JP6661385B2 - Holding table - Google Patents

Description

  The present invention relates to a holding table, and more particularly, to a holding table applicable to a turning device.

  BACKGROUND ART Conventionally, there has been known a turning device that turns an upper surface of a workpiece using a cutting tool having an arc-shaped cutting blade (see Patent Document 1). In the turning apparatus described in Patent Literature 1, a cutting tool is fixed to a part of an outer peripheral portion of a mount of a spindle that rotates around a vertical axis. The workpiece held on the chuck table is turned by turning the cutting tool around the vertical axis of the spindle while processing and feeding the chuck table (holding means) holding the workpiece at a low speed. . As a result, the workpiece is thinned to a uniform height (thickness).

  Further, with the recent thinning of circuit boards, there is a demand for further thinning of a workpiece to be turned. As an example, a coreless substrate having no core substrate can be given. The coreless substrate is a laminate formed of a plurality of layers such as a wiring layer and a resin layer, and is formed in a flexible sheet shape.

JP 2013-056397 A

  By the way, when a coreless substrate having a rectangular shape in a top view is processed by a turning device, the coreless substrate is placed on a holding table and held by suction. In this case, it is conceivable to press and hold the four sides of the coreless substrate so that the coreless substrate does not roll up from the holding table. However, since the coreless substrate has flexibility, the vicinity of the outer edge of the coreless substrate may be lifted from the holding surface. For this reason, when turning is performed, there is a problem that the cutting tool is caught on the raised portion, and is not properly processed.

  The present invention has been made in view of such a point, and an object of the present invention is to provide a holding table capable of suppressing a workpiece from floating from a holding surface.

The holding table according to the present invention is a holding table for holding a sheet-shaped, flexible , rectangular workpiece having a square wiring area in the center and a surplus area surrounding the wiring area on the outer periphery. A first suction holding portion having a rectangular holding surface for sucking and holding a wiring area of the workpiece, and a lower portion holding the outer peripheral edge of a surplus area of the workpiece sucked and held by the first suction holding portion below the holding surface; And a second suction holding unit that sucks a surplus area at a boundary between the outer periphery of the first suction holding unit and the pressing unit in the holding surface direction , and the second suction holding unit is A concave portion for attaching the first suction holding portion, and a first inclined surface which is inclined downward from the outer periphery of the concave portion toward the outer peripheral side, and the first suction holding portion and the concave portion are formed by the concave portion. A rectangular gap is formed between the inner wall and the inner wall. A second inclined surface opposed to the inclined surface of the second surface, the surplus area is sandwiched between the first inclined surface and the second inclined surface below the holding surface, and the second suction holding portion is The apex of the bulge of the workpiece formed above the holding surface at the boundary between the wiring area and the surplus area due to the outer peripheral edge of the workpiece being pushed down by the pushing-down portion, It is moved below the holding surface by sucking in the gap formed outside.

  According to this configuration, while the wiring region of the workpiece is suction-held by the first suction holding unit, the surplus region of the workpiece is pushed down below the holding surface, so that the first suction holding unit The workpiece is bent at the boundary (outer peripheral side) between the outer periphery and the depressed portion, and bulges. At this time, the workpiece (excess area) is sucked by the second suction holding portion at the boundary between the outer periphery of the first suction holding portion and the pressing portion, so that the bulge is drawn to the pressing portion side. Can be Thereby, it is possible to suppress the workpiece from floating from the holding surface.

  ADVANTAGE OF THE INVENTION According to this invention, it can suppress that a workpiece lifts from a holding surface by sucking the bulge of the workpiece which arises by bending.

1 is a perspective view of a turning device to which a holding table according to the present embodiment is applied. FIG. 3 is a schematic top view of the holding table according to the present embodiment. FIG. 3 is a schematic cross-sectional view of the holding table according to the present embodiment. FIG. 9 is a diagram illustrating a suction holding operation of the holding table according to the present embodiment. FIG. 5 is a partially enlarged view of a suction holding operation of the holding table according to the present embodiment.

  Hereinafter, a turning device to which the holding table according to the present embodiment is applied will be described with reference to the accompanying drawings. FIG. 1 is a perspective view of a turning apparatus to which the holding table according to the present embodiment is applied. Note that the holding table according to the present embodiment is not limited to a turning device as shown in FIG. 1, and may be applied to another type of processing device such as a grinding device. Note that a part of the configuration of the holding table illustrated in FIG. 1 is omitted for convenience of description.

  As shown in FIG. 1, the turning device 1 performs creep feed on the upper surface of the workpiece W with a single cutting tool 46 while processing and feeding the holding table 20 holding the workpiece W at a low speed in the X-axis direction. It is configured to turn with.

  The workpiece W is formed of a sheet-shaped coreless substrate formed by laminating a plurality of layers such as a wiring layer, a resin layer, and a silicon layer. The workpiece W is formed in a rectangular shape in a top view, and has flexibility. At the center of the workpiece W, a rectangular wiring area W1 is formed. An annular surplus area W2 is formed on the outer periphery of the workpiece W so as to surround the wiring area W1. This surplus area W2 is a scrap that is not used as a product. In addition, the workpiece W is not limited to the coreless substrate, and may have any configuration as long as it has a flexible sheet shape.

  A rectangular opening extending in the X-axis direction is formed on the upper surface of the base 10 of the turning device 1, and the opening is covered by a movable plate 11 movable with the holding table 20 and a bellows-shaped waterproof cover 12. ing. Below the waterproof cover 12, a ball screw type reciprocating means (not shown) for moving the holding table 20 in the X-axis direction is provided. On the surface of the holding table 20, a holding surface 21a (see FIG. 3) for sucking and holding the workpiece W is formed. The holding surface 21a is connected to a suction source (not shown) through a flow path in the holding table 20, and the workpiece W is sucked and held by a negative pressure generated on the holding surface 21a. The detailed configuration of the holding table 20 will be described later.

  The column 15 on the base 10 is provided with a feeding means 30 for moving the turning means 40 toward and away from the holding table 20 in the Z-axis direction. The feed means 30 has a pair of guide rails 31 arranged in the column 15 and parallel to the Z-axis direction, and a motor-driven Z-axis table 32 slidably mounted on the pair of guide rails 31. Nuts (not shown) are formed on the back side of the Z-axis table 32, and a ball screw 33 is screwed to these nuts. When the ball screw 33 is rotationally driven by a drive motor 34 connected to one end of the ball screw 33, the turning means 40 is moved in the Z-axis direction along the guide rail 31.

  The turning means 40 is mounted on the front surface of the Z-axis table 32 via a housing 41, and is provided with a mount 43 provided at the lower end of a cylindrical rotary spindle 42. The rotary spindle 42 is provided with a flange 44, and the turning means 40 is supported on the housing 41 via the flange 44. A tool attaching portion 45 is provided on a part of the lower surface of the mount 43 on the outer peripheral side, and a tool 46 is attached to the tool attaching portion 45. As the tool 46, a carbide tool, a diamond tool, or the like is used.

  In the turning apparatus 1 thus configured, the turning means 40 is moved closer to the holding table 20 while the cutting tool 46 is turned around the Z axis by the rotary spindle 42. Then, while the processing water or air is supplied toward the workpiece W and the tip of the cutting tool 46 is cooled, the cutting tool 46 is brought into rotational contact with the upper surface of the processing tool W, so that the tip of the cutting tool 46 and the processing piece are rotated. The workpiece W is relatively slid and the workpiece W is turned. The workpiece W is turned over the entire surface by rotating the holding table 20 horizontally at a low speed in the X-axis direction while rotating the cutting tool 46.

  Next, a holding table according to the present embodiment will be described with reference to FIGS. FIG. 2 is a schematic top view of the holding table according to the present embodiment. FIG. 3 is a schematic cross-sectional view of the holding table according to the present embodiment. Note that the holding tables shown in FIGS. 2 and 3 are merely schematic diagrams, and the dimensions and shapes of the respective parts are exaggerated.

  As shown in FIGS. 2 and 3, the holding table 20 according to the present embodiment is configured to suck and hold the sheet-shaped workpiece W, and holds the wiring region W1 of the workpiece W by suction. And a second suction holding unit (base 22) for sucking and holding the surplus area W2 of the workpiece W. Specifically, the holding table 20 is formed in a rectangular shape in a top view in which a rectangular suction plate 21 is attached to a base 22 having a rectangular concave portion 22a formed in the center of the surface.

  The upper surface of the suction plate 21 is a holding surface 21a that holds the wiring area W1 of the workpiece W by suction. The holding surface 21a has substantially the same size (area) as the wiring region W1 of the workpiece W. A plurality of through-holes 21b are formed in the suction board 21 from the upper surface to the lower surface. The through-hole 21b is connected to the first suction source 23 through a communication path 22b (first communication path) formed on the bottom surface of the rectangular recess 22a. The suction plate 21 is suctioned by the first suction source 23, so that a negative pressure is generated on the holding surface 21a, so that the workpiece W can be suction-held.

  Further, a slight gap is formed between the outer surface of the suction plate 21 and the rectangular recess 22a and the inner surface. This gap is connected to the second suction source 24 through a communication path 22c (second communication path) formed in the base 22. The suction timing of the first suction source 23 and the second suction source 24 can be freely adjusted by a valve (not shown).

  An inclined portion 25 that is inclined downward toward the outer peripheral side is formed on the outer periphery of the rectangular concave portion 22a. The inclined portion 25 is formed in a square ring shape in a top view so as to surround the rectangular concave portion 22a. Although the details will be described later, the inclined portion 25 functions as a support portion that supports a surplus area of the workpiece W.

  Further, above the four sides of the base 22, a plurality of pressing portions 26 (in this embodiment, one pressing member on each side of the base 22) that presses the outer peripheral edge (the surplus area W <b> 2) of the workpiece W toward the base 22. Four each). The holding portion 26 is formed of a long plate along each side of the base 22 and has an inclined surface 26a facing the inclined surface 25a of the inclined portion 25 (see FIG. 5). The surplus region W2 of the workpiece W is held by being sandwiched between the inclined portion 25 of the base 22 and the holding portion 26. Although details will be described later, the inclined portion 25 and the pressing portion 26 constitute a pressing portion that presses the surplus area W2 of the workpiece W below the holding surface 21a.

  By the way, in the case of a workpiece W having flexibility such as a coreless substrate, the outer peripheral side may be warped. For this reason, if only the workpiece W is suction-held on the holding surface 21a, the outer edge of the workpiece W may jump from the holding surface 21a. If turning is performed in this state, it is assumed that the tool 46 (see FIG. 1) is hooked on the workpiece W that has jumped up, and the workpiece W cannot be properly processed.

  As a countermeasure, it is conceivable to correct the warpage of the workpiece W by pressing the outer edge portion (surplus area W2) of the workpiece W. However, if the outer edge of the workpiece W is pushed down so as to be located below the holding surface 21a, the pushed workpiece W is bent, and the workpiece W rises up from the holding surface 21a ( For example, see FIG. 5A). Therefore, when the turning process is performed, the cutting tool 46 is caught on the workpiece W that has been lifted from the holding surface 21a, as described above, and the workpiece W cannot be appropriately processed. Even if the cutting tool 46 is not hooked on the workpiece W, a case where the workpiece W cannot be machined to a desired thickness as a result of the additional turning of the workpiece W by the amount of the lifting is assumed. You.

  Therefore, in the present embodiment, the wiring area W1 of the workpiece W is suction-held by the suction disk 21 (first suction holding unit), and the surplus area W2 of the workpiece W is pressed against the inclined portion 25 of the base 22. It is sandwiched between the section 26 and the section 26. At this time, when the surplus area W2 is pushed down below the holding surface 21a, the workpiece W is bent at the boundary between the suction plate 21 and the base 22 (rectangular concave portion 22a) and bulges. However, when the gap between the suction plate 21 and the rectangular recess 22a is sucked, the bulge is drawn downward. As a result, it is possible to suppress the workpiece W from rising above the holding surface 21a.

  Next, with reference to FIG. 4 and FIG. 5, an operation when the workpiece is suction-held using the holding table according to the present embodiment will be described. FIG. 4 is a diagram showing a suction holding operation of the holding table according to the present embodiment. FIG. 5 is a partially enlarged view of the suction holding operation of the holding table according to the present embodiment. 4A to 4C show operation transition diagrams of the suction holding. 5A is a partially enlarged view of a portion X in FIG. 4B, and FIG. 5B is a partially enlarged view of a portion Y in FIG. 4C.

  As shown in FIG. 4A, first, the workpiece W is placed on the suction plate 21 in a state in which the holding portion 26 is retracted from the base 22 (inclined portion 25). At this time, the workpiece W is positioned so that the wiring area W1 of the workpiece W is located on the holding surface 21a. Then, the suction area 21 is suctioned by the first suction source 23, so that the wiring area W1 of the workpiece W is suction-held on the holding surface 21a. At this time, suction by the second suction source 24 is not performed.

  Next, as shown in FIG. 4B and FIG. 5A, the outer edge portion (excess area W2) of the workpiece W is pushed down by the holding portion 26, and the workpiece W (excess area W2) is Is held between the inclined surface 25a and the inclined surface 26a of the holding portion 26. At this time, as a result of the outer edge of the workpiece W being pushed down below the holding surface 21a, the boundary between the wiring area W1 and the surplus area W2, that is, the outer surface of the suction plate 21 and the inner surface of the rectangular recess 22a are formed. A bend is formed in the workpiece W between them.

  As a result, a bulge B occurs in the workpiece W. In particular, as shown in FIG. 5A, a slight gap is formed between the holding surface 21a and the workpiece W due to the bulge B. At this time, the vertex of the bulge B is positioned above the surface of the workpiece W suction-held on the holding surface 21a without any gap.

  Next, suction is performed by the second suction source 24, and a negative pressure is generated in the gap between the outer surface of the suction plate 21 and the inner surface of the rectangular recess 22a. As a result, as shown in FIGS. 4C and 5B, the boundary between the wiring area W1 and the surplus area W2 is sucked downward. At this time, the gap between the holding surface 21a and the workpiece W (wiring region W1) disappears, and the vertex of the bulge B moves to the inclined portion 25 side. In particular, as shown in FIG. 5B, the top of the bulge B is positioned below the holding surface 21a. As a result, it is possible to prevent the wiring region W1 of the workpiece W from rising from the holding surface 21a.

  In this way, even if bending occurs when the outer peripheral edge of the workpiece W is clamped, the bent portion (bulge B) is sucked from between the suction plate 21 and the rectangular concave portion 22a, so that the apex of the bulge B is obtained. Of the bulge B can be shifted to the outer peripheral side so that does not protrude from the holding surface 21a. Thereby, the lifting of the workpiece W is suppressed, and when turning, the cutting tool 46 (see FIG. 1) can be prevented from being caught on the workpiece W, and the workpiece W can be formed to a desired thickness. Turning becomes possible.

  As described above, according to the present embodiment, the wiring area W1 of the workpiece W is suction-held by the first suction holding unit (suction board 21), while the surplus area W2 of the workpiece W is held. By being pushed down below the surface 21a, the workpiece W is bent at the boundary (outer periphery) between the outer periphery of the suction plate 21 and the push-down portion (inclined portion 25), and the bulge B is generated. At this time, the workpiece W (excess area W2) is sucked at the boundary between the outer periphery of the suction plate 21 and the rectangular concave portion 22a, so that the bulge B moves toward the pressing portion (the inclined portion 25 and the pressing portion 26). Gravitate. Thereby, it is possible to suppress the workpiece W from rising from the holding surface 21a.

  The present invention is not limited to the above embodiment, and can be implemented with various modifications. In the above embodiment, the size, shape, and the like illustrated in the accompanying drawings are not limited thereto, and can be appropriately changed without departing from the effects of the present invention. In addition, the present invention can be appropriately modified and implemented without departing from the scope of the object of the present invention.

  In the above-described embodiment, the first suction source 23 and the second suction source 24 are provided separately, but the present invention is not limited to this configuration. The first suction source 23 and the second suction source 24 may be common.

  In the above-described embodiment, the configuration is such that the workpiece W having a rectangular shape in a top view is suction-held, but the configuration is not limited to this. The workpiece W may be formed, for example, in a circular shape. In this case, it is preferable to appropriately change the shape of the holding table 20 according to the shape of the workpiece W. In addition, when the rectangular workpiece W is sucked and held, the surplus areas W2 at the four corners of the workpiece W are cut off in advance, so that when the surplus area W2 is sandwiched, wrinkles (holding surfaces 21a) are formed at the four corners. (Floating) can be prevented from occurring.

  As described above, the present invention has the effect of suppressing the lifting of a workpiece, and is particularly useful for a holding table applicable to a turning device.

W Workpiece W1 Wiring area W2 Surplus area 20 Holding table 21 Suction board (first suction holding section)
21a holding surface 22 base (second suction holding unit)
25 Inclined part (support part: push-down part)
26 Holding part (pressing part)
B bulge

Claims (1)

A holding table for holding a sheet-shaped and flexible rectangular workpiece having a square wiring area in the center and a surplus area surrounding the wiring area on the outer periphery,
A first suction holding portion having a rectangular holding surface for suction holding the wiring area of the workpiece;
A press-down unit that clamps the outer peripheral edge of the surplus area of the workpiece to be suction-held by the first suction-holding unit and presses down below the holding surface;
A second suction holding unit that sucks the surplus area at a boundary between the outer periphery of the first suction holding unit and the pressing unit in the holding surface direction ,
The second suction holding portion has a concave portion for attaching the first suction holding portion, and a first inclined surface inclined downward from the outer periphery of the concave portion toward the outer peripheral side, The recess forms a rectangular gap between the first suction holding unit and the inner wall of the recess,
The press-down portion has a second inclined surface facing the first inclined surface,
The surplus area is sandwiched below the holding surface between the first inclined surface and the second inclined surface,
The second suction holding portion is configured such that the outer peripheral edge of the workpiece is pressed down by the pressing portion, and the workpiece formed above the holding surface at a boundary portion between the wiring region and the surplus region. A holding table for moving the top of a bulge of an object below the holding surface by sucking the top of the bulge of the object through the gap formed outside the first suction holding section .

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