JP5072020B2 - Grinding member dressing method and grinding apparatus - Google Patents

Description

  The present invention relates to a method for dressing a grinding member of a grinding apparatus for grinding a semiconductor wafer or the like, and a grinding apparatus for suitably carrying out the dressing method.

  In recent years, the miniaturization of semiconductor devices has become more and more remarkable. Therefore, in order to realize device thinning, a semiconductor wafer having a large number of devices formed on the surface is subjected to backside grinding and thinning to a desired thickness before it is separated into devices. It has been broken. For backside grinding of semiconductor wafers, the semiconductor wafer is sucked and held on a vacuum chuck type chuck table, rotated (autorotated), and grinded, such as a grindstone placed opposite to the chuck table, while being rotated and rotated. 2. Description of the Related Art Generally, a grinding apparatus of a type that presses against a surface to be ground of a wafer is used.

  When a semiconductor wafer such as silicon is ground by a grinding member such as a grindstone, diamond abrasive grains contained in the grindstone may be worn away, and the grinding state may be deteriorated. At this time, it is possible to restore the condition of the grindstone by setting a dressing member formed of abrasive grains such as alumina with a binder on the chuck table instead of the semiconductor wafer and grinding the dressing member with the grinding member. is there. As a method of finding the timing for performing the dressing operation, for example, there is a method described in Patent Document 1.

JP-A-9-29630

  In the grinding apparatus as described above, an operator manually performs a setting operation for setting the dressing member on the chuck table. This is because many dress plates employ a porous dresser, and cannot be sucked and transported by a transport pad having a flat suction part for transporting a wafer. For this reason, it cannot be denied that there is a possibility that work mistakes may occur. If an operator mistake occurs, dressing is not performed properly and the condition of the grindstone may not be sufficiently recovered. Moreover, since the grinding operation of the wafer is interrupted by performing the dressing operation, there is a problem in that the production efficiency is lowered.

  Therefore, the present invention provides a dressing method for dressing a grinding member of a grinding device, a dressing method capable of efficiently dressing while suppressing the occurrence of work mistakes by an operator, and a grinding device that suitably implements the dressing method The purpose is to provide.

The dressing method of the present invention has a fully automatic conveyance function of conveying a workpiece by the conveying means, and dresses the holding means of the grinding apparatus that grinds one surface of the workpiece held by the holding means by the grinding member. A dressing method for dressing a grinding member by holding a plate and grinding the dressing plate, and transporting a dressing plate having a dresser portion ground by the grinding member and a held region that can be held by the transporting means The dressing plate placing step in which the means holds the held region and is placed on the holding means, the dressing step in which the dresser part of the dress plate is ground by the grinding member, and the dress plate, and a dress plate removal step of removing the holding means holds the workpiece is a disk-shaped substrate, the dress plate, a disk-shaped base which can be held by the holding means, the base board A circular first dresser portion disposed near the center of the surface, and an annular second dresser disposed around the first dresser portion on the surface of the base and having a diameter equivalent to the diameter of the workpiece. A donut-shaped suction surface having a diameter substantially equal to the inner diameter of the annular second dresser portion, and a first dresser portion substantially in the center surrounded by the suction surface. A recessed portion that accommodates the first dresser portion, and the surface portion of the base between the first dresser portion and the second dresser portion is configured as the held region that can be sucked and held on the suction surface of the transport unit It is characterized by being.

  In the dressing method of the present invention, since the dresser is provided with the dresser portion and the held region, the dress plate can be transported by the transport means in the same manner as when the workpiece is ground. Thereby, the dress plate is automatically placed on the holding means by the conveying means and is ground by the grinding member. After finishing the dressing of the dressing board, the dressing board is removed from the holding means by the conveying means. As a result, it is not necessary for the operator to manually set the dressing member on the holding means as in the prior art, and the dressing operation can be performed automatically in the same manner as the grinding operation of the work piece. Can be suppressed.

In addition, the dressing plate can be transported by the transporting means, and the dressing process can be performed while measuring the thickness of the second dresser portion with a thickness measuring gauge using a probe. Usually, since the cutting edge of the grinding member is removed by the dressing operation and the cutting edge height is changed, a setup operation for confirming the height position of the grinding member from the holding means is performed after the dressing operation. For this reason, conventionally, the grinding operation of the workpiece could not be resumed promptly after the dressing operation. However, in the present invention, the height position of the grinding member after the dressing operation can be accurately grasped by performing the dressing process while measuring the thickness of the second dresser part. For this reason, it is not necessary to perform setup after the dressing operation, and the workpiece grinding operation can be resumed promptly. In addition, since the thickness of the dressing plate before processing can be measured, the cutting edge of the grinding member is fast-forwarded to the surface of the dressing plate to optimize the working time, or dressing is performed until the specified amount of dressing plate is removed reliably. be able to. As a result, the working efficiency is improved.

Next, the workpiece grinding apparatus of the present invention is an apparatus that can suitably carry out the dressing method of the present invention, has a fully automatic conveyance function of conveying the workpiece by the conveying means, and holds it. A grinding device for grinding one surface of a workpiece held by a means with a grinding member. And it has a dresser part ground by a grinding member, and a to-be-held area which can be held by the conveying means, and is placed on the holding means in a state where the conveying means holds the to-be-held area, or from the holding means. A dress plate that is removed, and the workpiece is a disc-shaped substrate, and the dress plate is a disc-shaped base that can be held by the holding means, and a center of the surface of the base. A circular first dresser portion disposed, and an annular second dresser portion disposed around the first dresser portion on the surface of the base and having a diameter equivalent to the diameter of the workpiece; The conveying means includes a donut-shaped suction surface having a diameter substantially equal to the inner diameter of the annular second dresser portion, and a first dresser portion having a shape substantially the same as the first dresser portion at the center surrounded by the suction surface. A recess for accommodating the first dresser and the second; Base surface portion between the suppressor unit is characterized in that it is constructed as the object holding area that can be held by suction on the suction surface of the conveying means.

  In the grinding apparatus including the dressing member and the conveying unit as described above, it is preferable to include a thickness measuring unit that measures the thickness of the second dresser unit. Accordingly, the dressing process can be performed while measuring the thickness of the second dresser portion, and the height position of the grinding member after the dressing operation can be accurately grasped. In addition, since the thickness of the dressing plate before processing can be measured, the cutting edge of the grinding member is fast-forwarded to the surface of the dressing plate to optimize the working time, or dressing is performed until the specified amount of dressing plate is removed reliably. be able to. As a result, it is not necessary to set up after dressing work, and work efficiency can be improved.

  According to the present invention, the dressing operation is the same as the grinding operation of the workpiece by providing the dresser with the dresser portion and the held region, and further providing the grinding device with the conveying means corresponding to the dressing plate. Can be done automatically. In addition, since the thickness of the dressing plate before processing can be measured, the cutting edge of the grinding member is fast-forwarded to the surface of the dressing plate to optimize the working time, or the dressing plate is removed until the specified amount of the dressing plate is securely removed. Processing can be performed. As a result, it is possible to suppress the occurrence of work mistakes by the operator and improve the work efficiency of the dress work.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
[1] Semiconductor Wafer Reference numeral 1 in FIG. 1 indicates a disk-shaped semiconductor wafer (hereinafter abbreviated as a wafer) whose back surface is ground and thinned by the grinding apparatus of the embodiment shown in FIG. The wafer 1 is a silicon wafer or the like, and the thickness before processing is, for example, about 700 μm. A plurality of rectangular semiconductor chips 3 are partitioned on the surface of the wafer 1 by grid-like division planned lines 2. An electronic circuit (not shown) such as an IC or an LSI is formed on the surface of the semiconductor chip 3. A V-shaped notch 4 indicating a semiconductor crystal orientation is formed at a predetermined location on the peripheral surface of the wafer 1. The wafer 1 is finally cut and divided along the planned division line 2 and is divided into a plurality of semiconductor chips 3.

  When the back surface of the wafer 1 is ground, a protective tape 5 is attached to the surface on the side where the electronic circuit is formed as shown in FIG. 1B for the purpose of protecting the electronic circuit. As the protective tape 5, for example, a structure in which an adhesive of about 5 to 20 μm is applied to one side of a soft resin base sheet such as polyolefin having a thickness of about 70 to 200 μm is used, and the adhesive is applied to the back surface of the wafer 1. It is pasted together. The wafer 1 is thinned to, for example, 50 μm to 100 μm by backside grinding with a grinding apparatus shown in FIG.

[2] Grinding device Next, the configuration and operation of the grinding device 10 will be described.
A grinding apparatus 10 shown in FIG. 2 has a rectangular parallelepiped base 11, and the wafer 1 is placed in a supply cassette 70 detachably set at a predetermined position on the base 11 with the surface side facing up. In this state, a plurality are stacked and stored. One wafer 1 is pulled out from the supply cassette 70 by the transfer robot 71, and the wafer 1 is placed on the positioning table 72 with the back side facing up, and is determined at a fixed position.

  A turntable 13 that is rotationally driven in the R direction is provided on the base 11, and a plurality of (in this case, three) disc-shaped chuck tables 20 are provided on the outer periphery of the turntable 13. Are arranged at equal intervals in the circumferential direction. These chuck tables 20 are rotatably supported, and are rotated in one direction or both directions by a rotation driving mechanism (not shown).

  The wafer 1 positioned on the positioning table 72 is picked up from the positioning table 72 by the supply means 73 and concentrically with the surface to be ground facing up on one chuck table 20 that is operated in vacuum. Placed. The supply means 73 relates to the present invention and will be described in detail later. As shown in FIG. 3, the chuck table 20 has a circular suction part 21 made of a porous member formed at the center upper part of a frame body 22, and the wafer 1 is a suction surface that is the upper surface of the suction part 21. 21a is adsorbed and held so that the surface to be ground is exposed.

  The wafer 1 held on the chuck table 20 is sent to a primary processing position below the rough grinding unit 30A by rotating the turntable 13 by a predetermined angle in the R direction. At this position, the back surface is backed by the grinding unit 30A. Is roughly ground. Next, the turntable 13 is again rotated by a predetermined angle in the R direction to feed the wafer 1 to a secondary machining position below the finish grinding unit 30B. At this position, the back surface is finish ground by the grinding unit 30B. The

  Two columns 12A and 12B arranged in the X direction are erected at the end on the back side of the base 11, and on the front surfaces of these columns 12A and 12B, the grinding units 30A and 30B are respectively in the Z direction ( It is installed so that it can be raised and lowered in the vertical direction. A guide 40 extending in the Z direction is fixed to the front surface of each column 12A, 12B, and a slider 41 is slidably mounted on the guide 40. Each of the grinding units 30 </ b> A and 30 </ b> B is fixed to the front surface of the slider 41, and is moved up and down in the Z direction via the slider 41 by a ball screw type feed mechanism 43 driven by a servo motor 42.

  Each of the grinding units 30A and 30B has the same configuration, and is distinguished by the fact that the grindstone to be mounted is different for rough grinding and finish grinding. As shown in FIG. 3, the grinding units 30 </ b> A and 30 </ b> B have a cylindrical spindle housing 31 whose axial direction extends in the Z direction. 32 is supported. A grindstone wheel 35 is attached to the lower end of the spindle shaft 32 via a flange 34.

  The grindstone wheel 35 has a plurality of grindstones 37 arranged and fixed to the lower surface of an annular frame 36. The lower surface, which is the processing surface of the grindstone 37, is set to be orthogonal to the axial direction of the spindle shaft 32. As the grindstone 37, for example, a diamond-bonded material mixed with a glassy bond material, molded, and sintered is used.

  As the grindstone 37 attached to the grinding unit 30A for rough grinding, for example, one containing relatively coarse abrasive grains of about # 320 to # 400 is used. Further, as the grindstone 37 attached to the grinding unit 30B for finish grinding, for example, a grindstone containing relatively fine abrasive grains of about # 2000 to # 8000 is used. Each of the grinding units 30A and 30B is provided with a grinding water supply mechanism (not shown) for supplying grinding water for cooling and lubrication of the grinding surface or discharging grinding debris.

  The grinding wheel 35 rotates integrally with the spindle shaft 32, and the grinding outer diameter of the rotating grinding wheel 37 is set larger than the diameter of the wafer 1. Further, the processing position of the wafer 1 determined by rotating the turntable 13 by a predetermined angle is that the cutting edge, which is the lower surface of the grindstone 37, passes through the rotation center of the wafer 1 and the wafer 1 that rotates as the chuck table 20 rotates. It is set at a position where the entire back surface can be ground.

  The wafer 1 is ground by the grinding units 30A and 30B at each processing position of rough grinding and finish grinding. In the backside grinding, the chuck table 20 is rotated to rotate the wafer 1, and the grinding unit 30 </ b> A (30 </ b> B) is fed downward by the feeding mechanism 43, while the grinding wheel 37 of the rotating grinding wheel 35 is exposed on the wafer 1. This is done by pressing against the back side. Here, the wafer 1 is thinned to the target thickness, but the thickness is measured by a thickness measuring gauge 50 provided in the vicinity of each processing position.

  The thickness measurement gauge 50 includes a reference-side height gauge 51 in which the probe 51a contacts the surface 22a of the frame 22 of the chuck table 20, and a movable member in which the probe 52a contacts the surface of the workpiece (in this case, the back surface of the wafer 1). The thickness of the wafer 1 during back grinding is measured one by one by comparing the height measurement values of the two height gauges 51 and 52. The back surface grinding of the wafer 1 is performed while measuring the thickness of the wafer 1 with the thickness measurement gauge 50, and the feed amount of the grindstone wheel 35 by the feed mechanism 43 is controlled based on the measured value. In rough grinding, the target thickness after finish grinding is ground to, for example, 20 to 40 μm before, and the rest is ground by finish grinding.

  When the wafer 1 is thinned to the target thickness through rough grinding and finish grinding, the wafer 1 is recovered as follows. First, the finish grinding unit 30B is raised and retracted from the wafer 1, while the turntable 13 is rotated by a predetermined angle in the R direction so that the wafer 1 is placed on the chuck table 20 from the supply means 73. Returned to At this attachment / detachment position, the vacuum operation of the chuck table 20 is stopped, and then the wafer 1 is transported to the spinner type cleaning device 79 by the recovery means 78 and cleaned and dried. Thereafter, the wafer 1 is put into the recovery cassette 80 by the transport robot 71. Transported and contained. The chuck table 20 from which the wafer 1 has been removed is freed from grinding debris and the like by the cleaning water discharged from the nozzle 77. The collection means 78 relates to the present invention and will be described in detail later.

[3] Dress Plate, Supply Unit, and Collection Unit Next, the dress plate, supply unit, and collection unit used in the dressing method of the present invention will be described with reference to FIGS.
4 and 5, the dress plate 100 is formed by sintering and molding a base 101 made of vinyl chloride or the like and abrasive grains such as alumina at the center of the surface of the base 101 by vitrification or the like. A circular first dresser portion 102 and an annular second dresser portion 103 formed in the same manner as the first dresser portion 102 at a portion slightly inside the outer periphery of the base 101. The first dresser unit 102 and the second dresser unit 103 are arranged concentrically with respect to the base 100, and the base surface between the first dresser unit 102 and the second dresser unit 103 is supplied as described later. This is a held region 104 that is sucked and held by the suction surface 74 a of the means 73 and the collecting means 78.

  The abrasive grain size of the dresser part constituted by the first dresser part 102 and the second dresser part 103 is different depending on whether dressing a grinding wheel for rough grinding or dressing a grinding stone for finish grinding. That is, two types of dress plates 100 for rough grinding and finish grinding are prepared. In the dress plate 100 on which the grindstone for rough grinding is dressed, abrasive grains coarser than the size of the abrasive grains of the rough grinding stone are used. Further, in the dress plate 100 for dressing the grinding wheel for finish grinding, abrasive grains having a size two to three times larger than the grain size of the grinding stone for finish grinding are used. The base 100 is set to a size that can cover the suction surface 21 a of the chuck table 20. Accordingly, it is possible to prevent the dresser part generated by the dressing operation and the grinding scraps of the grindstone 37 from adhering to the suction surface 21a of the chuck table 20. Therefore, when the wafer 1 is ground after the dressing operation, the wafer 1 and the suction surface 21a It is possible to prevent grinding dust from being sandwiched therebetween.

  The supply means 73 and the collection means 78 that convey the wafer 1 and the dress plate 100 have the same configuration, and as shown in FIG. 6, are configured by a combination of a suction pad 74 and a horizontal swivel arm 75. The suction pad 74 has a donut-shaped suction surface 74a having an outer diameter slightly smaller than the inner diameter of the second dresser portion 103 and an inner diameter slightly larger than the outer diameter of the first dresser portion 102, and a suction surface 74a. A circular recess 74b that accommodates the first dresser 102 is provided in the center surrounded by the first dresser 102. The suction pad 74 is a vacuum chuck type, and the suction surface 74a is formed of a porous body 74c. Inside the suction pad 74 and the arm 75, an air suction path 76 for sucking air from the suction surface 74a is formed. By pressing the suction pad 74 against the held area 104 of the dress plate 100 and performing a vacuum operation, the dress plate 100 can be sucked and held. After attracting and holding the dress plate 100, the dress plate 100 is transported to the transport destination by turning the arm 75.

[4] Dressing Method The above is the configuration of the grinding apparatus 10 of the present embodiment. Next, the dressing method will be described.
First, the dress plate cassette containing the dress plate 100 is set in the grinding apparatus 10 in place of the supply cassette 70. The collection cassette 80 is also replaced with a dress plate cassette that can accommodate the dress plate 100. Next, a grinding condition for dressing is selected in which a feed speed and a rotational speed at the time of dressing are set. The grinding conditions for dressing are stored in advance in the grinding apparatus 10. When the grinding conditions for dressing are selected, the dress plate 100 is taken out of the cassette on the supply side by the transport robot 71, and the dress plate 100 is placed on the positioning table 72 so that the dresser portion is exposed. Next, the suction pad 74 of the supply means 73 is pressed against the held area 104 of the dress plate 100 placed on the positioning table 72. At this time, the first dresser 102 is accommodated in the recess 74b. After the suction pad 74 is pressed against the dress plate 100, the suction of the dress plate 100 is started, the held area 104 of the dress plate 100 is sucked by the suction surface 74 a, and then the arm 75 is turned to directly above the chuck table 20. To move. Next, the suction by the suction pad 74 is terminated. Accordingly, the dress plate 100 is placed on the chuck table 20 with the dresser portion exposed (dress plate placing step).

  When the dress plate 100 is placed on the chuck table 20, vacuum operation by the chuck table 20 is started, and the dress plate 100 is sucked and held on the suction surface 21a. Next, the turntable 13 is rotated in the R direction in the same manner as when the wafer 1 is ground, and the dress plate 100 is disposed below the dressing spindle. Next, the dress plate 100 and the grindstone wheel 35 are relatively rotated, and the spindle is fed into the dress plate 100 as shown in FIG. 7 to grind the dress plate 100 (dressing process). At this time, the probe 51a of the reference side height gauge 51 of the thickness measurement gauge 50 is brought into contact with the surface 22a of the frame body 22, and the probe 52a of the movable side height gauge 52 is brought into contact with the surface of the second dresser portion 103, respectively. Grind while measuring the thickness.

  When grinding is completed, the spindle is retracted upward, the turntable 13 is rotated again, and the dress plate 100 is returned to the attachment / detachment position. The dress plate 100 that has been returned to the attachment / detachment position is sucked and held by the suction pad 74 of the collecting means 78 that has moved to the top just as when the dress plate 100 was placed on the chuck table 20. Next, the arm 75 of the collecting means 78 that has adsorbed the dress plate 100 is turned, and the dress plate 100 is conveyed to the spinner type cleaning device 79 (dress plate removing step). Then, the suction of the dress plate 100 by the recovery means 78 is terminated, the dress plate 100 is cleaned and dried by the spinner type cleaning device 79, and transferred and stored in the recovery side cassette by the transport robot 71.

  The dress plate 100 of the present embodiment includes a first dresser unit 102 and a second dresser unit 103 that are ground by the grindstone 37, and a held region 104 that is sucked and held by the supply unit 73 and the collection unit 78. . Further, the supply unit 73 and the collection unit 78 have suction pads 74 corresponding to the dress plate 100. Accordingly, the dress plate 100 can be automatically conveyed from the supply-side cassette to the chuck table 20 in the same manner as when the wafer 1 is ground. Further, the dress plate 100 after grinding can be automatically conveyed from the chuck table 20 to the cassette on the collection side. Therefore, there is no need for an operator to set a dressing member on the chuck table 20 or to remove the dressing member from the chuck table 20 as in the prior art, and the dressing operation sets the grinding conditions in the same manner as the wafer grinding operation. Just do it. As described above, according to the present invention, since the dressing operation can be automated, it is possible to suppress the occurrence of an operation error by the operator.

  Conventionally, a setup operation for confirming the position of the cutting edge of the grindstone 37 from the chuck table 20 is performed after the dressing operation. Therefore, the grinding operation for the wafer 1 cannot be resumed promptly after the dressing operation. However, in the present embodiment, the dressing plate 100 is ground while measuring the thickness of the dressing plate 100 during the dressing process, so that the position of the cutting edge of the grindstone after the dressing operation can be accurately grasped. Thereby, it is not necessary to set up after the dressing operation, and the grinding operation of the wafer 1 can be resumed promptly. As a result, it is possible to improve the work efficiency of the dress work.

  In this embodiment, the present invention is applied to the grinding apparatus 10 that finishes the wafer 1 relatively thinly using two spindles that grind the wafer 1. However, the present invention is applicable to a grinding apparatus that finishes the wafer 1 relatively thick using one spindle. The invention can be implemented.

It is the (a) perspective view and (b) side view of the wafer ground by one Embodiment of this invention. It is a perspective view of the grinding device concerning one embodiment of the present invention. It is the (a) perspective view and the (b) side view which show the state which is grinding the wafer with the grinding unit with which the grinding apparatus of FIG. 2 is provided. It is a perspective view of the dress board ground by one Embodiment of this invention. It is (a) top view of the dress board ground by one Embodiment of this invention, (b) It is sectional drawing. It is sectional drawing of the conveyance means which conveys a wafer and a dress plate by one Embodiment of this invention. It is the (a) perspective view and (b) side view which show the state which grinds the dress board with the grinding unit with which the grinding apparatus of FIG. 2 is provided.

Explanation of symbols

1 ... wafer (workpiece)
DESCRIPTION OF SYMBOLS 10 ... Grinding device 20 ... Chuck table (holding means)
37 ... Whetstone (grinding member)
73 ... Supply means (conveyance means)
78 ... Recovery means (conveyance means)
DESCRIPTION OF SYMBOLS 100 ... Dress board 102 ... 1st dresser part (dresser part)
103 ... 2nd dresser part (dresser part)
104 ... Holded area

Claims (4)

Having a fully automatic conveyance function of conveying the workpiece by the conveying means, and holding a dress plate on the holding means of the grinding device for grinding one surface of the workpiece held by the holding means by the grinding member; A dressing method for dressing the grinding member by grinding a dress plate,
A dress plate placing step in which a dress plate having a dresser portion to be ground by the grinding member and a held area that can be held by the carrying means is placed on the holding means while the carrying means holds the held area. When,
A dressing step of grinding and dressing the dresser part of the dress plate by the grinding member;
A dressing plate removing step in which the conveying means holds the held area and removes the dressing board from the holding means ;
The workpiece is a disk-shaped substrate,
The dress board is
A disk-shaped base that can be held by the holding means;
A circular first dresser disposed near the center of the surface of the base;
An annular second dresser portion disposed around the first dresser portion on the surface of the base and having a diameter equivalent to the diameter of the workpiece;
The conveying means includes a donut-shaped suction surface having a diameter substantially equal to the inner diameter of the annular second dresser portion, and a first dresser portion having a shape substantially the same as the first dresser portion at the center surrounded by the suction surface. Having a recess to accommodate,
Between the first dresser part and the second dresser part, the surface portion of the base is configured as the held region that can be sucked and held on the suction surface of the transport means. > Dressing method characterized by The dressing method according to claim 1 , wherein the dressing step is performed while measuring the thickness of the second dresser portion. In a grinding apparatus having a fully automatic conveyance function of conveying a workpiece by a conveying means, and grinding one surface of the workpiece held by the holding means by a grinding member,
It has a dresser section ground by the grinding member and a held area that can be held by the conveying means, and is placed on the holding means or holding means in a state where the conveying means holds the held area. with a dress plate or taken away from,
The workpiece is a disk-shaped substrate,
The dress board is
A disk-shaped base that can be held by the holding means;
A circular first dresser disposed near the center of the surface of the base;
An annular second dresser portion disposed around the first dresser portion on the surface of the base and having a diameter equivalent to the diameter of the workpiece;
The conveying means includes a donut-shaped suction surface having a diameter substantially equal to the inner diameter of the annular second dresser portion, and a first dresser portion having a shape substantially the same as the first dresser portion at the center surrounded by the suction surface. Having a recess to accommodate,
A surface portion of the base between the first dresser portion and the second dresser portion is configured as the held region that can be sucked and held on the suction surface of the transport unit. > Grinding equipment characterized by The grinding apparatus according to claim 3 , further comprising a thickness measuring unit that measures a thickness of the second dresser part.

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