JP4955425B2 - Laser processing equipment - Google Patents

Description

  The present invention relates to a laser processing apparatus. For example, the present invention relates to a laser processing apparatus that performs laser processing (repair processing) for repairing an open defect in which a part of a pattern is missing in a liquid crystal substrate, a semiconductor substrate, a printed circuit board, or the like.

Conventionally, for example, in a manufacturing process of a liquid crystal display device (LCD), various inspections are performed on a glass substrate processed in a photolithography process. When a defect is detected in the resist pattern, etching pattern, or wiring pattern formed on the glass substrate as a result of this inspection, laser processing for correcting the defect, so-called repair processing is often performed using a laser processing apparatus. . This repair processing includes wiring repair that repairs an open defect in which a part of the pattern is missing, and cut correction that removes or cuts a short defect in which the patterns are in contact with each other. Cut correction requires only irradiating the cut portion with laser light, whereas wiring repair attaches a material filling the insufficient pattern, and therefore requires a different process from cut correction.
As a laser processing apparatus that performs such wiring repair, for example, Patent Document 1 discloses that a laser light source, a CVD cell, an optical system that circulates laser light on a substrate in the CVD cell, and a thermal dissociation reaction are used. Wiring formation comprising a source gas supply system for supplying a compound gas for depositing a substance to a CVD cell, a mechanism for holding the substrate in the CVD cell, and an XY stage for scanning the irradiation position of the laser beam with respect to the substrate An apparatus is described. This wiring forming apparatus performs wiring repair using a so-called CVD (Chemical Vapor Deposition) wiring technique.
JP-A-63-133549

However, the conventional laser processing apparatus as described above has the following problems.
The CVD wiring technique is a technique for extending a wiring length by depositing a material used for wiring repair from a gas phase and scanning with a laser beam, and a wiring speed is extremely low. In the technique described in Patent Document 1, in response to such a technical problem, the drawing speed is improved from 6 μm / s to 30 μm / s by changing the laser beam used in the CVD wiring technique from a circular beam to an elliptical beam. However, in recent years, since the substrate area tends to increase, the repair length per substrate also tends to increase, so further time reduction is strongly demanded.
Further, in the apparatus described in Patent Document 1, since it is necessary to cover the wiring repair range with a CVD cell and perform the wiring repair after adjusting the atmosphere in the CVD cell to the atmosphere of the source gas, the wiring repair of a large substrate is required. In this case, there is a problem that it takes time to change the setup for moving the CVD cell.
In general, it is necessary to perform both cut correction and wiring repair to correct a defect on one substrate. However, the apparatus disclosed in Patent Document 1 has a problem that cut correction and wiring repair cannot be performed alternately. . Even if a mechanism for performing both of them is provided in one apparatus, there is a problem that it is not possible to perform efficient defect correction because it takes time to change the setup when switching between the respective processes.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a laser processing apparatus that can quickly repair open defects and efficiently perform defect correction.

In order to solve the above-described problems, a laser processing apparatus according to the present invention includes an imaging unit that captures an image of a processing surface on which a layered pattern is formed using a layer-forming substance, and the processing target that is captured by the imaging unit. From the image of the surface, the defect is detected by distinguishing an open defect in which a part of the pattern of the processed surface is missing and a short defect in which the patterns of the processed surface are in contact with each other, and information on the position and shape of the defect is obtained. A laser processing apparatus having a defect detection unit that acquires defect information including a laser light source that generates laser light capable of evaporating or sublimating the layer forming material, and spatially modulating the laser light emitted from the laser light source A spatial modulation element, an imaging optical system that guides laser light reflected in a certain direction by the spatial modulation element to a processing surface, and an imaging position of the imaging optical system near the processing surface Optical axis An imaging position moving mechanism that moves to the substrate, a transfer substrate on which a transfer thin film made of the layer forming material is formed on a glass substrate, and the transfer substrate with the transfer thin film facing the processed surface side. In this state, on the optical path between the processing surface and the imaging optical system, the position can be moved in the direction along the optical axis of the imaging optical system and in the direction orthogonal thereto, and forward and backward movement with respect to the optical path Modulation data of the spatial modulation element for irradiating the open defect portion with the laser beam based on the transfer substrate moving mechanism that can be held and the defect information of the open defect detected by the defect detection unit And a modulation data generation unit that generates an untransferred region of the transfer thin film on the transfer substrate onto the open defect in the vicinity of the processed surface, and is generated by the modulation data generation unit. A configuration in which a laser beam spatially modulated based on modulation data is imaged on the transfer thin film, and the layer-forming material in the irradiated portion of the laser beam is transferred onto the open defect to repair the open defect. And
According to this invention, when an open defect is detected on the processing surface by the defect detection unit from the image of the processing surface captured by the imaging unit, the transfer substrate moving mechanism is driven to In a state where the transfer thin film faces the vicinity of the processing surface, the transfer thin film is advanced on the optical path between the processing surface and the imaging optical system. Then, based on the defect information acquired by the defect detection unit, the transfer substrate moving mechanism is driven to move the untransferred area of the transfer substrate onto the open defect near the processing surface.
On the other hand, the modulation data generation unit generates modulation data for irradiating the open defect portion with laser light based on the defect information from the defect detection unit, and sends it to the spatial modulation element. Further, the imaging position moving mechanism is driven to move the imaging position of the imaging optical system to the position of the transfer thin film.
Then, the laser light is irradiated onto the spatial modulation element, and the laser light spatially modulated according to the modulation data is imaged on the transfer thin film by the imaging optical system. As a result, the layer forming material in the laser light irradiation range in the transfer thin film of the transfer substrate can be evaporated or sublimated to the processed surface side, transferred onto the open defect, and the open defect can be repaired.
In addition, by using the transfer substrate moving mechanism, the defect correction of the open defect can be completed by retracting the transfer substrate from the optical path between the processing surface and the imaging optical system, and the imaging unit, the defect detection unit, Since the modulation data generation unit, the spatial modulation element, and the imaging optical system can be used for cut correction of a short defect, the configuration is changed to a configuration for correcting the cut of a short defect by simply changing the laser light source. be able to.

  According to the laser processing apparatus of the present invention, the layer forming material can be transferred from the transfer substrate in accordance with the open defect on the surface to be processed, so that the open defect can be corrected quickly without scanning the wiring pattern. Therefore, the defect correction can be performed efficiently.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In all the drawings, even if the embodiments are different, the same or corresponding members are denoted by the same reference numerals, and common description is omitted.

A laser processing apparatus according to an embodiment of the present invention will be described.
FIG. 1 is a schematic explanatory view in a cross section including an optical axis showing a schematic configuration of a laser processing apparatus according to an embodiment of the present invention. 2A and 2B are a plan view showing an array of micromirrors of the spatial modulation element of the laser processing apparatus according to the embodiment of the present invention, and a schematic perspective view explaining the micromirrors of the spatial modulation element. It is. FIGS. 3A and 3B are a schematic plan view of a transfer substrate unit of the laser processing apparatus according to the embodiment of the present invention and an AA view thereof. FIG. 4 is a functional block diagram showing a functional configuration of a control unit of the laser processing apparatus according to the embodiment of the present invention.

The laser processing apparatus 50 according to the present embodiment detects, for example, a pattern defect in a workpiece on which a layered pattern such as a metal wiring or a photoresist is formed on the surface, and corrects the defective portion with laser light. It is an apparatus for performing laser processing (repair processing). Examples of the workpiece include an LCD (liquid crystal display) glass substrate and a semiconductor wafer substrate.
Examples of the defect include an open defect in which a part of the pattern is missing and a short defect in which the patterns are in contact with each other. In this specification, the words “open” and “short” are used in a shape meaning and not in an electrical meaning. When the pattern is a conductive pattern, it corresponds to an open or short on the circuit.
In the following, wiring repair is used to repair a pattern by attaching a layer forming material that forms a pattern to the open defect missing part, and the pattern repairing is performed by cutting the contact part of a short defect with a laser beam. This is called correction.

  As shown in FIG. 1, the schematic configuration of the laser processing apparatus 50 includes a stage 17, a processing head moving mechanism 18, a laser light source unit 30, a spatial modulation element 6, an imaging lens 7 (imaging optical system), and an objective lens 10 ( Imaging optical system), illumination light source 14, observation imaging lens 12, imaging element 13, transfer substrate unit 40, transfer substrate moving mechanism 43, and control unit 60. Here, a part of the laser light source section 30, the spatial modulation element 6, the imaging lens 7, the objective lens 10, the illumination light source 14, the observation imaging lens 12, the imaging element 13, the transfer substrate unit 40, and the transfer substrate The moving mechanism 43 is integrally held in the casing to constitute the processing head 51.

The stage 17 holds the substrate 11 as a workpiece horizontally with the processing surface 11a facing upward, and a predetermined direction in the horizontal plane (for example, FIG. 1) by a control signal from the control unit 60. The substrate 11 is moved along the left-right direction).
The processing head moving mechanism 18 is a mechanism that moves the processing head 51 in a direction orthogonal to the moving direction of the substrate 11 (for example, a direction orthogonal to the plane of FIG. 1) based on information on the substrate 11 on the stage 17. It is provided on the horizontal beam of the gantry 52 which is a gate-type support member straddling.
The stage 17 and the processing head moving mechanism 18 combine the respective movements, thereby moving the processing head 51 relative to the processing surface 11a in the biaxial direction along the processing surface 11a. Is configured.
The machining head moving mechanism 16 is electrically connected to a machining area movement control unit 78 (see FIG. 4) of the control unit 60, and moves to a position on the surface 11a to be machined according to a control signal from the machining area movement control unit 78. To be controlled.

  The laser light source unit 30 is a light source for repairing that emits a laser beam 31 toward the spatial modulation element 6. In the present embodiment, the laser light source unit 30 includes the laser light source 1, the condensing unit 2, the optical fiber 3, and the collimating unit 4. Is adopted.

The laser light source 1 emits a laser beam 31 having an appropriate wavelength and output necessary for cut correction and wiring repair toward the processing surface 11a during cut correction and toward the transfer substrate unit 40 during wiring repair. Therefore, in this embodiment, a YAG laser capable of pulse oscillation is employed. The YAG laser has a fundamental wavelength λ ₁ = 1.064 μm and can emit second, third, and fourth harmonics (wavelengths λ ₂ = 532 nm, λ ₃ = 355 nm, and λ ₄ = 266 nm, respectively).
In the case of cut correction, it is possible to appropriately switch and set the laser wavelength having high absorption characteristics for the layer forming material or dust to be removed from the processing surface 11. For example, the oscillation wavelength of the ultraviolet region to remove the photoresist, for example, it is preferable to use a laser light such as wavelength lambda _3.
In the case of wiring restoration, in this embodiment, the wavelength λ ₁ in the infrared region is used in order to efficiently apply thermal energy to the transfer substrate unit 40.
The laser light source 1 is electrically connected to a laser light control unit 75 (see FIG. 4) of the control unit 60, and conditions such as the wavelength, output, and pulse width are set.

Since the laser light output from the laser light source 1 has a Gaussian distribution, the laser light output from the laser light source 1 is condensed by the condensing unit 2 in the optical fiber 3 in this embodiment. By optically coupling to one end face, passing through the optical fiber 3, and emitting from the other end face of the optical fiber 3, the light quantity distribution can be made uniform.
The laser light emitted from the other end face of the optical fiber 3 is condensed by the collimator unit 4 so that a laser light 31 that is a substantially parallel light beam can be formed.

The spatial modulation element 6 is a reflective spatial modulation element that spatially modulates the laser light 31 projected from the collimator unit 4 of the laser light source unit 30. In this embodiment, a DMD (Digital Micro mirror Device) which is a micro mirror array is employed. That is, a plurality of micromirrors 6a formed by, for example, MEMS (Micro Electro Mechanical Systems) technology or the like are two-dimensionally arranged in a reference plane extending in the depth direction of the paper surface of FIG. As shown in FIG. 2, a rectangular modulation region M having a long side W × short side H is formed.
On the back side of each micromirror 6a, as shown in FIG. 2B, a mirror driving unit 6b for applying an electric field to the micromirror 6a is provided, and each micromirror 6a is electrically connected to the spatial modulation element 6. Due to the electrostatic electric field generated by the control signal from the spatial modulation element driving unit 77 connected to, it is rotated, for example, by + 12 ° from the reference plane in the on state, and is rotated by −12 ° from the reference plane in the off state. Hereinafter, the light reflected by the micromirror 6a in the on state is referred to as on light 32, and the light reflected by the micromirror 6a in the off state is referred to as off light 35.
In the present embodiment, the laser beam 31 projected from the collimator unit 4 is deflected by the reflection mirror 5 a and is irradiated at a constant incident angle with respect to the reference plane of the spatial modulation element 6.

The imaging lens 7 and the objective lens 10 are a lens or a lens group that forms an image of the ON light 32 that is spatially modulated by the spatial modulation element 6 and reflected in a certain direction on the processing surface 11 a of the substrate 11. It is an optical element consisting of In the present embodiment, the objective lens 10 is designed at infinity.
In this embodiment, the imaging lens 7 is provided in an attitude in which the optical axis is parallel to the substrate 11, and the on-light 32 of the spatial modulation element 6 is transmitted between the spatial modulation element 6 and the imaging lens 7. A reflection mirror 5b that is incident along the optical axis of the imaging lens 7 is disposed.

The objective lens 10 is arranged so that its optical axis is along the normal direction of the surface 11a to be processed, and the optical axis of the imaging lens 7 is placed between the imaging lens 7 and the objective lens 10 with respect to the objective lens 10. A beam splitter 8 that bends to the optical axis is provided.
The beam splitter 8 includes a beam splitter surface that reflects the wavelength light of the ON light 32 and transmits the wavelength light of the observation light 33 described later.
In addition, the objective lens 10 is provided in such a manner that a plurality of sets according to the magnification can be switched by a revolver mechanism (not shown), and the lens barrel 10a of each objective lens 10 is in a state where the objective lens 10 is set on the optical axis. It is possible to move along the optical axis direction.
Such switching of the objective lens 10 and movement in the optical axis direction are performed by the objective lens moving mechanism 15 (imaging position moving mechanism) electrically connected to the objective lens control unit 73 (see FIG. 4) of the control unit 60. Is done by.

The projection magnification of the imaging optical system including the imaging lens 7 and the objective lens 10 is appropriately set according to the required processing accuracy on the processing surface 11a. For example, an image having a size of W × H of the entire modulation region M is set to be projected on the processing surface 11a to a size of W ′ × H ′ at a magnification β. That is, a region in the range of W ′ × H ′ on the processing surface 11a is a processable region R.
Here, the NA of the imaging lens 7 satisfies a resolution necessary for processing, and has a size such that light reflected as off-light (not shown) does not enter.

On the optical path between the beam splitter 8 and the objective lens 10, in order to irradiate the processing surface 11a through the objective lens 10, it is emitted by the illumination light source 14, and is condensed into substantially parallel light by the illumination lens 14a. A half mirror 9 for synthesizing the observation light 33 on the optical path is provided.
The illumination light source 14 is a light source that illuminates the processable region on the processing surface 11a in order to determine a processing shape and confirm a processing result. For example, an appropriate light source such as a xenon lamp or LED that generates visible light can be used.
The half mirror 9 is formed of a half mirror having a reflective transmittance characteristic that transmits the ON light 32 and reflects a part of the observation light 33. Further, the reflection transmittance characteristic of the half mirror 9 may be provided with a wavelength characteristic. In this case, it is preferable that the reflection ratio is a high transmittance with respect to the wavelength of the ON light 32, and preferably a transmittance of approximately 100%. In this way, it is possible to reduce the light amount loss in the imaging optical system. Further, it may be configured such that it can be retracted from the optical path by raising or moving when the laser beam 31 is irradiated.

The observation imaging lens 12 is a lens or a lens group that is disposed on the optical path of the light transmitted by the beam splitter 8 and has a conjugate relationship between the imaging position of the objective lens 10 and the imaging surface of the imaging element 13. .
The image pickup device 13 photoelectrically converts an image formed on the image pickup surface, and includes, for example, a two-dimensional CCD.
The image signal photoelectrically converted by the image pickup device 13 is sent to the image pickup control unit 70 (see FIG. 4) of the control unit 60 electrically connected to the image pickup device 13.
The observation imaging lens 12 and the imaging device 13 constitute an imaging unit.

  The transfer substrate unit 40 includes a transfer substrate 41 and a substrate holder 42 (gas levitation holder). The transfer substrate moving mechanism 43 causes an optical axis on the optical path between the objective lens 10 and the surface 11a to be processed. The position is movable in the direction along and perpendicular to each other, and is held so as to move forward and backward with respect to the optical path.

As shown in FIGS. 3A and 3B, the transfer substrate 41 is formed on one surface of the glass substrate 41a with a layer for repairing wiring on the substrate 11 by an appropriate film forming technique such as sputtering. A transfer thin film made of a substance is formed.
As the transfer thin film of the transfer substrate 41, an appropriate metal, metal compound, or metal alloy can be employed depending on the layer forming material for wiring repair. For example, examples of other layer forming materials capable of forming a thin film by sputtering include Au, Al, Pd, Ag, Cu, Ta, Mo, W, SiO ₂ , Si ₃ N ₄ , Al ₂ O ₃ , TiW, and TiN. TiC, ITO (Indium Tin Oxide), Ni-Cu alloy, Ni-Cr alloy, Nb-Ti alloy, Mo-Si alloy, Co-Cr alloy, Co-P alloy, iron-based alloy, stainless steel And so on.
In the present embodiment, for example, a metal thin film 41b (transfer thin film) made of, for example, Al or W is formed by sputtering in order to repair a metal wiring such as Al or W.
As the thickness of the metal thin film 41b, a thickness capable of efficiently evaporating or sublimating the transfer thin film according to the light amount of the laser light source 1, etc. can be adopted, and for example, 100 nm to 300 nm is preferable. The metal thin film 41b may be a thin film having a multilayer structure having a light absorption layer that absorbs laser light and converts it into thermal energy on the laser light incident side.

The material of the glass substrate 41a may be any material as long as it can transmit when the laser light for evaporating or sublimating the metal thin film 41b is irradiated as the ON light 32. In this embodiment, quartz glass having good heat resistance and thermal shock characteristics is employed.
An appropriate shape can be adopted as the shape of the glass substrate 41a in plan view. In the present embodiment, an example of a circular plate will be described, but it may be, for example, a rectangle or a polygon.

  Further, the transfer substrate 41 has four injection holes 41c for injecting a levitation gas supplied from a levitation mechanism 44, which will be described later, toward the processing surface 11a, on a circumference of a predetermined diameter near the outer edge, and the like. It is provided by penetrating in the thickness direction at a pitch.

The substrate holder 42 is a member that holds the transfer substrate 41 in a state in which the metal thin film 41b is directed to the substrate 11 side.
In the present embodiment, the holding portion 42a having an outer shape slightly larger than the outer shape of the transfer substrate 41 and having an opening 42b in the central portion and extending in a lateral direction from the side surface of the holding portion 42a. It consists of an arm part 42c.
A hole-shaped holding surface 42d for positioning and fixing the glass substrate 41a of the transfer substrate 41 is formed on the surface of the holding portion 42a on the substrate 11 side. Although an appropriate method can be adopted as a method for fixing the transfer substrate 41, adhesion is adopted in this embodiment.

Further, the holding surface 42d is formed with a gas flow path 42f composed of an annular groove portion in plan view in accordance with the circumference in which the injection hole 41c of the substrate holder 42 is formed. A gas flow path 42e, which is a through hole that has an end penetrating the gas flow path 42f and the other end penetrating the end in the extending direction of the arm part 42c, is provided.
For this reason, when the transfer substrate 41 is bonded to the substrate holder 42, the gas flow path 42f covers the area excluding the injection holes 41c by the glass substrate 41a to form a pipe line. As a result, the transfer substrate unit 40 is formed with a gas flow path that communicates from the gas flow path 42e through the gas flow path 42f to the injection hole 41c.

The transfer substrate moving mechanism 43 includes an XYZ stage that detachably holds the end of the arm portion 42c of the transfer substrate unit 40, and is electrically connected to the transfer substrate movement control unit 82 of the control unit 60 to transfer the transfer substrate unit 40. The position of the transfer substrate unit 40 can be moved by a control signal from the transfer substrate movement controller 82.
In addition, the transfer substrate moving mechanism 43 is provided with a tube 44a for supplying a gas of an appropriate pressure for floating the transfer substrate unit 40 to the gas flow path 42e, and the other end side of the tube 44a is the floating mechanism 44. (See FIG. 1).

The levitation mechanism 44 supplies a gas having an appropriate pressure to the gas flow path 42e of the transfer substrate unit 40 in accordance with a control signal from the levitation mechanism control unit 83 (see FIG. 4) of the control unit 60, and supplies the gas from the injection hole 41c. This is a gas supply mechanism for holding the transfer substrate 41 at a height Δ (see FIG. 3B) with respect to the processing surface 11a by spraying.
The height Δ is preferably a height sufficiently close to the processing surface 11a so that the layer forming material evaporated or sublimated by the laser light adheres to the processing surface 11a immediately below. Such Δ is preferably 1 μm to 30 μm, more preferably 1 μm to 5 μm.
In the present embodiment, the gas supplied by the levitation mechanism 44 employs an inert gas such as nitrogen gas in order to prevent oxidation of the metal of the metal thin film 41b when it evaporates or sublimates. .
When the transfer substrate unit 40 is levitated by the levitating mechanism 44, the transfer substrate moving mechanism 43 releases the holding state in the vertical direction (Z direction) of the arm portion 42c and is horizontally movable in the vertical direction. The position can be moved in the direction (X, Y direction).

As shown in FIG. 4, the control unit 60 includes the imaging device 13, the objective lens moving mechanism 15, the laser light source 1, the illumination light source 14, the spatial modulation element 6, the processing head moving mechanism 16, the display 27, and the transfer substrate moving mechanism 43. Are electrically connected to the levitation mechanism 44, communicate with each other, transmit and receive data and control signals, perform necessary arithmetic processing, and perform overall control of the laser processing apparatus 50. is there.
In the present embodiment, the control unit 60 has a device configuration in which a program created in correspondence with the control function and the arithmetic function shown in FIG. 4 by a computer including a CPU, a memory, an input / output unit, an external storage device, and the like. It is realized by executing or by hardware that realizes the control function shown in FIG.
The main functional block configuration of the control unit 60 includes an apparatus control unit 80, an image processing unit 71 (modulation data generation unit), a defect detection unit 72, a storage unit 74, a transfer substrate movement control unit 82 (movement position setting unit), A transfer history storage unit 81 and a communication interface 84 are included.

The apparatus control unit 80 performs overall control of the laser processing apparatus 50. The imaging control unit 70 that controls the imaging element 13 and the objective lens moving mechanism 15 control the objective lens 10 to perform switching and focus adjustment. A lens control unit 73, a laser light control unit 75 that performs condition setting and oscillation control of the laser light source 1, an illumination control unit 76 that performs lighting control of the illumination light source 14, and an on state and an off state of each micromirror 6a of the spatial modulation element 6. The position of the processing head 51 on the substrate 11 is controlled by controlling the amount of movement of the spatial modulation element driving unit 77 and the processing head moving mechanism 16 for controlling the switching between and the optical axis of the objective lens 10 in the processing region. A transfer area for controlling the relative movement of the processing area movement control unit 78, the position of the transfer substrate movement mechanism 43 in the three-axis direction, the advance and retreat to the optical path, and the holding state of the arm part 42c. Plate movement control unit 82, and a floating mechanism control unit 83 for controlling the floating mechanism 44 each are electrically connected, so that it sends a control signal to each.
The transfer substrate movement control unit 82 is electrically connected to a transfer history storage unit 81 that stores information on an untransferred area, which will be described later, selects the position of the untransferred area, and sets the movement position of the transfer substrate unit 40. It can be set.
The device control unit 80 is also electrically connected to the image processing unit 71, the storage unit 74, and the display 27, and can perform various image processing controls and display processing control of image data via them. .
Further, the apparatus control unit 80 is connected to the communication line 85 via the communication interface 84 and communicates with the board information database 86 constructed on the data server connected to the communication line 85, so that the stage 17. Information on the pattern formed on the processing surface 11a on the substrate 11 held on the substrate 11 according to the manufacturing process, and information on defects detected in advance by another inspection device, for example, a macro inspection device by automatic inspection or the like Etc. can be obtained.
In the present embodiment, the display 27 displays an observation image of the processing surface 11a, and can perform operation input of the laser processing apparatus 50 using a GUI.

The image processing unit 71 performs appropriate image processing such as noise processing and luminance correction on the image signal sent from the imaging device 13 to acquire image data of the processing surface 11a. The image data is sent to the defect detection unit 72 and stored in the storage unit 74 so that the image data can be enlarged and displayed on the display 27 via the device control unit 80.
In addition, when defect image data including defect information that needs to be corrected is sent from the defect detection unit 72, the magnification of the image forming optical system that includes the image forming lens 7 and the objective lens 10 is converted into the defect image data. In accordance with β, it is converted into position information on the spatial modulation element 6, and modulation data of the spatial modulation element 6 that can irradiate the on-light 32 to the region irradiated with the laser light is generated, via the device control unit 80. And sent to the spatial modulation element driving unit 77.

  The defect detection unit 72 performs defect detection processing from the image data sent from the image processing unit 71. For example, a luminance difference is obtained between the acquired image data and normal pattern image data stored in advance in the storage unit 74, and defects are extracted from data obtained by binarizing the difference data with a predetermined threshold. can do. Then, the shape analysis of the defect is performed, for example, it is determined whether the defect is an unnecessary defect or a defect that needs to be corrected, such as an isolated defect that does not impair the function of other normal patterns, When correction is necessary, it is determined whether the defect is an open defect or a short defect, and the image data is sent to the image processing unit 71 together with the determination result.

Next, the operation of the laser processing apparatus 50 will be described.
FIG. 5 is a flowchart for explaining the operation of the laser processing apparatus according to the embodiment of the present invention. FIG. 6A is a schematic explanatory diagram illustrating an example of a normal pattern on the surface to be processed. FIG. 6B is a schematic explanatory diagram illustrating an example of an open defect generated on the surface to be processed. FIG. 7 is a flowchart for explaining a wiring repair operation according to the embodiment of the present invention. FIG. 8 is a schematic explanatory diagram illustrating an example of modulation data of the spatial modulation element corresponding to the open defect of FIG. FIG. 9 is a schematic explanatory view showing the movement of the transfer substrate of the laser processing apparatus according to the embodiment of the present invention. FIG. 10 is a flowchart for explaining the cut correcting operation according to the embodiment of the present invention.

For example, when a defect is detected by another inspection apparatus such as a macro inspection apparatus, the substrate 11 is carried into the laser processing apparatus 50 and set on the stage 17. At this time, the transfer substrate unit 40 is retracted to the standby position outside the optical path in a state where the arm portion 42c is held in the three-axis directions and the gas supply of the levitation mechanism 44 is stopped.
In step S <b> 1, the apparatus control unit 80 accesses the substrate information database 86 to acquire image data of normal patterns formed on the substrate 11 and information on defects detected by other inspection apparatuses and store them in the storage unit 74. Remember.
Then, the first inspection position is determined based on the position information of the defect detected by another inspection apparatus, and the optical axis of the objective lens 10 is set to the first inspection position via the processing area movement control unit 78. Is sent to the machining area moving mechanism 16.
In the processing area moving mechanism 16, the stage 17 and the processing head moving mechanism 18 are driven based on the sent position coordinates to move the processing head 51 relative to the substrate 11.

In step S2, an image of the processing surface 11a is acquired, and defect detection processing for the visual field range is performed.
First, the revolver mechanism of the objective lens moving mechanism 15 is driven via the objective lens control unit 73, the objective lens 10 with a low magnification is set, and an image is acquired by the objective lens 10 with this magnification. For this purpose, the illumination light source 14 is turned on to generate observation light 33. The observation light 33 is made into a substantially parallel light beam by the illumination lens 14a, reflected by the half mirror 9, and the reflected light is condensed by the objective lens 10 to illuminate the visual field range on the processing surface 11a.
The reflected light 34 reflected by the processing surface 11 a is collected by the objective lens 10, passes through the half mirror 9 and the beam splitter 8, and is guided to the observation imaging lens 12. The reflected light 34 incident on the observation imaging lens 12 is imaged on the imaging surface of the imaging element 13.
The image sensor 13 photoelectrically converts the image of the imaged surface 11a to be processed and sends the image as an image signal to the imaging controller 70. The image signal is sent to the image processing unit 71, for example, focus information is generated by a contrast method or the like, and the focus information is sent to the objective lens control unit 73, whereby the objective lens 10 for the processing surface 11 a is obtained. Auto focus operation is performed.
Then, after focusing, the data is sent to the defect detection unit 72 as image data subjected to image processing such as noise removal and luminance correction as necessary. Further, it is stored in the storage unit 74 and displayed on the display 27.
The defect detection unit 72 performs a defect detection process such as taking a difference from well-known non-defective image data and binarizing the difference with a preset threshold value to detect a defect. However, in step S2, for the purpose of observation at a low magnification, the purpose is to confirm or correct the defect position by another inspection apparatus, and it is not determined whether the detected defect is an open defect or a short defect.

Next, in step S3, it is determined whether or not the presence of a defect has been confirmed as a result of the defect detection process in step S2. If there is a defect, position information of the detected defect is sent to the apparatus control unit 80. The process proceeds to step S4.
If the presence of a defect cannot be confirmed, the process proceeds to step S11.

  Next, in step S4, in order to acquire detailed information on the defect, the objective lens 10 is switched to a high-magnification lens, and the processing head 51 is moved according to the defect position information acquired in step S2. At this time, if there are a plurality of defects in the processable region R, the defect group moves to the center position, and image data of the processable region R is acquired. Then, the defect detection unit 72 performs the defect detection process again.

Next, in step S5, it is determined whether or not the presence of a defect has been confirmed as a result of the defect detection process in step S4. If a defect exists, the process proceeds to step S6.
On the other hand, if it is not possible to confirm the presence of a defect, or if the defect is not applied to the circuit pattern, such as a defect that does not require functional correction, the process proceeds to step S11. .

Next, in step S6, it is determined whether the defect in the processable region R includes an open defect.
For example, an example in which the normal pattern in the processable region R is the wiring pattern 101 as shown in FIG.
The wiring pattern 101 is formed by forming a metal wiring of a circuit in which a large number of TFTs are arranged from the same material as that of the metal thin film 41b. That is, a metal layer pattern including wirings 102a, 102b, 102c, source lines 103, 103a, 103b, TFT portion 104, drain electrodes 105, 105a, and the like is formed on the uppermost layer of the processing surface 11a. Reference numeral 106 denotes a gate line existing in the lower layer.
Assume that a captured image 110 as shown in FIG. 6B is acquired for such a wiring pattern 101. The defect detection unit 72 detects the defect area 111 as an open defect by taking the difference between the wiring pattern 101 and the captured image 110. That is, in the example of FIG. 6B, it can be seen that the wirings 102a, 102b, and 102c, the source lines 103a and 103b, and the drain electrode 105a are partially missing.
Thus, when an open defect is included, it transfers to step S7.
If there is no open defect, the process proceeds to step S8.

Step S7 is a step of performing wiring repair according to the flow shown in FIG.
In step S20, initial setting of wiring repair is performed. That is, the conditions of the laser light source 1 are set, the modulation data is created, and the number of transfers is set.
The condition of the laser light source 1 is set by the laser light controller 75 by setting the wavelength and output of the laser light source 1 for wiring repair.
The modulation data is created by the image processing unit 71.
For example, in order to repair the missing area of the defective area 111, the difference between the image of the wiring pattern 101 and the captured image 110 is taken, and the image on the modulation area M according to the magnification β of the imaging optical system. It converts into image data, and the modulation data which sets on / off of each micromirror 6a is created so that the ON light 32 reaches | attains the missing part on image data. FIG. 8 shows an example of this modulation data.
The ranges of the regions 102A, 102B, 102C, 103A, 103B, and 105A corresponding to the missing portions of the wirings 102a, 102b, and 102c, the source lines 103a and 103b, and the drain electrode 105a are set as the ON state data 121, respectively. Modulation data 200 in which all the modulation areas M are set to off-state data is generated. The modulation data 200 is generated, for example, as table data corresponding to the numerical values of the on state being 1 and the off state being 0 corresponding to the two-dimensional array position of each micromirror 6a.
Here, the ON portion of the modulation data 200 is set larger than the size of the defect detected in a range that does not cover other circuit patterns. Alternatively, it is set longer in the longitudinal direction connecting the circuits. This makes it possible to connect the circuits more reliably.

  The number of transfer times is set by the apparatus control unit 80. The number of times of transfer is set because the metal thin film 41b is thinner than the metal layer to be corrected, so that the transfer by the on-state data 121 is performed a plurality of times to form a desired metal layer. For example, when the thickness of the metal thin film 41b is 100 nm and the thickness of the metal layer to be corrected is 0.3 μm, the number of transfers is set to 3.

Next, in step S21, the transfer substrate movement mechanism 43 is driven by the transfer substrate movement control unit 82, and the transfer substrate unit 40 is advanced onto the processing surface 11a. At this time, the arm portion 42c is held, and the height on the work surface 11a is held higher than the height at the time of transfer.
The horizontal position of the transfer substrate unit 40 is set so that the untransferred area is positioned on the processable area R. That is, as shown in FIG. 3A, the transfer substrate 41 irradiates the range of the opening 42b with the on-light 32, thereby evaporating or sublimating the metal thin film 41b and processing the layer forming substance. In this embodiment, the rectangular transfer area 45 on the transfer substrate 41 corresponds to the size of the processable area R as shown in FIG. 9A. The virtual sections A ₁ , A ₂ , A ₃ ,... Are equally divided, and these sections are sequentially moved each time a transfer process is performed. The position information of these sections and information indicating which sections are untransferred areas are stored in the transfer history storage unit 81.
Therefore, in step S21, for example, compartment A ₁ causes the advance of the transfer substrate unit 40 in a position such as to overlap the processable region R.
If a section corresponding to the number of times of transfer cannot be secured, a warning prompting the replacement of the transfer substrate unit 40 is displayed on the display 27, and the process is continued after replacing the transfer substrate unit 40 with a new one.

  When the transfer substrate unit 40 advances onto the optical path, the transfer substrate 41 enters the imaging range of the image pickup device 13, so that the image processing unit 71 has a non-transparent portion of the transfer substrate 41 with respect to the metal thin film 41 b surface. The autofocus operation of the objective lens 10 is performed, and in the following steps, the focused state with respect to the surface of the metal thin film 41b is maintained.

Next, in step S <b> 22, the levitation mechanism controller 83 supplies levitation gas from the levitation mechanism 44. The supplied gas is injected from the four injection holes 41c toward the processing surface 11a through the gas flow paths 42e and 42f.
Next, in step S23, the holding of the arm portion 42c in the vertical direction (Z direction) is released by the transfer substrate moving mechanism 43. Thereby, the transfer substrate unit 40 is levitated to the position of the height Δ on the processing surface 11a by the gas ejected from the ejection hole 41c.
At this time, since the holding state of the arm part 42c in the horizontal direction (XY direction) is maintained, the position can be moved in the horizontal direction by the transfer substrate moving mechanism 43.
Thereby, even if Δ is a very small height, the transfer substrate 41 can be stably held, and can also be moved smoothly in the horizontal direction.

Next, in step S24, the transfer substrate movement control unit 82 refers to the information in the transfer history storage unit 81, drives the transfer substrate moving mechanism 43, and moves the transfer substrate 41 to the non-transfer area. The first transfer is a step S21, since the compartment A ₁ is selected a non-transfer region, so as to overlap precisely the compartment A ₁ is processable region R, the horizontal direction by the transfer substrate moving mechanism 43 Perform alignment. As a result, even if the horizontal position is shifted in step S23, it is possible to perform accurate alignment.
Transferring the second time and thereafter, with reference to the information of the transfer already region stored in the transfer history storage unit 81, for example, moved to the non-transfer area, such as compartment A _2.

Next, in step S <b> 25, the apparatus control unit 80 sends the modulation data 200 sent from the image processing unit 71 to the spatial modulation element driving unit 77.
When the modulation data 200 is sent to the spatial modulation element driving unit 77, each micro mirror 6 a of the spatial modulation element 6 is driven based on the modulation data 200.

Next, in step S <b> 26, the device control unit 80 causes the laser light control unit 75 to oscillate the laser light source 1 and emits a laser beam 31 of a substantially parallel light beam from the collimator unit 4.
The laser beam 31 is deflected by the reflection mirror 5 a and irradiates each minute mirror 6 a of the spatial modulation element 6. Then, when the ON light 32 is reflected by the micro mirror 6a in the ON state, it is incident along the optical axis of the imaging lens 7 by the reflection mirror 5b. On the other hand, the off-light 35 is reflected outside the NA of the imaging lens 7.
Thereby, only the ON light 32 is collected by the imaging lens 7, reflected by the beam splitter 8, transmitted through the half mirror 9, and imaged on the metal thin film 41 b by the objective lens 10. For this reason, the image of the modulation area M corresponding to the modulation data 200 is scaled to the size of the processable area R and formed on the metal thin film 41b.
As a result, the layer forming material at the position irradiated with the on-light 32 on the metal thin film 41b is evaporated or sublimated by receiving thermal energy, and adheres to the open defect portion of the processing surface 11a disposed in the vicinity. At this time, the height Δ of the transfer substrate 41 is stably held at a very small distance by the floating mechanism 44, so that the layer forming substance can be accurately and efficiently transferred to the opposing position.

Next, in step S <b> 27, the driving state of the spatial modulation element 6 is reset by the spatial modulation element driving unit 77. Then, stored in the transfer history storage unit 81 that partition A ₁ is a transcription finished area. This completes the first transfer.
Next, in step S28, the apparatus control unit 80 determines whether or not the number of times of transfer has reached the number of times of transfer set in step S20. If the number of times of transfer has not reached, the process proceeds to step S24, and the above-described step S24. Repeat ~ S27.
If the number of transfers has been reached, the process proceeds to step S29.

In step S29, the arm portion 42c is held in the up / down direction by the transfer substrate moving mechanism 43, and moved upward in order to separate it from the processing surface 11a. Then, the gas supply from the levitation mechanism 44 is stopped by the levitation mechanism control unit 83 (step S30), and then the transfer substrate unit 40 is moved out of the optical path by the transfer substrate moving mechanism 43.
This completes the wiring repair process (step S7 in FIG. 5). Then, the process proceeds to step S9.

On the other hand, step S8 is a step of performing cut correction according to the flow shown in FIG.
In step S40, an initial setting for cut correction is performed. That is, condition setting of the laser light source 1 and creation of modulation data are performed.
The condition of the laser light source 1 is set by the laser light controller 75 by setting the wavelength and output of the laser light source 1 for cut correction.
The modulation data is created by the image processing unit 71. In this case, modulation data for setting on / off of each micromirror 6a is created so that the ON light 32 is irradiated onto the pattern to be removed.

Next, in step S <b> 41, the apparatus control unit 80 sends the modulation data sent from the image processing unit 71 to the spatial modulation element driving unit 77.
When the modulation data is sent to the spatial modulation element driving unit 77, each micro mirror 6a of the spatial modulation element 6 is driven based on the modulation data.
Next, in step S42, similarly to step S26, the laser beam 31 is oscillated under the conditions set in step S40, and the processing surface 11a is irradiated with the on-light 32. As a result, the pattern in the processable region R is cut and corrected.
Next, in step S43, the driving state of the spatial modulation element 6 is reset by the spatial modulation element driving unit 77.
Above, step S8 is complete | finished and it transfers to step S9.
If there are both open and short defects in the workable region R, the cut correction in step S8 is performed after step S7.

In step S9 of FIG. 5, the image of the processing surface 11a after the execution of step S7 or S8 is picked up by the image pickup device 13, and defect detection processing is performed by the defect detection unit 72. Thereby, the correction result of step S7 or S8 is confirmed.
Next, in step S10, it is determined whether the open defect or the short defect to be corrected is corrected. If the correction is not successful, the process proceeds to step S4.
When it is determined that the correction is successful, the process proceeds to step S11.

In step S11, it is determined whether there are other inspection positions. If there are other inspection positions, the process proceeds to step S1.
If there is no other inspection position, the operation is terminated.

As described above, the laser processing apparatus 50 detects the defect of the substrate 11 and, when an open defect is detected, the arbitrarily shaped layer forming material is applied to the range of the processable region R corresponding to the modulation region M of the spatial modulation element 6. Transfer and repair open wiring defects. At this time, since the ON light 32 corresponding to the pattern to be transferred is generated by the spatial modulation element 6, any shape and any number of defects can be corrected at the same time as long as it is within the processable region R. Therefore, efficient correction can be performed.
Further, the laser processing apparatus 50 can also perform cut correction by commonly using observation means such as the observation imaging lens 12 and the imaging element 13 and the imaging optical system for repair processing. Yes. Wiring repair and cut correction can be selectively switched by moving the transfer substrate unit 40 forward and backward with respect to the optical path and changing the initial setting of the laser light source 1 as necessary.
Therefore, repair processing can be easily performed by switching between wiring repair and cut correction within one apparatus, and it is not necessary to transfer the substrate 11, and the setup can be changed quickly. it can.

  In addition, by injecting an inert gas from the injection hole 41c, the gap between the transfer substrate 41 and the processed surface 11a is kept minute, and the gap between the transfer substrate 41 and the processed surface 11a is not maintained. Since it is covered with the active gas, the inert atmosphere can be moved along with the movement of the transfer substrate 41, and the apparatus can be simplified.

Next, a laser processing apparatus according to a first modification of the embodiment of the present invention will be described.
FIG. 11 is a schematic explanatory view showing the movement of the transfer substrate of the laser processing apparatus according to the first modification of the embodiment of the present invention.

In this modification, the method of moving the untransferred area is changed in the wiring repair process of the above embodiment. Hereinafter, a description will be given focusing on differences from the above embodiment.
In this modification, when moving to the untransferred area in step S24 in FIG. 7, the size of the section to be moved is not fixed in advance, and the on-state data circumscribing where the on-state data 121 exists as shown in FIG. According to the size of the range 122 and the empty space of the non-transfer area on the transfer substrate 41, the non-transfer area is dynamically set and moved so as to minimize the remaining of the non-transfer area. Is.
For example, in order to perform wiring repair using the modulation data 200 shown in FIG. 8, the transfer area 45 of the transfer substrate 41 is already used for transfer in the sections B _{1 to} B ₄ , and the remaining area is the non-transfer area 45 a. Suppose there was.
At this time, the transfer substrate movement control unit 82 calculates, from the on-state data 121, a rectangular range including all the on-state data as the on-state data circumscribing range 122 (see FIG. 8). Then, adjacent to the partition _B 1 .about.B _4, the area of on-state data 121 is moved to the non-transfer region 45a reserved. For example, to move to the area _{S 1.} At this time, depending on the number of transfers n, if n times the area of the area of the region S ₁ is moved continuously be secured position, second or subsequent, e.g., S _{2, S} 3, sequentially _... to adjacent areas, such as Since it can move, it can move efficiently.
By repeating this, control is performed so that the untransferred area is minimized in the transfer area 45.
In this modification, since the transfer efficiency of the transfer substrate 41 is improved, wiring repair can be performed at low cost.

Next, a laser processing apparatus according to a second modification of the embodiment of the present invention will be described.
FIG. 12 is a schematic explanatory view in a cross section including an optical axis showing a schematic configuration of a laser processing apparatus according to a second modification of the embodiment of the present invention. FIG. 13 is a schematic perspective view showing a schematic configuration of a spatial modulation element of a laser processing apparatus according to a second modification of the embodiment of the present invention.

  The laser processing apparatus 55 of this modification includes a spatial modulation element 61 instead of the spatial modulation element 6 of the laser processing apparatus 50 of the above-described embodiment, and omits the reflection mirror 5a. Hereinafter, a description will be given focusing on differences from the above embodiment.

As shown in FIG. 12, the spatial modulation element 61 is disposed in the optical path of the laser beam 31 and transmits a part of the laser beam 31 according to the position in the optical path section, thereby performing spatial modulation. It is a modulation element. For example, using a MEMS technology capable of producing a minute movable structure capable of operating at high speed, a configuration is adopted in which a plurality of flips 61a in which a light-reflective minute rectangular plate is supported on one side by a rotating hinge are two-dimensionally arranged. be able to. Each flip 61a is rotated about a rotation hinge by applying an electrostatic voltage in accordance with a control signal. Therefore, in an off state where no electrostatic voltage is applied, the rotation angle is 0 degree, and the flips 61a are aligned on one plane. On the other hand, in the on state where an electrostatic voltage is applied, the rotation angle is 90 degrees, and the flip 61a is rotated to a position orthogonal to the plane in the off state.
The laser beam 31 is made incident substantially along the normal direction of the plane in which the flip-state flip-flops 61a are aligned.

With such a configuration, each flip 61a is controlled to be in an off state or an on state by the spatial modulation element driving unit 77. When the specific flip 61a is turned on, an opening corresponding to the arrangement of the flip 61a in the on state is formed, and the on light 32A is transmitted to the position of the flip 30a in the on state.
The on-light 32A is reflected by the reflection mirror 5b and is incident on the imaging lens 7, and is imaged by the objective lens 10 on the metal thin film 41b and the processing surface 11a.
For this reason, wiring repair and cut correction can be performed in exactly the same manner as the laser processing apparatus 50 of the above embodiment.

  In the above description, the example in which the autofocus of the objective lens 10 is performed by image processing such as a contrast method has been described. However, an autofocus operation by a distance measuring sensor or the like may be performed.

In the above description, the example has been described in which the focus position of the objective lens 10 is switched by performing an autofocus operation in accordance with the advance / retreat of the transfer substrate 41, but the transfer is performed by the transfer substrate moving mechanism 43. If a configuration is adopted in which the substrate 41 is held at a position having a constant height Δ with respect to the processing surface 11a, the focus position at the time of transfer is shifted from the processing surface 11a by a fixed height Δ, so that the transfer is performed. It is not necessary to autofocus the substrate 41 for use.
In this case, for example, a configuration in which the transfer substrate moving mechanism 43 and the transfer substrate unit 40 are held separately from the processing head 51 and the focus position of the objective lens 10 is changed by the vertical movement of the processing head 51 is adopted. Can do.

  In the above description, the laser processing apparatus can switch between wiring repair and cut correction. However, the laser processing apparatus adopts a laser light source 1 that only suits the condition of wiring repair and performs only wiring repair. It is good.

  In the description of the first modification of the above embodiment, when the untransferred area is dynamically allocated, the on-state data circumscribing range 122 is described as a rectangular outer shape. However, this is an example, and an arbitrary polygonal area is used. Can be adopted.

  In the above description, the gas floating holder has been described as an example of a configuration in which gas is injected through the injection hole penetrating the transfer substrate. However, the injection hole is a portion of the gas floating holder that holds the outer edge of the transfer substrate. It may be provided so as to penetrate through.

In the above description, the transfer substrate is described as an example of a structure in which gas floating is held. However, if the distance between the transfer surface and the surface to be processed can be maintained at a size that allows the layer-formed material to be transferred satisfactorily, it is not always necessary. It is not necessary to raise the gas.
Further, in the case where the layer forming substance is not likely to be oxidized during transfer, it is not necessary to inject an inert gas.

It is a schematic explanatory drawing in the cross section containing the optical axis which shows schematic structure of the laser processing apparatus which concerns on embodiment of this invention. It is a top view which shows the arrangement | sequence of the micromirror of the spatial modulation element of the laser processing apparatus which concerns on embodiment of this invention, and a typical perspective view explaining the micromirror of a spatial modulation element. It is the typical top view of the substrate unit for transfer of the laser processing apparatus concerning the embodiment of the present invention, and its AA figure. It is a functional block diagram which shows the function structure of the control unit of the laser processing apparatus which concerns on embodiment of this invention. It is a flowchart explaining operation | movement of the laser processing apparatus which concerns on embodiment of this invention. It is a schematic explanatory drawing which shows an example of the normal pattern of a to-be-processed surface, and a schematic explanatory drawing which shows an example of the open defect which generate | occur | produced in the to-be-processed surface. It is a flowchart explaining the wiring restoration operation | movement which concerns on embodiment of this invention. FIG. 7 is a schematic explanatory diagram illustrating an example of modulation data of a spatial modulation element corresponding to the open defect of FIG. It is a schematic explanatory drawing which shows the mode of the movement of the transfer substrate of the laser processing apparatus which concerns on embodiment of this invention. It is a flowchart explaining the cut correction operation | movement which concerns on embodiment of this invention. It is a schematic explanatory drawing which shows the mode of the movement of the transfer substrate of the laser processing apparatus which concerns on the 1st modification of embodiment of this invention. It is a schematic explanatory drawing in the cross section containing the optical axis which shows schematic structure of the laser processing apparatus which concerns on the 2nd modification of embodiment of this invention. It is a typical perspective view which shows schematic structure of the spatial modulation element of the laser processing apparatus which concerns on the 2nd modification of embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Laser light source 6, 61 Spatial modulation element 7 Imaging lens (imaging optical system)
10 Objective lens (imaging optical system)
11 Substrate (Workpiece)
11a Work surface 12 Imaging lens 13 for observation 13 Imaging element 15 Objective lens moving mechanism (imaging position moving mechanism)
16 Processing area moving mechanism 17 Stage 18 Processing head moving mechanism 30 Laser light source 31 Laser light 32, 32A ON light 40 Transfer substrate unit 41 Transfer substrate 41a Glass substrate 41b Metal thin film (transfer thin film)
41c Injection hole 42 Substrate holder (gas levitation holder)
42e, 42f Gas flow path 43 Transfer substrate moving mechanism 44 Levitation mechanism 45 Transfer area 45a Non-transfer area 50, 55 Laser processing apparatus 71 Image processing section (modulation data generation section)
72 Defect detection unit 73 Imaging position control unit 75 Laser light control unit 80 Device control unit 81 Transfer history storage unit 82 Transfer substrate movement control unit 101 Wiring pattern 111 Defect region 121 On-state data 122 On-state data circumscribing range M Modulation region R Machinable area R
A ₁ ,..., A ₅ , B ₁ ,..., B ₄ section S ₁ , S ₂ , S ₃ region

Claims (4)

An image capturing unit that captures an image of a processing surface on which a layered pattern is formed using a layer forming material, and a part of the pattern of the processing surface is missing from the image of the processing surface captured by the imaging unit A laser processing apparatus comprising: a defect detection unit that distinguishes an open defect from a short defect in which patterns on the surface to be processed are in contact with each other, detects a defect, and acquires defect information including information on the position and shape of the defect. And
A laser light source for generating a laser beam capable of evaporating or sublimating the layer forming material;
A spatial modulation element that spatially modulates the laser light emitted from the laser light source;
An imaging optical system that guides the laser beam reflected by the spatial modulation element in a certain direction to a processing surface;
An imaging position moving mechanism for moving the imaging position of the imaging optical system in the optical axis direction in the vicinity of the processing surface;
A transfer substrate in which a transfer thin film made of the layer forming material is formed on a glass substrate;
A direction along the optical axis of the imaging optical system on the optical path between the processing surface and the imaging optical system with the transfer substrate facing the processing surface with the transfer thin film facing toward the processing surface And a transfer substrate moving mechanism that can be moved in a direction orthogonal to each other and can move forward and backward with respect to the optical path;
A modulation data generation unit that generates modulation data of the spatial modulation element for irradiating the laser beam to the open defect portion based on the defect information of the open defect detected by the defect detection unit;
Laser light that has been spatially modulated based on the modulation data generated by the modulation data generation unit is moved on the untransferred area of the transfer thin film on the transfer substrate onto the open defect near the processing surface. A laser processing apparatus characterized in that an image is formed on the transfer thin film, and the layer forming material in the portion irradiated with the laser light is transferred onto the open defect so that the open defect can be repaired. The transfer substrate is held by the transfer substrate moving mechanism via a gas levitation holder in which a flow path for injecting an inert gas to the processing surface is formed,
2. The laser processing according to claim 1, wherein the transfer substrate moving mechanism is configured to selectively switch holding and releasing of the gas floating holder in the optical axis direction of the imaging optical system. apparatus. A transfer history storage unit for storing position information of a transferred region of the transfer substrate;
A moving position setting for setting the untransferred area used for transfer with reference to the size of the open defect detected by the defect detection section and the position information of the transferred area stored in the transfer history storage section With
3. The laser processing according to claim 1, wherein the transfer substrate moving mechanism moves the transfer substrate to an untransferred region set by the moving position setting unit during a transfer operation. 4. apparatus. The laser light source can be generated by selectively switching between a first laser beam capable of evaporating or sublimating the layer forming material and a second laser beam capable of removing a defect on the processing surface. ,
The defect detection unit can detect a short defect to be removed from the surface to be processed,
The modulation data generation unit generates modulation data of the spatial modulation element for irradiating the second laser beam on the short defect portion based on information on the short defect detected by the defect detection unit. ,
The short defect is eliminated by selecting the generation of the second laser beam in a state where the transfer substrate is retracted from the optical path between the processing surface and the imaging optical system by the transfer moving mechanism. The laser processing apparatus according to claim 1, wherein the laser processing apparatus can be removed.

Images