JP4074118B2 - Polishing equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a polishing apparatus capable of dressing a polishing tool for polishing a workpiece such as a semiconductor wafer held on a chuck table.
[0002]
[Prior art]
In the semiconductor device manufacturing process, a large number of rectangular regions are defined by cutting lines called streets arranged in a lattice pattern on the surface of a substantially wafer-shaped semiconductor wafer, and a semiconductor circuit is formed in each of the rectangular regions. Individual semiconductor chips are formed by separating the semiconductor wafer formed with such a large number of semiconductor circuits along the streets. In order to reduce the size and weight of the semiconductor chip, the semiconductor wafer is usually ground to the predetermined thickness by cutting the semiconductor wafer along the streets and separating the individual rectangular regions. Forming. The grinding of the back surface of the semiconductor wafer is usually performed by pressing a grinding tool formed by fixing diamond abrasive grains with an appropriate bond such as a resin bond against the back surface of the semiconductor wafer while rotating at high speed. When the back surface of the semiconductor wafer is ground by such a grinding method, a so-called processing strain is generated on the back surface of the semiconductor wafer, thereby considerably reducing the bending strength of the individually divided semiconductor chips. As a countermeasure for removing the processing strain generated on the back surface of the ground semiconductor wafer, a wet etching method in which the back surface of the ground semiconductor wafer is chemically etched using an etching solution containing nitric acid and hydrofluoric acid, A dry etching method using an etching gas is used. Further, a polishing method in which the back surface of a ground semiconductor wafer is polished using loose abrasive grains has been put into practical use.
[0003]
However, the wet etching method, the dry etching method, and the polishing method described above have poor productivity and the waste liquid causes environmental pollution. In order to solve such a problem, the present applicant uses a polishing tool made of a felt grindstone in which abrasive grains are dispersed in a felt and fixed with an appropriate bond agent, and then the back surface of the ground semiconductor wafer is polished and ground. A technique for removing distortion was proposed as Japanese Patent Application No. 2001-93397.
[0004]
[Problems to be solved by the invention]
Thus, in the polishing method using the felt tool made of felt grindstone proposed as Japanese Patent Application No. 2001-93397, the work piece is polished in a dry manner, so that the polishing surface of the polishing tool is easily clogged. The abrasive surface of the tool needs to be dressed frequently. For this reason, the operator interrupts the operation and manually places the dresser board on the chuck table, and rotates the dresser board placed on the chuck table while bringing the polishing surface of the polishing tool into contact with the dresser board. The work is carried out, which is troublesome and also causes a reduction in production efficiency.
[0005]
The present invention has been made in view of the above-described facts, and a main technical problem thereof is to provide a polishing apparatus capable of performing dressing work of a polishing tool without manual work.
[0006]
[Means for Solving the Problems]
  In order to solve the main technical problem, according to the present invention, a chuck table for holding a workpiece, and a polishing unit including a polishing tool for polishing the workpiece held on the chuck table, In the polishing apparatus provided,
  A dresser board transport mechanism for holding a dresser board for dressing the polishing tool and transporting the dresser board to the chuck table and a standby position separated from the chuck table;Equipped,
  The dresser board includes a main body having a grindstone portion on the upper surface, and a circular fitting portion formed to protrude from the lower surface of the main body,
The dresser board transport mechanism includes a dresser board holding arm having an annular holding portion that has a thickness dimension smaller than the thickness of the fitting portion of the dresser board and is fitted to the fitting portion, and the dresser board holding mechanism. A vertical movement means for moving the arm in the vertical direction; and a conveyance movement means for conveying the dresser board holding arm to the chuck table and the standby position.
  A polishing apparatus is provided.
[0007]
  The outer peripheral surface of the fitting portion of the dresser board is formed into a tapered surface whose diameter decreases downward, and the inner peripheral surface of the annular holding portion of the dresser board holding arm is the outer periphery of the fitting portion of the dresser board It is desirable to form in the taper surface corresponding to a surface.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of a polishing apparatus configured according to the present invention will be described in detail with reference to the accompanying drawings.
[0009]
FIG. 1 is a perspective view of a polishing apparatus according to the present invention.
The polishing apparatus comprises an apparatus housing, generally designated 2. The apparatus housing 2 includes a rectangular parallelepiped main portion 21 that extends elongated and an upright wall 22 that is provided at a rear end portion (upper right end in FIG. 1) of the main portion 21 and extends substantially vertically upward. Yes. A pair of guide rails 221 and 221 extending in the vertical direction are provided on the front surface of the upright wall 22. The polishing unit 3 is mounted on the pair of guide rails 221 and 221 so as to be movable in the vertical direction.
[0010]
The polishing unit 3 includes a moving base 31 and a spindle unit 32 attached to the moving base 31. The movable base 31 is provided with a pair of legs 311 and 311 extending in the vertical direction on both sides of the rear surface. The pair of legs 311 and 311 is slidably engaged with the pair of guide rails 221 and 221. Guided grooves 312 and 312 are formed. As described above, a support portion 313 protruding forward is provided on the front surface of the movable base 31 slidably mounted on the pair of guide rails 221 and 221 provided on the upright wall 22. The spindle unit 32 is attached to the support portion 313.
[0011]
The spindle unit 32 includes a spindle housing 321 mounted on the support portion 313, a rotary spindle 322 rotatably disposed on the spindle housing 321, and a servo motor as a drive source for rotationally driving the rotary spindle 322. 323. The lower end of the rotary spindle 322 protrudes downward beyond the lower end of the spindle housing 321, and a disk-shaped tool mounting member 324 is provided at the lower end. The tool mounting member 324 is formed with a plurality of bolt insertion holes (not shown) at intervals in the circumferential direction. A polishing tool 325 is mounted on the lower surface of the tool mounting member 324. As illustrated in FIGS. 2 and 3, the polishing tool 325 includes a disk-shaped support member 326 and a disk-shaped polishing member 327. The support member 326 is formed with a plurality of blind screw holes 326a extending downward from the upper surface at intervals in the circumferential direction. The lower surface of the support member 326 forms a circular support surface, and the polishing member 327 is joined to the circular support surface of the support member 326 by an appropriate adhesive such as an epoxy resin adhesive. In the illustrated embodiment, the abrasive member 327 is a felt grindstone in which abrasive grains are dispersed in the felt and fixed with an appropriate bond agent. The detailed description of the structure of the polishing member 327 itself made of the felt grindstone has already been described in detail in the specification and drawings of Japanese Patent Application No. 2001-93397 proposed by the present applicant. The description is omitted in the book. The polishing tool 325 is positioned on the lower surface of the tool mounting member 324 fixed to the lower end of the rotary spindle 322, and the blind screw formed on the support member 326 of the polishing tool 325 through the through hole formed in the tool mounting member 324. The polishing tool 325 is mounted on the tool mounting member 324 by screwing the fastening bolt 328 into the hole 326a.
[0012]
Referring back to FIG. 1, the polishing apparatus in the illustrated embodiment moves the polishing unit 3 up and down along the pair of guide rails 221 and 221 (in a direction perpendicular to a mounting surface of a chuck table described later). ) Is provided with a polishing unit feeding mechanism 4. The polishing unit feed mechanism 4 includes a male screw rod 41 disposed on the front side of the upright wall 22 and extending substantially vertically. The male screw rod 41 is rotatably supported by bearing members 42 and 43 whose upper end and lower end are attached to the upright wall 22. The upper bearing member 42 is provided with a pulse motor 44 as a drive source for rotationally driving the male screw rod 41, and the output shaft of the pulse motor 44 is connected to the male screw rod 41 by transmission. A connecting portion (not shown) that protrudes rearward from the center portion in the width direction is also formed on the rear surface of the movable base 31, and a through female screw hole that extends in the vertical direction is formed in the connecting portion, The male screw rod 41 is screwed into the female screw hole. Therefore, when the pulse motor 44 rotates in the forward direction, the moving base 31, that is, the polishing unit 3 is lowered or moved forward, and when the pulse motor 44 rotates in the reverse direction, the moving base 31, that is, the polishing unit 3 is raised or moved backward.
[0013]
The description will be continued with reference to FIG. 1. A substantially rectangular recessed portion 211 is formed on the rear half of the main portion 21 of the housing 2, and the chuck table mechanism 5 is disposed in the recessed portion 211. ing. The chuck table mechanism 5 includes a support base 51 and a disk-shaped chuck table 52 disposed on the support base 51 so as to be rotatable about a rotation center axis extending substantially vertically. The support base 51 is slidably mounted on a pair of guide rails (not shown) extending in the direction indicated by the arrows 23a and 23b in the front-rear direction (direction perpendicular to the front surface of the upright wall 22) on the immersion portion 211. The workpiece loading / unloading area 24 and the polishing area 25 facing the polishing member 327 of the polishing tool 325 constituting the spindle unit 32 in the direction indicated by the arrows 23a and 23b by a chuck table moving mechanism (not shown). It can be moved between. The support base 51 is reciprocated by a chuck table moving mechanism (not shown) in the polishing area 25. The chuck table 52 is made of an appropriate porous material such as porous ceramics, and is connected to suction means (not shown). Therefore, by selectively communicating the chuck table 52 with a suction means (not shown), the workpiece placed on the upper surface is sucked and held.
[0014]
On both sides in the moving direction of the support base 51 constituting the chuck table mechanism 5, as shown in FIG. 1, bellows means 53 having a reverse cross-sectional shape and covering a chuck table moving mechanism (not shown) 54 is attached. The bellows means 53 and 54 can be formed from any suitable material such as campus cloth. The front end of the bellows means 53 is fixed to the front wall of the immersion portion 211, and the rear end is fixed to the front end surface of the support base 51 of the chuck table mechanism 5. The front end of the bellows means 54 is fixed to the rear end surface of the support base 51 of the chuck table mechanism 5, and the rear end is fixed to the front surface of the upright wall 22 of the apparatus housing 2. When the chuck table mechanism 5 is moved in the direction indicated by the arrow 23a, the bellows means 53 is expanded and the bellows means 54 is contracted, and when the chuck table mechanism 5 is moved in the direction indicated by the arrow 23b, the bellows means. 53 is contracted and the bellows means 54 is extended.
[0015]
Continuing the description with reference to FIG. 1, a contact between the workpiece held on the chuck table 52 in the polishing region 25 and the polishing member 327 is provided on the side of the polishing region 25 in the main portion 21 of the apparatus housing 2. A cooling air nozzle 6 for ejecting cooling air is disposed in the part. The cooling air nozzle 6 is connected to a cooling air supply means (not shown).
[0016]
The polishing apparatus in the illustrated embodiment includes a dust-proof cover 7 surrounding a polishing tool 325 pressed against a workpiece held on the chuck table 52 together with the chuck table mechanism 5 positioned in the polishing area 52. It has. The dust-proof cover 7 has a box shape as a whole and includes an upper wall 71, a front wall 72, and both side walls 73 and 73. Both side walls 73, 73 of the dust cover 7 have shoulder surfaces 73 a, 73 a facing downward in the middle in the vertical direction, and the lower half portions of the both side walls 73, 73 are brought into close contact with both side surfaces of the immersive portion 211. The surfaces 73 a and 73 a are placed on the upper surfaces of both side edges of the main portion 21 of the housing 2. A rectangular opening 72 a for allowing passage of the chuck table mechanism 5 is formed in the front wall 72 of the dust cover 7. A circular opening 71 a for allowing the polishing tool 325 to pass is formed in the upper wall 71 of the dust cover 7. The upper wall 71 of the dustproof cover 7 is provided with a cylindrical member 74 that extends upward from the peripheral edge of the circular opening 71a. A part of the upper wall 71 of the dustproof cover 7 is provided with a door 75 for maintenance inspection that can be freely opened and closed. Further, an exhaust duct 76 for exhausting the inside of the dustproof cover 7 is attached to the upper wall 71 of the dustproof cover 7. The exhaust duct 76 is connected to an appropriate exhaust means (not shown). When the workpiece is polished by the polishing tool 325, polishing powder or the like in the polishing area 25 surrounded by the dustproof cover 7 is used. Dust is exhausted.
[0017]
The description will be continued based on FIG. 1. On the front half of the main portion 21 of the apparatus housing 2, a first cassette 11, a second cassette 12, a workpiece temporary placing means 13, and a cleaning means are provided. 14, a workpiece conveying means 15, a workpiece carrying-in means 16 and a workpiece carrying-out means 17 are arranged. The first cassette 11 stores a workpiece before polishing and is placed in a cassette carry-in area in the main portion 21 of the apparatus housing 2. The second cassette 12 is placed in a cassette unloading area in the main portion 21 of the apparatus housing 2 and stores a workpiece after polishing. The workpiece temporary placing means 13 is disposed between the first cassette 11 and the workpiece loading / unloading area 24, and temporarily places the workpiece before polishing. The cleaning means 14 is disposed between the workpiece loading / unloading area 24 and the second cassette 12, and cleans the workpiece after polishing. Workpiece conveying means 15 is disposed between the first cassette 11 and the second cassette 12, and the work piece stored in the first cassette 11 is carried out to the workpiece temporary placement means 13. At the same time, the workpiece cleaned by the cleaning means 14 is conveyed to the second cassette 12. The workpiece carrying-in means 16 is disposed between the workpiece temporary placing means 13 and the workpiece carrying-in / out area 24, and is placed on the workpiece temporary placing means 13 before polishing. The workpiece is transferred onto the chuck table 52 of the chuck table mechanism 5 positioned in the workpiece loading / unloading area 24. The workpiece unloading means 17 is disposed between the workpiece loading / unloading area 24 and the cleaning means 14, and is mounted on a chuck table 52 positioned in the workpiece loading / unloading area 24. The processed workpiece is conveyed to the cleaning means 14. The polishing apparatus in the illustrated embodiment includes a cleaning water spray nozzle 18 that cleans the chuck table 52 at the center of the main portion 21 of the apparatus housing 2. The cleaning water spray nozzle 18 ejects cleaning water toward the chuck table 52 in a state where the chuck table mechanism 5 is positioned in the workpiece loading / unloading area 24.
[0018]
The workpiece accommodated in the first cassette 11 is a semiconductor wafer having a front surface mounted on an annular frame via a protective tape (therefore, the semiconductor wafer is positioned on the upper surface), or a support substrate (sub A semiconductor wafer having a front surface mounted on a straight surface (therefore, the back surface of the semiconductor wafer is located on the upper side) may be used. The first cassette 11 containing the semiconductor wafer as such a workpiece is placed in a predetermined cassette carry-in area in the main portion 21 of the apparatus housing 2. Then, when all the semiconductor wafers before polishing that have been accommodated in the first cassette 11 placed in the cassette carry-in area are unloaded, a new cassette that accommodates a plurality of semiconductor wafers instead of the empty cassette 11 11 is manually placed in the cassette carry-in area. On the other hand, when a predetermined number of polished semiconductor wafers are loaded into the second cassette 12 placed in a predetermined cassette unloading area in the main portion 21 of the apparatus housing 2, the second cassette 12 is manually moved. It is unloaded and a new empty second cassette 12 is placed.
[0019]
Next, the processing operation of the above-described polishing apparatus will be briefly described.
The semiconductor wafer as the workpiece before polishing, which is accommodated in the first cassette 11, is conveyed by the vertical movement and the advance / retreat operation of the workpiece conveying means 15 and is placed on the workpiece temporary placing means 13. . The semiconductor wafer mounted on the workpiece temporary mounting means 13 is positioned in the workpiece loading / unloading area 24 by the turning operation of the workpiece loading means 16 after being centered here. It is placed on the chuck table 52 of the chuck table mechanism 5. The workpiece placed on the chuck table 52 is sucked and held on the chuck table 52 by suction means (not shown).
[0020]
When the semiconductor wafer is sucked and held on the chuck table 52, the chuck table moving mechanism (not shown) is operated to move the chuck table mechanism 5 in the direction indicated by the arrow 23a, and is positioned at the polishing start position of the polishing area 25. At the polishing start position of the polishing area 25, the chuck table 52 holding the semiconductor wafer W is rotated at, for example, about 300 rpm, the servo motor 323 is driven to rotate the polishing tool 325 at 4000 to 7000 rpm, and the polishing is performed. The pulse motor 44 of the unit feed mechanism 4 is driven to rotate forward so that the polishing unit 3 is lowered or advanced. Then, the polishing member 327 of the polishing tool 325 is pressed against the back surface of the semiconductor wafer on the chuck table 52 with a predetermined load. Next, a chuck table moving mechanism (not shown) is operated in one direction to move the chuck table mechanism 5 to a predetermined polishing end position in the direction indicated by the arrow 23a. At this time, the moving speed of the chuck table mechanism 5 is set to 100 to 200 mm / min, for example. When the chuck table 52 moves to the polishing end position, the chuck table moving mechanism (not shown) is operated in the other direction to move the chuck table mechanism 5 in the direction indicated by the arrow 23b to return to the polishing start position, and the above operation is repeated. Execute. By performing this grinding operation for a preset time or a predetermined number of times of reciprocation of the chuck table mechanism 5, the back surface of the semiconductor wafer is dry-polished by a predetermined amount by the action of the polishing member 327, and residual processing strain is removed. Is done.
[0021]
In the illustrated embodiment, at the time of dry polishing by the polishing member 327 of the polishing tool 325, the cooling air nozzle 6 disposed on the side of the polishing region 25 is connected to the contact portion between the polishing member 327 and the semiconductor wafer. Since the cooling air is injected, the contact surface between the grinding surface 327e and the semiconductor wafer can be further cooled. Although the above-mentioned dry polishing action causes the abrasive powder to scatter, the exhaust means (not shown) is operated at this time, and the dust scattered in the dustproof cover 7 is exhausted through the exhaust duct 76.
[0022]
When the polishing is finished as described above, the polishing tool 325 is separated upward from the back surface of the semiconductor wafer, and the chuck table mechanism 5 is moved to the workpiece loading / unloading area 24 in the direction indicated by the arrow 23b. Thereafter, the suction holding of the polished semiconductor wafer on the chuck table 52 is released, and the semiconductor wafer released from the suction holding is unloaded by the workpiece unloading means 17 and conveyed to the cleaning means 14. The semiconductor wafer transported to the cleaning means 14 is cleaned here and then stored in a predetermined position of the second cassette 12 by the workpiece transport means 15.
[0023]
In the above-described polishing apparatus, polishing powder adheres to the polishing surface 327a of the polishing member 327 constituting the polishing tool 325 during polishing, and clogging occurs. It is necessary to dress this clogged polishing surface 327a. In the polishing apparatus shown in FIG. 1, the dresser is disposed near the chuck table 52 in the main portion 21 of the apparatus housing 2 and dresses the polishing tool 325. A dresser board transport mechanism 9 that holds the board 8 and transports the dresser board 8 to the chuck table 52 and the standby position is provided. Hereinafter, the dresser board 8 and the dresser board transport mechanism 9 will be described with reference to FIGS. 4 and 5.
[0024]
The dresser board 8 shown in FIGS. 4 and 5 includes a disc-shaped main body 81 and a circular fitting portion 82 formed to protrude from the lower surface of the main body 81. The main body 81 is made of aluminum, and a grindstone portion 811 is provided on the upper surface thereof. In order to provide the grindstone portion 811 in the main body 81, for example, it can be formed by a known electroforming method. That is, the main body 81 made of an aluminum material is masked while leaving the grinding wheel forming portion, and nickel plating is performed in a plating solution in which diamond abrasive grains are mixed in a nickel sulfate solution. The grindstone part 811 which becomes can be formed. The fitting portion 82 constituting the dresser board 8 is formed integrally with the main body 81, and has an outer diameter smaller than the outer diameter of the main body 81. The outer peripheral surface 821 of the fitting part 82 is formed in the taper surface where a diameter becomes small toward the downward direction, as shown in FIG.
[0025]
Next, the dresser board transport mechanism 9 will be described.
4 and 5 includes a dresser board holding arm 91 that holds the dresser board 8, vertical movement means 92 that moves the dresser board holding arm 91 in the vertical direction, and the dresser board holding mechanism. The arm 91 is provided with a chuck table 52 and a transfer moving means 93 for transferring the arm 91 to a standby position indicated by a solid line in FIG. 1 set at a position separated from the chuck table 52. The dresser board holding arm 91 includes an annular holding portion 911 at the tip. As shown in FIG. 4, the inner peripheral surface 911 a of the annular holding portion 911 is formed into a tapered surface corresponding to the tapered surface forming the outer peripheral surface 821 of the fitting portion 82 of the dresser board 8. That is, the inner peripheral surface 911a of the annular holding portion 911 is formed as a tapered surface whose diameter decreases from the upper end to the lower end, and the inner peripheral surface 911a of the holding portion 911 and the outer peripheral surface 821 of the fitting portion 82 are formed. Are in contact with each other over the entire surface. Further, the thickness of the annular holding portion 911 is smaller than the thickness of the fitting portion 82 of the dresser board 8 as shown exaggeratedly in FIG. By fitting the fitting portion 82 of the dresser board 8 into the annular holding portion 911 formed in this way, the lower surface of the body 81 of the dresser board 8 is held on the upper surface of the holding portion 911 as shown in FIG. Is done. Then, the tapered surface forming the inner peripheral surface 911a of the holding portion 911 and the tapered surface forming the outer peripheral surface 821 of the fitting portion 82 of the dresser board 8 come into contact with each other, so that the dresser board 8 has an annular holding portion 911. Is held at the center position. Thus, the dresser board 8 held by the holding portion 911 of the dresser board holding arm 91 is positioned such that the lower surface of the fitting portion 82 protrudes downward from the lower surface of the holding portion 911.
[0026]
The base end portion 912 of the dresser board holding arm 91 having the annular holding portion 911 configured as described above is attached to the operating shaft 94. The operating shaft 94 is supported by the main portion 21 of the apparatus housing 2 so as to be rotatable and movable in the vertical direction. The operation shaft 94 is operated in the vertical direction by the vertical movement means 92 and the conveyance movement means 93 and is also rotated. The vertical movement means 92 includes a pulse motor capable of normal rotation and reverse rotation and a screw mechanism driven by the pulse motor. When the pulse motor is driven forward, the operating shaft 94 is raised, and when the pulse motor is driven reversely, the vertical movement means 92 operates. The shaft 94 is lowered. The transport moving means 93 includes a pulse motor capable of normal rotation and reverse rotation and a drive mechanism driven by the pulse motor. When the pulse motor is driven to rotate forward, the operation shaft 94 is rotated in one direction, and the pulse motor is When driven in reverse, the operating shaft 94 is rotated in the other direction. The pulse motor as the drive source for the vertical movement means 92 and the pulse motor as the drive source for the transport movement means 93 are controlled by a control means (not shown). The dresser board transport mechanism 9 configured as described above is positioned at the standby position shown in FIG. 1 with the dresser board 8 held by the holding portion 911 of the dresser board holding arm 91.
[0027]
Next, an operation of holding the dresser board 8 on the chuck table 52 in order to dress the polishing surface 327a of the polishing member 327 constituting the polishing tool 325 will be described with reference to FIGS.
The transport movement means 93 is operated from the state positioned at the standby position shown in FIG. 1 to rotate the dresser board holding arm 91 about the operating shaft 94, and the dresser board 8 held by the dresser board holding arm 91 is moved. As shown in FIG. 6, the wafer is conveyed to a position above the chuck table 52 positioned in the polishing area 25. Next, when the dresser board holding arm 91 is lowered by moving the vertical movement means 92 downward, the lower surface of the fitting portion 82 of the dresser board 8 held by the dresser board holding arm 91 is placed on the upper surface of the chuck table 52. Is done. Then, the vertical movement means 92 is slightly lowered to lower the dresser board holding arm 91, and the upper and lower sides of the holding part 911 of the dresser board holding arm 91 are moved up and down at a position where the lower surface does not contact the chuck table 52 as shown in FIG. The operation of the moving means 92 is stopped. In this way, when the lower surface of the fitting portion 82 of the dresser board 8 is placed on the upper surface of the chuck table 52, the suction means (not shown) is operated to suck and hold the dresser board 8 on the chuck table 52. As described above, in the illustrated embodiment, the dresser board 8 can be placed on the chuck table 52 without manual operation, so that work efficiency can be improved.
[0028]
If the dresser board 8 is sucked and held on the chuck table 52 as described above, the dressing operation is executed as in the conventional case. That is, the chuck table 52 that sucks and holds the dresser board 8 is rotated at, for example, about 300 rpm, the servo motor 323 is driven to rotate the polishing tool 325 at 4000 to 7000 rpm, and the pulse motor 44 of the polishing unit feed mechanism 4. Is driven forward to lower or advance the polishing unit 3. Then, the polishing member 327 of the polishing tool 325 is pressed against the upper surface of the dresser board 8 on the chuck table 52 with a predetermined load. As a result, the polishing surface 327 a of the polishing member 327 constituting the polishing tool 325 rotating while being pressed against the upper surface of the dresser board 8 with a predetermined load is dressed by the grindstone portion 811 of the dresser board 8.
[0029]
When dressing of the polishing surface 327a of the polishing member 327 constituting the polishing tool 325 is completed as described above, the pulse motor 44 of the polishing unit feed mechanism 4 is driven in reverse to raise the polishing unit 3, and the servo motor The driving of H.323 is stopped, the rotation of the polishing tool 325 is stopped, and the rotation of the chuck table 52 is stopped. Next, the suction holding of the dresser board 8 sucked and held on the chuck table 52 is released, and the vertical moving means 92 of the dresser board transport mechanism 9 is lifted to raise the dresser board holding arm 91 to hold the dresser board. The dresser board 8 is held on the upper surface of the holding portion 911 of the arm 91. Then, the dresser board holding arm 91 holding the dresser board 8 by operating the transport moving means 93 is transported to the standby position shown in FIG.
[0030]
【The invention's effect】
The polishing apparatus according to the present invention includes a dresser board transport mechanism that holds a dresser board for dressing a polishing tool and transports the dresser board to a chuck table and a standby position separated from the chuck table. Since the board can be placed on the chuck table without manual operation, work efficiency can be improved.
[Brief description of the drawings]
FIG. 1 is a perspective view showing an embodiment of a polishing apparatus constructed according to the present invention.
2 is a perspective view showing a polishing tool constituting a polishing unit equipped in the polishing apparatus shown in FIG. 1. FIG.
3 is a perspective view showing a state of the polishing tool shown in FIG. 2 as viewed from the lower surface side.
4 is a perspective view of a dresser board and a dresser board transport mechanism provided in the polishing apparatus shown in FIG. 1. FIG.
FIG. 5 is a side view showing a state in which the dresser board is held in the dresser board transport mechanism shown in FIG.
6 is an explanatory view showing a state in which a main part is broken, showing a state where the dresser board held by the dresser board transport mechanism shown in FIG. 4 is transported to an upper position of the chuck table.
7 is an explanatory view showing a state in which a main part is cut away in a state where the dresser board held by the dresser board transport mechanism shown in FIG. 4 is placed on the chuck table. FIG.
[Explanation of symbols]
2: Device housing
3: Polishing unit
31: Moving base
32: Spindle unit
321: Spindle housing
322: Rotating spindle
323: Servo motor
324: Tool mounting member
325: Polishing tool
326: Support member
327: Polishing member
4: Polishing unit feed mechanism
44: Pulse motor
5: Chuck table mechanism
51: Support base
52: Chuck table
53, 54: Bellows means
55: Air nozzle
6: Cooling air nozzle
7: dust cover
11: First cassette
12: Second cassette
13: Workpiece temporary placement means
14: Cleaning means
15: Workpiece conveying means
16: Workpiece carrying means
17: Workpiece unloading means
18: Washing water injection nozzle
8: Dresser board
81: Body of dresser board
811: Whetstone part of dresser board
82: Dresser board mating part
9: Dresser board transfer mechanism
91: Dresser board holding arm
911: Dresser board holding arm holding part
92: Vertical movement means
93: Transport moving means
94: Actuating shaft

Claims (2)

In a polishing apparatus comprising: a chuck table that holds a workpiece; and a polishing unit that includes a polishing tool for polishing the workpiece held on the chuck table.
Holding a dresser board for dressing the polishing tool, and comprising a dresser board transport mechanism for transporting the dresser board to the chuck table and a standby position spaced apart from the chuck table ;
The dresser board includes a main body having a grindstone portion on the upper surface, and a circular fitting portion formed to protrude from the lower surface of the main body,
The dresser board transport mechanism includes a dresser board holding arm having an annular holding portion that has a thickness dimension smaller than the thickness of the fitting portion of the dresser board and is fitted to the fitting portion, and the dresser board holding mechanism. A vertical movement means for moving the arm in the vertical direction; and a conveyance movement means for conveying the dresser board holding arm to the chuck table and the standby position.
A polishing apparatus characterized by that. The outer peripheral surface of the fitting portion of the dresser board is formed into a tapered surface whose diameter decreases downward, and the inner peripheral surface of the annular holding portion of the dresser board holding arm is the fitting surface of the dresser board. The polishing apparatus according to claim 1 , wherein the polishing apparatus is formed on a tapered surface corresponding to the outer peripheral surface of the joint portion.

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