrates, color filter substrates, glass substrates for flat panel displays, optical disk substrates, solar cell panels (hereinafter simply referred to as “panels for solar cells”) included in liquid crystal display devices and plasma display devices. The present invention relates to a technique for detecting the position of a substrate.

  In order to perform appropriate processing in a substrate processing apparatus that performs various processing on a substrate, it is important that the processing target substrate is placed in a relative positional relationship with respect to the processing target. It is. For this reason, in many substrate processing apparatuses, alignment of the substrate (processing for aligning the substrate so as to be in an appropriate position with respect to the processing unit) is performed prior to actual processing.

  In order to perform alignment properly, it is important to accurately detect the initial position of the substrate. In this regard, for example, Patent Document 1 discloses a technique for irradiating light on an edge of a substrate, detecting each position on the edge from the change in the amount of light, and specifying the position of the substrate based on the detected position. ing. Further, Patent Document 1 discloses a configuration in which an orientation flat or notch formed on the edge of the substrate is detected, and the rotational position of the substrate is specified based on the detected position. Patent Document 2 discloses a configuration in which a scribe line formed in an in-plane region of a substrate is detected and the rotational position of the substrate is adjusted based on the detected position. Patent Document 3 discloses a technique for avoiding erroneous detection of a notch by detecting the notch after adjusting the rotational position of the substrate based on the extending direction of the scribe line. On the other hand, Patent Document 4 discloses a configuration in which the intersection of scribe lines is detected and the position of the substrate is adjusted based on the detected position.

JP-A-10-242250 JP-A-6-69319 JP 2010-177691 A Japanese Patent Laid-Open No. 4-23341

  As described above, various techniques for detecting the position of the substrate have been proposed. However, in the aspect of detecting the edge position of the substrate and specifying the position of the substrate as in Patent Document 1, for example, when the edge of the substrate is roughened or chipped due to the process performed in advance, or There is a high possibility that the position of the substrate cannot be accurately detected when the edges are stepped in a bonded substrate (a substrate in which a semiconductor layer is bonded to a supporting substrate) or the like.

  When reliable information cannot be acquired from the edge of the substrate, the position of the substrate can only be specified using only information that can be acquired from the in-plane region of the substrate.

  However, in the aspect in which the position of the substrate is specified only from information that can be acquired from the in-plane region of the substrate, it is difficult to specify the position of the substrate quickly and accurately. For example, as in Patent Document 4, when the position of the substrate is specified by detecting the intersection of the scribe lines formed in the in-plane region of the substrate, if the substrate placement error is larger than the pitch of the intersection of the scribe lines, Since it is not uniquely identified which of the innumerable intersections in the in-plane region of the substrate is detected, there is a high possibility that the position of the substrate is erroneously specified. In other words, if one of the marks periodically present in the in-plane region is detected and the position of the substrate is specified, if the substrate placement error becomes larger than the mark existence cycle, the position of the substrate is accurately determined. There is a high possibility that it cannot be specified.

  For example, the above situation can be avoided if the position of the substrate is specified by detecting only one mark in the in-plane region of the substrate. However, in this case, if the substrate placement error increases, there is a high possibility that the unique mark will be missed in the field of view of the camera, and it will take time to detect the unique mark. As a result, it takes a long time to specify the position of the substrate.

  This invention is made in view of said subject, and it aims at providing the technique which can detect the position of a board | substrate rapidly and reliably using the information which can be acquired from the surface area of a board | substrate.

  A first aspect is a position detection device that detects a position of a substrate, a stage on which the substrate is placed, an imaging unit that images an in-plane region of the substrate placed on the stage, and the imaging A position specifying unit that specifies the position of the substrate based on the imaging data acquired by the unit, and the in-plane region of the substrate is partitioned by a grid-like scribe line, whereby a plurality of in-plane regions are provided in the in-plane region. A chip region is formed, and the position specifying unit analyzes the imaging data and detects a scribe line arranged on the outermost periphery of the scribe lines; and the outermost periphery Based on the detection position of the scribe line arranged on the center chip, the center chip is located at the center of the layout area where the plurality of chip areas are arranged. It includes a region specifying unit, based on the position of the central tip area, and the center position specifying unit for specifying the central position of the substrate.

  A second aspect is the position detection device according to the first aspect, wherein the central chip area specifying unit specifies a center position of the layout area based on a detection position of a scribe line arranged on the outermost periphery. Then, the position of the central chip area is specified based on the center position of the layout area.

  A 3rd aspect is a position detection apparatus which concerns on a 2nd aspect, Comprising: The said outermost periphery scribe line detection part is arrange | positioned at both ends among a group of 1st scribe lines extended in parallel with a 1st axis | shaft. And detecting a position of the pair of first scribe lines, and a pair of second scribe lines arranged at both ends of the group of second scribe lines extending in parallel with the second axis orthogonal to the first axis. 2, each position of the scribe line is detected, and the center chip region specifying part is located between the center line of the pair of first scribe lines arranged at both ends and the pair of second scribe lines arranged at both ends. The intersection position with the dotted line is acquired as the center position of the layout area.

  A fourth aspect is a position detection apparatus according to any one of the first to third aspects, and includes a drive unit that relatively moves the stage and the imaging unit, and detects the outermost scribe line. The image pickup unit picks up the image pickup unit while moving the image pickup unit relatively from the vicinity of the edge of the substrate along the radial direction of the substrate placed on the stage toward the vicinity of the center of the substrate. Data is acquired one after another, each of the acquired image data is analyzed in the order of acquisition, and the first detected scribe line is detected as a scribe line arranged on the outermost periphery.

  A fifth aspect is a position detection device according to any one of the first to fourth aspects, wherein the position specifying unit analyzes the imaging data and detects an extending direction of the scribe line. A direction detection unit; and a rotation position specifying unit that specifies a rotation posture of the substrate based on an extending direction of the scribe line.

  A 6th aspect is a drawing apparatus, Comprising: The position detection apparatus which detects the position of a board | substrate, the drawing stage which mounts the said board | substrate, and irradiates light toward the said board | substrate mounted in the said drawing stage A light irradiation unit that draws a pattern on the substrate, and a position adjustment unit that adjusts a placement position of the substrate on the drawing stage based on the position of the substrate specified by the position detection device, The position detection device includes a stage on which the substrate is placed, an imaging unit that images an in-plane region of the substrate placed on the stage, and a position of the substrate based on imaging data acquired by the imaging unit. A plurality of chip regions are formed in the in-plane region by dividing the in-plane region of the substrate by a grid-like scribe line, and the position specifying unit includes: The imaging Based on the outermost scribe line detection unit for detecting the scribe line arranged on the outermost periphery of the scribe lines, and the detection position of the scribe line arranged on the outermost periphery. A center chip area specifying unit for specifying the position of the center chip area arranged in the center of the layout area where the chip area is arranged, and a center for specifying the center position of the substrate based on the position of the center chip area A position specifying unit.

  A seventh aspect is a position detection method for detecting the position of a substrate, in which a) an in-plane region of the substrate placed on a stage is imaged, and b) an image acquired in the a) step. Identifying a position of the substrate based on the data, and by dividing the in-plane region of the substrate by a grid-like scribe line, a plurality of chip regions are formed in the in-plane region. And b) step b1) analyzing the imaging data to detect a scribe line arranged on the outermost periphery of the scribe lines; and b2) detecting a scribe line arranged on the outermost periphery. Identifying a position of a central chip area disposed in the center of a layout area in which the plurality of chip areas are disposed based on a position; b3) based on a position of the central chip area; And a step of identifying the center position of the substrate.

  According to the first and seventh aspects, the position of the scribe line arranged on the outermost periphery among the scribe lines formed on the substrate is detected, and the center position of the substrate is specified based on this. According to this configuration, the position of the substrate can be quickly and reliably specified only by the in-plane information of the substrate without using the edge information of the substrate.

  According to the second aspect, the center position of the layout area is specified based on the position of the scribe line arranged on the outermost periphery, and the position of the central chip area is specified based on the center position of the layout area. According to this configuration, the position of the central chip region can be specified easily and accurately.

  According to the third aspect, among the group of scribe lines extending in parallel, the center line of the pair of scribe lines arranged at both ends is specified, and the center line along the first axis and the center line along the second axis Is obtained as the center position of the layout area. According to this configuration, the position of the center of the layout area can be identified efficiently.

  According to the fourth aspect, the imaging unit is successively moved along the radial direction of the substrate placed on the stage from the vicinity of the edge of the substrate toward the center of the substrate, and the imaging data is successively transferred to the imaging unit. The acquired image data is analyzed in the order of acquisition, and the first detected scribe line is detected as the scribe line arranged on the outermost periphery. According to this structure, the scribe line arrange | positioned in the outermost periphery can be pinpointed correctly and rapidly.

  According to the fifth aspect, since the rotation posture of the substrate is specified based on the extending direction of the scribe line, the rotation position of the substrate can be detected only by the in-plane information of the substrate without using the edge information of the substrate.

  According to the sixth aspect, the position of the substrate is quickly and reliably specified only by the in-plane information of the substrate without using the edge information of the substrate, and the position of the substrate on the drawing stage is determined based on the specified position of the substrate. The placement position is adjusted. Therefore, it is possible to perform an appropriate drawing process on the substrate while suppressing a decrease in throughput.

It is a top view which shows a board | substrate typically. It is a figure which shows typically schematic structure of a position detection apparatus. It is a block diagram which shows the hardware constitutions of a control part. It is a block diagram which shows the function structure of a position detection apparatus. It is a figure which shows the whole flow of a position detection process. It is explanatory drawing which shows typically a mode that the temporary correction of a rotation position is performed. It is explanatory drawing which shows typically a mode that the correction | amendment of the rotation position is performed. It is a figure which shows the flow of the process which pinpoints the position of the center of a board | substrate. It is a figure for demonstrating the process which pinpoints the position of the center of a board | substrate. It is a figure for demonstrating the process which pinpoints the position of the center of a board | substrate. It is a figure which shows the flow of a detection process of an outermost periphery scribe line. It is a figure which shows the flow of the process which pinpoints the position of a center chip | tip area | region. It is a figure for demonstrating the process which pinpoints the position of a center chip | tip area | region. It is a figure for demonstrating the process which pinpoints the position of a center chip | tip area | region. It is a figure which shows typically the schematic structure of a drawing apparatus. It is a figure which shows the flow of a series of processes performed in a drawing apparatus.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. The following embodiment is an example embodying the present invention, and does not limit the technical scope of the present invention.

<1. Substrate 9>
Before describing the position detection device 1, the substrate 9 that is the target of the position detection device 1 will be described with reference to FIG. 1. FIG. 1 is a plan view schematically showing the substrate 9.

  A front-rear direction and a left-right direction orthogonal to the front-rear direction are defined in advance in the in-plane region of the substrate 9 that is the target in the position detection device 1. A plurality of scribe lines 91 parallel to the front-rear direction and a plurality of scribe lines 91 parallel to the left-right direction intersect to form a grid-like street. Each rectangular area surrounded by the scribe line 91 forms a chip area 92 corresponding to one chip. That is, in the in-plane region of the substrate 9, a plurality of chip regions 92 that are respectively arranged on lattice points are formed. In the in-plane region of the substrate 9, a region where a plurality of chip regions 92 are arranged is hereinafter referred to as “layout region 93”. Further, the scribe lines 91 forming the outer edge of the layout region 93 (that is, the scribe lines 91 arranged on the outermost periphery among the scribe lines 91 arranged in a lattice shape) are also referred to as “outermost scribe lines 910”. .

  Of the plurality of chip areas 92 arranged in the layout area 93, the chip area 92 arranged in the center of the layout area 93 (specifically, the center (geometric center) of the layout area 93 (hereinafter “layout center 930”)). The chip area 92) closest to the above is referred to as “central chip area 920”. However, when there are a plurality of chip regions 92 closest to the layout center 930, one chip region 92 that satisfies a predetermined condition among the plurality of chip regions 92 is selected as the central chip region 920. Conditions for selecting the center chip region 920 can be arbitrarily defined. In this embodiment, the chip area 92 whose left rear corner of the chip area 92 coincides with the layout center 930 is selected as the central chip area 920.

  Here, the positional relationship between the center chip region 920 and the center of the substrate 9 (hereinafter referred to as “substrate center 90”) is defined in advance at the design stage and can be acquired as a known value. Here, the “substrate center 90” refers to the geometric center of the main surface of the substrate 9 in an ideal state where the edge of the substrate 9 is not rough.

  Since the plurality of chip regions 92 are generally arranged in a layout that can acquire the largest number of chips from the in-plane region of the substrate 9, in many cases, as shown in FIG. 930 coincides with the substrate center 90. However, the layout center 930 does not always coincide with the substrate center 90, and the layout center 930 may be slightly shifted from the substrate center 90 depending on the type of the substrate 9. For example, when a notch such as an orientation flat or a notch is formed in the rear direction of the substrate 9, for example, the layout region 93 is arranged at a position slightly deviated in the front direction of the substrate 9 in order to avoid this. Sometimes. In such a case, the layout center 930 comes to a position shifted by a minute amount in the forward direction from the substrate center 90.

  A target mark 94 is defined at a fixed position in the in-plane area of the substrate 9 (in this embodiment, a fixed position in each chip area 92). That is, in the chip region 92, a large number of patterns of elements, pads, bumps, wirings, and the like, and photoresist patterns for forming them are formed, but among them, they are asymmetric in the front-rear and left-right directions and A layout of one pattern or a combination of a plurality of patterns that can be uniquely identified in the chip is selected as the target mark 94. If such a target mark 94 is defined, the direction of the substrate 9 can be uniquely specified by observing its shape.

<2. Position detecting device 1>
The configuration of the position detection device 1 will be described with reference to FIG. FIG. 2 is a diagram schematically illustrating a schematic configuration of the position detection device 1.

  The position detection device 1 is a device that detects the position of the substrate 9, and is a base 101, a stage 11 on which the substrate 9 is placed, and an imaging unit that images the upper surface of the substrate 9 placed on the stage 11. 12, a drive mechanism 13 that relatively moves the stage 11 and the imaging unit 12, and a control unit 14 that controls these units. Note that the imaging unit 12 may capture the pattern of the lower surface (back surface) of the substrate 9 with infrared light transmitted through the substrate 9.

<Stage 11>
The stage 11 has a flat plate-like outer shape, and is a holding unit that holds and holds the substrate 9 in a horizontal posture on the upper surface thereof. A plurality of suction holes (not shown) are formed on the upper surface of the stage 11, and by forming a negative pressure (suction pressure) in the suction holes, the substrate 9 placed on the stage 11 is placed on the stage 11. It can be fixedly held on the upper surface of the.

<Imaging unit 12>
The imaging unit 12 is a mechanism that images the upper surface of the substrate 9 placed on the stage 11. The imaging unit 12 can be composed of, for example, a light source composed of LEDs, a lens barrel, an objective lens, and a CCD image sensor composed of an area image sensor (two-dimensional image sensor). In response to an instruction from the control unit 14, the imaging unit 12 images the substrate 9 placed on the stage 11 and captures a part of the in-plane region of the substrate 9 to obtain two-dimensional image data (multitone Image data). In this embodiment, it is assumed that the imaging area captured by the imaging unit 12 at a time is smaller than the size of one chip area 92 on the substrate 9.

<Drive mechanism 13>
The drive mechanism 13 is a mechanism that is controlled by the control unit 14 and relatively moves the stage 11 and the imaging unit 12 along the θ axis and the R axis, for example, the stage 11 is moved along the θ axis. A θ driving mechanism 131 that rotates and an R driving mechanism 132 that moves the imaging unit 12 along the R axis are provided. However, the position detection apparatus 1 has an XY coordinate system (a coordinate system defined by the directions of two orthogonal axes defined in the upper surface of the base 101 (X direction and Y direction)) with respect to the base 101. XsYs coordinate system defined in the placement surface of the stage 11 (a seating system defined by the directions of the two orthogonal axes defined in the placement surface of the stage 11 (Xs direction and Ys direction)) Is stipulated. Assume that the origins of these XY coordinate system and XsYs coordinate system coincide with the center 110 of the mounting surface of the stage 11. Now, the R axis on which the imaging unit 12 is driven is an axis passing through the center 110 of the stage 11, and in this embodiment, it is assumed that the R axis coincides with the X axis. Further, the θ axis is a rotation direction around the rotation axis A (the rotation axis A passing through the center 110 of the stage 11 and perpendicular to the mounting surface of the stage 11).

<Control unit 14>
The control unit 14 is electrically connected to each unit included in the position detection device 1 and controls the operation of each unit of the position detection device 1 while executing various arithmetic processes.

  FIG. 3 is a block diagram illustrating a hardware configuration of the control unit 14. The control unit 14 includes, for example, a general computer in which a CPU 141, a ROM 142, a RAM 143, a storage device 144, and the like are interconnected via a bus line 145. The ROM 142 stores basic programs and the like, and the RAM 143 is used as a work area when the CPU 141 performs predetermined processing. The storage device 144 is configured by a nonvolatile storage device such as a flash memory or a hard disk device. The storage device 144 stores a program P. The CPU 141 as a main control unit performs arithmetic processing according to the procedure described in the program P, so that various functions are realized. The program P is normally stored and used in advance in a memory such as the storage device 144, but is recorded in a recording medium such as a CD-ROM or DVD-ROM or an external flash memory (program product). (Or provided by downloading from an external server via a network) and may be additionally or exchanged stored in a memory such as the storage device 144. Note that some or all of the functions realized in the control unit 14 may be realized in hardware by a dedicated logic circuit or the like.

  In the control unit 14, an input unit 146, a display unit 147, and a communication unit 148 are also connected to the bus line 145. The input unit 146 includes various switches, a touch panel, and the like, and receives various input setting instructions from an operator. The display unit 147 includes a liquid crystal display device, a lamp, and the like, and displays various information under the control of the CPU 141. The communication unit 148 has a data communication function via a LAN or the like. Further, in the control unit 14, interfaces 149 a and 149 b are connected to the bus line 145. The interface 149 a is connected to the imaging unit 12, and the interface 149 b is connected to the drive mechanism 13, and exchanges information with these units 12 and 13.

  Information that defines the positional relationship between the substrate center 90 and the central chip region 920 of the substrate 9 that is a position detection target is given to the position detection device 1 in advance, and is stored in the storage device 144. The storage device 144 also stores template image data used for detecting the scribe line 91, the target mark 94, and the like.

<3. Functional configuration>
A functional configuration realized in the position detection apparatus 1 will be described with reference to FIG. FIG. 4 is a block diagram illustrating a functional configuration of the position detection device 1.

  The position detection device 1 includes a position specifying unit 20 that detects the position of the substrate 9 placed on the stage 11. The position specifying unit 20 is realized in the control unit 14 by, for example, the CPU 141 performing predetermined arithmetic processing according to the program P, or by hardware using a dedicated logic circuit or the like.

  The position specifying unit 20 includes a rotational position correcting unit 21 and a center position detecting unit 22.

<Rotation position correction unit 21>
The rotational position correction unit 21 is a functional unit that corrects the rotational position of the substrate 9 so that the substrate 9 is in an upright state, and includes a line direction detection unit 211, a target mark detection unit 212, and a rotation angle specification unit 213. And a drive mechanism control unit 214. However, in the “upright state”, the directions of the two orthogonal axes defined in the in-plane region of the substrate 9 (the front-rear direction and the left-right direction) are in a rotational positional relationship defined with respect to the XY coordinate system. In this embodiment, for example, a state in which the front direction of the substrate 9 coincides with the −Y direction is defined as an upright state.

  The line direction detection unit 211 analyzes the imaging data acquired by the imaging unit 12 and detects the extending direction of the scribe line 91 formed on the substrate 9 on the stage 11.

  The target mark detection unit 212 analyzes the imaging data acquired by the imaging unit 12 and detects the target mark 94 formed on the substrate 9 on the stage 11.

  The rotation angle specifying unit 213 specifies the rotation angle of the substrate 9. Specifically, the rotation angle identification unit 213 identifies the rotation angle of the substrate 9 (“temporary rotation angle θ1” described later) based on the extending direction of the scribe line 91 detected by the line direction detection unit 211. Further, the rotation angle of the substrate 9 (“correct rotation angle θ2” described later) is specified based on the detection result of the target mark 94 by the target mark detection unit 212.

  The drive mechanism control unit 214 corrects the rotational position of the substrate 9 by controlling the drive mechanism 13 based on the rotation angle of the substrate 9 specified by the rotation angle specifying unit 213.

<Center position detection unit 22>
The center position detection unit 22 is a functional unit that detects the substrate center 90, and includes an outermost peripheral line detection unit 221, a center chip region specifying unit 222, and a center position specifying unit 223.

  The outermost peripheral line detection unit 221 analyzes the imaging data acquired by the imaging unit 12 and scribe lines 91 (outermost peripheral scribe lines 910) arranged on the outermost periphery among the scribe lines 91 formed on the substrate 9. Is detected. Specifically, the outermost peripheral line detection unit 221 relatively moves the imaging unit 12 from the vicinity of the edge of the substrate 9 toward the center of the substrate 9 along the radial direction of the substrate 9 placed on the stage 11. While moving, the imaging unit 12 acquires imaging data one after another, analyzes each imaging data acquired one after another, and detects the scribe line 91 detected first as the outermost scribe line 910. .

  The center chip area specifying unit 222 specifies the position of the center chip area 920 disposed in the center of the layout area 93 based on the detection position of the outermost peripheral scribe line 910. Specifically, the center chip area specifying unit 222 specifies the position of the layout center 930 based on the detection position of the outermost peripheral scribe line 910, and determines the position of the center chip area 920 based on the position of the layout center 930. Identify.

  The center position specifying unit 223 specifies the position of the substrate center 90 based on the position of the center chip region 920. However, as described above, the position detection device 1 is preliminarily provided with information defining the positional relationship between the central chip region 920 and the substrate center 90, and the center position specifying unit 223 determines the substrate center based on the information. 90 positions are specified.

<4. Process flow>
<4-1. Overall flow>
The overall flow of processing (position detection processing) in which the position detection device 1 detects the position of the substrate 9 will be described with reference to FIG. FIG. 5 is a diagram showing the overall flow of the position detection process.

  When the substrate 9 is placed on the stage 11, first, the rotational position correction unit 21 temporarily corrects the rotational position of the substrate 9 (step S1).

  The process of step S1 will be described with reference to FIG. FIG. 6 is an explanatory diagram schematically showing how the rotational position is temporarily corrected. First, the line direction detection unit 211 detects the extending direction of the scribe line 91 formed on the substrate 9 on the stage 11. Specifically, the line direction detection unit 211 controls the drive mechanism 13 to move the imaging unit 12 to a predetermined position such that at least one scribe line 91 falls within the field of view. 12, the predetermined region M1 in the in-plane region of the substrate 9 is imaged. Then, the acquired imaging data is analyzed, any one of the scribe lines 91 being imaged is detected, and the extending direction is specified. The scribe line 91 is detected by, for example, pattern matching with template image data stored in advance in the storage device 144.

  Subsequently, the rotation angle identification unit 213 identifies the provisional rotation angle θ1 of the substrate 9 based on the extending direction of the scribe line 91 detected by the line direction detection unit 211. Specifically, an angle formed by the scribe line 91 with, for example, the + X direction is calculated, and this is acquired as a temporary rotation angle θ1 of the substrate 9. However, at this stage, the temporary rotation angle θ1 is an angle formed by the scribe line 91 extending in the front-rear direction of the substrate 9 and the X axis, or the scribe line 91 extending in the left-right direction of the substrate 9 is the X axis. It is not possible to specify whether the angle is the angle between. That is, at this stage, it is not possible to accurately specify how much the substrate 9 is deviated from the upright state.

  Subsequently, the drive mechanism control unit 214 controls the drive mechanism 13 to rotate the stage 11 in the −θ direction by the provisional rotation angle θ1 of the substrate 9. Thereby, the rotational position of the substrate 9 is temporarily corrected. Specifically, each scribe line 91 formed on the substrate 9 is in a state parallel to the X axis or the Y axis. However, at this stage, it cannot be determined whether the scribe line 91 extending in the front-rear direction and the left-right direction of the substrate 9 is parallel to the X-axis or the Y-axis. That is, at this stage, the substrate 9 may be in an upright state, or may be in a rotational position that is deviated by 90 degrees, 180 degrees, or 270 degrees from the upright state.

  Refer to FIG. 5 again. When the rotational position of the substrate 9 is provisionally corrected, the center position detector 22 then detects the position of the substrate center 90 (step S2). Specifically, the center position detection unit 22 identifies the position of the central chip region 920, and based on the identified position of the central chip region 920, the position of the substrate center 90 is within the XsYs coordinate system (as a result, Specify (within the XY coordinate system) (upper row in FIG. 7). Further, the rotational position correcting unit 21 positively corrects the rotational position of the substrate 9 (step S3). Specifically, the drive mechanism control unit 214 controls the drive mechanism 13 to rotate the stage 11 so that the front direction of the substrate 9 coincides with the −Y direction (lower stage in FIG. 7). That is, the substrate 9 is brought into an upright state. The processing of step S2 to step S3 will be specifically described later.

  This completes the position detection process. By performing the series of processes described above, the substrate 9 placed on the stage 11 is placed in an upright state, and the position of the substrate center 90 is specified in the XY coordinate system of the apparatus.

<4-2. Specification of substrate center 90 and positive correction of rotational position>
A series of processes in steps S2 to S3 in FIG. 5 will be specifically described with reference to FIGS. FIG. 8 is a diagram showing the flow of the processing. 9 and 10 are explanatory diagrams schematically showing how the processing is performed.

  As shown in the lower part of FIG. 6 or the upper part of FIG. 9 at the stage where the temporary correction in step S1 is performed, the front-rear direction and the left-right direction of the substrate 9 placed on the stage 11 are represented by X The scribe lines 91 formed on the substrate 9 are parallel to the X axis and the Y axis, respectively. In this state, it is assumed that the Xs axis of the coordinate system (XsYs coordinate system) of the stage 11 is defined in a direction parallel to the X axis, and the Ys axis is defined in a direction parallel to the Y axis. Therefore, the extending direction of each scribe line 91 formed on the substrate 9 is parallel to each of the Xs axis and the Ys axis.

  First, the outermost peripheral line detection unit 221 detects the outermost peripheral scribe line 910 at the end portion on the −R side of the substrate 9 placed on the stage 11. Now, the -R direction coincides with the -Xs direction. Therefore, here, the outermost peripheral scribe line 910a on the −Xs side (that is, the scribe line 91 arranged on the most −Xs side among the group of scribe lines 91 extending in parallel with the Ys axis) is detected, and The Xs coordinate position of the outermost scribe line 910a is specified (upper stage in FIG. 9) (step S11).

  Here, in addition to FIG. 9, refer to FIG. 11 for processing in which the outermost peripheral line detection unit 221 detects the outermost peripheral scribe line 910 at the −R side end of the substrate 9 placed on the stage 11. Specific explanation will be given. FIG. 11 is a diagram showing the flow of the processing.

  The outermost peripheral line detection unit 221 first moves the imaging unit 12 to a predetermined initial position (step S101), and then causes the imaging unit 12 to image a predetermined area M11 in the in-plane area of the substrate 9 (step S101). S102). Here, specifically, the initial position is directly above the position where the outer edge of the layout area 93 of the substrate 9 comes when the substrate 9 is placed on the stage 11 with the position being displaced to the maximum in the −R direction. Stipulated in If the initial position is defined in this way, the area M11 captured by the imaging unit 12 arranged at the initial position is always (that is, no matter how the substrate 9 is placed on the stage 11). This is always a region including the outer edge of the layout region 93 of the substrate 9 or a region outside the layout region 93.

  Subsequently, the outermost peripheral line detection unit 221 analyzes the imaging data acquired in step S102 and detects a scribe line 91 orthogonal to the R axis (step S103). As described above, the scribe line 91 is detected by, for example, pattern matching with template image data stored in advance in the storage device 144.

  If the scribe line 91 orthogonal to the R axis is not detected in step S103 (NO in step S103), it means that the area M11 previously captured is outside the layout area 93. In this case, the outermost peripheral line detection unit 221 moves the imaging unit 12 in the + R direction (that is, toward the vicinity of the center of the substrate 9) (step S104) and is adjacent to the + R side of the previously imaged region M11. The region M12 to be imaged is imaged (step S102). Then, the newly acquired imaging data is analyzed, and the scribe line 91 orthogonal to the R axis is detected again (step S103).

  When the scribe line 91 orthogonal to the R axis is detected in step S103 (YES in step S103), the outermost peripheral line detection unit 221 determines that the detected scribe line 91 is the outermost peripheral scribe line 910. . That is, in step S103, it has been confirmed that the scribe line 91 orthogonal to the R axis does not exist in the region on the −R side from the imaging region of the imaging data to be analyzed. As described above, the imaging of the imaging unit 12 is performed. Since the area is smaller than the size of one chip area 92 on the substrate 9, the scribe line 91 (the scribe line 91 orthogonal to the R axis) that can be detected from the imaging data obtained by one imaging is 1 at the maximum. It is a piece. Therefore, when the scribe line 91 orthogonal to the R axis is detected in step S103, the scribe line 91 can be determined as the outermost peripheral scribe line 910. When the outermost periphery scribe line 910 is detected, the outermost periphery scribe line 221 detects the position of the outermost periphery scribe line 910 (when the detected outermost periphery scribe line 910 extends in parallel with the Ys axis). Identifies the Xs coordinate position of the outermost scribe line 910, or the Ys coordinate position of the outermost scribe line 910 if the detected outermost scribe line 910 extends parallel to the Xs axis) Then, the position information is stored (step S105). Here, as described in <Imaging unit 12> above, it is assumed that the imaging region of the imaging unit 12 is smaller than the size of one chip region 92 on the substrate 9. When the imaging area is larger than the size of one chip area 92, a plurality of scribe lines 91 may be detected in the imaging data. In that case, the most -R side scribe line 91 among the plurality of detected scribe lines 91 can be determined as the outermost peripheral scribe line 910.

  As described above, the outermost peripheral line detection unit 221 moves the imaging unit 12 to the imaging unit 12 while relatively moving the imaging unit 12 from the vicinity of the edge of the substrate 9 toward the center of the substrate 9 along the radial direction of the substrate 9. The imaging data is acquired one after another, each of the acquired imaging data is analyzed in the order of acquisition, and the scribe line 91 detected first is detected as the outermost scribe line 910.

  Reference is again made to FIGS. When the Xs position of the outermost scribe line 910a on the −Xs side is specified, the outermost line detection unit 221 subsequently controls the θ driving mechanism 131 to rotate the stage 11 by 180 degrees along the θ axis. Then, the outermost scribe line 910 at the end portion on the −R side of the substrate 9 placed on the stage 11 is detected again. When the stage 11 is rotated 180 degrees along the θ axis, the −R direction coincides with the + Xs direction. Therefore, here, the outermost scribe line 910b on the + Xs side (that is, the scribe line 91 arranged on the most + Xs side among the group of scribe lines 91 extending in parallel with the Ys axis) is detected, and the outermost scribe line 91 is detected. The Xs coordinate position of the scribe line 910b is specified (the lower part of FIG. 9) (step S12).

  When the Xs position of the outermost scribe line 910b on the + Xs side is specified, the outermost periphery line detection unit 221 then controls the θ drive mechanism 131 to rotate the stage 11 by 90 degrees along the θ axis. Then, the outermost scribe line 910 at the end portion on the −R side of the substrate 9 placed on the stage 11 is detected again. When the stage 11 is rotated 90 degrees along the θ axis, the −R direction coincides with the −Ys direction. Therefore, here, the outermost scribe line 910c on the -Ys side (that is, the scribe line 91 arranged on the most -Ys side among the group of scribe lines 91 extending in parallel with the Xs axis) is detected, and The Ys coordinate position of the outermost peripheral scribe line 910c is specified (upper stage in FIG. 10) (step S13).

  When the Ys position of the outermost scribe line 910c on the −Ys side is specified, the outermost line detection unit 221 subsequently controls the θ driving mechanism 131 to rotate the stage 11 by 180 degrees along the θ axis. Then, the outermost scribe line 910 at the end portion on the −R side of the substrate 9 placed on the stage 11 is detected again. When the stage 11 is rotated 180 degrees along the θ axis, the −R direction coincides with the + Ys direction. Therefore, here, the outermost scribe line 910d on the + Ys side (that is, the scribe line 91 arranged on the most + Ys side among the group of scribe lines 91 extending in parallel with the Xs axis) is detected, and the outermost scribe line 91 is detected. The Ys coordinate position of the scribe line 910d is specified (the lower part of FIG. 10) (step S14).

  By performing the processing of step S11 to step S14, each Xs position of the pair of outermost scribe lines 910a and 910b disposed at both ends of the group of scribe lines 91 extending in parallel with the Ys axis, and the Xs axis The Ys positions of the pair of outermost scribe lines 910c and 910d arranged at both ends of the group of scribe lines 91 extending in parallel with each other are specified. When the positions of the outermost peripheral scribe lines 910a, 910b, 910c, and 910d are specified, the center chip area specifying unit 222 then specifies the position of the center chip area 920 (step S15). Note that the process of step S15 does not have to be started after all the processes of steps S11 to S14 are completed, and may be started when the process of step S12 is completed, for example.

  The process of step S15 will be specifically described with reference to FIGS. FIG. 12 is a diagram showing the flow of the processing. 13 and 14 are diagrams for explaining the processing.

  First, the center chip region specifying unit 222 checks whether or not each Xs position of the pair of outermost scribe lines 910a and 910b extending in parallel with the Ys axis is an appropriate value (step S201). Specifically, the center chip area specifying unit 222 calculates a separation distance ΔXs about the Xs axis of the pair of outermost scribe lines 910a and 910b, and the calculated value is the length of the chip area 92 in the front-rear direction. It is determined whether at least one of an integral multiple of d1 (see FIG. 1) and an integral multiple of the horizontal length d2 of the chip region 92 (see FIG. 1) is satisfied.

  When a negative result is obtained in step S201 (that is, when the separation distance ΔXs is neither an integer multiple of the length d1 nor an integer multiple of the length d2), the central chip area specifying unit 222 has a pair of It is determined that each Xs position of the outermost scribe lines 910a and 910b is not an appropriate value, and after a predetermined error process is performed, the process ends.

  On the other hand, when a positive evaluation is obtained in step S201, the center chip region specifying unit 222 determines that the Xs positions of the pair of outermost scribe lines 910a and 910b are appropriate values. In this case, the center chip region specifying unit 222 subsequently extends in parallel with the Ys axis based on the Xs positions of the pair of outermost scribe lines 910a and 910b, and the pair of outermost scribe lines 910a, The Xs position of the center line passing through the middle of 910b (hereinafter referred to as “first center line C1”) is specified (step S202). The first center line C1 extends parallel to the Ys axis and passes through the layout center 930.

  Subsequently, the center chip region specifying unit 222 checks whether or not each Ys position of the pair of outermost scribe lines 910c and 910d extending in parallel with the Xs axis is an appropriate value (step S203). This process is the same as the process in step S201 described above. That is, the center chip area specifying unit 222 calculates the separation distance ΔYs about the Ys axis of the pair of outermost scribe lines 910c and 910d, and the calculated value is an integer of the length d1 of the chip area 92 in the front-rear direction. It is determined whether at least one of the multiple and the integral multiple of the horizontal length d2 of the chip region 92 is satisfied.

  When a negative result is obtained in step S203, the center chip area specifying unit 222 determines that each Ys position of the pair of outermost scribe lines 910c and 910d is not an appropriate value, and performs a predetermined error process. Above, the process ends.

  On the other hand, when a positive evaluation is obtained in step S203, the center chip region specifying unit 222 determines that each Ys position of the pair of outermost scribe lines 910c and 910d is an appropriate value. In this case, the center chip region specifying unit 222 subsequently extends in parallel with the Xs axis based on each Ys position of the pair of outermost scribe lines 910c and 910d, and the pair of outermost scribe lines 910c, The Ys position of the center line passing through the middle of 910d (hereinafter referred to as “second center line C2”) is specified (step S204). The second center line C2 extends in parallel with the Xs axis and passes through the layout center 930.

  Subsequently, the center chip area specifying unit 222 specifies the position of the intersection of the first center line C1 and the second center line C2, and acquires this as the position of the layout center 930 (step S205). As a result, the position of the layout center 930 is specified in the XsYs coordinates.

  As described above, the central chip region 920 has a predetermined positional relationship with respect to the layout center 930. Therefore, when the position of the layout center 930 is specified, the central chip area specifying unit 222 specifies the position of the central chip area 920 in the XsYs coordinates based on the position of the layout center 930 (step S206).

  The process of step S206 will be specifically described. At the stage where the process of step S205 is completed, since the rotational position of the substrate 9 is not accurately specified, the scribe line 91 extending in the front-rear direction and the left-right direction of the substrate 9 is either the Xs axis or the Ys axis. It cannot be determined whether they are in parallel. Therefore, the position of the central chip region 920 corresponding to the layout center 930 may be four depending on the rotational position of the substrate 9 with respect to the upright state, as shown in FIG. 14, and the central chip region 920 actually exists. The position to do is one of the four ways. Therefore, the central chip region specifying unit 222 first determines the position D1 of the central chip region 920 when the substrate 9 is deviated from the upright state by 0 degrees (that is, there is no deviation from the erect state), the substrate 9. The position D2 of the central chip region 920 when the substrate 9 is deviated 90 degrees from the upright state, the position D3 of the central chip region 920 when the substrate 9 is deviated 180 degrees from the upright state, and the substrate 9 are The position D4 of the center chip area 920 when it is assumed that the position is shifted by 270 degrees from the standing state is calculated.

  Subsequently, for each case where the central chip area 920 exists at each of the four positions D1, D2, D3, and D4 according to the calculation result, the target mark detection unit 212 sets the target mark in the central chip area 920. The imaging unit 12 is caused to image a region where 94 should exist.

  Subsequently, the target mark detection unit 212 detects the target mark 94 for each of the obtained four images, and whether or not the target mark 94 exists in the image at a predetermined position and a predetermined posture. Judging. This determination is made, for example, by pattern matching with template image data stored in advance in the storage device 144.

  Of the four image data, only one target mark 94 actually exists at a predetermined position and a predetermined posture in the image. Therefore, when it is specified which of the four images has the target mark 94 in a predetermined position and a predetermined posture, the position captured by the image is indicated by the central chip region 920. It can be said that it is a position that actually exists. Therefore, the central chip area specifying unit 222 acquires, as the position of the central chip area 920, the XsYs coordinate of the position where the central chip area 920 is actually found out of the four positions D1, D2, D3, and D4.

  Note that when it is specified which of the four images has the target mark 94 in a predetermined position and a predetermined posture, the position of the central chip region 920 is determined, and at the same time, the correct position of the substrate 9 is determined. It is also determined whether the rotational deviation amount from the standing state is 0 degree, 90 degrees, 180 degrees, or 270 degrees. Therefore, the rotation angle specifying unit 213 acquires the rotation deviation amount from the upright state of the substrate 9 found here as the correct rotation angle θ2 of the substrate 9.

  Refer to FIG. 8 again. As described above, the position of the central chip region 920 and the position of the substrate center 90 are known values defined in advance. Therefore, when the position of the center chip area 920 is specified in the XsYs coordinates in step S15, the center position specifying unit 223 subsequently determines the position of the substrate center 90 based on the position of the center chip area 920 in the XsYs coordinates. It is specified in the system (step S16). However, since the relationship between the XY coordinate system and the XsYs coordinate system is always grasped by the control unit 14, when the position of the substrate center 90 is specified in the XsYs coordinate system, the substrate center 90 in the XY coordinate system is immediately determined. The position will be specified.

  Subsequently, the rotational position correcting unit 21 positively corrects the rotational position of the substrate 9 in accordance with the correct rotational angle θ2 of the substrate 9 (step S17). As described above, the rotation angle specifying unit 213 specifies whether the correct rotation angle θ2 of the substrate 9 is 0 degree, 90 degrees, 180 degrees, or 270 degrees based on the position where the target mark 94 is detected. ing. Therefore, the drive mechanism control unit 214 controls the drive mechanism 13 to rotate the stage 11 according to the rotation angle θ2 so that the front direction of the substrate 9 coincides with the −Y direction (lower stage in FIG. 7). . That is, the substrate 9 is brought into an upright state.

<5. Drawing device 3>
<5-1. Configuration>
Next, the configuration of the drawing device 3 on which the position detection device 1 is mounted will be described with reference to FIG. FIG. 15 is a schematic diagram illustrating a schematic configuration of the drawing apparatus 3.

  The drawing device 3 continuously performs local exposure on the drawing target by irradiating laser light, which is exposure light, while scanning, and draws an exposure image of a desired circuit pattern on the drawing target. This is a direct drawing apparatus (direct drawing apparatus), and includes a drawing stage 31, a drawing stage drive mechanism 32, and an optical head 33. Furthermore, the position detection apparatus 1 mentioned above and the conveyance apparatus 34 which delivers the board | substrate 9 between the position detection apparatus 1 and the drawing stage 31 are provided. Moreover, the control part 35 which obtains and controls these each part is provided.

<Drawing stage 31>
The drawing stage 31 has a flat outer shape, and is a holding unit that places and holds the substrate 9 that is a drawing target in a horizontal posture on the upper surface thereof. A plurality of suction holes (not shown) are formed on the upper surface of the drawing stage 31. By forming a negative pressure (suction pressure) in the suction holes, the substrate 9 placed on the drawing stage 31 is removed. It can be fixedly held on the upper surface of the drawing stage 31.

<Drawing stage drive mechanism 32>
The drawing stage drive mechanism 32 is a mechanism for moving the drawing stage 31 with respect to the base 301. The drawing stage 31 moves the drawing stage 31 in the main scanning direction, the sub-scanning direction orthogonal to the main scanning direction, and the rotation direction (rotation about the vertical axis). Move in each direction.

<Optical head 33>
The optical head 33 is a mechanism for drawing a circuit pattern on the substrate 9 by irradiating the upper surface of the substrate 9 placed on the drawing stage 31 with light for exposure. The optical head 33 mainly includes a light source 331 and a modulation unit 332.

  The light source 331 emits laser light. The light emitted from the light source 331 is converted into linear light having a uniform intensity distribution (line beam whose light beam cross section is linear light) via an illumination optical system (not shown), and then the modulation unit 332. Is incident on.

  The modulation unit 332 is a functional unit that performs spatial modulation on the light emitted from the light source 331. However, spatially modulating light specifically means changing the spatial distribution of light (amplitude, phase, polarization, etc.). The modulation unit 332 includes, for example, a GLV (Grating Light Valve) (registered trademark of Silicon Light Machines (San Jose, Calif.)) Which is a diffraction grating type spatial light modulator. Can do. Further, for example, a configuration including a spatial light modulator in which micromirrors that are modulation units, such as DMD (Digital Micromirror Device: registered trademark of Texas Instruments), are two-dimensionally arranged may be employed. Further, for example, a configuration including a spatial light modulator in which modulation units such as mirrors are arranged one-dimensionally may be employed.

  The modulation unit 332 includes, for example, M spatial modulation elements arranged along the sub-scanning direction, and each spatial modulation element performs on / off setting of laser light irradiation according to the control of the control unit 35. . As a result, spatially modulated light for M pixels along the sub-scanning direction is emitted from the modulation unit 332. However, the control unit 35 drives the modulation unit 332 according to drawing data describing a circuit pattern group to be drawn on the substrate 9. Therefore, from the modulation unit 332, spatially modulated light for M pixels subjected to modulation based on drawing data is emitted.

  In this configuration, while the optical head 33 is moved relative to the substrate 9 placed on the drawing stage 31 in the main scanning direction, the spatially modulated light for M pixels along the sub-scanning direction is intermittently emitted. The circuit pattern group (the circuit pattern group described in the drawing data) is drawn on the substrate 9 by emitting the light to the surface (that is, continuously projecting the pulsed light on the surface of the substrate 9).

<Conveyor 34>
The transport device 34 includes two hands 341 and 341 for supporting the substrate 9 and a hand drive mechanism 342 that moves the hands 341 and 341 independently. Each hand 341 is moved back and forth and moved up and down by being driven by a hand drive mechanism 342, and transfers the substrate 9 between the drawing stage 31 and the position detection device 1.

<Position detection device 1>
The position detection device 1 is a device that detects the position of the substrate 9 and performs position detection processing on an unprocessed substrate 9 before drawing processing. The configuration and operation of the position detection device 1 are as described above. The control unit 14 of the position detection device 1 is realized by the control unit 35 of the drawing device 3.

<Control unit 35>
The control unit 35 is electrically connected to each unit included in the drawing device 3 and controls the operation of each unit of the drawing device 3 while executing various arithmetic processes. The control unit 35 can be configured by a general computer (see FIG. 3). The storage device of the control unit 35 stores data (drawing data) describing a pattern to be exposed on the substrate 9, and the control unit 35 controls the optical head 33 based on the drawing data as described above. To do. The drawing data is, for example, data obtained by rasterizing CAD data generated using CAD, and is data in which presence / absence of exposure for each pixel position is set. The control unit 35 acquires drawing data and stores it in a storage device prior to a series of processes for the substrate 9. The acquisition of drawing data may be performed by receiving from an external terminal device connected via a network or the like, or may be performed by reading from a recording medium.

<5-2. Operation>
The operation of the drawing apparatus 3 will be described with reference to FIG. FIG. 16 is a diagram illustrating a flow of a series of processes performed in the drawing apparatus 3. A series of operations described below is performed under the control of the control unit 35.

  First, the transport device 34 takes out the unprocessed substrate 9 from the cassette placed on the cassette placement portion (not shown) and carries it into the drawing device 3 (step S301).

  The transport device 34 first places the substrate 9 carried into the drawing device 3 on the stage 11 of the position detection device 1. In the position detection apparatus 1, a process (position detection process) for detecting the position of the substrate 9 placed on the stage 11 is performed (step S302). The specific flow of the processing is as described above. By performing the position detection processing, the substrate 9 placed on the stage 11 is placed in an upright state, and the position of the substrate center 90 is determined in the coordinate system of the position detection device 1 and, in turn, in the coordinate system of the drawing device 3. Identified.

  When the position detection process is completed, the transfer device 34 subsequently carries the substrate 9 out of the position detection device 1 and places it on the drawing stage 31 (step S303). However, when the transport device 34 picks up the substrate 9 placed on the stage 11 with the hand 341, the transport device 34 adjusts the position of the hand 341 in accordance with the position information of the substrate center 90 specified in step S302, and the hand 341. The substrate 9 is picked up so that the position determined with respect to (for example, the center of the hand 341) coincides with the substrate center 90. Then, the substrate 9 held on the hand 341 is placed on the drawing stage 31 so that the center of the hand 341 coincides with the center of the drawing stage 31. As a result, the substrate 9 is placed on the drawing stage 31 with the substrate center 90 aligned with the center of the drawing stage 31. That is, in the drawing apparatus 3, the transport device 34 functions as a position adjustment unit that adjusts the placement position of the substrate 9 on the drawing stage 31 based on the position of the substrate 9 specified by the position detection device 1.

  When the substrate 9 is placed on the upper surface of the drawing stage 31, the drawing stage 31 sucks and holds it. When the substrate 9 is held by suction on the drawing stage 31, a pattern drawing process is performed on the substrate 9 (step S304). In the drawing process, the control unit 35 causes the drawing stage drive mechanism 32 to move the drawing stage 31 along the main scanning direction (main scanning), and moves the drawing stage 31 along the sub scanning direction (sub scanning direction). Scanning) is repeated. On the other hand, while the drawing stage 31 is moved along the main scanning direction, the control unit 35 draws drawing light on the optical head 33 (M pixels along the sub-scanning direction in which spatial modulation corresponding to the drawing data is formed). Minute light) is generated, and this is intermittently irradiated toward the substrate 9. Therefore, every time one main scan is completed, a pattern for one stripe is drawn on the surface of the substrate 9 by the optical head 33. When one main scan is completed, the drawing stage drive mechanism 32 moves the drawing stage 31 by a distance corresponding to the width of one stripe along the sub-scanning direction (sub-scanning). When the sub-scanning is completed, the main scanning is performed again. Here, a pattern for one stripe is drawn on the substrate 9 by the optical head 33, and thereby a drawing area for one stripe drawn earlier is drawn. Next, a pattern for one stripe is drawn. By repeating main scanning and sub-scanning a predetermined number of times, a pattern is drawn on the entire surface of the substrate 9.

  When the pattern is drawn on the entire upper surface of the substrate 9, the transfer device 34 carries out the processed substrate 9 (step S305). Thus, a series of processes for the substrate 9 is completed.

<6. Effect>
In the position detection apparatus 1 according to the above-described embodiment, the position of the outermost peripheral scribe line 910 arranged on the outermost periphery among the scribe lines 91 formed on the substrate 9 is detected, and based on this, the center of the substrate is detected. 90 positions are specified. According to this configuration, the position of the substrate 9 can be quickly and reliably specified only by the in-plane information of the substrate 9 without using the edge information of the substrate 9.

  In particular, in the position detection device 1 according to the above-described embodiment, the position of the layout center 930 is specified based on the position of the outermost peripheral scribe line 910, and the center chip region 920 is determined based on the position of the layout center 930. Identify the location. According to this configuration, the position of the central chip region 920 can be specified easily and accurately.

  In particular, in the position detection device 1 according to the above-described embodiment, the center line (first center line C1) of the outermost peripheral scribe lines 910a and 910b extending in parallel with the first axis is orthogonal to the first axis. The center lines (second center line C2) of the outermost scribe lines 910c and 910d extending in parallel with the second axis are specified, and the intersection position of these center lines C1 and C2 is acquired as the position of the layout center 930. According to this configuration, the position of the layout center 930 can be identified efficiently.

  In particular, in the position detection device 1 according to the above-described embodiment, the imaging unit 12 is directed from the vicinity of the edge of the substrate 9 toward the vicinity of the center of the substrate 9 along the radial direction of the substrate 9 placed on the stage 11. While relatively moving, the imaging unit 12 acquires imaging data one after another, analyzes each imaging data acquired one after another in the order of acquisition, and first detects the scribe line 91 as the outermost scribe line 910. Detect as. According to this configuration, the outermost peripheral scribe line 910 can be specified accurately and promptly.

  In particular, in the position detection device 1 according to the above-described embodiment, since the rotation posture of the substrate 9 is specified based on the extending direction of the scribe line 91, the in-plane of the substrate 9 is not used without using the edge information of the substrate 9. The rotational position of the substrate 9 can be detected only by information.

  In particular, in the drawing apparatus 3 according to the above-described embodiment, the position of the substrate 9 can be quickly and surely specified only by the in-plane information of the substrate 9 without using the edge information of the substrate 9, and the specified substrate 9, the mounting position of the substrate 9 on the drawing stage 31 is adjusted. Therefore, an appropriate drawing process can be performed on the substrate 9 while suppressing a decrease in throughput.

<7. Modification>
In the above embodiment, in the process of step S206, four positions where the central chip region 920 may exist are assumed, and the target mark 94 is detected for each position. This embodiment has an advantage that it can be applied to any shape (for example, square) of the chip region 92. Here, for example, when the chip area 92 is rectangular, in step S201, when the separation distance ΔXs is, for example, an integral multiple of the length d1 in the front-rear direction of the chip area 92, the front-rear direction of the substrate 9 is the Xs axis. Specified along. Therefore, the posture of the central chip region 920 is limited to two postures in which the front-rear direction is along the Xs axis. Conversely, if the separation distance ΔXs is an integral multiple of the length d2 of the chip region 92 in the left-right direction in step S201, the left-right direction of the substrate 9 is specified to be along the Xs axis. Therefore, in this case, the posture of the central chip region 920 is limited to two postures in which the horizontal direction is along the Xs axis. In this manner, the position of the central chip area 920 is narrowed down in two ways according to the result of step S201, and only the positions of the target marks 94 corresponding to the two central chip areas 920 are imaged to perform pattern matching. Also good. The same applies to the case where the separation distance ΔYs is an integral multiple of the length d1 or the length d2 in step S203. This modification is particularly effective when the difference between the length d1 in the front-rear direction and the length d2 in the left-right direction of the center chip region 92 chips is large.

  Further, the drive mechanism 13 according to the above embodiment is necessarily configured to include the θ drive mechanism 131 that rotates the stage 11 in the θ direction and the R drive mechanism 132 that moves the imaging unit 12 in the R direction. There is no need. For example, the drive mechanism 13 may include a mechanism that moves the imaging unit 12 relative to the fixed stage 11 in the R direction and the θ direction. On the contrary, it is good also as a structure provided with the mechanism which moves the stage 11 relatively to each direction of R direction and (theta) direction with respect to the fixed imaging part 12. FIG.

  In the above-described embodiment, the drive mechanism 13 is a mechanism that relatively moves the stage 11 and the imaging unit 12 in each of the R direction and the θ direction. There is no need. For example, the drive mechanism 13 may include an XYθ drive mechanism that moves the stage 11 in each of the X direction, the Y direction, and the θ direction.

  In the above embodiment, whether the deviation amount of the substrate 9 from the upright state is 0 degree, 90 degrees, 180 degrees, or 270 degrees is based on the shape of the target mark 94. However, it can be specified in other modes. For example, when the target mark 94 is formed at a predetermined position in the chip area 92 (for example, the left front corner), each of the four corners of the chip area 92 is imaged and the target mark 94 is detected from which corner. The amount of deviation from the upright state of the substrate 9 can also be specified based on the above. Further, for example, a target mark 94 is formed at a position in a predetermined direction (for example, the front direction) near the edge in the in-plane region of the substrate, and each of the + X direction, −X direction, + Y direction, and −Y direction is formed. Each position near the edge in the in-plane region of the substrate 9 is imaged, and the amount of deviation from the upright state of the substrate 9 can be specified based on from which direction the target mark 94 is detected. .

  Further, in the above embodiment, after detecting the outermost peripheral scribe line 910 on the + Xs side, the stage 11 is rotated 180 degrees along the θ axis, whereby the imaging unit 12 is moved to the −Xs side end of the substrate 9. However, by moving the imaging unit 12 along the R axis without moving the stage 11, the imaging unit 12 may be relatively moved to the end of the substrate 9 on the −Xs side. . The same applies to the Ys direction.

  In the drawing apparatus 3 according to the above-described embodiment, the transport device 34 adjusts the placement position of the substrate 9 on the drawing stage 31 based on the position of the substrate 9 specified by the position detection device 1. However, the position detection apparatus 1 is provided with an XY drive mechanism that moves the stage 11 along the X direction and the Y direction, and the XY drive mechanism has the substrate center specified by the process after the position detection process is completed. The stage 11 may be moved according to the position information 90, and the stage 11 may be moved so that the substrate center 90 coincides with a predetermined position (for example, the origin position) in the XY coordinates. In this case, the transport device 34 only needs to pick up the substrate 9 at a fixed position (for example, a position where the center of the hand 341 is at the origin position of the XY coordinates). That is, in this modified example, the XY drive mechanism functions as a position adjustment unit that adjusts the placement position of the substrate 9 on the drawing stage 31 based on the position of the substrate 9 specified by the position detection device 1. .

  In the embodiment described above, a mechanism for moving the imaging unit 12 along the normal direction of the mounting surface of the stage 11 may be provided. In this configuration, it is possible to adjust the separation distance between the imaging unit 12 and the surface region of the substrate 9 placed on the stage 11 by controlling the driving mechanism.

  Further, in the drawing apparatus 3 according to the above-described embodiment, the stage 11 and the drawing stage 31 of the position detection apparatus 1 are provided separately, but these may be shared by one stage.

  In the drawing apparatus 3 according to the above embodiment, the optical head 33 and the substrate 9 are relatively moved when the drawing stage 31 is driven by the drawing stage driving mechanism 32. By moving the optical head 33 with respect to the fixed drawing stage 31 (or by moving the drawing stage 31 and the optical head 33 together), the optical head 33 and the substrate 9 are relatively moved. May be.

  In the above embodiment, the position detection device 1 is mounted on the drawing device 3 that directly exposes a pattern on the photosensitive material by scanning the photosensitive material on the substrate 9 with the modulated drawing light. As described above, the position detection apparatus 1 may be mounted on an exposure apparatus that exposes the photosensitive material formed on the substrate 9 in a planar shape using a light source and a photomask, or irradiates the substrate 9 with light. Then, it may be mounted on a substrate processing apparatus that performs various processes other than the process of exposing the pattern. For example, a coating processing apparatus that applies a coating liquid from a coating head to a substrate on a stage while moving the stage on which the target substrate is placed with respect to the coating head, and a stage on which the target substrate is placed. For example, the substrate on the stage can be imaged from the inspection head while being moved relative to the inspection head, and can be mounted on an inspection processing device that inspects the pattern shape and the like formed on the surface of the substrate.

DESCRIPTION OF SYMBOLS 1 Position detection apparatus 11 Stage 12 Imaging part 13 Drive mechanism 14 Control part 20 Position specification part 21 Rotation position correction | amendment part 211 Line direction detection part 212 Target mark detection part 213 Rotation angle specification part 214 Drive mechanism control part 22 Center position detection part 221 Outermost peripheral line detection unit 222 Central chip region specifying unit 223 Center position specifying unit 3 Drawing device 9 Substrate 90 Substrate center 93 Layout region 930 Layout center

Claims (7)

A position detection device for detecting the position of a substrate,
A stage on which the substrate is placed;
An imaging unit for imaging an in-plane region of the substrate placed on the stage;
A position specifying unit that specifies the position of the substrate based on imaging data acquired by the imaging unit;
With
A plurality of chip regions are formed in the in-plane region by dividing the in-plane region of the substrate by a grid-like scribe line,
The position specifying unit is
Analyzing the imaging data and detecting an outermost scribe line detection unit for detecting a scribe line arranged on the outermost periphery among the scribe lines;
Based on the detection position of the scribe line arranged on the outermost periphery, a central chip area specifying unit that specifies the position of the central chip area arranged in the center of the layout area in which the plurality of chip areas are arranged,
Based on the position of the central chip region, a center position specifying unit that specifies the center position of the substrate,
A position detection device comprising: The position detection device according to claim 1,
The central chip region specifying unit is
A position detection device that specifies a center position of the layout area based on a detection position of a scribe line arranged on the outermost periphery, and specifies a position of the center chip area based on the center position of the layout area. The position detection device according to claim 2,
The outermost peripheral scribe line detection unit is
While detecting each position of a pair of 1st scribe line arrange | positioned at both ends among a group of 1st scribe lines extended in parallel with a 1st axis | shaft, it is parallel to the 2nd axis | shaft orthogonal to the said 1st axis | shaft. Detecting each position of a pair of second scribe lines arranged at both ends of the group of second scribe lines extending to
The central chip region specifying unit is
Obtaining the intersection position of the center line of the pair of first scribe lines disposed at both ends and the midpoint line of the pair of second scribe lines disposed at both ends as the center position of the layout area;
Position detection device. The position detection device according to any one of claims 1 to 3,
A drive unit that relatively moves the stage and the imaging unit;
With
The outermost peripheral scribe line detection unit is
The imaging data is sequentially transferred to the imaging unit while the imaging unit is relatively moved from the vicinity of the edge of the substrate along the radial direction of the substrate placed on the stage toward the center of the substrate. The position detection device detects the scribe lines detected first as the scribe lines arranged on the outermost periphery by analyzing the acquired image data sequentially in order of acquisition. The position detection device according to any one of claims 1 to 4,
The position specifying unit is
Analyzing the imaging data, an extension direction detection unit for detecting the extension direction of the scribe line;
Based on the extending direction of the scribe line, a rotational position identifying unit that identifies the rotational posture of the substrate,
A position detection device comprising: A position detection device for detecting the position of the substrate;
A drawing stage on which the substrate is placed;
A light irradiation unit that irradiates light toward the substrate placed on the drawing stage and draws a pattern on the substrate;
A position adjusting unit that adjusts the mounting position of the substrate on the drawing stage based on the position of the substrate specified by the position detection device;
With
The position detecting device is
A stage on which the substrate is placed;
An imaging unit for imaging an in-plane region of the substrate placed on the stage;
A position specifying unit that specifies the position of the substrate based on imaging data acquired by the imaging unit;
With
A plurality of chip regions are formed in the in-plane region by dividing the in-plane region of the substrate by a grid-like scribe line,
The position specifying unit is
Analyzing the imaging data and detecting an outermost scribe line detection unit for detecting a scribe line arranged on the outermost periphery among the scribe lines;
Based on the detection position of the scribe line arranged on the outermost periphery, a central chip area specifying unit that specifies the position of the central chip area arranged in the center of the layout area in which the plurality of chip areas are arranged,
Based on the position of the central chip region, a center position specifying unit that specifies the center position of the substrate,
A drawing apparatus comprising: A position detection method for detecting the position of a substrate,
a) imaging the in-plane region of the substrate placed on the stage;
b) specifying the position of the substrate based on the imaging data acquired in the step a);
With
A plurality of chip regions are formed in the in-plane region by dividing the in-plane region of the substrate by a grid-like scribe line,
Step b)
b1) Analyzing the imaging data and detecting a scribe line arranged on the outermost periphery among the scribe lines;
b2) identifying a position of a central chip area arranged at the center of a layout area where the plurality of chip areas are arranged based on detection positions of scribe lines arranged on the outermost periphery;
b3) identifying the center position of the substrate based on the position of the central chip region;
A position detection method comprising:

Images