KR20090024076A - Laser processing device - Google Patents

Abstract

A laser processing device for preventing the deterioration of a digital micromirror device or the optical fiber is provided to perform the laser processing by simply easily changing the intensity of the beam to be irradiated to a processing object. A laser processing device(1) comprises: a laser source(3) generating the beam to be irradiated to a processing object(A); a digital micromirror device(4) irradiating the beam to the processing object to the specific location with a specific form; and a irradiation optical system(5) irradiating the beam configured with the spatial modulation element.

Description

Laser processing device {LASER PROCESSING DEVICE}

TECHNICAL FIELD This invention relates to a laser processing apparatus. Specifically, It is related with the laser processing apparatus which correct | amends the defect of the pattern formed in board | substrates, such as a glass substrate for liquid crystal panels.

Conventionally, the laser repair apparatus which corrects the defect which generate | occur | produced in board | substrates, such as a glass substrate for liquid crystal panels with a laser beam, is known (for example, refer patent document 1).

This laser repair apparatus extracts a defect on a substrate by image-processing an image obtained by photographing a substrate with an imaging device, and defects a digital mirror device (DMD) disposed at a position conjugate with a substrate to be irradiated with laser light. By controlling to the shape of, the laser beam matched to the shape and position of the defect can be irradiated onto the substrate, and even a complicated shape defect can be corrected at high speed accurately.

[Patent Document 1] Japanese Patent Application Laid-Open No. 2005-103581

However, in a substrate such as a glass substrate for a liquid crystal panel, since the material constituting the pattern exists from a relatively low strength material such as a transparent electrode to a relatively high strength material such as a metal electrode, a pattern of a low strength material It is necessary to adjust the intensity of the laser light output from the laser light source so as to irradiate weak laser light with respect to and irradiate strong laser light with respect to a pattern of a material having a high intensity. However, if the intensity of the laser light is increased, deterioration of the DMD or the optical fiber should be taken into consideration, and thus there is a problem that the laser light of a certain intensity or more cannot be irradiated.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and provides a laser processing apparatus capable of performing a laser processing simply and easily by changing the intensity of a laser beam irradiated to a processing target while preventing deterioration of a DMD or an optical fiber. It is aimed.

In order to achieve the above object, the present invention provides the following means.

This invention is arrange | positioned in the laser light source which generate | occur | produces the laser beam irradiated to a process object, and the position which is conjugated with the said process object, and shape | molds so that the said laser beam from the said laser light source may irradiate the said process object in a desired position and shape. And an illumination optical system for irradiating the laser beam shaped by the space modulation device to the processing target, and the irradiation optical system includes a magnification changing optical system for continuously changing the magnification of the laser light. It provides a laser processing apparatus.

According to the present invention, the laser light emitted from the laser light source is shaped into a desired position and shape by being incident on the spatial modulation element, and then irradiated to the processing object through the irradiation optical system, and the processing object is depending on the position and shape of the laser light. Processed. In this case, the magnification of the laser light is continuously adjusted by the magnification changing optical system included in the irradiation optical system.

Therefore, the intensity | strength of a laser beam can be changed and irradiated to a process object, without changing the intensity of the laser beam output from a laser light source, or the intensity of the laser beam to a space modulation element.

In the above-mentioned invention, the imaging optical system which forms the image of the said processing object, the imaging device arrange | positioned at the imaging position of the said imaging optical system, and image | photographs the image of the said processing object, and the image of the said processing object acquired by the said imaging device. An irradiation area setting part which controls the said space modulation element so that the irradiation area of the said laser beam may correspond to the said desired position and shape based on data may be provided.

In this way, the image of the object to be processed formed by the imaging optical system is acquired as image data by the imaging device, and the irradiation area setting unit operates based on the acquired image data to control the spatial modulation element, thereby causing laser The irradiation area of light is set, and a process target can be laser-processed to a desired position and shape.

In the above-described invention, the storage unit for storing the normal processing pattern data of the processing target, the normal processing pattern data stored in the storage unit, and the image data of the processing target acquired by the imaging device are compared with each other. You may provide the upper region extraction part which extracts the position and shape of one area | region as said desired position and shape.

In this way, by the operation of the upper region extraction unit, the normal processing pattern data stored in the storage unit and the image data of the processing target acquired by the imaging device are compared, and the position and shape of the upper region are extracted. Therefore, by irradiating a laser beam to the irradiation area which matches the position and shape of the extracted area | region, and removing this, a process object can be laser-processed by a normal processing pattern.

Moreover, in the above-mentioned invention, the said upper region extraction part is equipped with the material determination part which judges the material of the said upper area | region based on the image data acquired by the said imaging device, and is based on the material judged by the said material determination part. You may be equipped with the magnification control part which controls the magnification of the said magnification change optical system based on it.

In this way, the material of the extracted upper region is determined by the material determining unit, and the magnification of the magnification changing optical system is controlled by the magnification control unit based on the determined material. That is, by controlling the magnification of the magnification changing optical system according to the material of the region, it is possible to adjust the energy density of the laser light to be irradiated according to the material and to perform an appropriate laser processing.

In this case, it is preferable that the magnification control unit controls the magnification changing optical system at a higher magnification than that of a material having low strength when the material determined by the material determination unit is a material having high strength.

In this way, for a material with high strength, such as a metal electrode, the magnification control part raises the magnification of the magnification change optical system, condenses a laser beam, and increases the energy density, and makes the laser processing easy, and the intensity | strength of a transparent electrode etc. For a material having a low value, the magnification of the magnification changing optical system can be lowered to prevent excessive energy from being concentrated, and laser processing can be efficiently performed in a wide range at once.

Moreover, in the above-mentioned invention, the movement mechanism which relatively moves the said process object and the said irradiation optical system, and the said moving mechanism is controlled according to the change of irradiation position accompanying control of the magnification of the magnification change optical system by the said magnification control part. You may comprise a position control part.

In this manner, the position control unit controls the moving mechanism to relatively move the object to be processed and the irradiation optical system in accordance with the change of the irradiation position accompanying the control of the magnification of the magnification changing optical system, and irradiates a laser beam to a desired position of the object to be processed. Laser processing can be performed efficiently.

Moreover, in the above-mentioned invention, the said irradiation optical system and the said imaging optical system may be equipped with the common objective optical system for irradiation of the said laser beam to the said processing object, and imaging | photography of the said processing object.

By doing in this way, an objective optical system can be shared and the apparatus structure can be simplified, and the imaging of the processing target through the imaging optical system and the laser processing of the processing target through the irradiation optical system can be performed quickly without moving the objective optical system.

Furthermore, in the above-mentioned invention, it is provided with the deflection means which matches a part of the optical axis of the said irradiation optical system and the said imaging optical system, and the said magnification change optical system is arrange | positioned on the common optical axis of the said irradiation optical system and the said imaging optical system. desirable.

In this way, the magnification changing optical system is arranged on the common optical axis of the irradiation optical system and the imaging optical system matched by the deflection means, so that the magnification of both the irradiation optical system and the imaging optical system can be simultaneously changed by the operation of the magnification changing optical system.

Moreover, in the above-mentioned invention, deflection means for matching a part of the optical axis of the said irradiation optical system and the said imaging optical system may be provided, and the said magnification change optical system may be arrange | positioned between the said laser light source and the said deflection means.

In this way, when the magnification of the magnification changing optical system is changed, the irradiation range in the image can be enlarged or reduced without changing the magnification of the image acquired by the imaging optical system.

According to the present invention, the effect of laser processing can be obtained by easily and easily changing the intensity of the laser beam irradiated to the processing target while preventing deterioration of the DMD or the optical fiber.

A laser processing apparatus 1 according to an embodiment of the present invention will be described below with reference to FIGS. 1 to 4.

As shown in FIG. 1, the laser processing apparatus 1 according to the present embodiment includes a stage 2 that can be driven in two horizontal directions, and a glass substrate for a liquid crystal panel (processing target A) mounted on the stage 2. The laser light source 3 which generates the laser beam irradiated with respect to the laser beam, the DMD (spatial modulation element) 4 which shapes the position and shape of the laser beam emitted from the laser light source 3, and the shaping | molding by the DMD 4 For the liquid crystal panel formed by the irradiation optical system 5 which irradiates the laser beam to the glass substrate A for liquid crystal panels, the imaging optical system 6 which forms the image of the glass substrate A for liquid crystal panels, and the imaging optical system 6 CCD (imaging device) 7 which captures the image of the glass substrate A, the image processing part 8 which processes the image data acquired by the CCD 7, and the image data processed by the image processing part 8 Based on the display unit 26 to display and the processing result by the image processing unit 8, the stage ( 2), the control apparatus 10 which controls the DMD 4 and the zoom optical system 9 mentioned later is provided.

In Fig. 1, reference numeral 11 denotes an optical fiber for guiding laser light emitted from the laser light source 3, and reference numerals 12 and 13 denote mirrors for deflecting the laser light.

The DMD 4 is arrange | positioned at the position optically conjugate with the glass substrate for liquid crystal panels. Moreover, the DMD 4 is equipped with many micro mirrors (not shown) squarely arranged. Each of the micromirrors can be independently switched to an ON state and an OFF state, and the state is selectively switched by the irradiation area setting unit 14 described later.

The laser light guided from the laser light source 3 is irradiated to all the micro mirrors of the DMD 4. Then, only the laser light incident on the micromirror set to the ON state by the irradiation area setting unit 14 is directed to the mirror 13.

The irradiation optical system 5 condenses the laser light deflected by the dichroic mirror 15 and the dichroic mirror 15 which deflects the laser light from the DMD 4 and directs it vertically downward. A zoom optical system (magnification changing optical system) 9 capable of continuously changing the magnification, and an objective lens (objective optical system) for condensing the laser beam passing through the zoom optical system 9 on the glass substrate A for a liquid crystal panel on the stage 2. (16) is provided. Here, the zoom optical system 9 and the objective lens 16 are comprised so that the mirror surface of the DMD 4 and the glass substrate A for liquid crystal panels may always be optically conjugate.

The zoom optical system 9 includes a plurality of lenses 9a including at least one lens that is movable in the optical axis direction, and a lens drive device 9b that drives to change positions of the plurality of lenses 9a. .

The imaging optical system 6 includes an illumination light source 17 that emits illumination light, for example, visible light, a collimating lens 18 that makes the illumination light from the illumination light source 17 almost parallel, and a collimation lens. The half mirror 19 which deflects the illumination light which became almost parallel light by (18), and makes it enter the objective lens 16, and it is reflected by the glass substrate A for liquid crystal panels, is condensed by the objective lens 16, and is half mirror 19, a lens 20 for condensing and imaging the reflected light of the illumination light transmitted through the zoom optical system 9 and the dichroic mirror 15 is provided. Here, the imaging optical system is configured by the zoom optical system 9 and the lens 20. Moreover, the zoom optical system 9, the lens 20, and the objective lens 16 are comprised so that the light-receiving surface of the CCD 7 and the glass substrate A for liquid crystal panels may always be optically conjugate.

The control device 10 stores a normal processing pattern data based on the design data of the glass substrate A for the liquid crystal panel to be processed, the position of the defect, the material of the defect, and the relationship between the magnification of the zoom optical system 9 ( 21 and the processing pattern data stored in the storage unit 21 and the image data of the glass substrate A for liquid crystal panel processed by the image processing unit 8 are compared, and the upper regions are extracted to extract the extracted defects. The main control computer (material determination unit, upper region extraction unit) 22 for determining the material, and the micromirror for turning on from the DMD 4 in accordance with the shape of the region extracted by the main control computer 22 According to the irradiation area setting unit 14 to be set and the position of the area extracted by the main control computer 22, the stage 2 is placed so that the center of the area coincides with the center of the viewing range of the objective lens 16. A stage control unit 23 to drive and a main control computer The magnification control part 24 which controls the magnification of the zoom optical system 9 by the magnification according to the material determined by the computer 22 is provided. In the figure, reference numeral 25 denotes an input unit for performing various inputs.

The operation of the laser processing apparatus 1 according to the present embodiment configured as described above will be described.

In order to correct the defect which occurred in the glass substrate A for liquid crystal panels using the laser processing apparatus 1 which concerns on a present Example, the liquid crystal panel glass substrate A is fixed on the stage 2 to a positioning state, and an objective lens is used. It is arrange | positioned under the vertical of (16). About the defect in the glass substrate A for liquid crystal panels, it extracts beforehand at a distinguishing step, and stores the position of the defect coordinate as a processing position.

And the operator inputs a start instruction from the input part 25, the main control computer 22 operates the stage 2 via the stage control part 23, and the machining position memorize | stored in advance is the objective lens 16. FIG. The glass substrate A for liquid crystal panel is moved and positioned so that it may be arrange | positioned on the optical axis of.

In this state, the illumination light source 17 is operated so that the illumination light emitted from the illumination light source 17 is transferred to the liquid crystal panel glass substrate by the objective lens 16 through the collimated lens 18 and the half mirror 19. Is investigated.

Illumination light reflected by the glass substrate A for liquid crystal panels is condensed by the objective lens 16, and passes through the half mirror 19, the zoom optical system 9, and the dichroic mirror 15, and by the lens 20 It forms and is displayed by CCD7 as shown to Fig.2 (a). The captured image is sent to the main control computer 22 after being processed by the image processing unit 8 and displayed on the display unit 26. Thereby, an operator can confirm the shape of the defect B in the glass substrate A for liquid crystal panels in the image displayed on the display part 26.

In the main control computer 22, the machining pattern data of the machining position stored in the storage unit 21 is read out and compared with the image data sent from the image processing unit 8. Specifically, the difference of both data is calculated, and the shape and position are extracted as the area | region which differed as the area | region of defect B. FIG.

In addition, the main control computer 22 includes a stage (such that the center position of the region of the defect B extracted (the region enclosed by the rectangle of the broken lines in FIG. 2A) coincides with the optical axis of the objective lens 16). 2) is driven to reposition the glass substrate A for the liquid crystal panel.

In addition, in the main control computer 22, the material in the region of the extracted defect B is determined. Specifically, the main control computer 22 detects the color of the region of the extracted defect B, thereby specifying the material from the relationship between the color stored in the storage unit 21 and the material, and then to the magnification control unit 24. Output

The magnification control section 24 selects a magnification corresponding to the material sent and outputs it to the zoom optical system 9 to change the magnification of the zoom optical system 9. Specifically, when the portion of the defect B is a member made of a high strength material, for example, a metal electrode or the like that needs to strengthen the energy intensity of the crystal laser beam, the magnification of the zoom optical system 9 is increased, and the defect B has a low intensity. In the case of a member of a material, for example, a transparent electrode which can be modified even at a weak energy intensity, the magnification of the zoom optical system 9 is lowered.

When the magnification of the zoom optical system 9 is controlled to be high by the operation of the magnification control unit 24, the image captured by the CCD 7 and displayed on the display unit 26 is, for example, FIG. 2B. As shown in FIG. That is, the image data near the defect part B acquired again by the CCD 7 is processed by the image processing part 8 and displayed by the display part 26, is sent to the main control computer 22, and the area | region of the defect B is carried out. Extract it again.

And the shape data of the area | region (hatched area | region) of the defect B extracted again by the main control computer 22 is sent to the irradiation area setting part 14, and is set to the area | region set by the irradiation area setting part 14. The micromirrors of the corresponding DMD 4 are turned on. That is, in the example shown in FIG.2 (b), since the zoom optical system 9 is set with the magnification which the area | region of defect B is displayed on the whole display part 26, the irradiation area | region setting part 14 extracted The micromirror in which the shape of the region of the defect B is switched on to be reproduced in the maximum region on the DMD 4 is selected.

In this state, the main control computer 22 operates the laser light source 3 and emits laser light. The laser light emitted from the laser light source 3 is guided through the optical fiber 11, and then deflected by the mirror 12 to be incident almost all over the DMD 4.

Since the micromirror of the area | region corresponding to the shape of the defect B is switched on by DM operation | movement of the irradiation area setting part 14 as mentioned above, the micromirror of the incident laser beam Only the laser light incident on the region switched to the on state is reflected toward the irradiation optical system 5.

The laser light reflected by the DMD 4 in the direction of the irradiation optical system 5 includes the mirror 13, the dichroic mirror 15, the zoom optical system 9, the half mirror 19, and the objective lens ( Through 16), the glass substrate A for liquid crystal panels on the stage 2 is irradiated. Since the magnification of the zoom optical system 9 is set to a high magnification, the laser light is sufficiently focused by the zoom optical system 9, irradiated to the region of the extremely narrow defect B of the glass substrate A for liquid crystal panel, and by laser processing. The fault is eliminated.

In this case, according to the laser processing apparatus 1 according to the present embodiment, since the laser light reflected in the wide area of the DMD 4 is condensed and processed in a narrow area by the zoom optical system 9, the intensity is high. Laser processing of the member which consists of materials increases an energy density, and can remove a defect area easily.

On the other hand, when the magnification of the zoom optical system 9 is controlled to be low by the operation of the magnification control unit 24, the image captured by the CCD 7 and displayed on the display unit 26 is, for example, shown in FIG. It is reduced as shown in b). And by the operation of the irradiation area setting part 14, only the narrow range micromirror corresponding to only the area | region of the defect B extracted again by the main control computer 22 is switched to an on state. Therefore, in laser processing of a member made of a material having low strength, the energy density can be reduced, and only defects in the surface layer can be removed without affecting the lower layer.

In this case, it is not necessary to change the intensity of the laser light emitted from the laser light source, and the apparatus can be simplified. In addition, by changing the area of the micromirror to be turned on in the DMD 4, by changing the energy density of the laser light incident on the glass substrate for the liquid crystal panel, as much as necessary for the laser light incident on the DMD (4). It can be set to a constant energy density of. Therefore, there is an advantage in that deterioration of the micromirror of the DMD 4, deterioration of the optical fiber 11, and the like can be prevented.

Further, according to the laser processing apparatus 1 according to the present embodiment, since the magnification is continuously changed by the zoom optical system 9, the magnification is selected to effectively utilize the DMD 4 in accordance with the shape of the irradiation area. Can be. Therefore, the irradiation area can be prevented from protruding from the use area of the DMD 4, and high speed is achieved by batch irradiation matching the shape of the area of the defect B without switching the micromirror in the on state in the DMD 4. This has the advantage of correcting defect B. In particular, when setting the magnification of the zoom optical system 9 low, since the irradiation range of the laser beam by the irradiation optical system 5 becomes much wider, the defect B which spreads in several places can also be corrected simultaneously.

In this embodiment, the acquired image is processed to determine the material of the region of the defect B, and the magnification of the zoom optical system 9 is set at the magnification stored in correspondence with the material. Instead, The magnification of the zoom optical system 9 may be stored in relation to the color of the defect region, not to the material. In addition, in addition to the color, the luminance and the material of the defective area may be corresponded in advance, and the material may be specified from the luminance of the defective area. In addition, when the material of a defect area can be specified by a process step, a size, a position, a shape, etc., you may make it based on these.

In addition, by looking at the image of the defect B displayed on the display unit 26, the operator may determine the material and input the magnification from the input unit 25. For example, when a defect is detected after resist coating and image development, since the material of a defective part can be estimated as a resist, you may specify a material in a step.

In the present embodiment, in contrast with normal processing pattern data and image data, the upper part is extracted as the region of the defect B, and the DMD 4 is used to ablate the entire region of the defect B. FIG. Although the irradiation area of a laser beam was set, instead, as shown in FIG. 3, when defect B is like a short circuit of a circuit, you may set sufficient area | region C necessary for cutting this as an irradiation area.

In addition, in the present embodiment, since the zoom optical system 9 is disposed on the optical axis where the imaging optical system 6 and the irradiation optical system 5 are common, the display unit 26 displays the zoom optical system 9 even if the magnification of the zoom optical system 9 is changed. The shape and size of the irradiated area to be converted can be matched with the shape and size of the area of the micromirror which is turned on in the DMD 4.

In other words, when the defect B is enlarged and displayed on the display unit 26, the micromirror in the ON state is also increased in the DMD 4 to irradiate the defect B with a large amount of laser light, and when the defect B is reduced in the display unit 26. In the DMD 4 as well, the micro mirror in the on state can be reduced so that switching to irradiate the defect B with a low energy density laser light can be performed automatically. There is also an advantage that the operator viewing the display unit 26 can intuitively understand the laser processing state currently being performed.

Instead, as shown in FIG. 5, the zoom optical system 9 may be disposed on the optical axis of the irradiation optical system 5 which is not common to the optical axis of the imaging optical system 6. In this case, the magnification information from the magnification control unit 24 is sent to the irradiation area setting unit 14 to calculate the irradiation area including the magnification of the zoom optical system 9 by image processing or the like, and the DMD at the magnification adjusted to the irradiation area. Although it is necessary to control (4), by doing in this way, the irradiation optical system 5 containing the zoom optical system 9 can be easily unitized.

Here, the objective lens 16 and the lens 20 are configured such that the light receiving surfaces of the liquid crystal panel glass substrate A and the CCD 7 are optically conjugated, and the objective lens 16 and the zoom optical system ( 9) is comprised so that the mirror surface of the glass substrate A for liquid crystal panels, and the DMD4 may optically conjugate.

In addition, in this embodiment, although the zoom optical system 9 which can change a magnification continuously was employ | adopted, you may employ | adopt the system which switches a multiple magnification optical system like a revolver instead.

In this embodiment, the glass substrate A for the liquid crystal panel to be processed is moved in the horizontal (2) direction by the operation of the stage (2). Instead, the stage (2) is driven in one direction, The irradiation optical system 5 and the imaging optical system 6 may be horizontally moved in another direction perpendicular to the driving direction of the stage 2.

In addition, the stage 2 may be fixed and the irradiation optical system 5 and the imaging optical system 6 may be driven in two horizontal directions.

1 is an overall configuration diagram showing a laser processing apparatus according to an embodiment of the present invention.

FIG. 2 is a view showing an example of an image of a processing target obtained by the laser processing apparatus of FIG. 1, (a) is an example of an image at an initial magnification of a zoom optical system, and (b) is irradiation at an enlarged magnification of a zoom optical system Examples of images of the regions are shown respectively.

(A) of FIG. 3 shows another image example of the process target acquired with the laser processing apparatus of FIG. 1, (b) has shown the image example containing the modification of the irradiation area by the magnification of a zoom optical system, respectively.

Fig. 4 is a diagram showing another example of the image of the object obtained by the laser processing apparatus of Fig. 1, (a) is an example of the image by the initial magnification of the zoom optical system, and (b) is the reduction of the zoom optical system. Examples of images of the irradiation area are shown, respectively.

5 is an overall configuration diagram illustrating a modification of the laser processing apparatus of FIG. 1.

[Description of the code]

A: Glass substrate for liquid crystal panels (processing object)

B: Defective Area

1: laser processing device

2: stage (moving mechanism)

3: laser light source

4: DMD (Spatial Modulation Element)

5: irradiation optical system

6: imaging optical system

7: CCD (imaging device)

9: Zoom optics (magnification change optics)

14: irradiation area setting unit

15: dichroic mirror (deflection means)

16: objective lens (objective optical system)

21: memory

22: main control computer (upper area extraction section, material determination section)

23: stage control unit (position control unit)

24: magnification control unit

Claims (13)

A laser light source for generating laser light irradiated to the processing target, A spatial modulation element disposed at a position conjoint with the processing object and shaped to irradiate the processing object with a desired position and a desired shape at the laser light from the laser light source; Irradiation optical system that irradiates the processing target with the laser light shaped by the spatial modulation element Including, The said irradiation optical system is a laser processing apparatus containing the magnification change optical system which changes the magnification of the said laser beam continuously. The method of claim 1, An imaging optical system for forming an image of the processing target; An imaging device arranged at an imaging position of the imaging optical system and configured to photograph an image of the processing target; And an irradiation area setting unit for controlling the spatial modulation element such that the irradiation area of the laser beam matches the desired position and the desired shape based on the image data of the processing target acquired by the imaging device. The method of claim 2, A storage unit for storing normal processing pattern data of the processing target; Upper region extraction for comparing the normal processing pattern data stored in the storage unit with the image data of the processing target acquired by the imaging device, and extracting the position and shape of the difference region as the desired position and the desired shape. Laser processing apparatus comprising a part. The method of claim 3, The upper region extracting unit includes a material determining unit that determines a material of the upper region based on the image data acquired by the imaging device; And a magnification control unit for controlling the magnification of the magnification changing optical system based on the material determined by the material determination unit. The method of claim 4, wherein And the magnification control unit controls the magnification changing optical system at a higher magnification than that of a material having low strength when the material determined by the material determination unit is a material having high strength. The method of claim 1, A moving mechanism for relatively moving the processing target and the irradiation optical system; And a position control unit for controlling the moving mechanism in accordance with the change of the irradiation position accompanying the control of the magnification of the magnification change optical system by the magnification control unit. The method of claim 2, A moving mechanism for relatively moving the processing target and the irradiation optical system; And a position control unit for controlling the moving mechanism in accordance with the change of the irradiation position accompanying the control of the magnification of the magnification change optical system by the magnification control unit. The method of claim 3, A moving mechanism for relatively moving the processing target and the irradiation optical system; And a position control unit for controlling the moving mechanism in accordance with the change of the irradiation position accompanying the control of the magnification of the magnification change optical system by the magnification control unit. The method of claim 4, wherein A moving mechanism for relatively moving the processing target and the irradiation optical system; And a position control unit for controlling the moving mechanism in accordance with the change of the irradiation position accompanying the control of the magnification of the magnification change optical system by the magnification control unit. The method of claim 5, A moving mechanism for relatively moving the processing target and the irradiation optical system; And a position control unit for controlling the moving mechanism in accordance with the change of the irradiation position accompanying the control of the magnification of the magnification change optical system by the magnification control unit. The method according to any one of claims 2 to 10, The said irradiation optical system and the said imaging optical system contain the common objective optical system for irradiation of the said laser beam to the said processing object, and the imaging of the said processing object. The method of claim 11, Deflecting means for matching a part of an optical axis of said irradiation optical system and said imaging optical system, The magnification changing optical system is disposed on a common optical axis of the irradiation optical system and the imaging optical system. The method of claim 11, Deflecting means for matching a part of an optical axis of said irradiation optical system and said imaging optical system, The magnification changing optical system is disposed between the laser light source and the deflection means.

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