JP2006181700A - Cutting device and method for cutting workpiece - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent a cutting blade and workpiece from being damaged, even if an end material of the workpiece scatters during cutting by the cutting blade. <P>SOLUTION: In this cutting device, the cutting blade 43 is attachably and detachably mounted to a spindle 41. By disposing a cutting water supply nozzle 46 at a position where the end material does not scatter when the cutting blade 43 is rotated, the end material is prevented from colliding with the cutting water supply nozzle 46. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a cutting apparatus and a cutting method for performing cutting while supplying cutting water to a workpiece.

  In a semiconductor device manufacturing process, an integrated circuit such as an IC or LSI is formed in a rectangular area defined by streets formed in a lattice shape on a substantially circular wafer surface. And by cutting a street using a cutting device, it divides | segments into the device for every integrated circuit, and each device is utilized for various electronic devices.

  In a cutting device, cutting is performed by cutting a high-speed rotating cutting blade into the street and dividing into individual devices. Therefore, heat generated by friction is generated at a portion where the cutting blade and the wafer are in contact with each other, and this heat is generated. This may cause a decrease in cutting quality or wear of the cutting blade portion of the cutting blade. Therefore, in the cutting apparatus, a nozzle that ejects cutting water is provided in the vicinity of the contact portion where the cutting blade and the wafer come into contact, and the contact portion is cooled by the cutting water ejected from the nozzle. (For example, refer to Patent Document 1). The cooling of the contact portion performed in this way is also performed when cutting a plate-like object other than the semiconductor wafer. For example, when a CSP (Chip Size Package) substrate is cut vertically and horizontally and divided into individual CSPs, cutting may be performed in a state where the CSP substrate is held by a holding member for conveyance (for example, patents). Even in such a case, the contact portion between the cutting blade and the CSP substrate is cooled by the cutting water.

JP-A-6-13460 JP 2001-85449 A

  However, in order to further enhance the cooling effect, the nozzle that ejects the cutting water has a plate shape near the contact portion between the cutting blade and the workpiece, for example, in a position close enough not to contact the plate-like object in Patent Document 1. Because it is arranged parallel to the surface of the object, if the end material, especially the end material surrounding the device, scatters in the rotation direction of the cutting blade together with the cutting water by cutting with the cutting blade, the scattered end material supplies the cutting water. There is a problem that the nozzle collides with the nozzle, collides with the cutting blade and damages the cutting blade, or collides with the device and damages the device. Further, since the cutting water is directly sprayed onto the workpiece, the end material is scattered by the pressure of the spraying, and there is a problem that the cutting blade and the device are similarly damaged. In particular, as in Patent Document 2, when the plate-like object is a CSP substrate and the CSP substrate is cut while being sucked and held by a holding member for conveyance, compared to the case where it is attached to an adhesive tape. This problem becomes prominent because mill ends are easily scattered.

  Therefore, the problem to be solved by the present invention is to prevent damage to the cutting blade and the workpiece even when the end material is scattered during cutting with the cutting blade.

  A cutting apparatus according to the present invention includes at least a chuck table that holds a workpiece, and a cutting means that cuts the workpiece while supplying cutting water to the workpiece held by the chuck table. A spindle, a spindle housing that rotatably supports the spindle, a cutting blade that is detachably attached to the free end of the spindle and has a cutting edge on the outer periphery, and a cutting water supply nozzle that supplies cutting water to the cutting blade The cutting water supply nozzle is disposed on a side opposite to a side where the end material generated by the cutting is scattered by the rotation of the cutting blade, and jets cutting water to one surface of the cutting blade portion. A second injection unit that injects cutting water onto the other surface of the injection unit and the cutting blade unit, and the cutting blade unit is cut by the cutting water injected from the first injection unit and the second injection unit. cold With the cutting water is supplied to the contact portion between the blade portion and the workpiece cut by the accompanying rotation of the cutting water by the rotation of the cutting blade. The workpiece includes a substantially circular semiconductor wafer, a rectangular CSP substrate, and the like, but the shape and material are not limited, and may be a glass substrate, for example.

  It is desirable that the cutting water supply nozzle is disposed at a retracted position that does not get in the way when the cutting blade is attached to and detached from the spindle. Moreover, it is desirable that the first injection unit and the second injection unit are disposed so as to inject cutting water into a region of 1/8 to 1/4 of the cutting blade part.

  A workpiece cutting method according to the present invention relates to a method of cutting a workpiece held on a chuck table with a cutting blade that rotates using the above-described cutting apparatus, and includes a first injection unit and a second injection unit. The cutting water is sprayed from the jet section of the nozzle to cool the cutting blade section of the cutting blade, and the cutting water is supplied to the contact portion between the cutting blade section and the workpiece by the accompanying rotation of the cutting blade. It is characterized by.

  In this cutting method, it is desirable that the first injection unit and the second injection unit supply cutting water to a region of 1/8 to 1/4 of the cutting blade part. As the workpiece, for example, there is a CSP substrate. In this case, the CSP substrate may be sucked and held through a holding member having a suction path communicating with a suction hole formed in the chuck table.

  In the cutting apparatus according to the present invention, since the cutting water supply nozzle is disposed on the side opposite to the side where the end material scatters when the cutting blade rotates, the cutting water collides with the cutting water supply nozzle even when the end material scatters. There is no splash on the blade or workpiece. Therefore, it is possible to prevent the cutting blade and the workpiece from being damaged. In addition, since cutting water is supplied to the contact portion between the cutting edge portion and the workpiece by the rotation of the cutting water due to the rotation of the cutting blade, the cutting water is not directly injected to the workpiece. In this respect, it is possible to prevent damage to the cutting blade and the workpiece due to the rebound of the end material in the cutting water supply nozzle. And since cutting water is supplied to the contact part of a cutting blade part and a workpiece by the accompanying rotation of cutting water, cooling of a cutting blade and the said contact part is fully performed.

  When the cutting water supply nozzle is disposed at a retracted position that does not interfere with the cutting blade when it is attached to or detached from the spindle, the cutting water supply nozzle does not get in the way when the cutting blade is attached or detached, and the attachment or removal is performed smoothly. be able to. Moreover, when the 1st injection part and the 2nd injection part inject cutting water with respect to the area | region of 1/8-1/4 of a cutting blade part, the cooling effect can fully be ensured.

  In the workpiece cutting method according to the present invention, the cutting water is supplied to the contact portion between the cutting edge portion and the workpiece by the rotation of the cutting water by the rotation of the cutting blade, and the cutting water is directly applied to the contact portion. Since the contact portion can be cooled without being supplied, the end material is not scattered by the cutting water, thereby preventing damage to the cutting blade and the workpiece.

  Moreover, if the 1st injection part and the 2nd injection part supply cutting water to the area | region of 1/8-1/4 of a cutting blade part, sufficient cooling effect can be ensured. Furthermore, when the workpiece is a CSP substrate and the CSP substrate is sucked and held via a holding member having a suction path communicating with a suction hole formed in the chuck table, the CSP substrate is made of an adhesive tape or the like. Although it is not fixed, the end material is likely to scatter. However, even if the end material scatters, it does not collide with the cutting water supply nozzle, so that it is more effective without damaging the cutting blade and the CSP substrate.

  A cutting device 1 shown in FIG. 1 is a device that cuts a rectangular plate-like object, and the rectangular plate-like object is sucked and held by a chuck table 2 that can move in the X-axis direction. This chuck table 2 has a configuration in which a suction hole 21 communicating with a suction source is provided at the center of a rectangular mounting table 20.

  For example, when cutting the CSP substrate 6 shown in FIG. 2, the CSP substrate 6 is placed and held on the mounting table 20 via the holding plate 7. The CSP substrate 6 is provided with the separation planned lines 60 vertically and horizontally, and the individual CSPs 61 are obtained by cutting and separating the scheduled separation lines 60. The holding plate 7 is provided with a suction path 70 penetrating from the front surface to the back surface thereof and communicating with the suction hole 21 of the chuck table 2, and the holding plate 7 on which the CSP substrate 6 is placed is placed on the placement table 20. When the suction force is applied from the suction hole 21, the suction force is transmitted to the surface of the mounting table 20, and the CSP substrate 6 is sucked and held. Note that a relief groove 71 corresponding to the scheduled separation line 60 of the CSP substrate 6 is formed in the holding plate 7 in advance.

  Returning to FIG. 1 and continuing the description, the alignment means 3 is disposed above the movement path of the chuck table 2 in the −X direction. The alignment unit 3 includes an imaging unit 30, and can image the surface of the CSP substrate 6 to detect the scheduled separation lines 60 provided vertically and horizontally on the CSP substrate 6.

  The cutting means 4 is disposed on the −X direction side of the alignment means 3. The cutting means 4 is formed integrally with the imaging unit 30. Further, the imaging unit 30 and the cutting blade 43 constituting the cutting means 4 are positioned on a straight line in the X-axis direction, and when the planned separation line 60 is detected by the imaging unit 30, the planned separation line and the cutting blade 43 is automatically aligned with 43 in the Y-axis direction.

  As shown in FIG. 3, in the cutting means 4, a spindle 41 is rotatably supported by a spindle housing 40, and a flange 42 is fixed to the spindle 41, and the flange 42 has a support surface 420. Yes. The cutting blade 43 is detachably attached to the free end 41 a of the spindle 41, and the nut 44 is screwed onto the male screw 410 formed on the spindle 41, so that the cutting blade 43 is sandwiched between the support surface 420 and the nut 44. To be fixed. Here, the cutting blade 43 is formed with a base 430 in which a hole for inserting the spindle 41 is formed in the central portion, and an outer peripheral portion on one side surface of the base 430 protruding from the base 430 to the outer peripheral side. And a cutting blade portion 431.

  FIG. 4 shows a state in which the cutting blade 43 is mounted and fixed to the spindle 41, and the spindle 41, the cutting blade 43, and the like are covered from above by a blade cover 45. The blade cover 45 is provided with a cutting water supply nozzle 46. The cutting water supply nozzle 46 includes a first injection unit 460 and a second injection unit 461 that inject cutting water, both of which are lateral to the cutting blade 43 when viewed from the front side (+ Y direction side). It is arranged. A first cutting water inlet 450 and a second cutting water inlet 451 are provided in the upper part of the blade cover 45, and the first cutting water inlet 450 communicates with the first injection unit 460 and the second cutting water inlet 460. The water inflow port 451 communicates with the second injection unit 461.

  As shown in FIG. 5, in the cutting blade 43, a cutting blade portion 431 is fixed to one side surface of the base 430. The first injection unit 460 and the second injection unit 461 are arranged so as to sandwich the cutting blade part 431 from both sides, and the first injection unit 460 is one surface on the + Y direction side of the cutting blade part 431. The cutting water is sprayed onto the surface of the cutting blade portion 431 on the −Y direction side.

  Next, a case where the separation line 60 of the CSP substrate 6 shown in FIG. 2 is cut vertically and horizontally and divided into individual CSPs will be described with reference to FIG. 1 and other drawings as appropriate. As shown in FIG. 1, the CSP substrate 6 is sucked and held by the chuck table 2 via the holding plate 7, and is positioned directly below the alignment means 3 by moving the chuck table 2 in the + X direction.

  Then, the surface of the CSP substrate 6 is imaged by the imaging unit 30, one of the scheduled separation lines 60 is detected, and alignment with the cutting blade 43 in the Y-axis direction is performed. In this state, the chuck table 2 holding the CSP substrate 6 further moves in the + X direction, the cutting means 4 descends while the cutting blade 43 rotates at a high speed, and the cutting blade 43 cuts into the detected separation line 60. Cutting is performed.

  When the chuck table 2 is reciprocated in the X-axis direction and cutting is performed while the cutting means 4 is indexed in the Y-axis direction by an interval between adjacent separation lines, all the separation lines in the same direction are cut. The When the same cutting is performed after the chuck table 2 is further rotated by 90 degrees, all the scheduled separation lines are cut and divided into CSPs 61 as individual devices.

  At the time of cutting performed in this way, as shown in FIG. 6, the cutting water is sprayed from the first spraying portion 460 toward the front side of the cutting blade portion 431 of the cutting blade 43 (the end portion side of the spindle 41), Cutting water is sprayed from the second injection portion 461 toward the back side (spindle housing 40 side) of the cutting blade portion 431, and the cutting blade portion 431 is cooled.

  FIG. 7 shows a state in which the cutting water is injected from the first injection unit 460 and the second injection unit 461 when viewed from the front side (+ Y direction side). Is injected in a substantially horizontal direction. The cutting water sprayed in this way is supplied to the contact portion between the cutting blade portion 431 and the CSP substrate 6 by the accompanying rotation of the cutting blade 43 as shown in FIG. 7 to cool the contact portion. Provided. The 1st injection part 460 and the 2nd injection part 461 in the example of illustration inject cutting water with respect to the area | region of 1/8-1/4 of the cutting blade part 431. FIG.

  In the example of FIG. 7, since the cutting blade 43 rotates clockwise, the cutting water and the end material generated by the cutting are also scattered in the rotation direction. However, the first injection unit 460 and the first injection unit 460 constituting the cutting water supply nozzle 46 The second injection portion 461 is arranged on the opposite side of the rotation direction of the cutting blade 43 with respect to the contact portion between the cutting blade 43 and the CSP substrate 6, that is, on the opposite side to the side where the end material scatters when the cutting blade 43 rotates. It is installed. Therefore, even if the end material scatters during cutting, the end material does not collide with the cutting water supply nozzle 46 and return to the workpiece or the cutting blade 43. Therefore, the CSP substrate 6 or the cutting blade 43 Can be prevented from being damaged. Further, the cutting water is not directly sprayed onto the CSP substrate 6 and the workpiece is cooled by the accompanying rotation of the cutting blade 43, so that it is possible to prevent scattering of the end material due to the cutting water spraying. In particular, when the CSP substrate 6 is held only by adsorption, the mill ends are likely to be scattered, which is more effective.

  Further, since the cutting water is supplied to the contact portion between the cutting blade portion 431 and the CSP substrate 6 due to the accompanying rotation of the cutting water, cooling of the cutting blade 43 and the contact portion is ensured. Since the 1st injection part 460 and the 2nd injection part 461 can inject cutting water with respect to the area | region of 1/8-1/4 of the cutting blade part 431, the cooling effect is also enough.

  Further, the cutting water supply nozzle 46 is located on the outer peripheral side of the cutting blade 43 when viewed from the front side, and is disposed at a retracted position that does not overlap with the attaching / detaching direction (Y axis direction, axial direction) of the cutting blade 43 with respect to the spindle 41. Therefore, the cutting water supply nozzle 46 does not get in the way at the time of attachment / detachment, and attachment / detachment can be performed smoothly.

It is a perspective view which shows an example of a cutting device. It is a perspective view which shows an example of a CSP board | substrate and a holding plate. It is a disassembled perspective view which shows an example of a cutting means. It is a disassembled perspective view which shows an example of a cutting means. It is a side view which shows an example of a cutting means. It is a side view which shows a mode that a CSP board | substrate is cut using a cutting means. It is a front view which shows a mode that a CSP board | substrate is cut using a cutting means.

Explanation of symbols

1: Cutting device 2: Chuck table 20: Placement table 21: Suction hole 3: Alignment means 30: Imaging unit 4: Cutting means 40: Spindle housing 41: Spindle
410: Male thread 42: Flange
420: Support surface 43: Cutting blade
430: Base 431: Cutting blade portion 44: Nut 45: Blade cover 46: Cutting water supply nozzle
460: First injection unit 461: Second injection unit 5: Cutting water 6: CSP substrate 60: Separation scheduled line 7: Holding plate 70: Suction path 71: Escape groove

Claims (6)

A cutting apparatus comprising at least a chuck table for holding a workpiece and a cutting means for cutting the workpiece while supplying cutting water to the workpiece held on the chuck table,
The cutting means includes a spindle, a spindle housing that rotatably supports the spindle, a cutting blade that is detachably attached to a free end portion of the spindle, and has a cutting blade portion on an outer periphery thereof, and cutting water is supplied to the cutting blade. A cutting water supply nozzle for supplying,
The cutting water supply nozzle is disposed on a side opposite to a side where the end material generated by the cutting is scattered by the rotation of the cutting blade, and the cutting water is sprayed to one surface of the cutting blade portion. A second injection unit that injects cutting water onto the other surface of the cutting unit and the first injection unit and the cutting water injected from the second injection unit A cutting device in which the cutting blade is cooled and the cutting water is supplied to the contact portion between the cutting blade and the workpiece by the accompanying rotation of the cutting water by the rotation of the cutting blade.   The cutting device according to claim 1, wherein the cutting water supply nozzle is disposed at a retracted position that does not get in the way when the cutting blade is attached to and detached from the spindle.   The cutting device according to claim 1 or 2, wherein the first injection unit and the second injection unit inject cutting water into a region of 1/8 to 1/4 of the cutting blade portion. A cutting method according to claim 1, 2 or 3, wherein the workpiece held by the chuck table is cut by a rotating cutting blade,
The cutting blade portion of the cutting blade is cooled by spraying cutting water from the first injection portion and the second injection portion, and the cutting blade portion is rotated by the rotation of the cutting blade. A method of cutting a workpiece by supplying cutting water to a contact portion with the workpiece.   5. The workpiece cutting method according to claim 4, wherein the first injection unit and the second injection unit supply cutting water to a region of ８ to ¼ of the cutting blade part.   The workpiece cutting method according to claim 4, wherein the workpiece is a CSP substrate, and the CSP substrate is sucked and held by the chuck table via a holding member.

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