JP2010118426A - Holding table and machining device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a holding table that improves the efficiency of work and speeds up processing without requiring replacement when a circular workpiece or a rectangular workpiece is a machining target. <P>SOLUTION: A holding face 32a includes a circular-workpiece holding region 33 for holding a circular workpiece 1A, and a rectangular workpiece holding region 35 for holding a rectangular workpiece 1B having four corner parts, which are formed into a concentric shape and into a superposed state. Each four corner-part holding part 36a protrudes from the circular-workpiece holding region 33 so as to be respectively aligned with each of the four corner parts of the rectangular workpiece 1B. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention provides, for example, a holding table that holds a processed surface by sucking the workpiece when performing processing such as cutting or groove formation on a thin plate-like workpiece such as a semiconductor wafer or a substrate of various electronic components. The present invention relates to a processing apparatus provided.

  For example, in the semiconductor device manufacturing process, a large number of rectangular regions are defined on the surface of a disk-shaped semiconductor wafer by grid-like division lines, and electronic circuits such as IC and LSI are formed on the surface of these rectangular regions, and then After the necessary processing such as polishing after the back surface is ground, all the divided lines are cut and cut, that is, diced to obtain a large number of semiconductor chips. The semiconductor chip thus obtained is packaged by resin sealing and widely used in various electric / electronic devices such as mobile phones and PCs (personal computers).

  In Patent Document 1, a semiconductor wafer held by being attracted to a holding table (a chuck table in the same document) by negative pressure action is cut by rotating a disk-shaped cutting blade attached to the tip of a spindle at high speed. A cutting-type dicing apparatus is described (see Patent Document 1). In addition to the above-mentioned disk-shaped semiconductor wafer represented by a silicon wafer, the substrate of an electronic device that is diced with a cutting blade in this way is a rectangular substrate such as a CSP (chip size package) substrate. There is also.

JP-A-8-25209

  By the way, as the holding table, a table corresponding to the shape and dimensions of a work (generically referred to as the wafer, substrate, etc.) is often used. Therefore, processing is performed by changing the holding table for each shape of the workpiece. However, each time the holding table is replaced, it is necessary to set up the apparatus by measuring the height position of the holding table, which is the processing reference surface. For this reason, there are problems such as complicated work and a delay in processing time.

  Therefore, according to the present invention, when a circular workpiece and a rectangular workpiece are used as workpieces, it is not necessary to replace the workpiece, and as a result, the replacement operation can be omitted, thereby improving work efficiency and processing speed. It is an object of the present invention to provide a holding table that can be realized and a processing device such as a cutting device provided with such a holding table.

  The holding table of the present invention is a holding table having a holding surface that holds and holds a workpiece, and the holding surface is a rectangular workpiece holding area that holds a circular workpiece and a rectangular shape that has four corners. A rectangular work holding area for holding a work, and the rectangular work holding area includes four corner holding parts which are held by matching four corners of the rectangular work. It is characterized by being formed to protrude from the holding region.

  According to the holding table of the present invention, the holding table is replaced by forming the circular work holding area and the rectangular work holding area corresponding to the dimensions of the circular work and the rectangular work, respectively. It is possible to hold circular and rectangular workpieces without doing so.

  Next, the processing apparatus of the present invention is based on the premise that the workpiece of the present invention (Claim 1) is disposed in an opening of an annular frame and supported by the frame via an adhesive tape. And it is characterized by including the holding table of Claim 1 with which the flame | frame holding | maintenance part which hold | maintains this flame | frame was attached, and the processing means which processes the workpiece | work hold | maintained at this holding table.

  The processing apparatus of the present invention includes a form in which a defect portion is formed at a location corresponding to the corner portion holding portion of the rectangular workpiece holding region on the inner peripheral edge of the frame. Moreover, as a processing means of the processing apparatus of this invention, the cutting means which cuts a workpiece | work with a rotary blade is mentioned.

  The work referred to in the present invention is not particularly limited. For example, an adhesive member such as a semiconductor wafer such as a silicon wafer or a DAF (Die Attach Film) provided on the back surface of a semiconductor wafer for chip mounting as a circular one. Or a sapphire substrate. In addition, the rectangular shape includes semiconductor product packages, ceramic and glass substrates, various electronic components, various drivers such as LCD drivers for controlling and driving liquid crystal display devices, and various micron-order precisions are required. Examples include processed materials.

  According to the holding table of the present invention, it is possible to hold both a circular workpiece and a rectangular workpiece. For this reason, it is necessary to replace each time a circular workpiece or a rectangular workpiece is held. As a result, there is an effect that the efficiency of the work and the speeding up of the process can be improved because the replacement work can be omitted.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
FIG. 1 shows a cutting apparatus 10 according to an embodiment. The cutting apparatus 10 performs, for example, a thin plate-shaped workpiece having a thickness of about 1 mm or less than 1 mm in thickness by automatic control, and the workpiece is divided into a number of rectangular pieces (for example, chips and devices). It is a dicing apparatus for dicing.

(1) Workpieces First, work pieces will be explained. In the cutting device 10 of the present embodiment, both the circular workpiece 1A shown in FIG. 2A and the rectangular workpiece 1B shown in FIG. An example of the circular workpiece 1A is a semiconductor wafer such as a silicon wafer. On the other hand, examples of the rectangular workpiece 1B include a semiconductor product package and a substrate made of ceramic or glass. The length of the rectangular workpiece 1B is slightly longer than the diameter of the circular workpiece 1A, and the aspect ratio (length on the short side / length on the long side) is, for example, about 1/2 to 1/4. Is.

  In the circular workpiece 1A and the rectangular workpiece 1B, the division lines 2 are set in a lattice shape, and thereby a large number of rectangular pieces 3 are partitioned. The workpieces 1 </ b> A and 1 </ b> B are divided into a large number of pieces 3 by cutting all the planned division lines 2 by the cutting device 10. In the following description, when it is not necessary to distinguish the circular workpiece 1A from the rectangular workpiece 1B, the workpiece is collectively referred to as the workpiece 1.

  In this case, the cutting (dicing) performed by the cutting apparatus 10 includes a process of cutting from the surface to the middle of the thickness to form a groove, in addition to a full cut that penetrates the thickness completely. When the groove is formed, the workpiece 1 is divided into a large number of pieces 3 by further cutting the remaining thickness portion of the groove with a cutting blade in the subsequent process or by applying stress to cleave it. .

  When the workpiece 1A or the workpiece 1B is supplied to the cutting apparatus 10, as shown in FIGS. 2 (a) and 2 (b), the workpiece 1A or the workpiece 1B is disposed in the opening 4a of the annular frame 4. It is in a state of being supported via the tape 5. The frame 4 has rigidity made of a plate material such as metal. The pressure-sensitive adhesive tape 5 has one surface that is a pressure-sensitive adhesive surface, and the frame 4 and the workpieces 1A and 1B are attached to the pressure-sensitive adhesive surface.

(2) Cutting Device (2-1) Configuration of Cutting Device Next, the cutting device 10 shown in FIG. 1 will be described. This cutting apparatus 10 is for cutting the workpiece 1 with a cutting blade 62 rotated at a high speed, and is of a biaxially opposed type in which a pair of cutting blades 62 are arranged to face each other. Reference numeral 11 in FIG. 1 is a base frame, and a portal column 12 is fixed to the base frame 11. A pair of X-axis guides 21 extending in the horizontal X direction are provided at the center of the base frame 11, and an X-axis slider 22 is slidably attached to these X-axis guides 21. The X-axis slider 22 is reciprocated along the X-axis guide 21 by a ball screw feed mechanism 24 operated by an X-axis feed motor 23. On the X-axis slider 22, a negative pressure chuck type chuck table (holding table) 30 is provided through the table base 25 to attract and hold the workpiece by negative pressure action.

  The chuck table 30 has a substantially disc shape, and is supported by the table base 25 so as to be rotatable about the Z direction (vertical direction) as a rotation axis. The table base 25 is provided with a rotation drive mechanism for rotating the chuck table 30 (not shown). As shown in FIGS. 3 and 4, the chuck table 30 includes a disk-shaped frame body 31 made of stainless steel and the like, and a disk-shaped porous body 32 fixed to the upper surface of the frame body 31. Yes. On most of the upper surface of the frame 31, a recess 31b is formed concentrically leaving the outer peripheral edge 31a, and the porous body 32 is fitted and fixed to the recess 31b. The upper surface of the porous body 32 is flush with the upper surface of the outer peripheral edge portion 31 a of the frame 31, and the upper surface of the porous body 32 is configured as a holding surface 32 a that sucks and holds the workpiece 1.

  When the operation for generating the negative pressure is performed, the chuck table 30 sucks the air above the porous body 32 to generate the negative pressure, and the workpiece 1 supported by the frame 4 as described above. Is mounted on the chuck table 30 in which the operation of generating negative pressure is performed, and at the same time, is adsorbed and held on the holding surface 32 a of the porous body 32. Around the chuck table 30, a plurality of clamps (frame holding portions) 39 for detachably holding the frame 4 are disposed. These clamps 39 are attached to the frame body 31. At the same time that the workpiece 1 is held on the chuck table 30, the frame 4 is gripped and held by the clamp 39.

  FIG. 5 shows a state in which the workpiece 1 is held on the chuck table 30 and the frame 4 is held on the clamp 39. As shown in the figure, the clamp 39 is disposed so that the upper surface of the clamp 39 is equal to or lower than the holding surface 32a of the chuck table 30 in a state where the frame 4 is gripped. Accordingly, the frame 4 is pulled down below the holding surface 32a, whereby the outer portion of the adhesive tape 5 outside the chuck table 30 in the annular portion 5a between the work 1 and the frame 4 is lowered downward toward the outer peripheral side. It is in a state of being pulled at an angle. The so-called “frame pull-down” by the clamp 39 is performed in order to prevent the cutting blade 62 from interfering with the clamp 39 when the workpiece is cut by the cutting blade 62 as will be described later.

  As shown in FIG. 3, the holding surface 32a of the porous body 32 in the chuck table 30 of the present embodiment is not a circular shape with a simple plan view, and the circular workpiece 1A matches and holds the workpiece 1A. A circular workpiece holding region 33 (shown by a chain line) and a rectangular workpiece holding region 35 (shown by a two-dot chain line) that holds the workpiece 1B when the rectangular workpiece 1B is coincident with each other are concentrically overlapped with each other. It has become. In other words, the holding surface 32a matches the outer shape of the workpieces 1A and 1B that are overlapped with the centers thereof matching. The diameter of the circular workpiece holding region 33 is substantially the same as the diameter of the circular workpiece 1A.

  Both ends in the longitudinal direction of the rectangular work holding area 35 protrude from the circular work holding area 33, and a pair of corner holding parts 36 a are formed in each protruding part 36. The four corner portions of the rectangular workpiece 1B are respectively held by these corner portion holding portions 36a. The outer peripheral edge 31a of the frame 31 has a shape along the outer shape of the holding surface 32a, and is formed with a constant width.

  As shown in FIG. 3, the frame 4 is arranged concentrically around the chuck table 30 in a state where the workpiece 1 is held by the chuck table 30. On the inner peripheral edge of the frame 4, a rectangular triangular missing part 4 b corresponding to the corner holding part 36 a is formed at a position that hits the radial direction from the four corner holding parts 36 a of the rectangular work holding area 35.

  According to the chuck table 30, the circular workpiece 1A is held by being overlapped with the circular workpiece holding region 33 of the holding surface 32a, and the rectangular workpiece 1B is overlapped by the rectangular workpiece holding region 35 of the holding surface 32a. Held. The workpiece 1A (1B) held on the chuck table 30 in this way is reciprocated in the X direction along with the movement of the X-axis slider 22 together with the chuck table 30.

  Next, as shown in FIG. 1, the portal column 12 is horizontally stretched between a pair of leg portions 12 a arranged in the Y direction across the X-axis guide 21 and the upper end portions of the leg portions 12 a. And a beam portion 12b. A pair of upper and lower Y-axis guides 13 extending in the Y direction are provided on the surface of the beam portion 12b. A first Y-axis slider 41 and a second Y-axis slider 51 are slidably attached to the Y-axis guides 13, respectively. It has been. The first Y-axis slider 41 is reciprocated along the Y-axis guide 13 by a first Y-axis ball screw feed mechanism 43 operated by a first Y-axis feed motor (not shown). The second Y-axis slider 51 is reciprocated along the Y-axis guide 13 by a second Y-axis ball screw feed mechanism 53 that is operated by a second Y-axis feed motor 52.

  The first Y-axis slider 41 and the second Y-axis slider 51 are each provided with a pair of Z-axis guides 14 extending in the Z direction. The first Z-axis guide 44 of the first Y-axis slider 41 has a first Z-axis slider 44. A second Z-axis slider 54 is slidably attached to the Z-axis guide 14 of the second Y-axis slider 51. The first Z-axis slider 44 is moved up and down along the Z-axis guide 14 by a first Z-axis ball screw feed mechanism (not shown) operated by a first Z-axis feed motor 45. The second Z-axis slider 54 is moved up and down along the Z-axis guide 14 by a second Z-axis ball screw feed mechanism (not shown) operated by the second Z-axis feed motor 55.

  A first cutting spindle (machining means, cutting means) 47 is fixed to a lower end portion of the first Z-axis slider 44 via a first bracket 46, and a second bracket is attached to the lower end portion of the second Z-axis slider 54. A second cutting spindle 57 (processing means, cutting means) 57 is fixed via 56. Each of the cutting spindles 47 and 57 has the same configuration, and a spindle shaft (not shown) that is rotationally driven by a servo motor or the like is accommodated in a rectangular parallelepiped housing 61, and the tip of the spindle shaft that protrudes from the tip opening of the housing 61. In addition, a disc-shaped cutting blade 62 is mounted. As the cutting blade 62, one corresponding to the workpiece 1 is used. For example, a blade in which diamond abrasive grains are fixed to the periphery of a disk-shaped substrate is used.

  In each of the cutting spindles 47 and 57, the housing 61 is fixed to the lower ends of the brackets 46 and 56 so that the spindle shafts are parallel to the Y direction and coaxial with each other, and the cutting blades 62 face each other. The cutting spindles 47 and 57 are moved in the Y direction integrally with the Y-axis sliders 41 and 51, respectively, and are moved toward and away from each other in the Y direction.

  The cutting blade 62 cuts into the workpiece 1 held on the chuck table 30 and performs a cutting process. In this cutting apparatus 10, since the spindle shaft, which is the rotation axis of the cutting blade 62, runs along the Y direction, the machining feed direction in which the cutting blade 62 cuts into the workpiece 1 and proceeds with cutting is the X direction, and is divided. The indexing direction for positioning the cutting blade 62 on the planned line 2 is the Y direction. Accordingly, the machining feed is performed by moving the chuck table 30 in the X direction and moving the workpiece 1 in the X direction relative to the cutting blade 62. Further, the indexing is performed by moving the cutting blade 62 in the Y direction by the Y-axis sliders 41 and 51.

  The cutting blade 62 is covered with a blade cover 63, and the blade cover 63 is provided with a nozzle for supplying cutting water to the cutting blade 62 and a cutting point. The cutting water is supplied for the purpose of cooling, lubrication, cleaning of processing points, and the like, and the scattering of the cutting water is suppressed by the blade cover 63. Although not shown in FIG. 1, cutting scraps and cutting water generated during the cutting process around the chuck table 30 are the X-axis guide 21, the X-axis slider 22, the X-axis feed motor 23, and the ball. A waterproof cover is provided to prevent the screw feed mechanism 24 from falling.

(2-2) Operation of Cutting Device The above is the overall configuration of the cutting device 10 according to an embodiment, and next, an operation example in which the workpiece 1 is diced into a large number of pieces by the cutting device 10 will be described. To do.

  First, the work 1 supported by the frame 4 via the adhesive tape 5 is attracted and held by the chuck table 30. In this embodiment, as described above, the circular work 1A and the rectangle shown in FIG. Any of the shaped workpieces 1B can be held on the chuck table 30.

  In order to hold the circular workpiece 1A on the chuck table 30, the workpiece 1A is overlapped with the circular workpiece holding area 33 of the holding surface 32a. Further, in order to hold the rectangular workpiece 1B on the chuck table 30, the four corners of the workpiece 1B are respectively matched with the four corner holding portions 36a of the rectangular workpiece holding region 35 of the holding surface 32a, and The whole is overlapped with the rectangular work holding area 35. As a result, the workpiece 1A (1B) is adsorbed and held on the porous body 32 of the chuck table 30 that has been previously operated to generate a negative pressure. The workpiece 1A (1B) is held by the chuck table 30, and at the same time, the frame 4 is held and held by the clamp 39.

  When the workpiece 1 is held on the chuck table 30, the chuck table 30 moves and the workpiece 1 is conveyed to a machining position corresponding to a position below each of the cutting spindles 47 and 57. At this machining position, the workpiece 1 is cut by the cutting blade 62 and diced into a large number of pieces 3.

  Prior to cutting, a setup for recognizing the distance between the chuck table 30 and each cutting blade 62 is performed. In the setup, the cutting spindles 47 and 57 are lowered to bring the cutting edges of the cutting blades 62 into contact with the outer peripheral edge 31a of the frame body 31, and the height position at this time is set as the reference height of the cutting spindles 47 and 57. The position. Each of the cutting spindles 47 and 57 is controlled in the amount of cutting into the workpiece 1 based on the distance from the reference height position.

  As a method of efficiently cutting the workpiece 1, there is a method of simultaneously cutting the two scheduled division lines 2 by one machining feed in the X direction. In this method, first, the Z-direction positions of the first and second cutting spindles 47 and 57 are made the same, and the distance between the cutting blades 62 that are coaxially opposed to each other is set in the workpiece 1. It is set to a distance corresponding to two parallel scheduled division lines 2 of the grid-like divided division lines 2 and having a minimum interval. The minimum interval between the cutting blades 62 is, for example, an interval between a plurality of pieces 3 of about 3 or 4 pieces. Hereinafter, the description will be continued on the assumption that the cutting is performed by cutting from the surface of the workpiece 1 to a predetermined depth to form a groove.

  The cutting spindles 47 and 57 are lowered while maintaining the above state, and the position of the cutting blade 62 in the Z direction is positioned at a position where the blade edge cuts into the workpiece 1 held on the chuck table 30 by a predetermined depth. Next, from the state where each cutting blade 62 is rotated, the X-axis slider 22 is moved in the X direction to feed the work, and each cutting blade 62 is cut into the division line 2 of the workpiece 1 on the chuck table 30. , Forming a groove. In order to position the cutting blade 62 on the scheduled division line 2, a known alignment means using a camera or the like is used.

  When grooves are formed in the first two X-direction division lines 2, the respective cutting spindles 47 and 57 are raised to return the chuck table 30 to the starting point of the machining feed, and then the next two divisions. In order to form a groove in the planned line 2, index feeding is performed in which the cutting spindles 47 and 57 are moved in the Y direction by the length of the interval between the planned divided lines 2. Next, after lowering each of the cutting spindles 47 and 57 to the machining height position, the chuck table 30 is moved in the machining feed direction, and a groove is formed in the planned dividing line 2 adjacent to the two previously scheduled divided lines 2. Form.

  By repeating the above-described machining feed by reciprocation in the X direction, returning to the machining start point, and index feeding in the Y direction, all the division lines 2 extending in the X direction are cut. Subsequently, the chuck table 30 is rotated by 90 °, and the uncut division planned line 2 that has been extended in the Y direction so far is switched again to be parallel to the X direction. And the groove | channel is formed in all the division | segmentation scheduled lines 2 extended in a X direction by repeating the said procedure. As a result, grooves are formed in all of the plurality of grid-like division lines 2. Thereafter, the workpiece 1 is divided into a large number of pieces 3 by cutting the remaining thickness of the groove with another cutting blade or by applying stress to cleave it. A large number of the divided pieces 3 remain attached to the adhesive tape 5 and the form as the workpiece 1 is maintained. Thereafter, the pieces 3 are transferred to the pick-up process and taken out individually. It is.

(3) Effects of Chuck Table 30 According to the chuck table 30 of the present embodiment, the circular workpiece holding area 33 in which the circular workpiece 1A is matched to the holding surface 32a of the porous body 32 and is sucked and held, and A rectangular work holding area 35 where the rectangular work 1B matches and is sucked and held is formed concentrically. Therefore, either the workpiece 1A or the workpiece 1B can be held on the chuck table 30. That is, when the workpiece to be processed is changed from the workpiece 1A to the workpiece 1B or when the workpiece 1B is changed to the workpiece 1A, it is not necessary to replace the chuck table 30. Since the chuck table 30 does not need to be replaced, there is no need to perform complicated setup operations. As a result, it is possible to increase the efficiency of the work and speed up the processing. Further, it is not necessary to prepare a chuck table corresponding to each of the workpiece 1A and the workpiece 1B, and the parts can be shared.

  In addition, since the inner peripheral edge of the frame 4 is formed with the missing portions 4b corresponding to the four corner holding portions 36a of the rectangular work holding region 35, the adhesive tape 5 can be separated from each corner holding portion 36a. The shortest distance to the frame 4 can be increased. For this reason, the above-described “frame pull-down” when the frame 4 is held by the clamp 39 can be performed also at a portion corresponding to the corner holding portion 36 a close to the frame 4. This is because by extending the shortest distance from each corner holding portion 36 a to the frame 4, it is possible to secure the tape expansion width corresponding to the “frame withdrawal”.

  As described above, both the circular workpiece 1A and the rectangular workpiece 1B can be held within the range of the inner diameter of the frame 4, and the distance between the chuck table 30 and the inner peripheral edge of the frame 4 can be set as described above. In order to make the length such that “drawing” is possible, a chuck table in which the circular work holding area 33 and the rectangular work holding area 35 are overlapped as in the present embodiment is effective. Further, it is particularly preferable to form the missing portions 4b on the inner peripheral edge of the frame 4 corresponding to the four corner holding portions 36a of the rectangular workpiece holding region 35, because the above-mentioned “frame pulling down” can be performed more reliably. It is valid.

(4) Modified Example of Chuck Table FIG. 6 shows a modified example of the chuck table 30. The holding surface 32a of the porous body 32 in the chuck table 30 includes the circular work holding area 33 (shown by a chain line) and a square work holding area 37 (a square work holding area 37 (not shown) is held in alignment. Are formed concentrically with the circular work holding region 33.

  The length of one side of the square workpiece holding region 37 is shorter than the diameter of the circular workpiece holding region 33, and four corner holding portions 37 a that respectively match the four corners of the square workpiece protrude from the circular workpiece holding region 33. Is formed. These corner | angular part holding | maintenance parts 37a are arrange | positioned at equal intervals in the circumferential direction. And the location which hits the radial direction from the four corner | angular part holding parts 37a of the square workpiece holding | maintenance area | region 37 of the inner periphery of the flame | frame 4 which supports the workpiece | work 1 hold | maintained at this chuck table 30 respond | corresponds to the corner | angular part holding part 37a. The right-angled triangular defect 4b is formed.

  According to the chuck table 30, the circular workpiece 1A is attracted and held in alignment with the circular workpiece holding region 33 of the holding surface 32a. Further, the rectangular work 1B is attracted and held by matching the four corners with the four corner holding parts 37a and the square work holding area 37 as a whole.

  The chuck table 30 of the above embodiment uses the porous body 32 and sucks and holds the workpiece by a negative pressure action. However, the chuck table of the present invention is limited with respect to means for sucking and holding the workpiece. Not done. For example, using a solid material such as stainless steel, a chuck table that forms a large number of holes and grooves on the work holding surface and sucks the air in the holes and grooves to generate a negative pressure for chucking Also, the present invention can be applied. The principle of adsorption may not be negative pressure, and may be a chuck table using electromagnetic adsorption or electrostatic adsorption. Moreover, as a processing means, you may use things other than a cutting blade, for example, the laser processing means etc. which irradiate a laser beam etc. are mentioned.

It is a perspective view of the cutting device concerning one embodiment of the present invention. It is a perspective view which shows the state by which the workpiece | work to which cutting is given was supported by the flame | frame via the adhesive tape, Comprising: (a) A workpiece | work is circular shape, (b) is a workpiece | work rectangular shape. It is a top view which shows the chuck table with which the cutting device of one Embodiment is provided, and a flame | frame. It is sectional drawing of the chuck table of one Embodiment. It is sectional drawing which shows the state which hold | maintained the workpiece | work on the chuck table of one Embodiment. It is a top view which shows the modification of the chuck table of one Embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Work 1A ... Circular work 1B ... Rectangular work 4 ... Frame 4a ... Frame opening 5 ... Adhesive tape 10 ... Cutting device 30 ... Chuck table (holding table)
32a ... holding surface 33 ... circular work holding area 35 ... rectangular work holding area 36a, 37a ... corner holding part 37 ... square work holding area 39 ... clamp (frame holding part)
47, 57 ... Cutting spindle (processing means, cutting means)
62 ... Cutting blade

Claims (4)

A holding table having a holding surface for sucking and holding a workpiece,
The holding surface is
A circular workpiece holding area for holding a circular workpiece;
A rectangular work holding area for holding a rectangular work having four corners,
The rectangular work holding area is characterized in that four corner holding parts that hold the four corners of the rectangular work in alignment with each other protrude from the circular work holding area. Holding table. The workpiece is disposed in an opening of an annular frame, and is supported on the frame via an adhesive tape,
The holding table according to claim 1, further comprising a frame holding unit for holding the frame;
Processing means for processing the workpiece held on the holding table;
The processing apparatus characterized by including at least.   The processing apparatus according to claim 2, wherein a defect portion is formed at a position corresponding to the corner portion holding portion of the rectangular workpiece holding region on the inner peripheral edge of the frame.   The processing apparatus according to claim 2, wherein the processing unit is a cutting unit that cuts the workpiece with a rotating blade.

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