TW201737403A - Split fixture and splitting method splitting a wafer formed by offsetting device rows adjacent to each other with a first preset division line interposed therebetween - Google Patents
Split fixture and splitting method splitting a wafer formed by offsetting device rows adjacent to each other with a first preset division line interposed therebetween Download PDFInfo
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- TW201737403A TW201737403A TW105140459A TW105140459A TW201737403A TW 201737403 A TW201737403 A TW 201737403A TW 105140459 A TW105140459 A TW 105140459A TW 105140459 A TW105140459 A TW 105140459A TW 201737403 A TW201737403 A TW 201737403A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
Abstract
Description
本發明有關用於藉由切削刀片把形成鄰接的裝置列中的第2分割預定線為非直線狀的晶圓分割成一個一個的裝置(device)的分割治具及該晶圓的分割方法。 The present invention relates to a dividing jig for dividing a wafer in which a second dividing line to be formed in a row adjacent to each other in a row of adjacent devices is formed into a single device by a cutting blade, and a method of dividing the wafer.
藉由分割預定線區劃IC、LSI等的複數個裝置而形成在表面的晶圓，係藉由切割裝置分割成一個一個的裝置，且被利用在攜帶式電話、個人電腦等的電器。 The wafer formed on the surface by dividing a plurality of devices such as a predetermined line division IC, LSI, etc., is divided into one device by a cutting device, and is used in an electric appliance such as a portable telephone or a personal computer.
攜帶式電話或個人電腦等的電器追求更輕量化、小型化，所謂的複數個裝置配設成格子狀的晶片尺寸封裝(CSP)之封裝技術也持續開發著。作為這樣的CSP技術，係形成複數個對應到半導體晶片的連接端子之連接端子，並且，在區劃在各半導體晶片的分割預定線形成為格子狀之銅版等的電極板把複數個的半導體晶片配設成矩陣狀，藉由從半導體晶片的背面側重塑了樹脂的樹脂部，把電極板與半導體晶片予以一體化，經此，形成CSP基板。經由沿分割預定線切斷該封裝基板，分割成一個一個被封裝的晶片尺寸封裝(CSP)。 An electric appliance such as a portable telephone or a personal computer has been pursued to be lighter and smaller, and a packaging technology in which a plurality of devices are arranged in a lattice-like chip size package (CSP) has been continuously developed. In the above-described CSP technology, a plurality of connection terminals corresponding to the connection terminals of the semiconductor wafer are formed, and a plurality of semiconductor wafers are disposed on the electrode plates of the copper plate or the like which are formed in a lattice-shaped division line of each semiconductor wafer. In a matrix form, the resin portion of the resin is reshaped from the back side of the semiconductor wafer, and the electrode plate and the semiconductor wafer are integrated to form a CSP substrate. The package substrate is cut along a predetermined dividing line and divided into packaged wafer size packages (CSPs).
在此，被指謫有在形成上述般的CSP基板之際，在覆蓋經由樹脂的重塑所形成的CSP基板的樹脂部內發生孔隙(形成在形成品內部的空洞)，使得有產品的可靠性下降的情況，為了抑制經由該重塑所形成的樹脂的成型膜內部的孔隙的發生，在具有形成直線狀的複數個第1分割預定線、以及設在與該第1分割預定線正交的方向之複數個第2分割預定線，在藉由該第1分割預定線與該第2分割預定線而被區劃的各區域配設裝置的晶圓中，經由沿該第1分割預定線配列的複數個裝置列使包挾該第1分割預定線而鄰接的裝置列彼此偏置，形成鄰接的裝置列中的第2分割預定線成為非直線狀的方式，抑制經由重塑所形成的樹脂的成型膜內部的孔隙的發生之技術為公知(參閱專利文獻1)。 Here, when the above-described CSP substrate is formed, pores (cavities formed inside the formed product) are formed in the resin portion of the CSP substrate formed by the reshaping of the resin, so that the reliability of the product is obtained. In the case of the fall, in order to suppress the occurrence of voids in the formed film of the resin formed by the reshaping, a plurality of first division planned lines having a straight line shape and orthogonal to the first division planned line are provided. a plurality of second division planned lines in the direction, and the wafers arranged in the respective regions partitioned by the first division planned line and the second division planned line are arranged along the first division planned line The plurality of device rows are arranged such that the adjacent first row of predetermined lines and the adjacent device rows are offset from each other, and the second predetermined dividing line in the adjacent device row is formed to be non-linear, and the resin formed by reshaping is suppressed. A technique for generating pores inside a formed film is known (refer to Patent Document 1).
[專利文獻1]韓國公開專利第2016-0000953號專利公報 [Patent Document 1] Korean Patent Publication No. 2016-0000953
根據記載在上述專利文獻1的技術，記載有防止在經由樹脂的重塑所形成的成型膜內部發生孔隙，鄰接的裝置列的第2分割預定線不形成連續直線狀，在照原樣下是無法使切削刀片直進沿第2分割預定線照原樣切削 ，在沿第1分割預定線切削過後，把偏置的裝置列的位置靠齊到其他的裝置列後沿第2分割預定線切削這一點是必要的。 According to the technique described in the above-mentioned Patent Document 1, it is described that pores are prevented from occurring inside the formed film formed by remodeling of the resin, and the second planned dividing line of the adjacent device row does not form a continuous straight line, and it is impossible to form the same as it is. Cutting the cutting blade straight along the 2nd cut line as it is After cutting along the first dividing line, it is necessary to align the positions of the offset device rows to the other device rows and then cut along the second dividing line.
但是，即便參閱了上述專利文獻1，在切削加工中具體使用什麼樣的構成的分割治具而可以有效率進行第1、第2分割預定線的切削這一點是沒有記載的。特別是，用於載置用在把CSP基板分割成一個一個的裝置的切削裝置中的分割前的CSP基板之保持床臺，係有必要形成在切削時從切削刀片受到的加工負載應保持CSP基板穩固之吸引手段，在習知的保持床臺的構造中，是有沿CSP基板的第1分割預定線切削後，無法容易靠齊偏置的裝置列與鄰接的裝置列之問題。 However, even if the above-described Patent Document 1 is referred to, it is not described that the cutting of the first and second dividing lines can be efficiently performed by what kind of dividing jig is specifically used in the cutting process. In particular, it is necessary to form a holding bed for the CSP substrate before the division in the cutting device for dividing the CSP substrate into one device, and it is necessary to form a machining load to be received from the cutting blade during cutting. The suction means for securing the substrate is a problem in the structure of the conventional holding bed, which is a device row which cannot be easily offset by the cutting along the first dividing line of the CSP substrate.
本發明係有鑑於上述事實而為之者，其主要的技術課題在於提供一種分割治具、及晶圓的分割方法，係藉由切割裝置有效率地把晶圓分割成一個一個的裝置，該晶圓為具有形成直線狀之複數個第1分割預定線、以及設在與該第1分割預定線正交的方向之複數個第2分割預定線，在藉由該第1分割預定線與該第2分割預定線區劃出的各區域配設裝置，形成沿該第1分割預定線配列之複數個裝置列使包挾著該第1分割預定線而鄰接的裝置列彼此偏置。 The present invention has been made in view of the above circumstances, and a main technical object thereof is to provide a method for dividing a jig and a wafer, which is an apparatus for efficiently dividing a wafer into one by a cutting device. The wafer has a plurality of first division planned lines formed in a straight line shape, and a plurality of second division planned lines provided in a direction orthogonal to the first division planned line, and the first division planned line and the first division line Each of the area arrangement devices defined by the second division predetermined line region forms a plurality of device rows arranged along the first division planned line so as to be offset from each other by a device row adjacent to the first division planned line.
為了解決上述主要的技術課題，根據本發明，提供一種一種分割治具，係用於藉由切削刀片把晶圓分割成一個一個的裝置，該晶圓具有形成直線狀之複數個第1分割預定線、以及設在與該第1分割預定線正交的方向之複數個第2分割預定線，在藉由該第1分割預定線與該第2分割預定線所區劃出的各區域配設有裝置，沿該第1分割預定線配列之複數個裝置列，係配列成把包挾著該第1分割預定線而鄰接的裝置列之彼此偏置在第1分割預定線方向，經此，形成鄰接的裝置列中的第2分割預定線為非直線狀；其特徵為：該分割治具，係利用具有形成複數個把晶圓的各裝置吸引保持在上表面的吸引部的吸引區域之本體、以及形成在該本體的內部並傳遞吸引力到該吸引部之吸引路徑，所構成；在該吸引區域，形成有：對應到該第1分割預定線之切削刀片的第1餘隙溝、以及對應到該第2分割預定線而設在相對於第1餘隙溝而正交的方向之切削刀片的第2餘隙溝340；該本體的該吸引區域，係為了對應到該晶圓的鄰接的各裝置列而設的該第2餘隙溝從非直線狀的狀態位置成直線狀，形成含有在保持著吸引部所致之吸引功能下沿該第1餘隙溝滑動的長條狀的板。 In order to solve the above-mentioned main technical problems, according to the present invention, there is provided a dividing jig for a device for dividing a wafer into one by a cutting blade, the wafer having a plurality of first divisional reservations forming a linear shape a line and a plurality of second division planned lines provided in a direction orthogonal to the first division planned line are disposed in each of the regions defined by the first division planned line and the second division planned line In the device, the plurality of device rows arranged along the first dividing line are arranged to be offset from each other by the device row adjacent to the first dividing line to be offset in the first dividing line direction, thereby forming The second predetermined dividing line in the adjacent device row is non-linear; and the dividing jig is a body having a suction region that attracts and holds the suction portion on the upper surface by a plurality of devices for forming the wafer. And a suction path formed in the main body and transmitting an attraction force to the suction portion; wherein the suction region is formed with a first clearance groove corresponding to the cutting insert of the first division planned line a second clearance groove 340 of the cutting insert that is disposed in a direction orthogonal to the first clearance groove corresponding to the second division planned line; the suction region of the body corresponds to the wafer adjacent to the wafer The second clearance groove provided in each of the device rows is linearly formed from a non-linear state position, and is formed in a long shape including sliding along the first clearance groove while holding a suction function by the suction portion. board.
更進一步，提供一種晶圓的切割方法，乃是使用上述分割治具之晶圓的切斷方法，係利用以下製程所構成：第1切斷製程，係用切削刀片切斷形成鄰接的裝置 列中的第2分割預定線為非直線狀的晶圓的第1分割預定線，把該晶圓做成長條狀；板位置製程，係沿第1餘隙溝滑動該板，被分割成長條狀的晶圓的第2分割預定線位置成一直線；以及第2切斷製程，係用切削刀片切斷位置成一直線的第2分割預定線，把該晶圓分割成一個一個的裝置。 Furthermore, a method of cutting a wafer using the above-described method for cutting a wafer is provided by the following process: a first cutting process is performed by cutting a cutting blade to form an adjacent device The second dividing line in the column is a first dividing line of the non-linear wafer, and the wafer is made into a strip shape; the board position process is to slide the board along the first clearance groove, and the strip is divided into strips. The second dividing line position of the wafer is in a straight line; and the second cutting process is a second dividing line that is cut in a straight line by the cutting insert, and the wafer is divided into one unit.
本發明之分割治具係構成如上述般，為一種分割治具，係係適用在用於藉由切削刀片把晶圓分割成一個一個的裝置之分割裝置，該晶圓形成沿第1分割預定線配列之複數個裝置列配列成包挾著該第1分割預定線而鄰接的裝置列彼此偏置在第1分割預定線方向，經此，形成配設在與鄰接的裝置列中的第1分割預定線正交的方向之第2分割預定線為非直線狀；其中，該分割治具是利用具有形成複數個吸引保持各裝置之吸引部的吸引區域之本體、以及形成在該本體的內部且傳遞吸引力到該吸引部之吸引路徑所構成；在該吸引區域，形成有：對應到該第1分割預定線之切削刀片的第1餘隙溝、以及對應到該第2分割預定線而設在相對於第1餘隙溝而正交的方向之切削刀片的第2餘隙溝；該本體的該吸引區域，係為了對應到該晶圓的鄰接的各裝置列而設的該第2餘隙溝從非直線狀的狀態位置成直線狀，形成含有在保持著吸引部所致之吸引功能下沿該第1餘隙溝滑動的長條狀的板；經此，在用切 削刀片切斷第1分割預定線後，滑動長條狀的板把第2分割預定線位置成直線狀，藉由直進的切削刀片可以有效率把晶圓分割成一個一個的裝置。 The dividing jig of the present invention is a dividing fixture as described above, and is applied to a dividing device for dividing a wafer into one by a cutting insert, the wafer forming is scheduled to be divided along the first division. The plurality of devices arranged in the line arrangement are arranged so as to be adjacent to the first division planned line, and the adjacent device rows are offset from each other in the first division planned line direction, thereby forming the first arrangement in the adjacent device row. The second division planned line in the direction orthogonal to the predetermined line is a non-linear shape, wherein the division jig is formed by a body having a suction region that forms a plurality of suction portions for attracting and holding the respective devices, and is formed inside the body And a suction path for transmitting the attraction force to the suction portion; wherein the suction region is formed with a first clearance groove corresponding to the cutting insert of the first division planned line and corresponding to the second division planned line a second clearance groove of the cutting insert disposed in a direction orthogonal to the first clearance groove; the suction region of the main body is the second portion provided to correspond to each adjacent device row of the wafer Gap Linear state position linearly formed along the clearance groove of the first elongated slide plate contained in the holding portion due to the suction function of the suction; after this, cut with After the cutting blade cuts the first dividing line, the long strip-shaped plate linearly positions the second dividing line, and the straight cutting insert can efficiently divide the wafer into one device.
1‧‧‧切割裝置 1‧‧‧ cutting device
2‧‧‧裝置外殼 2‧‧‧ device housing
3‧‧‧被加工物保持機構 3‧‧‧Processed object retention mechanism
4‧‧‧切削手段 4‧‧‧ cutting means
5‧‧‧對準手段 5‧‧‧Alignment means
6‧‧‧開口部 6‧‧‧ openings
7‧‧‧收容容器 7‧‧‧ containment container
10‧‧‧晶圓(CSP基板) 10‧‧‧ wafer (CSP substrate)
31‧‧‧保持床臺 31‧‧‧ Keep the bed
32‧‧‧保持床臺支撐手段 32‧‧‧ Keeping the bed support means
101‧‧‧第1分割預定線 101‧‧‧1st dividing line
102‧‧‧第2分割預定線 102‧‧‧2nd dividing line
103‧‧‧裝置 103‧‧‧ device
312‧‧‧板 312‧‧‧ board
320‧‧‧吸引部 320‧‧‧Attraction
330‧‧‧第1餘隙溝 330‧‧‧1st clearance
340‧‧‧第2餘隙溝 340‧‧‧2nd gap
[圖1]適用根據本發明構成的分割治具之雷射加工裝置。 [Fig. 1] A laser processing apparatus to which a dividing jig constructed in accordance with the present invention is applied.
[圖2]根據本發明構成的分割治具的立體圖。 Fig. 2 is a perspective view of a dividing jig constructed in accordance with the present invention.
[圖3]說明圖2所示的分割治具的構造之說明圖。 Fig. 3 is an explanatory view for explaining the structure of the dividing jig shown in Fig. 2;
[圖4]圖3所表示的分割治具的A-A、B-B、C-C剖視圖。 Fig. 4 is a cross-sectional view showing the A-A, B-B, and C-C of the dividing jig shown in Fig. 3.
[圖5]說明使用圖2所示的分割治具的晶圓的分割方法之說明圖。 Fig. 5 is an explanatory view for explaining a method of dividing a wafer using the division jig shown in Fig. 2 .
以下，參閱附圖詳細說明有關根據本發明構成的分割治具及晶圓的分割方法的適合的實施方式。 Hereinafter, a suitable embodiment of the dividing jig and the method of dividing the wafer constructed according to the present invention will be described in detail with reference to the accompanying drawings.
於圖1，表示適用根據本發明構成的分割治具的切割裝置1的整體立體圖。圖1表示的切割裝置1，具備裝置外殼2。於該裝置外殼2，配設有：保持成為被加工物的晶圓10(CSP基板)之被加工物保持機構3、用於切削被加工物之切削手段4、以及用於進行保持切削手段4與保持被加工物的被加工物保持機構的對位之對準之對 準手段5。被加工物保持機構3，係具備：吸引保持構成本發明的分割治具的晶圓10之保持床臺31、以及支撐該保持床臺31之保持床臺支撐手段32。於保持床臺支撐手段32，具備有配設在保持床臺31的下表面之後述的空氣活塞350可以收納的凹部321。該保持床臺31，係如圖2(a)表示，利用由形成在略矩形上之後述的本體基座部311與板312構成的床臺本體310所構成，於該床臺本體310的上表面，設有複數個設成與形成在作為被加工物的晶圓10的一個一個的裝置對應之吸引部320，形成吸引區域。 Fig. 1 shows an overall perspective view of a cutting device 1 to which a dividing jig constructed in accordance with the present invention is applied. The cutting device 1 shown in Fig. 1 is provided with a device casing 2. In the device casing 2, a workpiece holding mechanism 3 for holding a wafer 10 (CSP substrate) to be processed, a cutting means 4 for cutting a workpiece, and a holding cutting means 4 are disposed. Alignment with the alignment of the workpiece holding mechanism that holds the workpiece Standard means 5. The workpiece holding mechanism 3 includes a holding bed 31 that sucks and holds the wafer 10 constituting the dividing jig of the present invention, and a holding bed supporting means 32 that supports the holding bed 31. The holding bed support means 32 is provided with a recessed portion 321 which can be accommodated by an air piston 350 which is disposed on the lower surface of the holding bed 31. The holding bed 31 is constituted by a bed main body 310 formed of a main body base portion 311 and a plate 312 which will be described later in a slightly rectangular shape, on the bed main body 310, as shown in Fig. 2(a). The surface is provided with a plurality of suction portions 320 corresponding to one of the devices 10 formed as the workpiece, and a suction region is formed.
返回圖1繼續說明，構成被加工物保持機構3的保持床臺支撐手段32，係具備把保持床臺31繞設定成相對於上表面也就是保持面垂直的軸旋動之未圖示旋轉驅動手段。如此構成的保持床臺支撐手段32，係構成可移動在圖1中搬入、搬出保持床臺31所位置的被加工物之搬入搬出區域、以及在切削手段4的下方中實施對被加工物的加工之加工區域，藉由未圖示的X軸方向移動手段，可以使其一楝在以箭頭X表示的加工進給方向(X軸方向)。 Referring back to Fig. 1, the holding bed supporting means 32 constituting the workpiece holding mechanism 3 is provided with a non-illustrated rotational driving for rotating the holding bed 31 about an axis which is set to be perpendicular to the upper surface, that is, the holding surface. means. The holding bed support means 32 configured as described above constitutes a loading/unloading area of a workpiece that can be moved in and out of the holding bed 31 in FIG. 1, and a workpiece to be processed under the cutting means 4. The machining region to be processed can be twisted in the machining feed direction (X-axis direction) indicated by the arrow X by an X-axis direction moving means (not shown).
切削手段4，係具備：沿以與X軸方向正交的箭頭Y表示的分度進給方向(Y軸方向)配設之心軸外殼41、被支撐在該心軸外殼41且可旋轉之旋轉心軸42、安裝在該旋轉心軸42的末端部之切削刀片43、以及配設在該切削刀片43的兩側之切削水供給噴嘴44。 The cutting means 4 includes a spindle housing 41 disposed along an index feeding direction (Y-axis direction) indicated by an arrow Y orthogonal to the X-axis direction, and is supported by the spindle housing 41 and rotatable A rotary mandrel 42, a cutting insert 43 attached to a distal end portion of the rotary mandrel 42, and a cutting water supply nozzle 44 disposed on both sides of the cutting insert 43 are provided.
如圖1表示，在鄰接到該裝置外殼2的搬入搬出區域之位置，設有用於回收分割晶圓10而得的晶片之晶片落下用的開口部6，於該開口部6的下方，具備收容從該開口部6回收的晶片之晶片收容容器7，晶片收容容器7係夠成為可以從裝置外殼2抽出。 As shown in FIG. 1, an opening portion 6 for dropping a wafer for collecting a wafer obtained by dividing the wafer 10 is provided at a position adjacent to the loading/unloading region of the device casing 2, and the opening portion 6 is provided below the opening portion 6. The wafer storage container 7 of the wafer recovered from the opening portion 6 is capable of being taken out from the device casing 2 so as to be able to be taken out from the device casing 2.
該對準手段5係構成：位在搬入搬出區域與加工區域之間，具備檢測保持在保持床臺31的晶圓10的應加工區域之功能，利用顯微鏡或CCD攝影機等的光學手段所構成，把已拍攝的影像訊號送到未圖示控制手段。尚且，於本實施方式的切割裝置1，除此之外也具備：用於在該保持床臺31位在搬入搬出區域的情況下搬入搬出成為被加工物的晶圓10之搬入搬出手段、使切削加工後的晶圓10洗淨、乾燥之手段、用於把加工後的晶片落入到該晶片落下用的開口部6之落入手段等用於加工晶圓的種種的構成，但並非為構成本發明的重要部分的緣故，省略其圖示、說明。 The alignment means 5 is configured to be positioned between the loading/unloading area and the processing area, and has a function of detecting an area to be processed held by the wafer 10 holding the bed 31, and is configured by an optical means such as a microscope or a CCD camera. The captured image signal is sent to a control device not shown. In addition, the cutting device 1 of the present embodiment is provided with a loading/unloading means for loading and unloading the wafer 10 as a workpiece when the holding bed 31 is in the loading/unloading area. The means for washing and drying the wafer 10 after the cutting, the dropping means for dropping the processed wafer into the opening portion for dropping the wafer, and the like for processing the wafer, but not The illustration and description of the important parts of the present invention are omitted.
在此，如圖2(a)所示，根據本發明構成的切割裝置1中，成為被加工物的晶圓10為略矩形形狀，具有形成直線狀之複數個第1分割預定線101、以及設在與該第1分割預定線101正交的方向之複數個第2分割預定線102，在藉由該第1分割預定線101、以及該第2分割預定線102所區劃出的各區域配設裝置103。相對於沿該第1分割預定線101配列複數個裝置103之裝置列L1、L3、L5，包挾著該第1分割預定線而鄰接的裝置列L2 、L4配列成在第1分割預定線方向偏置，設在各個裝置列L1~L5的第2分割預定線102，係相對於第1分割預定線互相具有段差而交叉，亦即，形成非直線狀。 As shown in FIG. 2(a), in the dicing apparatus 1 of the present invention, the wafer 10 to be processed is a substantially rectangular shape, and has a plurality of first division planned lines 101 which are linearly formed, and The plurality of second division planned lines 102 provided in the direction orthogonal to the first division planned line 101 are arranged in the respective regions defined by the first division planned line 101 and the second division planned line 102. A device 103 is provided. The device arrays L1, L3, and L5 in which the plurality of devices 103 are arranged along the first dividing line 101 are adjacent to the device row L2 adjacent to the first dividing line. L4 is arranged to be offset in the direction of the first division planned line, and the second division planned line 102 provided in each of the device rows L1 to L5 intersects with each other with a step difference with respect to the first division planned line, that is, a non-linear line is formed. shape.
在經由形成在構成本發明的分割治具的保持床臺31的本體310的上表面之複數個吸引部320所構成的吸引區域，設有：根據上述晶圓10的裝置配置對應到第1分割預定線101的切削刀片的第1餘隙溝330、以及對應到第2分割預定線102的切削刀片的第2餘隙溝340。初始狀態下，配合加工前的晶圓10中的第1分割預定線101、第2分割預定線102的型態，相對於經由沿第1餘隙溝330配設之複數個吸引部320所構成的吸引部列L1’、L3’、L5’，包挾著該第1餘隙溝330鄰接的吸引部列L2’、L4’，係偏置在第1餘隙溝330方向，分別形成吸引部列L1’~L5’之第2餘隙溝340，係相對於第1餘隙溝330互相具有段差而交叉，並非配置在一直線上，成為非直線狀。 The suction region formed by the plurality of suction portions 320 formed on the upper surface of the main body 310 of the holding bed 31 constituting the dividing jig of the present invention is provided to correspond to the first division according to the device arrangement of the wafer 10 The first clearance groove 330 of the cutting insert of the predetermined line 101 and the second clearance groove 340 of the cutting insert corresponding to the second division planned line 102. In the initial state, the pattern of the first division planned line 101 and the second division planned line 102 in the wafer 10 before processing is formed with respect to a plurality of suction portions 320 disposed along the first clearance groove 330. The suction portion rows L1', L3', and L5' are surrounded by the suction portion rows L2' and L4' adjacent to the first clearance groove 330, and are biased in the direction of the first clearance groove 330 to form suction portions. The second clearance grooves 340 of the columns L1' to L5' intersect with each other with a step difference with respect to the first clearance grooves 330, and are not arranged on a straight line, and are non-linear.
有關構成上述的分割治具之保持床臺31，係根據圖2~4更進一步詳細說明之。如圖3所表示，該保持床臺31的本體310，係利用本體基座部311、以及長條狀的板部312所構成，本體基座部311係經由接合上構件311a、以及設有形成後述的吸入氣體路徑的凹部311c之下構件311b而構成。經由接合該上構件311a與下構件311b，在本體基座部311的內部，如圖3的A-A線剖視圖(參閱圖4)所表示，以該凹部311c與該上構件311a的 下表面部形成吸引路徑。在本體基座部311的側壁，配設連接到未圖示的吸引源之吸引管36，透過吸引管36在該吸引路徑內做吸引。形成在本體基座部311上表面的吸引部列L1’、L3’、L5’的吸引部320係連通到該吸引路徑，在吸引部列L1’與L3’之間、L3’與L5’之間，形成長條狀的板312可以滑動的板滑動凹部370、370。 The holding bed 31 constituting the above-described dividing jig is further described in detail with reference to Figs. As shown in FIG. 3, the main body 310 of the holding bed 31 is constituted by a main body base portion 311 and an elongated plate portion 312, and the main body base portion 311 is formed by joining the upper members 311a and being provided. The concave portion 311c of the suction gas passage to be described later is constituted by the lower member 311b. By joining the upper member 311a and the lower member 311b, the inside of the body base portion 311, as shown in a cross-sectional view taken along line A-A of FIG. 3 (see FIG. 4), with the concave portion 311c and the upper member 311a The surface of the table below forms a suction path. A suction pipe 36 connected to a suction source (not shown) is disposed on a side wall of the main body base portion 311, and is sucked through the suction pipe 36 in the suction path. The suction portion 320 formed in the suction portion rows L1', L3', and L5' on the upper surface of the main body base portion 311 communicates with the suction path, between the suction portion columns L1' and L3', and L3' and L5' In between, the elongated plate 312 is formed to be slidable plate sliding recesses 370, 370.
如圖3所表示，板312形成二分叉形狀，在板312的遠方側的側面，形成嵌合到形成在本體基座部311的板滑動凹部370的溝部313之導引軌條314、314。在連結經由形成在板312的上表面的吸引部320所形成的吸引部列L2’、L4’之連結部315，被固定在本體基座部311的下表面的空氣活塞350支撐成可以進退的活塞桿351的末端部被固定的桿連結部316係朝向下方而形成。 As shown in FIG. 3, the plate 312 is formed in a bifurcated shape, and guide rails 314, 314 which are fitted to the groove portion 313 of the plate sliding recess 370 formed in the body base portion 311 are formed on the side surface on the far side of the plate 312. . The air piston 350 fixed to the lower surface of the body base portion 311 is supported to be advanced and retractable by connecting the joint portions 315 of the suction portion rows L2' and L4' formed by the suction portions 320 formed on the upper surface of the plate 312. The rod connecting portion 316 whose distal end portion of the piston rod 351 is fixed is formed to face downward.
經由沿本體基座部311的該導引凹部311c使板312的導引軌條314嵌合滑動並抵接到最裏端，成為圖2(a)表示的初始狀態。經由這樣的構成，形成吸引區域之全部的吸引部320被連接到該吸入氣體路徑311c，透過吸引管36吸引吸入氣體路徑311c內的空氣，可以吸引載置在吸引部320上的晶圓10。尚且，本實施方式中的第1餘隙溝330，係形成在本體基座部311與板部312的相合面之間。 The guide rail 314 of the plate 312 is fitted and slid along the guide recess 311c of the body base portion 311 and abuts against the innermost end, and becomes an initial state shown in Fig. 2(a). With this configuration, the suction portion 320 forming all of the suction regions is connected to the suction gas passage 311c, and the air in the suction gas passage 311c is sucked by the suction pipe 36, whereby the wafer 10 placed on the suction portion 320 can be sucked. Further, the first clearance groove 330 in the present embodiment is formed between the surface of the body base portion 311 and the plate portion 312.
從圖2(a)可以明白，該初始狀態下，經由沿第1餘隙溝330配設的複數個吸引部320所構成的吸引部列L1’、L3’、L5’、以及包挾該第1餘隙溝330而鄰接 的吸引部列L2’、L4’，係經由偏置在第1餘隙溝330方向，分別形成吸引部列L1’~L5’之第2餘隙溝340，係互相具有段差而交叉，不形成在一直線上，成為不連續。 As can be understood from Fig. 2(a), in the initial state, the suction portion rows L1', L3', L5', and the plurality of suction portions 320 disposed along the first clearance groove 330 are provided. 1 gap groove 330 and adjacent The suction portion rows L2' and L4' are formed so as to be offset from each other in the first clearance groove 330 direction, and the second clearance grooves 340 of the suction portion rows L1' to L5' are formed so as to intersect each other with a step and do not form. On a straight line, it becomes discontinuous.
本實施方式的本體310，係從上述的圖2(a)表示的初始狀態，如圖2(b)所表示般，可以成為用於切削加工第2分割預定線的第2狀態。更具體方面，對空氣活塞350經由未圖示控制手段輸出驅動訊號的話，驅動空氣活塞350的活塞桿351，使板312沿第1餘隙溝滑動。經此，吸引部列L1’~L5’中，為了成為不連續的第2餘隙溝330成為排列在一直線上之第2狀態，使板312移動。 The main body 310 of the present embodiment can be the second state for cutting the second division planned line as shown in Fig. 2(b) from the initial state shown in Fig. 2(a). More specifically, when the air piston 350 outputs a drive signal via a control means not shown, the piston rod 351 of the air piston 350 is driven to slide the plate 312 along the first clearance groove. As a result, in the suction portion rows L1' to L5', the plate 312 is moved in order to form the discontinuous second clearance groove 330 in the second state arranged on the straight line.
構成本發明的分割治具的保持床臺31的本體310，係如上述般，從初始狀態變化到第2狀態，各吸引部320與吸引路徑的連通狀態係照原樣保持，也在任一的狀態下，經由從吸引管36吸引吸引路徑的空氣所產生的負壓作用在吸引部320，保持著吸引部所致之吸引功能，第2餘隙溝位置在一直線上。 The main body 310 of the holding bed 31 constituting the dividing jig of the present invention is changed from the initial state to the second state as described above, and the communication state between each of the suction portions 320 and the suction path is maintained as it is, and is also in any state. Next, the negative pressure generated by the air that sucks the suction path from the suction pipe 36 acts on the suction portion 320, and the suction function by the suction portion is maintained, and the second clearance groove position is on the straight line.
根據本發明構成的分割治具係如以上的構成，以下，一邊參閱圖1、2、圖5，說明有關使用該分割治具的晶圓的分割方法。 The division jig according to the present invention has the above configuration. Hereinafter, a method of dividing a wafer using the division jig will be described with reference to FIGS. 1 and 2 .
首先，收容在載置在未圖示卡匣床臺的卡匣之加工前的晶圓10，係經由未圖示的搬入搬出手段從該卡匣取出，搬入載置到保持床臺31上。尚且，在實施該搬入搬出手段前，作動對準手段5，拍攝保持床臺31的 上表面也就是吸引區域，拍攝第1、第2離隙溝，把已拍攝的影像訊號輸入到控制手段，把從影像訊號算出的該離隙溝位置的xy座標值儲存到記憶體。 First, the wafer 10 before being processed in a cassette placed on a cassette bed (not shown) is taken out from the cassette by a loading/unloading means (not shown), and loaded and placed on the holding bed 31. Further, before the loading/unloading means is implemented, the alignment means 5 is actuated to photograph the holding bed 31. The upper surface is also the attraction area, and the first and second relief grooves are taken, and the captured image signal is input to the control means, and the xy coordinate value of the position of the relief groove calculated from the image signal is stored in the memory.
此時，保持床臺31，係相合到加工前的晶圓10，成為上述的初始狀態，經此，分別形成吸引部列L1’~L5’之第2餘隙溝340，係在吸引部列L1’~L5’中不形成直線狀，相對於第1餘隙溝330具有段差而交叉，形成非直線狀。 At this time, the bed 31 is held in contact with the wafer 10 before the processing, and is in the initial state described above, whereby the second clearance grooves 340 of the suction portion rows L1' to L5' are formed, respectively, in the suction portion row. L1' to L5' are not formed linearly, and have a step with respect to the first clearance groove 330, and are formed in a non-linear shape.
把該晶圓10載置在保持床臺31上，把該離隙溝位置的xy座標值儲存到記憶體後，驅動未圖示的X軸方向移動手段，把保持床臺31移動到對準手段5的下方的拍攝位置，拍攝晶圓10的上表面，算出第1分割預定線101、以及第2分割預定線102的xy座標位置。 The wafer 10 is placed on the holding bed 31, and the xy coordinate value of the position of the gap is stored in the memory, and the X-axis moving means (not shown) is driven to move the holding table 31 to the alignment. At the imaging position below the means 5, the upper surface of the wafer 10 is imaged, and the xy coordinate position of the first division planned line 101 and the second division planned line 102 is calculated.
算出第1分割預定線101、以及第2分割預定線102的xy座標位置的話，經由該控制手段，算出第1、第2分割預定線的xy座標位置、與先記憶的第1、第2餘隙溝的xy座標位置之偏差，使載置在保持床臺31上的晶圓10暫時從保持床臺31上退避，為了第1、第2分割預定線與第1、第2餘隙溝一致，以X軸、Y軸方向、及旋轉方向補正保持床臺31，之後把退避的晶圓10再度載置在保持床臺31上。其結果，保持床臺31上的第1、第2餘隙溝、與晶圓10上的第1、第2分割預定線完全一致。接著，經由驅動未圖示的吸引源，透過吸引管36吸引保持床臺31內的吸引路徑內的空氣，在保持床臺31上吸 引固定晶圓10。 When the xy coordinate position of the first division planned line 101 and the second division planned line 102 is calculated, the xy coordinate position of the first and second division planned lines and the first and second remaining memories are calculated by the control means. The deviation of the xy coordinate position of the groove causes the wafer 10 placed on the holding bed 31 to be temporarily retracted from the holding bed 31, and the first and second dividing lines are aligned with the first and second clearance grooves. The bed 31 is held in the X-axis, Y-axis direction, and rotation direction, and then the retracted wafer 10 is placed on the holding bed 31 again. As a result, the first and second clearance grooves on the bed 31 are kept identical to the first and second division planned lines on the wafer 10. Then, by sucking a suction source (not shown), the air in the suction path in the holding bed 31 is sucked by the suction pipe 36, and sucked on the holding bed 31. The wafer 10 is fixed.
在保持床臺31上吸引固定晶圓10的話，利用對準手段5拍攝被吸引固定在保持床臺31上的晶圓10的第1分割預定線101，實施確認是否與加工進給方向也就是X軸方向平行之對準作業。若第1分割預定線101與X軸方向平行的話，控制旋轉保持床臺支撐手段32之未圖示的旋轉驅動手段，調整成被保持在保持床臺31之晶圓的第1分割預定線101與X軸方向平行。 When the fixed wafer 10 is sucked and held on the holding bed 31, the first dividing line 101 of the wafer 10 sucked and fixed on the holding bed 31 is imaged by the alignment means 5, and it is confirmed whether or not it is in the processing feed direction. The alignment of the X-axis direction is parallel. When the first division planned line 101 is parallel to the X-axis direction, the rotation driving means (not shown) that controls the rotation holding bed support means 32 is adjusted to be held by the first division planned line 101 of the wafer holding the bed 31. Parallel to the X-axis direction.
如上述實施對準的話，把保持床臺31移動到切削手段4的下方的加工區域，使切削刀片43旋轉，使未圖示的裁切進給手段作動，裁切進給在下方的晶圓10側。此時的裁切進給量係設定成切削刀片43的切刃之外周圍緣到達形成在保持床臺31的上表面之離隙溝330、340的位置。接著，如圖5(a)所表示，使未圖示X軸方向移動手段作動，使保持床臺31在以箭頭X表示的方向以指定的切削進給速度移動，該切削刀片43在稍稍越過該第1分割預定線101的終端部的位置使該保持床臺31的移動停止，該切削刀片43退避到上方，並且，朝向鄰接的下個應切削的第1分割預定線101分度進給，使切削刀片43下降，反覆該切削加工，切削晶圓10上之全部的第1分割預定線101。其結果，晶圓10係沿全部的第1分割預定線10被分割，沿第1分割預定線101配置的裝置列L1~L5被分割成長條狀(第1切斷製程)。尚且，在實施該切削的情況下，從切削水供給噴嘴44對切削刀 片43的切削部供給切削水。 When the alignment is performed as described above, the holding bed 31 is moved to the processing region below the cutting means 4, the cutting insert 43 is rotated, and the cutting feed means (not shown) is actuated to cut the wafer to be fed below. 10 sides. The cutting feed amount at this time is set such that the peripheral edge of the cutting edge of the cutting insert 43 reaches the position of the relief grooves 330, 340 formed on the upper surface of the holding bed 31. Next, as shown in Fig. 5(a), the X-axis direction moving means (not shown) is actuated to move the holding bed 31 at a predetermined cutting feed speed in the direction indicated by the arrow X, and the cutting insert 43 is slightly crossed. The position of the end portion of the first division planned line 101 stops the movement of the holding bed 31, the cutting blade 43 retreats upward, and the indexing feed is performed toward the next predetermined first dividing line 101 to be cut. The cutting insert 43 is lowered, and the cutting process is repeated to cut all of the first division planned lines 101 on the wafer 10. As a result, the wafer 10 is divided along all of the first division planned lines 10, and the device rows L1 to L5 arranged along the first division planned line 101 are divided into strips (first cutting process). Further, in the case where the cutting is performed, the cutter is supplied from the cutting water supply nozzle 44 The cutting portion of the sheet 43 supplies cutting water.
如上述，實施了第1切斷製程的話，使保持著吸引部所致之吸引功能之保持床臺支撐手段32在圓周方向旋轉90°，更進一步，驅動空氣活塞350，伸長活塞桿351，如圖2(b)所示，使長條狀的板312滑動，形成在該吸引部列L2’與L4’的第2餘隙溝340，係與形成在吸引部列L1’、L3’、L5’的第2餘隙溝340排列成直線狀。其結果，就載置在保持床臺31上的晶圓10來看，在加工前，在裝置列L1~L5中成為不連續的第2分割預定線102，係位置成排列在一直線上(板位置付製程)，尚且，在本實施方式，使保持床臺支撐手段32旋轉90°使板312滑動；但不特別限定於此，也可以是，在板312為不連續的第2分割預定線102，係在滑動成排列在一直線上後，使保持床臺保持手段32旋轉90°旋轉。 As described above, when the first cutting process is performed, the holding table support means 32 that holds the suction function by the suction portion is rotated by 90 in the circumferential direction, and further, the air piston 350 is driven to extend the piston rod 351, such as As shown in Fig. 2(b), the elongated plate 312 is slid, and the second clearance grooves 340 formed in the suction portion rows L2' and L4' are formed in the suction portion rows L1', L3', and L5. The second clearance grooves 340 are arranged in a straight line. As a result, in view of the wafer 10 placed on the holding bed 31, the second dividing line 102 is discontinuous in the device rows L1 to L5 before processing, and the positions are arranged in a straight line (board). Location payment In the present embodiment, the holding table support means 32 is rotated by 90 degrees to slide the plate 312. However, the plate 312 is not particularly limited thereto, and the plate 312 may be a discontinuous second dividing line 102. After the slides are aligned in a straight line, the holding table holding means 32 is rotated by 90 degrees.
若為了形成在晶圓10的第2分割預定線102排列成直線狀而使該板312滑動的話，使保持床臺31移動到對準手段5的下方區域，與加工過的第1分割預定線同樣，利用對準手段5檢測第2分割預定線，進行對準，把保持床臺31一邊加工進給在X軸方向一邊切削加工成為直線狀的第2分割預定線(參閱圖5(b))，反覆切削1個第2分割預定線後分度進給在Y軸方向，實施全部的第2分割預定線的切削加工(第2切斷製程)。 When the plate 312 is slid in order to form the second dividing line 102 formed on the wafer 10, the holding bed 31 is moved to the lower region of the alignment means 5 and the processed first dividing line. In the same manner, the second dividing line is detected by the aligning means 5, and the aligning is performed, and the holding bed 31 is machined and fed into the second dividing line to be linearly cut in the X-axis direction (see FIG. 5(b). In the Y-axis direction, the cutting processing (second cutting process) of all the second dividing lines is performed in the Y-axis direction.
如上述，第2分割預定線102，係與開始晶圓10的加工之前的狀態不同，在結束第1切斷製程後位置 成直線狀的緣故，可以沿第2分割預定線對裝置列L1~L5一口氣實施切削加工，可以有效率切削加工。 As described above, the second division planned line 102 is different from the state before the start of processing of the wafer 10, and the position after the end of the first cutting process is completed. In the case of a straight line, it is possible to perform cutting processing on the device rows L1 to L5 along the second predetermined dividing line, and it is possible to perform efficient cutting.
結束上述的第1切斷製程、第2切斷製程後，藉由未圖示的洗淨、乾燥手段使其洗淨、乾燥，解除來自作用在保持床臺31的吸引區域的吸引源的吸引，使用未圖示的落入手段把分割成一個一個的裝置從開口部6收容到收容容器7。接著，1批份的CSP基板的切削加工結束後，藉由收容容器7把分割成一個一個的裝置運到下個製程。 After the first cutting process and the second cutting process described above are completed, the cleaning and drying means (not shown) are washed and dried to release the suction from the suction source acting on the suction region of the holding bed 31. The device that is divided into one by one is placed in the storage container 7 from the opening 6 by using a dropping means (not shown). Next, after the cutting process of the one-part CSP substrate is completed, the device divided into one by one is transported to the next process by the storage container 7.
在上述的本實施方式中，晶圓10係構成為裝置列為L1~L5之5列，保持床臺31係與該晶圓10相合，以L1’~L5’構成吸引部列；但本發明不限定於此。例如，可以以3列(L1~L3)構成作為被加工物的晶圓的裝置列，構成把中央的裝置列L2相對於鄰接的L1、L3而偏置，保持床臺31也與該晶圓相合，把吸引部列作為3列(L1’~L3’)，使其中央的吸引部列L2’偏置鄰接的L1’、L3’，只要是2列以上的話，用怎樣的列數來構成都是可以的。 In the above-described embodiment, the wafer 10 is configured in five rows of devices L1 to L5, and the holding bed 31 is in contact with the wafer 10, and the suction portion is formed by L1' to L5'. It is not limited to this. For example, the device row of the wafer as the workpiece can be formed in three columns (L1 to L3), and the central device row L2 is biased with respect to the adjacent L1 and L3, and the bed 31 is also held with the wafer. When the matching portion is arranged in three columns (L1' to L3'), the central suction portion row L2' is offset from the adjacent L1' and L3', and if it is two or more columns, the number of columns is used. It is all right.
10‧‧‧晶圓(CSP基板) 10‧‧‧ wafer (CSP substrate)
31‧‧‧保持床臺 31‧‧‧ Keep the bed
32‧‧‧保持床臺支撐手段 32‧‧‧ Keeping the bed support means
36‧‧‧吸引管 36‧‧‧ suction tube
101‧‧‧第1分割預定線 101‧‧‧1st dividing line
102‧‧‧第2分割預定線 102‧‧‧2nd dividing line
103‧‧‧裝置 103‧‧‧ device
310‧‧‧本體 310‧‧‧ Ontology
311‧‧‧本體基座部 311‧‧‧ body base
312‧‧‧板 312‧‧‧ board
320‧‧‧吸引部 320‧‧‧Attraction
330‧‧‧第1餘隙溝 330‧‧‧1st clearance
340‧‧‧第2餘隙溝 340‧‧‧2nd gap
L1~L5‧‧‧裝置列 L1~L5‧‧‧ device column
L1’~L5’‧‧‧吸引部列 L1’~L5’‧‧‧Attraction
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| JP2016013200A JP2017135232A (en) | 2016-01-27 | 2016-01-27 | Dividing jig and dividing method for wafer |
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| TW201737403A true TW201737403A (en) | 2017-10-16 |
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| JP (1) | JP2017135232A (en) |
| KR (1) | KR20170089763A (en) |
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| JP6890894B2 (en) * | 2017-08-21 | 2021-06-18 | 株式会社ディスコ | Manufacturing method of holding jig |
| JP6970554B2 (en) * | 2017-08-21 | 2021-11-24 | 株式会社ディスコ | Processing method |
| CN112397988B (en) * | 2019-08-12 | 2022-10-14 | 潍坊华光光电子有限公司 | Reverse side cutting device and method of heat sink for semiconductor laser |
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| KR20160000953A (en) * | 2014-06-25 | 2016-01-06 | 삼성전자주식회사 | Substrate and a method of manufacturing semiconductor packages |
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