JP6194227B2 - Holding device and holding method - Google Patents

Description

  The present invention relates to a holding technique for holding a holding object in which a substrate is bonded to a central portion of a dicing tape having a dicing frame attached to the outer periphery.

  For example, as one of processing techniques that can be applied to a substrate such as a thinned wafer substrate, there is a method of processing the substrate in a state where the substrate is bonded to the center of a dicing tape having a dicing frame attached to the outer periphery. is there. As a tool for suitably executing this method, Patent Document 1 discloses a holding device that holds a substrate bonded to a central portion of a dicing tape having a dicing frame on its outer periphery. Patent Document 1 discloses a holding device that sucks a region sandwiched between a substrate and a dicing frame in a dicing tape as one aspect of the holding device.

JP 2013-4666 A (published January 7, 2013)

  However, the holding device that sucks the region sandwiched between the substrate and the dicing frame in the dicing tape may fail to suck the dicing tape if the dicing frame is distorted. This is because the dicing tape may be deformed due to distortion of the dicing frame.

  The present invention has been made in view of the above problems, and suppresses failure of suction of the dicing tape due to distortion of the dicing frame in a holding device that sucks an area sandwiched between the substrate and the dicing frame in the dicing tape. The main purpose is to provide technology to do this.

  In order to solve the above-described problems, a holding device according to the present invention includes a mounting surface on which a holding target formed by adhering a substrate to a central portion of a dicing tape having a dicing frame attached to the outer periphery is mounted. The mounting surface is provided with a first suction port for sucking a region sandwiched between the substrate and the dicing frame in the dicing tape, and a dicing frame mounting portion for mounting the dicing frame, Between the part where the first suction port is provided on the placement surface and the part where the dicing frame placement part is provided, the placement surface is opposite to the side where the placement target is placed. It is characterized in that a bent portion is formed so as to be bent.

  According to the present invention, the bent portion is provided between the portion where the first suction port is provided and the portion where the dicing frame placing portion is provided, and the dicing tape is supported at the bent portion. There is an effect that the dicing tape on the suction port can be prevented from being deformed due to the distortion of the dicing frame, and the suction failure of the dicing tape can be suppressed.

It is a sectional side view which shows typically the schematic structure of the holding | maintenance apparatus which concerns on Embodiment 1 of this invention, (a) shows the state which is not holding the holding object, (b) is holding the holding object. Indicates the state. It is a top view which shows typically schematic structure of the holding | maintenance apparatus which concerns on Embodiment 1 of this invention, (a) shows the state which is not holding the holding object, (b) is the state holding the holding object Indicates. It is a side sectional view showing typically the state where the holding device concerning Embodiment 1 of the present invention is holding the holding object which has the distorted dicing frame. It is a sectional side view which shows typically the schematic structure of the holding | maintenance apparatus which concerns on Embodiment 2 of this invention, (a) shows the state which is not holding the holding object, (b) is holding the holding object. Indicates the state. It is side sectional drawing which shows typically the state which the holding | maintenance apparatus which concerns on Embodiment 2 of this invention hold | maintains the holding object which has the distorted dicing frame. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a side sectional view schematically showing a state in which a holding device according to Embodiments 1 and 2 of the present invention holds a holding object having a hard dicing tape, and FIG. The holding device which concerns is shown, (b) shows the holding device which concerns on Embodiment 2. FIG. It is a sectional side view which shows typically the schematic structure of the holding | maintenance apparatus which does not have a bending part shown as a reference, (a) shows the state holding the holding | maintenance object which has an undistorted dicing frame, (b ) Shows a state where a holding object having a distorted dicing frame is held.

  The present invention includes a mounting surface on which a holding target formed by adhering a substrate to a center portion of a dicing tape having a dicing frame attached to the outer periphery is mounted, and the mounting surface includes the substrate in the dicing tape and the substrate. A portion provided with a first suction port for sucking a region sandwiched between the dicing frame and a dicing frame mounting portion for mounting the dicing frame, and a portion provided with the first suction port on the mounting surface A holding portion in which a bent portion is formed so that the mounting surface bends in a direction opposite to the side on which the mounting target is mounted between the dicing frame mounting portion and the portion provided with the dicing frame mounting portion. Providing equipment.

Embodiment 1
FIG. 1 is a side sectional view schematically showing a schematic configuration of a holding device 10 according to Embodiment 1 of the present invention, in which (a) shows a state where the holding object 1 is not held, and (b) shows The state which hold | maintains the holding object 1 is shown. FIG. 2 is a top view schematically showing a schematic configuration of the holding device 10, where (a) shows a state where the holding object 1 is not held, and (b) shows a holding object 1. Indicates the state.

(Retention target)
A holding object 1 which is an object to be held by the holding device 100 is formed by adhering a substrate 4 to a central portion of a dicing tape 3 having a dicing frame 2 attached to the outer periphery (FIG. 1 and FIG. 2B). reference).

  The substrate 4 is not limited to a wafer substrate, and may be an arbitrary substrate such as a ceramic substrate, a thin film substrate, or a flexible substrate.

  The dicing tape 3 is bonded to one side of the substrate 4 in order to reinforce the strength of the substrate 4. In this embodiment, the board | substrate 4 in the holding object 1 is affixed on the center part of the dicing tape 3 with which the dicing frame 2 was attached to the outer periphery.

  As the dicing tape 3, for example, a dicing tape having a configuration in which an adhesive layer is formed on a base film can be used. As the base film, for example, a resin film such as PVC (polyvinyl chloride), polyolefin, or polypropylene can be used. The outer diameter of the dicing tape 3 is larger than the outer diameter of the substrate 4. When these are bonded together, a part of the dicing tape 3 is exposed at the outer edge portion of the substrate 4.

  A dicing frame 2 for preventing bending of the dicing tape 3 is attached to the outer periphery of the exposed surface of the dicing tape 3. That is, the dicing frame 2 is exposed at the outer edge portion of the dicing tape 3. Examples of the dicing frame 2 include a metal dicing frame such as aluminum, an alloy dicing frame such as stainless steel (SUS), and a resin dicing frame. Examples of the resin dicing frame include a resin dicing frame manufactured by Shin-Etsu Polymer Co., Ltd. or DISCO Corporation.

  If a dicing frame made of metal or alloy is used as the dicing frame 2, it is rigid, hard to be distorted and inexpensive, but it is heavy compared to a resin dicing frame, so it burdens the operator or the transport robot during transport. It takes. In recent years, a flat and rigid resin dicing frame has been developed, and has an advantage of being lighter than a metal or alloy dicing frame that has been widely used. The resin-made dicing frame is light in weight so that it can be easily transported, and further has an advantage that dust generation due to friction is small when it is taken in and out of a metal frame cassette.

(Holding device)
The holding device 10 includes a mounting surface 11 on which the holding object 1 is mounted. The mounting surface 11 has a dicing frame mounting portion 12, a bent portion 15, and a first suction port from the outer periphery toward the center. 13 and the second suction port 14 are provided in this order (see FIGS. 1 and 2A). In one embodiment, the holding device 10 may include, for example, a rotation driving unit (not shown) and function as a spin chuck.

  In the following description, the direction from the placement surface 11 toward the substrate 4 when the holding object 1 is placed on the placement surface 11 is referred to as the upper side, and the opposite direction is referred to as the lower side. In the present embodiment, the holding object 1 is placed on the placement surface 11 such that the dicing tape 3 is below the substrate 4 (see FIG. 1 and FIG. 2B).

  The mounting surface 11 has a top portion at which the second suction port 14 is provided, and a downwardly inclined surface (tapered surface) is formed between the portion and the bent portion 15. Further, the bent portion 15 constitutes a step on the placement surface 11 where the dicing frame placement portion 12 becomes lower than the portion where the first suction port 13 is provided. It is flat (see FIG. 1A). However, this shape is merely an example, and the present invention is not limited to this.

  The dicing frame placing part 12 is a part on the placing surface 11 where the dicing frame 2 is placed when the holding object 1 is placed. Further, since the dicing frame 2 is disposed on the outer periphery of the holding object 1, the dicing frame mounting portion 12 can be similarly installed on the outer periphery of the mounting surface 11.

  The second suction port 14 is a suction port that sucks the substrate 4. Specifically, the second suction port 14 is disposed so as to be positioned below the substrate 4 when the holding object 1 is placed on the placement surface 11, and the dicing tape to which the substrate 4 is bonded. The substrate 4 is sucked and held on the mounting surface 11 by sucking out the gas between 3 and the second suction port 14 (see FIG. 1 and FIG. 2B). In one embodiment, the second suction port 14 is connected to decompression means (not shown) via a pipe 16.

  In one embodiment, the second suction port 14 is provided in the central portion of the mounting surface 11 and can be a table (porous stage) configured by a porous body through which gas can flow ((FIG. 2 ( a)). However, this invention is not limited to this, The structure of a well-known suction port can be employ | adopted.

  The first suction port 13 is a suction port that sucks a region of the dicing tape 3 sandwiched between the substrate 4 and the dicing frame 2. Specifically, the first suction port 13 is positioned below a region of the dicing tape 3 sandwiched between the substrate 4 and the dicing frame 2 when the holding object 1 is placed on the placement surface 11. The dicing tape 3 is sucked and held on the mounting surface 11 by sucking out the gas between the dicing tape 3 and the first suction port 13 (see FIG. 1 and FIG. 2B). In one embodiment, the first suction port 13 is connected to decompression means (not shown) via a pipe 16.

  In one embodiment, a plurality of first suction ports 13 are provided in a region sandwiched between the second suction port 14 and the dicing frame mounting portion 12 on the mounting surface 11, and preferably the dicing tape 3 is attached. It arrange | positions at substantially equal intervals on the same periphery so that it can attract | suck uniformly (refer (a) of FIG. 2). However, the present invention is not limited to this, and they may not be arranged on the same circumference, and the interval between them may not be constant.

  In one embodiment, the first suction port 13 may be provided on a downwardly inclined surface (taper surface) formed between the portion where the second suction port 14 is provided and the bent portion 15.

  As described above, when the holding object 1 is placed on the placement surface 11, the substrate 4 is sucked into the second suction port 14, and the region sandwiched between the substrate 4 and the dicing frame 2 in the dicing tape 3 is the first. The holding object 1 is held on the mounting surface 11 by being sucked into the one suction port 13 and the dicing frame 2 being mounted on the dicing frame mounting portion 12.

  In particular, a region sandwiched between the substrate 4 and the dicing frame 2 in the dicing tape 3 is a portion that is flexible and easily deformed in the holding object 1. By holding the area of the dicing tape 3 with the first suction port 13, the holding object 1 can be stably held. Further, when the region in the dicing tape 3 is separated from the placement surface 11, a solvent atmosphere generated during processing of the holding object 1 enters between the region and the placement surface 11, and the dicing tape 3 is May be bent. By sucking and holding the region in the dicing tape 3 by the first suction port 13, the region can be prevented from being separated from the placement surface 11, and the dicing tape 3 can be prevented from being bent by the solvent atmosphere. .

(Bent part)
Between the site | part in which the 1st suction port 13 in the mounting surface 11 was provided, and the site | part in which the dicing frame mounting part 12 was provided, the mounting surface 11 in the direction opposite to the side in which the holding object 1 is mounted. Is bent (see FIG. 1A). Thereby, the site | part 3a on the bending part 15 in a dicing tape will be in the state stretched | supported by using the bending part 15 as a fulcrum. By bending the dicing tape by the bent portion 15, the bending of the dicing tape can be prevented.

  The bent portion 15 is provided between the portion on the placement surface 11 where the first suction port 13 is provided and the portion where the dicing frame placement portion 12 is provided, and the side on which the holding object 1 is placed. The mounting surface 11 is only required to be bent in the opposite direction, and the shape is not particularly limited. For example, the mounting surface 11 may be chamfered (for example, R chamfering or C chamfering). Further, it is more preferable that the first suction ports 13 and the dicing frame mounting portion 12 are separated from each other, and a circular shape is particularly preferable. The bending angle is not particularly limited, but is more preferably 45 ° or more and 90 ° or less, and particularly preferably 80 ° or more and 90 ° or less. In any case, the mounting surface 11 is formed in the bent portion 15 so as to protrude in the direction from the mounting surface 11 toward the dicing tape 3, and thereby the dicing tape 3 as described above is part of the mounting surface 11. In 3a, it is possible to realize a state of stretching with the bent portion 15 as a fulcrum.

  Although the present invention is not limited to this, since the dicing frame mounting portion 12 is provided below the first suction port 13 (see FIG. 1), the portion 3a on the bent portion 15 The state in which the dicing tape 3 is stretched can be more suitably realized.

  Similarly, the present invention is not limited to this, but the bent portion 15 is provided between the portion of the placement surface 11 where the first suction port 13 is provided and the portion where the dicing frame placement portion 12 is provided. (See FIG. 1), the state in which the dicing tape 3 is stretched at the portion 3a on the bent portion 15 can be particularly preferably realized.

  Here, in order to explain the effect of providing the bent portion 15, a case where the holding device does not have the bent portion will be described first. FIG. 7 is a side sectional view schematically showing a schematic configuration of a holding device 90 that does not have a bent portion shown as a reference. FIG. 7A shows a holding object 1 having a dicing frame 2 that is not distorted. (B) shows the state which hold | maintains the holding object 1 which has the distorted dicing frame 2. FIG.

  The holding device 90 includes a dicing frame placement unit 91, a first suction port 93, and a second suction port 94. When the holding object 1 having the undistorted dicing frame 2 is placed, the dicing frame placement unit 91 is placed. The dicing frame 2 is placed, the first suction port 93 sucks the region sandwiched between the substrate 4 and the dicing frame 2 in the dicing tape 3, and the second suction port 94 sucks the substrate 4. Holding object 1 is held (see FIG. 7A).

  However, when the holding device 90 holds the holding object 1 having the distorted dicing frame 2, the dicing tape 3 is deformed by the distortion of the dicing frame 2, and the first suction port 93 sucks the dicing tape 3. There are cases where it is not possible (see FIG. 7B). This is because when the dicing tape 3 is deformed and is not in close contact with the first suction port 93, gas can flow from the surroundings between the first suction port 93 and the dicing tape 3.

  As described above, in the holding device 90 having no bent portion, the first suction port 93 may fail to suck the dicing tape 3 due to distortion of the dicing frame 2.

  On the other hand, in the holding device 10 having the bent portion 15, failure of suction of the dicing tape 3 due to distortion of the dicing frame 2 can be suppressed. FIG. 3 is a side sectional view schematically showing a state in which the holding device 10 holds the holding object 1 having the distorted dicing frame 2.

  In the holding device 10, due to distortion of the dicing frame 2, the portion on the dicing frame 2 side of the portion 3 a in the dicing tape 3 is deformed. However, deformation of the portion of the dicing tape 3 closer to the substrate 4 than the portion 3a is suppressed. This is because, as described above, the dicing tape 3 is stretched with the bent portion 15 as a fulcrum at the part 3a, and the position of the part 3a is fixed, so that deformation caused by distortion of the dicing frame 2 exceeds the part 3a. It does not occur. Since the deformation of the portion of the dicing tape 3 closer to the substrate 4 than the portion 3a is suppressed, the first suction port 13 can successfully suck and hold the dicing tape 3 (see FIG. 3).

  As described above, in the holding device 10, the bent portion 15 is provided between the portion where the first suction port 13 is provided and the portion where the dicing frame placing portion 12 is provided, and the dicing tape is formed in the bent portion 15. 3 (part 3a) is supported, so that the dicing tape 3 on the first suction port 13 is prevented from being deformed due to the distortion of the dicing frame 2, and the suction failure of the dicing tape 3 is suppressed. Can do.

  In the present embodiment, the position where the first suction port 13 is provided is a region sandwiched between the substrate 4 and the dicing frame 2 in the dicing tape 3 when the holding object 1 is placed on the placement surface 11. There is no particular limitation as long as the position is below. However, it is more preferable that the first suction port 13 sucks a position closer to the dicing frame 2 than the substrate 4, and it is particularly preferable to suck a position immediately before the dicing frame 2. When the first suction port 13 sucks a position closer to the dicing frame 2 than the substrate 4, the solvent atmosphere generated during the processing of the holding object 1 causes the dicing tape 3, the placement surface 11, and the like from the outer peripheral side. It is possible to prevent the dicing tape 3 from being bent and prevent the dicing tape 3 from bending.

  Moreover, although this invention is not limited to this, when the dicing frame 2 is mounted on the mounting surface 11 so as to be positioned below the substrate 4 (see FIG. 1B), The dicing tape 3 is pulled downward. Thereby, the influence of the curvature of the board | substrate 4 and the wrinkle of the dicing tape 3 can be reduced.

  When the dicing frame 2 is positioned below the substrate 4, the region sandwiched between the substrate 4 and the dicing frame 2 in the dicing tape 3 is bent according to the shape of the mounting surface 11. Although this invention is not limited to this, the surface which inclines below between the site | part in which the 2nd suction port 14 in the mounting surface 11 was provided, and the site | part in which the 1st suction port 13 was provided. By being included (see (a) in FIG. 1), the bending of the region sandwiched between the substrate 4 and the dicing frame 2 in the dicing tape 3 becomes smooth, and the mounting surface 11 and the dicing tape 3 Breakage of the dicing tape 3 on the contact surface can be suppressed.

  Moreover, although this invention is not limited to this, the mounting surface 11 seals the area | region pinched | interposed into the site | part attracted | sucked by the board | substrate 4 and the 1st suction opening 13 in the dicing tape 3. FIG. It has become. Thereby, it can suppress that the solvent atmosphere generate | occur | produced at the time of the process of the holding object 1 enters between the said area | region and the mounting surface 11, and the dicing tape 3 bends.

  The solvent that forms the solvent atmosphere is not particularly limited, and may be a cleaning liquid for cleaning the substrate 4, for example. Such a cleaning liquid is not particularly limited as long as it contains a non-aqueous solvent. For example, a known cleaning liquid using a terpene solvent such as p-menthane can be used. Examples of the terpene solvent include straight-chain hydrocarbons such as hexane, heptane, octane, nonane, methyloctane, decane, undecane, dodecane, tridecane, etc., branched hydrocarbons having 4 to 15 carbon atoms; geraniol, nerol , Linalool, citral, citronellol, p-menthane, o-menthane, m-menthane, diphenylmenthane, menthol, isomenthol, neomenthol, limonene, α-terpinene, β-terpinene, γ-terpinene, α-terpineol, β- Terpineol, γ-terpineol, terpinen-1-ol, terpinen-4-ol, 1,4-terpine, 1,8-terpine, carvone, yonon, tuyon, camphor, bornane, borneol, norbornane, pinane, α-pinene, β-pinene, tsujang Cyclic hydrocarbons (terpenes), monoterpenes such as α-tujon, β-tujon, caran, camphor, longifolene, 1,4-cineole, 1,8-cineole, diterpenes such as abietane and abietic acid, etc. ).

  Further, even when a solvent is not particularly used for the treatment of the holding object 1, a solvent atmosphere may be formed by an adjacent processing device or a cleaning device, and the holding device 10 is also suitable in that case. Can be used for

[Embodiment 2]
The following will describe another embodiment of the present invention with reference to FIGS. For convenience of explanation, members having the same functions as those described in the first embodiment are given the same reference numerals, and descriptions thereof are omitted.

  FIG. 4 is a side sectional view schematically showing a schematic configuration of the holding device 20 according to the second embodiment of the present invention, where (a) shows a state where the holding object 1 is not held, and (b) shows The state which hold | maintains the holding object 1 is shown. FIG. 3 is a side sectional view schematically showing a state in which the holding device 20 holds the holding object 1 having the distorted dicing frame 2.

  The holding device 20 includes a mounting surface 21 corresponding to the mounting surface 11, a dicing frame mounting portion 22 corresponding to the dicing frame mounting portion 12, a first suction port 23 corresponding to the first suction port 13, and a second suction. A second suction port 24 corresponding to the port 14, a bent portion 25 corresponding to the bent portion 15, and a pipe 26 corresponding to the pipe 16 are provided. The holding device 20 is different from the holding device 10 in that the portion of the placement surface 21 where the first suction port 23 is provided and the portion where the second suction port 24 is provided are flush with each other (FIG. 4). (See (a)).

  Similar to the holding device 10, the holding device 20 is provided with a bent portion 25 from a portion where the first suction port 23 is provided to a portion where the dicing frame mounting portion 22 is provided, and dicing is performed at the bent portion 25. Since the tape 3 (part 3a thereof) is supported, the dicing tape 3 on the first suction port 23 is prevented from being deformed due to the distortion of the dicing frame 2, and the suction failure of the dicing tape 3 is suppressed. (See FIG. 5).

  Next, a comparison between the holding device 10 and the holding device 20 will be described. FIG. 6 is a side sectional view schematically showing a state in which the holding device 10 and the holding device 20 hold the holding object 1 having the hard dicing tape 3, and (a) shows the holding device 10. , (B) shows the holding device 20.

  The holding device 10 includes a surface inclined downward from a portion of the placement surface 11 where the second suction port 14 is provided to a portion where the first suction port 13 is provided. When the dicing tape 3 is relatively hard (it is difficult to bend), the dicing tape 3 extending from the bottom of the substrate 4 does not follow the downwardly inclined surface and may float with respect to the mounting surface 11 (FIG. 6 (a)). In that case, the first suction port 13 fails to suck the dicing tape 3.

  On the other hand, if the part where the second suction port 24 is provided on the mounting surface 21 and the part where the first suction port 23 is provided are flush with each other as in the holding device 20, a harder (comparison) Even the dicing tape 3 that is hard) does not float from the flat mounting surface 21 (see FIG. 6B). Therefore, the first suction port 23 can suck the dicing tape 3 successfully.

  However, the bending angle of the dicing tape 3 at the portion 3a when the holding device 20 is used is larger than the bending angle of the dicing tape 3 at the portion 3a when the holding device 10 is used. Therefore, when the holding device 20 is used when the dicing tape 3 is relatively soft, a linear mark may remain on the portion 3a of the dicing tape 3.

  Therefore, it is preferable to use the holding device 10 and the holding device 20 properly according to the hardness of the dicing tape 3. The criteria for proper use are not particularly limited. For example, the holding process is performed several times using the prepared dicing tape 3, and it is used after determining which of the holding device 10 and the holding device 20 brings a preferable result. A holding device may be selected.

  In addition, a holding method for holding an object to be held by the holding device according to each embodiment described above is also within the scope of the present invention.

  The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope shown in the claims, and embodiments obtained by appropriately combining technical means disclosed in different embodiments. Is also included in the technical scope of the present invention. Furthermore, a new technical feature can be formed by combining the technical means disclosed in each embodiment.

  The present invention can be used, for example, for surface treatment of a thinned wafer.

DESCRIPTION OF SYMBOLS 1 Holding object 2 Dicing frame 3 Dicing tape 4 Substrate 10, 20 Holding device 11, 21 Placement surface 12, 22 Dicing frame placement part 13, 23 First suction port 14, 24 Second suction port 15, 25 Bending part 16 , 26 Piping

Claims (8)

A mounting surface for mounting a holding object in which a substrate is bonded to the center of a dicing tape with a dicing frame attached to the outer periphery;
The placement surface is provided with a first suction port for sucking a region sandwiched between the substrate and the dicing frame in the dicing tape, and a dicing frame placement portion for placing the dicing frame,
Between the portion where the first suction port is provided on the placement surface and the portion where the dicing frame placement portion is provided, the placement surface is opposite to the side where the holding object is placed. A bent part is formed to be bent ,
The first suction port sucks a position of the dicing tape closer to the dicing frame than the substrate . A mounting surface for mounting a holding object in which a substrate is bonded to the center of a dicing tape with a dicing frame attached to the outer periphery;
The placement surface is provided with a first suction port for sucking a region sandwiched between the substrate and the dicing frame in the dicing tape, and a dicing frame placement portion for placing the dicing frame,
Between the portion where the first suction port is provided on the placement surface and the portion where the dicing frame placement portion is provided, the placement surface is opposite to the side where the holding object is placed. A bent part is formed to be bent ,
The holding apparatus according to claim 1, wherein the placement surface is provided with a second suction port for sucking the substrate . 3. The holding device according to claim 1, wherein the dicing frame mounting portion is provided below the first suction port when a direction from the mounting surface toward the substrate is upward. 4. . The step is formed including the bent portion between a portion where the first suction port is provided on the placement surface and a portion where the dicing frame placement portion is provided. The holding device according to any one of 1 to 3 . The holding device according to claim 2 , wherein a portion provided with the first suction port and a portion provided with the second suction port on the placement surface are flush with each other. When the direction from the placement surface toward the substrate is upward, the portion on the placement surface is inclined downward from the portion where the second suction port is provided to the portion where the first suction port is provided. The holding device according to claim 2 , wherein a surface is included. The mounting surface is in the dicing tape, and the substrate, according to claim 1-6, characterized in that is adapted to seal the site to be aspirated, a region sandwiched between the by the first suction port The holding device according to any one of the above. The holding device according to any one of claim 1 to 7 holding method, characterized in that for holding the holding object.

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