TW201013817A - Laser repairing device and laser repairing method - Google Patents

Abstract

The subject of the invention is to more precisely control the illumination of a laser beam and more suitably repair the defects. To solve the problem, a recipe storage part is provided to store images corresponding to the illuminating conditions of the laminated substance for each of plural lamination domains on the surface of a glass substrate. An image processing part is provided to identify the range of defects on a Flat Panel Display (FPD) substrate manufactured by various substances laminated on the glass substrate, and discriminate the illumination domain by determining which lamination domain is overlapped with the range of defects based on the images of the illuminating conditions. A master control part makes use of a laser control part and a space modulation control part to sequentially assign more than one space modulation patterns to a quadratic space light modulator for each illumination domain and also control a laser unit, so as to illuminate a laser beam on the illumination domain with the illuminating condition corresponding to the lamination domain overlapped with the illumination domain.

Description

201013817 VI. Description of the invention: [Rhyme ^ Mingyue t is a technology ^ chair 々 灭 ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ The above substances are laminated on one surface of the substrate to be manufactured. BACKGROUND OF THE INVENTION In the manufacturing process of a flat panel display (FPD), for example, by using a photolithography process using a plurality of reticle, the pattern is reversed by a surname technique or a bismuth technique on a glass substrate. An electrode pattern or a thin film transistor (TFT: Thin Film Transistor) is formed thereon. In particular, a TFT substrate of a liquid crystal display (LCD) uses a gate bus line layer, an insulating film layer, an amorphous layer, a source or a drain bus line (source). A -drain bus line layer, an insulating film layer, and 4 to 5 masks forming a transparent electrode layer were used to manufacture a TFT substrate. About ® FPD, in addition to the liquid crystal display, there is also a plasma display panel (PDp ··

Plasma Display Panel), surface conduction electron emission display (SEd: Surface-conduction Electron Display) and other various types. Further, the products produced by laminating various substances on the substrate are also referred to as "substrate", "glass substrate", "FPD glass substrate" and the like. In the following, in order to distinguish a glass substrate which is a substrate which has not been laminated, and a product in which various materials are laminated and formed with electrodes and TFTs, the latter is referred to as a "glass substrate" and the latter is referred to as "Fpd". Substrate". 201013817 The term "product" includes semi-finished products (work_in_process) in the middle of manufacturing, and also includes finished products after manufacture. In the manufacturing process of the FPD, inspection and correction of the defects of the FpD substrate are performed. In recent years, with the increase in the size of the FPD, it has become an important issue to correct the defects that cause malfunctions in various manufacturing processes and to increase the production rate. For example, defects that cause malfunctions include "short-circuit defects" between wirings and "open defects" in which wiring is broken. Further, the shape defect of the anti-side 帛 φ which is a cause of the "short-circuit defect" which may occur during the formation of the (4) case also constitutes a defect to be corrected. Further, foreign matter such as a partieal and a resist attached to the surface of the FPD substrate is also an example of a defect to be corrected by removal. The method of correcting the defect is known by the technique of laser repair to correct the defect by the laser beam to correct the defect. For example, the short defect is removed by irradiating the laser beam. Formed

Corrected by short-circuit defects connected between wirings on the substrate, attached to FpD

The particles on the surface of the plate or the anti-(four) 丨, etc. caused the foreign matter to be removed due to the irradiation of the laser beam. That is, short-circuit defects and foreign matter are targets of laser repair. It is desirable to illuminate the laser beam on the laser repair according to the type and shape of each defect. (4) 'In the correction of the short-circuit defect of the metal pattern, the higher the input = the wavelength at which the metal is removed (for example, I) ) the laser beam. On the removal of the object, a laser beam suitable for removing non-metallic particles or a shorter wavelength (for example, 355 nm) of the 201013817 anti-surge agent is irradiated. Further, in order to avoid damage of the pattern portion other than the defect, the irradiation range of the laser beam is set in accordance with the shape of each defect. Further, for example, it is conventionally possible to disable the pixels by cutting off the wiring, and to correct the lighting defects in which the pixels are always lit, and to correct the non-lighting defects in which the pixels are often turned off. However, it is now required to correct bad pixels to a higher level of correction. In the various correction works, the correction is made after the end of the layer project of the transparent electrode. Below the last layer, there is a formed metal wiring or a thin film transistor (TFT: Thin Film Transitor). Further, since the transparent electrode is transparent, the laser beam for correction is transmitted, and as a result, the laser beam reaches the metal wiring or the TFT and the pixel is destroyed. Thus, the correction after forming the final layer is complicated by the technique required to prevent destruction of the pixels. In the laser repairing device, it is known that a CCD (Charge Coupled Device) camera captures an FPD substrate to be inspected to generate image information, and the image processing unit generates defects capable of displaying defect characteristics from image information. Feature information, based on defect feature information. A technique of shaping laser light by a digital micromirror device (DMD) (for example, refer to Patent Document 1). Further, the defect correcting device having the defect detecting portion for detecting the defect generated in the FPD substrate in comparison with the reference image may further include the following (for example, 'Reference Patent Document 2'). • For the defect on the drive circuit component or on the wiring, set the prohibited area setting unit 5 of the prohibition correction field. 201013817 • Set the defect part of the part of the related prohibited area to be removed, and the defect area of the unrelated prohibited area as the correction area setting part of the correction field. A priority setting unit that sets the priority of the correction order in the correction field, and a correction unit that corrects the defect in accordance with the priority. [Patent Document 1] JP-A-2007-29983 (Patent Document 2) International Publication No. WO2004/099866 [Invention DISCLOSURE OF THE INVENTION PROBLEM TO BE SOLVED BY THE INVENTION As described above, in the laser repair for the defect of the surface of the FPD substrate, several techniques have been developed in order to achieve more suitable laser beam irradiation. SUMMARY OF THE INVENTION An object of the present invention is to achieve a finer control of laser beam irradiation in laser repair, thereby achieving more appropriate correction of defects. Means for Solving the Problem According to the same aspect of the present invention, a laser repairing apparatus for irradiating a laser beam with defects on a surface of a product to correct a defect is provided, and the product is used to form a circuit-layer-layer Further, in accordance with another aspect of the present invention, a method of performing the foregoing laser repair apparatus is provided. The laser repairing device includes an injection mechanism, a secondary element spatial light modulation mechanism, an age mechanism, a Lai mechanism, a classification mechanism, and a control mechanism. The injection mechanism emits the laser beam. The second-dimensional spatial light modulation mechanism of the month is a mechanism for spatially modulating the aforementioned laser beam emitted by the above-mentioned injection mechanism according to the specified spatial modulation pattern, and is directed to the surface of the product. The storage mechanism recognizes the range of the defect by the identification mechanism corresponding to the irradiation condition corresponding to the irradiation condition of the layer--second speed-species substance on the surface of the substrate. . . The foregoing distinguishing mechanism is based on the conditional information that has been stored and is illuminated according to the plurality of laminated layers.

The above-mentioned singularity of the above-mentioned illuminating collar is divided into a front-forward mechanism for the aforementioned distinguishing mechanism, and the above-mentioned respective illuminating fields are faced with the above-mentioned two-dimensional space modulating machine The modulation pattern-surface controls the emission mechanism, and the laser beam is irradiated to the illumination field in accordance with the aforementioned 四(4) piece corresponding to the laminated field overlapping the illumination area. EFFECT OF THE INVENTION According to the present invention, each of the irradiation fields having a small defect is used as a position, and the laser beam can be irradiated depending on the irradiation conditions. _, it is possible to achieve a finer correction of the conventional laser repair that determines the illumination conditions by using a trap as a unit. Secondly, the conditions of the irradiation conditions are more sensitive to the illumination conditions of the laminated areas, which are more sensitive or prohibited. The irradiation of the laser beams in each illumination area should be controlled. Know the fine. According to the present invention, a more suitable laser repair can be achieved by such fine control. 7 201013817 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing the configuration of a laser repairing apparatus according to an embodiment of the present invention. Fig. 2 is an example of a cross-sectional view of an FPD substrate. Figure 3 is an example of a reference image. Fig. 4 is an example of an image of an irradiation condition. Figure 5 is an example of a camera image that maps defects. Figure 6 is a flow chart showing the operation of the laser repairing apparatus for a piece of FPD substrate. Fig. 7 shows a first example of a spatial modulation pattern group. Fig. 8 shows a second example of the spatial modulation pattern group. Fig. 9 shows a third example of the spatial modulation pattern group. [Embodiment 3] BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the following embodiments, the terms "glass substrate" and "FPD substrate" are used as described above. In other words, the "glass substrate" is a substrate in which no layer is laminated, and the "FPD substrate" is a product in which various materials are laminated on a glass substrate. The term "substrate" as used herein refers to a glass substrate that is compared with a "product", that is, an FPD substrate. Moreover, the "product", that is, the "FPD substrate", can be manufactured by manufacturing a gate bus bar layer, an insulating film layer, an amorphous germanium layer, a source or drain bus bar layer, an insulating film layer, and a transparent electrode layer. The semi-finished product in the middle of the project may also be a finished product in which each layer is formed. The following embodiment of the laser repair 201013817 object is the FPD substrate thus defined. Fig. 1 is a view showing the configuration of a laser repairing apparatus according to an embodiment of the present invention. The laser repairing apparatus 100 of the present embodiment is a device that illuminates a laser beam to correct a defect occurring in the FPD substrate 101. The FPD substrate 1〇1 is a product manufactured by laminating one or more layers of a circuit of a substrate (ie, a glass substrate) to form a circuit of an active matrix type liquid crystal display using a TFT as a switching element. . For example, a general FPD substrate for LCD has a multilayer structure in which a substance layer is layered to 4 to 5 layers. In the present embodiment, the FPD substrate 101 of the semi-finished product is also included in the object to be corrected (work: work) to be corrected by laser processing. Thus, the number of layers on the FPD substrate 101 is defined as "one or more layers" as described above. The laser repair apparatus 100 is indirectly connected to the display 102 and the defect inspection apparatus 103 directly or via a network. The defect inspection device 103 is a device for inspecting whether or not the surface of the FPD substrate 101 is defective. When the defect inspection device 103 detects a defect, defect information including a coordinate indicating a position at which the defect has been detected is generated. The defect inspection device 1〇3 can discriminate the size, shape, type, and the like that have been detected, and can also include the identified result in the defect information. The defect inspection device 103 outputs defect information to the laser repair device 1A. As a result, the laser repairing apparatus 100 can recognize where the FPD substrate 101 is defective based on the defect information input from the defect inspection apparatus 1〇3, and correct the defect. The laser repair apparatus 100 of the present embodiment includes pC (pers〇nal 9 201013817)

Computer 104, laser unit 105, quadratic spatial light modulator 106, stage 1〇7, imaging unit 1〇8, and various optical elements such as mirrors and lenses. The PC 104 controls the operation of the laser repairing device 1〇〇. The laser repairing device 1〇〇 may also include any other computer such as a workstation or a servo machine instead of the PCi〇4. The PC 104 includes a non-electrical memory that is not shown in the figure, such as a CPU (Central Processing Unit) or R〇M (Read Only Memory), which is not shown in the figure, and is used as a working area. An external memory device such as a RAM (Random Access Memory) or a hard disk device that is not shown in the drawing, and an input device for accepting input from an operator. By executing the program by the CPU, the functions of each unit to be described later can be realized. The program can be memorized in the external memory device of the PC 104 or R〇M. Or the program can be stored in a computer-readable memory medium, provided to the PC104 via a memory media drive, or provided to the pci〇4 via the Internet. Regardless of the processing, the CPU loads the program into the RAM and executes the program by using the RAM as a workstation, thereby realizing the functions of the respective units shown in the PC 104 in Fig. 1. The functions of the respective units in the PC 104 will be described later. The laser unit 105 has a function as an injection mechanism for emitting a laser beam, and includes a laser light source 109, a coupling unit 110, a fiber 111 for guiding the laser beam, and a light source for The projection unit 112 of the laser beam is emitted in the desired direction. The laser light source 1〇9 is a YAG: yttrium-aluminum-garnet laser oscillator. The defects constituting the laser repair target in the present embodiment are mainly particles adhering to the surface of the FPD substrate 101, a resist film, and the like. Thus, a laser light source that emits a laser beam suitable for removing a shorter wavelength of a particle and a resist film can be used. The wavelength of the laser beam of the present embodiment can be, for example, 355 nn or 266 mn. The near ultraviolet wavelength is also acceptable. Further, the laser light source 109 may be a mechanism for performing pulse oscillation, or may be a mechanism for continuously oscillating. That is, the laser beam of the present embodiment may be a pulsed laser beam or a continuous wave (CW: Continous Wave) laser beam. When it is a pulsed laser beam, the pulse amplitude is, for example, 5 ns, and the pulse repetition frequency is, for example, 100 Hz. The laser beam emitted from the laser light source 109 is transmitted from the projection unit itll2 through the coupling unit 11 and the optical fiber 111. A 'human space spatial light modulator 106 is configured to spatially modulate a laser beam emitted from a laser unit 1 〇 5 functioning as an injection mechanism according to a specified spatial modulation pattern, and illuminate the ray The article on which the object to be repaired is the surface of the FPD substrate 1〇1. In the present embodiment, the quadratic-spatial optical modulator 1〇6 is a DMD (Digital Micromirror Device) arranged in a quadratic array, and the reflection of the laser beam can be performed by the 0N/0FF of each micromirror. The cross-sectional shape forms an arbitrary shape. Further, unlike the mechanical mechanism for forming a rectangular opening by a conventional shading plate, the DMD can collectively form the reflection pattern into an arbitrary shape at a plurality of points, and irradiate the laser beam reflected by each reflection pattern onto the FPD substrate. Further, a transmissive or reflective type spatial light modulator using liquid crystal may be used as the secondary element spatial light modulator 1〇6 instead of the DMD. The stage 107 holds the FPD board 1〇1, and the imaging unit 1〇8 photographs the surface of the FPD board 1〇1. The stage 107 can hold the FPD substrate 1 by using, for example, a caliper and a squirting pad (Π. The stage 1 〇 7 can be used to eject air to make 17] 〇 11 201013817 substrate 101 floating floating stage. The stage 107 is constructed to be corrected and photographed on the surface of the FPD substrate 101. That is, the stage 107 is constructed to be movable in the XY direction to be arbitrarily changeable. The relative position of the beam path to the FPD board 101 and the relative position of the optical axis of the imaging unit 108 to the FPD board 101. Instead of the XY stage 107, the stage on which the FPD board 101 can be mounted can be fixed, and the cross section can be set. The gantry of the fixed stage can be moved along the fixed stage, and the laser repair head is set to be movable to the horizontal arm of the elevated frame. Further, the laser repairing device 100 is illustrated. After the optical system, the details of the relative movement of the stage 107 will be described. The imaging unit 108 may be, for example, a CCD (Charge Coupled Device) camera or a complementary metal oxide semiconductor (CMOS: Complementary Metal-Oxide Semiconductor) camera. Also, the camera unit 1〇8 can The mechanism for capturing a color image may also be a mechanism for capturing a monochrome gray scale image of a so-called luminance image. As described above, the laser repair device 100 is to be a laser by a two-dimensional spatial light modulator 106. The cross-sectional shape of the laser beam emitted from the unit 105 is shaped into a defect shape of the laser repair target and irradiated onto the FPD substrate 101, and the defect located on the surface of the FPD substrate 101 is corrected. In order to achieve such laser beam irradiation, the present embodiment The optical system of the laser repairing apparatus 100 of the aspect is configured as follows. That is, the laser beam emitted by the laser unit 1〇5 is reflected by the mirror 113 and injected into the secondary element spatial light modulator 106 at a predetermined angle θίη. As described above, the second-element spatial light modulator 106 of the present embodiment is a micro-mirror arranged on the DMD of the secondary 12 201013817 element array. The memory cell for driving (mem〇ry ce(1) and the micro-mirrors of the DMD Corresponding to the state of the memory cell according to the drive, the mirror faces of the micromirrors are driven to different tilt angles. The state of the memory cell has "on state" and "off state". The signal toward each memory cell is independent. Therefore, each of the micromirrors is independently driven into one of a conductive state and an open state. The incident light of the micromirror that is incident with the predetermined angle θίη with respect to the conductive state is opposite to the quadratic spatial light modulator. 1〇6 is emitted at a predetermined angle. However, the inclination angle of the mirror surface of the micro mirror in the on state and the off state is different, and therefore, the incident light incident on the micromirror at the same predetermined angle h with respect to the off state is oriented at a predetermined angle. 0<^ different direction reflections. For example, the difference between the tilt angles of the micro mirrors in the on state and the off state is 1 degree. The laser beam in the on state is incident on the mirror 114 at a predetermined angle 0, and is reflected by the mirror 114 toward the direction parallel to the optical axis of the imaging lens 115, and passes through the imaging lens 115 to reach the beam splitter 116. In this manner, the laser beam is reflected by the beam splitter 116, transmitted through the half mirror 117, and irradiated onto the surface of the FPD substrate 1〇1 by the contact lens 118. That is, as shown in Fig. 1, the laser beam from the mirror 114 to the beam splitter 116 along the optical axis of the imaging lens 115 is reflected by the beam splitter ι 16 toward the optical axis of the objective lens 118. The beam splitter 116 can be, for example, a dichroic mirror. Further, the laser beam reflected by the micromirror in the off state of the secondary element spatial light modulator 106 is reflected in the direction in which the mirror 114 is not incident as indicated by a broken line in Fig. 1 . Therefore, the beam profile shape of the laser beam incident on the mirror 114 becomes a secondary light 13 201013817 spatial light modulator! The shape of the spatial modulation pattern driven by each of the micro mirrors of the 对应 6 corresponding to the on state and the off state. The laser repairing device pair further includes an illumination source m and an imaging lens 12, and the imaging unit 108 is disposed such that the optical axis of the imaging unit 1〇8 and the optical axis of the objective lens 118 are aligned. The illumination light emitted from the illumination light source 119 passes through the imaging lens 120 to reach the half mirror 11 and is reflected by the half mirror m toward the optical axis of the objective lens and is irradiated onto the surface of the FPD substrate 1〇1.

The laser repair device 100 further includes an imaging lens 12ι. The optical axis of the imaging lens 121 also coincides with the optical axis of the objective lens 118. Therefore, the light reflected on the surface of the FpD substrate 丨 Q advances along the optical axis of the object lens 118 as described below. That is, the reflected light on the surface of the FPD substrate 101 is incident on the half mirror 117' through the mirror lens 118, passes through the half mirror 117, enters the beam splitter 116, passes through the beam splitter 116, and is imaged by the imaging lens 121. The light receiving surface of the part 1〇8. In this manner, the beam splitter 116 functions to merge the illumination light path of the laser beam with the observation optical path of the imaging unit 108. Further, the laser repairing apparatus 1 is configured to constitute a position where the surface of the FPD board 101 and the secondary-element spatial light modulator 106 are conjugated, and the surface of the FPD substrate 101 and the light receiving surface of the imaging unit 108 are conjugate. . Further, the mirror 114, the imaging lens 115, the beam splitter 116, the half mirror 117, the objective lens 118, the illumination light source 119, the imaging lens 120, and the imaging lens 121 may be combined into one microscope unit. The microscope unit has a function of reducing the laser beam spatially modulated by the two-dimensional spatial light modulator 106 and projecting onto the surface of the FPD substrate 101, and a function of magnifying the surface of the FPD substrate 101. 14 201013817 The laser repairing apparatus 100 constructed as above is controlled by the PC 104 as described below. The PCHM has functions as a main control unit 122, a recipe storage unit 123, a stage control unit 124, a laser control unit 125, a spatial modulation control unit 126, and a video processing unit 127. The main control unit 122 is realized by the state in which the CPU of the PC 104 executes the program. The main control unit 122 controls the stage control unit 124, the laser control unit 125, the spatial modulation (four) unit 126, and the video processing unit 127. Further, the "master control 122 receives the defect information from the defect check 103", and the information of the correction method for designating the so-called "recipe" is read by the party-age unit 123, and the image processing unit 127 receives the result of the image processing. The recipe storage unit 123 realizes by the PC 104 which has a Ram which is not shown in the figure and stores the recipe. The recipe storage unit 123 can also be realized by both the ram and the hard disk device. Here, the FPD substrate 1〇1 is used to form a circuit for forming a gate bus layer, an amorphous (four), a source or a secret bus layer, an insulating film layer, and a transparent electrode layer. A product manufactured or manufactured after the material is produced in one or more layers of the surface area of the glass substrate. The details of the recipe will be described later, but the reference image 300 illustrated in Fig. 3 and the irradiation condition image 4 illustrated in Fig. 4 are registered as a recipe. The irradiation condition image 400 is based on a physical property such as a reflectance, a laser resistance, a thermal action (absorption rate, a thermal conductivity) of a laser beam of a specific wavelength of a substance constituting the pattern, and a laser repair prohibition field, and a glass substrate. A plurality of layers of the gate bus bar layer, the insulating film layer, the amorphous germanium layer, the source or the surface layer of the layer of the wiring layer, the insulating film layer and the transparent electrode layer are formed on the surface. g & setting, the -r injury corresponding to the irradiation condition information of the irradiation condition, the P recipe storage portion 12 3 has a setting for forming the uppermost transparent electrode and forming the lower layer in order to prevent the laser irradiation The thunder three complex forbidden band, for the metal wiring existing in the lower layer of the transparent electrode, there is no weak laser power that will not damage the surrounding due to the thermal effect caused by the laser irradiation, and the storage per laser irradiation field setting The function of the god institution that changes the conditional information of the laser power that is distinguished.

The plant control unit 124 is realized by the CPU of the program PC1〇4 and the interface between the stage 1〇7 and the PCHM. Further, the stage control unit 124 controls the stage 1 to 7 in accordance with an instruction from the main control unit 122. That is, the stage control unit 124 controls the stage 107 so that the optical axis of the objective lens 118 intersects the surface of the FPD board 1〇1 at a position designated by the main control unit 122. In accordance with the control of the stage control unit 124, the stage 107 relatively moves the FPD board 1〇1 in a plane perpendicular to the optical axis of the receiver lens 118. ❹ This relative movement is used to irradiate the laser beam to the position on the surface of the FPD board 1〇1, and to move the image at any position on the surface of the FPD board 1〇1 as the center of the field of view. The specific method of relative movement differs depending on the specific configuration of the stage 107. For example, 'the two axes parallel to the floor surface and orthogonal to each other are set to the x-axis and the y-axis, the optical axis of the objective lens 118 is perpendicular to the floor surface, and the stage 1〇7 is arranged to hold the FPD substrate in parallel with the floor surface. 101. In this case, for example, the following configurations (a) to (c) can be performed. According to the configuration of the stage 107, the stage control unit 124 operates as follows. 16 201013817 (a) The stage 107 is constructed to move the FPD substrate 101 in the X direction and the y direction by a motor not shown in the drawing. In this case, the stage control unit 124 controls the stage 107 to move the FPD board 1〇1 along the x-axis and the axis in accordance with an instruction from the main control unit 122. (b) The stage 107 is constructed to allow the FPD substrate 101 to move in the X direction by a motor not shown in the drawing, and includes a gantry that is fixed to the gantry to cross the single-axis moving stage 1 〇7. In this case, the overhead has parallel horizontal beams, and the laser repair unit (laser unit 105, laser illumination optical system, observation optical system) can be moved along the horizontal beam. The stage control unit 124 instructs the motor that is not shown in the drawing on the stage to indicate the amount of movement of the FPD board 1〇1 in the x direction and the amount of movement of the optical unit in the y direction. In this case, the control lens 118 and FpD are controlled. The relative position between the substrate FpD substrate 101 in the X direction and the y direction. (c) The stage 107 includes a door type elevated frame fixed to the gantry and placed on both sides of the fixed stage 1〇7 and movable along the fixed stage in the x direction. In this case, as in the case of (b), there is a horizontal beam parallel to the y-axis, and the same laser repairing unit as that of the case of (b) can be moved toward the horizontal beam. The stage control unit Π4 indicates the movement amount of the truss in the X direction to the motor not shown in the drawing, and the amount of movement of the laser repair unit in the y direction, thereby controlling the object lens 118 and the FPD substrate. The relative position between the FpD substrate 1〇1 in the X direction and the y direction. For example, by the above configurations (a) to (c), it is possible to irradiate the laser beam to an arbitrary position on the surface of the FPD substrate 1〇1 and to perform the center of the field of view on the surface of the FpD substrate ι〇ι. The relative movement of the shot. 17 201013817 The laser control unit 12 5 controls the laser unit 105 in accordance with an instruction from the main control unit j 2 2 . The laser control unit 125 is realized by executing the interface between the cpu of the PC and the interface between the stage 1 and the PC 104. Laser Control Department] 25 Controls The following 5 (4) are loaded. The laser (four) part (2) controls one or more of (b) to (h) according to the specification of the laser single (four) $. (a) The timing at which the laser beam begins to illuminate. (b) The output power of the laser beam (ie the energy intensity per unit of the beam profile) (C) the wavelength of the laser beam (d) the exposure time of the laser beam (e) the laser beam is the pulse wave Laser material, the number of pulses to be irradiated (f) When the laser beam is a pulsed laser beam, the pulse wave repeats the frequency (g) When the laser beam is a pulsed laser beam, the pulse amplitude (h) continuously oscillates or Pulse oscillation

The spatial modulation control unit 126 independently drives each of the micromirrors of the secondary element (four) optical modulator 1G6 into a state or an off state in accordance with a finger from the main control unit 122 to control the secondary element spatial optical modulator. The image processing unit m receives the image captured and output by the imaging unit 1〇8. The image processing unit 127 outputs the received image of the captured image to the display page ==2 and outputs the received image of the captured image surface to the main image. The image processing and image 7 has the illumination of the recipe storage unit 123 according to the texture function. Conditional information, the range of the == machine is divided into a function of a division of 18 201013817 or more in accordance with the overlapping of # s and right stem in the complex layered field. The image processing unit 127, which is the function of the division mechanism, has a plurality of illumination fields to the main control unit 122. Further, the main control unit m, the laser control unit 125, and the spatial modulation control unit 126 have one-to-one spatial modulation pattern in the order of the spatial modulation control unit 126 serving as the secondary inter-modulation mechanism. The function of the control mechanism of the laser unit 1〇5 of the injection mechanism. The main control unit 12 as a control unit 2, the laser control unit 125 and the spatial modulation control unit 丨26 control each field of one or more illumination areas distinguished by the image processing unit 127 to correspond to the illumination field Irradiation conditions in overlapping superposed areas direct the laser beam to the illumination field. Next, the operation of the laser repairing apparatus 100 will be described by a specific example in which the FPD board 101 is cut. Fig. 2 to Fig. 5 are diagrams showing a specific example of the FPD board 101. Fig. 6 is a flow chart showing the operation of the laser repairing apparatus 100. Fig. 2 is an example of a cross-sectional view of an FPD substrate. The fpd substrate 200 of Fig. 2 is a specific example of the FPD board 101 of Fig. 1 . The FPD substrate 200 is an example in which one or more layers of a material for forming one or more types of circuits are laminated on the surface of the glass substrate 2〇1. In Fig. 2, six layers of various substances are laminated on the glass substrate 201 as follows to form the FPD substrate 200. • Layer 1: Metal for Gate 202 • Layer 2: Insulation Film 203 • Layer 3: Amorphous Silicon 204 • Layer 4: Metal for Source 205 and Bungee 206 19 201013817. Layer 5: Insulating film 207 • Layer 6. Indium tin oxide for transparent electrodes (ιτο: Indium Tin 〇乂1 (16) 210 and 211 Further, it is useful for forming an insulating film 207 to connect the source 205 with A contact hole 208 to which a transparent electrode of the ITO 210 is connected, and a contact hole 209 for connecting the transparent electrode of the electrode 206 and the crucible 211. Thus, various substances are laminated on the glass substrate 201 to form a TFT (Thin Film Transistor). In Fig. 2, the straight lines A, B, and C are in a direction perpendicular to the optical axis of the objective lens 118 of the surface of the glass substrate 201, and the straight line A, B, or C constitutes a laser beam depending on the position of the defect. Here, the ITO 210 and the crucible 211 are transparent, and the insulating film 203 and the insulating film 207 are also made of a transparent material such as cerium oxide (SiO 2 ). Therefore, the irradiated laser beam not only affects the formation of the uppermost layer. Transparent electrode, which will pass through and affect the gold present in the lower layer It is a wiring. In the inventor, the experiment obtained the "comparison with the case where the metal is not in the lower layer" when the metal is in the lower layer, and the material in the upper layer is susceptible to damage. For example, the lines A, B, and C in Fig. 2 are An example of the illumination path of the metal in the lower layer. When the laser beam is irradiated along the illumination path, the material on the upper layer of the metal is susceptible to damage. Considering the reason why the upper layer is susceptible to damage when the metal is in the lower layer, the following two The first reason is that it is affected by both transmitted light and reflected light. For example, when the laser beam is irradiated along the straight line B, the amorphous germanium 204 is not only subjected to the laser beam transmitted from the upper surface and transmitted through the insulating film 207. The effect, and will be affected by the laser beam reflected by the metal of the gate 202 in each layer. Therefore, in this example, the amorphous germanium 204 is affected by excessive irradiation of the laser beam, and is damaged. Possibility. Similarly, the case where the laser beam is irradiated along the straight line A or C is also affected by both the transmitted light and the reflected light, and the substance in the upper layer of the metal is damaged. Under the influence of heat, the metal will reach a high temperature when it is irradiated by the laser beam. Therefore, for example, when the laser beam is irradiated along the line C of FIG. 2, it is trapped by the metal of the gate 202 and the source 205. The insulating film 203 and the amorphous germanium layer 204 are not only directly affected by the laser beam but also affected by the heat from the metal. Therefore, in this example, the insulating film 203 and the amorphous germanium layer 204 are damaged. Possibility. Similarly, the case where the laser beam is irradiated along the straight line A or B is also affected by the heat 'there is a possibility that the layer adjacent to the metal is damaged. As described above, the degree of damage due to the laser beam differs depending on the substance that has been layered to complete the underlying layer. Therefore, in order to more appropriately perform the irradiation of the laser beam in the laser repair, it is preferable to consider not only the state of the uppermost layer at the time of the laser repair but also the substance of the lower layer to take control into the irradiation mode. Therefore, in order to suppress the damage and sufficiently correct the defect, the present embodiment uses the fourth image or the irradiation condition image 4 to be described later, and the lower layer material is also incorporated to irradiate the laser beam. Next, a specific example of the FPD board will be continuously described with reference to FIG. Figure 3 is an example of a reference image. The reference image 3 of Fig. 3 is a template prepared for each project of the FPD substrate to be laser repaired and each of which is subjected to laser repair. For example, the reference image 300 of Fig. 3 is prepared for use in laser repair at a time point when the layered material reaches the sixth layer of the second layer of the FpD substrate of a certain type. For example, if it is necessary to separately perform laser repair at the time when the layers are completed, it is necessary to prepare reference images for the first layer to the fifth layer for the same type of FPD substrate. The reference image 300 is prepared by a laser repair device 1 or other device. In the present embodiment, the laser repairing apparatus 1 is described as a means for preparing the reference image 300. The φ reference image 300 is an image obtained by photographing a portion of a defect-free FPD substrate. Hereinafter, the FPD substrate photographed to obtain the reference image 300 is referred to as a "reference FPD substrate" and is distinguished from the FpD substrate 100 of the first image of the laser repair target. The reference image 300 of FIG. 3 is obtained by placing the reference FpD substrate on the stage 1〇7, and the imaging unit 1〇8 captures a part of the reference FpD substrate and obtains the reference image 3 At the time of shooting, the illumination source illuminates the illumination light under the same conditions as when the laser is repaired. Further, when η is set to a positive φ integer ', and a reference image 3 〇〇 for performing laser repair at the time (4) when the laminated material is completed to the n-th layer is obtained, the reference FPD in which the laminated material is completed to the n-th layer is completed. Substrate. Any of the FPD board and the FPD board 110 is manufactured by repeating the same circuit pattern on the glass substrate to form a quad array. Hereinafter, the minimum unit of the reverse of the circuit pattern is defined as "pixel". For example, 'Yu Qing's i point is displayed in groups of three elements corresponding to the color filters of red (R), green (6), and blue (8) 22 201013817, respectively. In Fig. 3, considering the width of the paper, the entire circuit pattern corresponding to the two pixels and the partial circuit pattern of only one pixel are displayed. However, the reference image 300 may also be an image containing a range corresponding to more pixels. The reference image 3 obtained as described above reflects the thin metal wiring of the TFT and the lower layer thereof. That is, the reference image 3〇〇 reflects the gate bus lines 301a and 301c, the storage capacitor (CS: storage capacitor) bus line 301b, the source/drain wirings 302a to 302c, and the CS bus. The wiring of the contact hole 303a & 3〇3bs on the line 301b is extended, the TFTs 304a to 304d formed by the laminated amorphous germanium 204, and the transparent electrodes 305a to 305d. Further, in Fig. 3, the source/drain wirings 3〇2a to 3〇2c are transverse to the gate bus bar line 301a, and the metal layers of the gate electrode 202 in Fig. 2 are stacked on the upper layer. The source 205 corresponds to the case of the metal of the drain 2〇6. The C S bus bar 3 01 b is formed by laminating the metal of the second layer in the same manner as the gate bus bars 301a and 301c with a sufficient current flowing through the TFTs 3 and 3 . Moreover, the range of the transparent electrode is not shown in FIG. Further, although the range of the transparent electrodes 305a to 305d is shown in Fig. 3, the transparent electrodes 305a to 305d are actually transparent, so that the reference image 3A is not limited to the outline as shown in Fig. 3. Such reference image 300 is stored as part of the recipe on a hard disk device such as PC 104 that is not shown. Thereafter, the reference image storage unit 123 realized by the RAM reads and stores the reference image 3〇〇 as needed. Moreover, the reference image 300 can also be used to generate the illumination condition image of FIG. 23 201013817 Figure 4 is an image of the irradiation conditions. The irradiation condition image of Fig. 4 is based on the spring reference image (10) "" and is included in the recipe. Also, the condition image 400 is generated based on the reference image_. In the present embodiment, the image processing unit 127 instructs the conditional image 400 by the operator instructing the laser repair apparatus 100 in accordance with the reference image 、. ..., first, the content and meaning of the illumination condition image 4〇〇 in Fig. 4 will be described. As above (4), the illumination condition image

An example of the illumination condition information that is expressed as an image. Irradiation conditions can also be expressed in a form other than images. The irradiation condition image 4 of the present embodiment is a grayscale image of a single color of a so-called luminance image, and the pixel assigner of the irradiation condition image 4 indicates the brightness of the irradiation condition. Further, "pixel" in the description of Fig. 4 means "pixel" which is the minimum unit constituting the irradiation condition image_ itself.

For simplification of the description, the luminance of each pixel constituting the irradiation condition image 400 of the present embodiment is an integer value of 〇 or more and 〇〇 or less. In other words, the luminance 〇 of each pixel constituting the image of the fourth condition fields 404a and 404b which is the shape of the TFT 504a and the transparent electrode 5〇5a corresponds to the black of the fourth figure, and constitutes the conditional field 4 in which the pattern is not formed. The brightness 100 of the pixel of the image of 〇la, 4〇lb corresponds to white. The luminance L of the pixel P in the irradiation condition image 400 indicates the irradiation condition when the laser beam is irradiated onto the point Q on the FPD substrate 1 corresponding to the pixel P. The larger the value of the luminance L, the more the laser beam is strongly irradiated to the point q. Further, although § has been described as "strong irradiation", the intensity of the irradiation can be controlled by various methods as will be described later with reference to Figs. 7 to 9 . 24 201013817 In the irradiation condition image 4 of Fig. 4, the complex pixels of the same brightness correspond to the same one of the irradiation conditions. As shown in FIG. 4, the irradiation condition image 4 〇〇 includes the second condition regions 401a and 401b corresponding to the first condition and displaying white at a luminance of 1 、, corresponding to the second condition, and displaying light gray at a luminance of 6 〇. The first conditional areas 402a to 402c and the third conditional areas 403a to 403c corresponding to the third condition and displaying the rich gray with the luminance of 3〇, and the fourth conditional field 4 corresponding to the fourth condition and displaying the black with the luminance 〇 4a~404h.

For example, the irradiation image condition 400 of Fig. 4 is divided into four colors of white, light gray, rich gray, and black, which are respectively applied to the brightness of four types of 1〇〇, 60, 30, and 〇. Hereinafter, in the description of FIGS. 4 to 8 for convenience, the irradiation conditions of the luminances 1G G, 6 G, 3 G, and _ are referred to as "i-th condition", "second condition", and "dimension", respectively. 3 conditions" and "4th condition". The first condition shown in white shows the strongest illumination. The second condition shown in light gray indicates 60% intensity irradiation of the i-th condition, and the third condition shown in rich gray indicates intensity irradiation of 3G% of the condition. The fourth condition shown in black indicates the irradiation of 〇% of the working condition, in other words, the fourth condition indicates the area of the irradiation prohibition in which the laser beam cannot be irradiated. Each of these fields is an area in which the above-mentioned "layered field" is exemplified in the field of how the substance is laminated on the surface of the glass substrate 2〇1. The irradiation condition image 400 is an example of irradiation condition information corresponding to the irradiation conditions corresponding to the substance of the above-mentioned type or more in the layered layer in the field of the plurality of layers. In this manner, the respective luminances of the plurality of laminated regions in the irradiation condition image 400 are set to values according to the irradiation conditions corresponding to the laminated region. Example 25 201013817 For example, the irradiation condition indicates the energy to be irradiated per unit area, and the value proportional to the energy is set as the brightness in each field of the complex laminated field. In the case where the irradiation condition image 400 displays white, the first condition fields 4〇1& and 401b can be clearly compared with the reference image 3〇〇 of Fig. 3, and the fields of the electrodes, the TFTs, and the wiring are not formed. In other words, the first condition areas 4〇1a and 4〇lb are in the field of laminating only the insulating film 2〇3 and the insulating film 2〇7 on the glass substrate 201 in Fig. 2 . In such a field, there is almost no damage caused by the irradiation of the laser beam, and therefore, the laser beam can be strongly irradiated and appropriately corresponds to the second condition. Further, in the second condition field 402a in which the irradiation condition image 400 is displayed in light gray, it can be clearly understood from the comparison with the reference image 3 in FIG. 3, in the field in which the gate bus line 3〇la is formed. A substance used to form other circuit elements (specifically, 'amorphous stone 〇2〇4, metal for metal 汲 2〇6 for source 2〇5, ITO210 or ΙΤ〇211) is not laminated in the upper layer. . In the FPD board 1〇1, when the laser beam is irradiated to the field corresponding to the second condition field 4〇2&, as described with reference to FIG. 2, due to the gate 2〇2

The influence of metal 'has the ability to damage the surrounding material and the like. Therefore, it is appropriate to irradiate the second condition field 4〇2a with a weaker beam than the second condition. However, in the second condition field 402a, only the gate bus line 3〇ia is formed, and no other circuit elements are formed in the upper layer. Therefore, there is little damage to the field of the TFT or the like which adversely affects the operation of the circuit. . Accordingly, it is not necessary for the FPD substrate 101 to illuminate the laser beam in the field corresponding to the second conditional field. Therefore, this embodiment makes the second condition field correspond to the 26 201013817 second condition. Similarly, in the same manner as the gate bus bar 301a, the CS bus bar line 301b and the gate bus bar line 3〇1 of the first layer are formed, and the portions for forming other circuit elements are not stacked on the upper layer. The second condition fields 402b and 402c corresponding to the irradiation condition image 4 〇〇 in light gray color correspond to each other. Further, in the irradiation condition image 400, when the third condition fields 403a to 403c indicated by the rich gray are compared with the reference image 3〇〇 of the third figure, it can be clearly understood that 'the laminated source/drain wiring 3' respectively. Among the fields of the metal used for 2a to 3〇2c, the transparent electrodes 3〇5a to 5〇3d are not laminated in the upper layer. In the FPD substrate 1〇1, when the laser beam is irradiated to the field corresponding to the third condition field 4〇3&~4〇沘, the source electrode 205 or the drain electrode 206 is used as described with reference to FIG. The influence of the metal may cause damage to the surroundings of the upper and lower layers. Therefore, it is appropriate for the FpD substrate (8) to irradiate the field corresponding to the third condition fields 403a to 403c with a laser beam having a weaker second-order condition. Further, the portion of the third condition fields 403a to 403c is transverse to the field in which the metal such as the gate bus bar 30U is laminated in the lowermost layer. Thus, in the FpD substrate ι〇ι, when the laser beam is irradiated to the region corresponding to the third condition field, the f beam is transmitted to the lowermost layer through the upper layer. Therefore, it is appropriate to irradiate the laser beam with the substrate ΗΠ for the field corresponding to the strips of the third conditional field to the third condition which is weaker than the second condition. Of course, it can also be based on whether the lower layer has a gate bus line, a 汇 bus line 3Glb or a gate bus line 3Qle metal, and the source/drain wiring is applied to the range of 302e. Classification and corresponding to 27 201013817 different irradiation conditions. However, in the present embodiment, the balance between the simplicity of the image 400 for generating the irradiation condition and the precision of the irradiation condition specified by the irradiation condition image 4 is obtained, and the finer classification is conservative. Further, in Fig. 3, the auxiliary wiring extending from the contact hole 3?3b toward the TFT 304b is also formed in the same layer as the source electrode 205 and the drain electrode 206. Here, the portion which is not overlapped with the transparent electrodes 3A5a to 305d among the wirings which are auxiliary to these is also the third condition corresponding to the third condition fields 403a to 403c, and is shown in dark gray in Fig. 4 . Further, in the irradiation condition image 400, it can be clearly understood that the fourth condition fields 404a to 404h of the black display are compared with the reference image 300 of the third figure, and any of the TFTs 304a to 304d and the transparent electrodes 305a to 305d are repeated. field of. In other words, the fourth condition fields 404a to 404h are in the field of amorphous slabs 204, ITO 210, or IT0211. The TFTs 304a to 304d and the transparent electrodes 305a to 305d are easily damaged by the irradiation of the laser beam, and the possibility of circuit failure during the damage is high. Therefore, in this embodiment, the formation of the TFTs 304a to 304d and the transparent electrodes 3〇5a are prohibited. The 305d field illuminates the laser beam. As described above, the prohibition phase of the irradiation is based on the fourth condition. Therefore, the fourth condition fields 404a to 404h are made to correspond to the fourth condition. As described above, the luminance L of each pixel p of the irradiation condition image 400 indicates the irradiation condition when the laser beam is irradiated to the point Q on the FPD substrate 101 corresponding to the pixel P. Further, the larger the value of the luminance L is, the more intense the laser beam is applied to the Q point. The method of generating such an illumination condition image 28 201013817 400 from the reference image 300 of Fig. 3 is various depending on the embodiment. In the present embodiment, the image processing unit 127 of Fig. 1 generates an irradiation condition image 400 in accordance with an operator's input. Further, although not shown in the drawings in Fig. 1, the PC 104 is provided with an input device including a pointing device such as a mouse or a touch sensor, a keyboard, and the like. In this embodiment, the operator views the range of the source/drain wiring 302a in the reference image 300 by the input device while viewing the reference image 300-surface displayed by the display 102, and inputs the specified range for distribution. An indication indicating the value of the "30" of the irradiation condition. The irradiation conditions of this embodiment are represented by numerical values of 0 to 100, and therefore, can also be said to represent the percentage with respect to the strongest irradiation conditions. Similarly, for other laminated fields, the operator specifies the range of each laminated field in the reference image 300 by means of an input device. The operator inputs a value indicating the irradiation condition to be assigned in the specified layered area by the input means. Further, the image processing unit 127 of the present embodiment includes a function of automatically repeating the same processing as a function of the wheeled operation of the assisting operator. The reference image 300 maps the correct periodic arrangement of the various circuit patterns of the plurality of pixels. Therefore, the video processing unit 127 applies the circuit pattern of an arbitrary one pixel to the state of the circuit pattern of the other pixels, thereby reducing the burden on the operator's input. That is, the image processing unit 127 performs image processing of the pixel of the smallest unit of the reverse pattern, or the circuit pattern from the designated 1 pixel by the main control unit 122 29 201013817 by the input device. The operator of the range identifies the range of circuit patterns that identify 1 pixel. The sound-in-one-box image processing unit 127 applies an instruction to the circuit pattern of the other elements to the (4) of each of the laminated fields performed by the circuit pattern of any of the layers to give an instruction to the corresponding irradiation condition. As a result, the irradiation condition image 400 including the circuit pattern of the plurality of pixels can be automatically generated from the reference image 300 including the circuit pattern of the plurality of pixels, only in a state in which the operator gives an instruction to the pixel. Further, in order to assist the operator in instructing the operator to indicate the situation of the layered area, the t/image processing unit 127 provides the same function as the "recognition" tool or the ph〇t〇retouch tools. For example, it should be prohibited. The shape of the range of the transparent electrodes 3〇5& which illuminate the laser beam is not an irregular hexagon as shown in Fig. 3. The operator moves the pointer on the screen displayed on the display 1〇2 to designate the transparent electrode 3 The six vertices of the hexagonal shape. The image processing and the range of the hexagonal shape of the transparent electrode 305a can also be selected from the coordinates of the six points that have been input. Further, the present embodiment is constructed by selecting a reference by the pointing device. At one point in the image 300, the main control unit 122 inputs the image processing unit 127, and automatically sets the irradiation condition having the range of the brightness of the selected point to automatically set the corresponding brightness for the field to be activated, and operates. The image processing unit 127 may display the selection result on the display 102 so that the operator can correct the selection condition according to the need, and the image processing unit 127 may preliminarily determine the irradiation condition. The value u is a value input by the operator from the input device, and may be a value determined by the image processing unit according to the distribution of the brightness of the reference image 300 according to 30 201013817. For example, when the source//drain wiring 3 is specified according to the input device. When the i point in 〇2a is selected, the reference image 300 is selected to reflect the range of the source/drain wiring 3〇2a of the same brightness. As a result, the range of the source/drain wiring 302a is specified. It is not necessary to draw a complicated shape by an input device such as a pointing device. Alternatively, the image processing unit 127 may specify a straight material on the reference image 300 according to the input device to generate a brightness change on the straight line of the display (10). The chart is displayed on the display 102, and the operator can select or change the illumination conditions of each pattern area while referring to the chart. For example, it is set between the cs bus line 30115 and the gate bus line 3〇lc, and the input device accepts the designation. The input of the line parallel to the CS bus line 3〇115. The brightness of the subtracted line is different from that of the source/drain wire wiring ~ 302c in other parts. The graph of the change in luminance on the straight line is effective for the operator to determine the range of the source/drain wiring 302a based on the reference 3_. The image processing unit m provides the above various auxiliary functions to reduce the operation. The wheel of the person is burdened, and the illumination condition image is generated from the reference image 300 according to the input received by the input device. Moreover, the illumination condition information is displayed in the gray-scale image as the illumination condition image 400. The operator is visually easy. Mastering the irradiation conditions, it is possible to suppress the human error in the formula 0. The image of the image of the defective image is shown in Fig. 5. The image of the image in the fifth image is taken by the camera (10). Obtained by the object's FpD substrate ι〇ι 31 201013817. That is, the main control unit 122 receives the defect information from the defect inspection device 103. Therefore, the defect that is to be corrected by the laser repair is called "object defect". The main control unit 122 selects an object defect from the defect information from the defect inspection device 103. The main control unit 122 instructs the stage control unit 124 to move the stage 107 in the X direction and the y direction in accordance with the position information (defect coordinate data) of the specified defect in order to incorporate the target defect into the field of view of the object lens 118. The object defect coincides with the optical axis of the lens of the object. The stage control unit 1124 controls the stage 1 to 7 in accordance with an instruction from the main control unit 122. ^ After the relative movement described above, the imaging unit 108 captures the surface of the FPD board 101 and outputs the captured image 500 to the display 1〇2, and also outputs it to the image processing unit 127. The captured image 500' of the fifth image of the FPD substrate 101 on which the laser repair target has been taken reflects the gate bus line 501a, the CS bus line 5〇1b, the terminal bus line 501c, and the source/drain wiring. 502a~502c. Further, the auxiliary wiring formed in the same layer as the source/drain wirings 502a to 502c and extending through the contact holes 503a and 503b on the CS bus bar 501b is also reflected on the parallax image 500. Further, the captured image 500 also reflects the TFTs 504a to 504d formed by laminating the amorphous stone 〇2〇4. Similarly to the reference image 300, the transparent electrodes 505a to 505d are transparent. Therefore, although the actual imaged image 500 is not clearly defined, the outline of the transparent electrodes 5A5 to 505d is shown in Fig. 5. Further, the captured image 500 also reflects the defect 506 which is a target defect. The defect 506 is, for example, a particle attached to the surface of the FPD substrate 101 or a residue of the anti-surname 32 201013817 film or the like. The defect 506 covers a plurality of fields which are present in the gate bus line 501c, the source/drain wiring 502b, and the transparent electrodes 505a to 505c, respectively, in which different substances are laminated. According to this embodiment, the laser beam is irradiated onto the defect 506 under different illumination conditions in each of the different fields, and the manner of illumination of the laser beam within the defect 506 can be extremely finely controlled. As described above, with reference to Figs. 2 to 5, a specific example of the FPD substrate is described, and the recipe and the image of the image are described. Next, the operation of the laser repairing apparatus 1A will be described with reference to Figs. 6 to 9. Further, as described in Fig. 4, although the irradiation condition indicates the intensity of the irradiation, the intensity of the irradiation can be controlled by various methods. Therefore, first, referring to Fig. 6, the method of controlling the intensity of the irradiation will be specifically described with reference to Figs. 7 to 9 after the non-determination is taken from the common point of controlling the intensity of the irradiation. Fig. 6 is a flow chart showing the action of the laser repairing device. Further, it is assumed that the following (a) to (c) processors have been completed before the processing of the sixth drawing is started. (a) The process of loading the FPD board 101 into the laser repairing apparatus 1〇〇. (b) For example, the input device not shown in the figure is subjected to the processing of the main control unit 122 by receiving information such as the type of the FPD board 101 and the identifier of the FPD board 101. (c) The defect inspection device 1〇3 outputs the defect information about the FPD substrate 101 to the laser repairing device 1A, and the main control unit 122 reads the defect information to the RAM. After the processing of (4) to (c) is completed, the processing of Fig. 6 is started, and after the processing of Fig. 6 is completed, the FPD board 101 is carried out from the laser repairing apparatus 100. 33 201013817 In step S101 of Fig. 6, the main control unit 122 reads out the recipe stored in advance from the recipe storage unit 123. Next, in step S102, the main control unit 122 reads the defect coordinates regarding one object defect specified by the defect information, and the defect information is accepted by the defect inspection device 103. In step S103, the imaging unit 108 captures the target defect on the surface of the FPD substrate 101, and acquires, for example, the captured image 500 of Fig. 5, the imaging unit 1〇8 outputs the captured imaging image 500 to the display 1〇2 and the image processing unit 127. Next, in step S104, the image processing unit 127 recognizes the range of the defect 506 based on the captured image 500 of Fig. 5 which is rotated by the imaging unit ι8. For example, the image processing unit 127 compares the captured image 500 with the reference image 300 of FIG. 3 included in the recipe, and recognizes the range of the target defect from the difference image between the reference image 3 and the captured image 500. The image processing unit can recognize the size, shape, position, and range of the defect 506 by binarizing the difference image with an appropriate threshold value. In the next step S105, the image processing unit 127 compares the range of the identified defect 506 with the irradiation condition image 4 (10) of Fig. 4 included in the recipe. Further, the image processing unit 127 performs alignment of the captured image 5 〇〇 with the irradiation condition image 4 G G generated by the reference image 3 以 as a pre-comparison of the comparison. The image processing unit 127 divides the range of the defect 5〇6 into one or more irradiation fields, based on the comparison result of the (4) defect of the image taken after the alignment (4). That is, in the example of the present embodiment shown in Figs. 4 and 5, the image processing unit i27 divides the _ of the defect 5〇6 into the following (4) to (1): collar 34 201013817 domain. (a) A field that overlaps with the white first condition field 401b. (b) An area that is located around the fourth condition field 404b and overlaps with the white area in the fourth picture to which the reference symbol is not assigned. (c) A field that is located around the fourth condition field 404d and overlaps with the white field in which the reference symbol is not assigned in Fig. 4. (d) A field that is located around the fourth condition field 404f and overlaps with the field of white which is not assigned the reference symbol in Fig. 4. ® (e) The area that overlaps with the second conditional field 402c of light gray (separated into two fields). (f) A field that overlaps with the third condition field 403b of the rich gray. (g) A field that overlaps with the black fourth condition field 404b. (h) A field that overlaps with the black fourth condition field 404d. (1) A field overlapping with the black fourth condition field 404f. When the image processing unit 127 divides the range of the defect 506 into the plural illumination areas (a) to (1) as described above, the result of the division is output to the main control unit 122. ® As such, the process shifts to step S106. In step S106, the main control unit 122 generates a spatial modulation pattern corresponding to each inspection condition based on the discrimination result in step S105. Further, each "space modulation pattern" is a pattern designated by the binary element spatial light modulator 106. Specifically, each of the spatial modulation patterns is a binary element spatial light modulator 106 that independently designates a pattern of any of the on state or the off state for each of the micromirrors. For example, Μ and N are positive integers, and the second-element spatial light modulator 106 is set to 35 201013817 with a small number of parts. For example, if the secondary element is a DMD, the tiny part is a tiny mirror. In this case, the I spatial modulation pattern can be represented by a white representation of the on state and a binary image of the broken bear μ Ν pixel in black. The main control unit 12 2 determines how to control the spatial modulation pattern corresponding to each irradiation condition by controlling the intensity of the irradiation indicated by the irradiation condition. Examples of the spatial modulation pattern will be described later in conjunction with Figs. 7 to 9.

Then, in the step 07, the main control (four) 122 performs the control of the spatially modulated pattern-surface illumination laser beam in the step-by-step manner. In the control of step S107, the laser beam is irradiated to the illumination field in accordance with the illumination conditions corresponding to the laminated field of the illumination field in the respective fields of the above-mentioned illumination fields. .

The main control unit 122 inputs the spatial modulation patterns to the spatial modulation control unit 126, and assigns parameters to the laser (four) unit 125 for each of the lasers. The surface defect 506 is corrected while changing the irradiation condition. After performing the series of flow processing described above, the control unit 122 determines whether or not the other defects of the unprocessed defect are satisfied in the next step S108. If it is another defect that has not been processed, the process returns to step S102 and the series process is performed in the same manner. If all the defects have been processed, the process of Fig. 6 is terminated. Referring to the figure, a series of actions of the laser repairing device 1 is described. 0 36 201013817 The following side assigns step S106 and step S107 of FIG. 6 to the corresponding side with reference to FIG. 7 to FIG. 9 to illustrate the spatial adjustment. An example of a variable pattern group. Fig. 7 shows a first example of a spatial modulation pattern group. The spatial modulation pattern group 600 of FIG. 7 is composed of three spatial modulation patterns of the spatial modulation pattern 6 (the spatial modulation pattern 604 and the spatial modulation pattern 607. The spatial modulation pattern group 600 is suitable for the mine. An example of the spatial modulation pattern group when the output power of the light source 109 is variable. The order of the three spatial modulation patterns in the spatial modulation pattern group 600 is arbitrary, but φ is spatially modulated as follows. The order of the patterns 〇1, 604, and 607. As described above, in the case where the two-dimensional spatial light modulator 106 is a DMD having a plurality of micro mirrors, each spatial modulation pattern can indicate the conduction state in white. The binary image of the ΜχΝ pixel in the off state is indicated by black. In Fig. 7, the spatial modulation patterns 6〇1, 6〇4, and 6〇7 are only extracted to be equivalent to the defects included in the field of view of the object lens 118. The part near 5〇6 is represented by a binary image of white and black. In the space modulation pattern, the white area of the specified conduction state is called “conduction area” and the black area of the specified disconnection state is called Disconnected collar In addition, in Fig. 7, in order to facilitate the display of the defect line of the defect 5〇6 in white, the conduction state is not specified for each micromirror. The spatial modulation pattern 6〇1 is the illumination condition image of Fig. 4. In the case, the conduction field (10) corresponding to the third condition indicated by the brightness of "30" and the disconnection field 6〇3 outside the field are formed. The conduction field 602 includes (f) explained in step S105 of Fig. 6. In the field of illumination ° and the example of Figure 7 in order to more accurately correct the defect, Ray 37 201013817 shot repair device _ not only on the defect, but also on the defect (4) illuminate the laser beam. Therefore, the conduction of the space modulation pattern 601 The field is the area of the illumination of (7) and the sum of the areas in the vicinity of the defect and the third conditional area of Fig. 4, that is, the 'conduction field _ is the field that overlaps with the third conditional field in or near the defect. (3) The conditional field (4) corresponds to the third article, and the irradiation condition indicated by the brightness of the stomach "30". Further, the spatial modulation pattern 604 is formed in the illumination condition image of Fig. 4, and is composed of a conduction field 605 605 corresponding to the second condition indicated by the brightness of "60", and a field other than the field. In the field of conduction, the milk is separated into two, but the term “conductor field 605” is collectively referred to. The field of conduction 6〇5 contains the field of illumination regarding the step (Fig. 6) of the figure 6 (4). Further, the conduction field 6G5 is used to more accurately correct the defect, and is included in the vicinity of the defect 506 and the second condition field in the fourth figure. Overlapping areas. That is, the conduction field 605 is in the field of the defect 506 (10) or the vicinity of the second condition field 402c. The second conditional field bar corresponds to the second condition (i.e., the irradiation condition indicated by the brightness of "60"). Further, the inter-process modulation pattern 607 is composed of the conduction field 608 corresponding to the condition indicated by the brightness of "100" and the field 609 outside the field in the irradiation condition image 4 of Fig. 4. The conductive field 6〇8 is divided into four, but it is collectively referred to as “conducting field 6〇8”. The conductive field 608 includes the field of illumination of (4) to (d) which have been described with respect to step 81〇5 of Fig. 6. Further, the conduction field _ is used to more reliably correct the defect 38 201013817 506, which is included in the field of the vicinity of the defect 506 and the white portion indicating the second condition of the fourth figure. In other words, the conduction field 608 is a field in which the field corresponding to the first condition indicating the brightness of the "1" is in or near the defect 5〇6 (for example, the second condition field is degraded). In this manner, the spatial modulation pattern group 6 is composed of the spatial modulation pattern 601 corresponding to the third condition, the spatial modulation pattern 6〇4 corresponding to the second condition, and the spatial modulation pattern 607 corresponding to the first condition. Composition. The inter-modulation patterns 601, 604, and 607 corresponding to the third condition have a shape of a field of a specific gray scale (ie, a specific brightness) according to the irradiation condition image 4' for forming a laser beam. A pattern of the same shape. The reason why the spatial modulation pattern group 6 has no spatial modulation pattern corresponding to the fourth condition is that the fourth condition of the present embodiment indicates that the irradiation of the laser beam is prohibited. Next, the manner of use of the spatial modulation pattern group 6〇〇 will be described. The timing of using the spatial modulation pattern group 600 is, for example, the following and established. The laser source 109 can oscillate continuously or pulse wave. (a) The power of the laser source 109 is variable. (b) The output power Pmax and the irradiation time τ corresponding to the luminance of "1" indicating the strongest illumination condition in the irradiation condition image 4 〇 第 in Fig. 4 are set in advance. For example, the values of the output power pmax and the irradiation time T correspond to the irradiation condition image 400 and are stored in the recipe dependency unit 123. (a) and (b) when the step S106 of the sixth figure is established, when the main control unit 122 generates the spatial modulation pattern group 6〇〇, the spatial modulation pattern group 600 is subjected to the spatial modulation pattern group 600 as described below. The laser beam is irradiated. 39 201013817 In order to spatially modulate the laser beam in accordance with the spatial modulation pattern 601 corresponding to the third condition indicated by the brightness of the "30", the main control unit 122 will spatially modulate the laser beam. The data of the spatial modulation pattern 601 is output to the spatial modulation control unit 126. Further, the main control unit 122 calculates the rounding power p3 corresponding to the third condition based on the equation (1). h^PmaxXOO/lOO) (1) In this manner, the main control unit 122 instructs the laser control unit 125 to control the ejector illumination time T to output the power of the laser beam from the laser unit 1〇5.

Further, the main control unit 122 synchronizes the operation timing of the secondary element spatial light modulator 1〇6 with the laser unit 1〇5 by the spatial modulation control unit 126 and the laser control unit 125. That is, the main control unit 122 performs the synchronous control so that the secondary element spatial light modulator 106 drives the respective micro mirrors in accordance with the spatial modulation pattern 6〇1, and the laser unit 105 starts to emit the laser. As described above, when the laser beam that is emitted from the output power I in the irradiation time τ is spatially modulated in accordance with the spatial modulation pattern 601 and is irradiated onto the surface of the FPD substrate, the main control unit 122 switches the manner of irradiation. That is, in order to adjust the laser beam to the second modulation mode 604 by the second-order spatial light modulator 1〇6 in accordance with the second condition indicated by the brightness of the so-called "60", the main control unit 122 The data of the spatial modulation pattern 6〇4 is rotated to the spatial modulation control unit 126. Further, the main control unit 122 calculates the output power corresponding to the second condition according to the equation (2). (2) The main control unit 122 instructs the laser control unit 125 to perform the culling 40 '〇13817. = Irradiation time T The laser beam is emitted from the laser unit 1〇5 at the output power p2. Further, the main control unit 122 performs the same synchronization control as described above. As described above, when the lightning beam emitted from the irradiation power τ at the output power p2 is spatially modulated in accordance with the spatial modulation pattern 604 and irradiated onto the surface of the FpD substrate 1〇1, the main control unit 122 switches the manner of irradiation. That is, in order to adjust the laser beam modulator x 〇6 between the laser beam beams X a in accordance with the spatial modulation pattern 607 corresponding to the second condition indicated by the brightness of the "100", the main control unit 122 will The data of the spatial modulation pattern 6〇7 is output = spatial modulation control unit 126. Further, the main control unit 122 calculates the output power 对应 corresponding to the first condition based on the equation (3).

Pl==Pmax><(100/100) (3) - In this way, the main control unit 122 instructs the laser control unit 125 to cause the coverage illumination time τ to output the laser from the laser unit 1〇5 at the output power P1. bundle. The main control unit 122 performs the same synchronization control as described above. As described above, when the irradiation time τ is covered and the Q laser beam emitted by the output power p丨 is continuously illuminating the surface of the FPD substrate 101 in accordance with the spatial modulation pattern 6〇7, the correction of the defect 506 is ended. . That is, the process proceeds from step S107 in Fig. 6 to the process of step S108. Further, in the above description, the lengths of the spatial modulation times in accordance with the spatial modulation patterns 6〇1, 6〇4, and 607 are equal to the irradiation time τ, and the output powers A, Pa, and p1 are changed. However, when the laser source 丨〇9 continuously oscillates, or when the laser source 109 oscillates, the pulse repetition period is much shorter than the irradiation time T, and it can be considered that the pulse wave number is proportional to the irradiation time. The control in step S107 can also be performed. 201013817 In other words, the main control unit 122 performs the spatial modulation/surface modification of the spatial modulation pattern 6()1 corresponding to the third condition, and calculates the illumination time I according to the equation (4). Field, fruit T3 = Tx (3〇 / i〇0) (4), so - the main control unit I22 indirectly controls the laser unit 1G5 by laser control and 5, so that the irradiation time T3 is covered by the wheel Output power p thunder shot. π ίβ, the main control unit 122 performs the same synchronization control as described above, and rotates the data of the spatial modulation pattern 6G1 to (4) the modulation control unit © after the irradiation time τ3, the main control unit 12 corresponds to the condition. _ 漏 漏 漏 漏 : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : Τ2 emits the laser beam at the output power ρ. Further, the main control unit 122_ax outputs the data of the spatial modulation pattern 604: the same synchronization control 126 as described above. Only the wheel-to-space modulation control unit 122 is rotated. - The face is adjusted according to the inter-i-modulation, according to the equation (6), after the irradiation time T, the main control Z-condition corresponding to the spatial modulation pattern 607* emits the irradiation time T1 of the laser beam. (6)

Tl^TxGOO/lOO) In this way, the main control unit 122 and the r-street- 1 nc. laser control unit 125 indirectly control the laser early 1兀5 to cover the shot.

‘,,, and time Τι to output power P 42 201013817 laser beam. Further, the main control unit 122 performs the same synchronization control surface as described above to rotate the spatial modulation pattern 607 to the spatial modulation control unit 126. As described above, the main control unit 122, the laser control unit 125, and the spatial modulation control unit 126 have the following functions as control means. That is, as the control mechanism, each part _ face two: the under-dimensional space light adjustment (four) I% sequentially specifies the complex inter-process modulation pattern _ ~ surface control laser unit (8) 'to enable more than one area of the field of illumination The laser beam is illuminated at a time corresponding to the illumination condition of the illumination field. In addition, 'any of the output power and the illumination time are changed, as the various parts of the & mechanism'--the surface control laser unit (10) sequentially switches the output power and emits the laser beam... Saki two-dimensional space light modulation ^ touch The complex spatial modulation pattern is designated so that the energy irradiated per unit area in each of the one or more illumination fields corresponds to the illumination condition corresponding to the illumination area. In this way, in the above example, each part of the control mechanism is further controlled to cause the second-dimensional spatial light modulator 1〇6 to switch the spatial modulation mode according to the sequence of the plurality of spatial modulation patterns, and The laser unit 1〇5 switches the timing synchronization of the wheel output power. In this way, the main control unit 122 is configured by the spatial modulation control unit 126 to sequentially design the three spatial modulation patterns 601, 604, and 607' to the second-dimensional spatial light modulators 1 to 6 by the laser control unit. 125. When the laser control unit 105 controls the main control unit 122 to change the control of the other one of the fixed illumination time and the output power, the illumination field (a) described in the step S105 of FIG. 6 can be realized. ~ (1) The various areas of the appropriate laser irradiation 43 201013817 bundle. Namely, it is possible to perform control of extremely fine laser beam irradiation in units smaller than one defect 506, i.e., in each of the irradiation fields (a) to (i). In this embodiment, the laser beam is additionally irradiated to a small area in the vicinity of the defect 506, and as described above, the small area in the vicinity of the defect 506 is also set corresponding to each laminated field. Therefore, according to the present embodiment, the irradiation field is irradiated with the laser beam for each of the fields of the fields (a) to (i) in the irradiation field in accordance with the irradiation conditions corresponding to the laminated region overlapping the irradiation region. Further, a conventional method for shaping a cross-sectional shape of a beam of a laser beam and using a physical mechanism such as a slit can be known. However, in this embodiment, an electrically-driven DMD is used as the secondary element spatial light modulator 1 〇 6. Therefore, the present embodiment can treat the time required to switch the spatial modulation pattern to zero. Accordingly, in the present embodiment, compared with the conventional method using the physical mechanism, the laser beam can be extremely finely irradiated in a very short time and in a field smaller than the defect 506, and can be appropriately controlled. Moreover, it is possible to prevent wasted illumination of the laser beam by extremely fine control, and as a result, there is no violent stress on the secondary element spatial light modulator 106 and other optical elements due to the laser beam. Therefore, the life of the secondary element spatial light modulator 106 or the like is not excessively shortened. Fig. 8 shows a second example of the spatial modulation pattern group. The spatially modulated pattern group 700 of Fig. 8 is composed of three spatially modulated patterns of the spatial modulation pattern 70, the spatial modulation pattern 7〇4, and the spatial modulation pattern 7〇7. Further, the order of the spatial modulation patterns in the spatially modulated pattern group 700 is arbitrary, but the order of the spatial modulation patterns 701, 704, and 707 is set hereinafter. 201013817 Similarly to Fig. 7, Fig. 8 also shows that the spatial modulation pattern 7〇7〇4 and 7〇7 only extract the portion corresponding to the defect 5〇6 in the field of view of the object lens 118. Black binary image representation. Further, the outline of the defect 5〇6 is conveniently illustrated as in the seventh drawing. The spatial modulation pattern 701 is composed of a conduction field 702 for driving the corresponding micro mirror to be in an on state, and a field 7 other than the fields.

The conduction field 702 is in the vicinity of the defect 506 or the vicinity thereof, and is represented by the field corresponding to the third condition indicated by the brightness of the so-called "30" in the irradiation condition image 400 of Fig. 4, and is expressed by the brightness of the so-called "6". The field of the second conditional sense and the field in which all of the fields corresponding to the first condition indicated by the brightness of "100" overlap. In other words, the conduction field 702 includes the sum of the illumination fields (a) to (f) described in the step S105 of Fig. 6. Further, the conduction field 7〇2 is closer to the defect 506, and includes a field in which the fields in the irradiation condition image 400 corresponding to all of the third to third conditions overlap. . Similarly, the spatial modulation pattern 704 is composed of the conduction field 7〇5 and the disconnection field 7〇6. The conductive field 705 is split into two, but is collectively referred to as "conducting field 705." ^ The conduction field 705 is in the vicinity of the defect 506 or in the vicinity of the illumination condition image 400 of FIG. 4, and the second condition indicated by the brightness of the so-called "60", and the brightness of the so-called "100". The area in which the third condition of the ^ condition overlaps. In other words, the conduction field 7〇5 includes the sum of the irradiation fields of (a) to (), and includes fields overlapping with the first to second conditions and the respective fields in the emission condition image 400. The spatial modulation pattern 707 is a conduction field 708 in which the field corresponding to the first condition indicated by the brightness of the so-called "100" is superimposed on the defect 506 or the vicinity thereof by the defect 506 or the vicinity thereof. 709 constitutes. In other words, the conduction field 708 includes the sum of the irradiation fields of (a) to (d), and includes the field in which the fields in the irradiation condition image 400 corresponding to the first condition overlap. Further, the conduction area 708 is divided into four, and is collectively referred to as "conduction area 708". That is, the conductive field 702 includes a conductive field 705 and the conductive field 705 includes a conductive field 708. Next, the manner of use of the spatial modulation pattern group 700 will be described. The spatial modulation map group 700 can also be used in the case where the output power of the laser light source 1〇9 is constant. Further, the laser light source 109 may be a continuous oscillating person or a pulse oscillating person. The spatially modulated pattern group 700 is used, for example, when (a) or (b) is established as follows. (a) When the laser light source 109 continuously oscillates, the irradiation time Tmax (= T) corresponding to the luminance of "1 〇〇" indicating the strongest irradiation condition in the irradiation condition image 400 of Fig. 4 is set in advance. For example, the irradiation time value corresponds to the irradiation condition image 400 and is stored in the recipe storage unit 丨23. (b) The number of pulse waves corresponding to the brightness of r 1 〇〇 which indicates the strongest irradiation condition in the irradiation condition image 400 of Fig. 4 when the laser light source 1 〇 9 pulse is vibrated

Nmax is preset. For example, the value of the pulse number!^^ is corresponding to the irradiation condition image 4〇〇 and stored in the recipe storage unit 123. When (a) or (b) is established, in step s1〇6 of Fig. 6, when the main control unit generates the spatial modulation pattern group 7〇〇, in step 81〇7, according to the spatial modulation pattern group as described below 700 is irradiated with a laser beam. The main control unit 122 causes the binary element spatial light modulator 106 to spatially modulate the laser beam in accordance with the spatial modulation pattern 7〇1, and outputs the data of the spatial modulation pattern 46 201013817 701 to the spatial modulation control unit 126. . Also, from: _ shooting condition is the first piece to the strongest, and the plural _ condition corresponds to the inclusion of the guide, the laser cut __ recorded, the master, the output and the so-called "3." brightness Indicates Article 3 II = Time T3. Alternatively, when the laser light source 1 () 9 is pulsed, the main portion; and the radiation expression (7) calculates the number of pulses corresponding to the third condition. Work 2

N3 = Nmaxx(3〇/i〇0) (?) In this way, when the laser source 1〇9 is continuously relocated, the main control unit is controlled by the laser and 5 indirectly controls the f-unit milk to cover the illumination. ; D 3 continues to shoot the laser beam. Alternatively, the laser light source 1G9 is a pulse wave, and the main control unit 122 indirectly controls the laser unit 1〇5 by the laser control unit 125 to irradiate the pulse wave N3 times. At the same time, when the laser beam is emitted from the laser unit 1〇5, the main control unit 122 performs the same synchronization control as that described with reference to Fig. 7 to perform spatial modulation by the inter-turn modulation pattern 701. After the irradiation time A, the pulse wave is irradiated; after that, the main control unit 122 switches the mode of the irradiation. That is, the main control unit 122 causes the two-dimensional spatial light modulator 1〇6 to spatially modulate the laser beam in accordance with the spatial modulation pattern 7〇4, and outputs the data of the spatial modulation pattern 704 to the spatial modulation control. Part 126. Further, the space modulation map 704 is included in the conduction field 705 in the field corresponding to the second condition and the first condition. Also, the conductive field 705 is included in the conductive field 702. In this case, the laser beam is irradiated according to the spatial modulation pattern 7〇4, and the reference is made to the guide 47 201013817 as the "radiation_" or the pulse wave number. That is, the main control unit performs the necessary field according to the second condition. The amount of material, and the surface connection = the spatial modulation of the inter-process modulation pattern 701 - the calculation of the difference between the illumination energy of the laser beam irradiated on the surface of the substrate 101. The main control portion 122 is a laser source (10) In the case of continuous oscillation, the irradiation time Ta' is calculated according to the equation (8). The laser light is based on the laser _9 pulse wave according to the formula (9 pulse wave number Na).

Ta=Tx(60-30) /〇.

Na = Nmaxx ((60-30) / ι〇0) (9) In this case, when the laser light source 109 is continuously vibrating, the main control unit 122 controls the laser unit 105 to emit the laser beam covering the irradiation time Ta. Alternatively, when the laser source 109 is oscillated, the main control unit 122 indirectly controls the laser unit 105 by the laser control unit (2) to illuminate the pulse train. At the same time, the main control unit 122 performs synchronous control when the laser unit 1〇5 emits the laser beam to perform spatial modulation by the spatial modulation pattern 7〇4. After the irradiation time or the irradiation of the pulse train, the main control unit 122 switches the manner of the irradiation. That is, the main control unit 122 spatially modulates the laser beam in order to make the laser beam spatially modulated in accordance with the spatial modulation pattern 7〇7, and outputs the data of the spatial modulation pattern 707 to the spatial modulation control. Part 126. Further, the field corresponding to the second 丨 condition in the spatial modulation pattern is included in the conduction field. Further, 48 201013817 the conduction field 708 is included in both the conduction field 702 and the conduction field 705. As described above, the irradiation time or the number of pulse waves to be calculated by the main control unit 12 in accordance with the spatial modulation pattern 707 corresponds to the difference between the irradiation energy necessary for the first condition and the energy of the irradiation. . In other words, when the laser light source 109 continuously oscillates, the main control unit 122 calculates the irradiation time Tb according to the equation (1), and calculates the pulse wave number Nb according to the equation (11) when the laser light of the laser light source 109 oscillates.

Tb= Τχ((100- 60)/100) (10)

Nb = Nmaxx ((100 - 60) / 100) (11) When the laser light source 109 continuously oscillates, the main control unit 122 indirectly controls the laser unit 1〇5 by the laser control unit 125 to cover the illumination. Time Tb continues to emit the laser beam. Alternatively, when the laser light source 1 〇 9 pulse oscillates, the main control unit 122 indirectly controls the laser unit 1 〇 5 by the laser control unit 125 to illuminate the pulse wave Nb times. At the same time, the main control unit 122 performs synchronous control when the laser beam is emitted from the laser unit 1〇5 to perform spatial modulation by the spatial modulation pattern 707. Further, in the above description, the main control unit 122 controls the irradiation time or the pulse wave number corresponding to each of the spatial modulation patterns 7 (Π, 704, and 705) by the laser control unit 125. However, the main control unit 122 also controls The laser control unit 125 may be notified only of the timing of the start of irradiation of the laser beam and the irradiation time 。. In this case, the irradiation time from the start of the laser beam after the irradiation time Τ3 and the irradiation time from the start of the laser beam When the main control unit 122 switches the spatial modulation pattern by the spatial modulation control unit 126 after the irradiation time T2 (= T3 + Ta), the laser repairing apparatus 100 operates in the same manner as described above. 49 201013817 The space space light modulator 106 space transfer a + 』 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄 丄When 109 is continuously oscillated, the total of the time when the laser beam is irradiated to the fields of the first to third condition pairs is T, T2, and T3, respectively, and the wave is made based on the above-mentioned 'laser'. Vibration _ 1 beam (four) in the division of the third article Field of the pulse wave corresponding to the total number of, respectively N_, NmaxX (60/100), N3.

In this way, according to the above-mentioned control using the spatial modulation pattern group, the _ field (4) which can be explained to the lion lion 5, respectively, corresponds to the illuminating secret (ie, the 阙 condition f 彡 _ The intensity of the money voyage) illuminates the laser beam.

When the "laser light source" is continuously oscillated as described above, the main control unit 122, the laser control unit 5, and the air-to-variable control unit 126 function as a control structure, and the following functions are performed as the control unit. In the second-element space, the modulator (10) sequentially specifies the complex-empty-pattern-plane control laser early element 105 so that each field of the more than one illumination field is equivalent to the number of waves corresponding to the illumination of the collared red riding Guiyi Lei beam. Further, in the example of Fig. 8, the main control unit 122 can control not only the irradiation time but also the pulse wave number, but also the output power. _, the main (four) portion 122 can also control the laser unit milk by the laser control unit 125 so that the corresponding spatial modulation maps, 704 and 7〇7 respectively illuminate the laser beam with output power &, IΜ and (7) P2) . In this case, the irradiation time of each of the spatial modulation patterns is equal, for example, the above-described irradiation time τ. 50 201013817 In the above-described embodiment, the case where the spatial modulation pattern group knife is a complex spatial modulation pattern is described. However, the field in which the irradiation conditions are different may be divided into a plurality of spatial modulation patterns. Composition. Fig. 9 shows a third example of the spatial modulation pattern group. The example of Fig. 9 is an example of the overlap of the laser repair using the other formulas shown in Figs. 3 and 4, and the overlapping concept of Fig. 9 is conceptually shown to be the object of the laser repair. The defect gw area of the captured image obtained by the FPD substrate 101 is cut into a pattern of the irradiation field. Further, the spatial modulation pattern 900 of Fig. 9 adjusts the power of the laser beam divided by the overlapping concept map 800. The overlap concept map 800 displays the range of the defect 801, and the first condition field 802 'the second condition field 803, the third condition field 8〇4, and the fourth condition field 805 which are respectively distinguished from the four irradiation conditions. The example of Fig. 4 is the same as the example of the 9th®. The integer of 丨(10) indicates the irradiation condition. Each of the irradiation conditions in the example of Fig. 9 is represented by the next numerical value. • 1st condition: 50

The second condition: 75 The third condition: 100 The fourth condition: 〇 803 = the condition field 8G2 is the area of the rectangle on the left side, the second condition field, the area of the rectangle below, and the third condition field 804 is the collar of the L shape on the right side. We are the field of the rectangle of the upper right. As shown in the overlapping concept map _, there are 4 different illuminations. Therefore, in step S105 of Fig. 6, the range of shadowing is divided into four irradiation fields. That is, the range of the defective coffee: 51 201013817 is the first irradiation field 8〇6 overlapping the first condition field 802, the second irradiation field 8〇7 overlapping the second condition field 803, and the third condition field 8〇4 The third irradiation field 808 that overlaps and the fourth irradiation field 809 that overlaps with the fourth condition field 805. According to the illumination field thus distinguished, in the step 81〇6 of Fig. 6, the main control unit 122 generates a spatial modulation pattern group composed of only one null_change__. In such a good amount, the main (four) portion 122, the laser control unit 125, and the null=modulation control unit 126 perform control for irradiating the laser beam with the spatial modulation of the spatial modulation pattern 900. Spatial Modulation Pattern _ As in the seventh and eighth figures, in the binary image of the ΜχΝ pixel corresponding to the DMD having the 微小 micro mirrors, only the one corresponding to the missing 丨岐 (4) is extracted and displayed. Further, in the example of Fig. 9, the additional laser beam irradiation in the vicinity of the defect 8〇1 is not performed. Moreover, for the convenience of the drawing, the boundary line between the different illumination fields and the outline of the defect _ are displayed on the spatial modulation pattern. However, the actual binary image indicating the spatial modulation pattern _ does not have the - pixels in the binary image of each square =0 which is smaller than the boundary modulation, and corresponds to each micromirror. With respect to the spatial modulation pattern 900, in the 箆1, the silk exists (four) in the range of her 6 dragons (four) "" from the white pixels or the display disconnected state color pixels. The ratio of the number of white pixels to the number of black pixels is represented by an integer of 52 201013817, and the first condition is represented by the value of the so-called "5 〇 illumination field 806", such as 5〇· ( 100-50)=! · ! (12). 1 (12)

❹ Similarly, in the spatial modulation pattern 9〇〇 and the second range, there are also black pixels in a state in which the on-state of the emission state 807 is displayed. The white (four) image is the pixel-to-display disconnect ratio, and the second condition corresponding to the field 807 of the number of pixels of the table of the irradiation condition _~ the number of the sub-pixels is the so-called "improved by the second irradiation collar 75: _" 75Η3:1 indicates that it is a white pixel in the range corresponding to the third illumination field 8〇8. This is the third condition corresponding to the first field _ for the so-called “conference” The most numerical value is used to display the irradiation conditions. In other words, the ratio of the number of pixels of the white and the number of pixels of the black corresponding to the spatial modulation pattern 9 (10) and the third illumination field 808 is as shown in the equation (14). 100 : (100 - 1 〇〇) = 1 : 〇 (14) Conversely, in the range corresponding to the spatial modulation pattern 900 and the fourth illumination area 8〇9, only the black pixels in the off state are displayed. This is the fourth condition corresponding to the fourth irradiation field 809, which is represented by the minimum value used for displaying the irradiation condition by the so-called "〇". In other words, the ratio of the number of white pixels to the number of black pixels in the range corresponding to the spatial modulation pattern 9 〇〇 and the fourth illumination area 809 is as shown in the equation (15). 0 : (100 — 〇)= 〇: 1 (I;) According to the spatial modulation pattern group consisting only of the spatial modulation pattern 9〇〇 201013817 The illumination of the laser beam is especially in correspondence with a micro mirror. In the case where the area on the surface of the FPD substrate ιοί of the irradiated laser beam is very small, it is suitable for the reason that in this case, the laser beam is irradiated with the space modulation according to the spatial modulation pattern 9〇〇. When the average is within one irradiation area, the laser beam is irradiated to each of the irradiation fields by the irradiation conditions corresponding to the condition images of the irradiation condition image shown in FIG. For example, the value of the so-called "100" indicating the strongest irradiation condition indicates the second condition with a value of a ratio of 50%, and the case of (formula) irradiates the laser beam with 5G% of the second irradiation field 806. Therefore, if the area on the surface of the FPD substrate 1G1 corresponding to the micro-mirror beam and the ray-short beam is very small, it can be regarded as "the most intense illumination when the average first irradiation field is within 8 〇6. The intensity of 5〇% of the condition uniformly illuminates the laser beam." The same is true for other areas of illumination. That is, the example of Fig. 9 can be summarized as follows. The second-element spatial light modulator 106 includes a second one that is arranged in a quadratic array shape and can be driven at least to the first and second tilt angles (that is, the tilt angles corresponding to the on state and the off state, respectively). A tiny mirror of the number (=]^><^).空间 The spatial modulation control unit 126 having the function as a control unit specifies the spatial modulation pattern 9〇〇 of the secondary pupil spatial light modulator 106, and the micro mirrors and the conduction state of the second number of micromirrors are The pattern corresponding to the disconnected state. Further, the present invention is not limited to the above-described embodiment, and can be variously modified. Several examples are described below. The manner in which the layers of the materials constituting the circuit of the FPD substrate are laminated is various depending on the embodiment. The cross-sectional view of Fig. 2 is one of the specific examples, and there are also cases in which a material different from that of Fig. 2 is laminated on the glass substrate 201 to manufacture an FPD substrate. In this case as well, as in the above-described embodiment, it is also possible to illuminate a suitable laser beam in accordance with the formulation of the material corresponding to the layer. Further, the product to be subjected to laser repair in the above embodiment is not limited to the FPD substrate. The above-described embodiment can be applied to a laser repair target other than the FPD substrate, for example, an LSI (Large Scale Intedration) chip or a printed wiring board. Moreover, the arrangement of each optical element shown in FIG. 1 is only an example. For example, it can be appreciated that the mirror 113 can be saved by changing the configuration of the laser unit 105. In addition to this, various changes can be made. Further, in step S104 of Fig. 6, the image processing unit 丨27 can recognize the brightness of the defect 5〇6 of the captured image 5〇〇 based on the position and range of the recognized defect 506. The image processing unit 127 can also recognize the type of the defect 506 based on the brightness of the defect 5〇6, and determine whether or not to correct it based on the type of the defect 5〇6. When the image processing unit 127 determines that correction is not necessary, the following steps S105 to S107 may be omitted. Further, as exemplified in Figs. 7 to 9 , how to specifically generate the spatially modulated pattern ridges formed by the spatial modulation patterns is various in accordance with the embodiment. Typically, as shown in Figs. 7 to 9 , each of the spatial modulation patterns is one of the following (a) to (4), but a pattern other than this may be used. (a) A spatial modulation pattern (b) indicating one of the orders of one or more illumination areas indicates the sum of an area of the illumination collar 55 201013817 represented by the spatial modulation pattern of (a) above and the vicinity of the illumination area. The spatial modulation pattern (4) indicates a spatial modulation pattern (d) indicating a sum of plural numbers in one or more illumination fields, and indicates a field in which the complex illumination field and the vicinity of the complex illumination region are represented by the spatial modulation pattern of (C) above. The spatial modulation pattern of the sum is further 'the method for controlling the irradiation of the laser beam for each of the irradiation fields in accordance with the respective irradiation conditions is not limited to the method illustrated in FIGS. 7 to 9. E.g,

It is also possible to change both the output power and the illumination time depending on the switching of the spatial modulation pattern. I singly, the laser source 109 continuously oscillates and realizes the DMD of the quadratic spatial light modulator 106. The driving speed of the micro mirror is very fast (that is, the irradiation time T 〇 can be very short) When driving a micro mirror, the following controls are also possible. That is, the laser control unit 125 controls the laser light source 109 to emit a CW laser beam of a certain output power in order to cover the irradiation time. In parallel with this, the spatial modulation control unit 126 drives each of the micromirrors by, for example, PWM (Pulse Width Modulation), and the ratio of the conduction state to the irradiation time TG (that is, the duty cycle) and the irradiation condition image. The brightness of 400 is proportional. The main control unit 122 assigns a command to the laser control unit 125 and the spatial modulation control unit 丨26 to perform the above control. Further, for example, when the intensity of the irradiation condition is expressed by the total amount of energy irradiated per unit area, the energy of each unit area of the irradiation condition may be irradiated to each of the irradiation areas. For example, the timing of the switching between the output power switching and the spatial modulation pattern does not have to be a 56. 201013817, and 0 is also used as an illumination condition to represent an integer of 1〇〇, and Or the area of the layer corresponding to the irradiation condition indicated by "100" is not necessary. That is, it is also possible that all of the laminated fields correspond to the intermediate irradiation conditions. Of course, the range indicating the riding condition value may be 0 to 100 which is not the above-described embodiment, and may be arbitrarily determined in advance. For example, by multiplying the range of values indicating the irradiation conditions, the multiplication of the filaments (1) to (1) can be appropriately determined by the specification of the laser unit 105, and it is not necessary to store a constant such as pmax in the recipe storage unit 123. For example, in the case where the value in the range of 〇 to pmax can be set as the brightness of the irradiation condition image 4〇〇, the value indicating the service condition is the value of the output power of the missing material (4) 5. ’This does not require the calculation of equations (1) to (7). The same applies to other formulas. Moreover, the above-described embodiment produces the illumination condition image 400 based on the reference image 300 obtained by actually capturing the reference FPD substrate 101. However, the illumination condition image 4 can also be generated in accordance with the design data of the FPD substrate 101 to replace the reference shirt image 300. A specific example of the s ten data is the CAD (Computer Aided Design) data of the mask pattern used for the light meal. When using CAD data, it is necessary to correct the shape of the substance actually laminated and the slight difference in the shape of the mask pattern. Further, the above-described embodiment sets the irradiation conditions in accordance with the input from the operator, but may also depend on the reflectance, laser resistance, and thermal action (absorption rate) of the laser beam with respect to a specific wavelength of the substance laminated in each layer. The physical properties such as the thermal conductivity and the layer thickness of the material layered in each layer are automatically set in the condition field, and the irradiation conditions are calculated for each condition field, and the formulation is automatically prepared. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a configuration diagram of a laser repairing apparatus in an embodiment of the present invention. Fig. 2 is an example of a cross-sectional view of an FPD substrate. Figure 3 is an example of a reference image. Fig. 4 is an example of an image of an irradiation condition. ❿ Figure 5 is an example of a camera image that maps defects. Figure 6 is a flow chart showing the operation of the laser repairing apparatus for a piece of FPD substrate. Fig. 7 shows a first example of a spatial modulation pattern group. Fig. 8 shows a second example of the spatial modulation pattern group. Fig. 9 shows a third example of the spatial modulation pattern group. [Main component symbol description] 100.. . Laser repair device 101.. .FPD substrate 102.. Display 103.. . Defect inspection device

104.. .PC 105.. . Laser unit 106.. . Two-element spatial light modulator 107.. Station 108.. Camera unit 109.. Laser light source 110.. Coupling unit 111. .optical fiber 112...projection unit 113, 114" mirror 115, 120, 121... imaging lens 116... beam splitter 117... half mirror 118..

58 201013817

119 119.·· illuminating light source 122··· main control unit 123.· recipe storage unit 124...stage control unit 125...laser control unit 126...space modulation control unit 127...image processing unit 200..FPLD Substrate 201...glass substrate 202.. interpole 203, 207... insulating film 204... amorphous 矽205.. source 206.. . 汲 208 209 209... contact hole

210 to 211...ITO 300...reference images 301a, 301c, 501a, 501c... gate bus bars 301b, 501b...CS bus bars 302a to 302c, 502a to 502c... source/汲Polar wirings 303a to 303b, 503a to 503b··. contact holes

304a to 304d, 504a to 504d, TFTs 305a to 305d, 505a to 505d, transparent electrode 400, irradiation condition image 401 a to 401 b... first condition field 402a to 402c... second condition field 403a to 403c... The third condition field 404a to 404h... the fourth condition field 500: the captured image 506, 801... the defect 600, 700... the spatial modulation pattern group 601, 604, 607, 701, 704, 707, 900... spatial adjustment Variable patterns 602, 605, 608, 702, 705, 708... Turn-on fields 603, 606, 609, 703, 706, 709... Break field 800... Overlap concept maps 802 to 805... 1st to 4th conditions Fields 806 to 809... 1st to 4th illumination fields 59

Claims (1)

201013817 VII. Patent application scope: 1. A laser repair device that illuminates a defect on the surface of a product to correct the aforementioned defects, and the product is used to form one of the circuits. Any one or more of the above materials are laminated on the surface of the substrate, and include: an emission mechanism that emits the laser beam; and a secondary element spatial light modulation mechanism that is spatially adjusted according to a specified spatial modulation pattern. Transforming the laser beam emitted by the injection mechanism and irradiating the surface of the product; the storage mechanism is for storing the illumination condition information, and the illumination condition information is for each laminated field of the plurality of laminated fields on the surface of the substrate, Corresponding to the irradiation conditions of the above-mentioned one or more substances accumulated in the laminated field; the identification mechanism identifies the range of the defects; the distinguishing mechanism is based on the information of the aforementioned irradiation conditions stored in the storage mechanism, and is based on Which of the above multiple layers is overlapped, the aforementioned identification mechanism has The foregoing range of the aforementioned defects is divided into one or more areas of illumination; and the control means is for each of the illumination fields of the one or more illumination areas that have been distinguished by the foregoing division mechanism, facing the aforementioned two-dimensional spatial modulation mechanism sequentially The irradiation means is controlled while the one or more spatial modulation patterns are designated, and the laser beam is irradiated to the irradiation area in accordance with the irradiation conditions of the laminated field overlapping the irradiation area. 2. The laser repairing apparatus according to claim 1, wherein the illumination 60 201013817 condition is expressed as an image, and the brightness of each of the plurality of laminated fields in the image is set in accordance with the image The layered area corresponds to the value of the aforementioned irradiation condition. [3] The laser repairing device of claim 2, wherein the irradiation condition indicates energy for illuminating each unit area, and a value proportional to the energy is set in each laminated field of the plurality of laminated fields as The aforementioned brightness. 4. The laser repairing apparatus of claim 1, wherein the aforementioned irradiation condition indicates energy for illuminating each unit area. 5. The laser repairing apparatus according to claim 1, wherein the laser beam is a laser beam, and the control mechanism sequentially controls a plurality of spatial modulation patterns in the face of the second-dimensional spatial modulation mechanism. The injection mechanism illuminates the pulsed laser beam with a pulse wave number corresponding to the irradiation condition corresponding to the irradiation area in each of the irradiation areas of the one or more irradiation fields. 6. The laser repairing apparatus according to claim 2, wherein the control unit controls the injection mechanism to face the one or more illumination fields while sequentially designating a plurality of spatial modulation patterns facing the second-dimensional spatial modulation mechanism. Each of the irradiation fields irradiates the laser beam with a time corresponding to the irradiation condition corresponding to the irradiation area. 7. The laser repairing apparatus according to claim 1, wherein the control unit controls the injection mechanism to sequentially switch the output power and emit the laser beam in the same direction, and the plurality of spatial modulation mechanisms are sequentially designated to be plural. The spatial modulation pattern 'is such that the energy of each unit area irradiated in each of the one or more illumination fields is equivalent to the aforementioned illumination condition corresponding to the illumination area. 8. The laser repairing device of claim 7, wherein the control mechanism controls the second-dimensional spatial modulation mechanism to switch the timing of the spatial adjustment mode according to the plurality of spatial modulation patterns sequentially designated, The timing of synchronizing the output power with the aforementioned injection mechanism is synchronized. 9. The laser repairing apparatus according to claim 1, wherein the second-element spatial light modulation mechanism includes a first number arranged in a quadratic array shape and capable of driving at least a first and a second tilt angle The micro-mirror, wherein the control means specifies each of the spatial modulation patterns of the one or more spatial modulation patterns of the second-element spatial light modulation means, and the respective micro-mirrors of the first number of micro-mirrors and the first or In the pattern corresponding to the second inclination angle, the control means specifies, in the second-element spatial light modulation means, a spatial modulation corresponding to each of the first or the second inclination angle and the second micro-mirror a pattern in which the first and the first of the first plurality of micromirrors corresponding to the irradiation target are driven in each of the irradiation fields of the one or more irradiation fields The ratio of the number of the aforementioned micromirrors of the inclination angle is a value corresponding to the irradiation condition corresponding to the irradiation region. 10. The laser repairing apparatus according to claim 1, wherein the spatial modulation pattern of the one or more spatial modulation patterns sequentially designated by the control unit to the two-dimensional spatial light modulation mechanism is the following pattern: A spatial modulation pattern is one of the one or more illumination areas 62 201013817; and the second spatial modulation pattern is a region of the illumination area indicated by the first spatial modulation pattern and the vicinity of the illumination area. And a third spatial modulation pattern indicating a plurality of sums in the one or more irradiation fields; or a fourth spatial modulation pattern indicating a plurality of the illumination fields and the plural represented by the third spatial modulation pattern The sum of the fields near the field of illumination. 11. A laser repairing method for illuminating a laser beam with a defect on a surface of a product to correct the defect, and the article is to be used to form one or more layers of the circuit to form a layer or more on the surface of the substrate. The method includes the following steps: reading the irradiation condition information, wherein the laminated condition field of the plurality of laminated layers on the surface of the substrate and the irradiation condition of the one or more substances according to the layered one or more layers in the laminated field Corresponding to; identifying the range of the aforementioned defects; and classifying the aforementioned range of the identified defects into more than one illumination field according to the previously read illumination condition information and according to which of the plurality of stacked layers is overlapped; And emitting one or more spatial modulation patterns for spatial modulation on the one side of the laser beam, thereby spatially modulating and emitting the aforementioned lightning of 63 201013817 for each illumination field of the one or more illumination fields in a different order Beaming and illuminating the surface of the aforementioned article to correspond to the photo Field of the overlap of the field of irradiation conditions laminate, the irradiation field irradiated with the laser beam to the collar. 64