CN111522156A - Method and device for detecting substrate defects - Google Patents
Method and device for detecting substrate defects Download PDFInfo
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- CN111522156A CN111522156A CN202010321122.6A CN202010321122A CN111522156A CN 111522156 A CN111522156 A CN 111522156A CN 202010321122 A CN202010321122 A CN 202010321122A CN 111522156 A CN111522156 A CN 111522156A
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- 239000000758 substrate Substances 0.000 title claims abstract description 401
- 238000000034 method Methods 0.000 title claims abstract description 335
- 230000007547 defect Effects 0.000 title claims abstract description 174
- 230000008439 repair process Effects 0.000 claims abstract description 48
- 239000004973 liquid crystal related substance Substances 0.000 description 12
- 238000001514 detection method Methods 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 11
- 239000010408 film Substances 0.000 description 5
- 238000007689 inspection Methods 0.000 description 5
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- 239000011521 glass Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
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- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
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- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1306—Details
- G02F1/1309—Repairing; Testing
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N2021/9513—Liquid crystal panels
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Abstract
The embodiment of the invention discloses a method and a device for detecting defects of a substrate, wherein after a first substrate process, the defects of the substrate in the first substrate process are identified, and a first process defect file is generated, wherein the first process defect file comprises an information column of the first substrate process and first parameter information of the first substrate process; acquiring preset first standard parameter information of the first substrate process; comparing the first parameter information with the first standard parameter information, and determining whether the substrate after the first substrate process needs to be repaired; if so, sending a first repairing instruction to the substrate repairing equipment so that the substrate repairing equipment can repair the defects of the first substrate process in the substrate according to the first process defect file, and adding an information column for distinguishing the substrate process in the software of the substrate defect detecting device to avoid unnecessary repeated repair of the process meeting the conditions and save the repairing capacity.
Description
Technical Field
The invention relates to the technical field of display panel production, in particular to a method and a device for detecting defects of a substrate.
Background
Liquid crystal display panels have been rapidly developed and widely used in recent years. Most of the existing liquid crystal display devices in the market are backlight liquid crystal display devices, which include a liquid crystal display panel and a backlight module (backlight module). Generally, a Liquid Crystal display panel is composed of a Color Filter substrate (CF), a Thin film transistor substrate (TFT), a Liquid Crystal (LC) sandwiched between the Color Filter substrate and the Thin film transistor substrate, and a Sealant; the working principle is that the rotation of liquid crystal molecules of the liquid crystal layer is controlled by applying driving voltage on the two glass substrates, and light rays of the backlight module are refracted out to generate a picture.
A color film substrate or an array substrate of a liquid crystal display panel is produced by a plurality of processes, in the production process, AOI (automatic optical inspection) equipment plays a role in detecting process defects, and then repair equipment is used for repairing bad defects.
The existing substrate detection technology can not identify the process name or can identify the process name of the substrate but only judge that the defects of the substrate process are completely repaired or not repaired, and can not independently repair any substrate process in a customized way. And (3) leaving a trace after the quality defect of the front substrate procedure is repaired, wherein the trace is considered as a quality defect problem in the rear substrate procedure and enters a repairing link again, so that the repair capacity of the rear procedure is wasted.
Disclosure of Invention
The embodiment of the invention provides a method and a device for detecting defects of a substrate, aiming at solving the problem of capacity waste caused by repeated repair of process defects in a substrate manufacturing process.
In order to solve the above problem, in a first aspect, the present application provides a method for detecting a defect of a substrate, including:
after a first substrate process, identifying defects of the substrate in the first substrate process, and generating a first process defect file, wherein the first process defect file comprises an information field of the first substrate process and first parameter information of the first substrate process;
acquiring preset first standard parameter information of the first substrate process;
comparing the first parameter information with the first standard parameter information, and determining whether the substrate after the first substrate process needs to be repaired;
if so, sending a first repairing instruction to the substrate repairing equipment so that the substrate repairing equipment can repair the defects of the first substrate process in the substrate according to the first process defect file.
Further, after a second substrate process, identifying defects of the substrate in the second substrate process, and generating a second process defect file on the basis of the first process record file, wherein the second process defect file comprises an information field of the second substrate process and parameter information of the second substrate process;
comparing the second parameter information with the second standard parameter information, and determining whether the substrate after the second substrate process needs to be repaired;
if so, sending a second repairing instruction to the substrate repairing equipment so that the substrate repairing equipment can repair the defects of the second substrate process in the substrate according to the second process defect file
Further, the determining, by comparing the first parameter information with the first standard parameter information, whether the substrate after the first substrate process needs to be repaired includes:
respectively comparing the first point location information of each pixel with the first standard point location information to respectively determine whether the first standard point location information corresponding to the first point location information of each pixel in each pixel is matched;
and if the number of pixels, of which the first point location information and the corresponding first standard point location information are not matched, in each pixel reaches a first preset threshold value, determining that the substrate after the first substrate process needs to be repaired.
Further, the first point location information of each pixel includes a first pixel coordinate of each pixel, and the first standard point location information of each pixel includes a first standard pixel coordinate of each pixel;
the first point location information of each pixel further comprises first form information corresponding to a first pixel coordinate of each pixel, and the first standard point location information of each pixel further comprises first standard form information corresponding to a first standard pixel coordinate of each pixel;
the comparing the first point location information of each pixel with the first standard point location information respectively to determine whether the first standard point location information corresponding to the first point location information of each pixel in each pixel is matched includes:
respectively comparing the first form information with the first standard form information to respectively determine whether the first form information of each pixel in each pixel is matched with the corresponding first standard form information;
and when the first form information of the target pixel in each pixel is matched with the corresponding first standard form information, determining that the first point location information of the target pixel is matched with the first standard point location information.
Further, the method further comprises:
after determining that the substrate after the first substrate process does not need to be repaired, if a third repairing instruction for repairing the substrate after the first substrate process by a user is obtained;
and sending a third repairing instruction to the substrate repairing equipment so that the substrate repairing equipment repairs the defects of the first substrate process in the substrate according to the first process defect file.
In a second aspect, the present application provides an apparatus for detecting defects on a substrate, comprising:
a first identification unit, configured to identify a defect of a substrate in a first substrate process after the first substrate process, and generate a first process defect file, where the first process defect file includes an information field of the first substrate process and first parameter information of the first substrate process;
the first acquisition unit is used for acquiring first standard parameter information of a preset first substrate process;
the first comparison unit is used for comparing the first parameter information with the first standard parameter information and determining whether the substrate after the first substrate process needs to be repaired;
and the first sending unit is used for sending a first repairing instruction to the substrate repairing equipment if the substrate after the first substrate process needs to be repaired, so that the substrate repairing equipment repairs the defects in the first substrate process in the substrate according to the first process defect file.
Further, on the basis of the above detection device, the device further includes:
a second identification unit, configured to identify a defect of a substrate in a second substrate process after the second substrate process, and generate a second process defect file based on the first process record file, where the second process defect file includes an information field of the second substrate process and parameter information of the second substrate process;
the second acquisition unit is used for acquiring second standard parameter information of a preset second substrate process;
the second comparison unit is used for comparing the second parameter information with the second standard parameter information and determining whether the substrate after the second substrate process needs to be repaired;
and the second sending unit is used for sending a second repairing instruction to the substrate repairing equipment if the substrate after the second substrate process needs to be repaired, so that the substrate repairing equipment can repair the defects in the second substrate process in the substrate according to the second process defect file.
Further, the first parameter information includes first point location information of each pixel of the substrate, the first standard parameter information includes first standard point location information of each pixel of the substrate, and the first comparing unit is specifically configured to:
respectively comparing the first point location information of each pixel with the first standard point location information to respectively determine whether the first standard point location information corresponding to the first point location information of each pixel in each pixel is matched;
and if the number of pixels, of which the first point location information and the corresponding first standard point location information are not matched, in each pixel reaches a first preset threshold value, determining that the substrate after the first substrate process needs to be repaired.
Further, the first point location information of each pixel includes a first pixel coordinate of each pixel, and the first standard point location information of each pixel includes a first standard pixel coordinate of each pixel;
the first point location information of each pixel further comprises first form information corresponding to a first pixel coordinate of each pixel, and the first standard point location information of each pixel further comprises first standard form information corresponding to a first standard pixel coordinate of each pixel;
the first comparison unit is specifically configured to:
respectively comparing the first form information with the first standard form information to respectively determine whether the first form information of each pixel in each pixel is matched with the corresponding first standard form information;
and when the first form information of the target pixel in each pixel is matched with the corresponding first standard form information, determining that the first point location information of the target pixel is matched with the first standard point location information.
Further, the apparatus further comprises:
a third obtaining unit, configured to obtain, after determining that the substrate after the first substrate process does not need to be repaired, a third repair instruction for repairing the substrate after the first substrate process by a user;
and the third sending unit is used for sending a third repairing instruction to the substrate repairing equipment so that the substrate repairing equipment can repair the defects of the first substrate process in the substrate according to the first process defect file.
The embodiment of the invention provides a method for detecting defects of a substrate, which comprises the steps of after a first substrate process, identifying the defects of the substrate in the first substrate process, and generating a first process defect file, wherein the first process defect file comprises an information field of the first substrate process and first parameter information of the first substrate process; acquiring preset first standard parameter information of the first substrate process; comparing the first parameter information with the first standard parameter information, and determining whether the substrate after the first substrate process needs to be repaired; if so, sending a first repairing instruction to the substrate repairing equipment so that the substrate repairing equipment can repair the defects of the first substrate process in the substrate according to the first process defect file. According to the embodiment of the invention, on the basis that the historical processes cannot be identified or the historical processes are identified but only all the processes can be repaired or not repaired, the information column for distinguishing the substrate processes is added into the process defect file of the substrate, so that the information column of the substrate processes can distinguish the defect file in each step of the process, each step of the process is further identified and distinguished, any one or more processes can be repaired or not repaired in a self-defined manner based on the information column in the repairing process, unnecessary repeated repairing of the processes meeting the conditions is avoided, and the repairing capacity is saved.
The embodiment of the invention provides a substrate defect detection device, which comprises a first identification unit, a first acquisition unit, a first comparison unit and a first sending unit, wherein a first process defect file in the first identification unit comprises an information column of a first substrate process and first parameter information of the first substrate process, the first parameter information of the first substrate process is used for being compared with first standard parameter information and judging whether a substrate after the first substrate process needs to be repaired or not, and the information column of the first substrate process is used for distinguishing the substrate processes, so that the substrate defect detection device provided by the embodiment can identify and distinguish each process and help repair equipment to repair any one or more processes in a user-defined manner. Unnecessary repeated repair of the process meeting the conditions is avoided, and therefore repair capacity is saved.
Drawings
The technical solution and other advantages of the present application will become apparent from the detailed description of the embodiments of the present application with reference to the accompanying drawings.
FIG. 1 is a schematic diagram of a method for detecting defects on a substrate according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a manufacturing process of a COA according to an embodiment of the present invention;
fig. 3 is a schematic diagram of a manufacturing process of a POA according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
The existing AOI detection technology can not identify the name of a substrate process or can identify the name of the substrate process but only judge that the defects of the substrate process are completely repaired or not repaired, and can not independently repair any substrate process in a customized manner. And (3) leaving a trace after the quality defect of the front substrate procedure is repaired, wherein the trace is considered as a quality defect problem in the rear substrate procedure and enters a repairing link again, so that the repair capacity of the rear substrate procedure is wasted.
Accordingly, embodiments of the present invention provide a method and an apparatus for detecting defects of a substrate, which are used to solve the problem of waste of productivity caused by repeated repair of process defects in a substrate manufacturing process, and are described in detail below.
First, a method for detecting a substrate defect is provided in an embodiment of the present invention, referring to fig. 1, fig. 1 is a schematic diagram illustrating a method for repairing a substrate defect according to an embodiment of the present invention. The method comprises the following steps:
s10, after the first substrate process, identifying the defects of the substrate in the first substrate process, and generating a first process defect file, wherein the first process defect file comprises an information field of the first substrate process and first parameter information of the first substrate process; the color film substrate or the array substrate of the liquid crystal display panel is produced by a plurality of processes, such as a BM process, an ITO process, a PS process and the like of the color film substrate, wherein the first substrate process can be the BM process, the ITO process and the PS process;
in this embodiment, the substrate may be a color film substrate or an array substrate, and the first substrate process may be any process of the color film substrate or the array substrate in a manufacturing process.
Specifically, the information field of the substrate process may be represented by BM, ITO or PS, or may be represented by other terms or symbols that can distinguish the substrate processes, such as symbols 1, 2 and 3, which respectively represent BM, ITO and PS processes.
Specifically, the first parameter information of the first substrate process may be a point location, a gray scale value, or other parameters capable of representing substrate defect information.
S20, acquiring preset first standard parameter information of the first substrate process; specifically, the first standard parameter information is a series of parameters for determining whether the substrate is defective corresponding to the first parameter information;
s30, comparing the first parameter information with the first standard parameter information, and determining whether the substrate after the first substrate process needs to be repaired;
and S40, if yes, sending a first repairing instruction to the substrate repairing equipment so that the substrate repairing equipment can repair the defects of the first substrate process in the substrate according to the first process defect file.
Specifically, the substrate repairing device is a laser repairing device.
The embodiment of the invention provides a method for detecting defects of a substrate, which comprises the steps of after a first substrate process, identifying the defects of the substrate in the first substrate process, and generating a first process defect file, wherein the first process defect file comprises an information field of the first substrate process and first parameter information of the first substrate process; acquiring preset first standard parameter information of the first substrate process; comparing the first parameter information with the first standard parameter information, and determining whether the substrate after the first substrate process needs to be repaired; if so, sending a first repairing instruction to the substrate repairing equipment so that the substrate repairing equipment can repair the defects of the first substrate process in the substrate according to the first process defect file. According to the embodiment of the invention, on the basis that the historical processes cannot be identified or the historical processes are identified but only all the processes can be repaired or not repaired, the information column for distinguishing the substrate processes is added into the process defect file of the substrate, so that the information column of the substrate processes can distinguish the defect file in each step of the process, each step of the process is further identified and distinguished, any one or more processes can be repaired or not repaired in a self-defined manner based on the information column in the repairing process, unnecessary repeated repairing of the processes meeting the conditions is avoided, and the repairing capacity is saved.
On the basis of the foregoing embodiment, in another specific embodiment of the present application, the method for detecting a defect of a substrate further includes:
s50, after the second substrate process, identifying the defects of the substrate in the second substrate process, and generating a second process defect file on the basis of the first process record file, wherein the second process defect file comprises an information field of the second substrate process and parameter information of the second substrate process;
specifically, the second substrate step is a step subsequent to the first substrate step, and for example, in a COA substrate, when the first substrate step is a BM step, the second substrate step is an ITO step, and when the first substrate step is an ITO step, the second substrate step is a PS step.
S60, comparing the second parameter information with the second standard parameter information, and determining whether the substrate after the second substrate process needs to be repaired;
and S70, if yes, sending a second repairing instruction to the substrate repairing equipment so that the substrate repairing equipment can repair the defects of the second substrate process in the substrate according to the second process defect file.
In another specific embodiment of the present application, the determining whether the substrate after the first substrate process needs to be repaired by comparing the first parameter information with the first standard parameter information includes:
respectively comparing the first point location information of each pixel with the first standard point location information to respectively determine whether the first standard point location information corresponding to the first point location information of each pixel in each pixel is matched;
and if the number of pixels, of which the first point location information and the corresponding first standard point location information are not matched, in each pixel reaches a first preset threshold value, determining that the substrate after the first substrate process needs to be repaired. On the basis of the above embodiment, in another specific embodiment, the first point location information of each pixel includes a first pixel coordinate of each pixel, and the first standard point location information of each pixel includes a first standard pixel coordinate of each pixel;
the first point location information of each pixel further comprises first form information corresponding to a first pixel coordinate of each pixel, and the first standard point location information of each pixel further comprises first standard form information corresponding to a first standard pixel coordinate of each pixel;
specifically, the first form information may include RB (reflective black), RW (reflective white), or TW (transmissive white).
The comparing the first point location information of each pixel with the first standard point location information respectively to determine whether the first standard point location information corresponding to the first point location information of each pixel in each pixel is matched includes:
respectively comparing the first form information with the first standard form information to respectively determine whether the first form information of each pixel in each pixel is matched with the corresponding first standard form information;
and when the first form information of the target pixel in each pixel is matched with the corresponding first standard form information, determining that the first point location information of the target pixel is matched with the first standard point location information.
Specifically, when comparing whether the first point location information of the target pixel in each pixel matches with the corresponding first standard point location information, the coordinates of the target pixel are determined, the form information of the pixel at the coordinates of the target pixel, that is, the first form information of the target pixel, is obtained, and then compared with the first standard form information at the coordinates of the target pixel, and whether the first form information of the target pixel matches with the corresponding first standard point location information is determined, when the first form information of the target pixel matches with the corresponding first standard form information, the first point location information of the target pixel matches with the corresponding first standard point location information, for example, when the first form information of the target pixel is different from the corresponding first standard form information, the first form information of the target pixel indicates a mismatch, when the first form information of the target pixel is RB (reflective black), the corresponding first standard form information is RW (reflective white), the first form information indicating that the target pixel does not match with the corresponding first standard form information, at this time, the first point location information of the target pixel and the corresponding first standard point location information do not match.
Further, when the first morphological information of the target pixel and the corresponding first standard morphological information do not match,
the first point location information of each pixel further comprises a first gray-scale value corresponding to a first pixel coordinate of each pixel, and the first standard point location information of each pixel further comprises a first standard gray-scale value corresponding to a first standard pixel coordinate of each pixel;
the comparing the first point location information of each pixel with the first standard point location information respectively to determine whether the first standard point location information corresponding to the first point location information of each pixel in each pixel is matched further includes:
when the first form information of the target pixel in each pixel is not matched with the corresponding first standard form information, respectively comparing the first gray-scale value with the first standard gray-scale value to respectively determine whether the first gray-scale value of each pixel in each pixel is matched with the corresponding first standard gray-scale value;
and when the first gray-scale value of the target pixel in each pixel is matched with the corresponding first standard gray-scale value, determining that the first point location information of the target pixel is matched with the first standard point location information.
The repair equipment can repair the defects, and can be controlled by a program or customized by a user.
In another specific embodiment of the present application, the method further comprises:
after determining that the substrate after the first substrate process does not need to be repaired, if a third repairing instruction for repairing the substrate after the first substrate process by a user is obtained;
and sending a third repairing instruction to the substrate repairing equipment so that the substrate repairing equipment repairs the defects of the first substrate process in the substrate according to the first process defect file.
Specifically, the inspection device for identifying defects of the substrate in the substrate process is AOI.
The repair device repairs the defects, and one or more of the defects can be repaired at the same time.
In another embodiment of the present application, the patch instruction comprises:
the number of repair items may be zero, one, or more than one.
The substrate repairing equipment can be used for repairing defects generated in the current process or historical processes.
Specifically, the defect existing in the second substrate step may be an unrepaired defect generated in the first substrate step, or a defect generated in the second substrate step
In an embodiment of the present invention, a method for detecting a defect of a COA (Color Filter on Array) is further provided, referring to fig. 2, a COA substrate is divided into an upper substrate and a lower substrate, and fig. 2 shows a process for manufacturing the upper substrate and the lower substrate of the COA, where the method for repairing the upper substrate includes:
after a BM (Black Matrix) process is performed on a substrate, defects of the substrate in the BM process are identified by using AOI, generated information is compared with preset standard parameter information, a generated defect file is named BM, the BM defect file includes a process information field and corresponding parameter information, in this embodiment, the content of the process information field is represented by BM, and the parameter information corresponding to the BM process includes: point location, shape, defect judgment and pre-procedure judgment modules. If the defect is judged to be yes, sending a corresponding BM repairing instruction to substrate repairing equipment so that the substrate repairing equipment can repair the defect of the BM process in the substrate according to the BM defect file;
specifically, the dots are represented by X and Y axes, and the shapes include RB (reflective black), RW (reflective white), TW (transmissive white), and the corresponding gray-scale values.
The gray scale value refers to the color depth of a point in a black-and-white image, and ranges from 0 to 255, wherein black is 0 and white is 255, and the darker the color is, the smaller the gray scale value is.
Specifically, the generated information is compared with the preset standard parameter information in the steps of the above embodiment, and the comparison content is the morphological information of the pixel point and the corresponding gray-scale value.
Specifically, the previous process determination information module is configured to determine whether the process belongs to a current process or a historical process, and in this embodiment, BM is the current process.
After a process of manufacturing an ITO (Indium Tin Oxide) layer on a substrate, defects of the substrate in the ITO process are identified by using AOI, generated information is compared with preset standard parameter information, a defect file generated on the basis of a BM defect file is named as ITO, the ITO defect file comprises an information column of the ITO process and corresponding parameter information, and specifically, the content of the information column of the process is represented by BM and ITO. If the defect judgment information is yes, sending a corresponding repairing instruction to the substrate repairing equipment so that the substrate repairing equipment can repair BM or ITO defects existing in an ITO process in the substrate according to the ITO defect file;
after a substrate manufacturing (PS) process, defects of the substrate in the PS process are identified by using AOI (automatic optical inspection), generated information is compared with preset standard parameter information, a defect file generated on the basis of a PS defect file is named as PS, the PS defect file comprises information columns of the PS process and corresponding parameter information, and specifically, the content of the information columns of the process is represented by BM, ITO and PS. If the defect judgment information corresponding to the content of the information column of the process is yes, sending a corresponding repairing instruction to the substrate repairing equipment, so that the substrate repairing equipment can repair the defects of BM, ITO or PS in the PS process in the substrate according to the PS defect file.
The detection method of the lower substrate of the COA substrate comprises the following steps:
after the process of fabricating Array and R, G, B layers on a substrate, identifying defects of the substrate in the R, G, B process by using AOI, comparing the generated information with preset standard parameter information, and generating defect files named as R, G and B based on the defect files, wherein the defect files comprise information fields of R, G, B processes and corresponding parameter information, and specifically, the content of the information fields of the processes is represented by Array, R, G and B. If the defect judgment information corresponding to the content of the process information field is yes, a corresponding repairing instruction is sent to the substrate repairing equipment, so that the substrate repairing equipment repairs the defects of Array, R, G and B in the R, G, B process in the substrate according to the R, G, B defect file.
It should be noted that the method for detecting a defect of a substrate only describes repairing a COA substrate, and it is understood that, in addition to the COA substrate, in the embodiment of the present invention, other substrates may be repaired, such as a POA (PS array ) or an HVA (High Vertical Alignment) type substrate, and please refer to fig. 3, which shows a process for manufacturing an upper substrate and a lower substrate of a POA, and a specific example is not limited herein.
The substrate detection method provided by the embodiment of the invention has multiple purposes, and can be used for a multi-process quality monitoring and repairing system, defects repaired by processes before filtration, or any defect monitoring and repairing process in the quality monitoring industry of liquid crystal panels.
The embodiment of the present invention further provides a substrate defect detecting apparatus, where the substrate defect detecting apparatus is located in AOI, and the substrate defect detecting apparatus includes:
a first identification unit, configured to identify a defect of a substrate in a first substrate process after the first substrate process, and generate a first process defect file, where the first process defect file includes an information field of the first substrate process and first parameter information of the first substrate process;
the first acquisition unit is used for acquiring first standard parameter information of a preset first substrate process;
the first comparison unit is used for comparing the first parameter information with the first standard parameter information and determining whether the substrate after the first substrate process needs to be repaired;
and the first sending unit is used for sending a first repairing instruction to the substrate repairing equipment if the substrate after the first substrate process needs to be repaired, so that the substrate repairing equipment repairs the defects in the first substrate process in the substrate according to the first process defect file.
On the basis of the above embodiment, in another specific embodiment of the present application, the apparatus further includes:
a second identification unit, configured to identify a defect of a substrate in a second substrate process after the second substrate process, and generate a second process defect file based on the first process record file, where the second process defect file includes an information field of the second substrate process and parameter information of the second substrate process;
the second acquisition unit is used for acquiring second standard parameter information of a preset second substrate process;
the second comparison unit is used for comparing the second parameter information with the second standard parameter information and determining whether the substrate after the second substrate process needs to be repaired;
and the second sending unit is used for sending a second repairing instruction to the substrate repairing equipment if the substrate after the second substrate process needs to be repaired, so that the substrate repairing equipment can repair the defects in the second substrate process in the substrate according to the second process defect file.
In another specific embodiment of the present application, the first parameter information includes first point location information of each pixel of the substrate, the first standard parameter information includes first standard point location information of each pixel of the substrate, and the first comparing unit is specifically configured to:
respectively comparing the first point location information of each pixel with the first standard point location information to respectively determine whether the first standard point location information corresponding to the first point location information of each pixel in each pixel is matched;
and if the number of pixels, of which the first point location information and the corresponding first standard point location information are not matched, in each pixel reaches a first preset threshold value, determining that the substrate after the first substrate process needs to be repaired.
On the basis of the foregoing embodiment, in another specific embodiment of the present application, the first point location information of each pixel includes a first pixel coordinate of each pixel, and the first standard point location information of each pixel includes a first standard pixel coordinate of each pixel;
the first point location information of each pixel further comprises first form information corresponding to a first pixel coordinate of each pixel, and the first standard point location information of each pixel further comprises first standard form information corresponding to a first standard pixel coordinate of each pixel;
the first comparison unit is specifically configured to:
respectively comparing the first form information with the first standard form information to respectively determine whether the first form information of each pixel in each pixel is matched with the corresponding first standard form information;
in another specific embodiment of the present application, when the first shape information of the target pixel in the pixels matches with the corresponding first standard shape information, it is determined that the first point location information of the target pixel matches with the first standard point location information.
The device further comprises:
a third acquisition unit: after determining that the substrate after the first substrate process does not need to be repaired, if a third repairing instruction for repairing the substrate after the first substrate process by a user is obtained;
a third transmitting unit: and the third repairing instruction is sent to the substrate repairing equipment, so that the substrate repairing equipment can repair the defects of the first substrate process in the substrate according to the first process defect file.
It should be noted that, in the embodiment of the substrate defect detecting apparatus, only the above structure is described, and it is understood that, in addition to the above structure, the substrate defect detecting apparatus of the embodiment of the present invention may further include any other necessary structure as needed, and the specific structure is not limited herein.
The embodiment of the invention provides a substrate defect detection device, which comprises a first identification unit, a first acquisition unit, a first comparison unit and a first sending unit, wherein a first process defect file in the first identification unit comprises an information column of a first substrate process and first parameter information of the first substrate process, the first parameter information of the first substrate process is used for being compared with first standard parameter information and judging whether a substrate after the first substrate process needs to be repaired or not, and the information column of the first substrate process is used for distinguishing the substrate processes, so that the substrate defect detection device provided by the embodiment can identify and distinguish each process and help repair equipment to repair any one or more processes in a user-defined manner. Unnecessary repeated repair of the process meeting the conditions is avoided, and therefore repair capacity is saved.
The embodiment of the present invention further provides an automatic optical inspection apparatus, which integrates any one of the substrate defect detection devices provided by the embodiments of the present invention, and the automatic optical inspection apparatus includes:
one or more processors;
a memory; and
one or more applications, wherein the one or more applications are stored in the memory and configured to be executed by the processor to perform the steps of the substrate defect detection method of any of the above embodiments.
It will be understood by those skilled in the art that all or part of the steps of the methods of the above embodiments may be performed by instructions or by associated hardware controlled by the instructions, which may be stored in a computer readable storage medium and loaded and executed by a processor.
To this end, an embodiment of the present invention provides a computer-readable storage medium, which may include: read Only Memory (ROM), Random Access Memory (RAM), magnetic or optical disks, and the like. The computer program is loaded by a processor to execute the steps of any one of the substrate defect detecting methods provided by the embodiments of the present invention.
In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and parts that are not described in detail in a certain embodiment may refer to the above detailed descriptions of other embodiments, and are not described herein again.
In a specific implementation, each unit or structure may be implemented as an independent entity, or may be combined arbitrarily to be implemented as one or several entities, and the specific implementation of each unit or structure may refer to the foregoing method embodiment, which is not described herein again.
The above operations can be implemented in the foregoing embodiments, and are not described in detail herein.
The method and the apparatus for detecting defects of a substrate according to the embodiments of the present invention are described in detail, and the principles and embodiments of the present invention are described herein by using specific examples, and the description of the embodiments is only used to help understanding the method and the core concept of the present invention; meanwhile, for those skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
Claims (10)
1. A method of detecting defects in a substrate, the method comprising:
after a first substrate process, identifying defects of the substrate in the first substrate process, and generating a first process defect file, wherein the first process defect file comprises an information field of the first substrate process and first parameter information of the first substrate process;
acquiring preset first standard parameter information of the first substrate process;
comparing the first parameter information with the first standard parameter information, and determining whether the substrate after the first substrate process needs to be repaired;
if so, sending a first repairing instruction to the substrate repairing equipment so that the substrate repairing equipment can repair the defects of the first substrate process in the substrate according to the first process defect file.
2. The method of claim 1, further comprising:
after a second substrate process, identifying the defects of the substrate in the second substrate process, and generating a second process defect file on the basis of the first process record file, wherein the second process defect file comprises an information field of the second substrate process and parameter information of the second substrate process;
comparing the second parameter information with the second standard parameter information, and determining whether the substrate after the second substrate process needs to be repaired;
and if so, sending a second repairing instruction to the substrate repairing equipment so that the substrate repairing equipment can repair the defects of the second substrate process in the substrate according to the second process defect file.
3. The method according to claim 1, wherein the first parameter information includes first point location information of each pixel of the substrate, the first standard parameter information includes first standard point location information of each pixel of the substrate, and the comparing the first parameter information and the first standard parameter information determines whether the substrate after the first substrate process needs to be repaired includes:
respectively comparing the first point location information of each pixel with the first standard point location information to respectively determine whether the first standard point location information corresponding to the first point location information of each pixel in each pixel is matched;
and if the number of pixels, of which the first point location information and the corresponding first standard point location information are not matched, in each pixel reaches a first preset threshold value, determining that the substrate after the first substrate process needs to be repaired.
4. The method of claim 3, wherein the first dot location information of each pixel comprises a first pixel coordinate of each pixel, and the first standard dot location information of each pixel comprises a first standard pixel coordinate of each pixel;
the first point location information of each pixel further comprises first form information corresponding to a first pixel coordinate of each pixel, and the first standard point location information of each pixel further comprises first standard form information corresponding to a first standard pixel coordinate of each pixel;
the comparing the first point location information of each pixel with the first standard point location information respectively to determine whether the first standard point location information corresponding to the first point location information of each pixel in each pixel is matched includes:
respectively comparing the first form information with the first standard form information to respectively determine whether the first form information of each pixel in each pixel is matched with the corresponding first standard form information;
and when the first form information of the target pixel in each pixel is matched with the corresponding first standard form information, determining that the first point location information of the target pixel is matched with the first standard point location information.
5. The method of claim 1, further comprising:
after determining that the substrate after the first substrate process does not need to be repaired, if a third repairing instruction for repairing the substrate after the first substrate process by a user is obtained;
and sending a third repairing instruction to the substrate repairing equipment so that the substrate repairing equipment repairs the defects of the first substrate process in the substrate according to the first process defect file.
6. An apparatus for detecting defects in a substrate, the apparatus comprising:
a first identification unit, configured to identify a defect of a substrate in a first substrate process after the first substrate process, and generate a first process defect file, where the first process defect file includes an information field of the first substrate process and first parameter information of the first substrate process;
the first acquisition unit is used for acquiring first standard parameter information of a preset first substrate process;
the first comparison unit is used for comparing the first parameter information with the first standard parameter information and determining whether the substrate after the first substrate process needs to be repaired;
and the first sending unit is used for sending a first repairing instruction to the substrate repairing equipment if the substrate after the first substrate process needs to be repaired, so that the substrate repairing equipment repairs the defects in the first substrate process in the substrate according to the first process defect file.
7. The apparatus of claim 6, further comprising:
a second identification unit, configured to identify a defect of a substrate in a second substrate process after the second substrate process, and generate a second process defect file based on the first process record file, where the second process defect file includes an information field of the second substrate process and parameter information of the second substrate process;
the second acquisition unit is used for acquiring second standard parameter information of a preset second substrate process;
the second comparison unit is used for comparing the second parameter information with the second standard parameter information and determining whether the substrate after the second substrate process needs to be repaired;
and the second sending unit is used for sending a second repairing instruction to the substrate repairing equipment if the substrate after the second substrate process needs to be repaired, so that the substrate repairing equipment can repair the defects in the second substrate process in the substrate according to the second process defect file.
8. The apparatus according to claim 6, wherein the first parameter information includes first point location information of each pixel of the substrate, the first standard parameter information includes first standard point location information of each pixel of the substrate, and the first comparing unit is specifically configured to:
respectively comparing the first point location information of each pixel with the first standard point location information to respectively determine whether the first standard point location information corresponding to the first point location information of each pixel in each pixel is matched;
and if the number of pixels, of which the first point location information and the corresponding first standard point location information are not matched, in each pixel reaches a first preset threshold value, determining that the substrate after the first substrate process needs to be repaired.
9. The apparatus of claim 8, wherein the first dot location information of each pixel includes a first pixel coordinate of each pixel, and the first standard dot location information of each pixel includes a first standard pixel coordinate of each pixel;
the first point location information of each pixel further comprises first form information corresponding to a first pixel coordinate of each pixel, and the first standard point location information of each pixel further comprises first standard form information corresponding to a first standard pixel coordinate of each pixel;
the first comparison unit is specifically configured to:
respectively comparing the first form information with the first standard form information to respectively determine whether the first form information of each pixel in each pixel is matched with the corresponding first standard form information;
and when the first form information of the target pixel in each pixel is matched with the corresponding first standard form information, determining that the first point location information of the target pixel is matched with the first standard point location information.
10. The apparatus of claim 6, further comprising:
a third obtaining unit, configured to, after determining that the substrate after the first substrate process does not need to be repaired, obtain a third repair instruction for repairing the substrate after the first substrate process by a user;
and the third sending unit is used for sending a third repairing instruction to the substrate repairing equipment so as to enable the substrate repairing equipment to repair the defects of the first substrate process in the substrate according to the first process defect file.
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