TWI377104B - Laser repair apparatus - Google Patents

Description

1. The invention relates to a laser repairing device which can irradiate laser light 5 to a glass substrate of a liquid crystal display (hereinafter referred to as LCD) or a semiconductor crystal. Repair (correction) of the defective portion generated on the object to be inspected such as a circular or printed circuit board. I: Prior Art 3 • Background Art 10 In the manufacturing steps of the LCD, various inspections were performed on the glass substrate processed by the lithography imaging process. As a result of the inspection, if a defective portion such as a foreign matter or a residual pattern is detected in the resist pattern or the etching pattern formed on the glass substrate, the defective portion is irradiated with the laser light to correct the repair process of the defective portion. The repairing method is generally, for example, injecting ultraviolet laser light output by the ultraviolet 15 laser oscillator into a variable rectangular opening, and opening and closing the variable rectangular opening by the movable mouth of each %, and the cross section of the ultraviolet laser light A method of shaping a shape to a desired size and illuminating a defective portion. The method of repairing the defect includes the following methods. The technique described in Patent Document 1 is to reduce the irradiation area by minimizing the irradiation position of the laser beam for one defect portion and the irradiation area of the irradiation area, such as laser light. And high-precision repair processing. Further, in the technique disclosed in Patent Document 2, the slit which is a variable rectangular opening for irradiating the laser light and the object to be inspected such as the defective portion are moved relative to each other, and the surface is repaired, and the irradiation can be reduced in the same manner. The residue of zone 5 1377104 is repaired with high precision. In addition to the method of adjusting the cross-sectional shape of the laser light by a rectangle, a method of adjusting the cross-sectional shape of the laser light to an arbitrary shape has also been proposed. For example, the technique described in Patent Document 3 uses a minute lens as a spatial modulation device 5, and by switching the angle of the lens, it is possible to switch between laser irradiation (ON) and shielding (OFF), depending on each laser piece. The unit is laser processed to transfer the pattern. [Patent Document 1: JP-A-2000-347387] [Patent Document: JP-A-H08-174242] SUMMARY OF THE INVENTION PROBLEMS TO BE SOLVED BY THE INVENTION In actual LCD manufacturing steps There are various defects in the process, and the processing methods for repairing defects with laser light 15 are also different. For example, the defective portion which is electrically short-circuited due to the residual resist pattern remains, and the appropriate laser power is set for the irradiation region irrespective of the normal resist pattern, that is, the defective portion can be removed by laser irradiation once or twice. However, in the defective portion generated by the foreign matter being wound up in the exposure step of the resist pattern, even if the foreign matter that is wound up is irradiated with the laser beam 20, the defective portion cannot be removed by the laser irradiation of one or two times. As described above, the type of the defect or the state in which the defect is generated, for example, a situation in which the foreign matter defective portion is in contact with a plurality of normal resist patterns having different potentials, causing an electrical short circuit, and the like, is efficiently and accurately repaired in accordance with the estimation result. Processing is extremely important. In addition, as the size (area) of the glass substrate on which the LCD is manufactured is enlarged, the pattern of the semiconductor wafer is refined, and the technology is advanced, the production environment of the substrate to be inspected is greatly changed, and it can be predicted that it can be repaired according to the conventional method. The processing method will increase the inspection time (working time), and how to reduce the working time becomes an important issue. In the repair processing method described in Patent Document 1 and Patent Document 2, the focus is placed on the high-precision, but it is feared that the irradiation condition is changed (especially, the opening and closing operation of the rectangular opening), or The processing time is increased by checking the relative movement of the object with the laser optical axis. Further, although the repairing method described in Patent Document 3 can perform lens control at a high speed, the pattern transfer processing can be performed at a high speed. However, since the specific method is not described regarding the shape of the transfer target, it is difficult to achieve high-accuracy transfer processing. . The present invention has been made in view of the above problems, and an object thereof is to provide a laser repairing apparatus capable of performing high-precision and high-speed laser repair processing. Means for Solving the Problems In order to solve the above problems, the laser repairing device of the present invention is capable of irradiating laser light emitted from a laser light source to a correction target region on an object to be inspected, including: photographing The mechanism is capable of capturing the object to be inspected to generate image information; the image processing mechanism is capable of generating defect determination information by the image information generated by the image capturing mechanism, and determining the laser light irradiation according to the defect determination information. The irradiation condition of the time; the laser light shaping mechanism' is adapted to adjust the shape of the laser light according to the irradiation condition determined by the image processing means; and the illumination optical system is capable of irradiating the shaped laser light to the foregoing Corrected to the 1377104 image area. Further, in the laser repairing apparatus of the present invention, the laser light shaping means includes: a spatial modulation device that irradiates the laser light from the laser light source and has a plurality of pixels arranged in a 1st order or a 2nd direction. The micro-5 small device; and the spatial modulation device control mechanism can control the state of the spatial modulation device according to the aforementioned irradiation condition. Moreover, in the laser repairing apparatus of the present invention, the space modulating device control means can control the state of the space modulating means in accordance with the shape of the correction target area. Further, in the laser repairing apparatus of the present invention, the space modulation device control means can control the space modulation device by using the laser light irradiation prohibition region of the object to be inspected as the mask information for the correction target region. status. Further, in the laser repairing apparatus of the present invention, the spatial modulation device control mechanism can control the presence or absence of laser light to be irradiated to each of the micro devices constituting the spatial modulation device. Further, in the laser repairing apparatus of the present invention, the image processing means includes an irradiation condition history memory means for storing information used in determining the irradiation condition in association with the irradiation condition, and determining 20 In the irradiation condition, the image processing means can read the past irradiation conditions memorized by the irradiation condition history memory means. Further, in the laser repairing apparatus of the present invention, the defect determination information is obtained from information of one or more of a color, an area, a brightness, a position, and a number of defects in the correction target region. 8 1377104 In order to repair the target, the repair process is performed efficiently and accurately according to the result of the estimation. Fig. 1 shows the configuration of the laser repairing apparatus according to the first embodiment of the present invention. In the present embodiment, a digital micromirror device (hereinafter referred to as DMD) 5 is used as a spatial modulation device for shaping laser light, and the DMD system has a plurality of micromirrors (micro devices) arranged in a 1-dimensional or 2-dimensional direction. The group of tiny devices. Further, regarding the DMD control at the time of laser light irradiation, the presence or absence of the irradiation is controlled by changing the angle of the micro mirror constituting the DMD. The LCD glass substrate 10 (inspected substrate) to be inspected is placed on the XY table 1. The object to be inspected may be any substrate on which a fine pattern is formed, such as a semiconductor wafer, a printed circuit board, a color filter for LCD, a pattern mask, etc. In the present embodiment, a glass substrate of an LCD is taken as an example. The χγ table 1 can be moved in the χγ direction by the drive control by the movement drive control unit 3. The substrate drive inspection unit 4 is connected to the movement drive control unit 3. The substrate inspection device 4 is, for example, a pattern inspection device, and can perform defect inspection on the glass substrate 2 and process the inspection result data including the coordinates, size, and defect type of the defect portion on the glass substrate 2, or the inspection result. The information is transmitted to the inspection condition reading unit 26 and the like. The movement drive control unit 3 receives the inspection result data from the substrate inspection cassette device 4, controls the movement of the XY table 1 in the χ γ direction according to the coordinate data of each defect portion in the inspection result data, and automatically controls each of the glass substrate 2 The defective portion is positioned at the repair portion position, that is, the irradiation position of the repair light r emitted from the repairing light source 14 to be described later. The illumination light source 5 emits illumination light that illuminates the glass substrate 2. A beam splitter 7 is provided through the relay lens 6 in the light path of the illumination light <S > 10 1377104. In the reflected light path of the beam splitter 7, the polarizing mirror 8 is provided with an objective lens 9 ^ on the extension line passing through the optical axis p of the objective lens 9, the beam splitter 7 and the beam splitter 8, and is disposed through the relay lens 10 There is a CCD camera 11 (photographing mechanism). The cCD camera 11 captures the glass substrate 2 by the intermediate lens 10 and the objective lens 9, and generates image information. The image processing unit 12 (image processing means) acquires the defective image data output from the CCD camera as a map. Like the information, the inspection condition reading unit 26 acquires information necessary for the inspection. The information acquired from the inspection condition reading unit 26 is, for example, reference image data from a subject to be inspected in a normal state. The reference image data is created by, for example, the method disclosed in Japanese Laid-Open Patent Publication No. 2005-10042. The image processing unit 12 extracts the defective portion on the glass substrate 2 from the difference image data obtained by comparing the defective image data with the reference image data, performs binarization processing, and creates a defect extraction 15 image for displaying the defect shape. data. Further, the image processing unit 12 can obtain the outline of the defective portion from the defective image data or the difference image data to create a material for displaying the defect shape. The defect shape image data which is obtained from the defective image data, the defect extracted image data, or the like, and which can display the shape of the field of the laser light irradiation is displayed on the display 13 (image display means). 20 The repairing light source 14 (laser light source) emits laser light r which can repair the defective portion of the glass substrate 2. For example, the laser light source YAG laser oscillator is used as the repairing light source 14β, and the repair light source _ receives the information that is rotated from the image processing unit 12 (the laser light is displayed at the time of illumination described later). The set laser light source setting information is 'controlled to select the power of the laser light r (the energy intensity per unit area, etc.) from the value set to an arbitrary value 11 1377104 or a predetermined value, and constitutes the laser light shaping mechanism of the present invention. portion. The DMD unit 16 (a laser beam shaping mechanism and a spatial modulation device) is provided in the transmission mirror 15 in the light path of the laser beam emitted from the repairing light source 14. The DMD unit 16 is constructed such that a plurality of DMdi 7 (microdevices) as shown in Fig. 2 are arranged in the two-dimensional vertical and horizontal directions as shown in Fig. 3. As shown in Fig. 2, in the DMD 17, a micromirror 19 is provided on the upper portion of the drive storage unit 18 in a digitally controllable manner, for example, at an angle of ±10° and 0° (horizontal). The DMD 17 can switch the angle ±1〇 at a high speed by the electrostatic attractive force caused by the voltage difference between the micro mirrors 19 and the driving storage unit 18. For example, those disclosed in Japanese Laid-Open Patent Publication No. 2000-28937 are known. The rotation of the micromirror 19 is limited to an angle of 1 〇. And 〇N in the drive storage unit a is rotated by an angle ±1〇. When it is "OFF", it returns to the horizontal angle 〇. . Further, the micromirror 19 is formed into a micromirror of several μm to 15 + μη1 using a semiconductor manufacturing technique, and as shown in FIG. 3, a micromirror 19 is arranged in two dimensions on the driving storage unit 18 to constitute a DMD unit. 16. The reference reflection surface 16a of the DMD unit 16 (the reflection surface when the angle of each micromirror 19 is 〇β) sets the exit angle of the laser light r with respect to the incident optical axis as 〇i, and when each micromirror 19 is due to ''N ', tilt to angle +1 〇. At this time, the χγ plane 2〇 is inclined at an inclination angle of 0a so that the exit angle of the laser light r is set to this. The reference reflecting surface 16a is set to a θ 〇 angle with respect to the optical axis of the incident angle of the laser light r from the arrangement position of the mirror portion 15, the relay lens 2 〇, the beam splitter 8 and the like, and is inclined at an inclination angle 9a. Further, the DMD unit 16 is ruptured in response to the incident direction or the outgoing direction of the laser light r to the tilting angle of the reference reflecting surface 16a as adjusted by 12 1377104 in the χυθ direction of the support table 16b. The exit angle 0 of the #光光 r is determined, for example, by the rotation angle + ιβ of each of the micromirrors 19 when the drive storage unit is turned ON. The laser light r emitted at the exit angle is incident on the beam splitter 8 through the relay lens 20. Also, if the drive storage is set to "〇ff", the laser diaphragm will be reflected in the h direction, and * will pass through the relay lens 20 to shoot the beam splitter 8. Further, the laser beam emitted from the repairing light source 14 is reflected by the mirror portion 15 and enters the DMD unit 16' at an incident angle. However, the mirror portion 15 can be removed, and the laser beam emitted from the repairing light source 14 can be directly incident on the DMD. single_. The mirror portion 24, which is detachably provided in the optical path of the repairing 10 light source I4 and the mirror portion I5, is provided with a repair position light source 25 for illuminating visible light and confirming the irradiation range beforehand. In the optical system having the above configuration, the CCD camera U is disposed from the glass substrate 2 through the beam splitter 8, and the DMD unit 16 is disposed from the glass substrate 2 through the beam splitter 8. The arrangement position 15 of the CCD camera and the DMD unit 16 is The conjugate positional relationship with respect to the glass substrate 2. The laser shape control unit 21 (spatial modulation device control unit) can read the defect shape image data of each defective portion on the glass substrate 2 formed by the image processing unit 12, and corresponds to the defect shape image data. The control information is output to the DMD driving unit 2 2 (spatial modulation device control unit), and the control information can be set by the driving storage unit 18 of each of the micro mirrors 19 of the DMD unit 16 disposed in the region irradiated with the laser light 20. When it is "ON", the drive storage unit 18 of each of the micro mirrors 19 disposed in another area is set to "OFF". In the defect shape image data created by the image processing unit 12, for example, when the defective portion cannot extract the full defect region, or the normal region is erroneously smoked <S) 13 1377104 as the defective portion, The subsequent trimming portion 23 of the shape control portion 21 can manually correct the extracted defective portion regions. The trimming unit 23 registers the unextracted defective area setting area by the manual operation using the drawing tool, and registers it as a defective part or an area setting area which is erroneously extracted as a defective part, and registers 5 as a normal area. In order to match the cross-sectional shape of the laser light r to the defective portion of the glass substrate 2 by the operation of the trimming portion 23, the support table 16b can be controlled to be slightly moved in the χυθ direction. The DMD drive unit 22 drives the drive storage units 18 of the DMD unit 16 to "ON" and "off" in accordance with the control information "delivered by the laser shape control unit 21." After the image processing and the laser light inspection _ the defect portion of the substrate 2 is repaired, the image data of the same position from the CCD camera 11 is obtained, and the self-check condition reading unit is obtained from the image data and the comparison. The reference image of Fig. 26 is the difference between the image data and the material that is judged to be "completed". If the patching is completed*, the image processing unit 12 creates the defective shape image data of the defective portion again from the difference image data. The pattern 21 reads the defective shape created by the image processing unit 12 again = = =, and sets the drive storage unit 18 of the D·unit 兄 brother 9 of the defective shape image data to "ON". 20 Camera == Reference Chart says "Ir. Processing Unit 12". The coffee photo 2 = r4aa, and the inspection condition _26 round - start material ^ defect extraction portion 31. The defect extracting unit 31 is used to perform positional comparison when the reference image data bb is read by the defect image data of the map. The position can correspond to the brightness (brightness) of each of the P 31 control defect image data a a and the reference image data b b 14 . When the brightness is compatible, the defect extracting unit 31 compares the two, and generates difference image data (an image composed of absolute values of luminance differences of the respective pixels). Next, the defect extracting unit 31 determines, based on the difference image data, that the absolute value of the luminance difference 5 is a threshold value Th1 (for example, when the image data is composed of 256 gradations, TM=30 or the like is set), and the reference map is used. The image bb is different from the defect image data aa, that is, the determination of the defective portion on the defective image data, and whether the display is a defective portion, in other words, the missing (four) output portion 31 generates a defect-extracting image data that can display the shape of the missing alpha shape. Ee and output. For example, from the missing image data aa displayed in the figure and the reference image data displayed as the 5th map, the image data generated as the fifth (: the defect shown in the figure is extracted (3). The defective image data aa , reference image data (10) and defect extraction departmentΜ

The output line trap image data_into the defect state determination unit I 15 2 determines from the image f material that the item of the display defect f can be displayed, and the item of the display feature is, for example: What kind of defect is the type of J, such as a foreign object, or a residual defect such as a residual pattern film; what position of the defect (4) (for example, 'short circuit between different potentials, ^ not exposed to any potential, etc.); And whether or not the repair process is required. 2 〇 = result 'The defect state determination unit 32 can output the irradiation county data dcm indicating the characteristics and state of the irradiation including the defect and the defect judgment image. The image displays the defect image: the object area's defect determination information is displayed by the non-image information. For example, the laser light source setting information gg of the 15 1377104 light setting as shown in Fig. 6 can be generated as shown in Figs. 5A to 5C. The defect shape image data ff is sent to the laser shape control purchase 21, and the laser beam setting information gg is sent to the repairing light source 14 〇 For example, the illumination target image data dd shown in Fig. 6A is set to the number of illumination times 5 The defective shape image data ff at the next time indicates that the image of the second person is not irradiated with the first image of the image shown in Fig. 6B and the image of the second person with the image data shown in Fig. 6C. Here, with respect to Fig. 68, the laser light is irradiated as an illumination pair

In the entire area of the image, the 6Cth diagram causes the laser light to cause an electrical short-circuit, i.e., the peripheral portion of the anti-money pattern or the bus bar, and does not illuminate the position away from the anti-corrosion pattern or the bus bar. The sixth (: the picture is expected to achieve the effect of indeed repairing the electrical short circuit. 诼En 部 12 processing _ outside ... ΓΓΤ, the financial trap image gong time, the defect extraction image data cc, and the defect shape image information Through the distance 15

The device 34 outputs the information hh to the display 13 as a display, so that an image of the image data can be displayed on the display 13. The selector 自动 automatically displays an image on the display 13 when the image data to be displayed or the image data generated by the rim is selected by the manual switch. In addition, the image data selected by the selector 34 does not necessarily have to be one. For the defective image data aa, the display may also generate a display with overlapped defect extraction image real CC or defect shape image data ff and overlapping display. Display Information Next, the operation of the image processing unit 12 will be described with reference to Fig. 7 . The defective image data aa from the c camera 11 and the image data bb from the inspection condition reading unit 26 are input to the defect extracting unit 31 and the defect state determining unit 3 2 the soil extracting unit 31 to start the comparison of the defective image data aa and Reference, y 1 豕 page material bt 17 1377104 Position and brightness on the screen, producing a different image (an image composed of the bright values of each pixel) (step lock S701). Then, the defect is, and the singularity of the singularity of the singularity of the singularity of the singularity of the singularity of the singularity of the singularity of the singularity of the pixel The binary image data ce ' is output to the defect state determination unit 32 (step = the figure shown in the figure is 'the defect extraction image data ccJl, the defect portion, that is, the difference: the pixel at the 5th pixel value is the threshold value Thm is white The pixel, the pixel whose difference value of the defect image is smaller than the threshold value Th1, is a black pixel. Then, the 'defective state determination unit 3 2 judges that the defective portion is turned according to the defect extraction image. · 7G3). Step by step 之 3 _ base W ' only only in the white pixel with (4) missing domain, but also contains the area of the quasi-non-junction is above the predetermined value. When judging the defect does not exist ^ ' even forward To step S·; when it is determined that there is a defective portion, in the case of step S703, when it is determined that there is a defective portion (YES), the defect is male, and the fixed portion 32 compares the defective extracted image data ee, and Attached to the pattern area of the base judgment image = bb, the map of the nose contact defect The number of regions (step S704). The pattern region data is displayed in the pattern region of the new manufacturing step as the correction target in the binary image. For example, if the reference image asset 20 is the 8A image, the setting is as follows. Figure 8B. The area (black area) formed by the pattern shown in Fig. 8B is the pattern area of the corrected object. The pattern area is set to have different regions at different potentials. That is, when the defective portion exists across different pattern regions, the same current flows to the place where the potential difference should be present, and an electrical short circuit occurs. Therefore, according to the positional relationship between the defective portion and the pattern region, the defect image data aa and the reference image data bb which have been subjected to the positional comparison are judged whether or not an electrical short circuit has occurred, and the processing of the step 87〇4 is performed. For example, as shown in Fig. 9A, for the defect image as shown in Fig. 8C, the material is heavy and the missing portion 9〇1 and the pattern area, since the defect state does not touch any pattern area, at this time, the contact pattern The number of regions is 0. Further, as shown in Fig. 9C, with respect to the defective image data as shown in Fig. 9B, the defective portion 902 and the pattern region are overlapped, and the defective portion 9〇2 is in contact with the _ electrode pattern (4) and ', which exists in the center of the facet. The bus line 9 is located between the electrode patterns, and the pattern area that is in contact with this time is 3. The defect state determination unit 32 can calculate the number of pattern regions as follows. Each of the defect state determination units 32 obtains the number of pattern regions Npl from the pattern region data from the defect determination image f. Then, the defect state determination unit 32 acquires the defect extraction map. The logical product of the black and white inverted data (= the black portion of the defective portion) and the pattern area is obtained, and the number of black regions "Nbl" is obtained for the result. Then, the defect state determining unit 32 extracts the number of pattern regions "Nti" of the contact using the formula (1). Ntl = (Ncl + Npl) - Nbl (1) For example, in the 8A to 8C and 9A to 9C, the number of the pattern area 2 NP1 of the 83th is 16. In addition, when the defect image data is the 8C and 9B, both are defective, and the number of defective portions is "Ncl, and both are 1. According to the above, the number of pattern regions is calculated as "Ntl"". In the case of Fig. 8C, the logical product of the black-and-white reverse of the image data cc of the defective extracted image data cc and the data of the pattern area 19 1377104 shown in Fig. 83 is displayed in an area other than the white color of the ninth image, and the area other than white is = is equivalent to the black area) The number "Nbl" is 17. Therefore, the number of pattern regions "Ntl, is (Ncl+Npl)_Nbl=(l + 16)-17=0 〇On the other hand, the defect image data In the case of FIG. 9B, the logical product result of the black-and-white reverse of the image data cc and the pattern area data shown in FIG. 8B is extracted from the Q-domain defect other than the white image 5 of the ninth figure, and the area other than white is = equivalent to black area) The number "Nbl" is 14. Therefore, the number of pattern regions "Ntl" is (Ncl + Npl) - Nbl = (l + 16) - 14 = 3. After the processing of step S704 is completed, the defect state determining unit 32 determines whether or not the number of pattern regions of the contact 10 is greater than 1 (step S705). When the number of contact pattern areas is larger than 1, the process proceeds to step S706, and when it is 1 or less, the process proceeds to step S7〇9. For example, in Figs. 8A to 8C and Figs. 9A to 9C, when the defect image data is the 8C picture, the number of pattern regions "Ntl" is 〇, then step S7〇5 is NO, and the next process is step S709. Further, when the defective image data is the 15th 9th, the number of pattern regions "Ntl" is 3, the step S705 is "YES", and the next processing step is the step S706. If the number of pattern areas in contact is greater than 1 means that an electrical short circuit will occur. In the present embodiment, the abnormality of the function of the object to be inspected is used as the correction area, and thus the determination in step S7〇5 is performed. However, if the correction area is set for the purpose of maintaining the shape of the pattern, The criterion for the determination in step S705 can be set as "whether or not the number of pattern regions in contact is 丨 or more", that is, whether or not the defective portion has a contact pattern region as a more stringent condition. In step S705, when the number of contact pattern regions is larger than ryes, the defect state determination portion 32 reads from the defect image data (10), the reference image data, and 20 c, 5 > 1377104

If the shape of the illumination is indicated by a thin outline,

A table of control coefficients for the number of exposures. In the entire portion of the whole portion, the pattern portion (the bus line in FIG. 12A) is generated in the latest step, and the second irradiation is as shown in FIG. 12B, and the irradiation shape region 1103 is set to illuminate the contour of the defect portion, that is, only the irradiation. The pattern area is where electrical shorts are caused. Further, as shown in Fig. 12C, the third irradiation is performed to set the irradiation shape region 1104 to illuminate the outline of the irradiation shape region 1103 of Fig. 12B. The reason for setting the irradiation shapes of Figs. 11A, 11B, and 12A to 12C is also equivalent to the reason of Figs. 10A to 10D. The irradiation shape of each of the laser beams as shown in Figs. 10A to 10D, 11A to 11B, and 12A to 12C can be generated by Morphology calculation of image processing. For example, regarding the second irradiation shape, the first irradiation shape can be represented by a binary image, and an intermediate image in which a plurality of contraction processes (Erosion) are performed in this manner can be obtained from the first irradiation shape. The 2-value image is generated by subtracting the intermediate image. Further, in the third irradiation shape, the second irradiation shape can be represented by a binary image, and the second intermediate image which is subjected to the plurality of contraction processing in this manner can be obtained, and the second irradiation shape is obtained from the second irradiation shape. The binary image is generated by subtracting the second intermediate image. The number of times of shrinkage processing can be appropriately set, and if so, the number of times of shrinkage can be less. 'The definition of the thicker outline table can be set according to the color information, and the defect image data aa and 23 1377104 between the reference image breeding bb' Set to match the position of the pattern and the brightness of each image. The coefficients relating to the color information are referred to as Re, Gc, and Bc, respectively, and the defect state determining unit 32 calculates coefficients for each color. The coefficient relating to the color information displayed in the fifth embodiment is based on the difference between the images in the region where there is no defect and the absence of the pattern (non-pattern region, for example, the base region, etc.) There is a difference in each image in the defective pattern area. That is, by the difference in the area where the pattern is not present, it can be seen that there is a difference in the pattern area where the defect is present. 10 For example, regarding the color information of R (red), the average brightness of the defective non-pattern area in the defect image data aa is set to Def_NP_ND(R), and the average brightness setting of the defective pattern area is set. In the Def_P_D(R)' reference image data bb, the average brightness of the non-average pattern area where the defect portion corresponding to the defect image data aa is removed is set to 15 Ref-NP(R), and the defect image data is The average brightness of the pattern area at the defect portion of aa is set to Ref_P(R), and the coefficient Rc of the color information of R can be calculated by the equation (2).

Rc=||(Def_NP_ND(R)/Ref_NP(8)_(Def_p_D(R)/Refp( R)|| (2) 20 For other color information (G, B), the coefficients are also calculated by the same definition.

Gc, Be. According to the formula (2), it can be presumed that the smaller the coefficient is, the closer the color of the defect portion is to the color of the pattern region (the correlation is large), that is, the defect portion is generated by the pattern film. Further, the conditions for comparing the threshold values Th_Rc, Th_Gc, and Th_Bc can be used with respect to the calculated RC, Gc, and Be. When the coefficient is a threshold value of <S) 24 1377104, the defect state determination unit 32 sets the control coefficients aRc, ctGc, and aBc that can set the number of irradiations to be greater than the threshold value, and the defect state determination unit 32 sets aRc, aGc, and aBc to 0, respectively. The threshold values Th, Th_Gc, and Th-Be are values equal to or greater than 0, and can be set, for example, to about 〇丨~〇 2 5 . In the thirteenth aspect, the types of defective portions are estimated using the control coefficients aRc, aGe, and aBc set according to Fig. 13 and, as a result, a table for using the gain coefficient β d for the number of times of irradiation different depending on the type of defect is defined. The condition is calculated based on the logical calculations of aRc, aGc, and aBc. If all the control coefficients are 1', the defect state determination unit 32 determines that the defect is "film residual" type, and sets the gain coefficient ?ίΐ to 1.0. When one or more control coefficients are 〇, the defect state determining unit 32 determines that the defect is a "foreign matter" type, and sets the profit factor βίΐ to 1.5. The determination result of the defect type is output to the irradiation condition setting unit. 33 ° 15 The defect determination criterion in the figure is based on whether or not there is correlation of color information on all colors. That is, if the defect is caused by the same "film" as the pattern area, the correlation coefficient Rc, GC,

Bc will become smaller (color correlation will become larger), control coefficients aRc, aGc, aBc all become 1 °. On the other hand, if the defect is different from the pattern area color, for example, black or white 20 colors, the coefficient Re related to each color At least one color of Gc and Be will be large (the color correlation becomes small), so at least one of the control coefficients aRc, aGc, and aBc will become 〇. Gain coefficient β (1 is a factor that changes the number of times of laser light irradiation depending on the type of defect. In the 13th frame, the number of exposures to the "foreign matter" type defect can be increased. 25 1377104 Fig. 13C is based on the image data of the defect. The defect portion area ' defines a table of the number of times of laser light irradiation Ta. In Fig. 13C, the area of the defect portion is expressed as the defect portion pixel ratio AAp with respect to the size (number of pixels) of the image data. Regarding the area ratio AAp, The size relationship between the threshold value Th_As and the threshold value 5 Th-A1 is used as a condition, and the defect state determination unit 32 classifies the defect portion area into three types: "Small", "Medium", and 1&quot; Large. The threshold values Th_As, Th In the case of the A1, the value of the area ratio is not less than 1 and the value of 1 or less, and the Th_As &lt; Th-Ah defect state determination unit 32 is set to, for example, Th_As=〇j and Th_Al=〇.25. 10 Regarding the condition 'If the area ratio AAp is smaller than The limit state determination unit 32 classifies the defect portion area as "Small", and the area ratio AAp is equal to or greater than the threshold value Th_As and less than the threshold value Th_A to classify the defect portion area as "Medium"; When the area ratio AAp is equal to or greater than the threshold value Th_Al, the area of the defect portion is classified into "Large", the area classification result output 15 to the irradiation condition setting unit 33. The irradiation condition setting unit 33 sets the area irradiation amount of the laser light based on the area classification result. In Fig. 13C, if the area of the defective portion is "Small", the number of times of irradiation Ta is 1; when the area of the defective portion is "Medium", the number of times of irradiation Ta is 2; and when the area of the defective portion is "Large", the number of times of irradiation Ta is 3. That is, the number of times of radiation of the light beam 20 is increased in proportion to the area of the defect portion. The irradiation condition setting unit 3 3 sets the gain coefficient Pd for the number of times of irradiation set according to Fig. 13B and the setting of Fig. 13C. The number of irradiations Ta of the area is determined by the formula (3), and the number of times of the laser light irradiation ST of the actual repair process is determined. ST = pdxTa (3) 26 1377104 The pixel of the data and the arrangement of the lower portion of the micro mirror 19 are displayed. In the form, the image element and the micro mirror are respectively arranged to correspond to each other. For example, the fourth image shows the case where the magnification is the same as that of the observation when the laser light is irradiated. At this time, the pixel size is larger than the area of the micro mirror 19 _: _ (two-phase size), that is, one (i) corresponds to one micro-mirror 19. Thus, the irradiation of the laser light can be controlled in one pixel unit. Figure 14B shows that the magnification of the laser light is relatively When the magnification is doubled at the time of observation, that is, when the area ratio is 4 times, the ratio of the pixel size to the area of the micromirror is 1:4, that is, there is one micromirror 19 per 2×2 pixels. Therefore, although the density of the micromirrors 19 is larger than that of the 14A, the structure of the DMD unit 16 can be simplified, and the processing can be speeded up. The actual DMD has a gap between the tiny mirrors, and the fourth panel shows the situation. In Fig. 14C, the area ratio of the pixel size to the micromirror is, for example, a relationship of 1: 0.8, that is, the arrangement relationship of the size of the micromirror 19 when the size of the pixel is smaller than 15 pixels. At this time, the laser light is not reflected around the micromirror 19, and the laser light reflected from the micromirrors can be irradiated to a region of one pixel only by setting the defocusing of the actually irradiated object. That is, even if there is a gap, the gap can be filled and irradiated by defocusing. Even if the micromirror 19 is the same size as one pixel as shown in FIG. 14A, when the entire one pixel cannot be photographed (uneven), the entire irradiation area can be controlled by at least not reflecting the peripheral portion. Uneven. Specifically, there is a method of reducing the reflectance of the peripheral portion, causing curvature in the peripheral portion, and changing the direction of reflection. In the 14th to 14th Cth, the micromirror 19 corresponding to the pixel to be irradiated is premised on controlling the reflection of the laser light, but the controller 28 is limited to this, and for example, It is used to distribute the micromirror between the 1st pixel and the control of the (4th) line of small money-small-like laser light. In the case of the second irradiation, the laser beam is reflected by the even-numbered micromirrors of each row. This can extend the durability of the DMD unit 16 and use the reflective DMD as a spatial modulation to make use of the other. The spatial modulation device, for example, is arranged in a two-dimensional manner to have the same effect; the liquid crystal shutter of J or the fast n configuration of the micro shutter can also obtain an image effect. L〇15 The object above is described in the laser repairing and pre-installation of this embodiment from the shooting of the inspection (from the production of the image, the reliance on the lack of (four) levy of the defect characteristics of the image area ^_ or area, etc.] The correction of the shape of the target is determined by the correction of the defect, and the state of the laser is determined. This can automatically perform high-precision repair processing. The <br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br> The ratio of the number of two pixels (defect area) of the total number of pixels to the state of the classification correction target region "Which type is the film residual type or the foreign matter type, or the area of the defect portion is 20 .3⁄4^ g") The classification result determines the piece ^. By this, it is possible to efficiently perform the repair process in response to the appropriate irradiation strip for correcting the state of the object. By using a spatial modulation device composed of a micro device, the laser field (four) is adjusted in accordance with the (four) domain, and the repair process suitable for the fine portion can be performed even if the correction includes the fine portion. Further, by controlling the spatial modulation device according to the irradiation condition of 29 1377104, the correction processing state can be changed at a high speed even if the correction target state changes, so that the repair processing time can be shortened, and high-speed repair processing for one correction region can be performed without waste.

Further, since the shape of the correction target region is controlled in accordance with the shape of the correction target region (the angle of the micromirror 19 in the present embodiment), even if the correction target region has a complicated shape, an irradiation region of a suitable shape can be set and performed. Indeed - the actual patching process. In addition, as described with reference to FIGS. 5A to 5C and FIGS. 6A to 6C, the object to be inspected is irradiated as #光光光1 by controlling the micro device to apply a mask to the correction target region. In the forbidden area, the laser beam is irradiated to the correction target area where the area that should not be irradiated is removed, so that the repair process without error irradiation can be performed. Further, since it is possible to control the irradiation of the laser light by the micro device unit by controlling the presence or absence of the laser light irradiation in each of the minute devices constituting the spatial modulation device, even if the correction target region contains a minute or a complicated shape, it can be prevented from being damaged. The repair process is performed normally and normally. • The irradiation condition is determined by using the defect feature information included in the correction target region to indicate the secret feature, and the irradiation condition can be determined in accordance with the defect state, so that the irradiation condition can be corrected for the irradiation condition of the correction target. In addition to the defect type or area, the defect feature information of the present embodiment includes: repairing the defect shape in the object area of the JP m &amp; r ^ y (defect extraction drawing material CC), redundancy, position (whether or not The number of defective parts obtained by extracting image data from the defect by calculating the number of cases in the contact defect part, etc., and causing a short circuit between different potentials, or being in contact with any potential) )Wait. 30 # _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ By using the reference image information (reference image data bb), the comparison is made as -'t image money (the defect image data ridge can distinguish the two differences) as the correction target area. Further, since the normal position can be removed from the correction target area by using the reference image, the correction processing can be surely performed without erroneously irradiating the correction target area. 10 and ^, the object to be inspected is displayed by the - surface, and the superimposed display is related to the information of the complement processing (in the present embodiment, the defect image information ee is displayed for displaying the defect shape, and the shape of the laser light irradiation region is displayed. In the case of the operator, the second embodiment of the present invention can be clearly described. In the present embodiment, the image processing unit 12 The illumination condition of the past riding condition is memorized. 5 The memory section of the memory can be read as needed. The following is only a description of the image of the embodiment and the image of the embodiment. The configuration of the second embodiment is different from the configuration of the first embodiment in that the irradiation condition processing material and the irradiation condition are provided in the memory unit 42, and the condition of the first real surface state is set. The part 43 is input from the defect determination information ee outputted from the defect state determination unit 32 to the irradiation condition history processing material. Then, the information ee is judged by the defect of the same content as the irradiation condition setting unit. The illumination history information jj generated by the irradiation condition setting unit 43 is input to the irradiation condition history processing unit 4b, and the irradiation condition history information jj has a format that can be easily referred to when searching for a later history, the information on the shooting condition 31 1377104 is generated. And generating according to the defect shape image data ff and the laser light source setting information gg. The format example 5 has an index Ls_Cx indicating an irradiation condition as shown in Fig. 16, and the variable serial form is attached. The number of irradiations of LS-Cx is composed of the laser power Cx-nJ&gt;, the shape change amount Cx-η, and the laser beam solution Cx_n_;F at each irradiation (at the time of the nth irradiation). The calendar management unit 4i stores the input irradiation condition history information jj in the irradiation condition calendar 10 in the above-described form. 'Beiji 祁 For example, the original irradiation target image data such as the displayed irradiation area, The first result is (10), the first money is used when the shape is changed by the number of times of the morphological calculus (Erosion) of the first 〇Α~_ 15 20 figure, the UA~qing, and the 12C chart. status It is assumed that the absolute shot = part history memory unit 42 corresponds to the defect judgment of the input person = the illumination condition and the illumination condition Lu Xj. Specifically, in the space constituting the defect judgment attribute *^ Forming a read-and-fix information (4) "Heavy ~" has a cluster of -疋 size, for one cluster, the link has the index LS__Cx as shown in the figure. The 16th is used to fix the irradiation condition, By means of the image, the image of the cluster is formed by the eigenspace of the cluster, which is formed by the illumination object "ee" to the illumination condition history processing unit 41ee and the feature space of the information eccentricity information ee. The Euclidean distance or the Mahalanobis distance (the distance of the dispersion of the test tiger cluster) is read from the illumination condition history storage unit 42 to the illumination condition of the index LS_Cx connected to the cluster having the smallest distance. The irradiation condition history information jj is transmitted to the irradiation condition setting unit 43, and an efficient repair processing can be performed. When the defect determination information ee at this time is not included in the cluster having the smallest distance, the cluster can be expanded to include the defect determination information ee or the like, and the effect can be further exhibited. On the other hand, in the actual processing, the reason for the fact that the image information cannot be completely taken out may be different from the correction of the operator's requirement 10 in the actual processing. In this case, the trimming unit 23 may be necessary. The irradiation conditions are corrected. At this time, the operator must correct the object to be inspected that needs to be corrected again, and it is harmful to the labor. Therefore, in the present embodiment, the operator corrects the information corrected by the trimming unit 23 via the shot shape control unit 21 as the trimming information kk to the irradiation condition history processing unit 41, and the correction content of the job 15 can be checked. The image information of the object is associated with and stored in the illumination condition history storage unit 42. Specifically, in the illumination condition history information corresponding to the defect determination information ee obtained from the current image information, the information about the irradiation condition is extracted from the trimming information, and the history of the irradiation condition is rewritten. The capital Feng. Thereby, even if a similar object to be inspected appears in the subsequent inspection, the operator can perform the repairing process by the trimmed irradiation condition, so that the operator can perform the inspection efficiently without performing the trimming. The processing performed by the irradiation condition history processing unit 41 will be described below. Figure 17 shows the memory and reading of the information on the general illumination conditions. 33 1377104 Sub. In FIGS. 17A and 17B, the defect determination information ee includes: brightness of the defective portion, color information between the image information including the defective portion, and reference image information for the reference image information, and the area of the defective portion, which are the axes The feature space of the 3 dimensional space, that is, the image information is represented as shown in Figs. 17A and 17B. On the other hand, the irradiation condition history information jj indicates the irradiation condition according to the format shown in Fig. 16. The relationship between the defect determination information ee and the irradiation condition history information jj is not one pair g 1 'for one irradiation condition history information jj (ie, irradiation condition), the defect determination information ee (ie, the feature amount of the image information) is distributed, that is, The irradiation conditions form one cluster of 1 group. When the irradiation condition history of the defect determination information ee corresponding to the current inspection target is not found in the irradiation condition history storage unit 42, the irradiation condition history processing unit 41 calculates the distance from the center of gravity of the cluster constituting each irradiation condition. When the distance of the center of gravity of the cluster is equal to or less than the predetermined threshold value, the irradiation condition history processing unit 41 reads the irradiation conditions of the group 15 from the irradiation condition history storage unit 42. The irradiation condition history information jj is sent to the irradiation condition setting unit 43, and the cluster of the irradiation conditions is updated (enlarged) to include the defect determination information ee. On the other hand, if the distance from the center of gravity of the nearest cluster is larger than the predetermined threshold, the irradiation condition history processing unit 41 determines that it is necessary to reset the indication that the irradiation condition is set to include the new irradiation condition for the irradiation condition history. The information is output to the irradiation condition setting unit 43. On the other hand, after the irradiation condition setting unit 43 determines the irradiation condition, the irradiation condition history processing unit 4 sets the irradiation condition of the silk (four) shooting condition to the irradiation condition, and forms a new one from the corresponding shortage capital (10). The cluster, 34 (the formation of the cluster is formed by non-points) is formed by the defect determination information ee having a size of the center of gravity. By repeating the above-described processing, it is possible to determine the irradiation condition of the defect determination information ee from the past experience, and to achieve intelligent repair processing. Further, the operator's repaired irradiation condition history information jj is updated as follows. Fig. 17B shows how the history information is updated when the rounding correction information is entered. The trimming information kk is subjected to the irradiation condition processing unit, and the irradiation condition history port M1 reforms the cluster indicating the irradiation condition LS_Cp reflecting the trimming information kk from the cluster (irradiation condition LS: C2) containing the current defect determination information ee. The cluster of Xianjian Qian Guanxun α (10) information feature center of gravity, with a certain size and size, "T 鞠 鞠 包含 包含 包含 包含 包含 包含 包含 包含 包含 群集 群集 群集 群集 群集 群集 群集 群集 群集 群集 群集 群集 群集 群集 群集 群集 群集 群集 群集Ee belongs to the cluster of the non-irradiation condition LS-C2 = Irradiation condition history record '_2 Read irradiation strip 2: Π: ! History capital · Send to the irradiation condition setting · As above, the priority is compared with the table 2 = shooting condition The cluster is borrowed to be high, and it can be "study for the priority of the cluster of irradiation conditions / irradiation conditions." The person's finger does not 'can achieve a more intelligent 17B diagram indicating that the operator will not only illuminate the conditions, ie If the clustering condition is changed to a new one, for example, the cluster will be clustered with the current patching process, but the operator has the existing condition_cluster merged with other::== 35 &lt; S ) f, because (4) If done - times After trimming, it is possible to carry out the repair processing to reflect the correction content, so that the labor of the operator can be greatly reduced. 10 15 The 18A to 18D drawings illuminate the course of the irradiation conditions in the present embodiment. The use case of the information is the image data, and particularly the irradiation conditions changed by the operator's repair are displayed. As shown in the figure lu, when the defect image data contains the foreign object surface, and the foreign matter is deleted, the secret part is extracted from the reference image data, and it is difficult to call it (4) the film. Therefore, if only the foreign object surface is regarded as a defective part, _ in the case where the phase difference (4) is not short-circuited, the irradiation area may not be set. Therefore, as shown in Fig. 1, the illumination (4) field when the first irradiation of the laser light is corrected is corrected by the operator's trimming. At this point, the operator also corrects the exposure or other exposure conditions of the laser material as needed. The correction result is stored in the irradiation condition history memory unit 42 as a new irradiation condition for the current lack of information, and then when the defect image data as shown in FIG. 18C appears, the defect image has the same 18 A is similar to the defect part of the feature, so the defect determination information of the new defect image data is similar to the defect determination information of the previous defect image data. After the new defect image data is missing (4), the information is input to the irradiation condition of the processing unit 41, and the irradiation condition history processing unit 4 determines that the irradiation condition updated when the worker in the 18th operation is trimmed is also applied to this time. Irradiation conditions. As described above, even if an object to be inspected similar to that of the operator's trimming occurs, the repairing process can be realized according to the irradiation condition updated at the time of trimming. Even if there are many similar objects to be inspected, the operator only needs to perform the trimming, and the rest can be automatically repaired according to the trimming content, which can make the inspection itself 36 efficient. As described above, the laser repairing apparatus according to the present embodiment relates the information used in the irradiation condition (information obtained from the image information) to the irradiation condition, and when the irradiation condition is determined for the current correction target, Reading the illuminating body from the previous irradiation condition history#

More than 1 piece. In this way, the relationship between the irradiation conditions and the image information can be learned, and the efficiency of the irradiation conditions can be achieved. In particular, when the operator corrects the illumination, the correction is made by

Recalling the conditions of the revised conditions and the information of the illuminating strips and the earth AT, and then processing the similar objects to be inspected, the φ1 4 lai can be corrected without further correction, and the irradiation conditions are directly read from the irradiation condition history. Yes, it is possible to implement automatic repair processing according to the needs of the operator. In the above, the embodiment of the invention is not described in detail with reference to the drawings. However, the specific configuration is not limited to the embodiments, and design changes and the like without departing from the scope of the invention may be included. 15 [Simplified drawing ^] Fig. 1 is a block diagram showing the construction of a laser repairing device of the first wall of the present invention. Fig. 2 is a schematic perspective view showing an i-th embodiment of the present invention. Fig. 3 is a view showing the arrangement of the micromirrors 20 in the unit of the third embodiment of the present invention. Fig. 4 is a block diagram showing the configuration of an image processing unit included in the laser repairing apparatus of the first embodiment of the present invention. Figs. 5, 5, and 5C are reference diagrams of examples of image data processed by the image processing unit included in the laser repairing apparatus of the α-th aspect of the present invention. 37 1377104 FIGS. 6A, 6B, and 6C are reference diagrams of an example of image data processed by an image processing unit included in the laser repairing apparatus of the first embodiment of the present invention. . Fig. 7 is a flow chart showing the processing procedure performed by the image processing unit included in the laser repairing apparatus of the first embodiment of the present invention. 5A, 8B, and 8C are diagrams for explaining the processing performed by the defect state determining unit of the laser repairing apparatus according to the first embodiment of the present invention. Figs. 9A, 9B, and 9C are diagrams for explaining the processing performed by the defect state determining unit included in the laser repairing apparatus according to the first embodiment of the present invention. 10A, 10B, 10C, and 10D are diagrams for explaining a laser light irradiation method according to the first embodiment of the present invention. 11A and 11B are views showing a reference of a laser light irradiation method according to the first embodiment of the present invention. 15A, 12B, and 12C are diagrams for explaining a laser light irradiation method according to the first embodiment of the present invention. Figs. 13A, 13B, 13C, and 13D are diagrams showing the contents of the table used for determining the defect determination information and the laser light source setting information by the defect characteristics in the first embodiment of the present invention. 20A, 14B, and 14C are diagrams showing the relationship between the pixels of the image data of the first embodiment of the present invention and the size and arrangement of the micro mirrors constituting the DMD. Fig. 15 is a block diagram showing the configuration of an image processing unit included in the laser repairing apparatus of the second embodiment of the present invention. &lt;S) 38 1377104 Fig. 16 is a reference diagram showing the constitution of the irradiation condition history information of the second embodiment of the present invention. 17A and 17B are block diagrams showing the processing performed by the irradiation condition history processing unit included in the laser repairing apparatus of the second embodiment of the present invention. Figs. 18A, 18B, 18C, and 18D are diagrams for explaining an example of use of the irradiation condition history information of the second embodiment of the present invention. [Description of main component symbols] 1...XY table 17...DMD 2...glass 18...drive storage unit 3...moving drive control unit 19...micro mirror 4...substrate inspection device 20...relay lens 5...illumination light source 21...laser shape control unit 6,10...relay lens 22...DMD drive unit 7,8...beam splitter 23...dressing unit 9...object lens 24...mirror unit 11...CCD camera 25...repairing position confirmation light source 12...image processing unit 26...inspection condition reading unit 13...display 31...defect extraction Part 14...repairing light source 32...defective state determining unit 15...mirror unit 33...irradiation condition setting unit 16...DMD unit 34...selector 16a...reference reflecting surface 41.. Irradiation condition history processing unit 16b... support table 42... illumination condition history memory unit 39 1377104

1001, 1002, 1003... illuminating shape regions 1101, 1102, 1103, 1104... illuminating 43... illuminating condition setting unit 901.. defective portion 902.. defective portion 903a, 903b... electrode pattern 904... bus bar Line shape area 1801... foreign object aa.. defect image data bb... reference image data cc... defect extraction image data dd... illumination target image data ee... defect determination information ff. .. defect shape image data gg... laser light source setting information hh... display display information jj... illumination condition history information kk... patch information h... direction L... patch position p... light car by r ...repair light S...step Θ...angle 40

Claims (1)

1377104 • Patent application No. 95125845 revised and replaced by 101.07.06 X. Patent application scope: 5 10 15 20 1. A laser repairing device that can irradiate laser light emitted from a laser light source to a correction target area on an object to be inspected, and includes: a photographing mechanism that can take a picture of the object to be inspected The image processing mechanism is configured to generate defect feature information of the feature of the defect by the image information generated by the shooting mechanism, and determine an irradiation condition when the laser light is irradiated according to the defect feature information; The modulation device includes a plurality of micro devices arranged in the first-order direction or the second-order direction, which are irradiated by the laser light, and the laser light can be shaped according to the illumination condition determined by the image processing unit; a variable device control mechanism that controls the state of the spatial modulation device according to the irradiation condition; and an illumination optical system that irradiates the shaped laser light to the correction target region, wherein the illumination condition includes the laser light The number of irradiations, the irradiation shape corresponding to each irradiation, and the corresponding irradiation The power of the aforementioned laser light and the oscillation period of the aforementioned laser light corresponding to each illumination. 2. A laser repairing device for irradiating a laser beam emitted from a laser light source to a correction target area on an object to be inspected, comprising: a photographing mechanism capable of photographing the object to be inspected to generate image information 41 1377104 Patent Application No. 95125845 revised and replaced by 101.07.06 10 15 20 The image processing mechanism is configured to generate defect feature information of the feature of the defect by the image information generated by the shooting mechanism, and determine an irradiation condition when the laser light is irradiated according to the defect feature information; The variable device is a plurality of micro devices arranged in the first-order direction or the second-order direction, which are irradiated by the laser light, and the laser light can be shaped according to the illumination condition determined by the image processing unit; a device control unit that controls the state of the spatial modulation device according to the irradiation condition; and an illumination optical system that irradiates the shaped laser light to the correction target region, wherein the illumination condition includes the laser light The number of irradiations, the irradiation shape corresponding to each irradiation, and the oscillation period of the laser light corresponding to each irradiation. 3. A laser repairing device, which is capable of irradiating a laser beam emitted from a laser light source to a correction target area on an object to be inspected, and includes: a photographing mechanism capable of photographing the object to be inspected to generate image information An image processing mechanism that generates, by the image information generated by the photographing mechanism, defect characteristic information indicating a feature of the defect, and determines an irradiation condition when the laser light is irradiated according to the defect characteristic information; The device is modified by the above-mentioned laser light, which is arranged in the above-mentioned application of the patent application No. 95, s. a plurality of micro devices having a 10 1 1 1 or 2 dimensional direction, wherein the laser light can be shaped according to the illumination condition determined by the image processing unit; and the spatial modulation device control mechanism can be based on the illumination condition And controlling the state of the spatial modulation device; and the illuminating optical system, wherein the irradiated laser light is irradiated to the correction target region, wherein the irradiation condition includes the number of times of irradiation of the laser light, and the thunder corresponding to each irradiation The power of the light, and the period of the vibration corresponding to the aforementioned laser light for each illumination. 4. A laser repairing device for irradiating a laser beam emitted from a laser light source onto a correction target area on an object to be inspected, comprising: a photographing mechanism that is capable of photographing the object to be inspected to generate image information. The image processing mechanism is configured to generate defect feature information of the feature of the defect by the image information generated by the photographing mechanism, and determine an illumination condition when the laser light is irradiated according to the defect feature information; the spatial modulation device a plurality of micro devices arranged in the first-order direction or the second-order direction by the laser light, and the laser light can be shaped according to the illumination condition determined by the image processing unit; the spatial modulation device controls The mechanism is capable of controlling the state of the spatial modulation device according to the foregoing illumination condition; and 43 1377104 10 15 Patent Application No. 95125845, Revision 101.0106 In the illuminating optical system, the shaped laser light after the shaping is irradiated to the correction target region, and the irradiation condition includes the number of times of irradiation of the laser light and an oscillation period corresponding to the laser light for each irradiation. 5. The laser repairing apparatus according to any one of claims 1 to 4, wherein the spatial modulation device control mechanism controls the state of the spatial modulation device according to the shape of the correction target region. 6. The laser repairing device according to any one of claims 1 to 4, wherein the spatial modulation device control means can use the laser light irradiation prohibition region of the object to be inspected as the light for the correction target region The cover uses information to control the state of the aforementioned spatial modulation device. 7. The laser repairing apparatus according to any one of claims 1 to 4, wherein the spatial modulation device control means controls whether or not the aforementioned laser light is irradiated to each of the aforementioned micro devices constituting the spatial modulation device. 8. The laser repairing apparatus according to any one of claims 1 to 4, wherein the image processing mechanism has an illumination condition history memory mechanism, wherein the information used in determining the illumination condition and the illumination are used. The condition is associated with the memory, and when the illumination condition is determined, the image processing means can read the past illumination condition remembered by the illumination condition history memory means. 9. The laser repairing device of any one of claims 1 to 4, wherein the ten defect characteristic information includes the aforementioned correction target area 44 1377104 Patent Application No. 95125845, Patent Application No. 101.07.06 10 15 20 One or more of the shape, brightness, position, and number of defects in the domain. 10. The laser repairing apparatus according to any one of claims 1 to 4, wherein the image processing means compares the reference image information about the object to be inspected with the image information generated by the photographing means. To determine the aforementioned correction target area. 11. The laser repairing device according to any one of claims 1 to 4, further comprising an image display mechanism capable of displaying an image of the object to be inspected and displaying the shape of the defect in an overlapping manner One or more of the image and the image indicating the shape of the irradiation region of the laser light. 12. A laser repairing apparatus comprising: a laser light source, an illumination optical system, wherein the laser light emitted from the laser light source is irradiated to the object to be inspected; the spatial modulation mechanism is disposed in the illumination optical system In the optical path, the laser light is shaped by driving a plurality of micro devices arranged in the 1st or 2nd direction; the imaging mechanism is capable of capturing the object to be inspected and acquiring image information; The mechanism may generate a difference image by using the image information and the pre-memorized reference image information, extract the defect information on the object to be inspected, and generate a laser to irradiate the laser to the object to be inspected according to the obtained defect information. Irradiating the object information, and displaying the defect characteristic information of the above-mentioned missing feature of the patent application No. 95 1377104 _ Object information to control the aforementioned spatial modulation mechanism, 5 The image processing means sets the normal pattern area on the object to be inspected as a laser light irradiation prohibition area based on the defect information and the reference image information, and the laser light irradiation prohibition area is used by the control means. The area is irradiated with the target area as the laser light irradiation target area. 46