JP7391568B2 - How to use cutting equipment - Google Patents

Description

The present invention relates to a method of using a cutting device in which the imaging means is disposed at a position where it can image a first region on the holding means that includes the center of rotation, but cannot image a second region that does not include the center of rotation.

Multiple devices such as ICs and LSIs are divided by dividing lines, and the wafer formed on the surface is divided into individual device chips by a cutting device equipped with a cutting blade, and then processed into electrical equipment such as mobile phones and personal computers. used.

Furthermore, a package substrate in which a plurality of device chips are arranged on a wiring board divided by dividing lines and the device side is coated with mold resin is also divided into individual package devices by a cutting machine (see, for example, Patent Document 1). .

Japanese Patent Application Publication No. 2001-196328

Large cutting equipment is selected when cutting equipment is used to divide large package substrates into individual device chips to produce packaged devices in large quantities; For small-volume production, small-sized cutting equipment is selected. It is desired that such a small-sized cutting device be further miniaturized so that it can be placed in a narrow space. However, as a result of pursuing miniaturization of cutting equipment, the mounting position of the imaging means for detecting the planned dividing line of the package substrate is restricted, and the imaging area is limited to the chuck of the holding means arranged to hold the package substrate. A problem has arisen in that only a part of the area (for example, 2/3 area) on the table can be covered, and when a plurality of package substrates are held within the dicing frame, the entire area cannot be imaged at once.

The present invention has been made in view of the above facts, and its main technical problem is that the imaging means can image a first area including the rotation center on the holding means, but cannot image a second area that does not include the rotation center. An object of the present invention is to provide a cutting device that can image the entire area of a workpiece and detect a scheduled dividing line even if the cutting device is disposed at a different position.

In order to solve the above-mentioned main technical problem, the present invention provides a rotatable holding means for holding a workpiece, a cutting means equipped with a cutting blade for cutting the workpiece held by the holding means, an X-axis moving means for processing and feeding the holding means in the X-axis direction; a Y-axis moving means for indexing and feeding the cutting means in the Y-axis direction perpendicular to the X-axis direction; an imaging means for imaging the workpiece disposed on the holding means and held by the holding means, the imaging means being capable of imaging a first region including the center of rotation on the holding means but not including the center of rotation; A method of using a cutting device disposed in a position where a second region cannot be photographed, the method comprising: positioning a workpiece held by the holding means directly below the imaging means; and positioning the workpiece in the first region. a first image acquisition step of capturing an image of the workpiece that has been placed in the second area to obtain a first image; and rotating the holding means by 180 degrees to transfer the workpiece that was in the second area to the first area. a second image acquisition step of positioning and imaging the workpiece to obtain a second image , the line to be divided on the workpiece based on the first image and the second image; A method of using a cutting device for detecting is provided.

The workpiece is a substrate having a plurality of devices in an area defined by a plurality of planned dividing lines, and includes at least a first substrate and a second substrate, and in the first image acquisition step, , detecting the position of the planned dividing line of the first substrate based on the first image obtained by imaging the first substrate positioned in the first area, and aligning it with the cutting blade; and in the second image acquisition step, the planned dividing line of the second substrate is determined based on the second image obtained by imaging the second substrate positioned in the first area. The position may be detected and aligned with the cutting blade. Further, the first substrate and the second substrate are provided with a characteristic pattern corresponding to the planned dividing line, and in the first image acquisition step, the characteristic pattern is determined by referring to the first image. detecting the planned dividing line of the first substrate by pattern matching based on the pattern matching and aligning it with the cutting blade; By pattern matching based on the feature pattern rotated by 180 degrees, the planned dividing line of the second substrate can be detected and aligned with the cutting blade.

A method of using the cutting device of the present invention includes: a holding means that holds a workpiece and is rotatable; a cutting means equipped with a cutting blade that cuts the workpiece held by the holding means; an X-axis moving means for feeding processing in the axial direction; a Y-axis moving means for indexing and feeding the cutting means in the Y-axis direction perpendicular to the X-axis direction; an imaging means for taking an image of the workpiece held by the holding means, the imaging means being capable of imaging a first area on the holding means that includes the rotation center, but images a second area that does not include the rotation center; A method of using a cutting device disposed in a position where a cutting device cannot be used, the method comprising: positioning a workpiece held by the holding means directly below the imaging means; a first image acquisition step of capturing a first image by rotating the holding means by 180 degrees to position the workpiece that was in the second area in the first area; a second image acquisition step of capturing a second image, and detecting a planned dividing line on the workpiece based on the first image and the second image. , the imaging means is arranged with priority given to miniaturization, and is placed in a position where the imaging means can take an image of a first area including the rotation center on the holding means but cannot take an image of a second area that does not include the rotation center. Even in the case where the holding means is provided, the entire area of the workpiece on the holding means can be captured by the imaging means.

FIG. 2 is an overall perspective view of the cutting device. FIG. 2 is a perspective view illustrating a mode in which a first image acquisition step is performed using the cutting device of FIG. 1; FIG. 2 is a perspective view showing a mode when implementing a second image acquisition step using the cutting device of FIG. 1. FIG.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a method of using a cutting device constructed based on the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 shows a perspective view of a cutting device 1 configured to realize the method of using the cutting device of this embodiment. The cutting device 1 includes a holding means 20 for holding a workpiece, an X-axis moving means 30 for machining and feeding the holding means 20 in the X-axis direction indicated by an arrow X in the figure, and a cutting means 40 for cutting the workpiece. , a Y-axis moving means 50 that indexes and feeds the cutting means 40 in the Y-axis direction indicated by arrow Y in the figure orthogonal to the X-axis direction, and a holding means 20 disposed adjacent to the cutting means 40 in the X-axis direction. and an imaging means 6 for taking an image of the workpiece held in the workpiece.

As shown in FIG. 1, the holding means 20 includes a rectangular X-axis movable plate 21 mounted on the base 2 so as to be movable in the X-axis direction, and a cylindrical cylinder fixed to the upper surface of the X-axis movable plate 21. It includes a pillar 22 having a shape of a shape, and a cover plate 23 having a rectangular shape fixed to the upper end of the pillar 22. A chuck table 24 is disposed on the cover plate 23 and extends upward through a circular hole formed on the cover plate 23. The chuck table 24 holds an annular frame F that holds a workpiece via an adhesive tape T, and is configured to be rotatable in the direction indicated by an arrow R1 by a rotation drive means (not shown) housed in the support column 22. . The upper surface of the chuck table 24 is formed from a porous material having air permeability and constitutes a substantially horizontally extending holding surface. The chuck table 24 is connected to suction means (not shown) by a flow path (not shown) passing through the support 22 . A plurality of clamps 25 for gripping the frame F held by the chuck table 24 are arranged at intervals on the outside of the chuck table 24.

The X-axis direction moving means 30 converts the rotational motion of the motor 31 into linear motion via the ball screw 32 and transmits it to the X-axis direction movable plate 21, and transfers the rotational motion of the motor 31 to the X-axis guide rails 2A, 2A on the base 2. The X-axis direction movable plate 21 is moved forward and backward along the X-axis direction.

The cutting means 40 is disposed at a rear position adjacent to the holding means 20 in the Y-axis direction. The cutting means 40 includes a spindle unit 41. The spindle unit 41 includes a cutting blade 43 that is fixed to the tip of a rotating spindle 42 and has a cutting edge on its outer periphery, and a blade cover 44 that protects the cutting blade 43. The cutting blade 43 is configured to be rotatable together with the rotating spindle 42. A cutting water supply means 45 is disposed on the blade cover 44 at a position adjacent to the cutting blade 43, and supplies cutting water introduced through the blade cover 44 toward the cutting position. A rotational drive source such as a motor is housed at the other end of the spindle unit 41 , and the motor rotates the cutting blade 43 by rotating the rotating spindle 42 .

The cutting means 40 described above is supported by a cutting means support section 47. A pair of Y-axis guide rails 2B, 2B parallel to the Y-axis direction are arranged on the base 2, and a cutting means support part 47 is slidably attached to the Y-axis guide rails 2B, 2B. There is. The cutting means support part 47 is configured to be movable along the Y-axis direction by a Y-axis moving means 50. The Y-axis moving means 50 converts the rotational motion of the motor 51 into linear motion via the ball screw 52, transmits it to the cutting means support part 47, and moves it along the Y-axis guide rails 2B, 2B on the base 2. The cutting means support portion 47 is moved forward and backward in the Y-axis direction.

A pair of Z-axis guide rails 48 parallel to the Z-axis direction (vertical direction) indicated by arrow Z are provided on the upper side surface of the cutting means support portion 47 . A Z-axis moving base 46 that supports the spindle unit 41 is slidably attached to the Z-axis guide rail 48 . A motor 49 is disposed in the cutting means support section 47, and the rotation of the motor 49 is converted into linear motion via a ball screw (not shown), and the linear motion is transmitted to the Z-axis moving base 46. By rotating the motor 49, the cutting means 40 is moved forward and backward in the Z-axis direction via the Z-axis moving base 46.

At a position adjacent to the cutting blade 44 constituting the cutting means 40 in the X-axis direction, an imaging means 6 for taking an image of the top of the chuck table 24 of the holding means 20 is disposed. When cutting the workpiece, the imaging means 6 images the workpiece, acquires an image, performs alignment, and detects the position of the scheduled dividing line of the workpiece to be cut.

The cutting device 1 includes a control means 100 (see FIGS. 2 and 3), as will be described later. The control means 100 is constituted by a computer, and includes a central processing unit (CPU) that performs arithmetic processing according to a control program, a read-only memory (ROM) that stores the control program, etc., and an image taken by the imaging means 6 and a detected detection. It includes a readable and writable random access memory (RAM) for temporarily storing values, calculation results, etc., an input interface, and an output interface (details are not shown). The control means 100 controls each operating section of the cutting device 1, records appropriate information including the image taken by the imaging means 6, and performs pattern matching based on the image taken and acquired by the imaging means 6. The control program includes a control program that detects the position of the planned dividing line by performing the following steps.

The cutting device 1 of this embodiment has the configuration generally described above, and its operation will be described in detail below.

The workpieces of this embodiment are, for example, a rectangular first substrate 10A and a second substrate 10B, as shown in FIGS. 2 and 3, and are wiring substrates partitioned by dividing lines 14. This is a package substrate with a plurality of device chips 12 arranged thereon and the device side covered with a molding resin. Note that the first substrate 10A and the second substrate 10B described above are the same substrate in terms of design. As shown in FIG. 2, characteristic patterns 16a, 16b and characteristic patterns 16c, 16d are formed at the corners of the first substrate 10A and the second substrate 10B, respectively. The positions where the characteristic patterns 16a to 16d are formed and their shapes are arbitrary, but for example, on the upper side of the outer peripheral frame portions of the first substrate 10A and the second substrate 10B where the device chips 12 are not formed. It is an equilateral triangle with the apex oriented to the right. In this embodiment, the first substrate 10A and the second substrate 10B are placed at a predetermined position and in a predetermined direction on an adhesive tape T whose outer periphery is attached to an annular frame F having an opening. is attached to. It is preferable that the feature patterns 16a to 16d are figures that, when the chuck table 24 is rotated 180 degrees, have a shape different from the feature pattern before the rotation. Below, a method of using the cutting device 1 for detecting a dividing line to be used when performing cutting will be described in more detail.

(Positioning process)
FIG. 2 shows a first substrate 10A and a second substrate 10B held on a chuck table 24 (not shown) via an adhesive tape T. The first substrate 10A and the second substrate 10B held on the chuck table 24 are positioned at an imaging position directly below the imaging means 6 by operating the X-axis direction moving means 30 described above. process). When the chuck table 24 is positioned at the imaging position, the first substrate 10A and the second substrate 10B are arranged in the X-axis direction, and one of the scheduled dividing lines 14 is aligned in the X-axis direction. It is positioned along the line. This imaging position is the position where the chuck table 24 is positioned in FIG. 1, and is the state where it has been moved furthest toward the imaging means 6 side.

(First image acquisition step)
The cutting device 1 of this embodiment is designed with priority given to miniaturization, and as a result, the position where the imaging means 6 is disposed is limited. The range that can be imaged is limited to a first region indicated by Va on the right side when viewed in the X-axis direction of the two-dot chain line L in FIG. More specifically, although the first region Va includes the rotation center P when rotating the chuck table 24, there is a region to the left of the two-dot chain line L that does not include the rotation center P in the X-axis direction. There is a second region Vb that cannot be imaged even though it is on the chuck table 24, and the area ratio of the upper surface of the chuck table 24 defined by the first region Va and the second region Vb is, for example, 2. : The ratio is about 1. In this embodiment, first, a first image is acquired by the imaging means 6 in a state where the first area Va can be imaged (first image acquisition step). Note that, as shown in FIG. 2, the first region Va includes the entire area of the first substrate 10A.

(Second image acquisition step)
As described above, in this embodiment, as a result of arranging the imaging means 6 with priority on miniaturization, even if the chuck table 24 is moved to the imaging position directly below the imaging means 6, the area that can be imaged is There is a region (second region Vb) that cannot be positioned, and in this state, the first image cannot include the entire second substrate 10B. Therefore, in this embodiment, the chuck table 24 of the holding means 20 is rotated by 180° in the direction indicated by the arrow R2 in FIG. 2 about the rotation center P, and as shown in FIG. The second substrate 10B is positioned in the first area Va that can be imaged by the imaging means 6. Thereby, the second substrate 10B, whose entire area could not be captured in the first image, is positioned and imaged in the first area Va, and a second image is obtained (second image acquisition step).

In this embodiment, as described above, by performing the first image acquisition step and the second image acquisition step, the imaging means 6 is arranged with priority given to miniaturization, and the imaging means 6 is However, even if the image is placed in a position where the first area Va including the rotation center P on the holding means 20 can be imaged but the second area Vb which does not include the rotation center P cannot be imaged, the entire area on the chuck table 24 can be imaged. can be captured by the imaging means 6. Therefore, even when two or more substrates (first substrate 10A and second substrate 10B) are held on the check table 24, the dividing line 14 of each substrate is cut by the cutting device 1. The cutting blade 44 can be positioned on the hairline H (see FIGS. 2 and 3) formed on the monitor (not shown), and the cutting blade 44 can be accurately positioned on the planned dividing line 14 to perform cutting. .

Next, each substrate is A method for detecting the position of the scheduled dividing line 14 by the control means 100 will be described below.

While performing the above-described first image acquisition step and second image acquisition step, the planned dividing line is In order to detect the position of 14, first, the control means 100 detects the characteristic pattern formed on the first substrate 10A and the second substrate 10B to be processed, and the characteristic pattern and the division formed on the substrate. The position information of the planned line is stored in advance (preparation step).

In this preparation step, for example, a model substrate identical to the first substrate 10A and the second substrate 10B is prepared in advance and imaged, and the shapes and positional relationships of the two characteristic patterns on the model substrate and the two characteristic patterns are imaged. This is achieved by storing the positional relationship between the line and the scheduled dividing line in the control means 100 as position information of the scheduled dividing line. Note that the planned dividing lines whose positions are stored based on the two characteristic patterns are at least a planned dividing line in a predetermined direction and a planned dividing line formed in a direction orthogonal to the predetermined direction. Furthermore, the planned dividing lines whose positions are stored based on the two characteristic patterns may be all scheduled dividing lines on the model board, or several scheduled dividing lines selected at predetermined intervals. Alternatively, there may be only two orthogonal planned dividing lines.

Using information about the feature pattern stored in advance in the control means 100 through the above-described preparation process and the positional relationship between the feature pattern and the planned dividing line, the first The procedure for detecting the planned dividing line 14 of the substrate 10A and the second substrate 10B is as follows.

After performing the positioning process of the embodiment described above, a first image acquisition process is performed. By imaging the first area Va shown in FIG. 2, a first image including the first substrate 10A is acquired. Here, by control programming provided in the control means 100, while referring to the first image, pattern matching is performed based on the feature pattern stored in the control means 100, and the features on the first substrate 10A are Capture patterns 16a and 16b. As a result, the position of the planned dividing line 14 on the first substrate 10A is detected based on the positional information of the characteristic patterns 16a, 16b and the planned dividing line 14 stored in advance, and the planned dividing line 14 and the hair line H are detected. Then, the rotation angle of the chuck table 24 and the Y coordinate of the planned dividing line 14 are stored in the control means 100. Once the positional information of the dividing line 14 on the first substrate 10A is stored in the control means 100, when performing the cutting process, cutting is performed based on the positional information of the detected dividing line 14. It becomes possible to accurately position the blade 44 on the planned dividing line 14.

Further, when detecting the planned dividing line 14 of the second substrate 10B, the above-described second image acquisition step is performed. A second image including the second substrate 10B is acquired by imaging the first area Va after rotating the chuck table 24 by 180 degrees as shown in FIG. Here, pattern matching is performed by the control program provided in the control means 100 in the same way as when the planned dividing line 14 of the first substrate 10A was detected. Here, as described above, since the second substrate 10B is imaged with the chuck table 24 rotated 180 degrees, when performing pattern matching, the image of the second substrate 10B is This is performed using a feature pattern obtained by rotating the feature pattern used when detecting the planned dividing line 14 by 180 degrees. Thereby, the characteristic patterns 16c and 16d can be captured based on the second image shown in the first area Va shown in FIG. Furthermore, when detecting the planned dividing line 14 based on the characteristic patterns 16c and 16d captured by this second image, as described above, the second substrate 10B is placed with the chuck table 24 rotated 180 degrees. Since this has been captured, the positional information of the planned dividing line stored in the preparation process is also applied after 180 degree coordinate transformation for the positional relationship between the characteristic pattern and the scheduled dividing line 14. Thereby, with reference to the second image, the planned dividing line 14 of the second substrate 10B is detected by pattern matching based on the characteristic pattern rotated by 180 degrees, and the planned dividing line 14 and the hair line H are matched, The rotation angle of the chuck table 24 and the Y coordinate of the planned dividing line 14 are stored in the control means 100. If the planned dividing line 14 on the second substrate 10B is detected, when cutting the second substrate 10B, the cutting blade is adjusted based on the positional information of the detected dividing planned line 14. 44 can be accurately positioned on the planned dividing line 14.

In the embodiment described above, the operation of the present embodiment was explained based on an example in which two package substrates are held on the chuck table 24, but the present invention is not limited to this, and the number of package substrates is three or more. This may be the case in some cases.

In addition, in the above explanation, as a result of pursuing miniaturization of the cutting device, the mounting position of the imaging means for detecting the planned dividing line of the package board is limited, and the imaging area is limited to hold the package board. A problem occurred in that the holding means installed in the dicing frame could only cover a part of the area on the chuck table, and when multiple package substrates were held in the dicing frame, the entire area could not be imaged at once. Although it has been explained that the present invention is intended to solve the above problems, conversely, it can also be said that by applying the technical idea of the present invention, it is possible to achieve a higher level of miniaturization of the cutting device.

1: Cutting device 2: Base 2A: X-axis guide rail 2B: Y-axis guide rail 6: Imaging means 10A: First package board 10B: Second package board 20: Holding means 21: X-direction movable plate 22: Support column 23: Cover plate 24: Chuck table 30: X-axis direction moving means 31: Motor 32: Ball screw 40: Cutting means 41: Spindle unit 42: Rotating spindle 43: Cutting blade 44: Blade cover 45: Cutting water supply means 46 : Z-axis moving base 47 : Cutting means support part 48 : Z-axis guide rail 49 : Motor 49
50: Y-axis direction moving means 51: Motor 52: Ball screw 100: Control means

Claims (3)

A holding means that holds and can rotate a workpiece, a cutting means equipped with a cutting blade that cuts the workpiece held by the holding means, and an X-axis moving means that processes and feeds the holding means in the X-axis direction. , a Y-axis moving means for indexing and feeding the cutting means in the Y-axis direction perpendicular to the X-axis direction, and a workpiece disposed adjacent to the cutting means in the X-axis direction and held by the holding means. an imaging means for taking an image,
A method of using a cutting device, wherein the imaging means is disposed at a position where it can image a first area on the holding means that includes the rotation center, but cannot image a second area that does not include the rotation center,
a positioning step of positioning the workpiece held by the holding means directly below the imaging means;
a first image acquisition step of capturing an image of the workpiece positioned in the first area to obtain a first image;
a second image acquisition step of rotating the holding means by 180 degrees, positioning the workpiece that was in the second area in the first area , and capturing an image of the workpiece to obtain a second image;
including;
A method of using a cutting device that detects a dividing line on a workpiece based on the first image and the second image . The workpiece is a substrate having a plurality of devices in a region partitioned by a plurality of planned dividing lines, and includes at least a first substrate and a second substrate,
In the first image acquisition step, the position of the planned dividing line of the first substrate is detected based on the first image obtained by imaging the first substrate positioned in the first area. and align the cutting blade with the cutting blade.
In the second image acquisition step, the position of the planned dividing line of the second substrate is detected based on the second image obtained by imaging the second substrate positioned in the first area. 2. The method of using the cutting device according to claim 1, wherein the cutting device is aligned with the cutting blade by using the cutting blade. The first substrate and the second substrate are provided with a characteristic pattern corresponding to the planned dividing line,
In the first image acquisition step, referring to the first image, detecting a planned dividing line of the first substrate by pattern matching based on the characteristic pattern and aligning it with the cutting blade;
In the second image acquisition step, the cutting blade is detected by pattern matching based on a feature pattern obtained by rotating the feature pattern by 180 degrees with reference to the second image, and the cutting blade is 3. The method of using the cutting device according to claim 2 , wherein alignment is performed with the cutting device.