JP2015076561A - Dividing method for circular plate-shaped objects - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent scattering of chips during cutting work without entailing extra cost or man-hours.SOLUTION: A dividing method for a circular plate-shaped object (W) comprises: positioning first planned division lines (51) in the cutting feed direction and cutting-feeding the circular plate-shaped object from one end to just before the other end relative to each first planned division line in a half surface size area (57A) resulting from bisecting in a first direction; turning the circular plate-shaped 180° and cutting-feeding it from one end to just before the other end relative to each first planned division line in the remaining half surface size area (57B); positioning second planned division lines (52) in the cutting feed direction and cutting-feeding the circular plate-shaped from one end to just before the other end relative to each second planned division line in a half surface size area (57C) resulting from bisecting in a second direction; and turning the circular plate-shaped turned 180° and cutting-feeding it from one end to just before the other end relative to each second planned division line in the remaining half surface size area (57D).

Description

  The present invention relates to a method for dividing a circular plate-shaped object in which a circular plate-shaped object is cut with a cutting blade along divided intersecting lines and divided into individual chips.

  In the field of manufacturing precision parts, semiconductor wafers, optical device wafers, circular plates such as glass and various ceramics may be divided into individual rectangular chips. When dividing a circular plate-shaped object, a dicing tape is usually stuck to one side of the circular plate-shaped object, and the dicing tape is cut with a cutting blade outside the outer peripheral edge of the circular plate-shaped object. Then, with the dicing tape cut with the cutting blade, the cutting blade is relatively moved along the line where the circular plate is to be divided, so that the circular plate is fully cut and divided into individual rectangular chips. doing.

  By the way, in order to take out a rectangular chip from the circular plate-like object, an end material chip that does not become a triangular or trapezoidal rectangle is generated in the vicinity of the outer peripheral edge of the circular plate-like object. The edge chip has a smaller area than the rectangular chip, and the outer peripheral edge of the circular plate is chamfered, and the adhesive force of the edge chip to the dicing tape is weak. There is a possibility that the material chip peels off and so-called chip jump occurs. In view of this, a dicing tape has been proposed in which an annular adhesion strengthening region in which the adhesion force to the outer peripheral edge of a circular plate-shaped object is reinforced is provided (for example, see Patent Document 1).

JP2013-21109A

  However, since the dicing tape proposed in Patent Document 1 has a special specification, the cost is high, and it is necessary to align the outer peripheral edge of the circular plate-like object with the annular adhesion strengthening region of the dicing tape. There is a problem that increases. Further, even with such a dicing tape, there is a possibility that chip jumping cannot be prevented depending on the size of a triangular or trapezoidal end material chip.

  The present invention has been made in view of these points, and an object of the present invention is to provide a method for dividing a circular plate-like object that can prevent the occurrence of chip skipping at the time of cutting without cost and man-hours.

  A method for dividing a circular plate-like object according to the present invention includes a plurality of first division lines that are attached to a frame via a tape and extend in a first direction, and a second direction that intersects the first direction. A plurality of second division planned lines to be extended are set, a chip area having a plurality of chips partitioned by the first division planned line and the second division planned line, and an outer periphery surrounding the chip area A method for dividing a circular plate-like object, in which a plurality of chips are formed by cutting the first scheduled division line and the second scheduled division line of a circular plate-like object having a surplus region with a cutting blade. The circular plate-like object is positioned so that the first direction is the cutting feed direction, and the circular plate-like object and the cutting blade are moved relative to each other in the cutting feed direction; The circular plate-like object and the cutting blur corresponding to the interval between the division lines. A plurality of first division lines are cut in a half-surface region from one side edge to the center of the circular plate-like object by sequentially repeating index feed that moves relative to the index feed direction orthogonal to the cutting feed direction. The first cutting step, and after performing the first cutting step, the circular plate-like object is rotated by 180 ° and positioned so that the first direction is the cutting feed direction, A cutting feed that moves the workpiece and the cutting blade relative to the cutting feed direction, and the circular plate-like product and the cutting blade relative to the index feed direction corresponding to the interval between the first division lines. A second cutting step of cutting a plurality of first division lines for a half-surface region from the center of the circular plate-like object in the first direction to the other side edge by sequentially repeating the indexing and moving; After performing the second cutting step, Positioning so that the second direction is the cutting feed direction, the distance between the cutting feed for moving the circular plate-like object and the cutting blade relative to the cutting feed direction, and the second scheduled dividing line The half plate from one side edge to the center of the circular plate-like material in the second direction by sequentially repeating the circular plate-like material and the indexing feed that relatively moves the cutting blade in the indexing feed direction. A third cutting step of cutting a plurality of second division lines for the region, and after performing the third cutting step, the circular plate-like object is rotated by 180 ° so that the second direction is the cutting direction. The circular plate-like material is positioned so as to be in the feed direction, and the circular plate-like object and the cutting blade move relative to the cutting feed direction, and the circular plate-like shape corresponds to the interval between the second divided lines. Move the object and the cutting blade relative to each other in the indexing feed direction A fourth cutting step of cutting a plurality of second division lines in a half-surface region from the center of the circular plate-like object in the second direction to the other side edge by sequentially repeating the indexing and feeding; The blade is cut from the outside of the outer peripheral edge of the circular plate-shaped object, and the cutting blade forms an uncut area without cutting the outer peripheral excess area of the circular plate-shaped object on the cutting end side.

  According to this configuration, in the first cutting process, the first division line is cut from the outside of the outer peripheral edge in the half surface area on one side obtained by dividing the circular plate-like object in the first direction, and the second cutting process. Then, in the remaining half surface area, the first division line is cut from the opposite direction to the first cutting step. Further, in the third cutting step, the second division line is cut from the outside of the outer peripheral edge in the half surface region on one side divided in the second direction of the circular plate-like object, and in the fourth cutting step, the remaining part In the half surface area, the second division line is cut from the opposite direction to the third cutting step. Further, in the first to fourth cutting processes, the outer peripheral surplus area of the circular plate-like object is not cut and an uncut area is formed on the end side of the cutting feed. For this reason, the cutting grooves along the first and second scheduled division lines do not intersect in the outer peripheral surplus area which is the formation area of the triangular or trapezoidal end material chips. Therefore, triangular or trapezoidal end material chips can be reduced in the outer peripheral surplus area of the circular plate-like object, and the occurrence of chip jump can be prevented without incurring costs and man-hours.

  According to the present invention, cutting blades are fed to the circular plate-shaped object so that the cutting grooves along the first and second division lines do not intersect at the outer peripheral surplus area, thereby increasing costs and man-hours. Therefore, it is possible to prevent the occurrence of chip skipping.

It is a perspective view of the cutting device concerning this embodiment. It is an upper surface schematic diagram of the circular plate-shaped object which concerns on this Embodiment. It is explanatory drawing of the 1st-4th cutting process which concerns on this Embodiment.

  Hereinafter, with reference to the accompanying drawings, a method for dividing a circular plate-like object according to the present embodiment will be described. FIG. 1 is a perspective view of a cutting apparatus according to the present embodiment. FIG. 2 is a schematic top view of the circular plate-like object according to the present embodiment. In addition, the cutting device used with the division | segmentation method of the circular plate-shaped object concerning this Embodiment is not limited to the structure shown in FIG. For example, the present invention can be applied to a cutting device including a pair of cutting blades.

  As shown in FIG. 1, the cutting apparatus 1 is configured to divide the circular plate-like object W into individual chips by moving the cutting blade 45 relative to the circular plate-like object W. As shown in FIG. 2, the circular plate-like object W includes a first division planned line 51 extending in the first direction and a second division planned line 52 extending in the second direction intersecting the first direction. And is divided into a lattice pattern. The circular plate-like object W is provided with a chip region 54 where a rectangular chip is formed, and an outer peripheral surplus region 55 surrounding the chip region 54. Various devices D are formed in the chip region 54.

  A dicing tape (tape) T is attached to the back surface of the circular plate-like object W, and an annular frame F is attached to the outer periphery of the dicing tape T. As described above, the circular plate-like object W is carried into the cutting apparatus 1 while being supported by the frame F via the dicing tape T. The circular plate W may be a semiconductor wafer in which a device such as IC or LSI is formed on a semiconductor substrate such as silicon or gallium arsenide, or an optical device such as an LED on a ceramic, glass or sapphire inorganic material substrate. An optical device circular plate-like material on which is formed may be used.

  Returning to FIG. 1, a chuck table moving mechanism 13 for moving the chuck table 12 in the X-axis direction is provided on the base 11 of the cutting apparatus 1. The chuck table moving mechanism 13 includes a pair of guide rails 21 arranged on the base 11 and parallel to the X-axis direction, and a motor-driven X-axis table 22 slidably installed on the pair of guide rails 21. doing. A chuck table 12 is provided on the X-axis table 22. A nut portion (not shown) is formed on the back side of the X-axis table 22, and a ball screw 23 is screwed to the nut portion. Then, when the drive motor 24 connected to one end of the ball screw 23 is rotationally driven, the chuck table 12 is moved along the guide rail 21 in the X-axis direction.

  The chuck table 12 is formed in a disc shape, and is rotatably provided on the upper surface of the X-axis table 22 via the θ table 25. On the upper surface of the chuck table 12, a holding surface 28 is formed of a porous ceramic material. The holding surface 28 is connected to a suction source (not shown) through a flow path in the chuck table 12, and the circular plate-like object W is sucked and held by the negative pressure generated on the holding surface 28. Four clamp portions 29 are provided around the chuck table 12 via a pair of support arms. Each clamp part 29 is driven by an air actuator (not shown), whereby the frame F around the circular plate-like object W is clamped and fixed from four directions.

  On the base 11 of the cutting apparatus 1, a blade unit moving mechanism 14 that moves the blade unit 15 in the Y-axis direction and the Z-axis direction above the chuck table 12 is provided. The blade unit moving mechanism 14 has a pair of guide rails 31 arranged on the base 11 and parallel to the Y-axis direction, and a motor-driven Y-axis table 32 slidably installed on the pair of guide rails 31. doing. The Y-axis table 32 is formed in a rectangular shape when viewed from above, and a side wall 33 is erected at one end in the X-axis direction.

  The blade unit moving mechanism 14 includes a pair of guide rails 34 (only one is shown) installed on the wall surface of the side wall portion 33 and parallel to the Z-axis direction, and a Z that is slidably installed on the pair of guide rails 34. A shaft table 35 is provided. A spindle unit 36 extending in the Y-axis direction toward the chuck table 12 is supported by the Z-axis table 35 in a cantilever manner. Further, nut portions (not shown) are formed on the back sides of the Y-axis table 32 and the Z-axis table 35, and ball screws 37 and 38 are screwed to these nut portions. The drive motors 41 and 42 connected to one end portions of the ball screws 37 and 38 are rotationally driven, whereby the blade unit 15 is moved along the guide rails 31 and 34 in the Y-axis direction and the Z-axis direction.

  The cutting blade 45 of the blade unit 15 is provided at the tip of a spindle shaft (not shown) of the spindle unit 36. The cutting blade 45 is constituted by a resin blade in which diamond abrasive grains are hardened with a resin bond to form a circle. The cutting blade 45 is covered with a blade cover 46, and the blade cover 46 is provided with an injection nozzle 47 for injecting cutting water toward the cutting portion. The blade unit 15 rotates the cutting blade 45 at high speed, and cuts the circular plate-like object W while spraying cutting water from a plurality of spray nozzles 47 onto the cutting portion.

  The cutting apparatus 1 configured as described above is loaded with the circular plate-like object W with the dicing tape T, and the first to fourth cutting steps are performed on the circular plate-like object W. In the first cutting step, half of the first scheduled dividing lines 51 are cut in the half surface region 57A obtained by dividing the circular plate-like object W in the first direction (see FIG. 3A). In the second cutting step, the remaining half of the first division planned line 51 is cut in the remaining half surface region 57B obtained by rotating the circular plate W by 180 ° (see FIG. 3B). On the end side of the cutting feed in the first and second cutting steps, cutting is performed so that the outer peripheral surplus region 55 of the circular plate-like object W is left. Also in the third and fourth cutting steps, the outer peripheral surplus region 55 is left in the half surface regions 57C and 57D obtained by dividing the circular plate-like object W in the second direction in the same manner as in the first and second cutting steps. The 2nd division | segmentation scheduled line 52 is cut (refer FIG. 3C and D).

  Hereinafter, with reference to FIG. 3, the division | segmentation method of a circular plate-shaped object is demonstrated concretely. FIG. 3 is an explanatory diagram of the first to fourth cutting steps according to the present embodiment. 3A shows an example of the first cutting process, FIG. 3B shows an example of the second cutting process, FIG. 3C shows an example of the third cutting process, and FIG. 3D shows an example of the fourth cutting process. In FIG. 3, the solid arrow indicates the cutting feed in the current process, and the broken arrow indicates the cutting feed in the previous process. In the first to fourth cutting steps, the cutting order is not particularly limited, and can be changed as appropriate.

  As shown in FIG. 3A, in the first cutting step, the chuck table 12 (see FIG. 1) so that the first direction in which the first division planned line 51 extends becomes the cutting feed direction (X-axis direction). The upper circular plate W is positioned at the reference position (0 ° position). The cutting blade 45 is aligned with the first scheduled dividing line 51 in a state where the cutting blade 45 is positioned outside the outer peripheral edge of the circular plate-like object W. Then, the dicing tape T is cut by the cutting blade 45 outside the circular plate-like object W while the cutting water is jetted from the jet nozzle 47 (see FIG. 1). When the dicing tape T is cut to a predetermined depth by the cutting blade 45, the chuck table 12 (see FIG. 1) is cut and fed to the cutting blade 45 in the X-axis direction.

  At this time, the cutting blade 45 is cut from the outside of the outer peripheral edge of the circular plate-like object W by the cutting blade 45 at the start side (one end 61 side), and the circular plate-like shape at the end side of the cutting feed (the other end 62 side). The cutting blade 45 rises in front of the outer edge of the object W and is separated from the circular plate-like object W. In this way, the first dividing line 51 is cut from the one end 61 to the front of the other end 62 by the cutting blade 45. When one first scheduled dividing line 51 is cut, the cutting blade 45 is sent in the indexing direction (Y-axis direction) corresponding to the interval between the first scheduled dividing lines 51, and the adjacent first divided line 51 is divided. The cutting blade 45 is aligned with the planned line 51.

  This cutting feed and index feed are sequentially repeated, and the first division planned line 51 of the circular plate-like object W is cut sequentially from the one side edge 63 side. Thereby, a plurality of first division planned lines 51 in the half surface region 57A from the one side edge 63 to the center 69 of the circular plate-like object W, that is, half of the first division planned lines 51 of the circular plate-like object W are cut. Is done. In the first cutting process, cutting is sent so as to leave the other end 62 side of the first scheduled dividing line 51, so that the cutting end of the circular plate W (the other end 62 side) is not cut. Region 59A is formed.

  As shown in FIG. 3B, after the first cutting process is performed, the second cutting process is performed. In the second cutting step, the circular plate-like object W is rotated 180 ° from the reference position, and the first direction is the cutting feed direction (X-axis direction) on the chuck table 12 (see FIG. 1). The circular plate-like object W is positioned at a 1/2 rotation position (180 ° position). The cutting blade 45 is aligned with the first scheduled dividing line 51 in a state where the cutting blade 45 is positioned outside the outer peripheral edge of the circular plate-like object W. The dicing tape T is cut into the cutting blade 45 outside the circular plate W, and the chuck table 12 (see FIG. 1) is cut and fed to the cutting blade 45 in the X-axis direction.

  At this time, since the direction of the circular plate W is reversed in the first cutting process and the second cutting process, the first scheduled dividing line 51 is cut from the other end 62 side by the cutting blade 45. . On the start side (the other end 62 side) of the cutting feed, the cutting blade 45 cuts from the outside of the outer peripheral edge of the circular plate-like object W, and on the end side (one end 61 side) of the cutting feed, The cutting blade 45 rises at the outer edge and is separated from the circular plate W. In this way, the first dividing line 51 is cut from the other end 62 to the front of the one end 61 by the cutting blade 45. When one first scheduled dividing line 51 is cut, the cutting blade 45 is sent in the indexing direction (Y-axis direction), and the cutting blade 45 is aligned with the adjacent first divided scheduled line 51.

  This cutting feed and index feed are sequentially repeated, and the first division planned line 51 of the circular plate-like object W is cut sequentially from the other side edge 64 side. As a result, the plurality of first scheduled division lines 51 in the half surface region 57B from the center 69 to the other side edge 64 of the circular plate-shaped object W, that is, the remaining first divided planned lines 51 of the circular plate-shaped object W are left. Half are cut. In the second cutting process, cutting is fed so as to leave the one end 61 side of the first scheduled dividing line 51, so that the uncut region 59 </ b> B is provided on the end side (one end 61 side) of the cutting feed in the circular plate-like object W. Is formed.

  As shown in FIG. 3C, after the second cutting process is performed, the third cutting process is performed. In the third cutting step, the circular plate-like object W on the chuck table 12 (see FIG. 1) so that the second direction in which the second division line 52 extends is the cutting feed direction (X-axis direction). Is positioned at the 1/4 rotation position (90 ° position). The cutting blade 45 is aligned with the second scheduled division line 52 in a state where the cutting blade 45 is positioned outside the outer peripheral edge of the circular plate-like object W. The dicing tape T is cut into the cutting blade 45 outside the circular plate W, and the chuck table 12 (see FIG. 1) is cut and fed to the cutting blade 45 in the X-axis direction.

  At this time, the cutting blade 45 is cut from the outside of the outer peripheral edge of the circular plate-like object W by the cutting blade 45 on the start side (one end 65 side), and the circular plate is formed on the end side of the cutting feed (the other end 66 side). The cutting blade 45 rises in front of the outer edge of the object W and is separated from the circular plate-like object W. In this way, the second dividing line 52 is cut from the one end 65 to the front of the other end 66 by the cutting blade 45. When one second scheduled division line 52 is cut, the cutting blade 45 is sent in the indexing direction (Y-axis direction), and the cutting blade 45 is aligned with the adjacent second scheduled division line 52.

  This cutting feed and index feed are sequentially repeated, and the second division planned line 52 of the circular plate W is cut sequentially from the one side edge 67 side. Thus, a plurality of second scheduled division lines 52 in the half surface region 57C from the one side edge 67 to the center 69 of the circular plate-like object W, that is, half of the second scheduled division lines 52 of the circular plate-like object W are cut. Is done. In the third cutting step, cutting is fed so as to leave the other end 66 side of the second scheduled dividing line 52, so that the cutting end of the circular plate-like object W (the other end 66 side) is not cut. Region 59C is formed.

  In the uncut region 59C, the first scheduled dividing line 51 has already been cut during the first cutting process, but the second scheduled dividing line 52 is not cut in the third cutting process. Further, in the third cutting process, the second planned dividing line 52 of the uncut area 59B at the time of the second cutting process is cut. This uncut area 59B is scheduled to be divided at the first time during the second cutting process. The line 51 is not cut. For this reason, the cutting grooves along the first and second scheduled division lines 51 and 52 do not intersect in the uncut regions 59B and 59C. Therefore, triangular or trapezoidal end material chips can be reduced, and occurrence of chip jumping can be prevented.

  As shown in FIG. 3D, after the third cutting process is performed, the fourth cutting process is performed. In the fourth cutting step, the chuck plate 12 (see FIG. 1) is used so that the circular plate-like object W is rotated 180 ° from the ¼ rotation position and the second direction becomes the cutting feed direction (X-axis direction). ) The upper circular plate W is positioned at the 3/4 rotation position (270 ° position). The cutting blade 45 is aligned with the second scheduled division line 52 in a state where the cutting blade 45 is positioned outside the outer peripheral edge of the circular plate-like object W. The dicing tape T is cut into the cutting blade 45 outside the circular plate W, and the chuck table 12 (see FIG. 1) is cut and fed to the cutting blade 45 in the X-axis direction.

  At this time, since the direction of the circular plate W is reversed in the third cutting process and the fourth cutting process, the second scheduled dividing line 52 is cut from the other end 66 side by the cutting blade 45. . On the start side (the other end 66 side) of the cutting feed, the cutting blade 45 cuts from the outside of the outer peripheral edge of the circular plate-like object W, and on the end side (one end 65 side) of the cutting feed, The cutting blade 45 rises before the outer edge and is separated from the circular plate-like object W. In this way, the second scheduled dividing line 52 is cut from the other end 66 to the front of the one end 65 by the cutting blade 45. When one second scheduled division line 52 is cut, the cutting blade 45 is sent in the indexing direction (Y-axis direction), and the cutting blade 45 is aligned with the adjacent second scheduled division line 52.

  This cutting feed and index feed are sequentially repeated, and the second division line 52 of the circular plate-like object W is cut sequentially from the other side edge 68 side. As a result, a plurality of second scheduled division lines 52 in the half surface region 57D from the center 69 to the other side edge 68 of the circular plate-shaped object W, that is, the remaining second divided planned lines 52 of the circular plate-shaped object W are remaining. Half are cut. In the fourth cutting process, cutting is fed so as to leave the one end 65 side of the second division line 52, so that the uncut region 59D is provided on the end side (one end 65 side) of the cutting feed in the circular plate-like object W. Is formed.

  In the uncut region 59D, the first planned division line 51 has already been cut during the second cutting step, but the second planned division line 52 is not cut during the fourth cutting step. Further, in the fourth cutting process, the second scheduled division line 52 of the uncut area 59A at the time of the first cutting process is cut. This uncut area 59A is scheduled to be divided at the first cutting process. The line 51 is not cut. For this reason, the cutting grooves along the first and second scheduled division lines 51 and 52 do not intersect in the uncut regions 59A and 59D. Therefore, triangular or trapezoidal end material chips can be reduced, and occurrence of chip jumping can be prevented.

  By the way, if only the triangular or trapezoidal end material chips are reduced in the outer peripheral surplus area 55, a configuration in which an uncut area 59 is formed not only at the end of cutting feed but also at the start of cutting feed by chopper cutting is considered. It is done. However, in the chopper cut, the cutting blade 45 is lowered while the circular blade W is cut into the cutting blade 45 at the start of cutting feed. For this reason, if the cutting blade 45 is not lowered slowly, the cutting blade 45 and the circular plate-like object W may be damaged, and there is a problem that the processing time becomes long. On the other hand, in the present embodiment, at the start of cutting feed, the cutting blade 45 is lowered without cutting the circular plate-like object W outside the outer peripheral edge of the circular plate-like object W. For this reason, the cutting blade 45 can be lowered quickly, and the processing time can be shortened as compared with the case of performing chopper cutting.

  As described above, according to the method for dividing the circular plate-like object W according to the present embodiment, the half-plate region 57A on one side obtained by dividing the circular plate-like object W in the first direction has Cutting is performed from one end 61 to the front of the other end 62, and in the remaining half surface region 57B, cutting is performed from the other end 62 of the first scheduled dividing line 51 to the front of the one end 61. Further, in the half surface region 57C on one side which is divided into two in the second direction of the circular plate-like object W, cutting is performed from one end 65 to the front of the other end 66 of the second scheduled dividing line 52, and in the remaining half surface region 57D the second half surface region 57D Cutting is performed from the other end 66 of the planned dividing line 52 to the front of one end 65. Thus, since the outer peripheral surplus region 55 of the circular plate-like object W is not cut on the end side of the cutting feed, the first and second outer surplus regions 55, which are the formation areas of the triangular or trapezoidal end material chips, are used. Cutting grooves along the division lines 51 and 52 do not intersect. Therefore, triangular or trapezoidal end material chips can be reduced in the outer peripheral surplus region 55 of the circular plate-like object W, and the occurrence of chip jump can be prevented without incurring costs and man-hours.

  In addition, this invention is not limited to the said embodiment, It can change and implement variously. In the above-described embodiment, the size, shape, and the like illustrated in the accompanying drawings are not limited to this, and can be appropriately changed within a range in which the effect of the present invention is exhibited. In addition, various modifications can be made without departing from the scope of the object of the present invention.

  For example, in the present embodiment, the configuration in which the circular plate-like object W is divided using the single cutting blade 45 is applied as the method for dividing the circular plate-like object W. However, the present invention is not limited to this configuration. The method of dividing the circular plate W can be applied to step cutting using a pair of cutting blades 45. In this case, a normal half cut is performed with the uniaxial cutting blade 45, and a full cut is performed with the biaxial cutting blade 45 using the method of dividing the circular plate-like object W. In addition, you may make it the structure which implements a half cut using the division | segmentation method of the circular plate-shaped object W also with the cutting blade 45 of 1 axis | shaft side.

  As described above, the present invention has an effect that it is possible to prevent the occurrence of chip jumping at the time of cutting without incurring costs and man-hours. This is useful for a method for dividing a circular plate to be divided.

DESCRIPTION OF SYMBOLS 1 Cutting device 45 Cutting blade 51 1st division | segmentation planned line 52 2nd division | segmentation scheduled line 54 Tip area | region 55 Peripheral surplus area | region 57A-57D Half surface area 59A-59D Uncut area | region 61 One end of 1st division | segmentation line 62 1st 65, one end of the second scheduled line 66, the other end of the second scheduled line 63, 67 one side edge of the circular plate 64, 68 the other side edge 69 of the circular plate 69 center F Frame T Dicing tape (tape)
W Circular plate

Claims (1)

A plurality of first division lines that are attached to the frame via tape and extend in the first direction and a plurality of second division lines that extend in the second direction intersecting the first direction A circular plate-shaped object comprising: a chip area having a plurality of chips set and partitioned by the first division line and the second division line; and an outer peripheral surplus area surrounding the chip area A method for dividing a circular plate-like object, in which the first division line and the second division line are cut with a cutting blade to form a plurality of chips,
The circular plate-like object is positioned so that the first direction is the cutting feed direction, the cutting feed for moving the circular plate-like object and the cutting blade in the cutting feed direction, and the first division schedule The circular plate-like object and the indexing feed that moves the cutting blade relative to the indexing feed direction orthogonal to the cutting feed direction are sequentially repeated corresponding to the line interval, and the circular plate-like object is centered from one side edge. A first cutting step of cutting a plurality of first division planned lines with respect to the half-surface region,
After performing the first cutting step, the circular plate is rotated 180 ° so that the first direction is the cutting feed direction, and the circular plate and the cutting blade are cut into the cutting blade. The cutting feed that moves relatively in the feed direction and the index feed that moves the circular plate-like object and the cutting blade relatively in the index feed direction corresponding to the interval between the first division lines are sequentially repeated. A second cutting step of cutting a plurality of first division lines for a half-surface region from the center of the circular plate-like object to the other side edge in the first direction;
After performing the second cutting step, the cutting feed is positioned so that the second direction is the cutting feed direction, and the circular plate-like object and the cutting blade are moved relative to the cutting feed direction. And the circular feed in the second direction by sequentially repeating the circular plate-like object and the indexing feed for relatively moving the cutting blade in the index feed direction corresponding to the interval between the second division lines. A third cutting step of cutting a plurality of second scheduled division lines for a half-surface region from one side edge to the center of the plate-like object;
After performing the third cutting step, the circular plate is rotated 180 ° so that the second direction is the cutting feed direction, and the circular plate and the cutting blade are cut into the cutting blade. The cutting feed that moves relatively in the feed direction, and the index feed that moves the circular plate-like object and the cutting blade relatively in the index feed direction in accordance with the interval between the second division lines. Repeatingly, a fourth cutting step of cutting a plurality of second division lines for a half-surface region from the center of the circular plate-like object in the second direction to the other side edge;
The cutting blade is cut from the outside of the outer peripheral edge of the circular plate-shaped object, and the cutting blade forms an uncut area without cutting the outer peripheral area of the circular plate-shaped object on the cutting end side. To divide a circular plate.

Images